JPS6215425U - - Google Patents
Info
- Publication number
- JPS6215425U JPS6215425U JP10658685U JP10658685U JPS6215425U JP S6215425 U JPS6215425 U JP S6215425U JP 10658685 U JP10658685 U JP 10658685U JP 10658685 U JP10658685 U JP 10658685U JP S6215425 U JPS6215425 U JP S6215425U
- Authority
- JP
- Japan
- Prior art keywords
- band
- circumferential direction
- plating
- edge
- electrodeposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図は、この考案の１実施例を示すもので、
バンドソーを示す一部正面図、第２図はバンドソ
ーを製作する過程を示した一部正面図、第３，４
図は従来例を示すもので、第３図は第１図に相当
する一部正面図、第４図は第３図の―線矢視
図である。
１０……バンド、１０ａ……一縁部、１１……
メツキ層、１２……ブレード。
Figure 1 shows one embodiment of this invention.
Figure 2 is a partial front view showing the band saw, Figure 2 is a partial front view showing the process of manufacturing the band saw, Figures 3 and 4 are
The drawings show a conventional example; FIG. 3 is a partial front view corresponding to FIG. 1, and FIG. 4 is a view taken along the line - in FIG. 10...band, 10a...one edge, 11...
Metsuki layer, 12...Blade.
Claims (1)
両側面であつて、その周方向全周にわたつてメツ
キしたメツキ層を形成し、かつメツキにより砥粒
を電着した複数のブレードをバンドの周方向に間
欠的に設けたことを特徴とするバンドソー。 A plating layer is formed on both sides of one edge in the circumferential direction of an endless metal band over the entire circumference, and a plurality of blades on which abrasive grains are electrodeposited by plating are attached to the band. A band saw characterized by being provided intermittently in the circumferential direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10658685U JPS6215425U (en) | 1985-07-12 | 1985-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10658685U JPS6215425U (en) | 1985-07-12 | 1985-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6215425U true JPS6215425U (en) | 1987-01-29 |
Family
ID=30982082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10658685U Pending JPS6215425U (en) | 1985-07-12 | 1985-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6215425U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH029680U (en) * | 1988-06-27 | 1990-01-22 | ||
| JP2005059164A (en) * | 2003-08-18 | 2005-03-10 | Asahi Diamond Industrial Co Ltd | Electro-deposition band saw |
-
1985
- 1985-07-12 JP JP10658685U patent/JPS6215425U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH029680U (en) * | 1988-06-27 | 1990-01-22 | ||
| JP2005059164A (en) * | 2003-08-18 | 2005-03-10 | Asahi Diamond Industrial Co Ltd | Electro-deposition band saw |