WO2022039009A1 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
WO2022039009A1
WO2022039009A1 PCT/JP2021/028587 JP2021028587W WO2022039009A1 WO 2022039009 A1 WO2022039009 A1 WO 2022039009A1 JP 2021028587 W JP2021028587 W JP 2021028587W WO 2022039009 A1 WO2022039009 A1 WO 2022039009A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting element
pixel
drive
display device
Prior art date
Application number
PCT/JP2021/028587
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
昌哉 玉置
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2022543352A priority Critical patent/JP7418590B2/ja
Priority to CN202180056219.1A priority patent/CN116057717A/zh
Priority to US18/021,362 priority patent/US20230326908A1/en
Publication of WO2022039009A1 publication Critical patent/WO2022039009A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F21/00—Mobile visual advertising
    • G09F21/04—Mobile visual advertising by land vehicles
    • G09F21/049—Mobile visual advertising by land vehicles giving information to passengers inside the vehicles
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • G09F23/0093—Advertising on or in specific articles, e.g. ashtrays, letter-boxes on phone-carried indicia
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Definitions

  • the plurality of pixel units 4 have a matrix arrangement pattern, and the first light emitting element 41 and the second light emitting element 42 included in the pixel unit 4 located in one of the two adjacent rows of the matrix. One may emit light, and the other of the first light emitting element 41 and the second light emitting element 42 included in the pixel unit 4 located in the other row may emit light. In this case, when viewed as a whole of the displayed image, the display unevenness of the displayed image can be reduced more effectively.
  • the above configuration has the following effects.
  • their light emitting portions are unevenly distributed in the central portion of the bottom surface portion 2aa. Therefore, regardless of which of the first light emitting element 41 and the second light emitting element 42 emits light, it is possible to suppress the light emitted from the cavity 30 to the outside in a biased direction. As a result, when viewed as a whole of the displayed image, the display unevenness of the displayed image can be reduced more effectively.
  • the light emitting elements 41 and 42 may be flip-chip connected to the anode electrode 7 and the cathode electrode 8.
  • the light emitting elements 41 and 42 and the anode electrode 7 and the cathode electrode 8 are electrically and mechanically connected by flip-chip connection using a conductive connecting member such as a solder ball, a metal bump, or a conductive adhesive. May be good. Further, the light emitting elements 41 and 42 and the anode electrode 7 and the cathode electrode 8 may be electrically connected by using a conductive connecting member such as a bonding wire.
  • the drive control unit 5 executes the first drive for a predetermined ratio (for example, half) of the pixel units 4 among the plurality of pixel units 4, and the drive control unit 5 performs the first drive for the remaining (for example, the remaining half) pixel units 4.
  • Execute 2 drives are not limited to half in the strict sense.
  • the drive control unit 5 may execute the first drive for about half of the pixel units 4 and the second drive for the remaining pixel units 4.
  • the drive control unit 5 may execute the first drive for 30 to 70% of the pixel units 4 of the plurality of pixel units 4 and execute the second drive for the remaining pixel units 4. good.
  • a single anode electrode 7 is arranged in the central portion C of each mounting portion 2aa, and the anode electrode 7 is sandwiched in the outer peripheral portion of each mounting portion 2aa.
  • One cathode electrode 8 may be arranged. Both the anode terminal 41a of the first light emitting element 41 and the anode terminal 42a of the second light emitting element 42 may be electrically connected to the anode electrode 7. Further, the cathode terminal 41b of the first light emitting element 41 and the cathode terminal 42b of the second light emitting element 42 may be electrically connected to the two cathode electrodes 8.
  • the drive control unit 5 controls each of the plurality of pixel units 4.
  • the drive control unit 5 can execute the first drive for driving the first light emitting element 41 and the second drive for driving the second light emitting element 42 for each pixel unit 4.
  • the drive control unit 5 executes either the first drive or the second drive for each of the plurality of pixel units 4.
  • the pixel unit since the pixel unit includes the first light emitting element and the second light emitting element having a redundant configuration, one of the light emitting elements shall be a redundant light emitting element. As a result, the manufacturing yield can be improved. Further, in the display device of the first disclosure, since the first light emitting element and the second light emitting element are driven differently depending on the pixel portion, the display unevenness of the displayed image can be reduced. Further, in the display device of the second disclosure, the cavity constituting the pixel portion has the first electrode or the second electrode corresponding to the first terminal or the second terminal on the side where the light emitting portion is unevenly distributed, and the center of the bottom surface portion. Since it is located in the part, it is possible to reduce the display unevenness of the displayed image.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Marketing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
PCT/JP2021/028587 2020-08-18 2021-08-02 表示装置 WO2022039009A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022543352A JP7418590B2 (ja) 2020-08-18 2021-08-02 表示装置
CN202180056219.1A CN116057717A (zh) 2020-08-18 2021-08-02 显示装置
US18/021,362 US20230326908A1 (en) 2020-08-18 2021-08-02 Display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020138151 2020-08-18
JP2020-138151 2020-08-18

Publications (1)

Publication Number Publication Date
WO2022039009A1 true WO2022039009A1 (ja) 2022-02-24

Family

ID=80322659

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/028587 WO2022039009A1 (ja) 2020-08-18 2021-08-02 表示装置

Country Status (4)

Country Link
US (1) US20230326908A1 (zh)
JP (1) JP7418590B2 (zh)
CN (1) CN116057717A (zh)
WO (1) WO2022039009A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120984U (ja) * 1991-04-19 1992-10-29 タキロン株式会社 ドツトマトリクス発光表示体
JPH0654081U (ja) * 1992-12-21 1994-07-22 タキロン株式会社 発光表示体
JP2010010112A (ja) * 2008-06-30 2010-01-14 Canon Inc 表示装置
JP2016512347A (ja) * 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
JP2018101785A (ja) * 2016-12-20 2018-06-28 エルジー ディスプレイ カンパニー リミテッド 発光ダイオードチップ及びこれを含む発光ダイオードディスプレイ装置
US20200135092A1 (en) * 2019-12-23 2020-04-30 Intel Corporation Methods and apparatus for in-pixel driving of micro-leds
JP2020106745A (ja) * 2018-12-28 2020-07-09 日亜化学工業株式会社 画像表示装置および画像表示装置の製造方法
US20200235084A1 (en) * 2019-01-21 2020-07-23 Innolux Corporation Foldable display device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120984U (ja) * 1991-04-19 1992-10-29 タキロン株式会社 ドツトマトリクス発光表示体
JPH0654081U (ja) * 1992-12-21 1994-07-22 タキロン株式会社 発光表示体
JP2010010112A (ja) * 2008-06-30 2010-01-14 Canon Inc 表示装置
JP2016512347A (ja) * 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
JP2018101785A (ja) * 2016-12-20 2018-06-28 エルジー ディスプレイ カンパニー リミテッド 発光ダイオードチップ及びこれを含む発光ダイオードディスプレイ装置
JP2020106745A (ja) * 2018-12-28 2020-07-09 日亜化学工業株式会社 画像表示装置および画像表示装置の製造方法
US20200235084A1 (en) * 2019-01-21 2020-07-23 Innolux Corporation Foldable display device
US20200135092A1 (en) * 2019-12-23 2020-04-30 Intel Corporation Methods and apparatus for in-pixel driving of micro-leds

Also Published As

Publication number Publication date
JP7418590B2 (ja) 2024-01-19
CN116057717A (zh) 2023-05-02
US20230326908A1 (en) 2023-10-12
JPWO2022039009A1 (zh) 2022-02-24

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