JP3934745B2 - Substrate transfer unit and wet processing apparatus using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate transfer unit used for wet processing for forming an electronic circuit on a surface of a liquid crystal substrate or a silicon wafer as a semiconductor substrate, and a wet processing apparatus using the substrate transfer unit.
[0002]
[Prior art]
Conventionally, in order to form an electronic circuit on a surface of a liquid crystal substrate or a silicon wafer which is a semiconductor substrate, a surface treatment called a wet treatment has been performed. This process usually includes steps of resist coating, exposure, development, etching, and resist removal. By repeating these steps, a predetermined electronic circuit is formed on the substrate.
[0003]
Etching and resist removal here are conventionally performed by a series type wet processing apparatus as shown in FIG. This processing apparatus has a plurality of units such as a loader unit, a chemical unit, a water washing unit, a drying unit, an unloader unit arranged in the order of processes. As a substrate transfer method between units, a roller transfer method or a biaxial robot method is mainly used. Is used.
[0004]
In addition, for the chemical treatment in the chemical unit and the pure water treatment in the washing unit, the treatment liquid is applied to the entire surface of the substrate by spraying the treatment liquid from a number of nozzles provided in each unit or immersion in the treatment liquid. It is structured to spread.
[0005]
[Problems to be solved by the invention]
Such a series-type wet processing apparatus has reached a level at which there is no problem in the processing itself due to repeated improvements. However, the following inconveniences are still not solved.
[0006]
Multiple units are arranged in a single row, and more than one chemical solution unit and water washing unit are generally arranged for throughput improvement and process stabilization. It reaches 10 m. Further, since etching and resist removal are performed in one wet process, at least two rows of this long apparatus are required, and the wet process is usually repeated, so that the area occupied by the apparatus becomes enormous.
[0007]
Recently, it has been actively promoted to improve processing capacity by replacing old equipment with new ones. In that case, it would be costly to add a clean room, so increase the processing capacity in the same space as before. This is the demand of the majority of users. However, even though it is a state-of-the-art device, the device length is still long, so it is difficult to increase the number of devices in the same space, and therefore the processing capacity cannot be dramatically increased.
[0008]
Due to the throughput method in which the substrate passes through all the units, it is difficult to cope with the change in the processing process accompanying the change in the specification. For example, in the apparatus of FIG. 12, it is impossible to change the process such as reducing the chemical treatment to one time or omitting the chemical treatment and performing only water washing.
[0009]
Recently, the number of cases for specifying the substrate processing process is increasing on the user side. However, in the conventional apparatus, since the downstream process is affected by the upstream process, the degree of freedom in changing the process is small. In addition, the current situation is that the user's request cannot be fully met.
[0010]
When one of the units fails, the substrate on the upstream side cannot be taken out, and the substrate may become a defective product depending on the location where the substrate exists. For example, when the water washing unit breaks down, the substrate existing in the upstream chemical solution unit is left with the chemical solution attached, and as a result, the substrate becomes a defective product.
[0011]
An object of the present invention is to provide a substrate transfer unit that solves these problems and a wet processing apparatus using the same.
[0012]
[Means for Solving the Problems]
In order to solve the above problems, the present inventor arranges various substrate processing units for etching, washing, etc. around the omnidirectional substrate transfer unit using a robot, and the central substrate transfer unit. A radial layout was considered in which a series of processing was performed by transferring substrates to various surrounding substrate processing units.
[0013]
According to this radial layout, the length of the apparatus is shortened, and the substrate is arbitrarily sent to each processing unit via the central substrate transfer unit, so the route of the substrate is not limited, and the upstream and downstream relationships of the process Is also resolved. Therefore, it is easy to change the processing process accompanying the specification change and to set the process desired by the user, and the influence on other units when one unit fails is eliminated.
[0014]
However, in the case of the radial layout, it is necessary for the omnidirectional substrate transfer unit located at the center to handle from the substrate before processing to the substrate after processing. In other words, the series of processing is roughly divided into chemical processing and cleaning processing for removing the chemical. However, in the case of the radial layout, one substrate transfer unit immediately after the chemical processing is performed. After handling the substrate to which the metal adheres, a clean substrate after the cleaning process is also handled. For this reason, there exists a problem that a chemical | medical solution transfers to a clean board | substrate via a board | substrate delivery / reception unit, and unless this problem is solved, a radial layout will not be implement | achieved.
[0015]
In addition, the substrate transfer unit handles a substrate adjacent to the substrate processing unit that performs chemical processing and to which the chemical is attached. Therefore, it is inevitable that the inside of the unit becomes a strong corrosive atmosphere, and it is necessary to effectively isolate the drive unit that drives the hand unit from the corrosive atmosphere. However, in the radial layout, since the hand portion of the substrate transfer unit moves in a complicated manner compared to the serial layout, the structure of the drive portion is also complicated. And it is not easy to isolate this complicated drive part from the corrosive atmosphere, but it is also important to solve this isolation problem in order to realize a radial layout.
[0016]
The present invention provides an omnidirectional substrate transfer unit that reliably prevents chemical transfer even when handling a substrate before processing to a substrate after processing, thereby enabling a radial layout, and its radiation type A wet processing apparatus adopting a layout is provided. The present invention also provides an omnidirectional substrate transfer unit that can easily and surely shield the drive unit even though the hand unit performs a complicated operation of transferring a substrate to the surroundings. Is.
[0017]
  The substrate exchanging unit of the present invention includes a plurality of substrate exchanging hand portions arranged in a plurality of stages in the vertical direction, and a plurality of substrates so that the substrates can be exchanged independently at at least a plurality of positions in the circumferential direction. 3D drive of the hand partIn order to perform the three-dimensional drive, at least a rotational movement around the vertical line and a vertical movement are performed.Drive meansIn addition, as a shield mechanism for the drive means, a movable cover that covers the drive means and performs a lifting and rotating motion together with the drive means, a water tank for water sealing the lower end of the cover, A partition plate through which the cover penetrates with a gap, and means for sucking a space below the partition plateIs.
[0018]
The drive means includes a rotary lift shaft that rotates around the vertical line and moves up and down in the vertical direction, and a plurality of straight drive units that are attached to the rotary lift shaft and that each drive the hand unit straight in the horizontal direction. It is preferable that it has a simple structure.
[0019]
(Delete)
[0020]
In the wet processing apparatus of the present invention, a plurality of substrate processing units are arranged around the substrate transfer unit of the present invention.
[0021]
In the substrate transfer unit of the present invention, a plurality of hand portions for handling the substrate are arranged in a plurality of stages in the vertical direction. These hand portions can transfer the substrate independently at at least a plurality of positions in the circumferential direction.
[0022]
Now, if the number of stages of the hand part is two, the hand part is such that the upper hand part handles the substrate to which the chemical solution before and after the treatment does not adhere, and the lower hand part handles the substrate to which the chemical liquid during the treatment adheres. By properly using these, the chemical solution is prevented from adhering to the upper hand portion, and the hand portion is always kept clean, so that the substrate after processing is prevented from being contaminated by the chemical solution. By the way, if this is not used properly, transfer of the chemical solution through the hand part becomes a problem, and if the substrate with the chemical solution attached is handled in the upper hand part even if this use is done separately, the upper hand part There is a possibility that the lower hand part may be contaminated by the chemical liquid due to the dropping of the chemical liquid from the lower hand part to the lower hand part or the down flow accompanying the suction and exhaust in the unit.
[0023]
  Also driving meansA space below the partition plate is sucked through the gap around the movable cover that covers the cover, thereby forming a strong downflow along the cover. In order not to obstruct the movement of the hand part, it is impossible to completely cover the drive means with the cover, but the cover through the inevitable opening is formed by forming a strong downflow along this cover Intrusion of outside air into the inside is effectively prevented.
[0024]
The number of steps of the hand portion in the substrate transfer unit of the present invention is not limited to two, but may be three or more. Each hand unit does not necessarily need to be able to send and receive substrates steplessly in all directions. If there are three substrate processing units arranged in the surroundings, a minimum number of substrates must be transferred in the three directions. If you can.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0026]
FIG. 1 is a plan view of a wet processing apparatus according to an embodiment of the present invention.
[0027]
This wet processing apparatus is an etching processing apparatus for a liquid crystal substrate functionally corresponding to the wet processing apparatus of the series layout shown in FIG. As shown in FIG. 1, the present processing apparatus has a double-hand robot type substrate transfer unit 100 as a center, and a spin-type first substrate processing unit 200 and a second substrate processing unit 200 ′ are arranged on both sides thereof. In addition, a radial layout is adopted in which a buffer / double-sided cleaning unit 300 is disposed on the front side, and a substrate transfer unit 400 and a loader unit 500 that also serves as a loader / unloader are disposed on one side of the buffer / double-sided cleaning unit 300. ing. The buffer is a temporary table when the substrate transfer unit 100 exchanges the liquid crystal substrate 600.
[0028]
The loader unit 500 positions a stocker 700 loaded with an unprocessed liquid crystal substrate 600 and a stocker 800 loaded with a processed liquid crystal substrate 600 at fixed positions. The substrate transfer unit 400 takes out the unprocessed liquid crystal substrate 600 from the stocker 700 and places it on the buffer unit of the buffer / double-sided cleaning unit 300 using a single robot hand. Also, the processed liquid crystal substrate 600 placed in the buffer section of the buffer / double-sided cleaning unit 300 is placed on the stocker 800. The substrate transfer unit 100 uses the double-handed robot, and appropriately uses the buffer unit of the buffer / double-sided cleaning unit 300 while appropriately using the first substrate processing unit 200, the second substrate processing unit 200 ′, and the buffer / double-sided unit. The liquid crystal substrate 600 is transferred to the double-sided cleaning unit of the cleaning unit 300. On the other hand, the first substrate processing unit 200, the second substrate processing unit 200 ′, and the double-sided cleaning unit of the buffer / double-sided cleaning unit 300 perform predetermined processing on the received liquid crystal substrate 600. Accordingly, the processed liquid crystal substrate 600 in the stocker 700 is sequentially etched and carried into the stocker 800.
[0029]
Here, the first substrate processing unit 200 and the second substrate processing unit 200 ′ are basically spin processing units having the same structure, and the former is an etching unit and the latter is based on the difference in processing liquid and slight specification. Is used as a finishing cleaning and drying unit (rinse dryer).
[0030]
In the etching processing apparatus, hydrogen fluoride or the like is used as the etching processing solution, and an extremely corrosive gas is generated from the processing solution. Therefore, countermeasures against corrosion and environmental measures are important. From this point of view, the interiors of the substrate transfer unit 100, the first substrate processing unit 200, the second substrate processing unit 200 ′, the buffer / double-sided cleaning unit 300, etc. are sucked into negative pressure. The inside of the first substrate processing unit 200 (etching unit) that directly uses a processing solution such as strong hydrogen fluoride is sucked to the strongest negative pressure, and the first substrate processing unit 200 and the opening for transferring the substrate. The substrate transfer unit 100 directly connected via the substrate is sucked moderately, and the second substrate processing unit 200 ′ connected indirectly to the first substrate processing unit 200 via the substrate transfer unit 100 and the buffer / double-sided cleaning Each unit 300 is sucked weakly. Thereby, direct diffusion of the corrosive gas generated in the first substrate processing unit 200 (etching unit) is prevented. In addition, measures are taken for each unit to prevent corrosion in the first substrate processing unit 200 and corrosion in other units due to indirect diffusion through the processing liquid or the like adhering to the liquid crystal substrate 600. Yes.
[0031]
The structures and functions of the substrate transfer unit 100, the first substrate processing unit 200, the second substrate processing unit 200 ′, and the buffer / double-sided cleaning unit 300 will be described in detail below.
[0032]
2 is a longitudinal front view of the substrate transfer unit 100, and FIG. 3 is a perspective view of a double hand robot used in the substrate transfer unit 100. As shown in FIG.
[0033]
As shown in FIG. 2, the substrate transfer unit 100 includes a double hand robot 110 installed at the center of the housing 130 and a shield mechanism 120 that isolates the double hand robot 110 from a corrosive atmosphere.
[0034]
As shown in FIG. 3, the double hand robot 110 includes a rotary lift shaft 112 driven by a rotary lift drive unit 111, a rotary lift base 113 attached to the upper end of the rotary lift shaft 112, and a rotary lift base 113. It has linear drive units 114 and 114 attached to both sides, and horizontal robot hands 115 and 116 that are linearly driven in the horizontal direction by the linear drive units 114 and 114.
[0035]
The robot hands 115 and 116 are arranged in two upper and lower stages. The upper robot hand 115 handles the liquid crystal substrate 600 before and after processing, and the lower robot hand 116 handles the liquid crystal substrate 600 being processed. When the upper robot hand 116 handles the liquid crystal substrate 600 being processed, and the lower robot hand 116 handles the liquid crystal substrate 600 before and after processing, it is generated from the processing liquid adhering to the upper robot hand 115 and this processing liquid. The corrosive gas that is generated contaminates the lower robot hand 116 that handles the liquid crystal substrate 600 after processing, leading to contamination of the liquid crystal substrate 600. However, when the clean liquid crystal substrate 600 before and after processing is handled by the upper robot hand 116 and the liquid crystal substrate 600 being processed is handled by the lower robot hand 116, these contaminations do not occur.
[0036]
Each robot hand holds the liquid crystal substrate 600 on the tip, and rotates, moves up and down, and moves forward and backward by driving by the rotary drive unit 111 and the straight drive units 114 and 114, and a combination of these operations. Thus, the liquid crystal substrate 600 is transferred to the first substrate processing unit 200, the second substrate processing unit 200 ′, and the buffer / double-sided cleaning unit 300. In order to prevent corrosion, each robot hand is subjected to a surface treatment with a fluororesin or the like.
[0037]
As shown in FIG. 2, the shield mechanism 120 of the substrate transfer unit 100 is provided on the main cover 124 and the cylindrical main cover 124 that covers the rotary lift driving unit 111 and the rotary lift shaft 112 of the double hand robot 110. A sub cover 125 that covers the hand portion of the double hand robot 120, an annular water tank 121 that surrounds and installs the rotary lift drive unit 111 of the double hand robot 110, and an annular water tank that is provided on the outer peripheral side of the water tank 121. A liquid receiver 122 and a partition plate 123 provided above the liquid receiver 122 and partitioning the inside of the housing 130 up and down are provided. Here, the liquid receiver 122 also serves as a second partition plate that partitions the inside of the housing 130 up and down.
[0038]
The main cover 124 formed of a cylindrical skirt has an upper end connected to the rotary lift base 113 of the double hand robot 110 and a lower portion inserted into the water in the water tank 121. With this water-sealing structure, the portion below the hand portion is isolated from the corrosive atmosphere in the housing 130 without hindering the rotation operation and the lifting operation of the hand portion of the double hand robot 110. However, the hand portion is not isolated only by this water seal structure. Therefore, although the sub cover 125 is provided on the main cover 124 to cover the hand portion, it is impossible to completely cover the hand portion because of the necessity of placing the liquid crystal substrate 600 on the tip of the hand. In addition, the corrosive gas may enter the sub cover 125, and the corrosive gas may also enter the main cover 124 via the movable parts (straight drive units 114, 114, etc.). As a countermeasure against this, it is conceivable to pressurize the inside of the main cover 124, but this leads to a complicated apparatus configuration and an increase in scale. Therefore, here, the partition plate 123 is provided with a gap 126 on the outer peripheral side of the main cover 124, and the inside of the housing 130 is sucked between the liquid receiver 122 and the partition plate 123.
[0039]
With this configuration, the space above the partition plate 123 in the housing 130 is sucked below the partition plate 123 through the gap 126 between the partition plate 123 and the main cover 124, and as a result, above the partition plate 123. In this space, a down flow is formed along the outer peripheral surfaces of the main cover 124 and the sub cover 125. For this reason, even if the inside of the main cover 124 is not pressurized, the situation where the corrosive gas enters the sub cover 125 and the main cover 124 is avoided, and the double hand robot 120 is protected from the corrosive gas except for the hand portion. Is done.
[0040]
Note that water is supplied into the water tank 121 in order to suppress the progress of water contamination in the water tank 121 due to the dissolution of the corrosive gas. The water overflowing from the water tank 121 is accumulated in the liquid receiver 122 and is appropriately extracted outside.
[0041]
4 is a front view of the first substrate processing unit 200, FIG. 5 is a plan view of the unit, and FIG. 6 is a longitudinal sectional view of a sealing mechanism provided in the unit.
[0042]
As shown in FIGS. 4 and 5, the first substrate processing unit 200, which is an etching unit, includes a rotor 220 provided at the center of the processing tank 210 and three rotors provided around the rotor 220. Horizontal swing arms 230, 240, 250. The rotor 220 holds the liquid crystal substrate 600 horizontally and rotates it at a predetermined speed.
[0043]
The swing arm 230 is supported by an up-and-down vertical rotating shaft 231, and performs an up-and-down operation and a turning operation around the rotating shaft 231 by the up-and-down operation and rotation operation of the rotating shaft 231. The other swing arms 240 and 250 also perform the raising / lowering operation and the turning operation by the same mechanism. The length of each swing arm is set so that the tip of the arm is positioned on the center of rotation when the swing arm is positioned substantially on the radial line with respect to the rotation circle of the rotor 220.
[0044]
Three spray nozzles 232, 232, and 232 are attached to the swing arm 230 at equal intervals. Each of these spray nozzles sprays the etching processing liquid supplied through the flexible tube 233 downward, and jointly sprays the etching processing liquid in the longitudinal direction of the swing arm 230 together. Similarly, three spray nozzles 242, 242, 242 arranged in the longitudinal direction are also attached to the swing arm 240, which is supported in a substantially diagonal position across the rotation center of the rotor 220, The etching process liquid is continuously jetted in the longitudinal direction. Then, by arranging the two swing arms 230 and 240 in a line along the diameter direction of the rotation circle of the rotor 220, continuous and uniform injection of the etching treatment liquid is performed along the diameter direction.
[0045]
A gas nozzle 252 is attached to the tip of the remaining swing arm 250 in order to perform a nitrogen gas purge at the center of the rotating circle.
[0046]
In the first substrate processing unit 200, which is an etching unit, a highly corrosive processing liquid is sprayed from above onto the liquid crystal substrate 600 on the rotor 220. Therefore, it is necessary to isolate the rotational drive unit below the rotor 220 from the upper rotor unit. is there. The shielding mechanism for this isolation will be described with reference to FIG.
[0047]
The rotor 220 has a plurality of pins 221 for supporting the liquid crystal substrate 600. A ring-shaped holder 222 that holds the rotor 220 is attached to an upper end portion of a vertical rotating shaft 223 that is rotationally driven by a motor (not shown). The rotating shaft 223 is rotatably supported in a cylindrical post 224 via a bearing 225. The shield mechanism 260 has a partition plate 261 that partitions the inside of the processing tank 210 up and down. The partition plate 261 is in the shape of a truncated cone having an opening at the center for discharging the treatment liquid dripped from above, and the inner edge of the upper end is an annular holding attached to the upper end of the post 224 The member 262 is hermetically connected. An annular water tank 263 is formed on the holding member 262. Fresh water continues to be supplied into the water tank 263, and an annular convex portion 264 protruding from the lower surface of the holder 222 is inserted into the water from above. Further, the inside of the post 224 is pressurized by air supplied through the nipple 265 and the through hole 266.
[0048]
According to such a shield mechanism 260, the rotor 220 and the holder 222 are located in a space outside (above) the partition plate 261. On the other hand, the rotation drive unit including the rotation shaft 223 and the post 224 is located in the space inside (lower) the partition plate 261. Both spaces are separated by inserting the convex portion 264 of the holder 222 into the water in the water tank 263. Here, the corrosive gas generated from the treatment liquid dissolves in the water in the water tank 263 and attempts to enter the rotating shaft 223 over the convex portion 264, but fresh water continues to be supplied into the water tank 263. In addition, since the inside of the post 224 is pressurized, there is no possibility that the corrosive gas comes out of the water in the water tank 263 and enters the rotating shaft 223 side. Therefore, the rotary drive part of the rotor 220 is completely isolated from the upper rotor part, and corrosion of the rotary drive part by the corrosive gas generated on the rotor part side is prevented.
[0049]
FIG. 7 is a plan view of the second substrate processing unit 200 ′.
[0050]
The second substrate processing unit 200 ′ is basically a spin processing unit having the same structure as the first substrate processing unit 200, which is an etching unit. Used as a drying unit (rinse dryer).
[0051]
That is, in the second substrate processing unit 200 ′, which is a finish cleaning / drying unit (rinse dryer), pure water for finish cleaning is sprayed from the three spray nozzles 232, 232, 232 attached to the swing arm 230. . Three ultrasonic oscillators 243, 243, and 243 are attached to the swing arm 240 that is supported in a substantially diagonal position across the rotation center of the rotor 220 at intervals in the longitudinal direction. Ultrasonic cleaning is performed in conjunction with pure water injection from the spray nozzles 232, 232, and 232. A gas nozzle 252 for performing a nitrogen gas purge is attached to the tip of the swing arm 250.
[0052]
The other structure is basically the same as that of the first substrate processing unit 200.
[0053]
8 is a front view showing the internal structure of the buffer / double-sided cleaning unit 300, FIG. 9 is a plan view of the double-sided cleaning unit of the unit, and FIG. 10 is a side view of the double-sided cleaning unit.
[0054]
The buffer / double-sided cleaning unit 300 has a two-stage structure in which the buffer unit 320 is provided on the double-sided cleaning unit 310. The buffer unit 320 includes upper and lower two-stage substrate support bases 321 and 322 for temporarily placing the liquid crystal substrate 600. The upper substrate support portion 321 is used for the liquid crystal substrate 600 before and after processing, and the lower substrate support portion 322 is used for the liquid crystal substrate 600 being processed. Similar to the case of the robot hands 115 and 116 described above, such a proper use is prevented by preventing the upper substrate support portion 321 from being contaminated by the processing liquid or the like adhering to the liquid crystal substrate 600 during the processing. This is to keep 321 always clean.
[0055]
The double-sided cleaning unit 310 is a third substrate processing unit. The double-sided cleaning unit 310 includes a rectangular box-shaped cleaning tank 311, a plurality of fixed pins 312 provided inside the cleaning tank 311 for horizontally supporting the liquid crystal substrate 600, and the liquid crystal substrate 600. Are provided with two sets of elevating pins 313 and 314 for moving up and down, and sprinklers 315 and 316 respectively arranged two above and below the substrate support position.
[0056]
The cleaning tank 311 has an opening for loading and unloading a substrate on the front surface, and the opening is opened and closed by a shutter 317. The shutter 317 is driven by a cylinder 317 a provided below the cleaning tank 311. Similar openings that are opened and closed by the shutter are also provided in the first substrate processing unit 200 and the second substrate processing unit 200 ′.
[0057]
The plurality of fixed pins 312 are attached to a frame-shaped frame 312 a that also serves as a positioning frame of the liquid crystal substrate 600 with a space therebetween. Of the two sets of front and rear lifting pins 313 and 314, the lifting pins 313 near the opening of the cleaning tank 311 are mounted symmetrically on the lifting frame 313a and are provided below the cleaning tank 311. It is driven up and down in two stages by the stage cylinder 313b. The lift pins 314 that are separated from the opening of the cleaning tank 311 are symmetrically attached to the lift frame 314 a and are driven up and down by a one-stage cylinder 314 b provided below the cleaning tank 311. The elevating pins 313 and 314 are lower than the fixed pin 312 at the lower limit, and the first stage ascending position of the elevating pin 313 and the upper limit position of the elevating pin 324 are the same and higher than the fixed pin 312. It becomes level, and the raising position (rising limit) of the second stage of the elevating pin 313 becomes higher than this.
[0058]
The upper sprinkler 315 is provided above and below the substrate support position by the above pins with a space in the front and rear direction. Each has a horizontal water supply pipe 315a extending to the left and right, and a plurality of downward nozzles 315b attached to the water supply pipe 315a at intervals, and the water supply pipe 315a is predetermined in a state where pure water is injected from the nozzle 315b. By rotating at an angle, the pure water is jetted downward over a wide range in the front-rear direction and the left-right direction. On the other hand, the lower sprinkler 316 is provided below the substrate support position by the above pins with a space in the front and rear direction. Each has a horizontal water supply pipe 316a extending to the left and right, and a plurality of upward nozzles 316b attached to the water supply pipe 316a at intervals, and the water supply pipe 316a is predetermined in a state where pure water is injected from the nozzle 316b. By rotating at an angle, the pure water is ejected over a wide range in the front-rear direction and the left-right direction.
[0059]
In the case where the liquid crystal substrate 600 is horizontally supported at a fixed position and cleaned on both sides, it is necessary to support the liquid crystal substrate 600 from below, so that there is a problem that cleaning is not performed at the support point on the back surface (lower surface). Further, there is a problem that the cleaning property is deteriorated due to poor water sweeping on the surface (upper surface). In order to solve these problems, the double-sided cleaning section 310 is provided with two sets of elevating pins 313 and 314 along with a plurality of fixed pins 312.
[0060]
That is, the liftable pins 313 are fixed at the first raised position and the liftable pins 314 are fixed at the upper limit position, and the liquid crystal substrate 600 carried into the cleaning tank 311 by the robot hand is moved to these liftable pins. It is mounted on 313,314. Then, the liquid crystal substrate 600 is transferred onto the fixed pins 312 by lowering the elevating pins 313 and 314 to the lower limit position. In this state, both surfaces of the liquid crystal substrate 600 supported on the fixed pins 312 are cleaned by spraying pure water from the water sprayers 315 and 316. After washing in this state for a predetermined time, the elevating pin 313 is raised to the second stage ascending position (upper limit) while continuing pure water injection. As a result, the liquid crystal substrate 600 is separated from the fixed pin 312 and the contact portion with the fixed pin 312 on the back surface is also cleaned. Further, when the liquid crystal substrate 600 is inclined, the pure water spraying position is changed on the front surface and the back surface, and the pure water sprayed on each surface flows along each surface. For this reason, uniform cleaning is performed on each surface. Further, the replacement of pure water is promoted particularly on the surface (upper surface). Thus, both sides of the liquid crystal substrate 600 are efficiently cleaned at a fixed position.
[0061]
Next, an etching process operation using the present wet processing apparatus will be described by focusing on one specific liquid crystal substrate 600.
[0062]
The substrate transfer unit 400 takes out the unprocessed liquid crystal substrate 600 from the stocker 700 fixed to the loader unit 500 and carries it into the buffer unit 320 of the buffer / double-sided cleaning unit 300. At this time, the liquid crystal substrate 600 is placed on the upper substrate support 321 in the buffer unit 320.
[0063]
Thereafter, the liquid crystal substrate 600 is taken out from the buffer unit 320 by the double hand robot 110 of the substrate transfer unit 100, loaded into the first substrate processing unit 200 as an etching unit, and placed on the rotor 220. At this time, in the double hand robot 110, the upper robot hand 115 is used. In the first substrate processing unit 200, the three swing arms 230, 240, 250 are all in the retracted position around the rotor 220.
[0064]
When the liquid crystal substrate 600 is placed on the rotor 220, the swing arms 230 and 240 are rotated and aligned in a direction along the diameter line of the rotation circle of the rotor 220. In this state, the etching liquid is sprayed from the spray nozzles 232... 242. Here, the spray nozzles 232... 242... Are arranged in a line in the direction along the diameter line of the rotation circle of the rotor 220, and spray the etching processing solution continuously and uniformly in that direction. Therefore, on the surface of the liquid crystal substrate 600, the etching treatment liquid is uniformly supplied in the direction along the diameter line of the rotation circle without depending on the centrifugal force due to the rotation, and the etching treatment liquid is efficiently replaced with a new liquid over the entire surface. By being replaced, an efficient etching process is performed on the entire surface.
[0065]
In addition, as described above, the rotational drive unit of the rotor 220 is isolated from the corrosive atmosphere by the seal mechanism 260 and protected from corrosion, even though a highly corrosive treatment liquid is used.
[0066]
When spraying of the etching treatment liquid from the spray nozzles 232,..., 242,. Instead, the swing arm 250 advances to a position along the radial line of the rotation circle of the rotor 220, and the gas nozzle 252 faces the rotation center portion of the liquid crystal substrate 600 from above. In this state, the rotor 220 rotates at high speed, and nitrogen gas is injected from the gas nozzle 252. Due to the high-speed rotation of the rotor 220, the processing liquid remaining on the surface of the liquid crystal substrate 600 is removed by centrifugal force. Further, the processing liquid remaining on the central portion of the liquid crystal substrate 600 where the centrifugal force does not move moves to the periphery where the centrifugal force works by the nitrogen gas purge from the gas nozzle 252 and is removed.
[0067]
When the liquid crystal substrate 600 is completely drained, the double-hand robot 110 of the substrate transfer unit 100 carries the liquid crystal substrate 600 from the first substrate processing unit 200 into the double-sided cleaning unit 310 of the buffer / double-sided cleaning unit 300. . At this time, in the double hand robot 110, the lower robot hand 116 is used. Depending on the relationship with other liquid crystal substrates 600, the liquid crystal substrate 600 is transported through the buffer unit 320 of the buffer / double-sided cleaning unit 300, and the lower substrate support 322 is used in the buffer unit 320. The
[0068]
In the double-sided cleaning unit 310, as described above, pure water is sprayed from the water sprayers 315 and 316 in a state where the liquid crystal substrate 600 is horizontally supported on the fixed pins 312, thereby roughly cleaning both sides of the liquid crystal substrate 600. Is done. Subsequently, as the elevating pins 313 are raised while continuing pure injection, the liquid crystal substrate 500 is transferred onto the elevating pins 313, and the back surface (lower surface) of the uncleaned portion (contact of the fixed pins 312) ) Is also cleaned. Further, the liquid crystal substrate 600 is tilted by operating the elevating pins 313 and 314, and pure water is jetted on both sides in this state, so that the replacement of pure water is promoted on the surface (upper surface), and there is no unevenness. Efficient rough cleaning is performed.
[0069]
When the rough cleaning of the liquid crystal substrate 600 is completed, the liquid crystal substrate 600 is transferred from the double-sided cleaning unit 310 to the second substrate processing unit 200 ′ by the double hand robot 110 of the substrate transfer unit 100. Also at this time, in the double hand robot 110, the lower robot hand 116 is used. Depending on the relationship with other liquid crystal substrates 600, the liquid crystal substrate 600 is transported through the buffer unit 320 of the buffer / double-sided cleaning unit 300, and the lower substrate support base 322 is used in the buffer unit 320. The
[0070]
In the second substrate processing unit 200 ′, after the liquid crystal substrate 600 is placed on the rotor 220, the swing arms 230 and 240 are rotated and aligned in a direction along the diameter line of the rotation circle of the rotor 220. . In this state, pure water is injected from the spray nozzles 232... While the rotor 220 rotates at a low speed. In addition, the ultrasonic oscillator 243 attached to the swing arm 240 is activated. Thereby, the surface of the liquid crystal substrate 600 is ultrasonically cleaned.
[0071]
When this is finished, the swing arms 230 and 240 return to their original positions. Instead, the swing arm 250 advances to a position along the radial line of the rotation circle of the rotor 220, and the gas nozzle 252 faces the rotation center portion of the liquid crystal substrate 600 from above. In this state, the rotor 220 rotates at high speed, and nitrogen gas is injected from the gas nozzle 252. Due to the high-speed rotation of the rotor 220, pure water remaining on the surface of the liquid crystal substrate 600 is removed by centrifugal force. Further, the pure water remaining on the central portion of the liquid crystal substrate 600 where the centrifugal force does not work moves to the periphery where the centrifugal force works by the nitrogen gas purge from the gas nozzle 252 and is removed.
[0072]
After finishing cleaning and drying in this manner, the liquid crystal substrate 600 is carried into the buffer unit 320 of the buffer / double-sided cleaning unit 300 from the second substrate processing unit 200 ′ by the double hand robot 110 of the substrate transfer unit 100. The At this time, in the double hand robot 110, the upper robot hand 115 is used. In the buffer unit 320, the liquid crystal substrate 600 is placed on the upper substrate support 321.
[0073]
Finally, the liquid crystal substrate 600 in the buffer unit 320 is transported to the loader unit 500 by the substrate transfer unit 400 and stored in the stocker 800 fixed in the loader unit 500.
[0074]
As described above, the specific liquid crystal substrate 600 is processed, but in the actual processing, the liquid crystal substrates 600 in the stocker 700 are sequentially processed and returned to the stocker 800.
[0075]
In addition, although the above process is a regular etching process, the present wet processing apparatus only performs a process that does not use the first substrate processing unit 200 that is an etching unit, for example, a finish cleaning that uses the second substrate processing unit 200 ′. It is also possible to perform.
[0076]
Although the present wet processing apparatus performs an etching process on the liquid crystal substrate 600, the resist removal process following the etching process can be similarly performed by changing the processing liquid. In addition, process changes can be easily handled by increasing / decreasing units and changing types. Further, a substrate other than the liquid crystal substrate, for example, a wafer can be processed.
[0077]
FIG. 11 is an equipment configuration diagram showing an example of use of the wet processing apparatus according to the present invention. Here, wet processing apparatuses A to D are combined with a substrate transfer robot traveling unit 900 provided with a loader 500a and an unloader 500b on both sides. Here, the buffer / double-sided cleaning unit 300 is disposed separately from the buffer unit 300 a and the double-sided cleaning unit 300. Up to now, a substrate manufacturing factory in a semiconductor manufacturer has constructed a line for each chemical solution and achieved the necessary process. However, by using different chemical solutions in the wet processing apparatuses A to D, even if the types of chemical solutions increase, 1 The necessary processes in the line are achieved.
[0078]
【The invention's effect】
  As described above, the substrate transfer unit according to the present invention arranges a plurality of hand portions that perform transfer of the substrate independently in a plurality of stages in the vertical direction, so that the substrate from the pre-processing substrate to the post-processing substrate is arranged. Even when handling, the transfer of chemicals is surely prevented, thereby realizing a wet processing apparatus with a highly efficient radial layout.In addition, the substrate transfer unit can easily and reliably shield the drive unit and isolate it from the corrosive atmosphere, despite the complicated operation necessary for realizing the radial layout.
[0079]
Further, the wet processing apparatus of the present invention realizes a radial layout using the substrate transfer unit of the present invention, and has the following advantages compared to the conventional series layout.
[0080]
The device length is short and the number of lines is greatly reduced. As a result, the apparatus floor area is reduced to, for example, 1/3 to 1/4. In other words, it is very small compared to its capacity. For this reason, it is possible to dramatically improve the processing capacity within the same floor area.
[0081]
Since the substrate is arbitrarily sent to the surrounding processing units via the central substrate transfer unit, the path of the substrate is not limited, and the upstream and downstream relationships of the process are also eliminated. Therefore, it is easy to change the processing process accompanying the specification change and to set the process desired by the user. That is, the degree of freedom for the processing process is very large.
[0082]
Even when one unit breaks down, the substrate remaining in the other unit can be discharged.
[Brief description of the drawings]
FIG. 1 is a plan view of a wet processing apparatus according to an embodiment of the present invention.
FIG. 2 is a longitudinal front view of a substrate transfer unit used in the wet processing apparatus.
FIG. 3 is a perspective view of a double hand robot used in the substrate transfer unit.
FIG. 4 is a front view of a first substrate processing unit used in the wet processing apparatus.
FIG. 5 is a plan view of the substrate processing unit.
FIG. 6 is a longitudinal sectional view of a sealing mechanism provided in the substrate processing unit.
FIG. 7 is a plan view of a second substrate processing unit used in the wet processing apparatus.
FIG. 8 is a front view of a buffer / double-sided cleaning unit used in the wet processing apparatus;
FIG. 9 is a plan view of a double-sided cleaning unit of the buffer / double-sided cleaning unit.
FIG. 10 is a side view of the double-sided cleaning unit.
FIG. 11 is a configuration diagram of equipment using a wet processing apparatus according to the present invention.
FIG. 12 is a configuration diagram of a conventional wet processing apparatus.
[Explanation of symbols]
100 Board transfer unit
110 Double-handed robot
115,116 Robot hand
120 Shield mechanism
200 First substrate processing unit
220 rotor
230, 240, 250 Swing arm
232,242 spray nozzle
252 gas nozzle
260 Shield mechanism
200 'second substrate processing unit
243 Ultrasonic oscillator
300 Buffer / double-sided cleaning unit
310 Double-sided cleaning section
312 Fixed pin
313,314 Lifting pin
315,316 Sprinkler
320 Buffer
400 Substrate transfer unit
500 Loader unit
600 LCD substrate
700,800 stocker

Claims (3)

A hand portion for a plurality of substrates exchange arranged in a plurality of stages in the vertical direction, so that the transfer of the substrate independently by the plurality of the hand unit at least a plurality of positions in the circumferential direction is performed by driving a plurality of hand unit 3D Drive means for performing at least rotational movement around the vertical line and vertical movement for the three-dimensional drive, and as a shield mechanism for the drive means, the drive means is covered and lifted together with the drive means. A movable cover that performs rotational movement, a water tank for sealing the lower end of the cover, a partition that divides the space up and down and penetrates the cover with a gap, and a space below the partition substrate transfer unit, characterized by comprising means for.   The drive means includes a rotary lift shaft that rotates around the vertical line and moves up and down in the vertical direction, and a plurality of straight drive units that are attached to the rotary lift shaft and that each drive the hand unit straight in the horizontal direction. The substrate transfer unit according to claim 1. A wet processing apparatus comprising: the substrate transfer unit according to claim 1; and a plurality of substrate processing units disposed around the substrate transfer unit.

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