JP3673329B2 - Substrate processing apparatus and cleaning method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a substrate processing apparatus and a cleaning method applied to manufacture of various substrates such as a semiconductor wafer and a glass substrate of a liquid crystal display.
[0002]
[Prior art]
  Conventionally, as an apparatus for manufacturing a semiconductor wafer, a glass substrate of a liquid crystal display, etc., for example, a substrate cleaning unit for cleaning a substrate before processing, and a coater unit such as a spin coater for forming a thin film of a photoresist solution on the substrate; An edge processing unit that removes unnecessary thin film on the substrate edge of the thin film formed by the spin coater, a baking unit that dries the photoresist liquid on the substrate surface from which the unnecessary thin film on the edge is removed, and the like There is generally known a substrate processing apparatus that performs processing while transferring a substrate between units by a transfer robot.
[0003]
  In such a substrate processing apparatus, in the coater unit and the edge processing unit, the photoresist liquid adheres to each part of the apparatus such as a nozzle for supplying the photoresist liquid during the processing process, and this causes drying to cause particle generation. For this reason, a cleaning device for injecting a cleaning liquid to a portion where the photoresist liquid adheres is provided, and thereby the photoresist liquid is cleaned and removed.
[0004]
[Problems to be solved by the invention]
  However, in the conventional substrate processing apparatus, the above-described cleaning apparatus is generally operated for every predetermined number of substrates set in advance. For example, the transfer of the substrate is interrupted or stopped for some reason. Then, since the cleaning apparatus does not operate for a long period of time, the attached photoresist solution is dried and particles are generated, or removal of the attached resist solution is extremely difficult.
[0005]
  In addition, when a plurality of cleaning devices are provided, the amount of photoresist solution attached and the time required to remove the attached photoresist solution depend on the portion to which the photoresist solution adheres, the cleaning ability of each cleaning device, etc. Because of the large difference, it is not always sufficient to operate various cleaning apparatuses uniformly under the same conditions in order to effectively prevent the generation of particles and to ensure the processing efficiency of the substrate.
[0006]
  The present invention has been made to solve the above problems, and by operating the cleaning device at an appropriate timing according to the processing status of the substrate, the generation of particles is ensured while ensuring the processing efficiency of the substrate. It is an object of the present invention to provide a substrate processing apparatus and a cleaning method that can be prevented.
[0007]
[Means for Solving the Problems]
  The substrate processing apparatus of the present invention forms a thin film on the substrate surface by carrying out processing while carrying the substrate in and out of a plurality of processing units, and also performs a plurality of cleanings for cleaning and removing unnecessary deposits attached to the apparatus by the processing. In the substrate processing apparatus provided with the means, timing setting means for enabling the operation timing of each of the cleaning means to be set, and cleaning control means for operating each of the cleaning means at the operation timing set by the timing setting means, Equipped withThe operation timing is set to a timing according to the processing status of the substrate in the processing section upstream of the processing section provided with the cleaning means.(Claim 1).
[0008]
  In addition, the substrate processing is provided with a plurality of cleaning means for forming a thin film on the substrate surface by carrying out processing while carrying the substrate in and out of a plurality of processing units, and cleaning and removing unnecessary deposits attached to the apparatus by the processing. The apparatus comprises a timing setting means for enabling the operation timing of each of the cleaning means to be set, and a cleaning control means for operating each of the cleaning means at an operation timing set by the timing setting means. The timing is set to a timing corresponding to the amount of delay in loading the substrate into the processing section provided with the cleaning means while the substrate processing apparatus is in operation (Claim 2).
[0009]
  ThisTheseAccording to the apparatus, the operation timing of each cleaning means can be operated at an appropriate timing according to the processing status of the substrate, the function of each cleaning means, or the cleaning location,In particular, each of the above timings should be set as the operation timingThis makes it possible to effectively prevent the generation of particles while ensuring the processing efficiency of the substrate.
[0010]
  ThisTheseIn the equipment ofThe timing setting means includes, as the operation timing, (1) a timing according to the processing status of the substrate in the processing section upstream of the processing section provided with the cleaning means, and (2) the operation of the substrate processing apparatus. , Timing according to the amount of delay in loading the substrate into the processing unit provided with the cleaning means, (3) timing according to at least one of when the substrate processing apparatus is operated and when stopped, and (4) during operation of the substrate processing apparatus Of the timings corresponding to the occurrence of the non-processing state, a plurality of timings including at least (1) timing can be set (Claim 3), or a plurality of timings including at least (2) timing. It is preferable that the timing can be set.
[0011]
  According to these apparatuses, each cleaning unit can be operated at a better timing suitable for the processing status of the substrate, the function of each cleaning unit, and the like, and such timing setting can be easily performed.
[0012]
  Claim 3And claim 4In the description, “when operating and when stopped” is not limited to when the power is turned on / off, and all substrates are processed after the substrates are loaded into the substrate processing apparatus, and the substrates are unloaded from the substrate processing apparatus. It is meant to include after.
[0013]
  Further, if the cleaning control means is configured to selectively operate the cleaning means from a plurality of operating conditions (claims)5) In addition, the cleaning process can be performed according to the function of each cleaning means, the cleaning location, etc., and the maximum time can be effectively used as long as it does not affect the processing tact of the substrate. It becomes possible.
[0014]
  In particular, the processing unit includes a thin film forming unit that supplies a liquid to the surface of the substrate held on the rotary table via a nozzle member and forms a thin film on the substrate surface by a centrifugal force accompanying the rotation of the substrate. As a cleaning means, a substrate processing apparatus having a nozzle cleaning means for cleaning the nozzle member, a rotary table cleaning means for cleaning the rotary table, and a peripheral portion cleaning means for cleaning the periphery of the rotary table (claims)6Alternatively, the processing unit has an edge removing unit that positions the substrate after the thin film is transferred by the conveying means on the processing table by the positioning member and removes unnecessary thin film formed on the substrate edge. In the substrate processing apparatus having the positioning member cleaning means for cleaning the positioning member and the processing table cleaning means for cleaning the processing table as the cleaning means (claim 7), the liquid for forming the thin film is Such a substrate processing apparatus, as it frequently adheres to the apparatus, is defined in the above claims.5By adopting this configuration, it becomes possible to improve the productivity and quality of the substrate through ensuring the processing efficiency of the substrate and preventing the generation of particles.
[0015]
  As a more specific configuration,The substrate processing apparatus includes a table that holds a substrate and a nozzle member that supplies a liquid to the surface of the substrate held on the table.As a cleaning meansNozzle cleaning hand for cleaning the nozzle memberStepIt has(Claim 8).
[0016]
  On the other hand, the cleaning method according to the present invention forms a thin film on the surface of the substrate by carrying out the processing while carrying the substrate in and out of a plurality of processing units, and also cleans and removes unnecessary deposits attached to the apparatus by the processing. A cleaning method for the processing section of the substrate processing apparatus provided with the cleaning means, wherein operation timings of the cleaning means are respectively set.According to the processing status of the substrate in the processing unit upstream of the processing unit provided with the cleaning meansThe timing is set in advance, and each of the processing units is cleaned by operating each of the cleaning means at this operation timing (claims).9).
[0017]
  Another cleaning method according to the present invention is as follows.A substrate processing apparatus provided with a plurality of cleaning means for forming a thin film on a substrate surface by carrying out processing while carrying the substrate in and out of a plurality of processing units, and cleaning and removing unnecessary deposits attached to the apparatus by the processing. In the cleaning method for the processing unit, the operation timing of each cleaning unit is set to a timing corresponding to the amount of delay in loading the substrate into the processing unit in which the substrate processing apparatus is in operation. Each processing unit is set by operating each cleaning means at this operation timing.Is to be washed (claims)10).
[0018]
  In addition, in the description of each claim, “cleaning” includes not only so-called cleaning in which dirt is washed away using pure water or a cleaning agent, but also so-called cleaning that sweeps or sucks off adhering foreign matter. It is.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described with reference to the drawings.
[0020]
  FIG. 1 schematically shows an example of a substrate processing apparatus to which the present invention is applied. As shown in the figure, a substrate processing apparatus 10 includes, in order from the upstream side (the left side in the figure), a loader 11 that serves as a substrate loading unit, a standby unit 12 that temporarily holds the substrate, and a photoresist solution. Are provided with a coater unit 14 for forming a thin film, an edge processing unit 16 for removing an unnecessary thin film on the substrate edge, a baking unit 18 for drying treatment, and an unloader 19 serving as a substrate unloading unit. Then, the substrate is taken out from the cassette put in the loader 11, and the substrate is processed while being sequentially transferred between the units by the transfer robots 20 to 22, and is stored in the cassette set in the unloader 19 and transferred. It is configured. In the substrate processing apparatus 10, the present invention is applied to the coater unit 14 and the edge processing unit 16.
[0021]
  The coater unit 14 is a spin coater that forms a thin film of a photoresist solution on its surface while rotating a square substrate. As shown in FIG. 2 and FIG. 3, a substrate holding unit provided on the base of the coater unit 14 30, a lid portion 31 supported so as to be able to move up and down, and a table cleaner 75 for cleaning the suction portion 33 of the rotary table 32 described later.
[0022]
  The substrate holding unit 30 includes a rectangular rotary table 32 that holds the substrate W, a cup 34 that covers the periphery of the rotary table 32, and a liquid supply device 35 that supplies a photoresist liquid to the surface of the substrate W.
[0023]
  The rotary table 32 is rotationally driven by a motor 32a, and a suction part 33 for vacuum suction of the substrate W is provided at the center thereof. The suction part 33 is moved up and down by driving an air cylinder (not shown). Is configured to do. When the substrate W is carried in and out, only the suction unit 33 of the rotary table 32 is raised and lowered to deliver the substrate W. On the other hand, the substrate 33 is rotated integrally with the rotary table 32 during processing. W is configured to rotate.
[0024]
  The liquid supply device 35 is provided with a slit-like nozzle 38 extending in a uniaxial direction, and the nozzle 38 is movable above the rotary table 32 in a direction perpendicular to the uniaxial direction. That is, a pair of rails 39 extending in parallel to each other and a ball screw shaft 36b that rotates by the operation of the motor 36a are disposed on the side portion of the cup 34, and a support member 37 is slidably mounted on the rail 39. The nozzle 38 is attached to the support member 37, and the nut portion of the support member 37 is screwed into the ball screw shaft 36b.
[0025]
  At the time of processing, the nozzle 38 is moved integrally with the support member 37 in accordance with the rotation of the ball screw shaft 36b by the operation of the motor 36a, and the nozzle 38 is set at a predetermined supply position above the rotary table 32. A certain amount of photoresist solution is supplied to the surface of the substrate W.
[0026]
  On the other hand, when the liquid is not supplied, the support member 37 is held at the retracted position outside the cup 34 (the position shown by the solid line in FIG. 4), and further outside the retracted position as necessary. It is arranged at the cleaning position (position indicated by a two-dot chain line in FIG. 4).
[0027]
  As shown in FIGS. 4 and 5, a solvent pot 40 storing a drying prevention solvent is supported at the retracted position by an air cylinder 41 so as to be movable up and down. In the state where the support member 37 is set at the retracted position, the solvent pot 40 is held at the rising end position, and the nozzle 38 is interposed in the solvent atmosphere, thereby preventing the photoresist solution from the nozzle 38 from being dried. It has come to be.
[0028]
  A nozzle cleaning device 42 for cleaning and removing the photoresist solution adhering to the nozzle 38 is provided at the cleaning position. The nozzle cleaning device 42 is provided with a cleaning head 43, and the cleaning head 43 can reciprocate along the nozzle 38. That is, at the cleaning position, as shown in FIG. 6, a rail 44 extending in parallel with the nozzle 38 and a ball screw shaft 45 that rotates by driving of the motor 46 are provided below the nozzle 38. The nut 44 of the cleaning head 43 is screwed onto the ball screw shaft 45 while being slidably mounted on the rail 44. As a result, the cleaning head 43 reciprocates along the rail 44 from the origin position (position indicated by the solid line in FIG. 6) where the cleaning head 43 is positioned outwardly on one end side of the nozzle 38 in accordance with the forward / reverse rotation drive of the motor 46. ing.
[0029]
  As shown in FIGS. 7 and 8, the cleaning head 43 is composed of a U-shaped container allowing the nozzle 38 to be interposed therein, and a cleaning agent (not shown) is inserted into the cleaning head 43 via a rinse valve 47a and an N2 valve 47b. A configuration that includes a plurality of cleaning nozzles 47 that are connected to a supply source (hereinafter referred to as “rinse”) and an N 2 supply source, and project from both sides of the nozzle 38, and a discharge duct 48 for discharging the rinse after cleaning to the outside. It has become. That is, as the cleaning head 43 is reciprocated along the nozzle 38 while rinsing and N2 blow are ejected from the cleaning nozzle 47, the photoresist liquid adhering to the nozzle 38 is removed (hereinafter, referred to as "cleaning head 43"). This cleaning is called nozzle cleaning).
[0030]
  As shown in FIG. 3, the lid 31 is configured such that a disk-like plate 51 is rotatably supported at the lower part of a main body 50 supported so as to be movable up and down, and the main body 50 is lowered to a predetermined height position. As a result, the lid portion 31 is combined with the substrate holding portion 30, that is, the plate 51 is interposed in the cup 34 of the substrate holding portion 30, and is configured to engage with the turntable 32 in a state where a predetermined gap is formed. Yes. At the time of processing, the rotary table 32 and the plate 51 are rotated together with the substrate W on the rotary table 32 covered with the plate 51.
[0031]
  By the way, the substrate holding unit 30 and the lid unit 31 of the spin coater are provided with a plurality of cleaning nozzles for cleaning and removing the photoresist solution adhering to the rotary table 32 and the cup 34 during the processing. Accordingly, the substrate holding unit 30 and each part of the lid 31 are cleaned (hereinafter, this cleaning is referred to as cup cleaning) by spraying rinse from each of these cleaning nozzles while rotating the rotary table 32. Yes.
[0032]
  Specifically, as shown in FIGS. 3 and 9, the substrate holding unit 30 is provided with five types of nozzles such as an outer peripheral rinse nozzle 55, a cup rinse nozzle 56, a back rinse nozzle 57, a trap rinse nozzle 58, and an exhaust port rinse nozzle 59. A cleaning nozzle is provided. Further, as shown in FIG. 10, a first plate rinse nozzle 65 (hereinafter referred to as a first PR nozzle 65), a chuck rinse nozzle 66 and a second plate rinse nozzle 67 (hereinafter referred to as a second PR nozzle 66) are provided on the lid portion 31. Three types of cleaning nozzles are provided.
[0033]
  The outer peripheral rinsing nozzle 55 is precisely provided outside the substrate holder 30 and is supported by a driving means (not shown) so as to be movable in the vertical and horizontal directions. Then, it is normally located at the retreat position on the side of the cup 34 and is moved to an operating position where the tip of the nozzle faces the inside of the cup 34 only at the time of cleaning, and rinse is sprayed to the peripheral edge of the turntable 32, thereby. It is designed to clean the periphery of the.
[0034]
  The cup rinse nozzle 56 is provided on the inner peripheral surface of the cup 34 at a position facing the peripheral edge of the rotary table 32. The cup rinse nozzle 56 injects rinse toward the peripheral edge of the rotary table 32 and rebounds from the rotary table 32. The inner peripheral surface of the cup 34 is cleaned with a rinse.
[0035]
  The back rinse nozzle 57 is provided at a position facing the lower surface of the turntable 32, and the lower surface of the turntable 32 is cleaned by spraying rinse.
[0036]
  The trap rinse nozzle 58 is provided on the lower surface of the rotary table 32 at a position facing the peripheral edge thereof, and sprays the rinse toward the resist discharge port 61 formed at the peripheral edge of the rotary table 32. It has become. That is, at the peripheral edge of the rotary table 32, as shown in FIG. 9, a resist discharge port 61 for leading the photoresist liquid collected at the peripheral edge of the rotary table 32 by centrifugal force to the liquid storage portion 62 formed in the cup 34. The photoresist solution adhering to the resist discharge port 61 is removed by the rinsing spray from the trap rinse nozzle 58.
[0037]
  The exhaust port rinse nozzle 59 injects rinse into an exhaust passage 64 formed below the rotary table 32. That is, an exhaust passage 64 communicating with the liquid storage section 62 is provided below the turntable 32 as shown in FIG. 9, and the atmospheric gas containing the mist of the photoresist liquid stored in the liquid storage section 62 is exhausted from the exhaust table 64. It is discharged outside through a passage 64 and an exhaust duct 63 connected to the exhaust passage 64. Further, the photoresist liquid, the rinsing liquid and the like stored in the liquid storage section 62 are discharged from the drain 52.
[0038]
  As shown in FIG. 10, the first PR nozzle 65 and the chuck rinse nozzle 66 are integrally provided in the central portion of the main body 50 of the lid portion 31. These nozzles 65 and 66 are displaceable to an operating position in which the nozzle tip protrudes downward from an opening 51 a formed at the center of the plate 51 and a later-described retraction position above the plate 51, and are in the above-described operating position. In this state, the lower surface of the plate 51 and the peripheral surface of the rotary table 32 are cleaned by spraying a rinse from the first PR nozzle 65 to the lower surface of the plate 51 by the chuck rinse nozzle 66 on the peripheral surface of the rotary table 32. It has become.
[0039]
  Here, as shown in FIGS. 10 and 11, the first PR nozzle 65 and the chuck rinse nozzle 66 are attached to the output shaft of the motor 69 via the support member 68, and are moved up and down integrally with the motor 69 by the air cylinder 70. It can be displaced in the direction. That is, after the cleaning is completed, the nozzles 65 and 66 are moved from the operating position to a position above the plate 51 (position indicated by a one-dot chain line in FIG. 10) by driving the motor 69 and the air cylinder 70, and further 90 °. By being swung, the main body 50 is accommodated in a retracted position (a position indicated by a one-dot chain line in FIG. 11) on the side of the central axis. During processing of the substrate W, the plug body 71 supported so as to be movable up and down above the opening 51a is moved to the lower end position by driving the air cylinder 72 so that the opening 51a is blocked. It has become.
[0040]
  The second PR nozzle 67 is provided in the main body 50 at a portion slightly lateral to the central portion thereof, and the upper surface of the plate 51 is washed by spraying the rinse toward the plate 51. .
[0041]
  In addition, each nozzle 55-59 of the said board | substrate holding | maintenance part 30 is connected to the rinse supply source outside a figure through the rinse valves 55a-59a, respectively. The second PR nozzle 67 of the lid 31 is connected to a rinse supply source via a rinse valve 67a, and the first PR nozzle 65 and the chuck rinse nozzle 66 are both connected to a rinse supply source via a rinse valve 65a.
[0042]
  The table cleaner 75 mainly cleans the suction portion 33 of the rotary table 32 where washing by rinsing spray as described above is not preferable. As shown in FIG. 2 and FIG. It is installed in the direction.
[0043]
  The table cleaner 75 includes a cleaning head 76 and air cylinders 77 and 78 that move the head 76 in the vertical direction and the horizontal direction. As shown in FIG. 12, an ultrasonic generator 79a and a vacuum nozzle 79b connected to a dust collection negative pressure generator (not shown) are arranged in parallel on the head 76, and an ultrasonic wave generated by the ultrasonic generator 79a is provided. By blowing sonic air onto the surface of the suction portion 33, the foreign matter attached on the suction portion 33 is peeled off, and the foreign matter is sucked and discharged by the vacuum nozzle 79b.
[0044]
  At the time of cleaning, after the head 76 is moved from the initial position outside the cup 34 shown in FIG. 13A to above the end of the rotary table 32, it faces the surface of the rotary table 32 with a predetermined gap. The position is lowered to the position (FIGS. 13B and 13C), and the head 76 is reciprocated in this state, whereby the suction portion 33 is cleaned (hereinafter, this cleaning is performed on the rotary table). Called cleaning).
[0045]
  On the other hand, as shown in FIG. 2, the edge processing unit 16 includes a rectangular processing table 80 that holds the substrate W after the thin film formation processing in the coater unit 14 by vacuum suction, and the processing table 80. An edge processing device 81 arranged around, a positioning device 82 for the substrate W, and a table cleaner 90 for cleaning the surface of the processing table 80 are provided.
[0046]
  The processing table 80 can be moved up and down by driving an air cylinder or the like. When the substrate W is carried in, the processing table 80 receives the substrate W transported by the transport robot 21 at the rising end position and is provided at the falling end position. The edge processing device 81 is configured to be set at a predetermined work position. That is, the transfer robot 21 is provided with a pair of left and right hands 21a that can be brought into contact with and separated from each other, and the left and right edges of the substrate W are supported by both hands 21a. When the substrate W is set above the processing table 80, the processing table 80 moves to the ascending end position to support the substrate W from below, and the both hands 21a are displaced to the separation position. As the table 80 moves to the lowered end position, the substrate W is transferred.
[0047]
  Each of the edge processing devices 81 is provided in correspondence with each corner portion of the substrate W set at the work position, and each edge processing device 81 reciprocates along each side of the substrate W. However, an unnecessary thin film is washed away by spraying rinse along the edge of the substrate W.
[0048]
  The positioning device 82 corrects a planar positional shift of the substrate W transferred on the processing table 80, and is provided in a pair in the diagonal direction of the processing table 80, and thereby the substrate W is placed on both sides in the diagonal direction. The substrate W is positioned by holding it from above. That is, each positioning device 82 has a head 84 at the tip of an arm 83 that turns by driving a motor (not shown), and the head 84 includes a pair of positioning pins 85 that protrude downward. . At the time of positioning, as shown in FIGS. 2 and 14, the positioning pin 85 is brought into contact with the corner portion of the substrate W from both sides in the diagonal direction in accordance with the turning of the arm 83 to mechanically shift the position of the substrate W. On the other hand, the arm 83 is housed in the retracted position on the side of the processing table 80 except during such positioning.
[0049]
  Each positioning device 82 is provided with a pin cleaning device 86 for cleaning and removing the photoresist solution adhering to the positioning pin 85 in accordance with the positioning of the substrate W as described above. Is disposed at a position corresponding to the lower side of the head 84 housed in the head.
[0050]
  As shown in FIGS. 2 and 15A, the pin cleaning device 86 is provided with a pair of cylindrical cleaning pots 87 corresponding to the positioning pins 85, and a rinse valve is provided inside each of the cleaning pots 87. A plurality of nozzles connected to the rinse supply source and the N2 supply source via the 87a and N2 valves 87b, respectively, and a discharge duct for discharging the rinse after cleaning to the outside are provided. Are configured to move up and down integrally by driving an air cylinder (not shown).
[0051]
  At the time of cleaning, the cleaning pot 87 is set to the raised position with the arm 83 of the positioning device 82 stored in the retracted position (the state shown in FIG. 15A), so that the positioning pin 85 is placed in the cleaning pot 87. (FIG. 15 (b)), and in this state, rinse and N2 blow are sprayed to clean the positioning pins 85 (hereinafter, this cleaning is referred to as pin cleaning).
[0052]
  As shown in FIG. 2, the table cleaner 90 is composed of a head 91 and an air cylinder 92 that moves the head 91 in the horizontal direction. The table cleaner 90 has the same configuration as the table cleaner 75 of the coater unit 14 except that an air cylinder for moving the head 91 up and down is not provided, and the head 91 is opposed to the processing table 80. By moving, the foreign matter adhering to the processing table 80 is sucked and discharged while peeling (hereinafter, this is referred to as processing table cleaning). The table cleaner 90 is not provided with an air cylinder for moving the head 91 up and down because there is no obstacle such as the cup 34 of the coater unit 14 in the cleaning operation of the processing table 80 of the head 91. It is.
[0053]
  In the substrate processing apparatus 10 as described above, the substrate W carried into the standby unit 12 from the cassette of the loader 11 is first transferred onto the spin table 32 of the spin coater by the transfer robot 20 and then transferred by the liquid supply device 35. A photoresist solution is applied to the surface. Then, after the substrate holding part 30 and the lid part 31 are combined, the thin film of the photoresist liquid is formed on the surface of the substrate W by being rotated integrally with the rotary table 32. After the thin film is formed, it is transferred to the edge processing unit 16 by the transfer robot 21 and transferred onto the processing table 80, and positioning by the positioning device 82 is performed. Then, after the unnecessary thin film portion is removed along with the movement of the edge processing apparatus 81, it is transferred to the bake unit 18 by the transfer robot 22, and the substrate W is heated and cooled in the bake unit 18, and the unloader 19. Stored in the cassette.
[0054]
  During the processing operation on the substrate W, various cleanings such as the nozzle cleaning device 42 or the cleaning device are operated at a predetermined timing, so that nozzle cleaning, cup cleaning, rotary table cleaning, pin cleaning, Processing table cleaning is performed, whereby the photoresist solution and the like adhering to each part of the coater unit 14 and the edge processing unit 16 is cleaned and removed as the substrate W is processed.
[0055]
  FIG. 16 shows a control system of the substrate processing apparatus 10 that controls the cleaning and cleaning apparatuses of the coater unit 14 and the edge processing unit 16. In the following description, unless otherwise distinguished, cleaning and cleaning are simply referred to as cleaning for convenience of description.
[0056]
  As shown in the figure, the substrate processing apparatus 10 is provided with a main body control unit 100 for comprehensively controlling the whole, and the coater unit 14 and the edge processing unit 16 have units 14, 16 respectively. A coater unit control unit 101 and an edge processing unit control unit 111 are provided, and the coater unit control unit 101 and the edge processing unit control unit 111 are connected to the main body control unit 100, respectively.
[0057]
  The coater unit control unit 101 includes a shaft control unit 103 that comprehensively controls drive sources such as a motor and an air cylinder mounted on the coater unit 14, a rinse valve control unit 104 that controls opening and closing of each rinse valve, An N2 valve control unit 105 that controls the opening and closing of each N2 valve, an ultrasonic generator control unit 106 that controls the operation of the ultrasonic generator 79a in the table cleaner 75 and the negative pressure generation of the vacuum nozzle 79b, and dust collection, respectively. The negative pressure generation control unit 107 is connected, and based on information relating to the production status of the substrate processing apparatus 10 output from the main body control unit 100, the nozzle cleaning and the cup are performed in accordance with the cleaning mode described in detail later. In order to perform cleaning and rotary table cleaning, each drive unit and the like is connected to the coater unit control unit 101 via the control units 103 to 107. It is adapted to be controlled Ri.
[0058]
  Similarly, the edge processing unit control unit 111 includes a shaft control unit 113 that controls the driving source such as a motor and an air cylinder mounted on the end surface processing unit 16 and a rinse that controls the opening and closing of each rinse valve. The valve control unit 114, the N2 valve control unit 115 that controls the opening and closing of each N2 valve, and the ultrasonic generator control unit that controls the operation of the ultrasonic generator and the generation of the negative pressure of the vacuum nozzle in the table cleaner 90, respectively. 116 and a negative pressure generation control unit 117 for dust collection are connected, and each drive unit or the like performs edge processing via the control units 113 to 117 in order to perform pin cleaning and processing table cleaning according to a cleaning mode described later. The unit control unit 111 controls the unit.
[0059]
  Reference numeral 100a denotes input / output means for inputting the cleaning mode and the like, and is connected to the main body control unit 100.
[0060]
  Next, control of the apparatuses for cleaning in the coater unit 14 and the edge processing unit 16 will be described with reference to FIGS.
[0061]
  In this flow, first, initial setting is performed in step S1, where each cleaning mode of nozzle cleaning of the coater unit 14, cup cleaning, rotary table cleaning, pin cleaning of the edge processing unit 16, and processing table cleaning is performed. For example, a BUSY / ON normal mode, which will be described later, is set.
[0062]
  In step S <b> 2, it is determined whether or not a mode setting command has been issued from the main body control unit 100. The mode setting is performed in advance by the operator via the input / output means 100a.
[0063]
  In step S3, it is determined whether or not a drive start command has been issued. If no start command has been issued, a standby state is set. On the other hand, if a start command is issued, it is determined in step S4 whether the substrate processing apparatus 10 is BUSY.ON, that is, whether a cassette is loaded in the loader 11. In step S5, the BUSY. It is determined whether or not the interval is ON, that is, whether or not the substrate processing apparatus 10 is stopped due to some trouble. In step S6, whether or not a carry-in delay occurs, that is, the coater unit 14 or the edge processing unit. It is determined whether or not the loading of the substrate W to 16 is delayed. In step S7, it is determined whether or not the lot has ended, that is, whether or not the processing of the final substrate W of the designated number of lots has been completed. In step S8, it is determined whether or not BUSY / OFF, that is, whether or not the final substrate W is stored in the cassette of the unloader 19.
[0064]
  If it is determined in step S8 that it is not BUSY · OFF, the process proceeds to step S4. On the other hand, if it is determined in step S8 that it is BUSY · OFF, the substrate processing apparatus 10 is subjected to processing in steps S9 and S10 described later. Is stopped, this flowchart ends.
[0065]
  If it is determined in step S2 of the flowchart that the mode setting command has been issued, the process proceeds to step S12, and the nozzle cleaning, cup cleaning, rotary table cleaning and edge processing unit of the coater unit 14 are performed according to the flowcharts shown in FIGS. Setting processing of each cleaning mode of 16 pin cleaning and processing table cleaning is performed.
[0066]
  If it is determined in step S4 that BUSY / ON, the process proceeds to step S13, and it is determined whether or not there is a cleaning process set in the later-described BUSY / ON mode among the above-described cleaning processes. If there is a cleaning process, the process proceeds to step S14 and the cleaning process is executed.
[0067]
  Similarly, if the BUSY / ON interval is determined in step S5, it is determined in step S15 whether there is a cleaning process set in a BUSY / ON interval mode, which will be described later, and a carry-in delay occurs in step S6. If it is determined in step S17, it is determined whether or not there is a cleaning process set in a later-described delay mode. If it is determined in step S7 that the lot has been completed, the lot mode described later is set in step S19. When it is determined in step S8 that BUSY / OFF is present, it is determined in step S9 whether there is a cleaning process set in a BUSY / OFF mode, which will be described later. . If there is a cleaning process set for each mode in these determinations, the process proceeds to steps S16, S18, S20 and S10, respectively, and the cleaning process is executed.
[0068]
  FIG. 19 is a flowchart showing the mode setting process in step S12.
[0069]
  In the mode setting process, first, after setting the mode of the cup cleaning process in step S25, the nozzle cleaning process, the rotary table cleaning process, the pin cleaning process, and the process table cleaning are sequentially performed while the process proceeds to step S26 to step S29. Each mode of processing is set.
[0070]
  Each mode setting in steps S25 to S29 is performed according to the flowchart shown in FIG.
[0071]
  In this flow, first, in step S30, it is determined whether or not the BUSY / ON mode (hereinafter referred to as BN mode) is designated. The BN mode is a mode in which cleaning is performed based on BUSY / ON detection (timing according to operation of the substrate processing apparatus). If it is determined that this mode has been designated, the process further proceeds to step S31 to determine whether or not the simple mode has been designated. If the simple mode has been designated, the process proceeds to step S32 and the cleaning mode is set. The BN simple mode is set. On the other hand, if it is determined that the simple mode is not designated, the process proceeds to step S33 and the cleaning mode is set to the BN normal mode.
[0072]
  Here, the simple mode is a mode in which processing in the normal mode is simplified, and is a mode in which, for example, the cleaning time is set shorter than that in the normal mode. The specific contents of the normal mode and the simple mode differ for each cleaning process, and will be described in detail later.
[0073]
  If it is determined in step S30 that the BN mode is not designated, the process proceeds to step S34, where it is determined whether or not the BUSY / ON interval mode (hereinafter referred to as BN interval mode) is designated. The BN interval mode is a mode in which cleaning is performed based on detection of the BN interval (timing according to occurrence of a non-processing state of the substrate processing apparatus). If it is determined that this mode is designated, a step is further performed. The process proceeds to S35 and it is determined whether or not the simple mode is designated. When the simple mode is designated, the process proceeds to step S36, and the cleaning mode is set to the BN interval simple mode. On the other hand, when the simple mode is not designated, the process proceeds to step S37 and the cleaning mode is set to the BN interval normal mode.
[0074]
  If it is determined in step S34 that the BN interval mode is not specified, the process proceeds to step S38, where it is determined whether or not the lot mode is specified. The lot mode is a mode in which cleaning is performed based on detection of the end of a specified number of lots. If it is determined that this mode has been specified, the process further proceeds to step S39 to determine whether the simple mode has been specified. Is judged. When the simple mode is designated, the process proceeds to step S40 and the cleaning mode is set to the lot simple mode. On the other hand, if the simple mode is not designated, the process proceeds to step S41 and the cleaning mode is set to the lot normal mode. The number of lots is specified at the time of mode setting, for example.
[0075]
  If it is determined in step S38 that the lot mode is not specified, the process proceeds to step S42, where it is determined whether the BUSY / OFF mode (hereinafter referred to as BF mode) is specified. The BF mode is a mode in which cleaning is performed based on BUSY / OFF detection (timing according to stoppage of the substrate processing apparatus). If it is determined that this mode is designated, the process proceeds to step S43. Then, it is determined whether or not the simple mode is designated. When the simple mode is designated, the process proceeds to step S44 and the cleaning mode is set to the BF simple mode. On the other hand, if the simple mode is not designated, the process proceeds to step S45 and the cleaning mode is set to the BF normal mode.
[0076]
  If it is determined in step S42 that the BF mode is not specified, the process proceeds to step S46, where it is determined whether or not the delay mode is specified. The delay mode is a mode in which cleaning is performed based on detection of arrival delay of the substrate W to the coater unit 14 or the edge processing unit 16 (timing according to the amount of delay in loading the substrate), and this mode is designated. If it is determined that the simple mode has been selected, the process further proceeds to step S47 to determine whether or not the simple mode has been designated. When the simple mode is designated, the process proceeds to step S48, and the cleaning mode is set to the delay simple mode. On the other hand, if the simple mode is not designated, the process proceeds to step S49 and the cleaning mode is set to the delayed normal mode.
[0077]
  Note that the flowchart shown in FIG. 20 is an example in which the cleaning mode is set alternatively from the above modes. For example, by setting the cleaning mode according to the flowcharts shown in FIGS. The mode may be set to overlap. Briefly explaining this flowchart, first, it is determined whether or not the BN mode is designated in step S90, and if designated, the BN normal mode or the BN simple mode is set through the processing of steps S95 to S97. Then, the process proceeds to step S91.
[0078]
  In step S91, it is determined whether or not the BN interval mode is designated. If designated, the BN interval normal mode or the BN interval simple mode is set through the processing of steps S98 to S100, and the process proceeds to step S92. Is done. Thereafter, similarly, in steps S92, S93, and S94, it is determined whether or not the lot mode, the BF mode, and the delay mode are sequentially designated. If designated, the designated modes are set.
[0079]
  FIGS. 21 to 24 show the respective cleaning processes executed in step S14, step S16, step S18, step S20 and step S10 of the flowcharts shown in FIGS. Hereinafter, these processes will be described.
[0080]
  FIG. 21 shows the cup cleaning process. In this process, first, the outer peripheral rinsing nozzle 55 is moved to the operating position, and then the outer rinsing nozzle 55 injects rinse for a predetermined time while the rotary table 32 is rotated at a low speed. As a result, the periphery of the rotary table 32 is cleaned (steps S50 to S52).
[0081]
  When the rinsing injection is stopped, the rotary table 32 is stopped in synchronism with this, the outer peripheral rinsing nozzle 55 is moved to the retracted position, and the lid portion 31 is moved to the descending end position to the substrate holding unit 30. Merged (steps S53 to S55). Then, after the first PR nozzle 65 and the chuck rinse nozzle 66 are moved to the operating position, rinse is ejected from the first PR nozzle 65, the chuck rinse nozzle 66, and the second PR nozzle 67 for a predetermined time while the rotary table 32 is rotated. The As a result, the upper and lower surfaces of the plate 51 and the surface of the turntable 32 are cleaned (steps S56 to S58).
[0082]
  When the rinsing injection is stopped, the rotary table 32 is stopped in synchronization with this, and the first PR nozzle 65 and the chuck rinsing nozzle 66 are moved to the retracted position (steps S59 and S60). When the movement of the first PR nozzle 65 and the chuck rinse nozzle 66 is completed, the rotary table 32 is rotated again, and the fixed rinse nozzle 56, the back rinse nozzle 57, the trap rinse nozzle 58, and the exhaust port rinse nozzle 59 are fixed. Time rinse is injected. As a result, the inner peripheral surface of the cup 34, the back surface of the rotary table 32, the resist discharge port 61 and the exhaust passage 64 are cleaned (steps S61 and S62).
[0083]
  And if rinse injection is stopped, a drying process will be performed at Step S63 next. This drying process is performed by rotating the rotary table 32 at a high speed for a certain period of time and removing the rinse adhering to the rotary table 32 by centrifugal force.
[0084]
  When the drying process is completed, the rotary table 32 is stopped, and then the lid 31 is moved to the rising end position, and the cup cleaning process is completed (steps S63 to S65).
[0085]
  Incidentally, in such a cup cleaning process, the processes of steps S50 to S65 shown in FIG. 21 are processes in the normal mode of the cup cleaning, and in the simple mode process, for example, the outer peripheral rinse nozzle 55 and the second PR nozzle 67. And the process in which the rinse injection by the exhaust port rinse nozzle 59 is omitted, that is, the process in which steps S50 to S54 in the above flow are omitted is performed.
[0086]
  FIG. 22 shows the nozzle cleaning process. In this process, first, in the liquid supply device 35, after the solvent pot 40 is moved to the lower end position, the support member 37 is moved and the nozzle 38 is set to the cleaning position (steps S70 and S71). In the nozzle cleaning device 42, while the cleaning head 43 is reciprocated a predetermined number of times along the nozzle 38 from the origin position, rinse and N2 blow are ejected from the cleaning nozzle 47 during this movement, whereby the nozzle 38 Cleaning is performed (step S72).
[0087]
  Thus, when the cleaning head 43 is reciprocated a predetermined number of times and the cleaning head 43 is reset to the origin position, the support member 37 is moved and the nozzle 38 is reset to the retracted position, and then the solvent pot 40 is raised. The nozzle cleaning process is completed by resetting to the end position (steps S73 and S74).
[0088]
  The simple mode in the nozzle cleaning process is set such that the number of reciprocating movements of the cleaning head 43 in step S72 is smaller than that in the normal mode. For example, when the cleaning head 43 is reciprocated twice in the normal mode. In the simple mode, the cleaning head 43 is moved only once.
[0089]
  FIG. 23 shows the pin cleaning process. In this process, the cleaning pot 87 is set at the ascending end position in the pin cleaning device 86, whereby the positioning pin 85 of the positioning device 82 is inserted into the cleaning pot 87 (step S80). Then, after rinsing is sprayed on the positioning pin 85 for a predetermined time to clean the positioning pin 85, N2 blow is sprayed for a predetermined time and the positioning pin 85 is dried (steps S81 and S82). .
[0090]
  When the drying process is thus completed, the cleaning pot 87 is reset to the lowered end position, and the cleaning process for the positioning pins 85 is completed (step S83).
[0091]
  In the simple mode in the pin cleaning process, the rinse injection time in step S81 is set to be shorter than that in the normal mode. For example, in the simple mode, the rinse injection time is half of the normal mode. It is set up.
[0092]
  FIG. 24 shows the rotary table cleaning process of the coater unit 14. In this process, after the head 76 of the table cleaner 75 is set on one end side of the suction part 33 of the rotary table 32, it is reciprocated a predetermined number of times on the suction part 33, and during this movement, the ultrasonic generator 79a and The rotary table 32 is cleaned by operating the vacuum nozzle 79b (steps S85 to S87). When the head 76 is reciprocated a predetermined number of times, the head 76 is reset to the initial position outside the cup 34 and the cleaning of the rotary table 32 is completed.
[0093]
  The simple mode in the rotary table cleaning process is set such that the number of reciprocating movements of the head 76 is smaller than that in the normal mode. For example, when the cleaning head 76 is reciprocated twice in the normal mode, the head 76 is moved in the simple mode. It is designed to move only one round trip.
[0094]
  Note that the processing table cleaning processing by the table cleaner 90 of the edge processing unit 16 is basically performed according to the flow shown in FIG. 24, and the description thereof is omitted here.
[0095]
  As described above, in the substrate processing apparatus 10, each cleaning device mounted on the coater unit 14 and the edge processing unit 16 can be operated at a plurality of timings such as the BN mode. By setting the cleaning timing of the apparatus to an appropriate timing according to the processing status of the substrate W, the function of each cleaning apparatus, the cleaning location, etc., the cleaning process can be performed efficiently and appropriately by each cleaning apparatus. . Therefore, as compared with the conventional apparatus of this type in which the various cleaning apparatuses are operated at the same timing uniformly, the generation of particles can be reliably prevented while ensuring the processing efficiency of the substrate W.
[0096]
  In particular, in the above embodiment, not only the operation timing of each cleaning device but also the cleaning content can be selectively set, that is, the cleaning content can be selectively set from the normal mode and the simple mode. Therefore, by selecting an appropriate mode from these modes in consideration of the operation timing, it is possible to perform an appropriate cleaning process according to the function of each cleaning device, the cleaning location, etc. The cleaning process can be performed by effectively using the maximum time within a range that does not affect the processing tact. Therefore, the processing efficiency can be ensured and the generation of particles can be better achieved.
[0097]
  In addition, the substrate processing apparatus 10 of the said embodiment is an example of the substrate processing apparatus to which this invention was applied, The specific structure can be suitably changed in the range which does not deviate from the summary of this invention.
[0098]
  For example, although not specifically described in the above embodiment, the bake unit 18 performs the processing with the substrate W held on the plate. Therefore, as a device for cleaning the plate, for example, the table cleaner 75 is used. , 90 may be provided. Therefore, in this case, the cleaning device for these plates may be operated at each timing of the above-described embodiment, and may be controlled according to the control flow shown in FIGS.
[0099]
  In the substrate processing apparatus 10, the coater unit 14 is composed of a spin coater. Of course, the present invention can be applied to the case where the coater unit 14 is composed of an apparatus for forming a thin film such as a slit coater or a roll coater. Can be applied.
[0100]
  Furthermore, in the above embodiment, the timing mode is set from five types of modes such as the BN mode, the BN interval mode, the lot mode, the BF mode, and the delay mode as the timing for operating each cleaning device. Other timing modes may be set. For example, when many processing units are arranged on the upstream side of the coater unit 14, the processing for one lot is completed, and the first substrate of the next lot is set in advance on the upstream side of the coater unit 14. The timing according to the processing status of the substrate in the upstream processing unit, such as the time when the processing unit is carried into the processing unit or the cleaning processing is performed when the processing of the first substrate in the processing unit is completed. Alternatively, the timing mode for performing the cleaning process may be set, or the timing mode for performing the cleaning process for each substrate may be set. That is, the timing mode may be appropriately determined according to the specific configuration of the substrate processing apparatus to be applied. In the above embodiment, the cleaning process can be selected from the normal mode and the simple mode. For example, in addition to these modes, a precision mode for performing cleaning more precisely can be selected, or more stages can be selected. You may enable it to select the washing | cleaning content (for example, 10 steps). Of course, it is not always necessary to be able to select the mode of the cleaning condition. For example, the cleaning process may be performed under a single condition.
[0101]
【The invention's effect】
  As described above, the substrate processing apparatus of the present invention forms a thin film on the surface of the substrate by carrying out processing while carrying the substrate in and out of a plurality of processing units, and removes unnecessary deposits attached to the apparatus by processing. In a substrate processing apparatus provided with a plurality of cleaning means for cleaning and removing,The operation timing of each cleaning means can be operated at an appropriate timing according to the processing status of the substrate, the function of each cleaning means, the cleaning location, etc. In particular, the processing unit provided with the cleaning means as the operation timing The timing according to the processing status of the substrate in the processing section on the upstream side, or the timing according to the delay in loading of the substrate into the processing section provided with the cleaning means is set during the operation of the substrate processing apparatus. SoGeneration of particles can be reliably prevented while appropriately ensuring the substrate processing efficiency.
[0102]
  In this device,As the operation timing, (1) timing according to the processing status of the substrate in the processing unit upstream of the processing unit provided with the cleaning unit, and (2) the substrate processing apparatus is in operation and provided with the cleaning unit. (3) Timing according to at least one of when the substrate processing apparatus is in operation and when it is stopped, and (4) When the substrate processing apparatus is in operation and in a non-processed state. If it is possible to set a plurality of timings including at least the timing (1) among the timings corresponding to the occurrence of the occurrence, or a plurality of timings including at least the timing (2) can be set, each cleaning means can be mounted on It can be operated at a better timing suitable for the processing conditions and functions of each cleaning means, and such timing setting is easily performed. It can become.
[0103]
  Furthermore, if the cleaning control unit is configured to selectively operate the cleaning unit from a plurality of operating conditions, the cleaning process can be performed according to the function of each cleaning unit, the cleaning location, or the like. The cleaning can be performed by effectively using the maximum time within a range that does not affect the processing tact of the substrate.
[0104]
  In particular, the processing unit includes a thin film forming unit that supplies a liquid to the surface of the substrate held on the rotary table via a nozzle member and forms a thin film on the substrate surface by a centrifugal force accompanying the rotation of the substrate. As a cleaning means, a substrate processing apparatus having a nozzle cleaning means for cleaning the nozzle member, a rotary table cleaning means for cleaning the rotary table, and a peripheral cleaning means for cleaning the periphery of the rotary table, or transported as a processing section A substrate having a thin film formed thereon, which is transferred onto the processing table, is positioned by a positioning member to remove an unnecessary thin film formed on the substrate edge, and the positioning unit serves as the positioning unit. In a substrate processing apparatus having a positioning member cleaning means for cleaning a member and a processing table cleaning means for cleaning the processing table, a thin film is formed. Since the liquid adheres to frequent device, on this substrate processing apparatusStructureBy adopting the configuration, it is possible to improve the productivity and quality of the substrate through ensuring the processing efficiency of the substrate and preventing the generation of particles.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a substrate processing apparatus to which the present invention is applied.
FIG. 2 is a plan view showing a coater unit and an edge processing unit of the substrate processing apparatus.
FIG. 3 is a perspective view showing a spin coater applied to the coater unit.
FIG. 4 is a plan view showing a liquid supply apparatus.
FIG. 5 is a side view showing a liquid supply device and a solvent pot.
FIG. 6 is a side view showing a liquid supply device and a nozzle cleaning device.
FIG. 7 is a cross-sectional view showing a cleaning head of a nozzle cleaning device.
FIG. 8 is a plan view showing a cleaning head of the nozzle cleaning device.
FIG. 9 is a cross-sectional view of a principal part showing a substrate holding part of a spin coater.
FIG. 10 is a cross-sectional view of a main part showing a lid part of a spin coater.
FIG. 11 is a plan view showing a driving structure of a first plate rinse nozzle and a chuck rinse nozzle.
FIG. 12 is a cross-sectional view showing a configuration of a head of the table cleaner.
FIGS. 13A to 13C are schematic views for explaining a cleaning operation by a table cleaner provided in the coater unit.
FIG. 14 is a side view showing a positioning state of the substrate by the positioning device.
FIGS. 15A and 15B are diagrams for explaining a pin cleaning operation by a pin cleaning device. FIGS.
FIG. 16 is a block diagram showing a control system of a substrate processing apparatus that controls each cleaning device of a coater unit and an edge processing unit.
FIG. 17 is a flowchart (main flow) showing a control example of each cleaning device of the coater unit and the edge processing unit.
FIG. 18 is a flowchart (main flow) showing a control example of each cleaning device of the coater unit and the edge processing unit.
FIG. 19 is a flowchart showing a mode setting process in the flowcharts of FIGS. 17 and 18;
20 is a flowchart showing each cleaning process mode setting process in the flowchart of FIG.
FIG. 21 is a flowchart showing a cup cleaning process.
FIG. 22 is a flowchart showing a nozzle cleaning process.
FIG. 23 is a flowchart showing a pin cleaning process.
FIG. 24 is a flowchart showing a rotary table cleaning process.
FIG. 25 is a flowchart showing another example of each cleaning process mode setting process in the flowchart of FIG.
FIG. 26 is a flowchart showing another example of each cleaning process mode setting process in the flowchart of FIG.
[Explanation of symbols]
  10 Substrate processing equipment
  12 Standby unit
  14 Coater unit
  16 Edge processing unit
  18 bake units
  20, 21, 22 Transport robot
  30 Substrate holder
  31 Lid
  35 Liquid supply device
  42 Nozzle cleaning device
  55 Peripheral rinse nozzle
  56 Cup rinse nozzle
  57 Back rinse nozzle
  58 Trap rinse nozzle
  59 Exhaust outlet rinse nozzle
  65 First plate rinse nozzle
  66 Chuck rinse nozzle
  67 Second plate rinse nozzle
  75,90 Table cleaner
  80 processing table
  82 Positioning device
  86 pin cleaning equipment
  100 Control unit
  101 Coater unit controller
  111 Edge processing unit controller

Claims (10)

In a substrate processing apparatus provided with a plurality of cleaning means for forming a thin film on a substrate surface by performing processing while carrying the substrate in and out of a plurality of processing units and cleaning and removing unnecessary deposits attached to the apparatus by the processing. , comprising a timing setting means allowing setting respective operation timings of the respective cleaning means, and a cleaning control means for operating each said respective cleaning means with operation timing set by the timing setting means, said operation timing The substrate processing apparatus is characterized in that the timing is set according to the processing status of the substrate in the processing section upstream of the processing section provided with the cleaning means . In a substrate processing apparatus provided with a plurality of cleaning means for forming a thin film on a substrate surface by performing processing while carrying the substrate in and out of a plurality of processing units and cleaning and removing unnecessary deposits attached to the apparatus by the processing. A timing setting means for enabling the operation timing of each cleaning means to be set; and a cleaning control means for operating each of the cleaning means at an operation timing set by the timing setting means. , even during operation of the substrate processing apparatus, carry delay amount board processor you wherein it is set to a timing corresponding to the substrate to the processing section to which the cleaning means are provided. The timing setting means, as the operation timing,
( 1) Timing according to the processing status of the substrate in the processing unit upstream of the processing unit provided with the cleaning means,
(2) Timing in accordance with the amount of delay in loading the substrate into the processing unit provided with the cleaning means, while the substrate processing apparatus is in operation.
(3) Timing according to at least one of operation and stop of the substrate processing apparatus,
(4) The plurality of timings including at least the timing (1) among the timings corresponding to the occurrence of the non-processing state while the substrate processing apparatus is in operation can be set. Substrate processing equipment. The timing setting means, as the operation timing,
( 1) Timing according to the processing status of the substrate in the processing unit upstream of the processing unit provided with the cleaning means,
(2) Timing in accordance with the amount of delay in loading the substrate into the processing unit provided with the cleaning means, while the substrate processing apparatus is in operation.
(3) Timing according to at least one of operation and stop of the substrate processing apparatus,
(4) according to claim 2, characterized in that it is possible to set a plurality of timing including the timing of at least (2) of the timing corresponding to the occurrence of non-treated state even during the operating the substrate processing apparatus Substrate processing equipment.   The substrate processing apparatus according to claim 1, wherein the cleaning control unit is configured to selectively operate the cleaning unit from a plurality of operating conditions. The substrate processing apparatus includes, as the processing unit, a thin film forming unit that supplies a liquid to a surface of a substrate held on a rotary table via a nozzle member and forms a thin film on the surface of the substrate by a centrifugal force generated by the rotation of the substrate. And having, as the cleaning means, a nozzle cleaning means for cleaning the nozzle member, a rotary table cleaning means for cleaning the rotary table, and a peripheral portion cleaning means for cleaning the periphery of the rotary table. the substrate processing apparatus according to any one of claims 1 to 5. The substrate processing apparatus, as the processing unit, removes an unnecessary thin film formed on a substrate edge by positioning a substrate after forming a thin film, which is transferred onto a processing table by a conveying means, with a positioning member. has a section, as the cleaning means, a positioning member cleaning means for cleaning the positioning member, one of the claims 1 to 5, characterized in that and a processing table cleaning means for cleaning the processing table A substrate processing apparatus according to claim 1. The substrate processing apparatus includes a table for holding a substrate, Bei example a nozzle member for supplying liquid to a surface of the substrate held on the table, the nozzle cleaning means to clean the nozzle member as the cleaning means 6. The substrate processing apparatus according to claim 1, further comprising a substrate processing apparatus. A substrate processing apparatus provided with a plurality of cleaning means for forming a thin film on a substrate surface by carrying out processing while carrying the substrate in and out of a plurality of processing units, and cleaning and removing unnecessary deposits attached to the apparatus by the processing. A method of cleaning the processing unit,
The operation timing of each of the cleaning means is set in advance to a timing according to the processing status of the substrate in the processing section upstream of the processing section provided with the cleaning means, and each cleaning means is operated at this operation timing. The cleaning method is characterized in that each of the processing units is cleaned. A substrate processing apparatus comprising a plurality of cleaning means for forming a thin film on a substrate surface by performing processing while carrying the substrate in and out of a plurality of processing units, and cleaning and removing unnecessary deposits attached to the apparatus by the processing. A method of cleaning the processing unit,
  The operation timing of each of the cleaning means is set in advance to a timing corresponding to the amount of delay in loading the substrate into the processing unit provided with the cleaning means while the substrate processing apparatus is in operation. A cleaning method, wherein each processing section is cleaned by operating each of the cleaning means.

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