CN102115869B

CN102115869B - Film coating device

Info

Publication number: CN102115869B
Application number: CN200910312962XA
Authority: CN
Inventors: 裴绍凯
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2009-12-31
Filing date: 2009-12-31
Publication date: 2013-11-20
Anticipated expiration: 2029-12-31
Also published as: CN102115869A

Abstract

The invention relates to a film coating device which comprises a film coating chamber, a coated part placing board and an evaporation coating device, wherein the coated part placing board and the evaporation coating device are installed in the film coating chamber and arranged oppositely; the coated part placing board is a flat board; the film coating device also comprises a plasma emitter which is arranged in the film coating chamber and between the evaporation coating device and the coated part placing board; and the plasma emitter comprises a plurality of mutually parallel and coplanar plasma emitting tubes which form a plane parallel to the coated part placing board. The film coating effect of the film coating device is better.

Description

Film coating apparatus

Technical field

The present invention relates to a kind of film coating apparatus.

Background technology

At present, many Industrial products surface all is coated with function film to improve the various performances of product surface., as the plated surface last layer anti-reflective film at optical mirror slip,, to reduce the reflectivity of lens surface, reduce the energy waste of incident light through eyeglass.And for example in some filtering assembly plated surface last layer filter coating, make spectral filter, it can filter out the light of a predetermined band.Usually, film coating method mainly comprises vapour deposition method, ion plating method, radio frequency magnetron sputter, chemical Vapor deposition process etc.

Evaporation coating device generally includes an evaporation chamber, one and is used for carrying the umbrella shape substrate of workpiece to be coated and one and is positioned at the crucible that is used for the carrying coating materials under this umbrella shape substrate.Traditional evaporation coating method is that base material to be coated is positioned on the umbrella shape substrate, then makes the coating materials of gaseous state or ionic state be deposited on base material upper surface formation film to be coated.Yet the crucible that is used for the carrying coating materials in general evaporation coating device is not exclusively equal apart from the distance of this each point of umbrella shape substrate, causes sedimentation rate unequal,, so can produce the phenomenon of membrane thickness unevenness, affects coating quality.

Summary of the invention

In view of this, be necessary to provide a kind of coating effects film coating apparatus preferably.

A kind of film coating apparatus, the film-coated part that comprise coating chamber, is installed in this coating chamber is placed plate, evaporation coating device.Evaporation coating device and film-coated part are placed plate and are oppositely arranged.It is a flat board that film-coated part is placed plate.Film coating apparatus also comprises and being located in coating chamber, and the plasma emitters between evaporation coating device and film-coated part placement plate.Plasma emitters comprises and being parallel to each other and coplanar a plurality of plasma emission pipes, and it is parallel that the formed plane of a plurality of plasma emission pipes and film-coated part are placed plate.

The plasma body that the gaseous molecular that the evaporation coating device of this film coating apparatus produces and this plasma body projector produce mutually clashes into and forms the plated film ion.To place plate parallel with film-coated part in plane due to a plurality of plasma emission pipes institute, thus each plasma emission pipe to film-coated part to place the distance of plate equal.Thus, arrive film-coated part after the almost identical distance of the plated film ion flight after plasma emitters is processed and place the plate surface, formed coating film thickness is comparatively even, and quality product is better.

Description of drawings

Fig. 1 is the schematic perspective view of the film coating apparatus of the embodiment of the present invention.

Fig. 2 is the decomposing schematic representation of film coating apparatus shown in Figure 1.

Fig. 3 is the diagrammatic cross-section of Fig. 1 along the III-III direction.

Fig. 4 is the schema of using method of the film coating apparatus of the embodiment of the present invention.

The main element nomenclature

Film coating apparatus	100
		Coating chamber	10
Substrate to be coated	11
		Evaporation coating device	13
Plasma emitters	15
		Top board	101
Base plate	103
		Side plate	105
Open holes	107
		The evaporation crucible	131
The first mounting block	132
		The second mounting block	133
Shower nozzle	134
		Installation portion	1331
Fixed part	1332
		Accepting hole	1333
Opening	1341
		The plasma transmitting tube	151
Air slot	153
		Venting hole	155

Embodiment

Be described in further detail below in conjunction with the film coating apparatus of accompanying drawing to the embodiment of the present invention.

Please consult simultaneously Fig. 1 to Fig. 3, the film coating apparatus 100 that embodiment of the present invention provides comprises coating chamber 10, is installed on film-coated part placement plate 11, evaporation coating device 13 and plasma emitters 15 in coating chamber 10.

Coating chamber 10 is the cuboid housing, and it comprises top board 101, the base plate 103 relative with top board 101, and four side plates 105 that are connected with base plate 103 with top board 101.Offer an open holes 107 on base plate 103.Can be filled be used to the rare gas element that shields, for example argon gas in coating chamber 10.

Film-coated part is placed plate 11 and is roughly flat board, and it is installed on the top board 101 of coating chamber 10.Workpiece (not shown) to be coated can be installed on film-coated part and place on plate 11.

Evaporation coating device 13 is located at the base plate 103 of coating chamber 10.Evaporation coating device 13 comprises evaporation crucible 131, the first mounting block 132, the second mounting block 133 and shower nozzle 134.Evaporation crucible 131 is used for accommodating coating raw material.The first mounting block 132 is roughly right cylinder, and evaporation crucible 131 is fixed on its top.The first mounting block 132 sides also offer outside screw.The second mounting block 133 comprises installation portion 1331 and the fixed part 1332 of one-body molded and coaxial setting.The second mounting block 133 offers the accepting hole 1333 that runs through installation portion 1331 and fixed part 1332, establishes the internal thread that matches with the outside screw that the first mounting block 132 is arranged on the sidewall of accepting hole 1333.Thus, by rotating the just height of capable of regulating evaporation crucible 131 relative coating chambers 10 of the first mounting block 132.Fixed part 1332 is disc, and the size of the diameter of its cross section matches with the aperture of the open holes 107 of base plate 103.Fixed part 1332 inserts in and is fixed in open holes 107, makes installation portion 1331 be positioned at outside coating chamber 110.

Shower nozzle 134 is roughly the truncated cone-shaped cavity, and the end that its diameter is larger is fixed in the fixed part 1332 of the second mounting block 133, and the end that its diameter is less has opening 1341.Shower nozzle 134 and the second mounting block 134 form a receiving space 135.When the coating raw material coating raw material in heating evaporation crucible 131 evaporated into gaseous molecular, it reached one and determines the backward upper eruption of concentration in receiving space 135, to improve the movement velocity of gaseous molecular.

Plasma emitters 15 is used for discharging plasma body.Plasma emitters 15 comprises a plurality of plasma emission pipes 151 that are parallel to each other.Each plasma emission pipe 151 two ends is fixed on the two opposite sides plate 105 of coating chamber 10 respectively.The spacing of two plasma emission pipes 151 of arbitrary neighborhood equates.A plurality of plasma emission pipes 151 are positioned at same plane, and this plane is parallel with film-coated part placement plate 11.Therefore, each on each plasma emission pipe 151 is put to the vertical range of film-coated part placement plate 11 equal.Plasma emission pipe 151 is the pipe of hollow, and its inside offers air slot 153 vertically.Also offer a plurality of venting holes 155 that communicate with air slot 153 on plasma emission pipe 151.Film coating apparatus 100 also comprises the compressed air source unit (not shown) that is connected with a plurality of plasma emission pipes 151, this compressed air source unit can be filled with gas in a plurality of plasma emission pipes 151, and make this gas from air slot 153 in venting hole 155 enters coating chamber 10.This gas both can be rare gas element, was also reactant gases, also can be the mixture of rare gas element and reactant gases.Plasma emission pipe 151 consists of electro-conductive material, is preferably stainless steel.Film coating apparatus 100 also comprises the supply unit (not shown) that is connected with a plurality of plasma emission pipes 151.This supply unit can apply voltage to a plurality of plasma emission pipes 151.In present embodiment, this supply unit applies a voltage that is enough to ionize this rare gas element between adjacent two plasma body transmitting tubes.

See also Fig. 4, it is the using method schema of the film coating apparatus 100 of embodiment of the present invention, and it comprises the following steps:

Step S101, be filled with a rare gas element in coating chamber 10.In present embodiment, this rare gas element is argon gas.The mode that is filled with this rare gas element is to be filled with rare gas element by the external air source device in a plurality of plasma emission pipes 151, and make this rare gas element from air slot 153 in venting hole 155 enters coating chamber 10.Be appreciated that this rare gas element also can enter in coating chamber 10 by other intake ducting that is connected with this coating chamber 10.

Step S102, apply a voltage by this supply unit to a plurality of plasma emission pipes 151 of this plasma body projector 15, makes the argon gas that is positioned at plasma emission pipe 151 near zones be ionized to argon plasma.

Step S103, heating is positioned at the coating raw material of evaporation coating device 13 and forms the molecule of gaseous state and towards plasma emitters 15 directions, move.Can adopt these coating raw materials of instrument heating evaporation such as electron beam gun, then make shower nozzle 134 ejections of the molecule of gaseous state from evaporation coating device 13, and towards plasma emitters 15 motions.In present embodiment, this coating raw material is titanium oxide.

Near the rear plated film ion that generates of argon plasma collision that step S104, the molecule of this gaseous state are with being positioned at plasma emission pipe 151.This plated film ion can be dispersed in the surface of plasma emission pipe 151.In present embodiment, this plated film ion is titanium ion.

Step S105, this plated film ion continue from plasma emission pipe 151 surfaces to place plate 11 motions towards film-coated part, and finally are deposited on the surperficial plated film that forms of film-coated part placement plate 11.In present embodiment, this plated film is titanium.

Because 151 of a plurality of plasma emission pipes are parallel with film-coated part placement plate 11 in plane, therefore, each on each plasma emission pipe 151 is put to the vertical range of film-coated part placement plate 11 equal.Thus, from the rear arrival film-coated part of distance that the titanium ion flight on plasma emission pipe 151 surfaces is almost identical, place plate 11 surfaces, formed coating film thickness is comparatively even, and quality product is better.In addition,, by adjusting the height of evaporation crucible 131 relative coating chambers 10, also can control the vaporator rate of coating raw material, further improve the physical properties of plated film.

After being appreciated that step S104, can be filled with reactant gases in a plurality of plasma emission pipes 151 by the external air source device, and make this reactant gases from air slot 153 in venting hole 155 enters coating chamber 10.This reactant gases can be oxygen.After near the oxygen argon plasma with being positioned at plasma emission pipe 151 contacts, can dissociate into oxonium ion, and with titanium ion reaction generation titanium oxide gaseous molecular, be deposited on film-coated part placement plate 11 surface formation plated films.

In addition, those skilled in the art can also do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.

Claims

1. film coating apparatus, comprise coating chamber, the film-coated part that is installed in this coating chamber is placed plate, evaporation coating device, this evaporation coating device and this film-coated part are placed plate and are oppositely arranged, its improvement is: it is a flat board that this film-coated part is placed plate, this film coating apparatus also comprises to be located in this coating chamber, and the plasma emitters between this evaporation coating device and this film-coated part placement plate, this plasma body projector comprises and being parallel to each other and coplanar a plurality of plasma emission pipes be used to discharging plasma body, this formed plane of a plurality of plasma emission pipes is parallel with this film-coated part placement plate.

2. film coating apparatus as claimed in claim 1 is characterized in that: the spacing of two plasma emission pipes of arbitrary neighborhood equates.

3. film coating apparatus as claimed in claim 1, it is characterized in that: be filled with rare gas element in this coating chamber, this film coating apparatus also comprises with these many plasma emission pipes and being connected, and can apply the supply unit of the voltage that is enough to ionize this rare gas element between adjacent two plasma emission pipes.

4. film coating apparatus as claimed in claim 3, it is characterized in that: this plasma body transmitting tube consists of electro-conductive material.

5. film coating apparatus as claimed in claim 3, it is characterized in that: this plasma body transmitting tube is hollow structure, this plasma body transmitting tube surface offers a plurality of venting holes, and this rare gas element is filled with in this plasma body transmitting tube and from the venting hole of this plasma body transmitting tube, enters this coating chamber.

6. film coating apparatus as claimed in claim 1, it is characterized in that: this evaporation coating device comprises evaporation crucible, the first mounting block and the second mounting block, this evaporation crucible is fixed in this first mounting block, this second mounting block is fixed in coating chamber, this first mounting block coordinates by screw thread rotationally with this second mounting block, to adjust this evaporation crucible position of this coating chamber relatively.

7. film coating apparatus as claimed in claim 6, it is characterized in that: this evaporation coating device also comprises the shower nozzle that is arranged on the evaporation crucible, this shower nozzle is the truncated cone-shaped cavity, the larger end of this shower nozzle diameter is fixed in this second mounting block, the less end of diameter has opening, from the evaporation gas of evaporation crucible from this opening towards this plasma body Transmitter side to ejection.