KR20190080729A - Coating apparatus and control method thereof - Google Patents

Abstract

The present invention is able to prevent the drying of the front end of a nozzle even if the waiting time of the nozzle becomes long and suppress the discharge amount of coating liquid at the time of preliminary discharge. A coating apparatus (100) provided by the present invention comprises: a transfer device (40) which relatively transfers a substrate (S) and a nozzle (20); a standby unit (30) which is able to arrange the nozzle (20) by the transfer device (40); and a control unit (50) which controls the nozzle (20) and the transfer device (40). The standby unit (30) has a supply unit (31) supplying supply liquid to the front end (21) of the nozzle (20). The control unit (50) has: a determination unit (52) which determines if the nozzle (20) exceeds predetermined standby time in the standby unit (30); and an indication unit (53) which operates the transfer device (40) to provide supply liquid as much as predetermined supply time by the supply unit (31) to the front end (21) of the nozzle (20) when the determination unit (52) determines that predetermined standby time is exceeded.

Description

TECHNICAL FIELD [0001] The present invention relates to a coating apparatus and a coating apparatus,

The present invention relates to a coating device and a control method of the coating device.

2. Description of the Related Art In order to form a thin film on a substrate such as a semiconductor or glass, a coating apparatus for discharging a predetermined liquid from a nozzle such as a slit nozzle is known (see, for example, Patent Document 1). Recently, a so-called Fan-out Panel Level Package (PLP) technique has been proposed as an example of a method of manufacturing an electronic device. In the fan-out type PLP technology, for example, a separation layer deformed by absorption or heating of light is formed on a support such as a semiconductor wafer, and a layer having an electronic component thereon (this layer is sometimes referred to as a substrate) Are laminated to form a laminate.

Thereafter, light or heat is applied to the separation layer to separate the layer (substrate) having the electronic component from the support and the layer (substrate) having the electronic component is cut for each electronic component to obtain the electronic device. It has also been proposed to use a quadrangular glass support as the support. In the fan-out type PLP technology using such a glass support, the coating liquid for forming the separation layer is applied to a glass support and dried, . For applying the coating liquid to the glass support, for example, application of the above-described coating apparatus having a slit nozzle or the like may be considered.

Japanese Patent Application Laid-Open No. 2006-167639

Usually, in a case where a coating operation is performed on a substrate, the coating apparatus usually applies a coating liquid to a glass support or the like after cleaning the tip of the nozzle by previously discharging the coating liquid from the nozzle in advance. In addition, it is customary to wait the nozzle at a predetermined standby position until the next application operation is performed.

Particularly, in the case of applying the above-described coating device in the above-mentioned fan-out type PLP technology, the waiting time of the nozzle may become longer. In this case, in order to prevent the nozzle tip from drying during the waiting period, it is also possible to immerse the tip of the nozzle in the liquid for preventing drying. However, if the tip of the nozzle is immersed in the liquid for a long period of time, there is a possibility that the liquid may intrude into the nozzle from the tip of the nozzle by the capillary phenomenon. The infiltrated liquid can be discharged from the nozzle in the preliminary discharge, but in this case, it is necessary to increase the discharging amount of the coating liquid in the preliminary discharge operation, thereby unnecessarily discharging the coating liquid.

An object of the present invention is to provide a coating apparatus and a coating apparatus control method capable of suppressing the drying amount of the coating liquid in the preliminary soil release while preventing drying of the tip of the nozzle even if the waiting time of the nozzle becomes long.

According to a first aspect of the present invention, there is provided a coating device comprising a moving device for relatively moving a substrate and a nozzle, a standby part for placing the nozzle by the moving device, and a control part for controlling the nozzle and the moving device, And a supply unit for supplying a liquid to the tip of the nozzle, wherein the control unit includes: a determination unit that determines whether or not a predetermined waiting time has elapsed from the nozzle in the standby portion; and a determination unit And an instruction section for operating the moving device to supply the liquid to the leading end of the nozzle by a predetermined supply time by the supply section.

According to a second aspect of the present invention, there is provided a control method of a coating apparatus comprising a moving device for relatively moving a substrate and a nozzle, and a waiting part capable of placing the nozzle by the moving device, wherein the waiting part includes: A determination process of determining whether or not a predetermined waiting time has elapsed in a nozzle in a standby portion and a determination process of determining whether or not a predetermined waiting time has elapsed by the determination process, A supply process for operating the moving device to supply the liquid by a predetermined amount of time.

According to the present invention, even when the waiting time of the nozzle is prolonged, drying of the tip of the nozzle can be prevented, and the discharge amount of the coating liquid in the preliminary soil release can be suppressed.

1 is a side view schematically showing an example of a coating apparatus according to the first embodiment.
2 is a plan view schematically showing an example of a coating apparatus according to the first embodiment.
Fig. 3 shows an example of a nozzle, (A) is a view in the X direction, and Fig. 3 (B) is a cross-sectional view along the line AA in Fig.
Fig. 4 shows an example of a supply unit, and Fig. 4 (A) is a plan view and Fig. 4 (B) is a cross-sectional view taken along line BB of Fig.
Fig. 5 shows an example of the immersion operation in which the tip end of the nozzle is immersed in the supply liquid in the supply section. Fig. 5A is a cross-sectional view showing the immersion state, and Fig. 5B is a state in which the tip end of the nozzle is separated from the supply liquid.
6 is a cross-sectional view showing another example of the supply unit.
7 is a diagram showing an example of the preliminary ejection unit and the cleaning unit.
8 is a view showing an example of a squeegee cleaning operation.
Fig. 9 is a flowchart showing an example of a control method of a coating apparatus according to the embodiment.
Fig. 10 shows an example of the operation of the applicator and shows the state in which the nozzle is waiting at the standby position.
Fig. 11 shows an example of the operation of the application device, and shows a state in which it is preliminarily ejected.
Fig. 12 shows an example of the operation of the application device, and shows a state in which the application liquid is applied.
Fig. 13 shows an example of the operation of the application device, and shows the state in which the tip of the nozzle is immersed in the feed liquid.
Fig. 14 shows an example of the operation of the applicator and shows the state in which the nozzle is returned to the standby position.
15 is a plan view showing an example of a coating apparatus according to the second embodiment.
16 is a plan view showing an example of a coating apparatus according to the third embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, parts are emphasized or a part thereof is shown in a simplified manner in order to facilitate understanding of the respective components, and actual structures, shapes, scale, and the like may be different.

[First Embodiment]

Fig. 1 is a side view schematically showing an example of a coating apparatus 100 according to the first embodiment. Fig. Fig. 2 is a plan view schematically showing an example of the application device 100. Fig. 1 and 2, for example, in a fan-out type Fan-out Panel Level Package (PLP) technology, on a substrate S such as a glass or a semiconductor wafer serving as a support, In the case of applying a coating liquid for forming a separation layer which is altered by absorption or heating of light or when applying a coating liquid for forming an adhesive layer on the separation layer, For example, when applying a coating liquid for molding.

1 and 2, the application device 100 includes a stage 10, a nozzle 20, a standby portion 30, a moving device 40, and a control portion 50 . In describing the configuration of the application device 100, the direction in the figure will be described using an XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is referred to as an XY plane. In this XY plane, the relative movement direction between the stage 10 and the nozzle 20 is denoted as X direction, and the direction orthogonal to the X direction is denoted as Y direction. The vertical direction perpendicular to the XY plane is denoted as Z direction. It is to be noted that the directions indicated by the arrows in the drawing are the + direction and the opposite direction is the -direction in the X direction, the Y direction and the Z direction, respectively.

The stage 10 has, for example, a rectangular stage and a placement surface 11 on which the substrate S is placed. The mounting surface 11 is set to a dimension capable of supporting the substrate S. The stage 10 is provided with a holding device (not shown) for holding the substrate S placed on the placement surface 11. The holding device may be, for example, an adsorption device for vacuum-adsorbing the substrate S placed on the placement surface 11, and may be a clamp device for clamping the end portion of the substrate S placed on the placement surface 11, It may be. The stage 10 may be provided with a positioning portion for positioning the substrate S placed on the placement surface 11, for example.

On the stage 10, for example, a substrate S disposed around the coating device 100 is transported by a not shown substrate transport device. The substrate transfer device (not shown) takes out the substrate S from the stage 10. The configuration of the substrate transfer apparatus is optional, and the application apparatus 100 may include the substrate transfer apparatus. The coating apparatus 100 may also include a transfer device for transferring the substrate S to / from a substrate transfer device (not shown). The substrate S may be conveyed to the stage 10 as it is or may be placed on a tray or the like and placed on the placement surface 11 together with the tray.

On the stage 10, a coating position P3 which is one of the positions of the nozzles 20 is set. The application position P3 is a position where the application of the application liquid Q1 to the substrate S is started. The application position P3 is set in a region on the + Z side (upper side) of the stage 10. In the present embodiment, since the application position P3 is the application start position with respect to the substrate S, the substrate S placed on the stage 10 has the end on the + X side aligned with the application position P3 maintain. The application position P3 may be appropriately changed in accordance with the end on the + X side of the substrate S placed on the stage 10, instead of the fixed position. The stage 10 is not limited to being fixedly arranged, but may be movable in at least one of the X direction, the Y direction, and the Z direction by a driving device or the like.

The nozzle 20 discharges a coating liquid Q1 for forming a separation layer or the like onto the substrate S. Fig. 3 is a view showing an example of the nozzle 20. Fig. Fig. 3 (A) is a side view, and Fig. 3 (B) is a sectional view taken along the line A-A in Fig. 3 (A). The nozzle 20 is a slit nozzle. As shown in Fig. 3 (A), the nozzle 20 is an elongated shape extending in the Y direction. A slit-shaped opening 21a along the Y direction is formed at the tip 21 of the nozzle 20 in the -Z direction (downward direction). The opening 21a faces the -Z direction (downward). The nozzle 20 can discharge the coating liquid Q1 or the like in the -Z direction from the opening 21a.

The dimension of the opening 21a in the Y direction is set, for example, in conformity with the substrate S placed on the placement surface 11, and the dimension in the Y direction is set smaller than the dimension in the Y direction of the substrate S . With this configuration, the coating liquid Q1 is not applied to the peripheral region of the substrate S on the stage 10 from the nozzle 20. [ The nozzle 20 is formed, for example, in an exchangeable manner, and is suitably exchanged in accordance with the size (dimension in the Y direction) of the substrate S to be coated. The replacement nozzle 20 is disposed, for example, in the vicinity of the stage 10, and can be replaced by a manual operation of the operator or by a nozzle changing device (not shown). Further, the nozzle 20 may be provided with a mechanism capable of adjusting the discharge length (or discharge width) of the coating liquid Q1 in the Y direction.

3 (B), a flow path 21b for flowing the coating liquid Q1 to the opening portion 21a and an upper side (upstream side) of the flow path 21b are formed in the interior of the nozzle 20, A coating liquid holding portion 21c for holding the coating liquid Q1 is formed. A coating liquid supply source (not shown) is connected to the coating liquid holding unit 21c. This coating liquid supply source has a pump (not shown). By driving the pump, the coating liquid Q1 is supplied from the coating liquid supply source into the coating liquid holding portion 21c, and the pressure in the coating liquid holding portion 21c is raised to open the opening 21a The coating liquid Q1 is discharged.

As shown in Figs. 1 and 2, the standby portion 30 is disposed relative to the stage 10 in the direction of movement relative to the nozzle 20, that is, on the end side of the stage 10 in the X direction. For example, the standby portion 30 is disposed on the end side closer to the application position P3, which is the start position of the application operation by the nozzle 20, with respect to the stage 10. [ The standby portion 30 has a supply portion 31, a preliminary discharge portion 32, and a cleaning portion 33. The preliminary ejecting portion 32 and the cleaning portion 33 are formed at the same point. However, the preliminary ejecting portion 32 and the cleaning portion 33 may be formed separately. The supply section 31 is disposed on the + X side of the stage 10 and the preliminary discharge section 32 and the cleaning section 33 are disposed on the + X side of the supply section 31. The supply part 31 is disposed so as to be sandwiched between the stage 10 and the preliminary discharge part 32 and the cleaning part 33 as seen from the top.

The arrangements of the supply part 31, the preliminary discharge part 32 and the cleaning part 33 are not limited to the shapes shown in Figs. 1 and 2. For example, the preliminary discharge portion 32 and the cleaning portion 33 are disposed on the + X side of the stage 10, and the supply portion 31 is disposed on the + X side of the preliminary discharge portion 32 and the cleaning portion 33 . The supply portion 31 and the preliminary discharge portion 32 (cleaning portion 33) may be arranged so as to overlap each other in the vertical direction (Z direction).

Fig. 4 is a diagram showing an example of the supply unit 31. Fig. Fig. 4 (A) is a plan view, and Fig. 4 (B) is a sectional view taken along the line B-B in Fig. 4 (A). As shown in Figs. 4 (A) and 4 (B), the supply unit 31 supplies the supply liquid (liquid) Q2 to the tip end 21 of the nozzle 20. The feed liquid Q2 is a liquid for suppressing drying of the tip end 21 of the nozzle 20. [ As the supply liquid Q2, for example, a solvent used for the coating liquid Q1 to be applied from the nozzle 20 can be used. Examples of such a solvent include organic solvents such as a thinner.

In this embodiment, the supply unit 31 is, for example, a deep fusing unit for immersing the tip end 21 of the nozzle 20 in the supply liquid Q2. The supply section 31 has a storage section 31a for storing the supply liquid Q2.

When the information of the storage portion 31a is released, the stored feed liquid Q2 may evaporate and decrease. In this case, a liquid supply source (not shown) may be connected to the storage portion 31a so that the supply liquid Q2 can be appropriately supplied to the storage portion 31a from the liquid supply source. The supply of the supply liquid Q2 to the storage portion 31a may be performed continuously, for example, or intermittently at predetermined time intervals. A liquid level sensor or the like may be formed in the storage portion 31a, and the supply liquid Q2 may be supplied in accordance with the output from the liquid level sensor. For example, a discharge section (not shown) for discharging the supply liquid Q2 from the storage section 31a may be formed. The supply liquid Q2 may be discharged by the discharge unit and the new supply liquid Q2 may be supplied to the storage unit 31a. With this configuration, the feed liquid Q2 stored in the storage portion 31a can be exchanged.

5A and 5B are views showing an example of an immersion operation in which the tip of the nozzle 20 is immersed in the supply liquid Q2 in the supply portion 31. FIG. As shown in Fig. 5 (A), in the immersion operation, the tip end 21 of the nozzle 20 is immersed in the feed liquid Q2 by a predetermined immersion time (predetermined supply time). In this case, for example, it is immersed in the feed liquid Q2 to a position of about 5 mm to 8 mm from the tip end 21. When the leading end 21 is dipped in the feed liquid Q2, the feed liquid Q2 enters the nozzle 20 from the opening 21a by capillary phenomenon.

The tip end 21 of the nozzle 20 is moved to the feed liquid Q2 after the tip end 21 of the nozzle 20 has been immersed in the feed liquid Q2 and after a predetermined immersion time has elapsed, . In one embodiment, the predetermined immersion time is shorter than the time the nozzle 20 is waiting. The predetermined immersion time is set to, for example, one-fiftieth of the predetermined waiting time in the nozzle 20. The predetermined immersion time is, for example, about 1 second to about 2 seconds. It is possible to set the predetermined immersion time in such a short time as compared with the case where the tip end 21 of the nozzle 20 is immersed in the feed liquid Q2 over a long period of time, Q2 are prevented from reaching above the flow path 21b by the capillary phenomenon. Therefore, the step of discharging the desired coating liquid Q1 from the nozzle 20 can be performed with a small preliminary discharge.

Further, by using the solvent of the coating liquid Q1 as the supply liquid Q2, the influence on the coating liquid Q1 in the flow path 21b is reduced.

Fig. 6 is a cross-sectional view showing another example of the supply unit in the present embodiment. 6, the supplying unit 34 may be a discharging device for spraying or spraying the supply liquid Q2 toward the tip end 21 of the nozzle 20. For example, The supply section 34 has a discharge section 34a for spraying the supply liquid Q2 toward the tip end 21 of the nozzle 20. [ The discharge portion 34a is disposed so as to sandwich the tip end 21 of the nozzle 20 in the X direction and is arranged on the + X side and the -X side of the nozzle 20, for example, along the tip 21 And are formed at a plurality of regular intervals in the Y direction.

The supply unit 34 is configured to supply the supply unit 34 with a predetermined supply time (a time corresponding to the predetermined immersion time) from the discharge unit 34a toward the tip end 21 of the nozzle 20, And the feed liquid Q2 is discharged. The predetermined supply time in the supply unit 34 may be longer or shorter than the predetermined immersion time in the supply unit 31 described above. The discharge amount per unit time from the discharge portion 34a can be arbitrarily set. The supply liquid Q2 discharged from the discharge portion 34a adheres to the tip end 21 of the nozzle 20 or the mist liquid Q2 floats near the opening 21a, ).

When the feed liquid Q2 is sprinkled or sprayed onto the tip end 21 of the nozzle 20 from the discharge portion 34a like the supply portion 34 shown in Fig. 6, depending on the discharge time or the discharge amount per unit time However, it is possible to reduce the penetration of the feed liquid Q2 into the flow path 21b due to the capillary phenomenon, as compared with the case where the tip end 21 is immersed in the feed liquid Q2.

7 is a view showing an example of the preliminary ejecting portion 32 and the cleaning portion 33. Fig. As shown in Fig. 7, the preliminary ejecting portion 32 is formed to perform the preliminary ejecting operation with respect to the nozzle 20. Fig. The preliminary discharging operation is an operation of preliminarily discharging the coating liquid Q1 from the opening 21a before discharging the coating liquid Q1 to the substrate S. [ In the preliminary ejection, the dispensing liquid Q1 is discharged, and the dispensing liquid Q2 entering into the nozzle 20 is discharged together with the dispensing liquid Q1. In the preliminary ejection, the feed liquid Q2 is initially ejected, and after the mixture of the feed liquid Q2 and the coating liquid Q1 is ejected, the ejection liquid Q2 is ejected.

In the preliminary discharge portion 32, as shown in Fig. 7, a discharge tank 35 is formed. The discharge chamber 35 has a groove portion 35a having a V-shaped cross section along the XZ plane so that the tip end 21 of the nozzle 20 can be inserted. The V-shaped groove 35a can easily collect the coating liquid Q1 and the supply liquid Q2 discharged from the nozzle 20 on the bottom portion 35b. A discharge section (not shown) is connected to the bottom section 35b, and the discharge section is discharged to the outside through the coating liquid Q1 or the like which is stuck to the bottom section 35b. The discharged liquid (the coating liquid Q1, the supply liquid Q2, and the like) discharged to the outside may be used to generate the coating liquid Q1 or the supply liquid Q2.

The cleaning section 33 removes deposits such as the coating liquid Q1 or the supply liquid Q2 adhered to the tip end 21 of the nozzle 20. 7, the cleaning section 33 is disposed at the same position as the preliminary ejection section 32, but is not limited to this configuration and may be disposed separately from the preliminary ejection section 32. [ The cleaning section 33 has a squeegee 36. The squeegee 36 is disposed on the + X side and the -X side with respect to the tip end 21 of the nozzle 20 and is brought into contact with the tip 21 of the nozzle 20 by a driving device And each of them is formed so as to be movable in the Y direction.

Fig. 8 is a view showing an example of the cleaning operation by the squeegee 36. Fig. 8, the squeegee 36 is moved in the + Y direction while abutting against the -Y side surface of the tip end 21 of the nozzle 20, thereby moving the tip end 21 of the nozzle 20, Such as the coating liquid Q1 and the supply liquid Q2, which are adhered to the substrate W, are scratched off. The adhered material scraped off by the squeegee 36 falls on the discharge tank 35 and is discharged from the discharge tank 35 to the outside. As described above, in the preliminary ejecting section 32 and the cleaning section 33, the same ejection tank 35 is used. The cleaning portion 33 is not limited to the squeegee 36, and for example, an air knife or the like may be used.

The nozzle 20 moved by the moving device 40 can stand by in the standby portion 30. [ 1, the nozzle 20 can be disposed in each of the standby position P1, the preliminary ejecting / cleaning position P2, and the feeding position P4. The standby position P1 is a position where the substrate S is placed on the mounting surface 11 (for example, when the substrate S does not exist on the mounting surface 11) 20). The standby position P1 is a position where neither the supplying section 31, the preliminary discharging section 32 nor the cleaning section 33 is accessed. In the present embodiment, the standby position P1 is set at, for example, a position away from the discharge tank 35 to the + Z side (upward). However, the waiting position P1 is not limited to the upper side (the preliminary discharge portion 32 and the cleaning portion 33) of the discharge tank 35 and may be, for example, a position above the supply portion 31 The supply portion 31, the preliminary discharge portion 32, and the cleaning portion 33, as shown in Fig.

The preliminary ejection / cleaning position P2 is a position at which the preliminary ejection is performed by the nozzle 20 in the preliminary ejection section 32 and the front end 21 of the nozzle 20 is ejected by the cleaning section 33, Is carried out. In the present embodiment, the position where the preliminary ejection is performed and the position where the cleaning is performed are common positions (preliminary ejection / cleaning position P2). The supply position P4 is a position where supply of the supply liquid Q2 is performed to the tip end 21 of the nozzle 20 by the supply portion 31. [ The supply position P4 is a position at which the tip end 21 of the nozzle 20 is immersed in the supply liquid Q2 in the reservoir 31a of the supply unit 31. [

As shown in Figs. 1 and 2, the moving device 40 moves the nozzle 20 in the X direction and the Z direction. The moving device 40 moves the nozzle 20 in the X direction and the Z direction to move the nozzle 20 to the standby position P1, the preliminary ejection / cleaning position P2, the application position P3, (P4), and the nozzle 20 can be held at each position. The moving device 40 can relatively move the substrate S and the nozzle 20 by moving the nozzle 20 relative to the substrate S supported on the stage 10. [

The movable device 40 includes, for example, a door-shaped frame movable in the X direction with respect to the stage 10, and a support portion 40b movably supporting the nozzle 20 in the Z direction in the upper beam portion of the door- . The movement of the door frame in the X direction and the movement of the nozzle 20 in the Z direction are performed by driving a driving device (not shown). Further, the mobile device 40 is not limited to a configuration using a door frame or the like. For example, a robot hand or a manipulator for holding the nozzle 20 may be used as the moving device 40, and the nozzle 20 may be configured to be movable in six degrees of freedom. The moving device 40 may be configured to move the nozzle 20 to any one of the nozzles 20 disposed in any one of the nozzles 20 Or the preliminary discharge portion 32 (the cleaning portion 33) may be moved relative to the discharge portion 31 or the preliminary discharge portion 32 (cleaning portion 33).

The control unit 50 controls the operations of the nozzle 20, the supply unit 31 (34) of the standby unit 30, the preliminary discharge unit 32, the cleaning unit 33, and the moving device 40. The control unit 50 has an arithmetic processing unit such as a CPU (Central Processing Unit), and a storage unit such as a main storage unit or an auxiliary storage unit (not shown). Various programs and various information are stored in the storage device. 1, the control unit 50 includes an operation control unit 51, a determination unit 52, an instruction unit 53, a timer 54, and a storage unit 55. [

The operation control section 51 performs a waiting operation for waiting the nozzle 20 at the standby position P1, a preliminary discharge operation for performing the preliminary discharge of the nozzle 20 at the preliminary discharge / cleaning position P2, A supply operation for supplying the supply liquid Q2 to the tip end 21 of the nozzle 20 at the supply position P4 and a supply operation for supplying the supply liquid Q2 to the application position P3 The coating operation for coating the coating liquid Q1 on the substrate S from the nozzle 20 is controlled.

In the waiting operation, the operation control unit 51 controls the mobile unit 40 to move the nozzle 20 from the standby position P1 and wait. In the preliminary ejection operation, the operation control section 51 controls the moving device 40 to move the nozzle 20 to the preliminary ejecting / cleaning position P2, and controls the nozzle 20 to move the nozzle 20 from the opening 21a And the coating liquid Q1 is discharged. The operation control section 51 controls the moving device 40 to move the nozzle 20 to the preliminary ejection / cleaning position P2 and controls the cleaning section 33 to move the nozzle 20 The squeegee 36 is brought into contact with the tip end 21 to move the squeegee 36 in the Y direction. The operation control section 51 controls the moving device 40 to move the nozzle 20 to the supply position P4 and feed the supply section 31 (34) to the tip end 21 of the nozzle 20, (Q2). The operation control section 51 controls the nozzle 20 while moving the nozzle 20 in the X direction with respect to the substrate S by controlling the moving device 40 in the application operation so as to apply the coating from the opening section 21a And the liquid Q1 is discharged onto the substrate S.

The judging unit 52 judges whether or not the waiting time of the waiting nozzle 20 in the waiting unit 30 has passed the predetermined waiting time. The predetermined waiting time is set in advance by an operator or the like in accordance with, for example, the coating liquid Q1 to be applied from the nozzle 20 or the like. The judging unit 52 judges whether or not the time measured by the timer 54 has passed a predetermined waiting time. In this case, the timer 54 counts the elapsed time from the time when the application operation to the substrate S by the nozzle 20 is completed, or the elapsed time from when the nozzle 20 is immersed in the supply unit 31 The elapsed time from the time point is measured.

The instructing section 53 instructs the nozzle section 20 to perform immersion in which the liquid is supplied to the tip end 21 of the nozzle 20 by the supplying section 31 for a predetermined immersion time when the judging section 52 judges that the predetermined waiting time has elapsed And performs an operation. This immersion operation is an example of one of the above-described supply operations. The instructing section 53 controls the moving device 40 to move the nozzle 20 to the supply position P4 in the immersion operation so that the tip end 21 of the nozzle 20 is moved to the supply liquid Q2 for a predetermined immersion time. Here, the predetermined immersion time is shorter than the predetermined waiting time, for example, not more than one-half of the predetermined waiting time. The predetermined immersion time may be set by an operator or the like, and may be automatically set to, for example, one-half of a predetermined waiting time or the like when the predetermined waiting time is set.

The storage unit 55 stores programs, information, and the like for performing the operations of the standby operation, the preliminary discharge operation, the supply operation (immersion operation), the cleaning operation, and the application operation. These programs, information, and the like are used to perform the respective operations of the nozzle 20, the standby portion 30 (the supply portion 31 (34), the preliminary discharge portion 32, the cleaning portion 33) A program for control, information, and the like.

Next, the operation of the coating apparatus 100 constructed as described above will be described. Fig. 9 is a flowchart showing an example of a control method of the application device 100 according to the embodiment. 10 to 14 are views showing an example of the operation of the application device 100 according to the embodiment. In the control method of the application device 100 according to the embodiment, each additional operation is performed under the control of the control unit 50. [ In describing the flowchart of Fig. 9, it should be noted that Figs. 1 to 8 are appropriately taken into consideration. First, as shown in Fig. 9, the nozzle 20 is queued at the standby position P1 (step ST01). The operation control unit 51 of the control unit 50 controls the waiting position of the nozzle 20 at the standby position P1 in the standby portion 30 as shown in Fig.

Subsequently, the operation control unit 51 determines whether or not to start the application operation for the substrate S (determination processing: step ST02). The operation control unit 51 performs a coating operation on the substrate S when detecting that the substrate S has been placed on the placement surface 11 of the stage 10 by a substrate transfer device Is started. The operation control unit 51 may detect the placement of the substrate S with respect to the placement surface 11 by receiving a signal indicating completion of conveyance of the substrate S from a substrate transfer apparatus It may detect the placement of the substrate S with respect to the placement surface 11 by a signal from a sensor or the like formed on the substrate. The operation control unit 51 is not limited to the determination of the start of the coating operation on the substrate S depending on whether the substrate S is mounted on the placement surface 11 or not. For example, the operation control section 51 may detect the start of the coating operation by detecting another state (for example, a state where the positioning of the substrate S with respect to the stage 10 is completed).

11, in the case where it is determined in step ST02 that the application operation to the substrate S is to be started (YES in step ST02), the operation control section 51 causes the moving device 40 to move the nozzle 20 ) To the preliminary ejecting / cleaning position P2. After the nozzle 20 is moved to the preliminary ejection / cleaning position P2, the operation control unit 51 performs the preliminary ejection operation by the nozzle 20 (preliminary ejection process: step ST03). The operation control unit 51 causes the nozzle 20 to discharge a predetermined amount of the coating liquid Q1 from the opening 21a toward the discharge tank 35 in step ST03. The amount of the coating liquid Q1 to be preliminarily ejected is set in advance by an operator or the like.

The coating liquid Q1 discharged from the opening 21a of the nozzle 20 by the preliminary discharging operation is received in the discharging tank 35 and then discharged to the outside. Foreign matter (for example, liquid such as the feed liquid Q2) which has entered the opening 21a and the nozzle 20 is discharged. By performing the preliminary ejection, the state of the coating liquid Q1 held in the vicinity of the opening 21a inside the nozzle 20 is adjusted.

After the preliminary ejection operation is performed on the nozzle 20 in the preliminary ejection process of step ST03, the operation control section 51 continues to perform the preliminary ejection / cleaning process on the nozzle 20 (Cleaning processing: step ST04). The operation control unit 51 causes the squeegee 36 of the cleaning unit 33 to come into contact with the tip end 21 of the nozzle 20 in the cleaning process of step ST04 and moves the squeegee 36 in the Y direction . Liquid or foreign matter adhering to the tip end 21 of the nozzle 20 is scratched by the movement of the squeegee 36 and is discharged to the outside from the discharge tank 35. [

After the front end 21 of the nozzle 20 is cleaned, the operation control unit 51 controls the moving unit 40 to move the nozzle 20 to the application position P3 as shown in Fig. 12 . After the nozzle 20 is moved, the operation control unit 51 performs a coating operation on the substrate S (coating process: step ST05). In step ST05, the operation control unit 51 sets the position of the opening 21a (the space between the opening 21a and the substrate S) with respect to the substrate S by opposing the opening 21a to the substrate S, So that the discharge start position is aligned.

After the positioning of the opening 21a (nozzle 20) is performed, the operation control unit 51 moves the coating liquid Q1 from the opening 21a of the nozzle 20 to the substrate S, The nozzle 20 is moved in the -X direction by the device 40. [ The operation control section 51 moves the nozzle 20 in the -X direction by a predetermined distance corresponding to the dimension of the substrate S in the X direction and then stops the discharge of the coating liquid Q1 from the nozzle 20 And stops the movement of the nozzle 20 by the moving device 40. The coating liquid Q1 is supplied onto the substrate S by discharging the coating liquid Q1 from the nozzle 20 to the substrate S while moving the substrate S and the nozzle 20 relatively in the X direction, Is formed. In this manner, the coating operation for one substrate S is completed.

After the coating operation for one substrate S is completed, the operation control unit 51 determines whether or not the coating operation has been completed for all the substrates (step ST06). For example, for the step ST06, the operation control section 51 counts the number of times of completion of the coating operation by +1 each time the coating operation for one substrate S is completed, and when the sum of the counted counts is preset It is determined that the coating operation has been completed with respect to all the substrates when the number of the substrates S reaches the number of times. When the counted number does not reach the predetermined number of substrates S, the operation control unit 51 determines that the coating operation has not been completed for all of the substrates.

Further, the determination method in step ST06 is not limited to the above determination method. For example, when the final substrate S among the substrates to be subjected to the coating operation is carried into the stage 10, the final substrate S is conveyed to the control section 50 from the substrate conveyance device 60 or the like A signal indicating that the signal is transmitted may be used. In this case, the operation control unit 51 may detect whether or not the signal is received, and may determine that the coating operation has been completed for all the substrates when receiving the signal. It is also possible to set the predetermined time from the start of operation of the coating apparatus 100 in advance and use the substrate S as the last substrate S when the predetermined time is reached.

The operation control unit 51 moves the nozzle 20 to the standby position P1 and stops the operation of the stage 20 in the case where it is determined in step ST06 that the coating operation has been completed for all substrates (YES in step ST06) 10 and the standby portion 30 is stopped to complete the operation of the application device 100. [

In this way, when the substrate S is placed on the placement surface 11 of the stage 10 before the predetermined waiting time for the nozzle 20 has passed, the operation control section 51 performs the coating operation by the nozzle 20 . That is, when the substrate S is placed on the placement surface 11 before the predetermined waiting time elapses, the nozzle 20 moves from the standby position P1 to the preliminary ejection / cleaning position P2, After the cleaning operation is performed, the wafer W is moved to the coating position P3 to perform the coating operation. Therefore, when the standby time of the nozzle 20 at the standby position P1 is short, the supply operation of the supply liquid Q2 by the supply unit 31 is not executed, and the above-described steps ST03 to ST05 are executed.

14, the operation control unit 51 determines whether or not the coating operation is completed on all the substrates (NO in step ST06) Is moved to the standby position P1, and then the operation after step ST01 is executed.

9, when it is determined in step ST02 that the application operation to the substrate S is not started (NO in step ST02), the determination unit 52 (see FIG. 1) of the control unit 50 Determines whether or not the predetermined waiting time has elapsed from the nozzle 20 (measurement processing: step ST07). In the measurement processing of step ST07, the determining section 52 determines whether or not the coating of the substrate S by the nozzle 20 is completed or the point of time when the nozzle 20 is immersed in the supplying section 31 , It is determined whether or not the elapsed time from the most recent time has passed the predetermined waiting time. The timer 54 (see FIG. 1) of the control unit 50 measures the elapsed time from the completion of the application and the elapsed time from the time of completion of the immersion. If the determination section 52 determines that the predetermined waiting time has not elapsed (NO in step ST07), the instruction section 53 (see Fig. 1) of the control section 50 performs the operations after step ST02 .

On the other hand, in the measurement processing in step ST07, when the determination section 52 determines that the predetermined waiting time has elapsed (YES in step ST07), the instruction section 53 instructs the mobile device 40, The nozzle 20 is moved to the supply position P4 by the supply unit 31 and the supply liquid Q2 is supplied to the tip end 21 of the nozzle 20 by the supply unit 31 (supply process: step ST08). The instructing section 53 instructs the nozzle 20 to move to the feeding position P4 after positioning the nozzle 20 to the + Z side of the feeding position P4 by the moving device 40 in the feeding process of step ST08, So that the tip end 21 of the nozzle 20 is immersed in the feed liquid Q2 of the feed part 31. [

In this embodiment, the supply processing in step ST08 is an immersion treatment in which the tip end 21 of the nozzle 20 is immersed in the supply liquid Q2 of the supply part 31. [ 6, when the nozzle 20 is moved to the supply position P4 and then the supply liquid Q2 is supplied from the discharge portion 34a to the tip end 21 of the nozzle 20 ) Or sprayed (see Fig. 6). The supply process of step ST08 when this supply section 34 is used is a discharge process for spraying or spraying the supply liquid Q2 to the tip end 21 of the nozzle 20. [ In the supply process of step ST08, either the tip end 21 of the nozzle 20 is immersed in the feed liquid Q2, or the feed liquid Q2 is sprayed onto the tip end 21 of the nozzle 20 or sprayed The supply liquid Q2 enters the inside of the nozzle 20 (flow path 21b) from the opening 21a by the capillary phenomenon.

The control unit 50 causes the tip 21 of the nozzle 20 to be immersed in the feed liquid Q2 by the predetermined immersion time (predetermined supply time) From the supply position P4 to the + Z side (upward), and the tip end 21 is taken out from the supply liquid Q2. In this case, for example, the timer 54 of the control unit 50 measures the elapsed time after the nozzle 20 is placed at the supply position P4. When the measurement result by the timer 54 reaches a predetermined immersion time, the instruction unit 53 moves the nozzle 20 in the + Z direction and takes it out of the feed liquid Q2. In addition, since the predetermined immersion time is short, the amount of the supply liquid Q2 entering into the nozzle 20 due to the capillary phenomenon is suppressed as compared with the case where the nozzle 20 is immersed for a predetermined waiting time .

The control unit 50 causes the moving unit 40 to lift the nozzle 20 and remove the tip end 21 of the nozzle 20 from the feed liquid Q2, Similarly, the moving device 40 moves the nozzle 20 to the standby position P1. The timer 54 newly measures the elapsed time with respect to the predetermined waiting time from the point of time when the immersion of the nozzle 20 into the supplying section 31 is completed. Thereafter, the operation control unit 51 executes the operation after step ST02. The operations after step ST02 are as described above.

In the case where the operation after step ST02 is executed, the predetermined waiting time used in the measuring process in step ST07 may be used, or a new predetermined waiting time different from the predetermined waiting time may be used. The new predetermined waiting time may be shorter than the predetermined waiting time or may be longer than the predetermined waiting time. The new predetermined waiting time may be stored in advance in the storage unit 55 or the like of the control unit 50 or may be set automatically according to the number of times of application to the substrate S or the like.

In the supply process of step ST08, the predetermined immersion time previously used may be used as the predetermined immersion time (predetermined supply time), or a new predetermined immersion time different from the previously predetermined immersion time may be used. For example, when the predetermined waiting time is short, the predetermined immersion time may be shorter than the predetermined immersion time, or may be longer than the predetermined predetermined immersion time when the predetermined waiting time is long. In addition, when the predetermined immersion time is automatically set to a value equal to or less than 1/50 according to the predetermined waiting time, the predetermined immersion time may be automatically changed in accordance with the change of the predetermined waiting time.

When the nozzle 20 is moved to the standby position P1 after the supply process in step ST08, the same preliminary discharge as in the preliminary discharge process in step ST03 may be performed. That is, in the supply process of step ST08, the nozzle 20 is in a state in which the supply liquid Q2 is contained by the capillary phenomenon, and the containing liquid Q2 may be partially or completely discharged by the preliminary discharge. This preliminary ejection is performed as a pre-processing for waiting the nozzles 20, and an amount different from the preliminary ejection processing in step ST03 may be ejected from the nozzles 20. Fig. The amount of the feed liquid Q2 infiltrating into the nozzle 20 at the time of standby of the nozzle 20 becomes small and the amount of the feed liquid Q2 intruding into the nozzle 20 at the time of performing the feed processing of step ST08 is reduced. Can be reduced.

As described above, according to the coating apparatus 100 according to the first embodiment and the control method of the coating apparatus 100, when it is judged that the predetermined waiting time has elapsed from the nozzle 20, Since the supply liquid Q2 is supplied to the nozzle 21 by the predetermined supply time shorter than the predetermined waiting time by the supply unit 31 even if the waiting time of the nozzle 20 becomes long, The amount of the feed liquid Q2 entering into the nozzle 20 due to the capillary phenomenon is suppressed. This makes it possible to suppress the discharge amount of the coating liquid (Q1) at the time of the preliminary discharge processing and to suppress the waste of the coating liquid (Q1).

[Second Embodiment]

In the above-described first embodiment, the configuration in which the standby portion 30 is disposed on the + Z side of the stage 10 is described as an example, but the present invention is not limited to this. 15 is a plan view showing an example of a coating apparatus according to the second embodiment. In the following description, the same or equivalent constituent elements as those of the above embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. As shown in Fig. 15, the coating apparatus 100A has a waiting section 30A. The base portion 30A is arranged on the + Y side of the stage 10. [ Further, the standby portion 30A may be disposed on the -Y side of the stage 10. The supply portion 31 and the preliminary discharge portion 32 (cleaning portion 33) are arranged side by side in the X direction in the standby portion 30A.

The standby position P1 of the nozzle 20 is set above the preliminary discharge portion 32 (cleaning portion 33) and the supply position P4 is set corresponding to the supply portion 31, Is the same as the first embodiment described above. Also, the preliminary ejection / cleaning position P2 is set below the standby position P1, which is the same as the first embodiment described above. The moving device 40 has a configuration for moving the nozzle 20 in the Y direction between the application position P3 and the standby position P1 in the standby portion 30A. The moving device 40 is configured to move the nozzle 20 in the X direction between the standby position P1 and the supply position P4 in the standby portion 30A.

Since the operation of the application device 100A is the same as that of the application device 100 of the first embodiment, a description thereof will be omitted. The supply portion 34 shown in Fig. 6 may be used instead of the supply portion 31 in the standby portion 30A.

As described above, the coating apparatus 100A according to the second embodiment is provided with the moving apparatus 40 and the control unit 50 which are the same as the first embodiment. Therefore, even if the waiting time of the nozzle 20 becomes long, It is possible to suppress the amount of the feed liquid Q2 entering into the nozzle 20 by the capillary phenomenon while preventing the tip 21 of the nozzle 21 from drying. In addition, since the application unit 100A is formed on the + Y side of the stage 10, the length of the entire apparatus in the X direction is shortened, and it is possible to install the apparatus on the floor surface having a short X direction It becomes. In the coating device 100A according to the second embodiment, the standby position P1 may be set above the preliminary ejecting / cleaning position P2.

[Third embodiment]

16 is a plan view showing an example of a coating apparatus according to the third embodiment. In the following description, the same or equivalent constituent elements as those of the above embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. As shown in Fig. 16, the coating apparatus 100B is provided with a waiting section 30B. The base portion 30B is arranged on the + Y side of the stage 10. [ Further, the standby portion 30B may be disposed on the -Y side of the stage 10. In the standby portion 30B, the supply portion 31 and the preliminary discharge portion 32 (cleaning portion 33) are arranged side by side in the Y direction.

The standby position P1 of the nozzle 20 is set above the preliminary discharge portion 32 (cleaning portion 33) and the supply position P4 is set corresponding to the supply portion 31, Is the same as the first embodiment described above. Also, the preliminary ejection / cleaning position P2 is set below the standby position P1, which is the same as the first embodiment described above. The moving device 40 is provided with a rotation mechanism capable of rotating the nozzle 20 about the Z axis by 90 DEG between the application position P3 and the standby position P1 in the standby portion 30B have. The moving device 40 has a structure for moving the nozzle 20 in the Y direction between the standby position P1 and the supply position P4.

Since the operation of the application device 100A is the same as that of the application device 100 of the first embodiment, a description thereof will be omitted. In addition, the supply portion 34 shown in Fig. 6 may be used instead of the supply portion 31 in the standby portion 30B.

As described above, the coating apparatus 100B according to the third embodiment is provided with the moving apparatus 40 and the control unit 50 which are the same as those in the first embodiment. Therefore, even if the waiting time of the nozzle 20 becomes long, It is possible to suppress the amount of the feed liquid Q2 entering into the nozzle 20 by the capillary phenomenon while preventing the tip 21 of the nozzle 21 from drying. In the coating device 100B, since the standby portion 30 is formed on the + Y side of the stage 10, the length of the entire device in the X direction is shortened so that the coating device 100B can be installed on a floor surface having a short X direction It becomes. In addition, since the supplying section 31 and the preliminary discharging section 32 (cleaning section 33) are arranged in the longitudinal direction along the X direction, as compared with the coating apparatus 100A of the second embodiment, The length in the Y direction can be shortened.

Although the embodiments and the examples have been described above, the present invention is not limited to the above description, and various modifications are possible within the scope not departing from the gist of the present invention. For example, in the above-described embodiment, the configuration in which the supply unit 31 and the preliminary discharge unit 32 (cleaning unit 33) are arranged around the stage 10 in the plan view has been described as an example, The present invention is not limited to this configuration. For example, the supply section 31 and the preliminary discharge section 32 (cleaning section 33) may be arranged above the stage 10 (+ Z side) as viewed in plan.

In the above-described embodiment, the description has been given taking the configuration in which the standby portions 30, 30A, and 30B are disposed on the + X side or + Y side of the stage 10, but the present invention is not limited to this configuration. For example, in the standby portion 30, the preliminary discharge portion 32 (cleaning portion 33) is disposed on the + X side of the stage 10, and the supply portion 31 is disposed on the -X side of the stage 10 And the preliminary ejecting portion 32 (cleaning portion 33) may be configured to sandwich the stage 10 in the X direction so that the preliminary ejecting portion 32 (cleaning portion 33) X side of the stage 10 and the supply part 31 is disposed on the + Y side or -Y side of the stage 10. In this case, The preliminary discharge portion 32 (cleaning portion 33) is disposed on the + Y side of the stage 10 and the supply portion 31 is disposed on the -Y side of the stage 10 The supply section 31 and the preliminary discharge section 32 (cleaning section 33) may sandwich the stage 10 in the Y direction so as to be disposed in the Y direction.

In the above-described embodiment, a configuration in which one base portion 30, 30A, and 30B is disposed with respect to the stage 10 is described as an example, but the present invention is not limited to this configuration. For example, two or more standby portions 30, 30A, and 30B may be disposed with respect to the stage 10. [ Two or more supply portions 31 and 34 or a preliminary discharge portion 32 and a cleaning portion 33 may be formed in one of the standby portions 30, 30A and 30B.

In the embodiment described above, the substrate S and the nozzle 20 are relatively moved by moving the nozzle 20 in the Z direction. However, the present invention is not limited to this configuration . For example, the stage 10 on which the substrate S is mounted may be configured to move in the X direction with respect to the nozzle 20, or both the stage 10 and the nozzle 20 may move in the X direction do.

6 is not limited to the one formed separately from the preliminary discharge portion 32 and the cleaning portion 33 but may be formed by a combination of the preliminary discharge portion 32 and the cleaning portion 33 The discharge section 34a of the supply section 34 is formed in the discharge tank 35 used in the discharge section 34a and the supply liquid Q2 may be sprayed or sprayed from the discharge section 34a to the tip of the nozzle 20. [ In this case, since the supply portion 34 uses the same tank as the preliminary discharge portion 32 and the cleaning portion 33, the air bearing portion 30 and the like can be made compact.

In the above-described embodiment, the description has been given taking the configuration in which the standby portions 30, 30A, and 30B include both the preliminary ejecting portion 32 and the cleaning portion 33, but the present invention is not limited to this configuration. For example, the standby section 30 may be configured to omit either the preliminary ejection section 32 or the cleaning section 33, and may omit both the preliminary ejection section 32 and the cleaning section 33 .

P1 ... Standby position
P2 ... Preliminary discharge / cleaning position
P3 ... Application position
P4 ... Supply location
Q1 ... Coating liquid
Q2 ... Amount of supply
S ... Board
10 ... stage
11 ... If you do
20 ... Nozzle
21 ... point
30, 30A, 30B ... Base donation
31, 34 ... Supplier
31a ... Storage section
32 ... The pre-
33 ... Three governments
35 ... Exhaust tank
40 ... Mobile device
50 ... The control unit
51 ... [0040]
52 ... [0031]
53 ... Indicator
54 ... timer
55 ... The storage unit
100, 100A, 100B ... Application device

Claims (21)

1. A coating apparatus comprising a moving device for relatively moving a substrate and a nozzle, a standby part capable of placing the nozzle by the moving device, and a control part for controlling the nozzle and the moving device,
Wherein the waiting section has a supply section for supplying liquid to the tip of the nozzle,
Wherein the control unit includes a judging unit for judging whether or not the predetermined waiting time has elapsed in the nozzle in the waiting unit, and a judging unit for judging whether or not the predetermined waiting time has elapsed And an instruction section for operating the moving device to supply the liquid by a predetermined supply time by the supplying section. The method according to claim 1,
Wherein the supply unit is a dipping joining member for dipping the tip of the nozzle into the liquid. The method according to claim 1,
Wherein the supplying section is a discharging device for spraying or spraying the liquid onto the tip of the nozzle. The method according to claim 1,
Wherein the liquid is a solvent used for a coating liquid applied from the nozzle. The method according to claim 1,
Wherein the predetermined supply time is shorter than the predetermined waiting time. 6. The method of claim 5,
Wherein the predetermined supply time is one fifth or less of the predetermined waiting time. 7. The method according to any one of claims 1 to 6,
Wherein the control unit has a timer for measuring time from timing of completion of application of the liquid to the substrate by the nozzle or timing of completion of supply of liquid to the nozzle by the supply unit,
Wherein the determination unit determines whether or not the time measured by the timer has passed the predetermined waiting time. 7. The method according to any one of claims 1 to 6,
Wherein the waiting section has a preliminary ejecting section for preliminarily ejecting the nozzle and a cleaning section for cleaning the tip of the nozzle. 9. The method of claim 8,
Wherein the preliminary ejection unit and the cleaning unit use the same set. 9. The method of claim 8,
The control unit controls the supply unit to preliminarily discharge the liquid to the tip of the nozzle and then to the nozzle in the preliminary discharge unit and to clean the tip of the nozzle after preliminary discharge by the cleaning unit , Application device. 9. The method of claim 8,
Wherein the controller is configured to perform the preliminary ejection of the liquid to the nozzle in the preliminary ejecting part without performing the supply of the liquid by the supplying part when the substrate is coated with the substrate by the nozzle before the predetermined waiting time elapses, And the tip of the nozzle after the preliminary ejection is cleaned by the cleaning section. 7. The method according to any one of claims 1 to 6,
And a stage for mounting the substrate,
Wherein the waiting portion is disposed on an end side in a moving direction relative to the stage. There is provided a control method of a coating device comprising a moving device for relatively moving a substrate and a nozzle, and a waiting part capable of placing the nozzle by the moving device,
Wherein the waiting section has a supply section for supplying liquid to the tip of the nozzle,
A determination process of determining whether or not the predetermined waiting time of the nozzle in the standby portion has elapsed;
And a supplying process of operating the moving device to supply the liquid by a predetermined supply time to the leading end of the nozzle when the predetermined waiting time has elapsed by the determining process Control method. 14. The method of claim 13,
Wherein the supplying treatment includes immersing the tip of the nozzle in a dipping tank formed as the supplying part. 14. The method of claim 13,
Wherein the supplying process includes spraying or spraying the liquid from the discharging device formed as the supplying part to the tip of the nozzle. 14. The method of claim 13,
Wherein the liquid in the supplying process is a solvent used in a coating liquid applied from the nozzle. 17. The method according to any one of claims 13 to 16,
Wherein the predetermined supply time is shorter than the predetermined waiting time. 18. The method of claim 17,
Wherein the predetermined supply time is not more than 1/50 of the predetermined waiting time. 17. The method according to any one of claims 13 to 16,
And measuring the time from the timing of completion of application of the liquid to the substrate by the nozzle or the timing of completion of supply of the liquid to the nozzle by the supply unit,
Wherein the determination processing determines whether or not the time measured by the measurement processing exceeds the predetermined waiting time. 17. The method according to any one of claims 13 to 16,
A preliminary ejection process of preliminarily ejecting the nozzle after the supply process and a cleaning process of cleaning the tip of the nozzle after the preliminary ejection process by a cleaning section. 21. The method of claim 20,
The preliminary discharge processing is performed without performing the supply processing and the cleaning processing is performed after the preliminary discharge processing when the substrate is coated with the substrate by the nozzle before the predetermined waiting time elapses Wherein the control unit controls the dispensing apparatus.

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