WO2021261345A1 - Laser machining system and method for applying liquid to machining pallet - Google Patents

Abstract

This laser machining system (ST) comprises: a laser machining device (92) that performs laser machining on a material (Wa); a pallet transfer device (91) that transfers, to the laser machining device (92), a machining pallet (2) including a skid group (23G) having a plurality of skids (23); and a liquid application device (6) including a lower nozzle group (8) that sprays a liquid (M) as mist (ML) from below onto the machining pallet (2) transferred from the pallet transfer device (91) to the laser machining device (92).

Description

Liquid application method to laser processing system and processing pallet

The present invention relates to a laser processing system and a method for applying a liquid to a processing pallet.

Patent Document 1 describes that in laser cutting processing, when the member to be cut is moved before irradiation with a laser beam, oil is sprayed over the entire upper surface of the member to be cut. It is described in Patent Document 1 that this makes it possible to prevent spatter or melts scattered during processing from sticking to the member to be cut without increasing the tact time of processing.

Patent Document 2 describes a cleaning device for an operator to manually clean the skid of a pallet that supports a member to be cut in laser cutting. Further, Patent Document 2 describes that cleaning can be easily performed by applying a spatter adhesion inhibitor to the skid after cleaning.

Japanese Patent No. 4562995 Japanese Unexamined Patent Publication No. 2012-08624

Conventionally, the work of applying a liquid such as a spatter adhesion inhibitor to the skid of a pallet is generally performed manually by an operator using a sprayer or the like before laser cutting the member to be cut. .. Since this coating operation is performed independently in the middle of the laser cutting process, the tact time increases and the productivity decreases. Further, the manual application of the liquid causes unevenness in the amount of the liquid applied to the skid, and there is a risk that spatter or dross will easily and early adhere to the portion where the amount is small. If dross or the like sticks to the skid, depending on the degree of sticking, the member to be cut may be scratched, or the member to be cut may not be held horizontally and the dimensional accuracy required for the product may not be obtained. Quality degradation occurs.

The laser processing system according to one aspect of the present invention includes a laser processing device that performs laser processing on a material, a pallet transfer device that transfers a processing pallet including a skid group having a plurality of skids to the laser processing device, and the pallet transfer device. It is provided with a liquid coating device including a lower nozzle group that sprays liquid as a mist from below on the machining pallet that is conveyed from the device to the laser machining device.

According to one aspect of the present invention, the productivity and quality of the laser cutting process are unlikely to deteriorate.

FIG. 1 is a perspective view showing a schematic configuration of a laser processing system according to an embodiment of the present invention. FIG. 2 is a plan view showing a processing pallet included in the pallet transfer device included in the laser processing system of FIG. FIG. 3 is a partial side view of the processing pallet of FIG. FIG. 4 is a schematic side view showing the arrangement positions of the upper nozzle group and the lower nozzle group with respect to the processing pallet of FIG. FIG. 5 is a schematic front view for explaining a liquid coating range in the liquid coating device included in the pallet transfer device included in the laser processing system of FIG. 1. FIG. 6 is a piping system diagram of the liquid coating device of FIG. 5 having an upper nozzle group and a lower nozzle group. FIG. 7 is a side view showing a mode in which the mist is sprayed onto the skid by the lower nozzle. FIG. 8 is a schematic front view showing a mist spraying operation on a processing pallet of the liquid coating apparatus in the laser processing system of FIG. 1. FIG. 9 is a perspective view showing a schematic configuration of a modified example of the laser processing system of FIG. FIG. 10 is a piping system diagram of the liquid coating device included in the laser processing system of FIG. FIG. 11 is a schematic view showing the mist spraying operation on the processing pallet of the upper nozzle portion included in the liquid coating apparatus of FIG.

FIG. 1 is a perspective view showing a schematic configuration of a laser processing system ST according to an embodiment of the present invention. For convenience of explanation, each direction of up, down, left, right, front and back is defined as the direction indicated by the arrow in FIG. Further, the left and right are the X-axis, the front and back are the Y-axis, and the top and bottom are the Z-axis. In FIGS. 1, 4, 5, 7, and FIG. 9, which shows a modification described later, RT, LT, UP, DN, FR, and RR are shown in the right, left, up, down, front, and rear directions, respectively. Indicated by.

As shown in FIG. 1, the laser processing system ST includes a pallet transfer device 91, a laser processing device 92, and a control device 93. The pallet transfer device 91 is arranged adjacent to the laser processing device 92. In this embodiment, the pallet transfer device 91 is arranged on the right side of the laser processing device 92. The laser processing apparatus 92 performs laser processing on the material Wa which is a member to be machined. The pallet transfer device 91 carries in and out the processing pallet 2 on which the material Wa is placed to and from the laser processing device 92. The control device 93 controls the operation of the pallet transfer device 91 and the laser processing device 92. The control device 93 is not limited to a separate body as shown in FIG. 1, and may be the same body as any of the pallet transfer device 91 and the laser processing device 92.

The schematic structure and operation of the pallet transfer device 91 and the laser processing device 92 will be described. The operation of the pallet transfer device 91 and the laser processing device 92 is executed by the control device 93 controlling the operation of the drive unit (not shown) of each.

The pallet transfer device 91 includes a storage unit 911, a transfer main body unit 912, and a lifter unit 913. The pallet transfer device 91 includes a material pallet 1, a processing pallet 2, and a single-sheet taking unit 3. In the present embodiment, the pallet transfer device 91 includes two processing pallets 2. Hereinafter, the two processing pallets 2 are distinguished as processing pallets 2A and 2B, if necessary.

The transport main body portion 912 of the pallet transport device 91 is arranged so as to be connected to the right end portion of the laser processing device 92. The storage portion 911 is arranged so as to be connected to the rear end portion of the transport main body portion 912. The lifter portion 913 is installed in the front portion of the transport main body portion 912. The lifter portion 913 has a lifter tray 5 that moves up and down between the lower position and the central position above the lower position as shown by the arrow D1. In FIG. 1, the lifter tray 5 at the lower position is shown by a solid line, and the lifter tray 5 at the center position is shown by a alternate long and short dash line. The lifter tray 5 can be moved up and down on which the processing pallet 2 is placed.

The pallet transfer device 91 includes a liquid coating device 6. The liquid coating device 6 is a device for spraying and coating the liquid M on the processing pallet 2 and the material Wa placed on the processing pallet 2. The liquid coating device 6 has a main body portion 61 having a tank 61a containing the liquid M, an upper nozzle portion 62, and a lower nozzle portion 63. The upper nozzle portion 62 includes the upper nozzle group 7. The lower nozzle portion 63 includes the lower nozzle group 8. Details of the liquid coating device 6 will be described later.

The transport main body unit 912 transfers the material Wa, which is placed on the material pallet 1 from the storage unit 911 and supplied, to the processing pallet 2 that goes in and out of the laser processing device 92. The transport main body portion 912 has an entrance / exit 914 through which the processing pallet 2 enters and exits at a portion facing the laser processing device 92. The transport main body 912 transports the machining pallet 2 to and from the laser machining device 92 through the entrance / exit 914. The lifter section 913 temporarily retracts the two machining pallets 2A and 2B to the outside of the transport body section 912 in order to simultaneously operate the two machining pallets 2A and 2B between the transport body section 912 and the laser machining device 92. In addition, it is possible to change the positions of the two processing pallets 2A and 2B in the upper and lower two stages in the transport main body 912.

The laser processing device 92 has a laser processing head 921. The laser machining head 921 moves independently in each of the X-axis, Y-axis, and Z-axis directions, and irradiates the material Wa placed on the machining pallet 2 with the laser beam Ls to perform machining such as cutting or drilling. Apply. The laser machining head 921 ejects the assist gas toward the machining site during laser machining.

The processing pallet 2 moves to the left from the transfer main body 912 of the pallet transfer device 91 through the doorway 914 with the material Wa mounted on it, and is carried into the laser processing device 92. The material Wa mounted on the processing pallet 2 and supplied to the laser processing apparatus 92 is laser-processed by the laser processing head 921 to become a processed material Wb. After laser machining, the machining pallet 2 moves to the right with the machined material Wb placed on it, and moves to the transport main body 912 of the pallet transport device 91 through the entrance / exit 914.

With these schematic configurations, the laser processing system ST separates the material Wa to be processed next from the material pallet 1 while processing one material Wa placed on one processing pallet 2A by the laser processing apparatus 92. It can be transferred to the processing pallet 2B. Therefore, in the laser machining system ST, when the machining of the material Wa of the machining pallet 2A is completed and the machining pallet 2A is returned to the transport main body 912 through the entrance / exit 914, the position of the machining pallet 2A and the machining pallet 2B is changed immediately. The processing pallet 2B on which the following material Wa is placed can be put into the laser processing apparatus 92. As a result, the laser processing system ST has high productivity.

Next, each member and device will be specifically described. The transport main body portion 912 is a hexahedron frame-shaped body. The transport main body portion 912 is arranged so as to be connected to the laser processing device 92. The storage portion 911 is arranged so as to be connected to the rear portion of the transport main body portion 912. The storage unit 911 and the transport body unit 912 reciprocate the material pallet 1 between the storage unit 911 and the transport body unit 912 at a position P1 above the center in the vertical direction of the transport body unit 912 as shown by an arrow D2. Support as much as possible. The material pallet 1 has a size capable of mounting a material Wa, which is, for example, a plate material to be processed by the laser processing apparatus 92. The material pallet 1 reciprocates between the storage unit 911 and the transport main body unit 912. In the storage unit 911, a plurality of material Wa are laminated on the material pallet 1 by a robot or the like from an automated warehouse connected to the storage unit 911. A plurality of laminated material Wa is referred to as a laminated body Wt.

The single-sheet taking unit 3 is provided in the upper part of the inside of the transport main body 912. The single-sheet taking unit 3 has a plurality of suction portions 3a that suck and hold the plate material in a horizontal posture from above. As shown by the arrow D3, the plurality of suction portions 3a are integrated with the plate material sucked between the upper position P3 above the suction position P2 and the lower position P4 located at the lower part of the transport main body portion 912. Move to.

As a result, the single-sheet taking unit 3 sucks and holds the highest single material Wa from the laminated body Wt placed on the material pallet 1 moved from the storage unit 911 to the transport main body 912 by the suction unit 3a, and holds the suction. The material Wa can be moved between the upper position P3 and the lower position P4.

A switch rack 4 is installed at the lower part of the inside of the transport main body 912. The switch rack 4 is substantially box-shaped and has two upper and lower upper holding portions 4c and a lower holding portion 4d. The upper holding portion 4c and the lower holding portion 4d can each hold the processing pallet 2 on which they are placed. The switch rack 4 has a left opening 4a that opens to the left and connects to the laser processing apparatus 92, and a front opening 4b that opens to the front and connects to the lifter tray 5.

The switch rack 4 moves up and down as shown by arrow D6 between the lower position shown by the solid line in FIG. 1 and the upper position shown by the alternate long and short dash line. In the lower position, the upper holding portion 4c is located at the position P5 in the vertical direction of the upper holding portion 4c. In the upper position, the upper holding portion 4c is located at the position P6 above the position P5.

When the switch rack 4 is in the lower position, the upper holding portion 4c and the laser processing device 92 are connected, and the processing pallet 2 mounted on the upper holding portion 4c is indicated by an arrow D4 between the upper holding portion 4c and the laser processing device 92. Movable as shown. When the switch rack 4 is in the upper position, the lower holding portion 4d and the laser processing device 92 are connected, and the processing pallet 2 mounted on the lower holding portion 4d is between the lower holding portion 4a and the laser processing device 92. Is movable as shown by arrow D4.

When the switch rack 4 is in the lower position, the processing pallet 2 mounted on the lower holding portion 4d can enter and exit the lifter tray 5 in the lower position through the front opening 4b as shown by the arrow D5. When the processing pallet 2 moves from the switch rack 4 to the lifter tray 5 at the lower position and the lifter tray 5 mounts the processing pallet 2 and rises to the center position, the lifter tray 5 is connected to the upper holding portion 4c of the switch rack 4 at the lower position. Then, the processing pallet 2 can be moved between the lifter tray 5 and the upper holding portion 4c. In this way, the processing pallet 2 can be moved between the upper holding portion 4c and the lower holding portion 4d of the switch rack 4 via the lifter tray 5.

When the switch rack 4 is in the upper position, the processing pallet 2 in the upper holding portion 4c can be accessed by the single-sheet taking unit 3 descending to the lower position P4. That is, the single-sheet taking unit 3 can put the adsorbed material Wa on the processing pallet 2. Further, the processed material Wb placed on the processing pallet 2 can be adsorbed and lifted up to the upper position P3 away from the processing pallet 2.

A product pallet (not shown) can be reciprocated between the storage unit 911 and the transport main body unit 912 in the same manner as the material pallet 1. As a result, the single-sheet taking unit 3 lifts the processed material Wb adsorbed from the processing pallet 2 to the upper position P3, and then moves the processed material Wb from the storage unit 911 to the transport main body unit 912 on the processed material Wb. Can be placed. After that, the product pallet on which the processed material Wb is placed moves to the storage unit 911, and the processed material Wb is carried out to a predetermined place by a robot or the like.

As shown in FIG. 2, the processing pallet 2 has a frame-shaped base portion 21 and a plurality of thin plate skids 23. The plurality of skids 23 are referred to as skid group 23G. The base portion 21 is a rectangular frame in a plan view. A plurality of skids 23 are arranged side by side at predetermined intervals in the X-axis direction, which is the longitudinal direction, in a posture extending in the Y-axis direction, which is the lateral direction of the base portion 21. The skid 23 is formed of, for example, a rolled steel plate for general structure having a thickness of 12 mm. The base portion 21 has a support frame 22 at the center in the lateral direction. The support frame 22 extends in the longitudinal direction and engages and supports the skid 23 at its central portion.

As shown in FIGS. 2 and 3, the skid 23 has a strip-shaped base 233 and a support 234 formed on the upper edge of the base 233. The support portion 234 has a plurality of groove portions 232 repeatedly formed at a predetermined pitch. Each groove portion 232 is formed by being cut in an inverted isosceles triangle shape having the apex below the upper end portion of the support portion 234. That is, the support portion 234 has a substantially saw blade shape in which a plurality of narrow isosceles triangular support pieces 236 having an upper apex as the apex in the side view are juxtaposed and formed so as to project.

The height position of each of the top portions 231 of the plurality of support pieces 236 in the support portion 234 is constant, whereby the skid group 23G supports the mounted plate material without distortion. As shown in FIG. 3, in the processing pallet 2, the plurality of skids 23 are attached so that the positions of the top portions 231 of the adjacent skids 23 in the Y direction are offset by a half pitch in the side view. That is, as the skid 23, two types of skids 23a and skids 23b whose tops 231 are displaced from each other when attached to the base portion 21 are alternately installed to form a skid group 23G which is a group of a plurality of skids 23 as a whole. ing.

With the above configuration, the material Wa processed by the laser processing device 92 is placed on the material pallet 1 in the storage unit 911, and then moves to the transport main body unit 912 together with the material pallet 1. The material Wa that has moved to the transport main body portion 912 is lifted by the single sheet taking unit 3 and transferred to the processing pallet 2A that is waiting in the upper holding portion 4c of the switch rack 4 at the upper position. After that, the switch rack 4 descends from the upper position to the lower position, and the processing pallet 2A of the upper holding portion 4c is put into the laser processing apparatus 92 with the material Wa mounted on it.

While the laser machining apparatus 92 is machining the material Wa mounted on the machining pallet 2A, the machining pallet 2B held by the lower holding portion 4d of the switch rack 4 passes through the front opening 4b of the switch rack 4. Move to the lifter tray 5 at the lower position. When the processing pallet 2B moves, the lifter tray 5 rises to the center position together with the processing pallet 2B. When the lifter tray 5 reaches the center position, the processing pallet 2B moves to the empty upper holding portion 4c of the switch rack 4 and waits for the next material Wa to be loaded from the single sheet taking unit 3.

As described above, in the laser machining system ST, immediately before the start of machining by the laser machining device 92, the first machining pallet 2 on which the material Wa is placed moves from the transport main body 912 to the laser machining device 92. Further, an empty second processing pallet 2 on which nothing is placed goes in and out between the switch rack 4 and the lifter tray 5.

Next, the liquid coating device 6 will be described with reference to FIGS. 1 and 4 to 6. FIG. 4 is a schematic side view showing the arrangement positions of the upper nozzle group 7 and the lower nozzle group 8 with respect to the processing pallet 2. FIG. 5 is a schematic front view for explaining a liquid coating range in the liquid coating device 6. FIG. 6 is a piping system diagram of the liquid coating device 6.

As shown in FIG. 1, the upper nozzle group 7 and the lower nozzle group 8 of the liquid coating device 6 are arranged in the front-rear direction at the upper part and the lower part of the entrance / exit 914 of the transfer main body portion 912 of the pallet transfer device 91, respectively. .. As shown in FIGS. 4 and 5, the liquid coating device 6 is a processing pallet 2 that passes through the entrance / exit 914 when the processing pallet 2 on which the material Wa is placed moves from the transport main body portion 912 to the laser processing device 92. The mist ML of the liquid M is sprayed and applied to the skid group 23G and the material Wa.

As shown in FIGS. 1 and 6, the liquid coating device 6 has a main body portion 61 including a tank 61a, an upper supply path 64, an upper nozzle group 7, a lower supply path 65, and a lower nozzle group 8. The tank 61a houses the material Wa and the liquid M to be applied to the skid group 23G and the like, and is connected to the high-pressure air source AR. The liquid M is, for example, a spatter adhesion inhibitor that prevents spatter or dross from adhering to the skid 23.

As shown in FIG. 6, the upper nozzle group 7 includes five upper nozzles 71 to 75. The first end side of the upper supply path 64 is connected to the tank 61a, and the second end side opposite to the first end is branched into three branch lines 641 to 643 via the decompressor 764.

The branch path 641 branches into three paths via the electromagnetic on-off valve 761 and is connected to the upper nozzles 71 to 73, respectively. The shunt 642 is connected to the upper nozzle 74 via an electromagnetic on-off valve 762. The shunt 643 is connected to the upper nozzle 75 via an electromagnetic on-off valve 763.

The lower nozzle group 8 has nozzle sets 81 to 88. The nozzle sets 81 to 88 are composed of a pair of lower nozzles whose symbols are distinguished by a and b, respectively. For example, the nozzle set 81 is a set including the lower nozzle 81a and the lower nozzle 81b. As shown in FIG. 5, in each nozzle set of the lower nozzle group 8, the pair of lower nozzles are tilted in the transport direction of the processing pallet 2 with respect to the straight upward direction in the front view, in the upper left direction or the upper right direction. Inject mist ML. In FIG. 5, on behalf of a plurality of nozzle sets, the lower nozzle 81a and the lower nozzle 81b of the nozzle set 81 inject mist ML in the upper left direction or the upper right direction in which the lower nozzle 81a and the lower nozzle 81b are tilted by an angle θ with respect to the direction directly above. It shows the state. The angle θ is 15 ° or less, for example, 5 °. More specifically, in front view, one lower nozzle 81a of the nozzle set 81 ejects mist ML in the upper left direction, and the other lower nozzle 81b of the nozzle set 81 ejects mist ML in the upper right direction. The same applies to the other nozzle sets 82 to 88. Here, the left direction is the traveling direction in which the machining pallet 2 is conveyed toward the laser machining apparatus 92, as indicated by the arrow D4. The right direction is the direction opposite to the traveling direction in which the machining pallet 2 is conveyed toward the laser machining device 92.

The lower supply path 65 includes two supply paths, a supply path 65a and a supply path 65b. In the supply path 65a, the first end side is connected to the tank 61a, and the second end side opposite to the first end is a total of eight lower nozzles 81a to 84a of the nozzle set 81 to 84 via the electromagnetic on-off valve 891. It is connected in parallel to 81b to 84b.

The first end side of the supply path 65b is connected to the tank 61a, and the second end side opposite to the first end is branched into two branch lines 65b1 and 65b2. The second end side of the shunt 65b1 opposite to the first end is connected in parallel to the four lower nozzles 85a, 85b, 86a, 86b of the nozzle sets 85, 86 via the electromagnetic on-off valve 892. The second end side of the shunt 65b2, which is opposite to the first end, is connected in parallel to the four lower nozzles 87a, 87b, 88a, 88b of the nozzle sets 87, 88 via the electromagnetic on-off valve 893.

The opening / closing operation of the electromagnetic on-off valves 761 to 763 corresponding to the upper nozzle group 7 and the electromagnetic on-off valves 891 to 893 corresponding to the lower nozzle group 8 is controlled by the control device 93. As a result, the liquid M is ejected as mist ML from the nozzle connected to the electromagnetic on-off valve opened by the control device 93. For example, when the electromagnetic on-off valve 892 is opened by the control device 93, the liquid M contained in the tank 61a passes through the shunt 65b1 and is ejected as mist ML from the lower nozzles 85a, 85b, 86a, 86b.

The upper nozzles 71 to 75 of the upper nozzle group 7 and the lower nozzles 81a to 88a and 81b to 88b of the lower nozzle group 8 are fan-shaped nozzles. The fan-shaped nozzle is a nozzle that ejects mist ML into a range of an elongated shape having a length in one direction. The elongated shape is, for example, an elongated rectangle, an elongated ellipse, and the like. The width of this elongated shape does not have to be constant, and the center in the longitudinal direction does not have to be the maximum width. The upper nozzles 71 to 75 and the lower nozzles 81a to 88a and 81b to 88b are arranged in such a posture that the longitudinal direction of the ejection range is the Y-axis direction.

The arrangement position of each nozzle in the upper nozzle group 7 and the lower nozzle group 8 in the Y-axis direction corresponds to the size of the standard plate when the material Wa mounted on the skid group 23G of the processing pallet 2 is a plate material. The control device 93 sets an XY coordinate system with the X-axis and the Y-axis as reference axes for the skid group 23G of the machining pallet 2. In the XY coordinate system, coordinates (Px0, Py0) are set as reference positions of the material Wa or the like to be placed on the processing pallet 2. That is, when the material Wa of the standard plate is placed on the skid group 23G, one corner of the material Wa is positioned at the coordinates (Px0, Py0), and the pair of long sides and short sides are X-axis and Y-axis, respectively. Make it parallel to.

The reference position Px in the X-axis direction is set to a position close to the left end of the processing pallet 2 as shown in FIG. The reference position Py in the Y-axis direction is set to a position close to the front end of the machining pallet 2 as shown in FIG. The main types of standard-sized plates mounted on the skid group 23G of the processing pallet 2 are the following three types. That is, they are commonly known as 3 × 6 plates (size: 914 mm × 1829 mm), commonly known as 4 × 8 plates (size: 1219 mm × 2438 mm), and commonly known as 5 × 10 plates (size: 1524 mm × 3048 mm).

One corner of each standard plate is positioned at the reference positions Px and Py of the coordinates (Px0, Py0) with respect to the processing pallet 2, and the two orthogonal sides of each standard plate are parallel to the X and Y axes, respectively. Put it in the posture that becomes. In this case, in FIG. 4, the widths of the 3 × 6 plate, the 4 × 8 plate, and the 5 × 10 plate in the Y-axis direction are the positions Py1 and the position Py2, respectively, from the position Py where the Y coordinate in the skid group 23G is Py0. And the width up to the position Py3. Similarly, in FIG. 5, the lengths of the 3 × 6 plate, the 4 × 8 plate, and the 5 × 10 plate in the X-axis direction are from the position Px whose X coordinate is Px0 to the position Px1, the position Px2, and the position Px3, respectively. Indicated by the length of.

As shown in FIG. 4, the upper nozzles 71 to 73 are arranged at approximately equal intervals from the front side to the rear side above the range from the position Py to the position Py1, which is the range corresponding to the width of the 3 × 6 plate. ing. The mist MLs 71 to ML73, which are mist MLs ejected from each of the upper nozzles 71 to 73, are partially overlapped and are evenly sprayed into the range of position Py to position Py1 of the skid group 23G of the processing pallet 2.

As shown in FIG. 4, the upper nozzle 74 is arranged above the range from the position Py1 to the position Py2, which is the range corresponding to the portion of the width of the 4 × 8 plate larger than the 3 × 6 plate. .. The mist ML74 ejected from the upper nozzle 74 is evenly sprayed into the range from the position Py1 to the position Py2 of the skid group 23G of the processing pallet 2.

As shown in FIG. 4, the upper nozzle 75 is arranged above the range from the position Py2 to the position Py3, which is the range corresponding to the portion of the width of the 5 × 10 plate larger than the 4 × 8 plate. .. The mist ML75 ejected from the upper nozzle 75 is evenly sprayed into the range from the position Py2 to the position Py3 of the skid group 23G of the processing pallet 2.

In this way, the pallet transfer device 91 opens the electromagnetic on-off valve 761 of the liquid coating device 6 so that the skid 23 in the processing pallet 2 is in the range of position Py to position Py1 corresponding to the 3 × 6 plate. Liquid M can be sprayed and applied. Further, when the 3 × 6 plate is placed at a predetermined position of the skid group 23G, the liquid can be sprayed and applied to the entire width range of the upper surface of the 3 × 6 plate.

The pallet transfer device 91 sprays and coats the liquid M in the range from the position Py to the position Py2 corresponding to the 4 × 8 plate by opening the electromagnetic on-off valve 761 and the electromagnetic on-off valve 762 of the liquid coating device 6. can. Further, when the 4 × 8 plate is placed at a predetermined position of the skid group 23G, the liquid can be sprayed and applied to the entire width range of the upper surface of the 4 × 8 plate.

The pallet transfer device 91 can spray and apply the liquid M to the range from the position Py to the position Py3 corresponding to the 5 × 10 plate by opening the electromagnetic on-off valves 761 to 763 of the liquid coating device 6. Further, when the 5 × 10 plate is placed at a predetermined position in the skid group 23G, the liquid M can be sprayed and applied to the entire width range of the upper surface of the 5 × 10 plate.

As shown in FIG. 4, in the skid group 23G, below the range of the position Py to the position Py1, which is the range corresponding to the width of the 3 × 6 plate, the nozzle sets 81 to 84 are located from the front side to the rear side. They are arranged in order. The mist ML81 to ML84 ejected upward from each of the nozzle sets 81 to 84 is sprayed onto at least the range from the position Py to the position Py1 of the skid group 23G of the processing pallet 2. That is, the mists ML81 to ML86 ejected from the nozzle sets 81 to 84 are evenly sprayed onto the entire width range of the lower surface of the 3 × 6 plate placed at the predetermined position of the skid group 23G.

As shown in FIG. 4, below the range of the position Py1 to the position Py2, which is the range corresponding to the portion of the skid group 23G having a width larger than the 3 × 6 plate, the nozzle set 85. , 86 are arranged. The mist ML85 and ML86 ejected upward from the nozzle sets 85 and 86 are sprayed onto at least the range from the position Py1 to the position Py2 of the skid group 23G of the processing pallet 2. That is, the liquid M is evenly applied to the entire width range of the lower surface of the 4 × 8 plate placed at the predetermined position of the skid group 23G by the mist ML81 to ML86 ejected from the nozzle sets 81 to 86.

As shown in FIG. 4, the nozzle set 87 is below the range from position Py2 to position Py3, which is a range corresponding to a portion of the skid group 23G having a width of 5 × 10 plates larger than that of 4 × 8 plates. , 88 are arranged. The mist ML87 and ML88 ejected upward from the nozzle sets 87 and 88 are sprayed onto at least the range from the position Py2 to the position Py3 of the skid group 23G of the processing pallet 2. That is, the mist ML81 to ML88 ejected from the nozzle sets 81 to 88 sprays the liquid M evenly over the entire width range of the lower surface of the 5 × 10 plate placed at the predetermined position of the skid group 23G.

When a spatter adhesion inhibitor is applied as the liquid M in order to prevent deposits such as spatter or dross from adhering to each skid 23, the surface of the base 233 and the end face 235 of the groove 232 in the skid 23 are coated. , It is necessary to apply the spatter adhesion inhibitor evenly. The end surface 235 of the groove portion 232 is the same portion as the end surface 235 of the support piece 236. Since the end face 235 of the groove portion 232 faces upward, the spatter adhesion preventive agent can be applied to the end face 235 by spraying the spatter adhesion preventive agent as mist ML from the upper nozzle portion 62 located above the skid 23. can.

On the other hand, in the pallet transfer device 91, the upper nozzle portion 62 is responsible for applying the spatter adhesion preventive agent to the upper surface Wa 1 of the material Wa placed on the processing pallet 2, and the lower nozzle portion 63 is responsible for spattering the end surface 235 of the groove portion 232. It is responsible for applying the anti-adhesion agent.

FIG. 7 is a side view showing a mode in which the spatter adhesion inhibitor is applied to the groove portion 232 by the lower nozzle 83a in the lower nozzle portion 63. The material Wa is supported by a plurality of skid 23 tops 231. As shown in FIG. 7, the lower nozzle 83a is a fan-shaped nozzle as described above. The mist ML of the spatter adhesion inhibitor ejected upward from the lower nozzle 83a is sprayed onto the lower surface Wa2 of the material Wa in a rectangular range having a length PR1 in the longitudinal direction, which is long in the Y-axis direction.

The processing pallet 2 is open below the skid group 23G except for the base portion 21 of the frame body that supports the skid group 23G and the support frame 22 extending in the longitudinal direction arranged in the center of the base portion 21 in the lateral direction. Therefore, almost all of the mist ML ejected from the lower side to the upper side of the processing pallet 2 reaches the lower surface Wa 2 of the material Wa mounted on the skid group 23G.

The spatter adhesion inhibitor sprayed on the lower surface Wa2 hits the lower surface Wa2 and rebounds randomly, and a part of the rebound reaches the end surface 235 of the groove 232 of the skid 23. Therefore, the spatter adhesion inhibitor that randomly bounces off the lower surface Wa2 reaches the end surface 235 from various angles. Similarly, the spatter adhesion inhibitor reaches the side surfaces of the groove portion 232 and the base portion 233 from various angles. As a result, the spatter adhesion inhibitor is evenly and evenly applied to the side surface of the base portion 233 and the groove portion 232 of the skid 23 and the end surface 235 of the groove portion 232. Further, each of the plurality of nozzle sets 81 to 88 of the lower nozzle group 8 has a pair of lower nozzles. Then, to explain the nozzle set 81 as a representative, as described above, the nozzle set 81 has a pair of lower nozzles 81a and 81b, and the direction of ejection of the lower nozzle 81a and the lower nozzle 81b upward from the mist ML is The processing pallet 2 carried into the laser processing apparatus 92 is tilted toward the front side and the rear side in the moving direction (X-axis direction), not directly above. This also applies to the other nozzle sets 82 to 88. Therefore, mist ML is sprayed from both the left side and the right side in the X-axis direction on the side surfaces of the base portion 233 and the groove portion 232 of the skid 23, and the mist ML bounces on the lower surface Wa 2 of the material Wa and diffuses over a wider range. do. As a result, the spatter adhesion inhibitor is applied more evenly and more evenly to the base portion 233 and the side surface of the groove portion 232 of the skid 23 and the end surface 235 of the groove portion 232.

The control device 93 controls the injection timing of the mist ML from the upper nozzle group 7 and the lower nozzle group 8. Specifically, the injection timing is controlled according to the size of the material Wa placed on the processing pallet 2. More specifically, the control device 93 ejects the mist ML from the upper nozzle group 7 toward the material Wa while the material Wa of the processing pallet 2 is passing directly under the upper nozzle group 7, and the material Wa of the processing pallet 2 is lower. While passing directly above the nozzle group 8, the mist ML is ejected from the lower nozzle group 8 toward the material Wa.

As shown in FIG. 5, the upper nozzle group 7 and the lower nozzle group 8 are arranged so as to face each other at the same position P78 in the X-axis direction. Mist ML is ejected from the upper nozzle group 7 and the lower nozzle group 8 while the processing pallet 2 is moving from the transport main body 912 toward the laser processing device 92 toward the left of the arrow D4 also shown in FIG. .. The control device 93 controls the movement of the processing pallet 2, and when the material Wa mounted on the skid group 23G of the processing pallet 2 is a 3 × 6 plate, a 4 × 8 plate, and a 5 × 10 plate, it corresponds to each. It controls the ejection operation of the mist ML.

The control device 93 grasps whether or not the material Wa is mounted on the skid group 23G and the size of the loaded material Wa by referring to the processing information supplied from the outside in advance including such information. do. Whether or not the material Wa is mounted and the size of the material Wa are determined by determining whether or not the metal member is mounted on the skid group 23G of the processing pallet 2 on the pallet transfer device 91 and the size when the material Wa is mounted. A plurality of sensors to be detected may be provided, and the control device 93 may be configured to acquire the sensors based on the detection information of the sensors.

When the material Wa mounted on the skid group 23G is a 3 × 6 plate, the control device 93 sets the position P78 where the upper nozzle group 7 and the lower nozzle group 8 are installed at least from the position Px on the processing pallet 2 to the position Px1. Mist ML is ejected while passing. In the case of the 4 × 8 plate, the control device 93 ejects the mist ML from the position P78 where the upper nozzle group 7 and the lower nozzle group 8 are installed, at least while the position Px2 passes from the position Px. In the case of the 5 × 10 plate, the control device 93 ejects the mist ML from the position P78 where the upper nozzle group 7 and the lower nozzle group 8 are installed, at least while the position Px3 passes from the position Px.

By the above-mentioned liquid coating method, in the pallet transfer device 91, the spatter adhesion inhibitor is applied to at least the portion of the skid group 23G to be processed, so that wasteful consumption of the spatter adhesion inhibitor can be suppressed.

By providing the above-mentioned liquid coating device 6, the pallet transfer device 91 can automatically and evenly apply the spatter adhesion inhibitor to the entire surface including the end surface 235 of the groove portion 232 of each skid 23 of the processing pallet 2. Specifically, as shown in FIG. 8, the pallet transfer device 91 includes the upper nozzle group 7 and the upper nozzle group 7 which are vertically separated from each other in the vicinity of the entrance / exit 914 where the processing pallet 2 enters and exits the laser processing device 92. It has a nozzle portion 66 including a lower nozzle group 8.

The control device 93 passes the processing pallet 2 on which the material Wa is placed from the pallet transport device 91 toward the laser processing device 92 between the upper nozzle group 7 and the lower nozzle group 8, and at that time, the upper nozzle group The mist ML of the liquid M is ejected from the 7 and the lower nozzle group 8 toward the material Wa. As a result, the coating film MT7 of the spatter adhesion inhibitor sprayed from the upper nozzle group 7 adheres to the upper surface Wa1 of the material Wa placed on the skid group 23G of the processing pallet 2. At the same time, the coating film MT8 of the spatter adhesion inhibitor sprayed from the lower nozzle group 8 is applied to the entire surface including the lower surface Wa 2 of the material Wa and the end surface 235 of the groove 232 of each skid 23 in the range corresponding to the material Wa. adhere to.

As described above, the mist ML of the spatter adhesion preventive agent ejected upward from the lower nozzle group 8 is the end face of the groove portion 232 in the range corresponding to the lower surface Wa 2 of the material Wa and the material Wa of the skid 23 placed on the processing pallet 2. It adheres as a liquid film to the entire surface including 235. As a result, spatter or dross is less likely to adhere to each skid 23, and the cleaning frequency of the skid 23 can be reduced. In addition, since spatter or dross is less likely to adhere to each skid 23, the material Wa placed on the skid group 23G is less likely to be scratched, the material Wa is stably and horizontally held, and the quality of laser cutting is highly maintained. To.

On the other hand, the mist ML of the spatter adhesion preventive agent ejected downward from the upper nozzle group 7 is sprayed onto the upper surface Wa 1 of the material Wa placed on the processing pallet 2 and applied. As a result, the melt generated when the material Wa is laser machined is easily separated from the material Wa by the assist gas sprayed on the machined part and discharged downward, and the dross adheres to the cut part or the skid 23. It becomes difficult to do.

The application of the spatter adhesion inhibitor to the skid group 23G and the upper surface Wa 1 of the material Wa is executed in accordance with the charging operation from the transport main body 912 of the processing pallet 2 to the laser processing apparatus 92. Therefore, the process and takt time do not increase, and the productivity is maintained at a high level without deterioration.

9 to 11 are diagrams showing a laser processing system STA which is a modification of the laser processing system ST according to the above embodiment. The laser processing system STA replaces the pallet transfer device 91 of the laser processing system ST with the pallet transfer device 91A. The pallet transfer device 91A has a liquid application device 6A in which an upper nozzle portion 62A including an upper nozzle group 7A is added to the liquid application device 6 of the pallet transfer device 91. FIG. 9 is a perspective view showing a schematic configuration of the laser processing system STA. FIG. 10 is a piping system diagram of the liquid coating device 6A. FIG. 11 is a schematic side view showing the spraying operation of the mist ML on the processing pallet 2 of the liquid coating device 6A.

As shown in FIG. 9, the upper nozzle portion 62A of the liquid coating device 6A is upward with respect to the skid group 23G of the processing pallet 2 that moves between the upper holding portion 4c of the switch rack 4 and the lifter tray 5 at the center position. It is arranged at a position where mist ML can be sprayed from. As shown in FIG. 10, the liquid coating device 6A branches from the two-way electromagnetic switching valve 67 arranged in the middle of the upper supply path 64 and the two-way electromagnetic switching valve 67 with respect to the configuration of the liquid coating device 6. It has an upper supply shunt 64A connected to the upper nozzle group 7A.

The upper nozzle group 7A has, for example, the same configuration, and has an upper nozzle 71A to 75A and an electromagnetic on-off valve 761A to 763A for controlling the opening and closing of the upper nozzles 71A to 75A by three systems, respectively. The operations of the two-way electromagnetic switching valve 67 and the electromagnetic on-off valves 761A to 763A are controlled by the control device 93.

As shown in FIG. 11, the pallet transfer device 91A skids by the upper nozzle group 7A when the machined pallet 2 on which nothing is placed is moved between the upper holding portion 4c of the switch rack 4 and the lifter tray 5. The mist ML of the spatter adhesion inhibitor can be sprayed onto the group 23G from above. Depending on the operation mode of the pallet transfer device, the transfer step of the processing pallet 2 may include a cleaning step of the skid group 23G by reciprocating between the switch rack 4 and the lifter tray 5 and using a brush (not shown). When the machining pallet 2 is moved after cleaning with the brush, the control device 93 operates the liquid coating device 6A with only the upper supply shunt 64A open by the two-way electromagnetic switching valve 67, and spatters the skid group 23G. The operation is controlled so that the anti-adhesion agent is applied. As a result, it is possible to automate the application of the spatter adhesion inhibitor to the skid group 23G and prevent a decrease in productivity.

The laser processing systems ST and STA can apply the liquid M to each skid 23 of the skid group 23G by spraying the mist ML upward from below with the material Wa mounted on the skid group 23G. As a result, a liquid film is sufficiently formed on the entire surface including the end face 235 of the skid 23. This is because the mist ML bounced off the lower surface Wa2 in various directions and the droplets dripping from the lower surface Wa2 adhere to the surface of the skid 23. In the laser processing systems ST and STA, the liquid film formed by applying the liquid M is evenly thicker than the case where the mist ML is sprayed from above without placing anything on the skid group 23G. Further, in the laser machining systems ST and STA, a part (for example, half) of the pair of lower nozzles 81a to 88a and 81b to 88b of the lower nozzle group 8 is carried into the laser machining apparatus 92 on the front side in the traveling direction of the machining pallet 2. The mist ML is ejected diagonally upward in front of the laser, and the rest ejects mist ML diagonally upward in the rear side in the traveling direction. As a result, a more even and uniform liquid film can be formed on the entire surface including the end face 235 of the skid 23.

The number of processing pallets 2 simultaneously transported by the pallet transport devices 91 and 91A, the reprinting procedure from the material pallet 1, and the like are not limited to the above-mentioned contents. At least, the pallet transfer device 91, 91A may be capable of executing the liquid coating operation when moving the processing pallet 2 on which the material Wa before processing is placed from the pallet transfer device 91, 91A to the laser processing device 92. Further, the pallet transport device 91A may be capable of executing the liquid coating operation in the in / out operation of temporarily retracting the processing pallet 2 from the transport main body 912 to the lifter tray 5.

The liquid M sprayed onto the skid group 23G and the material Wa is not limited to the spatter adhesion inhibitor.

Although the embodiments of the present invention have been described above, the above-described embodiments do not limit the present invention. Those skilled in the art can make various modifications and changes in specific embodiments without departing from the technical idea and scope of the present invention.

The entire contents of Japanese Patent Application No. 2020-107678 filed on June 23, 2020 are incorporated herein by reference.

Claims (8)

1. A laser processing device that performs laser processing on materials and
   A pallet transfer device that transfers a processing pallet containing a skid group having a plurality of skids to the laser processing device, and a pallet transfer device.
   A liquid coating device including a lower nozzle group that sprays liquid as a mist from below on the processing pallet transferred from the pallet transfer device to the laser processing device.
   Laser processing system equipped with.
2. The lower nozzle group has a plurality of lower nozzles and has a plurality of lower nozzles.
   The laser processing system according to claim 1, wherein the plurality of lower nozzles are fan-shaped nozzles.
3. The laser processing system according to claim 2, wherein the plurality of lower nozzles eject the mist in a state of being tilted in a state in which the processing pallet is tilted in a transport direction to the laser processing apparatus.
4. The plurality of lower nozzles are configured as a pair of pairs of lower nozzles.
   One of the lower nozzles of the pair of sets ejects the mist to the front side in the traveling direction in the transport direction.
   The laser processing system according to claim 3, wherein the other lower nozzle of the pair of sets ejects the mist to the rear side in the traveling direction in the transport direction.
5. Each of the plurality of skids
   A strip-shaped base and
   A support portion that is located at the upper edge of the base portion and supports the material, and has a triangular shape with an upper apex and includes a plurality of parallel support pieces.
   Equipped with
   In the laser machining system, the lower nozzle group sprays the liquid as a mist from below and hits the lower surface of the material placed on the skid group of the machining pallet, and the mist of the liquid that hits the lower surface and bounces off the liquid. The laser processing system according to any one of claims 1 to 4, wherein a liquid is applied to the end faces of the plurality of support pieces.
6. The laser processing system according to any one of claims 1 to 5, wherein the liquid is a spatter adhesion inhibitor.
7. The laser according to any one of claims 1 to 6, wherein the liquid coating apparatus includes an upper nozzle group that sprays the liquid as a mist from above on the processing pallet and the material placed on the processing pallet. Processing system.
8. A processing pallet containing a skid group having a plurality of skids is carried into a laser processing device together with a material placed on the skid group.
   A liquid is sprayed from below as a mist onto the carried-in processing pallet to hit the lower surface of the material, and the liquid is applied to the upward end face of the skid by the mist of the liquid that hits the lower surface and bounces off.
   A method of applying liquid to a processing pallet equipped with.

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