WO2021232977A1 - 天线模块和电子设备 - Google Patents

天线模块和电子设备 Download PDF

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Publication number
WO2021232977A1
WO2021232977A1 PCT/CN2021/085655 CN2021085655W WO2021232977A1 WO 2021232977 A1 WO2021232977 A1 WO 2021232977A1 CN 2021085655 W CN2021085655 W CN 2021085655W WO 2021232977 A1 WO2021232977 A1 WO 2021232977A1
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WIPO (PCT)
Prior art keywords
heat dissipation
dissipation element
antenna
antenna module
heat
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PCT/CN2021/085655
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English (en)
French (fr)
Inventor
徐峰
Original Assignee
Oppo广东移动通信有限公司
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Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021232977A1 publication Critical patent/WO2021232977A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion

Definitions

  • This application relates to the field of electronic equipment, and in particular to an antenna module and electronic equipment.
  • the antenna components of electronic equipment usually generate a large amount of heat during operation, and it is necessary to install a heat sink such as a heat sink to dissipate the antenna components.
  • a heat sink such as a heat sink
  • the installation of the heat sink may reduce the radiation rate of the antenna signal, especially When using 5G wireless communication, because the spectrum used in 5G communication mainly includes sub-6GHz and millimeter wave, but the millimeter wave frequency is high and the wavelength is short, the diffraction ability is weak, the penetration ability is weak, and it cannot exist within a certain distance of the antenna component.
  • the embodiments of the present application provide an antenna module and electronic equipment.
  • the electronic device of the embodiment of the present application includes a housing and the above-mentioned antenna module, the antenna module is at least partially disposed in the housing, and the projection of the first heat dissipation element on the transmitting surface at least partially covers the transmitting surface. noodle.
  • FIG. 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is another three-dimensional schematic diagram of the electronic device according to the embodiment of the present application.
  • FIG. 3 is a schematic diagram of the internal structure of an electronic device according to an embodiment of the present application.
  • FIG. 4 is another three-dimensional schematic diagram of the electronic device according to the embodiment of the present application.
  • Fig. 5 is an exploded schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 6 is a three-dimensional schematic diagram of an antenna module according to an embodiment of the present application.
  • Fig. 7 is a schematic plan view of an antenna module according to an embodiment of the present application.
  • FIG. 8 is an exploded schematic diagram of the antenna module of the embodiment of the present application.
  • Figure 9 is a schematic diagram of the molecular structure of ultra-high molecular weight polyethylene fibers without directional extrusion and drawing stacking;
  • Figure 10 is a schematic diagram of the molecular structure of ultra-high molecular weight polyethylene fibers after directional extrusion and drawing and stacking;
  • FIG. 11 is another exploded schematic diagram of the antenna module according to the embodiment of the present application.
  • Fig. 12 is a schematic diagram of the comparison of the lobe width of the antenna signal in the horizontal direction
  • FIG. 13 is a schematic diagram of the comparison of the lobe width of the antenna signal in the vertical direction
  • FIG. 14 is a schematic diagram of the comparison of the radiation efficiency of the antenna signal in the horizontal direction
  • Fig. 15 is a comparison diagram of the radiation efficiency of the antenna signal in the vertical direction.
  • Electronic device 1000 base station 1100, antenna module 100, circuit board 10, antenna 20, emitting surface 21, mounting surface 22, accommodating space 23, first heat dissipation element 30, first substrate 31, first heat sink 32, second The heat dissipation element 40, the second substrate 41, the second heat sink 42, the third heat dissipation element 50, the housing 200, the heat dissipation channel 210, the base 220, the air intake channel 221, the surrounding wall 230, the top cover 240, the connector 300, the frame The body 400, the cooling fan 500, and the rotating mechanism 600.
  • FIG. 1 shows a three-dimensional schematic diagram of an electronic device 1000 according to an embodiment of the present application.
  • the electronic device 1000 in the embodiment of this application includes but is not limited to wireless devices such as Customer Premise Equipment (CPE) and wireless routers.
  • the electronic device 1000 may be a 5G client terminal device, and the client terminal device is a type of wireless broadband access
  • the device can convert the signal transmitted by the base station 1100 (Base Station) (for example, 5G millimeter wave signal) into a WiFi (Wireless Fidelity) signal common to mobile terminals such as tablets, smartphones, and notebooks, and can support multiple mobile terminals at the same time Go online.
  • the client terminal device may also send data to the base station 1100 to transmit the data to the server center through the base station 1100.
  • the electronic device 1000 may be installed indoors or outdoors. Specifically, when the electronic device 1000 is installed indoors, the electronic device 1000 may be installed on a wall or placed on a desk or other places. When the electronic device 1000 is installed outdoors, the electronic device 1000 may be fixed on a wall, for example, the electronic device 1000 may be fixed on the wall by a mounting frame. The electronic device 1000 located outdoors can be connected to an indoor mains power supply through a wire, so that the mains can continuously power the electronic device 1000.
  • the electronic device 1000 may have a regular shape such as a cylindrical shape or a square column shape. Of course, the electronic device 1000 may also have other irregular shapes. In the electronic device 1000 shown in FIG. 1, the cross-section of the electronic device 1000 is roughly elliptical.
  • the electronic device 1000 includes a housing 200, a frame 400, a heat dissipation fan 500, and an antenna module 100.
  • the frame 400 is disposed in the housing 200, and the frame 400 is used to carry internal components of the electronic device 1000, for example, the frame 400 is used to carry the antenna module 100 and the heat dissipation fan 500.
  • the heat dissipating fan 500 is disposed in the casing 200, and the heat dissipating fan 500 is used to generate air flow to dissipate the heat in the casing 200 to the outside of the casing 200.
  • the antenna module 100 is at least partially disposed in the housing 200.
  • the antenna module 100 can be used to send and receive signals.
  • the housing 200 is an external part of the electronic device 1000.
  • the housing 200 may constitute the external shape of the electronic device 1000, or in other words, the specific shape of the electronic device 1000 is roughly determined by the housing 200.
  • the housing 200 is cylindrical, the overall shape of the electronic device 1000 is cylindrical.
  • the housing 200 may have a hollow structure, and the housing 200 may house internal components of the electronic device 1000 to protect the internal components of the electronic device 1000.
  • the housing 200 can reduce the impact of the internal components of the electronic device 1000, and prevent the internal components from causing undesirable consequences such as displacement and affecting the normal use of the electronic device 1000.
  • the housing 200 can reduce the contact of foreign objects such as dust and water vapor with the internal components, and prevent the internal components from being damaged by a short circuit.
  • the housing 200 may be made of materials such as metal or plastic. In order to improve the ability of the electronic device 1000 to send and receive signals, the housing 200 may be made of non-shielding materials such as plastic. In this way, the signal can penetrate the housing 200 and be received by the antenna module 100 in the housing 200. In addition, the antenna module 100 in the housing 200 can transmit signals through the housing 200.
  • the housing 200 can be made of multiple materials according to the specific functions of the housing 200.
  • the housing 200 as a bearing part may be made of a strong material such as metal.
  • the housing 200 may have a heat dissipation channel 210 for dissipating heat in the housing 200 to the outside of the housing 200.
  • the heat in the housing 200 can be dissipated to the outside of the housing 200 through the heat dissipation channel 210, thereby reducing the temperature in the housing 200 and ensuring the normal operation of the electronic device 1000.
  • the heat dissipation channel 210 may be a hole with a specific shape such as a circular hole, a square hole, or a special shape.
  • the number of heat dissipation channels 210 may be multiple, and the plurality of heat dissipation channels 210 may be arranged at intervals along the circumferential direction of the housing 200.
  • the multiple heat dissipation channels 210 may increase the heat dissipation area of the heat inside the housing 200, thereby improving electronic components.
  • the cooling rate of the device 1000 may be a hole with a specific shape such as a circular hole, a square hole, or a special shape.
  • the number of heat dissipation channels 210 may be multiple, and the plurality of heat dissipation channels 210 may be arranged at intervals along the circumferential direction of the housing 200.
  • the multiple heat dissipation channels 210 may increase the heat dissipation area of the heat inside the housing 200, thereby improving electronic components.
  • the heat dissipation channel 210 may be located at the top of the housing 200. It can be understood that air with a higher temperature generally flows upward. Therefore, arranging the heat dissipation channel 210 on the top of the housing 200 facilitates the dissipation of heat in the housing 200 through the heat dissipation channel 210.
  • the “top” referred to in the embodiments of the present application refers to the part located above the electronic device 1000 when the electronic device 1000 is in normal use.
  • the height of the top of the electronic device 1000 is 1/4 of the total height of the electronic device 1000. Therefore, the top of the housing 200 is the upper part of the housing 200 when the electronic device 1000 is in normal use.
  • the heat dissipation channel 210 may be formed on the top surface of the housing 200 or on the side surface of the housing 200, or the heat dissipation channel 210 may be formed on both the top surface and the side surface of the housing 200.
  • the heat dissipation channel 210 may be omitted.
  • the heat dissipation of the electronic device 1000 can be directly transferred to the outside of the housing 200 through the housing 200.
  • the housing 200 includes a base 220, a surrounding wall 230, and a top cover 240.
  • the surrounding wall 230 connects the base 220 and the top cover 240.
  • the base 220 and the surrounding wall 230 may be a separate structure, or in other words, the surrounding wall 230 can be detachably installed on the base 220.
  • the base 220 and the surrounding wall 230 may also be an integral structure.
  • the surrounding wall 230 and the top cover 240 may be a separate structure or an integral structure.
  • the base 220 may provide support when the electronic device 1000 is placed on a supporting surface such as a desktop.
  • the base 220 may have a block shape or a plate shape or the like.
  • the base 220 is provided with an air inlet channel 221, and the air inlet channel 221 is used for the external air of the electronic device 1000 to enter the housing 200, so that the gas absorbs the heat generated by the electronic device 1000 and radiates from the heat dissipation channel 210 To the outside of the housing 200.
  • the surrounding wall 230 may form a accommodating space for accommodating internal components of the electronic device 1000.
  • the surrounding wall 230 may be a continuous structure, in other words, the surrounding wall 230 does not form a joint seam.
  • the connector 300 of the electronic device 1000 is exposed from the surrounding wall 230 (as shown in 3 and 4).
  • the electronic device 1000 can communicate with other devices or connect to a power source through the connector 300.
  • the said connector 300 is, for example, a USB (Universal Serial Bus) connector 300, a connector 300 such as a power socket.
  • the embodiment of the present application does not limit the specific type of the connector 300.
  • the top cover 240 can cover the top of the surrounding wall 230.
  • the top cover 240 can shield the internal components of the electronic device 1000 from the top of the surrounding wall 230.
  • the top cover 240 may have a sheet-like or block-like structure.
  • the outer end surface of the top cover 240 may have a shape such as a circle, an ellipse, etc., and the structure and shape of the top cover 240 are not limited herein.
  • the heat dissipation channel 210 is provided at the junction of the top cover 240 and the surrounding wall 230. In other words, the heat dissipation channel 210 is located between the top end of the surrounding wall 230 and the top cover 240. When the heat dissipation channel 210 is annular, the heat dissipation channel 210 may be formed by a gap formed by the spacing between the top cover 240 and the surrounding wall 230.
  • the frame 400 serves as a carrying element of the electronic device 1000.
  • the internal parts of the electronic device 1000 may be installed on the frame 400.
  • at least one of the heat dissipation fan 500 and the antenna module 100 may be installed on the frame 400.
  • the internal parts of the electronic device 1000 can be installed on the frame 400 by means of screws, buckles, etc., and the specific installation method of the internal parts is not limited here. Since the structure of the frame 400 is adapted to the installation position of the internal parts of the electronic device 1000, the shape of the frame 400 is generally irregular. In order to make the frame 400 easy to manufacture and shape, the frame 400 may be formed by an injection molding process.
  • the frame 400 can be omitted.
  • the heat dissipation fan 500 is spaced apart from the antenna module 100, and the heat dissipation fan 500 is used to generate air flow to transfer the heat generated by the antenna module 100 and other components in the housing 200 through the heat dissipation channel 210.
  • the heat in 200 is radiated to the outside of housing 200.
  • the cooling fan 500 can speed up the flow of gas, thereby reducing the internal temperature rise of the electronic device 1000, and ensuring the normal use of the electronic device 1000.
  • lower temperature air can be sucked in from the air intake passage 221, so that the lower temperature air absorbs the heat generated by the antenna module 100 and other components in the housing 200 and then exhausts it from the heat dissipation passage 210 .
  • the heat dissipation fan 500 is located above the antenna module 100.
  • the “above” referred to here means that when the electronic device 1000 is in normal use, the direction of the electronic device 1000 away from the ground is “up”. Therefore, in this embodiment, the position of the cooling fan 500 is higher than the position of the antenna module 100.
  • the heat dissipation fan 500 can dissipate the heat generated by the antenna module 100 during operation to the outside of the housing 200 through the heat dissipation channel 210.
  • the cooling fan 500 may be a centrifugal fan or an axial fan.
  • the specific type of the cooling fan 500 is not limited here, as long as the cooling fan 500 can dissipate the heat in the housing 200 through the heat dissipation channel 210 to the outside of the housing 200 .
  • the heat dissipation fan 500 may be omitted.
  • the heat dissipation of the electronic device 1000 may be transferred to the outside of the housing 200 through the housing 200 or radiated to the outside of the housing 200 through the heat dissipation channel 210.
  • the antenna module 100 includes a circuit board 10, an antenna 20, and a first heat dissipation element 30.
  • the first heat dissipation element 30 is connected to the circuit board 10, and the dielectric constant of the first heat dissipation element 30 is less than 3.
  • the antenna 20 is electrically connected to the circuit board 10, and the emitting surface 21 of the antenna 20 faces the first heat dissipation element 30.
  • the antenna components of electronic equipment usually generate a large amount of heat during operation, and it is necessary to install a heat sink such as a heat sink to dissipate the antenna components.
  • the setting of the heat sink may reduce the radiation rate of the antenna signal .
  • the frequency spectrum used by 5G communication mainly includes sub-6GHz and millimeter wave, but the millimeter wave frequency is high and the wavelength is short, the diffraction ability is weak, and the penetration ability is weak.
  • the first heat dissipation element 30 can dissipate heat to the circuit board 10, and the emitting surface 21 of the antenna 20 faces the first heat dissipation element 30, and the dielectric constant of the first heat dissipation element 30 Less than or equal to 3 can effectively prevent the first heat dissipation element 30 from affecting the antenna signal. In this way, the dielectric constant of the first heat dissipation element 30 is small, and the attenuation of the signal is weak or even negligible, so that the heat dissipation capability of the antenna 20 can be improved without affecting the antenna signal.
  • the emitting surface 21 faces the first heat dissipation element 30 can be understood as meaning that the emission surface 21 is parallel to the first heat dissipation element 30 or is inclined at a certain angle, and the first heat dissipation element 30 is The projection on the emitting surface 21 and the emitting surface 21 at least partially overlap. In the following, if the same or similar description appears, it can also be understood with reference to this. In the embodiment shown in FIGS. 6-8, the emitting surface 21 faces the first heat dissipation element 30 and is parallel to the first heat dissipation element 30.
  • the antenna 20 is a millimeter wave antenna, and the millimeter wave antenna is used to transmit and receive millimeter waves (millimeter waves).
  • Millimeter waves are electromagnetic waves with a wavelength in the frequency range of 24GHz-52GHz. Because the millimeter wave frequency is high and the wavelength is short, the diffraction ability is weak, and the penetration ability is weak, there should be no structural parts within a certain distance range of the antenna module 100 that can cause the antenna 20 to transmit signals sharply attenuated.
  • the dielectric constant of the first heat dissipation element 30 is less than 3, which attenuates the millimeter wave signal relatively weakly, so that the first heat dissipation element 30 can affect the antenna without affecting the antenna signal.
  • the circuit board 10 may be a rigid circuit board 10 or a flexible circuit board 10.
  • the circuit board 10 in order to improve the stability of mounting the circuit board 10 and the millimeter wave antenna, is, for example, a rigid circuit board such as a printed circuit board (PCB).
  • PCB printed circuit board
  • the millimeter wave antenna 20 is in the form of a sheet.
  • the millimeter wave antenna can be fixed on the circuit board 10 by welding.
  • the millimeter wave antenna can communicate with the circuit board 10 to achieve the purpose of signal transmission.
  • the antenna 20 further includes a mounting surface 22 opposite to the transmitting surface 21, and the antenna 20 transmits and receives signals through the transmitting surface 21.
  • the antenna 20 is fixedly mounted on the circuit board 10 through the mounting surface 22, the first heat dissipation element 30 is disposed on the emission surface 21, and the first heat dissipation element 30 is used to dissipate the antenna 20.
  • the first heat dissipation element 30 can quickly dissipate the heat generated by the antenna 20 to reduce the temperature of the antenna module 100 and ensure the normal operation of the antenna 20.
  • the first heat dissipation element 30 includes a first substrate 31 and a plurality of first heat dissipation fins 32 arranged on the first substrate 31, the first substrate 31 is arranged on the antenna 20
  • the emitting surface 21 at least partially covers the emitting surface 21, and a plurality of first heat dissipation fins 32 are arranged on the first substrate 31 at intervals.
  • the plurality of first heat sinks 32 can increase the heat dissipation area of the first heat dissipation element 30 and improve the heat dissipation performance of the heat dissipation element.
  • the first substrate 31 and the first heat sink 32 can dissipate the heat generated by the emitting surface 21 of the antenna 20, and the heat dissipation fan 500 can form an air flow between the plurality of first heat dissipating fins 32, thereby dissipating the heat to the antenna
  • the emitting surface 21 of 20 dissipates heat.
  • a plurality of first heat sinks 32 are arranged substantially in parallel and substantially perpendicular to the first substrate 31, and the first substrate 31 is attached to the emitting surface 21 of the antenna 20.
  • the dielectric constant of the first heat dissipation element 30 is less than or equal to 2.8, and the loss tangent value of the first heat dissipation element 30 is less than or equal to 0.001. In this way, the first heat dissipation element 30 has less influence on the antenna signal.
  • the dielectric constant of the first heat dissipation element 30 ranges from 2.3 to 2.4, and the loss tangent of the first heat dissipation element 30 ranges from 0.00018 to 0.0002.
  • the first heat dissipation element 30 includes ultra-high molecular weight polyethylene fibers.
  • the first heat dissipation element 30 may be made of ultra-high molecular weight polyethylene fiber.
  • the ultra-high molecular weight polyethylene fiber has good electrical properties, and its dielectric constant and loss tangent angle are small, so that the dielectric constant of the first heat dissipation element 30 can reach a level less than 3, thereby preventing the first heat dissipation element 30 from affecting the antenna Signal.
  • the ultra-high molecular weight polyethylene fiber may be formed by stacking the ultra-high molecular weight polyethylene fiber by drawing the ultra-high molecular weight polyethylene.
  • the ultra-high temperature molecular weight polyethylene fiber formed by oriented drawing and stacking has thermal conductivity in the fiber length direction.
  • the first heat dissipation element 30 can have better heat conduction performance without affecting the antenna signal, which improves the heat dissipation capability.
  • the microscopic aspect of the thermal conductivity of the material is reflected in the kinetic energy transfer during the phonon oscillation process.
  • the most ideal state is that the lossless phonons in the plane collide with each other, that is, the completely elastic collision (also known as the ballistic transportation of phonons). tranport").
  • UHMWPE molded by ordinary sintering and injection molding resin materials due to the internal lattice defects and impurities during the pressing and injection molding process, the molded sheet has low thermal conductivity and poor thermal conductivity, generally ⁇ 8W/mK.
  • the ultra-high molecular weight polyethylene fiber material formed by directional extrusion, drawing and stacking can reduce the mean free path of phonons, thereby reducing the probability of inelastic collisions of phonons in a single fiber. Increase the thermal conductivity in the fiber length direction.
  • the thermal conductivity of the polyethylene fiber formed by drawing can reach 40W/mK in the fiber length direction.
  • the ultra-high molecular weight polyethylene fiber polymer particles are dissolved in a specific solvent or heated to a high temperature to 145° C. to prepare an ultra-high molecular weight polyethylene fiber suspension or melt.
  • the geometric and physical changes of the nascent fiber extruded by the spinneret, the gelation, crystallization, secondary transformation of the filaments in the process of extrusion and solidification, and the orientation of macromolecules in the stretching flow can be arranged. Change the physical and mechanical properties and thermal conductivity of the resulting fiber.
  • the prepared nascent fiber is pulled up for the second time, the internal crystal lattice is oriented again under the action of external force, and the fiber bundle with the internal polymer fibers uniformly arranged along the drawing direction is obtained.
  • the ultra-high molecular weight is formed by the above-mentioned directional extrusion and drawing.
  • Polyethylene fiber can reduce the mean free path of phonons, thereby reducing the probability of inelastic collision of phonons in a single fiber, and then increasing the thermal conductivity in the length direction of the fiber.
  • Figure 9 is a schematic diagram of the structure of the UHMWPE fiber under different magnifications without directional extrusion and drawing stacking.
  • Figure 10 is the UHMWPE fiber The structural schematic diagrams of the directional extrusion and drawing stacking in the above process under different magnifications, as can be seen from Figures 9 and 10, before the directional extrusion and drawing stacking, the molecules of the ultra-high molecular weight polyethylene fiber The structural arrangement is rather messy, does not have directional thermal conductivity, and its thermal conductivity in all directions is poor. However, the molecular arrangement of ultra-high molecular weight polyethylene fibers with directional thermal conductivity produced by directional extrusion and drawing stacking is relatively regular.
  • the internal crystal lattice of UHMWPE is oriented and arranged under the action of external force to obtain fiber bundles in which the internal polymer fibers are uniformly arranged along the drawing direction, which reduces the inelastic collision of phonons in a single fiber. Probability, and then increase the thermal conductivity in the fiber length direction (that is, the drawing direction).
  • the first heat dissipation element 30 is formed to extend along the direction perpendicular to the emitting surface 21, the drawing direction of the ultra-high molecular polyethylene fiber is perpendicular to the emitting surface 21, and the thermal conductivity of the first heat dissipation element 30 along the drawing direction is greater than Or equal to 40W/mK, the thermal conductivity in the other two directions perpendicular to the drawing direction is 0.12-0.5W/mK.
  • the heat conduction efficiency of the first heat dissipating element 30 perpendicular to the emitting surface 21 can be greatly increased by using the thermal conductivity of the ultra-high molecular weight polyethylene fiber in various directions, and at the same time, it can also avoid the large amount of heat diffusion from other directions.
  • the temperature of other parts is locally too high.
  • the drawing direction of the UHMWPE is the length direction of the fiber, that is, the extension direction of the first heat dissipation element 30.
  • the extension direction of the first substrate 31 and the extension direction of the first heat sink 32 are substantially perpendicular to the emitting surface 21.
  • the heat dissipation coefficient of the first heat dissipation element 30 is larger, and the heat dissipation performance is better.
  • the density of the first heat dissipation element 30 made of ultra-high molecular weight polyethylene fiber is relatively small, with a density of 0.930 g/cm 3 , which can make the electronic device 1000 lightweight.
  • the first heat dissipation element 30 can also be made of other materials with low dielectric constant, such as PP (polypropylene), PE (polyethylene), PTFE (Polytetra fluoroethylene, polytetrafluoroethylene) and SPS (Syndiotactic Polystyrene, syndiotactic polystyrene), etc.
  • PP polypropylene
  • PE polyethylene
  • PTFE Polytetra fluoroethylene
  • SPS Syndiotactic Polystyrene, syndiotactic polystyrene
  • the overall performance of the first heat dissipation element 30 of the present application is equivalent to the heat dissipation effect of the black sprayed Al-6061 radiator, and slightly better than the heat dissipation performance of the surface-polished Al-6061 radiator.
  • K 0.26W/mK
  • no radiator it can greatly reduce the heat source temperature (>10°C income).
  • the emissivity of the first heat dissipation element 30 is also improved (greater than 0.05), but the first heat dissipation element 30 has a slightly higher heat source temperature of 0.5°C. On the whole, this The overall performance of the applied first heat dissipation element 30 is equivalent to the heat dissipation effect of the black sprayed Al-6061 heat sink.
  • the density of the first heat dissipation element 30 made of ultra-high molecular weight fibers is 0.930g/cm 3 , which is much lower than the density of aluminum profiles (2.7g/cm 3 ), and does not require surface treatment processes, so it can be used as a The product is lighter and reduces the cost of the product.
  • the antenna module 100 further includes a second heat dissipation element 40, which is disposed on the circuit board 10 and is located outside the range to which the emitting surface 21 faces.
  • the second heat dissipation element 40 is located outside the range to which the emitting surface 21 faces" can be understood as being along the direction of the emitting surface 21, and there is no overlap between the second heat dissipation element 40 and the emitting surface 21.
  • the second heat dissipation element 40 can work with the first heat dissipation element 30 to dissipate the antenna module 100, which improves the heat dissipation capacity and enables more uniform heat dissipation.
  • the second heat dissipation element 40 is located on the emitting surface 21. The direction outside the range will not affect the antenna signal.
  • the second heat dissipation element 40 can be made of a metal material or a plastic material, such as a lightweight aluminum material, which is not specifically limited here.
  • the second heat dissipation element 40 and the antenna 20 are located on opposite sides of the circuit board 10, the second heat dissipation element 40 is opposite to the emitting surface 21, and the second heat dissipation element 40 is used for To dissipate heat from the circuit board 10.
  • the first heat dissipating element 30 can dissipate heat to the emitting surface 21, and the second heat dissipating element 40 can dissipate heat to the side of the circuit board 10 opposite to the emitting surface 21.
  • both sides of the circuit board 10 can dissipate heat at the same time, so that the heat dissipation is more balanced.
  • the antenna 20 as a millimeter wave antenna as an example
  • the first heat dissipating element 30 conducts the heat generated by the emitting surface 21, and the second heat dissipating element 40 transmits the mounting surface 22 to the circuit board 10 and the heat of the circuit board 10 itself.
  • the second heat dissipation element 40 includes a second substrate 41 and a plurality of second heat sinks 42 arranged on the second substrate 41, and the second substrate 41 is arranged on the circuit board 10. , A plurality of second heat sinks 42 are arranged on the second substrate 41 at intervals.
  • the following table shows that the power consumption of the millimeter wave antenna is 16.95W, and the second heat dissipation element 40 (such as Al-6061 heat sink) is arranged on the circuit board 10.
  • the addition of the first heat dissipation element 30 on the transmitting surface 21 and the absence of the first heat dissipation element 30 of the present application affect the junction temperature of the antenna 20.
  • Figures 12-15 compare the millimeter wave antenna lobe width and millimeter wave antenna lobe width with the first heat dissipation element 30 added to the transmitting surface 21 and the first heat dissipation element 30 without the application. The impact of efficiency.
  • FIG. 12 is a schematic diagram of the comparison of the lobe width of the millimeter wave antenna in the horizontal direction.
  • the line I is the horizontal lobe width curve when the first heat dissipation element 30 is not added to the transmitting surface 21.
  • Line I is the lobe width curve in the horizontal direction when the first heat dissipation element 30 is added to the emitting surface 21.
  • Fig. 13 is a comparison diagram of the lobe width of the millimeter wave antenna in the vertical direction.
  • the line III is the vertical lobe width curve when the first heat dissipation element 30 is not added to the emitting surface 21, and the line IV is the lobe width curve in the vertical direction.
  • the vertical lobe width curve When the first heat dissipation element 30 is added to the surface 21, the vertical lobe width curve.
  • Figure 14 is a schematic diagram of the comparison of the radiation efficiency of the millimeter wave antenna in the horizontal direction.
  • line I is the radiation efficiency curve of signals of different frequency bands in the horizontal direction when the first heat dissipation element 30 is not added to the transmitting surface 21.
  • VI is the radiation efficiency curve of signals of different frequency bands in the horizontal direction when the first heat dissipation element 30 is added to the emitting surface 21.
  • 15 is a schematic diagram of the comparison of the radiation efficiency of the millimeter wave antenna in the vertical direction.
  • the line VII is the radiation efficiency curve of the signals of different frequency bands in the vertical direction when the first heat dissipation element 30 is not added to the transmitting surface 21.
  • VIII is the radiation efficiency curve of signals of different frequency bands in the vertical direction when the first heat dissipation element 30 is added to the emitting surface 21.
  • the provision of the first heat dissipation element 30 can improve the heat dissipation capability without substantially affecting the antenna signal (lobe width and radiation efficiency).
  • the first heat dissipation element 30 and the second heat dissipation element 40 are integrally formed.
  • first heat dissipating element 30 and the second heat dissipating element 40 can be made into a composite heat sink.
  • the first heat dissipating element 30 can be made of a material with a low dielectric constant such as the above-mentioned ultra-high molecular weight polyethylene fiber.
  • the second heat dissipating element 40 can be made of metal or other materials.
  • the first heat dissipation element 30 is disposed on the circuit board 10, the number of antennas 20 is multiple, and the plurality of antennas 20 enclose a accommodating space 23, and the first heat dissipation element 30 is at least partially The ground is located in the accommodating space 23.
  • the first heat dissipation element 30 can extend into the accommodating space 23 enclosed by the antenna 20 without affecting the antenna signal, thereby reducing the space occupied by the first heat dissipation element 30 and enabling the electronic device 1000 to be more compact.
  • the antennas 20 are electrically connected to the circuit board 10, the first heat dissipation elements 30 of the plurality of antennas 20 are arranged at intervals, and the projections of the first heat dissipation elements 30 on the emission surfaces 21 of the plurality of antennas 20 are the same as those of the first heat dissipation elements 30.
  • the emitting surfaces 21 overlap at least partially.
  • the antenna 20 may be a WIFI antenna or other radio frequency antennas.
  • the first heat dissipation element 30 and the second heat dissipation element 40 can be integrally formed and arranged on one surface of the circuit board 10, the first heat dissipation element 30 at least partially extends into the accommodating space 23, and the second heat dissipation element 30 The element 40 is located outside the accommodating space 23.
  • the antenna module 100 may further include a third heat dissipation element 50, and the third heat dissipation element 50 is disposed on the circuit board 10 opposite to the first heat dissipation element 30 and the second heat dissipation element 40. The side of the back. In this way, heat dissipation can be performed on both sides of the circuit board 10 at the same time, which improves the heat dissipation performance and makes the heat dissipation more uniform.
  • the electronic device 100 further includes a rotating mechanism 600.
  • the antenna module 100 is connected to the rotating mechanism 600, and the rotating mechanism 600 is used to drive the antenna module 100 to rotate relative to the housing 200.
  • the antenna module 100 can be driven by the rotating mechanism 600 to achieve an orientation at any position, avoiding the need to set multiple antenna modules 100 in multiple directions, which can reduce the number of electronic components.
  • the cost of equipment 1000 the antenna module 100 can be driven by the rotating mechanism 600 to rotate, so that the antenna module 100 can be rotated to a predetermined position with a strong signal to transmit and receive signals, thereby improving the signal transmitting and receiving capabilities of the electronic device 1000.
  • the circuit board 10 of the antenna module 100 may be directly connected to the rotating mechanism 600, and the driving mechanism 600 drives the circuit board 10 to rotate, thereby driving other components of the antenna module 100 to rotate.
  • the antenna module 100 may also be connected to the rotating mechanism 600 through other components.
  • the antenna module 100 may be set on a bracket with the rotating mechanism 600 connected therebetween. The rotating mechanism 600 drives the bracket to rotate, thereby driving The antenna module 100 rotates.
  • the length of the first heat dissipation fin 32 in the middle portion of the first heat dissipation element 30 is longer than the length of the first heat dissipation fins 32 on both sides, and the length of the second heat dissipation element 40
  • the length of the second heat sink 42 in the middle part is also longer than the length of the second heat sink 32 on both sides.
  • the ends of the plurality of first heat sinks 32 away from the first substrate 31 are arranged in an arc shape, and the ends of the plurality of second heat sinks 42 away from the second substrate 41 are arranged in a circle. Arranged in an arc.
  • the plurality of first radiating fins 32 and the plurality of second radiating fins 42 are arranged in an arc shape to conform to the rotation track of the antenna module 100, which can prevent the antenna module 100 from interfering with the housing 200 during rotation, and at the same time, This allows the housing 200 to be made smaller.
  • the antenna module 100 includes the circuit board 10, the antenna 20 and the first heat dissipation element 30.
  • the first heat dissipation element 30 is connected to the circuit board 10, and the dielectric constant of the first heat dissipation element 30 is less than 3.
  • the antenna 20 is electrically connected to the circuit board 10, the emission surface 21 of the antenna 20 faces the first heat dissipation element 30, and the projection of the first heat dissipation element 30 on the emission surface 21 at least partially covers the emission surface 21.
  • the first heat dissipation element 30 can dissipate heat to the circuit board 10, and the emitting surface 21 of the antenna 20 faces the first heat dissipation element 30, and the dielectric of the first heat dissipation element 30
  • the constant less than or equal to 3 can effectively prevent the first heat dissipation element 30 from affecting the antenna signal.
  • the dielectric constant of the first heat dissipation element 30 is small, and the attenuation of the signal is weak or even negligible, so that the heat dissipation capability of the antenna 20 can be improved without affecting the antenna signal.

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种天线模块(100)和电子设备(1000)。天线模块(100)包括电路板(10)、天线(20)和第一散热元件(30)。第一散热元件(30)与电路板(10)连接，第一散热元件(30)的介电常数小于或者等于3。天线(20)与电路板(10)电连接，天线(20)的发射面(21)朝向第一散热元件(30)，第一散热元件(30)在发射面(21)上的投影至少部分地覆盖发射面(21)。

Description

天线模块和电子设备
优先权信息
本申请请求2020年05月18日向中国国家知识产权局提交的、专利申请号为202010417859.8的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及电子设备领域，具体涉及一种天线模块和电子设备。
背景技术
在相关技术中，电子设备的天线部件在工作时通常会产生较大的热量，需要设置散热器等散热装置对天线部件散热，然而，散热器的设置可能会降低天线信号的辐射率，特别是在使用5G无线通信时，由于5G通信所使用的频谱主要包括sub-6GHz和毫米波，但是，毫米波频率高波长短，衍射能力弱，穿透能力弱，在天线部件的一定距离范围内不能存在有会导致天线发射信急剧衰减的结构件。
发明内容
本申请实施方式提供了一种天线模块和电子设备。
本申请实施方式的天线模块包括：
电路板；
连接所述电路板的第一散热元件，所述第一散热元件的介电常数小于或等于3；和
与所述电路板电连接的天线，所述天线的发射面朝向所述第一散热元件。
本申请实施方式的电子设备包括壳体和上述的天线模块，所述天线模块至少部分设置在所述壳体内，所述第一散热元件在所述发射面上的投影至少部分地覆盖所述发射面。
申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子设备的立体示意图；
图2是本申请实施方式的电子设备的另一个立体示意图；
图3是本申请实施方式的电子设备的内部结构示意图；
图4是本申请实施方式的电子设备的又一个立体示意图；
图5是本申请实施方式的电子设备的分解示意图；
图6是本申请实施方式的天线模块的立体示意图；
图7是本申请实施方式的天线模块的平面示意图；
图8是本申请实施方式的天线模块的分解示意图；
图9是超高分子量聚乙烯纤维在没有经过定向挤出和拉丝堆叠时的分子结构示意图；
图10是超高分子量聚乙烯纤维在经过定向挤出和拉丝堆叠后的分子结构示意图；
图11是本申请实施方式的天线模块的另一分解示意图；
图12是天线信号的波瓣宽度在水平方向上对比示意图；
图13是天线信号的波瓣宽度在垂直方向上对比示意图；
图14是天线信号的辐射效率在水平方向上对比示意图；
图15是天线信号的辐射效率在垂直方向上对比示意图。
主要元件符号说明：
电子设备1000、基站1100、天线模块100、电路板10、天线20、发射面21、安装面22、容置空间23、第一散热元件30、第一基板31、第一散热片32、第二散热元件40、第二基板41、第二散热片42、第三散热元件50、壳体200、散热通道210、底座220、进气通道221、围壁230、顶盖240、连接器300、框体400、散热风扇500、转动机构600。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。
请参阅图1，图1示出了本申请实施方式的电子设备1000的立体示意图。本申请实施方式的电子设备1000包括但不限于客户终端设备(Customer Premise Equipment，CPE)和无线路由器等无线设备，例如电子设备1000可为5G客户终端设备，客户终端设备是一种无线宽带接入设备，可以将基站1100(Base Station)传送的信号(例如将5G毫米波信号)转换成平板电脑、智能手机、笔记本等移动终端通用的WiFi(Wireless Fidelity)信号，并且可同时支持多个移动终端上网。客户终端设备也可以将数据发送至基站1100，以通过基站1100将数据传送到服务器中心。
电子设备1000可以安装在室内，也可以安装在室外。具体地，在电子设备1000安装在室内时，电子设备1000可以安装在墙上，也可以放置在桌面上等位置。在电子设备1000安装在室外时，电子设备1000可以固定在墙上，例如，电子设备1000可以通过安装架固定在墙上。位于室外的电子设备1000可以通过导线连接至室内的市电电源，以使得市电可以为电子设备1000持续供电。
电子设备1000可以呈圆柱状、方柱形等规则形状，当然，电子设备1000也可以呈其他异形的形状。如图1所示的电子设备1000中，电子设备1000的横截面大致呈椭圆形。
请参阅图2-5，本申请的一个实施方式中，电子设备1000包括壳体200、框体400、散热风扇500和天线模块100。框体400设置在壳体200内，框体400用于承载电子设备1000的内部零部件，例如，框体400用于承载天线模块100及散热风扇500。散热风扇500设置在壳体200内，散热风扇500用于产生气流以将壳体200内的热量散发至壳体200外。
天线模块100至少部分设置在壳体200内。天线模块100可用于收发信号。
具体地，壳体200为电子设备1000的外部零件。壳体200可以构成电子设备1000的外部形状，或者说，电子设备1000的具体形状大致由壳体200决定。例如，在壳体200呈圆柱状时，电子设 备1000的整体形状呈圆柱状。
可以理解，壳体200可以为中空结构，壳体200可以收容电子设备1000的内部零部件以保护电子设备1000的内部零部件。例如，壳体200可以减少电子设备1000的内部零部件的受到的冲击，防止该内部零部件产生移位等不良后果而影响电子设备1000的正常使用。又如，壳体200可以减少灰尘、水汽等异物与该内部零部件接触，避免该内部零部件产生短路等损坏。
壳体200可以采用金属或者塑料等材料制成。为了提高电子设备1000收发信号的能力，壳体200可以采用塑料等非屏蔽材料制成。如此，信号可以穿透壳体200而被壳体200内的天线模块100接收。另外，壳体200内的天线模块100可以透过壳体200发射信号。
当然，壳体200可以根据壳体200的具体功能采用多种材料制成。例如，壳体200作为承载的部分可以采用金属等强度较大的材料制成。
请参阅图2和图4，在一些实施方式中，壳体200可以具有散热通道210，散热通道210用于使壳体200内的热量散发至壳体200外。如此，壳体200内热量可以通过散热通道210散发至壳体200外，从而降低壳体200内的温度，保证电子设备1000正常工作。
具体地，散热通道210可以为圆形孔、方形孔或者异形等具体形状的孔。另外，散热通道210的数量可以为多个，多个散热通道210可以沿壳体200的周向的间隔排布，多个散热通道210可以增加壳体200内的热量的散热面积，从而提高电子设备1000的降温速率。
进一步地，在一些实施方式中，散热通道210可以位于壳体200的顶部。可以理解，温度较高的空气一般向上流动，因此，将散热通道210设置在壳体200的顶部有利于壳体200内的热量通过散热通道210散发出去。
需要指出的是，本申请实施方式所指的“顶部”为在电子设备1000正常使用的情况下，位于电子设备1000上方的部分。例如，在高度方向上，电子设备1000的顶部的高度为电子设备1000的总高度的1/4。因此，壳体200的顶部为在电子设备1000正常使用的情况下，壳体200的上方部分。
散热通道210可以形成在壳体200的顶端面，也可以形成在壳体200的侧面，或者在壳体200的顶端面和侧面均形成有散热通道210。
当然，在电子设备1000的散热量足够小的时候，散热通道210可以省略。电子设备1000的散热量可以通过壳体200直接传递到壳体200外。
请参阅图4-5，在本申请一些实施方式中，壳体200包括底座220、围壁230和顶盖240。围壁230连接底座220和顶盖240。具体地，底座220和围壁230可以为分体结构，或者说，围壁230可以拆卸地安装在底座220上。当然，底座220和围壁230也可以为一体结构。围壁230和顶盖240可以为分体结构，也可以为一体结构。
底座220可以为电子设备1000放置在桌面等支撑面上时提供支撑。底座220可以为块状，也可以为板状等形状。本申请实施方式中，底座220开设有进气通道221，进气通道221用于供电子设备1000的外部气体进入壳体200内，以使气体吸收电子设备1000产生的热量后从散热通道210散发至壳体200外。
围壁230可以形成收容电子设备1000的内部零部件的收容空间。围壁230可以为连续结构，或者说，围壁230没有形成结合缝。本申请实施方式中，电子设备1000的连接器300从围壁230露出(如3和图4所示)。电子设备1000可以通过连接器300与其他设备通信或者连接电源。所说的连接器300例如为USB(Universal Serial Bus)连接器300、电源插接座等连接器300。本申请实施方式不限制连接器300的具体类型。
顶盖240可以遮盖围壁230的顶部。顶盖240可以从围壁230的顶部遮蔽电子设备1000的内部零部件。顶盖240可以呈片状或块状等结构。另外，顶盖240的外端面可以为圆形、椭圆形等形状，在此不限制顶盖240的结构和形状。
本申请实施方式中，散热通道210设置在顶盖240和围壁230的连接处。或者说，散热通道210位于围壁230的顶端和顶盖240之间。在散热通道210为环状时，散热通道210可以由顶盖240和围壁230的间隔设置形成的缝隙所形成。
在一些实施方式中，框体400作为电子设备1000的承载元件。电子设备1000的内部零件可以安装在框体400上。例如，散热风扇500和天线模块100中的至少一个可以安装在框体400上。再如电子设备1000的内部零件可以通过螺钉、卡扣等方式安装在框体400上，在此不限制该内部零件的具体安装方式。由于框体400的结构适应于电子设备1000的内部零件的安装位置，因此，框体400的形状一般呈非规则状。为了使得框体400容易制造成型，框体400可以采用注塑的工艺成型。
当然，在其他实施方式中，在壳体200可以支撑客户移动终端的情况下，框体400可以省略。
请参阅图3，本申请实施方式中，散热风扇500与天线模块100间隔设置，散热风扇500用于产生气流以将壳体200内天线模块100等零部件产生的热量通过散热通道210将壳体200内的热量散发至壳体200外。或者说，在散热风扇500工作时，带有热量的气流从壳体200内经过散热通道210后流出至壳体200外。如此，散热风扇500可以加快气体的流动，从而可以降低电子设备1000的内部温升，保证电子设备1000设备正常使用。
例如，散热风扇500在工作的过程中，可以从进气通道221吸入温度较低的空气，使得温度较低的空气吸收壳体200内天线模块100等零部件产生的热量后从散热通道210排出。
本申请实施方式中，散热风扇500位于天线模块100的上方。此处所指的“上方”为，电子设备1000处于正常使用的情况下，电子设备1000远离地面的方向为“上”。因此，本实施方式中，散热风扇500的位置高于天线模块100的位置。散热风扇500可将天线模块100工作时产生的热量通过散热通道210散发至壳体200外。
散热风扇500可以是离心风扇，也可以为轴流风扇，在此不限制散热风扇500的具体类型，只要散热风扇500可以将壳体200内的热量通过散热通道210散发至壳体200外即可。
当然，在其他实施方式中，在电子设备1000的散热量足够小的时候，散热风扇500可以省略。电子设备1000的散热量可以通过壳体200传递到壳体200外，或者通过散热通道210散发至壳体200外。
请参阅图6-8，本申请的一些实施方式中，天线模块100包括电路板10、天线20和第一散热元件30。第一散热元件30与电路板10连接，第一散热元件30的介电常数小于3。天线20与电路板10电连接，天线20的发射面21朝向第一散热元件30。
可以理解，在相关技术中，电子设备的天线部件在工作时通常会产生较大的热量，需要设置散热器等散热装置对天线部件散热，然而，散热器的设置可能会降低天线信号的辐射率，特别是在使用5G无线通信时，由于具5G通信所使用的频谱主要包括sub-6GHz和毫米波，但是，毫米波频率高波长短，衍射能力弱，穿透能力弱，在天线部件的一定距离范围内不能存在有会导致天线发射信急剧衰减的结构件。因此，如何在不影响天线信号的情况下提高天线的散热能力成为了技术人员研究的问题。
在本申请的天线模块100和电子设备1000中，第一散热元件30可对电路板10进行散热，并且，天线20的发射面21朝向第一散热元件30，第一散热元件30的介电常数小于或者等于3可以 有效避免第一散热元件30对天线信号造成影响。如此，第一散热元件30的介电常数较小，对信号的衰减程度较弱甚至可忽略不计，这样可以在不影响天线信号的情况下提高天线20的散热能力。
需要说明的是，在本申请的实施方式中，“发射面21朝向第一散热元件30”可以理解为发射面21与第一散热元件30平行或者是呈一定倾斜角度，第一散热元件30在发射面21上的投影与发射面21至少部分地重叠。在下文中，若出现相同或者类似的描述，也可参照此处理解。在图6-8所示的实施方式中，发射面21朝向第一散热元件30且与第一散热元件30平行。
请参阅图7-8，在一个实施方式中，天线20为毫米波天线，毫米波天线用于收发毫米波(millimeter wave)。毫米波是波长为频段在24GHz-52GHz内的电磁波。由于毫米波频率高波长短，衍射能力弱，穿透能力弱，在天线模块100的一定距离范围内不能存在有会导致天线20发射信急剧衰减的结构件。在本申请的天线模块100中，第一散热元件30的介电常数小于3，其对毫米波信号的衰减程度较弱，从而使得第一散热元件30可以在不影响天线信号的情况下对天线20模组进行散热。
具体地，电路板10可以为刚性电路板10，也可以为柔性电路板10。本实施方式中，为了提高电路板10与毫米波天线安装的稳定性，电路板10例如为印刷电路板(Printed Circuit Board，PCB)等刚性电路板。
请参阅图8，毫米波天线20呈片状。毫米波天线可以通过焊接的方式固定在电路板10上。毫米波天线可以与电路板10实现信号传递的目的。
具体地，请参阅图8，在一些实施方式中，天线20还包括与发射面21相背的安装面22，天线20通过发射面21收发信号。天线20通过安装面22固定安装在电路板10上，第一散热元件30设置在发射面21上，第一散热元件30用于对天线20进行散热。如此，第一散热元件30可以将天线20产生上的热量快速地散发，以降天线模块100的温度，保证天线20正常运行。
请参阅图6-8，在某些实施方式中，第一散热元件30包括第一基板31和设置在第一基板31上的多个第一散热片32，第一基板31设置在天线20的发射面21且至少部分地覆盖发射面21，多个第一散热片32间隔设置在第一基板31上。如此，多个第一散热片32可以增加第一散热元件30的散热面积，提高散热元件的散热性能。
具体地，第一基板31和第一散热片32可将天线20的发射面21产生的热量导出，散热风扇500可在多个第一散热片32之间形成气流，从而将热量导出以对天线20的发射面21进行散热。在图6-8中，多个第一散热片32基本平行设置且基本垂直第一基板31，第一基板31与天线20的发射面21贴合。
在一些实施方式中，第一散热元件30的介电常数小于或者等于2.8，第一散热元件30的损耗角正切值小于或等于0.001。如此，第一散热元件30对天线信号的影响较小。
优选地，在一个例子中，第一散热元件30的介电常数范围为2.3-2.4，第一散热元件30的损耗角正切值的范围为0.00018～0.0002。
在一些实施方式中，第一散热元件30包括超高分子量聚乙烯纤维。也即是说，第一散热元件30可由超高分子量聚乙烯纤维制成。超高分子量聚乙烯纤维具有电气性能良好，其介电常数和损耗正切角均较小，从而使得第一散热元件30的介电常数可以达到小于3的水平，从而防止第一散热元件30影响天线信号。
在一些实施方式中，超高分子量聚乙烯纤维可由所述超高分子量聚乙烯纤维由超高分子量聚乙烯拉丝堆叠形成。
如此，通过取向拉丝堆叠形成的超高温分子量聚乙烯纤维在纤维长度方向的导热性能。这样，第一散热元件30可以在不影响天线信号的前提下具备更加优良的导热性能，提高了散热能力。
可以理解，材料的导热性能微观方面体现在声子振荡过程中的动能传递，其中最理想的状态是平面方向无损耗的声子相互碰撞，即完全弹性碰撞(又称声子的弹道运输“ballistic tranport”)。影响材料导热性能的因素主要有三个方面：晶格缺陷、材料内部的杂质和边界效应。通过普通烧结、注塑成型的树脂材料成型的超高分子量聚乙烯，由于内部在压制、注塑成型过程中存在晶格缺陷和杂质，导致成型的片材导热系数较低，导热性能较差，一般<8W/mK。然而，在本申请的实施方式中，通过定向挤出、拉丝堆叠形成的超高分子量聚乙烯纤维材料，可减少声子平均自由程，从而降低单束纤维内声子的非弹性碰撞概率，继而增大在纤维长度方向的导热性能。例如，在一个实测过程中，经拉丝成型的聚乙烯纤维，在纤维长度方向的导热系数可以达到40W/mK。
具体地，在制备超高分子量聚乙烯纤维过程中，首先，将超高分子量聚乙烯纤维聚合物颗粒在特定溶剂中溶解或者高温加热至145℃制备出超高分子量聚乙烯纤维悬浮液或者熔体，用计量泵将溶液或熔体定量、连续、均匀地从喷丝头的细孔压出，这种细流在水、凝固液或空气中固化，生成初生纤维。
然后，经过喷丝头压出的初生纤维其几何形态和物理形态的变化，丝条在挤出、固化过程中的胶凝、结晶、二次转变和拉伸流动中的大分子取向化排列可改变所得纤维的物理机械性能及导热性能。制备得到的初生纤维经过二次拉升，内部晶格在外力作用下再次发生取向排列，得到内部高分子纤维沿着拉丝方向均匀排列的纤维束，通过上述定向挤出、拉丝形成的超高分子量聚乙烯纤维，可减少声子平均自由程，从而降低单束纤维内声子的非弹性碰撞概率，继而增大在纤维长度方向的导热性能。
具体地，请参阅图9和图10，图9为超高分子量聚乙烯纤维在没有经过定向挤出和拉丝堆叠时的在不同的放大倍数下的结构示意图，图10为超高分子量聚乙烯纤维在上述工艺中的定向挤出和拉丝堆叠时的在不同的放大倍数下的结构示意图，由图9和图10可知，在未进行定向挤出和拉丝堆叠之前，超高分子量聚乙烯纤维的分子结构排列较为杂乱，不具备定向导热性，其在各个方向上的导热性能较差，而经过定向挤出和拉丝堆叠制造出的具有定向导热性的超高分子量聚乙烯纤维的分子排列较为规则，在挤出和拉丝的过程中超高分子量聚乙烯的内部晶格在外力作用下发生取向排列，得到内部高分子纤维沿着拉丝方向均匀排列的纤维束，降低单束纤维内声子的非弹性碰撞概率，继而增大在纤维长度方向(即拉丝方向)的导热性能。
在本申请的实施方式中，第一散热元件30沿垂直于发射面21的方向延伸形成，超高分子聚乙烯纤维的拉丝方向垂直发射面21，第一散热元件30沿拉丝方向的导热系数大于或者等于40W/mK，在垂直于拉丝方向的另外两个方向上的导热系数为0.12-0.5W/mK。
如此，通过利用超高分子量聚乙烯纤维在各个方向上的导热异性可以使得第一散热元件30沿垂直于发射面21上的导热效率大大增加，同时也可以避免热量从其它方向进行大量的扩散而导致其它部位温度局部过高。
具体地，超高分子量聚乙烯的拉丝方向即为纤维的长度方向，也即第一散热元件30的延伸方向。例如，第一基板31的延伸方向，第一散热片32的延伸方向，在图6和图7所示的例子中，超高分子量聚乙烯纤维的长度方向即为基本垂直于发射面21的方向，在此方向上，第一散热元件30的散热系数较大，散热性能较好。
此外，在本申请的方式中，由超高分子量聚乙烯纤维制成的第一散热元件30的密度较小，其密度为0.930g/cm 3，这样可以使得电子设备1000实现轻量化。
可以理解的是，在其它实施方式中，第一散热元件30也可采用其它低介电常数的材料制成，例如PP(polypropylene，聚丙烯)、PE(polyethylene，聚乙烯)、PTFE(Poly tetra fluoroethylene， 聚四氟乙烯)和SPS(Syndiotactic Polystyrene，间规聚苯乙烯)等。其制作工艺也可采用上述的定向挤出和拉丝堆叠的方式成型，具体在此不作阐述。
进一步地，以热源功耗Q＝1W，在环境温度Ta＝35℃下，对比了相同尺寸大小的采用超高分子量聚乙烯拉丝堆叠形成的第一散热元件30和普通ABS塑胶散热器以及Al-6061(表面喷黑、不喷黑处理)散热器的散热效果，具体对比结果如表1所示：
表1
Figure PCTCN2021085655-appb-000001
有上表可知，本申请的第一散热元件30整体上性能与喷黑处理Al-6061散热器散热效果相当，比表面抛光Al-6061散热器的散热性能略好。而相比普通塑胶ABS散热器(K＝0.26W/mK)和不加散热器，能大幅降低热源温度(>10℃收益)。
同时，第一散热元件30的表面辐射率E＝0.95，相比抛光铝表面散热器辐射率E＝0.2能显著提高表面热辐射率，进一步提升散热能力。
相比喷黑处理的铝制散热器，第一散热元件30的辐射率也有一定的提升(大于0.05)，但第一散热元件30在热源温度上稍高了0.5℃，从整体上看，本申请的第一散热元件30整体上性能与喷黑处理Al-6061散热器散热效果相当。但超高分子量纤维制作而成的第一散热元件30的密度为0.930g/cm 3，其密度要远小于铝型材的密度(2.7g/cm 3)，且无需表面处理工艺，因此可以作为使得产品更加轻量化并且降低产品的成本。
请参阅图6-11，在一些实施方式中，天线模块100还包括第二散热元件40，第二散热元件40设置在电路板10上且位于发射面21所朝向的范围之外。
需要说明的是，“第二散热元件40位于发射面21所朝向的范围之外”可以理解为沿发射面21的朝向方向，第二散热元件40与所述发射面21不存在重叠部分。
如此，一方面，第二散热元件40可与第一散热元件30共同对天线模块100进行散热，提高了散热能力并且能够使得散热更加均匀，另一方面，第二散热元件40位于发射面21所朝向的范围之外不会对天线信号造成影响。第二散热元件40可采用金属材质或者塑料材质制成，例如轻质铝材，具体在此不作限制。
请参阅图6-8，在某些实施方式中，第二散热元件40和天线20位于电路板10的相背两侧，第二散热元件40与发射面21相背，第二散热元件40用于对电路板10进行散热。
如此，第一散热元件30可对发射面21进行散热，第二散热元件40可对电路板10的与发射面21相背的一侧散热。这样，电路板10两侧可同时散热，使得散热更加均衡。例如，以天线20为毫米波天线为例，第一散热元件30将发射面21产生的热量导出，第二散热元件40将安装面22传递给电路板10以及电路板10自身的热量导出。
请参阅图6-8，在一些实施方式中，第二散热元件40包括第二基板41和设置在第二基板41上的多个第二散热片42，第二基板41设置在电路板10上，多个第二散热片42间隔设置在第二基板41上。
下面，请参阅下表2，下表为以毫米波天线的功耗为16.95W，在电路板10上设置有第二散热元件40(例如Al-6061散热器)的基础上，分别对比了在发射面21上加第一散热元件30与不加本申请的第一散热元件30对天线20结温影响大小。
表2
Figure PCTCN2021085655-appb-000002
由表2中的数据经过对比后可知：在发射面21加第一散热元件30，可有效将天线20模组的温度降低12.5℃，其散热效率较好。
此外，请参阅下图12-15，图12-15分别对比了在发射面21上加第一散热元件30与不加本申请的第一散热元件30对毫米波天线波瓣宽度以及对毫米波效率的影响。
其中，图12为毫米波天线波瓣宽度在水平方向的对比示意图，在图12中，线I为发射面21上不加第一散热元件30时，水平方向的波瓣宽度曲线。线I为在发射面21上加第一散热元件30时，水平方向的波瓣宽度曲线。图13为毫米波天线波瓣宽度在垂直方向的对比示意图，在图14中，线III为发射面21上不加第一散热元件30时，垂直方向的波瓣宽度曲线，线IV为在发射面21上加第一散热元件30时，垂直方向的波瓣宽度曲线。
图14为毫米波天线在水平方向上的辐射效率的对比示意图，在图中，线I为发射面21上不加第一散热元件30时，不同频段信号在水平方向上的辐射效率曲线，线VI为在发射面21上加第一散热元件30时，不同频段信号在水平方向上的辐射效率曲线。图15为毫米波天线在垂直方向上的辐射效率的对比示意图，在图中，线VII为发射面21上不加第一散热元件30时，不同频段信号在垂直方向上的辐射效率曲线，线VIII为在发射面21上加第一散热元件30时，不同频段信号在垂直方向上的辐射效率曲线。
由图12-图15可知，在发射面21上添加本申请中的第一散热器对天线20的辐射场形影响较小，水平与垂直波瓣宽度基本无变化(见图12和图13)。对天线20的辐射效率略微有影响，其表现为部分频点有所提升，部分频点有所下降，波动范围较小(见图14和图15)，但从整体来说加载第一散热元件30对毫米波天线影响极小。
综上可知，在本申请的天线模块100中，设置第一散热元件30可以在基本不影响天线信号(波瓣宽度以及辐射效率)的情况下，提高散热能力。
请参阅图11，在某些实施方式中，第一散热元件30与第二散热元件40一体成型。
如此，可将第一散热元件30和第二散热元件40制作成复合散热器，第一散热元件30可由上述的超高分子量聚乙烯纤维等介电常数较低的材料制成，第二散热元件40可由金属或者其它材料制成。
请参阅图11，在一些实施方式中，第一散热元件30设置在电路板10上，天线20的数量为多个，多个天线20围成有容置空间23，第一散热元件30至少部分地位于容置空间23内。
如此，第一散热元件30可伸入至天线20围成的容置空间23而不会影响天线信号，从而减少第一散热元件30占用的空间，使得电子设备1000能够更加小型化。
具体地，在这样的实施方式中，天线20分别与电路板10电连接，多个天线20第一散热元件 30间隔设置，第一散热元件30在多个天线20的发射面21上的投影与发射面21至少部分地重叠。天线20可为WIFI天线或者是其它射频天线。在这样的实施方式中，第一散热元件30和第二散热元件40可一体成型设置在电路板10的一个面上，第一散热元件30至少部分地伸入容置空间23内，第二散热元件40位于容置空间23外。
此外，请参阅图11，在这样的实施方式中，天线模块100还可包括第三散热元件50，第三散热元件50设置在电路板10的与第一散热元件30和第二散热元件40相背的一侧。这样，可对电路板10的两侧同时进行散热，提高散热性能以及使得散热更加均匀。
请参阅图4，在某些实施方式中，电子设备100还包括转动机构600。天线模块100连接转动机构600，转动机构600用于驱动天线模块100相对壳体200转动。
如此，本申请实施方式的电子设备1000中，天线模块100随着可被转动机构600驱动以实现任意位置的朝向，避免了在多个方向上分别设置多个天线模块100，这样可以降低具电子设备1000的成本。另外，天线模块100可以被转动机构600驱动而发生转动，使得天线模块100可以转动至信号较强的预定位置以收发信号，提高电子设备1000的信号收发能力。
具体地，在这样的实施方式中，可以是天线模块100的电路板10直接与转动机构600连接，驱动机构600驱动电路板10转动，从而带动天线模块100的其它部件转动。在其它的实施方式中，天线模块100也可以是通过其他零部件与转动机构600连接，例如天线模块100可以设置在一个支架上，之间连接转动机构600，转动机构600驱动支架转动，从而带动天线模块100转动。
另外，请参阅图6，在本申请的实施方式中，第一散热元件30的中间部分的第一散热片32的长度要长于两侧的第一散热片32的长度，第二散热元件40的中间部分的第二散热片42的长度也要长于两侧的第二散热片32的长度。这样，可以减少在天线模块模块100转动时所占有的空间，从而防止在转动时第一散热片32和第二散热片42与壳体200发生干涉。具体地，请参阅图6和图7，多个第一散热片32远离第一基板31的端部呈圆弧形排布，多个第二散热片42远离第二基板41的端部呈圆弧形排布。这样，多个第一散热片32和多个第二散热片42均呈圆弧形排布符合天线模块100的转动轨迹，可以避免天线模块100在转动时与壳体200发生干涉，同时也可使得壳体200可以做的更小。
综上，本申请的一些实施方式中，天线模块100包括电路板10、天线20和第一散热元件30。第一散热元件30与电路板10连接，第一散热元件30的介电常数小于3。天线20与电路板10电连接，天线20的发射面21朝向第一散热元件30，第一散热元件30在发射面21上的投影至少部分地覆盖发射面21。
本申请实施方式的天线模块100和电子设备1000中，第一散热元件30可对电路板10进行散热，并且，天线20的发射面21朝向第一散热元件30，第一散热元件30的介电常数小于或者等于3可以有效避免第一散热元件30对天线信号造成影响。如此，第一散热元件30的介电常数较小，对信号的衰减程度较弱甚至可忽略不计，这样可以在不影响天线信号的情况下提高天线20的散热能力。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理 解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种天线模块，其特征在于，包括：
    电路板；
    连接所述电路板的第一散热元件，所述第一散热元件的介电常数小于或等于3；和
    与所述电路板电连接的天线，所述天线的发射面朝向所述第一散热元件，所述第一散热元件在所述发射面上的投影至少部分地覆盖所述发射面。
  2. 根据权利要求1所述的天线模块，其特征在于，所述第一散热元件包括超高分子量聚乙烯纤维。
  3. 根据权利要求2所述的天线模块，其特征在于，所述超高分子量聚乙烯纤维由超高分子量聚乙烯拉丝堆叠形成。
  4. 根据权利要求3所述的天线模块，其特征在于，所述第一散热元件沿所述垂直于所述发射面的方向延伸形成，所述超高分子聚乙烯纤维的拉丝方向垂直所述发射面，所述第一散热元件沿所述拉丝方向的导热系数大于或者等于40W/mK。
  5. 根据权利要求1所述的天线模块，其特征在于，所述天线包括毫米波天线。
  6. 根据权利要求5所述的天线模块，其特征在于，所述第一散热元件的介电常数小于或者等于2.8，所述第一散热元件的损耗角正切值小于或等于0.001。
  7. 根据权利要求6所述的天线模块，其特征在于，所述第一散热元件的介电常数范围为2.3～2.4，所述第一散热元件的损耗角正切值的范围为0.00018～0.0002。
  8. 根据权利要求5所述的天线模块，其特征在于，所述天线还包括与所述发射面相背的安装面，所述天线通过所述安装面固定安装在所述电路板上，所述第一散热元件设置在所述发射面上，所述第一散热元件用于对所述天线进行散热。
  9. 根据权利要求8所述的天线模块，其特征在于，所述第一散热元件包括第一基板和设置在所述第一基板上多个第一散热片，所述第一基板设置在所述发射面上且至少部分地覆盖所述发射面，所述多个第一散热片间隔设置在所述第一基板上。
  10. 根据权利要求9所述的天线模块，其特征在于，所述第一散热元件的中间部分的所述第一散热片的长度长于两侧的所述第一散热片的长度。
  11. 根据权利要求10所述的天线模块，其特征在于，多个所述第一散热片远离所述第一基板的端部呈圆弧形排布。
  12. 根据权利要求1所述的天线模块，其特征在于，所述天线模块还包括第二散热元件，所述第二散热元件设置在所述电路板上且位于所述发射面所朝向的范围之外。
  13. 根据权利要求12所述的天线模块，其特征在于，所述第二散热元件和所述第一散热元件位于所述电路板的相背两侧，所述第二散热元件与所述发射面相背，所述第二散热元件用于对所述电路板进行散热。
  14. 根据权利要求12所述的天线模块，其特征在于，所述第二散热元件包括第二基板和设置在所述第二基板上的多个第二散热片，所述第二基板设置在所述电路板上，所述多个第二散热片间隔设置在所述第二基板上。
  15. 根据权利要求14所述的天线模块，其特征在于，所述第二散热元件的中间部分的所述第二散热片的长度长于两侧的所述第二散热片的长度。
  16. 根据权利要求15所述的天线模块，其特征在于，多个所述第二散热片远离所述第二基板的 端部呈圆弧形排布。
  17. 根据权利要求12所述的天线模块，其特征在于，所述第一散热元件与所述第二散热元件一体成型。
  18. 根据权利要求1所述的天线模块，其特征在于，所述第一散热元件设置在所述电路板上，所述天线的数量为多个，多个所述天线围成有容置空间，所述第一散热元件至少部分地位于所述容置空间内。
  19. 一种电子设备，其特征在于，包括：
    壳体；和
    天线模块，所述天线模块至少部分地设置在所述壳体内，所述天线模块包括电路板、第一散热元件和天线，所述第一散热元件连接所述电路板，所述第一散热元件的介电常数小于或等于3，所述天线与所述电路板连接，所述天线的发射面朝向所述第一散热元件，所述第一散热元件在所述发射面上的投影至少部分地覆盖所述发射面。
  20. 根据权利要求19所述的电子设备，其特征在于，所述电子设备还包括转动机构，天线模块连接所述转动机构，所述转动机构用于驱动所述天线模块转动。
PCT/CN2021/085655 2020-05-18 2021-04-06 天线模块和电子设备 WO2021232977A1 (zh)

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