WO2022001290A1 - 一种背板 - Google Patents

一种背板 Download PDF

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Publication number
WO2022001290A1
WO2022001290A1 PCT/CN2021/087284 CN2021087284W WO2022001290A1 WO 2022001290 A1 WO2022001290 A1 WO 2022001290A1 CN 2021087284 W CN2021087284 W CN 2021087284W WO 2022001290 A1 WO2022001290 A1 WO 2022001290A1
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WO
WIPO (PCT)
Prior art keywords
protrusion
bottom plate
groove
mask
backplane
Prior art date
Application number
PCT/CN2021/087284
Other languages
English (en)
French (fr)
Inventor
张丁成
王水俊
李伟丽
范波涛
李文星
孙飞
辛小刚
Original Assignee
昆山国显光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Publication of WO2022001290A1 publication Critical patent/WO2022001290A1/zh
Priority to US17/824,188 priority Critical patent/US20220285622A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present application relates to the field of display technology, and in particular, to a backplane.
  • the present application mainly provides a backplane, which can improve the deformation of the corresponding glass substrate around the inner edge of the frame of the mask plate, improve the bonding effect of the glass substrate and the mask plate, and further improve the product yield.
  • the first technical solution provided by the present application is to provide a backplane, the backplane is used for pressing a mask plate assembly, and the mask plate assembly includes a laminated glass substrate and a mask plate, and the backplane is used for pressing the mask plate assembly.
  • the plate is used to cover the surface of the glass substrate to press the glass substrate, so that the glass substrate is attached to the mask plate;
  • the back plate includes: a bottom plate;
  • the bottom plate protrusions are arranged in an array, wherein the orthographic projection of the bottom plate protrusions on the mask plane completely falls within the scope of the mask plate, and the bottom plate protrusions located at the edge of the mask plate The distance between the projected projection and the edge of the mask is greater than or equal to the preset distance.
  • the height of the first protrusion minus the depth of the groove is equal to the height of the protrusion of the bottom plate.
  • the groove is provided with thread grooves corresponding to the number of first protrusions along the width direction, each first protrusion moves along the width direction of the groove correspondingly, and after moving to a predetermined position, each first protrusion fixed at a position corresponding to the thread groove.
  • the first protrusion located in the groove has a threaded hole penetrating the first protrusion, and the screw passes through the threaded hole and is inserted into the threaded groove to fix the first protrusion in the groove.
  • the outer side of the first protrusion away from the center of the bottom plate also has a limit bar, and the height of the limit bar is lower than the height of the first protrusion.
  • the backplane provided by the present application is provided with bottom plate protrusions arranged in an array on the side of the bottom plate facing the glass substrate, wherein the distance between the projection of the bottom plate protrusion located at the edge of the mask and the edge of the mask is greater than or equal to a preset distance In this way, the deformation of the corresponding glass substrate around the inner edge of the frame of the mask plate is improved, the bonding effect of the glass substrate and the mask plate is improved, and the product yield is improved.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a backplane of the present application.
  • FIG. 2 is a schematic structural diagram of the positional relationship of the backplane, the glass substrate and the mask plate of the present invention
  • FIG. 3 is a schematic structural diagram of a backboard of the present application adding a groove and a first protrusion on the basis of the first embodiment
  • FIG. 4 is a schematic diagram of the structure of the backplane of the present application in which a groove, a first protrusion and a limiting strip are added on the basis of the first embodiment.
  • the glass substrate is located between the backplane and the mask, and a surface of the backplane close to the glass substrate has a plurality of protrusions arranged in an array, the protrusions contact the glass substrate, and the backplane exerts pressure on the glass substrate, so that the glass substrate and the glass substrate Mask plate fit.
  • the applicant has found through research that the protrusions at the edge of the existing backplane are relatively close to the edge of the mask, which will cause the backplane to be pressed against the glass substrate, corresponding to the inner edge of the mask.
  • the glass substrate will be deformed, which will cause the mask plate to deform, resulting in poor adhesion between the glass substrate and the mask plate, which will affect the product yield during evaporation.
  • the distance between the projection of the projection and the edge position of the reticle is too close, the bonding effect between the effective evaporation area of the reticle and the glass will also be poor. people found.
  • the present application provides a backplane, the backplane makes the vertical distance between the protrusion at the edge of the backplane and the edge of the mask plate greater than or equal to a preset distance, so as to improve the corresponding glass substrate around the inner edge of the frame of the mask plate deformation, improve the bonding effect of the glass substrate and the mask plate, and then improve the product yield.
  • FIG. 1 is a schematic structural diagram of the first embodiment of the backplane of the present application.
  • the backplane 22 in this embodiment includes a bottom plate 11 , and the side of the bottom plate 11 facing the glass substrate is provided with a plurality of protrusions.
  • the protrusions include a plurality of bottom plate protrusions 111 arranged in an array.
  • the bottom plate protrusions 111 may also be referred to as main board protrusions.
  • the orthographic projection of the bottom plate protrusion 111 on the plane of the mask plate 12 completely falls within the range of the mask plate 12 , and the projection of the bottom plate protrusion 111 located at the edge of the mask plate 12 is the same as the edge of the mask plate 12 .
  • the vertical distance H is greater than or equal to the preset distance.
  • the back plate 22 of the present application is used for pressing the mask plate 12 and the glass substrate 21.
  • the glass substrate 21 is disposed between the back plate 22 and the mask plate 12 .
  • the laminated glass substrate 21 and the mask 12 may be referred to as a mask assembly, that is, the back plate 22 of the present application is used for pressing the mask assembly, and the back plate 22 covers the surface of the glass substrate 21 away from the mask 12 .
  • the glass substrate 21 is pressed so that the glass substrate 21 and the mask plate 12 are attached.
  • the distance between the projection of the bottom plate protrusion 111 at the edge position of the mask plate 12 and the edge position of the mask plate 12 should be H is greater than or equal to the preset distance, and the bottom plate protrusions 111 at the edge position of the bottom plate 11 need to be removed, so that the bottom plate protrusions 111 adjacent to the bottom plate protrusions 111 at the edge position are used as the bottom plate protrusions 111 at the edge position.
  • the distance H between the bottom plate protrusions 111 at the left and right edges of the back plate 22 and the edge of the mask plate 12 only needs to be greater than or equal to a predetermined distance.
  • the distance H between the bottom plate protrusions 111 at the edge positions of the upper and lower sides of the back plate 22 and the edge of the mask plate 12 can be set to be greater than or equal to a predetermined distance, which is not specifically limited.
  • the distance H between the base plate protrusions 111 at the edge positions on the left and right sides of the back plate 22 and the edge of the mask plate 12 is greater than or equal to the preset distance, the distance H at the edge positions on the left and right sides of the back plate 22 can be adjusted.
  • the bottom plate protrusions 111 are removed, so that the bottom plate protrusions 111 adjacent to the edge position serve as the outermost bottom plate protrusions 111 on the left and right sides.
  • the bottom plate protrusions at the upper and lower sides of the back plate 22 can be raised.
  • 111 is removed, so that the bottom plate protrusions 111 adjacent to the edge position serve as the outermost bottom plate protrusions 111 on the upper and lower sides.
  • the base plate protrusions 111 on the base plate 11 are arranged in an array and uniformly arranged, so that the force generated on the glass substrate 21 is uniform.
  • the bottom plate protrusion 111 can be a cube with a side length of 3-4 mm; optionally, the bottom plate protrusion 111 can be a rectangular parallelepiped, its width is 3-4 mm, and the length is slightly larger than the width.
  • the base plate protrusion 111 can be made of an aluminum alloy material.
  • the preset distance can be 3 mm, that is, the vertical distance H of the projection of the bottom plate protrusion 111 at the edge of the back plate 22 on the mask plate 12 from the edge of the mask plate 12 can be set to be greater than or equal to 3 mm . Further, the vertical distance H of the projection of the bottom plate protrusion 111 at the edge of the back plate 22 from the edge of the mask plate 12 to the edge of the mask plate 12 can be set to be greater than or equal to 3 mm and less than or equal to 20 mm.
  • multiple rows or columns of bottom plate protrusions 111 at the edge position can also be removed, so as to realize the vertical distance H between the bottom plate protrusion 111 at the edge position of the backplane 22 and the edge of the mask plate 12
  • the solution that is greater than or equal to the preset distance and less than or equal to 20 mm depends on the distance between two adjacent bottom plate protrusions 111 , which is not limited here.
  • FIG. 3 is a schematic structural diagram of the second embodiment of the backplane of the present application.
  • the backplane 22 shown in this embodiment includes a bottom plate 11 .
  • the side of the bottom plate 11 facing the glass substrate 21 is provided with a plurality of protrusions 10 arranged in an array.
  • the protrusions 10 on the bottom plate include a first protrusion located at an edge position. 112 and the bottom plate protrusions 111 at other positions except the edge position.
  • the grooves 114 are disposed corresponding to the positions of the first protrusions 112 .
  • the first protrusion 112 at the edge is slidably placed in the groove 114 .
  • the first protrusion 112 slides along the edge of the groove 114 so that the vertical distance H between the first protrusion 112 and the edge of the mask 12 is greater than or equal to a predetermined distance.
  • grooves 114 are provided on the edge of the backplane 22 so that the first protrusions 112 at the edge of the backplane 22 can slide in the grooves 114 to adjust the relationship between the first protrusions 112 at the edge of the backplane 22 and the mask. The vertical distance from the edge of the board 12.
  • the groove 114 is provided with a threaded groove 115 .
  • the threaded groove 115 is located in the groove 114 and is disposed along the width L direction of the groove 114 .
  • the number of the threaded grooves 115 is the same as the number of the first protrusions 112 at the edge of the bottom plate 11 .
  • Each first protrusion 112 correspondingly moves along the width L direction of the groove 114 , and after moving to a predetermined position, each first protrusion 112 is fixed at a corresponding position of the thread groove 115 .
  • the threaded groove 115 in the groove 114 spans the groove 114 .
  • the shape of the opening of the screw groove 115 may be a rectangle or an ellipse. Specifically, if the thread groove 115 is a rectangle, the length of the thread groove 115 is the same as the width L of the groove 114 . If the thread groove 115 is elliptical, the length of the long axis of the thread groove 115 is equal to the width L of the groove 114 . In a specific embodiment, the threaded groove 115 penetrates through the bottom plate 11; or, the threaded groove 115 does not penetrate through the bottom plate 11, which is not specifically limited.
  • the first protrusion 112 located at the edge of the back plate 22 and movable in the groove 114 has a threaded hole 113 therein.
  • the threaded groove 115 is rectangular, the diameter of the threaded hole 113 is equal to the width of the threaded groove 115; After sliding the first protrusion 112 along the groove 114 to a predetermined position, the screw passes through the threaded hole 113 on the first protrusion 112 and is inserted into the threaded groove 115 in the groove 114 to fix the first protrusion 112 on the bottom plate 11.
  • the width of the threaded groove 115 in the groove 114 is the same as the inner diameter of the threaded hole 113 on the first protrusion 112 .
  • the threaded groove 115 in the groove 114 and the threaded hole 113 on the first protrusion 112 have the same threading direction.
  • the predetermined position is a position where the vertical distance H from the edge of the mask 12 is greater than or equal to the preset distance. Specifically, the predetermined position is a position where the vertical distance H from the edge of the mask 12 is greater than or equal to 3 mm. Further, the predetermined position is a position where the vertical distance from the edge of the mask plate 12 is greater than or equal to 3 mm and less than or equal to 20 mm.
  • the screw does not protrude On the surface of the first protrusion 112 , that is, when the glass substrate 21 is pressed together, the screw does not contact the glass substrate 21 to prevent damage to the glass substrate 21 .
  • the length of the screw is less than the sum of the depths of the threaded hole 113 of the first protrusion 112 and the threaded groove 115 of the groove 114 .
  • the length of the screw is less than the sum of the depths of the threaded hole 113 of the first protrusion 112 and the threaded groove 115 of the groove 114 , and a surface of the first protrusion 112 away from the bottom plate 11 has a receiving groove at a position corresponding to the threaded hole 113 116.
  • the width L of the groove 114 is greater than or equal to 5 mm. It can be understood that the length of the threaded groove 115 can also be greater than or equal to 5 mm, so as to be used for laminating the glass substrate 21 and the mask plate. 12, the first protrusion 112 can be moved to a predetermined position in the groove 114, and the first protrusion 112 can be fixed by screws.
  • the predetermined position is a position that can avoid the deformation of the glass substrate 21 . Further, the predetermined position is a position where the vertical distance H from the edge of the mask plate 12 is greater than or equal to the predetermined distance. It is not specifically limited, and can be set by moving in the groove 114 .
  • the grooves 114 are arranged along the longitudinal direction of the bottom plate 11, and the width L of the grooves 114 perpendicular to the longitudinal direction of the bottom plate 11 is greater than or equal to 5 mm and less than or equal to 20 mm.
  • the size of the vertical distance between the bottom plate protrusion 111 on the edge of the backplane 22 or the first protrusion 112 from the edge of the mask plate 12 can be obtained through multiple experiments. It can be understood that this size is the best possible size. The size of the bonding effect between the glass substrate 21 and the mask plate 12 is improved, and then the maximum width of the groove 114 is determined based on the size.
  • the maximum width of the groove 114 may be 15 mm, that is, the width dimension of the groove 114 is greater than or equal to 5 mm and less than or equal to 15 mm; or in another embodiment, the width of the groove 114 The maximum width may be 18 mm, that is, the width dimension of the groove 114 is greater than or equal to 5 mm and less than or equal to 18 mm, which is not specifically limited.
  • the height of the first protrusion 112 is greater than the height of the bottom protrusion 111. Specifically, the height of the first protrusion 112 minus the depth of the groove 114 is equal to the height of the bottom protrusion 111.
  • the first protrusion 112 at the edge position is a rectangular parallelepiped. Specifically, there are connecting portions 117 between the first protrusions 112 to connect the first protrusions 112 at the edge positions. In this way, when the first protrusions 112 are moved in the grooves 114, all the first protrusions 112 at the edge can be moved at the same time, so that the first protrusions 112 located in the same column or row are not on the same straight line, which cannot be eliminated. deformation.
  • the heights of the connecting portions 117 connecting the first protrusions 112 and the first protrusions 112 may be the same, so that when the glass substrate 21 and the mask 12 are pressed together, the first protrusions 112 and the connecting portions 117 both contact the glass substrate 21 .
  • the height of the connecting portion 117 connecting the first protrusions 112 is lower than the height of the first protrusions 112 , so that when the glass substrate 21 and the mask plate 12 are laminated, only the first protrusions 112 contacts the glass substrate 21 , and the connecting portion 117 does not contact the glass substrate 21 .
  • the bottom plate 11 has grooves 114 .
  • the bottom plate 11 may be rectangular, specifically, the bottom plate 11 may be a cuboid, or may also be a cube, which is not specifically limited. This embodiment is described by taking the bottom plate 11 of a rectangular parallelepiped as an example.
  • the grooves 114 may be located on both sides of the edge of the long side of the bottom plate 11 .
  • the grooves 114 are arranged along the long sides of the bottom plate 11 , as shown in FIG. 3 . Therefore, when the first protrusion 112 is adjusted, the first protrusion 112 moves in a direction perpendicular to the long side.
  • the grooves 114 may be disposed along the short sides of the bottom plate 11 , so that when the first protrusions 112 are adjusted, the first protrusions 112 move in a direction perpendicular to the short sides.
  • the position of the groove 114 is not limited, specifically, the purpose is to eliminate the deformation and improve the bonding accuracy of the glass substrate 21 and the mask plate 12 .
  • the size and shape of the first protrusion 112 may be the same as the size and shape of the bottom protrusion 111 .
  • the size of the first protrusion 112 may be larger than the size of the bottom protrusion 111 .
  • the shape of the first protrusion 112 is different from that of the bottom plate protrusion 111 , which is not specifically limited.
  • the shape of the first protrusion 112 may be set as a rectangular parallelepiped, and the shape of the bottom plate protrusion 111 may be set as a cylindrical shape.
  • the first protrusions 112 and the bottom plate protrusions 111 are arranged in the same manner and are evenly distributed, so that the pressure acting on the glass substrate 21 is uniform. In this manner, preferably, the height of the connecting portion 117 connecting the first protrusions 112 is lower than the height of the first protrusions 112 , so that the connecting portion 117 does not contact the glass substrate 21 .
  • the arrangement of the first protrusions 112 and the bottom plate protrusions 111 is different. That is, the arrangement of the first protrusions 112 can be more dispersed, while the arrangement of the bottom plate protrusions 111 can be relatively dense. In this way, the height of the connecting portion 117 connecting the first protrusions 112 can be made equal to the first protrusions 112 The height of the connecting portion 117 contacts the glass substrate 21, so as to make the pressure acting on the glass substrate 21 as uniform as possible.
  • FIG. 4 is a schematic structural diagram of a third embodiment of the backplane of the present application.
  • the back plate 22 described in this embodiment has all the technical features of the second embodiment above, and on the basis of the second embodiment, a limit bar 118 is added on the outer side of the first protrusion 112 .
  • the limiting bar 118 is located outside the first protrusion 112 and is located on the long side of the bottom plate 11 and extends along the long side. In another embodiment, the limiting bar 118 may also be located on the short side of the bottom plate 11 and extend along the short side.
  • the height of the limiting strip 118 is smaller than the height of the bottom plate protrusions 111 .
  • the first protrusions 112 and the bottom plate protrusions 111 contact the glass substrate 21 .
  • the limit bar 118 does not contact the glass substrate 21; in the process of applying pressure to press the glass substrate 21 and the mask plate 12, after the glass substrate 21 is deformed and contacts the limit bar 118, it is limited by the limit bar 118. No longer deformed. That is, the height of the limit bar 118 is set according to the appropriate deformation amount of the glass substrate 21 , and the appropriate deformation amount of the glass substrate 21 does not affect the bonding accuracy of the glass substrate 21 and the mask plate 12 .
  • the groove 114 can be installed in the limit bar 118, so that the first protrusion 112 can move in the groove 114, So that the vertical distance H between the first protrusion 112 at the edge position and the edge of the mask plate 12 is greater than or equal to a predetermined distance.
  • the deformation of the glass substrate 21 corresponding to the inner edge of the frame of the mask plate 12 can be improved under the condition that the height of the limit bar 118 remains unchanged, the bonding effect of the mask plate 12 and the glass substrate 21 is improved, and the product quality is improved. Rate.
  • the height of the limiting bar 118 is lower than the height of the base plate protrusion 111 .
  • the vertical distance H between the base plate protrusion 111 at the edge position and the edge of the mask plate 12 is greater than or equal to a predetermined distance.
  • the backplane 22 described in this application is provided with protrusions 10 arranged in an array on the side of the bottom plate 11 facing the glass substrate 21 .
  • the protrusions 10 include a first protrusion 112 located at the edge of the bottom plate 11 and other positions of the bottom plate 11 .
  • the deformation of 21 improves the bonding effect between the mask plate 12 and the glass substrate 21, thereby improving the product yield.
  • the back plate 22 provided by the present application can still improve the deformation of the corresponding glass substrate 21 around the inner edge of the frame of the mask plate 12 when the height of the limiting strip 118 is lower than the bottom plate protrusion 111 or the first protrusion 112, The bonding effect between the mask plate 12 and the glass substrate 21 is improved, thereby improving the product yield.
  • the backplane 22 may be not changed, but the frame of the mask 12 may be enlarged.
  • the mask 12 includes a frame and a mask body, which can reduce the mask to a certain extent.
  • the frame of the board 12 and the mask 12 are expanded so that the vertical distance H between the edge of the mask 12 and the first protrusion 112 at the edge of the backplane 22 is greater than or equal to a predetermined distance.
  • the vertical distance H between the edge of the mask plate 12 and the first protrusion 112 at the edge of the back plate 22 is greater than or equal to a predetermined distance and less than or equal to 20 mm.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请提供一种背板，背板用于压合掩膜板组件，掩膜板组件包括层叠设置的玻璃基板以及掩膜板，背板用于覆盖在玻璃基板的表面以按压玻璃基板，使得玻璃基板与所述掩膜板贴合；背板包括：底板；和多个凸起，多个凸起包括底板凸起，底板凸起位于底板面向玻璃基板的一侧，底板凸起呈阵列排布，其中，底板凸起在掩膜板平面上的正投影完全落入掩膜板的范围内，且位于掩膜板边缘位置处的底板凸起的投影与掩模板边缘位置的距离大于或等于预设距离。以此改善掩膜板的框架内边缘周围对应的玻璃基板的形变，提高玻璃基板与掩膜板的贴合效果，进而提高产品良率。

Description

一种背板 技术领域
本申请涉及显示技术领域，特别是涉及一种背板。
背景技术
随着显示技术的发展，市场上对于显示面板的要求也越来越高，有机发光二极管显示屏因其具有对比度高、能够自发光及柔性显示等优点而得到越来越广泛的应用。目前在制备有机发光二极管的过程中通常会进行掩膜板蒸镀工艺，在蒸镀过程中，掩膜板的贴合精度直接影响到了产品的良率。
发明内容
本申请主要提供一种背板，改善掩膜板的框架内边缘周围对应的玻璃基板的形变，提高玻璃基板与掩膜板的贴合效果，进而提高产品良率。
为解决上述技术问题，本申请提供的第一个技术方案为：提供一种背板，背板用于压合掩膜板组件，掩膜板组件包括层叠设置的玻璃基板以及掩膜板，背板用于覆盖在玻璃基板的表面以按压玻璃基板，使得玻璃基板与掩膜板贴合；背板包括：底板；和多个凸起，多个凸起包括底板凸起，底板凸起位于底板面向玻璃基板的一侧，底板凸起呈阵列排布，其中，底板凸起在掩膜板平面上的正投影完全落入掩膜板的范围内，且位于掩膜板边缘位置处的底板凸起的投影与掩模板边缘位置的距离大于或等于预设距离。
其中，第一凸起的高度减去凹槽的深度等于底板凸起的高度。
其中，凹槽内沿宽度方向设置有与第一凸起数量对应的螺纹槽，每一第一凸起对应沿凹槽的宽度方向移动，并且在移动到预定位置后，每一第一凸起固定在一个对应的所述螺纹槽位置处。
其中，位于所凹槽内的第一凸起上具有贯穿第一凸起的螺纹孔，螺钉穿过螺纹孔并插入螺纹槽，以将第一凸起固定于所述凹槽内。
其中，相邻的第一凸起之间具有连接部，以将彼此相邻的第一凸起连接。
其中，第一凸起远离底板中心的外侧还具有限位条，限位条的高度低于第一凸起的高度。
本申请提供的背板在底板面向玻璃基板的一面设置阵列排布的底板凸起，其中，位于掩膜板边缘位置处的底板凸起的投影与掩模板边缘位置的距离大于或等于预设距离，以此改善掩膜板的框架内边缘周围对应的玻璃基板的形变，提高玻璃基板与掩膜板的贴合效果，进而提高产品良率。
附图说明
图1是本申请背板的第一实施例的结构示意图；
图2是本发明背板、玻璃基板以及掩模板的位置关系结构示意图；
图3是本申请背板的在第一实施例的基础上增设凹槽和第一凸起的结构示意图；
图4是本申请背板的在第一实施实施例的基础上增设凹槽、第一凸起和限位条的结构示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。
掩膜板在进行蒸镀时，需要通过背板将掩膜板与玻璃基板压合，使得掩膜板与玻璃基板贴合，并对位准确。具体的，玻璃基板位于背板与掩膜板之间，背板靠近玻璃基板的一表面具有若干阵列排布的凸起，凸起接触玻璃基板，背板向玻璃基板施加压力，使得玻璃基板与掩膜板贴合。申请人经研究发现，现有的背板边缘位置处的凸起距离掩膜板的边 缘的垂直距离较近，这会导致背板在压合玻璃基板时，掩膜板的框架内边缘周围对应的玻璃基板会产生形变，进而会使得掩膜板产生形变，导致玻璃基板与掩膜板贴合效果不好，在进行蒸镀时影响产品良率，同时，在平行于掩模版的平面上，若凸起的投影与掩模版的边缘位置的距离过近的话，也会使掩模版的有效蒸镀区与玻璃之间贴合效果不好，这种影响贴合效果的原因在此之前并没有人发现。本申请提供一种背板，该背板使得背板边缘位置处的凸起距离掩膜板的边缘的垂直距离大于等于预设距离，以此改善掩膜板的框架内边缘周围对应的玻璃基板的形变，提高玻璃基板与掩膜板的贴合效果，进而提高产品良率。
下面通过具体实施例，详细说明本申请的技术方案。
请参见图1，为本申请背板的第一实施例的结构示意图。本实施例所述的背板22包括底板11，底板11面向玻璃基板的一面设置有多个凸起。凸起包括阵列排布的多个底板凸起111。底板凸起111也可称为主板凸起。其中，底板凸起111在掩膜板12平面上的正投影完全落入掩膜板12的范围内，且位于掩膜板12边缘位置的底板凸起111的投影与掩膜板12的边缘的垂直距离H大于或等于预设距离。
本申请的背板22用于将掩膜板12与玻璃基板21压合，如图2所示，在背板22将掩模板12与玻璃基板21压合时背板22设置于玻璃基板21远离掩模板12的一侧，也即玻璃基板21设置于背板22与掩模板12之间。其中，层叠设置的玻璃基板21与掩模板12可以称作掩模板组件，也即本申请的背板22用于压合掩膜板组件，背板22覆盖在玻璃基板21远离掩模版12的表面以按压玻璃基板21，使得玻璃基板21与掩膜板12贴合。
当背板22边缘位置的底板凸起111距离掩膜板12的边缘的垂直距离H较小时，若要使得掩膜板12边缘位置处的底板凸起111的投影与掩模板12边缘位置的距离H大于或等于预设距离，需要将底板11边缘位置的底板凸起111去除，从而使得与边缘位置处的底板凸起111相邻的底板凸起111作为边缘位置处的底板凸起111。可以理解的是，在一实施例中，只需要使得背板22左右两侧的边缘位置处的底板凸起111 与掩膜板12边缘的距离H大于或等于预设距离。在另一实施例中，还可以设置背板22上下两侧的边缘位置处的底板凸起111与掩膜板12边缘的距离H大于或等于预设距离，具体不做限定。
具体的，若要使得背板22左右两侧的边缘位置处的底板凸起111与掩膜板12边缘的距离H大于或等于预设距离，可以将背板22左右两侧的边缘位置处的底板凸起111去除，使得与边缘位置相邻的底板凸起111作为左右两侧最外侧的底板凸起111。若要使得背板22上下两侧的边缘位置处的底板凸起111与掩膜板12边缘的距离H大于或等于预设距离，可以将背板22上下两侧的边缘位置处的底板凸起111去除，使得与边缘位置相邻的底板凸起111作为上下两侧最外侧的底板凸起111。
具体的，在本实施例中，底板11上的底板凸起111阵列排布并均匀设置，以使其在玻璃基板21上产生的力均匀。在一具体实施例中，底板凸起111可以为正方体，其边长为3～4毫米；可选的，底板凸起111可以为长方体，其宽度为3～4毫米，长度略大于宽度。其中，底板凸起111可采用铝合金材料。
在一实施例中，预设距离可以为3毫米，即可以设置背板22边缘位置的底板凸起111在掩膜板12的投影距离掩膜板12的边缘的垂直距离H大于或等于3毫米。进一步地，还可以设置背板22边缘位置的底板凸起111在掩膜板12的投影距离掩膜板12的边缘的垂直距离H大于或等于3毫米并小于或等于20毫米。具体的，在一实施例中，还可以将边缘位置处的多行或多列底板凸起111去除，进而实现背板22边缘位置的底板凸起111距离掩膜板12的边缘的垂直距离H大于或等于预设距离并小于或等于20毫米的方案，具体取决于相邻两个底板凸起111之间的距离，在此不做限定。
经过实验证明，本申请通过将最外侧边缘处的底板凸起111与掩膜板12边缘的垂直距离H设置为大于或等于预设距离，能够改善掩膜板12的框架内边缘周围对应的玻璃基板21的形变，提高玻璃基板21与掩膜板12的贴合效果，在使用掩膜板12进行蒸镀时，能够大大提高产品的良率。具体的，经过实验证明，采用本申请的方式，在进行蒸镀时， 产品良率提升百分之四十，依据产品的产能，其产生的经济价值可观。另外，本申请的方式，在进行蒸镀时，排版率也得到一定的提升，具体的，经过多次实验证明，采用本申请的方式，排版率提升约百分之二十，降低成本。
请参见图3，为本申请背板的第二实施例的结构示意图。本实施例所述的背板，在图1所示的第一实施例的基础上增设了凹槽114以及第一凸起112。具体的，本实施例所示的背板22包括底板11，底板11面向玻璃基板21的一面设置有阵列排布的多个凸起10，底板上的凸起10包括位于边缘位置的第一凸起112及除边缘位置外其余位置的底板凸起111。凹槽114对应第一凸起112的位置设置。具体的，边缘位置的第一凸起112可滑动地置于凹槽114内。第一凸起112沿凹槽114边缘位置滑动以使第一凸起112距离掩膜板12的边缘的垂直距离H大于或等于预设距离。
具体的，在背板22的边缘设置凹槽114，使得背板22边缘位置处的第一凸起112能够在凹槽114中滑动，以调节背板22边缘处第一凸起112与掩膜板12边缘的垂直距离。
可选的，凹槽114内设置有螺纹槽115，如图3所示，螺纹槽115位于凹槽114内并沿凹槽114的宽度L方向设置。具体的，螺纹槽115的数量与底板11边缘位置处的第一凸起112的数量相同。每一第一凸起112对应沿凹槽114的宽度L方向移动，并且在移动到预定位置后，每一第一凸起112固定在一个对应的螺纹槽115位置处。具体的，凹槽114内的螺纹槽115横跨凹槽114。具体的，螺纹槽115的开口形状可以为长方形，也可以为椭圆形。具体的，若螺纹槽115为长方形，则螺纹槽115的长度与凹槽114的宽度L相同。若螺纹槽115为椭圆形，则螺纹槽115的长轴尺寸等于凹槽114的宽度L。在一具体实施例中，螺纹槽115贯穿底板11；或者，螺纹槽115不贯穿底板11，具体不做限定。
可选的，位于背板22边缘且在凹槽114内可移动的第一凸起112内具有螺纹孔113。具体的，若螺纹槽115为长方形，则螺纹孔113的直径等于螺纹槽115的宽度；若螺纹槽115为椭圆形，则螺纹孔113的 直径等于螺纹槽115的短轴尺寸。在将第一凸起112沿凹槽114滑动移动至预定位置后，螺钉穿过第一凸起112上的螺纹孔113插入凹槽114内的螺纹槽115中，进而将第一凸起112固定于底板11上。具体的，在一实施例中，凹槽114内的螺纹槽115的宽度与第一凸起112上的螺纹孔113的内径相同。另外，凹槽114内的螺纹槽115与第一凸起112上的螺纹孔113的螺纹旋向相同。其中，预定位置为距离掩膜板12的边缘的垂直距离H大于或等于预设距离的位置，具体的，预定位置为距离掩膜板12的边缘的垂直距离H大于或等于3毫米的位置。进一步地，预定位置为距离掩膜板12的边缘的垂直距离大于或等于3毫米且小于等于20毫米的位置。
在一实施例中，在通过螺钉穿过第一凸起112上的螺纹孔113插入凹槽114内的螺纹槽115中，进而将第一凸起112固定于底板11上后，螺钉不凸出于第一凸起112的表面，即在压合玻璃基板21时，螺钉不与玻璃基板21接触，以防止损坏玻璃基板21。具体的，螺钉的长度小于第一凸起112的螺纹孔113及凹槽114的螺纹槽115的深度之和。或者，螺钉的长度小于第一凸起112的螺纹孔113及凹槽114的螺纹槽115的深度之和，并且第一凸起112远离底板11的一表面对应螺纹孔113的位置处具有收容槽116。在螺钉插入螺纹孔113及螺纹槽115中时，螺钉的钉头被收容于该收容槽116中，以使得螺钉不凸出于第一凸起112的表面，进而使得螺钉不与玻璃基板21接触。
在一具体实施例中，凹槽114的宽度L大于或等于5毫米，可以理解的是，螺纹槽115的长度也可以大于或等于5毫米，以此在进行压合玻璃基板21与掩膜板12时，可以在凹槽114中将第一凸起112移动至预定位置，并通过螺钉将第一凸起112固定。在一具体实施例中，预定位置为能够避免玻璃基板21产生形变的位置。进一步地，预定位置为与掩膜板12的边缘垂直距离H大于或等于预设距离的位置。具体不做限定，可以通过在凹槽114中移动进行设置。
在一具体实施例中，凹槽114沿底板11的长边方向设置，且凹槽114垂直于底板11的长边方向的宽度L大于或等于5毫米并小于或等于 20毫米。具体的，可以通过多次实验以得出背板22边缘的底板凸起111或者第一凸起112距离掩膜板12的边缘的垂直距离的尺寸，可以理解的，该尺寸为能够最好的改善玻璃基板21与掩膜板12贴合效果的尺寸，再基于该尺寸确定凹槽114的最大宽度。例如，在一实施例中，凹槽114的最大宽度可以为15毫米，即凹槽114的宽度尺寸大于或等于5毫米且小于或等于15毫米；或者在另一实施例中，凹槽114的最大宽度可以为18毫米，即凹槽114的宽度尺寸大于或等于5毫米且小于或等于18毫米，具体不做限定。
在一具体实施例中，第一凸起112的高度大于底板凸起111的高度，具体的，第一凸起112的高度减去凹槽114的深度等于底板凸起111的高度，即在压合玻璃基板21时，第一凸起112与底板凸起111均与玻璃基板21接触。
在一具体实施例中，边缘位置处的第一凸起112为长方体。具体的，第一凸起112之间具有连接部117，以将边缘位置处的第一凸起112连接。以此在将第一凸起112在凹槽114中移动时，可以将边缘处的所有第一凸起112同时移动，避免位于同一列或同一行的第一凸起112不在同一直线上，无法消除形变。
连接第一凸起112的连接部117与第一凸起112高度可以相同，进而使得在压合玻璃基板21与掩膜板12时，第一凸起112及连接部117均接触玻璃基板21。在另一可行实施例中，连接第一凸起112的连接部117的高度低于第一凸起112的高度，进而使得在压合玻璃基板21与掩膜板12时，仅第一凸起112接触玻璃基板21，而连接部117不接触玻璃基板21。
在一实施例中，底板11的至少一相对两侧具有凹槽114。底板11可以为矩形，具体的，底板11可以为长方体，或者还可以为正方体，具体不做限定。本实施例以长方体的底板11为例进行说明。具体的，凹槽114可以位于底板11的长边的边缘的两侧。具体的，凹槽114沿底板11的长边设置，如图3所示。以此，在调节第一凸起112时，第一凸起112沿与长边垂直的方向进行移动。或者，凹槽114可以沿底板11 的短边设置，以此，在调节第一凸起112时，第一凸起112沿与短边垂直的方向进行移动。凹槽114的位置不做限定，具体以能够消除形变，提高玻璃基板21与掩膜板12的贴合精度为目的。
在一具体实施例中，第一凸起112的尺寸可以与底板凸起111的尺寸与形状相同。或者，第一凸起112的尺寸可以大于底板凸起111的尺寸。或者第一凸起112的形状与底板凸起111不同，具体不做限定。例如在一实施例中，可以将第一凸起112的形状设置为长方体形，而将底板凸起111的形状设置为圆柱形。
在一可行实施例中，第一凸起112与底板凸起111的排布方式相同，且均匀分布，以此使得作用于玻璃基板21上的压力均匀。在此方式中，优选的使连接第一凸起112的连接部117的高度低于第一凸起112的高度，进而使得连接部117不接触玻璃基板21。
在另一可行实施例中，第一凸起112与底板凸起111的排布方式不同。即可以使得第一凸起112的排布较为分散，而底板凸起111的排布较为密集，在此方式中，可以使得连接第一凸起112的连接部117的高度等于第一凸起112的高度，进而使得连接部117接触玻璃基板21，以此尽可能地使作用于玻璃基板21上的压力均匀。
请参见图4，为本申请背板的第三实施例的结构示意图。本实施例所述的背板22具备上述第二实施例的所有技术特征，且在第二实施例的基础上，在第一凸起112的外侧增设限位条118。具体的，限位条118位于第一凸起112的外侧，且位于底板11的长边上并沿长边延伸。在另一实施例中，限位条118还可以位于底板11的短边上并沿短边延伸。
在一实施例中，限位条118的高度小于底板凸起111的高度，具体的，在压合玻璃基板21及掩膜板12前，第一凸起112及底板凸起111接触玻璃基板21，而限位条118不接触玻璃基板21；在施加压力压合玻璃基板21及掩膜板12的过程中，玻璃基板21在产生形变接触到限位条118后，被限位条118限制，不再产生形变。即限位条118的高度根据玻璃基板21的合适形变量设置，玻璃基板21的合适形变量不影响玻璃基板21与掩膜板12的贴合精度。
本实施例所示的背板22，其能够在限位条118的高度不变的情况下，采用在限位条118内测设置凹槽114，使得第一凸起112在凹槽114中移动，以使得边缘位置处的第一凸起112与掩膜板12边缘的垂直距离H大于或等于预设距离。以此在限位条118高度不变的情况下，改善掩膜板12的框架内边缘周围对应的玻璃基板21的形变，提高掩膜板12与玻璃基板21的贴合效果，进而提高产品良率。
在另一可行实施例中，限位条118的高度低于底板凸起111的高度，结合图1，限位条118位于底板凸起111的外侧，且位于底板11的长边上。在此实施例中，设置边缘位置处的底板凸起111与掩膜板12的边缘的垂直距离H大于或等于预设距离。以此能够在限位条118高度不变的情况下，改善掩膜板12的框架内边缘周围对应的玻璃基板21的形变，提高掩膜板12与玻璃基板21的贴合效果，进而提高产品良率。
本申请所述的背板22，其在底板11面向玻璃基板21的一面设置阵列排布的凸起10，凸起10包括位于底板11边缘位置处的第一凸起112以及位于底板11其余位置处的底板凸起111，其中，边缘位置的第一凸起112距离掩膜板12的边缘的垂直距离H大于或等于预设距离，以改善掩膜板12的框架内边缘周围对应的玻璃基板21的形变，提高掩膜板12与玻璃基板21的贴合效果，进而提高产品良率。并且本申请提供的背板22，其在限位条118高度低于底板凸起111或第一凸起112时，仍然能够改善掩膜板12的框架内边缘周围对应的玻璃基板21的形变，提高掩膜板12与玻璃基板21的贴合效果，进而提高产品良率。
在另一实施例中，还可以对背板22不做改变，而将掩膜板12的边框扩大，具体的，掩膜板12包括框架及掩膜板本体，可以在一定程度上将掩膜板12的边框及掩膜板12进行扩张，进而使得掩膜板12的边缘与背板22边缘位置处的第一凸起112的垂直距离H大于或等于预设距离。或者在另一实施例中，使得掩膜板12的边缘与背板22边缘位置处的第一凸起112的垂直距离H大于或等于预设距离并小于等于20毫米。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡 是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (16)

  1. 一种背板，其中，所述背板用于压合掩膜板组件，所述掩膜板组件包括层叠设置的玻璃基板以及掩膜板，所述背板用于覆盖在所述玻璃基板的表面以按压所述玻璃基板，使得所述玻璃基板与所述掩膜板贴合；
    所述背板包括：
    底板；和
    多个凸起，所述多个凸起包括底板凸起，所述底板凸起位于所述底板面向所述玻璃基板的一侧，所述底板凸起呈阵列排布，其中，所述底板凸起在所述掩膜板平面上的正投影完全落入所述掩膜板的范围内，且位于所述掩膜板边缘位置处的所述底板凸起的投影与所述掩模板边缘位置的距离大于或等于预设距离。
  2. 根据权利要求1所述的背板，其中，所述凸起还包括设于所述底板的边缘位置处的第一凸起，所述底板的边缘位置设置有与所述第一凸起位置对应的凹槽，所述第一凸起可滑动地置于所述凹槽内。
  3. 根据权利要求2所述的背板，其中，所述第一凸起的高度减去所述凹槽的深度等于所述底板凸起的高度。
  4. 根据权利要求2所述的背板，其中，所述凹槽沿所述底板的长边方向延伸，且所述凹槽垂直于所述底板的长边方向的宽度大于或等于5毫米，所述第一凸起在宽度方向上可滑动。
  5. 根据权利要求2所述的背板，其中，所述凹槽内沿宽度方向设置有与所述第一凸起数量对应的螺纹槽，每一所述第一凸起对应沿所述凹槽的宽度方向移动，并且在移动到预定位置后，每一所述第一凸起固定在一个对应的所述螺纹槽位置处。
  6. 根据权利要求5所述的背板，其中，所述凹槽沿底板的长边设置，在调节所述第一凸起时，所述第一凸起沿与所述底板的长边垂直的方向进行移动。
  7. 根据权利要求5所述的背板，其中，所述凹槽沿底板的短边设置，在调节所述第一凸起时，所述第一凸起沿与所述底板的短边垂直的方向进行移动。
  8. 根据权利要求5所述的背板，其中，位于所述凹槽内的所述第一凸起上具有贯穿所述第一凸起的螺纹孔，螺钉穿过所述螺纹孔并插入所述螺纹槽，以 将所述第一凸起固定于所述凹槽内。
  9. 根据权利要求8所述的背板，其中，所述螺钉的长度小于所述螺纹孔及所述凹槽的螺纹槽的深度之和。
  10. 根据权利要求8所述的背板，其中，所述第一凸起远离所述底板的一表面对应所述螺纹孔的位置处具有收容槽，所述螺钉将所述第一凸起固定于所述凹槽中后收容于所述收容槽中。
  11. 根据权利要求8所述的背板，其中，所述螺纹槽为长方形，所述螺纹槽的长度与所述凹槽的宽度相同；或者，所述螺纹槽为椭圆形，所述螺纹槽的长轴尺寸等于所述凹槽的宽度。
  12. 根据权利要求1所述的背板，其中，所述预设距离为3毫米。
  13. 根据权利要求2所述的背板，其中，相邻的所述第一凸起之间具有连接部，以将彼此相邻的所述第一凸起连接。
  14. 根据权利要求2所述的背板，其中，所述底板的至少一相对两侧具有所述凹槽。
  15. 根据权利要求2所述的背板，其中，所述第一凸起远离所述底板中心的外侧还具有限位条，所述限位条的高度低于所述第一凸起的高度。
  16. 根据权利要求15所述的背板，其中，所述限位条沿所述底板的长边方向设置。
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