CN115125522A

CN115125522A - Film coating system

Info

Publication number: CN115125522A
Application number: CN202210905470.7A
Authority: CN
Inventors: 邓必龙; 郑利勇; 张向东
Original assignee: Dragon Scale Shenzhen New Material Technology Co ltd
Current assignee: Dragon Scale Shenzhen New Material Technology Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2022-09-30

Abstract

The invention relates to the technical field of PECVD nano waterproof coating, and particularly discloses a coating system which comprises a process chamber, a radio-frequency electrode, a material frame and a material frame, wherein the material frame comprises a frame body and a first mesh plate, the first mesh plate is arranged at the periphery of the frame body, a product is placed in a clamping groove on the frame body, an electric field space formed between the radio-frequency electrode and the inner wall of a grounded process chamber after being connected with a power supply can excite a precursor to form plasma, the plasma is diffused in the inner space of the process chamber and is diffused to the position of the product through the first mesh plate of the material frame, the plasma is prevented from directly impacting the product due to the arrangement of the first mesh plate, meanwhile, the first mesh plate can play a role of uniform flow, the plasma concentration near the product at each position on the frame body is uniform, and the film forming rate of the product at each position is close, the thickness of the formed film is consistent, and the color difference of the surface of the product after film coating is small.

Description

Film coating system

Technical Field

The invention relates to the technical field of PECVD nano waterproof coating, in particular to a coating system.

Background

In the process of carrying out PECVD nanometer waterproof coating on products by using the existing coating system, because the concentration distribution of plasmas formed by exciting precursors in a space is uneven, the concentration of the plasmas around the products positioned at the edge position is higher than that of the plasmas around the products positioned at the middle position, and in addition, the impact force of the plasmas on the products positioned at the edge position is larger than that of the products positioned at the middle position, so that the film forming thickness and the film forming rate of the products positioned at the edge position are higher than those of the products positioned at the middle position, larger film thickness difference values among the products positioned at different positions are caused, and larger color difference exists among the products treated in the same batch, and the product quality is poor.

Therefore, a coating system is needed to solve the above problems.

Disclosure of Invention

The invention aims to provide a coating system, which has the advantages that the consistency of the film forming thickness and the film forming rate of a product in a material frame is higher, and the color difference of the surface of the product at different positions in the material frame after film forming is smaller.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention provides a coating system, comprising:

the technical scheme includes that the plasma processing device comprises a process cavity, wherein a radio frequency electrode, a material frame and a material frame are arranged in the process cavity, the material frame is arranged on the material frame and comprises a frame body and a first mesh plate, the first mesh plate is arranged on the periphery of the frame body, a plurality of clamping grooves for placing products are arranged on the frame body, one product is placed in each clamping groove, the radio frequency electrode is arranged between the material frame and the inner wall of the process cavity, an electric field space is formed between the radio frequency electrode and the inner wall of the process cavity, and a plasma diffusion space is formed inside the process cavity.

Optionally, the framework includes bottom plate, fixed frame and stand, the stand is fixed on the bottom plate, fixed frame is fixed on the stand, be equipped with a plurality of places on the fixed frame the product the draw-in groove, the product is placed fixed frame in the draw-in groove.

Optionally, the first mesh plate is arranged around the bottom plate and is fixedly connected with the bottom plate.

Optionally, the meshes of the first mesh plate are square holes, and the size of the square holes of the first mesh plate is 0.5mm × 0.5 mm-30 mm × 30 mm.

Optionally, the base plate and the fixing frame are square or circular.

Optionally, the material frame includes a second mesh plate, and the second mesh plate is arranged above the frame body and connected to the edge of the first mesh plate.

Optionally, the meshes of the second mesh plate are square holes, and the size of the square holes of the second mesh plate is 0.5mm × 0.5 mm-30 mm × 30 mm.

Optionally, a uniform flow screen plate is arranged between the radio-frequency electrode and the material frame, a square hole is arranged on the uniform flow screen plate, the size of the square hole on the uniform flow screen plate is 0.5mm × 0.5 mm-50 mm × 50mm, and the uniform flow screen plate is fixed on the process chamber.

Optionally, a rotating platform and a first driving device are arranged in the process chamber, the first driving device is in driving connection with the rotating platform, the first driving device can drive the rotating platform to rotate, and the material frame is arranged on the rotating platform.

Optionally, a rotating seat and a second driving device are arranged on the rotating platform, the second driving device is in driving connection with the rotating seat, the second driving device can drive the rotating seat to rotate, and the material frame is arranged on the rotating seat.

The invention has the beneficial effects that:

the invention provides a film coating system, which comprises a process chamber, wherein a radio-frequency electrode, a material frame and a material frame are arranged in the process chamber, the radio-frequency electrode is arranged between the inner wall of the process chamber and the material frame, the material frame is arranged on the material frame, the material frame comprises a frame body and a first mesh plate, the first mesh plate is arranged at the periphery of the frame body, a product is placed in a clamping groove on the frame body, an electric field space formed between the radio-frequency electrode and the inner wall of the process chamber can excite a precursor to form plasma, the plasma is diffused into a plasma diffusion space where the material frame is located and is diffused to the surface of the product through the first mesh plate of the material frame, due to the arrangement of the first mesh plate, the plasma is prevented from directly impacting the surface of the product, meanwhile, the first mesh plate can play a role of uniform flow, so that the plasma concentration near the surface of the product at each position on the frame body is uniform, therefore, the film forming thickness of the products at each position is consistent, the film forming speed is similar, and the color difference of the coated products is small.

Drawings

Fig. 1 is a schematic structural diagram of a coating system according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a frame and a product provided in the first embodiment of the present invention;

fig. 3 is a first schematic structural diagram of a material frame according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a material frame provided in the first embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a coating system provided in a second embodiment of the present invention;

fig. 6 is a schematic structural diagram of a frame and a product provided in the second embodiment of the present invention;

fig. 7 is a first schematic structural view of a material frame provided in the second embodiment of the present invention;

fig. 8 is a second schematic structural diagram of the material frame provided in the second embodiment of the present invention.

In the figure:

100. a process chamber; 110. a radio frequency electrode; 1101. a plasma diffusion space; 1102. an electric field space; 120. rotating the platform; 130. a rotating base; 140. a material frame; 200. material frame; 210. a base plate; 220. a fixing frame; 230. a column; 240. a first mesh plate; 250. a second mesh plate; 300. a flow uniformizing screen plate; 400. and (5) producing the product.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

Example one

As shown in fig. 1, the embodiment provides a coating system, which includes a process chamber 100, a material frame 140, a material frame 200, and an rf electrode 110 are disposed in the process chamber 100, the process chamber 100 is connected to a ground of a power supply, the rf electrode 110 is connected to an output end of the power supply, the rf electrode 110 is disposed between the material frame 140 and an inner wall of the process chamber 100, the material frame 200 is disposed on the material frame 140, the material frame 200 includes a frame body and a first mesh plate 240, the first mesh plate 240 is disposed around the frame body, a plurality of slots for holding products 400 are disposed on the frame body, each slot is capable of holding one product 400, an electric field space 1102 is formed between the rf electrode 110 and the inner wall of the process chamber 100, the rf electrode can excite a precursor to form a plasma through the electric field space after being powered on, a plasma diffusion space 1101 is formed inside the process chamber 100, the plasma formed in the electric field space 1102 can diffuse into the plasma diffusion space 1101, the plasma formed in the electric field space 1102 is prevented from directly impacting the surface of the product 400 arranged close to the edge of the frame body due to the arrangement of the first mesh plate 240, the diffusion speed of the plasma in the plasma diffusion space 1101 is alleviated, and the plasma can be homogenized through a large number of meshes arranged on the first mesh plate 240, so that the plasma concentration difference of the surface of the product 400 at each position on the frame body of the material frame 200 is small, the film forming speed difference of the surface of the product 400 at each position is small, the film forming thickness is uniform, the color difference of the surface of the product 400 is small after film coating is completed, the product quality is good, and the material frame 200 is simple in structure, easy to process and low in cost.

Referring to fig. 2, the material frame 200 in this embodiment is a square material frame 200, a frame body thereof includes a bottom plate 210, a fixing frame 220 and uprights 230, the bottom plate 210 and the fixing frame 220 are both square, the uprights 230 and the fixing frame 220 are both provided with a plurality of parts, the uprights 230 are spaced at the upper end face of the bottom plate 210, the fixing frames 220 are spaced in the height direction of the uprights 230, each fixing frame 220 is provided with a plurality of slots for placing the products 400, the slots on the fixing frames 220 are in one-to-one correspondence, the products 400 are sequentially inserted into the slots in one-to-one correspondence on the fixing frames 220 in the height direction along the uprights 230, thereby ensuring good fixation of the products 400, gaps are formed among the products 400, and plasma can smoothly diffuse to the surfaces of the products 400.

Further, referring to fig. 3, the first mesh plate 240 is arranged according to the shape of the material frame 200, the first mesh plate 240 may be integrally formed, or may be formed by splicing a plurality of first mesh plates 240, and the first mesh plate 240 is fixedly connected to the bottom plate 210, so that the four first mesh plates 240 can be arranged around the bottom plate 210 to surround the product 400, thereby achieving a good effect of mitigating plasma impact and a uniform flow.

In some embodiments, the mesh holes of the first mesh plate 240 may be square holes, and the size of the square holes of the first mesh plate 240 is 0.5mm × 0.5mm to 30mm × 30 mm. When the mesh size of the first mesh plate 240 is too small, it is not favorable for the diffusion of plasma, resulting in a thin film thickness of the surface of the product 400, and when the mesh size of the first mesh plate 240 is too large, it is not favorable for mitigating the impact of plasma, and the effect of improving the color difference of the product 400 after film formation is not significant, so that the mesh size of the first mesh plate 240 is set to be optimal within the above range. Illustratively, the mesh size of the first mesh plate 240 may be 0.5mm × 0.5mm, 1.0mm × 1.0mm, 2.0mm × 2.0mm, 5mm × 5mm, 10mm × 10mm, 20mm × 20mm, or 30mm × 30mm, etc., which will not be described herein again.

Of course, in other embodiments, the meshes of the first mesh plate 240 may be circular holes with a diameter of 0.5mm to 30mm, which is not listed here.

Meanwhile, the mesh holes of the first mesh plate 240 may be formed in other shapes, such as oval holes, besides square holes and circular holes, which are not listed here. In addition, the meshes can be arranged into uniformly distributed meshes, and the size or the distance between holes can be changed according to a certain rule.

As an alternative, referring to fig. 4, in some embodiments, the material frame 200 further includes a second mesh plate 250, and the second mesh plate 250 is disposed above the frame body and is connected to the edges of the four first mesh plates 240. Through the arrangement of the second mesh plate 250, the plasma in the space above the frame body can be uniformly flowed, the plasma concentration on the surface of the product 400 at each position in the frame body is more uniform, the consistency of film formation among products 400 in the same batch is good, and the color difference of the product 400 after film formation is small.

The meshes of the second mesh plate 250 can be square holes, and the square holes of the second mesh plate 250 are also 0.5mm × 0.5 mm-30 mm × 30mm in size, so that the processing is convenient due to the fact that the size of the square holes is consistent with that of the meshes of the first mesh plate 240. Illustratively, the mesh size of the second mesh plate 250 may be 0.5mm × 0.5mm, 1.0mm × 1.0mm, 2.0mm × 2.0mm, 5mm × 5mm, 10mm × 10mm, 20mm × 20mm, or 30mm × 30mm, etc., which will not be described herein again.

Of course, in other embodiments, the meshes of the second mesh plate 250 may be circular holes with a diameter of 0.5mm to 30mm, which is not listed here.

With continued reference to fig. 1, a flow-equalizing screen 300 is further disposed between the rf electrode 110 and the frame 140 in the present embodiment, and the flow-equalizing screen 300 is fixed on the process chamber 100. Through the arrangement of the flow-equalizing mesh plate 300, the impact of the plasma on the product 400 can be relieved, the diffusion speed of the plasma in the plasma diffusion space 1101 is relieved, and through a large number of meshes arranged on the flow-equalizing mesh plate 300, the flow-equalizing mesh plate can also play a role in equalizing the plasma, so that the plasma concentration difference of the surface of the product 400 at each position on the frame body of the material frame 200 is small. The shape of the mesh holes arranged on the uniform flow mesh plate 300 may be square, circular, or other shapes, which is not limited in this embodiment. Optionally, in some embodiments, the size of the square hole on the uniform flow screen 300 is 0.5mm × 0.5mm to 50mm × 50mm, and the specific size may be set according to actual situations, which is not described herein again. In other embodiments, the diameter of the circular hole on the uniform flow screen 300 is 0.5mm to 50mm, and the specific size can be set according to actual situations, which is not described herein again. In addition, the specific arrangement rule of the meshes on the uniform flow mesh plate 300 is not limited in this example.

Example two

The present embodiment further provides a coating system, referring to fig. 5 to 8, which is different from the coating system of the first embodiment in that: the material frame 200 in this embodiment is a circular material frame, and the bottom plate 210 and the fixing frame 220 are both circular. Of course, in some embodiments, the bottom plate 210 and the fixing frame 220 may also be provided in an approximately circular shape surrounded by circular arcs and straight lines.

Upright 230 and fixed frame 220 all set up a plurality ofly, a plurality of uprights 230 set up at the up end interval of bottom plate 210, a plurality of fixed frames 220 interval setting on the direction of height of upright 230, be equipped with a plurality of draw-in grooves of placing product 400 on every fixed frame 220, one-to-one between a plurality of draw-in grooves on a plurality of fixed frames 220, insert the draw-in groove of the one-to-one on a plurality of fixed frames 220 in proper order along the direction of height product 400 of upright 230, thereby guarantee that product 400's is fixed good, all have the clearance between a plurality of products 400, can make plasma smoothly through diffusion to product 400 surface.

Further, referring to fig. 7, the first mesh plate 240 is arranged according to the shape of the material frame, the first mesh plate 240 may be integrally formed, or may be formed by assembling a plurality of first mesh plates, and the first mesh plates 240 are all fixedly connected to the bottom plate 210, so that the four first mesh plates 240 can be arranged around the bottom plate 210 to surround the product 400, thereby achieving a good effect of mitigating plasma impact and a uniform flow effect.

Referring to fig. 8, the material frame 200 further includes a second mesh plate 250, the shape of the second mesh plate 250 is the same as that of the bottom plate 210, and the second mesh plate 250 is disposed above the frame body and connected to the edge of the first mesh plate 240. Through the arrangement of the second mesh plate 250, the plasma in the space above the frame body can be uniformly flowed, the plasma concentration on the surface of the product 400 at each position in the frame body is more uniform, the consistency of film formation among products 400 in the same batch is good, and the color difference of the product 400 after film formation is small.

With continued reference to fig. 5, a rotating platform 120 and a first driving device are further disposed in the process chamber 100, the first driving device is in driving connection with the rotating platform 120, the first driving device can drive the rotating platform 120 to rotate, and the material frame 140 is disposed on the rotating platform 120. The plasma can be driven to flow by the arrangement of the rotary platform 120, so that the plasma can conveniently enter the first mesh plate 240, and a coating film is formed on the surface of the product 400. The material frames 200 are provided with multiple groups, multiple groups of material frames 140 can be driven to rotate simultaneously through the rotary platform 120, each material frame 140 is arranged into multiple layers, each layer of the material frame 140 is provided with one material frame 200, and the multiple material frames 200 are separated through the material frame 140, so that the coating can be performed on more products 400 once, and the coating efficiency of the products 400 is improved.

More preferably, the rotating platform 120 in this embodiment is provided with a rotating base 130 and a second driving device, the second driving device is in driving connection with the rotating base 130, the second driving device can drive the rotating base 130 to rotate, each rotating base 130 is provided with a material frame 140, the plurality of material frames 140 are relatively independently arranged, and on the basis that the rotating platform 120 drives the plurality of material frames 140 to synchronously rotate, the rotating base 130 can respectively drive each material frame 140 to rotate, so that the concentration distribution of the plasma in the plasma diffusion space 1101 is more uniform.

The remaining structure in this embodiment is the same as the scheme in the first embodiment, and is not described here again.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A coating system, comprising:

the plasma processing device comprises a process chamber (100), wherein a radio frequency electrode (110), a material frame (200) and a material frame (140) are arranged in the process chamber (100), the material frame (200) is arranged on the material frame (140), the material frame (200) comprises a frame body and a first mesh plate (240), the first mesh plate (240) is arranged on the periphery of the frame body, a plurality of clamping grooves for placing products (400) are formed in the frame body, one product (400) is placed in each clamping groove, the radio frequency electrode (110) is arranged between the material frame (140) and the inner wall of the process chamber (100), an electric field space (1102) is formed between the radio frequency electrode (110) and the inner wall of the process chamber (100), and a plasma diffusion space (1101) is formed inside the process chamber (100).

2. The plating system of claim 1, wherein the frame comprises a bottom plate (210), a fixing frame (220) and a column (230), the column (230) is fixed on the bottom plate (210), the fixing frame (220) is fixed on the column (230), the fixing frame (220) is provided with a plurality of slots for placing the products (400), and the products (400) are placed in the slots of the fixing frame (220).

3. The plating system according to claim 2, wherein the first mesh plate (240) is disposed around the bottom plate (210) and is fixedly connected to the bottom plate (210).

4. The plating system according to claim 3, wherein the mesh openings of the first mesh plate (240) are square openings, and the size of the square openings of the first mesh plate (240) is 0.5mm by 0.5mm to 30mm by 30 mm.

5. The coating system according to claim 2, wherein the base plate (210) and the fixing frame (220) are square or circular.

6. The plating system according to any one of claims 1 to 5, wherein the material frame (200) comprises a second mesh plate (250), and the second mesh plate (250) is disposed above the frame body and connected to an edge of the first mesh plate (240).

7. The plating system according to claim 6, wherein the mesh openings of the second mesh plate (250) are square openings, and the size of the square openings of the second mesh plate (250) is 0.5mm by 0.5mm to 30mm by 30 mm.

8. The coating system according to claim 1, wherein a flow-homogenizing screen (300) is disposed between the radio frequency electrode (110) and the material frame (140), square holes are disposed on the flow-homogenizing screen (300), the size of the square holes on the flow-homogenizing screen (300) is 0.5mm x 0.5mm to 50mm x 50mm, and the flow-homogenizing screen (300) is fixed on the process chamber (100).

9. The coating system according to claim 1, wherein a rotary platform (120) and a first driving device are disposed in the process chamber (100), the first driving device is drivingly connected to the rotary platform (120), the first driving device can drive the rotary platform (120) to rotate, and the material frame (140) is disposed on the rotary platform (120).

10. The coating system according to claim 9, wherein the rotary platform (120) is provided with a rotary base (130) and a second driving device, the second driving device is in driving connection with the rotary base (130), the second driving device can drive the rotary base (130) to rotate, and the material frame (140) is disposed on the rotary base (130).