JPS60103656U - diamond wheel - Google Patents
diamond wheelInfo
- Publication number
- JPS60103656U JPS60103656U JP19640783U JP19640783U JPS60103656U JP S60103656 U JPS60103656 U JP S60103656U JP 19640783 U JP19640783 U JP 19640783U JP 19640783 U JP19640783 U JP 19640783U JP S60103656 U JPS60103656 U JP S60103656U
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- diamond wheel
- outer periphery
- embedded
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案のブレードの平面図、第２図は第１図の
Ｉ−Ｉ’部分の断面図、第３図及び第４図は第１図のブ
レードの異なる製法説明図、第５図は本考案の他の実施
例と被削材の部分断面図、第６図は一般のＶＴＲ用磁気
ヘッドの構成斜視図、第７図及び第８図はこの磁気ヘッ
ドを製造するために使われるウェハの斜視図、第９図は
溝加工の説明図である。
主苗な図番の説明、２０・・・ダイヤモンドホイール、
２２・・・外周部、２３・・・粒径の大きい砥粒、２４
・・・粒径の小さい砥粒。Fig. 1 is a plan view of the blade of the present invention, Fig. 2 is a sectional view taken along the line I-I' in Fig. 1, Figs. 3 and 4 are illustrations of different manufacturing methods for the blade in Fig. 1, and Fig. 5 The figure shows another embodiment of the present invention and a partial sectional view of the workpiece, FIG. 6 is a perspective view of the structure of a general VTR magnetic head, and FIGS. 7 and 8 are used to manufacture this magnetic head. FIG. 9 is a perspective view of a wafer to be processed, and is an explanatory diagram of groove processing. Explanation of main seedling numbers, 20...Diamond wheel,
22...Outer peripheral part, 23...Abrasive grains with large particle size, 24
...Abrasive grains with small particle size.
Claims (1)
外周部の先端側に埋設されている砥粒の粒径が該外周部
の基部側に埋設されている砥粒の粒径に比べて平均的に
大きく構成されていること。 を特徴とするダイヤモンドホイール。[Claim for Utility Model Registration] The outer periphery that contacts the workpiece is formed into a tapered shape, and the particle size of the abrasive grains embedded in the tip side of the outer periphery is the same as that of the abrasive grains embedded in the base side of the outer periphery. The average size of the abrasive grains used should be larger than that of the abrasive grains used. A diamond wheel featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19640783U JPS60103656U (en) | 1983-12-20 | 1983-12-20 | diamond wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19640783U JPS60103656U (en) | 1983-12-20 | 1983-12-20 | diamond wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60103656U true JPS60103656U (en) | 1985-07-15 |
Family
ID=30421393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19640783U Pending JPS60103656U (en) | 1983-12-20 | 1983-12-20 | diamond wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103656U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0365667U (en) * | 1989-05-15 | 1991-06-26 | ||
| JPH07164327A (en) * | 1993-12-08 | 1995-06-27 | Nec Corp | Cutting blade and electrolytic dressing, grinding and cutting device |
| JP2008149430A (en) * | 2006-12-20 | 2008-07-03 | Ran Corporation:Kk | Covering material grooving rotary cutter, covering material grooving device, and covering material mounting method |
-
1983
- 1983-12-20 JP JP19640783U patent/JPS60103656U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0365667U (en) * | 1989-05-15 | 1991-06-26 | ||
| JPH07164327A (en) * | 1993-12-08 | 1995-06-27 | Nec Corp | Cutting blade and electrolytic dressing, grinding and cutting device |
| JP2008149430A (en) * | 2006-12-20 | 2008-07-03 | Ran Corporation:Kk | Covering material grooving rotary cutter, covering material grooving device, and covering material mounting method |
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