WO2021239030A1 - 摄像模组及电子设备 - Google Patents

摄像模组及电子设备 Download PDF

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Publication number
WO2021239030A1
WO2021239030A1 PCT/CN2021/096224 CN2021096224W WO2021239030A1 WO 2021239030 A1 WO2021239030 A1 WO 2021239030A1 CN 2021096224 W CN2021096224 W CN 2021096224W WO 2021239030 A1 WO2021239030 A1 WO 2021239030A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive chip
camera module
substrate
lens
light
Prior art date
Application number
PCT/CN2021/096224
Other languages
English (en)
French (fr)
Inventor
徐波
彭士玮
高峰
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP21813567.1A priority Critical patent/EP4161053A4/en
Priority to KR1020227044705A priority patent/KR20230014729A/ko
Priority to JP2022571833A priority patent/JP2023526124A/ja
Publication of WO2021239030A1 publication Critical patent/WO2021239030A1/zh
Priority to US17/994,057 priority patent/US20230093281A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the technical field of communication equipment, and in particular to a camera module and electronic equipment.
  • a larger size and more complicated lens can be used, so that most of the light can be refracted on the photosensitive chip of the camera module through the lens.
  • the photosensitive chip of the camera module is usually a planar structure, it is easy to cause image distortion in the process of collecting images with a planar structure of the photosensitive chip, which makes the imaging easily distorted; at the same time, it is difficult to process lenses with complex shapes. Therefore, it is not conducive to the cost control of the electronic device, and the larger-sized lens is also not conducive to the miniaturization of the electronic device.
  • the present application discloses a camera module and an electronic device, which can solve the problem of poor imaging quality of the camera module of the current electronic device.
  • an embodiment of the present application discloses a camera module, including:
  • a lens, the lens is arranged on the bracket;
  • a substrate, the substrate is connected to the support;
  • the photosensitive chip module, the photosensitive chip module is arranged on the substrate, and the photosensitive chip module is electrically connected to the substrate, the photosensitive chip module is arranged opposite to the lens, the photosensitive chip module It has a light-receiving surface facing the lens, the light-receiving surface is a concave surface, and the light-receiving surface is formed by splicing a plurality of protrusions distributed in an array.
  • an embodiment of the present application discloses an electronic device, and the disclosed electronic device includes the aforementioned camera module.
  • the distance between the central part of the light receiving surface and the lens and the distance between the outer part of the light receiving surface and the lens are relatively small, it is possible to reduce the incidence of oblique light entering the outer part.
  • the optical path makes the optical path difference between the central part and the outer part relatively small, which can effectively reduce the distortion of imaging.
  • the light-receiving surface enables most of the light to be refracted on the photosensitive chip module through the lens to facilitate the miniaturization of the lens.
  • the light-receiving surface formed by the splicing of a plurality of protrusions distributed in the array can gather the light collected by the lens again, thereby reducing the photosensitive area required by the photosensitive chip module, which is conducive to the miniaturization design of the camera module.
  • FIG. 1 is a schematic structural diagram of a camera module disclosed in an embodiment of the application
  • FIG. 2 is a schematic structural diagram of a camera module disclosed in another embodiment of the application.
  • FIG. 3 is a schematic diagram of a part of the structure of a camera module disclosed in an embodiment of the application;
  • Fig. 4 is a partial enlarged schematic diagram of the part of the dashed frame in Fig. 3;
  • FIG. 5 is a schematic diagram of a part of the structure of a camera module disclosed in another embodiment of the application.
  • FIG. 6 is a partial enlarged schematic diagram of the part in the dashed frame in FIG. 5.
  • 400-photosensitive chip module 410-light-receiving surface, 411-bumps, 420-chip assembly, 421-photosensitive chip, 422-microconvex lens array, 430-light collector, 440-connection bump, 450-connection line ;
  • an embodiment of the present application discloses a camera module.
  • the disclosed camera module can be applied to electronic equipment.
  • the camera module includes a bracket 100, a lens 200, a substrate 300, and a photosensitive chip module 400.
  • the bracket 100 can provide an installation position for other components of the camera module.
  • the bracket 100 can be provided with an accommodation space, and other components of the camera module can be arranged in the accommodation space to make the structure of the camera module more compact.
  • the lens 200 is disposed on the bracket 100 so that the lens 200 is supported by the bracket 100.
  • the lens 200 can gather light so that the photosensitive chip module 400 in the camera module can obtain an image by sensing the light passing through the lens 200.
  • the substrate 300 is connected to the support 100.
  • the substrate 300 is used to carry components such as the photosensitive chip module 400.
  • the photosensitive chip module 400 is disposed on the substrate 300, and the photosensitive chip module 400 is electrically connected to the substrate 300.
  • the photosensitive chip module 400 can be controlled by the substrate 300.
  • the substrate 300 may be a PCB (Printed Circuit Board, printed circuit board), and the substrate 300 may also be a rigid-flex board, which is not limited in the embodiment of the present application.
  • the photosensitive chip module 400 is arranged opposite to the lens 200, so that the lens 200 can gather light onto the photosensitive chip module 400, and finally can make the photosensitive chip module 400 photosensitive and image.
  • the photosensitive chip module 400 has a light-receiving surface 410 facing the lens 200, the light-receiving surface 410 is a concave surface, and the light-receiving surface 410 is formed by splicing a plurality of protrusions 411 distributed in an array.
  • the light-receiving surface 410 is recessed in a direction away from the lens 200, so that the distance between the center portion of the light-receiving surface 410 and the lens 200 and the distance between the outer portion of the light-receiving surface 410 and the lens 200 are relatively small, and
  • the plurality of protrusions 411 refract the light to achieve the collimation of the light, so that the light can propagate in the direction perpendicular to the photosensitive surface in the photosensitive chip module 400.
  • the central part of the light-receiving surface 410 is arranged opposite to the lens 200, the optical path of the light entering the central part through the lens 200 is L1, and the optical path of the light entering the outer part through the lens 200 is L.
  • the photosensitive chip module 400 When the side surface facing the lens 200 is flat, the distance between the lens 200 and the central part is smaller than the distance between the lens 200 and the outer part, which results in that the optical path of the light entering the outer part is greater than that of the light entering the central part. In the end, the imaging distortion will be more serious.
  • L2 can be reduced so that the difference between L2 and L1 is small.
  • the arrow indicates the direction of light emission.
  • the oblique light emission can be reduced.
  • the optical path of the outer part makes the difference between the central part and the outer part smaller, which can effectively reduce the distortion of imaging.
  • the light-receiving surface 410 enables most of the light to be refracted on the photosensitive chip module 400 through the lens 200. In order to facilitate the miniaturization of the lens 200.
  • the light-receiving surface 410 formed by the splicing of a plurality of protrusions 411 distributed in an array can gather the light collected by the lens 200 again, thereby reducing the photosensitive area required by the photosensitive chip module 400, thereby facilitating the miniaturization of the camera module design.
  • the photosensitive chip module 400 may include a chip assembly 420 and a light collecting member 430.
  • the chip assembly 420 may be disposed in The substrate 300 can be electrically connected to the substrate 300. In this case, not only the chip assembly 420 can be supported by the substrate 300, but also the chip assembly 420 can be controlled by the substrate 300.
  • the light collecting member 430 may be disposed on the chip assembly 420, and the surface of the light collecting member 430 facing the lens 200 may be the light receiving surface 410.
  • This method can not only effectively reduce the imaging distortion of the camera module, but also, because the light receiving surface 410 is provided on the light collecting member 430, it can also avoid setting the light receiving surface 410 on the chip assembly 420, which makes the cost of the camera module too high. At the same time, this method can also ensure the integrity of the chip assembly 420.
  • the light-collecting member 430 can be an optical glue.
  • the optical glue has the characteristics of colorless and transparent, high light transmittance, etc., so that light can be irradiated to the chip assembly 420 through the light-collecting member 430; and the collection formed by the optical glue
  • the light component 430 has excellent bonding performance, so that the whole formed by the light collection component 430 and the chip assembly 420 can meet the requirements of the light path design, so that the imaging effect of the chip assembly 420 can be maintained.
  • the optical glue can be a natural resin optical glue or a synthetic resin optical glue, which is not limited in the embodiments of the present application.
  • the light collecting member 430 may be a molded part formed by pressing.
  • an optical glue can be dispensed on the surface of the chip assembly 420 facing the lens 200, and then molded by a mold, so that the optical glue can form the required light collector 430.
  • This method not only facilitates the molding of the light collecting member 430, but also enables the light collecting member 430 to be better attached to the chip assembly 420, so that the whole formed by the light collecting member 430 and the chip assembly 420 can better meet the optical path design. Therefore, the imaging effect of the chip assembly 420 can be maintained.
  • the photosensitive chip module 400 may include a chip assembly 420, and the chip assembly 420 may include a photosensitive chip 421 and a micro-convex lens array 422.
  • the photosensitive chip 421 is a device that converts optical signals into electrical signals.
  • the photosensitive chip 421 can be disposed on the substrate 300 and can be electrically connected to the substrate 300 so that the substrate 300 can carry and control the photosensitive chip 421, and the photosensitive chip 421 can It is a CCD (Charge-coupled Device) photosensitive chip or a CMOS (complementary Matal Oxide Semiconductor, complementary metal oxide semiconductor) photosensitive chip.
  • CCD Charge-coupled Device
  • CMOS complementary Matal Oxide Semiconductor, complementary metal oxide semiconductor
  • the micro-convex lens array 422 can be disposed on the photosensitive chip 421, and the micro-convex lens array 422 can face the lens 200.
  • the micro-convex lens array 422 can form collimated parallel rays by refracting the light, so that the light can be on the photosensitive chip 421.
  • the medium propagates in a direction perpendicular to the photosensitive surface, so that the imaging effect of the photosensitive chip 421 is better.
  • the micro-convex lens array 422 may include a plurality of micro-convex lenses, the height of the plurality of micro-convex lenses may gradually increase from the center of the photosensitive chip 421 to the periphery, and the micro-convex lenses face the end of the lens 200
  • the portion may be a protrusion 411, and the surface of a plurality of micro-convex lenses facing the lens 200 may be spliced into a light-receiving surface 410.
  • the micro-convex lens array 422 has the light-receiving surface 410, it can also avoid the cost of the camera module by providing the light-receiving surface 410 on the photosensitive chip 421.
  • this method can also ensure the integrity of the photosensitive chip 421, so that the photosensitive chip 421 can be a flat photosensitive chip.
  • the photosensitive chip 421 may be a flexible flat photosensitive chip or a rigid flat photosensitive chip, which is not limited in the embodiment of the present application.
  • the micro-convex lens array 422 can be an optical glue, so that while maintaining the imaging effect of the photosensitive chip 421, it can also facilitate the molding of the micro-convex lens array 422.
  • the micro-convex lens array 422 may be a molded part formed by a mold. In the processing process, firstly, optical glue can be applied to the surface of the photosensitive chip 421 facing the lens 200, and then molded by a mold to form the required optical glue.
  • the micro-convex lens array 422 allows the micro-convex lens array 422 to be better attached to the photosensitive chip 421.
  • the height of the protrusions 411 can be gradually increased to make the array distributed
  • the multiple protrusions 411 are spliced to form the light receiving surface 410.
  • the light-receiving surface 410 formed by the splicing of the plurality of protrusions 411 distributed in an array is equivalent to a tapered surface, so that the center portion of the light-receiving surface 410 is lower than the edge portion of the light-receiving surface 410, so that the center of the light-receiving surface 410
  • the optical path difference between the part and the edge part of the light-receiving surface 410 is smaller, and the distortion of the image can be reduced more effectively.
  • the light-receiving surface 410 of this structure enables a larger part of the light to be refracted on the photosensitive chip module 400 through the lens 200, so as to facilitate the miniaturization of the lens 200.
  • the photosensitive chip module 400 and the substrate 300 can be electrically connected in various ways.
  • the photosensitive chip module 400 may be provided with a connecting protrusion on the side facing the substrate 300.
  • Point 440 please refer to FIG. 1, the photosensitive chip module 400 may be electrically connected to the substrate 300 through the connection bumps 440.
  • the connecting bumps 440 can make the electrical connection between the photosensitive chip module 400 and the substrate 300 more stable, and the connecting bumps 440 can also make the photosensitive chip module 400 float on the photosensitive chip module 400 to prevent The substrate 300 interferes with the operation of the photosensitive chip module 400.
  • a side of the photosensitive chip module 400 facing the substrate 300 may be provided with a plurality of connecting bumps 440 distributed at intervals, and the photosensitive chip module 400 may be electrically connected to the substrate 300 through the plurality of connecting bumps 440.
  • the multiple connection bumps 440 enable the photosensitive chip module 400 to be better carried on the substrate 300, so as to better improve the mounting reliability of the photosensitive chip module 400.
  • the photosensitive chip module 400 and the substrate 300 may be electrically connected by a connecting wire 450.
  • a connecting wire 450 Please refer to FIG. 2.
  • This method can make the electrical connection between the photosensitive chip module 400 and the substrate 300 more reliable, so that the substrate 300 can better control the photosensitive chip module 400.
  • the photosensitive chip The module 400 may be directly on the surface of the substrate 300, so that the mounting stability of the photosensitive chip module 400 is better.
  • the connecting wire 450 may be a material with conductive properties such as metal, alloy, non-metal and the like.
  • the camera module when the camera module is applied to electronic equipment, the camera module needs to be electrically connected with the functional devices (such as the motherboard, battery, etc.) in the electronic equipment, so that the camera module can realize data transmission and charging. Wait for work.
  • the camera module may further include a flexible circuit board 500, and the flexible circuit board 500 may be electrically connected to the substrate 300, so that the camera module can be connected to functional devices in the electronic device through the flexible circuit board 500. Electric connection.
  • the flexible circuit board 500 can be flexibly set according to the specific space layout inside the electronic device, thereby reducing the design difficulty of the designer.
  • the flexible circuit board 500 has the advantages of high wiring density, light weight and thin thickness, and is also conducive to the light and thin design of electronic equipment.
  • the flexible circuit board 500 can be directly welded and connected with the functional devices in the electronic device.
  • this method is more complicated and inconvenient to operate when the flexible circuit board 500 needs to be replaced due to damage.
  • the camera module may further include a connector 600, and the connector 600 may be electrically connected to the flexible circuit board 500.
  • the flexible circuit board 500 may be electrically connected to functional devices in the electronic device through the connector 600.
  • the connection of the connector 600 is relatively reliable, and the flexible circuit board 500 can be detachably connected with the functional devices in the electronic device, so that the replacement operation of the flexible circuit board 500 is simple, and the maintainability of the electronic device can be improved.
  • the camera module may further include a filter 700, the filter 700 may be disposed on the support 100, and the filter 700 may be located between the lens 200 and the photosensitive chip module 400.
  • the filter 700 can filter stray light and improve the imaging quality of the camera module.
  • the filter 700 can be used to filter infrared light to reduce the influence of infrared light on the photosensitive chip module 400, thereby preventing infrared rays from generating infrared glare on the photosensitive chip module 400, thereby improving image quality.
  • the filter 700 can also filter other stray light, which is not limited in the embodiment of the present application.
  • the bracket 100 and the substrate 300 can form an installation space 110, the photosensitive chip module 400 can be located in the installation space 110, and the opening of the installation space 110 can face the lens 200.
  • This method can make the structure of the camera module more compact; at the same time, when the camera module is applied to an electronic device, this method can also prevent other components in the electronic device from affecting the operation of the photosensitive chip module 400.
  • the embodiment of the present application also discloses an electronic device.
  • the disclosed electronic device includes the camera module described in any of the above embodiments.
  • the electronic device may include a housing
  • the camera module can be arranged in the housing.
  • the housing can be provided with a light-transmitting area, and the camera module can face the light-transmitting area, so that the camera module can pass through the light-transmitting area to perform camera work.
  • the electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles and other devices.
  • the embodiments of the present application do not limit the specific types of electronic devices.

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  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
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Abstract

本申请公开一种摄像模组及电子设备，包括：支架(100)；镜头(200)，镜头(200)设置于支架(100)；基板(300)，基板(300)与支架(100)相连；感光芯片模组(400)，感光芯片模组(400)设置于基板(300)，且感光芯片模组(400)与基板(300)电连接，感光芯片模组(400)与镜头(200)相对设置，感光芯片模组(400)具有朝向镜头(200)的受光面(410)，受光面(410)为凹面，且受光面(410)由阵列分布的多个凸起(411)拼接构成。本申请还公开一种电子设备。

Description

摄像模组及电子设备
交叉引用
本发明要求在2020年05月28日提交中国专利局、申请号为202010470005.6、发明名称为“摄像模组及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请涉及通信设备技术领域，尤其涉及一种摄像模组及电子设备。
背景技术
随着电子设备的快速发展，电子设备的应用越来越广泛，诸如手机、平板电脑等电子设备在人们的工作、生活、娱乐等方面发挥着越来越多的作用。
目前，用户对电子设备的拍照效果的需求也越来越高。通常情况下，由于自然光是由多种光混合，电子设备的摄像模组在拍摄的过程中，不同波长的光线经过摄像模组的镜头折射后，由于不同光线的波长不同，不同光线在镜头上的折射率也会不同。
因此，为了将不同波长的光线校准汇聚到同一平面上，可以采用较大尺寸以及较复杂的镜头，以使大部分光线能够通过镜头折射于摄像模组的感光芯片上。但是，由于摄像模组的感光芯片通常为平面结构，在采用平面结构的感光芯片收集图像的过程中，容易导致图像失真，从而使得成像容易产生畸变；同时，复杂外形的镜头的加工难度较大，从而不利于电子设备的成本控制，较大尺寸的镜头也不利于电子设备的小型化设计。
发明内容
本申请公开一种摄像模组及电子设备，能够解决目前电子设备的摄像模组存在成像质量差的问题。
为解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例公开一种摄像模组，包括：
支架；
镜头，所述镜头设置于所述支架；
基板，所述基板与所述支架相连；
感光芯片模组，所述感光芯片模组设置于所述基板，且所述感光芯片模组与所述基板电连接，所述感光芯片模组与所述镜头相对设置，所述感光芯片模组具有朝向所述镜头的受光面，所述受光面为凹面，且所述受光面由阵列分布的多个凸起拼接构成。
第二方面，本申请实施例公开一种电子设备，所公开的电子设备包括上述的摄像模组。
本申请采用的技术方案能够达到以下有益效果：
本申请实施例公开的摄像模组中，由于受光面的中心部分与镜头之间的距离和受光面的外侧部分与镜头之间的距离相差较小，从而能够减小斜射光线射入外侧部分的光程，使得中心部分与外侧部分的光程差相差较小，可以有效降低成像的畸变，当然，受光面使得大部分光线能够通过镜头折射于感光芯片模组上，以便于镜头的小型化。同时，阵列分布的多个凸起拼接构成的受光面能够将镜头聚集的光线再次聚集，从而能够减小感光芯片模组所需的感光面积，进而有利于摄像模组的小型化设计。
附图说明
图1为本申请实施例公开的摄像模组的结构示意图；
图2为本申请另一实施例公开的摄像模组的结构示意图；
图3为本申请实施例公开的摄像模组的部分结构示意图；
图4为图3中虚线框部分的局部放大示意图；
图5为本申请另一实施例公开的摄像模组的部分结构示意图；
图6为图5中虚线框部分的局部放大示意图。
附图标记说明：
100-支架、110-安装空间；
200-镜头；
300-基板；
400-感光芯片模组、410-受光面、411-凸起、420-芯片组件、421-感光芯片、422-微凸镜阵列、430-集光件、440-连接凸点、450-连接线；
500-柔性电路板；
600-连接器；
700-滤光件。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的摄像模组进行详细地说明。
如图1所示，本申请实施例公开一种摄像模组，所公开的摄像模组可应用于电子设备，此摄像模组包括支架100、镜头200、基板300和感光芯片模 组400。
支架100能够为摄像模组的其他构件提供安装位置，支架100可以开设有容纳空间，摄像模组的其他构件可以设置于容纳空间内，以使摄像模组的结构更紧凑。
镜头200设置于支架100，从而通过支架100来支撑镜头200，镜头200能够聚集光线，以使摄像模组中的感光芯片模组400能够通过感应通过镜头200的光线获得影像。
基板300与支架100相连，基板300用于承载感光芯片模组400等元件，具体的，感光芯片模组400设置于基板300，且感光芯片模组400与基板300电连接，此种情况下，不仅通过基板300来支撑感光芯片模组400，并且通过基板300可以控制感光芯片模组400。基板300可以为PCB(Printed Circuit Board，印制电路板)，基板300也可以为软硬结合板，本申请实施例对此不做限制。
感光芯片模组400与镜头200相对设置，以便镜头200能聚集光线到感光芯片模组400上，最终能够使得感光芯片模组400感光成像。
本申请实施例中，感光芯片模组400具有朝向镜头200的受光面410，受光面410为凹面，且受光面410由阵列分布的多个凸起411拼接构成。此种情况下，受光面410沿背离镜头200的方向凹陷，以使受光面410的中心部分与镜头200之间的距离和受光面410的外侧部分与镜头200之间的距离相差较小，而且，多个凸起411通过对光线折射，从而实现光线的准直，使得光线能够在感光芯片模组400中以垂直于感光面的方向传播。
受光面410的中心部分与镜头200相对设置，透过镜头200射入中心部分的光线的光程为L1，透过镜头200射入外侧部分的光线的光程为L，在感光芯片模组400朝向镜头200的一侧表面为平面的情况下，镜头200距中心部分的距离小于镜头200距外侧部分的距离，由此导致射入外侧部分的光线的光程大于射入中心部分的光线的光程，最终导致成像畸变较为严重。
而本申请实施例中，由于外侧部分的高度较大，中心部位的高度较小，因此能够减小L2，使得L2与L1相差较小，如图3所示，箭头指光线的出射方向。
本申请实施例公开的摄像模组中，由于受光面410的中心部分与镜头200之间的距离和受光面410的外侧部分与镜头200之间的距离相差较小，从而能够减小斜射光线射入外侧部分的光程，使得中心部分与外侧部分的光程差相差较小，可以有效降低成像的畸变，当然，受光面410使得大部分光线能够通过镜头200折射于感光芯片模组400上，以便于镜头200的小型化。同时，阵列分布的多个凸起411拼接构成的受光面410能够将镜头200聚集的光线再次聚集，从而能够减小感光芯片模组400所需的感光面积，进而有利于摄像模组的小型化设计。
进一步地，本申请公开的实施例中，在一种可选的方案中，感光芯片模组400可以包括芯片组件420和集光件430，请参考图3和图4，芯片组件420可以设置于基板300，且可以与基板300电连接，此种情况下，不仅可以通过基板300来支撑芯片组件420，并且可以通过基板300来控制芯片组件420。
集光件430可以设置于芯片组件420上，集光件430朝向镜头200的表面可以为受光面410。此种方式不仅能够有效降低摄像模组成像的畸变，并且，由于受光面410开设于集光件430上，从而还能够避免在芯片组件420上开设受光面410而使得摄像模组的成本过高，与此同时，此种方式也能够保证芯片组件420的完整性。
当然，集光件430可以为光学胶件，光学胶具有无色透明、光透过率高等特点，从而有利于光线透过集光件430照射到芯片组件420上；并且，光学胶形成的集光件430具有优良胶接性能，以使集光件430与芯片组件420形成的整体能够满足光路设计要求，从而能够维持芯片组件420的成像效果。当然，光学胶可以为天然树脂光学胶，也可以为合成树脂光学胶，本申请实 施例对此不做限制。
进一步地，在集光件430为光学胶的情况下，集光件430可以为模具压制成型件。在具体的加工过程中，首先可以在芯片组件420朝向镜头200的一侧表面点光学胶，然后通过模具成型，以使光学胶形成所需要的集光件430。此种方式不仅便于集光件430的成型，还使得集光件430能够更好地贴附于芯片组件420上，以使集光件430与芯片组件420形成的整体能够更好地满足光路设计要求，从而能够维持芯片组件420的成像效果。
本申请实施例中，在另一种可选的实施例中，感光芯片模组400可以包括芯片组件420，芯片组件420可以包括感光芯片421和微凸镜阵列422，请参考图5和图6，感光芯片421是一种将光信号转换为电信号的器件，感光芯片421可以设置于基板300，且可以与基板300电连接，以使基板300可以承载且控制感光芯片421，感光芯片421可以为CCD(Charge-coupled Device电荷耦合元件)感光芯片或CMOS(complementary Matal Oxide Semiconductor，互补金属氧化物半导体)感光芯片。
微凸镜阵列422可以设置于感光芯片421上，微凸镜阵列422可以朝向镜头200，微凸镜阵列422能够通过对光线的折射，从而形成准直的平行光线，使得光线能够在感光芯片421中以垂直于感光面的方向传播，进而使得感光芯片421的成像效果更佳。
进一步地，本申请实施例中，微凸镜阵列422可以包括多个微凸镜，多个微凸镜的高度可以自感光芯片421的中心向四周逐渐增大，微凸镜朝向镜头200的端部可以为凸起411，且多个微凸镜朝向镜头200的表面可以拼接成受光面410。此种情况下，不仅能够有效降低摄像模组成像的畸变，并且，由于微凸镜阵列422上具有受光面410，从而还能够避免在感光芯片421上开设受光面410而使得摄像模组的成本过高，与此同时，此种方式也能够保证感光芯片421的完整性，以使感光芯片421可以为平面感光芯片。感光芯片421可以为柔性的平面感光芯片，也可以为刚性的平面感光芯片，本申请 实施例对此不做限制。
当然，微凸镜阵列422可以为光学胶件，从而在维持感光芯片421的成像效果的同时，还能够便于微凸镜阵列422的成型。具体的，微凸镜阵列422可以为模具压制成型件，在加工过程中，首先可以在感光芯片421朝向镜头200的一侧表面点光学胶，然后通过模具成型，以使光学胶形成所需要的微凸镜阵列422，以使微凸镜阵列422能够更好地贴附于感光芯片421上。
本申请公开的实施例中，为了更有效地降低成像的畸变，可选地，在感光芯片模组400的中心至边缘的方向上，凸起411的高度可以逐渐增大，以使阵列分布的多个凸起411拼接构成受光面410。此种情况下，阵列分布的多个凸起411所拼接构成的受光面410相当于锥形面，以使受光面410的中心部分低于受光面410的边缘部分，从而使得受光面410的中心部分与受光面410的边缘部分的光程差相差更小，进而能够更有效地降低成像的畸变。而且，此种结构的受光面410使得较大部分光线能够通过镜头200折射于感光芯片模组400上，以便于镜头200的小型化。
本申请实施例中，感光芯片模组400与基板300实现电连接的方式可以有多种，在一种可选的实施例中，感光芯片模组400朝向基板300的一侧可以设置有连接凸点440，请参考图1，感光芯片模组400可以通过连接凸点440与基板300电连接。此时，连接凸点440能够使得感光芯片模组400与基板300之间的电连接更稳定，并且，还可以通过连接凸点440使得感光芯片模组400悬空于感光芯片模组400，以防止基板300干扰感光芯片模组400的运作。
进一步地，感光芯片模组400朝向基板300的一侧可以设置有间隔分布的多个连接凸点440，感光芯片模组400可以通过多个连接凸点440与基板300电连接。此种情况下，多个连接凸点440使得感光芯片模组400能够更好地承载于基板300，以更好地提高感光芯片模组400的安装可靠性。
在另一种可选的实施例中，感光芯片模组400与基板300可以通过连接 线450电连接。请参考图2，此种方式可以使得感光芯片模组400与基板300的电连接可靠性更好，从而使得基板300能够更好地控制感光芯片模组400，同时，此种方式下，感光芯片模组400可以直接处于基板300的表面，以使感光芯片模组400的安装稳定性更好。连接线450可以是具有导电性能的金属、合金、非金属等材料。
本申请实施例中，在摄像模组应用于电子设备的情况下，摄像模组需要与电子设备中的功能器件(例如主板、电池等)电连接，以使摄像模组能够实现数据传输、充电等工作。在一种可选的实施例中，摄像模组还可以包括柔性电路板500，柔性电路板500可以与基板300电连接，以使摄像模组可以通过柔性电路板500与电子设备中的功能器件电连接。柔性电路板500能够根据电子设备内部的具体空间布局灵活设置，从而能够降低设计人员的设计难度。同时，柔性电路板500具有配线密度高、重量轻和厚度薄的优点，还有利于电子设备的轻薄化设计。
一般情况下，柔性电路板500与可以与电子设备中的功能器件直接焊接相连，但是，此种方式在柔性电路板500因损坏需要更换时操作较为复杂不便。基于此，在一种可选的实施例中，摄像模组还可以包括连接器600，连接器600可以与柔性电路板500电连接。柔性电路板500可以通过连接器600与电子设备中的功能器件电连接。连接器600的连接较为可靠，且能够使得柔性电路板500与电子设备中的功能器件实现可拆卸相连，使得柔性电路板500的更换操作简单，从而能够提高电子设备的可维护性。
本申请实施例中，摄像模组还可以包括滤光件700，滤光件700可以设置于支架100，且滤光件700可以处于镜头200与感光芯片模组400之间。滤光件700可以过滤杂光，提高摄像模组的成像质量。例如，滤光件700可以用于过滤红外光，以减少红外光对感光芯片模组400的影响，从而防止红外光线在感光芯片模组400上产生红外炫光，进而能够提高成像质量。当然，滤光件700也可以过滤其他杂光，本申请实施例对此不做限制。
本申请实施例公开的摄像模组中，支架100与基板300可以形成安装空间110，感光芯片模组400可以处于安装空间110，且安装空间110的开口可以朝向镜头200。此种方式能够使得摄像模组的结构更紧凑；与此同时，在摄像模组应用于电子设备的情况下，此种方式还能够防止电子设备中的其他构件影响感光芯片模组400的运作。
基于本申请实施例公开的摄像模组，本申请实施例还公开一种电子设备，所公开的电子设备包括上文任一实施例所述的摄像模组，具体的，电子设备可以包括壳体，摄像模组可以设置于壳体内，可选地，壳体可以开设有透光区域，摄像模组可以朝向透光区域，以使摄像模组能够透过透光区域进行摄像工作。
本申请实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等设备，本申请实施例不限制电子设备的具体种类。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (11)

  1. 一种摄像模组，包括：
    支架(100)；
    镜头(200)，所述镜头(200)设置于所述支架(100)；
    基板(300)，所述基板(300)与所述支架(100)相连；
    感光芯片模组(400)，所述感光芯片模组(400)设置于所述基板(300)，且所述感光芯片模组(400)与所述基板(300)电连接，所述感光芯片模组(400)与所述镜头(200)相对设置，所述感光芯片模组(400)具有朝向所述镜头(200)的受光面(410)，所述受光面(410)为凹面，且所述受光面(410)由阵列分布的多个凸起(411)拼接构成。
  2. 根据权利要求1所述的摄像模组，其中，所述感光芯片模组(400)包括芯片组件(420)和集光件(430)，所述芯片组件(420)设置于所述基板(300)，且与所述基板(300)电连接，所述集光件(430)设置于所述芯片组件(420)上，所述集光件(430)朝向所述镜头(200)的表面为所述受光面(410)。
  3. 根据权利要求1所述的摄像模组，其中，所述感光芯片模组(400)包括芯片组件(420)，所述芯片组件(420)包括感光芯片(421)和微凸镜阵列(422)，所述感光芯片(421)设置于所述基板(300)，且与所述基板(300)电连接，所述微凸镜阵列(422)设置于所述感光芯片(421)上，所述微凸镜阵列(422)包括多个微凸镜，多个所述微凸镜的高度自所述感光芯片(421)的中心向四周逐渐增大，所述微凸镜朝向所述镜头(200)的端部为所述凸起(411)，且多个所述微凸镜朝向所述镜头(200)的表面拼接成所述受光面(410)。
  4. 根据权利要求2所述的摄像模组，其中，所述集光件(430)为光学胶件。
  5. 根据权利要求1所述的摄像模组，其中，所述感光芯片模组(400) 朝向所述基板(300)的一侧设置有连接凸点(440)，所述感光芯片模组(400)通过所述连接凸点(440)与所述基板(300)电连接。
  6. 根据权利要求1所述的摄像模组，其中，所述感光芯片模组(400)与所述基板(300)通过连接线(450)电连接。
  7. 根据权利要求1所述的摄像模组，其中，所述摄像模组还包括柔性电路板(500)，所述柔性电路板(500)与所述基板(300)电连接。
  8. 根据权利要求7所述的摄像模组，其中，所述摄像模组还包括连接器(600)，所述连接器(600)与所述柔性电路板(500)电连接。
  9. 根据权利要求1所述的摄像模组，其中，所述摄像模组还包括滤光件(700)，所述滤光件(700)设置于所述支架(100)，且所述滤光件(700)处于所述镜头(200)与所述感光芯片模组(400)之间。
  10. 根据权利要求1所述的摄像模组，其中，所述支架(100)与所述基板(300)形成安装空间(110)，所述感光芯片模组(400)处于所述安装空间(110)，且所述安装空间(110)的开口朝向所述镜头(200)。
  11. 一种电子设备，包括权利要求1至10中任一项所述的摄像模组。
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