WO2023097455A1 - 背板及其制作方法、背光模组、显示装置 - Google Patents

背板及其制作方法、背光模组、显示装置 Download PDF

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Publication number
WO2023097455A1
WO2023097455A1 PCT/CN2021/134450 CN2021134450W WO2023097455A1 WO 2023097455 A1 WO2023097455 A1 WO 2023097455A1 CN 2021134450 W CN2021134450 W CN 2021134450W WO 2023097455 A1 WO2023097455 A1 WO 2023097455A1
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WIPO (PCT)
Prior art keywords
hole
wall
bottom wall
shiny
backplane
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Application number
PCT/CN2021/134450
Other languages
English (en)
French (fr)
Inventor
王耀东
郑仰利
张晓萍
张罗
刘全洲
刘芳怡
任健
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2021/134450 priority Critical patent/WO2023097455A1/zh
Priority to CN202180003710.8A priority patent/CN116529802A/zh
Publication of WO2023097455A1 publication Critical patent/WO2023097455A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present disclosure relates to the field of display technology, in particular to a backplane and a manufacturing method thereof, a backlight module, and a display device.
  • the liquid crystal display device includes: a display panel, and a backlight module for providing backlight for the display panel.
  • the backlight module includes: a backplane, a light-emitting element, and an optical film set.
  • the backplane has a receiving space, and the light-emitting element and the optical film set At least a part is provided in the accommodation space.
  • Embodiments of the present disclosure provide a backplane and a manufacturing method thereof, a backlight module, and a display device.
  • the present disclosure provides a backplane used in a display device, wherein the backplane includes:
  • the through hole has a hole wall protruding toward one side of the bottom wall, and the hole wall is connected with the bottom wall as an integral structure;
  • the materials of the bottom wall and the hole wall both include aluminum alloy material.
  • the tensile strength of the bottom wall is between 320Mpa and 390Mpa, the yield strength is between 200Mpa and 270Mpa, the Vickers hardness is between 100HV and 120HV, and the elongation is between 12% and 20%. .
  • the thickness of the bottom wall is between 0.09 mm and 1.01 mm, and the thickness of the hole wall is between 0.050 mm and 0.081 mm.
  • the end of the hole wall away from the bottom wall is provided with a bent portion, and the bent portion is formed into an integral structure with the hole wall and extends toward the middle of the through hole.
  • the longitudinal section of the through hole is rectangular.
  • the bent portion is an annular structure, and the width of the bent portion is between 0.05 mm and 0.15 mm.
  • the longitudinal section of the through hole is trapezoidal, the trapezoid has two top angles and two bottom angles, each of the top angles is greater than 90°, and each of the bottom angles is between 80° and between 90°.
  • the number of shiny rings is 4 or 5.
  • the shiny band is located on the side of the at least one shiny ring close to the bottom wall, and the width of the shiny band is larger than that of any shiny ring. width.
  • the ratio of the width of the shiny strip to the width of any shiny ring is in the range of [1.5, 4].
  • the diameter of the end of the through hole away from the bottom wall is between 2.5 mm and 4.5 mm.
  • a first groove is provided on the bottom wall near the hole wall.
  • the width of the first groove is between 0.08 mm and 0.12 mm, and the depth of the first groove is between 0.01 mm and 0.02 mm.
  • the backboard further includes a side wall, the side wall is connected to the bottom wall as an integral structure, and the side wall, the bottom wall and the hole wall define an accommodation space.
  • a second groove is provided on the bottom wall near the side wall.
  • the backplane is used in a display device, and the bottom wall is arranged opposite to a display panel of the display device.
  • An embodiment of the present disclosure further provides a backlight module, including the above-mentioned backplane, and the backlight module further includes: a backlight, at least a part of the backlight is located in the accommodation space.
  • the side wall of the backboard has: a first side, a second side and a top surface, the first side is opposite to the second side, the first side faces the receiving space, the the top surface connects the first side and the second side,
  • the backlight module further includes: a plastic frame surrounding the backlight and in contact with both the first side surface and the top surface of the sidewall of the backplane.
  • a glue injection hole is provided at the junction of the side wall and the bottom wall, a third groove is provided on the surface of the bottom wall facing the accommodating space, and a part of the glue frame is filled.
  • the third groove at least a part of the third groove is located on one side of the glue injection hole along the thickness direction of the side wall.
  • An embodiment of the present disclosure further provides a display device, including: the above-mentioned backplane and a display panel, where the display panel is disposed opposite to the bottom wall of the backplane.
  • adhesive glue is provided on the wall of the through hole of the back plate, and the adhesive glue fixes the hole wall of the through hole and the display panel, and the adhesive glue
  • the orthographic projection on the display panel is a ring structure, and the inner diameter of the ring structure is between 2.15 mm and 4.15 mm; or,
  • the display device further includes: a cover plate, the cover plate is arranged on the light emitting side of the display panel, the display panel is provided with a mounting hole, the hole wall of the through hole passes through the mounting hole, the Adhesive glue is provided on the hole wall of the through hole, and the adhesive glue fixes and bonds the hole wall of the through hole with the cover plate, and the orthographic projection of the adhesive glue on the cover plate is annular structure, the inner diameter of the annular structure is between 2.15 mm and 4.15 mm.
  • An embodiment of the present disclosure also provides a method for manufacturing the above-mentioned backplane, which includes:
  • a substrate is provided, and the material of the substrate includes an aluminum alloy material
  • the punching process includes:
  • n times of stamping on the target area of the substrate, so that the target area of the substrate is stretched n times to form a bent portion; wherein, the via hole is located on the bent portion, and the bent portion is located on the bent portion
  • the coverage area on the plane where the substrate is located and the depth of the curved portion increase with the increase in the number of punching times, and the aperture of the via hole increases with the increase in the number of punching times; n is an integer greater than 1;
  • the n+3th stamping is performed on the target area to form the through hole; wherein, after the n+3th stamping, the side wall of the bent portion is formed as a hole wall of the through hole.
  • each time punching is performed on the target area of the substrate a punching pin is used, and the Rockwell hardness of the punching pin is in the range of [60, 68).
  • FIG. 1 is a schematic diagram of forming a via hole provided in an example.
  • Figure 2A is a plan view of a backplane provided in some embodiments of the present disclosure.
  • Fig. 2B is a cross-sectional view along line A-A' in Fig. 2A provided in some embodiments of the present disclosure.
  • FIG. 2C is a schematic diagram of warping of the bottom wall.
  • FIG. 3A is a schematic diagram of forming via holes provided in some embodiments of the present disclosure.
  • Figure 3B is a schematic diagram of the distribution of shiny rings and shiny bands provided in some embodiments of the present disclosure.
  • Fig. 4 is a cross-sectional view along line A-A' in Fig. 2A provided in some other embodiments of the present disclosure.
  • Fig. 5 is a cross-sectional view along line A-A' in Fig. 2A provided in some other embodiments of the present disclosure.
  • FIG. 6 is a schematic diagram of a backlight module provided in some embodiments of the present disclosure.
  • FIG. 7A is an enlarged view of area Q in FIG. 6 .
  • FIG. 7B is a partial side view of the sidewall and the glue frame of the backplane provided in some embodiments of the present disclosure.
  • FIG. 8A is a schematic diagram of a display device provided in some embodiments of the present disclosure.
  • FIG. 8B is a schematic diagram of a display device provided in other embodiments of the present disclosure.
  • FIG. 9 is a flow chart of a manufacturing method of a backplane provided in some embodiments of the present disclosure.
  • FIG. 10 is a schematic diagram of a process of forming a through hole using a punching process provided in some embodiments of the present disclosure.
  • FIG. 11 is a schematic diagram of a process of forming a through hole using a punching process provided in some other embodiments of the present disclosure.
  • FIG. 12 is a schematic diagram of specific operations of step S24 provided in some embodiments of the present disclosure.
  • the liquid crystal display device includes: a display panel, and a backlight module for providing backlight for the display panel.
  • the backlight module includes: a backplane, a light-emitting element, and an optical film set.
  • the backplane has a receiving space, and the light-emitting element and the optical film set At least a part of is disposed in the accommodation space.
  • FIG. 1 is a schematic diagram of the process of forming a through hole provided in an example. As shown in Fig. 1, the process of forming a through hole includes S01-S04:
  • the longitudinal section of the through hole 12 is, for example, rectangular.
  • the substrate 11a is made of stainless steel, so as to obtain a stainless steel back plate with through holes.
  • the tensile strength of the stainless steel substrate is between 900Mpa and 950Mpa
  • the yield strength is between 650Mpa and 680Mpa
  • the Vickers hardness is between 300HV and 330HV
  • the elongation is between 25% and 40%.
  • the thickness of 11a is 0.1 mm.
  • the stainless steel backplane is heavy, which does not meet the weight reduction requirements of electronic devices (eg, display screens, mobile terminals).
  • electronic devices eg, display screens, mobile terminals.
  • mobile terminals for example, mobile phones, tablet computers
  • the market has a strong demand for lightweight, so the backplane needs to be prepared with lighter materials.
  • FIG. 2A is a plan view of the backplane provided in some embodiments of the present disclosure
  • FIG. 2B is a cross-sectional view along line AA' in FIG. 2A provided in some embodiments of the present disclosure
  • the backboard includes: a bottom wall 11 and a through hole 12 disposed on the bottom wall 11 .
  • the backplane can be used in a display device, and at this time, the through hole 12 can be arranged opposite to an image acquisition device (such as a camera component) of the display device.
  • the through hole 12 has a hole wall 121 protruding toward the bottom wall 11 (that is, the hole wall 121 protrudes from the bottom wall 11 in the thickness direction of the bottom wall 11), and the hole wall 121 is connected to the bottom wall 11 as an integral structure.
  • the through hole 12 can be formed on the bottom wall 11 by a punching process.
  • the materials of the bottom wall 11 and the hole wall 121 both include aluminum alloy material.
  • the density of the aluminum alloy material is lower. Therefore, in the embodiment of the present disclosure, when the material of the bottom wall 11 and the hole wall 121 is made of an aluminum alloy material, the weight of the back plate can be reduced, thereby reducing the Displays the weight of the entire device. At the same time, the aluminum alloy has better thermal conductivity, which is beneficial to the heat dissipation of the display screen and surrounding electronic components.
  • the backboard may further include: a side wall 13, the side wall 13 is connected to the bottom wall 11 as an integral structure, and the side wall 13, the bottom wall 11 and the hole wall 121 define the accommodation space Sp , the accommodating space can be used to accommodate at least a part of the backlight source, such as a light-emitting element and a light guide plate; it can also be used to accommodate at least a part of the display panel.
  • the backlight source such as a light-emitting element and a light guide plate
  • the through hole 12 can be formed on the aluminum alloy substrate by using the punching process first; then, the edge of the substrate is bent, and the bent part is used as the side wall 13 of the backplane, and the unbent The folded part serves as the bottom wall 11 of the backboard. Since the tensile strength, yield strength, Vickers hardness and elongation of aluminum alloy materials are much lower than those of stainless steel, if the method shown in Figure 1 is used to make small-diameter through holes on the aluminum alloy substrate, it will lead to crack.
  • the embodiments of the present disclosure provide a method for manufacturing a through hole, by which a through hole can be formed on an aluminum alloy substrate, and hole cracks can be reduced, so as to realize the purpose of using an aluminum alloy material to make a backplane.
  • FIG. 3A is a schematic diagram of making a through hole provided in some embodiments of the present disclosure. As shown in FIG. 3A , the process of forming a through hole 12 using a punching process includes:
  • n is an integer greater than 1.
  • the target area of the substrate 11a is stretched multiple times, and then punched and shaped to obtain a through hole of the required size. 12.
  • the substrate 11a can be fully stretched, and the substrate 11a is gradually deformed, thereby reducing the internal stress during punching.
  • each stamping is performed by using a punching pin, wherein the hardness of the punching pin is greater than that of the substrate 11a, and since the punching pin is in contact with the substrate 11a every time, the substrate 11a is subjected to an instantaneous impulse, so , under the action of this impulsive force, a circle of imprints will be formed on the substrate, which is called a shiny ring. Understandably, the number of burnished rings is one less than the number of stampings. For example, when the number of stamping times is 6, the number of shiny rings is 5.
  • the above-mentioned steps S1-S4 are used to form the through hole 12, and n in the step S2 is greater than 1, and the number of stamping times is greater than 4 times. Therefore, the hole wall 121 of the finally formed through hole 12 has many shiny lines rings, the number of shiny rings is greater than 3. For example, the number of shiny rings is 4 or 5 or 6. Wherein, when n is larger or smaller, hole cracks may be caused. Preferably, when the above-mentioned n is 3, compared with n taking other values, the through hole 12 can have a higher production yield. At this time, the shiny The number of rings is 5.
  • Fig. 3B is a schematic diagram of the distribution of shiny rings and shiny bands provided in some embodiments of the present disclosure.
  • the shiny band 121a is located on the side of at least one shiny ring close to the bottom wall 11, and the width H4 of the shiny band 121a is greater than the width H5 of any one shiny ring 121b (or H6).
  • the shiny band 121a is formed by punching multiple times (for example, 2 or 3 times).
  • the ratio of the width H4 of the shiny band 121a to the width H5 (or H6) of any one of the shiny rings 121b is between [1.5, 4] range.
  • the ratio of the width H4 of the shiny band 121a to the width H5 (or H6) of any one of the shiny rings 121b is in the range of [2,4], compared to that of the shiny band
  • the through hole 12 can have a higher manufacturing yield.
  • the distance from the shiny band 121a away from one end of the bottom wall 11 to the surface of the back plate bottom wall 11 away from the shiny band 121a is 121a from the hole wall 121 to the bottom of the back plate.
  • the distance from the end of the shiny belt 121a away from the bottom wall 11 to the surface of the bottom wall 11 of the backboard away from the side of the shiny belt 121a is 0.4 times the distance H, and one end of the shiny ring 121b away from the bottom wall 11 is to
  • the distance between the bottom wall of the backboard 11 and the surface on the side away from the shiny belt 121a is 0.7H, and the distance from the end of the other shiny ring 121b away from the bottom wall 11 to the surface on the side of the bottom wall 11 away from the shiny belt 121a is 0.9H.
  • the above-mentioned punching process of the embodiments of the present disclosure may be suitable for making through-holes 12 with smaller apertures.
  • the cross-section of the through-holes 12 is circular, and the diameter of the through-holes 12 may be between 2.5 mm and 4.5 mm. between.
  • the hole diameter can be between 2.5mm and 2.8mm, or between 2.7mm and 2.8mm, or between 2.8mm and 3.5mm, or between 3.5mm and 3.8mm, or between 3.8mm and 4.0mm between, or between 4.0mm and 4.5mm.
  • the diameter of the through hole 12 is 2.5mm, or 2.6mm, or 2.7mm, or 2.8mm, or 2.9mm, or 3.0mm, or 3.1mm, or 3.2mm, or 3.3mm, or 3.4mm, or 3.5mm .
  • the longitudinal section of the through hole 12 may be rectangular, that is, the longitudinal section of the hole wall 121 is perpendicular to the bottom wall 11 . It should be noted that the "perpendicular" here means that the angle between the two structures is within the range of 90° ⁇ 3°.
  • the backplane in the embodiment of the present disclosure can be used in a display device, and at this time, the bottom wall 11 of the backplane is used to be arranged opposite to the display panel of the display device.
  • the display panel can be a self-luminous display panel such as an OLED display panel, a QLED display panel, a QD-OLED display panel, or a Mini-LED display panel.
  • the accommodation space Sp of the backplane is used to accommodate the above-mentioned self-luminous display panel at least part of .
  • the display panel is a liquid crystal display panel. At this time, at least a part of the backlight may be disposed in the accommodation space Sp of the back panel.
  • the backlight may be an edge-type backlight or a direct-type backlight.
  • the backlight includes a light guide plate and a light bar.
  • the light guide plate is at least partly located in the accommodation space Sp, wherein an avoidance hole is arranged on the light guide plate, and the hole wall 121 passes through the avoidance hole.
  • the backlight source is a direct-type backlight source
  • the backlight source includes a direct-type lamp board on which self-luminous point light sources can be arranged in an array. hole, the hole wall 121 passes through the avoidance hole.
  • the accommodating space Sp is used to accommodate the backlight source and the optical film set
  • the optical film set may include a plurality of optical films
  • each optical film may be provided with an avoidance hole
  • the hole wall 121 passes through the avoidance hole. hole.
  • the height of the hole wall 121 is defined as the vertical distance h0 between the position of the hole wall 121 farthest from the bottom wall 11 of the backplane and the bottom wall 11 of the backplane.
  • the height of the hole wall 121 may be between 0.65 mm and 0.78 mm, so as to facilitate the hole wall 121 to pass through the avoidance hole on each optical film, thereby keeping each optical film stable.
  • the height of the hole wall 121 is set to be slightly higher than that of the kth optical film from the side away from the bottom wall of the backplane to the backplane.
  • This setting can try to prevent the light from the light source from entering the avoidance hole.
  • this design can prevent the light from the backlight from causing crosstalk to the optical collection.
  • the height of the hole wall 121 can be set between 0.65 mm and 0.72 mm, for example, the height of the hole wall 121 is 0.65 mm, or 0.67 mm, or 0.69 mm, or 0.70 mm, or 0.72 mm;
  • the multiple optical films of the optical film group include: a reflection sheet, a light guide plate, a diffusion film and two prism films, the reflection sheet, light guide plate, diffusion film and two prism films are sequentially stacked on the bottom wall 11 of the backplane
  • the height of the hole wall 121 can be set between 0.72 mm and 0.78 mm, for example, the height of the hole wall 121 is 0.72 mm, or 0.75 mm, or 0.77 mm, or 0.78 mm.
  • the side of the backlight away from the bottom wall of the backplane is the side of the light guide plate away from the bottom wall 11 of the backplane; when the backlight is a direct-type backlight, the backlight The side of the source away from the bottom wall 11 of the back panel is the light output side of the lamp panel.
  • the height of the hole wall 121 is slightly smaller than the distance of the surface of the plastic frame 15 facing away from the bottom wall 11 to the bottom wall 11, which can prevent the hole wall 121 from causing a large pressure on the display panel after the display panel 30 and the backlight module are assembled.
  • the height of the hole wall 121 is denoted as h0
  • the distance from the side of the k-th optical film away from the bottom wall of the backplane to the bottom wall 11 of the backplane is denoted as h1
  • the surface of the plastic frame 15 away from the bottom wall 11 is denoted by the bottom wall 11
  • the distance of is recorded as h2, then h2>h0>h1.
  • (h0-h1) is not greater than 0.05mm
  • (h2-h1) ranges from 0.015mm to 0.03mm.
  • the tensile strength of the bottom wall 11 is between 320Mpa and 390Mpa, the yield strength is between 200Mpa and 270Mpa, the Vickers hardness is between 100HV and 120HV, and the elongation is between 12% and 20%.
  • the thickness of the bottom wall 11 is between 0.09mm ⁇ 1.01mm, and the thickness of the hole wall 121 is between 0.050mm ⁇ 0.081mm, so that the bottom wall 11 has a strong tensile strength and a high elongation, so as to reduce or Prevent poor hole cracking.
  • the tensile strength of the bottom wall 11 is between 320Mpa-330Mpa, or between 330Mpa-350Mpa, or between 350Mpa-360Mpa, or between 360Mpa-370Mpa, or between 370Mpa-390Mpa.
  • the tensile strength of the bottom wall 11 is 320Mpa, or 325Mpa, or 330Mpa, or 335Mpa, or 340MPa, or 350Mpa, or 355Mpa, or 360Mpa, or 365Mpa, or 370Mpa, or 375Mpa, or 380Mpa, or 385Mpa, or 390Mpa .
  • the yield strength of the bottom wall 11 is between 200Mpa-230Mpa, or between 230Mpa-250Mpa, or between 250Mpa-270Mpa.
  • the yield strength of the bottom wall 11 is 200Mpa, or 210Mpa, or 220Mpa, or 230Mpa, or 240Mpa, or 250Mpa, or 260Mpa, or 270Mpa.
  • the Vickers hardness of the bottom wall 11 is between 100HV-105HV, or between 105HV-110HV, or between 110HV-115HV, or between 115HV-120HV.
  • the Vickers hardness of the bottom wall 11 is 100HV, or 103HV, or 105HV, or 107HV, or 110HV, or 112HV, or 115HV, or 118HV, or 120HV.
  • the elongation of the bottom wall 11 is between 12%-15%, or between 15%-18%, or between 18%-20%.
  • the elongation rate of the bottom wall 11 is 12%, or 13%, or 14%, or 15%, or 16%, or 17%, or 18%, or 19%, or 20%.
  • the thickness of the bottom wall 11 is in the range of 0.095 mm to 1.005 mm
  • the thickness of the hole wall 121 is in the range of 0.05 mm to 0.06 mm, or in the range of 0.06 mm to 0.07 mm, or in the range of 0.07 mm to 0.081 mm.
  • the thickness of the bottom wall 11 is 0.09mm, or 0.095, or 0.1mm, or 0.105mm; the thickness of the hole wall 121 is, for example, 0.05mm, or 0.06mm, or 0.061mm, or 0.065mm, or 0.07 mm, or 0.081mm.
  • the tensile strength of the bottom wall 11 is 374MPa, the yield strength is 262, the Vickers hardness is 115HV, the elongation is 18.1%, the thickness of the bottom wall 11 is between 1.0mm, and the thickness of the hole wall 121 is 0.061mm, Therefore, the bottom wall 11 can be fully stretched, and the situation of hole cracking can be reduced to the greatest extent.
  • the material of the bottom wall 11 can be aluminum-magnesium alloy.
  • the use of aluminum-magnesium alloy can improve the strength and surface hardness of the bottom wall 11 and reduce the rate of defective scratches.
  • the inventors of the present disclosure have carried out experimental verification on the yield rate of the through holes 12 produced in steps S1-S4, wherein the tensile strength of the bottom wall 11 is 374MPa, the yield strength is 262, the Vickers hardness is 115HV, and the elongation rate is 18.1 %, the thickness of the bottom wall 11 is between 1.0 mm, the longitudinal section of the through hole 12 is rectangular, and the diameter of the through hole 12 is 2.94 mm.
  • the thickness of the hole wall 121 is 0.061mm, indicating that the material has been fully stretched during the stretching process.
  • the defect rate of hole cracks is lower. significantly reduce.
  • a first groove V1 is provided on the bottom wall 11 near the hole wall 121 .
  • the first groove V1 may be adjacent to the hole wall 121 , that is, there is no space between the first groove V1 and the hole wall 121 .
  • the first groove V1 can prevent the hole wall 121 from rebounding after the through hole 12 is formed on the substrate.
  • the first groove V1 can be formed on the bottom wall 11 by using a ribbing process.
  • the first groove V1 may be an annular structure surrounding the through hole 12 .
  • the width and depth of the first groove V1 are small, it is not enough to reduce the resilience of the hole wall 121; and when the width and depth of the first groove V1 are large, the first groove is formed by the embossing process. In the process of V1, it is easy to cause deformation of the bottom wall 11.
  • the width of the first groove V1 is between 0.08 mm and 0.12 mm, and the depth of the first groove V1 is between 0.01 mm and 0.02 mm, so as to minimize the hole wall 121 Resilience, prevent deformation of the bottom wall 11, and improve the flatness of the surface of the bottom wall 11 away from the display panel.
  • the width of the first groove V1 is 0.08mm, or 0.09mm, or 0.1mm, or 0.11mm, or 0.12mm; the depth of the first groove V1 is 0.01mm, or 0.012mm, or 0.014mm, Or 0.016mm, or 0.018mm, or 0.02mm.
  • a second groove V2 can be provided on the bottom wall 11 near the sidewall 13 , and the second groove V2 can be in contact with the sidewall 13 .
  • the width of the second groove V2 is between 0.08 mm and 0.12 mm, and the depth of the second groove V2 is between 0.01 mm and 0.02 mm, so as to minimize the resilience of the side wall 13 and improve The flatness of the surface of the bottom wall 11 away from the display panel.
  • the flatness requirements of the surface of the bottom wall 11 facing away from the accommodating space are as follows:
  • the distance between the carrying platform is no more than 0.1mm, and the distance between the warped position on the bottom surface of the bottom wall 11 and the carrying platform is no more than 0.8mm.
  • FIG. 2C is a schematic diagram of the warping of the bottom wall. As shown in FIG. 2C , the warping position A of the bowl is located at the edge of the bottom wall 11 , and the warping position B is located in the middle of the bottom wall 11 , which is crest-shaped.
  • FIG. 4 is a cross-sectional view along line AA' in FIG. 2A provided in other embodiments of the present disclosure.
  • the structure shown in FIG. 4 is similar to that in FIG. 2B.
  • a through hole is provided on the bottom wall 11 12.
  • the hole wall 121 of the through hole 12 is connected with the bottom wall 11 as an integral structure, and the materials of the bottom wall 11 and the hole wall 121 of the through hole 12 both include aluminum alloy material.
  • the longitudinal section of the through hole 12 is rectangular.
  • a first groove V1 and a second groove V2 may be disposed on the bottom wall 11 .
  • the end of the hole wall 121 away from the bottom wall 11 is provided with a bent portion 122 , and the bent portion 122 is integrally formed with the hole wall 121 and extends toward the middle of the through hole 12 .
  • the bent portion 122 Through the arrangement of the bent portion 122, the stress on the top of the hole wall 121 can be further reduced, thereby further reducing the occurrence of hole cracks.
  • the height h0 of the hole wall 121 should be understood as the distance from the farthest point of the bent portion 122 to the bottom wall 11 of the backplane to the backplane. The distance from the board bottom wall 11.
  • the bending portion 122 is a ring structure, so as to reduce the stress on the top of the hole wall 121 and make it more uniform.
  • the width of the annular structure is between 0.05 mm and 0.15 mm, so as to minimize the stress on the end of the hole wall 121 away from the bottom wall 11 and reduce the failure of hole cracks.
  • the width of the annular structure is 0.05 mm or 0.08 mm or 0.1 mm or 0.12 mm or 0.15 mm.
  • the ring structure may be parallel or substantially parallel to the bottom wall 11 , that is, the angle between the plane where the ring structure is located and the plane where the bottom wall 11 is located is between 0° ⁇ 5°.
  • n in step S2 is 2, 3 or 4, that is, correspondingly, the through hole in FIG. 4 is formed by 5, 6 or 7 times of punching.
  • every adjacent two of the shiny rings formed in step S2 are in contact with each other or partially overlap, so as to form a shiny band. That is, the shiny rings formed by punching each time in step S2 constitute the shiny bands. At this time, there is a shiny ring and a shiny band on the hole wall 121 , and the shiny band is located on the side of the shiny ring close to the bottom wall 11 .
  • the width of the burnished band is greater than the width of the burnished ring.
  • the shiny strip is formed by two or three stampings, and at this time, the ratio of the width of the shiny strip to the width of any one of the shiny rings is in the range of [1.5, 4].
  • the shiny band is formed by 3 stampings. At this time, the ratio of the width of the shiny band to the width of the shiny ring is in the range of [2, 4]. At this time, compared with other stamping times, the shiny band is formed, and it can be obtained Highest production yield of vias 12 .
  • the measured results of the through hole 12 shown in Figure 4 are as follows: the tensile strength of the bottom wall 11 is 374MPa, the yield strength is 262, the Vickers hardness is 115HV, the elongation is 18.1%, and the thickness of the bottom wall 11 is less than 1.0mm. Between, the longitudinal section of the through hole 12 is rectangular, and the diameter d0 of the through hole 12 is 2.94 mm, the bent portion 122 is annular, the width of the bent portion 122 is 0.1 mm, and the height of the hole wall 121 is 0.69 mm.
  • step S2 is 3
  • the thickness of the hole wall 121 is 0.065 mm, and the defect rate of hole cracking is further reduced.
  • the diameter thereof is the inner diameter of the hole wall 121 (for example, the dimension indicated by d0 in FIG. 4 ), regardless of the bent portion 122 .
  • Fig. 5 is a cross-sectional view along line AA' in Fig. 2A provided in some other embodiments of the present disclosure.
  • Fig. 5 is similar to the structure shown in Fig. 2B.
  • a through hole is provided on the bottom wall 11 12.
  • the hole wall 121 of the through hole 12 is connected with the bottom wall 11 as an integral structure, and the materials of the bottom wall 11 and the hole wall 121 of the through hole 12 both include aluminum alloy material.
  • a first groove V1 and a second groove V2 may be disposed on the bottom wall 11 .
  • the longitudinal section of the through hole 12 is trapezoidal, and the trapezoid has two top corners (a1 and a2 as shown in FIG. 5 ) and two bottom corners (b1 and b2 as shown in FIG. 5 ), each Each top angle is greater than 90°, and each bottom angle is between 80° and 90°, so as to improve the stability of the through hole 12 .
  • the opening diameter d1 of the end of the through hole 12 close to the bottom wall 11 can be the same as that of the through hole 12 in FIG. Between 0.05 mm and 0.15 mm, for example, the difference between d2 and d1 is 0.05 mm or 0.08 mm or 0.1 mm or 0.12 mm or 0.15 mm.
  • the shiny ring formed on the hole wall 121 may be similar to the shiny ring on the hole wall 121 in FIG. 3B .
  • the through hole 12 in FIG. 5 is formed through the above steps S1-S4, and the number of shiny rings on the hole wall 121 is one less than the punching times. For example, when the punching times are 6 times, the number of shiny rings for 5.
  • n in step S2 is greater than 1, and the number of stamping times is greater than 4. Therefore, the hole wall 121 of the finally formed through hole 12 has multiple shiny rings, and the number of shiny rings is greater than 3.
  • n 3. Compared with n taking other values, the highest production yield of the through hole 12 can be obtained, and the number of shiny rings is 5 at this time.
  • the shiny band when at least two of the shiny rings formed in step S2 are close to each other, they will touch or partially overlap, thereby forming a shiny band.
  • the shiny band is located on the side of the at least one shiny ring close to the bottom wall 11, and the width of the shiny band is greater than the width of any shiny ring.
  • the shiny strip is formed by two or three stampings, and at this time, the ratio of the width of the shiny strip to the width of any one of the shiny rings is in the range of [1.5, 4]. For example, there are two shiny rings and a shiny band on the hole wall 121 .
  • the shiny band is formed by punching three times. At this time, the ratio of the width of the shiny band to the width of any shiny ring is in the range of [2, 4]. At this time, compared with other stamping times, the shiny band can be obtained. Highest production yield of vias 12 .
  • the measured results of the through hole 12 shown in Figure 5 are as follows: the tensile strength of the bottom wall 11 is 374MPa, the yield strength is 262Mpa, the Vickers hardness is 115HV, the elongation is 18.1%, and the thickness of the bottom wall 11 is less than 1.0mm. Between, the longitudinal section of the through hole 12 is trapezoidal, and the opening diameter of the end of the through hole 12 close to the bottom wall 11 is 2.94 mm, the opening diameter of the end of the through hole 12 away from the bottom wall 11 is 2.74 mm, and the height of the hole wall 121 is 0.69 mm .
  • step S2 When the above-mentioned punching process described in steps S1 to S4 is adopted, and n in step S2 is 3, the thickness of the hole wall 121 is 0.063 mm, and the detection defect rate of hole cracks is further reduced compared with the shape in FIG. 2 .
  • the end of the hole wall 121 away from the bottom wall 11 is provided with a bent portion, and the bent portion forms an integral structure with the hole wall 121 and extends toward the middle of the through hole 12 .
  • This structure can further reduce the stress on the top of the hole wall 121 , reduce the occurrence of hole cracks, and improve the yield.
  • FIG. 6 is a schematic diagram of a backlight module provided in some embodiments of the present disclosure. As shown in FIG. 6 , the backlight module includes the backplane provided in the above embodiments.
  • the backlight module also includes: a backlight, the backlight can emit light and an optical film set. At least a part of the optical film group is located in the accommodation space of the backplane.
  • the optical film set 20 includes a plurality of optical films, and the plurality of optical films may include: a reflective sheet 24 , a light guide plate 23 , a diffusion film 22 and a prism film 21 arranged in sequence along a direction away from the bottom wall 11 . At least a part of the light emitting member, the reflective sheet 24 and the light guide plate 23 are located in the accommodation space.
  • Each optical film is provided with an escape hole, and the hole wall 121 of the through hole 12 on the back plate passes through the escape hole of each optical film.
  • FIG. 7A is an enlarged view of area Q in FIG. 6 .
  • the backlight module further includes: a plastic frame 15 arranged around the optical film group 20 .
  • the side wall 13 of the backboard has: a first side 131, a second side 132 and a top surface 133, the first side 131 is opposite to the second side 132, the first side 131 faces the accommodating space, and the top surface 133 connects all The first side 131 and the second side 132 are described above.
  • the plastic frame 15 is in contact with both the first side surface 131 and the top surface 133 of the side wall 13 of the backplane.
  • a part of the plastic frame 15 is located inside the side wall 13 of the backboard and attached to the first side 131 ; the other part is supported on the top surface 133 of the side wall 13 .
  • the plastic frame 15 may be formed on the back plate by injection molding.
  • Fig. 7B is a partial side view of the side wall and the plastic frame of the back plate provided in some embodiments of the present disclosure.
  • the side wall 13 of the back plate is provided with a glue injection hole 13a, which can be used during injection molding. Glue is injected into the side wall 13 through the glue injection hole 13 a to form the glue frame 15 .
  • the bottom wall 11 of the backplane is provided with a first Three grooves V3 , a part of the glue frame 15 is filled in the third groove V3 , at least a part of the third groove V3 is located on one side of the glue injection hole 13 a along the thickness direction of the side wall 13 . That is, at least a part of the third groove V3 overlaps with the glue injection hole 13a in the thickness direction of the side wall 13, so that the path for external water vapor to penetrate into the backlight module from the glue injection hole is extended, and the glue frame 15 extends into the backlight module.
  • the part of the third groove V3 can effectively block water vapor, thereby preventing the structure in the accommodation space from being corroded by external water vapor.
  • the width of the third groove V3 is between 0.1mm-0.2mm, and the depth is between 0.01mm-0.02mm, so as to improve the water and oxygen barrier capability of the backlight module.
  • the third groove V3 may be an annular structure surrounding the optical film set 20 .
  • FIG. 8A is a schematic diagram of a display device provided in some embodiments of the present disclosure. As shown in FIG. 8A , the display device includes the above-mentioned backplane and a display panel 30 , and the display panel 30 is disposed opposite to the bottom wall 11 of the backplane.
  • the display panel 30 is a liquid crystal display panel, which specifically includes: an array substrate 31, a color filter substrate 32, a first polarizer 33 and a second polarizer 34, an array substrate 31 and a
  • the color filter substrate 32 is disposed opposite to each other, the first polarizer 33 is located on the side of the array substrate 31 away from the color filter substrate 32 , and the second polarizer 34 is located on the side of the color filter substrate 32 away from the array substrate 31 .
  • the display panel 30 is a liquid crystal display panel
  • the display device further includes a backlight, and at least a part of the backlight is disposed in the accommodation space of the backplane.
  • the backlight at least a part of the backlight is disposed in the accommodation space of the backplane.
  • the display device includes: a display area DA, a first non-display area NA1 and a second non-display area NA2, wherein the display area DA surrounds the first non-display area NA1, and the second non-display area NA2 surrounds the display area da.
  • the first non-display area NA1 includes: a light-transmitting sub-area TA and a light-shielding sub-area SA surrounding the light-transmitting sub-area TA, the hole wall 121 of the through hole 12 is located in the light-shielding sub-area SA, and the glue frame 15 is located in the second non-display area NA2.
  • Both the first polarizer 33 and the second polarizer 34 are provided with hollow structures, and the hollow structures on the first polarizer 33 and the second polarizer 34 at least cover the light-transmitting sub-area TA.
  • a first light-shielding layer 61 and a second light-shielding layer 62 are disposed between the display panel and the backlight module.
  • the first light-shielding layer 61 is located in the light-shielding sub-area SA to prevent light leakage at the through hole 12 .
  • the orthographic projection of the first light-shielding layer 61 on the display panel may be within the range of the orthographic projection of the backplane on the display panel 30 , or may exceed the orthographic projection of the backplane on the display panel 30 . For example, when the backplane adopts the structure in FIG.
  • the orthographic projection of the first light-shielding layer 61 on the display panel 30 may exceed the orthographic projection of the inner edge of the bent portion 122 on the display panel 30, and the width of the excess part is less than or Equal to 0.12mm.
  • the orthographic projection of the first light-shielding layer 61 on the display panel 30 may exceed the orthographic projection of the inner edge of the hole wall 121 on the display panel 30, and the width of the excess part is less than or equal to 0.12mm .
  • the second light-shielding layer 62 is located in the second non-display area, and the orthographic projection of the second light-shielding layer 62 on the display panel 30 covers the orthographic projection of the plastic frame 15 on the display panel 30, and the second light-shielding layer 62 is used to prevent the display panel 30 from Light leakage occurs at the edges.
  • the hole wall 121 of the through hole 12 of the back plate is provided with an adhesive 40, and the adhesive 40 fixes and bonds the hole wall 121 of the through hole 12 with the display panel 30, and the orthographic projection of the adhesive 40 on the display panel 30 It is ring-shaped and surrounds the light-transmitting sub-area TA.
  • the inner diameter of the adhesive 40 is the diameter of the light-transmitting sub-area TA.
  • the inner diameter of the adhesive 40 is between 2.15mm and 4.15mm, for example, the inner diameter of the adhesive 40 is 2.15mm, or 2.2mm, or 2.24mm, or 2.3mm, or 2.5mm, or 2.6mm , or 2.7mm, or 2.8mm, or 2.9mm, or 3.0mm, or 3.1mm, or 3.2mm, or 3.3mm, or 3.4mm, or 3.5mm, or 3.6mm, or 3.7mm, or 3.8mm, or 3.9mm, or 4.0mm, or 4.1mm, or 4.15mm.
  • the inner diameter of the adhesive 40 is 2.15mm, or 2.2mm, or 2.24mm, or 2.3mm, or 2.5mm, or 2.6mm , or 2.7mm, or 2.8mm, or 2.9mm, or 3.0mm, or 3.1mm, or 3.2mm, or 3.3mm, or 3.4mm, or 3.5mm, or 3.6mm, or 3.7mm, or 3.8mm, or 3.9mm, or 4.0mm, or 4.1mm, or 4.15
  • the adhesive 40 includes a first bonding portion 41 and a second bonding portion 42, the first bonding portion 41 is bonded to the first light shielding layer 61, the first polarizer 33 and the array substrate 31,
  • the second bonding part 42 is bonded to the first bonding part 41 , the first light shielding layer 61 and the hole wall 121 .
  • the orthographic projection of the second bonding portion 42 on the display panel 30 is ring-shaped, and the width of the ring can be in contact with the first bonding portion 41, so that the second bonding portion 42 and the first bonding portion 41 are opposite to the through hole 12. The edges are wrapped.
  • both the first bonding part 41 and the second bonding part 42 can be light-shielding glue, so as to prevent light leakage at the through hole 12 .
  • both the first bonding part 41 and the second bonding part 42 may use black light-shielding glue.
  • first bonding part 41 and the second bonding part 42 can be formed twice, specifically, in the assembly process of the display device, the first bonding part 41 can be formed on the display panel 30 first, Then the display panel 30 is fixedly connected with the backlight module; after that, the second bonding part 42 is formed.
  • the display device may further include a cover plate 51 and an optical adhesive layer 50 , the cover plate 51 is located on the side of the display panel 30 away from the backlight module, and the cover plate 51 is bonded to the display panel 30 through the optical adhesive layer 50 .
  • FIG. 8B is a schematic diagram of a display device provided in other embodiments of the present disclosure.
  • the display device includes the above-mentioned backplane and a display panel 30 , and the display panel 30 is disposed opposite to the bottom wall 11 of the backplane.
  • the display panel may be a self-luminous display panel such as an OLED display panel, a QLED display panel, a QD-OLED display panel, or a Mini-LED display panel. At this time, at least a part of the display panel may be disposed in the accommodation space of the backplane.
  • the display panel 30 is provided with an installation hole, and the hole wall 121 of the through hole 12 passes through the installation hole.
  • the display device also includes a cover plate 51, and the cover plate 51 is arranged on the light-emitting side of the display panel 30.
  • the hole wall of the through hole is provided with light-shielding adhesive glue, and the adhesive glue connects the hole wall 121 of the through hole with the cover plate 51.
  • the orthographic projection of the adhesive 40 on the cover plate 51 is a ring structure, and the inner diameter of the ring structure is between 2.15 mm and 4.15 mm.
  • Embodiments of the present disclosure also provide a method for manufacturing the above-mentioned backboard.
  • FIG. 9 is a flow chart of the method for manufacturing the backboard provided in some embodiments of the present disclosure. As shown in FIG. 9 , the method for manufacturing the backboard includes:
  • a substrate is provided, and the material of the substrate includes an aluminum alloy material, such as an aluminum-magnesium alloy.
  • Step S20 using a punching process to form a through hole on the substrate, the through hole including a hole wall protruding toward one side of the substrate.
  • FIG. 10 is a schematic diagram of the process of forming a through hole using a punching process provided in some embodiments of the present disclosure
  • FIG. 11 is a schematic diagram of a process of forming a through hole using a punching process provided in other embodiments of the present disclosure.
  • Step S20 includes :
  • n is an integer greater than 1
  • the coverage of the curved portion 12b refers to the orthographic projection range of the curved portion 12b on the reference plane, taking the plane where the unbent portion of the substrate 11a is located as the reference plane.
  • n 3. Compared with n taking other values, the highest production yield of the through hole 12 can be obtained.
  • n in step S22 can be between 2 and 5, so that the substrate 11a can be fully stretched.
  • n is 3, so that the substrate 11a can be fully stretched while preventing the process from being too complicated.
  • each punch is performed with a punch, which can be different for each punch.
  • FIG. 12 is a schematic diagram of the specific operation of step S24 provided in some embodiments of the present disclosure.
  • the substrate 11a is placed on the die insert 80 with the receiving hole 80v,
  • the bent portion 12b is located in the receiving hole 80v, and the bent portion 12b is punched by the punching needle 70 to adjust the shape of the bent portion 12b.
  • the bent portion 12b A certain gap is formed between the end away from the via hole 12 a and the punching pin 70 , so as to prevent the punching pin 70 from over-pressing the bent portion 12 b and causing cracks in the bent portion 12 .
  • the thickness of the substrate 11a is 0.1mm
  • FIG. 12 only uses step S24 as an example, and similar operations can be used for each stamping in other steps. The difference may be that the shape of the punching needle used may be different from that in FIG. 12 .
  • the substrate 11 a is rotary cut by punching and rotary cutting, so as to form a bent portion on the wall of the through hole. It should be noted that during the rotary cutting process, the edge of the bent portion is likely to form burrs extending along the height direction of the through hole. In order to prevent the burrs from affecting the display panel 30, the burrs can be reduced by controlling the process parameters during rotary cutting. The height is controlled at less than or equal to 0.05mm. For the through holes shown in FIG. 5 , in step S24 , the substrate 11 a can be punched by punching, and rotary cutting is not required.
  • each punching pin has a Rockwell hardness within the range of [60, 68), so as to reduce the fatigue stress of the aluminum alloy material during the process.
  • each punch has a Rockwell hardness of 60 or 62 or 64 or 66.
  • each punch pin has a Rockwell hardness of 64, so as to minimize the fatigue stress of the aluminum alloy material during the process.
  • the height difference between any two of the four preset reference points at the top of the hole wall can be made to be less than or equal to 0.03 mm by controlling the process parameters during each stamping.
  • the preset reference point is a reference point on the top surface of the hole wall (ie, the end surface of the hole wall facing the display panel), and the four preset reference points are evenly distributed along the circumference of the through hole.

Abstract

本公开提供了一种背板，用于显示装置中，其中，所述背板包括：底壁；设置在底壁上的通孔，所述通孔具有朝向所述底壁一侧突出的孔壁，所述孔壁与所述底壁连接为一体结构；其中，所述底壁和所述孔壁的材料均包括铝合金材料。本公开还提供了一种背板的制作方法、背光模组、显示装置。

Description

背板及其制作方法、背光模组、显示装置 技术领域
本公开涉及显示技术领域，具体涉及一种背板及其制作方法、背光模组、显示装置。
背景技术
液晶显示装置包括：显示面板、用于为显示面板提供背光的背光模组，背光模组包括：背板、发光件和光学膜片组，背板具有容纳空间，发光件和光学膜片组的至少一部分设置在容纳空间中。在一些显示装置(例如手机)中，需要在背板上形成通孔，该通孔与显示装置的图像采集器件相对。
发明内容
本公开实施例提出了一种背板及其制作方法、背光模组、显示装置。
为了实现上述目的，本公开提供一种背板，用于显示装置中，其中，所述背板包括：
底壁；
设置在底壁上的通孔，所述通孔具有朝向所述底壁一侧突出的孔壁，所述孔壁与所述底壁连接为一体结构；
其中，所述底壁和所述孔壁的材料均包括铝合金材料。
在一些实施例中，所述底壁的抗拉强度在320Mpa～390Mpa之间，屈服强度在200Mpa～270Mpa之间，维氏硬度在100HV～120HV之间，延伸率在12％～20％之间。
在一些实施例中，所述底壁的厚度在0.09mm～1.01mm之间，所述孔壁的厚度在0.050mm～0.081mm之间。
在一些实施例中，所述孔壁远离所述底壁的一端设置有弯折部，所述 弯折部与所述孔壁形成为一体结构，并朝向所述通孔中部延伸。
在一些实施例中，所述通孔的纵截面为矩形。
在一些实施例中，所述弯折部为环形结构，所述弯折部的宽度在0.05mm～0.15mm之间。
在一些实施例中，所述通孔的纵截面为梯形，所述梯形具有两个顶角和两个底角，每个所述顶角大于90°，每个所述底角在80°～90°之间。
在一些实施例中，所述孔壁上具有多条锃亮环，所述锃亮环的数量大于3。
在一些实施例中，所述锃亮环的数量为4或5。
在一些实施例中，所述孔壁上具有至少一条锃亮环以及一条锃亮带，所述锃亮带位于所述至少一条锃亮环靠近底壁的一侧，所述锃亮带的宽度大于任意一条锃亮环的宽度。
在一些实施例中，所述锃亮带的宽度与所述任意一条锃亮环的宽度之比在[1.5，4]范围内。
在一些实施例中，所述通孔远离所述底壁的一端的口径在2.5mm～4.5mm之间。
在一些实施例中，所述底壁上靠近所述孔壁的位置设置有第一凹槽。
在一些实施例中，所述第一凹槽的宽度在0.08mm～0.12mm之间，所述第一凹槽的深度在0.01mm～0.02mm之间。
在一些实施例中，所述背板还包括侧壁，所述侧壁与所述底壁连接为一体结构，所述侧壁、所述底壁和所述孔壁限定出容纳空间。
在一些实施例中，所述底壁上靠近所述侧壁的位置设置有第二凹槽。
在一些实施例中，所述背板用于显示装置中，所述底壁用于与所述显示装置的显示面板相对设置。
本公开实施例还提供一种背光模组，包括上述的背板，所述背光模组还包括：背光源，所述背光源的至少一部分位于所述容纳空间内。
在一些实施例中，所述背板的侧壁具有：第一侧面、第二侧面和顶面，所述第一侧面与第二侧面相对，所述第一侧面朝向所述容纳空间，所述顶面连接所述第一侧面与所述第二侧面，
所述背光模组还包括：胶框，所述胶框环绕所述背光源，并与所述背板侧壁的第一侧面和顶面均接触。
在一些实施例中，所述侧壁与所述底壁的交界处设置有注胶孔，所述底壁朝向所述容纳空间的表面上设置有第三凹槽，所述胶框的一部分填充在所述第三凹槽中，所述第三凹槽的至少一部分位于所述注胶孔沿所述侧壁厚度方向的一侧。
本公开实施例还提供一种显示装置，包括：上述的背板和显示面板，所述显示面板与所述背板的底壁相对设置。
在一些实施例中，所述背板的通孔的孔壁上设置有粘结胶，所述粘结胶将所述通孔的孔壁与所述显示面板固定粘结，所述粘结胶在所述显示面板上的正投影为环形结构，所述环形结构的内径在2.15mm～4.15mm之间；或者，
所述显示装置还包括：盖板，所述盖板设置在所述显示面板的出光侧，所述显示面板上设置有安装孔，所述通孔的孔壁穿过所述安装孔，所述通孔的孔壁上设置有粘结胶，所述粘结胶将所述通孔的孔壁与所述盖板固定粘结，所述粘结胶在所述盖板上的正投影为环形结构，所述环形结构的内径在2.15mm～4.15mm之间。
本公开实施例还提供一种上述背板的制作方法，其中，包括：
提供基板，所述基板的材料包括铝合金材料；
利用冲孔工艺在所述基板上形成通孔，所述通孔具有朝向所述基板一侧突出的孔壁；
其中，所述冲孔工艺包括：
对所述基板的目标区域进行第一次冲压，形成贯穿所述基板的过孔；
对所述基板的目标区域进行n次冲压，以使所述基板的目标区域受到n次拉伸，并形成弯曲部；其中，所述过孔位于所述弯曲部上，所述弯曲部在所述基板所在平面上的覆盖范围、所述弯曲部的深度随冲压次数的增加而增大，所述过孔的孔径随冲压次数的增加而增加；n为大于1的整数；
对受到n次拉伸后的目标区域进行第n+2次冲压，以使所述弯曲部的覆盖范围和深度、所述过孔的孔径达到目标要求；
对所述目标区域进行第n+3次冲压，以形成所述通孔；其中，经过第n+3次冲压后，所述弯曲部的侧壁形成为所述通孔的孔壁。
在一些实施例中，2≤n≤5。
在一些实施例中，对所述基板的目标区域进行每次冲压时，均采用冲针进行操作，所述冲针的洛氏硬度在[60，68)范围内。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1为一示例中提供的形成通孔的示意图。
图2A为本公开的一些实施例中提供的背板的平面图。
图2B为本公开的一些实施例中提供的沿图2A中A-A’线的剖视图。
图2C为底壁的翘曲示意图。
图3A为本公开的一些实施例中提供的制作通孔的示意图。
图3B为本公开的一些实施例中提供的锃亮环和锃亮带的分布示意图。
图4为本公开的另一些实施例中提供的沿图2A中A-A’线的剖视图。
图5为本公开的再一些实施例中提供的沿图2A中A-A’线的剖视图。
图6为本公开的一些实施例中提供的背光模组的示意图。
图7A为图6中Q区域的放大图。
图7B为本公开的一些实施例中提供的背板的侧壁和胶框的局部侧视图。
图8A为本公开的一些实施例中提供的显示装置的示意图。
图8B为本公开的另一些实施例中提供的显示装置的示意图。
图9为本公开的一些实施例中提供的背板的制作方法流程图。
图10为本公开的一些实施例中提供的利用冲孔工艺形成通孔的过程示意图。
图11为本公开的另一些实施例中提供的利用冲孔工艺形成通孔的过程示意图。
图12为本公开的一些实施例中提供的步骤S24的具体操作示意图。
具体实施方式
以下结合附图对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
除非另作定义，本公开实施例使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“连接”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
液晶显示装置包括：显示面板、用于为显示面板提供背光的背光模组， 背光模组包括：背板、发光件和光学膜片组，背板具有容纳空间，发光件和光学膜片组中的至少一部分设置在容纳空间中。在一些显示装置(例如手机)中，需要在背板上形成通孔，该通孔可以与显示装置的图像采集器件相对。
在制备背板时，可以在基板上形成通孔，并将基板的边缘弯折，形成背板的侧壁。图1为一示例中提供的形成通孔的过程示意图，如图1所示，形成通孔的过程包括S01～S04：
S01、在基板11a上的目标区域进行第一次冲压，形成贯穿基板11a的过孔12a。
S02、对基板11a的目标区域进行第二次冲压，从而使基板11a受到拉伸，从而形成弯曲部12b。
S03、对基板11a的目标区域进行第三次冲压，从而使弯曲部12b的覆盖范围和深度、过孔12a的孔径均达到目标要求。
S04、对目标区域进行第四次拉伸，以形成通孔12。其中，通孔12的纵截面例如为矩形。
当采用图1所示的方法在基板上制作通孔时，对基板的抗拉强度、屈服强度、维氏硬度和延伸率的要求较高，这样，在制作小孔径(例如孔径小于4.0mm)的通孔时，才不会出现孔裂。因此，在相关技术中，基板11a采用不锈钢制成，从而得到具有通孔的不锈钢背板。在一个示例中，不锈钢基板的抗拉伸强度在900Mpa～950Mpa之间，屈服强度在650Mpa～680Mpa之间，维氏硬度在300HV～330HV之间，延伸率在25％～40％之间，基板11a的厚度为0.1mm，通过图1中的方法所制备孔径为2.94mm的通孔12时，经过上述步骤S01～S04中的四次拉伸后，通孔12的孔壁厚度在0.05mm～0.06mm之间，可以保证较高良率。
然而，不锈钢的背板较重，不符合电子设备(例如，显示屏、移动终端)减重的需求。尤其是在移动终端(例如，手机，平板电脑)中，市场 对轻量化的需求较为强烈，因此背板需要选用更轻便材料进行制备。
本公开实施例提供一种背板，图2A为本公开的一些实施例中提供的背板的平面图，图2B为本公开的一些实施例中提供的沿图2A中A-A’线的剖视图，如图2A和图2B所示，背板包括：底壁11和设置在底壁11上的通孔12。在一个示例中，背板可以用于显示装置中，此时，通孔12可以与显示装置的图像采集器件(例如相机组件)相对设置。通孔12具有朝向底壁11突出的孔壁121(即，孔壁121在底壁11的厚度方向上突出于底壁11)，孔壁121与底壁11连接为一体结构，这种情况下，可以通过冲孔工艺在底壁11上形成通孔12。其中，底壁11和孔壁121的材料均包括铝合金材料。
和不锈钢材料相比，铝合金材料的密度较小，因此，在本公开实施例中，当底壁11和孔壁121的材料采用铝合金材料时，可以减小背板的重量，从而减小显示装置整体的重量。同时，铝合金具有更好的导热能力，有利于显示屏以及周围电子元件的散热。
在一些实施例中，如图2B所示，背板还可以包括：侧壁13，侧壁13与底壁11连接为一体结构，侧壁13、底壁11和孔壁121限定出容纳空间Sp，该容纳空间可以用于容纳背光源的至少一部分，例如发光件和导光板；也可以用于容纳显示面板的至少一部分。
在背板的制作过程中，可以先利用冲孔工艺，在铝合金材料的基板上形成通孔12；之后，将基板的边缘弯折，弯折的部分作为背板的侧壁13，未弯折的部分作为背板的底壁11。由于铝合金材料的抗拉强度、屈服强度、维氏硬度和延伸率均比不锈钢低很多，因此，如果采用图1所示的方法在铝合金的基板上制作小孔径的通孔，将导致孔裂。经过验证，对于抗拉强度为374MPa、屈服强度为262、维氏硬度为115HV、延伸率为18.1％、厚度为1.0mm的基板，当采用上述步骤S01～S04在基板11a上形成纵截面为矩形、孔径为2.94mm的通孔12时，孔壁121的厚度达到0.083，表明材料在拉伸过程中未得到充分伸展，此时，出现孔裂情况的机率很大。
为此，本公开实施例提供了一种制作通孔的方法，利用该方法可以在铝合金的基板上形成通孔，并减少孔裂，从而实现采用铝合金材料制作背板的目的。
图3A为本公开的一些实施例中提供的制作通孔的示意图，如图3A所示，利用冲孔工艺形成通孔12的过程包括：
S1、对基板11a的目标区域进行第一次冲压，形成贯穿基板11a的过孔12a。
S2、对基板11a的目标区域进行n次冲压，以使基板11a的目标区域受到多次拉伸，并形成弯曲部12b；其中，过孔12a位于弯曲部12b上，弯曲部12b在基板11a所在平面上的覆盖范围、弯曲部12b的深度随冲压次数的增加而增大，过孔12a的孔径随冲压次数的增加而增加。n为大于1的整数。
S3、对受到n次拉伸后的目标区域进行第n+2次冲压，以使弯曲部12b在基板11a所在平面上的覆盖范围、弯曲部12b的深度、过孔12a的孔径达到目标要求。
S4、对基板11a的目标区域进行第n+3次冲压，以使目标区域定型，形成通孔12。其中，经过第n+3次冲压后，弯曲部12b的侧壁形成为上述通孔12的孔壁121。
也就是说，在制作通孔12时，对目标区域进行冲压形成过孔12a后，还对基板11a的目标区域进行了多次拉伸，之后进行冲压和定型，从而得到所需尺寸的通孔12。这样可以使基板11a得到充分伸展，使基板11a逐步发生形变，从而降低冲压时的内应力，这样，在制作孔径较小的通孔12时，可以减少或防止孔裂不良，改善产品质量。
其中，每次冲压时，均使用冲针进行操作，其中，冲针的硬度大于基板11a的硬度，并且，由于冲针每次与基板11a刚接触时，会使基板11a受到瞬间的冲力，因此，在该冲力作用下，会在基板上形成一圈印记，称之 为锃亮环。可以理解的是，锃亮环数量比冲压次数少一次。例如，当冲压次数为6次时，锃亮环的数量为5。在本公开实施例中，采用上述步骤S1～S4形成通孔12，且步骤S2中的n大于1，冲压次数大于4次，因此，最终形成的通孔12的孔壁121上具有多条锃亮环，锃亮环的数量大于3。例如，锃亮环的数量为4或5或6。其中，当n较大或较小时，均有可能造成孔裂，优选地，上述n为3时，相比于n取其他数值，通孔12可以有更高的制作良率，此时，锃亮环的数量为5。
图3B为本公开的一些实施例中提供的锃亮环和锃亮带的分布示意图，如图3B所示，在一些实施例中，步骤S2中所形成的锃亮环中的至少两条位置相近时，会相接触或部分重叠，从而形成锃亮带。此时，孔壁121上具有至少一条锃亮环121b以及一条锃亮带121a，锃亮带121a位于至少一条锃亮环靠近底壁11的一侧，锃亮带121a的宽度H4大于任意一条锃亮环121b的宽度H5(或H6)。在一些示例中，锃亮带121a是由多次(例如，2次或3次)冲压形成的，此时，锃亮带121a的宽度H4与任意一条锃亮环121b的宽度H5(或H6)之比在[1.5，4]范围内。当锃亮带121a是由3次冲压形成的，此时，锃亮带121a的宽度H4与任意一条锃亮环121b的宽度H5(或H6)之比在[2，4]范围内，相比于锃亮带121a由其他次数冲压形成时，通孔12可以有更高的制作良率。例如，孔壁121上具有两条锃亮环121b以及一条锃亮带121a，锃亮带121a远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面的距离为孔壁121到背板底壁11远离锃亮带121a一侧表面的最远距离H的0.3～0.5倍，其中一条锃亮环121b远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面的距离为0.6H～0.8H，另一条锃亮环121b远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面的距离为0.85H～0.95H。在一个具体实施例中，锃亮带121a远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面的距离为距离H的0.4倍，其中一条锃亮环121b远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面 的距离为0.7H，另一条锃亮环121b远离底壁11的一端到背板底壁11远离锃亮带121a一侧表面的距离为0.9H。
本公开实施例的上述冲孔工艺可以适用于制作孔径较小的通孔12，在一些实施例中，通孔12的横截面为圆形，通孔12的孔径可以在2.5mm～4.5mm之间。例如，孔径可以在2.5mm～2.8mm之间，或者在2.7mm～2.8mm之间，或者在2.8mm～3.5mm之间，或者在3.5mm～3.8mm之间，或者在3.8mm～4.0mm之间，或者在4.0mm～4.5mm之间。例如，通孔12的孔径为2.5mm，或2.6mm，或2.7mm，或2.8mm，或2.9mm，或3.0mm，或3.1mm，或3.2mm，或3.3mm，或3.4mm，或3.5mm。
如图2B所示，通孔12的纵截面可以为矩形，即，孔壁121的纵截面与底壁11垂直。需要说明的是，这里的“垂直”是指两个结构的夹角在90°±3°范围内。
本公开实施例中的背板可以用于显示装置中，此时，背板的底壁11用于与显示装置的显示面板相对设置。例如，显示面板可以为OLED显示面板、QLED显示面板、QD-OLED显示面板、Mini-LED显示面板等自发光显示面板，这种情况下，背板的容纳空间Sp用于容纳上述自发光显示面板的至少部分。又例如，显示面板为液晶显示面板，此时，背板的容纳空间Sp中可以设置背光源的至少一部分，例如，背光源可以为侧入式背光源或者直下式背光源。当背光源为侧入式背光源时，背光源包括导光板以及灯条。其中，导光板至少部分位于容纳空间Sp内，其中导光板上设置避让孔，孔壁121穿过避让孔。当背光源为直下式背光源时，背光源包括直下式灯板，灯板上可以阵列排列自发光点光源，直下式灯板，至少部分位于容纳空间Sp内，其中直下式灯板设置有避让孔，孔壁121穿过避让孔。
在一个具体实施例中，容纳空间Sp用于容纳背光源和光学膜片组，光学膜片组可以包括多个光学膜片，每个光学膜片上可以设置避让孔，孔壁121穿过避让孔。参考图4，孔壁121的高度定义为孔壁121最远离背板底 壁11的位置与背板底壁11之间的垂直距离h0。在一些实施例，孔壁121的高度可以在0.65mm～0.78mm之间，从而有利于孔壁121穿过各光学膜片上的避让孔，进而使各光学膜片保持稳定。
优选地，当背光源远离背板底壁11的一侧依次层叠k个光源膜片时，孔壁121的高度设置为略高于第k个光学膜片远离背板底壁的一侧到背板底壁11的距离。这样设置可以尽量避免光源的光线进入避让孔中。当避让孔用于采集光学信息时，这样设计可以避免背光源的光线对光学采集造成串扰。具体地，对于侧入式背光源，当光学膜片组的多个光学膜片包括：反射片、扩散膜和复合棱镜膜时，反射片、导光板、扩散膜和复合棱镜膜依次层叠设置在背板底壁上，孔壁121的高度可以设置在0.65mm～0.72mm之间，例如，孔壁121的高度为0.65mm，或0.67mm，或0.69mm，或0.70mm，或0.72mm；当光学膜片组的多个光学膜片包括：反射片、导光板、扩散膜和两个棱镜膜时，反射片、导光板、扩散膜和两个棱镜膜依次层叠设置在背板底壁11上，孔壁121的高度可以设置在0.72mm～0.78mm之间，例如，孔壁121的高度为0.72mm，或0.75mm，或0.77mm，或0.78mm。可以理解的是，当背光源为侧入式背光源时，背光源远离背板底壁的一侧为导光板远离背板底壁11的一侧；当背光源为直下式背光源时，背光源远离背板底壁11的一侧为灯板出光侧。另外，孔壁121的高度略小于胶框15背离底壁11的表面到底壁11的距离，这样可以防止显示面板30与背光模组组装完成后，孔壁121对显示面板造成较大的压力，从而防止出现因显示面板受到挤压而产生画面发黄的现象，进而改善显示效果。具体地，孔壁121的高度记作h0，第k个光学膜片远离背板底壁的一侧到背板底壁11的距离记作h1，胶框15背离底壁11的表面到底壁11的距离记作h2，则有h2>h0>h1。优选地，(h0-h1)不大于0.05mm，(h2-h1)的范围在0.015mm～0.03mm。
在一些实施例中，底壁11的抗拉强度在320Mpa～390Mpa之间，屈服强度在200Mpa～270Mpa之间，维氏硬度在100HV～120HV之间，延伸率在 12％～20％之间，底壁11的厚度在0.09mm～1.01mm之间，孔壁121的厚度在0.050mm～0.081mm之间，从而使底壁11具有较强的抗拉强度和较高的延伸率，以减少或防止孔裂不良。
示例性地，底壁11的抗拉强度为320Mpa～330Mpa之间，或者在330Mpa～350Mpa之间，或者在350Mpa～360Mpa之间，或者在360Mpa～370Mpa之间，或者在370Mpa～390Mpa之间。例如，底壁11的抗拉强度为320Mpa，或者325Mpa，或者330Mpa，或者335Mpa，或者340MPa，或者350Mpa，或者355Mpa，或者360Mpa，或者365Mpa，或者370Mpa，或者375Mpa，或者380Mpa，或者385Mpa，或者390Mpa。示例性地，底壁11的屈服强度在200Mpa～230Mpa之间，或者在230Mpa～250Mpa，或者在250Mpa～270Mpa之间。例如，底壁11的屈服强度为200Mpa，或者210Mpa，或者220Mpa，或者230Mpa，或者240Mpa，或者250Mpa，或者260Mpa，或者270Mpa。示例性地，底壁11的维氏硬度在100HV～105HV之间，或者在105HV～110HV之间，或者在110HV～115HV之间，或者在115HV～120HV之间。例如，底壁11的维氏硬度为100HV，或103HV，或105HV，或107HV，或110HV，或112HV，或115HV，或118HV，或120HV。
示例性地，底壁11的延伸率在12％～15％之间，或者15％～18％之间，或者18％～20％之间。例如，底壁11的延伸率为12％，或者13％，或者14％，或者15％，或者16％，或者17％，或者18％，或者19％，或者20％。示例性地，底壁11的厚度在0.095mm～1.005mm范围内，孔壁121的厚度在0.05mm～0.06mm之间，或者在0.06mm～0.07mm，或者在0.07mm～0.081mm之间。例如，底壁11的厚度为0.09mm，或者0.095，或者0.1mm，或者0.105mm；孔壁121的厚度例如为0.05mm，或者为0.06mm，或者为0.061mm，或者为0.065mm，或者为0.07mm，或者为0.081mm。
优选地，底壁11的抗拉强度为374MPa，屈服强度为262，维氏硬度为115HV，延伸率为18.1％，底壁11的厚度为1.0mm之间，孔壁121的厚度 为0.061mm，从而使底壁11可以得到充分伸展，最大可能地减少孔裂的情况。
在一个具体实施例中，底壁11的材料可以采用铝镁合金。采用铝镁合金可以提升底壁11的强度和表面硬度，降低划伤不良率。
本公开的发明人对步骤S1～S4所制作的通孔12良率进行了实验验证，其中，底壁11的抗拉强度为374MPa，屈服强度为262，维氏硬度为115HV，延伸率为18.1％，底壁11的厚度为1.0mm之间，通孔12的纵截面为矩形，且通孔12的孔径为2.94mm。当步骤S2中n取3时，孔壁121的厚度为0.061mm，表明材料在拉伸过程中得到了充分伸展，此时，相比于采用步骤S01～S04制作通孔12，孔裂不良率大幅降低。
考虑到铝合金材料的强度较低，因此，当在基板上形成通孔12之后，孔壁121容易出现回弹变形。为了防止这一现象，在一些实施例中，如图2B所示，底壁11上靠近所述孔壁121的位置设置有第一凹槽V1。其中，第一凹槽V1可以与孔壁121相邻，即，与孔壁121之间无间隔。第一凹槽V1可以防止在基板上形成通孔12后，孔壁121发生回弹。其中，可以利用压筋工艺在底壁11上形成第一凹槽V1。
其中，第一凹槽V1可以为环绕通孔12的环形结构。当第一凹槽V1的宽度和深度较小时，并不足以减小孔壁121的回弹力；而当第一凹槽V1的宽度和深度较大时，在利用压筋工艺形成第一凹槽V1的过程中，容易导致底壁11发生变形。有鉴于此，在一些实施例中，第一凹槽V1的宽度在0.08mm～0.12mm之间，第一凹槽V1的深度在0.01mm～0.02mm之间，从而尽量减小孔壁121的回弹力，并防止底壁11发生变形，提高底壁11远离显示面板的表面的平整性。
示例性地，第一凹槽V1的宽度为0.08mm，或0.09mm，或0.1mm，或0.11mm，或0.12mm；第一凹槽V1的深度为0.01mm，或0.012mm，或0.014mm，或0.016mm，或0.018mm，或0.02mm。
同理，如上文所述，将基板的边缘弯折，以形成背板的侧壁13。为了防止侧壁13回弹，可以在底壁11上靠近侧壁13的位置，设置第二凹槽V2，第二凹槽V2可以与侧壁13接触。在一些实施例中，第二凹槽V2的宽度在0.08mm～0.12mm之间，第二凹槽V2的深度在0.01mm～0.02mm之间，从而尽量减小侧壁13的回弹力，提高底壁11远离显示面板的表面的平整性。
在一些示例中，底壁11背离容纳空间的表面(记作底壁11的底面)的平整性要求如下：当底壁11放置在承载平台上时，底壁11的底面上的龟翘位置与承载平台的距离不超过0.1mm，底壁11的底面上的碗翘位置与承载平台的距离不超过0.8mm。图2C为底壁的翘曲示意图，如图2C所示，碗翘位置A位于底壁11的边缘，龟翘位置B位于底壁11中部，呈波峰状。
图4为本公开的另一些实施例中提供的沿图2A中A-A’线的剖视图，图4所示的结构与图2B类似，如图4所示，底壁11上设置有通孔12，通孔12的孔壁121与底壁11连接为一体结构，底壁11和通孔12的孔壁121的材料均包括铝合金材料。通孔12的纵截面为矩形。底壁11上可以设置第一凹槽V1和第二凹槽V2。
其中，侧壁13的内表面上具有3条以上的锃亮环。底壁11的各项性能参数、底壁11的厚度、孔壁121的厚度、通孔12的高度和口径、第一凹槽V1的深度和宽度、第二凹槽V2的深度和宽度均可以参见上文中对图2B的描述。下面仅对图4与图2B的区别进行描述。
在一些实施例中，参考图4，孔壁121远离底壁11的一端设置有弯折部122，弯折部122与孔壁121形成为一体结构，并向通孔12中部延伸。通过弯折部122的设置，可以进一步减小孔壁121顶部受到的应力，从而进一步减少孔裂的发生。需要说明的是，当孔壁121远离底壁11的一端设置有弯折部122时，上述孔壁121的高度h0应当理解为，弯折部122距离背板底壁11的最远点到背板底壁11的距离。
在一些实施例中，弯折部122为环形结构，以减小孔壁121顶部的各位置受到的应力更均匀。
其中，环形结构的宽度在0.05mm～0.15mm之间，以尽量减小孔壁121远离底壁11一端受到的应力，减少孔裂不良。例如，环形结构的宽度为0.05mm或0.08mm或0.1mm或0.12mm或0.15mm。
其中，环形结构可以与底壁11平行或基本平行，即，环形结构所在平面与底壁11所在平面之间的夹角在0°～5°之间。
对于图4中的通孔12，同样可以采用上述步骤S1至步骤S4所述的冲孔工艺形成。在一些实施例中，步骤S2中的n取2，3或4，即，对应通过5次，6次或7次冲压形成图4中的通孔。而步骤S4中的冲压过程的作用在于，对弯折部进行定型，并不会产生上述锃亮环。因此，在一些实施例中，当步骤S2中的每次冲压形成的锃亮环彼此间隔时，孔壁121上具有3、4或5个锃亮环。优选地，n＝3时，孔壁121上具4个锃亮环，此时可以获得最高的通孔12的制作良率。
而在另一些实施例中，在制作图4中的通孔12时，步骤S2中形成的锃亮环中每相邻两个相接触或部分重叠，从而形成锃亮带。即，步骤S2中每次冲压形成的锃亮环组成锃亮带。此时，孔壁121上具有一条锃亮环以及一条锃亮带，锃亮带位于锃亮环靠近底壁11的一侧。锃亮带的宽度大于锃亮环的宽度。在一些示例中，锃亮带是由两次或三次冲压形成的，此时，锃亮带的宽度与任意一条锃亮环的宽度之比在[1.5，4]范围内。在一些示例中，锃亮带是3次冲压形成的，此时，锃亮带的宽度与锃亮环的宽度之比在[2，4]范围内，此时相对于其他冲压次数形成锃亮带，可以获得最高的通孔12的制作良率。
对图4所示的通孔12的实测结果如下：底壁11的抗拉强度为374MPa，屈服强度为262，维氏硬度为115HV，延伸率为18.1％，底壁11的厚度为1.0mm之间，通孔12的纵截面为矩形，且通孔12的孔径d0为2.94mm， 弯折部122为环形，弯折部122的宽度为0.1mm，孔壁121的高度为0.69mm。当采用上述步骤S1至步骤S4所述的冲孔工艺，且步骤S2中n为3时，孔壁121的厚度为0.065mm，检测到孔裂不良率进一步降低。需要说明的是，对于通孔12，其孔径为孔壁121的内径(例如，图4中d0所标识的尺寸)，而与弯折部122无关。
图5为本公开的再一些实施例中提供的沿图2A中A-A’线的剖视图，图5与图2B所示的结构类似，如图5所示，底壁11上设置有通孔12，通孔12的孔壁121与底壁11连接为一体结构，底壁11和通孔12的孔壁121的材料均包括铝合金材料。底壁11上可以设置第一凹槽V1和第二凹槽V2。
其中，侧壁13的内表面上具有3条以上的锃亮环。底壁11的各项性能参数、底壁11的厚度、孔壁121的厚度、通孔12的高度、第一凹槽V1的深度和宽度、第二凹槽V2的深度和宽度均可以参见上文中对图2B的描述。下面仅对图5与图2B的区别进行描述。
在图5中，沿远离底壁11的方向，通孔12的横截面积逐渐缩小，这种结构也可以减少孔壁121顶部受到的应力，从而进一步减少孔裂的发生。
在一些实施例中，通孔12的纵截面为梯形，梯形具有两个顶角(如图5所示的a1和a2)和两个底角(如图5所示的b1和b2)，每个顶角大于90°，每个底角在80°～90°之间，从而提高通孔12的稳定性。其中，梯形可以为等腰梯形，即，a1＝a2，b1＝b2。通孔12靠近底壁11的一端的开口口径d1可以与图2B中的通孔12孔径相同，通孔12远离底壁11的一端的开口口径d2小于d1，d2与d1之间的差值可以在0.05mm～0.15mm之间，例如，d2与d1之间的差值为0.05mm或0.08mm或0.1mm或0.12mm或0.15mm。
对于图5中通孔12，其孔壁121上形成的锃亮环可以与图3B中的孔壁121上的锃亮环类似。在一些实施例中，通过上述步骤S1～S4形成图5中的通孔12，孔壁121上的锃亮环的数量比冲压次数少1，例如，当冲压 次数为6次时，锃亮环的数量为5。在一些实施例中，步骤S2中的n大于1，冲压次数大于4次，因此，最终形成的通孔12的孔壁121上具有多条锃亮环，锃亮环的数量大于3。优选地，n＝3，相比于n取其他数值，可以获得最高的通孔12的制作良率，此时锃亮环的数量为5。
在另一些实施例中，在形成图5中的通孔12时，步骤S2中所形成的锃亮环中的至少两条位置相近时，会相接触或部分重叠，从而形成锃亮带。此时，孔壁121上具有至少一条锃亮环以及一条锃亮带，锃亮带位于至少一条锃亮环靠近底壁11的一侧，锃亮带的宽度大于任意一条锃亮环的宽度。在一些示例中，锃亮带是由两次或三次冲压形成的，此时，锃亮带的宽度与任意一条锃亮环的宽度之比在[1.5，4]范围内。例如，孔壁121上具有两条锃亮环以及一条锃亮带。优选地，锃亮带是由三次冲压形成的，此时，锃亮带的宽度与任意一条锃亮环的宽度之比在[2，4]范围内，此时相对于其他冲压次数形成锃亮带，可以获得最高的通孔12的制作良率。
对图5所示的通孔12的实测结果如下：底壁11的抗拉强度为374MPa，屈服强度为262Mpa，维氏硬度为115HV，延伸率为18.1％，底壁11的厚度为1.0mm之间，通孔12的纵截面为梯形，且通孔12靠近底壁11一端的开口口径为2.94mm，通孔12远离底壁11一端的开口口径为2.74mm，孔壁121的高度为0.69mm。当采用上述步骤S1至步骤S4所述的冲孔工艺，且步骤S2中n为3时，孔壁121的厚度为0.063mm，检测到孔裂不良率相比于图2形态进一步降低。
可以理解的是，对于图5所示结构，孔壁121远离底壁11的一端设置有弯折部，弯折部与孔壁121形成为一体结构，并向通孔12中部延伸。这种结构可以进一步减少孔壁121顶部受到的应力，减少孔裂的发生，提升良率。
图6为本公开的一些实施例中提供的背光模组的示意图，如图6所示，背光模组包括上述实施例中提供的背板。
另外，背光模组还包括：背光源，背光源可以发光件和光学膜片组。光学膜片组的至少一部分位于背板的容纳空间中。示例性地，光学膜片组20包括多个光学膜片，多个光学膜片可以包括沿远离底壁11的方向依次设置的：反射片24、导光板23、扩散膜22和棱镜膜21。发光件、反射片24和导光板23的至少一部分位于容纳空间中。每个光学膜片上设置有避让孔，背板上的通孔12的孔壁121穿过各光学膜片的避让孔。
图7A为图6中Q区域的放大图，如图6和图7A所示，背光模组还包括：胶框15，胶框15环绕光学膜片组20设置。其中，背板的侧壁13具有：第一侧面131、第二侧面132和顶面133，第一侧面131与第二侧面132相对，第一侧面131朝向容纳空间，所述顶面133连接所述第一侧面131与第二侧面132。胶框15与背板的侧壁13的第一侧面131和顶面133均接触。即，胶框15的一部分位于背板的侧壁13内侧，并与第一侧面131贴合；另一部分支撑在侧壁13的顶面133上。其中，可以通过注塑的方式形成在背板上形成胶框15。
图7B为本公开的一些实施例中提供的背板的侧壁和胶框的局部侧视图，如图7B所示，背板的侧壁13上设置有注胶孔13a，在注塑时，可以通过注胶孔13a向侧壁13内侧注入胶体，进而形成胶框15。为了防止外界水汽从注胶孔进入背板的容纳空间，在一些实施例中，如图2B、图4和图5所示，背板的底壁11朝向所述容纳空间的表面上设置有第三凹槽V3，胶框15的一部分填充在第三凹槽V3中，第三凹槽V3的至少一部分位于注胶孔13a沿侧壁13厚度方向的一侧。即，第三凹槽V3的至少一部分与注胶孔13a在侧壁13的厚度方向上有交叠，这样，外界的水汽从注胶孔渗入背光模组内部的路径延长，胶框15伸入第三凹槽V3的部分可以对水汽进行有效阻挡，从而防止容纳空间内的结构受到外界水汽的侵蚀。
在一些示例中，第三凹槽V3的宽度在0.1mm～0.2mm之间，深度在0.01mm～0.02mm之间，从而提高背光模组的隔水氧能力。另外，第三凹槽 V3可以为环绕光学膜片组20的环形结构。
图8A为本公开的一些实施例中提供的显示装置的示意图，如图8A所示，显示装置包括上述背板和显示面板30，显示面板30与背板的底壁11相对设置。
在一些实施例中，如图8A所示，显示面板30为液晶显示面板，其具体包括：阵列基板31、彩膜基板32、第一偏光片33和第二偏光片34，阵列基31板和彩膜基板32相对设置，第一偏光片33位于阵列基板31远离彩膜基板32的一侧，第二偏光片34位于彩膜基板32远离阵列基板31的一侧。当显示面板30采用液晶显示面板时，显示装置还包括背光源，背光源的至少一部分设置在背板的容纳空间中，具体可以参见上文描述，这里不再赘述。
如图8A所示，显示装置包括：显示区DA、第一非显示区NA1和第二非显示区NA2，其中，显示区DA环绕第一非显示区NA1，第二非显示区NA2环绕显示区DA。第一非显示区NA1包括：透光子区TA和环绕透光子区TA的遮光子区SA，通孔12的孔壁121位于遮光子区SA，胶框15位于第二非显示区NA2。第一偏光片33、第二偏光片34上均设置有镂空结构，第一偏光片33和第二偏光片34上的镂空结构至少覆盖透光子区TA。
如图8A所示，显示面板与背光模组之间还设置有第一遮光层61和第二遮光层62，第一遮光层61位于遮光子区SA，用于防止通孔12处发生漏光。第一遮光层61在显示面板上的正投影可以位于背板在显示面板30上的正投影范围内，也可以超出背板在显示面板30上的正投影。例如，当背板采用图4中的结构时，第一遮光层61在显示面板30上的正投影可以超出弯折部122的内侧边缘在显示面板30上的正投影，超出部分的宽度小于或等于0.12mm。当背板采用图5中的结构时，第一遮光层61在显示面板30上的正投影可以超出孔壁121的内侧边缘在显示面板30上的正投影，超出部分的宽度小于或等于0.12mm。第二遮光层62位于第二非显示区，第 二遮光层62在显示面板30上的正投影覆盖胶框15在显示面板30上的正投影，第二遮光层62用于防止显示面板30的边缘位置发生漏光。
背板的通孔12的孔壁121上设置有粘结胶40，粘结胶40将通孔12的孔壁121与显示面板30固定粘结，粘结胶40在显示面板30上的正投影为环形，并环绕透光子区TA。其中，粘结胶40的内径即为透光子区TA的直径。示例性地，粘结胶40的内径在2.15mm～4.15mm之间，例如，粘结胶40的内径为2.15mm，或2.2mm，或2.24mm，或2.3mm，或2.5mm，或2.6mm，或2.7mm，或2.8mm，或2.9mm，或3.0mm，或3.1mm，或3.2mm，或3.3mm，或3.4mm，或3.5mm，或3.6mm，或3.7mm，或3.8mm，或3.9mm，或4.0mm，或4.1mm，或4.15mm。
如图8A所示，粘结胶40包括第一粘结部41和第二粘结部42，第一粘结部41与第一遮光层61、第一偏光片33和阵列基板31粘结，第二粘结部42与第一粘结部41、第一遮光层61和孔壁121粘结。第二粘结部42在显示面板30上的正投影为环形，环形的宽度以可以与第一粘结部41接触，以使第二粘结部42与第一粘结部41对通孔12的边缘进行包裹。应当理解的是，第二粘结部42的宽度是指，第二粘结部42在显示面板30上的环形投影的内边缘与外边缘之间的距离。优选地，第一粘结部41和第二粘结部42均可以为遮光胶，以防止通孔12处发生漏光。具体地，第一粘结部41和第二粘结部42均可以采用黑色的遮光胶。
需要说明的是，第一粘结部41和第二粘结部42可以分两次形成，具体地，在显示装置的组装过程中，可以先在显示面板30上形成第一粘结部41，再将显示面板30与背光模组固定连接；之后，再形成第二粘结部42。
如图8A所示，显示装置还可以包括盖板51和光学胶层50，盖板51位于显示面板30远离背光模组的一侧，盖板51与显示面板30通过光学胶层50粘结。
图8B为本公开的另一些实施例中提供的显示装置的示意图，如图8A 所示，显示装置包括上述背板和显示面板30，显示面板30与背板的底壁11相对设置。与图8A不同的是，在图8B中，显示面板可以为OLED显示面板、QLED显示面板、QD-OLED显示面板、Mini-LED显示面板等自发光显示面板。此时，显示面板的至少一部分可以设置在背板的容纳空间中。
如图8B所示，显示面板30上设置有安装孔，通孔12的孔壁121穿过安装孔。显示装置还包括盖板51，盖板51设置在显示面板30的出光侧，所述通孔的孔壁上设置有遮光的粘结胶，粘结胶将通孔的孔壁121与盖板51固定粘结，粘结胶40在盖板51上的正投影为环形结构，环形结构的内径在2.15mm～4.15mm之间。
本公开实施例还提供一种上述背板的制作方法，图9为本公开的一些实施例中提供的背板的制作方法流程图，如图9所示，背板的制作方法包括：
S10、提供基板，基板的材料包括铝合金材料，例如铝镁合金。
S20、利用冲孔工艺在基板上形成通孔，通孔包括朝向基板一侧突出的孔壁。图10为本公开的一些实施例中提供的利用冲孔工艺形成通孔的过程示意图，图11为本公开的另一些实施例中提供的利用冲孔工艺形成通孔的过程示意图，步骤S20包括：
S21、如图10和图11所示，对基板11a的目标区域进行第一次冲压，形成贯穿基板11a的过孔12a。
S22、如图10和图11所示，对基板11a的目标区域进行n次冲压，以使基板11a的目标区域受到n次拉伸，并形成弯曲部12b；其中，过孔12a位于弯曲部12b上，弯曲部12b的覆盖范围、弯曲部12b的深度随冲压次数的增加而增大，过孔12a的孔径随冲压次数的增加而增加。其中，n为大于1的整数，弯曲部12b的覆盖范围是指，以基板11a未弯折部分所在平面作为参考平面，弯曲部12b在参考平面上的正投影范围。优选地，n＝3，相比于n取其他数值，可以获得最高的通孔12的制作良率。
在一些实施例中，步骤S22中的n可以在2～5之间，以使基板11a得到充分伸展。例如，n为3，从而使基板11a得到充分伸展，同时防止工艺过于复杂。
S23、如图10和图11所示，对经过拉伸后的目标区域进行第n+2次冲压，以使弯曲部12b的覆盖范围和深度、过孔12a的孔径均达到目标要求。
S24、如图10和图11所示，对目标区域进行第n+3次冲压，以形成通孔12。其中，经过第n+3次冲压后，弯曲部12b的侧壁形成为通孔12的孔壁121。
在一些实施例中，每次冲压均利用冲针进行操作，每次冲压使用的冲针可以不同。
图12为本公开的一些实施例中提供的步骤S24的具体操作示意图，如图12所示，在对目标区域进行定型时，将基板11a放置在具有容纳孔80v的凹模镶件80上，弯曲部12b位于容纳孔80v中，利用冲针70对弯曲部12b进行冲压，从而调整弯曲部12b的形状。其中，冲针70与容纳孔80v的侧壁的顶端之间具有一定的距离d，该距离d大于基板11a的厚度，这种情况下，冲针70对弯曲部12b进行冲压时，弯曲部12b远离过孔12a的一端与冲针70之间会形成一定的间隙，从而防止冲针70对弯曲部12b的过度挤压而导致弯曲部12出现裂痕。例如，基板11a的厚度为0.1mm时，冲针70与容纳孔80v的侧壁的顶端之间具有0.11mm的距离，这时，弯曲部12b远离过孔12a的一端与冲针70之间可以留有0.01mm的缝隙。需要说明的是，虽然弯曲部12b远离过孔12a的一端与冲针70之间留有缝隙，但是，弯曲部12b靠近过孔12a的一端是与冲针70接触的，从而保证冲压的顺利进行。
需要说明的是，图12仅仅是以步骤S24为例进行说明的，其他步骤中的每次冲压均可以采用类似的操作，区别可以在于，所使用的冲针形状可以与图12中不同。
另外，对于图4中所示的通孔，在步骤S24中，采用冲压旋切冲针对基板11a进行旋切，从而得到在通孔的孔壁上形成弯折部。需要说明的是，在旋切过程中，弯折部的边缘容易形成沿通孔的高度方向延伸的毛刺，为了防止毛刺对显示面板30造成影响，可以通过控制旋切时的工艺参数，将毛刺的高度控制在小于或等于0.05mm。对于图5中所示的通孔，在步骤S24中，采用冲针对基板11a进行冲压即可，不需要进行旋切。
在一些实施例中，每次冲压时，采用的各冲针的洛氏硬度在[60，68)范围内，从而降低工艺过程中铝合金材料的疲劳应力。例如，各冲针的洛氏硬度为60或62或64或66。优选地，各冲针的洛氏硬度为64，以最大程度地降低工艺过程中铝合金材料的疲劳应力。
在一些实施例中，可以通过控制每次冲压时的工艺参数，使孔壁顶部的四个预设参考点中的任意二者之间的高度差小于或等于0.03mm。其中，预设参考点为孔壁的顶面(即，孔壁朝向显示面板的端面)上的参考点，且四个预设参考点沿通孔的周向均匀分布。
需要说明的是，说明书中出现的例如“m1～m2”的范围表述，包括m1和m2端点值。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (25)

  1. 一种背板，其中，所述背板包括：
    底壁；
    设置在底壁上的通孔，所述通孔具有朝向所述底壁一侧突出的孔壁，所述孔壁与所述底壁连接为一体结构；
    其中，所述底壁和所述孔壁的材料均包括铝合金材料。
  2. 根据权利要求1所述的背板，其中，所述底壁的抗拉强度在320Mpa～390Mpa之间，屈服强度在200Mpa～270Mpa之间，维氏硬度在100HV～120HV之间，延伸率在12％～20％之间。
  3. 根据权利要求1所述的背板，其中，所述底壁的厚度在0.09mm～1.01mm之间，所述孔壁的厚度在0.050mm～0.081mm之间。
  4. 根据权利要求1所述的背板，其中，所述孔壁远离所述底壁的一端设置有弯折部，所述弯折部与所述孔壁形成为一体结构，并朝向所述通孔中部延伸。
  5. 根据权利要求4所述的背板，其中，所述通孔的纵截面为矩形。
  6. 根据权利要求4所述的背板，其中，所述弯折部为环形结构，所述弯折部的宽度在0.05mm～0.15mm之间。
  7. 根据权利要求1所述的背板，其中，所述通孔的纵截面为梯形，所述梯形具有两个顶角和两个底角，每个所述顶角大于90°，每个所述底角在80°～90°之间。
  8. 根据权利要求1至7中任意一项所述的背板，其中，所述孔壁上具有多条锃亮环，所述锃亮环的数量大于3。
  9. 根据权利要求8所述的背板，其中，所述锃亮环的数量为4或5。
  10. 根据权利要求1至7中任意一项所述的背板，其中，所述孔壁上具有至少一条锃亮环以及一条锃亮带，所述锃亮带位于所述至少一条锃亮环靠近底壁的一侧，所述锃亮带的宽度大于任意一条锃亮环的宽度。
  11. 根据权利要求10所述的背板，所述锃亮带的宽度与所述任意一条锃亮环的宽度之比在[1.5，4]范围内。
  12. 根据权利要求1至7中任意一项所述的背板，其中，所述通孔远离所述底壁的一端的口径在2.5mm～4.5mm之间。
  13. 根据权利要求1至7中任意一项所述的背板，其中，所述底壁上靠近所述孔壁的位置设置有第一凹槽。
  14. 根据权利要求13所述的背板，其中，所述第一凹槽的宽度在0.08mm～0.12mm之间，所述第一凹槽的深度在0.01mm～0.02mm之间。
  15. 根据权利要求1至7中任意一项所述的背板，其中，所述背板还包括侧壁，所述侧壁与所述底壁连接为一体结构，所述侧壁、所述底壁和所述孔壁限定出容纳空间。
  16. 根据权利要求15所述的背板，其中，所述底壁上靠近所述侧壁的 位置设置有第二凹槽。
  17. 根据权利要求1至7中任意一项所述的背板，其中，所述背板用于显示装置中，所述底壁用于与所述显示装置的显示面板相对设置。
  18. 一种背光模组，包括权利要求15至17中任意一项所述的背板，所述背光模组还包括：背光源，所述背光源的至少一部分位于所述容纳空间内。
  19. 根据权利要求18所述的背光模组，其中，所述背板的侧壁具有：第一侧面、第二侧面和顶面，所述第一侧面与第二侧面相对，所述第一侧面朝向所述容纳空间，所述顶面连接所述第一侧面与所述第二侧面，
    所述背光模组还包括：胶框，所述胶框环绕所述背光源，并与所述背板侧壁的第一侧面和顶面均接触。
  20. 根据权利要求19所述的背光模组，其中，所述侧壁与所述底壁的交界处设置有注胶孔，所述底壁朝向所述容纳空间的表面上设置有第三凹槽，所述胶框的一部分填充在所述第三凹槽中，所述第三凹槽的至少一部分位于所述注胶孔沿所述侧壁厚度方向的一侧。
  21. 一种显示装置，包括：权利要求1至17中任意一项所述的背板和显示面板，所述显示面板与所述背板的底壁相对设置。
  22. 根据权利要求21所述的显示装置，其中，
    所述背板的通孔的孔壁上设置有粘结胶，所述粘结胶将所述通孔的孔壁与所述显示面板固定粘结，所述粘结胶在所述显示面板上的正投影为环 形结构，所述环形结构的内径在2.15mm～4.15mm之间；或者，
    所述显示装置还包括：盖板，所述盖板设置在所述显示面板的出光侧，所述显示面板上设置有安装孔，所述通孔的孔壁穿过所述安装孔，所述通孔的孔壁上设置有粘结胶，所述粘结胶将所述通孔的孔壁与所述盖板固定粘结，所述粘结胶在所述盖板上的正投影为环形结构，所述环形结构的内径在2.15mm～4.15mm之间。
  23. 一种权利要求1至17中任一项所述的背板的制作方法，其中，包括：
    提供基板，所述基板的材料包括铝合金材料；
    利用冲孔工艺在所述基板上形成通孔，所述通孔具有朝向所述基板一侧突出的孔壁；
    其中，所述冲孔工艺包括：
    对所述基板的目标区域进行第一次冲压，形成贯穿所述基板的过孔；
    对所述基板的目标区域进行n次冲压，以使所述基板的目标区域受到n次拉伸，并形成弯曲部；其中，所述过孔位于所述弯曲部上，所述弯曲部在所述基板所在平面上的覆盖范围、所述弯曲部的深度随冲压次数的增加而增大，所述过孔的孔径随冲压次数的增加而增加；n为大于1的整数；
    对受到n次拉伸后的目标区域进行第n+2次冲压，以使所述弯曲部的覆盖范围和深度、所述过孔的孔径达到目标要求；
    对所述目标区域进行第n+3次冲压，以形成所述通孔；其中，经过第n+3次冲压后，所述弯曲部的侧壁形成为所述通孔的孔壁。
  24. 根据权利要求23所述的制作方法，其中，2≤n≤5。
  25. 根据权利要求23所述的制作方法，其中，对所述基板的目标区域 进行每次冲压时，均采用冲针进行操作，所述冲针的洛氏硬度在[60，68)范围内。
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