WO2021082841A1 - 摄像模组和电子设备 - Google Patents

摄像模组和电子设备 Download PDF

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Publication number
WO2021082841A1
WO2021082841A1 PCT/CN2020/118095 CN2020118095W WO2021082841A1 WO 2021082841 A1 WO2021082841 A1 WO 2021082841A1 CN 2020118095 W CN2020118095 W CN 2020118095W WO 2021082841 A1 WO2021082841 A1 WO 2021082841A1
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WO
WIPO (PCT)
Prior art keywords
camera module
convex
photosensitive
processor
portions
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Application number
PCT/CN2020/118095
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English (en)
French (fr)
Inventor
王强
Original Assignee
Oppo广东移动通信有限公司
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Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021082841A1 publication Critical patent/WO2021082841A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/95—Computational photography systems, e.g. light-field imaging systems
    • H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio

Definitions

  • This application relates to the field of electronic technology, in particular to a camera module and electronic equipment.
  • the electronic device can control various functions of the electronic device through its main board, such as the main board controlling the camera module to realize the camera function.
  • the embodiments of the present application provide a camera module and electronic equipment, which can improve the imaging quality of the camera module.
  • an embodiment of the present application provides a camera module, which includes:
  • a lens assembly including a plurality of interconnected convex parts
  • a plurality of photosensitive sensors the number of the photosensitive sensors is equal to the number of the convex and transparent parts, and one photosensitive sensor is used to collect images through one of the convex and transparent parts.
  • an embodiment of the present application also provides a camera module, which includes:
  • a lens assembly comprising a plurality of interconnected convex parts
  • a photosensitive sensor configured to collect images through the plurality of convex and transparent parts, the photosensitive sensor having a plurality of photosensitive regions, the number of the photosensitive regions is equal to the number of the convex and transparent parts;
  • a processor which is electrically connected to the photosensitive sensor
  • the processor is used for:
  • the multiple initial images are synthesized to obtain a synthesized image.
  • an embodiment of the present application also provides an electronic device, which includes a camera module, and the camera module includes:
  • a lens assembly comprising a plurality of mutually connected convex parts, the plurality of convex parts are arranged in a matrix;
  • a plurality of photosensitive sensors the plurality of photosensitive sensors are arranged in a matrix, the number of the photosensitive sensors is equal to the number of the convex portions, and one photosensitive sensor is used to collect data through one of the convex portions For the image, the projection of each of the convex and transparent portions at the installation position of the photosensitive sensor overlaps with one of the photosensitive sensors.
  • FIG. 1 is a block diagram of a camera module provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the structure of the lens assembly in the camera module provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a photosensitive sensor in a camera module provided by an embodiment of the application.
  • FIG. 4 is another block diagram of a camera module provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a camera module provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of another structure of the photosensitive sensor in the camera module provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of two different sizes of the photosensitive sensor corresponding to different image distances when the field of view angle of the camera module is unchanged.
  • FIG. 8 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • FIG. 1 is a block diagram of a camera module provided by an embodiment of the application.
  • the camera module 200 can take photos and videos to realize a camera function, a camera function, a face recognition function, and the like.
  • the camera module 200 may include a lens assembly 220 and a photosensitive sensor 240.
  • the photosensitive sensor 240 can collect images through the lens assembly 220 for taking pictures or video recordings.
  • FIG. 2 is a schematic structural diagram of a lens assembly in a camera module provided by an embodiment of the application.
  • the lens assembly 220 may include a plurality of convex portions 222, a plurality of connecting portions 224 and a base portion 226.
  • the base part 226 can form the basic structure of the lens assembly 220, and it can be arranged at the peripheral position of the lens assembly 220.
  • Each convex portion 222 is equivalent to a convex lens.
  • the plurality of convex portions 222 may be spaced apart from each other, for example, a connecting portion 224 is connected between every two convex portions 222, and a connecting portion 224 may be spaced between two adjacent convex portions 222.
  • two adjacent convex portions 222 may also be partially connected, for example, a part of the arc-shaped edges of two adjacent convex portions 222 are connected. All the protruding parts 222 can be arranged in a matrix, and the matrix arrangement is easy to form, which can save process.
  • the convex portions 222 can also be arranged in other ways, and the arrangement of the respective convex portions 222 can be arranged according to the actual requirements of the camera module 200.
  • each convex portion 222 may be the same or different. For example, all the convex parts 222 have the same size, another example is that some of all the convex parts 222 have the same size and some have different sizes, for example, all the convex parts 222 have different sizes.
  • each convex portion 222 may be the same or different.
  • the curvatures of all the convex parts 222 are the same, another example is that some of the curvatures of all the convex parts 222 are the same, and some of the curvatures are different, or the curvature of all the convex parts 222 are different.
  • the lens assembly 220 shown in FIG. 2 is only an example of the shape of the lens assembly 220, and does not constitute a limitation on the shape of the lens assembly 220.
  • the plurality of protruding portions 222, the plurality of connecting portions 224, and the base portion 226 may use the same material, such as a plastic material.
  • the plurality of convex portions 222, the plurality of connecting portions 224, and the base portion 226 may be integrally formed by injection molding. It can be understood that the camera module 200 generally requires a higher precision for the lens assembly 220, and molding the lens assembly 220 by injection molding using a mold can ensure the precision requirements. Moreover, the process is simple and easy to realize.
  • the lens assembly 220 can also be made of other materials, such as glass materials.
  • the lens assembly 220 can be molded by engraving. Among them, the glass material is generally heavier than the plastic material, and the process is more complicated than the lens component of the plastic material. In the actual process, the material of the lens component 220 can be selected according to the requirements.
  • the plurality of convex portions 222, the plurality of connecting portions 224, and the base portion 226 may also be molded without injection molding or engraving.
  • the lens assembly only includes a substrate with a flat plate structure and a plurality of convex portions.
  • the convex part can be adhered to the substrate with transparent glue.
  • the lens assembly formed by transparent colloid bonding has higher precision than the lens assembly formed by transparent colloid bonding.
  • the embodiment of the present application provides a novel lens assembly 220 that can meet the user's requirements for the camera module 200 in terms of appearance and performance.
  • FIG. 3 is a schematic structural diagram of a photosensitive sensor in a camera module provided by an embodiment of the application.
  • the number of photosensitive sensors 240 may be the same as the number of convex portions 222 in the lens assembly 220.
  • One photosensitive sensor 240 corresponds to one convex portion 222, that is, one photosensitive sensor 240 can collect images through one convex portion 222.
  • One photosensitive sensor 240 can collect one image through one convex portion 222, and multiple photosensitive sensors 240 can collect multiple images.
  • the photosensitive sensors 240 can be arranged in a matrix, and the matrix arrangement is easy to form. Of course, the photosensitive sensors 240 can also be arranged in other ways. The arrangement of the photosensitive sensors 240 can be arranged according to the actual requirements of the camera module 200.
  • the photosensitive sensor 240 may be arranged in the same manner as the convex portion 222, and the projection of each convex portion 222 at the installation position of the photosensitive sensor 240 overlaps with one photosensitive sensor 240, such as each convex portion 222 in the The projection of the circuit board of the camera module 200 overlaps with a photosensitive sensor 240 so that a convex portion 222 corresponds to a photosensitive sensor 240 to ensure that a photosensitive sensor 240 can collect images through a convex portion 222.
  • each photosensitive sensor 240 may be the same or different. For example, all photosensitive sensors 240 have the same size, another example is that some of all photosensitive sensors 240 have the same size and some have different sizes, or all photosensitive sensors 240 have different sizes. In some embodiments, when the size of each photosensitive sensor 240 is the same, at least a part of the plurality of convex portions 222 has a different size; when the size of each convex portion 222 is the same, at least a portion of the size of each sensor 240 is different.
  • Each photosensitive sensor 240 may be packaged in the circuit board of the camera module 200, and each photosensitive sensor 240 is not electrically connected to each other. Each photosensitive sensor 240 may be electrically connected to a processor or a processing circuit on the circuit board of the camera module 200, and the control of each photosensitive sensor 240 may be realized by the processor of the camera module 200.
  • the camera module 200 may further include a processor 260, and the processor 260 may be understood as a processing circuit of the camera module 200.
  • the processor 260 may be integrated on the circuit board of the camera module 200.
  • the processor 260 may receive a shooting instruction.
  • the shooting instruction may be an instruction for instructing the camera module 200 to take a photo, or an instruction for instructing the camera module 200 to take a picture, or it may be an instruction for instructing the camera module 200 to take a picture. Instructions for face recognition.
  • the processor 260 may control each photosensitive sensor 240 to collect images through a convex portion 222 according to the shooting instruction to obtain multiple initial images.
  • the processor 260 can control all the photosensitive sensors 240 to collect through all the convex parts 222 to obtain the same number of initial images as the photosensitive sensors 240.
  • An initial image is collected by one photosensitive sensor 240 through one convex part 222.
  • the processor 260 may synthesize the multiple initial images based on the multiple initial images to obtain a synthesized image.
  • the processor 260 may synthesize all the initial images. It is also possible to synthesize a part of all the original images, and discard a part of the original images. For example, if one or more initial images are of poor quality or certain parameters do not meet the preset requirements, they can be discarded instead of being synthesized.
  • the processor 260 may also control only a part of the photosensitive sensors 240 to collect images. Under some conditions, for example, when the image quality is not high, a part of the photosensitive sensor 240 can be used to collect images, so as to save power consumption and increase the imaging speed. For example, when the power supply for the camera module 200 is insufficient, a part of the photosensitive sensor 240 may be used for image collection.
  • the embodiment of the present application can improve the imaging quality of the camera module 200 through the matching relationship between the plurality of photosensitive sensors 240 and the plurality of convex portions 222.
  • the camera module 200 may further include a carrier 280, a flexible circuit board 210 and a connector 230.
  • the components of the camera module 200 such as the lens assembly 220, the photosensitive sensor 240, the circuit board, etc., can all be arranged on the carrier 280.
  • One end of the flexible circuit board 210 can be electrically connected to the circuit board arranged in the carrier 280, and the other end of the flexible circuit board 210 can be provided with a connector 230, and the connector 230 can be mated and connected with other connection structures.
  • the camera module has one photosensitive sensor, and the one photosensitive sensor may be divided into the same number of photosensitive areas as the convex and transparent portions.
  • FIG. 6 is a schematic diagram of another structure of the photosensitive sensor in the camera module provided by an embodiment of the application.
  • the one photosensitive sensor 240 may have a plurality of photosensitive areas 242, and the plurality of photosensitive areas 242 may be virtual areas, which may be implemented by algorithm control.
  • the number of photosensitive regions 242 may be equal to the number of convex portions 222.
  • One photosensitive area 242 can collect an image through one convex portion 222, that is, one photosensitive area 242 can be arranged corresponding to one convex portion 222.
  • the one photosensitive sensor 240 may be electrically connected to a processor of the camera module 200, such as the processor 260, and the processor 260 may control the photosensitive area 242 of the one photosensitive sensor 240 to collect images.
  • the processor 260 may receive a shooting instruction.
  • the processor 260 can control each photosensitive area 242 to collect images through a convex portion 222 according to the shooting instruction to obtain multiple initial images.
  • the processor 260 can control all the photosensitive areas 242 to collect through all the convex portions 222 to obtain the same number of initial images as the photosensitive areas 242.
  • An initial image is collected from one photosensitive area 242 through one convex portion 222.
  • the processor 260 may perform synthesis processing on the multiple initial images based on the multiple initial images to obtain a synthesized image.
  • the processor 260 may also control only a part of the photosensitive areas 242 to collect images. Under some conditions, such as when the image quality is not high, a part of the photosensitive area 242 can be used to collect images to save power consumption and increase the imaging speed. For example, when the power supply for the camera module 200 is insufficient, a part of the photosensitive area 242 may be used for image collection.
  • the embodiment of the present application can improve the imaging quality of the camera module 200 through the matching relationship between the plurality of photosensitive regions 242 and the plurality of convex portions 222.
  • the camera module generally has a certain angle of view, that is, the effective light incident angle of the camera module.
  • the image distance of the camera module and the size of the photosensitive sensor have a direct proportional relationship, that is, the larger the image distance of the camera module, the larger the size of the photosensitive sensor, and the image distance of the camera module The smaller the photosensitive sensor, the smaller the size.
  • the image distance of the camera module can be understood as the distance from the imaging position to the center of the lens assembly.
  • the field of view of the camera module is constant, if the imaging quality of the camera module is increased, the pixels of the photosensitive sensor are usually increased. As the pixels of the photosensitive sensor increase, the size of the photosensitive sensor will increase, resulting in an increase in the image distance of the camera module, which will increase the overall thickness of the camera module.
  • Figure 7 is a schematic diagram of two different sizes of photosensitive sensors corresponding to different image distances when the field of view of the camera module remains unchanged.
  • the camera module has a certain field of view FOV, and the field of view FOV is, for example, 40 degrees.
  • the photosensitive sensor of the camera module can have two sizes, such as 3mm and 6mm.
  • the camera module has an image distance v, such as 1.79 mm, and the lens component of the camera module has a certain size l, such as 50 mm. If you improve the imaging quality of the camera module, you can choose to increase the pixel points of the photosensitive sensor.
  • the size of the photosensitive sensor of the camera module is increased from 3mm to 6mm, that is, when the size of the photosensitive sensor of the camera module is 6mm, the camera module The group has an image distance V, such as 3.58 mm, and the lens component of the camera module has a certain size L, such as 100 mm.
  • V image distance
  • L lens component
  • the size of the photosensitive sensor of the camera module will increase the image distance of the camera module, and may also increase the thickness of the lens assembly. As a result, the overall thickness of the camera module increases.
  • the camera module 200 provided by the embodiment of the present application is used to improve the camera module without increasing the image distance or the thickness of the lens assembly 220 when the field of view of the camera module is constant.
  • the imaging quality of the group 200 does not additionally increase the thickness of the camera module 200.
  • a single convex portion 222 corresponds to a field of view, and the camera module 200 realizes image synthesis by using multiple convex portions 222 to achieve larger The angle of view.
  • the camera module 200 provided in the embodiments of the present application can be applied to electronic equipment, so as to reduce the limitation of the camera module 200 on the thickness of the whole machine, and provide the possibility for thin electronic equipment. At the same time, the imaging quality of the electronic device using the camera module 200 can also be improved.
  • the electronic device 20 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cell phone, a media player, or other handheld or portable electronic devices, smaller devices (such as watch devices) , Hanging devices, earphones or earpiece devices, devices embedded in glasses or other devices worn on the user’s head, or other wearable or micro devices), televisions, computer monitors that do not contain embedded computers , Game devices, navigation devices, embedded systems (such as systems in which electronic devices with displays are installed in kiosks or cars), devices that implement the functions of two or more of these devices, or other electronic devices equipment.
  • the electronic device 20 is a portable device, such as a cell phone, a media player, a tablet computer, or other portable computing device. Other configurations can be used for the electronic device 20 if necessary.
  • the example of FIG. 8 is only illustrative.
  • the electronic device 20 may include a camera module 200, a housing 400, and a display screen 600.
  • the display screen 600 may be disposed on the housing 400 to form a storage space, and the storage space may house various components of the electronic device 20 such as a camera module 200, a main board, a battery, and the like.
  • the camera module 200 can be used as the front camera of the electronic device 20.
  • the camera module 200 can be arranged between the display screen 600 and the housing 400.
  • the camera module 200 can be arranged under the display area of the display screen 600, or can be arranged at The non-display area of the display 600. It should be noted that the camera module 200 can also be used as a rear camera of the electronic device 20.
  • the display screen 600 may be a touch screen display incorporating conductive capacitive touch sensor electrode layers or other touch sensor components (for example, resistive touch sensor components, acoustic touch sensor components, force-based touch sensor components, light-based touch sensor components, etc.), or It can be a non-touch sensitive display.
  • Capacitive touch screen electrodes can be formed by indium tin oxide pads or arrays of other transparent conductive structures.
  • the display screen 600 may include a display pixel array formed by liquid crystal display (LCD) components, an electrophoretic display pixel array, a plasma display pixel array, an organic light emitting diode display pixel array, an electrowetting display pixel array, or a display based on other display technologies Pixels.
  • LCD liquid crystal display
  • electrophoretic display pixel array a plasma display pixel array
  • organic light emitting diode display pixel array a plasma display pixel array
  • electrowetting display pixel array or a display based on other display technologies Pixels.
  • a display screen cover layer such as a transparent glass layer, light-transmitting plastic, sapphire, or other transparent dielectric layer may be used to protect the display screen 600.
  • the housing 400 may be formed of plastic, glass, ceramic, fiber composite material, metal (for example, stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.
  • the housing 400 may be formed using a one-piece configuration in which some or all of the housing 400 is processed or molded into a single structure, or multiple structures (for example, an inner frame structure, a surface forming an outer housing) may be used. One or more structures, etc.) are formed.
  • Example 1 A camera module, which includes:
  • a lens assembly including a plurality of interconnected convex parts
  • a plurality of photosensitive sensors the number of the photosensitive sensors is equal to the number of the convex and transparent parts, and one photosensitive sensor is used to collect images through one of the convex and transparent parts.
  • Example 2 The camera module according to Example 1, wherein the plurality of convex transparent portions are arranged in a matrix, and the plurality of photosensitive sensors are arranged in a matrix.
  • Example 3 The camera module according to Example 2, wherein the projection of each of the convex portions at the installation position of the photosensitive sensor overlaps with one of the photosensitive sensors.
  • Example 4 The camera module according to Example 1, wherein the lens assembly includes a plurality of connecting parts, and the plurality of convex parts are fixedly connected by the plurality of connecting parts.
  • Example 5 The camera module according to Example 4, wherein the plurality of convex portions and the plurality of connecting portions are made of plastic material, and the plurality of convex portions and the plurality of connecting portions are injection molded forming.
  • Example 6 The camera module according to Example 1, wherein the lens assembly is made of glass material, and the lens assembly is formed by engraving.
  • Example 7 The camera module according to Example 1, wherein a part of the arc-shaped edges of two adjacent convex transparent portions are connected.
  • Example 8 The camera module according to Example 1, wherein the camera module further includes a first processor, and the first processor is electrically connected to the plurality of photosensitive sensors;
  • the first processor is used for:
  • each of the photosensitive sensors is controlled to collect images through one of the convex and transparent parts to obtain a plurality of initial images, and one of the initial images is collected by one of the photosensitive sensors through one of the convex and transparent parts.
  • the multiple initial images are synthesized to obtain a synthesized image.
  • Example 9 The camera module according to Example 8, wherein the processor is further configured to synthesize a part of the plurality of initial images, and discard another part of the initial images.
  • Example 10 The camera module according to Example 8, wherein the processor is further configured to control a part of the plurality of photosensitive sensors to collect images under some conditions.
  • Example 11 A camera module, which includes:
  • a lens assembly comprising a plurality of interconnected convex parts
  • a photosensitive sensor configured to collect images through the plurality of convex and transparent parts, the photosensitive sensor having a plurality of photosensitive regions, the number of the photosensitive regions is equal to the number of the convex and transparent parts;
  • a second processor the second processor is electrically connected to the photosensitive sensor
  • the second processor is used for:
  • the multiple initial images are synthesized to obtain a synthesized image.
  • Example 12 The camera module according to Example 11, wherein the plurality of convex transparent portions are arranged in a matrix, and the plurality of photosensitive regions are arranged in a matrix.
  • Example 13 The camera module according to Example 12, wherein the projection of each of the convex portions on the photosensitive sensor overlaps with one of the photosensitive regions.
  • Example 14 The camera module according to Example 11, wherein the lens assembly includes a plurality of connecting parts, and the plurality of convex parts are fixedly connected by the plurality of connecting parts.
  • Example 15 The camera module according to Example 14, wherein the plurality of convex portions and the plurality of connecting portions are made of plastic material, and the plurality of convex portions and the plurality of connecting portions are injection molded forming.
  • Example 16 The camera module according to Example 11, wherein the lens component is made of glass material, and the lens component is formed by engraving.
  • Example 17 The camera module according to Example 11, wherein a part of the arc-shaped edges of two adjacent convex transparent portions are connected.
  • Example 18 The camera module according to Example 11, wherein the second processor is further configured to synthesize a part of the plurality of initial images, and discard another part of the initial images.
  • Example 19 The camera module according to Example 11, wherein the second processor is further configured to control a part of the plurality of photosensitive sensors to collect images under some conditions.
  • Example 20 An electronic device including a camera module, the camera module including:
  • a lens assembly comprising a plurality of mutually connected convex parts, the plurality of convex parts are arranged in a matrix;
  • a plurality of photosensitive sensors the plurality of photosensitive sensors are arranged in a matrix, the number of the photosensitive sensors is equal to the number of the convex portions, and one photosensitive sensor is used to collect data through one of the convex portions For the image, the projection of each of the convex and transparent portions at the installation position of the photosensitive sensor overlaps with one of the photosensitive sensors.

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Abstract

本申请实施例提供一种摄像模组和电子设备，摄像模组包括镜片组件和多个感光传感器，镜片组件包括多个相互连接的凸透部；感光传感器的个数与凸透部的个数相等，一个感光传感器用于透过一个凸透部采集图像。本申请实施例可以提高摄像模组成像的质量。

Description

摄像模组和电子设备
本申请要求于2019年10月30日提交中国专利局、申请号为201911047801.2、申请名称为“摄像模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，特别涉及一种摄像模组和电子设备。
背景技术
随着通信技术的发展，诸如智能手机等电子设备越来越普及。在电子设备的使用过程中，电子设备可通过其主板控制电子设备的各种功能，诸如主板控制摄像模组实现摄像功能。
发明内容
本申请实施例提供一种摄像模组和电子设备，可以提高摄像模组的成像质量。
第一方面，本申请实施例提供一种摄像模组，其包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部；和
多个感光传感器，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像。
第二方面，本申请实施例还提供一种摄像模组，其包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部；
感光传感器，所述感光传感器用于透过所述多个凸透部采集图像，所述感光传感器具有多个感光区域，所述感光区域的个数与所述凸透部的个数相等；和
处理器，所述处理器与所述感光传感器电性连接；
所述处理器用于：
接收拍摄指令；
根据所述拍摄指令控制所述感光传感器透过所述多个凸透部采集图像，得到多个初始图像；
对所述多个初始图像进行合成，得到合成图像。
第三方面，本申请实施例还提供一种电子设备，其包括摄像模组，所述摄像模组包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部，所述多个凸透部矩阵式排布；和
多个感光传感器，所述多个感光传感器矩阵式排布，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像，每一所述凸透部在所述感光传感器安装位置的投影与一个所述感光传感器重叠。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的摄像模组的框图。
图2为本申请实施例提供的摄像模组中镜片组件的结构示意图。
图3为本申请实施例提供的摄像模组中感光传感器的结构示意图。
图4为本申请实施例提供的摄像模组的另一框图。
图5为本申请实施例提供的摄像模组的结构示意图。
图6为本申请实施例提供的摄像模组中感光传感器的另一结构示意图。
图7为摄像模组的视场角不变时感光传感器两种不同尺寸对应不同像距的示意图。
图8为本申请实施例提供的电子设备的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
请参阅图1，图1为本申请实施例提供的摄像模组的框图。摄像模组200可进行拍照、摄像以实现拍照功能、摄像功能、人脸识别功能等。摄像模组200可包括镜片组件220和感光传感器240。感光传感器240可以透过镜片组件220采集图像以进行拍照或摄像。
请参阅图2，图2为本申请实施例提供的摄像模组中镜片组件的结构示意图。镜片组件220可包括多个凸透部222、多个连接部224和基体部226。基体部226可以成型镜片组件220的基本结构，其可以设置在镜片组件220的周缘位置。
每一个凸透部222等效为一个凸透镜。多个凸透部222可以相互间隔开，诸如每两个凸透部222之间连接有一个连接部224，相邻两个凸透部222之间可以间隔有连接部224。需要说明的是，相邻两个凸透部222之间也可以部分连接，比如两个相邻的凸透部222的弧形边缘的一部分连接。所有的凸透部222可以按照矩阵的方式排列，矩阵的方式排列容易成型，可以节省工艺。当然凸透部222也可以按照其他方式进行排列，各个凸透部222的排列方式可根据摄像模组200的实际需求进行排布。
各个凸透部222的大小可以相同，也可以不相同。比如所有凸透部222的大小均相同，再比如所有凸透部222中的一部分大小相同、一部分大小不相同，还比如所有凸透部222的大小均不相同。
各个凸透部222的弧度可以相同，也可以不相同。比如所有凸透部222的弧度均相同，再比如所有凸透部222中的一部分弧度相同、一部分弧度不同，还比如所有凸透部222的弧度均不相同。
需要说明的是，图2所示的镜片组件220仅为对镜片组件220形状的举例，并不构成对镜片组件220形状的限制。
多个凸透部222、多个连接部224和基体部226可以采用相同的材料，诸如塑料材料。多个凸透部222、多个连接部224和基体部226可以采用注塑的方式一体成型。可以理解的是，摄像模组200一般对镜片组件220的精度要求较高，采用模具通过注塑的方式成型镜片组件220可以确保精度要求。而且工艺简单，容易实现。
需要说明的是，镜片组件220也可以采用其他材料，诸如玻璃材料。可以 采用雕刻的方式成型镜片组件220。其中，玻璃材料一般比塑料材料重，工艺相比塑料材料的镜片组件更复杂，实际过程中可根据需求选择镜片组件220的材料。
还需要说明的是，多个凸透部222、多个连接部224和基体部226也可以不采用注塑的方式或雕刻的方式成型，诸如镜片组件仅包括一个平板结构的基板和多个凸透部，凸透部可以采用透明胶体粘接到基板上。然而，采用透明胶体粘接成型的镜片组件相比采用注塑成型的镜片组件，采用注塑成型的镜片组件的精度比采用透明胶体粘接成型的镜片组件的精度高。
本申请实施例提供一种新型的镜片组件220可以在外观上和性能上满足用户对摄像模组200的需求。
请参阅图3，图3为本申请实施例提供的摄像模组中感光传感器的结构示意图。感光传感器240的个数可以与镜片组件220中的凸透部222的个数相同。一个感光传感器240与一个凸透部222相对应，即一个感光传感器240可以透过一个凸透部222采集图像。一个感光传感器240可以透过一个凸透部222采集一个图像，多个感光传感器240可以采集多个图像。
各个感光传感器240可以按照矩阵的方式进行排列，矩阵的方式排列容易成型。当然各个感光传感器240也可以按照其他方式进行排列。各个感光传感器240的排列方式可以根据摄像模组200的实际需求进行排布。在一些实施例中，感光传感器240可以与凸透部222的排布方式相同，每一个凸透部222在感光传感器240安装位置的投影与一个感光传感器240重叠，诸如每一个凸透部222在摄像模组200的电路板的投影与一个感光传感器240重叠，以使得一个凸透部222与一个感光传感器240相对应，确保一个感光传感器240可以透过一个凸透部222采集图像。
各个感光传感器240的尺寸可以相同，也可以不相同。比如所有感光传感器240的尺寸均相同，再比如所有感光传感器240中的一部分尺寸相同、一部分尺寸不相同，还比如所有感光传感器240的尺寸均不相同。在一些实施例中，各个感光传感器240的尺寸均相同时，多个凸透部222至少有一部分大小不同；各个凸透部222的大小均相同时，各个传感器240至少有一部分尺寸不相同。
各个感光传感器240可以封装到摄像模组200的电路板中，各个感光传感 器240在电性上相互不连接。各个感光传感器240可以与摄像模组200电路板上的处理器或者说是处理电路电性连接，可以通过摄像模组200的处理器来实现对各个感光传感器240的控制。
请参阅图4，图4为本申请实施例提供的摄像模组的另一框图。摄像模组200还可以包括处理器260，该处理器260可以理解为摄像模组200的处理电路。该处理器260可以集成在摄像模组200的电路板上。
处理器260可以接收拍摄指令，该拍摄指令可以是用来指示摄像模组200拍照的指令，也可以是用来指示摄像模组200进行摄像的指令，还可以是用来指示摄像模组200进行人脸识别的指令。
处理器260接收到拍摄指令后，处理器260可以根据该拍摄指令控制每一个感光传感器240透过一个凸透部222采集图像，以得到多个初始图像。处理器260可以控制所有的感光传感器240透过所有的凸透部222采集得到与感光传感器240个数相同的初始图像，一个初始图像由一个感光传感器240透过一个凸透部222采集得到。
处理器260控制所有的感光传感器240采集到与其个数相同的初始图像后，处理器260可以基于该多个初始图像对该多个初始图像进行合成处理，以得到合成后的图像。
需要说明的是，处理器260在对多个初始图像进行合成时，可以将所有的初始图像进行合成。也可以对所有初始图像中的一部分进行合成，而舍弃一部分初始图像。比如：有一个或多个初始图像质量较差或者某一些参数不符合预设要求，则可以将其舍弃，而不对其进行合成。
还需要说明的是，处理器260在控制多个感光传感器240采集图像时，也可以仅控制一部分感光传感器240采集图像。在一些条件下，比如对图像质量要求不高时，可采取一部分感光传感器240来采集图像，以节省功耗，且可以提高成像速度。还比如当为摄像模组200提供电量不足时，则可以采取一部分感光传感器240进行图像的采集。
本申请实施例通过多个感光传感器240与多个凸透部222的配合关系可以提高摄像模组200成像的质量。
请参阅图5，图5为本申请实施例提供的摄像模组的结构示意图。该摄像 模组200还可以包括载体280、柔性电路板210和连接器230。摄像模组200的部件诸如镜片组件220、感光传感器240、电路板等均可以设置在载体280上。柔性电路板210的一端可以与设置在载体280内的电路板进行电性连接，柔性电路板210的另一端可以设置一连接器230，连接器230可以与其他连接结构进行配合连接。
需要说明的是，本申请实施例感光传感器也可以不设置多个，诸如摄像模组具有一个感光传感器，该一个感光传感器可以划分成与凸透部相同个数的感光区域。
请参阅6，图6为本申请实施例提供的摄像模组中感光传感器的另一结构示意图。摄像模组200的感光传感器240可以为一个，该一个感光传感器240可以透过多个凸透部222采集图像。
该一个感光传感器240可以具有多个感光区域242，该多个感光区域242可以为虚拟的区域，可以采用算法控制的方式实现。其中，感光区域242的个数可以与凸透部222的个数相等。一个感光区域242可以透过一个凸透部222采集一个图像，即一个感光区域242可以与一个凸透部222对应设置。该多个感光区域242的划分可以参考图3所示多个感光传感器的排布及方式，在此不再赘述。
该一个感光传感器240可以与摄像模组200的处理器诸如处理器260电性连接，处理器260可以控制该一个感光传感器240的感光区域242采集图像。
处理器260可以接收拍摄指令。
处理器260接收到拍摄指令后，处理器260可以根据该拍摄指令控制每一个感光区域242透过一个凸透部222采集图像，以得到多个初始图像。处理器260可以控制所有的感光区域242透过所有的凸透部222采集得到与感光区域242个数相同的初始图像，一个初始图像由一个感光区域242透过一个凸透部222采集得到。
处理器260控制所有的感光区域242采集到与其个数相同的初始图像后，处理器260可以基于该多个初始图像对该多个初始图像进行合成处理，以得到合成后的图像。
需要说明的是，处理器260在控制多个感光区域242采集图像时，也可以 仅控制一部分感光区域242采集图像。在一些条件下，比如对图像质量要求不高时，可采取一部分感光区域242来采集图像，以节省功耗，且可以提高成像速度。还比如当为摄像模组200提供电量不足时，则可以采取一部分感光区域242进行图像的采集。
本申请实施例通过多个感光区域242与多个凸透部222的配合关系可以提高摄像模组200成像的质量。
摄像模组一般具有一定的视场角，即摄像模组的有效进光角度。在摄像模组的视场角一定的情况下，摄像模组的像距和感光传感器的尺寸具有正比例关系，即摄像模组的像距越大感光传感器的尺寸越大、摄像模组的像距越小感光传感器的尺寸越小。摄像模组的像距可理解为成像位置到镜片组件中心的距离。当摄像模组的视场角一定时，若增加摄像模组的成像质量，通常是增加感光传感器的像素点。由于感光传感器的像素点增加，进而会增加感光传感器的尺寸，导致摄像模组的像距增加，从而就会增加摄像模组的整体厚度。
例如：请参阅图7，图7为摄像模组的视场角不变时感光传感器两种不同尺寸对应不同像距的示意图。其中摄像模组具有一定的视场角FOV，该视场角FOV诸如为40度。该摄像模组的感光传感器可以具有两种尺寸，诸如3mm和6mm。当摄像模组的感光传感器的尺寸为3mm时，摄像模组具有像距v，该像距v诸如为1.79mm，以及摄像模组的镜片组件具有一定的尺寸l，该l诸如为50mm。若提高摄像模组的成像质量，可选择将增加感光传感器的像素点，诸如摄像模组的感光传感器的尺寸由3mm增加到6mm，即当摄像模组的感光传感器的尺寸为6mm时，摄像模组具有像距V，像距V诸如为3.58mm，以及摄像模组的镜片组件具有一定的尺寸L，该L诸如为100mm。在摄像模组的视场角不变的情况下，摄像模组的感光传感器的尺寸增加会增加摄像模组的像距，还可能增加镜片组件的厚度。导致摄像模组的整体厚度增加。
基于此，本申请实施例所提供的摄像模组200用于在摄像模组的视场角一定的情况下，在不会额外增加像距或不额外增加镜片组件220厚度的基础上来提高摄像模组200的成像质量，进而不会额外增加摄像模组200的厚度。需要说明的是，本申请实施例在不考虑摄像模组200的厚度时，以单个凸透部222对应一个视场角，摄像模组200通过多个凸透部222实现图像合成可以具有更 大的视场角。
本申请实施例所提供的摄像模组200可以应用到电子设备中，以降低摄像模组200对整机厚度的限制，为薄电子设备提供可能。同时，还可以提高电子设备采用摄像模组200成像的质量。
请参阅图8，图8为本申请实施例提供的电子设备的结构示意图。电子设备20可为计算设备诸如膝上型计算机、包含嵌入式计算机的计算机监视器、平板电脑、蜂窝电话、媒体播放器、或其他手持式或便携式电子设备、较小的设备(诸如腕表设备、挂式设备、耳机或听筒设备、被嵌入在眼镜中的设备或者佩戴在用户的头部上的其他设备，或其他可佩戴式或微型设备)、电视机、不包含嵌入式计算机的计算机显示器、游戏设备、导航设备、嵌入式系统(诸如其中具有显示器的电子设备被安装在信息亭或汽车中的系统)、实现这些设备中的两个或更多个设备的功能的设备、或其他电子设备。在图8的示例性配置中，电子设备20是便携式设备，诸如蜂窝电话、媒体播放器、平板电脑、或者其他便携式计算设备。如果需要，其他配置可用于电子设备20。图8的示例仅是示例性的。
电子设备20可以包括摄像模组200、壳体400及显示屏600。显示屏600可设置在壳体400上以形成收纳空间，该收纳空间可以收纳电子设备20的各种器件诸如摄像模组200、主板、电池等。
摄像模组200可以作为电子设备20的前置摄像头，摄像模组200可以设置在显示屏600和壳体400之间，摄像模组200可以设置在显示屏600的显示区域下方，也可以设置在显示屏600的非显示区域。需要说明的是，摄像模组200也可以作为电子设备20的后置摄像头。
显示屏600可为结合导电电容触摸传感器电极层或者其他触摸传感器部件(例如，电阻触摸传感器部件、声学触摸传感器部件、基于力的触摸传感器部件、基于光的触摸传感器部件等)的触摸屏显示器，或者可为非触敏的显示器。电容触摸屏电极可由氧化铟锡焊盘或者其他透明导电结构的阵列形成。
显示屏600可包括由液晶显示器(LCD)部件形成的显示器像素阵列、电泳显示器像素阵列、等离子体显示器像素阵列、有机发光二极管显示器像素阵列、电润湿显示器像素阵列、或者基于其他显示器技术的显示器像素。
可使用显示屏覆盖层诸如透明玻璃层、透光塑料、蓝宝石、或其他透明电介质层来保护显示屏600。
壳体400可由塑料、玻璃、陶瓷、纤维复合材料、金属(例如，不锈钢、铝等)、其他合适的材料、或这些材料的任意两种或更多种的组合形成。壳体400可使用一体式配置形成，在该一体式配置中，一些或全部壳体400被加工或模制成单一结构，或者可使用多个结构(例如，内框架结构、形成外部外壳表面的一种或多种结构等)形成。
以上对本申请实施例提供的摄像模组和电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。
下面给出一些示例性实施例。
示例1：一种摄像模组，其包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部；和
多个感光传感器，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像。
示例2：根据示例1的摄像模组，其中，所述多个凸透部矩阵式排布，所述多个感光传感器矩阵式排布。
示例3：根据示例2的摄像模组，其中，每一所述凸透部在所述感光传感器安装位置的投影与一个所述感光传感器重叠。
示例4：根据示例1的摄像模组，其中，所述镜片组件包括多个连接部，所述多个凸透部通过所述多个连接部固定连接。
示例5：根据示例4的摄像模组，其中，所述多个凸透部和所述多个连接部均采用塑料材质，所述多个凸透部和所述多个连接部采用注塑的方式成型。
示例6：根据示例1的摄像模组，其中，所述镜片组件采用玻璃材料，所述镜片组件采用雕刻的方式成型。
示例7根据示例1的摄像模组，其中，相邻两个所述凸透部的弧形边缘的一部分连接。
示例8：根据示例1的摄像模组，其中，所述摄像模组还包括第一处理器，所述第一处理器与所述多个感光传感器电性连接；
所述第一处理器用于：
接收拍摄指令；
根据所述拍摄指令控制每一个所述感光传感器透过一个所述凸透部采集图像，以得到多个初始图像，其中一个初始图像由一个所述感光传感器透过一个所述凸透部采集得到；
对所述多个初始图像进行合成，得到合成图像。
示例9：根据示例8的摄像模组，其中，所述处理器还用于对所述多个初始图像中的一部分进行合成，而舍弃另外一部分初始图像。
示例10：根据示例8的摄像模组，其中，所述处理器还用于在一些条件下，控制所述多个感光传感器中的一部分感光传感器采集图像。
示例11：一种摄像模组，其包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部；
感光传感器，所述感光传感器用于透过所述多个凸透部采集图像，所述感光传感器具有多个感光区域，所述感光区域的个数与所述凸透部的个数相等；和
第二处理器，所述第二处理器与所述感光传感器电性连接；
所述第二处理器用于：
接收拍摄指令；
根据所述拍摄指令控制所述感光传感器透过所述多个凸透部采集图像，得到多个初始图像；
对所述多个初始图像进行合成，得到合成图像。
示例12：根据示例11的摄像模组，其中，所述多个凸透部矩阵式排布，所述多个感光区域矩阵式排布。
示例13：根据示例12的摄像模组，其中，每一所述凸透部在所述感光传感器的投影与一个所述感光区域重叠。
示例14：根据示例11的摄像模组，其中，所述镜片组件包括多个连接部，所述多个凸透部通过所述多个连接部固定连接。
示例15：根据示例14的摄像模组，其中，所述多个凸透部和所述多个连接部均采用塑料材质，所述多个凸透部和所述多个连接部采用注塑的方式成型。
示例16：根据示例11的摄像模组，其中，所述镜片组件采用玻璃材料，所述镜片组件采用雕刻的方式成型。
示例17：根据示例11的摄像模组，其中，相邻两个所述凸透部的弧形边缘的一部分连接。
示例18：根据示例11的摄像模组，其中，所述处第二理器还用于对所述多个初始图像中的一部分进行合成，而舍弃另外一部分初始图像。
示例19：根据示例11的摄像模组，其中，所述第二处理器还用于在一些条件下，控制所述多个感光传感器中的一部分感光传感器采集图像。
示例20：一种电子设备，其包括摄像模组，所述摄像模组包括：
镜片组件，所述镜片组件包括多个相互连接的凸透部，所述多个凸透部矩阵式排布；和
多个感光传感器，所述多个感光传感器矩阵式排布，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像，每一所述凸透部在所述感光传感器安装位置的投影与一个所述感光传感器重叠。

Claims (20)

  1. 一种摄像模组，其包括：
    镜片组件，所述镜片组件包括多个相互连接的凸透部；和
    多个感光传感器，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像。
  2. 根据权利要求1所述的摄像模组，其中，所述多个凸透部矩阵式排布，所述多个感光传感器矩阵式排布。
  3. 根据权利要求2所述的摄像模组，其中，每一所述凸透部在所述感光传感器安装位置的投影与一个所述感光传感器重叠。
  4. 根据权利要求1所述的摄像模组，其中，所述镜片组件包括多个连接部，所述多个凸透部通过所述多个连接部固定连接。
  5. 根据权利要求4所述的摄像模组，其中，所述多个凸透部和所述多个连接部均采用塑料材质，所述多个凸透部和所述多个连接部采用注塑的方式成型。
  6. 根据权利要求1所述的摄像模组，其中，所述镜片组件采用玻璃材料，所述镜片组件采用雕刻的方式成型。
  7. 根据权利要求1所述的摄像模组，其中，相邻两个所述凸透部的弧形边缘的一部分连接。
  8. 根据权利要求1所述的摄像模组，其中，所述摄像模组还包括第一处理器，所述第一处理器与所述多个感光传感器电性连接；
    所述第一处理器用于：
    接收拍摄指令；
    根据所述拍摄指令控制每一个所述感光传感器透过一个所述凸透部采集图像，以得到多个初始图像，其中一个初始图像由一个所述感光传感器透过一个所述凸透部采集得到；
    对所述多个初始图像进行合成，得到合成图像。
  9. 根据权利要求8所述的摄像模组，其中，所述处理器还用于对所述多个初始图像中的一部分进行合成，而舍弃另外一部分初始图像。
  10. 根据权利要求8所述的摄像模组，其中，所述处理器还用于在一些条件下，控制所述多个感光传感器中的一部分感光传感器采集图像。
  11. 一种摄像模组，其包括：
    镜片组件，所述镜片组件包括多个相互连接的凸透部；
    感光传感器，所述感光传感器用于透过所述多个凸透部采集图像，所述感光传感器具有多个感光区域，所述感光区域的个数与所述凸透部的个数相等；和
    第二处理器，所述第二处理器与所述感光传感器电性连接；
    所述第二处理器用于：
    接收拍摄指令；
    根据所述拍摄指令控制所述感光传感器透过所述多个凸透部采集图像，得到多个初始图像；
    对所述多个初始图像进行合成，得到合成图像。
  12. 根据权利要求11所述的摄像模组，其中，所述多个凸透部矩阵式排布，所述多个感光区域矩阵式排布。
  13. 根据权利要求12所述的摄像模组，其中，每一所述凸透部在所述感光传感器的投影与一个所述感光区域重叠。
  14. 根据权利要求11所述的摄像模组，其中，所述镜片组件包括多个连接部，所述多个凸透部通过所述多个连接部固定连接。
  15. 根据权利要求14所述的摄像模组，其中，所述多个凸透部和所述多个连接部均采用塑料材质，所述多个凸透部和所述多个连接部采用注塑的方式成型。
  16. 根据权利要求11所述的摄像模组，其中，所述镜片组件采用玻璃材料，所述镜片组件采用雕刻的方式成型。
  17. 根据权利要求11所述的摄像模组，其中，相邻两个所述凸透部的弧形边缘的一部分连接。
  18. 根据权利要求11所述的摄像模组，其中，所述处第二理器还用于对所述多个初始图像中的一部分进行合成，而舍弃另外一部分初始图像。
  19. 根据权利要求11所述的摄像模组，其中，所述第二处理器还用于在一些条件下，控制所述多个感光传感器中的一部分感光传感器采集图像。
  20. 一种电子设备，其包括摄像模组，所述摄像模组包括：
    镜片组件，所述镜片组件包括多个相互连接的凸透部，所述多个凸透部矩 阵式排布；和
    多个感光传感器，所述多个感光传感器矩阵式排布，所述感光传感器的个数与所述凸透部的个数相等，一个所述感光传感器用于透过一个所述凸透部采集图像，每一所述凸透部在所述感光传感器安装位置的投影与一个所述感光传感器重叠。
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