WO2021248303A1 - Coating equipment and application - Google Patents

Coating equipment and application Download PDF

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Publication number
WO2021248303A1
WO2021248303A1 PCT/CN2020/095072 CN2020095072W WO2021248303A1 WO 2021248303 A1 WO2021248303 A1 WO 2021248303A1 CN 2020095072 W CN2020095072 W CN 2020095072W WO 2021248303 A1 WO2021248303 A1 WO 2021248303A1
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WO
WIPO (PCT)
Prior art keywords
reaction chamber
coating
electrode
column
coating equipment
Prior art date
Application number
PCT/CN2020/095072
Other languages
French (fr)
Chinese (zh)
Inventor
宗坚
Original Assignee
江苏菲沃泰纳米科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江苏菲沃泰纳米科技股份有限公司 filed Critical 江苏菲沃泰纳米科技股份有限公司
Priority to CN202080001813.6A priority Critical patent/CN114072539B/en
Priority to PCT/CN2020/095072 priority patent/WO2021248303A1/en
Publication of WO2021248303A1 publication Critical patent/WO2021248303A1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges

Definitions

  • the present invention relates to the field of coating, in particular to coating equipment and applications.
  • the coating can protect the surface of the material and endow the material with good physical and chemical durability.
  • Some coatings, such as polymer coatings, have certain anti-corrosion properties. They form a protective film layer on the surface of electronic components such as electronic appliances, circuit boards, etc., which can effectively protect the circuit from corrosion and damage in a corrosive environment, thereby improving The reliability of electronic components.
  • a typical coating equipment has a reaction chamber, a feed port connected to the reaction chamber, and an exhaust port.
  • the reaction gas is introduced into the feed port.
  • the reactive gas undergoes chemical vapor deposition on the surface of the workpiece to be coated under the action of the plasma to form a coating.
  • it is necessary to continuously draw a vacuum so that the exhaust gas generated by the continuous reaction of the reactive material on the surface of the workpiece can be removed from the exhaust port, so as to maintain a stable coating pressure condition.
  • the feed port of the traditional coating equipment is located at the side of the reaction chamber, and the gas extraction port is located at the middle position of the reaction chamber.
  • the flow direction of the reaction gas is from the side of the reaction chamber to the middle position.
  • the concentration gradually decreases along the gas flow direction, which is likely to cause the closer to the middle of the reaction chamber, the thinner or unqualified the coating thickness on the surface of the workpiece to be coated.
  • the coating equipment includes a support set in the reaction chamber, and a plurality of the workpieces to be coated are supported on the support.
  • the support The middle position of the reaction chamber is arranged symmetrically, and a certain avoidance space is reserved between the reaction chamber and the side wall of the reaction chamber. Since the feed port is also located on the side wall of the reaction chamber, the reaction gas needs to diffuse through the avoidance space.
  • a large amount of reactant gas gathers in the avoidance space, which easily causes the coating thickness on the surface of the workpiece to be coated to not meet the standard, and even the surface of the workpiece to be coated near the middle position is not up to the standard. The phenomenon of forming a coating.
  • a typical existing coating equipment further includes a plasma excitation field arranged in the reaction chamber, wherein the workpiece to be coated and the feed port are respectively located on both sides of the plasma excitation field, wherein the feed
  • the reaction gas is passed through the opening to generate discharge through the excitation field, and then is deposited on the surface of the workpiece to be coated on the opposite side of the excitation field to form a thin film.
  • the monomer needs to completely pass through the excitation field before it can be deposited on the surface of the workpiece to be coated.
  • the excitation field easily decomposes a large amount of monomers for a long time or excessively, destroying the monomer. The structural integrity of the body reduces the quality of the film.
  • An advantage of the present invention is to provide a coating equipment and application, wherein the reaction gas can diffuse uniformly from a position close to the middle of a reaction chamber of the coating equipment to the surroundings, thereby increasing the uniformity of the reaction gas concentration in the reaction chamber and improving The uniformity of the film layer formed on the surface of at least one workpiece to be coated.
  • Another advantage of the present invention is to provide a coating equipment and application, in which a movable support is moved in the reaction chamber to stir the reaction gas dispersed in the reaction chamber to increase the amount of gas on the substrate. The uniformity of the polymer film layer formed on the surface.
  • Another advantage of the present invention is to provide a coating equipment and its application, which can avoid problems such as poor film performance due to excessive decomposition of the reactive gas monomer during the coating process, thereby improving the quality of the coating.
  • Another advantage of the present invention is to provide a coating equipment and a coating method, wherein in some embodiments, the workpiece to be coated is adapted to be placed for introducing the reaction gas into the reaction chamber Between the feed port and an electrode device for exciting the reaction gas, thereby reducing excessive decomposition of the film forming material.
  • Another advantage of the present invention is to provide a coating equipment and coating method, in which the monomer molecular structure in the prepared coating or film is relatively complete, and the branching and crosslinking ratio in the molecular structure can be preset and adjusted. To prepare coatings or films with good performance.
  • Another advantage of the present invention is to provide a coating equipment and application, wherein the coating equipment has a simple structure, convenient use, and low cost.
  • the present invention provides a coating equipment for coating the surface of a workpiece to be coated, including:
  • reaction chamber wherein the reaction chamber has a reaction chamber and at least one feed port connected to the reaction chamber, wherein the feed port is located near the middle of the reaction chamber so as to A reaction gas is introduced into the reaction chamber, and the electrode device discharges in the reaction chamber for coating the surface of the workpiece to be coated.
  • the reaction chamber further has at least one suction port located adjacent to the inner surface of the reaction chamber.
  • it further includes at least one intake column, wherein the intake column is accommodated in the reaction chamber, wherein the intake column has an intake chamber and a plurality of outlets located on the side of the intake column.
  • the electrode device includes at least one electrode, wherein the electrode is located outside the intake column.
  • the electrode has a plurality of through holes, wherein the through holes correspond to the air outlet holes.
  • At least part of the intake column is made of conductive material, and the electrode discharges toward the intake column.
  • the electrode device further includes at least one conductive plate, wherein the conductive plate is installed on the intake column, and the electrode discharges toward the conductive plate.
  • the conductive plate has a plurality of air holes corresponding to the air outlet holes.
  • the electrode is a moving electrode, which is movably disposed in the reaction chamber relative to the reaction chamber.
  • a movable support is further included, the movable support is movably arranged in the reaction chamber relative to the reaction chamber, and the workpiece to be coated is suitable to be held in the reaction chamber.
  • the movable support moves along with the movable support, and the electrode is installed on the movable support.
  • the two feed ports are symmetrically located on the upper and lower sides of the reaction chamber, wherein the upper and lower ends of the gas inlet cavity of the gas inlet column are respectively connected to the two Inlet.
  • the diameter of the air outlet hole away from the feed port gradually increases.
  • the number of the air outlet holes away from the feed port gradually increases.
  • the suction port is located on one side of the reaction chamber.
  • it further includes at least one support, wherein the support is rotatably accommodated in the reaction chamber for supporting the workpiece to be coated to rotate in the reaction chamber.
  • bracket rotates around the intake column.
  • a plurality of the suction ports are respectively located around the reaction chamber.
  • the coating equipment further includes at least one support, wherein the support is fixedly or rotatably accommodated in the reaction chamber for supporting the workpiece to be coated.
  • the coating equipment further includes a feeding device, wherein the feeding device is connected to the feeding port for filling the reaction chamber with a reaction gas.
  • the coating equipment further includes an air extraction device, wherein the air extraction device is connected to the air extraction port for maintaining the reaction chamber in a preset negative pressure environment.
  • the electrode device is arranged at a position close to the side wall in the reaction chamber, and forms a plasma environment, so that the workpiece to be coated is suitable for being placed on the inlet column and the chamber. Between the electrode device.
  • the coating equipment further includes a support, wherein the support is installed between the electrode device and the intake column, wherein the support is a movable support, and the support It is used to support the workpiece to be coated to reciprocate in and out of the plasma environment.
  • the present invention provides a coating method including:
  • reaction chamber of a reaction chamber of a coating equipment with reaction gas along at least one feed port, wherein the feed port is located at a position close to the middle of the reaction chamber;
  • Fig. 1 is a schematic diagram of a coating equipment according to a preferred embodiment of the present invention.
  • FIG. 2A is a schematic partial cross-sectional view of an embodiment of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 2B is a schematic diagram of an alternative structure of the air inlet column of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • 3A is a schematic partial cross-sectional view of an embodiment of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • 3B is a schematic diagram of an alternative structure of the air inlet column of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 4 is a schematic plan view of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
  • FIG. 5 is a schematic plan view of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the discharge of the electrode device of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the discharge of the electrode device of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
  • Fig. 8 is a three-dimensional schematic diagram of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 9 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 10 is a schematic partial cross-sectional view of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 11 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 12 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 13 is a schematic diagram of the support of the coating equipment driving the workpiece to be coated to make a rotational movement according to a modified embodiment of the above-mentioned preferred embodiment of the present invention.
  • the term “a” should be understood as “at least one” or “one or more”, that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be more than one, and the term “one” cannot be understood as a restriction on the number.
  • FIGS. 1 to 12 a coating equipment according to a preferred embodiment of the present invention is illustrated separately.
  • Figure 1 it is a schematic diagram of an application of the coating equipment.
  • the coating equipment can be used to coat the surface of the workpiece to be coated, and prepare at least one layer of coating on the surface of the workpiece to be coated to protect the surface of the workpiece to be coated, or to impart physical or chemical properties to the surface of the workpiece to be coated Wait.
  • the coating equipment includes a reaction chamber 10 and an electrode device 20, wherein the workpiece to be coated is accommodated in the reaction chamber 10, wherein the reaction chamber 10 can be communicated with Into the reactive gas, the reactive gas includes, but is not limited to, reactive raw materials or plasma source gas used for coating.
  • the electrode device 20 is used for discharging in the reaction chamber 10, and a plasma environment can be formed in the reaction chamber 10 for coating the surface of the workpiece to be coated.
  • the reaction chamber body 10 has a reaction chamber 11, at least one feed port 12 communicating with the reaction chamber 11, and at least one suction port 13, wherein the feed port 12 is located in the reaction chamber.
  • the body 10 is close to the middle position 101, wherein the suction port 13 is located at the side position 102 of the reaction chamber 10, that is, the suction port 13 is located adjacent to the inner surface of the reaction chamber 10.
  • the feed port 12 is used to pass reaction gas into the reaction chamber 11, and the gas extraction port 13 is used to draw out the gas in the reaction chamber 11.
  • the reaction gas is introduced into the reaction chamber 11 along the feed port 12, and is discharged from the reaction chamber 11 through the gas extraction port 13.
  • the gas flow direction in the reaction chamber 11 It is from the feed port 12 to the gas extraction port 13, that is, the gas flow direction is from the middle position 101 to the side position 102 of the reaction chamber 11.
  • the position near the middle 101 of the reaction cavity 10 is defined as a position of the reaction cavity 10 within a preset radius range with the center of one side as the center of the circle.
  • the reaction cavity 10 is a cube, a cuboid, an ellipsoidal sphere or a sphere structure, etc.
  • the position near the middle 101 of the reaction cavity 10 is a preset with the center of the upper or lower side of the reaction cavity 10 being the center of the circle.
  • the feed inlet 11 is located near the center of the upper or lower side of the reaction chamber 10, preferably at the upper center or lower center of the reaction chamber 10.
  • the side position 102 of the reaction chamber 10 is defined as any position on the side of the reaction chamber 10, that is, the suction port 13 is located at any position on the side of the reaction chamber 10, This is not restricted.
  • the workpiece to be coated is contained in the reaction chamber 11, and the feed port 12 of the coating device is located at a position near the middle 101 of the reaction chamber 10, instead of the side position 102 of the reaction chamber 10,
  • the reaction gas concentration near the middle position 101 of the reaction chamber 10 is increased to prevent the situation that the coating on the surface of the workpiece to be coated near the middle position of the reaction chamber 10 is thin or unqualified.
  • the coating equipment includes at least one air inlet column 30, wherein the air inlet column 30 is accommodated in the reaction chamber 11, and the air inlet column 30 has an air inlet The cavity 31 and a plurality of air outlet holes 32 on the side thereof, wherein the feed port 12 communicates with the air inlet cavity 31.
  • the air inlet column 30 is preferably a hollow cylindrical structure to form the air inlet cavity 31, and the air outlet hole 32 communicates with the air inlet cavity 31 and the reaction cavity 11.
  • the reaction gas is introduced into the gas inlet chamber 31 from the feed port 12, and then diffuses into the reaction chamber 11 along each of the gas outlet holes 32, which facilitates the relatively uniform diffusion of the reaction gas to the reaction chamber 11 In order to improve the uniformity of the coating.
  • the air intake column 30 is a hollow or hollow cylindrical structure or a square column structure or the like.
  • the air inlet column 30 is vertically arranged at a position close to the middle of the reaction chamber 11, such as a position close to the central axis, and the end of the air inlet column 30 is just connected to the inlet 12 Through, sealed connection is optional. It is understandable that, in an optional embodiment, there is one feed port 12, and one end of the gas inlet column 30 corresponding to the feed port 12 is in communication with the feed port 12. In another optional embodiment, there are two inlets 12, which are respectively located symmetrically at the upper and lower sides of the reaction chamber 10 near the middle position 101, and the upper and lower ends of the inlet column 30 are respectively It is connected with the corresponding feed port 12 to realize simultaneous air intake on both sides, thereby improving air intake efficiency.
  • the hole diameter or the number of the air outlet holes 32 far from the feed port 12 gradually increases.
  • the diameter or number of the outlet holes 32 along the axial direction of the inlet column 30 from the inlet 12 gradually increases.
  • the unit air output of the air outlet 32 at a position far away from the inlet 12 is beneficial to promote the unit air output of the air outlet 32 at all positions on the side of the air inlet column 30 to be relatively uniform, that is, it is beneficial to promote
  • the amount of reaction gas diffused to the reaction chamber 11 by the gas inlet holes 32 at various positions in the axial direction of the gas inlet column 30 is relatively uniform, thereby improving the coating uniformity.
  • the diameter, shape, number, and arrangement of the air outlet holes 32 of the air inlet column 30 can be set according to actual coating requirements, and this is only an example.
  • FIGS. 9 and 10 there are two inlets 12, and they are connected to the two ends of the inlet column 30 respectively.
  • the number of the outlet holes 32 far from the inlet 12 gradually increases. .
  • the number of the air outlet holes 32 in the middle part of the intake column 30 is more than the number of the air outlet holes 32 at both ends.
  • the electrode device 20 includes at least one electrode 21, wherein the electrode 21 is located outside the gas inlet column 30, and the electrode 21 is used for discharging in the reaction chamber 11 .
  • the electrode 21 can discharge.
  • the electrode 21 is a cathode
  • the reaction chamber 10 may be made of a metal material to serve as an anode.
  • the reaction chamber 10 is grounded to discharge electricity in the reaction chamber 11.
  • At least part of the intake column 30 is made of conductive material, wherein the intake column 30 serves as an anode, and the electrode 21 discharges toward the intake column 30.
  • the intake column 30 is grounded, and there is a preset discharge distance between the electrode 21 and the intake column 30.
  • the electrode device 20 further includes at least one conductive plate 22 made of conductive material, wherein the conductive plate 22 is installed on the intake column 20, and the electrode 21 faces the The conductive plate 22 discharges, and there is a preset discharge distance between the electrode 21 and the conductive plate 22.
  • the electrode 21 may be supported by a bracket, or the electrode 21 may also be installed on the intake column 20.
  • the conductive plate 22 has a conductive surface, and the electrode 21 corresponds to the conductive surface and discharges. It is understandable that there may be no need to provide the conductive plate 22, and the intake column 30 made of at least part of a conductive material provides the conductive surface for the electrode 21 to discharge.
  • the electrode 21 has a plurality of through holes 211, wherein the through holes 211 correspond to the outlet holes 32 of the inlet column 30 to improve the uniformity of the reaction gas diffusion.
  • part of the reaction gas may pass through the electrode 21 along the through hole 211. It can be understood that the number, diameter, shape, and arrangement of the through holes 211 can be preset according to actual coating requirements.
  • the conductive plate 22 has a plurality of air holes 221 corresponding to the air outlet holes 32, wherein the air holes 221 allow the reaction gas to pass through, and prevent the conductive plate 22 from shielding the outlet holes.
  • the pores 32 improve the uniformity of the reaction gas diffusion.
  • the number, diameter, shape, and arrangement of the air holes 221 can be preset according to actual coating requirements.
  • the number of electrodes 21 is set to four, which are respectively arranged symmetrically around the intake column 30, and the conductive plates 22 are also set to four correspondingly, which correspond to the corresponding electrodes. 21 corresponds.
  • the electrode 21 is a moving electrode, which is movably arranged in the reaction chamber 10 relative to the reaction chamber 10 so as to be installed in the reaction chamber 11 of the coating device. Provide a relatively uniform discharge environment.
  • the coating equipment includes a movable support 40, wherein the movable support 40 is movably arranged in the reaction chamber 10 relative to the reaction chamber 10, wherein The coated workpiece is adapted to be held on the movable support 40 to move with the movable support 40, and the electrode 21 is installed on the movable support 40.
  • the electrode 21 can rotate together with the movable support 40, and a stage for supporting the workpiece to be coated rotates around its central axis when the movable support 40 rotates, so that the coating
  • the relative movement between the electrode 21 of the equipment and the workpiece to be coated is caused by the rotation of the carrier, so that the electrode 21 provides a relatively uniform discharge environment for the workpiece to be coated.
  • the workpiece to be coated in the coating equipment can move relative to the electrode 21 so that the workpiece to be coated can be located inside the opposite electrode 21 or far away from the inner area of the opposite electrode 21 during the coating process, avoiding plasma only relying on Diffusion and deposition on the surface of the workpiece to be coated leads to a slower deposition rate.
  • the electrode 21 can move. This kind of moving electrode not only makes the coating uniform, but also because some of the coating material gas can pass through the discharge area to be fully ionized, and some of the discharge area that does not pass through the electrode is incompletely ionized, so Raw materials with different ionization forms can be adjusted to obtain a richer coating structure and a more stable coating quality through the adjustment of coating parameters.
  • the relative position between the electrode 21 and the movable support 40 is fixed, and the movable support 40 of the coating equipment can not interfere with the discharge of the electrode 21.
  • the suction port 13 is located on one side of the reaction chamber 11.
  • the suction port 13 is located at any position on one side of the reaction chamber 11.
  • the coating equipment includes at least one support 50, wherein the support 50 is rotatably accommodated in the reaction chamber 11 for supporting the workpiece to be coated to rotate in the reaction chamber 11.
  • the support 50 is a support that can rotate around an axis in the reaction chamber 11, and the axis is preferably the central axis of the reaction chamber 10, thereby driving the workpiece to be coated in the reaction chamber 11 Rotation is conducive to the uniformity of the coating on the workpiece to be coated.
  • the gas flow direction in the coating chamber 11 is from the feed port 12 to the exhaust port 13, and the support 50 drives each workpiece to be coated in the reaction chamber 11 Internal rotation makes each workpiece to be coated pass through the flowing reaction gas in turn to increase the uniformity of the coating.
  • the movable bracket 40 and the bracket 50 may be the same, that is, the electrode 21 may be provided on the bracket 50.
  • the movable bracket 40 and the bracket 50 can also be installed in cooperation with each other, or separated from each other, which is not limited here.
  • the support 50 rotates around the inlet column 30 to drive the workpiece to be coated to rotate in the reaction chamber 11 around the inlet column 30.
  • the intake column 30 is located at the position of the axis.
  • the support 50 supports the workpiece to be coated around the intake column 30, and there is no need to reserve a space between the support 50 and the intake column 30, so that the reaction gas can be It diffuses directly from the intake column 30 to the space where the bracket 50 is located. Therefore, compared with the traditional coating equipment, the coating equipment of the present invention does not need to pass through the avoiding space during the coating process.
  • the air intake column 30 directly diffuses to the workpiece to be coated to ensure the quality of the coating.
  • a plurality of the gas extraction ports 13 are respectively located on different sides of the reaction chamber 11, so that a plurality of gas flow directions in different directions can be formed in the reaction chamber 11 to increase the workpieces to be coated
  • the coating uniformity For example, as shown in FIG. 12, there are four air extraction ports 13, which are respectively located around the reaction chamber 11, so that they are formed in the reaction chamber 11 from the middle of the reaction chamber 11 toward the reaction chamber 11.
  • the four gas flow directions on the four sides of the four sides to increase the uniformity of the gas in the reaction chamber 11. It is understandable that by adding a larger number of air extraction ports and arranging the positions of the air extraction ports, the flow direction and quantity of the reaction gas can be adjusted to meet the coating requirements.
  • the support 50 is fixedly or rotatably accommodated in the reaction chamber 11. That is, in the above-mentioned optional embodiment, the support 50 may be fixedly arranged in the reaction chamber 11, and the workpiece to be coated supported by the support 50 is also relatively contained in the reaction chamber 11. As the flow direction of the reaction gas in the reaction chamber 11 increases, the uniformity of the reaction gas in the reaction chamber 11 is increased, so that the reaction gas in the reaction chamber 11 flows relatively uniformly through the workpieces to be coated , Thereby increasing the uniformity of the coating. It can be understood that, in order to further improve the coating uniformity, the support 50 is rotatably accommodated in the reaction chamber 11.
  • the feed inlet 12 may be provided with more than one
  • the intake column 30 may be provided with more than one correspondingly.
  • a plurality of the air inlet columns 30 are arranged side by side in the reaction chamber 11 and are respectively communicated with the corresponding feeding ports 12.
  • there are five intake columns 30, one of the intake columns 30 is set in the middle of the reaction chamber 11, and the other four intake columns 30 are symmetrically arranged in the middle of the intake column.
  • the periphery of the air column 30 and between the middle and the side wall of the reaction chamber 11, preferably at a quarter of the position of the reaction chamber, that is, the four air inlet columns 30 on the periphery are symmetrically arranged in the middle Around the intake column 30.
  • the bracket 50 is provided in multiple, and each bracket 50 is arranged on the outer side of the corresponding air inlet column 30.
  • each bracket 50 is arranged on the outer side of the corresponding air inlet column 30.
  • each of the brackets 50 respectively rotates around the corresponding intake column 30 to improve the uniformity of the coating.
  • the bracket 50 has a hollow structure or a hollow structure to ensure the gas flow in the reaction chamber 11 and reduce the obstruction to the gas flow.
  • the number of the brackets 50 and the intake columns 30 are the same, and the brackets 50 are respectively arranged on the outer side of the corresponding intake column 30 and rotate around it, and there is a certain amount between the brackets 50 Avoid space to prevent it from affecting its rotation.
  • the workpiece to be coated is adapted to be placed in the feed port 12 for introducing the reaction gas into the reaction chamber 11 and Between the electrode devices 20 that excite the reaction gas, the excessive decomposition of the film forming material is thus reduced.
  • the gas inlet column 30 is located near the middle position 101 of the reaction chamber 11 and communicates with the feed port 12, that is, the feed port 12 is also connected to the reaction chamber 11. Near the middle position 101.
  • the electrode device 20 is disposed at a position near the side wall of the reaction chamber 11.
  • the electrode device 20 is supported at a position near the side wall of the reaction chamber 11 through an electrode holder, or the electrode device 20 can be installed on the side wall of the reaction chamber 11 and does not need to be installed on an electrode holder.
  • the workpiece to be coated is placed in the area between the electrode device 20 and the gas inlet column 30 in the reaction chamber 11.
  • the electrode device 20 generates plasma by discharging the released plasma source gas, and forms a plasma environment 201 around it.
  • the electrode 21 of the electrode device 20 is installed at a position close to the side wall of the reaction chamber 11, and the plasma environment 201 is formed at a position close to the side wall of the reaction chamber 11.
  • the position close to the side wall may be a partial area of the surrounding area close to the side wall in the reaction chamber 11, or the position close to the side wall may be a surrounding area close to the side wall in the reaction chamber 11.
  • the reaction gas is charged into the gas inlet cavity 31 of the gas inlet column 30 along the feed port 12, and diffuses into the gas inlet cavity 32 of the gas inlet column 30.
  • the reaction chamber 11 In the reaction chamber 11, and first reaches the area in the reaction chamber 11 where the workpiece to be coated is placed, only a part of the reaction gas is excited by the electrode device 20, causing the reaction gas to decompose, polymerize and deposit On the surface of the workpiece to be coated to form a coating.
  • the reaction gas may be a single molecule of monomer, oligomer, or a combination thereof, etc., for example, the oligomer may be a dipolymer or the like. In the description of the following embodiments, the reaction gas is described by taking gas monomer or monomer vapor as an example.
  • the workpiece to be coated is suitable to be placed in the flow path of the plasma environment 201 formed by the reaction gas flowing from the inlet column 30 to the electrode device 20, and the workpiece to be coated is
  • the distance between the gas inlet posts 30 is smaller than the distance between the workpiece to be coated and the electrode device 20, and not all the reaction gas is excited by the electrode device 20, so as to avoid the reaction gas during the coating process. Excessive decomposition of monomers leads to problems such as poor film performance, thereby improving the quality of the coating.
  • the support 50 is arranged between the intake column 30 and the electrode device 20, the workpiece to be coated is suitable to be supported on the support 50, and the support 50 is a movable support.
  • the support 50 can support the workpiece to be coated to reciprocate between the plasma environment 201 formed by the discharge of the electrode device 20 and the intake column 30.
  • the support 50 is a movable support, and the support 50 reciprocates between the plasma environment 201 and the intake column 30.
  • the support 50 reciprocally moves the workpiece to be coated
  • the air outlet 32 of the plasma environment 201 or the air inlet column 30 can be alternately approached.
  • the movement mode of the support 50 may be rotation, turning or translation, or the like, or in other words, the support 50 is configured as a rotatable structure, a reversible structure, or a translational structure to move the workpiece to be coated.
  • Rotation, flip or translation movement is not restricted here.
  • the support 50 is a rotatable structure, wherein the support 50 can drive the workpiece to be coated to rotate in the reaction chamber 11 around the intake column 30, and the electrode device 20 is in the reaction chamber 11
  • the plasma environment 201 is formed in one side area of the cavity 11 close to the sidewall position, and the support 50 drives the workpiece to be coated to rotatably enter and exit the plasma environment 201 alternately.
  • the support 50 reciprocally enters and exits the plasma environment 201 formed by the electrode device 20.
  • the gas monomer or monomer vapor adheres to the surface of the workpiece to be coated to form a thin layer, that is, the gas monomer or monomer vapor is Adsorbed on the surface of the workpiece to be coated.
  • the gas monomer or monomer vapor attached to the surface of the workpiece to be coated is activated by the plasma.
  • the gas monomer or monomer vapor is grafted or polymerized with the activated molecules on the surface of the workpiece to be coated, and the film grows thicker. This is repeated continuously until a film or coating with a predetermined thickness is prepared on the surface of the workpiece to be coated.
  • the difference from the prior art is that the prior art uses plasma to act on the gas monomer or monomer vapor in the space, wherein the gas monomer or monomer vapor molecules are completely exposed to the plasma. In the body, it decomposes in space and generates various polymerization products, which are then deposited on the surface of the workpiece to be coated to prepare a film or coating, resulting in low molecular integrity in the film or coating, and poor performance of the film or coating;
  • the plasma generated by the electrode device 20 only acts on the gas monomer or monomer vapor molecules adsorbed on the surface of the workpiece to be coated, and then connects with the gas monomer or monomer vapor molecules that have not been plasma-affected. Branches or polymerized growth to prepare films or coatings, and the molecular integrity is high, so the performance of the film or coating is better.
  • part of the gas monomer or monomer vapor diffuses into the plasma environment 201, decomposes and polymerizes in the plasma environment 201, and deposits on the surface of the workpiece to be coated when it moves, forming a part of the coating.
  • This part of the polymerization product has a higher degree of branching and cross-linking structure.
  • a certain degree of branching and cross-linking in the coating is beneficial to improve the polymerization efficiency and the stability of the coating.
  • the present invention can conveniently control the branching and cross-linking ratio in the coating by adjusting the moving speed and residence time of the workpiece to be coated between the air outlet 32 of the air inlet column 30 and the plasma environment 201, Obtain the best coating characteristics.
  • the movement path, movement speed, rhythm, residence time, cycle time, and movement time of the stent 50 can be preset to control the branching and cross-linking of molecules in the prepared coating. Proportion to ensure performance, suitable for preparing the required film or coating, etc.
  • the coating equipment further includes a feeding device 60, wherein the feeding device 60 is connected to the feeding port for filling the reaction chamber 11 with reaction gas.
  • the reaction gas directly comes from a gas source or is generated by the vaporization of a liquid raw material.
  • the feeding device 60 is directly connected to the coating cavity 10 and communicates with the coating cavity 11 through the feeding port 12.
  • the coating equipment further includes an air extraction device 70, wherein the air extraction device 70 is connected to the air extraction port 13, and the air extraction device 70 is used for air extraction to maintain the reaction chamber 11 at a preset negative pressure Environment, the air extraction device 70 is connected to the coating cavity 10 and communicates with the coating cavity 11 through the air extraction port 13.
  • this embodiment also provides a coating method, including:
  • the feed device 60 fills the reaction chamber 11 with reaction gas through the feed port 12, and the gas extraction device 70 continuously draws out the reaction gas through the gas extraction port 13
  • the gas in the reaction chamber 11 to ensure that the reaction chamber 11 is in a preset negative pressure environment, and the electrode device 20 discharges in the reaction chamber 11 to form a plasma environment in the reaction chamber 11 to Coating on the surface of the workpiece to be coated.
  • the gas inlet column 30 is accommodated in the reaction chamber 11, the gas inlet column 30 communicates with the feed port 12, and the gas inlet column 30 has a plurality of gas outlet holes 32, so that the reaction gas The air outlet hole 32 of the air inlet column 30 diffuses into the reaction chamber 11 to improve the uniformity of the coating film.
  • electric discharge is performed in the reaction chamber 11 through the electrode 21, wherein the electrode 11 is located outside the gas inlet column 30.
  • the electrode 21 has a plurality of through holes 211, wherein the through holes 211 correspond to the air outlet holes 32.
  • At least part of the intake column 30 is made of a conductive material, wherein the electrode 21 discharges toward the intake column 30.
  • the conductive plate 22 is installed on the intake column 30, wherein the electrode 21 discharges toward the conductive plate 22.
  • the conductive plate 22 has a plurality of air holes 221 corresponding to the air outlet holes 32.
  • the electrode 21 is a moving electrode, which is movably disposed in the reaction cavity 10 relative to the reaction cavity 10.
  • the two feed ports 12 are symmetrically located on the upper and lower sides of the reaction chamber 11, and the upper and lower sides of the gas inlet chamber 31 of the gas inlet column 30 are located symmetrically.
  • the two ends are respectively connected with the two feeding ports 12.
  • the pore size or the number of the air outlet holes 32 away from the feed port 12 gradually increases.
  • the suction port 13 is located on one side of the reaction chamber 11.
  • a plurality of the suction ports 13 are respectively located around the reaction chamber 11.
  • the support 50 is rotatably or fixedly accommodated in the reaction chamber 11.
  • the plasma environment 201 is formed by discharging the electrode device 20 at a position close to the side wall of the reaction chamber 11, wherein the workpiece to be coated is suitable to be placed in the reaction chamber 11 Between the position near the middle and the position near the side wall in the cavity 11.
  • the workpiece to be coated is moved in and out of the plasma environment 201 reciprocally.

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Abstract

The present invention provides coating equipment and an application, for use in coating the surface of a workpiece to be coated. The coating equipment comprises an electrode device and a reaction chamber. The reaction chamber has a reaction chamber body, and at least one feed port and at least one evacuation port communicating with the reaction chamber body. The feed port is located close to the middle of the reaction chamber, and the evacuation port in a side of the reaction chamber. The electrode device discharges in the reaction chamber body for coating the surface of a workpiece to be coated.

Description

镀膜设备和应用Coating equipment and applications 技术领域Technical field
本发明涉及到镀膜领域,特别涉及到镀膜设备和应用。The present invention relates to the field of coating, in particular to coating equipment and applications.
背景技术Background technique
涂层能够对于材料表面进行防护,可以赋予材料良好的物理、化学耐久性。部分涂层比如说聚合物涂层具有一定的防腐蚀性能,其在电子电器、电路板等电子元器件表面形成保护膜层,可以有效地保护电路在腐蚀环境下免遭侵蚀、破坏,从而提高电子元器件的可靠性。The coating can protect the surface of the material and endow the material with good physical and chemical durability. Some coatings, such as polymer coatings, have certain anti-corrosion properties. They form a protective film layer on the surface of electronic components such as electronic appliances, circuit boards, etc., which can effectively protect the circuit from corrosion and damage in a corrosive environment, thereby improving The reliability of electronic components.
一种典型的镀膜设备具有一反应腔、连通于该反应腔的一进料口和一抽气口,在镀膜过程中,需要将一个或多个待镀膜工件放置在该反应腔内,然后从该进料口通入反应气体。反应气体在等离子体的作用下在该待镀膜工件表面进行化学气相沉积形成涂层。在这个过程中,需要持续地抽真空以使得反应材料在工件表面不断反应产生的尾气可从抽气口被移出,从而维持稳定的镀膜压力条件。A typical coating equipment has a reaction chamber, a feed port connected to the reaction chamber, and an exhaust port. During the coating process, one or more workpieces to be coated need to be placed in the reaction chamber, and then removed from the reaction chamber. The reaction gas is introduced into the feed port. The reactive gas undergoes chemical vapor deposition on the surface of the workpiece to be coated under the action of the plasma to form a coating. In this process, it is necessary to continuously draw a vacuum so that the exhaust gas generated by the continuous reaction of the reactive material on the surface of the workpiece can be removed from the exhaust port, so as to maintain a stable coating pressure condition.
传统的镀膜设备的该进料口位于该反应腔的侧面位置,该抽气口位于反应腔的中间位置,在镀膜过程中,反应气体的流动方向为从该反应腔的侧面至中间位置,反应气体浓度沿气体流动方向逐渐降低,易造成越靠近该反应腔的中间位置,该待镀膜工件的表面的涂层厚度越薄或不合格的情况出现。进一步地,该镀膜设备包括被设置于该反应腔的一支架,多个该待镀膜工件被支撑于该支架,为满足使用的方便性,例如可旋转或可拆装的支架结构,该支架沿该反应腔的中间位置对称布置,且与该反应腔的侧壁之间预留一定的避让空间,由于该进料口也位于该反应腔的侧壁,反应气体需经该避让空间后扩散至被安装于该反应腔支架的该待镀膜工件,大量的反应气体聚集在该避让空间,易导致该待镀膜工件的表面的涂层厚度不达标,甚至靠近中间位置的该待镀膜工件的表面未形成涂层的现象。The feed port of the traditional coating equipment is located at the side of the reaction chamber, and the gas extraction port is located at the middle position of the reaction chamber. During the coating process, the flow direction of the reaction gas is from the side of the reaction chamber to the middle position. The concentration gradually decreases along the gas flow direction, which is likely to cause the closer to the middle of the reaction chamber, the thinner or unqualified the coating thickness on the surface of the workpiece to be coated. Further, the coating equipment includes a support set in the reaction chamber, and a plurality of the workpieces to be coated are supported on the support. In order to meet the convenience of use, for example, a rotatable or detachable support structure, the support The middle position of the reaction chamber is arranged symmetrically, and a certain avoidance space is reserved between the reaction chamber and the side wall of the reaction chamber. Since the feed port is also located on the side wall of the reaction chamber, the reaction gas needs to diffuse through the avoidance space. For the workpiece to be coated installed on the reaction chamber support, a large amount of reactant gas gathers in the avoidance space, which easily causes the coating thickness on the surface of the workpiece to be coated to not meet the standard, and even the surface of the workpiece to be coated near the middle position is not up to the standard. The phenomenon of forming a coating.
另外,现有的一种典型的镀膜设备还包括设置在该反应腔内的一等离子体激发场,其中该待镀膜工件与该进料口分别位于该等离子体激发场的两侧,其中进料口通入反应气体经过该激发场发生放电,然后沉积于该激发场相反侧的该待镀 膜工件的表面,以形成薄膜。由此可见,单体需完全穿过该激发场后才能够沉积于该待镀膜工件的表面,而在穿过过程中,该激发场易使大量的单体长时间或过度分解,破坏了单体的结构完整性,降低薄膜质量。In addition, a typical existing coating equipment further includes a plasma excitation field arranged in the reaction chamber, wherein the workpiece to be coated and the feed port are respectively located on both sides of the plasma excitation field, wherein the feed The reaction gas is passed through the opening to generate discharge through the excitation field, and then is deposited on the surface of the workpiece to be coated on the opposite side of the excitation field to form a thin film. It can be seen that the monomer needs to completely pass through the excitation field before it can be deposited on the surface of the workpiece to be coated. During the passage, the excitation field easily decomposes a large amount of monomers for a long time or excessively, destroying the monomer. The structural integrity of the body reduces the quality of the film.
发明内容Summary of the invention
本发明的一优势在于提供一镀膜设备和应用,其中反应气体能够自所述镀膜设备的一反应腔的靠近中间位置向周围均匀扩散,增加所述反应腔内的反应气体浓度的均一性,提高在至少一待镀膜工件的表面形成的膜层的均一性。An advantage of the present invention is to provide a coating equipment and application, wherein the reaction gas can diffuse uniformly from a position close to the middle of a reaction chamber of the coating equipment to the surroundings, thereby increasing the uniformity of the reaction gas concentration in the reaction chamber and improving The uniformity of the film layer formed on the surface of at least one workpiece to be coated.
本发明的另一优势在于提供一镀膜设备和应用,其中通过一可运动支架在所述反应腔内移动,以起到搅拌分散到所述反应腔中的反应气体,以增加在所述基材表面上形成的聚合物膜层的均匀性。Another advantage of the present invention is to provide a coating equipment and application, in which a movable support is moved in the reaction chamber to stir the reaction gas dispersed in the reaction chamber to increase the amount of gas on the substrate. The uniformity of the polymer film layer formed on the surface.
本发明的另一优势在于提供一种镀膜设备及其应用,其能够避免镀膜过程中因反应气体单体的过度分解而导致薄膜性能不良等问题,从而提高镀膜质量。Another advantage of the present invention is to provide a coating equipment and its application, which can avoid problems such as poor film performance due to excessive decomposition of the reactive gas monomer during the coating process, thereby improving the quality of the coating.
本发明的另一个优势在于提供一种镀膜设备及镀膜方法,其中在一些实施例中,待镀膜的所述待镀膜工件被适于放置于用于将所述反应气体引入到所述反应腔中的所述进料口和用于激发所述反应气体的一电极装置之间,因此减少了膜层形成材料的过度分解。Another advantage of the present invention is to provide a coating equipment and a coating method, wherein in some embodiments, the workpiece to be coated is adapted to be placed for introducing the reaction gas into the reaction chamber Between the feed port and an electrode device for exciting the reaction gas, thereby reducing excessive decomposition of the film forming material.
本发明的另一个优势在于提供一种镀膜设备及其镀膜方法,其中所制备的涂层或薄膜中的单体分子结构较为完整,且分子结构中的分支和交联比例能够被预设调整,以制备性能良好的涂层或薄膜。Another advantage of the present invention is to provide a coating equipment and coating method, in which the monomer molecular structure in the prepared coating or film is relatively complete, and the branching and crosslinking ratio in the molecular structure can be preset and adjusted. To prepare coatings or films with good performance.
本发明的另一优势在于提供一镀膜设备和应用,其中所述镀膜设备结构简单,使用方便,成本较低。Another advantage of the present invention is to provide a coating equipment and application, wherein the coating equipment has a simple structure, convenient use, and low cost.
根据本发明的一方面,本发明提供一镀膜设备,以供在待镀膜工件的表面镀膜,包括:According to one aspect of the present invention, the present invention provides a coating equipment for coating the surface of a workpiece to be coated, including:
一电极装置;和An electrode device; and
一反应腔体,其中所述反应腔体具有一反应腔、连通于所述反应腔的至少一进料口,其中所述进料口位于所述反应腔体的靠近中间位置,以向所述反应腔内通入反应气体,其中所述电极装置在所述反应腔内放电,以供在该待镀膜工件的表面镀膜。A reaction chamber, wherein the reaction chamber has a reaction chamber and at least one feed port connected to the reaction chamber, wherein the feed port is located near the middle of the reaction chamber so as to A reaction gas is introduced into the reaction chamber, and the electrode device discharges in the reaction chamber for coating the surface of the workpiece to be coated.
在本发明的一些实施例中,所述反应腔体还具有至少一抽气口,其位于邻近 所述反应腔体的内表面的位置。In some embodiments of the present invention, the reaction chamber further has at least one suction port located adjacent to the inner surface of the reaction chamber.
在本发明的一些实施例中,进一步包括至少一进气柱,其中所述进气柱被容纳于所述反应腔,其中所述进气柱具有一进气腔和多个位于其侧面的出气孔,其中所述进料口连通所述进气腔。In some embodiments of the present invention, it further includes at least one intake column, wherein the intake column is accommodated in the reaction chamber, wherein the intake column has an intake chamber and a plurality of outlets located on the side of the intake column. The air hole, wherein the feed port communicates with the air inlet cavity.
在本发明的一些实施例中,所述电极装置包括至少一电极,其中所述电极位于所述进气柱的外侧。In some embodiments of the present invention, the electrode device includes at least one electrode, wherein the electrode is located outside the intake column.
在本发明的一些实施例中,所述电极具有多个通孔,其中所述通孔对应于所述出气孔。In some embodiments of the present invention, the electrode has a plurality of through holes, wherein the through holes correspond to the air outlet holes.
在本发明的一些实施例中,至少部分所述进气柱由导电材料制成,其中所述电极朝向所述进气柱放电。In some embodiments of the present invention, at least part of the intake column is made of conductive material, and the electrode discharges toward the intake column.
在本发明的一些实施例中,所述电极装置进一步包括至少一导电板,其中所述导电板被安装于所述进气柱,其中所述电极朝向所述导电板放电。In some embodiments of the present invention, the electrode device further includes at least one conductive plate, wherein the conductive plate is installed on the intake column, and the electrode discharges toward the conductive plate.
在本发明的一些实施例中,所述导电板具有多个对应于所述出气孔的气孔。In some embodiments of the present invention, the conductive plate has a plurality of air holes corresponding to the air outlet holes.
在本发明的一些实施例中,所述电极是运动电极,其相对于所述反应腔体可运动地设置在所述反应腔体内。In some embodiments of the present invention, the electrode is a moving electrode, which is movably disposed in the reaction chamber relative to the reaction chamber.
在本发明的一些实施例中,进一步包括一可运动支架,所述可运动支架相对于所述反应腔体可运动地设置在所述反应腔体内,其中该待镀膜工件适于被保持于所述可运动支架随着所述可运动支架运动,所述电极被安装于所述可运动支架。In some embodiments of the present invention, a movable support is further included, the movable support is movably arranged in the reaction chamber relative to the reaction chamber, and the workpiece to be coated is suitable to be held in the reaction chamber. The movable support moves along with the movable support, and the electrode is installed on the movable support.
在本发明的一些实施例中,两个所述进料口对称地位于所述反应腔的上下两侧,其中所述进气柱的所述进气腔的上下两端分别连通两个所述进料口。In some embodiments of the present invention, the two feed ports are symmetrically located on the upper and lower sides of the reaction chamber, wherein the upper and lower ends of the gas inlet cavity of the gas inlet column are respectively connected to the two Inlet.
在本发明的一些实施例中,远离所述进料口的所述出气孔的孔径逐渐增大。In some embodiments of the present invention, the diameter of the air outlet hole away from the feed port gradually increases.
在本发明的一些实施例中,远离所述进料口的所述出气孔的数量逐渐增多。In some embodiments of the present invention, the number of the air outlet holes away from the feed port gradually increases.
在本发明的一些实施例中,其中所述抽气口位于所述反应腔的其中一侧。In some embodiments of the present invention, the suction port is located on one side of the reaction chamber.
在本发明的一些实施例中,进一步包括至少一支架,其中所述支架被可旋转地容纳于所述反应腔,以供支撑该待镀膜工件在所述反应腔内旋转。In some embodiments of the present invention, it further includes at least one support, wherein the support is rotatably accommodated in the reaction chamber for supporting the workpiece to be coated to rotate in the reaction chamber.
在本发明的一些实施例中,其中所述支架绕所述进气柱旋转。In some embodiments of the present invention, wherein the bracket rotates around the intake column.
在本发明的一些实施例中,其中多个所述抽气口分别位于所述反应腔的四周。In some embodiments of the present invention, a plurality of the suction ports are respectively located around the reaction chamber.
在本发明的一些实施例中,所述镀膜设备进一步包括至少一支架,其中所述支架被固定地或可旋转地容纳于所述反应腔,以供支撑该待镀膜工件。In some embodiments of the present invention, the coating equipment further includes at least one support, wherein the support is fixedly or rotatably accommodated in the reaction chamber for supporting the workpiece to be coated.
在本发明的一些实施例中,所述镀膜设备进一步包括进料装置,其中所述进 料装置连通所述进料口,以供向所述反应腔内充入反应气体。In some embodiments of the present invention, the coating equipment further includes a feeding device, wherein the feeding device is connected to the feeding port for filling the reaction chamber with a reaction gas.
在本发明的一些实施例中,所述镀膜设备进一步包括抽气装置,其中所述抽气装置连通所述抽气口,以供维持所述反应腔处于预设的负压环境。In some embodiments of the present invention, the coating equipment further includes an air extraction device, wherein the air extraction device is connected to the air extraction port for maintaining the reaction chamber in a preset negative pressure environment.
在本发明的一些实施例中,所述电极装置被设置于所述反应腔内的靠近侧壁位置,并形成等离子体环境,以供待镀膜工件适于被放置于所述进气柱和所述电极装置之间。In some embodiments of the present invention, the electrode device is arranged at a position close to the side wall in the reaction chamber, and forms a plasma environment, so that the workpiece to be coated is suitable for being placed on the inlet column and the chamber. Between the electrode device.
在本发明的一些实施例中,所述镀膜设备进一步包括一支架,其中所述支架被安装于所述电极装置与所述进气柱之间,其中所述支架为可运动支架,所述支架用于支撑待镀膜工件往复地进出所述等离子体环境。In some embodiments of the present invention, the coating equipment further includes a support, wherein the support is installed between the electrode device and the intake column, wherein the support is a movable support, and the support It is used to support the workpiece to be coated to reciprocate in and out of the plasma environment.
根据本发明的另一方面,本发明提供一镀膜方法,包括:According to another aspect of the present invention, the present invention provides a coating method including:
沿至少一进料口向一镀膜设备的一反应腔体的反应腔充入反应气体,其中所述进料口位于所述反应腔体的靠近中间位置;Fill a reaction chamber of a reaction chamber of a coating equipment with reaction gas along at least one feed port, wherein the feed port is located at a position close to the middle of the reaction chamber;
从位于所述反应腔的侧面位置的至少一抽气口抽出所述反应腔内的气体,以维持所述反应腔处于预设的负压环境;以及Extract the gas in the reaction chamber from at least one air extraction port located on the side of the reaction chamber, so as to maintain the reaction chamber in a preset negative pressure environment; and
在所述反应腔内放电。Discharge in the reaction chamber.
附图说明Description of the drawings
图1是根据本发明的一较佳实施例的镀膜设备的示意图。Fig. 1 is a schematic diagram of a coating equipment according to a preferred embodiment of the present invention.
图2A是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的部分剖面示意图。2A is a schematic partial cross-sectional view of an embodiment of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图2B是根据本发明的上述较佳实施例的镀膜设备的进气柱的一种可选结构的示意图。2B is a schematic diagram of an alternative structure of the air inlet column of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图3A是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的部分剖面示意图。3A is a schematic partial cross-sectional view of an embodiment of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图3B是根据本发明的上述较佳实施例的镀膜设备的进气柱的一种可选结构的示意图。3B is a schematic diagram of an alternative structure of the air inlet column of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图4是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的平面示意图。4 is a schematic plan view of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
图5是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的平面示意图。5 is a schematic plan view of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
图6是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的电极装置的放电示意图。FIG. 6 is a schematic diagram of the discharge of the electrode device of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
图7是根据本发明的上述较佳实施例的镀膜设备的一种实施方式的电极装置的放电示意图。FIG. 7 is a schematic diagram of the discharge of the electrode device of an embodiment of the coating equipment according to the above preferred embodiment of the present invention.
图8是根据本发明的上述较佳实施例的镀膜设备的立体示意图。Fig. 8 is a three-dimensional schematic diagram of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图9是根据本发明的上述较佳实施例的镀膜设备的一种变形结构的示意图。FIG. 9 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图10是根据本发明的上述较佳实施例的镀膜设备的一种变形结构的部分剖面示意图。FIG. 10 is a schematic partial cross-sectional view of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图11是根据本发明的上述较佳实施例的镀膜设备的一种变形结构的示意图。FIG. 11 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图12是根据本发明的上述较佳实施例的镀膜设备的一种变形结构的示意图。FIG. 12 is a schematic diagram of a modified structure of the coating equipment according to the above-mentioned preferred embodiment of the present invention.
图13是根据本发明的上述较佳实施例的一种变形实施例的镀膜设备的支架带动待镀膜工件做旋转运动的示意图。FIG. 13 is a schematic diagram of the support of the coating equipment driving the workpiece to be coated to make a rotational movement according to a modified embodiment of the above-mentioned preferred embodiment of the present invention.
具体实施方式detailed description
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention And to simplify the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so the above terms should not be understood as limiting the present invention.
可以理解的是,术语“一”应理解为“至少一”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可以为多个,术语“一”不能理解为对数量的限制。It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be more than one, and the term "one" cannot be understood as a restriction on the number.
参考附图1至图12所示,是根据本发明的一较佳实施例的一镀膜设备被分别阐明。参考附图1,是所述镀膜设备的一应用示意图。Referring to FIGS. 1 to 12, a coating equipment according to a preferred embodiment of the present invention is illustrated separately. Referring to Figure 1, it is a schematic diagram of an application of the coating equipment.
所述镀膜设备可用于在待镀膜工件的表面进行镀膜,在待镀膜工件的表面制 备至少一层涂层,以对待镀膜工件的表面起到保护作用,或赋予待镀膜工件的表面物理或化学性能等。The coating equipment can be used to coat the surface of the workpiece to be coated, and prepare at least one layer of coating on the surface of the workpiece to be coated to protect the surface of the workpiece to be coated, or to impart physical or chemical properties to the surface of the workpiece to be coated Wait.
如图1和图4所示,所述镀膜设备包括一反应腔体10和一电极装置20,其中待镀膜工件被容置于所述反应腔体10,其中所述反应腔体10可被通入反应气体,所述反应气体包括但不限于用于镀膜的反应原料或等离子体源气体等。所述电极装置20用于在所述反应腔体10内进行放电,可在所述反应腔体10内形成等离子体环境,以供在待镀膜工件的表面镀膜。As shown in Figures 1 and 4, the coating equipment includes a reaction chamber 10 and an electrode device 20, wherein the workpiece to be coated is accommodated in the reaction chamber 10, wherein the reaction chamber 10 can be communicated with Into the reactive gas, the reactive gas includes, but is not limited to, reactive raw materials or plasma source gas used for coating. The electrode device 20 is used for discharging in the reaction chamber 10, and a plasma environment can be formed in the reaction chamber 10 for coating the surface of the workpiece to be coated.
如图1所示,所述反应腔体10具有一反应腔11、连通所述反应腔11的至少一进料口12和至少一抽气口13,其中所述进料口12位于所述反应腔体10的靠近中间位置101,其中所述抽气口13位于所述反应腔体10的侧面位置102,即所述抽气口13位于邻近所述反应腔体10的内表面的位置。所述进料口12用于向所述反应腔11内通入反应气体,所述抽气口13用于抽出所述反应腔11内的气体。As shown in FIG. 1, the reaction chamber body 10 has a reaction chamber 11, at least one feed port 12 communicating with the reaction chamber 11, and at least one suction port 13, wherein the feed port 12 is located in the reaction chamber. The body 10 is close to the middle position 101, wherein the suction port 13 is located at the side position 102 of the reaction chamber 10, that is, the suction port 13 is located adjacent to the inner surface of the reaction chamber 10. The feed port 12 is used to pass reaction gas into the reaction chamber 11, and the gas extraction port 13 is used to draw out the gas in the reaction chamber 11.
也就是说,在镀膜过程中,反应气体沿所述进料口12通入所述反应腔11,从所述抽气口13排出所述反应腔11,在所述反应腔11内气体的流动方向为自所述进料口12至所述抽气口13,即气体的流动方向为自所述反应腔11的靠近中间位置101至侧面位置102。That is to say, during the coating process, the reaction gas is introduced into the reaction chamber 11 along the feed port 12, and is discharged from the reaction chamber 11 through the gas extraction port 13. The gas flow direction in the reaction chamber 11 It is from the feed port 12 to the gas extraction port 13, that is, the gas flow direction is from the middle position 101 to the side position 102 of the reaction chamber 11.
在本实施例中,所述反应腔体10的靠近中间位置101被定义为所述反应腔体10的以一侧中心为圆心的预设半径范围的位置。优选地,所述反应腔体10为正方体、长方体、椭圆球体或球体结构等,所述反应腔体10的靠近中间位置101为所述反应腔体10的以上侧或下侧中心为圆心的预设半径范围的位置。也就是说,所述进料口11位于所述反应腔体10的上侧或下侧的靠近中心的位置,优选地位于所述反应腔体10的上侧中心或下侧中心位置。所述反应腔体10的侧面位置102被定义为所述反应腔体10的侧面的任一位置,也就是说,所述抽气口13位于所述反应腔体10的侧面的任一位置,在此不受限制。In this embodiment, the position near the middle 101 of the reaction cavity 10 is defined as a position of the reaction cavity 10 within a preset radius range with the center of one side as the center of the circle. Preferably, the reaction cavity 10 is a cube, a cuboid, an ellipsoidal sphere or a sphere structure, etc., and the position near the middle 101 of the reaction cavity 10 is a preset with the center of the upper or lower side of the reaction cavity 10 being the center of the circle. Set the position of the radius range. In other words, the feed inlet 11 is located near the center of the upper or lower side of the reaction chamber 10, preferably at the upper center or lower center of the reaction chamber 10. The side position 102 of the reaction chamber 10 is defined as any position on the side of the reaction chamber 10, that is, the suction port 13 is located at any position on the side of the reaction chamber 10, This is not restricted.
待镀膜工件被容置于所述反应腔11内,所述镀膜设备的所述进料口12位于所述反应腔10的靠近中间位置101,而非所述反应腔10的侧面位置102,以提高位于所述反应腔10的靠近中间位置101的反应气体浓度,防止靠近所述反应腔10的中间位置的待镀膜工件的表面的涂层较薄或不合格的情况出现。The workpiece to be coated is contained in the reaction chamber 11, and the feed port 12 of the coating device is located at a position near the middle 101 of the reaction chamber 10, instead of the side position 102 of the reaction chamber 10, The reaction gas concentration near the middle position 101 of the reaction chamber 10 is increased to prevent the situation that the coating on the surface of the workpiece to be coated near the middle position of the reaction chamber 10 is thin or unqualified.
如图2A、2B所示,进一步地,所述镀膜设备包括至少一进气柱30,其中所 述进气柱30被容纳于所述反应腔11,其中所述进气柱30具有一进气腔31和多个位于其侧面的出气孔32,其中所述进料口12连通所述进气腔31。所述进气柱30优选为中空的柱形结构,以形成所述进气腔31,所述出气孔32连通所述进气腔31和所述反应腔11。反应气体由所述进料口12通入所述进气腔31,然后沿各所述出气孔32扩散至所述反应腔11内,有利于促使反应气体相对均匀地扩散至所述反应腔11内,以提高镀膜均匀性。优选地,所述进气柱30为镂空或中空的圆柱形结构或方柱形结构等。As shown in FIGS. 2A and 2B, further, the coating equipment includes at least one air inlet column 30, wherein the air inlet column 30 is accommodated in the reaction chamber 11, and the air inlet column 30 has an air inlet The cavity 31 and a plurality of air outlet holes 32 on the side thereof, wherein the feed port 12 communicates with the air inlet cavity 31. The air inlet column 30 is preferably a hollow cylindrical structure to form the air inlet cavity 31, and the air outlet hole 32 communicates with the air inlet cavity 31 and the reaction cavity 11. The reaction gas is introduced into the gas inlet chamber 31 from the feed port 12, and then diffuses into the reaction chamber 11 along each of the gas outlet holes 32, which facilitates the relatively uniform diffusion of the reaction gas to the reaction chamber 11 In order to improve the uniformity of the coating. Preferably, the air intake column 30 is a hollow or hollow cylindrical structure or a square column structure or the like.
在本实施例中,所述进气柱30竖直设置于所述反应腔11的靠近中间位置如靠近中心轴位置,且所述进气柱30的端部与所述进料口12恰好相连通,可选为密封连通。可以理解的是,在一可选实施例中,所述进料口12为一个,其中所述进气柱30的对应所述进料口12的一端与所述进料口12相连通。在另一可选实施例中,所述进料口12为两个,分别对称地位于所述反应腔体10的上下两侧的靠近中间位置101,所述进气柱30的上下两端分别与对应的所述进料口12相连通,可实现两侧同时进气,提高进气效率。In this embodiment, the air inlet column 30 is vertically arranged at a position close to the middle of the reaction chamber 11, such as a position close to the central axis, and the end of the air inlet column 30 is just connected to the inlet 12 Through, sealed connection is optional. It is understandable that, in an optional embodiment, there is one feed port 12, and one end of the gas inlet column 30 corresponding to the feed port 12 is in communication with the feed port 12. In another optional embodiment, there are two inlets 12, which are respectively located symmetrically at the upper and lower sides of the reaction chamber 10 near the middle position 101, and the upper and lower ends of the inlet column 30 are respectively It is connected with the corresponding feed port 12 to realize simultaneous air intake on both sides, thereby improving air intake efficiency.
可选地,如图2A、2B、3A以及3B所示,远离所述进料口12的所述出气孔32的孔径逐渐增大或数量逐渐增多。换句话说,自所述进料口12沿所述进气柱30的轴向方向的所述出气孔32的孔径逐渐增大或数量逐渐增多。反应气体从所述进料口12进入所述进气腔31后,并沿所述进气腔31轴向扩散的方向上,所述出气孔32的孔径逐渐增大或数量逐渐增多,以提高远离所述进料口12的位置的所述出气孔32的单位出气量,有利于促使所述进气柱30的侧面所有位置的出气孔32的单位出气量相对均匀,即有利于促使沿所述进气柱30的轴向方向上的各个位置的所述进气孔32扩散至所述反应腔11的反应气体量相对均匀,从而提高镀膜均匀性。熟知本领域的技术人员可知,所述进气柱30的所述出气孔32的孔径、形状、数量以及排布均可以根据实际镀膜需求而做出相应的设置,在此仅作举例。Optionally, as shown in FIGS. 2A, 2B, 3A, and 3B, the hole diameter or the number of the air outlet holes 32 far from the feed port 12 gradually increases. In other words, the diameter or number of the outlet holes 32 along the axial direction of the inlet column 30 from the inlet 12 gradually increases. After the reaction gas enters the gas inlet cavity 31 from the feed port 12 and diffuses along the axial direction of the gas inlet cavity 31, the diameter or number of the outlet holes 32 gradually increases to increase The unit air output of the air outlet 32 at a position far away from the inlet 12 is beneficial to promote the unit air output of the air outlet 32 at all positions on the side of the air inlet column 30 to be relatively uniform, that is, it is beneficial to promote The amount of reaction gas diffused to the reaction chamber 11 by the gas inlet holes 32 at various positions in the axial direction of the gas inlet column 30 is relatively uniform, thereby improving the coating uniformity. Those skilled in the art can know that the diameter, shape, number, and arrangement of the air outlet holes 32 of the air inlet column 30 can be set according to actual coating requirements, and this is only an example.
如图9和图10所示,所述进料口12为两个,且分别连通所述进气柱30的两端,其中远离所述进料口12的所述出气孔32的数量逐渐增多。也就是说,所述进气柱30的中间部分的所述出气孔32的数量多于两端的所述出气孔32的数量。As shown in FIGS. 9 and 10, there are two inlets 12, and they are connected to the two ends of the inlet column 30 respectively. The number of the outlet holes 32 far from the inlet 12 gradually increases. . In other words, the number of the air outlet holes 32 in the middle part of the intake column 30 is more than the number of the air outlet holes 32 at both ends.
如图4至图7所示,所述电极装置20包括至少一电极21,其中所述电极21 位于所述进气柱30的外侧,其中所述电极21用于在所述反应腔11内放电。换句话说,所述电极21能够放电。比如说,所述电极21为阴极,所述反应腔体10可以由金属材料制成,以作为阳极,例如所述反应腔体10接地,从而在所述反应腔11内放电。As shown in FIGS. 4 to 7, the electrode device 20 includes at least one electrode 21, wherein the electrode 21 is located outside the gas inlet column 30, and the electrode 21 is used for discharging in the reaction chamber 11 . In other words, the electrode 21 can discharge. For example, the electrode 21 is a cathode, and the reaction chamber 10 may be made of a metal material to serve as an anode. For example, the reaction chamber 10 is grounded to discharge electricity in the reaction chamber 11.
在本实施例中,至少部分所述进气柱30由导电材料制成,其中所述进气柱30作为阳极,所述电极21朝向所述进气柱30放电。优选地,所述进气柱30接地,所述电极21与所述进气柱30之间具有预设的放电间距。In this embodiment, at least part of the intake column 30 is made of conductive material, wherein the intake column 30 serves as an anode, and the electrode 21 discharges toward the intake column 30. Preferably, the intake column 30 is grounded, and there is a preset discharge distance between the electrode 21 and the intake column 30.
在一可选实施例中,所述电极装置20进一步包括至少一导电板22,由导电材料制成,其中所述导电板22被安装于所述进气柱20,其中所述电极21朝向所述导电板22放电,所述电极21与所述导电板22之间具有预设的放电间距。所述电极21可以由支架支撑,或者所述电极21也被安装于所述进气柱20。In an optional embodiment, the electrode device 20 further includes at least one conductive plate 22 made of conductive material, wherein the conductive plate 22 is installed on the intake column 20, and the electrode 21 faces the The conductive plate 22 discharges, and there is a preset discharge distance between the electrode 21 and the conductive plate 22. The electrode 21 may be supported by a bracket, or the electrode 21 may also be installed on the intake column 20.
值得一提的是,所述导电板22具有一导电面,其中所述电极21对应于所述导电面并进行放电。可以理解的是,可以无需设置所述导电板22,由至少部分导电材料制成的所述进气柱30提供所述导电面,以供所述电极21进行放电。It is worth mentioning that the conductive plate 22 has a conductive surface, and the electrode 21 corresponds to the conductive surface and discharges. It is understandable that there may be no need to provide the conductive plate 22, and the intake column 30 made of at least part of a conductive material provides the conductive surface for the electrode 21 to discharge.
优选地,如图6所示,所述电极21具有多个通孔211,其中所述通孔211对应于所述进气柱30的所述出气孔32,以提高反应气体扩散的均匀性,以提高镀膜均匀性。也就是说,部分的反应气体可以沿所述通孔211穿过所述电极21。可以理解的是,所述通孔211的数量、孔径、形状以及排布均可以根据实际镀膜需求而预设。Preferably, as shown in FIG. 6, the electrode 21 has a plurality of through holes 211, wherein the through holes 211 correspond to the outlet holes 32 of the inlet column 30 to improve the uniformity of the reaction gas diffusion. To improve the uniformity of the coating. In other words, part of the reaction gas may pass through the electrode 21 along the through hole 211. It can be understood that the number, diameter, shape, and arrangement of the through holes 211 can be preset according to actual coating requirements.
进一步地,如图7所示,所述导电板22具有多个对应于所述出气孔32的气孔221,其中所述气孔221允许反应气体穿过,避免了所述导电板22遮蔽所述出气孔32,从而提高反应气体扩散的均匀性。当然,所述气孔221的数量、孔径、形状以及排布均可以根据实际镀膜需求而预设。Further, as shown in FIG. 7, the conductive plate 22 has a plurality of air holes 221 corresponding to the air outlet holes 32, wherein the air holes 221 allow the reaction gas to pass through, and prevent the conductive plate 22 from shielding the outlet holes. The pores 32 improve the uniformity of the reaction gas diffusion. Of course, the number, diameter, shape, and arrangement of the air holes 221 can be preset according to actual coating requirements.
在本实施例中,所述电极21被设置为四个,分别对称地布置在所述进气柱30的四周,所述导电板22也相应地设置为四个,分别与相应的所述电极21对应。In this embodiment, the number of electrodes 21 is set to four, which are respectively arranged symmetrically around the intake column 30, and the conductive plates 22 are also set to four correspondingly, which correspond to the corresponding electrodes. 21 corresponds.
在一可选实施例中,所述电极21是运动电极,其相对于所述反应腔体10可运动地设置在所述反应腔体10内,以在所述镀膜设备的所述反应腔11内提供相对均匀的放电环境。In an optional embodiment, the electrode 21 is a moving electrode, which is movably arranged in the reaction chamber 10 relative to the reaction chamber 10 so as to be installed in the reaction chamber 11 of the coating device. Provide a relatively uniform discharge environment.
进一步地,如图4所示,所述镀膜设备包括一可运动支架40,其中所述可运 动支架40相对于所述反应腔体10可运动地设置在所述反应腔体10内,其中待镀膜工件适于被保持于所述可运动支架40随着所述可运动支架40运动,所述电极21被安装于所述可运动支架40。例如,所述电极21能够随着所述可运动支架40一同转动,并且用于承载待镀膜工件的一载台在随着所述可运动支架40转动时还绕其中轴自转,从而所述镀膜设备的所述电极21与待镀膜工件之间产生的相对移动由所述载台自转引起,从而使所述电极21对这些待镀膜工件提供相对均匀的放电环境。Further, as shown in FIG. 4, the coating equipment includes a movable support 40, wherein the movable support 40 is movably arranged in the reaction chamber 10 relative to the reaction chamber 10, wherein The coated workpiece is adapted to be held on the movable support 40 to move with the movable support 40, and the electrode 21 is installed on the movable support 40. For example, the electrode 21 can rotate together with the movable support 40, and a stage for supporting the workpiece to be coated rotates around its central axis when the movable support 40 rotates, so that the coating The relative movement between the electrode 21 of the equipment and the workpiece to be coated is caused by the rotation of the carrier, so that the electrode 21 provides a relatively uniform discharge environment for the workpiece to be coated.
所述镀膜设备中的待镀膜工件可通过和所述电极21的相对运动使得待镀膜工件在镀膜过程中既可以处于相对的电极21内部又可以远离相对的电极21内部区域,避免等离子体仅依靠扩散而沉积在待镀膜工件表面导致沉积速度较慢。The workpiece to be coated in the coating equipment can move relative to the electrode 21 so that the workpiece to be coated can be located inside the opposite electrode 21 or far away from the inner area of the opposite electrode 21 during the coating process, avoiding plasma only relying on Diffusion and deposition on the surface of the workpiece to be coated leads to a slower deposition rate.
所述电极21能够运动,这种运动电极不仅可使镀膜均匀,而且由于镀膜原料气体有的能够穿过放电区被充分电离,有的未穿过所述电极的放电区被不完全电离,这样不同电离形态的原料可以通过镀膜参数的调节得到更加丰富的镀膜结构和更稳定的镀膜质量。The electrode 21 can move. This kind of moving electrode not only makes the coating uniform, but also because some of the coating material gas can pass through the discharge area to be fully ionized, and some of the discharge area that does not pass through the electrode is incompletely ionized, so Raw materials with different ionization forms can be adjusted to obtain a richer coating structure and a more stable coating quality through the adjustment of coating parameters.
所述电极21和所述可运动支架40之间的相对位置固定,所述镀膜设备的所述可运动支架40能够不干扰所述电极21的放电。The relative position between the electrode 21 and the movable support 40 is fixed, and the movable support 40 of the coating equipment can not interfere with the discharge of the electrode 21.
在本实施例中,如图8所示,所述抽气口13位于所述反应腔11的其中一侧。优选地,所述抽气口13为一个,其中所述抽气口13位于所述反应腔11的一侧的任意位置。进一步地,所述镀膜设备包括至少一支架50,其中所述支架50被可旋转地容纳于所述反应腔11,以供支撑待镀膜工件在所述反应腔11内旋转。例如,所述支架50为可在所述反应腔11内绕一轴线转动的支架,所述轴线优选地为所述反应腔体10的中轴线,从而带动待镀膜工件在所述反应腔11内旋转,有利于待镀膜工件镀膜的均匀性。也就是说,在镀膜过程中,在所述镀膜腔11内的气体流动方向为由所述进料口12至所述抽气口13,所述支架50带动各待镀膜工件在所述反应腔11内旋转,使各待镀膜工件依次穿过流动的反应气体,增加镀膜均匀性。可以理解的是,所述可运动支架40与所述支架50可以为同一个,即所述电极21可以被设置于所述支架50。所述可运动支架40与所述支架50也可以相互配合地安装在一起,或者相互分离,在此不受限制。In this embodiment, as shown in FIG. 8, the suction port 13 is located on one side of the reaction chamber 11. Preferably, there is one suction port 13, and the suction port 13 is located at any position on one side of the reaction chamber 11. Further, the coating equipment includes at least one support 50, wherein the support 50 is rotatably accommodated in the reaction chamber 11 for supporting the workpiece to be coated to rotate in the reaction chamber 11. For example, the support 50 is a support that can rotate around an axis in the reaction chamber 11, and the axis is preferably the central axis of the reaction chamber 10, thereby driving the workpiece to be coated in the reaction chamber 11 Rotation is conducive to the uniformity of the coating on the workpiece to be coated. That is to say, during the coating process, the gas flow direction in the coating chamber 11 is from the feed port 12 to the exhaust port 13, and the support 50 drives each workpiece to be coated in the reaction chamber 11 Internal rotation makes each workpiece to be coated pass through the flowing reaction gas in turn to increase the uniformity of the coating. It is understandable that the movable bracket 40 and the bracket 50 may be the same, that is, the electrode 21 may be provided on the bracket 50. The movable bracket 40 and the bracket 50 can also be installed in cooperation with each other, or separated from each other, which is not limited here.
更进一步地,所述支架50绕所述进气柱30旋转,从而带动待镀膜工件绕所述进气柱30在所述反应腔11内旋转。换句话说,所述进气柱30位于所述轴线 的位置。Furthermore, the support 50 rotates around the inlet column 30 to drive the workpiece to be coated to rotate in the reaction chamber 11 around the inlet column 30. In other words, the intake column 30 is located at the position of the axis.
值得一提的是,所述支架50支撑待镀膜工件围绕于所述进气柱30的四周,且所述支架50与所述进气柱30之间可以不需要预留间距,使得反应气体能够从所述进气柱30直接扩散至所述支架50所在的空间,因此,相对于传统的镀膜设备,本发明的所述镀膜设备在镀膜过程中,反应气体无需经过避让空间,即可从所述进气柱30直接扩散至待镀膜工件,保证了镀膜质量。It is worth mentioning that the support 50 supports the workpiece to be coated around the intake column 30, and there is no need to reserve a space between the support 50 and the intake column 30, so that the reaction gas can be It diffuses directly from the intake column 30 to the space where the bracket 50 is located. Therefore, compared with the traditional coating equipment, the coating equipment of the present invention does not need to pass through the avoiding space during the coating process. The air intake column 30 directly diffuses to the workpiece to be coated to ensure the quality of the coating.
在一可选实施例中,多个所述抽气口13分别位于所述反应腔11的不同的侧面,使得所述反应腔11内能够形成多个不同方向的气体流动方向,以增加待镀膜工件的镀膜均匀性。例如,如图12所示,所述抽气口13为四个,分别位于所述反应腔11的四周,从而在所述反应腔11内形成自所述反应腔11的中间朝向所述反应腔11的四个侧面的四个气体流动方向,以增加所述反应腔11内的气体均匀性。可以理解的是,可以通过增设更多数量的抽气口和布置所述抽气口的位置,以调整反应气体的流动方向和数量,满足镀膜需求。In an optional embodiment, a plurality of the gas extraction ports 13 are respectively located on different sides of the reaction chamber 11, so that a plurality of gas flow directions in different directions can be formed in the reaction chamber 11 to increase the workpieces to be coated The coating uniformity. For example, as shown in FIG. 12, there are four air extraction ports 13, which are respectively located around the reaction chamber 11, so that they are formed in the reaction chamber 11 from the middle of the reaction chamber 11 toward the reaction chamber 11. The four gas flow directions on the four sides of the four sides to increase the uniformity of the gas in the reaction chamber 11. It is understandable that by adding a larger number of air extraction ports and arranging the positions of the air extraction ports, the flow direction and quantity of the reaction gas can be adjusted to meet the coating requirements.
进一步地,所述支架50被固定地或可旋转地容纳于所述反应腔11。也就是说,在上述可选实施例中,所述支架50可以固定地设置于所述反应腔11内,由所述支架50支撑的待镀膜工件也相对地容纳于所述反应腔11内,由于所述反应腔11内的反应气体的流动方向的增多,增加了所述反应腔11内的反应气体的均匀性,使得所述反应腔11内的反应气体相对均匀地流过各待镀膜工件,从而增加镀膜均匀性。可以理解的是,为进一步地提高镀膜均匀性,所述支架50可旋转地容纳于所述反应腔11。Further, the support 50 is fixedly or rotatably accommodated in the reaction chamber 11. That is, in the above-mentioned optional embodiment, the support 50 may be fixedly arranged in the reaction chamber 11, and the workpiece to be coated supported by the support 50 is also relatively contained in the reaction chamber 11. As the flow direction of the reaction gas in the reaction chamber 11 increases, the uniformity of the reaction gas in the reaction chamber 11 is increased, so that the reaction gas in the reaction chamber 11 flows relatively uniformly through the workpieces to be coated , Thereby increasing the uniformity of the coating. It can be understood that, in order to further improve the coating uniformity, the support 50 is rotatably accommodated in the reaction chamber 11.
值得一提的是,如图11所示,所述进料口12可以设置为更多个,所述进气柱30相应地被设置为多个。多个所述进气柱30并列地设置于所述反应腔11内,且分别与对应的所述进料口12相连通。例如,所述进气柱30被设置为五个,其中一个所述进气柱30设置于所述反应腔11的中间,另外四个所述进气柱30对称地布置于中间的所述进气柱30的四周,且位于所述反应腔11的中间与侧壁之间,优选地为所述反应腔的四分之一的位置,即外围的四个进气柱30对称地设置于中间的所述进气柱30的四周。It is worth mentioning that, as shown in FIG. 11, the feed inlet 12 may be provided with more than one, and the intake column 30 may be provided with more than one correspondingly. A plurality of the air inlet columns 30 are arranged side by side in the reaction chamber 11 and are respectively communicated with the corresponding feeding ports 12. For example, there are five intake columns 30, one of the intake columns 30 is set in the middle of the reaction chamber 11, and the other four intake columns 30 are symmetrically arranged in the middle of the intake column. The periphery of the air column 30 and between the middle and the side wall of the reaction chamber 11, preferably at a quarter of the position of the reaction chamber, that is, the four air inlet columns 30 on the periphery are symmetrically arranged in the middle Around the intake column 30.
更进一步地,所述支架50被设置为多个,各所述支架50设置于相应的所述进气柱30的外侧。例如,所述进气柱30为五个,所述支架50为四个,四个所述支架50分别设置于外围的四个所述进气柱30的外侧,四个所述支架50之间 互不干扰,相互之间预留一定的避让空间。更进一步地,各所述支架50分别绕对应的所述进气柱30自转,以提高镀膜均匀性。可以理解的是,所述支架50为中空的结构,或者镂空的结构,以保证气体在所述反应腔11内流动,减少对气体流动的阻碍。或者,所述支架50与所述进气柱30的数量一致,各所述支架50分别设置于对应的所述进气柱30的外侧并绕其自转,各所述支架50之间具有一定的避让空间,防止影响其自转。Furthermore, the bracket 50 is provided in multiple, and each bracket 50 is arranged on the outer side of the corresponding air inlet column 30. For example, there are five intake columns 30, four brackets 50, and four brackets 50 are respectively arranged on the outer side of the four intake columns 30 on the periphery, between the four brackets 50 Do not interfere with each other, and reserve a certain amount of avoidance space between each other. Furthermore, each of the brackets 50 respectively rotates around the corresponding intake column 30 to improve the uniformity of the coating. It is understandable that the bracket 50 has a hollow structure or a hollow structure to ensure the gas flow in the reaction chamber 11 and reduce the obstruction to the gas flow. Alternatively, the number of the brackets 50 and the intake columns 30 are the same, and the brackets 50 are respectively arranged on the outer side of the corresponding intake column 30 and rotate around it, and there is a certain amount between the brackets 50 Avoid space to prevent it from affecting its rotation.
在本优选实施例的一个变形实施例中,待镀膜的所述待镀膜工件被适于放置于用于将所述反应气体引入到所述反应腔11中的所述进料口12和用于激发所述反应气体的所述电极装置20之间,因此减少了膜层形成材料的过度分解。如图13所示,所述进气柱30位于所述反应腔11的靠近中间位置101,并与所述进料口12相连通,即所述进料口12也连通于所述反应腔11的靠近中间位置101。所述电极装置20被设置于所述反应腔11的靠近侧壁位置,举例地,所述电极装置20通过一电极支架支撑于所述反应腔11的靠近侧壁位置,或者,所述电极装置20可以安装于所述反应腔11的侧壁,并不需要安装于一电极支架。在镀膜时,待镀膜工件被放置于所述反应腔11内的所述电极装置20与所述进气柱30之间的区域。In a modified embodiment of the preferred embodiment, the workpiece to be coated is adapted to be placed in the feed port 12 for introducing the reaction gas into the reaction chamber 11 and Between the electrode devices 20 that excite the reaction gas, the excessive decomposition of the film forming material is thus reduced. As shown in FIG. 13, the gas inlet column 30 is located near the middle position 101 of the reaction chamber 11 and communicates with the feed port 12, that is, the feed port 12 is also connected to the reaction chamber 11. Near the middle position 101. The electrode device 20 is disposed at a position near the side wall of the reaction chamber 11. For example, the electrode device 20 is supported at a position near the side wall of the reaction chamber 11 through an electrode holder, or the electrode device 20 can be installed on the side wall of the reaction chamber 11 and does not need to be installed on an electrode holder. During film coating, the workpiece to be coated is placed in the area between the electrode device 20 and the gas inlet column 30 in the reaction chamber 11.
所述电极装置20通过对释放的等离子体源气体进行放电产生等离子体,并在其周围形成等离子体环境201。具体地,所述电极装置20的所述电极21被安装于所述反应腔11的靠近侧壁位置,并在所述反应腔11的靠近侧壁位置形成所述等离子环境201。所述靠近侧壁位置可以为所述反应腔11内的靠近侧壁的四周区域中的部分区域,或者所述靠近侧壁位置可以为所述反应腔11内的靠近侧壁的四周区域。The electrode device 20 generates plasma by discharging the released plasma source gas, and forms a plasma environment 201 around it. Specifically, the electrode 21 of the electrode device 20 is installed at a position close to the side wall of the reaction chamber 11, and the plasma environment 201 is formed at a position close to the side wall of the reaction chamber 11. The position close to the side wall may be a partial area of the surrounding area close to the side wall in the reaction chamber 11, or the position close to the side wall may be a surrounding area close to the side wall in the reaction chamber 11.
具体地,在镀膜时,反应气体沿所述进料口12充入所述进气柱30的所述进气腔31,并沿所述进气柱30的所述出气孔32散入所述反应腔11内,并首先地到达所述反应腔11内的放置所述待镀膜工件的区域,仅一部分所述反应气体受到所述电极装置20的激发,使所述反应气体分解,聚合并沉积在待镀膜工件的表面,以形成涂层。所述反应气体可以为单个分子的单体、低聚物或其组合物等,例如,低聚物可以为双聚合物等。在下述实施例的描述中,所述反应气体以气体单体或单体蒸汽为例进行说明。Specifically, during film coating, the reaction gas is charged into the gas inlet cavity 31 of the gas inlet column 30 along the feed port 12, and diffuses into the gas inlet cavity 32 of the gas inlet column 30. In the reaction chamber 11, and first reaches the area in the reaction chamber 11 where the workpiece to be coated is placed, only a part of the reaction gas is excited by the electrode device 20, causing the reaction gas to decompose, polymerize and deposit On the surface of the workpiece to be coated to form a coating. The reaction gas may be a single molecule of monomer, oligomer, or a combination thereof, etc., for example, the oligomer may be a dipolymer or the like. In the description of the following embodiments, the reaction gas is described by taking gas monomer or monomer vapor as an example.
在本发明中,由于所述待镀膜工件被适于放置于反应气体从所述进气柱30 流向所述电极装置20形成的等离子体环境201的流动路径中,并且所述待镀膜工件和所述进气柱30之间的距离小于所述待镀膜工件和所述电极装置20之间的距离,不是所有的所述反应气体都被所述电极装置20激发,从而避免镀膜过程中因反应气体单体的过度分解而导致薄膜性能不良等问题,从而提高镀膜质量。In the present invention, since the workpiece to be coated is suitable to be placed in the flow path of the plasma environment 201 formed by the reaction gas flowing from the inlet column 30 to the electrode device 20, and the workpiece to be coated is The distance between the gas inlet posts 30 is smaller than the distance between the workpiece to be coated and the electrode device 20, and not all the reaction gas is excited by the electrode device 20, so as to avoid the reaction gas during the coating process. Excessive decomposition of monomers leads to problems such as poor film performance, thereby improving the quality of the coating.
进一步地,所述支架50被设置于所述进气柱30与所述电极装置20之间,所述待镀膜工件适于被支撑于所述支架50,所述支架50为可运动支架,所述支架50可支撑所述待镀膜工件在所述电极装置20放电形成的所述等离子体环境201和所述进气柱30之间做往复运动。具体地,所述支架50为可运动支架,所述支架50在所述等离子体环境201和所述进气柱30之间做往返运动,在镀膜时,所述支架50往复地移动待镀膜工件可交替地靠近所述等离子体环境201或所述进气柱30的所述出气孔32。Further, the support 50 is arranged between the intake column 30 and the electrode device 20, the workpiece to be coated is suitable to be supported on the support 50, and the support 50 is a movable support. The support 50 can support the workpiece to be coated to reciprocate between the plasma environment 201 formed by the discharge of the electrode device 20 and the intake column 30. Specifically, the support 50 is a movable support, and the support 50 reciprocates between the plasma environment 201 and the intake column 30. During coating, the support 50 reciprocally moves the workpiece to be coated The air outlet 32 of the plasma environment 201 or the air inlet column 30 can be alternately approached.
可选地,所述支架50的运动方式可以为旋转、翻转或平移等,或者说,所述支架50被设置为可旋转结构、可翻转结构或可平移结构,以移动所述待镀膜工件进行旋转、翻转或者平移运动,在此不受限制。如图13所示,所述支架50为可旋转结构,其中所述支架50可带动待镀膜工件绕所述进气柱30在所述反应腔11内旋转,所述电极装置20在所述反应腔11内的靠近侧壁位置的其中一侧区域形成所述等离子体环境201,所述支架50带动所述待镀膜工件可旋转地交替地进出所述等离子体环境201。在镀膜过程中,所述支架50往复地进出所述电极装置20形成的所述等离子体环境201。当所述支架50靠近所述进气柱30的所述出气孔32时,气体单体或单体蒸汽在所述待镀膜工件的表面附着形成一薄层,即气体单体或单体蒸汽被吸附于所述待镀膜工件的表面。当所述支架50靠近所述等离子体环境201时,所述待镀膜工件表面附着的气体单体或单体蒸汽被所述等离子体活化。当所述支架50再次靠近所述进气柱30的所述出气孔32时,气体单体或单体蒸汽与所述待镀膜工件表面被活化的分子发生接枝或聚合,膜层生长变厚,以此不断地重复,直到所述基待镀膜工件表面制备预定厚度的薄膜或涂层。Optionally, the movement mode of the support 50 may be rotation, turning or translation, or the like, or in other words, the support 50 is configured as a rotatable structure, a reversible structure, or a translational structure to move the workpiece to be coated. Rotation, flip or translation movement is not restricted here. As shown in FIG. 13, the support 50 is a rotatable structure, wherein the support 50 can drive the workpiece to be coated to rotate in the reaction chamber 11 around the intake column 30, and the electrode device 20 is in the reaction chamber 11 The plasma environment 201 is formed in one side area of the cavity 11 close to the sidewall position, and the support 50 drives the workpiece to be coated to rotatably enter and exit the plasma environment 201 alternately. During the coating process, the support 50 reciprocally enters and exits the plasma environment 201 formed by the electrode device 20. When the support 50 is close to the air outlet 32 of the inlet column 30, the gas monomer or monomer vapor adheres to the surface of the workpiece to be coated to form a thin layer, that is, the gas monomer or monomer vapor is Adsorbed on the surface of the workpiece to be coated. When the support 50 is close to the plasma environment 201, the gas monomer or monomer vapor attached to the surface of the workpiece to be coated is activated by the plasma. When the support 50 approaches the air outlet 32 of the inlet column 30 again, the gas monomer or monomer vapor is grafted or polymerized with the activated molecules on the surface of the workpiece to be coated, and the film grows thicker. This is repeated continuously until a film or coating with a predetermined thickness is prepared on the surface of the workpiece to be coated.
本发明这个实施例中,其与现有技术的不同之处在于,现有技术是利用等离子体作用于空间的气体单体或单体蒸汽,其中气体单体或单体蒸汽分子完全暴露于等离子体中,在空间发生分解并生成各种聚合产物,再沉积在待镀膜工件表面制备薄膜或涂层,导致薄膜或涂层中的分子完整度低,薄膜或涂层的性能较差; 而本变形实施例中,所述电极装置20产生的等离子体只作用于吸附于待镀膜工件表面的气体单体或单体蒸汽分子,再与未经等离子体作用的气体单体或单体蒸汽分子接枝或聚合生长,以制备薄膜或涂层,且分子完整度高,因此薄膜或涂层的性能更好。In this embodiment of the present invention, the difference from the prior art is that the prior art uses plasma to act on the gas monomer or monomer vapor in the space, wherein the gas monomer or monomer vapor molecules are completely exposed to the plasma. In the body, it decomposes in space and generates various polymerization products, which are then deposited on the surface of the workpiece to be coated to prepare a film or coating, resulting in low molecular integrity in the film or coating, and poor performance of the film or coating; In the modified embodiment, the plasma generated by the electrode device 20 only acts on the gas monomer or monomer vapor molecules adsorbed on the surface of the workpiece to be coated, and then connects with the gas monomer or monomer vapor molecules that have not been plasma-affected. Branches or polymerized growth to prepare films or coatings, and the molecular integrity is high, so the performance of the film or coating is better.
另一方面,部分气体单体或单体蒸汽扩散到等离子体环境201,在等离子体环境201空间分解聚合并在待镀膜工件移动过来时沉积在其表面,构成涂层的一部分。这部分聚合产物具有较高程度的分支和交联结构。涂层中存在一定程度的分支和交联有利于提高聚合效率和涂层的稳定性。本发明可以通过调节待镀膜工件在所述进气柱30的所述出气孔32和所述等离子体环境201之间的移动速度和滞留时间,方便地控制涂层中的分支和交联比例,获得最佳的涂层特性。On the other hand, part of the gas monomer or monomer vapor diffuses into the plasma environment 201, decomposes and polymerizes in the plasma environment 201, and deposits on the surface of the workpiece to be coated when it moves, forming a part of the coating. This part of the polymerization product has a higher degree of branching and cross-linking structure. A certain degree of branching and cross-linking in the coating is beneficial to improve the polymerization efficiency and the stability of the coating. The present invention can conveniently control the branching and cross-linking ratio in the coating by adjusting the moving speed and residence time of the workpiece to be coated between the air outlet 32 of the air inlet column 30 and the plasma environment 201, Obtain the best coating characteristics.
值得一提的是,所述支架50的移动路径、移动速度、节奏、滞留时间、循环时间以及移动时间均能够被预设,以控制所制备的涂层中的分子间的分支与交联的比例,以保证性能,以适于制备所需的薄膜或涂层等。It is worth mentioning that the movement path, movement speed, rhythm, residence time, cycle time, and movement time of the stent 50 can be preset to control the branching and cross-linking of molecules in the prepared coating. Proportion to ensure performance, suitable for preparing the required film or coating, etc.
在本实施例中,所述镀膜设备进一步包括进料装置60,其中所述进料装置60连通所述进料口,以供向所述反应腔11内充入反应气体。例如,所述反应气体直接来自于气体源或由液体原料汽化生成。所述进料装置60直接连接于所述镀膜腔体10,并通过所述进料口12与所述镀膜腔11相连通。In this embodiment, the coating equipment further includes a feeding device 60, wherein the feeding device 60 is connected to the feeding port for filling the reaction chamber 11 with reaction gas. For example, the reaction gas directly comes from a gas source or is generated by the vaporization of a liquid raw material. The feeding device 60 is directly connected to the coating cavity 10 and communicates with the coating cavity 11 through the feeding port 12.
所述镀膜设备进一步包括抽气装置70,其中所述抽气装置70连通所述抽气口13,所述抽气装置70用于抽气,以供维持所述反应腔11处于预设的负压环境,所述抽气装置70被连接于所述镀膜腔体10,并通过所述抽气口13与所述镀膜腔11相连通。The coating equipment further includes an air extraction device 70, wherein the air extraction device 70 is connected to the air extraction port 13, and the air extraction device 70 is used for air extraction to maintain the reaction chamber 11 at a preset negative pressure Environment, the air extraction device 70 is connected to the coating cavity 10 and communicates with the coating cavity 11 through the air extraction port 13.
另一方面,本实施例还提供了一镀膜方法,包括:On the other hand, this embodiment also provides a coating method, including:
S10、沿所述进料口12向所述镀膜设备的所述反应腔体10的所述反应腔11充入反应气体,其中所述进料口12位于所述镀膜设备的所述反应腔体10的所述反应腔11的靠近中间位置;S10. Fill the reaction chamber 11 of the reaction chamber 10 of the coating equipment with a reaction gas along the feed port 12, wherein the feed port 12 is located in the reaction chamber of the coating equipment 10 near the middle position of the reaction chamber 11;
S20、从位于所述反应腔11的侧面位置的所述抽气口13抽出所述反应腔11内的气体,以维持所述反应腔11处于预设的负压环境;以及S20. Extract the gas in the reaction chamber 11 from the gas extraction port 13 located on the side of the reaction chamber 11 to maintain the reaction chamber 11 in a preset negative pressure environment; and
S30、在所述反应腔11内放电。S30. Discharge in the reaction chamber 11.
也就是说,在镀膜过程中,所述进料装置60通过所述进料口12向所述反应腔11内充入反应气体,所述抽气装置70通过所述抽气口13持续抽出所述反应 腔11内的气体,以保证所述反应腔11处于预设的负压环境,所述电极装置20在所述反应腔11内放电,以在所述反应腔11内形成等离子体环境,以在待镀膜工件表面镀膜。That is to say, during the coating process, the feed device 60 fills the reaction chamber 11 with reaction gas through the feed port 12, and the gas extraction device 70 continuously draws out the reaction gas through the gas extraction port 13 The gas in the reaction chamber 11 to ensure that the reaction chamber 11 is in a preset negative pressure environment, and the electrode device 20 discharges in the reaction chamber 11 to form a plasma environment in the reaction chamber 11 to Coating on the surface of the workpiece to be coated.
进一步地,所述进气柱30被容置于所述反应腔11内,所述进气柱30连通所述进料口12,所述进气柱30具有多个出气孔32,使得反应气体通过所述进气柱30的所述出气孔32扩散至所述反应腔11内,以提高镀膜均匀性。Further, the gas inlet column 30 is accommodated in the reaction chamber 11, the gas inlet column 30 communicates with the feed port 12, and the gas inlet column 30 has a plurality of gas outlet holes 32, so that the reaction gas The air outlet hole 32 of the air inlet column 30 diffuses into the reaction chamber 11 to improve the uniformity of the coating film.
在一些实施例中,在所述方法中,通过所述电极21在所述反应腔11内放电,其中所述电极11位于所述进气柱30的外侧。In some embodiments, in the method, electric discharge is performed in the reaction chamber 11 through the electrode 21, wherein the electrode 11 is located outside the gas inlet column 30.
在一些实施例中,在所述方法中,其中所述电极21具有多个通孔211,其中所述通孔211对应于所述出气孔32。In some embodiments, in the method, wherein the electrode 21 has a plurality of through holes 211, wherein the through holes 211 correspond to the air outlet holes 32.
在一些实施例中,在所述方法中,至少部分所述进气柱30由导电材料制成,其中所述电极21朝向所述进气柱30放电。In some embodiments, in the method, at least part of the intake column 30 is made of a conductive material, wherein the electrode 21 discharges toward the intake column 30.
在一些实施例中,在所述方法中,所述导电板22被安装于所述进气柱30,其中所述电极21朝向所述导电板22放电。In some embodiments, in the method, the conductive plate 22 is installed on the intake column 30, wherein the electrode 21 discharges toward the conductive plate 22.
在一些实施例中,在所述方法中,所述导电板22具有多个对应于所述出气孔32的气孔221。In some embodiments, in the method, the conductive plate 22 has a plurality of air holes 221 corresponding to the air outlet holes 32.
在一些实施例中,在所述方法中,所述电极21是运动电极,其相对于所述反应腔体10可运动地设置在所述反应腔体10内。In some embodiments, in the method, the electrode 21 is a moving electrode, which is movably disposed in the reaction cavity 10 relative to the reaction cavity 10.
在一些实施例中,在所述方法中,两个所述进料口12对称地位于所述反应腔11的上下两侧,其中所述进气柱30的所述进气腔31的上下两端分别连通两个所述进料口12。In some embodiments, in the method, the two feed ports 12 are symmetrically located on the upper and lower sides of the reaction chamber 11, and the upper and lower sides of the gas inlet chamber 31 of the gas inlet column 30 are located symmetrically. The two ends are respectively connected with the two feeding ports 12.
在一些实施例中,在所述方法中,远离所述进料口12的所述出气孔32的孔径逐渐增大或数量逐渐增多。In some embodiments, in the method, the pore size or the number of the air outlet holes 32 away from the feed port 12 gradually increases.
在一些实施例中,在所述方法中,所述抽气口13位于所述反应腔11的其中一侧。或者,多个所述抽气口13分别位于所述反应腔11的四周。In some embodiments, in the method, the suction port 13 is located on one side of the reaction chamber 11. Alternatively, a plurality of the suction ports 13 are respectively located around the reaction chamber 11.
在一些实施例中,在所述方法中,所述支架50可旋转地或固定地容纳于所述反应腔11。In some embodiments, in the method, the support 50 is rotatably or fixedly accommodated in the reaction chamber 11.
在一些实施例中,在所述方法中,通过所述电极装置20在所述反应腔11的靠近侧壁位置放电形成所述等离子体环境201,其中待镀膜工件被适于放置于所述反应腔11内的所述靠近中间位置与所述靠近侧壁位置之间。In some embodiments, in the method, the plasma environment 201 is formed by discharging the electrode device 20 at a position close to the side wall of the reaction chamber 11, wherein the workpiece to be coated is suitable to be placed in the reaction chamber 11 Between the position near the middle and the position near the side wall in the cavity 11.
在一些实施例中,在所述方法中,往复地移动所述待镀膜工件进出所述等离子体环境201。In some embodiments, in the method, the workpiece to be coated is moved in and out of the plasma environment 201 reciprocally.
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。Those skilled in the art should understand that the above description and the embodiments of the present invention shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been completely and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the principles, the implementation of the present invention may have any deformation or modification.

Claims (40)

  1. 一镀膜设备,以供在待镀膜工件的表面镀膜,其特征在于,包括:A coating equipment for coating the surface of the workpiece to be coated, characterized in that it includes:
    一电极装置;和An electrode device; and
    一反应腔体,其中所述反应腔体具有一反应腔、连通于所述反应腔的至少一进料口,其中所述进料口位于所述反应腔体的靠近中间位置,以向所述反应腔内通入反应气体,其中所述电极装置在所述反应腔内放电,以供在该待镀膜工件的表面镀膜。A reaction chamber, wherein the reaction chamber has a reaction chamber and at least one feed port connected to the reaction chamber, wherein the feed port is located near the middle of the reaction chamber so as to A reaction gas is introduced into the reaction chamber, and the electrode device discharges in the reaction chamber for coating the surface of the workpiece to be coated.
  2. 根据权利要求1所述的镀膜设备,所述反应腔体还具有至少一抽气口,其位于邻近所述反应腔体的内表面的位置。4. The coating equipment according to claim 1, wherein the reaction chamber further has at least one suction port located adjacent to the inner surface of the reaction chamber.
  3. 根据权利要求1所述的镀膜设备,进一步包括至少一进气柱,其中所述进气柱被容纳于所述反应腔,其中所述进气柱具有一进气腔和多个位于其侧面的出气孔,其中所述进料口连通所述进气腔。The coating equipment according to claim 1, further comprising at least one air inlet column, wherein the air inlet column is accommodated in the reaction chamber, wherein the air inlet column has an air inlet cavity and a plurality of An air outlet, wherein the feed port communicates with the air inlet cavity.
  4. 根据权利要求3所述的镀膜设备,其中所述电极装置包括至少一电极,其中所述电极位于所述进气柱的外侧。3. The coating equipment according to claim 3, wherein the electrode device comprises at least one electrode, wherein the electrode is located outside the intake column.
  5. 根据权利要求4所述的镀膜设备,其中所述电极具有多个通孔,其中所述通孔对应于所述出气孔。4. The coating apparatus according to claim 4, wherein the electrode has a plurality of through holes, wherein the through holes correspond to the air outlet holes.
  6. 根据权利要求4或5所述的镀膜设备,其中至少部分所述进气柱由导电材料制成,其中所述电极朝向所述进气柱放电。The coating equipment according to claim 4 or 5, wherein at least a part of the intake column is made of conductive material, and wherein the electrode discharges toward the intake column.
  7. 根据权利要求4或5所述的镀膜设备,所述电极装置进一步包括至少一导电板,其中所述导电板被安装于所述进气柱,其中所述电极朝向所述导电板放电。The coating equipment according to claim 4 or 5, wherein the electrode device further comprises at least one conductive plate, wherein the conductive plate is installed on the intake column, and the electrode discharges toward the conductive plate.
  8. 根据权利要求7所述的镀膜设备,其中所述导电板具有多个对应于所述出气孔的气孔。8. The coating equipment according to claim 7, wherein the conductive plate has a plurality of air holes corresponding to the air outlet holes.
  9. 根据权利要求4或5所述的镀膜设备,其中所述电极是运动电极,其相对于所述反应腔体可运动地设置在所述反应腔体内。The coating device according to claim 4 or 5, wherein the electrode is a moving electrode, which is movably arranged in the reaction chamber relative to the reaction chamber.
  10. 根据权利要求9所述的镀膜设备,进一步包括一可运动支架,其中所述可运动支架相对于所述反应腔体可运动地设置在所述反应腔体内,其中该待镀膜工件适于被保持于所述可运动支架随着所述可运动支架运动,所述电极被安装于所述可运动支架。The coating equipment according to claim 9, further comprising a movable support, wherein the movable support is movably arranged in the reaction chamber relative to the reaction chamber, wherein the workpiece to be coated is suitable to be held As the movable support moves with the movable support, the electrode is installed on the movable support.
  11. 根据权利要求3所述的镀膜设备,其中两个所述进料口对称地位于所述反应腔的上下两侧,其中所述进气柱的所述进气腔的上下两端分别连通两个所述进料口。The coating equipment according to claim 3, wherein the two feed ports are symmetrically located on the upper and lower sides of the reaction chamber, and the upper and lower ends of the gas inlet cavity of the gas inlet column are respectively connected with two The feed port.
  12. 根据权利要求3或10所述的镀膜设备,其中远离所述进料口的所述出气孔的孔径逐渐增大。The coating equipment according to claim 3 or 10, wherein the diameter of the air outlet hole away from the feed port gradually increases.
  13. 根据权利要求3或10所述的镀膜设备,其中远离所述进料口的所述出气孔的数量逐渐增多。The coating equipment according to claim 3 or 10, wherein the number of the air outlet holes away from the feed port gradually increases.
  14. 根据权利要求2所述的镀膜设备,其中所述抽气口位于所述反应腔的其中一侧。4. The coating equipment according to claim 2, wherein the suction port is located on one side of the reaction chamber.
  15. 根据权利要求14所述的镀膜设备,进一步包括至少一支架,其中所述支架被可旋转地容纳于所述反应腔,以供支撑该待镀膜工件在所述反应腔内旋转。The coating equipment according to claim 14, further comprising at least one support, wherein the support is rotatably accommodated in the reaction chamber for supporting the workpiece to be coated to rotate in the reaction chamber.
  16. 根据权利要求15所述的镀膜设备,进一步包括至少一进气柱,其中所述进气柱被容纳于所述反应腔,其中所述进气柱具有一进气腔和多个位于其侧面的出气孔,其中所述进料口连通所述进气腔,其中所述支架绕所述进气柱旋转。The coating equipment according to claim 15, further comprising at least one air inlet column, wherein the air inlet column is accommodated in the reaction chamber, wherein the air inlet column has an air inlet chamber and a plurality of The air outlet, wherein the feed port is connected to the air inlet cavity, and the bracket rotates around the air inlet column.
  17. 根据权利要求2所述的镀膜设备,其中多个所述抽气口分别位于所述反应腔的四周。4. The coating equipment according to claim 2, wherein a plurality of the air extraction ports are respectively located around the reaction chamber.
  18. 根据权利要求17所述的镀膜设备,进一步包括至少一支架,其中所述支架被固定地或可旋转地容纳于所述反应腔,以供支撑该待镀膜工件。The coating equipment according to claim 17, further comprising at least one support, wherein the support is fixedly or rotatably accommodated in the reaction chamber for supporting the workpiece to be coated.
  19. 根据权利要求1所述的镀膜设备,进一步包括进料装置,其中所述进料装置连通所述进料口,以供向所述反应腔内充入反应气体。The coating equipment according to claim 1, further comprising a feeding device, wherein the feeding device communicates with the feeding port for filling the reaction chamber with a reaction gas.
  20. 根据权利要求2所述的镀膜设备,进一步包括抽气装置,其中所述抽气装置连通所述抽气口,以供维持所述反应腔处于预设的负压环境。The coating equipment according to claim 2, further comprising an air extraction device, wherein the air extraction device communicates with the air extraction port for maintaining the reaction chamber in a preset negative pressure environment.
  21. 根据权利要求3所述的镀膜设备,所述电极装置被设置于所述反应腔内的靠近侧壁位置,并形成等离子体环境,以供待镀膜工件适于被放置于所述进气柱和所述电极装置之间。The coating equipment according to claim 3, wherein the electrode device is arranged in the reaction chamber close to the side wall, and forms a plasma environment, so that the workpiece to be coated is suitable for being placed on the inlet column and Between the electrode devices.
  22. 根据权利要求21所述的镀膜设备,进一步包括一支架,其中所述支架被安装于所述电极装置与所述进气柱之间,其中所述支架为可运动支架,所述支架用于支撑待镀膜工件在所述等离子体环境和所述进气柱之间往复运动。The coating equipment according to claim 21, further comprising a bracket, wherein the bracket is installed between the electrode device and the intake column, wherein the bracket is a movable bracket, and the bracket is used to support The workpiece to be coated reciprocates between the plasma environment and the intake column.
  23. 一镀膜方法,其特征在于,包括:A coating method is characterized in that it includes:
    沿至少一进料口向一镀膜设备的一反应腔体的反应腔充入反应气体,其中所 述进料口位于所述反应腔体的靠近中间位置;Fill a reaction chamber of a reaction chamber of a coating equipment with reaction gas along at least one feed port, wherein the feed port is located at a position close to the middle of the reaction chamber;
    从位于所述反应腔的侧面位置的至少一抽气口抽出所述反应腔内的气体,以维持所述反应腔处于预设的负压环境;以及Extract the gas in the reaction chamber from at least one air extraction port located on the side of the reaction chamber, so as to maintain the reaction chamber in a preset negative pressure environment; and
    在所述反应腔内放电。Discharge in the reaction chamber.
  24. 根据权利要求23所述的镀膜方法,至少一进气柱被容纳于所述反应腔,其中所述进气柱具有一进气腔和多个位于其侧面的出气孔,其中所述进料口连通所述进气腔。The coating method according to claim 23, wherein at least one gas inlet column is contained in the reaction chamber, wherein the gas inlet column has an gas inlet cavity and a plurality of gas outlet holes on the side of the gas inlet column, wherein the material inlet Communicate with the air inlet cavity.
  25. 根据权利要求24所述的镀膜方法,其中通过至少一电极在所述反应腔内放电,其中所述电极位于所述进气柱的外侧。22. The coating method of claim 24, wherein at least one electrode is used to discharge in the reaction chamber, wherein the electrode is located outside the gas inlet column.
  26. 根据权利要求25所述的镀膜方法,其中所述电极具有多个通孔,其中所述通孔对应于所述出气孔。The coating method according to claim 25, wherein the electrode has a plurality of through holes, wherein the through holes correspond to the air outlet holes.
  27. 根据权利要求25或26所述的镀膜方法,其中至少部分所述进气柱由导电材料制成,其中所述电极朝向所述进气柱放电。The coating method according to claim 25 or 26, wherein at least a part of the intake column is made of conductive material, and the electrode discharges toward the intake column.
  28. 根据权利要求25或26所述的镀膜方法,至少一导电板被安装于所述进气柱,其中所述电极朝向所述导电板放电。According to the coating method of claim 25 or 26, at least one conductive plate is installed on the intake column, wherein the electrode discharges toward the conductive plate.
  29. 根据权利要求28所述的镀膜方法,其中所述导电板具有多个对应于所述出气孔的气孔。The coating method according to claim 28, wherein the conductive plate has a plurality of air holes corresponding to the air outlet holes.
  30. 根据权利要求25或26所述的镀膜方法,其中所述电极是运动电极,其相对于所述反应腔体可运动地设置在所述反应腔体内。The coating method according to claim 25 or 26, wherein the electrode is a moving electrode, which is movably arranged in the reaction chamber relative to the reaction chamber.
  31. 根据权利要求24所述的镀膜方法,其中两个所述进料口对称地位于所述反应腔的上下两侧,其中所述进气柱的所述进气腔的上下两端分别连通两个所述进料口。The coating method according to claim 24, wherein the two feed inlets are symmetrically located on the upper and lower sides of the reaction chamber, and the upper and lower ends of the gas inlet cavity of the gas inlet column are respectively connected with two The feed port.
  32. 根据权利要求24或31所述的镀膜方法,其中远离所述进料口的所述出气孔的孔径逐渐增大。The coating method according to claim 24 or 31, wherein the pore diameter of the air outlet hole away from the feed port gradually increases.
  33. 根据权利要求24或31所述的镀膜方法,其中远离所述进料口的所述出气孔的数量逐渐增多。The coating method according to claim 24 or 31, wherein the number of the air outlet holes away from the feed port gradually increases.
  34. 根据权利要求24所述的镀膜方法,其中所述抽气口位于所述反应腔的其中一侧。The film coating method according to claim 24, wherein the suction port is located on one side of the reaction chamber.
  35. 根据权利要求34所述的镀膜方法,至少一支架被可旋转地容纳于所述反应腔。The coating method according to claim 34, wherein at least one support is rotatably accommodated in the reaction chamber.
  36. 根据权利要求35所述的镀膜方法,其中所述支架绕所述进气柱旋转。The coating method according to claim 35, wherein the bracket rotates around the intake column.
  37. 根据权利要求24所述的镀膜方法,其中多个所述抽气口分别位于所述反应腔的四周。The coating method according to claim 24, wherein a plurality of the air extraction ports are respectively located around the reaction chamber.
  38. 根据权利要求37所述的镀膜方法,至少一支架被固定地或可旋转地容纳于所述反应腔。According to the coating method of claim 37, at least one support is fixedly or rotatably accommodated in the reaction chamber.
  39. 根据权利要求23所述的镀膜方法,通过一电极装置在所述反应腔的靠近侧壁位置放电形成等离子体环境,其中待镀膜工件被适于放置于所述反应腔内的所述靠近中间位置与所述靠近侧壁位置之间。The coating method according to claim 23, wherein a plasma environment is formed by discharging an electrode device at a position close to the side wall of the reaction chamber, wherein the workpiece to be coated is suitable to be placed in the close middle position of the reaction chamber And the position close to the side wall.
  40. 根据权利要求39所述的镀膜方法,往复地移动所述待镀膜工件进出所述等离子体环境。According to the coating method of claim 39, the workpiece to be coated is moved back and forth in and out of the plasma environment.
PCT/CN2020/095072 2020-06-09 2020-06-09 Coating equipment and application WO2021248303A1 (en)

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