JP2005271184A - Saw blade, bit and band saw - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a saw blade, a bit and a band saw, preventing the separation of hard abrasive grains due to the action of heat in soldering or bonding, having long life and good sharpness, preventing the influence of thermal distortion, having high working accuracy, eliminating the need of masking a tip base, and dispensing with large-sized equipment in the case of a large-diameter tool to hold down the cost. <P>SOLUTION: A substrate 1 is formed disc-like, and in a plurality of first tip bases 2, joint surfaces 6 are bonded to the outer peripheral surface 5 of the disc-like base 1 by second soldering 3 using hard solder 3a or fusion welding 4, and hard abrasive grains are fixed to the side surface and outermost edge surface except the side near the joint surface 6 by first soldering using hard solder so that the side surface 7 near the joint surface 6 is not influenced by action of heat due to first soldering 3 or fusion welding 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to saw blades, bits and band saws used for cutting, cutting and drilling of stone, concrete, steel and other materials.

Conventionally, for example, Japanese Patent Application Laid-Open No. 11-58245 (Patent Document 1) has proposed an electrodeposition tool and a method for manufacturing the electrodeposition tool. The above-described conventional example is an electrodeposition tool in which abrasive grains are electrodeposited on the outer periphery of a circular base, and the circular base is composed of a base body and a plurality of chip bases that are attached to the outer periphery to form a cutting blade. The chip base is electrodeposited on a required region before being attached to the base body, and is integrally attached to the peripheral edge of the base body at a predetermined interval by a sticking means such as brazing. However, at the time of electrodeposition processing on the chip base, a process of performing masking or the like other than the electrodeposition required region is necessary.
Furthermore, for example, in Japanese Patent Application Laid-Open No. 2003-200352 (Patent Document 2),
Electrodeposition tools have been proposed. The above-described conventional example is an electrodeposition tool in which diamond abrasive grains or cBN abrasive grains are fixed to the outer peripheral surface and end surface of a cylindrical base metal or the outer peripheral surface and side surfaces of a disk-shaped base metal by an electrodeposition method. There is no chip base, and the abrasive grains are directly electrodeposited on the cylindrical base metal or the disk base main body. For this reason, it is necessary to secure high processing accuracy while suppressing distortion of the base metal due to heat during electrodeposition, and to solve the reduction in sharpness caused by peeling of the abrasive grains. Further, in this conventional example, a tool having a larger diameter and a larger electrodeposition facility are required, and cost measures are required.
Furthermore, for example, Japanese Patent Laid-Open No. 2000-317848 (Patent Document 3) proposes a band saw. In the above-described conventional example, a plurality of chip mounting portions are formed at a predetermined interval on one side edge of a flat belt, and a segment chip made of superabrasive grains and forming a substantially rectangular parallelepiped has a mounting surface to the belt. Are provided with grooves corresponding to the width of the belt. The both side surfaces of the groove are fitted in a state sandwiching both side surfaces of the belt, and fixed to each chip mounting portion by brazing. As a result, the width of the belt grinding path is minimized, and the wear of the individual chips can be made uniform.
JP-A-11-58245 JP 2003-200352 A JP 2000-317848 A

  In view of this, the present invention provides that the hard abrasive grains are fixed to the chip base in advance by brazing using a hard solder, and the chip base is made into a disk shape, a cylindrical shape, or a strip by brazing or fusion welding using a hard solder. By joining to the base of the base, there is no peeling of hard abrasive grains due to the action of heat during brazing and joining, long life and sharpness, no influence of thermal distortion, high processing accuracy, An object of the present invention is to provide a saw blade, a bit, and a band saw that do not require masking and do not require a large-scale equipment for a large-diameter tool, and that reduce costs.

In the first aspect of the present invention, a plurality of first chip bases to which hard abrasive grains are fixed by first brazing using hard brazing are arranged at intervals on the outer peripheral surface of a disk-shaped substrate. ,
The joining surface of the first chip base is joined to the outer peripheral surface of the disk-shaped base by second brazing using a hard solder or fusion welding to solidify molten metal. It is a saw blade.

In the present invention of claim 2, the joint surface of the first chip base is joined to the outer peripheral surface of the disk-shaped substrate by second brazing using the hard solder or the fusion welding. Side surfaces excluding the side surfaces in the vicinity of the joint surface of the first chip base by the first brazing using the hard solder so that the side surfaces in the vicinity of the joint surface are not affected by heat during the joining. The saw blade according to claim 1, wherein the hard abrasive grains are fixed to the outermost edge surface of the first chip base.

According to the third aspect of the present invention, a plurality of second chip bases to which hard abrasive grains are fixed by first brazing using hard brazing are arranged at intervals on one outer end face of a cylindrical base. And
The joining surface of the second chip base is joined to the outer end surface of the cylindrical base by second brazing using a hard solder or fusion welding to solidify molten metal. Is a bit.

According to a fourth aspect of the present invention, the joining surface of the second chip base is joined to the outer end surface of the cylindrical base body by the second brazing or the fusion welding using the hard solder, Side surfaces excluding the side surfaces in the vicinity of the joint surface of the second chip base by the first brazing using the hard solder so that the side surfaces in the vicinity of the joint surface are not affected by heat at the time of joining; The bit according to claim 3, wherein the hard abrasive grains are fixed to the outermost edge surface of the second chip base.

In the present invention of claim 5, the third chip base to which the hard abrasive grains are fixed by the first brazing using the hard solder is disposed on one outer end surface of the cylindrical base body,
The joining surface of the third chip base is joined to the outer end surface of the cylindrical base by second brazing using a hard solder or fusion welding to solidify molten metal. Is a bit.

According to a sixth aspect of the present invention, the joining surface of the third chip base is joined to the outer end surface of the cylindrical base body by the second brazing or the fusion welding using the hard solder, Side surfaces excluding the side surfaces in the vicinity of the joint surface of the third chip base by the first brazing using the hard solder so that the side surfaces in the vicinity of the joint surface are not affected by heat at the time of joining; The bit according to claim 5, wherein the hard abrasive grains are fixed to the outermost edge surface of the third chip base.

According to the seventh aspect of the present invention, a plurality of fourth chip bases to which the hard abrasive grains are fixed by the first brazing using the hard brazing are provided at intervals on one side edge surface of the belt-like substrate. Arranged,
The bonding surface of the fourth chip base is bonded to the side edge surface of the band plate-like substrate by second brazing using a hard brazing or fusion welding to solidify molten metal. It is a band saw.

According to the present invention of claim 8, the joining surface of the fourth chip base is joined to the side edge surface of the band plate-like substrate by the second brazing using the hard solder or the fusion welding. The side surface in the vicinity of the joint surface of the fourth chip base is removed by the first brazing using the hard solder so that the side surface in the vicinity of the joint surface is not affected by heat during the joining. The band saw according to claim 7, wherein the hard abrasive grains are fixed to a side surface and an outermost edge surface of the fourth chip base.

According to the first aspect of the present invention, as shown in FIGS. 1 to 3, a plurality of first chip bases 2 to which the hard abrasive grains 11 are fixed by the first brazing 8 using the hard brazing 8a. The disc-shaped substrate 1 is arranged with an interval on the outer peripheral surface 5 of the disc-shaped substrate 1, and the bonding surface 6 of the first chip base 2 uses the outer peripheral surface 5 of the disc-shaped substrate 1 and the hard solder 3a. Bonding is performed by the second brazing 3 or the fusion welding 4 for solidifying the molten metal 4a.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the disk-shaped substrate 1, and the processing accuracy is high. Furthermore, a large-diameter tool does not require a large facility and can reduce the cost.

According to the present invention of claim 2, as shown in FIGS. 4 a to 4 c, the joining surface 6 of the first chip base 2 has the second brazing 3 or the molten metal 4 a using the hard solder 3 a. A first braze 8a is used so that the outer peripheral surface 5 of the disk-shaped substrate 1 is bonded by the fusion welding 4 to be solidified, and the side surface 7 in the vicinity of the bonding surface 6 is not affected by the heat of the bonding. The hard abrasive grains 11 are fixed to the side surface 9 excluding the side surface 7 in the vicinity of the bonding surface 6 of the first chip base 2 and the outermost edge surface 10 of the first chip base 2 by brazing 8.
For this reason, masking of the first chip base 2 is unnecessary. Further, since the hard abrasive grains 11 are not peeled off from the first chip base 2 by the action of heat when the first chip base 2 and the disc-shaped substrate 1 are joined, the life is long and sharp. good.

According to the third aspect of the present invention, as shown in FIGS. 5, 6a, 6b, and 7a, the second hard abrasive grains 11 are fixed by the first brazing 8 using the hard brazing 8a. A plurality of chip bases 13 are arranged at intervals on one outer end surface 13 of the cylindrical base body 12, and the joining surface 15 of the second chip base 13 is connected to the outer end face 14 of the cylindrical base body 12. The second brazing 3 using the hard solder 3a or the fusion welding 4 for solidifying the molten metal 4a.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the cylindrical base body 12, and the processing accuracy is high. Furthermore, a large-diameter tool does not require a large facility and can reduce the cost.

According to the present invention of claim 4, as shown in FIGS. 7 a, 7 b and 4 c, the joining surface 15 of the second chip base 13 is the second brazing 3 or melting using the hard solder 3 a. A first brazing 8a is used so that the side surface 16 in the vicinity of the joint surface 15 is not subjected to the action of heat during the joining, and is joined to the outer end surface 14 of the cylindrical base 12 by fusion welding 4 for solidifying the metal 4a. The hard abrasive grains 11 are fixed to the side surface 17 excluding the side surface 16 in the vicinity of the bonding surface 15 of the second chip base 13 and the outermost edge surface 18 of the second chip base 13 by one brazing 8.
For this reason, masking of the first chip base 2 is unnecessary. Further, since the hard abrasive grains 11 do not peel from the second chip base 13 due to the action of heat when the second chip base 13 and the cylindrical base 12 are joined, the life is long and the sharpness is good. .

According to the fifth aspect of the present invention, as shown in FIGS. 8, 9a and 9b, the third chip base on which the hard abrasive grains 11 are fixed by the first brazing 8 using the hard brazing 8a. 20 is disposed on one outer end surface 21 of the cylindrical base body 19, and the joining surface 22 of the third chip base 20 is the second end surface using the outer end surface 21 of the cylindrical base body 19 and the hard solder 3a. It joins by the brazing 3 or the fusion welding 4 which solidifies the molten metal 4a.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the cylindrical base body 12, and the processing accuracy is high. Furthermore, a large-diameter tool does not require a large facility and can reduce the cost.

According to the present invention of claim 6, as shown in FIGS. 9 a, 9 b and 4 c, the joining surface 22 of the third chip base 20 is the second brazing 3 or melting using the hard solder 3 a. A first brazing 8a is used to join the outer end surface 21 of the cylindrical base body 19 by fusion welding 4 for solidifying the metal 4a, and to prevent the side surface 23 in the vicinity of the joining surface 22 from being affected by heat during joining. The hard abrasive grains 11 are fixed to the side surface 24 excluding the side surface 23 in the vicinity of the bonding surface 22 of the third chip base 20 and the outermost edge surface 25 of the third chip base 20 by the brazing 8 of 1.
For this reason, masking of the third chip base 20 is unnecessary. Further, since the hard abrasive grains 11 are not peeled off from the third chip base 20 by the action of heat at the time of joining the third chip base 20 and the cylindrical base body 19, it has a long life and good sharpness. .

According to the present invention of claim 7, as shown in FIGS. 10 a to 10 c, a plurality of fourth chip bases 27 to which the hard abrasive grains 11 are fixed by the first brazing 8 using the hard solder 8 a are provided. Are disposed at intervals on one side edge surface 28 of the base plate 26 in the form of a strip,
The joining surface 29 of the fourth chip base 27 is joined by the side edge surface 28 of the strip-like base body 26 and the second brazing 3 using the hard solder 3a or the fusion welding 4 for solidifying the molten metal 4a. Is done.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the band plate-like base body 26, and the processing accuracy is high. Furthermore, a large-diameter tool does not require a large facility and can reduce the cost.

According to the present invention of claim 8, as shown in FIGS. 10 b to 10 c and 4 c, the joint surface 29 of the fourth chip base 27 is the second brazing 3 or melting using the hard solder 3 a. The hard braze 8a is bonded to the side edge surface 28 of the band plate-like substrate 26 by fusion welding 4 for solidifying the metal 4a, and the side surface 30 in the vicinity of the bonding surface 29 is not affected by the heat of the bonding. By the first brazing 8 to be used, the hard abrasive grains 11 are fixed to the side surface 31 excluding the side surface 30 in the vicinity of the bonding surface 29 of the fourth chip base 27 and the outermost edge surface 32 of the fourth chip base 27. .
For this reason, masking of the fourth chip base 27 is unnecessary. Further, since the hard abrasive grains 11 are not peeled off from the fourth chip base 27 by the action of heat at the time of joining the fourth chip base 27 and the strip-shaped base body 26, it has a long life and sharpness. good.

Hereinafter, the present invention will be described with reference to the drawings based on the embodiments.

As shown in FIG. 1, a saw blade according to an embodiment of the present invention has a mounting hole 1b formed in a central portion 1a of a disc-like base 1, and a plurality of mounting holes 1b as shown in FIGS. The first chip base 2 is disposed on the outer peripheral surface 5 of the disk-shaped substrate 1 at a predetermined interval by the second brazing 3 using the hard solder 3a or the fusion welding 4 for solidifying the molten metal 4a. Be joined. The hard abrasive grains 11 are fixed to the first chip base 2 by the first brazing 8 using the hard brazing 8a in advance.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the disk-shaped substrate 1, and the processing accuracy is high. Furthermore, masking of the first chip base 2 is unnecessary, and a large-diameter tool does not require a large facility and can reduce costs.
As shown in FIGS. 4a and 4b, when the first chip base 2 and the disk-shaped base 1 are bonded, the side surface 7 in the vicinity of the bonding surface 6 of the first chip base 2 is hard. Side surfaces 9 excluding the side surface 7 in the vicinity of the joint surface 6 and the second brazing member 3 using the brazing member 3a or the heat welding 4 for solidifying the molten metal 4a to prevent the hard abrasive grains 11 from peeling off. Hard abrasive grains 11 are fixed to the outermost edge surface 10 in advance by first brazing 8 using a hard braze 8a.
For this reason, since the hard abrasive grains 11 are not peeled off from the first chip base 2 by the action of heat when the first chip base 2 and the disk-shaped substrate 1 are joined, the life is long and sharp. Is good.

As a means for joining the first chip base 2 and the disk-shaped base body 1, when the material of the first chip base 2 and the disk-shaped base body 1 is a different metal or non-metal, a hard solder 3 a is used. In the case of the same kind of metal material or the like, the second brazing 3 using the fusion welding 4 for solidifying the molten metal 4a can be used.
A specific method of the first brazing 8 using the hard solder 8a is to first knead a flux and a powdery brazing material, and apply them uniformly to the first chip base 2. Before the brazing material layer dries, the diamond abrasive grains 11 are sprayed and pressed to bury the diamond abrasive grains 11. Next, the first chip base 2 is put into a furnace (vacuum furnace), and the brazing material is melted to fix the diamond abrasive grains 11.
The material of the first chip base 2 is preferably tool steel containing Ti, but hard materials such as sintered metal and ceramics can also be applied, and are not limited depending on the application. The hard abrasive grains 11 are preferably superhard abrasive grains such as diamond and borazon. Further, as shown in FIG. 4c, the thickness 11a of the hard abrasive grains 11 to be formed is preferably equal to one hard abrasive grain 11.

The method of the second brazing 3 using the hard brazing 3a and the first brazing 8 using the brazing brazing 8a is preferably brazed in a vacuum furnace, but uses heat of combustion, electricity, light, etc. as a heat source. There are various types such as brazing, ultrasonic brazing, metallizing method, etc., which can be set according to the hard abrasive, the material of the chip base and the required quality (strength).
The brazing material in the second brazing 3 using the hard brazing 3a and the first brazing 8 using the hard brazing 8a is preferably a silver brazing material containing Ti or a copper brazing material. In the case of Cu—Ni brazing and ceramics, Ag—Cu—Ti brazing is used, and in the case of copper brazing, Cu—Mn—Ni brazing is used.
For the fusion welding 4 for solidifying the molten metal 4a, there are various welding methods using an electric energy source such as arc welding, laser welding, etc., and the material of the disk-shaped substrate 1 and the first chip base 2 to be joined. Depending on the dimensions and shape, it can be set in consideration of work efficiency, joint reliability, and the like.

As shown in FIGS. 5, 6a and 6b, the bit of one embodiment of the present invention includes a plurality of second chip bases 13 formed by second brazing 3 or molten metal using hard brazing 3a. By fusion welding 4 which solidifies 4a, it is arranged and bonded to one outer end surface 14 of the cylindrical base 12 at a predetermined interval. The hard abrasive grains 11 are fixed to the second chip base 13 by the first brazing 8 using the hard brazing 8a in advance.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the cylindrical base body 12, and the processing accuracy is high. Furthermore, masking of the second chip base 13 is not required, and a large-diameter tool does not require a large facility and can reduce costs.
As shown in FIGS. 7a and 7b, when the second chip base 13 and the cylindrical base 12 are bonded, the side surface 16 near the bonding surface 15 of the second chip base 13 is hard. In order to prevent the hard abrasive grains 11 from being peeled off due to the heat of the second brazing 3 or fusion welding 4 using 3a, the side 17 and the outermost edge 18 except for the side 16 in the vicinity of the bonding surface 15 are previously provided. The hard abrasive grains 11 are fixed by the first brazing 8 using the hard solder 8a.
For this reason, since the hard abrasive grains 11 do not peel off from the second chip base 13 due to the action of heat at the time of joining the second chip base 13 and the cylindrical base body 12, it has a long life and sharpness. good.

As means for joining the second chip base 13 and the cylindrical base 12, the first brazing 3 is used when the second chip base 13 and the cylindrical base 12 are made of different metals or non-metals. In the case of the same kind of metal material, the fusion welding 4 for solidifying the molten metal 4a can be used.
A specific method of the first brazing 8 using the hard solder 8a is to first knead a flux and a powdery brazing material and uniformly apply them to the second chip base 13. Before the brazing material layer dries, the diamond abrasive grains 11 are sprayed and pressed to bury the diamond abrasive grains 11. Next, the second chip base 13 is put into a furnace (vacuum furnace), and the brazing material is melted to fix the diamond abrasive grains 11.
The material of the second chip base 13 is preferably tool steel containing Ti, but hard materials such as sintered metals and ceramics can also be applied, and are not limited depending on the application. The hard abrasive grains 11 are preferably superhard abrasive grains such as diamond and borazon. Further, as shown in FIG. 4c, the thickness 11a of the hard abrasive grains 11 to be formed is preferably equal to one hard abrasive grain 11.

The brazing material in the second brazing 3 using the hard brazing 3a and the first brazing 8 using the hard brazing 8a is preferably a silver brazing material containing Ti or a copper brazing material. In the case of Cu—Ni brazing and ceramics, Ag—Cu—Ti brazing is used, and in the case of copper brazing, Cu—Mn—Ni brazing is used.
The method of the second brazing 3 using the hard brazing 3a and the first brazing 8 using the brazing brazing 8a is preferably performed by brazing in a vacuum furnace. There are various types such as brazing, ultrasonic brazing, metallizing method, etc., which can be set according to the hard abrasive, the material of the chip base and the required quality (strength).
The fusion welding 4 for solidifying the molten metal 4a includes various welding methods using an electric energy source such as arc welding and laser welding. The material of the cylindrical base 12 and the second tip base 13 to be joined, It can be set in consideration of work efficiency, joint reliability, etc., depending on dimensions and shape.

In the bit of another embodiment of the present invention, as shown in FIG. 8, the third tip base 20 formed in a ring shape has a second brazing 3 or a molten metal 4a using a hard brazing 3a. It is joined to one outer end surface 21 of the cylindrical base body 19 by the fusion welding 4 to be solidified. Further, as shown in FIG. 9b, the hard abrasive grains 11 are fixed to the third chip base 20 by the first brazing 8 using the hard solder 8a in advance.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the cylindrical base body 19 and has high processing accuracy. Furthermore, the masking of the third chip base 20 is unnecessary, and a large-diameter tool does not require a large facility and can reduce the cost.
Further, as shown in FIG. 9b, when the third chip base 20 and the cylindrical base body 19 are bonded, the side surface 23 in the vicinity of the bonding surface 22 of the third chip base 20 uses the hard solder 3a. The side surface 24 except the side surface 23 in the vicinity of the joint surface 22 and the outermost edge surface 25 so that the hard abrasive grains 11 do not peel off under the action of heat by the second brazing 3 or the fusion welding 4 that solidifies the molten metal 4a. Further, the hard abrasive grains 11 are fixed in advance by the first brazing 8 in which the hard abrasive grains 11 use the hard solder 8a.
For this reason, since the hard abrasive grains 11 do not peel off from the third chip base 20 due to the action of heat at the time of joining the third chip base 20 and the cylindrical base body 19, it has a long life and sharpness. good.

As a means for joining the second chip base 20 and the cylindrical base body 19, when the material of the third chip base 20 and the cylindrical base body 19 is a dissimilar metal or a non-metal, a hard solder 3a is used. In the case of the same kind of metal material or the like, the fusion welding 4 for solidifying the molten metal 4a can be used.
As a specific method of the first brazing 8 using the hard brazing 8a, first, a flux and a powdery brazing material are kneaded and uniformly applied to the third chip base 20. Before the brazing material layer dries, the diamond abrasive grains 11 are sprayed and pressed to bury the diamond abrasive grains 11. Next, the third chip base 20 is put into a furnace (vacuum furnace), and the brazing material is melted to fix the diamond abrasive grains 11.
The material of the third chip base 20 is preferably tool steel containing Ti, but hard materials such as sintered metals and ceramics can also be applied and are not limited depending on the application. The hard abrasive grains 11 are preferably superhard abrasive grains such as diamond and borazon. Further, as shown in FIG. 4c, the thickness 11a of the hard abrasive grains 11 to be formed is preferably equal to one hard abrasive grain 11.

The method of the second brazing 3 using the hard brazing 3a and the first brazing 8 using the brazing brazing 8a is preferably brazed in a vacuum furnace, but uses heat of combustion, electricity, light, etc. as a heat source. There are various types such as brazing, ultrasonic brazing, metallizing method, etc., which can be set according to the hard abrasive, the material of the chip base and the required quality (strength).
The brazing material in the second brazing 3 using the hard brazing 3a and the first brazing 8 using the hard brazing 8a is preferably a silver brazing material containing Ti or a copper brazing material. In the case of Cu-Ni brazing and ceramics, Ag-Cu-Ti brazing
For copper brazing, Cu—Mn—Ni brazing or the like is used.
For the fusion welding 4 for solidifying the molten metal 4a, there are various welding methods using an electric energy source such as arc welding, laser welding, etc., and the materials and dimensions of the cylindrical base body 19 and the third chip base 20 to be joined. Depending on the shape, it can be set in consideration of work efficiency, joint reliability, and the like.

In the band saw of one embodiment of the present invention, as shown in FIGS. 10a and 10b, the plurality of fourth tip bases 27 solidify the second brazing 3 or the molten metal 4a using the hard brazing 3a. By the fusion welding 4 to be performed, the belt plate-like base body 26 is arranged and bonded to the side edge surface 28 at a predetermined interval. The hard abrasive grains 11 are fixed to the fourth chip base 27 by the first brazing 8 using the hard brazing 8a in advance.
For this reason, the influence of the thermal strain due to the first brazing 8 using the hard brazing 8a does not reach the band plate-like base body 26, and the processing accuracy is high. Further, the masking of the fourth chip base 27 is unnecessary, and a large-diameter tool does not require a large facility and can reduce the cost.
Further, as shown in FIGS. 10b and 10c, when the fourth chip base 27 and the band plate-like base 26 are bonded, the side surface 30 in the vicinity of the bonding surface 29 of the fourth chip base 27 is hard. Side surfaces 31 excluding the side surface 30 in the vicinity of the joint surface 29 and the second brazing 3 using the brazing 3a or the heat action by the fusion welding 4 that solidifies the molten metal 4a and the hard abrasive grains 11 do not peel off. The hard abrasive grains 11 are fixed to the outermost edge surface 32 in advance by the first brazing 8 using the hard solder 8a.
For this reason, since the hard abrasive grains 11 are not peeled off from the fourth chip base 27 by the action of heat at the time of joining the fourth chip base 27 and the strip-shaped base body 26, it has a long life and sharpness. Is good.

As a means for joining the fourth chip base 27 and the belt-like base 26, when the material of the fourth chip base 27 and the belt-like base 26 is a dissimilar metal or a non-metal, a hard solder 3a is used. As the second brazing 3 to be used, in the case of the same kind of metal material or the like, the fusion welding 4 for solidifying the molten metal 4a can be used.
A specific method of the first brazing 8 using the hard solder 8a is to first knead a flux and a powdery brazing material and apply them uniformly to the fourth chip base 27. Before the brazing material layer dries, the diamond abrasive grains 11 are sprayed and pressed to bury the diamond abrasive grains 11. Next, the fourth chip base 27 is placed in a furnace (vacuum furnace), and the brazing material is melted to fix the diamond abrasive grains 11.
The material of the fourth chip base 27 is preferably tool steel containing Ti, but hard materials such as sintered metals and ceramics can also be applied and are not limited depending on the application. The hard abrasive grains 11 are preferably superhard abrasive grains such as diamond and borazon. Further, as shown in FIG. 4c, the thickness 11a of the hard abrasive grains 11 to be formed is preferably equal to one hard abrasive grain 11.

The method of the second brazing 3 using the hard brazing 3a and the first brazing 8 using the brazing brazing 8a is preferably brazed in a vacuum furnace, but uses heat of combustion, electricity, light, etc. as a heat source. There are various types such as brazing, ultrasonic brazing, metallizing method, etc., which can be set according to the hard abrasive, the material of the chip base and the required quality (strength).
The brazing material in the second brazing 3 using the hard brazing 3a and the first brazing 8 using the hard brazing 8a is preferably a silver brazing or a copper brazing containing Ti. In the case of Cu—Ni brazing and ceramics, Ag—Cu—Ti brazing is used, and in the case of copper brazing, Cu—Mn—Ni brazing is used.
For the fusion welding 4 for solidifying the molten metal 4a, there are various welding methods using an electric energy source such as arc welding, laser welding, etc., and the material of the band plate base 26 and the fourth chip base 27 to be joined Depending on the dimensions and shape, it can be set in consideration of work efficiency, joint reliability, and the like.
Next, the strip-shaped base body 26 is not limited to the form shown in FIG. 10a of the above embodiment, and a circular endless strip-shaped base body is also possible.

  The present invention provides a chip base in which hard abrasive grains are fixed in advance by first brazing using a hard solder, a disk shape or a cylinder by second brazing using hard brazing or fusion welding that solidifies molten metal. It is bonded to a substrate having a strip shape or a strip shape. For this reason, it has a long life with no flaking of hard abrasive grains, good sharpness, no influence of thermal distortion, high machining accuracy, no masking of the chip base, and large equipment is required for large diameter tools Instead, it is used as a saw blade, bit and band saw with reduced cost.

FIG. 1a is a front view of a saw blade according to a first embodiment of the present invention. FIG. 1 b is a side view of the saw blade according to the first embodiment of the present invention. It is A sectional view taken on the line of FIG. It is a fragmentary perspective view of the saw blade of Example 1 of this invention. FIG. 4 a is a view from B in FIG. 3. FIG. 4b is a C view of FIG. FIG. 4c is an enlarged view of each portion D in FIGS. 4a, 7a, and 9b. It is a fragmentary perspective view of the bit of Example 2 of the present invention. FIG. 6a is a plan view of the bit according to the second embodiment of the present invention. FIG. 6b is a side view of the bit according to the second embodiment of the present invention. FIG. 7a is an E view of FIG. FIG. 7 b is a F view of FIG. 5. It is a perspective view of the bit of Example 3 of the present invention. FIG. 9a is a plan view of a bit according to the third embodiment of the present invention. FIG. 9b is a side view of the bit according to the third embodiment of the present invention. FIG. 10a is a front view of a band saw according to a fourth embodiment of the present invention. 10b is a cross-sectional view taken along the line G in FIG. 10a. FIG. 10c is an enlarged view of a portion H in FIG. 10a.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Disc-shaped base | substrate 1a Center part 1b Mounting hole 2 1st chip base 3 2nd brazing 3a Hard solder 4 Fusion welding 4a Molten metal 5 Outer peripheral surface
6 joint surface
7, 9 side
8 First brazing 8a Hard brazing 10 Outermost edge surface 11 Hard abrasive grains 11a Hard abrasive thickness 12, 19 Cylindrical substrate
13 Second chip base 14, 21 Outer end surface 15 Bonding surface 16, 17 Side surface 18 Outermost edge surface
20 Third chip base 22 Bonding surface 23, 24 Side surface 25 Outermost edge surface 26 Band-plate-shaped base 27 Fourth chip base 28 Side edge surface 28a Mounting portion 29 Bonding surface 30, 31 Side surface 32 Outermost edge surface

Claims (8)

A plurality of first chip bases to which hard abrasive grains are fixed by first brazing using hard brazing are arranged at intervals on the outer peripheral surface of the disc-shaped substrate;
The bonding surface of the first chip base is bonded to the outer peripheral surface of the base on the disk by second brazing using a hard brazing or fusion welding to solidify a molten metal. Saw blade to do. The joint surface of the first chip base is joined to the outer peripheral surface of the disk-shaped base by second brazing using the hard solder or the fusion welding, and a side surface in the vicinity of the joint surface is The first chip base and the side surfaces excluding the side surfaces in the vicinity of the joint surface of the first chip base by the first brazing using the hard solder so as not to receive the effect of heat at the time of bonding The saw blade according to claim 1, wherein the hard abrasive grains are fixed to the outermost edge surface. A plurality of second chip bases to which the hard abrasive grains are fixed by the first brazing using the hard solder are arranged at intervals on one outer end surface of the cylindrical base body;
The joining surface of the second chip base is joined to the outer end surface of the cylindrical base by second brazing using a hard solder or fusion welding to solidify molten metal. bit. The joint surface of the second chip base is joined to the outer end surface of the cylindrical base body by second brazing using the hard solder or the fusion welding, and a side surface in the vicinity of the joint surface is In order not to receive the effect of heat at the time of joining, the side surfaces of the second chip base except for the side face in the vicinity of the joint surface by the first brazing using the hard solder and the second chip base The bit according to claim 3, wherein the hard abrasive grains are fixed to the outermost edge surface. A third chip base to which hard abrasive grains are fixed by first brazing using a hard solder is disposed on one outer end surface of a cylindrical base;
The joining surface of the third chip base is joined to the outer end surface of the cylindrical base by second brazing using a hard solder or fusion welding to solidify molten metal. bit. The joint surface of the third chip base is joined to the outer end surface of the cylindrical base body by the second brazing using the hard solder or the fusion welding, and the side surface in the vicinity of the joint surface is In order not to receive the effect of heat at the time of bonding, the side surfaces of the third chip base except for the side surfaces in the vicinity of the bonding surface by the first brazing using the hard solder and the third chip base The bit according to claim 5, wherein the hard abrasive grains are fixed to the outermost edge surface. A plurality of fourth chip bases to which the hard abrasive grains are fixed by the first brazing using the hard solder are arranged at intervals on one side edge surface of the belt-like base;
The bonding surface of the fourth chip base is bonded to the side edge surface of the band plate-like substrate by second brazing using a hard brazing or fusion welding to solidify molten metal. A band saw. The joint surface of the fourth chip base is joined to the side edge surface of the band plate-like substrate by the second brazing using the hard solder or the fusion welding, and a side surface in the vicinity of the joint surface. However, the first chip base using the hard brazing removes the side surface except the side surface of the fourth chip base in the vicinity of the bonding surface and the fourth chip base so that the heat is not applied during the bonding. The band saw according to claim 7, wherein the hard abrasive grains are fixed to the outermost edge surface of the table.

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