WO2022004254A1 - Panneau sandwich - Google Patents
Panneau sandwich Download PDFInfo
- Publication number
- WO2022004254A1 WO2022004254A1 PCT/JP2021/020958 JP2021020958W WO2022004254A1 WO 2022004254 A1 WO2022004254 A1 WO 2022004254A1 JP 2021020958 W JP2021020958 W JP 2021020958W WO 2022004254 A1 WO2022004254 A1 WO 2022004254A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- prepreg
- core layer
- lignin
- sandwich panel
- resin
- Prior art date
Links
- 239000012792 core layer Substances 0.000 claims abstract description 93
- 239000005011 phenolic resin Substances 0.000 claims abstract description 80
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 239000011230 binding agent Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 37
- 229920005610 lignin Polymers 0.000 claims description 84
- 238000000034 method Methods 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 17
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 15
- 238000000354 decomposition reaction Methods 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 12
- 229920001568 phenolic resin Polymers 0.000 claims description 12
- 229920006231 aramid fiber Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 239000004760 aramid Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000000243 solution Substances 0.000 description 32
- 239000000047 product Substances 0.000 description 21
- 238000002485 combustion reaction Methods 0.000 description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 14
- 150000002989 phenols Chemical class 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229920001187 thermosetting polymer Polymers 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000011282 treatment Methods 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 8
- 239000002028 Biomass Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000005470 impregnation Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 241000196324 Embryophyta Species 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 235000008216 herbs Nutrition 0.000 description 4
- YHEWWEXPVKCVFY-UHFFFAOYSA-N 2,6-Dimethoxy-4-propylphenol Chemical compound CCCC1=CC(OC)=C(O)C(OC)=C1 YHEWWEXPVKCVFY-UHFFFAOYSA-N 0.000 description 3
- PXIKRTCSSLJURC-UHFFFAOYSA-N Dihydroeugenol Chemical group CCCC1=CC=C(O)C(OC)=C1 PXIKRTCSSLJURC-UHFFFAOYSA-N 0.000 description 3
- 229920002488 Hemicellulose Polymers 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 238000010411 cooking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 241000218645 Cedrus Species 0.000 description 2
- GXGJIOMUZAGVEH-UHFFFAOYSA-N Chamazulene Chemical group CCC1=CC=C(C)C2=CC=C(C)C2=C1 GXGJIOMUZAGVEH-UHFFFAOYSA-N 0.000 description 2
- 241000218631 Coniferophyta Species 0.000 description 2
- 229920003261 Durez Polymers 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004925 denaturation Methods 0.000 description 2
- 230000036425 denaturation Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000002029 lignocellulosic biomass Substances 0.000 description 2
- -1 methylols Chemical class 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011134 resol-type phenolic resin Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- KSEBMYQBYZTDHS-HWKANZROSA-M (E)-Ferulic acid Natural products COC1=CC(\C=C\C([O-])=O)=CC=C1O KSEBMYQBYZTDHS-HWKANZROSA-M 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- 240000000731 Fagus sylvatica Species 0.000 description 1
- 235000010099 Fagus sylvatica Nutrition 0.000 description 1
- 240000007182 Ochroma pyramidale Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000209504 Poaceae Species 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000190021 Zelkova Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate group Chemical group [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007336 electrophilic substitution reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- KSEBMYQBYZTDHS-HWKANZROSA-N ferulic acid Chemical compound COC1=CC(\C=C\C(O)=O)=CC=C1O KSEBMYQBYZTDHS-HWKANZROSA-N 0.000 description 1
- 229940114124 ferulic acid Drugs 0.000 description 1
- KSEBMYQBYZTDHS-UHFFFAOYSA-N ferulic acid Natural products COC1=CC(C=CC(O)=O)=CC=C1O KSEBMYQBYZTDHS-UHFFFAOYSA-N 0.000 description 1
- 235000001785 ferulic acid Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000011121 hardwood Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 229920005611 kraft lignin Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- CYGSXDXRHXMAOV-UHFFFAOYSA-N o-cresol hydrogen sulfate Chemical compound CC1=CC=CC=C1OS(O)(=O)=O CYGSXDXRHXMAOV-UHFFFAOYSA-N 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000029553 photosynthesis Effects 0.000 description 1
- 238000010672 photosynthesis Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- PCMORTLOPMLEFB-ONEGZZNKSA-N sinapic acid Chemical compound COC1=CC(\C=C\C(O)=O)=CC(OC)=C1O PCMORTLOPMLEFB-ONEGZZNKSA-N 0.000 description 1
- PCMORTLOPMLEFB-UHFFFAOYSA-N sinapinic acid Natural products COC1=CC(C=CC(O)=O)=CC(OC)=C1O PCMORTLOPMLEFB-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- QURCVMIEKCOAJU-UHFFFAOYSA-N trans-isoferulic acid Natural products COC1=CC=C(C=CC(O)=O)C=C1O QURCVMIEKCOAJU-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C1/00—Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like
Definitions
- the present invention relates to a sandwich panel.
- the sandwich panel is composed of a hollow honeycomb core composed of a wall having a hexagonal cross section and a skin material such as a pair of prepregs joined to both sides of the honeycomb core.
- Sandwich panels which are lightweight and highly rigid, are used, for example, in structural members for aircraft.
- a method for manufacturing a sandwich panel As a general method, for example, there is a technique described in Patent Document 1. According to the same document, a plurality of cloths are impregnated with a phenol resin, and two laminated plates obtained by heat and pressure molding are impregnated with a phenol resin phenol resin phenol resin composition, heated, and cured. A sandwich panel can be obtained by arranging it on both sides of the honeycomb core and forming it under heat and pressure molding.
- the present inventor has made both the core layer and the prepreg water-soluble as a binder resin. It was found that it is effective to include a phenol resin. That is, by using the water-soluble phenol resin, the phenol resin can be impregnated into the core layer and the prepreg without using an organic solvent, the impregnation property of the phenol resin becomes high, and the adhesion between the core layer and the prepreg becomes high.
- the following first invention was completed by finding that it is possible to obtain a high degree of combustion resistance and good combustion resistance.
- a sandwich panel comprising a core layer having a honeycomb structure and a cured product of a prepreg provided on both sides of the core layer.
- a sandwich panel is provided in which both the core layer and the prepreg contain a water-soluble phenolic resin as a binder resin.
- the present inventor has found that the impregnation property can be dramatically improved by using a specific water-soluble phenol resin, and by using this for at least one of the core layer and the prepreg, the core layer and the prepreg can be used.
- the adhesion can be improved and good combustion resistance can be obtained, and the following second invention has been completed.
- a sandwich panel comprising a core layer having a honeycomb structure and a cured product of a prepreg provided on both sides of the core layer.
- the core layer and / or the prepreg contains a water-soluble phenolic resin as a binder resin, and the prepreg contains a water-soluble phenol resin.
- a sandwich panel is provided in which the water-soluble phenol resin is a phenol resin synthesized by using one or more selected from lignin, lignin derivatives, lignin decomposition products and modified products thereof.
- a sandwich panel having good adhesion and combustion resistance is provided.
- FIG. 1 is a schematic view showing an example of a sandwich panel according to the present embodiment.
- the sandwich panel 100 of the present embodiment includes a core layer 10 having a honeycomb structure, a cured product (resin plate 40) of a prepreg 20 (prepreg 21 on the upper surface and prepreg 22 on the lower surface) provided on both sides of the core layer 10.
- a cured product resin plate 40
- prepreg 20 prepreg 21 on the upper surface and prepreg 22 on the lower surface
- both the core layer 10 and the prepreg 20 contain a water-soluble phenol resin as a binder resin.
- a water-soluble phenol resin as a binder resin.
- the water-soluble phenol resin of the present embodiment is a resin that can be dissolved or dispersed in water. As a result, the water solubility is increased, and the wettability with the core layer 10 and the prepreg 20 can be improved.
- the water-soluble phenolic resin include lignin, lignin derivatives, lignin decomposition products, and phenolic resins using one or more selected from these modified products.
- examples of the lignin modified product include those disclosed in Japanese Patent Publication No. 48-22340.
- the lignin modification rate of the lignin-modified phenolic resin is preferably 10 to 60%, more preferably 20 to 50%.
- the modification rate is preferably 10 to 60%, more preferably 20 to 50%.
- the lignin-modified phenol resin is obtained by reacting lignins, which will be described later, phenols, and aldehydes in the presence of a catalyst. Further, the above-mentioned resole-type lignin-modified phenol resin can be obtained by reacting lignins, phenols and aldehydes in the presence of an alkaline catalyst.
- the lignins used in the lignin-modified phenolic resin include at least one selected from lignin and lignin derivatives. Lignin, along with cellulose and hemicellulose, is a major component that forms the structure of plants and is one of the most abundant aromatic compounds in nature.
- Examples of lignin include alkaline lignin such as kraft lignin, soda lignin, soda-anthraquinone lignin, pulp lignin containing lignin sulfonic acid; organosolv lignin; high temperature and high pressure water treatment lignin; explosive lignin; enzyme saccharified lignin; lignophenol; phenolized lignin.
- lignin is not particularly limited, and examples thereof include woods and herbs that contain lignin and form xylem, such as conifers such as cedar, pine and hinoki, broad-leaved trees such as beech, birch, nara and zelkova, rice and wheat. Examples include grasses (herbs) such as corn and bamboo. Of these, lignin derived from coniferous trees is preferable from the viewpoint of mechanical properties of the cured prepreg product.
- the "lignin derivative” refers to a compound having a unit structure constituting lignin or a structure similar to the unit structure constituting lignin.
- the lignin derivative has a phenol derivative as a unit structure. Since this unit structure has chemically and biologically stable carbon-carbon bonds and carbon-oxygen-carbon bonds, it is resistant to chemical deterioration and biological decomposition.
- Examples of the lignin derivative include guaicylpropane (ferulic acid) represented by the following formula (A), syringylpropane (sinapinic acid) represented by the formula (B), and 4-hydroxyphenylpropane represented by the formula (C). (Cumaric acid) and the like.
- the composition of the lignin derivative depends on the biomass used as the raw material.
- Lignin derivatives containing a guaiacylpropane structure are mainly extracted from conifers.
- Lignin derivatives containing a guaiacyl propane structure and a syringyl propane structure are mainly extracted from hardwoods.
- Lignin derivatives containing a guaiacyl propane structure, a syringyl propane structure and a 4-hydroxyphenyl propane structure are mainly extracted from herbs.
- the lignin derivative is preferably obtained by decomposing biomass.
- Biomass takes in and immobilizes carbon dioxide in the atmosphere in the process of photosynthesis, so biomass contributes to suppressing the increase in carbon dioxide in the atmosphere. It can contribute to the suppression of carbon dioxide.
- the biomass include lignocellulosic biomass.
- lignocellulosic biomass include leaves, bark, branches and wood of plants containing lignin, and processed products thereof.
- plants containing lignin include the above-mentioned broad-leaved trees, coniferous trees, and gramineous plants.
- Biomass decomposition methods include chemical treatment methods, hydrolysis treatment methods, steam explosion methods, supercritical water treatment methods, subcritical water treatment methods, mechanical treatment methods, cresol sulfate methods, pulp production methods, etc. Can be mentioned. From the viewpoint of environmental load, steam blasting method, sub-critical water treatment method, and mechanical treatment method are preferable. From the viewpoint of cost, the pulp production method is preferable. From the viewpoint of cost, it is preferable to use by-products of biomass utilization.
- the lignin derivative examples include those obtained by decomposing lignocellulosic, which is a combination of lignin, cellulose and hemicellulose.
- the lignin derivative may contain a lignin decomposition product, a cellulose decomposition product, a hemicellulose decomposition product, etc., which are mainly composed of a compound having a lignin skeleton.
- the lignin derivative preferably has many reaction sites on which the curing agent acts by the electrophilic substitution reaction on the aromatic ring, and the fragrance containing a phenolic hydroxyl group is excellent in that the less steric damage near the reaction site is, the better the reactivity. It is preferable that at least one of the ortho-position and the para-position of the ring is unsubstituted, and lignin derived from coniferous trees or herbs, which contains a large amount of guaiacyl nucleus or 4-hydroxyphenyl nucleus structure as an aromatic unit of lignin, is preferable.
- the lignin derivative may be one having a functional group in the lignin derivative (lignin secondary derivative).
- the functional group of the lignin secondary derivative is not particularly limited, but for example, two or more of the same functional groups capable of reacting with each other or those capable of reacting with other functional groups are preferable.
- Specific examples thereof include a vinyl group having a carbon-carbon unsaturated bond, an ethynyl group, a maleimide group, a cyanate group, an isocyanate group and the like, in addition to an epoxy group and a methylol group.
- the core layer 10 for example, a sheet-like member formed by impregnating a base material for a core layer having a honeycomb structure with a binder resin can be used.
- the core layer 10 can have high strength and light weight due to the honeycomb structure.
- the honeycomb structure is a known structure, and is intended to be a structure in which a plurality of substantially regular hexagonal through holes penetrating from the upper surface to the lower surface are formed.
- the binder resin of the core layer 10 contains the above-mentioned water-soluble phenol resin, but may contain other resins other than the above-mentioned water-soluble phenol resin as long as the effect of the present invention is not impaired, for example. , Thermosetting resin and the like.
- the thermosetting resin include thermosetting resins such as phenol resins other than water-soluble, unsaturated polyester resins, and epoxy resins.
- the phenolic resin includes a compound having one or more phenolic hydroxyl groups in the molecule, for example, novolak resin such as novolak type phenol, novolak type cresol, novolak type naphthol; bisphenol resin such as bisphenol F, bisphenol A; paraxylylene.
- Phenolic aralkyl resins such as modified phenolic resins; resol-type phenolic resins such as dimethylene ether-type resol and methylol-type phenol; compounds obtained by further converting the above resins into methylols.
- a binder resin is dissolved in a known organic solvent and used as a binder solution by impregnating the base material for the core layer.
- Examples of the base material having the honeycomb structure of the core layer 10 include those obtained by molding aramid fiber, paper, balsa wood, plastic, aluminum, titanium, glass, an alloy thereof and the like into a honeycomb shape by a known method. From the viewpoint of heat resistance, it is preferable that the base material having the honeycomb structure of the core layer 10 contains aramid fibers.
- the layer thickness of the core layer 10 is not particularly limited, but may be, for example, 1 mm or more and 50 mm or less, 3 mm or more and 40 mm or less, or 5 mm or more and 30 mm or less.
- each core cell in the core layer 10 is not particularly limited, but can be, for example, 1 mm or more and 10 mm or less on one side.
- the area of the surface (upper surface, lower surface) of the core layer 10 is not limited, but for example, it may have a surface area for one sandwich panel or a total surface area for a plurality of sandwich panels. good. This makes it possible to separate one sandwich panel 100 into individual pieces and cut out a plurality of panels to obtain the sandwich panel 100, thereby improving productivity.
- the area of the surface (upper surface, lower surface) of the core layer 10 can be a large area, and may be, for example, 1 m 2 or more.
- the core layer 10 may have various surface treatments on the inside and / or the outside from the viewpoint of improving corrosion resistance and heat resistance.
- the prepreg 20 for example, a sheet member in a B stage state in which a binder resin is impregnated into a prepreg base material can be used.
- the prepreg base material include a fiber base material.
- the reaction rate calculated from the measurement result of DSC (Differential Scanning Calorimeter) for the binder resin impregnated in the prepreg substrate is more than 0% and 60% or less, preferably 0. It means that it is 5% or more and 55% or less, and more preferably 1% or more and 50% or less.
- the binder resin of the prepreg 20 contains the above-mentioned water-soluble phenol resin, but may contain a resin other than the above-mentioned water-soluble phenol resin as long as the effect of the present invention is not impaired.
- the above-mentioned water-soluble phenol resin is used.
- the fiber base material aramid fiber, polyester fiber, polyphenylene sulfide fiber, carbon fiber, graphite fiber, glass fiber, silicon carbide fiber and the like can be used. From the viewpoint of high heat resistance, the fiber base material preferably contains glass fiber.
- the heat resistance of the sandwich panel 100 can be further improved. Further, since the difference in linear expansion coefficient between the resin plate 40 and the core layer 10 can be reduced, the warp of the sandwich panel 100 can be suppressed.
- the prepreg 20 is in a B stage state in which, for example, a binder resin is impregnated into a fiber base material.
- a binder resin is impregnated into a fiber base material.
- the binder resin is dissolved in an organic solvent and then impregnated with the fiber base material, the organic solvent remains in the prepreg in the B stage state, and the odor due to the residual solvent is present in the sandwich panel manufacturing process. There was a problem.
- the prepreg 20 of the present embodiment uses a water-soluble phenol resin as the binder resin, the odor caused by the conventional organic solvent can be reduced.
- the upper limit of the glass transition temperature (Tg) of the cured product of the prepreg 20 is, for example, 250 ° C. or lower, preferably 220 ° C. or lower, and more preferably 200 ° C. or lower. This makes it possible to carry out the heat and pressurization treatment under low temperature conditions.
- the lower limit of the glass transition temperature (Tg) may be, for example, 110 ° C. or higher, or 120 ° C. or higher. This makes it possible to improve the thermal characteristics.
- the binder resins used in the core layer 10 and the prepreg 20 may be the same or different from each other, but they can effectively improve the adhesion and the combustion resistance. It is preferably the same binder resin.
- the resin plate 40 of the present embodiment is obtained by curing the prepreg 20 in the manufacturing process of the sandwich panel 100. The curing conditions are shown in the description of the manufacturing method of the sandwich panel 100.
- a plurality of resin plates 40 may be laminated. Further, another functional layer may be interposed between the core layer 10 and the resin plate 40. For example, a thermoplastic sheet may be interposed to improve the adhesion.
- the sandwich panel 100 of this embodiment can be suitably used for an aircraft panel.
- the sandwich panel 100 can be used for the interior of an aircraft such as a toilet and a partition, and the equipment inside the aircraft such as a wagon housing.
- Step 1 Preparation of Core Layer 10 and Prepreg 20
- a base material for the core layer 10 is prepared.
- the base material for the core layer 10 has a honeycomb structure and is preferably formed of aramid fibers.
- a base material having a honeycomb structure is prepared, and the base material is impregnated with a binder solution containing a water-soluble phenol resin. Then, the base material is dried to obtain a core layer 10 using a water-soluble phenol resin as a binder resin.
- a base material for prepreg 20 prepares a base material for prepreg 20.
- the base material for the prepreg 20 include a fiber base material.
- the base material for prepreg 20 is impregnated with a binder solution containing a water-soluble phenol resin. Then, the base material is dried to obtain prepreg 20 using a water-soluble phenol resin as a binder resin.
- both the core layer 10 and the prepreg 20, as the impregnation method for example, a method of injecting and coating the base material using an injection device such as the binder solution spray nozzle, and a method of immersing the base material in the binder solution.
- a method of applying the binder solution to the substrate by various coaters such as a knife coater and a comma coater, a method of transferring the binder solution to the substrate by a transfer roll, and the like. Of these, a method of immersing the base material in the binder solution is preferable.
- the conditions for heating and drying are not particularly limited, but usually 100 to 220 ° C., preferably 120 to 190 ° C. for 2 to 10 minutes.
- the binder solution containing the water-soluble phenol resin may contain other additives in addition to the water-soluble phenol resin.
- the additive is not particularly limited, and examples thereof include fillers such as inorganic fillers, rubber, and thermoplastic resins.
- a thermosetting resin other than the water-soluble phenol resin may be contained as long as the effect of the present invention is not impaired, and examples thereof include thermosetting resins such as phenol resin, unsaturated polyester resin and epoxy resin. Be done.
- the content of the water-soluble phenol resin contained in the binder solution is not particularly limited, but is preferably 70 to 100% by mass, preferably 80% by mass or more, when the total solid content is 100% by mass. More preferred.
- Step 2 Laminating the core layer and the prepreg
- the prepreg 20 in the B stage state prepreg 21, 22
- a laminate containing the core layer 10 and the prepreg 20 is formed.
- the prepreg 20 can cover the entire surface (upper surface and lower surface) of the core layer 10.
- the number of prepregs 20 to be laminated may be one or a plurality.
- another functional layer may be arranged between the core layer 10 and the prepreg 20.
- a foam layer made of a thermosetting resin can be used as the other functional layer.
- a metal plate 30 (the upper side is a metal plate 31 and the lower side is a metal plate 32) is arranged on the upper and lower surfaces of the laminated body.
- the core layer 10 and the prepreg 20 are heated and pressed while the metal plate 30 is in contact with the prepreg 20.
- the prepreg 20 can be cured to form the resin plate 40 (the upper side is the resin plate 41 and the lower side is the resin plate 42).
- the above heating and pressurization for example, conditions of 110 ° C. to 140 ° C., 30 minutes to 90 minutes, and 0.35 MPa to 2.0 MPa can be adopted.
- the above heating and pressurizing step can be performed in the atmosphere. Therefore, productivity can be improved.
- the resin constituting the prepreg 20 when the prepreg 20 is heated and pressed, a part of the resin constituting the prepreg 20 may move onto the inner wall surface of the honeycomb structure of the core layer 10.
- the resin constituting the resin plate 40 is covered from the resin plate 40 to a part of the upper end portion or the lower end portion of the inner wall of the core layer 10. It will be formed continuously so that the adhesion can be improved.
- the structure is such that the entire inside of the core layer 10 is not filled with the resin constituting the resin plate 40. Thereby, the sandwich panel 100 having a structure excellent in strength and light weight can be obtained.
- a cushion layer may be arranged between the metal plate 30 and the prepreg 20 to heat and pressurize.
- the cushion layer may be made of, for example, a paper material, a rubber material, or a composite material thereof.
- both the core layer 10 and the prepreg 20 contain a water-soluble phenol resin
- at least one of the core layer 10 and the prepreg 20 is a binder.
- the resin contains a water-soluble phenol resin
- the above-mentioned water-soluble phenol resin is made by using one or more selected from lignin, a lignin derivative, a lignin decomposition product and a modified product thereof. It has the same configuration and function as the sandwich panel 100 of the first embodiment.
- the points different from the first embodiment will be described.
- the water-soluble phenol form is made of one or more selected from lignin, lignin derivatives, lignin decomposition products and modified products thereof, whereby the water-soluble phenol resin is said to be water-soluble.
- the impregnation property of the sex phenol resin can be dramatically improved, and as a result, by using it for at least one of the core layer 10 and the prepreg 20, the adhesion between the core layer and the prepreg can be improved and good combustion resistance can be obtained. Be done.
- the water-soluble phenol form using one or more selected from the above-mentioned lignin, lignin derivative, lignin decomposition product and modified product thereof has adhesion and combustion resistance. It is preferable that it is used in the prepreg 20, and it is more preferable that it is used in the core layer 10 and the prepreg 20.
- no water-soluble phenol resin is used as the binder solution, provided that at least one of the core layer 10 and the prepreg 20 contains the water-soluble phenol resin as the binder resin.
- a solution may be used.
- the binder solution that does not use the water-soluble phenol resin a known one can be used, and a solution obtained by dissolving a thermosetting resin other than the water-soluble phenol resin in a known organic solvent can be used.
- the thermosetting resin include thermosetting resins such as phenol resins other than water-soluble, unsaturated polyester resins, and epoxy resins.
- the phenolic resin includes a compound having one or more phenolic hydroxyl groups in the molecule, for example, novolak resin such as novolak type phenol, novolak type cresol, novolak type naphthol; bisphenol resin such as bisphenol F, bisphenol A; paraxylylene.
- Phenolic aralkyl resins such as modified phenolic resins; resol-type phenolic resins such as dimethylene ether-type resol and methylol-type phenol; compounds obtained by further converting the above resins into methylols.
- lignin used for the synthesis of lignin-modified phenolic resin was prepared by the following procedure. 1500 parts by mass of dried cedar wood flour with a water content of 50%, 5000 parts by mass of pure water, 180 parts by mass of sodium hydroxide, 120 parts by mass of sodium carbonate and 0.5 parts by mass of 9,10-anthraquinone as a cooking aid in a capacity of 10 L It was charged in a stainless steel autoclave facility and subjected to a cooking reaction at 170 ° C. for 3 hours with stirring. The post-reaction cooking liquor was cooled to room temperature, the pulp component was removed by a screen, and then the black liquor containing lignin was separated.
- the separated black liquor was concentrated to a concentration of 20% with an evaporator to obtain a concentrated black liquor.
- Dilute sulfuric acid was added to the concentrated black liquor to adjust the pH to 8, and the resulting precipitate was centrifuged. After washing twice with 500 parts by mass of water, the precipitate was suspended in 5 times the amount of water and readjusted to pH 2 with dilute sulfuric acid.
- the precipitated lignin was centrifuged again, washed with a small amount of water, suction filtered, and freeze-dried to obtain 140 parts by mass of alkaline lignin in the form of a brown powder.
- ⁇ Lignin-modified phenolic resin b The synthesis was carried out in the same manner as the lignin-modified phenol resin a except that 139 parts by mass of phenol was changed to 205 parts by mass of phenol and 139 parts by mass of alkaline lignin was changed to 67 parts by mass, and 654 parts by mass of lignin-modified phenol resin b was obtained.
- the lignin denaturation rate based on the solid resin content was 20%, the non-volatile content was 52%, the pH was 7.8, and the viscosity of the solution resin was 0.68 Pa ⁇ s.
- Binder solution The following binder solution was prepared.
- -Binder solution A1 A water-soluble phenol resin (33304 manufactured by Durez) was used as the binder solution A1.
- -Binder solution A2 The lignin-modified phenol resin b having a lignin modification rate of 20% obtained by the above synthesis method was used as a binder solution A2.
- -Binder solution A3 The lignin-modified phenol resin a having a lignin modification rate of 42% obtained by the above synthesis method was used as a binder solution A3.
- Binder solution B An organic solvent (methanol) -based phenol resin (23056 manufactured by Durez) was used as the binder solution B.
- Example 1 Production of core layer A honeycomb core was prepared using aramid paper (“Nomex412” manufactured by DuPont, thickness 50 ⁇ m). A series of operations such as impregnating the obtained honeycomb core with the binder solution A for 5 minutes, taking out the honeycomb core, and drying at 80 ° C. for 45 minutes was repeated twice. Then, it was cured at 190 ° C. for 30 minutes to obtain a core layer having a thickness of 10 mm and a thickness of 48.1 kg / m 3. 2) Production of prepreg Glass fiber (# 7781, manufactured by HEXCEL) was impregnated with the binder solution A and dried at 150 ° C.
- aramid paper Nomex412 manufactured by DuPont, thickness 50 ⁇ m.
- a sheet-shaped prepreg (thickness 250 ⁇ m).
- the prepreg was in the B stage state.
- 3) Manufacture of sandwich panel A laminated body was obtained by arranging one prepreg on each side of the core layer. Subsequently, a SUS plate (thickness: 1.5 mm, Rz: 1.0 ⁇ m) was pressed against both sides of the obtained laminate, and heated and pressed at 0.7 MPa, 127 ° C. for 60 minutes using a mechanical press. The prepreg was cured to form a resin plate. Then, the SUS plate was separated from the resin plate to obtain a sandwich panel composed of a resin plate, a honeycomb core, and a resin plate. The glass transition temperature (Tg) of the cured product of the prepreg was 180 ° C.
- Examples 2 to 4 Each sandwich panel was obtained in the same manner as in Example 1 except that the binder solution of the core layer and the binder solution of the prepreg were as shown in Table 1.
- Adhesion Measurements were made in accordance with ASTM D1781 (Standard Test Method for Drum Peeling for Adhesives) and evaluated according to the following criteria: ⁇ : ⁇ 150N / 76mm ⁇ : ⁇ 100N / 76mm and ⁇ 150N / 76mm ⁇ :> 80N / 76mm and ⁇ 100N / 76mm ⁇ : ⁇ 80N / 76mm
- the core layer and prepreg before laminating were each observed under a microscope at 50 times and evaluated according to the following criteria.
- ⁇ No voids are confirmed in the core layer and prepreg
- Slight voids are present in at least one of the core layer and prepreg
- Many voids are present in at least one of the core layer and prepreg
- Core layer and prepreg There is a void on at least one side
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
Le panneau sandwich (100) de l'invention est équipé : d'une couche cœur (10) possédant une structure en nid d'abeilles ; et d'un objet durci (plaque de résine (40)) d'un préimprégné (20) agencé sur les deux faces de la couche cœur(10). La couche cœur (10) et le préimprégné (20) contiennent tous deux une résine phénolique hydrosoluble en tant que liant.
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Citations (5)
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JPH01158022A (ja) * | 1987-09-04 | 1989-06-21 | Oji Paper Co Ltd | リグニン−フェノール樹脂組成物 |
JPH07266475A (ja) * | 1994-03-21 | 1995-10-17 | Ciba Geigy Ag | ハニカム製品の製造方法 |
JPH1143546A (ja) * | 1997-07-30 | 1999-02-16 | Toray Ind Inc | クロスプリプレグおよびハニカム構造体 |
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WO2018047772A1 (fr) * | 2016-09-09 | 2018-03-15 | 出光興産株式会社 | Procédé de production d'une composition de résine contenant de la lignine, et pièce moulée en résine contenant de la lignine |
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JP2003276005A (ja) * | 2002-03-27 | 2003-09-30 | Ecotec Kk | リグノフェノール誘導体で処理した成形圧縮外皮構造繊維パネル |
JP2005065750A (ja) * | 2003-08-27 | 2005-03-17 | Takasago Internatl Corp | 消臭剤含有製品 |
TW200827092A (en) * | 2006-10-18 | 2008-07-01 | Tsudakoma Ind Co Ltd | Processing head for machine tool |
JP5354882B2 (ja) * | 2006-12-01 | 2013-11-27 | トヨタ車体株式会社 | リグニン変性ノボラック型フェノール系樹脂の製造方法 |
JP7215046B2 (ja) * | 2018-09-28 | 2023-01-31 | 住友ベークライト株式会社 | フェノール変性リグニン樹脂を含有する樹脂材料の製造方法、それを用いた構造体の製造方法 |
JP2020050814A (ja) * | 2018-09-28 | 2020-04-02 | 住友ベークライト株式会社 | フェノール変性リグニン樹脂を含む樹脂材料、それを用いたフェノール変性リグニン樹脂組成物および構造体 |
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JPH01158022A (ja) * | 1987-09-04 | 1989-06-21 | Oji Paper Co Ltd | リグニン−フェノール樹脂組成物 |
JPH07266475A (ja) * | 1994-03-21 | 1995-10-17 | Ciba Geigy Ag | ハニカム製品の製造方法 |
JPH1143546A (ja) * | 1997-07-30 | 1999-02-16 | Toray Ind Inc | クロスプリプレグおよびハニカム構造体 |
JP2013018822A (ja) * | 2011-07-08 | 2013-01-31 | Hitachi Ltd | エポキシ化リグニン樹脂又はエポキシ化リグノフェノール樹脂、その樹脂組成物、ワニス及び硬化物 |
WO2018047772A1 (fr) * | 2016-09-09 | 2018-03-15 | 出光興産株式会社 | Procédé de production d'une composition de résine contenant de la lignine, et pièce moulée en résine contenant de la lignine |
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