WO2022012226A1 - 背光模组及其设计方法、显示装置 - Google Patents
背光模组及其设计方法、显示装置 Download PDFInfo
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- WO2022012226A1 WO2022012226A1 PCT/CN2021/098962 CN2021098962W WO2022012226A1 WO 2022012226 A1 WO2022012226 A1 WO 2022012226A1 CN 2021098962 W CN2021098962 W CN 2021098962W WO 2022012226 A1 WO2022012226 A1 WO 2022012226A1
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- light
- light control
- substrate
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- backlight module
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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Definitions
- the present disclosure relates to the field of display technology, and in particular, to a backlight module, a design method thereof, and a display device.
- Mini LED Light Emitting Diode
- LED for English abbreviation
- Mini LED the sub-millimeter light-emitting diode
- Mini LEDs can be used in backlight modules in liquid crystal display devices as light-emitting elements of backlight modules. In this way, by utilizing the advantages of Mini LED, the backlight module can achieve the advantages of regional dimming, fast response, simple structure and long life.
- embodiments of the present disclosure provide a backlight module, a design method thereof, and a display device.
- a backlight module comprising:
- a plurality of light emitting diode chips disposed on the first substrate, the plurality of light emitting diode chips being arranged on the first substrate in an array along a first direction and a second direction;
- the light control structure is configured to: receive the light emitted from the light emitting diode chip, and control the luminous flux distribution of the light emitted from the light control structure,
- the backlight module includes a plurality of light control area groups, and the plurality of light control area groups are in a one-to-one correspondence with a plurality of light-emitting diode chips, and each light control area group at least includes a first light control area and a second light control area.
- the orthographic projection of the first light control area of each light control area group on the first substrate covers the orthographic projection of the light-emitting diode chip corresponding to the light control area group on the first substrate, and each light The orthographic projection of the second light control region of the light control region group on the first substrate surrounds the orthographic projection of the first light control region of the light control region group on the first substrate;
- the light control structure includes a plurality of light control substructure groups, and the plurality of light control substructure groups are respectively located in the plurality of light control area groups, and each light control substructure group includes at least a first light control substructure and a second light control substructure. control substructure;
- Each of the light control substructures includes a plurality of light transmission parts and a plurality of light reflection parts, and the proportion of the light transmission parts in the first light control substructure is the same as that of the light transmission parts in the second light control substructure.
- the proportions are different.
- the proportion of the light-transmitting portion in the first light-controlling substructure is the area of the orthographic projection of all the light-transmitting portions included in the first light-controlling substructure on the first substrate and the first light-controlling substructure.
- the ratio of the area of the first light control region where the structure is located, and the proportion of the light-transmitting parts in the second light-control sub-structure is the ratio of all the light-transmitting parts included in the second light-control sub-structure on the first substrate.
- the first light control substructure is located in the first light control region
- the second light control substructure is located in the second light control region
- the first light control substructure The proportion of the middle light-transmitting portion is smaller than the proportion of the light-transmitting portion in the second light control substructure.
- the plurality of light-transmitting parts and the plurality of light-reflecting parts of the light control structure are alternately arranged.
- the plurality of light transmission parts and the plurality of light reflection parts of the light control structure are alternately arranged along the first direction
- the plurality of light transmission parts and the plurality of light reflection parts of the light control structure are arranged along the second direction.
- the directions are arranged alternately.
- the light control structure includes a reflective layer formed of a reflective material and a plurality of hollow parts formed in the light emitting layer, and the plurality of hollow parts constitute the plurality of light transmission parts, The portion of the light-reflecting layer located between every two adjacent hollow portions constitutes the plurality of light-reflecting portions.
- a plurality of light-reflecting parts of the light control structure are arranged in an array along the first direction and the second direction, and the light control structure includes filling in every two adjacent light-reflecting parts.
- a transparent material layer covering the plurality of light-reflecting parts is formed between the parts, and the part of the transparent material layer located between every two adjacent light-reflecting parts constitutes the plurality of light-transmitting parts.
- the backlight module further includes: a first conductive layer disposed on the first substrate, the first conductive layer including a plurality of first traces;
- the second conductive layer disposed on the side of the first conductive layer away from the first substrate, the second conductive layer including a plurality of second wirings;
- the first cover layer disposed on the first substrate, the first cover layer is formed of a light-transmitting material, the first cover layer at least fills the gaps between the plurality of first traces,
- the plurality of light-reflecting parts of the light control structure include the plurality of first traces and the plurality of second traces, and the plurality of light-transmitting parts of the light control structure include the first cover layer. a portion located in the gaps between the plurality of first traces.
- the first traces extend in the first direction
- the second traces extend in the second direction
- the plurality of first traces and the plurality of first traces The orthographic projection of the combination of the two wirings on the first substrate is in a plurality of zigzag shapes.
- each light control area group further includes a third light control area, and the orthographic projection of the third light control area of each light control area group on the first substrate surrounds the light control area group the orthographic projection of the second light control region on the first substrate;
- Each light control substructure group further includes a third light control substructure, and the third light control substructure is located in the third light control region;
- the third light control substructure also includes a plurality of light transmission parts and a plurality of light reflection parts, the proportion of the light transmission parts in the third light control substructure, the proportion of the light transmission parts in the second light control substructure.
- the proportion and the proportion of the light transmission part in the first light control substructure are different from each other, and the proportion of the light transmission part in the third light control substructure is all the light transmission parts included in the third light control substructure.
- each light control area group further includes a fourth light control area, and the orthographic projection of the fourth light control area of each light control area group on the first substrate surrounds the light control area group The orthographic projection of the third light control region on the first substrate;
- Each light control substructure group further includes a fourth light control substructure, and the fourth light control substructure is located in the fourth light control region;
- the fourth light control substructure also includes a plurality of light transmission parts and a plurality of light reflection parts, the proportion of the light transmission parts in the fourth light control substructure, the proportion of the light transmission parts in the third light control substructure.
- the proportion, the proportion of the light transmission part in the second light control substructure and the proportion of the light transmission part in the first light control substructure are all different from each other, and the light transmission part in the fourth light control substructure is different from each other.
- the ratio is the ratio of the area of the orthographic projection of all light-transmitting parts included in the fourth light control substructure on the first substrate to the area of the fourth light control region where the fourth light control substructure is located.
- each light control region group includes N light control regions, where N is a positive integer greater than or equal to 2; the N light control regions include at least the first light control region and all the light control regions.
- the orthographic projection of the Nth light control region of each light control region group on the first substrate surrounds the N-1th light control region of the light control region group in the first light control region. Orthographic projection on the substrate.
- the backlight module further includes a plurality of light diffusing structures disposed on the first substrate, wherein the orthographic projections of the plurality of light diffusing structures on the first substrate respectively cover The orthographic projection of the plurality of light emitting diode chips on the first substrate, and the light diffusing structure is used for diffusing the light emitted from the light emitting diode chips.
- each of the light diffusing structures includes a plurality of triangular prisms, each triangular prism has an apex angle and a side opposite to the apex angle, and the side of the triangular prism is located near the first substrate.
- one side of the triangular prism, and the apex angle is located on the side of the triangular prism away from the first substrate.
- the backlight module further includes a first planarization layer disposed on the first substrate, wherein the first planarization layer covers the plurality of triangular prisms, and the first planarization layer
- the refractive index of the material of the ionization layer is greater than the refractive index of the material of the light diffusing structure.
- the first substrate includes a first side and a second side opposite to the first side, and the plurality of light emitting diode chips and the light control structure are respectively located on the first substrate the first side and the second side;
- the plurality of light diffusing structures are disposed on the first side of the first substrate and between the first substrate and the plurality of light emitting diode chips.
- the first substrate includes a first side and a second side opposite the first side, and the plurality of light emitting diode chips and the light control structure are located on the first substrate the first side;
- the display substrate further includes a first reflective layer disposed on the first substrate, and the first reflective layer is disposed between the first conductive layer and the first substrate;
- the orthographic projection of the first reflective layer on the first substrate covers the orthographic projection of the first trace on the first substrate, and the orthographic projection of the first reflective layer on the first substrate The orthographic projection also covers the orthographic projection of the second trace on the first substrate.
- the display substrate further includes a second reflective layer disposed on the first substrate, the second reflective layer being located on a side of the second cover layer away from the first substrate;
- the orthographic projection of the second reflective layer on the first substrate at least partially overlaps with the orthographic projection of the first trace on the first substrate, and the second reflective layer is on the first substrate
- the orthographic projection of the second trace at least partially overlaps with the orthographic projection of the second trace on the first substrate, and the orthographic projection of the second reflective layer on the first substrate is a back-shaped.
- the backlight module further includes an encapsulation layer and a reflective structure, wherein the encapsulation layer is disposed on the first substrate and covers the plurality of light-emitting diode chips, and the reflective structure is located on the first substrate.
- the encapsulation layer is at a side away from the first substrate, and the orthographic projection of the reflective structure on the first substrate at least covers the orthographic projection of the plurality of light-emitting diode chips on the first substrate.
- the reflective structure includes a plurality of lenses arranged in an array on the first substrate, each of the lenses protruding in a direction away from the first substrate .
- the reflective structure includes a groove portion, an orthographic projection of the groove portion on the first substrate and an orthographic projection of the plurality of light emitting diode chips on the first substrate At least partially overlapping, the groove portion is concave in a direction toward the light emitting diode chip.
- the backlight module further includes an encapsulation layer and a reflective structure, wherein the encapsulation layer is disposed on the first substrate and covers the plurality of light-emitting diode chips, and the reflective structure is located on the first substrate.
- the orthographic projection of the reflective structure on the first substrate at least covers the orthographic projection of the plurality of light emitting diode chips on the first substrate.
- the light emitting diode chips are sub-millimeter light emitting diode chips.
- a display device including the above-mentioned backlight module.
- a method for designing a backlight module comprising the following steps:
- the parameters at least including the size of the light-emitting diode chip and the luminous flux and light-emitting angle of the light emitted by the light-emitting diode chip;
- the thickness of the first substrate and the determined upper limit of the number of reflections determine the period value of each light control area and the light emitting diode chip array, where the period value of the light emitting diode chip array is two adjacent The center distance of the LED chip;
- the light control structure in each light control area is designed.
- FIG. 1 is a schematic plan view of a backlight module according to some exemplary embodiments of the present disclosure
- FIG. 2 is a cross-sectional view of a backlight module according to some exemplary embodiments of the present disclosure, taken along line A-A' in FIG. 1;
- FIG. 3 is a partial flowchart of a design method of a backlight module according to some exemplary embodiments of the present disclosure
- FIG. 4 schematically shows a reflection light path diagram of the light emitted from the LED chip in the glass substrate
- Figure 5 schematically shows a plan view of each light control region
- 6A and 6B are schematic structural diagrams of individual light control structures included in a backlight module according to some exemplary embodiments of the present disclosure
- 6C is a schematic structural diagram of a light control structure formed by traces included in a backlight module according to some exemplary embodiments of the present disclosure
- FIG. 7 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, this FIG. 7 may be a cross-sectional view of the backlight module taken along the line B-B' in FIG. 1;
- FIG. 8 is a schematic structural diagram of a light diffusion structure included in a backlight module according to some exemplary embodiments of the present disclosure
- FIG. 9 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, this FIG. 9 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1;
- FIG. 10 is a partial plan view of a light control structure formed by traces included in a backlight module according to some exemplary embodiments of the present disclosure
- Fig. 11 is a partial enlarged view of the light control structure shown in Fig. 10, in which the back-shaped structure is schematically shown;
- FIG. 12 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, FIG. 9 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1;
- Fig. 13 is a partial enlarged view of the reflection structure included in the backlight module shown in Fig. 12;
- FIG. 14 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, this FIG. 14 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1;
- FIG. 15 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, this FIG. 15 may be a cross-sectional view of the backlight module taken along the line B-B' in FIG. 1;
- FIG. 16 is a flowchart of a method for manufacturing the backlight module shown in FIG. 7 according to some exemplary embodiments of the present disclosure
- FIG. 17 is a flowchart of a method for manufacturing the backlight module shown in FIG. 9 according to some exemplary embodiments of the present disclosure.
- FIG. 18 is a schematic diagram of a display device according to some exemplary embodiments of the present disclosure.
- the X axis, the Y axis and the Z axis are not limited to the three axes of the rectangular coordinate system, and may be interpreted in a broader sense.
- the X, Y, and Z axes may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.
- "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z” may be interpreted as X only, Y only, Z only, or Any combination of two or more of X, Y and Z such as XYZ, XYY, YZ and ZZ.
- the term "and/or" includes any and all combinations of one or more of the associated listed items.
- an inorganic light emitting diode refers to a light emitting element made of inorganic materials, wherein LED means an inorganic light emitting element different from OLED.
- the inorganic light-emitting element may include a sub-millimeter light emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED in English) and a Micro Light Emitting Diode (Micro Light Emitting Diode, abbreviated as Micro LED in English).
- Mini LED a sub-millimeter light emitting diode
- Micro LED Micro Light Emitting Diode
- the sub-millimeter light-emitting diode ie Mini LED refers to a small light-emitting diode with a grain size between Micro LED and traditional LED.
- the grain size of Mini LED can be between 100 and 300 microns.
- the expression “light control structure” means that the structure can control the light incident thereon such that the energy distribution or luminous flux distribution of the light exiting through the structure meets predetermined requirements.
- the expression “light control area” means that the energy distribution or luminous flux distribution of the light emitted in this area needs to be controlled to meet predetermined requirements.
- the backlight module includes: a first substrate; a plurality of light emitting diode chips disposed on the first substrate, the plurality of light emitting diode chips are arranged in an array on the first substrate along a first direction and a second direction and a light control structure disposed on the first substrate, the light control structure is configured to: receive the light emitted from the light emitting diode chip, and control the luminous flux distribution of the light emitted from the light control structure, wherein , the backlight module includes a plurality of light control area groups, the plurality of light control area groups are in a one-to-one correspondence with a plurality of light-emitting diode chips, and each light control area group at least includes a first light control area and a second light control area , the orthographic projection of the first light control region of each light control region group on the first substrate covers the orthographic projection of the light-emitting di
- a backlight module according to an embodiment of the present disclosure may include a first substrate 1 and an LED chip array disposed on the first substrate 1.
- the first substrate 1 may be a glass substrate
- the LED chip array may include a plurality of LED chips 2 .
- a plurality of LED chips 2 are arranged in an array on the first substrate 1 by mounting (eg, surface mounting, etc.). As shown in FIG. 1 , a plurality of LED chips 2 are schematically shown arranged on the first substrate 1 in an array along the first direction X and the second direction Y.
- first direction X and the second direction Y are perpendicular to each other, and the third direction Z is perpendicular to the first direction X and the second direction Y.
- the LED chip 2 may be a Mini LED chip.
- Mini LED can be driven by thin film transistors like active matrix, or can be driven by driver IC in passive matrix, for example, LED backlight can be driven by driver IC.
- the Mini LED backlight module can be applied to an LCD display panel to form a display screen.
- the Mini LED backlight module can be divided into hundreds to tens of thousands of areas as needed, each area can correspond to multiple pixels in the display panel, and the brightness of each area can be independently controlled. In this way, the light-dark contrast ratio of the display screen can be increased to 10,000,000:1, which is the same as that of OLED.
- Mini LED can be set to off. If the image needs to be particularly bright, such as fireworks, the brightness of the Mini LEDs in this area can be increased. Through such sub-regional control, not only can the contrast of light and dark be greatly improved, but also power can be saved.
- a rectangular frame is used to represent the LED chip in FIG. 1 , but it can be understood that the LED chip in the embodiment of the present disclosure is not limited to being a rectangle, and may be other shapes such as a circle and a polygon.
- each LED chip 2 Since the light emitted by each LED chip 2 has a Lambertian distribution, it is necessary to design the pitch value of the LED chip array and the light control area of each LED chip 2 to ensure the uniformity of the light emitted by the entire backlight module. Sex meets the requirements.
- the expression "the pitch value of the LED chip array or LED chip” is also called the period value of the LED chip array or the LED chip, indicating the distance between the centers of two adjacent LED chips in the LED chip array, as shown in Figure 1 and As shown in FIG. 2, it is indicated by the reference sign p.
- FIG. 3 is a partial flowchart of a design method of a backlight module according to some exemplary embodiments of the present disclosure.
- a design method of a backlight module according to some exemplary embodiments of the present disclosure will be described with reference to FIGS. 1 to 3 .
- step S31 parameters of the LED chip are acquired.
- the parameters may include the luminous flux of the light emitted from the LED chip, the light-emitting angle, and the like. After selecting the model of the LED chip, these parameters are all determined values.
- step S32 the upper limit value of the number of times of reflection of light emitted from the LED chip is determined.
- FIG. 4 schematically shows a reflection light path diagram of the light emitted from the LED chip in the glass substrate.
- a part of the light emitted from the LED chip may be emitted from the front surface (ie, in a direction perpendicular to the first substrate 1 ), and this part of the light may be emitted directly without being reflected in the first substrate 1 .
- the other part of the light emitted from the LED chip is reflected multiple times in the first substrate 1 and then emitted. The longer the light travels, the more reflections, and the lower the light efficiency of the final emitted light. That is, in the process of light transmission and reflection, loss of light occurs.
- the loss of light is related to the material through which the light is transmitted and reflected.
- the first substrate 1 is a glass substrate, that is, light is mainly transmitted and reflected in the glass.
- the light loss of each reflection of the light can be calculated, so as to determine the emitted light from the LED chip number of reflections.
- FIG. 4 it schematically shows a situation where the outgoing light of an LED chip undergoes 6 reflections (including 3 reflections on the upper surface and 3 reflections on the lower surface), and after more (for example, 8 reflections) After the above) reflection, the loss of light may be large, and this part of the light can be ignored. That is to say, when designing, the reflected light within 6 times can be mainly considered.
- step S33 the period value of each light control area and the LED chip array is determined.
- Each light control area can be determined according to the light emission angle of the LED chip, the chip size, the thickness of the first substrate 1 and the number of reflections determined in step S32.
- FIG. 4 four light control areas are schematically shown.
- the four light control areas are respectively referred to as the first light control area, the second light control area, the third light control area and the fourth light control area.
- the areas are denoted by the reference numerals A1, A2, A3 and A4, respectively.
- the outgoing light of the LED chip 2 is emitted after 0 reflections, that is, the outgoing light of the LED chip 2 is directly emitted.
- the outgoing light of the LED chip 2 is reflected twice (one time on the upper surface and one time on the lower surface) and then exits.
- the outgoing light of the LED chip 2 is reflected four times (two reflections on the upper surface and two reflections on the lower surface) and then exits.
- the outgoing light of the LED chip 2 is reflected for 6 times (3 reflections on the upper surface and 3 reflections on the lower surface) and then exits.
- the energy of the light emitted from the first light control area A1 is greater than that of the light emitted from the second light control area A2
- the energy of the light emitted from the second light control area A2 is greater than that of the third light control area
- the energy of the light emitted from A3, the energy of the light emitted from the third light control area A3 is greater than the energy of the light emitted from the fourth light control area A4.
- the shape of the orthographic projection of each of the first light control area A1 , the second light control area A2 , the third light control area A3 and the fourth light control area A4 on the first substrate 1 is a circle or a ring , but embodiments of the present disclosure are not limited to circle and torus shapes.
- the orthographic projection of the first light control area A1 on the first substrate 1 has a center O, which coincides with the orthographic projection of the center of the LED chip 2 on the first substrate 1 .
- the sizes of the first light control area A1 , the second light control area A2 , the third light control area A3 and the fourth light control area A4 can be respectively represented by the radius of their respective orthographic projections (circles).
- Figure 5 schematically shows a plan view of the various light control regions.
- the first light control area A1, the second light control area A2, the third light control area A3 and the fourth light control area A4 may have a first radius R1, a second radius R2, a A third radius R3 and a fourth radius R4.
- the orthographic projection area of the first light control area A1 on the first substrate 1 is a circular area with the center O as the center and the first radius R1 as the radius
- the second light control area A2 is on the first substrate 1
- the orthographic projection area is the circular area obtained by subtracting the circular area with the center O as the center and the second radius R2 as the radius minus the circular area with the center O as the center and the first radius R1 as the radius
- the third The orthographic projection area of the light control area A3 on the first substrate 1 is the circular area with the center O as the center and the third radius R3 as the radius minus the circle with the center 0 as the center and the second radius R2 as the radius
- the orthographic projection area of the fourth light control area A4 on the first substrate 1 is the circular area with the center 0 as the center and the fourth radius R4 as the radius minus the center O as the center of the circle
- the light emission angle ⁇ of the LED chip can be obtained, and the size of the LED chip (ie, the diameter of the LED chip) is d.
- the thickness t of the first substrate 1 can also be obtained.
- the values of the first radius R1, the second radius R2, the third radius R3 and the fourth radius R4 can be calculated respectively according to the following formulas:
- the light emission angle ⁇ of the LED chip is about 41 degrees
- the LED chip size d is about 100 ⁇ m, that is, the radius of the LED chip (the distance between its edge and the center O) is 50 ⁇ m.
- the thickness t of the first substrate 1 is about 0.5 mm.
- the outgoing light of the LED chip has a large loss. Therefore, in the exemplary embodiment shown in FIG. 4 , the outgoing light of two adjacent LED chips 2 is in the fourth light Mixed in the control area A4, that is, the fourth light control area A4 of the two adjacent LED chips 2 are overlapped. In this way, the distance between the centers O of two adjacent LED chips 2 (that is, the period value or pitch value of the LED chip array) can be calculated, and with reference to FIG. 4 , it can be calculated as follows:
- step S34 the light transmittance and/or light reflectivity of each light control region is determined.
- the expression “light transmittance of the light control area” means the ratio of light transmitted after light is incident on the light control area to the light incident on the light control area
- the expression “light reflectivity of the light control area” means the light The ratio of the light reflected after incident on the light control area to the light incident on the light control area.
- the luminous flux of its outgoing light is known. That is, the total luminous flux incident on each light control region is known. In this way, the luminous flux of light incident on each of the light control areas A1 , A2 , A3 and A4 can be calculated. According to the luminous flux of the light incident on each light control area A1, A2, A3 and A4, and considering the area of each light control area A1, A2, A3 and A4, it is possible to calculate the luminous flux of each light control area A1, A2, A3 and A4. Light transmittance and light reflectivity.
- the light transmittance and light reflectivity of each light control region can be determined, as shown in the following table.
- the light transmittance of the first light control area A1 is the smallest
- the light transmittance of the second light control area A2 is the largest
- the light transmittance of the third light control area A3 and the fourth light control area A4 located between the two. It should be understood that the luminous flux of light emitted from a light control region is affected by the luminous flux of incident light in the light control region, the area of the light control region and the light transmittance of the light control region.
- the light transmittance of the first light control area A1 is the smallest; although the third light control area A3 and the fourth light The luminous flux of the incident light in the control area A4 is small, but since the area of each of the third light control area A3 and the fourth light control area A4 is relatively large, in general, the light transmittance can be set to be higher than The light transmittance of the first light control area A1 is large, but smaller than the light transmittance of the second light control area A2.
- the respective light transmittances are designed for each light control area, so that the luminous flux of the light emitted from each light control area is basically consistent, that is, the uniformity of the backlight module can be improved.
- step S35 the light control structure in each light control region is designed according to the determined light transmittance of each light control region.
- a light control structure may be provided on the light emitting side of each LED chip 2, and the light control structures in each light control area may be different, so that the light transmittance of each light control area matches the light transmittance determined in the above step S34.
- a separate light control structure may be provided on the light-emitting side of each LED chip 2 .
- 6A and 6B are schematic structural diagrams of individual light control structures included in a backlight module according to some exemplary embodiments of the present disclosure. As shown in FIGS. 6A and 6B , the light control structure 6 may include a plurality of light-transmitting parts 61 and a plurality of light-reflecting parts 62 . When the light is incident on the light-transmitting part 61 , it can be transmitted through the light-transmitting part 61 ; when the light is incident on the light-reflecting part 62 , it can be reflected by the light-reflecting part 62 .
- a layer of reflective material (or a layer of opaque material) may be formed first, and then a plurality of light-transmitting holes or hollows may be formed in the reflective material layer, for example, a patterning process may be used to form a plurality of light-transmitting holes or hollows Light-transmitting holes or hollowed-out portions, these light-transmitting holes or hollowed-out portions form the light-transmitting portion 61 .
- a plurality of light-transmitting parts 61 are arranged at intervals in an array in the light-emitting material layer. In this way, the portion of the light-reflecting material layer between adjacent light-transmitting portions 61 forms the light-reflecting portion 62 .
- the light-transmitting portion 61 formed by the patterning process may be referred to as a light-controlling microstructure.
- a layer of reflective material (or a layer of opaque material) can be formed, and then a plurality of reflective patterns arranged in an array and spaced apart through a patterning process can be formed, and these reflective patterns form the reflective portion 62 .
- the gaps between the plurality of light-reflecting portions 62 form the light-transmitting portion 61 .
- a transparent material may also be filled between the plurality of reflective patterns 62 , and the transparent material portion located between the plurality of reflective patterns 62 forms the light-transmitting portion 61 .
- the light-reflecting portion 62 formed through the patterning process may be referred to as a light control microstructure.
- the light control structure 6 may include a plurality of light-transmitting parts 61 and a plurality of light-reflecting parts 62 .
- a plurality of light-transmitting parts 61 and a plurality of light-reflecting parts 62 are arranged alternately, that is, a light-reflecting part 62 is provided between two adjacent light-transmitting parts 61 , and a light-reflecting part 62 is arranged between two adjacent light-transmitting parts 62 .
- a light-transmitting portion 61 is provided between.
- orthographic projections of the light-transmitting portion 61 in FIG. 6A and the light-reflecting portion 62 in FIG. 6B in the XY plane are shown as circles, the embodiments of the present disclosure are not limited to this.
- the orthographic projection of the portion 61 and the reflecting portion 62 in FIG. 6B in the XY plane can be any suitable shape, for example, a rectangle, a rounded rectangle, an ellipse, and the like.
- step S35 may further include the following steps: S351. According to the light transmittance of each light control area, determine the proportion of the light transmission part 61 and the light reflection part 62 included in the light control structure in each light control area ; S352. Determine the size of the light control microstructure included in the light control structure in each light control area according to the determined proportion of the light transmission portion 61 and the light reflection portion 62 .
- step S351 it can be determined that: for the light control structure in the first light control area A1, the area of the orthographic projection of the light-transmitting portion 61 in the XY plane accounts for the first 22.56% of the total area of the light control area A1, the orthographic projection area of the reflective portion 62 in the XY plane accounts for 77.44% of the total area of the first light control area A1; for the light control structure in the second light control area A2, The area of the orthographic projection of the light-transmitting portion 61 in the XY plane accounts for 29.13% of the total area of the second light control area A2, and the area of the orthographic projection of the reflective portion 62 in the XY plane accounts for 29.13% of the total area of the second light control area A2.
- the orthographic projection area of the light-transmitting portion 61 in the XY plane accounts for 26.94% of the total area of the third light control area A3, and the reflective portion 62 is in the XY plane.
- the area of the orthographic projection accounts for 73.06% of the total area of the third light control area A3; for the light control structure in the fourth light control area A4, the area of the orthographic projection of the light-transmitting portion 61 in the XY plane accounts for the fourth light control area.
- the area of the orthographic projection of the reflective portion 62 in the XY plane accounts for 28.12% of the total area of the area A4, accounting for 71.88% of the total area of the fourth light control area A4.
- the size of the light control microstructures in each light control area can be determined according to the above ratio.
- the dimensions here may include the diameter of each light control microstructure 61 and the center distance between two adjacent light control microstructures 61 (the center distance may also be referred to as light control microstructures 61 ).
- the pitch value or period value of the structure as shown in FIG. 6B, the size here may include the diameter of each light control microstructure 62 and the center distance between two adjacent light control microstructures 62 (the center distance It can also be called the pitch value or period value of the light-controlled microstructure).
- step S352 factors of the actual processing technology also need to be considered. Since each light control microstructure 62 is formed through a patterning process by means of a mask, the resolution limitation of the mask processing process needs to be considered.
- the distribution density of the light control microstructures in each light control region should be different.
- the distribution density of the light control microstructures 62 in the first light control area A1 is the largest
- the distribution density of the light control microstructures 62 in the second light control area A2 is the smallest
- the third light control area A2 has the smallest distribution density.
- the distribution density of the light control microstructures 62 in the light control area A3 and the fourth light control area A4 is the same as the distribution density of the light control microstructures 62 in the first light control area A1 and the light control microstructures in the second light control area A2. between the distribution densities of the structures 62 .
- the expression “distribution density” refers to the distribution number of certain structures, parts, elements or parts per unit area, which can indicate the degree of sparse distribution of these structures, parts, elements or parts in a certain area.
- the diameters of the light control microstructures located in each light control region may be the same.
- the pitch values of the light control microstructures in each light control region can be designed to be different. This point will be described in more detail below in conjunction with the accompanying drawings. instruction of.
- the light control structure may be formed by wirings disposed on the light-emitting side of each LED chip 2 .
- the expression “trace” may include traces formed of conductive materials, which are generally opaque materials, such as metal conductive materials such as Cu.
- these traces may be electrically connected to electrodes of the respective LED chips 2 for providing electrical signals to the respective LED chips 2 .
- FIG. 6C is a schematic structural diagram of a light control structure formed by traces included in a backlight module according to some exemplary embodiments of the present disclosure.
- a plurality of wirings 7 are arranged on the light-emitting side of each LED chip 2 , and the plurality of wirings 7 are arranged at intervals. Since the traces are formed of opaque materials, the parts of the traces 7 located in the respective light control regions can form the light-reflecting portion 62 of the light-control structure, and the gaps between the traces 7 form the light-transmitting portion 61 of the light-control structure. .
- step S35 may further include the following steps: S351. Determine the routing mode according to the light transmittance of each optical control area; S352. Determine the routing in each optical control area according to the determined routing mode size of.
- step S351 according to the light transmittance of each light control area, it may be determined that the wiring mode is the back-shaped wiring mode. That is, a part of the wiring 7 extends along the first direction X, and the other part of the wiring 7 extends along the second direction Y.
- the wiring extending in the first direction X is referred to as the first wiring 71
- the wiring 7 extending in the second direction Y is referred to as the second wiring 72 .
- the projections of the first wiring 71 and the second wiring 72 on the XY plane form a back-shaped shape.
- step S352 the size of the wiring 7 in each of the light control areas A1, A2, A3 and A4 may be determined.
- the dimension here may include the line width of each trace and the spacing between every two adjacent traces (hereinafter simply referred to as the trace spacing).
- the size of the wiring in each light control area should be different.
- the line widths of the traces located in each light control area may be the same.
- the line spacing in each light control area can be designed to be different, so as to achieve different light transmittances in different light control areas.
- the wiring spacing in the first optical control area A1 may be the smallest, the wiring spacing in the second optical control area A2 is the largest, and the wiring spacing in the third optical control area A3 and the fourth optical control area may be the largest.
- the wiring spacing in the area A4 is between the wiring spacing in the first light control area A1 and the wiring spacing in the second light control area A2.
- the line widths of the wires extending through each light control region may also be different.
- the line width of the traces extending through the first light control area A1 may be set larger to achieve greater light reflectivity in the first light control area A1;
- the line width of the traces is set smaller to achieve a smaller light reflectivity in the second light control area A2, that is, the line width of the traces extending through the first light control area A1 may be larger than that extending through the second light control area A1
- the backlight modules according to some exemplary embodiments of the present disclosure will be further described with reference to the accompanying drawings. It should be noted that, the backlight module can be designed and manufactured according to the above-mentioned design method or design principle.
- FIG. 7 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure.
- FIG. 7 may be a cross-sectional view of the backlight module taken along the line B-B' in FIG. 1 .
- the backlight module may include a first substrate 1 and an LED chip array disposed on the first substrate 1 .
- the LED chip array may include a plurality of Mini LED chips 2 .
- the Mini LED chip 2 may be a positive chip.
- the backlight module may further include a light control structure 6 disposed on the first substrate 1 .
- the light control structure 6 may refer to FIG. 6A and FIG. 6B , and the above descriptions for FIG. 6A and FIG. 6B may be incorporated herein.
- the light control structure 6 may include a plurality of light-transmitting parts 61 and light-reflecting parts 62 .
- a plurality of light-transmitting parts 61 and a plurality of light-reflecting parts 62 are arranged alternately, that is, a light-reflecting part 62 is provided between two adjacent light-transmitting parts 61 , and a light-reflecting part 62 is arranged between two adjacent light-transmitting parts 62 .
- a light-transmitting portion 61 is provided between.
- a plurality of light-transmitting parts 61 and a plurality of light-reflecting parts 62 are alternately arranged, that is, a light-reflecting part 62 is disposed between two adjacent light-transmitting parts 61 , and a light-reflecting part 62 is arranged between two adjacent light-transmitting parts 62 .
- a light-transmitting portion 61 is provided between.
- the light-reflecting portion 62 may be a light-controlling microstructure formed of a light-reflecting material or an opaque material.
- the light-transmitting material may be filled between every two adjacent light-reflecting parts 62 , and optionally, the light-transmitting material may also cover the light-reflecting parts 62 .
- the light-transmitting portion 61 is formed by the light-transmitting material filled between every two adjacent light-reflecting portions 62 .
- each light-reflecting portion 62 may be formed of metals such as Ag, Al, AlNd (aluminum neodymium), and CuNi (copper-nickel alloy), or a laminated structure formed of ITO/Ag/ITO.
- the light-transmitting material may include materials such as silicon nitride or silicon oxide.
- the light control structure 6 and the LED chip 2 are respectively disposed on opposite sides of the first substrate 1 .
- the LED chip 2 is arranged on the lower side of the first substrate 1
- the light control structure 6 is arranged on the upper side of the first substrate 1 .
- the backlight module may include a plurality of light control regions. 4 , 5 and 7 , the plurality of light control areas are schematically shown as 4 light control areas A1 , A2 , A3 and A4 .
- each LED chip 2 a plurality of light control regions are formed.
- the plurality of light control regions corresponding to each LED chip 2 may be referred to as a light control region group.
- the plurality of LED chips 2 are in one-to-one correspondence with the plurality of light control area groups.
- the light control area group corresponding to each LED chip 2 includes four light control areas A1 , A2 , A3 and A4 .
- the embodiments of the present disclosure are not limited thereto, for example, the light control area group corresponding to each LED chip 2 includes 2 light control areas, 3 light control areas, 5 light control areas or more light control areas .
- each light control region group may include N light control regions, where N is a positive integer greater than or equal to 2; the N light control regions include at least the first light control region and the second light control region area, the orthographic projection of the Nth light control area of each light control area group on the first substrate surrounds the orthographic projection of the N-1th light control area of the light control area group on the first substrate .
- the orthographic projection of the first light control area A1 on the first substrate 1 may cover the orthographic projection of the LED chip 2 corresponding to the light control area group on the first substrate 1 .
- the area of the orthographic projection of the first light control area A1 on the first substrate 1 may be larger than the area of the orthographic projection of the LED chips 2 corresponding to the light control area group on the first substrate 1 .
- the orthographic projection of the second light control area A2 on the first substrate 1 may surround the orthographic projection of the first light control area A1 on the first substrate 1 .
- the orthographic projection of the third light control area A3 on the first substrate 1 may surround the orthographic projection of the second light control area A2 on the first substrate 1 .
- the orthographic projection of the fourth light control area A4 on the first substrate 1 may surround the orthographic projection of the third light control area A3 on the first substrate 1 .
- the orthographic projection of the first light control area A1 on the first substrate 1 may be circular, and each of the second light control area A2, the third light control area A3 and the fourth light control area A4 is on the first substrate
- the orthographic projection on 1 can be circular.
- the part of the light control structure 6 located in the first light control area A1 is called the first light control substructure 6A
- the part of the light control structure 6 located in the second light control area A2 is called as the first light control substructure 6A
- the second light control substructure 6B, the part of the light control structure 6 located in the third light control area A3 is called the third light control substructure 6C
- the light control structure 6 is located in the fourth light control area A4
- the part is called the fourth light control substructure 6D.
- each light control substructure group may include a first light control substructure 6A, a second light control substructure 6B, a third light control substructure 6C, and a fourth light control substructure 6D.
- each light control region can have different light transmittance and light reflectivity.
- the expression “the proportion of the light-transmitting part in the light-controlling substructure” can be expressed by the area of the orthographic projection of all the light-transmitting parts included in the light-controlling substructure on the first substrate and the light-transmitting part where the light-controlling substructure is located The ratio of the area of the control area is expressed.
- the expression “the proportion of the light-reflecting parts in the light-controlling substructure” can be expressed as the ratio of the area of the orthographic projection of all the light-reflecting parts included in the light-controlling substructure on the first substrate to the area of the light-controlling region where the light-controlling substructure is located Express.
- the first light control substructure 6A, the second light control substructure 6B, the third light control substructure 6C and the fourth light control substructure 6C are different from each other.
- the proportions of the light-reflecting portions 62 are also different from each other.
- the proportion of the light transmitting portion 61 in the first light control substructure 6A may be about 22%; the proportion of the light transmitting portion 61 in the second light control substructure 6B may be about 29%; the third light control substructure The proportion of the light-transmitting portion 61 in 6C may be about 27%; the proportion of the light-transmitting portion 61 in the fourth light control substructure 6D may be about 28%.
- the period values of the first light control substructure 6A, the second light control substructure 6B, the third light control substructure 6C and the fourth light control substructure 6D may not be equal to each other.
- the light control microstructure is the reflective portion 62 .
- the period value of each light control substructure 6A can be determined by the size of one light-reflecting portion 62 along one direction (for example, the size along the first direction X) and the distance between two adjacent light-reflecting portions 62 along this direction (for example, along the first direction X). The sum of the distances in the direction X) is represented. This is indicated by reference numeral p1 in FIG. 7 .
- the period value of the first light control substructure 6A may be smaller than the period value of the second light control substructure 6B, and the period value of each of the third light control substructure 6C and the fourth light control substructure 6D may be between between the period value of the first light control substructure 6A and the period value of the second light control substructure 6B.
- the period value of each of the first light control substructure 6A, the second light control substructure 6B, the third light control substructure 6C and the fourth light control substructure 6D needs to be set between 10 microns and 100 microns. within the range.
- the period value is less than 10 ⁇ m, the processing difficulty is increased due to the limitation of the resolution of the mask used in the patterning process.
- the period value is greater than 100 microns, each light control microstructure will be visually visible to the human eye, and the display quality will be reduced.
- the backlight module may further include a light diffusing structure 8 .
- the light diffusing structure 8 is configured to diffuse light emitted from the LED chip 2 and incident on the light diffusing structure 8 .
- the backlight module may include a plurality of light diffusing structures 8 , and the plurality of light diffusing structures 8 are in one-to-one correspondence with the plurality of LED chips 2 .
- the orthographic projections of the plurality of light diffusing structures 8 on the first substrate may be located in the plurality of first light control areas A1 respectively, and the orthographic projections of the plurality of light diffusing structures 8 on the first substrate respectively cover the plurality of LED chips Orthographic projection on the first substrate.
- the light diffusing structure 8 is disposed on the side of the first substrate 1 close to the LED chip 2 , and is disposed between the LED chip 2 and the first substrate 1 .
- Each light diffusing structure 8 may include a plurality of prisms 81 .
- each prism 81 may extend along the second direction Y, that is, each prism 81 may be a strip prism.
- the plurality of prisms 81 are arranged along the first direction X.
- each prism 81 is a triangular prism.
- Each prism 81 has an apex angle ⁇ and a side 82 opposite the apex angle ⁇ .
- the edge 82 may be located on the side of the prism 81 close to the first substrate 1
- the vertex angle ⁇ may be located on the side of the prism 81 away from the first substrate 1 .
- the vertically upward light rays are diffused after passing through the prism 81 .
- the vertex angles ⁇ of the plurality of prisms 81 may be set to be the same as each other. In this way, it is advantageous to manufacture the light diffusing structure.
- the vertex angles ⁇ of at least some of the plurality of prisms 81 may be set to be different from each other. In this way, the diffusion of light can be more favorable.
- the backlight module may further include a buffer layer 3 disposed between the first substrate 1 and the light diffusing structure 8 , the buffer layer 3 can improve the flatness of the lower surface of the first substrate 1 and can be adjusted stress. In this way, the formation of the light diffusing structure 8 on the first substrate 1 is facilitated.
- the backlight module may further include a first planarization layer 4 disposed on the first substrate 1 .
- the first planarization layer 4 may cover the plurality of prisms 81 .
- the first planarization layer 4 may be composed of a transparent organic material
- the prisms 81 may be composed of a transparent organic material such as transparent resin
- the refractive index of the material of the first planarization layer 4 is greater than that of the material of the light diffusing structure 8 .
- the refractive index of the material of the first planarization layer 4 may be about 1.55 ⁇ 1.65, and the refractive index of the material of the light diffusing structure 8 may be about 1.2. Through such refractive index matching, it is more favorable for the light diffusing structure to play the role of light diffusing.
- the backlight module may further include a first conductive layer 5 and a second conductive layer 9 disposed on the first substrate 1 .
- the first conductive layer 5 is located on the side of the first planarization layer 4 away from the first substrate 1
- the second conductive layer 9 is located on the side of the first conductive layer 5 away from the first substrate 1 .
- Both the first conductive layer 5 and the second conductive layer 9 may be made of metal conductive material, for example, copper.
- the thickness of the first conductive layer 5 may be greater than the thickness of the second conductive layer 9 .
- Each LED chip 2 may include 2 electrodes, namely a first electrode 21 and a second electrode 22 .
- the plurality of traces are respectively electrically connected to the first electrode 21 and the second electrode 22 for supplying electrical signals to the LED chip 2 .
- the backlight module may further include a cover layer 11 disposed on the side of the first planarization layer 4 away from the first substrate 1 , and the cover layer 11 may be located on a plurality of lines in the first conductive layer 5 . It can also be located between multiple traces in the second conductive layer 9 .
- the cover layer 11 may be a laminated structure, for example, may include a silicon nitride layer and a resin layer; the cover layer 11 may also include a single-layer structure composed of low-temperature organic materials.
- the backlight module may further include an encapsulation layer 12 on one side of the LED chip 2 away from the first substrate 1 .
- the encapsulation layer 12 covers the LED chip 2 to protect the LED chip 2 .
- the encapsulation adhesive is coated on the side of the LED chip 2 away from the first substrate 1 , and the encapsulation layer 12 is formed after drying.
- the encapsulant may include transparent light-curable or heat-curable resin, such as silica gel.
- the backlight module may further include a reflective structure 13 disposed on the side of the encapsulation layer 12 away from the first substrate 1 .
- the orthographic projection of the reflection structure 13 on the first substrate 1 covers the orthographic projection of the plurality of LED chips 2 on the first substrate 1 , and also covers the orthographic projection of the light control structure 6 on the first substrate 1 .
- the LED chip 2 may emit light upward, and the light-emitting side of the backlight module is the upper side shown in FIG. 7 .
- the reflective structure 13 can reflect this part of the light toward the light-emitting side, thereby improving the overall light efficiency of the backlight module.
- the backlight module can also include a quantum dot film layer 14, that is, the backlight module adopts the combined structure of LED and quantum dots.
- the quantum dot film layer 14 and the LED chip 2 are respectively disposed on opposite sides of the first substrate 1 .
- the quantum dot film layer 14 is disposed on the side of the light control structure 6 away from the first substrate 1 .
- the light emitted by the LED chip 2 may be blue light, that is, the LED is a blue light LED.
- the quantum dot film layer 14 may include red light quantum dots that emit red light after being excited by blue light and/or green light quantum dots that emit green light after being excited by blue light.
- the embodiments of the present disclosure are not limited thereto, and the quantum dot film layer 14 may also include yellow quantum dots that emit yellow light after being excited by blue light.
- the quantum dot film layer 14 By arranging the quantum dot film layer 14, the optical effect of converting the light of the blue LED chip into white light for output can be achieved.
- the light emitted from the LED chip 2 is blue light. When the blue light passes through the quantum dot film layer 14, part of the blue light is converted into red light and green light under the excitation of the blue light. The red and green light and unconverted blue light are then mixed to form white light.
- the backlight module may further include a brightness enhancement film layer 15 and a diffusion film layer 16 .
- the brightness enhancement film layer 15 is disposed on the side of the quantum dot film layer 14 away from the first substrate 1
- the diffusion film layer 16 is disposed on the side of the brightness enhancement film layer 15 away from the first substrate 1 .
- the light emitted from the LED chip 2 can be divided into different regions, which can improve the uniformity of the emitted light of the entire backlight module.
- the uniformity of the emitted light of the entire backlight module can reach 90%.
- a lower diffuser plate with a relatively thick thickness is usually required.
- the lower diffuser plate is arranged between the LED chip and the quantum dot film layer.
- the thickness of the lower diffuser plate is relatively thick, and the loss of light efficiency of light passing through the lower diffuser plate is relatively large, for example, it can reach 20% to 30%.
- the light diffusion structure and the light control structure disposed on the first substrate it is not necessary to use the lower diffusion plate, so that not only the thickness of the backlight module can be reduced, but also the thickness of the backlight module can be improved. overall light effect.
- each trace for the LED chip array is formed on the first substrate 1 such as a glass substrate, that is, the first substrate 1 serves as a carrier substrate for the LED chips.
- the first substrate 1 serves as a carrier substrate for the LED chips.
- the first substrate 1 can be used as a light guide plate, which can reduce the optical path of the backlight module. Mixing distance.
- the first substrate 1 can also be used as a carrier substrate for a light diffusion structure, a light control structure, and the like. In this way, the thickness of the backlight module can be further reduced, and the competitiveness of the product can be improved. Specifically, referring back to FIG.
- the backlight module mainly includes a first substrate 1 such as a glass substrate, and LED chips 2 and an encapsulation layer 12 and a quantum dot film layer 14 arranged on both sides of the first substrate 1 , and the brightness enhancement Membrane layer 15 and diffusion membrane layer 16 .
- the thickness of the first substrate 1 is about 0.5 mm
- the combined thickness of the LED chip 2 and the encapsulation layer 12 is about 0.2 mm
- the thickness of the quantum dot film layer 14 is about 0.2 mm
- the thickness of the brightness enhancement film layer 15 is about 0.13 mm mm
- the thickness of the diffusion film layer 16 is about 0.1 mm.
- the overall thickness of the backlight module is about 1.13 mm. It can be seen that the overall thickness of the backlight module can be significantly reduced.
- FIG. 9 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure.
- FIG. 9 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1 .
- the backlight module may include a first substrate 1 and an LED chip array disposed on the first substrate 1 .
- the LED chip array may include a plurality of Mini LED chips 2 .
- the Mini LED chip 2 may be a flip chip.
- the light control structure 6 of the backlight module is formed by wiring.
- the light control structure 6 may refer to FIG. 6C , and the above descriptions for FIG. 6C may be incorporated herein.
- FIG. 10 is a partial plan view of a light control structure formed by traces included in a backlight module according to some exemplary embodiments of the present disclosure.
- FIG. 11 is a partial enlarged view of the light control structure shown in FIG. 10 , in which the zigzag structure is schematically shown.
- a plurality of wirings 7 are arranged on the light-emitting side of each LED chip 2 , and the wirings 7 are arranged at intervals. Since the traces are formed of opaque materials, the parts of the traces 7 located in the respective light control regions can form the light-reflecting portion 62 of the light-control structure, and the gaps between the traces 7 form the light-transmitting portion 61 of the light-control structure. .
- the backlight module may include: a buffer layer 3 disposed on the first substrate 1 ; a first reflective layer 20 disposed on a side of the buffer layer 3 away from the first substrate 1 ; a first reflective layer 20 disposed away from the first substrate 1
- the first conductive layer 5 on one side of the first substrate 1, the first conductive layer 5 is provided with a plurality of traces 7; the first cover layer 21 provided on the first substrate 1, the first cover layer 21 is filled in Between a plurality of traces 7 and covering a part of the first conductive layer 5; a second conductive layer 9 disposed on the side of the first conductive layer 5 away from the first substrate 1, and a plurality of wiring 7; protective layer 22 arranged on the side of the second conductive layer 9 away from the first substrate 1; first passivation layer 23 arranged on the side of the protective layer 22 away from the first substrate 1; arranged on the first passivation layer 23
- the traces may include traces formed of conductive materials, and the conductive materials are generally opaque materials, such as metal conductive materials such as Cu. These traces 7 can be electrically connected to electrodes of each LED chip 2 for providing electrical signals to each LED chip 2 .
- each trace 7 located in the first conductive layer 5 may extend along the first direction X
- each trace 7 located in the second conductive layer 9 may extend along the second direction Y.
- the wiring extending in the first direction X is referred to as the first wiring 71
- the wiring 7 extending in the second direction Y is referred to as the second wiring 72 .
- the projections of the first traces 71 and the second traces 72 in the XY plane form a zigzag shape, as shown in FIG. 10 and FIG. 11 .
- the thickness of the first conductive layer 5 may be greater than the thickness of the second conductive layer 9 .
- each LED chip 2 a plurality of light control regions are formed.
- the plurality of light control regions corresponding to each LED chip 2 may be referred to as a light control region group.
- the plurality of LED chips 2 are in one-to-one correspondence with the plurality of light control area groups.
- the light control area group corresponding to each LED chip 2 includes four light control areas A1 , A2 , A3 and A4 .
- the embodiments of the present disclosure are not limited thereto, for example, the light control area group corresponding to each LED chip 2 includes 2 light control areas, 3 light control areas, 5 light control areas or more light control areas .
- the orthographic projection of the first light control area A1 on the first substrate 1 may be a square, and each of the second light control area A2 , the third light control area A3 and the fourth light control area A4 is on the first substrate 1
- the orthographic projection on can be a square ring.
- the orthographic projection of the first light control area A1 on the first substrate 1 may cover the orthographic projection of the LED chip 2 corresponding to the light control area group on the first substrate 1 .
- the area of the orthographic projection of the first light control area A1 on the first substrate 1 may be larger than the area of the orthographic projection of the LED chips 2 corresponding to the light control area group on the first substrate 1 .
- the orthographic projection of the second light control area A2 on the first substrate 1 may surround the orthographic projection of the first light control area A1 on the first substrate 1 .
- the orthographic projection of the third light control area A3 on the first substrate 1 may surround the orthographic projection of the second light control area A2 on the first substrate 1 .
- the orthographic projection of the fourth light control area A4 on the first substrate 1 may surround the orthographic projection of the third light control area A3 on the first substrate 1 .
- the part of the light control structure 6 located in the first light control area A1 is called the first light control substructure 6A
- the part of the light control structure 6 located in the second light control area A2 is called as the first light control substructure 6A
- the second light control substructure 6B, the part of the light control structure 6 located in the third light control area A3 is called the third light control substructure 6C
- the light control structure 6 is located in the fourth light control area A4
- the part is called the fourth light control substructure 6D.
- each light control substructure group may include a first light control substructure 6A, a second light control substructure 6B, a third light control substructure 6C, and a fourth light control substructure 6D.
- each light control region can have different light transmittance and light reflectivity.
- the first light control substructure 6A, the second light control substructure 6B, the third light control substructure 6C and the The proportions of the light-transmitting parts 61 in the fourth light control substructure 6D are different from each other, and accordingly, the first light control substructure 6A, the second light control substructure 6B, the third light control substructure 6C and the fourth light control substructure 6C
- the proportions of the light-reflecting portions 62 in the structures 6D are also different from each other.
- the proportion of the light transmitting portion 61 in the first light control substructure 6A may be about 22%; the proportion of the light transmitting portion 61 in the second light control substructure 6B may be about 29%; the third light control substructure The proportion of the light-transmitting portion 61 in 6C may be about 27%; the proportion of the light-transmitting portion 61 in the fourth light control substructure 6D may be about 28%.
- the size of the wiring in each light control area should be different.
- the line widths of the traces located in each light control area may be the same.
- the line spacing in each light control area can be designed to be different, so as to achieve different light transmittances in different light control areas.
- the wiring spacing in the first light control area A1 may be the smallest
- the wiring spacing in the second light control area A2 may be the largest
- the line spacing in A4 is between the line spacing in the first light control area A1 and the line spacing in the second light control area A2.
- the line widths of the wires extending through each light control region may also be different.
- the line width of the traces extending through the first light control area A1 may be set larger to achieve greater light reflectivity in the first light control area A1;
- the line width of the traces is set smaller to achieve a smaller light reflectivity in the second light control area A2, that is, the line width of the traces extending through the first light control area A1 may be larger than that extending through the second light control area A1
- the wirings 7 are arranged densely; in the second light control area A2, the wirings 7 are arranged sparsely; in the third light control area A3 and the fourth light control area A4, The sparse degree of the wiring 7 is between the first light control area A1 and the second light control area A2.
- the wiring period may be in the range of 2-100 microns.
- the trace period here can be equal to the sum of the width of one trace and the spacing between two adjacent traces.
- the processing difficulty is increased due to the limitation of the resolution of the mask used in the patterning process.
- the trace period is greater than 100 microns, each trace will be visually visible to the human eye, reducing display quality.
- some of the wires in each light control area may be designed as wires that do not transmit electrical signals, that is, this part of the wires
- the line mainly plays the role of light control.
- the LED chip 2 is a flip chip that emits light downward. That is, the emitted light of the LED chip 2 is emitted downward, reflected by the reflective structure 13 and then emitted toward the upper side.
- the orthographic projection of the second reflective layer 25 on the first substrate 1 at least partially overlaps with the orthographic projection of the first traces 71 on the first substrate 1 , and the orthographic projection of the second reflective layer 25 on the first substrate 1 overlaps the second The orthographic projections of the traces 72 on the first substrate 1 at least partially overlap.
- the orthographic projection of the second reflective layer 25 on the first substrate 1 is annular.
- the orthographic projection of the second reflective layer 25 on the first substrate 1 can also be in a back-shape.
- the second reflective layer 25 is located below each trace 7, which can prevent a large amount of outgoing light from directly irradiating the traces 7, thereby reducing the absorption of the outgoing light by the copper traces, which is beneficial to improve the light efficiency.
- part of the outgoing light of the LED chip 2 can be converted into light with a large angle, so that part of the outgoing light can be incident on the light control area other than the first light control area A1, that is, They can function similarly to the light diffusing structures 8 described above. In this way, they cooperate with the light control structure formed by the traces, which can improve the uniformity of the light emitted by the display module and improve the overall light efficiency.
- the first reflective layer 20 is provided between the first conductive layer 5 and the base substrate 1 .
- the orthographic projection of the first reflective layer 20 on the first substrate 1 at least partially overlaps with the orthographic projection of the first traces 71 on the first substrate 1 , for example, the orthographic projection of the first reflective layer 20 on the first substrate 1 covers The orthographic projection of the first traces 71 on the first substrate 1 .
- the orthographic projection of the first reflective layer 20 on the first substrate 1 and the orthographic projection of the second traces 72 on the first substrate 1 at least partially overlap, for example, the orthographic projection of the first reflective layer 20 on the first substrate 1 also The orthographic projection of the second traces 72 on the first substrate 1 is covered.
- the orthographic projection of the first reflective layer 20 on the first substrate 1 is annular.
- the orthographic projection of the first reflective layer 20 on the first substrate 1 may also be in a back-shape.
- a quantum dot film layer 14 is further provided on the side of the first substrate 1 away from the buffer layer 3 . After light is incident on the quantum dot film layer 14 , scattering occurs, and at this time, part of the light is reflected back by the quantum dot film layer 14 .
- this part of the light can be reflected toward the light-emitting side, so as to prevent this part of the light from being incident on the copper traces and being partially absorbed, thereby improving the overall light efficiency of the backlight module.
- a second passivation layer 26 is disposed between the first reflective layer 20 and the first conductive layer 5 .
- the second passivation layer 26 can protect the first reflective layer 20 .
- the second passivation layer 6 can also be omitted, that is, the first reflective layer 20 and the first conductive layer 5 can be in contact, so that the transmission resistance of each trace can be reduced and the problem of IRDrop can be reduced.
- the protective layer 20 covers the portion of the second conductive layer 9 located in the bonding area BDA. As shown in FIG. 9 , some traces 72 are located in the bonding area BDA, and the surfaces of these traces 72 away from the first substrate 1 need to be exposed to facilitate electrical connection with external circuits. In the embodiment of FIG. 9 , the exposed surfaces of the traces 72 are covered with a protective layer 20 to prevent the copper traces from being oxidized.
- the protective layer 20 may be made of a conductive material such as ITO.
- the first passivation layer 23 covers at least a part of the second conductive layer 9 . As shown in FIG. 9 , openings 231 are provided in the first passivation layer 23 to expose the surface of the protective layer 20 away from the first substrate 1 , so that the protective layer 20 can be electrically connected to external circuits.
- the backlight module may further include a quantum dot film layer 14 , that is, the backlight module adopts a combined structure of LEDs and quantum dots.
- the quantum dot film layer 14 and the LED chip 2 are respectively disposed on opposite sides of the first substrate 1 .
- the quantum dot film layer 14 is disposed on the side of the light control structure 6 away from the first substrate 1 .
- the backlight module may further include a brightness enhancement film layer 15 and a diffusion film layer 16 .
- the brightness enhancement film layer 15 is disposed on the side of the quantum dot film layer 14 away from the first substrate 1
- the diffusion film layer 16 is disposed on the side of the brightness enhancement film layer 15 away from the first substrate 1 .
- backlight module shown in FIG. 9 has the same advantages and effects as those described in the above embodiments. For these advantages and effects, reference may be made to the above description.
- FIG. 12 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure, for example, FIG. 9 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1 .
- FIG. 12 the main structure of the embodiment shown in FIG. 12 is the same as that shown in FIG. 9 , and the difference between the two will be mainly described below, and the above description can be referred to for the similarities.
- the difference between the two is mainly in the reflective structure.
- FIG. 13 is a partial enlarged view of a reflection structure included in the backlight module shown in FIG. 12 .
- the reflection structure 13 includes a plurality of lenses 130 .
- a plurality of lenses 130 may be arranged on the first substrate 1 in an array. Each of the lenses 130 protrudes in a direction away from the first substrate 1 .
- each lens 130 may be composed of organic resin.
- the convex surface of the lens 130 is an arc surface, and the arc surface may be at least a part of a circle. As shown in FIG. 13 , a dashed circle with LO as the center is schematically shown, and the arc surface is a part of the dashed circle.
- the diameter of the circle can be represented by LD.
- the period value LP of the reflective structure 13 can be represented by the center-to-center distance between two adjacent lenses 130 , that is, the distance between the two circle centers LO shown in FIG. 13 .
- the inventor found through research that when the diameter LD is more than twice the period value LP, the reflective structure 13 can produce a better scattering effect on the light incident thereon. At this time, in combination with the above-mentioned light control structure 6, the uniformity of the light emitted from the backlight module can be further improved, which is beneficial to improve the overall light efficiency.
- FIG. 14 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure.
- FIG. 14 may be a cross-sectional view of the backlight module taken along the line C-C' in FIG. 1 .
- the main structure of the embodiment shown in FIG. 14 is the same as that shown in FIG. 9 and FIG. 12 , the differences will be mainly described below, and the above descriptions can be referred to for the similarities.
- the backlight module may include: a buffer layer 3 disposed on the first substrate 1; a first reflective layer 20 disposed on the side of the buffer layer 3 away from the first substrate 1; disposed on the first reflective layer 20
- the second conductive layer 9 is provided on the side of the first conductive layer 5 away from the first substrate 1, and the second conductive layer 9 is provided with a plurality of A line 7; a protective layer 22 arranged on the side of the second conductive layer 9 away from the first substrate 1; a first passivation layer 23 arranged on the side of the protective layer 22 away from the first substrate 1; arranged on the first passivation
- the backlight module further includes a reflection structure 13 , and the reflection structure 13 is disposed on the side of the first substrate 1 away from the LED chip 2 . That is, the emission structure 13 and other structures on the first substrate 1 are respectively located on opposite sides of the first substrate 1 .
- the LED chip 2 emits light downward. That is, the emitted light of the LED chip 2 is emitted downward, reflected by the reflective structure 13 and then emitted toward the upper side.
- the reflective structure 13 may be the reflective structure shown in FIG. 9 , or the reflective structure shown in FIG. 12 and FIG. 13 .
- FIG. 15 is a schematic structural diagram of a backlight module according to some exemplary embodiments of the present disclosure.
- FIG. 15 may be a cross-sectional view of the backlight module taken along the line B-B' in FIG. 1 .
- the main structure of the embodiment shown in FIG. 15 is the same as that shown in FIG. 7 , the differences will be mainly described below, and the above descriptions can be referred to for the similarities.
- the reflective structure 13 may have a groove portion 135 .
- the orthographic projection of the groove portion 135 on the first substrate 1 at least partially overlaps with the orthographic projection of the LED chip 2 on the first substrate 1 .
- the orthographic projection of the groove portion 135 on the first substrate 1 falls. into the orthographic projection of the LED chip 2 on the first substrate 1 .
- the reflection structure 13 is disposed on the side of the LED chip 2 away from the first substrate 1 , and the groove portion 135 is concave in the direction toward the LED chip 2 .
- the groove portion 135 is formed in a pyramid-like structure like a pyramid.
- the light emitted from the LED chip 2 is incident on the groove portion 135, and is reflected by the groove portion 135, and then exits toward the light-emitting side at a larger angle, that is, the groove portion 135 can play the role of scattering light. .
- one groove portion 135 is shown, however, the present disclosure is not limited thereto, and in other embodiments, the reflective structure 13 may include a plurality of groove portions.
- the structures described in the above embodiments may be combined with each other without conflict.
- the structures shown in FIGS. 12 to 14 can also be applied to the embodiment shown in FIG. 7
- the structure shown in FIG. 15 can also be applied to the embodiment shown in FIG. 9 .
- the LED chip emits light upward
- the light control structure provided on the light-emitting side of the LED chip is formed by a separate light control layer
- a light diffusion structure is provided between the LED chip and the separate light control layer
- the LED chip is flip-chip and emits light downward
- the light control structure is formed by a plurality of traces arranged in a back shape, and is matched with a plurality of reflective structures; in FIG.
- the LED chip is a flip chip and emits light downward.
- the light control structure is formed by a plurality of traces arranged in a back-shaped shape, and is matched with a plurality of reflective structures, and a reflective structure includes a plurality of lenses; in FIG. 14 , The LED chip is a positive-mounted chip and emits light downward.
- the light control structure is formed by a plurality of traces arranged in a back-shaped shape, and is matched with a plurality of reflective structures, and a reflective structure includes a plurality of lenses; in FIG.
- the LED chip In order to flip the chip and emit light downward, the light control structure is formed by a plurality of traces arranged in a zigzag shape, and is matched with a plurality of reflective structures, and one of the reflective structures includes a groove portion.
- the present disclosure is not limited to the above-described embodiments, and structures in these embodiments may be replaced or combined with each other without conflict.
- an upward-emitting LED chip can be combined with a light control structure formed by multiple traces arranged in a zigzag shape, and a light diffusion structure can also be applied to a light control structure formed by a plurality of traces arranged in a zigzag shape.
- the backlight module may include both a light control structure formed by a separate light control layer ( FIG. 7 ) and a light control structure formed by a plurality of traces arranged in a zigzag shape ( FIG. 7 ). 12).
- FIG. 16 is a flowchart of a method for manufacturing the backlight module shown in FIG. 7 according to some exemplary embodiments of the present disclosure. Referring to FIG. 7 and FIG. 16 in combination, the method may be performed according to the following steps.
- a light control microstructure is fabricated on the first substrate 1 such as a glass substrate, for example, a plurality of light-reflecting portions 62 are fabricated.
- the light-reflecting portion 62 may be formed of a single metal such as metal Ag, Al, and AlNd, or a composite metal such as ITO/Ag/ITO.
- a metal material layer may be deposited on the first substrate 1, and then a plurality of light-reflecting parts 62 may be formed through a patterning process.
- a light-transmitting material layer is formed on the first substrate 1 .
- the light-transmitting material layer may be filled between every two adjacent light-reflecting parts 62 , and optionally, the light-transmitting material layer may also cover the light-reflecting parts 62 .
- the light-transmitting portion 61 is formed by the light-transmitting material filled between every two adjacent light-reflecting portions 62 .
- the light-transmitting material layer may be formed of an inorganic material such as silicon nitride or silicon oxide, or an organic polymer, and its thickness may be in the range of 1000-3000 angstroms.
- step S163 the first substrate 1 is turned over, and the buffer layer 3 is formed on the opposite side of the first substrate 1 .
- the buffer layer 3 can be used to adjust the stress and ensure the surface flatness of the first substrate 1 .
- step S164 the light diffusing structure 8 is formed on the side of the buffer layer 3 away from the first substrate 1 .
- a transparent organic material such as a transparent resin can be used to fabricate the light diffusing structure 8 .
- transparent organic materials are prepared into prismatic structures.
- the number of prismatic structures may be single or multiple.
- step S165 the first planarization layer 4 is prepared on the first substrate 1 .
- the first planarization layer 4 covering the light diffusing structure 8 may be formed by leveling with a transparent organic fluid.
- the refractive index of the material of the first planarization layer 4 is greater than the refractive index of the material of the light diffusing structure 8 .
- the refractive index of the material of the first planarization layer 4 may be about 1.55 ⁇ 1.65, and the refractive index of the material of the light diffusing structure 8 may be about 1.2.
- step S166 the first conductive layer 5 is formed on the side of the first planarization layer 4 away from the first substrate 1 .
- the first conductive layer 5 can be formed by using Cu metal through a sputtering process or an electroplating process, and the thickness of the first conductive layer can be in the range of 2-10 ⁇ m. Then, through a patterning process, it is patterned to form a plurality of traces.
- the cover layer 11 may be formed.
- the capping layer 11 can be made of silicon nitride with a thickness of about 100 nm, and then filled and cured with resin.
- direct filling with low temperature organic materials may be employed.
- step S167 the second conductive layer 9 is formed on the side of the first conductive layer 5 away from the first substrate 1 .
- the second conductive layer 9 may be formed by using Cu metal through a sputtering process or an electroplating process, and the thickness of the second conductive layer may be smaller than that of the first conductive layer. Then, through a patterning process, it is patterned to form a plurality of traces.
- step S168 the LED chip 2 is bonded on the first substrate 1 .
- the LED chip 2 can be bonded to the first substrate 1 through a piece-bonding process, so that each electrode of the LED chip 2 is electrically connected to each wire on the first substrate 1 .
- step S169 an encapsulation layer 12 covering the LED chips 2 is formed on the first substrate 1 .
- the encapsulation glue may be coated on the side of the LED chip 2 away from the first substrate 1 , and the encapsulation layer 12 may be formed after drying.
- the encapsulant may include transparent light-curable or heat-curable resin, such as silica gel.
- a reflection structure 13 is formed on a side of the encapsulation layer 12 away from the first substrate 1 .
- the reflective structure 13 can be a laminated structure of ITO/Ag/ITO, or a commercially available reflective film.
- step S171 the first substrate 1 is turned over, and the quantum dot film layer 14 , the brightness enhancement film layer 15 and the diffusion film layer 16 are laminated in sequence.
- FIG. 17 is a flowchart of a method for manufacturing the backlight module shown in FIG. 9 according to some exemplary embodiments of the present disclosure. Referring to FIG. 9 and FIG. 17 in combination, the method may be performed as follows.
- the buffer layer 3 is formed on the first substrate 1 .
- the buffer layer 3 can be used to adjust the stress and ensure the surface flatness of the first substrate 1 .
- step S1712 the first reflection layer 20 is formed on the side of the buffer layer 3 away from the first substrate 1 .
- the first reflective layer 20 may be formed of a single metal such as metal Ag, Al, and AlNd (aluminum neodymium), or a composite metal such as ITO/Ag/ITO.
- a metal material layer may be deposited on the first substrate 1, and then the first reflective layer 20 may be formed through a patterning process.
- a second passivation layer 26 may be formed on the side of the first reflective layer 20 away from the first substrate 1 .
- the second passivation layer 26 may be formed of an inorganic material such as silicon nitride or silicon oxide, or an organic polymer material, and its thickness is 1000 ⁇ 3000 angstroms.
- step S173 the first conductive layer 5 is formed on the side of the first reflective layer 20 away from the first substrate 1 .
- the first conductive layer 5 can be formed by using Cu metal through a sputtering process or an electroplating process, and the thickness of the first conductive layer can be in the range of 2-10 ⁇ m. Then, through a patterning process, it is patterned to form a plurality of traces.
- the first cover layer 21 may be formed.
- the first capping layer 21 can be made of silicon nitride with a thickness of about 100 nanometers, and then filled and cured with resin.
- direct filling with low temperature organic materials may be employed.
- step S174 the second conductive layer 9 is formed on the side of the first conductive layer 5 away from the first substrate 1 .
- the second conductive layer 9 can be formed by using Cu metal through sputtering process or electroplating process, and the thickness of the second conductive layer can be smaller than the thickness of the first conductive layer, for example, in the range of 0.5-1 ⁇ m. Then, through a patterning process, it is patterned to form a plurality of traces.
- step S175 a protective layer 22 is formed on the side of the second conductive layer 9 away from the first substrate 1 .
- the protective layer 22 may be formed of a conductive material such as ITO, with a thickness of 500-1500 angstroms.
- step S176 a first passivation layer 23 and a second capping layer 24 are sequentially formed on the side of the protective layer 22 away from the first substrate 1 .
- the first passivation layer 23 may be formed of materials such as silicon nitride, silicon oxide, or silicon oxynitride, and has a thickness in the range of 1000-3000 angstroms.
- the second cover layer 24 can be directly leveled by using an organic material, and the optional material includes resin, polyimide-based material, and acrylic-based material.
- the optional material includes resin, polyimide-based material, and acrylic-based material.
- a low temperature process technology can be used, for example, the temperature is less than 150°C.
- step S177 the second reflective layer 25 is formed on the side of the second cover layer 24 away from the first substrate 1 .
- step S178 the LED chip 2 is bonded to the first substrate 1 .
- the LED chip 2 can be bonded to the first substrate 1 through a piece-bonding process, so that each electrode of the LED chip 2 is electrically connected to each wire on the first substrate 1 .
- step S179 an encapsulation layer 12 covering the LED chips 2 is formed on the first substrate 1 .
- the encapsulation glue may be coated on the side of the LED chip 2 away from the first substrate 1 , and the encapsulation layer 12 may be formed after drying.
- the encapsulant may include transparent light-curable or heat-curable resin, such as silica gel.
- step S180 a reflective structure 13 is formed on a side of the encapsulation layer 12 away from the first substrate 1 .
- the reflective structure 13 can be a laminated structure of ITO/Ag/ITO, or a commercially available reflective film can be used.
- step S181 the first substrate 1 is turned over, and the quantum dot film layer 14 , the brightness enhancement film layer 15 and the diffusion film layer 16 are laminated in sequence.
- FIG. 18 is a schematic diagram of a display device according to some exemplary embodiments of the present disclosure.
- the display device includes the above-mentioned backlight module.
- the display device can be any product or component with display function.
- the display device may be a smart phone, a portable phone, a navigation device, a television (TV), a car audio body, a laptop computer, a tablet computer, a portable multimedia player (PMP), a personal digital assistant (PDA), etc. Wait.
- TV television
- PMP portable multimedia player
- PDA personal digital assistant
- the display device has all the features and advantages of the above-mentioned backlight module, which can be referred to the above description of the light-emitting substrate, and will not be repeated here.
- the terms “substantially,” “approximately,” “approximately,” and other similar terms are used as terms of approximation rather than as terms of degree, and are intended to explain what would be recognized by one of ordinary skill in the art Inherent deviation of a measured or calculated value.
- “About” or “approximately” as used herein includes the stated value and is intended to mean the Specific values, as determined by one of ordinary skill in the art, are within acceptable tolerances. For example, “about” can mean within one or more standard deviations, or within ⁇ 10% or ⁇ 5% of the stated value.
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Abstract
Description
光控区域 | A1 | A2 | A3 | A4 |
光透过率 | 22.56% | 29.13% | 26.94% | 28.12% |
光反射率 | 77.44% | 70.87% | 73.06% | 71.88% |
Claims (21)
- 一种背光模组,包括:第一基板;设置于所述第一基板的多个发光二极管芯片,所述多个发光二极管芯片沿第一方向和第二方向成阵列地布置在所述第一基板上;和设置于所述第一基板的光控结构,所述光控结构被配置为:接收所述发光二极管芯片的出射光,并控制从所述光控结构射出的光的光通量分布,其中,所述背光模组包括多个光控区域组,多个光控区域组与多个发光二极管芯片分别一一对应,每一个光控区域组至少包括第一光控区域和第二光控区域,每一个光控区域组的第一光控区域在所述第一基板上的正投影覆盖与该光控区域组对应的发光二极管芯片在所述第一基板上的正投影,每一个光控区域组的第二光控区域在所述第一基板上的正投影包围该光控区域组的第一光控区域在所述第一基板上的正投影;所述光控结构包括多个光控子结构组,多个光控子结构组分别位于多个光控区域组中,每一个光控子结构组至少包括第一光控子结构和第二光控子结构;以及每一个所述光控子结构均包括多个透光部和多个反光部,所述第一光控子结构中透光部的占比与所述第二光控子结构中透光部的占比不同。
- 根据权利要求1所述的背光模组,其中,所述第一光控子结构位于所述第一光控区域,所述第二光控子结构位于所述第二光控区域,所述第一光控子结构中透光部的占比小于所述第二光控子结构中透光部的占比。
- 根据权利要求1或2所述的背光模组,其中,所述光控结构的多个透光部和多个反光部交替地布置。
- 根据权利要求3所述的背光模组,其中,所述光控结构包括由反光材料形成的反光层和形成在所述发光层中的多个镂空部,所述多个镂空部构成所述多个透光部,所述反光层位于每两个相邻的镂空部之间的部分构成所述多个反光部;或者,所述光控结构的多个反光部沿所述第一方向和所述第二方向成阵列地布置,所述光控结构包括填充在每两个相邻的反光部之间且覆盖所述多个反光部的透明材料层,所述透明材料层位于每两个相邻的反光部之间的部分构成所述多个透光部。
- 根据权利要求1或2所述的背光模组,还包括:设置于所述第一基板的第一导电层,所述第一导电层包括多条第一走线;设置于所述第一导电层远离所述第一基板一侧的第二导电层,所述第二导电层包括多条第二走线;和设置于所述第一基板的第一覆盖层,所述第一覆盖层由透光材料形成,所述第一覆盖层至少填充于所述多条第一走线之间的间隙,其中,所述光控结构的多个反光部包括所述多条第一走线和所述多条第二走线,所述光控结构的多个透光部包括所述第一覆盖层的位于所述多条第一走线之间的间隙中的部分。
- 根据权利要求5所述的背光模组,其中,所述第一走线沿所述第一方向延伸,所述第二走线沿所述第二方向延伸,所述多条第一走线和所述多条第二走线的组合在所述第一基板上的正投影呈多个回字形。
- 根据权利要求1~2和6中任一项所述的背光模组,其中,每一个光控区域组还包括第三光控区域,每一个光控区域组的第三光控区域在所述第一基板上的正投影包围该光控区域组的第二光控区域在所述第一基板上的正投影;每一个光控子结构组还包括第三光控子结构,所述第三光控子结构位于所述第三光控区域;所述第三光控子结构也包括多个透光部和多个反光部,所述第三光控子结构中透光部的占比、所述第二光控子结构中透光部的占比和所述第一光控子结构中透光部的占比彼此均不同。
- 根据权利要求7所述的背光模组,其中,每一个光控区域组还包括第四光控区域,每一个光控区域组的第四光控区域在所述第一基板上的正投影包围该光控区域组的第三光控区域在所述第一基板上的正投影;每一个光控子结构组还包括第四光控子结构,所述第四光控子结构位于所述第四光控区域;所述第四光控子结构也包括多个透光部和多个反光部,所述第四光控子结构中透光部的占比、所述第三光控子结构中透光部的占比、所述第二光控子结构中透光部的占比和所述第一光控子结构中透光部的占比彼此均不同。
- 根据权利要求1或2所述的背光模组,其中,每一个光控区域组包括N个光控区域,其中,N为大于等于2的正整数;所述N个光控区域至少包括所述第一光控区域和所述第二光控区域,每一个光控区域组的第N个光控区域在所述第一基板上的正投影包围该光控区域组的第N-1个光控区域在所述第一基板上的正投影。
- 根据权利要求1或2所述的背光模组,还包括设置于所述第一基板的多个光扩散结构,其中,所述多个光扩散结构在所述第一基板上的正投影分别覆盖所述多个发光二极管芯片在所述第一基板上的正投影,所述光扩散结构用于扩散所述发光二极管芯片的出射光。
- 根据权利要求10所述的背光模组,其中,每一个所述光扩散结构包括多个三棱镜,每一个三棱镜具有顶角和与该顶角相对的边,所述三棱镜的边位于所述三棱镜靠近所述第一基板的一侧,所述顶角位于所述三棱镜远离所述第一基板的一侧。
- 根据权利要求11所述的背光模组,还包括设置于所述第一基板的第一平坦化层,其中,所述第一平坦化层覆盖所述多个三棱镜,所述第一平坦化层的材料的折射率大于所述光扩散结构的材料的折射率。
- 根据权利要求10所述的背光模组,其中,所述第一基板包括第一侧和与所述第一侧相反的第二侧,所述多个发光二极管芯片和所述光控结构分别位于所述第一基板的第一侧和第二侧;所述多个光扩散结构设置在所述第一基板的第一侧,且位于所述第一基板与所述多个发光二极管芯片之间。
- 根据权利要求5所述的背光模组,其中,所述第一基板包括第一侧和与所述第一侧相反的第二侧,所述多个发光二极管芯片和所述光控结构均位于所述第一基板的第一侧;所述显示基板还包括设置于所述第一基板的第一反射层,所述第一反射层设置在所述第一导电层与所述第一基板之间;所述第一反射层在所述第一基板上的正投影覆盖所述第一走线在所述第一基板上的正投影,并且,所述第一反射层在所述第一基板上的正投影还覆盖所述第二走线在所述第一基板上的正投影。
- 根据权利要求14所述的背光模组,其中,所述显示基板还包括设置于所述第一基板的第二反射层,所述第二反射层位于所述第二覆盖层远离所述第一基板的一侧;所述第二反射层在所述第一基板上的正投影与所述第一走线在所述第一基板上的正投影至少部分重叠,所述第二反射层在所述第一基板上的正投影与所述第二走线在所述第一基板上的正投影至少部分重叠,所述第二反射层在所述第一基板上的正投影呈回字形。
- 根据权利要求15所述的背光模组,还包括封装层和反射结构,其中,所述封装层设置于所述第一基板且覆盖所述多个发光二极管芯片,所述反射结构位于所述封装层远离所述第一基板的一侧,所述反射结构在所述第一基板上的正投影至少覆盖所述多个发光二极管芯片在所述第一基板上的正投影。
- 根据权利要求16所述的背光模组,其中,所述反射结构包括多个透镜,所述多个透镜成阵列地布置在所述第一基板上,每一个所述透镜沿远离所述第一基板的方向凸出。
- 根据权利要求16所述的背光模组,其中,所述反射结构包括凹槽部,所述凹槽部在所述第一基板上的正投影与所述多个发光二极管芯片在所述第一基板上的正投 影至少部分重叠,所述凹槽部沿朝向所述发光二极管芯片的方向凹入。
- 根据权利要求15所述的背光模组,还包括封装层和反射结构,其中,所述封装层设置于所述第一基板且覆盖所述多个发光二极管芯片,所述反射结构位于所述第一基板的第二侧,所述反射结构在所述第一基板上的正投影至少覆盖所述多个发光二极管芯片在所述第一基板上的正投影。
- 一种显示装置,包括权利要求1至19中任一项所述的背光模组。
- 一种背光模组的设计方法,包括以下步骤:获取发光二极管芯片的参数,所述参数至少包括发光二极管芯片的尺寸以及发光二极管芯片出射光的光通量和发光角度;确定所述发光二极管芯片出射光的反射次数的上限值;根据发光二极管芯片的参数、第一基板的厚度以及确定出的反射次数的上限值确定各个光控区域以及发光二极管芯片阵列的周期值,所述发光二极管芯片阵列的周期值为两个相邻的发光二极管芯片的中心距;确定各个光控区域的光透过率和光反射率;以及根据确定出的各个光控区域的光透过率,设计各个光控区域中的光控结构。
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CN110068956A (zh) * | 2018-01-24 | 2019-07-30 | 夏普株式会社 | 照明装置及显示装置 |
CN111781771A (zh) * | 2020-07-14 | 2020-10-16 | 京东方科技集团股份有限公司 | 背光模组及其设计方法、显示装置 |
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