WO2021235310A1 - Substrat de del, empilement et procédé de fabrication de substrat de del - Google Patents

Substrat de del, empilement et procédé de fabrication de substrat de del Download PDF

Info

Publication number
WO2021235310A1
WO2021235310A1 PCT/JP2021/018185 JP2021018185W WO2021235310A1 WO 2021235310 A1 WO2021235310 A1 WO 2021235310A1 JP 2021018185 W JP2021018185 W JP 2021018185W WO 2021235310 A1 WO2021235310 A1 WO 2021235310A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
reflective layer
led
light source
less
Prior art date
Application number
PCT/JP2021/018185
Other languages
English (en)
Japanese (ja)
Inventor
吉田昌平
宇都孝行
内田裕仁
荘司秀夫
磯崎崇志
Original Assignee
東レ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レ株式会社 filed Critical 東レ株式会社
Priority to CN202180033745.6A priority Critical patent/CN115516650A/zh
Priority to KR1020227035214A priority patent/KR20230015314A/ko
Priority to JP2021531332A priority patent/JPWO2021235310A1/ja
Publication of WO2021235310A1 publication Critical patent/WO2021235310A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present invention relates to LED substrates and laminates.
  • liquid crystal displays In recent years, many displays using liquid crystals have been used as display devices for personal computers, televisions, mobile phones, and the like. These liquid crystal displays can be displayed by installing a surface light source called a backlight from the back side and irradiating the light.
  • a surface light source called a backlight
  • a film to which a white pigment is added or a film containing fine bubbles inside is used alone as a reflective layer used for a backlight for a liquid crystal display, or these films are bonded to a metal plate, a plastic plate, or the like.
  • a film containing fine bubbles inside is widely used because it has a certain effect on improving the brightness and making the screen brightness uniform (Patent Documents 1 and 2).
  • the reflective layer For the reflective layer, a configuration that utilizes light reflection due to the difference in refractive index at the interface between the fine bubbles contained inside the film and the matrix resin is widely adopted. In order to achieve higher reflectivity, it is necessary to increase the number of interfaces. In order to increase the number of interfaces, the formation of voids having inorganic particles having a relatively small particle size as nuclei has been studied (Patent Documents 3 and 4).
  • Patent Document 5 a method of making a hole according to the position of a light source (LED) and setting the LED so as to come out through the hole has been performed.
  • LED method mini LED method
  • the reflective film described in Patent Documents 1 to 4 is used as the reflective layer of the mini LED type LED substrate
  • the light source can be miniaturized (that is, opened).
  • the miniaturization of holes there is a problem that the difficulty of processing increases and the yield of LED substrate production decreases.
  • the LED substrate can be produced, there are problems that the brightness is significantly lowered and the brightness unevenness is increased as compared with the conventional LED method, and a solution has been desired.
  • the mini LED method it is preferable to provide an adhesive layer or an adhesive layer between the substrate and the reflective film in order to improve the adhesion and stacking accuracy, but in that case, the conventional LED method does not cause any problem.
  • the presence of the raised part around the hole greatly affects the brightness and workability.
  • the object of the present invention is to solve the above-mentioned problems caused by the prior art. That is, it is an object of the present invention to provide an LED substrate and a laminate capable of achieving sufficient brightness even when used for a mini LED type backlight.
  • an LED substrate and a laminate having the following configurations having the following configurations, and the present invention has been reached. That is, [I] An LED substrate having an LED light source and a reflective layer on at least one surface of the base material, wherein the reflective layer contains a white pigment, and the height of the protrusion from the reflective layer of the LED light source (P). Is an LED substrate of 20 ⁇ m or more and 200 ⁇ m or less. [II] The LED substrate according to [I], wherein the reflective layer contains a polyester resin as a main component, and the average void content in a cross section perpendicular to the layer surface of the reflective layer is 10% or more and 70% or less.
  • the laminate having the release layer, the adhesive layer, the reflective layer, and the support layer in this order has through holes penetrating all the layers, and the step A of removing the release layer from the laminate.
  • a method for manufacturing an LED substrate comprising a step B of fixing the adhesive layer and the substrate after the step A, and a step C of peeling the support layer from the reflective layer after the step B.
  • the brightness of the mini LED backlight can be improved.
  • the LED substrate of the present invention will be described with reference to FIG.
  • an LED substrate having an LED light source 5 and a reflection layer 3 on at least one surface of a base material 2 the height of a protrusion from the reflection layer of the LED light source.
  • the LED substrate 1 in which the (P) 6 is 20 ⁇ m or more and 200 ⁇ m or less can be mentioned.
  • the protrusion height (P) referred to here is the highest point of the reflective layer near the LED light source (the point where the distance from the substrate is the maximum) and the highest point of the LED light source (the distance from the substrate is the maximum). It refers to the height difference from the point).
  • the present inventors have reduced the brightness due to the miniaturization of the LED because the highest point of the LED light source is lower than the highest point of the reflective layer, so that the light emitted from the LED light source is blocked by the reflective layer. Was found to be the cause. Therefore, by controlling the height (P) of the protruding portion of the LED light source within the specific range, it is possible to suppress the phenomenon that the light emitted from the LED light source is blocked by the reflective layer and the brightness is lowered, and further, the brightness is further reduced. Unevenness can be suppressed. By setting the protrusion height (P) to 20 ⁇ m or more, it is possible to prevent the light emitted from the LED light source from being blocked by the reflective layer and reducing the brightness.
  • the protrusion height (P) is 200 ⁇ m or less, the total thickness of the backlight becomes thick due to the large LED, which hinders the thinning of the display and hinders the high definition of the display. It can be suppressed.
  • the protrusion height (P) is preferably 35 ⁇ m or more and 120 ⁇ m or less, and most preferably 50 ⁇ m or more and 70 ⁇ m or less. The larger the protrusion height (P), the easier it is to improve the brightness of the backlight on which the LED substrate is mounted. Further, the lower the protrusion height (P) is, the smaller the size of the LED can be, and the thinner the display and the higher the definition of the display can be easily achieved.
  • the method for setting the height (P) of the protrusion from the reflective layer of the LED light source to 20 ⁇ m or more and 200 ⁇ m or less is not particularly limited, and examples thereof include a method of adjusting the balance between the height of the LED light source and the thickness of the reflective layer.
  • the base material used for the LED substrate of the present invention supports a conductor pattern having wiring and terminals.
  • the conductor patterns may be insulated from each other, and examples thereof include an insulating resin substrate made of glass epoxy.
  • the base material used in the present invention is not particularly limited, and a material generally used for a base material for an LED can be used.
  • a material for example, an insulating resin substrate obtained by impregnating a reinforcing material such as glass cloth or paper with a thermoplastic resin such as an epoxy resin, a phenol resin, or a polyimide resin, laminating, and heating and pressurizing.
  • Examples thereof include a sheet-like substrate containing a thermoplastic resin such as LCP, PPS, and thermoplastic polyimide, an insulating inorganic substrate such as ceramic, and a metal base substrate in which an insulating resin is laminated on a metal substrate such as aluminum.
  • a thermoplastic resin such as LCP, PPS, and thermoplastic polyimide
  • an insulating inorganic substrate such as ceramic
  • a metal base substrate in which an insulating resin is laminated on a metal substrate such as aluminum.
  • the LED light source used for the LED substrate of the present invention for example, a nitride semiconductor capable of emitting light in the visible range can be preferably used.
  • the LED substrate may include at least one LED element, and the number of LED elements can be changed according to the purpose and application.
  • the reflective layer used in the present invention needs to contain a white pigment.
  • a white resin layer formed by coating a thermosetting resin containing a white pigment such as titanium oxide on a substrate, a white pigment such as titanium oxide, and a white resin film containing bubbles. ..
  • a white resin film is preferably used from the viewpoint of brightness, processability, and uniformity of color.
  • the reflective layer in the present invention is mainly composed of polyester resin from the viewpoint of luminance, processability, and color uniformity, and the average void content in the cross section perpendicular to the layer surface of the reflective layer is 10% or more and 70%. The following is preferable. A more preferable average void content is 15% or more and 60% or less.
  • the main component refers to a component that occupies 50% by mass or more of the resin components constituting the resin composition.
  • the polyester resin refers to a polymer having an ester bond as a main chain, but the polyester resin used in the present invention is preferably a polyester resin having a structure in which a dicarboxylic acid and a diol are polycondensed.
  • the dicarboxylic acid component include terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, diphenyldicarboxylic acid, diphenylsulfonedicarboxylic acid, diphenoxyetanedicarboxylic acid, and 5-sodium sulfone as aromatic dicarboxylic acids.
  • Aromatic dicarboxylic acids such as dicarboxylic acids, oxalic acids, succinic acids, adipic acids, sebacic acids, dimer acids, maleic acids, fumaric acids and other aliphatic dicarboxylic acids, and 1,4-cyclohexanedicarboxylic acids and other alicyclic dicarboxylic acids.
  • Each component such as an oxycarboxylic acid such as paraoxybenzoic acid can be mentioned.
  • dicarboxylic acid ester derivative component an esterified product of the above dicarboxylic acid compound, for example, dimethyl terephthalate, diethyl terephthalate, 2-hydroxyethylmethyl ester terephthalate, dimethyl 2,6-naphthalenedicarboxylic acid, dimethyl isophthalate, adipic acid.
  • diol component include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6.
  • aliphatic dihydroxy compounds such as 2,2-dimethyl-1,3-propanediol (neopentyl glycol), polyoxyalkylene glycols such as diethylene glycol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, 1,4 -Examples include alicyclic dihydroxy compounds such as cyclohexanedimethanol and spiroglycol, and aromatic dihydroxy compounds such as bisphenol A and bisphenol S. Each of these may be used alone or in combination of two or more. Further, as long as the film-forming property is not affected as a film, one or more of trimellitic acid, pyromellitic acid and its ester derivative may be copolymerized in a small amount.
  • polyester resin examples include polyethylene terephthalate (hereinafter abbreviated as PET), polyethylene-2,6-naphthalenedicarboxylate, polypropylene terephthalate, polybutylene terephthalate, poly-1,4-cyclohexylene methylene terephthalate and the like. Can be particularly preferably used because it can be obtained at low cost and has good film-forming properties.
  • the polyester resin may be a homopolymer or a copolymer.
  • the copolymerization component in the case of a copolymer include aromatic dicarboxylic acid, aliphatic dicarboxylic acid, alicyclic dicarboxylic acid, and diol component having 2 to 15 carbon atoms, and examples thereof include isophthalic acid.
  • the resin is heated from 25 ° C. to 300 ° C. (1stRUN) at a heating rate of 10 ° C./min according to JIS K-7122 (1987), held in that state for 5 minutes, and then held.
  • the differential scanning calorimetry chart of 2ndRUN obtained by rapidly cooling at a rate of 40 ° C./min so as to be 25 ° C. or lower and then raising the temperature again from 25 ° C. to 300 ° C. at a heating rate of 10 ° C./min.
  • a resin having a crystal melting heat amount ⁇ Hm obtained from the peak area of the melting peak of 20 J / g or more is preferable.
  • the amount of heat of crystal melting ⁇ Hm is 25 J / g or more, and even more preferably 30 J / g or more.
  • polyester having a heat of crystal melting of 30 J / g or more the height of the raised portion at the peripheral portion of the hole can be kept small when drilling by punching.
  • the polyester used in the present invention preferably has a carboxyl group terminal group of 10 equivalents / t or more and 40 equivalents / t or less.
  • a more preferable number of carboxyl group terminal groups is 20 equivalents / t or more and 40 equivalents / t or less.
  • the polyester used in the present invention preferably has an intrinsic viscosity of 0.50 or more and 0.90 or less.
  • the more preferable intrinsic viscosity is 0.55 or more and 0.80 or less, and more preferably 0.60 or more and 0.70 or less.
  • the IV By setting the IV to 0.90 or less, the height of the raised portion at the peripheral portion of the hole can be kept small when drilling a hole by punching. If the IV is less than 0.50, when a void is formed by containing a void nucleating agent described later, the entanglement between the molecules becomes too small and the film formation breaks frequently, or even if the film formation is possible. Mechanical properties may deteriorate.
  • the reflective layer used in the present invention contains a thermoplastic resin that is incompatible with the resin as the main component.
  • incompatible is a combination of resins having a solubility parameter (hereinafter, may be abbreviated as "SP value") having a deviation of 0.5 (MPa 1/2) or more.
  • SP value a solubility parameter
  • the SP value was calculated based on the theory of the solubility parameter (“The Solution of Non-conductorrytes”, [3rd, ed.] Reinhold, NY 1959) proposed by Hildebrand et al., And each of the two types of resin was used. The larger the deviation of the SP value of the resin, the lower the compatibility of the resin becomes.
  • the incompatible thermoplastic resin is used as a void nucleating agent to form voids.
  • the thermoplastic resin that is incompatible with the resin as the main component is also simply referred to as "void nucleating agent".
  • a void is formed by peeling off the resin around the void nucleating agent by applying an external force by stretching a resin obtained by mixing the resin of the main component and the void nucleating agent at an arbitrary ratio.
  • void nucleating agents include polyolefin resins, polystyrene resins, polyamide resins, polyimide resins, polyetherimide resins, polyester resins, polyarylene sulfide resins, polyarylene oxide resins, polysulfone resins, polyphenylsulfone resins, and aromatics.
  • thermoplastic resins such as polyether ketone resins, acrylic resins, and fluororesins.
  • the main component resin is a polyester resin
  • a linear or split chain olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • a cyclic olefin resin such as polyethylene, polypropylene, polybutene, or polymethylpentene
  • olefin resin or a styrene resin
  • examples of the olefin resin include polyethylene, polypropylene, poly4-methylpentene-1 (hereinafter, may be abbreviated as "polymethylpentene” or "PMP"), and ethylene.
  • PMP polymethylpentene
  • ethylene ethylene
  • the propylene copolymer, the ethylene-butene-1 copolymer, and the cyclic olefin are styrene-based resins such as polystyrene, polymethylpentene, and polydimethylstyrene. These may be homopolymers or copolymers, and may be used in combination of two or more.
  • polymethylpentene or cyclic olefin is preferable because it can achieve both the effect as a void nucleating agent and the film-forming property.
  • the reflective layer used in the present invention preferably contains a white pigment in order to increase the amount of light emitted to the incident surface side due to light scattering and to improve the brightness of the display.
  • white pigments include titanium oxide, calcium carbonate, barium sulfate, zinc oxide, and magnesium oxide in terms of overall effects such as refractive index, void forming ability, whiteness, and optical density.
  • Particles containing silicate or titanate as a main component are preferable, and particles containing titanium oxide as a main component are particularly preferably used. If 50% by mass or more of the components constituting the particles are titanium oxide, it can be said that titanium oxide is the main component.
  • the average particle size (D50, mode average particle size) of the white pigment is preferably 0.05 to 1.0 ⁇ m.
  • the average particle size of the more preferable white pigment is 0.1 to 0.5 ⁇ m, and more preferably 0.15 to 0.35 ⁇ m.
  • the white pigment in the reflective layer is preferably more than 10% by mass and less than 40% by mass of all the components constituting the reflective layer. More preferably, the white pigment in the reflective layer is more than 15% by weight and less than 35% by weight.
  • the content of the white pigment in the reflective layer is within the above range.
  • the reflective layer used in the present invention is mainly composed of a polyester resin, and when the average void content in the cross section in the direction perpendicular to the layer surface is 10% or more and 70% or less, the reflectance of the reflective layer is high, which is preferable.
  • the void in the present invention refers to a void existing in a layer formed by a void nucleating agent or a white pigment.
  • the average void content can be determined by SEM cross-section observation and image analysis, which will be described later.
  • the void formation method is as follows: a mixture containing the polyester resin as a main component and a void nucleating agent or a white pigment described above is stretched to apply an external force to form the polyester resin and the void nucleating agent, or the polyester resin and the white pigment.
  • It can be formed by a peeling method.
  • Specific examples thereof include a method in which a mixture containing a resin containing a polyester resin as a main component and a void nucleating agent or a white pigment is melt-extruded and then stretched in at least one direction to form voids inside.
  • the average void content By setting the average void content to 10% or more, the reflectance of the reflective layer can be increased. Further, by setting the average void content to 70% or less, it is possible to suppress tearing during film formation and improve productivity.
  • the reflection layer has one or more through holes, the LED light source is arranged through the through holes in the reflection layer, and the area of the LED light source when observed from directly above the surface of the base material.
  • (Sl), the area of the through hole (Sh), and the ratio (Sl / Sh) are 0.25 or more and less than 1.00. It is preferably 0.50 or more, more preferably 0.75 or less.
  • the area ratio (Sl / Sh) is too small, the amount of light reflected by the reflective layer is reduced, which may cause a problem of reduced brightness.
  • the area ratio (Sl / Sh) is 0.75 or less, there is an appropriate gap between the LED and the through hole, so that high assembly accuracy is not required at the time of setup, and the productivity of the LED substrate is improved. It is possible to make it.
  • the ratio (H2 / H1) of the height (H1) of the LED light source to the height (H2) of the reflective layer is preferably 0.1 or more and 0.8 or less.
  • H2 / H1 By setting H2 / H1 to 0.8 or less, it is possible to prevent the light emitted from the LED light source from being blocked by the reflective layer and reducing the brightness and the unevenness of brightness.
  • H2 / H1 is set to 0.1 or more, the total thickness of the backlight becomes thick due to the large LED light source, which hinders the thinning of the display and hinders the high definition of the display. Can be suppressed.
  • H2 / H1 is preferably 0.1 or more and 0.6 or less, and more preferably 0.1 or more and 0.5 or less.
  • the height of the LED light source (H1) represents the distance between the tip of the LED light source and the surface of the base material
  • the height of the reflective layer (H2) represents the distance between the surface of the reflective layer and the surface of the base material.
  • the LED substrate of the present invention has an adhesive layer on at least one surface of the reflective layer, and the reflective layer has one or more through holes and a raised portion protruding toward the adhesive layer within a region of 1.0 mm around the through holes.
  • the ratio (t / h) of the height (h) of the raised portion to the thickness (t) of the adhesive layer is preferably 0.20 or more and less than 1.00. It is preferably 0.50 or more, more preferably 0.70 or more.
  • the reflective layer is attached to a sheet-like material such as a diffuser plate located on the substrate or on the surface opposite to the substrate via the adhesive layer.
  • the ratio (t / h) is set to less than 1.00, the total thickness of the backlight can be reduced while maintaining good brightness of the display, which can contribute to the thinning of the display.
  • the three-dimensional surface roughness SRa of the surface of the reflective layer opposite to the substrate is 300 nm or more and less than 2000 nm.
  • the three-dimensional surface roughness SRa is within the above range, when the light emitted from the LED at a shallow angle is reflected on the surface of the reflective material, it reaches a long distance in the backlight, and the high definition of the display becomes high. It can be suppressed from being inhibited.
  • the three-dimensional surface roughness to 300 nm or more, when the backlight is partially driven, it is possible to suppress the case where the part that is turned off looks bright with the light from the part that is turned on.
  • the cost for processing can be suppressed and the yield can be increased. More preferably, it is 500 nm or more.
  • the method in which the surface roughness is within the above range is not particularly limited, but it is preferable that the reflective material has a layer containing particles or beads for forming irregularities.
  • the LED light source is a blue LED light source.
  • the LED substrate of the present invention has a plurality of LED light sources, it is preferable to have one or more LED light sources.
  • a blue light source having a short wavelength among visible light is used as the light source, the problem that the light emitted from the LED light source is blocked by the reflective layer arises more strongly, so that the effect of improving the brightness by the present invention can be further obtained. It is preferable because it can be done.
  • the range of 1.0 mm around the through hole represents a region included in a concentric circle having a radius of 1.0 mm starting from the center of gravity of the through hole when the reflective layer is viewed from directly above the surface, and is described by a measurement method described later. Desired.
  • the height (h) of the raised portion represents the height at which the reflective layer most protrudes toward the adhesive layer within a region of 1.0 mm around the through hole.
  • t / h is more preferably 0.50 or more, still more preferably 0.70 or more.
  • the laminated body is arranged so that the LED is arranged in the through hole of the laminated body.
  • the raised portion blocks the light emitted from the inside of the LED through hole, suppresses the decrease in the brightness of the display, and adheres to the substrate when bonded. Can be improved.
  • the ratio (t / h) is set to less than 2.00, it is possible to suppress the misalignment during the laminating process due to the adhesive layer being too thick.
  • the total thickness of the backlight can be reduced while maintaining good brightness of the display, which can contribute to the thinning of the display.
  • the thickness (t) of the adhesive layer is preferably 0.1 ⁇ m or more and 25 ⁇ m or less. It is more preferably 0.5 ⁇ m or more and 20 ⁇ m or less, and further preferably 1 ⁇ m or more and 15 ⁇ m or less. If the thickness is less than 0.1 ⁇ m, the adhesive strength may be insufficient. Further, if it is larger than 25 ⁇ m, the height of the raised portion of the peripheral portion of the hole may be increased during the drilling process, or the position may be strongly displaced during the bonding process.
  • the height (h) of the raised portion is preferably 25 ⁇ m or less. It is more preferably 20 ⁇ m or less, still more preferably 15 ⁇ m or less. If the height of the raised portion is larger than 25 ⁇ m, the adhesion at the time of bonding to the substrate may decrease.
  • the above-mentioned through holes are for arranging LEDs, and the size, shape, and ratio of the through holes in the in-plane direction of the laminated body are changed according to the size and the number of LEDs.
  • the through hole does not become too large as compared with the size of the mini LED type LED, and light can be sufficiently reflected.
  • the major axis of the through hole By setting the major axis of the through hole to 0.2 mm or more, it is possible to suppress a decrease in yield due to a deviation during processing for aligning the LED arrangement and the hole position. It is more preferably 0.3 mm or more and 3.0 mm or less, and further preferably 0.4 mm or more and 2.5 mm or less. Further, by setting the aperture ratio to 0.1% or more, the number of LEDs having a sufficient amount of light can be arranged.
  • the laminated body can maintain the shape as a film, and the reflection performance can be improved. It is more preferably 0.3% or more and 50% or less, and further preferably 0.5% or more and 40% or less.
  • the object of the present invention is to arrange the LED in the through hole, there is no problem even if a component other than the LED is arranged in the through hole as long as the effect of the present invention is not impaired.
  • the shape and size of the through hole do not have to be constant. In that case, it is preferable that 90% or more of the total number of through holes has a major axis of 0.2 to 5.0 mm.
  • the processing can be mechanical processing, chemical etching, or a plurality of them.
  • mechanical processing it can be processed by drilling with a drill or drill, press processing, Thomson processing, and embossing roll processing.
  • chemical etching laser processing with a CW laser or a pulse laser can be used.
  • punching methods such as press working, Thomson machining, and embossing roll machining are particularly preferably used from the viewpoint of productivity.
  • the thickness of the reflective layer is preferably 80 ⁇ m or less.
  • the thickness of the reflective layer is preferably 65 ⁇ m or less.
  • the thickness of the reflective layer is 20 ⁇ m or more.
  • the reflectance of the reflective layer can be sufficiently increased.
  • the film-forming property and the handleability at the time of processing can be improved. More preferably, it is 30 ⁇ m or more.
  • the through hole in the present invention is manufactured by the punching method described later, if the thickness of the reflective layer is thick, the height (h) of the raised portion protruding toward the adhesive layer within the area of 1.0 mm around the through hole is high. It becomes a tendency to become.
  • the method for setting the thickness of the reflective layer within the above-mentioned preferable range is not particularly limited, but when a white resin film is used for the reflective layer, in the conventional material, the decrease in the thickness of the reflective layer has a trade-off relationship with the reflectance. Therefore, it is difficult to achieve both, and the film-forming property is remarkable when the film thickness is 80 ⁇ m or less due to the influence of the white pigment added in a large amount to increase the reflectance and the voids formed by the stretching step. There was a problem that the film itself became difficult due to the deterioration. To solve this problem, it is preferable to perform a surface treatment for enhancing the compatibility between the white pigment and the resin.
  • the surface treatment agent silicone, a silane coupling agent, an aluminum chelating agent, polyurea and the like are preferably used. Particularly preferred is a silane coupling agent.
  • the surface-treated white pigment particles are melt-kneaded with the void nucleating agent in advance to obtain a masterbatch, and then the resin which is the main component of the reflective layer and the masterbatch are melt-kneaded to obtain the masterbatch. It is also preferable to obtain a structure in which white pigment particles are contained inside the void nucleating agent.
  • the height of the LED light source is preferably 250 ⁇ m or less. It is more preferably 100 ⁇ m or less. Conventionally, an LED light source having a height of 1 mm or more has been used. When performing delicate display, the number of LED light sources is increased, but the manufacturing cost associated with the cost of increasing the LED light sources has been a problem. Further, when changing from a normal flat display to a curved display, there is a problem that a desired curved shape cannot be realized due to the size and rigidity of the LED.
  • the LED light source having the height of the LED light source in the above range is suitable for mass production using the chip-on-board method of mounting directly on the substrate, the LED light source having a height of 1 mm or more is suitable for mass production. Since the cost is low, the cost can be reduced when the number of LED light sources is increased. Further, by using the LED light source having the height of the LED light source in the above range, it is possible to achieve the followability to the curved surface shape, and it can be preferably used for a thin liquid crystal display application.
  • a peeling layer is formed from a laminate having at least the peeling layer, the adhesive layer, the reflective layer, and the support layer in this order and having through holes penetrating all the layers.
  • Examples thereof include a manufacturing method including step C of peeling (removing the support layer from the laminate attached to the substrate).
  • the method is not particularly limited to such an example.
  • a method of manufacturing the release layer, the reflective layer, and the support layer by a method of manufacturing each of them and then laminating them in a subsequent step can be given as an example.
  • a method for producing a reflective layer included in a laminated body of the present invention will be described with reference to a three-layer laminated film as an example, but the present invention is not particularly limited to this example, and even a single layer may be used. It may have a laminated structure other than the three layers.
  • the main extruder is a resin as a raw material for the core layer (Y), and the sub-extruder is a surface layer (X). Add the raw material resin. It is preferable that each raw material is dried so that the water content is 50 ppm or less.
  • the raw material can be supplied to each extruder, and for example, an X / Y / X three-layer laminated film can be obtained by using two extruders and a feed block or a multi-manifold installed on the upper part of the T-die.
  • the extruded unstretched sheet is closely cooled and solidified on a cooled drum to obtain an unstretched laminated film.
  • This unstretched film is heated to a temperature equal to or higher than the glass transition temperature (Tg) of the polymer by roll heating and, if necessary, infrared heating, etc., and stretched in the longitudinal direction (hereinafter, may be referred to as longitudinal stretching) to obtain a longitudinally stretched film. obtain.
  • This stretching is performed by utilizing the difference in peripheral speed between two or more rolls.
  • the magnification of longitudinal stretching depends on the required characteristics of the application, but is preferably 2 to 6 times, more preferably 3 to 4 times. When it is set to 2 times or more, the reflectance can be increased, and when it is set to 6 times or less, breakage during film formation can be suppressed.
  • the film after longitudinal stretching is subsequently subjected to sequential stretching in a direction orthogonal to the longitudinal direction (hereinafter, may be referred to as transverse stretching), heat fixation, and heat relaxation to obtain a biaxially oriented film.
  • the treatment is preferably performed while the film is running.
  • the preheating and stretching temperature for lateral stretching are preferably performed at a glass transition temperature (Tg) or higher (Tg + 20 ° C.) of the polymer.
  • Tg glass transition temperature
  • the lateral stretching ratio depends on the required characteristics of the application, but is preferably 2.5 to 6 times, more preferably 3 to 4 times.
  • the reflectance can be increased by setting the reflectance to 2.5 times or more. Breaking during film formation can be suppressed by setting the value to 6 times or less.
  • heat treatment was continuously performed in a tenter at a temperature of 180 to 230 ° C. for 1 to 60 seconds to make it uniform. After slow cooling, cool to room temperature and wind up on a roll. The heat treatment may be performed while relaxing the film by 3 to 12% in the longitudinal direction and / or the width direction thereof.
  • stretching by the sequential biaxial stretching method may be stretched by either the sequential biaxial stretching method or the simultaneous biaxial stretching method, and further, if necessary, two. After axial stretching, re-longitudinal stretching and / or re-transverse stretching may be performed.
  • each polyester film in order to impart slipperiness, antistatic property, ultraviolet light absorption performance, etc. to at least one surface of each polyester film within the range where the effect of the present invention is not impaired, various coating liquids are used using well-known techniques. May be applied, or a hard coat layer or the like may be provided to enhance impact resistance. The coating may be applied at the time of film production (in-line coating) or may be applied on the polyester film after film production (offline coating).
  • a method for manufacturing the release layer used in the present invention will be described.
  • a method for producing the release layer a method in which a polyester film is produced by the same method as the above-mentioned method for producing a reflective layer, and then a release agent is applied and dried in order to impart mold releasability can be mentioned.
  • a method of applying and drying the release agent either an in-line coating method performed at the time of forming the polyester film or an offline coating method performed after forming the polyester film film may be performed.
  • the method for producing the support layer examples include a method in which a polyester film is produced by the same method as the method for producing a reflective layer, and then a slightly adhesive layer is applied and dried in order to impart slight adhesiveness.
  • a method for applying and drying the slightly adhesive layer either an in-line coating method performed at the time of forming the polyester film or an offline coating method performed after forming the polyester film film may be performed. Further, a pigment may be appropriately added to the slightly adhesive layer for identification.
  • an adhesive layer is applied to a polyester film to be a reflective layer, dried, and then laminated with a release layer.
  • a laminated body can be obtained by applying a slightly adhesive layer containing a colorant to the support layer, drying it, and laminating it on the reflective layer side of the laminated polyester film which is a release layer / adhesive layer / reflective layer. ..
  • the adhesive layer is a layer having a peeling force of 2 N / 25 mm or more measured by the 180 ° peeling test described in JIS Z 0237: 2009, and the slightly adhesive layer is measured by the 180 ° peeling test described in JIS Z 0237: 2009.
  • the layer has a peeling force of 0.01 N / 25 mm or more and less than 2 N / 25 mm.
  • a single-sided copper foil-clad laminate is prepared, an etching resist is formed on the copper foil by a printing method, and then etching is performed to form a conductor pattern having wiring and terminals for mounting LEDs on one surface of the insulating substrate.
  • the substrate was obtained.
  • an LED light source for example, a rectangular parallelepiped blue LED light source having a light emitting portion height of 100 ⁇ m and a vertical and horizontal length of 300 ⁇ m
  • a rectangular parallelepiped blue LED light source having a light emitting portion height of 100 ⁇ m and a vertical and horizontal length of 300 ⁇ m
  • a through hole having a desired size is formed at a position corresponding to the position of the LED light source of the base material to which the LED light source is connected.
  • a known method such as a method using a drill or a laser, a punching using a Thomson blade, a press die, or an embossed roll can be used, but the punching method is used from the viewpoint of productivity. It is preferably used.
  • a punching method By forming a through hole from the support side of the laminated body by using a punching method, a raised portion protruding toward the adhesive layer side is formed in a region of 1.0 mm around the through hole.
  • the height of the raised portion protruding toward the adhesive layer can be controlled by controlling the clearance between the male mold and the female mold of the punching mold.
  • the clearance between the male and female punching molds is 10 ⁇ m or more and 75 ⁇ m or less, more preferably 20 ⁇ m or more and 50 ⁇ m or less.
  • the distance between the tip of the LED light source and the surface of the reflective layer was measured by the same method and used as the protrusion height (P). If observation from the side is difficult, cut the entire LED substrate perpendicular to the surface of the reflective layer so as not to be deformed by a diamond cutter, then finish-cut the cross section using an ion milling device and then use an electron microscope. Observed. Further, the ratio (H2 / H1) of the height (H1) of the LED light source and the height (H2) of the reflective layer was calculated by dividing H2 by H1.
  • the cross-sectional image is captured in image analysis software, and three points on the surface of the reflective layer located at least 2.0 mm away from each other at least 1.1 mm away from the center of gravity of the through hole when the reflective layer is viewed from directly above the surface are selected.
  • the reflective layer surface baseline 7 was determined.
  • the region included in the concentric circle with a radius of 1.0 mm is defined as the through hole circumference 1.0 mm region 8 and the through hole circumference 1.0 mm.
  • the height of the maximum point 10 of the raised portion of the reflective layer protruding toward the adhesive layer side with respect to the baseline in the region was determined.
  • the LED substrate created in the example described later is made to emit light, and an image is taken with a CCD camera (DXC-390 manufactured by SONY) from a point 90 cm directly above the LED substrate, and an image analysis device (CA-manufactured by Konica Minolta) is used.
  • a CCD camera DXC-390 manufactured by SONY
  • CA-manufactured by Konica Minolta CA-manufactured by Konica Minolta
  • an image in the range of 20 mm ⁇ 20 mm was captured, the brightness level was controlled to 30,000 steps and automatically detected, and the brightness was calculated.
  • an LED substrate excluding only the reflective layer was prepared, and the brightness was measured in the same manner.
  • the brightness of the LED substrate having the reflective layer was divided by the luminance of the LED substrate without the reflective layer to obtain the relative luminance.
  • the brightness was evaluated according to the following criteria. A: 130% or more B: 120% or more and less than 130% C: 100% or more and less than 120% D: less than 100%.
  • Luminance unevenness The luminance unevenness (%) was calculated by the following formula for the five relative luminance values measured at arbitrary five points in the relative luminance measurement of (6).
  • Luminance unevenness (%) ⁇ (maximum value of 5 relative brightness values)-(minimum value of 5 relative brightness values) / (average value of 5 relative brightness values) ⁇ ⁇ 100 Luminance unevenness and sample condition were evaluated according to the following criteria.
  • B Luminance unevenness is 2.0% or more and less than 5.0%
  • C Luminance unevenness is 5.0% or more and less than 10.0%
  • D Luminance unevenness is 10.0% or more ..
  • the measurement conditions were the conditions at which the display resolution was the highest.
  • the thickest layer was observed, and the sample cross section was observed so that the target region range to be observed by mapping was 10,000 to 22,500 ⁇ m 2 in total.
  • the highest point is defined as the cut surface, and the portion with a height of -50 to 0 nm with the height of the cut surface as the reference height is a white region (brightness 100) and a height of -50 nm.
  • the part less than the black area (brightness 0) was used to binarize the observation data.
  • the void content V was calculated for all 19 vertical cross sections produced, and the average value was taken as the average void content.
  • Polyester resin (a) Polymerization of terephthalic acid and ethylene glycol using antimony trioxide as a catalyst was carried out by a conventional method to obtain polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the obtained PET had a glass transition temperature of 77 ° C., a melting point of 255 ° C., an intrinsic viscosity of 0.63 dl / g, a heat of crystal melting of 35 J / g, and a terminal carboxyl group concentration of 40 equivalents / t.
  • Thermoplastic resin (b) A commercially available cyclic olefin resin "TOPAS 6017" (Nippon Polyplastics Co., Ltd.) was used.
  • Titanium dioxide master To 50 parts by mass of titanium dioxide particles (number average particle size 0.25 ⁇ m, rutile type), 0.25 parts by mass of a silane coupling agent “11-100 Adaptive” (manufactured by Tohredo Corning Co., Ltd.) was added by a conventional method. After surface treatment, 50 parts by mass of the polyester resin (a) was kneaded with a twin-screw extruder to obtain titanium dioxide master pellets (c).
  • a silane coupling agent “11-100 Adaptive” manufactured by Tohredo Corning Co., Ltd.
  • Aggregated silica master (d) Agglomerated silica particles (number average particle diameter 4.0 ⁇ m) were kneaded with 10 parts by mass of particle concentration and 90 parts by mass of polyester resin (a) with a twin-screw extruder to obtain silica master (d).
  • Example 1 [Release layer] A 38 ⁇ m-thick polyethylene terephthalate film (PET38X manufactured by Lintec Corporation) with a silicone release agent was used.
  • these molten polymers were merged in the T-die composite base so that the surface layer was laminated (X / Y / X) on both surface layers of the core layer. Subsequently, the fused molten polymer was extruded into a sheet to form a molten sheet, and the molten sheet was brought into close contact with a drum maintained at a surface temperature of 25 ° C. by an electrostatic application method and cooled and solidified to obtain an unstretched film.
  • the unstretched film was preheated with a roll group heated to a temperature of 80 ° C., and then longitudinally stretched (stretched in the longitudinal direction of the film) at the magnification shown in Table 2 while irradiating from both sides with an infrared heater.
  • a uniaxially stretched film was obtained by cooling with a roll group having a temperature of ° C.
  • the film was guided to a preheating zone at 90 ° C. in the tenter, and laterally stretched (stretched in the film width direction) at 95 ° C. at the magnification shown in Table 2.
  • the heat treatment was performed at the temperature shown in Table 2 in the heat treatment zone in the tenter, and then the film was uniformly slowly cooled and then wound on a roll to obtain a biaxially oriented polyester film (reflective layer) having the thickness shown in Table 2.
  • Silicone resin adhesive (SH4280PSA, manufactured by Toray Dow Corning Co., Ltd.) 100 parts by mass, benzoyl peroxide catalyst (Niper (R) BMT-K40, manufactured by Nikko Co., Ltd.) 0.15 mass on the film to be the reflective layer.
  • Niper (R) BMT-K40 manufactured by Nikko Co., Ltd.
  • a mixture of 50 parts by mass and 50 parts by mass of toluene was applied so that the thickness of the adhesive layer after drying was the thickness shown in Table 1-1, and heat-curing was performed at 70 ° C. for 3 minutes and at 180 ° C. for 5 minutes. ..
  • LED board With respect to the laminate obtained by the above method, a die press having a clearance between the male mold and the female mold of 55 ⁇ m was used, and the through-hole area and through-hole major axis per one were shown in Tables 1-1 and 1-2. It was processed to make a circular through hole as described in. The positions of the holes were adjusted so that the center of each LED light source when the LED mounting base material was observed from directly above the surface coincided with the center of each hole.
  • the peeling layer is removed from the laminated body, and each LED is placed on the LED mounting base material so that each LED can be inserted in the through hole, and a linear pressure of 5 kgf / cm is applied using a laminator. After fixing, the support layer was peeled off. Next, an acrylic diffuser is placed on it so that the gap with the blue LED is 5 mm, a prism sheet is placed on it, and the LED is allowed to stand for 1 hour under the conditions of a temperature of 25 ° C. and a relative humidity of 65%. A substrate was prepared.
  • Examples 2 to 9, Comparative Examples 1 to 4 An LED substrate was produced in the same manner as in Example 1 except that the conditions were as shown in Table 1-1 and Table 1-2.
  • Comparative Example 3 the LED substrate could not be manufactured because the positional deviation during the bonding process was strong. Further, in Comparative Example 4, the reflective layer was deformed when the support layer was peeled off, and the LED substrate could not be manufactured.
  • Example 10 An LED substrate was produced in the same manner as in Example 3 except that the drilling process was performed using a mold press having a clearance between the male mold and the female mold of 40 ⁇ m.
  • Example 11 [Reflective layer 7: Polyester film] After obtaining the reflective layer 2 shown in Table 2, a coating film having the following composition is applied so that the thickness after drying is 3 ⁇ m, and after the coating, the film is dried at a temperature of 120 ° C. for 2 minutes to obtain Table 1-. A polyester film (reflective layer 7) having the surface roughness described in 2 was obtained.
  • Binder Binder; Hals Hybrid (registered trademark) UV-G720T (solid content 40% by mass, manufactured by Nippon Catalyst Co., Ltd.): 10 parts by mass, curing agent; Duranate 24A-100 (manufactured by Asahi Kasei Chemicals Co., Ltd.): 0.4% by mass Parts, beads; "Olgasol” (registered trademark) 1002 UD NAT 1 (porous nylon 6 resin particles, manufactured by Alchema Co., Ltd., average particle diameter 5 ⁇ m): 4.6 parts by mass, solvent; ethyl acetate: 12 parts by mass.
  • An LED substrate was produced in the same manner as in Example 2 except that the reflective layer 7 was used as the reflective layer.
  • Example 12 An LED substrate was produced in the same manner as in Example 2 except that the following polyester film (reflection layer 8) was used as the reflection layer.
  • “Reflective layer 8: Polyester film] A raw material consisting of 60% by mass of polyester resin (a), 20% by mass of thermoplastic resin (b), and 20% by mass of titanium dioxide master (c) is vacuum dried at a temperature of 180 ° C. for 6 hours and then supplied to the main extruder. After melt extrusion at a temperature of 280 ° C., filtration was performed with a 30 ⁇ m cut filter.
  • the molten polymer was extruded from a T-die into a sheet to form a molten sheet, and the molten sheet was brought into close contact with a drum maintained at a surface temperature of 25 ° C. by an electrostatic application method and cooled and solidified to form an unstretched film. ..
  • the unstretched film was preheated with a roll group heated to a temperature of 80 ° C., and then longitudinally stretched (stretched in the longitudinal direction of the film) at the magnification shown in Table 2 while irradiating from both sides with an infrared heater. A uniaxially stretched film was obtained by cooling with a roll group having a temperature of ° C.
  • the film was guided to a preheating zone at 90 ° C. in the tenter, and laterally stretched (stretched in the film width direction) at 95 ° C. at the magnification shown in Table 2.
  • the heat treatment was performed at the temperature shown in Table 2 in the heat treatment zone in the tenter, and then the film was uniformly slowly cooled and then wound on a roll to obtain a biaxially oriented polyester film (reflection layer 8) having the thickness shown in Table 2. ..
  • Example 13 Comparative Example 5
  • Base material equipped with LED light source Blue LED light sources of the sizes shown in Table 1-2 are arranged in parallel at the pitch shown in Table 1-1 on a resin substrate having a long side (horizontal direction) of 140 mm and a short side (vertical direction) of 76.4 mm.
  • a base material equipped with an LED light source was prepared. The pitch was the same both vertically and horizontally, and the LEDs were installed so as to fill the entire surface.
  • Adhesive layer 100 parts by mass of silicone resin adhesive (SH4280PSA, manufactured by Toray Dow Corning Co., Ltd.), benzoyl peroxide catalyst (Niper (R) BMT-K40,) on the surface of the reflective layer provided on the surface of the base material on which the LED light source is mounted. (Manufactured by Nichiyu Co., Ltd.) A mixture of 0.15 parts by mass and 50 parts by mass of toluene was applied so that the thickness of the adhesive layer after drying was the thickness shown in Table 1-1, and the temperature was 70 ° C. for 3 minutes. It was heat-cured at 180 ° C. for 5 minutes to provide an adhesive layer. A screen printing method is used for coating, holes are made to avoid the LED light source, and the size of each hole is 0.4 mm 2. When viewed from directly above the surface of the substrate, the holes in the reflective layer are used. And the position overlapped.
  • silicone resin adhesive SH4280PSA, manufactured by Toray Dow Corning Co., Ltd.
  • LED board Next, an acrylic diffuser is placed on it so that the gap with the blue LED is 5 mm, a prism sheet is placed on it, and the LED is allowed to stand for 1 hour under the conditions of a temperature of 25 ° C. and a relative humidity of 65%. A substrate was prepared.
  • Example 6 An LED substrate was tried to be produced in the same manner as in Example 2 except that the release layer, the adhesive layer, and the reflective layer were laminated in this order and a laminate having no support layer was used, but the laminate was used as a base material. The LED substrate could not be manufactured because it could not be sufficiently adhered to.
  • an LED substrate that can be suitably used for a mini LED type backlight.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Planar Illumination Modules (AREA)

Abstract

Selon l'invention, un substrat de DEL (1) comprend, sur au moins une surface d'un matériau de base (2), une source de lumière à DEL (5), une couche réfléchissante (3), et une couche adhésive (4) disposée adjacente à la couche réfléchissante (3). La couche réfléchissante (3) comprend un pigment blanc. La source de lumière à DEL (5) a une partie faisant saillie au-delà de la couche réfléchissante (3) par une hauteur de saillie (P) de 20 µm à 200 µm compris. Le substrat de DEL (1) peut fournir une luminosité suffisante y compris lorsqu'il est utilisé en tant que substrat de DEL de type mini-DEL (1).
PCT/JP2021/018185 2020-05-22 2021-05-13 Substrat de del, empilement et procédé de fabrication de substrat de del WO2021235310A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180033745.6A CN115516650A (zh) 2020-05-22 2021-05-13 Led基板、叠层体及led基板的制造方法
KR1020227035214A KR20230015314A (ko) 2020-05-22 2021-05-13 Led 기판, 적층체, 및 led 기판의 제조 방법
JP2021531332A JPWO2021235310A1 (fr) 2020-05-22 2021-05-13

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-089421 2020-05-22
JP2020089421 2020-05-22
JP2020-156933 2020-09-18
JP2020156933 2020-09-18
JP2021-041094 2021-03-15
JP2021041094 2021-03-15

Publications (1)

Publication Number Publication Date
WO2021235310A1 true WO2021235310A1 (fr) 2021-11-25

Family

ID=78708363

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/018185 WO2021235310A1 (fr) 2020-05-22 2021-05-13 Substrat de del, empilement et procédé de fabrication de substrat de del

Country Status (5)

Country Link
JP (1) JPWO2021235310A1 (fr)
KR (1) KR20230015314A (fr)
CN (1) CN115516650A (fr)
TW (1) TW202209712A (fr)
WO (1) WO2021235310A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101820044A (zh) * 2010-04-09 2010-09-01 江苏伯乐达光电科技有限公司 金属基板及金属基板的led的封装方法
WO2011118109A1 (fr) * 2010-03-23 2011-09-29 株式会社朝日ラバー Substrat réfléchissant souple, procédé de fabrication associé, et composition de matériau de base utilisé dans un substrat réfléchissant
JP2012069749A (ja) * 2010-09-24 2012-04-05 Koito Mfg Co Ltd 発光モジュール
JP2014003260A (ja) * 2012-06-21 2014-01-09 Sumitomo Electric Printed Circuit Inc プリント配線板、プリント配線板集合体、プリント配線板の製造方法及び照明装置。
JP2014036127A (ja) * 2012-08-09 2014-02-24 Nichia Chem Ind Ltd 発光装置
WO2015045979A1 (fr) * 2013-09-27 2015-04-02 東レ株式会社 Film en polyester blanc
JP2016139760A (ja) * 2015-01-29 2016-08-04 Ｓｈマテリアル株式会社 リードフレーム、光半導体装置用樹脂付きリードフレーム及びこれらの製造方法、並びに光半導体装置
JP2017143236A (ja) * 2016-02-09 2017-08-17 日東電工株式会社 セラミックスプレート、その製造方法および光半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0816175A (ja) 1994-06-27 1996-01-19 Calsonic Corp 能動型消音器
JP2003160682A (ja) 2001-11-27 2003-06-03 Toray Ind Inc 光反射フィルム
JP3946183B2 (ja) 2003-10-27 2007-07-18 帝人デュポンフィルム株式会社 白色ポリエステルフィルム
JP2013136232A (ja) 2011-11-30 2013-07-11 Toray Ind Inc 光反射板用ポリエステルフィルム
JP6490891B2 (ja) 2013-11-29 2019-03-27 帝人フィルムソリューション株式会社 直下型面光源用白色反射フィルム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011118109A1 (fr) * 2010-03-23 2011-09-29 株式会社朝日ラバー Substrat réfléchissant souple, procédé de fabrication associé, et composition de matériau de base utilisé dans un substrat réfléchissant
CN101820044A (zh) * 2010-04-09 2010-09-01 江苏伯乐达光电科技有限公司 金属基板及金属基板的led的封装方法
JP2012069749A (ja) * 2010-09-24 2012-04-05 Koito Mfg Co Ltd 発光モジュール
JP2014003260A (ja) * 2012-06-21 2014-01-09 Sumitomo Electric Printed Circuit Inc プリント配線板、プリント配線板集合体、プリント配線板の製造方法及び照明装置。
JP2014036127A (ja) * 2012-08-09 2014-02-24 Nichia Chem Ind Ltd 発光装置
WO2015045979A1 (fr) * 2013-09-27 2015-04-02 東レ株式会社 Film en polyester blanc
JP2016139760A (ja) * 2015-01-29 2016-08-04 Ｓｈマテリアル株式会社 リードフレーム、光半導体装置用樹脂付きリードフレーム及びこれらの製造方法、並びに光半導体装置
JP2017143236A (ja) * 2016-02-09 2017-08-17 日東電工株式会社 セラミックスプレート、その製造方法および光半導体装置

Also Published As

Publication number Publication date
TW202209712A (zh) 2022-03-01
KR20230015314A (ko) 2023-01-31
CN115516650A (zh) 2022-12-23
JPWO2021235310A1 (fr) 2021-11-25

Similar Documents

Publication Publication Date Title
TWI619600B (zh) Biaxially oriented polyester film for demolding
JP5363206B2 (ja) 光学用ポリエステルフィルム
TWI608035B (zh) Biaxially oriented laminated polyester film for release
TW201634521A (zh) 二軸配向聚酯薄膜
TWI488743B (zh) Reflector with white film
JP6463952B2 (ja) 二軸配向ポリエステルフィルム
JP6630108B2 (ja) 艶消し層を有する二軸配向ポリエステルフィルム
JP2006051661A (ja) 離型フィルム
KR101812834B1 (ko) 광 반사체 및 그것을 사용한 면 광원 장치
WO2021235310A1 (fr) Substrat de del, empilement et procédé de fabrication de substrat de del
JP6862829B2 (ja) 白色反射フィルム
JP2010225434A (ja) フレキシブルエレクトロニクスデバイス基板およびその製造方法
JP2005181648A (ja) プリズムシート用光散乱性ポリエテルフィルム
JP2016221853A (ja) 積層ポリエステルフィルム
WO2021200454A1 (fr) Film de résine, substrat de mini-del, rétroéclairage et dispositif d'affichage
JP2006051681A (ja) 離型フィルム
JP7543702B2 (ja) 反射板および反射板を有する積層体
KR20190094846A (ko) 폴리에스테르 이형 필름 및 이의 제조 방법
JP7077942B2 (ja) トレイ形状を有する反射板
JP2018072496A (ja) エッジライト型バックライト用白色反射フィルム及びそれを用いた液晶ディスプレイ用バックライト
JP2023037175A (ja) ポリエステルフィルム、ミニｌｅｄ基板、バックライトおよびディスプレイ
JPWO2020050030A1 (ja) 反射板
JP2010208139A (ja) 二軸延伸ポリエステルフィルム
JP2022052029A (ja) Ｌｅｄ基板
JP2022052030A (ja) Ｌｅｄ基板

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2021531332

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21808344

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21808344

Country of ref document: EP

Kind code of ref document: A1