WO2022022705A1 - 一种带HfB 2涂层的刀具及其制备方法 - Google Patents

一种带HfB 2涂层的刀具及其制备方法 Download PDF

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WO2022022705A1
WO2022022705A1 PCT/CN2021/109786 CN2021109786W WO2022022705A1 WO 2022022705 A1 WO2022022705 A1 WO 2022022705A1 CN 2021109786 W CN2021109786 W CN 2021109786W WO 2022022705 A1 WO2022022705 A1 WO 2022022705A1
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coating
hfb
substrate
tool
chamber
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French (fr)
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王成勇
林海生
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Guangdong University of Technology
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Guangdong University of Technology
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/067—Borides

Definitions

  • the invention relates to the technical field of cutting tools, in particular to a cutting tool with HfB 2 coating and a preparation method thereof.
  • the cutting tool is particularly suitable for high-speed cutting of difficult-to-machine materials.
  • Tool coating materials are developed from binary coatings such as TiN, TiC, and CrN to multi-component coatings such as TiAlN, TiCN, TiSiN, and TiAlSiN.
  • the coating structure has developed from a single-layer coating to a multi-layer, nano-composite and other structures.
  • the performance of the tool coating in terms of wear resistance, red hardness, oxidation resistance, crack propagation resistance, etc.
  • the purpose of the present invention is to overcome the hardness, wear resistance, thermal conductivity and affinity to the processing material of the cutting tool in the prior art when the coated tool is used for machining difficult-to-machine materials such as superalloys and titanium alloys. Can not meet the defects of use requirements, provide a tool with higher hardness, wear resistance, thermal conductivity and lower material affinity, the tool reduces the local high temperature in the cutting area during the process of machining difficult-to-machine materials, Reduce tool bond wear and improve tool life and machining quality.
  • the present invention adopts the following technical solutions:
  • a tool with HfB 2 coating comprising:
  • the existing coated tools have the defects that the hardness, wear resistance, thermal conductivity and affinity for the processed materials cannot meet the requirements of use when machining high-temperature alloys, titanium alloys and other difficult-to-machine materials.
  • the invention is to deposit HfB 2 coating on the substrate in the tool.
  • the HfB 2 coating has excellent comprehensive properties such as high thermal conductivity and high hardness, and has great potential as a tool coating material.
  • HfB 2 coating which is suitable for preparing coated tools for industrial applications, giving full play to the excellent performance of HfB 2 coating, compared with chemical
  • the HfB 2 coating prepared by vapor deposition technology is more environmentally friendly, and the deposition rate is higher than that of RF magnetron sputtering technology.
  • the HfB 2 coating is deposited on the base of the tool, which may be a single layer of HfB 2 coating deposited on the base; or a multi-layer coating of HfB 2 coating and MeN coating deposited on the base, wherein , Me stands for alloying elements, and HfB coatings and MeN coatings are alternately deposited on the substrate.
  • the HfB 2 coating comprises 20-45% Hf and 55-80% B in atomic percent.
  • the thickness of the HfB 2 coating is 0.5-5 ⁇ m; or, the total thickness of the HfB 2 coating and the MeN coating is 0.5-5 ⁇ m.
  • the ratio of the thickness of the HfB 2 coating to the MeN coating is 1:(0.1-10).
  • the MeN coating includes 35-65% Me and 35-65% N in atomic percent.
  • the MeN coating is TiN coating, TiSiN coating, TiAlN coating, AlTiN coating, CrN coating, CrSiN coating or CrAlN coating
  • the substrate is a cemented carbide substrate or a high-speed steel substrate.
  • the present invention also discloses the preparation method of the cutter with HfB coating, the preparation method adopts coating equipment to deposit the coating on the substrate, and the preparation method comprises the following steps:
  • Substrate processing step the substrate is cleaned in ultrasonic waves and heated to remove surface moisture, then the substrate is clamped on a three-dimensional rotatable turntable and sent to the chamber of the coating equipment;
  • Steps of vacuuming the chamber firstly vacuum the chamber to below 2 ⁇ 10 -3 Pa, and then start the heater to remove the volatile impurities on the surface of the chamber and the substrate;
  • Glow cleaning step Pour high-purity gas Ar into the chamber, the vacuum degree in the chamber is 0.05 ⁇ 1.2Pa, set the substrate bias voltage -100 ⁇ -500V, and perform glow cleaning on the substrate for 10 ⁇ 30min;
  • Coating preparation steps set the vacuum degree in the chamber to 0.2 ⁇ 1.5Pa, the substrate bias voltage to 0 ⁇ -250V, the heating temperature of the heater to be 300 ⁇ 600°C, the rotation speed of the turret to be 1 ⁇ 15rpm, turn on the target power supply, Use DC magnetron sputtering or high-power magnetron sputtering to deposit on the substrate for 40-350min;
  • Steps for taking out the tool Turn off the power of the target material, wait until the chamber temperature drops below 100 °C, open the chamber, and take out the tool with HfB 2 coating.
  • the target is HfB 2
  • the gas introduced is Ar
  • the target power is 1-7KW.
  • the target materials are HfB 2 and Me targets, and the HfB 2 coating and MeN are prepared by alternately turning on the HfB 2 and Me targets.
  • the target power source pulse on time is 5-300us
  • the pulse-off time is 500-10000us.
  • a DC magnetron or high-power magnetron sputtering process is used to deposit a single-layer HfB 2 coating or a multi-layer coating comprising the HfB 2 coating on the base of the tool, and the tool with the HfB 2 coating has high hardness, Excellent comprehensive properties such as high thermal conductivity can effectively reduce the local high temperature in the cutting area, inhibit the bonding wear of the front and rear rake faces of the tool, improve the wear resistance of the tool, and achieve high efficiency in the processing of difficult-to-machine materials such as titanium alloys and high-temperature alloys. High quality machining.
  • FIG. 1 is a schematic structural diagram of a tool with HfB coating according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a tool with HfB coating according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a tool with HfB coating according to another embodiment of the present invention.
  • Fig. 4 is the scanning electron microscope picture of the coating section of the tool with HfB coating according to the first embodiment of the present invention
  • Fig. 5 is the transmission electron microscope picture of the tool with HfB coating of the second embodiment of the present invention.
  • Fig. 6 is the nanoindentation test result diagram of the coating surface of the tool with HfB coating according to the third embodiment of the present invention ;
  • FIG. 7 is a graph showing the result of scratch testing on the coating surface of the tool with HfB 2 coating according to Example 4 of the present invention.
  • FIG. 1 shows a schematic structural diagram of an embodiment of a tool with HfB 2 coating of the present invention.
  • the tool with HfB 2 coating shown in FIG. 1 has a single layer of HfB 2 coating, and the specific structure is: the tool includes a base body 10 and the HfB 2 coating 20 deposited on the surface of the base body 10 .
  • the HfB 2 coating 20 is deposited by DC magnetron sputtering.
  • the base body 10 may be a cemented carbide base body.
  • the HfB 2 coating layer 20 includes, in atomic percent, 41 atomic percent Hf, and 59 atomic percent B; the HfB 2 coating thickness is 2.5 ⁇ m.
  • Substrate pretreatment the substrate is cleaned in ultrasonic waves and heated to remove surface moisture, and then the substrate is clamped on a three-dimensional rotatable turntable and sent to the chamber of the coating equipment.
  • the prepared tool with HfB 2 coating has the following properties: the average grain size is 20nm, the coating hardness is 32GPa, the elastic modulus is 520GPa, and the bonding force between the coating and the substrate is 79N.
  • the coating section of the tool with HfB 2 coating of this embodiment is scanned by electron microscope, and the obtained scanning electron microscope image is shown in FIG. 4 .
  • a tool with HfB 2 coating the tool has a single layer of HfB 2 coating, and the specific structure is: the tool includes a substrate 10 and the HfB 2 coating deposited on the surface of the substrate 10 . 20.
  • the HfB 2 coating 20 is deposited by high-power magnetron sputtering.
  • the base body 10 is a high-speed steel base body.
  • the HfB 2 coating layer 20 includes, in atomic percent, 28 atomic percent of Hf, and 72 atomic percent of B; the HfB 2 coating thickness is 2.8 ⁇ m.
  • Substrate pretreatment the substrate is cleaned in ultrasonic waves and heated to remove surface moisture, and then the substrate is clamped on a three-dimensional rotatable turntable and sent to the chamber of the coating equipment.
  • the prepared tool with HfB 2 coating has the following properties: the average grain size is 10nm, the coating hardness is 48GPa, the elastic modulus is 605GPa, and the bonding force between the coating and the substrate is 82N.
  • FIG. 5 shows the image observed under the transmission electron microscope of the tool with HfB 2 coating prepared in this embodiment.
  • the cutting tool includes a base body 10, a first MeN coating 31 deposited on the surface of the base body 10, a HfB 2 coating 20 deposited on the first MeN coating 31, a coating layer 20 deposited on the surface of the base body 10, Second MeN coating 32 on the HfB coating 20 .
  • Me represents an alloying element.
  • the first MeN coating 31 , the HfB 2 coating 20 and the second MeN coating 32 are all deposited by DC magnetron sputtering.
  • the substrate 10 is a cemented carbide substrate, and the first MeN coating 31 and the second MeN coating 32 are both CrAlN coatings.
  • the HfB 2 coating 20 comprises, in atomic percent, 38 atomic percent Hf and 62 atomic percent B.
  • the first MeN coating 31 includes, in atomic percent, Cr at 45 atomic percent and N at 55 atomic percent.
  • the second MeN coating 32 includes, in atomic percent, Cr at 45 atomic percent and N at 55 atomic percent.
  • the thickness of the first MeN coating 31 is 1.4 ⁇ m
  • the thickness of the second MeN coating 32 is 1.4 ⁇ m
  • the thickness of the HfB 2 coating 20 is 0.7 ⁇ m.
  • Substrate pretreatment the substrate is cleaned in ultrasonic waves and heated to remove surface moisture, and then the substrate is clamped on a three-dimensional rotatable turntable and sent to the chamber of the coating equipment.
  • HfB 2 and Cr targets are used to prepare HfB 2 coating and CrN coating.
  • the gas is Ar
  • the target power is 6KW
  • the Cr target is turned on, the gas Ar and N2 are fed, and the flow ratio Ar:N is 1: 1.
  • the target power is 5KW, and the coating is prepared for 350min;
  • the prepared tool with HfB 2 coating has the following properties: the average grain size is 12nm, the bonding force between the coating and the substrate is 90N, the coating hardness is 24GPa, and the elastic modulus is 383GPa
  • FIG. 6 shows the test results of using a nano-indentation tester to detect the tool with HfB coating of this embodiment. From FIG. 6 , the load during the process of indenting and lifting from the coating surface with the nano-diamond indenter can be obtained. Displacement curve relationship, thereby deriving the coating hardness and elastic modulus values from the nanoindentation tester.
  • the cutting tool includes a base body 10, a first HfB 2 coating 21 deposited on the surface of the base body, a MeN coating 30 deposited on the first HfB 2 coating 21, a deposit Second HfB 2 coating 22 on the MeN coating 30 .
  • Me represents an alloying element.
  • the first HfB 2 coating 21 , the MeN coating 30 and the second HfB 2 coating 22 are all deposited by high-power magnetron sputtering.
  • the substrate 10 is a high-speed steel substrate, and the MeN coating 30 is an AlTiN coating.
  • the first HfB 2 coating 21 includes, in atomic percent, 22 atomic percent Hf and 78 atomic percent B.
  • the second HfB 2 coating 22 includes, in atomic percent, 22 atomic percent Hf and 78 atomic percent B.
  • the thickness of the first HfB 2 coating 21 is 0.7 ⁇ m
  • the thickness of the second HfB 2 coating 22 is 0.7 ⁇ m
  • the thickness of the MeN coating 30 is 0.35 ⁇ m.
  • Substrate pretreatment the substrate is cleaned in ultrasonic waves and heated to remove surface moisture, and then the substrate is clamped on a three-dimensional rotatable turntable and sent to the chamber of the coating equipment.
  • Preparation of coating set the vacuum degree in the chamber to 0.5Pa, the substrate bias voltage to -100V, the heating temperature of the heater to be 550°C, the rotation speed of the turntable to be 3rpm, and the target materials to be HfB 2 and AlTi targets.
  • HfB 2 and AlTi targets were used to prepare HfB 2 coating and AlTiN coating.
  • the coating preparation is carried out for 280min;
  • the prepared tool with HfB 2 coating has the following properties: the average grain size is 7nm, the hardness of the coating is 42GPa, the elastic modulus is 580GPa, and the bonding force between the coating and the substrate is 85N.
  • Fig. 7 shows the result of scratch test on the surface of the tool with HfB 2 coating of this embodiment. It can be seen from Fig. 7 that the coating has no obvious peeling phenomenon between the indenter loading force of 0-85N.

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Abstract

本发明公开一种带HfB 2涂层的刀具，其包括：基体和采用直流磁控溅射或高功率磁控溅射沉积在所述基体上的HfB 2涂层；或者，采用直流磁控溅射或高功率磁控溅射在所述基体上的交替沉积HfB 2涂层和MeN涂层，Me代表合金元素。本发明在刀具的基体上采用直流磁控或高功率磁控溅射工艺沉积单层HfB 2涂层或者是包含HfB 2涂层的多层涂层，带HfB 2涂层的刀具具有高硬度、高热导率等优异的综合性能，能够在钛合金、高温合金等难加工材料的加工过程中，有效降低切削区域的局部高温、抑制刀具前后刀面粘结磨损、提高刀具耐磨性能，实现高效高质量切削加工。

Description

一种带HfB 2涂层的刀具及其制备方法 技术领域
本发明涉及刀具技术领域，特别涉及一种带HfB 2涂层的刀具及其制备方法，该刀具特别适用于难加工材料的高速切削加工中。
背景技术
对于难加工材料的高速切削加工所用的刀具，通常采用物理气相沉积和化学气相沉积的方法在切削刀具表面进行涂层，能够有效提高刀具加工寿命和工件加工质量。随着高速加工技术的进步，对涂层刀具的性能要求也越来越高。刀具涂层材料由TiN、TiC、CrN等二元涂层向TiAlN、TiCN、TiSiN、TiAlSiN等多元涂层发展。涂层结构由单层涂层向多层、纳米复合等结构发展，刀具涂层在耐磨性、红硬性、抗氧化、抗裂纹扩展等方面性能得到了一定程度的提高，刀具涂层专用性也越来越明显。另一方面，近年来也提出了材料“素化”的概念，即在不改变和增加材料成分的前提下实现材料性能增强；有关学者在刀具涂层方面也采用了材料“素化”的概念，进行涂层的设计与制备。
随着各类高温合金、钛合金等难加工材料在各个领域的应用的发展，不仅要求涂层刀具具有较高的硬度和耐磨性，更要求其具有较高的热导率和较低的材料亲和力等性能，以降低加工过程中切削区域的局部高温，降低刀具粘结磨损，提高刀具加工寿命和加工质量。而现有加工该类难加工材料的涂层刀具，仍未能很好满足其高效高质量加工的需求。
发明内容
本发明的目的在于克服上述现有技术中涂层刀具用于加工高温合金、钛合金等难加工材料的切削加工时存在的刀具的硬度、耐磨性、热导率和对加工材料亲 和力等性能不能满足使用要求的缺陷，提供一种具有较高的硬度、耐磨性、热导率和较低的材料亲和力的刀具，该刀具在加工难加工材料的过程中降低了切削区域的局部高温，降低刀具粘结磨损，提高刀具加工寿命和加工质量。
为实现上述目的，本发明采用如下技术方案：
一种带HfB 2涂层的刀具，其包括：
基体；
采用直流磁控溅射或高功率磁控溅射沉积在所述基体上的HfB 2涂层；或者，采用直流磁控溅射或高功率磁控溅射在所述基体上的交替沉积HfB 2涂层和MeN涂层，Me代表合金元素。
现有的带涂层的刀具在加工高温合金、钛合金等难加工材料的切削加工时存在刀具的硬度、耐磨性、热导率和对加工材料亲和力等性能不能满足使用要求的缺陷，本发明在刀具是在基体上沉积HfB 2涂层，HfB 2涂层具有高热导率、高硬度等优异的综合特性，作为刀具涂层材料极具潜力。而且，在本发明中，采用了直流磁控溅射或高功率磁控溅射制备HfB 2涂层，适合制备工业应用的涂层刀具，充分发挥出HfB 2涂层的优异性能，相比化学气相沉积技术制备HfB 2涂层较为环保，相比射频磁控溅射技术沉积速率高。本发明中，在刀具的基体上沉积HfB 2涂层，可以是基体上沉积单独一层HfB 2涂层；也可以是在基体上沉积了HfB 2涂层和MeN涂层多层涂层，其中，Me代表合金元素，HfB 2涂层和MeN涂层交替地沉积在基体上。
进一步的，所述HfB 2涂层按原子百分比计包括20～45％的Hf，55～80％的B。
进一步的，所述HfB 2涂层的厚度为0.5～5μm；或者，HfB 2涂层和MeN涂层的总厚度为0.5～5μm。
进一步的，所述HfB 2涂层和MeN涂层的厚度之比为1:(0.1～10)。
进一步的，所述MeN涂层按原子百分比计包括35～65％的Me,35～65％的N。
进一步的，所述MeN涂层为TiN涂层、TiSiN涂层、TiAlN涂层、AlTiN涂层、CrN涂层、CrSiN涂层或者CrAlN涂层，所述基体为硬质合金基体或高速钢基体。
本发明还公开了所述的带HfB 2涂层的刀具的制备方法，所述制备方法采用涂层设备在基体上沉积涂层，包括以下步骤：
基体处理步骤：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室；
腔室抽真空步骤：先将腔室真空抽至2×10 -3Pa以下，再启动加热器去除腔室和基体表面易挥发杂质；
辉光清洗步骤：往腔室中通入高纯气体Ar，腔室内真空度为0.05～1.2Pa，设置基体偏压-100～-500V，对基体进行辉光清洗10～30min；
制备涂层步骤：设置腔室内真空度为0.2～1.5Pa，基体偏压为0～-250V，加热器为加热温度为300～600℃，转架旋转速度为1～15rpm，开启靶材电源，采用直流磁控溅射或高功率磁控溅射在基体上沉积40～350min；
取出刀具步骤：关闭靶材电源，待腔室温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
进一步的，制备涂层步骤中，在所述基体上沉积单层HfB 2涂层时，靶材为HfB 2，通入气体为Ar，靶材功率为1～7KW。
进一步的，制备涂层步骤中，在所述基体上交替沉积HfB 2涂层和MeN涂层时，靶材为HfB 2和Me靶，通过交替开启HfB 2和Me靶制备HfB 2涂层和MeN涂层；开启HfB 2靶时通入气体为Ar，靶材功率为1～7KW；通入Me靶时通入气体Ar和N 2， Ar:N 2流量比例为(0.5～3):1，靶材功率为1～7KW。
进一步的，采用高功率磁控溅射时，靶材电源脉冲开时间5～300us，脉冲关时间500～10000us。
与现有技术相比，本发明的有益效果是：
本发明在刀具的基体上采用直流磁控或高功率磁控溅射工艺沉积单层HfB 2涂层或者是包含HfB 2涂层的多层涂层，带HfB 2涂层的刀具具有高硬度、高热导率等优异的综合性能，能够在钛合金、高温合金等难加工材料的加工过程中，有效降低切削区域的局部高温、抑制刀具前后刀面粘结磨损、提高刀具耐磨性能，实现高效高质量切削加工。
附图说明
图1为本发明一种实施方式的带HfB 2涂层的刀具的结构示意图；
图2为本发明另一种实施方式的带HfB 2涂层的刀具的结构示意图；
图3为本发明又一种实施方式的带HfB 2涂层的刀具的结构示意图；
图4为本发明实施例一的带HfB 2涂层的刀具的涂层截面扫描电镜图；
图5为本发明实施例二的带HfB 2涂层的刀具的透射电镜图；
图6为本发明实施例三的带HfB 2涂层的刀具的涂层表面纳米压痕测试结果图；
图7为本发明实施例四的带HfB 2涂层的刀具的涂层表面划痕测试结果图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。本领域普通人员在没有做出创造性劳动前提下所获得的所有其他实 施例，均属于本发明的保护范围。
实施例一
请参照图1，图1显示了本发明一种带HfB 2涂层的刀具的一种实施方式的结构示意图。图1所显示的带HfB 2涂层的刀具具有单层HfB 2涂层，具体结构是：所述刀具包括基体10、沉积在所述基体10表面上的HfB 2涂层20。所述HfB 2涂层20是采用直流磁控溅射沉积而成的。所述基体10可以是硬质合金基体。所述HfB 2涂层20以原子百分比计，包括原子百分比为41％的Hf，和原子百分比为59％的B；HfB 2涂层厚度为2.5μm。
本实施方式的带HfB 2涂层的刀具的制备方法包括如下步骤：
1)基体预处理：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室。
2)腔室抽真空：先将腔室真空抽至2×10 -3Pa以下，再打开加热器设置为600℃加热60min，充分去除腔室和基体表面易挥发杂质，最终保持腔室抽真空度在2×10 -3Pa以下。
3)辉光清洗：通入高纯气体Ar，腔室内真空度为1.0Pa，设置基体偏压-300V，对基体进行辉光清洗30min。
4)制备涂层：设置腔室内真空度为1.0Pa，基体偏压为-200V，加热器的加热温度为600℃，转架旋转速度为5rpm，靶材为HfB 2，通入气体为Ar，靶材功率为6KW，开启靶材电源，采用直流磁控溅射技术，进行150min的涂层制备；
5)涂层结束后，关闭靶材电源，待腔室的温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
经过检测，所制备的带HfB 2涂层的刀具具有以下性能：晶粒平均尺寸为20nm,涂层硬度为32GPa,弹性模量为520GPa，涂层与基体结合力为79N。
对本实施例的带HfB 2涂层的刀具的涂层截面进行电镜扫描，获得的扫描电镜图如图4所示。
实例二
请参照图1，一种带HfB 2涂层的刀具，所述刀具具有单层HfB 2涂层，具体结构是：所述刀具包括基体10、沉积在所述基体10表面上的HfB 2涂层20。所述HfB 2涂层20是采用高功率磁控溅射沉积而成的。所述基体10是高速钢基体。所述HfB 2涂层20以原子百分比计，包括原子百分比为28％的Hf，和原子百分比为72％的B；HfB 2涂层厚度为2.8μm。
本实施方式的带HfB 2涂层的刀具的制备方法包括如下步骤：
1)基体预处理：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室。
2)腔室抽真空：先将腔室真空抽至2×10 -3Pa以下，再打开加热器设置为500℃加热50min，充分去除腔室和基体表面易挥发杂质，最终保持腔室抽真空度在2×10 -3Pa以下。
3)辉光清洗：通入高纯气体Ar，腔室内真空度为1.2Pa，设置基体偏压-400V，对基体进行辉光清洗20min。
4)制备涂层：设置腔室内真空度为0.5Pa，基体偏压为-50V，加热器的加热温度为400℃，转架旋转速度为8rpm，靶材为HfB 2，通入气体为Ar，采用高功率磁控溅射技术，靶材功率为5KW，靶材电源脉冲开时间40us，脉冲关时间1000us 进行350mi n的涂层制备；
5)涂层结束后，关闭靶材电源，待腔室的温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
经过检测，所制备的带HfB 2涂层的刀具具有以下性能：晶粒平均尺寸为10nm,涂层硬度为48GPa,弹性模量为605GPa，涂层与基体结合力为82N。
请参照图5，图5显示了本实施方式制得的带HfB 2涂层的刀具在透射电镜下观察到的图像。
实例三
请参照图2，一种带HfB 2涂层的刀具，所述刀具具有多层涂层，所述多层涂层包括HfB 2涂层。所述刀具的具体结构是：所述刀具包括基体10、沉积在所述基体10表面上的第一MeN涂层31、沉积在所述第一MeN涂层31上的HfB 2涂层20、沉积在所述HfB 2涂层20上的第二MeN涂层32。其中，Me代表合金元素。所述第一MeN涂层31、HfB 2涂层20、第二MeN涂层32均采用直流磁控溅射沉积而成。所述基体10为硬质合金基体，所述第一MeN涂层31和所述第二MeN涂层32均为CrAlN涂层。
所述HfB 2涂层20以原子百分比计，包括原子百分比为38％的Hf，原子百分比为62％的B。
所述第一MeN涂层31以原子百分比计，包括原子百分比为45％的Cr，和原子百分比为55％的N。
所述第二MeN涂层32以原子百分比计，包括原子百分比为45％的Cr，和原子百分比为55％的N。
所述第一MeN涂层31的厚度为1.4μm，所述第二MeN涂层32的厚度为1.4μm，所述HfB 2涂层20的厚度为0.7μm。
本实施方式的带HfB 2涂层的刀具的制备方法包括如下步骤：
1)基体预处理：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室。
2)腔室抽真空：先将腔室真空抽至2×10 -3Pa以下，再打开加热器设置为300℃加热30min，充分去除腔室和基体表面易挥发杂质，最终保持腔室抽真空度在2×10 -3Pa以下。
3)辉光清洗：通入高纯气体Ar，腔室内真空度为0.5Pa，设置基体偏压-500V，对基体进行辉光清洗10min。
4)制备涂层：设置腔室内真空度为0.9Pa，基体偏压为-150V，加热器的加热温度为300℃，转架旋转速度为3rpm，靶材为HfB 2和Cr靶，通过交替开启HfB 2和Cr靶制备HfB 2涂层和CrN涂层，开启HfB2靶时通入气体为Ar,靶材功率为6KW；开启Cr靶时通入气体Ar和N2，流量比例Ar:N为1:1,靶材功率为5KW，进行350min的涂层制备；
5)涂层结束后，关闭靶材电源，待腔室的温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
经过检测，所制备的带HfB 2涂层的刀具具有以下性能：晶粒平均尺寸为12nm,涂层与基体结合力为90N，涂层硬度为24GPa,弹性模量为383GPa
图6显示了采用纳米压痕测试仪检测本实施方式的带HfB 2涂层的刀具的测试结果图，由图6可以得到随纳米金刚石压头从涂层表面压入和抬起过程中的载荷位移曲线关系，从而由纳米压痕测试仪导出涂层硬度和弹性模量数值。
实例四
请参照图3，一种带HfB 2涂层的刀具，所述刀具具有多层涂层，所述多层涂层包括HfB 2涂层。所述刀具的具体结构是：所述刀具包括基体10、沉积在所述基体表面上的第一HfB 2涂层21、沉积在所述第一HfB 2涂层21上的MeN涂层30、沉积在所述MeN涂层30上的第二HfB 2涂层22。其中，Me代表合金元素。所述第一HfB 2涂层21、MeN涂层30、第二HfB 2涂层22均采用高功率磁控溅射沉积而成。所述基体10为高速钢基体，所述MeN涂层30为AlTiN涂层。
所述第一HfB 2涂层21以原子百分比计，包括原子百分比为22％的Hf，原子百分比为78％的B。
所述第二HfB 2涂层22以原子百分比计，包括原子百分比为22％的Hf，原子百分比为78％的B。
所述MeN涂层30以原子百分比计，包括原子百分比为60％的AlTi和40％的N。其中，AlTi原子比Al:Ti＝65:35。
所述第一HfB 2涂层21的厚度为0.7μm，所述第二HfB 2涂层22的厚度为0.7μm，所述MeN涂层30的厚度为0.35μm。
本实施方式的带HfB 2涂层的刀具的制备方法包括如下步骤：
1)基体预处理：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室。
2)腔室抽真空：先将腔室真空抽至2×10 -3Pa以下，再打开加热器设置为600℃加热60min，充分去除腔室和基体表面易挥发杂质，最终保持腔室抽真空度在2×10 -3Pa以下。
3)辉光清洗：通入高纯气体Ar，腔室内真空度为1.2Pa，设置基体偏压-500V，对基体进行辉光清洗30min。
4)制备涂层：设置腔室内真空度为0.5Pa，基体偏压为-100V，加热器的加热温度为550℃，转架旋转速度为3rpm，靶材为HfB 2和AlTi靶，通过交替开启HfB 2和AlTi靶制备HfB 2涂层和AlTiN涂层，开启HfB 2靶时通入气体为Ar,靶材功率为5KW，靶材电源脉冲开时间20us，脉冲关时间1200us；开启AlTi靶时通入气体Ar和N 2，流量比例Ar:N为1:2,靶材功率为5KW，，靶材电源脉冲开时间20us，脉冲关时间1200us，进行280min的涂层制备；
5)涂层结束后，关闭靶材电源，待腔室的温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
经过检测，所制备的带HfB 2涂层的刀具具有以下性能：晶粒平均尺寸为7nm,涂层硬度为42GPa,弹性模量为580GPa，涂层与基体结合力为85N。
图7显示了对本实施例的带HfB 2涂层的刀具表面进行划痕测试的结果图，由图7看出，涂层在压头加载力0-85N之间无明显剥落现象。
以上所述为本发明的较佳实施例而已，但本发明不应局限于该实施例和附图所公开的内容，所以凡是不脱离本发明所公开的精神下完成的等效或修改，都落入本发明保护的范围。

Claims (10)

  1. 一种带HfB 2涂层的刀具，其特征在于包括：
    基体；
    采用直流磁控溅射或高功率磁控溅射沉积在所述基体上的HfB 2涂层；或者，采用直流磁控溅射或高功率磁控溅射在所述基体上交替沉积HfB 2涂层和MeN涂层，Me代表合金元素。
  2. 如权利要求1所述的带HfB 2涂层的刀具，其特征在于：所述HfB 2涂层按原子百分比计包括20～45％的Hf，55～80％的B。
  3. 如权利要求1所述的带HfB 2涂层的刀具，其特征在于：所述HfB 2涂层的厚度为0.5～5μm；或者，HfB 2涂层和MeN涂层的总厚度为0.5～5μm。
  4. 如权利要求3所述的带HfB 2涂层的刀具，其特征在于：所述HfB 2涂层和MeN涂层的厚度之比为1:(0.1～10)。
  5. 如权利要求1所述的带HfB 2涂层的刀具，其特征在于：所述MeN涂层按原子百分比计包括35～65％的Me,35～65％的N。
  6. 如权利要求1所述的带HfB 2涂层的刀具，其特征在于：所述MeN涂层为TiN涂层、TiSiN涂层、TiAlN涂层、AlTiN涂层、CrN涂层、CrSiN涂层或者CrAlN涂层，所述基体为硬质合金基体或高速钢基体。
  7. 一种权利要求1至6任意一项所述的带HfB 2涂层的刀具的制备方法，其特征在于，采用涂层设备在基体上沉积涂层，包括以下步骤：
    基体处理步骤：将基体在超声波中清洗并进行加热去除表面水分，随后将基体装夹在可三维旋转的转架上，送入涂层设备的腔室；
    腔室抽真空步骤：先将腔室真空抽至2×10 -3Pa以下，再启动加热器去除腔室和基体表面易挥发杂质；
    辉光清洗步骤：往腔室中通入高纯气体Ar，腔室内真空度为0.05～1.2Pa，设置基体偏压-100～-500V，对基体进行辉光清洗10～30min；
    制备涂层步骤：设置腔室内真空度为0.2～1.5Pa，基体偏压为0～-250V，加热器的加热温度为300～600℃，转架旋转速度为1～15rpm，开启靶材电源，采用直流磁控溅射或者高功率磁控溅射在基体上沉积40～350min；
    取出刀具步骤：关闭靶材电源，待腔室温度降至100℃以下，打开腔室，取出带HfB 2涂层的刀具。
  8. 如权利要求7所述的制备方法，其特征在于：制备涂层步骤中，在所述基体上沉积单层HfB 2涂层时，靶材为HfB 2，通入气体为Ar，靶材功率为1～7KW。
  9. 如权利要求7所述的制备方法，其特征在于：制备涂层步骤中，在所述基体上交替沉积HfB 2涂层和MeN涂层时，靶材为HfB 2和Me靶，通过交替开启HfB 2和Me靶制备HfB 2涂层和MeN涂层；开启HfB 2靶时通入气体为Ar，靶材功率为1～7KW；通入Me靶时通入气体Ar和N 2，Ar:N 2流量比例为(0.5～3):1，靶材功率为1～7KW。
  10. 如权利要求7所述的制备方法，其特征在于：采用高功率磁控溅射时，靶材电源脉冲开时间5～300us，脉冲关时间500～10000us。
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