JPH0715726Y2 - Diamond saw - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a diamond saw for cutting, and in particular, it is composed of a strip-shaped or circular substrate used for cutting materials such as stone and concrete. It relates to the improvement of diamond saws.

[Prior Art] The types of diamond saws for cutting stone materials include band saws and gang saws formed by attaching diamond chips to a band-shaped plate, or segment type saw blades formed by attaching diamond chips to a circular substrate. and so on.

An example of a diamond saw using a strip plate is disclosed in Japanese Utility Model Publication No. 41-10306 as shown in FIGS. 4A to 4D. This diamond saw is 4A
As shown in Fig. 4 and Fig. 4B, a strip plate made of a long steel strip.
Notch portions 33a and 33b, which are notched beyond the center line X-X of the thickness of the strip plate 31, are alternately left and right (up and down direction in FIG. 4B) at one end 32 which is a cutting surface of 31, and the like. Ordinary single-layer diamond tips 34a, 34b made of diamond abrasive grains and a metal binder are embedded and fixed in the notches 33a, 33b provided at intervals.

[Problems to be Solved by the Invention] In the diamond saw as disclosed in Japanese Utility Model Publication No. 41-10306, the cutting surfaces of the diamond tips 34a and 34b can be arranged without irregularity. Ordinary single-layer chips composed of grains and a metal binder are used, and in the vicinity of the thickness center line of the strip plate 31, diamond chips 34a adjacent to each other,
34b is fixed beyond the center line XX position so that 34b overlaps. Therefore, the end side (that is, the outside) of the strip plate 31
The outer peripheral surface of the diamond tip located in the vicinity of the center line XX of the wall thickness of the strip plate 31 is less worn than the outer peripheral surface of the diamond tip, and the outer peripheral surface of each diamond tip 34a, 34b is located as shown in FIG. 4D. The outer peripheral surface of the diamond tip (that is, the shoulder portion) wears before the outer peripheral surface of the diamond tip located near the center line, causing a so-called "dag".
However, there is a problem in that the sharpness is remarkably reduced due to the occurrence of.

An object of the present invention is to provide a diamond saw capable of preventing so-called "drip" and improving sharpness.

[Means for Solving the Invention] The present invention has been made to solve the above-mentioned problems, and a diamond saw according to the present invention has diamond abrasive grains and diamond tips squeezed from a metal binder at predetermined intervals. In a diamond saw fixed to a cutting side end surface of a substrate, an outer layer at a position where the diamond tip projects from the substrate to the cutting side end surface, and a thickness of the outer layer of 3 to
The size of the diamond abrasive grains contained in the outer layer is larger than that of the diamond abrasive grains contained in the inner layer. While reducing the diamond abrasive grain concentration of the outer layer higher than the diamond abrasive grain concentration of the inner layer to increase the wear of the inner layer more than the outer layer, the diamond tip is at least on the cutting side end faces on both sides of the substrate. They are fixed one after another by shifting the position. Further, the substrate may be composed of a strip plate or a circular substrate.

[Operation] When a stone material or the like is cut using the diamond saw configured as described above, the outer layer of the diamond tip contains small diamond abrasive grains at a high concentration, whereas the inner layer forms the outer layer. Since the larger diamond abrasive grains are contained at a low concentration, the inner layer will be worn more than the outer layer as the cutting work progresses, and the diamond tip will have a recessed cross section, and the outer shoulder of the diamond tip will It is possible to prevent "shoulder sagging" from being always sharpened in the portion of "," and the outer side of the cutting surface of the diamond tip is kept in a sharp state, so that the sharpness is improved.

[Embodiment] An embodiment of the present invention will be described below with reference to the accompanying drawings.
It should be noted that the members and arrangements described below are not intended to limit the present invention, and within the scope of the present invention,
It can be modified in various ways.

1A to 1E show a first embodiment of the present invention. FIG. 1A is a partial front view of a diamond saw, FIG. 1B is a bottom view of FIG. 1A, and FIG. 1C is FIG. 1A. C-C sectional enlarged view of
FIG. 1D is an enlarged view of the DD cross section of FIG. 1A, and FIG. 1E is a cross sectional view showing the worn state of the diamond tip after a slight use of the band saw.

The diamond band saw S of the present embodiment is composed of a strip-shaped plate 1 as a substrate, a plurality of diamond chips 4 and the like.

And, the one end face on the cutting side of the strip 1 of this example is the first A
As shown in the figure, the multiple notch grooves 3, 3 are spaced at regular intervals.
... is provided. End faces 2,2 located between each notch groove 3
... on top of which diamond chips 4,4 are fixed.
Each diamond tip 4 is, as shown in FIG. 1B,
The belt-shaped plate 1 is fixed to the right and left alternately so as to project from the strip-shaped plate 1 (vertical direction in FIG. 1B). As a means for fixing the diamond tip 4 to the strip-shaped plate 1, conventionally known brazing and other known and known techniques are used.

As shown in FIGS. 1C and 1D, each diamond tip 4 of this example has an outer layer 4a located at a position projecting from the strip 1 toward the end face on the cutting side and an inner layer located on the strip 1 side. layer
The outer layer 4a is composed of small diamond abrasive grains 5 and a metal binder, and the inner layer 4b is composed of large diamond abrasive grains 6 and a metal binder.
The outer layer 4a has a diamond grain concentration of 15 to 45 (0.7 to 2.0
cts / cc) is much higher than the concentration of diamond abrasive grains in the inner layer 4b. The grain size of the small diamond abrasive grains 5 here is about US mesh 40 to 70, and the grain size of the larger diamond abrasive grains 6 is about US mesh 25 to 50. The same metal binder may be used for each layer, but when different ones are used, the inner layer 4b may be softer than the outer layer 4a. This is because the wear of the inner layer is made larger than that of the outer layer as the cutting work progresses, so that it is possible to easily form a state having a recessed cross-section, which will be described later, in the diamond tip 4. Furthermore, the thickness of the inner layer 4b is made 3 to 4 times thicker than the thickness of the outer layer 4a. With such a configuration, a recess 4c described later due to wear of the inner layer 4b can be increased as the cutting work progresses, and the recessed state of the diamond tip 4 can be favorably formed.

When a stone material or the like is cut using the diamond saw S having the above-described structure, each diamond tip 4 has no "shoulder" as in the conventional example, as shown in FIG. Since 4b is worn more than the outer layer 4a and the dents are formed over a wide range, good sharpness can be maintained until the end of the diamond tip.

Although the inner side surface 4d of each diamond tip 4 is flush with the side surface of the strip plate 1 in the first embodiment, the position of the inner side surface 4d may be changed depending on the thickness of the strip plate 1. Good things are natural.

2A and 2B show a second embodiment of the present invention. In this example, the same members, materials and the like as those in the first example are designated by the same reference numerals and the description thereof will be omitted.

The one end face 12 on the cutting side of the strip plate 11 of this example has the notches 15, 15 in order to embed the diamond tip 4 at a position between the notches 3 provided at regular intervals. Is provided. As shown in FIG. 2B, the notch 15 has two double-layered diamond tips 4 which are the same as those in the first embodiment, and the two diamond tips 4 are left and right alternately (up and down in FIG. 2B) in a staggered manner. It is fixed. With this structure, each diamond tip 4 is firmly held, and the operation and effect are similar to those of the first embodiment.

3A to 3D show a third embodiment of the present invention. The diamond saw S of this example is an example using a circular substrate.

As shown in FIG. 3A, the outer peripheral surface 22 on the cutting side of the circular substrate 21 is provided with a plurality of notched grooves 23, 23 at regular intervals, and the outer periphery located between the notched grooves 23. Two diamond tips 24 are fixed to the surface 22. As shown in FIG. 3B, the two diamond tips 24 are arranged on the left and right sides (the first and second sides) at a center XX of the thickness of the circular substrate 21 with a gap 25 therebetween.
It is fixed by shifting the position in the vertical direction (Fig. 3B).

The diamond tip 24 of the present example, as shown in FIG. 3C, is located on the side of the circular substrate 21 that is thicker than the outer layer 24a and the outer layer that is located at the position projecting from the circular substrate 21 to the cutting end face side. The outer layer 24a and the inner layer 24b have the same grain size and concentration as those of the first embodiment. In the case of this embodiment, the thickness of the circular substrate 21 is considerably large (5 mm
Therefore, the fixed range of the left and right diamond tips 24 is up to the center line of the thickness of the substrate as described above. For this reason, since the left and right diamond chips do not overlap each other in the vicinity of the center line of the substrate thickness, the thickness of the inner layer 24b of the diamond tip may be about three times the thickness of the outer layer 24a.

When the diamond saw S having such a structure is used for grooving of concrete, etc., the diamond tip 24 becomes 3D
As shown in the figure, there is no so-called "shoulder",
Since the inner layer 24b is worn more than the outer layer 24a and the recess 24c is formed, good sharpness is maintained.

In addition, in the first to third embodiments, the metal binder contained in the outer layer is preferably harder than the metal binder in the inner layer. And does not impair the effect.

[Effects of the Invention] As is clear from the above description, the diamond saw of the present invention is a diamond saw in which diamond chips composed of diamond abrasive grains and a metal binder are fixed to the end surface of the cutting side of the substrate at predetermined intervals. A two-layer chip comprising an outer layer at a position where the diamond tip projects from the substrate to the end face on the cutting side, and an inner layer at a thickness of 3 to 4 times the thickness of the outer layer and located on the substrate side. The size of the diamond abrasive grains contained in the outer layer is smaller than that of the diamond abrasive grains contained in the inner layer, and the diamond abrasive grain concentration of the outer layer is smaller than that of the inner layer. Since it was made higher to wear the inner layer more than the outer layer, the diamond tip has a recessed cross-section and the outer shoulder of the diamond tip is always The sharpness can be prevented and "shoulder sagging" can be prevented, and the sharpness can be improved. Since the sharpness can be improved in this way, the work efficiency is improved.

[Brief description of drawings]

1A to 1D show a first embodiment of the present invention, and FIG. 1A is a partial front view of a diamond band saw,
1B is a bottom view of FIG. 1A, FIG. 1C is an enlarged view of CC section of FIG. 1A, FIG. 1D is an enlarged view of DD section of FIG. 1A, and FIG. 1E uses a band saw slightly. 2A and 2B show a second embodiment of the present invention. FIG. 2A is a partial front view of the diamond band saw, and FIG. The bottom view and FIGS. 3A to 3D show the third embodiment of the present invention.
3A is a partial front view of the diamond saw, FIG. 3B is an expanded view of the outer periphery of FIG. 3A, and FIG. 3C is an enlarged cross-sectional view taken along the line CC of FIG. 3A.
3D is an enlarged view of the DD cross section of FIG. 3A, FIGS. 4A to 4D show a conventional example, FIG. 4A is a partial front view of a diamond band saw, and FIG. 4B is a bottom view of FIG. 4A. FIG. 4C is an enlarged cross-sectional view taken along the line CC of FIG. 4A, and FIG. 4 is an enlarged sectional view taken along the line D-D of FIG. 4A. 1,21 …… Substrate (band-shaped plate), 2,12 …… Cutting side end surface, 4,24…
… Diamond tips, 4a, 24a …… Outer layer, 4b, 24b ……
Inner layer, 5,6 ... Diamond abrasive grains, S ... Diamond saw.

Claims (2)

[Scope of utility model registration request] 1. A diamond saw having diamond chips composed of diamond abrasive grains and a metal binder fixed to a cutting-side end face of a substrate at a predetermined interval, wherein the diamond tip is located at a position protruding from the substrate to the cutting-side end face. It is composed of a two-layer chip consisting of an outer layer and an inner layer which is 3 to 4 times as thick as the outer layer and is located on the substrate side. The size of diamond abrasive grains contained in the outer layer is , Smaller than the diamond abrasive grains contained in the inner layer,
And, the diamond abrasive grain concentration of the outer layer is made higher than the diamond abrasive grain concentration of the inner layer to increase the wear of the inner layer more than the outer layer, and at least one diamond tip is provided on the cutting side end faces on both sides of the substrate. A diamond saw characterized in that it is fixed at a different position. 2. The diamond saw according to claim 1, wherein the substrate is a strip plate or a circular substrate.