WO2022050071A1 - Dispositif laser et procédé de fabrication de dispositif laser - Google Patents

Dispositif laser et procédé de fabrication de dispositif laser Download PDF

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Publication number
WO2022050071A1
WO2022050071A1 PCT/JP2021/030434 JP2021030434W WO2022050071A1 WO 2022050071 A1 WO2022050071 A1 WO 2022050071A1 JP 2021030434 W JP2021030434 W JP 2021030434W WO 2022050071 A1 WO2022050071 A1 WO 2022050071A1
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WIPO (PCT)
Prior art keywords
base
flow path
light source
source unit
holder
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PCT/JP2021/030434
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English (en)
Japanese (ja)
Inventor
琢斗 井口
義則 加藤
宇亮 森田
一希 川合
Original Assignee
浜松ホトニクス株式会社
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Application filed by 浜松ホトニクス株式会社 filed Critical 浜松ホトニクス株式会社
Priority to CN202180054293.XA priority Critical patent/CN116057796A/zh
Priority to US18/022,764 priority patent/US20230318245A1/en
Priority to EP21864129.8A priority patent/EP4181332A4/fr
Publication of WO2022050071A1 publication Critical patent/WO2022050071A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0602—Crystal lasers or glass lasers
    • H01S3/061—Crystal lasers or glass lasers with elliptical or circular cross-section and elongated shape, e.g. rod
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/09408—Pump redundancy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/1601—Solid materials characterised by an active (lasing) ion
    • H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
    • H01S3/1611—Solid materials characterised by an active (lasing) ion rare earth neodymium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/163—Solid materials characterised by a crystal matrix
    • H01S3/164—Solid materials characterised by a crystal matrix garnet
    • H01S3/1643—YAG
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4056—Edge-emitting structures emitting light in more than one direction

Definitions

  • This disclosure relates to a laser device and a method for manufacturing the laser device.
  • a laser device including a rod-shaped laser medium and a plurality of excitation light sources for emitting excitation light for exciting the laser medium is known (see, for example, Patent Document 1).
  • each excitation light source may be configured to be detachable from the laser device while the laser device is mounted on the laser system. In such a configuration, when exchanging each excitation light source, it is necessary to severely adjust the position and orientation of each excitation light source with respect to the laser medium so that the excitation distribution in the laser medium becomes a desired state.
  • the entire laser device may be configured to be detachable from the laser system. In such a configuration, when exchanging each excitation light source, it is necessary to severely adjust the position and orientation of the laser device in the laser system so that the optical axis of the laser medium coincides with the optical axis of the laser system. be.
  • the laser apparatus on one side of the present disclosure includes a rod-shaped laser medium extending along a first direction, a first base, and a first light source unit including a plurality of excitation light sources attached to the first base.
  • a holder that supports a second light source unit, at least one of the first base and the holder includes a first defining part that defines the position of the first base with respect to the holder, and at least one of the second base and the holder. , Includes a second defining part that defines the position of the second base with respect to the holder.
  • the first base and a plurality of excitation light sources are unitized as a first light source unit
  • the second base and a plurality of excitation light sources are unitized as a second light source unit
  • the second light source unit is supported by the holder in a state of being juxtaposed in the second direction.
  • a plurality of excitation light sources can be easily attached to and detached from the holder simply by attaching and detaching the first base and the second base to and from the holder.
  • the position of the first base with respect to the holder is defined by the first defining unit
  • the position of the second base with respect to the holder is the second.
  • a plurality of excitation light sources can be easily positioned with respect to the laser medium only by attaching each of the first base and the second base to the holder supporting the laser medium.
  • this laser device it is possible to facilitate the attachment / detachment of a plurality of excitation light sources and the positioning of a plurality of excitation light sources.
  • the holder includes a first holding member and a second holding member juxtaposed in the first direction, and a connecting member for connecting the first holding member and the second holding member.
  • the first light source unit and the second light source unit may be arranged between the first holding member and the second holding member. According to this, it is possible to reduce the size of the laser device and simplify the structure.
  • the connecting member may have a support surface that slidably supports the first base and the second base along the second direction. According to this, by sliding each of the first base and the second base on the support surface of the connecting member, a plurality of excitation light sources can be easily attached to and detached from the holder.
  • the connecting member includes, as a first defining part, a first stopper that regulates the movement of the first base along the second direction, and as a second defining part, in the second direction. It may include a second stopper that regulates the movement of the second base along.
  • the first base includes the first flow path through which the refrigerant flows
  • the second base includes the second flow path through which the refrigerant flows
  • the holder is the third flow path through which the refrigerant flows. May include. According to this, the laser medium and a plurality of excitation light sources can be cooled.
  • the first flow path, the second flow path, and the third flow path may communicate with each other. According to this, the laser medium and a plurality of excitation light sources can be efficiently cooled.
  • the holder includes a cylinder in which the laser medium is arranged inside, the cylinder has light transmission, and the third flow path is the laser medium and the cylinder.
  • the first branch includes the main flow path including the flow path between the main flow path, the first branch flow path and the second branch flow path branching from the main flow path, and the third branch flow path and the fourth branch flow path joining the main flow path.
  • the downstream end of the flow path is connected to the upstream end of the first flow path
  • the downstream end of the second branch flow path is connected to the upstream end of the second flow path, and the upstream end of the third branch flow path.
  • the end may be connected to the downstream end of the first flow path, and the upstream end of the fourth branch flow path may be connected to the downstream end of the second flow path.
  • the plurality of excitation light sources may be arranged along the circumference centered on the center line of the laser medium when viewed from the first direction. According to this, it is possible to make the excitation distribution uniform in the laser medium.
  • each of the plurality of excitation light sources may include a semiconductor laser device. According to this, it is possible to extend the life of the excitation light source. Further, since a plurality of excitation light sources are unitized as a first light source unit or a second light source unit, the delicacy required for handling as a single semiconductor laser device becomes unnecessary.
  • the semiconductor laser device may include a plurality of laminated semiconductor laser bars. According to this, the laser medium can be excited efficiently and sufficiently.
  • the laser apparatus on one side of the present disclosure includes a rod-shaped laser medium extending along a first direction, a first base, and a first light source unit including a plurality of excitation light sources attached to the first base.
  • a holder that supports the second light source unit, and at least one of the first base and the holder includes a first defining part that defines the position of the first base with respect to the holder, and at least the first base and the second base.
  • the first base and a plurality of excitation light sources are unitized as a first light source unit
  • the second base and a plurality of excitation light sources are unitized as a second light source unit
  • the second light source unit is supported by the holder in a state of being juxtaposed in the second direction.
  • a plurality of excitation light sources can be easily attached to and detached from the holder simply by attaching and detaching the first base and the second base to and from the holder.
  • the position of the first base with respect to the holder is defined by the first defining unit
  • the position of the second base with respect to the first base is defined.
  • a plurality of excitation light sources can be easily positioned with respect to the laser medium only by attaching each of the first base and the second base to the holder supporting the laser medium.
  • this laser device it is possible to facilitate the attachment / detachment of a plurality of excitation light sources and the positioning of a plurality of excitation light sources.
  • a method of manufacturing a laser apparatus includes a first light source unit including a first base and a plurality of excitation light sources attached to the first base, and a plurality of laser devices attached to the second base and the second base.
  • the first base is arranged in the holder from one side in the second direction intersecting the first direction in which the rod-shaped laser medium extends, and the first base is arranged in the holder from the other side in the second direction.
  • a laser device capable of facilitating attachment / detachment of a plurality of excitation light sources and facilitation of positioning of a plurality of excitation light sources, and a method for manufacturing such a laser device. ..
  • FIG. 1 is a cross-sectional view of the laser apparatus of one embodiment.
  • FIG. 2 is a cross-sectional view of the laser device along line II-II shown in FIG.
  • FIG. 3 is a cross-sectional view of the laser device along line III-III shown in FIG.
  • FIG. 4 is a cross-sectional view of the laser apparatus along the IV-IV line shown in FIG.
  • FIG. 5 is a cross-sectional view of the laser apparatus along the VV line shown in FIG.
  • FIG. 6 is a cross-sectional view of the laser device along the VI-VI line shown in FIG.
  • FIG. 7 is a cross-sectional view of a laser device for explaining a method of manufacturing the laser device of one embodiment.
  • FIG. 1 is a cross-sectional view of the laser apparatus of one embodiment.
  • FIG. 2 is a cross-sectional view of the laser device along line II-II shown in FIG.
  • FIG. 3 is a cross-sectional view of the laser device along line III-III
  • FIG. 8 is a cross-sectional view of the laser apparatus along VIII-VIII shown in FIG.
  • FIG. 9 is a front view of the first light source unit and the second light source unit of the modified example.
  • FIG. 10 is a perspective view of the first light source unit of the modified example.
  • FIG. 11 is a schematic diagram showing the excitation distribution of the laser medium by the first light source unit and the second light source unit of the modified example.
  • FIG. 12 is a front view of the first light source unit and the second light source unit of the modified example.
  • the laser device 1 includes a laser medium 20, a first light source unit 30, a second light source unit 40, and a holder 50.
  • the laser medium 20, the first light source unit 30, and the second light source unit 40 are supported by the holder 50.
  • the laser device 1 is used as a laser amplifier that amplifies the laser beam L in a laser system.
  • the direction in which the laser beam L is incident on the laser device 1 is referred to as the X direction
  • one direction perpendicular to the X direction is referred to as the Y direction
  • the direction perpendicular to both the X direction and the Y direction is referred to as the Z direction.
  • the laser medium 20 is a rod-shaped solid-state laser medium extending along the X direction (first direction).
  • the laser medium 20 has a center line CL parallel to the X direction.
  • the shape of the laser medium 20 is, for example, a cylindrical shape having a diameter of about 10 mm and a length of about 200 mm.
  • the material of the laser medium 20 is, for example, Nd: YAG.
  • the first light source unit 30 and the second light source unit 40 are arranged side by side in the Y direction (the second direction intersecting the first direction).
  • the first light source unit 30 is arranged on one side in the Y direction with respect to the center line CL.
  • the second light source unit 40 is arranged on the other side in the Y direction with respect to the center line CL.
  • the first light source unit 30 includes a first base 31 and a plurality of excitation light sources 32.
  • the plurality of excitation light sources 32 are attached to the first base 31.
  • the second light source unit 40 includes a second base 41 and a plurality of excitation light sources 42.
  • the plurality of excitation light sources 42 are attached to the second base 41.
  • the first base 31 and the second base 41 are plate-shaped members whose thickness direction is the X direction, respectively.
  • the set of the first base 31 and the second base 41 defines an opening having a plurality of inner surfaces facing the laser medium 20.
  • Each of the excitation light sources 32 is arranged on each of the plurality of mounting surfaces 31a of the first base 31 among the plurality of inner surfaces.
  • Each excitation light source 42 is arranged on each of the plurality of mounting surfaces 41a of the second base 41 among the plurality of inner surfaces.
  • the shape of the set of the first base 31 and the second base 41 is, for example, a rectangular plate shape.
  • the respective materials of the first base 31 and the second base 41 are, for example, aluminum.
  • the thickness of each of the first base 31 and the second base 41 is larger than the thickness of each of the first holding member 51 and the second holding member 52, which will be described later. This makes it possible to reliably hold the plurality of excitation light sources 32 and 42.
  • Each of the plurality of excitation light sources 32 and 42 emits excitation light EL for exciting the laser medium 20.
  • the plurality of excitation light sources 32 and 42 are arranged along the circumference centered on the center line CL of the laser medium 20 when viewed from the X direction.
  • the set of the first base 31 and the second base 41 defines a regular hexagonal opening having six mounting surfaces 31a, 41a as a plurality of inner surfaces, and six excitation light sources 32, 42. However, they are arranged at a pitch of 60 ° along the circumference centered on the center line CL.
  • the plurality of excitation light sources 32 and 42 are arranged inside the first base 31 and the second base 41 (on the laser medium 20 side), even if an impact is applied to the laser device 1 from the outside. , A plurality of excitation light sources 32, 42 can be reliably protected.
  • Each excitation light source 32 includes a semiconductor laser element 33 and a lens 34.
  • the semiconductor laser device 33 emits excitation light EL toward the laser medium 20.
  • the lens 34 is arranged on the laser medium 20 side with respect to the semiconductor laser element 33.
  • the lens 34 converges the excitation light EL emitted from the semiconductor laser device 33 on the laser medium 20.
  • the semiconductor laser element 33 includes a plurality of semiconductor laser bars 33a and a heat sink 33b.
  • the plurality of semiconductor laser bars 33a are laminated so that the emission end faces of the semiconductor laser bars 33a are arranged in two dimensions in a plane perpendicular to the direction in which the semiconductor laser element 33 and the laser medium 20 face each other.
  • the heat sink 33b is arranged on the mounting surface 31a in a state of supporting the plurality of semiconductor laser bars 33a.
  • the heat sink 33b absorbs the heat generated by the plurality of semiconductor laser bars 33a and releases the heat to the first base 31 side. It should be noted that each excitation light source 32 does not have to include the lens 34.
  • Each excitation light source 42 includes a semiconductor laser element 43 and a lens 44.
  • the semiconductor laser device 43 emits excitation light EL toward the laser medium 20.
  • the lens 44 is arranged on the laser medium 20 side with respect to the semiconductor laser element 43.
  • the lens 44 converges the excitation light EL emitted from the semiconductor laser device 43 on the laser medium 20.
  • the semiconductor laser element 43 includes a plurality of semiconductor laser bars 43a and a heat sink 43b.
  • the plurality of semiconductor laser bars 43a are laminated so that the emission end faces of the semiconductor laser bars 43a are arranged in two dimensions in a plane perpendicular to the direction in which the semiconductor laser element 43 and the laser medium 20 face each other.
  • the heat sink 43b is arranged on the mounting surface 41a in a state of supporting the plurality of semiconductor laser bars 43a.
  • the heat sink 43b absorbs the heat generated by the plurality of semiconductor laser bars 43a and releases the heat to the second base 41 side. It should be noted that each excitation light source 42 does not have to include the lens 44.
  • the holder 50 includes a first holding member 51, a second holding member 52, a connecting member 53, a pair of leg members 54, and a tubular body 55. As an example, the holder 50 is attached to the installation portion S of the laser system.
  • the first holding member 51 and the second holding member 52 are plate-shaped members whose thickness direction is the X direction, respectively.
  • the first holding member 51 and the second holding member 52 are arranged side by side in the X direction at predetermined intervals.
  • the first holding member 51 holds one end of the laser medium 20 in the X direction in a state where one end surface 20a of the laser medium 20 in the X direction is exposed.
  • the second holding member 52 holds the other end of the laser medium 20 in the X direction with the other end surface 20b of the laser medium 20 exposed in the X direction.
  • the first light source unit 30 and the second light source unit 40 are arranged between the first holding member 51 and the second holding member 52.
  • the shapes of the first holding member 51 and the second holding member 52 are, for example, rectangular plates.
  • each of the first holding member 51 and the second holding member 52 is, for example, aluminum.
  • the first light source unit 30 and the second light source unit 40 are located inside the outer edges of the first holding member 51 and the second holding member 52 when viewed from the X direction (that is, from the outer edge). Does not protrude outward). As a result, even if an impact is applied to the laser device 1 from the X direction, the first light source unit 30 and the second light source unit 40 can be reliably protected.
  • the connecting member 53 is a plate-shaped member having the Z direction as the thickness direction.
  • the connecting member 53 connects the first holding member 51 and the second holding member 52.
  • the connecting member 53 is hung between the end portion of the first holding member 51 on the installation portion S side and the end portion of the second holding member 52 on the installation portion S side.
  • the shape of the connecting member 53 is, for example, a rectangular plate.
  • the material of the connecting member 53 is, for example, aluminum.
  • the pair of leg members 54 are attached to the end portion of the first holding member 51 on the installation portion S side and the end portion of the second holding member 52 on the installation portion S side, respectively.
  • Each leg member 54 has a plurality of elongated holes 54a with the Y direction as the longitudinal direction.
  • the holder 50 is fixed to the installation portion S by fastening a plurality of bolts (not shown) to the installation portion S via a plurality of elongated holes 54a.
  • the tubular body 55 is a tubular member extending along the X direction.
  • the tubular body 55 is hung between the first holding member 51 and the second holding member 52 in a state where the laser medium 20 is arranged inside the tubular body 55.
  • the tubular body 55 has light transmission (transparency to the excitation light EL emitted from each of the excitation light sources 32 and 42).
  • the shape of the tubular body 55 is, for example, a cylindrical shape.
  • the material of the cylinder 55 is, for example, synthetic quartz.
  • the connecting member 53 has a groove 53a extending along the Y direction. Both ends of the groove 53a in the Y direction are open to one side and the other side in the Y direction.
  • the bottom surface of the groove 53a is a support surface 56 that supports the first base 31 and the second base 41 so as to be slidable along the Y direction.
  • the connecting member 53 includes a first stopper (first specified portion) 57 and a second stopper (second specified portion) 58.
  • the first stopper 57 regulates the movement of the first base 31 along the Y direction. More specifically, the first stopper 57 regulates the movement of the first base 31 toward the side approaching the laser medium 20 in the Y direction.
  • the second stopper 58 regulates the movement of the second base 41 along the Y direction. More specifically, the second stopper 58 regulates the movement of the second base 41 toward the side approaching the laser medium 20 in the Y direction.
  • the first base 31 By fitting the first base 31 into the groove 53a of the connecting member 53, the position of the first base 31 in the X direction and the Z direction with respect to the holder 50 (and thus with respect to the laser medium 20) is defined. To. By bringing the first base 31 into contact with the first stopper 57, the position of the first base 31 in the Y direction with respect to the holder 50 (and thus with respect to the laser medium 20) is defined. In this state, the first base 31 is fixed to each of the first holding member 51 and the second holding member 52 by bolts (not shown) or the like.
  • the second base 41 By fitting the second base 41 into the groove 53a of the connecting member 53, the position of the second base 41 in the X direction and the Z direction with respect to the holder 50 (and thus with respect to the laser medium 20) is defined. To. By bringing the second base 41 into contact with the second stopper 58, the position of the second base 41 in the Y direction with respect to the holder 50 (and thus with respect to the laser medium 20) is defined. In this state, the second base 41 is fixed to each of the first holding member 51 and the second holding member 52 by bolts (not shown) or the like.
  • the holder 50 includes a third flow path 90.
  • the first base 31 includes a first flow path 70.
  • the second base 41 includes the second flow path 80.
  • Refrigerant flows through the first flow path 70, the second flow path 80, and the third flow path 90.
  • the refrigerant is, for example, water.
  • the first flow path 70, the second flow path 80, and the third flow path 90 communicate with each other. That is, the first flow path 70, the second flow path 80, and the third flow path 90 are connected so that the refrigerant supplied from a common supply source (not shown) flows.
  • the third flow path 90 includes the main flow path 91.
  • the main flow path 91 includes a plurality of flow path portions 91a, 91b, 91c, 91d, 91e.
  • the flow path portion 91b is a flow path between the laser medium 20 and the tubular body 55.
  • the flow path portion 91d is a flow path in the pipe 59 spanned between the first holding member 51 and the second holding member 52.
  • the flow path portion 91a is formed in the first holding member 51.
  • the upstream end of the flow path portion 91a is located on the side surface 51a of the first holding member 51.
  • the upstream end of the flow path portion 91a is a refrigerant supply port.
  • the downstream end of the flow path portion 91a is connected to the upstream end of the flow path portion 91b.
  • the flow path portion 91c is formed in the second holding member 52.
  • the upstream end of the flow path portion 91c is connected to the downstream end of the flow path portion 91b.
  • the downstream end of the flow path portion 91c is connected to the upstream end of the flow path portion 91d.
  • the flow path portion 91e is formed in the first holding member 51.
  • the upstream end of the flow path portion 91e is connected to the downstream end of the flow path portion 91d.
  • the downstream end of the flow path portion 91e is located on the side surface 51a of the first holding member 51.
  • the downstream end of the flow path portion 91e is a refrigerant discharge port. Since the upstream end of the flow path portion 91a, which is the supply port of the refrigerant, and the downstream end of the flow path portion 91e, which is the discharge port of the refrigerant, are located on the side surface 51a of the first holding member 51, the external piping It is easy to handle.
  • the refrigerant is supplied from the upstream end of the flow path portion 91a, the refrigerant flows in the order of the flow path portions 91a, 91b, 91c, 91d, 91e, and the refrigerant flows downstream of the flow path portion 91e. Refrigerant is discharged from the end. As a result, the laser medium 20 is cooled.
  • the third flow path 90 further includes a first branch flow path 93 and a second branch flow path 94.
  • the first branch flow path 93 and the second branch flow path 94 are formed in the first holding member 51.
  • the first branch flow path 93 branches from the main flow path 91.
  • the upstream end 93a of the first branch flow path 93 is connected to the middle of the flow path portion 91a of the main flow path 91 (the portion of the main flow path 91 on the upstream side of the flow path portion 91b).
  • the downstream end 93b of the first branch flow path 93 is located on the surface 51b of the first holding member 51 on the side of the second holding member 52.
  • the second branch flow path 94 branches from the main flow path 91.
  • the upstream end 94a of the second branch flow path 94 is connected in the middle of the flow path portion 91a of the main flow path 91.
  • the downstream end 94b of the second branch flow path 94 is located on the surface 51b of the first holding member 51.
  • the third flow path 90 further includes a third branch flow path 95 and a fourth branch flow path 96.
  • the third branch flow path 95 and the fourth branch flow path 96 are formed in the first holding member 51.
  • the third branch flow path 95 joins the main flow path 91.
  • the upstream end 95a of the third branch flow path 95 is located on the surface 51b of the first holding member 51.
  • the downstream end 95b of the third branch flow path 95 is connected to the middle of the flow path portion 91e of the main flow path 91 (the portion of the main flow path 91 on the downstream side of the flow path portion 91b).
  • the fourth branch flow path 96 joins the main flow path 91.
  • the upstream end 96a of the fourth branch flow path 96 is located on the surface 51b of the first holding member 51.
  • the downstream end 96b of the fourth branch flow path 96 is connected in the middle of the flow path portion 91e of the main flow path 91.
  • the first flow path 70 is formed in the first base 31 so as to extend linearly along the Z direction when viewed from the X direction.
  • the upstream end 70a and the downstream end 70b of the first flow path 70 are located on the surface 31b on the first holding member 51 side of the first base 31.
  • the surface 31b of the first base 31 is in contact with the surface 51b of the first holding member 51.
  • the downstream end 93b of the first branch flow path 93 is connected to the upstream end 70a of the first flow path 70
  • the upstream end 95a of the third branch flow path 95 is downstream of the first flow path 70. It is connected to the end 70b.
  • an O-ring is used for the connection between the downstream end 93b and the upstream end 70a and the connection between the upstream end 95a and the downstream end 70b to prevent leakage of the refrigerant.
  • the refrigerant is supplied from the main flow path 91 at the upstream end 93a of the first branch flow path 93, and the first The refrigerant flows in the order of the branch flow path 93, the first flow path 70, and the third branch flow path 95, and the refrigerant joins the main flow path 91 at the downstream end 95b of the third branch flow path 95.
  • the first base 31 is cooled.
  • the semiconductor laser element 33 of each excitation light source 32 the first base 31 is cooled, so that the plurality of semiconductor laser bars 33a are cooled via the heat sink 33b.
  • the second flow path 80 is formed in the second base 41 so as to extend linearly along the Z direction when viewed from the X direction.
  • the upstream end 80a and the downstream end 80b of the second flow path 80 are located on the surface 41b on the side of the first holding member 51 in the second base 41.
  • the surface 41b of the second base 41 is in contact with the surface 51b of the first holding member 51.
  • the downstream end 94b of the second branch flow path 94 is connected to the upstream end 80a of the second flow path 80
  • the upstream end 96a of the fourth branch flow path 96 is downstream of the second flow path 80. It is connected to the end 80b.
  • an O-ring is used for the connection between the downstream end 94b and the upstream end 80a and the connection between the upstream end 96a and the downstream end 80b to prevent leakage of the refrigerant.
  • the refrigerant is supplied from the main flow path 91 at the upstream end 94a of the second branch flow path 94, and the second branch flow path 94 is supplied.
  • the refrigerant flows in the order of the branch flow path 94, the second flow path 80, and the fourth branch flow path 96, and the refrigerant joins the main flow path 91 at the downstream end 96b of the fourth branch flow path 96.
  • the second base 41 is cooled.
  • the semiconductor laser element 43 of each excitation light source 42 the second base 41 is cooled, so that the plurality of semiconductor laser bars 43a are cooled via the heat sink 43b.
  • the manufacturing method of the laser device 1 will be described.
  • the holder 50 in a state of supporting the laser medium 20 is attached to the installation portion S of the laser system.
  • the first light source unit 30 and the second light source unit 40 are prepared (preparation step).
  • the first base 31 is arranged from one side in the Y direction in the holder 50 in the state of supporting the laser medium 20, and the second base 41 is arranged in the holder 50 from the other side in the Y direction.
  • the first light source unit 30 and the second light source unit 40 are arranged side by side in the Y direction (step of arranging them side by side).
  • the first base 31 is fixed to each of the first holding member 51 and the second holding member 52 with bolts (not shown) or the like, and the second base is attached to each of the first holding member 51 and the second holding member 52.
  • the 41 is fixed with a bolt (not shown) or the like.
  • the first base 31 When attaching the first base 31 to the holder 50, the first base 31 is fitted into the groove 53a of the connecting member 53 in the X direction and in the X direction with respect to the holder 50 (and thus with respect to the laser medium 20).
  • the position of the first base 31 in the Z direction is defined. Further, by sliding the first base 31 on the support surface 56 of the connecting member 53 and bringing it into contact with the first stopper 57, the first base 31 is brought into contact with the first stopper 57 in the Y direction with respect to the holder 50 (and thus with respect to the laser medium 20).
  • the position of the first base 31 is defined. At this time, a situation in which the first base 31 comes into contact with the tubular body 55 and the tubular body 55 is damaged is prevented.
  • the second base 41 When attaching the second base 41 to the holder 50, the second base 41 is fitted into the groove 53a of the connecting member 53 in the X direction and in the X direction with respect to the holder 50 (and thus with respect to the laser medium 20).
  • the position of the second base 41 in the Z direction is defined. Further, by sliding the second base 41 on the support surface 56 of the connecting member 53 and bringing it into contact with the second stopper 58, the second base 41 is brought into contact with the second stopper 58 in the Y direction with respect to the holder 50 (and thus with respect to the laser medium 20).
  • the position of the second base 41 is defined. At this time, a situation in which the second base 41 comes into contact with the tubular body 55 and the tubular body 55 is damaged is prevented.
  • the first base 31 and the plurality of excitation light sources 32 are unitized as the first light source unit 30, and the second base 41 and the plurality of excitation light sources 42 are the second light source units. It is unitized as 40, and the first light source unit 30 and the second light source unit 40 are supported by the holder 50 in a state of being arranged side by side in the Y direction.
  • a plurality of excitation light sources 32 and 42 can be easily attached to and detached from the holder 50 by simply attaching and detaching the first base 31 and the second base 41 to and from the holder 50.
  • the position of the first base 31 with respect to the holder 50 is defined by the first stopper 57, and the position of the first base 31 is defined with respect to the holder 50.
  • the position of the second base 41 is defined by the second stopper 58.
  • the holder 50 includes a first holding member 51 and a second holding member 52 arranged side by side in the X direction, and a connecting member 53 connecting the first holding member 51 and the second holding member 52.
  • the first light source unit 30 and the second light source unit 40 are arranged between the first holding member 51 and the second holding member 52. This makes it possible to reduce the size of the laser device 1 and simplify the structure.
  • the connecting member 53 has a support surface 56 that supports the first base 31 and the second base 41 so as to be slidable along the Y direction.
  • the plurality of excitation light sources 32 and 42 can be easily attached to and detached from the holder 50 by sliding each of the first base 31 and the second base 41 on the support surface 56 of the connecting member 53.
  • the connecting member 53 includes a first stopper 57 that regulates the movement of the first base 31 along the Y direction, and a second stopper 58 that regulates the movement of the second base 41 along the Y direction. I'm out. As a result, the first base 31 and the second base 41 are brought into contact with each of the first stopper 57 and the second stopper 58 of the connecting member 53, whereby the plurality of excitation light sources 32, 42 with respect to the laser medium 20 are brought into contact with each other. Can be easily and reliably positioned.
  • the first base 31 includes the first flow path 70 through which the refrigerant flows
  • the second base 41 includes the second flow path 80 through which the refrigerant flows
  • the holder 50 contains the second flow path 80 through which the refrigerant flows. It includes a third flow path 90. Thereby, the laser medium 20 and the plurality of excitation light sources 32, 42 can be cooled.
  • the first flow path 70, the second flow path 80, and the third flow path 90 communicate with each other.
  • the laser medium 20 and the plurality of excitation light sources 32 and 42 can be efficiently cooled.
  • the third flow path 90 is a main flow path 91 including a flow path portion 91b between the laser medium 20 and the tubular body 55, a first branch flow path 93 branching from the main flow path 91, and a second branch flow. It includes a road 94, and a third branch flow path 95 and a fourth branch flow path 96 that join the main flow path 91.
  • the downstream end 93b of the first branch flow path 93 is connected to the upstream end 70a of the first flow path 70, and the downstream end 94b of the second branch flow path 94 is the second flow path 80.
  • the upstream end 95a of the third branch flow path 95 is connected to the downstream end 70b of the first flow path 70, and the upstream end 96a of the fourth branch flow path 96 is the second. It is connected to the downstream end 80b of the flow path 80.
  • the plurality of excitation light sources 32 and 42 are arranged along the circumference centered on the center line CL of the laser medium 20 when viewed from the X direction. According to this, it is possible to make the excitation distribution in the laser medium 20 uniform.
  • each excitation light source 32 includes a semiconductor laser element 33, and each excitation light source 42 includes a semiconductor laser element 43.
  • the life of each of the excitation light sources 32 and 42 can be extended.
  • the plurality of excitation light sources 32 are unitized as the first light source unit 30 and the plurality of excitation light sources 42 are unitized as the second light source unit 40, the delicacy required for handling as a single semiconductor laser device is required. Is unnecessary.
  • the semiconductor laser element 33 includes a plurality of laminated semiconductor laser bars 33a, and the semiconductor laser element 43 includes a plurality of laminated semiconductor laser bars 43a. This makes it possible to efficiently and sufficiently excite the laser medium 20.
  • the first base 31 is arranged on the holder 50 from one side in the Y direction intersecting the X direction in which the rod-shaped laser medium 20 extends, and the first base 31 is arranged in the holder 50 from the other side in the Y direction.
  • the plurality of excitation light sources 32 and 42 can be easily positioned with respect to the laser medium 20. Therefore, according to the method for manufacturing the laser device 1, it is possible to easily obtain the laser device 1 in which a plurality of excitation light sources 32, 42 are positioned with respect to the laser medium 20.
  • the present disclosure is not limited to the above embodiment.
  • the first light source unit 30 includes three excitation light sources 32, but the first light source unit 30 may include a plurality of excitation light sources 32.
  • the second light source unit 40 includes three excitation light sources 42, but the second light source unit 40 may include a plurality of excitation light sources 42.
  • the first light source unit 30 may include four excitation light sources 32 and the second light source unit 40 may include four excitation light sources 42.
  • the first light source unit 30 may include two excitation light sources 32, and the second light source unit 40 may include two excitation light sources 42.
  • the plurality of excitation light sources 32 and 42 are arranged at equal pitches along the circumference centered on the center line CL.
  • the first light source unit 30 has a plurality of excitation light sources 32a arranged in a row along the circumference centered on the center line CL, and the X direction from the circumference. It may include a plurality of excitation light sources 32b arranged in a row along the circumference deviated from. In the first light source unit 30 shown in FIG. 10A, one excitation light source 32a and one excitation light source 32b are arranged side by side in the X direction.
  • the second light source unit 40 combined with the first light source unit 30 also has the same configuration as the first light source unit 30.
  • the first light source unit 30 is displaced from the circumference in the X direction with at least one excitation light source 32a arranged along the circumference centered on the center line CL. It may include a plurality of excitation light sources 32b arranged in another row along the circumference. In the first light source unit 30 shown in FIG. 10B, three excitation light sources 32a and 32b are provided so that one excitation light source 32a is located between the two excitation light sources 32b when viewed from the X direction. , Are arranged at a pitch of 60 ° along the circumference centered on the center line CL.
  • the second light source unit 40 combined with the first light source unit 30 also has the same configuration as the first light source unit 30.
  • one excitation light source 32a and two excitation light sources 42a are arranged at a pitch of 120 ° along the circumference centered on the center line CL, as shown in FIG. 11A. ..
  • the two excitation light sources 32b and one excitation light source 42b will be arranged at a pitch of 120 ° along another circumference centered on the center line CL, as shown in FIG. 11 (b).
  • the six excitation light sources 32a, 32b, 42a, 42b have circumferences around the center line CL when viewed from a direction parallel to the center line CL, as shown in FIG. 11 (c). Will be arranged at a pitch of 60 ° along.
  • a uniform excitation distribution is given to the laser medium 20 by the excitation light EL emitted from each excitation light source 32a, 32b, 42a, 42b.
  • a plurality of excitation light sources 32 are arranged on the outer surface of the first base 31, and are emitted from each excitation light source 32 toward the laser medium 20.
  • the through hole 31c through which the excitation light EL passes may be formed in the first base 31.
  • a plurality of excitation light sources 42 are arranged on the outer surface of the second base 41, and the excitation light EL emitted from each excitation light source 42 toward the laser medium 20 passes through.
  • the through hole 41c may be formed in the second base 41.
  • the first flow path 70 may be formed in the first base 31 in a bent state (for example, a state in which the first flow path 70 is bent so as to approach each excitation light source 32).
  • the second flow path 80 may be formed in the second base 41 in a bent state (for example, a state of being bent so as to approach each excitation light source 42).
  • the first flow path 70 and the second flow path 80 are formed linearly in the first base 31 and the second base 41, respectively, their formation becomes easy.
  • the first flow path 70 may include a pipe provided separately from the main body of the first base 31 to which a plurality of excitation light sources 32 are attached.
  • the second flow path 80 may include a pipe provided separately from the main body of the second base 41 to which the plurality of excitation light sources 42 are attached.
  • the heat sink 33b of the semiconductor laser element 33 may include a flow path by introducing a refrigerant from the first flow path 70 and leading the refrigerant out to the first flow path 70.
  • the heat sink 43b of the semiconductor laser element 43 may include a flow path by introducing a refrigerant from the second flow path 80 and leading the refrigerant out to the second flow path 80.
  • the first base 31 and the second base 41 do not have to include the first flow path 70 and the second flow path 80, respectively. In that case, heat dissipation fins may be provided on each of the first base 31 and the second base 41.
  • the semiconductor laser elements 33 and 43 are cooled by cooling the first base 31 and the second base 41 by air cooling or natural heat dissipation.
  • Each excitation light source 32 may include an electronic cooling element for cooling the semiconductor laser element 33.
  • each excitation light source 42 may include an electron cooling element for cooling the semiconductor laser element 43.
  • the holder 50 includes the first stopper 57 as a first defining portion that defines the position of the first base 31 with respect to the holder 50, but the first base 31 includes the first defining portion.
  • both the first base 31 and the holder 50 may include the first ruler. That is, at least one of the first base 31 and the holder 50 may include a first defining portion that defines the position of the first base 31 with respect to the holder 50.
  • the first specified portion may be a positioning pin and a positioning hole, a positioning bolt, a positioning screw hole (in that case, also serves as fixing of the first base 31 to the holder 50) and the like.
  • the holder 50 includes the second stopper 58 as the second defining portion that defines the position of the second base 41 with respect to the holder 50, but the second base 41 includes the second defining portion.
  • both the second base 41 and the holder 50 may include the second regulation part. That is, at least one of the second base 41 and the holder 50 may include a second defining portion that defines the position of the second base 41 with respect to the holder 50.
  • the second specified portion may be a positioning pin and a positioning hole, a positioning bolt, a positioning screw hole (in that case, also serves as fixing of the second base 41 to the holder 50) and the like.
  • the holder 50 includes the first stopper 57 as a first defining portion that defines the position of the first base 31 with respect to the holder 50, and the holder 50 defines the position of the second base 41 with respect to the holder 50.
  • the second stopper 58 was included as the second regulation part, at least one of the first base 31 and the holder 50 includes the first regulation part that defines the position of the first base 31 with respect to the holder 50, and the first At least one of the 1st base 31 and the 2nd base 41 may include a 2nd ruler that defines the position of the 2nd base 41 with respect to the 1st base 31.
  • the plurality of excitation light sources 32 and 42 can be easily attached to and detached from the holder 50 by simply attaching and detaching the first base 31 and the second base 41 to and from the holder 50. Further, the plurality of excitation light sources 32 and 42 can be easily positioned with respect to the laser medium 20 only by attaching each of the first base 31 and the second base 41 to the holder 50 that supports the laser medium 20.
  • the holder 50 may not include, for example, the connecting member 53, or may include the connecting member 53, as long as it is configured to support the laser medium 20, the first light source unit 30, and the second light source unit 40. Regardless of whether or not, it is not necessary to include either the first holding member 51 or the second holding member.
  • the holder 50 is configured to support the laser medium 20, the first light source unit 30, and the second light source unit 40, so that each of the laser medium 20, the first light source unit 30, and the second light source unit 40 is configured. It is not essential that it is in contact with the holder 50.
  • the first light source unit 30 is supported by the holder 50 in a state where the first light source unit 30 is in contact with the holder 50, and the second light source unit 40 is in contact with the first light source unit 30 and separated from the holder 50.
  • the second light source unit 40 is supported by the holder 50.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Ce dispositif laser comprend : une première unité de source de lumière comprenant un milieu laser en forme de tige s'étendant le long d'une première direction, une première base et une pluralité de sources de lumière d'excitation fixées à la première base ; une seconde unité de source de lumière disposée côte à côte avec la première unité de source de lumière dans une seconde direction croisant la première direction et comprenant une seconde base et une pluralité de sources de lumière d'excitation fixées à la seconde base ; et un support qui supporte le milieu laser, la première unité de source de lumière et la seconde unité de source de lumière. Au moins l'un parmi la première base et le support comprend une première section de définition pour définir la position de la première base par rapport au support, et au moins l'un parmi la seconde base et le support comprend une seconde section de définition pour définir la position de la seconde base par rapport au support.
PCT/JP2021/030434 2020-09-04 2021-08-19 Dispositif laser et procédé de fabrication de dispositif laser WO2022050071A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180054293.XA CN116057796A (zh) 2020-09-04 2021-08-19 激光装置和激光装置的制造方法
US18/022,764 US20230318245A1 (en) 2020-09-04 2021-08-19 Laser device and method for manufacturing laser device
EP21864129.8A EP4181332A4 (fr) 2020-09-04 2021-08-19 Dispositif laser et procédé de fabrication de dispositif laser

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JP2020148901A JP7554610B2 (ja) 2020-09-04 2020-09-04 レーザ装置、及びレーザ装置の製造方法
JP2020-148901 2020-09-04

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3683296A (en) * 1970-10-13 1972-08-08 Texas Instruments Inc High efficiency laser cavity
US5012481A (en) * 1990-03-09 1991-04-30 Martin Marietta Corporation Flashlamp line replaceable unit
US5253260A (en) * 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
US5278860A (en) * 1992-09-28 1994-01-11 General Electric Company Modular construction of face-pumped laser head components
JPH07115237A (ja) * 1993-10-19 1995-05-02 Mitsui Petrochem Ind Ltd 固体レーザ装置
US5418809A (en) * 1994-05-31 1995-05-23 General Electric Company Modular slab assembly for a face-pumped laser
US5475702A (en) * 1994-05-31 1995-12-12 General Electric Company Diode pumped slab module
JP2000277837A (ja) * 1999-03-23 2000-10-06 Toshiba Corp 固体レーザ装置
JP2001068765A (ja) * 1999-08-24 2001-03-16 Ishikawajima Harima Heavy Ind Co Ltd キャビティ
JP2005285807A (ja) 2004-03-26 2005-10-13 Hamamatsu Photonics Kk 半導体レーザ励起固体レーザ装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5774488A (en) * 1994-06-30 1998-06-30 Lightwave Electronics Corporation Solid-state laser with trapped pump light
US5590147A (en) * 1994-12-19 1996-12-31 The Morgan Curcible Company Plc Side-pumped lasers
US5778020A (en) * 1996-06-04 1998-07-07 Cj Laser, Inc. ND: YAG laser pump head
JP2001068767A (ja) 1999-08-24 2001-03-16 Ishikawajima Harima Heavy Ind Co Ltd ランプコネクタバネ
JP2004207496A (ja) * 2002-12-25 2004-07-22 Nec Corp 固体レーザ発振器
CN100379099C (zh) * 2003-03-17 2008-04-02 三菱电机株式会社 激光振荡器
US7170919B2 (en) * 2003-06-23 2007-01-30 Northrop Grumman Corporation Diode-pumped solid-state laser gain module
JP7554611B2 (ja) 2020-09-04 2024-09-20 浜松ホトニクス株式会社 レーザ装置、及びレーザ装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3683296A (en) * 1970-10-13 1972-08-08 Texas Instruments Inc High efficiency laser cavity
US5012481A (en) * 1990-03-09 1991-04-30 Martin Marietta Corporation Flashlamp line replaceable unit
US5253260A (en) * 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
US5278860A (en) * 1992-09-28 1994-01-11 General Electric Company Modular construction of face-pumped laser head components
JPH07115237A (ja) * 1993-10-19 1995-05-02 Mitsui Petrochem Ind Ltd 固体レーザ装置
US5418809A (en) * 1994-05-31 1995-05-23 General Electric Company Modular slab assembly for a face-pumped laser
US5475702A (en) * 1994-05-31 1995-12-12 General Electric Company Diode pumped slab module
JP2000277837A (ja) * 1999-03-23 2000-10-06 Toshiba Corp 固体レーザ装置
JP2001068765A (ja) * 1999-08-24 2001-03-16 Ishikawajima Harima Heavy Ind Co Ltd キャビティ
JP2005285807A (ja) 2004-03-26 2005-10-13 Hamamatsu Photonics Kk 半導体レーザ励起固体レーザ装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4181332A4

Also Published As

Publication number Publication date
EP4181332A4 (fr) 2024-08-21
EP4181332A1 (fr) 2023-05-17
JP7554610B2 (ja) 2024-09-20
JP2022043569A (ja) 2022-03-16
US20230318245A1 (en) 2023-10-05
CN116057796A (zh) 2023-05-02

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