JPH03104553A - Cutting wire - Google Patents
Cutting wireInfo
- Publication number
- JPH03104553A JPH03104553A JP24161989A JP24161989A JPH03104553A JP H03104553 A JPH03104553 A JP H03104553A JP 24161989 A JP24161989 A JP 24161989A JP 24161989 A JP24161989 A JP 24161989A JP H03104553 A JPH03104553 A JP H03104553A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- wire
- cutting
- core wire
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 45
- 239000006061 abrasive grain Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 238000005219 brazing Methods 0.000 claims abstract description 27
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 14
- 239000010432 diamond Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 6
- 239000010937 tungsten Substances 0.000 claims abstract description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 5
- 239000011733 molybdenum Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 15
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 4
- 230000002349 favourable effect Effects 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 19
- 239000011888 foil Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はワイヤーソー等に取付けてセラξツクス等の
硬質材料を切断する切断用ワイヤーに関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting wire that is attached to a wire saw or the like to cut hard materials such as ceramics.
一般に、ワイヤーソーは第５図に示すように、複数のホ
イルＦに切断用ワイヤーＢを巻掛け、図示しない駆動源
によりホイルＦを回転し、これによって旋回移動する切
断用ワイヤーＢで非切断物Ｗを切削し切断するものであ
る。In general, as shown in FIG. 5, a wire saw has a cutting wire B wrapped around a plurality of foils F, and a drive source (not shown) rotates the foils F, thereby cutting the uncut object using the cutting wire B that rotates. This is for cutting and cutting W.
従来、セラξツクス等の硬質材料を切削し切断する切断
用ワイヤーＢは第３図および第４図に示すように、ワイ
ヤー状の芯線１１の表面にダイヤモンドあるいはボラゾ
ン等の高硬度砥粒１２を結合材１３により固定したもの
で、この製造には、芯線に高硬度砥粒をニッケル鍍金に
より固定する方法つまり電着により固定する方法や、そ
の高硬度砥粒を含む銅を主体とした焼結体を特殊な方法
により線引きして作成する方法等があり、両方とも金属
の結合材のかぶりによる抱き力つまり保持力と、電着の
場合は砥粒同士の搦みによる抱き力によって高硬度砥粒
を固定していた。Conventionally, a cutting wire B for cutting hard materials such as ceramics has high hardness abrasive grains 12 such as diamond or borazone on the surface of a wire-shaped core wire 11, as shown in FIGS. 3 and 4. It is fixed with a bonding material 13, and this manufacturing method involves fixing high hardness abrasive grains to the core wire by nickel plating, that is, fixing by electrodeposition, or sintering mainly made of copper containing the high hardness abrasive grains. There are methods such as drawing the body using a special method, and both methods use the holding force due to the covering of the metal binding material, and in the case of electrodeposition, the holding force due to the grinding of the abrasive grains makes it possible to create a high hardness abrasive. The grains were fixed.
〔発明が解決しようとする課題］
しかしながら、上記従来の切断用ワイヤーによると、次
のような問題点がある。[Problems to be Solved by the Invention] However, the above conventional cutting wire has the following problems.
電着による固定方法や線引きによる方法は、結合材を形
或する金属材料と高硬度砥粒との界面の接着力がなく、
金属の結合材や砥粒同士の搦みによる抱き力によって高
硬度砥粒を固定しているため、非切断物の切断作業によ
り高硬度砥粒の抱き力が弱くなれば脱落し、１個の高硬
度砥粒が脱落するとその高硬度砥粒の搦みによって係止
されている高硬度砥粒も脱落し易くなる。特に、乾式切
断を行う場合には切削の摩擦熱により容易に砥粒同士の
搦みによる抱き力となる内部応力が除去され、加えて結
合材の機械的強度も低下して、高硬度砥粒が脱落し易く
なる。Fixing methods such as electrodeposition and wire drawing do not have adhesive strength at the interface between the metal material forming the bonding material and the high hardness abrasive grains.
Since the high-hardness abrasive grains are fixed by the holding force of the metal binding material and the abrasive grains, if the holding force of the high-hardness abrasive grains becomes weak during cutting work on non-cutting objects, they will fall off and become one piece. When the high-hardness abrasive grains fall off, the high-hardness abrasive grains held by the hardness of the high-hardness abrasive grains also tend to fall off. In particular, when dry cutting is performed, the frictional heat of cutting easily removes the internal stress that causes the holding force caused by the grinding of the abrasive grains, and in addition, the mechanical strength of the bonding material decreases, and the high-hardness abrasive becomes easy to fall off.
また、金属の結合材のかぶりによる抱き力つまり保持力
により高硬度砥粒を固定しているが、複数のホイルに巻
掛けて使用するので、ホイル径が小さいと外径に大きな
引っ張り力を生じ、高硬度砥粒と結合材の間に隙間Ｓ（
第３図参照）を生じ、これを繰り返すことにより切刃で
ある高硬度砥粒の抜け出しも多くなって短寿命となる。In addition, the high-hardness abrasive grains are fixed by the holding force caused by the covering of the metal binding material, but since they are used by wrapping them around multiple foils, if the foil diameter is small, a large tensile force will be generated on the outer diameter. , a gap S (
(see Figure 3), and by repeating this, the high-hardness abrasive grains that form the cutting edge often slip out, resulting in a short life.
そして、いずれの方法も切刃である高硬度砥粒は結合材
に埋没されているため、高硬度砥粒には熱が蓄積され早
期に熱磨耗となり、切削力が低下する。In both methods, the high-hardness abrasive grains that serve as cutting edges are embedded in the binder, so heat is accumulated in the high-hardness abrasive grains, causing early thermal wear and reducing the cutting force.
この発明は上記問題点に鑑みてなされたもので、寿命が
長く、しかも切削性に優れた切断用ワイヤーを提供する
ことにある。This invention was made in view of the above problems, and the object is to provide a cutting wire that has a long life and excellent cutting properties.
この発明は上記課題を解決するため、高抗張力を有する
ワイヤー状の芯線と、その芯線の外周面に金属鑞付によ
り鑞接した高硬度砥粒とからなる切断用ワイヤーを構威
したものである．また、前記高硬度砥粒にはダイヤモン
ド砥粒またはボラゾン砥粒がよい。In order to solve the above-mentioned problems, this invention comprises a cutting wire consisting of a wire-shaped core wire having high tensile strength and high-hardness abrasive grains soldered to the outer peripheral surface of the core wire by metal brazing. ．． Further, the high hardness abrasive grains are preferably diamond abrasive grains or borazone abrasive grains.
そして、前記芯線はタングステンまたはモリブデンがよ
い。The core wire is preferably made of tungsten or molybdenum.
さらに、前記金属鑞付は銅一銀合金がよい。Furthermore, the metal brazing is preferably a copper-silver alloy.
この発明によれば、芯線に高硬度砥粒を金属鑞付で鑞接
したことにより高硬度砥粒が濡れを生じ、芯線と高硬度
砥粒との融着が可能となり、結合材のかぶりが少ない状
態で、強固に接着することができる．
〔実施例〕
この発明に係る一実施例を図面に基づいて説明する．
図面の第１図は切断用ワイヤーの説明図、第２図は第１
図のｎ−ｎ’線説明断面図である。According to this invention, the high hardness abrasive grains are soldered to the core wire using metal solder, so that the high hardness abrasive grains become wet, making it possible to fuse the core wire and the high hardness abrasive grains, and thereby reducing the covering of the bonding material. Strong adhesion can be achieved even with a small amount of adhesive. [Example] An example of the present invention will be explained based on the drawings. The first figure in the drawing is an explanatory diagram of the cutting wire, and the second figure is the first figure.
It is an explanatory sectional view taken along the line nn' in the figure.
第１図および第２図に示すように切断用ワイヤーＡは、
高抗張力を有するワイヤー状の芯線１と、その芯線ｌの
外周面に金属鑞付２により鑞接した高硬度砥粒３とから
なる．
この高硬度砥粒３は粒度＃１００〜４００のダイヤモン
ド砥粒やボラゾン砥粒である．ダイヤモンド砥粒は、空
気中では溶融金属によって濡れを生じることがなく、ま
た金属鑞付によっても融着させることができないが、雰
囲気の調整された容器内、例えば、真空中や不活性ガス
中でならば漏れを生じるので、融着が可能となる。As shown in FIGS. 1 and 2, the cutting wire A is
It consists of a wire-shaped core wire 1 having high tensile strength and high-hardness abrasive grains 3 soldered to the outer peripheral surface of the core wire 1 by metal brazing 2. The high hardness abrasive grains 3 are diamond abrasive grains or borazone abrasive grains with a grain size of #100 to #400. Diamond abrasive grains cannot be wetted by molten metal in air, nor can they be fused by metal brazing, but diamond abrasive grains cannot be wetted by molten metal in air, nor can they be fused by metal brazing. In that case, leakage would occur and fusion would be possible.
また、空気中ではダイヤモンドは約７００″Ｃの温度で
同素−変態を生じて黒鉛化するようになるが、雰囲気を
調整した容器内では、変態温度が約１０００″Ｃ程度ま
で上昇するので、約１０００″Ｃ以下での鑞接が可能と
なる。Furthermore, in air, diamond undergoes an allotropic transformation at a temperature of about 700"C and becomes graphitized, but in a container with a controlled atmosphere, the transformation temperature rises to about 1000"C. It is possible to solder at temperatures below about 1000″C.
金属鑞付としては芯線および炭素と反応しない材料が必
要となり、この金属鑞付が基材である芯線と反応して芯
線が金属鑞付に拡散すると、その拡散成分とダイヤモン
ド砥粒との間に反応を生じる。また、金属鑞付がダイヤ
モンド砥粒と反応すれば合金を生じ、湯流れが悪くなり
、鑞接不良となる恐れがある。Metal brazing requires a material that does not react with the core wire and carbon, and when this metal brazing reacts with the core wire, which is the base material, and the core wire diffuses into the metal brazing, there is a gap between the diffused components and the diamond abrasive grains. produce a reaction. Furthermore, if the metal braze reacts with the diamond abrasive grains, an alloy may be formed, which may impede the flow of the metal and result in poor soldering.
よって、高硬度砥粒３がダイヤモンド砥粒の場合、好ま
しい芯線ｌとしては強度および熱的特性からタングステ
ンやモリブデン等がよく、好ましい金属鑞付２は化学的
特性から金．ｓｍ．ｗ４およびそれらの合金であるが、
単体金属では鑞接温度が高くなり過ぎるので、銀一銅合
金がよく、特に、２８．１％銅一残恨の共晶合金がよい
。この合金の融点は７７９．４゜Ｃであり、従って、好
適な鑞接温度は８５０〜９ ０ ０ ”Ｃとなる。Therefore, when the high-hardness abrasive grains 3 are diamond abrasive grains, the preferred core wire 1 is tungsten, molybdenum, etc. from the viewpoint of strength and thermal properties, and the preferred metal brazing 2 is gold. sm. w4 and their alloys,
Since the soldering temperature of a single metal would be too high, a silver-copper alloy is preferable, and in particular, a 28.1% copper-copper eutectic alloy is preferable. The melting point of this alloy is 779.4°C, so the preferred soldering temperature is 850-900''C.
以上の方法によって製造した切断用ワイヤーＡは、鑞接
により高硬度砥粒３そのものが芯線１の外周面に直接的
に固着あるいは接着しているので、僅かな金属鑞付２で
かぶりが小さく、小面積での接着でも十分な鑞接強度を
保持し、切削による切断作業に共しても、切断性がよく
、高硬度砥粒３が脱落し難く、また、表面の高硬度砥粒
３が脱落しても、従来のように相互間の搦みによる抱き
力不足のため、連鎖的に隣接した高硬度砥粒３が脱落す
るということがないので長寿命化が期待できるし、さら
に、切削で熱が出ても、高硬度砥粒３は熱の放散面積が
大きい上熱伝導性に優れ、また金属鑞付２や芯線ｌ共に
熱伝導性がよいので、熱が蓄積されて高硬度砥粒３が燃
えることもなく、切削能力が低下することもない。In the cutting wire A manufactured by the above method, the high-hardness abrasive grains 3 themselves are directly fixed or bonded to the outer peripheral surface of the core wire 1 by brazing, so the fog is small with a small amount of metal brazing 2. It maintains sufficient soldering strength even when adhering in a small area, has good cutting properties even during cutting work, and the high-hardness abrasive grains 3 do not easily fall off, and the high-hardness abrasive grains 3 on the surface Even if the abrasive grains fall off, the adjacent high-hardness abrasive grains 3 will not fall off in a chain due to the lack of holding force due to mutual grinding, as in the past, so a longer life can be expected. Even if heat is generated, the high hardness abrasive grains 3 have a large heat dissipation area and are excellent in thermal conductivity, and both the metal brazing 2 and the core wire 1 have good thermal conductivity, so heat is accumulated and the high hardness abrasive grains The grains 3 do not burn and the cutting ability does not deteriorate.
また、第５図に示したようなワイヤーソーに取付けて使
用する場合に、複数のホイルに切断用ワイヤーＡを巻掛
けて使用するので、ホイル径が小さいと外径に大きな引
っ張り力を生じる。つまりワイヤーＡが湾曲することに
なるが、金属鑞付２のかふりが小さく、小面積での接着
でも十分な鑞接強度を保持できるので、従来の切断用ワ
イヤーのように、高硬度砥粒と結合材の間に隙間を生じ
これを繰り返すことにより金属疲労による切断を生じた
り、切刃である高硬度砥粒の抜け出したりすることがな
く、この点においても、長寿命化が期待できる．
以下、切断用ワイヤーの実験例を説明する。Furthermore, when the cutting wire A is used by being attached to a wire saw as shown in FIG. 5, the cutting wire A is wound around a plurality of foils, so if the foil diameter is small, a large tensile force is generated on the outer diameter. In other words, the wire A will be curved, but since the metal brazing 2 has a small bend and can maintain sufficient soldering strength even when bonding in a small area, it can be used with high hardness abrasive grains like a conventional cutting wire. By creating gaps between the bonding materials and repeating this process, there is no chance of cutting due to metal fatigue or the high-hardness abrasive grains that form the cutting edge will come off, and in this respect, a longer life can be expected. An experimental example of the cutting wire will be described below.
電熱ヒータおよび温度検知器を内蔵した雰囲気の調整さ
れた密閉容器内で、溶解した銀一銅等を主体とする合金
層にタングステン等のワイヤーを浸漬し、そのワイヤー
の外周部に鑞付の合金層を形威し、その外周面にダイヤ
モンドあるいはボラゾン等の砥粒を付着させ、８５０〜
９００″Ｃの温度で砥粒の鑞接を行った。In a sealed container with a controlled atmosphere and a built-in electric heater and temperature sensor, a wire of tungsten or other material is immersed in a layer of an alloy mainly composed of molten silver and copper, and the outer periphery of the wire is coated with a brazed alloy. A layer is shaped, and abrasive grains such as diamond or borazone are attached to the outer circumferential surface of the layer, and abrasive grains of 850~
The soldering of the abrasive grains was carried out at a temperature of 900″C.
金属鑞付はダイヤモンド砥粒層によく浸透しており芯材
ともよく溶着していた。外周表面の溶着が不十分なダイ
ヤモンド砥粒は取り除き、製品とした。そして、ワイヤ
ーソーとして使用するために、切断用ワイヤーの両端部
同士を接合して環状に形戒し、複数のホイルに巻き掛け
て、セラミックスの切断に使用したところ、切削性もよ
く、ダイヤモンド砥粒の脱落も見られず、従来の切断用
ワイヤーに比して２倍の寿命を示した。The metal brazing penetrated well into the diamond abrasive grain layer and was well welded to the core material. The diamond abrasive grains that were insufficiently welded to the outer peripheral surface were removed and the product was made. In order to use it as a wire saw, we joined the ends of a cutting wire to form a ring, wrapped it around multiple pieces of foil, and used it to cut ceramics. No particles were observed to fall off, and the lifespan was twice that of conventional cutting wires.
この発明は上記一実施例に限るものではなく、例えば、
鑞付添加金属として、Ｎｉ，Ｔｉ，Ｍｎ等を用いてもよ
い。また、芯線もタングステンやモリブデン以外である
ピアノ線等の硬高線等でもよい。This invention is not limited to the above-mentioned example, but for example,
Ni, Ti, Mn, etc. may be used as the brazing additive metal. Further, the core wire may also be a hard wire made of materials other than tungsten or molybdenum, such as piano wire.
〔発明の効果〕
この発明は以上のように構或したので、次のような効果
がある。[Effects of the Invention] Since this invention is constructed as described above, it has the following effects.
高硬度砥粒そのものが芯線の外周面に直接的に固着して
いるので、僅かな金属鑞付でかぶりが小さく、小面積で
の接着でも十分な鑞接強度を保持し、切削作業に共して
も、切断性がよく、高硬度砥粒が脱落し難く、表面の高
硬度砥粒が脱落しても、従来のように相互間の搦みによ
る抱き力不足のため、連鎖的に隣接した高硬度砥粒が脱
落するということがない。また、複数のホイルに巻掛け
て使用しても、金属疲労による切断を生じたり、切刃で
ある高硬度砥粒の抜け出しがないので、長寿命化が期待
できる．
さらに、金属鑞付のかぶりが小さくても十分な鑞接強度
を保持できるので、高硬度砥粒の露出部分が大きく熱方
散が良好となり、高硬度砥粒に熱が蓄積されて早期に熱
磨耗となることがなく、切削能力が低下することもない
。Since the high-hardness abrasive grains themselves are directly adhered to the outer peripheral surface of the core wire, fogging is small even with a small amount of metal brazing, and sufficient solder strength is maintained even when bonding in a small area, making it suitable for cutting work. Even if the high-hardness abrasive grains on the surface do not fall off, there is a lack of holding force due to mutual grinding, so the high-hardness abrasive grains do not easily fall off. High hardness abrasive grains do not fall off. In addition, even when used wrapped around multiple foils, there will be no cutting due to metal fatigue, and the high hardness abrasive grains that make up the cutting edge will not come off, so a long life can be expected. In addition, sufficient soldering strength can be maintained even with a small metal brazing cover, so the exposed area of the high-hardness abrasive grains is large and heat dissipation is good, allowing heat to accumulate in the high-hardness abrasive grains and heat up quickly. There is no wear and there is no reduction in cutting ability.
図面の第１図はこの発明の一実施例に係る切断用ワイヤ
ーの説明図、第２図は第１図のｎ−ｎ’線説明断面図、
第３図は従来例の説明図、第４図は第３図のＩＶ−ＩＶ
’線説明断面図、第５図はワイヤーソーの説明図である
。
Ａ・・・切断用ワイヤー ｌ・・・芯線２・・・金属
鑞付 ３・・・高硬度砥粒第２図
第４図
第５図FIG. 1 of the drawings is an explanatory diagram of a cutting wire according to an embodiment of the present invention, FIG. 2 is an explanatory sectional view taken along line nn' in FIG. 1,
Figure 3 is an explanatory diagram of the conventional example, and Figure 4 is IV-IV of Figure 3.
5 is an explanatory diagram of a wire saw. A... Cutting wire l... Core wire 2... Metal brazing 3... High hardness abrasive grains Figure 2 Figure 4 Figure 5
Claims (4)
の外周面に金属鑞付により鑞接した高硬度砥粒とからな
ることを特徴とする切断用ワイヤー。(1) A cutting wire characterized by comprising a wire-like core wire having high tensile strength and high-hardness abrasive grains soldered to the outer peripheral surface of the core wire by metal brazing.
ン砥粒であることを特徴とする請求項１記載の切断用ワ
イヤー。(2) The cutting wire according to claim 1, wherein the high-hardness abrasive grains are diamond abrasive grains or borazone abrasive grains.
ことを特徴とする請求項１または２記載の切断用ワイヤ
ー。(3) The cutting wire according to claim 1 or 2, wherein the core wire is made of tungsten or molybdenum.
る請求項１ないし３記載の切断用ワイヤー。(4) The cutting wire according to any one of claims 1 to 3, wherein the metal brazing material is a copper-silver alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24161989A JPH03104553A (en) | 1989-09-18 | 1989-09-18 | Cutting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24161989A JPH03104553A (en) | 1989-09-18 | 1989-09-18 | Cutting wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104553A true JPH03104553A (en) | 1991-05-01 |
Family
ID=17077021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24161989A Pending JPH03104553A (en) | 1989-09-18 | 1989-09-18 | Cutting wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104553A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
| US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
| JP2006123024A (en) * | 2004-10-26 | 2006-05-18 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
| JP2007126773A (en) * | 2005-11-02 | 2007-05-24 | Qingdao Gyoha En-Tech Co Ltd | Method for producing eyelet and its structure |
| JP2010131698A (en) * | 2008-12-04 | 2010-06-17 | Akita Univ | Saw wire and method of manufacturing the same |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| WO2022259927A1 (en) * | 2021-06-11 | 2022-12-15 | パナソニックＩｐマネジメント株式会社 | Electroplated wire and metal wire for saw wire and method for producing electroplated wire for saw wire |
-
1989
- 1989-09-18 JP JP24161989A patent/JPH03104553A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
| US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
| WO1999046077A3 (en) * | 1998-03-11 | 2003-07-24 | Norton Co | Superabrasive wire saw and method for making the saw |
| EP1371438A1 (en) * | 1998-03-11 | 2003-12-17 | Saint-Gobain Abrasives, Inc. | Superabrasive wire saw and method for making it |
| JP2006123024A (en) * | 2004-10-26 | 2006-05-18 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
| JP2007126773A (en) * | 2005-11-02 | 2007-05-24 | Qingdao Gyoha En-Tech Co Ltd | Method for producing eyelet and its structure |
| JP2010131698A (en) * | 2008-12-04 | 2010-06-17 | Akita Univ | Saw wire and method of manufacturing the same |
| JP4590513B2 (en) * | 2008-12-04 | 2010-12-01 | 国立大学法人秋田大学 | Saw wire and manufacturing method thereof |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| WO2022259927A1 (en) * | 2021-06-11 | 2022-12-15 | パナソニックＩｐマネジメント株式会社 | Electroplated wire and metal wire for saw wire and method for producing electroplated wire for saw wire |
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