JPH0365667U

JPH0365667U -

Info

Publication number: JPH0365667U
Application number: JP5449889U
Authority: JP
Priority date: 1989-05-15
Filing date: 1989-05-15
Publication date: 1991-06-26
Anticipated expiration: 2004-05-15
Also published as: JPH0715726Y2

Description

[Brief explanation of drawings]

第１Ａ図乃至第１Ｄ図は本考案の第１実施例を
示すものであり、第１Ａ図はダイヤモンドバンド
ソーの部分正面図、第１Ｂ図は第１Ａ図の底面図
、第１Ｃ図は第１Ａ図のＣ−Ｃ断面拡大図、第１
Ｄ図は第１Ａ図Ｄ−Ｄ断面拡大図、第１Ｅ図はバ
ンドソーを僅かに使用した後のダイヤモンドチツ
プの磨耗状態を示す断面図、第２Ａ図および第２
Ｂ図は本考案の第２実施例を示すものであり、第
２Ａ図はダイヤモンドバンドソーの部分正面図、
第２Ｂ図は第２Ａ図の底面図、第３Ａ図乃至第３
Ｄ図は本考案の第３実施例を示すものであり、第
３Ａ図はダイヤモンドソーの部分正面図、第３Ｂ
図は第３Ａ図の外周展開図、第３Ｃ図は第３Ａ図
のＣ−Ｃ断面拡大図、第３Ｄ図は第３Ａ図のＤ−
Ｄ断面拡大図、第３Ｅ図はダイヤモンドソーを僅
かに使用した後のダイヤモンドチツプの磨耗状態
を示す断面図、第４Ａ図乃至第４Ｄ図は従来例を
示すものであり、第４Ａ図はダイヤモンドバンド
ソーの部分正面図、第４Ｂ図は第４Ａ図の底面図
、第４Ｃ図は第４Ａ図のＣ−Ｃ断面拡大図、第４
Ｄ図は第４Ａ図のＤ−Ｄ断面拡大図、第４Ｅ図は
バンドソーを僅かに使用した後のダイヤモンドチ
ツプの磨耗状態を示す断面図である。１，２１……基板（帯状板）、２，１２……切
削側端面、４，２４……ダイヤモンドチツプ、４
ａ，２４ａ……外側層、４ｂ，２４ｂ……内側層
、５，６……ダイヤモンド砥粒、Ｓ……ダイヤモ
ンドソー。 1A to 1D show a first embodiment of the present invention, in which FIG. 1A is a partial front view of a diamond band saw, FIG. 1B is a bottom view of FIG. 1A, and FIG. 1C is a view of FIG. 1A. Enlarged cross-sectional view of C-C, 1st
Figure D is an enlarged cross-sectional view taken along the line D-D in Figure 1A, Figure 1E is a cross-sectional view showing the state of wear of the diamond tip after a slight use of the band saw, Figures 2A and 2
Figure B shows a second embodiment of the present invention, and Figure 2A is a partial front view of the diamond band saw.
Figure 2B is a bottom view of Figure 2A, Figure 3A to 3.
Figure D shows the third embodiment of the present invention, Figure 3A is a partial front view of the diamond saw, and Figure 3B is a partial front view of the diamond saw.
The figure is an expanded view of the outer periphery of Fig. 3A, Fig. 3C is an enlarged cross-sectional view of C-C in Fig. 3A, and Fig. 3D is a D--D of Fig. 3A.
FIG. 3E is an enlarged cross-sectional view of D, FIG. 3E is a cross-sectional view showing the state of wear of the diamond tip after slightly using a diamond saw, FIGS. 4A to 4D show conventional examples, and FIG. 4A shows a diamond band saw. FIG. 4B is a bottom view of FIG. 4A, FIG. 4C is an enlarged cross-sectional view taken along line C-C of FIG. 4A, and FIG.
Figure D is an enlarged cross-sectional view taken along the line DD in Figure 4A, and Figure 4E is a cross-sectional view showing the state of wear of the diamond tip after a slight use of the band saw. 1, 21...Substrate (band-shaped plate), 2, 12...Cutting side end surface, 4, 24...Diamond chip, 4
a, 24a...outer layer, 4b, 24b...inner layer, 5, 6...diamond abrasive grain, S...diamond saw.

補正平２．１１．２０図面の簡単な説明を次のように補正する。明細書第１３頁第１６行乃至第１８行の「第３
Ｅ図は・・・を示す断面図、」を削除する。明細書第１４頁第２行乃至第４行の「、第４Ｅ
図は・・・を示す断面図」を削除する。Amendment 11/20/1999 The brief description of the drawing is amended as follows. “3rd page” on page 13 of the specification, lines 16 to 18
"Figure E is a sectional view showing..." is deleted. ", 4E on page 14, lines 2 to 4 of the specification
The figure is a sectional view showing..." is deleted.

Claims

[Claims for Utility Model Registration] 1. A diamond saw in which diamond chips made of diamond abrasive grains and a metal binder are fixed to the cutting side end face of a substrate at predetermined intervals, the diamond chips being thicker than the outer layer and the outer layer. It consists of a two-layer chip with a thick inner layer, the size of the diamond abrasive grains contained in the outer layer is smaller than that of the diamond abrasive grains contained in the inner layer, and the diamond abrasive grains are concentrated in the outer layer. A diamond saw characterized in that the concentration of diamond abrasive grains is higher than that of the inner layer, and the diamond chips are fixed to the cutting side end surface of the substrate at a shifted position. 2. The diamond saw according to claim 1, wherein the thickness of the inner layer is at least twice the thickness of the outer layer. 3. The diamond saw according to claim 1 or 2, wherein the substrate is a strip plate or a circular substrate.