WO2021227727A1 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

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Publication number
WO2021227727A1
WO2021227727A1 PCT/CN2021/086142 CN2021086142W WO2021227727A1 WO 2021227727 A1 WO2021227727 A1 WO 2021227727A1 CN 2021086142 W CN2021086142 W CN 2021086142W WO 2021227727 A1 WO2021227727 A1 WO 2021227727A1
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WIPO (PCT)
Prior art keywords
substrate
layer
circuit board
display
flexible circuit
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PCT/CN2021/086142
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English (en)
French (fr)
Inventor
柴媛媛
牛文骁
刘练彬
陆旭
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Publication of WO2021227727A1 publication Critical patent/WO2021227727A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display module and a display device.
  • an objective of the present disclosure is to provide a display module with good heat dissipation performance, which can effectively improve yield, or avoid structural interference and signal interference problems between TFPC (touch flexible circuit board) and Driver IC.
  • the present disclosure provides a display module.
  • the display module includes a display substrate including a display area, a bending area, a binding area, and a frame area surrounding the display area, the bending area being located in the display area.
  • a drive control circuit the drive control circuit is provided on the display substrate, and falls in the frame binding area
  • the main flexible circuit board MFPC
  • the main flexible The circuit board is arranged on the display substrate, falls in the binding area, and is located inside the drive control circuit
  • a touch flexible circuit board the touch flexible circuit board is arranged on the drive control circuit and The main flexible circuit board is far away from the display substrate and falls in the binding area
  • a heat dissipation metal layer the heat dissipation metal layer is provided between the drive control circuit and the touch flexible circuit board Between, and in contact with the drive control circuit and the touch flexible circuit board
  • a heat dissipation film SCF
  • the heat generated by the Driver IC can be dispersed by the heat dissipation metal layer, so that the heat is quickly dissipated, avoiding local heat concentration and causing Panel burns.
  • the heat dissipation metal layer also has a shielding effect, which can effectively improve the touch control. Signal interference between flexible circuit board (TFPC) and Driver IC.
  • the material of the heat dissipation metal layer includes at least one of silver, copper, gold, aluminum, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, and lead.
  • the material of the heat dissipation metal layer is copper.
  • the thickness of the heat dissipation metal layer is 0.02 to 1 mm.
  • the orthographic projection of the heat dissipation metal layer on the display substrate overlaps the orthographic projection of the touch flexible circuit board on the display substrate.
  • the orthographic projection of the drive control circuit on the display substrate and the orthographic projection of the touch flexible circuit board on the display substrate, and the heat dissipation metal layer is on the display substrate.
  • the orthographic projection on the display substrate overlaps the overlap area.
  • the touch flexible circuit board includes: a substrate having a first surface and a second surface disposed opposite to each other; a first wire layer and a second wire layer, the first wire layer is provided On the first surface, the second wire layer is arranged on the second surface; the first glue layer and the second glue layer, the first glue layer is arranged on the first wire layer away from the On one surface of the substrate, the second adhesive layer is provided on the surface of the second wire layer away from the substrate; a first insulation protection layer and a second insulation protection layer, the first insulation protection The layer is provided on the surface of the first adhesive layer away from the substrate, the second insulating protective layer is provided on the surface of the second adhesive layer away from the substrate; the touch control circuit layer, the The touch control circuit layer is provided on the surface of the first insulating protective layer on the side of the first surface away from the substrate; a protective tape, the protective tape is provided on the touch circuit layer away from the substrate On the surface of the substrate; an electromagnetic shielding layer, the electromagnetic shielding layer is provided
  • the surface of the main flexible circuit board away from the display substrate is flush with the surface of the drive control circuit away from the display substrate.
  • the touch flexible circuit board is bound on the main flexible circuit board, and the binding position of the touch flexible circuit board and the main flexible circuit board is located on the main flexible circuit The inner side of the binding position of the board and the display substrate.
  • the heat dissipation film falls in the display area and the binding area.
  • the present disclosure provides a display device.
  • the display device includes the aforementioned display module. While achieving a narrow frame, the display device does not have the problem of panel burning caused by local overheating. At the same time, it can effectively improve the signal interference between TFPC and Driver IC. In addition, the spatial locations of TFPC, Driver IC, MFPC and SCF are reasonably set. While effectively ensuring the realization of the functions of each component and not interfering with each other, it can occupy a small space, which is in line with the trend of thinning and miniaturization of electronic equipment.
  • FIG. 1 is a schematic plan view of a non-bending state of a display module according to an embodiment of the present disclosure.
  • Fig. 2 is a schematic cross-sectional structure view taken along the line A-A in Fig. 1.
  • FIG. 3 is a schematic diagram of a side structure of a display module in a bent state according to another embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a cross-sectional structure of a binding area of a display module according to another embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of a cross-sectional structure of a binding area of a display module according to another embodiment of the present disclosure.
  • FIG. 6 is a schematic plan view of the structure of the binding area of the display module according to another embodiment of the present disclosure.
  • Fig. 7 is a schematic cross-sectional structure view taken along the line B-B in Fig. 6.
  • the COP packaging technology can make the frame very narrow, it also brings low yield, local overheating, which leads to panel burning and signal interference problems.
  • the local overheating problem is because the driver IC of the COP packaging technology is set up on the front side, the back side is the substrate of the Panel, and the lower part of the substrate is the SCF (heat dissipation film), so the heat generated by the Driver IC cannot directly contact the heat dissipation film , So that the heat cannot be quickly dissipated, resulting in local heat accumulation, and even panel burns.
  • the design principle of the display module is to avoid the Driver IC and TFPC as much as possible to avoid structural interference and signal interference between the two.
  • the COP technology uses the Driver IC on the substrate, resulting in the distance between the Driver IC and TFPC. Very close, it is difficult for TFPC to avoid Driver IC. If TFPC is made into two sections, the part that interferes with Driver IC is hollowed out, and the driver IC is bypassed, the internal space of the device becomes more and more crowded, and there is little space for TFPC. Do avoid driver IC design; and TFPC must have two bonding positions in two stages, and there will be many bonding problems in bilateral bonding, which leads to a low yield rate of COP packaging technology.
  • the present disclosure proposes a new design solution of adding a heat dissipation metal layer between the contact surface of the TFPC and the Driver IC.
  • the heat dissipation metal layer can disperse the heat generated by the Driver IC over the entire heat dissipation metal layer. , Thereby assisting heat dissipation, and because the heat dissipation metal layer has a shielding effect, it can effectively improve the signal interference between TFPC and Driver IC.
  • the present disclosure provides a display module.
  • the display module includes: a display substrate 10, the display substrate 10 includes a display area 11, a bending area 12 and a binding area 13, the bending area The folding area 12 is located between the display area 11 and the binding area 13; the drive control circuit 20 is provided on the display substrate 10 and falls in the binding area 13; The main flexible circuit board 60 is arranged on the display substrate 10, falls in the binding area 13, and is located inside the drive control circuit 20; the touch flexible circuit board 30, The touch flexible circuit board 30 is arranged on a side of the drive control circuit 20 and the main flexible circuit board 60 away from the display substrate 10 and falls in the bonding area 13; the heat dissipation metal layer 40, the The heat dissipation metal layer 40 is provided between the drive control circuit 20 and the touch flexible circuit board 30, and is in contact with the drive control circuit 20 and the touch flexible circuit board 30; the heat dissipation film 50, the The heat dissipation film 50, the The heat dissipation film 50, the The heat dissi
  • the heat generated by the Driver IC can be dispersed in the entire heat dissipation metal layer by setting the heat dissipation metal layer, so that the heat is quickly dissipated, avoiding local heat concentration and causing Panel burns, and the heat dissipation metal layer also has a shielding effect. It can effectively improve the signal interference between the touch flexible circuit board (TFPC) and the Driver IC, and there is no need to avoid the design of the TFPC and the Driver IC in the structure, which improves the yield rate and space utilization.
  • the heat-dissipating metal layer can be pre-integrated and arranged on the TFPC or Driver IC, which can be compatible with existing processes, is easy to implement, and has low cost.
  • the heat-dissipating metal layer and the heat-dissipating film can cooperate and cooperate to conduct and dissipate heat more quickly, and improve the performance of the display module.
  • the display substrate is not particularly limited, and may be a conventional display substrate in the art, for example, including but not limited to polymer substrates, such as polyimide (PI) substrates, etc., which will not be repeated here.
  • polymer substrates such as polyimide (PI) substrates, etc., which will not be repeated here.
  • the heat dissipation metal layer may be formed of a metal with good heat dissipation properties.
  • the material of the heat dissipation metal layer that may be used may include silver, copper, gold, aluminum, molybdenum, tungsten, zinc, and nickel. , At least one of iron, platinum, tin and lead.
  • the material of the heat dissipation metal layer is copper.
  • the thickness of the heat dissipation metal layer can be determined according to the height of the display module in the Z direction (that is, the thickness direction of the heat dissipation metal layer). When there is more space in the Z direction, the heat dissipation metal layer should be set thicker to obtain Better heat dissipation and shielding effect.
  • the thickness d of the heat-dissipating metal layer may be 0.02 to 1 mm, such as 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8mm, 0.9mm, 1mm, etc. Within this thickness range, better heat dissipation and shielding effects can be achieved without increasing the thickness of the display module.
  • the heat dissipation metal layer may be completely covered on the Driver IC, or partly covered on the Driver IC.
  • the orthographic projection of the heat dissipation metal layer 40 on the display substrate 10 overlaps the orthographic projection of the touch flexible circuit board 30 on the display substrate 10.
  • the area of the heat-dissipating metal layer depends on the size of the TFPC, for example, within 60mm ⁇ 30mm (this size range satisfies the circuit layout on the TFPC well, and can make the size of the TFPC smaller and occupy a smaller space.
  • the heat-dissipating metal layer can be integrated and disposed on the surface of the TFPC facing the Driver IC in advance, which is more convenient and faster to prepare, and has a higher yield.
  • the orthographic projection of the drive control circuit 20 on the display substrate 10 and the orthographic projection of the touch flexible circuit board 30 on the display substrate 10 have overlapping areas, so The orthographic projection of the heat dissipation metal layer 40 on the display substrate 10 overlaps with the overlap area.
  • the position of the heat dissipation metal layer can be flexibly set according to actual needs to meet the heat dissipation requirements and shielding effects of different working conditions, and the heat dissipation metal layer can also be pre-integrated and set on the touch flexible circuit board or drive control circuit more flexibly , In order to more convenient assembly.
  • the specific structure of the heat dissipation film can be flexibly selected according to actual needs.
  • the heat dissipation film may be a composite material, which may specifically include laminated foam, copper foil, mesh glue, etc. . As a result, it has a better heat dissipation effect.
  • the heat dissipation film 50 is located in the display area 11 and the binding area 13 of the display substrate, and the heat dissipation film is not provided in the bending area 12.
  • the display substrate can be made to have better bending performance, the bending radius is small, and the bending area is not provided with components with higher heat generation, which will not negatively affect the heat dissipation performance of the display module.
  • the drive control circuit can effectively input signals to the display module
  • its specific structure is not particularly limited.
  • it may include thin film transistors, necessary wiring and connection lines, etc., which can be performed with reference to conventional technologies. I won't repeat them here.
  • the touch flexible circuit board 30 includes: a substrate 31 having a first surface 311 and a second surface 312 opposed to each other; a first wire layer 321 and a second surface 312 Two wire layers 322, the first wire layer 321 is provided on the first surface 311, the second wire layer 322 is provided on the second surface 312; the first adhesive layer 331 and the second adhesive layer 332, so The adhesive layer 331 is provided on the surface of the first wire layer 321 away from the substrate 31, and the second adhesive layer 332 is provided on the surface of the second wire layer 322 away from the substrate 31; first insulation A protective layer 341 and a second insulating protective layer 342, the first insulating protective layer 341 is provided on the surface of the first adhesive layer 331 away from the substrate 31, and the second insulating protective layer 342 is provided
  • the protective tape 36 is provided on the surface of the touch control circuit layer 35 away from the substrate 31; a flexible protective layer 38 is provided on the second wire layer 322 away from the substrate 31; One side of the base material 31; the connection terminal 39, the connection terminal 39 is provided on the side of the second wire layer 322 away from the base material 31, wherein the second insulating layer 342 and the heat dissipation metal layer 40 phase contact.
  • the first wire layer and the second wire layer can be copper layers, which have better conductivity, and the first and second glue layers can be used to paste the first wire layer, the second wire layer and the substrate
  • the first insulating protective layer and the second insulating protective layer can be used to protect the first wire layer and the second wire layer, and the specific material can be plastic, such as polyimide (PI).
  • the touch flexible circuit board further includes: an electromagnetic shielding layer 37 disposed on the surface of the first insulating protection layer 341 away from the substrate 31 superior.
  • an electromagnetic shielding layer 37 disposed on the surface of the first insulating protection layer 341 away from the substrate 31 superior.
  • a heat-dissipating metal layer 40 is provided on the surface of the second insulating protection layer away from the base material, which can have the effects of heat dissipation and shielding. Therefore, only an electromagnetic shielding layer needs to be provided on the surface of the first insulating protection layer. , Further simplifies the structure and saves costs.
  • the orthographic projection of the main flexible circuit board 60 on the display substrate 10 and the orthographic projection of the touch flexible circuit board 30 on the display substrate 10 partially overlap .
  • the drive control circuit and the main flexible circuit board (MFPC) are arranged on the display substrate, and the touch flexible circuit board is arranged on the drive control circuit and the main flexible circuit board is far away from the display.
  • the specific binding position 61 can be located inside the Driver IC, and its height can be on the same plane as the Driver IC, that is, the main flexible circuit board is far away from the The surface of the display substrate is flush with the surface of the drive control circuit away from the display substrate. Further, since the orthographic projection of the main flexible circuit board 60 on the display substrate 10 and the orthographic projection of the touch flexible circuit board 30 on the display substrate 10 partially overlap, the touch flexible circuit board 30 can be bound to the main flexible circuit board 60 Above, the binding position 62 of the touch flexible circuit board 30 and the main flexible circuit board 60 is located inside the binding position 61 of the main flexible circuit board and the display substrate.
  • the touch control circuit 35 on the touch flexible circuit board 30 may be located inside the binding position 61 of the main flexible circuit board and the display substrate, and the functional elements 63 (such as capacitors) on the main flexible circuit board 60
  • the components, etc.) and the touch control circuit 35 are respectively located on opposite sides of the binding position 62 of the touch flexible circuit board 30 and the main flexible circuit board 60.
  • the Driver IC is used to provide signals for the display module
  • the touch flexible circuit board provides signals for the touch module
  • the main flexible circuit board is used to connect the side close to the bending area with the main board.
  • the overall control of the operation of the display module and the display device containing the display module is reasonable in design, occupy less space, have better heat dissipation effects, and will not overheat locally, and the three can work independently without affecting each other.
  • the present disclosure provides a display device.
  • the display device includes the aforementioned display module. While the display device achieves a narrow frame, it does not have the problem of panel burning caused by local overheating. At the same time, it can effectively improve the signal interference between TFPC and Driver IC. In addition, the spatial locations of TFPC, Driver IC, MFPC and SCF are reasonably set. While effectively ensuring the realization of the functions of each component and not interfering with each other, it can occupy a small space, which is in line with the trend of thinning and miniaturization of electronic equipment.
  • the specific type of the restriction device is not particularly limited, and it can be a mobile phone, a television, a tablet computer, an advertising screen, a drawing screen, a game console, a wearable device, etc., and it is understandable that, except for the aforementioned
  • the display device can also include the necessary structures and components of a conventional display device. Taking a mobile phone as an example, it can also include a touch module, a fingerprint recognition module, a camera module, a battery, a motherboard, and a storage device. The details of the device, housing, etc. can be carried out with reference to conventional technology, and will not be repeated here.
  • the specific setting method of the touch module is not particularly limited, and it can be an in-cell method, an on-cell method, etc., which will not be described one by one here.
  • first and second are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more than two, unless otherwise specifically defined.

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Abstract

一种显示模组和显示装置，显示模组包括：包括显示区（11）、弯折区（12）和绑定区（13）的显示基板（10）；设在显示基板（10）上，且落在绑定区（13）中的驱动控制电路（20）；设在显示基板（10）上，落在绑定区（13）中，且位于驱动控制电路（20）的内侧的主柔性电路板（60）；设在驱动控制电路（20）和主柔性电路板（30）远离显示基板（10）的一侧，且落在绑定区（13）中的触控柔性电路板（30）；设在驱动控制电路（20）和触控柔性电路板（30）之间，且与驱动控制电路（20）和触控柔性电路板（30）相接触的散热金属层（40）；设在显示基板（10）远离驱动控制电路（20）的一侧的散热膜（50）。

Description

显示模组及显示装置
相关申请的交叉引用
本公开要求于2020年05月13日提交的申请号为202010400673.1的中国专利申请的优先权权益，并将其全部引入本文。
技术领域
本公开涉及显示技术领域，具体的，涉及显示模组及显示装置。
背景技术
随着手机显示模组的发展，“全面屏”已经成为趋势，手机的四周边框越来越窄，COP封装技术应运而生，该技术是将Driver IC(驱动控制电路)做在Panel显示面板的基板上，这样就可以将Panel进行弯折，在背面与FPC(柔性电路板)进行Bonding(绑定)，因此Panel的下边框可以做到很窄。但COP封装技术仍存在不同的缺陷，仍需要进一步改进。
公开内容
本公开旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本公开的一个目的在于提出一种散热性能好、能够有效改善良率、或者避免TFPC(触控柔性电路板)与Driver IC之间的结构干涉和信号干扰问题的显示模组。
在本公开的一个方面，本公开提供了一种显示模组。根据本公开的实施例，该显示模组包括：显示基板，所述显示基板包括显示区、弯折区和绑定区和围绕所述显示区的边框区，所述弯折区位于所述显示区和所述绑定区之间；驱动控制电路，所述驱动控制电路设在所述显示基板上，且落在所述边框绑定区中；主柔性电路板(MFPC)，所述主柔性电路板设在所述显示基板上，落在所述绑定区中，且位于所述驱动控制电路的内侧；触控柔性电路板，所述触控柔性电路板设在所述驱动控制电路和所述主柔性电路板远离所述显示基板的一侧，且落在所述绑定区中；散热金属层，所述散热金属层设在所述驱动控制电路和所述触控柔性电路板之间，且与所述驱动控制电路和所述触控柔性电路板相接触；散热膜(SCF)，所述散热膜设在所述显示基板远离所述驱动控制电路的一侧。该显示模组中，通过设置散热金属层可以将Driver IC产生的热量分散，使得热量快速散去，避免了局部热量集中而导致Panel灼伤，同时散热金属层还具有屏蔽作用，可以有效改善触控柔性电路板 (TFPC)和Driver IC之间的信号干扰。
根据本公开的实施例，所述散热金属层的材料包括银、铜、金、铝、钼、钨、锌、镍、铁、铂、锡和铅中的至少一种。
根据本公开的实施例，所述散热金属层的材料为铜。
根据本公开的实施例，所述散热金属层的厚度为0.02～1mm。
根据本公开的实施例，所述散热金属层在所述显示基板上的正投影与所述触控柔性电路板在所述显示基板上的正投影重叠。
根据本公开的实施例，所述驱动控制电路在所述显示基板上的正投影与所述触控柔性电路板在所述显示基板上的正投影存在重叠区域，所述散热金属层在所述显示基板上的正投影与所述重叠区域重叠。
根据本公开的实施例，所述触控柔性电路板包括：基材，所述基材具有相对设置的第一表面和第二表面；第一导线层和第二，所述第一导线层设在所述第一表面上，所述第二导线层设在和所述第二表面上；第一胶层和第二胶层，所述第一胶层设在所述第一导线层远离所述基材的一侧表面上，所述第二胶层设在所述第二导线层远离所述基材的表面上；第一绝缘保护层和第二绝缘保护层，所述第一绝缘保护层设在所述第一胶层远离所述基材的表面上，所述第二绝缘保护层设在所述第二胶层远离所述基材的表面上；触控控制电路层，所述触控控制电路层设在位于所述第一表面一侧的所述第一绝缘保护层远离所述基材的表面上；保护胶带，所述保护胶带设在所述触控电路层远离所述基材的表面上；电磁屏蔽层，所述电磁屏蔽层设在位于所述第一表面一侧的所述绝缘保护层远离所述基材的表面上；柔性保护层，所述柔性保护层设在位于所述第二表面一侧的所述第二导线层远离所述基材的表面上；连接端子，所述连接端子设在位于所述第二表面一侧的所述第二导线层远离所述基材的表面上，其中，所述第二绝缘层和所述散热金属层相接触。
根据本公开的实施例，所述主柔性电路板远离所述显示基板的表面与所述驱动控制电路远离所述显示基板的表面齐平。
根据本公开的实施例，所述触控柔性电路板绑定在所述主柔性电路板上，且所述触控柔性电路板和所述主柔性电路板的绑定位置位于所述主柔性电路板和所述显示基板的绑定位置的内侧。
根据本公开的实施例，所述散热膜落在所述显示区和所述绑定区中。
在本公开的另一方面，本公开提供了一种显示装置。根据本公开的实施例，该显示装置包括前面所述的显示模组。该显示装置在实现窄边框的同时，不存在局部过热导致Panel灼烧的问题，同时可以有效改善TFPC和Driver IC之间的信号干扰，另外，TFPC、Driver  IC、MFPC和SCF空间位置设置合理，在有效保证各部件功能实现、互不干扰的同时，可以占据较小的空间，符合电子设备轻薄化和小型化的趋势。
附图说明
图1是本公开一个实施例的显示模组非弯折状态的的平面结构示意图。
图2是图1中沿A-A线的剖面结构示意图。
图3是本公开另一个实施例的显示模组的弯折状态的侧面的结构示意图。
图4是本公开另一个实施例的显示模组的绑定区的剖面结构示意图。
图5是本公开另一个实施例的显示模组的绑定区的剖面结构示意图。
图6是本公开另一个实施例的显示模组的绑定区的平面透视结构示意图。
图7是图6中沿B-B线的剖面结构示意图。
具体实施方式
下面详细描述本公开的实施例。下面描述的实施例是示例性的，仅用于解释本公开，而不能理解为对本公开的限制。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。
本公开是基于发明人的以下发现和认识而完成的：
虽然COP封装技术可以将边框做到很窄，但同时也带来了良率低、局部过热导致Panel灼烧和信号干扰问题。其中，局部过热问题是因为COP封装技术的Driver IC正面朝上设置，背面是Panel的基板，而基板的下部才是SCF(散热膜)，这样一来Driver IC产生的热量无法直接与散热膜接触，从而热量无法快速散去，从而造成局部热量积累，甚至产生Panel灼伤的问题。另外，显示模组的设计原则是尽可能将Driver IC与TFPC进行避让，以避免二者之间的结构干涉和信号干扰，但是COP技术由于将Driver IC做到基板上，导致Driver IC与TFPC距离很近，很难让TFPC避让Driver IC，如果将TFPC做成两段，将与Driver IC干涉的部分掏空，绕开Driver IC，则器件内部空间越来越拥挤，很少有空间提供给TFPC做避让Driver IC的设计；且TFPC分两段必定会有两个Bonding位置，双边Bonding会有诸多Bonding问题，从而导致COP封装技术良率较低。为了解决上述散热问题和信号干扰问题，本公开提出在TFPC与Driver IC的接触面之间增加一层散热金属层的新型设计方案，散热金属层可以将Driver IC产生的热量分散在整个散热金属层，从而协助散热，同时由于散热金属层具有屏蔽作用，可以有效改善TFPC与Driver IC之间的信号干扰，不需要在结构上对TFPC和Driver IC进行避让设计，避免绑定问题的同时，空间利用率和加工良率更 高。
在本公开的一个方面，本公开提供了一种显示模组。根据本公开的实施例，参照图1、图2和图3，该显示模组包括：显示基板10，所述显示基板10包括显示区11、弯折区12和绑定区13，所述弯折区12位于所述显示区11和所述绑定区13之间；驱动控制电路20，所述驱动控制电路20设在所述显示基板10上，且落在所述绑定区13中；主柔性电路板60，所述主柔性电路板60设在所述显示基板10上，落在所述绑定区13中，且位于所述驱动控制电路20的内侧；触控柔性电路板30，所述触控柔性电路板30设在所述驱动控制电路20和所述主柔性电路板60远离所述显示基板10的一侧，且落在绑定区13中；散热金属层40，所述散热金属层40设在所述驱动控制电路20和所述触控柔性电路板30之间，且与所述驱动控制电路20和所述触控柔性电路板30相接触；散热膜50，所述散热膜50设在所述显示基板10远离所述驱动控制电路10的一侧。该显示模组中，通过设置散热金属层可以将Driver IC产生的热量分散在整个散热金属层，使得热量快速散去，避免了局部热量集中而导致Panel灼伤，同时散热金属层还具有屏蔽作用，可以有效改善触控柔性电路板(TFPC)和Driver IC之间的信号干扰，不需要在结构上对TFPC和Driver IC进行避让设计，提高了良率和空间利用率。且散热金属层可以预先集成设置在TFPC上或者Driver IC上，可以与现有工艺兼容，易于实现，且成本较低。另外，散热金属层和散热膜可以配合、协同作用，更加快速的传导和疏散热量，提高显示模组的使用性能。
根据本公开的实施例，显示基板没有特别限制，可以为本领域常规的显示基板，例如包括但不限于聚合物基板，如聚酰亚胺(PI)基板等，在此不再过多赘述。
根据本公开的实施例，所述散热金属层可以选用散热性较好的金属形成，具体的，可以采用的散热金属层的材料可以包括银、铜、金、铝、钼、钨、锌、镍、铁、铂、锡和铅中的至少一种。在本公开的一个具体实施例中，所述散热金属层的材料为铜。由此，在可以快速导热，有效改善信号干扰的同时，成本较低，来源广泛，经济性较好。
根据本公开的实施例，散热金属层的厚度可以根据显示模组的Z向(即散热金属层的厚度方向)高度决定，当Z向空间较多则尽量将散热金属层设置厚一些，以获得更好的散热和屏蔽效果。一些具体实施例中，散热金属层的厚度d可以为0.02～1mm，具体如0.02mm、0.05mm、0.08mm、0.1mm、0.2mm、0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、0.9mm、1mm等。在该厚度范围内，既可以实现较好的散热和屏蔽效果，同时不会增加显示模组的厚度。
根据本公开的实施例，散热金属层可以全部盖在Driver IC上，也可以部分盖在Driver IC上。一些具体实施例中，参照图2，所述散热金属层40在所述显示基板10上的正投影与 所述触控柔性电路板30在所述显示基板10上的正投影重叠。此时，散热金属层的面积取决于TFPC的大小，例如在60mm×30mm以内(该尺寸范围在很好的满足TFPC上的线路布局的同时，可以使得TFPC的尺寸较小，占用较小的空间)，可以预先将散热金属层集成设置在TFPC朝向Driver IC的表面上，制备更加便捷和快速，且良率较高。另一些实施例中，参照图4，所述驱动控制电路20在所述显示基板10上的正投影与所述触控柔性电路板30在所述显示基板10上的正投影存在重叠区域，所述散热金属层40在所述显示基板10上的正投影与所述重叠区域重叠。由此，可以根据实际需要灵活设置散热金属层的位置，满足不同工作情况的散热需求和屏蔽效果，也可以更灵活的将散热金属层预先集成设置在触控柔性电路板上或者驱动控制电路上，以更方便的组装。
根据本公开的实施例，只要满足散热需求，散热膜的具体结构可以根据实际需要灵活选择，具体的，散热膜可以为复合材料，具体可以包括层叠设置的泡棉，铜箔，网格胶等。由此，具有较好的散热效果。一些具体实施例中，参照图3，散热膜50落在显示基板的显示区11中和绑定区13中，而弯折区12中并未设置散热膜。由此，能够使得显示基板具有较好的弯折性能，弯折半径较小，同时弯折区域并未设置产热较高的元件，并不会对显示模组的散热性能产生负面影响。
根据本公开的实施例，驱动控制电路只要可以有效为显示模组输入信号，其具体结构没有特别限制，例如可以包括薄膜晶体管、必要的走线和连接线路等等，具体可以参照常规技术进行，在此不再过多赘述。
根据本公开的实施例，只要触控柔性电路板可以有效为触控模组输入信号，触控柔性电路板的具体结构可以根据实际需要灵活选择。一些具体实施例中，参照图5，所述触控柔性电路板30包括：基材31，所述基材31具有相对设置的第一表面311和第二表面312；第一导线层321和第二导线层322，所述第一导线层321设在所述第一表面311上，第二导线层322设在所述第二表面312上；第一胶层331和第二胶层332，所述胶层331设在所述第一导线层321远离所述基材31的表面上，第二胶层332设在所述第二导线层322远离所述基材31的表面上；第一绝缘保护层341和第二绝缘保护层342，所述第一绝缘保护层341设在所述第一胶层331远离所述基材31的表面上，第二绝缘保护层342设在所述第二胶层332远离所述基材31的表面上；触控控制电路层35，所述触控控制电路层35设在所述第一绝缘保护层341远离所述基材31的表面上；保护胶带36，所述保护胶带36设在所述触控控制电路层35远离所述基材31的表面上；柔性保护层38，所述柔性保护层38设在所述第二导线层322远离所述基材31的一侧；连接端子39，所述连接端子39设在所述第二导线层322远离所述基材31的一侧，其中，所述第二绝缘层342和所述散热金属层 40相接触。具体的，第一导线层和第二导线层可以为铜层，由此导电性能较好，而第一胶层和第二胶层可以用于粘贴第一导线层、第二导线层和基材；第一绝缘保护层和第二绝缘保护层可以用于保护第一导线层和第二导线层，其具体材质可以为塑料，具体如聚酰亚胺(PI)等。
根据本公开的实施例，参照图5，所述触控柔性电路板还包括：电磁屏蔽层37，所述电磁屏蔽层37设在所述第一绝缘保护层341远离所述基材31的表面上。具体的，在第二绝缘保护层远离基材的表面上设置了散热金属层40，其可以兼具散热和屏蔽的效果，因此仅需要在第一绝缘保护层的表面上设置电磁屏蔽层即可，进一步简化了结构，节约了成本。
根据本公开的具体实施例，参照图6，所述主柔性电路板60在所述显示基板10上的正投影与所述触控柔性电路板30在所述显示基板10上的正投影部分重叠。具体的，参照图7，在显示模组的Z向上，驱动控制电路、主柔性电路板(MFPC)设在显示基板上，而触控柔性电路板设在驱动控制电路和主柔性电路板远离显示基板的一侧，其中，MFPC是Bonding在显示基板上，具体绑定位置61可以位于Driver IC的内侧，而其在高度上可以和Driver IC在同一平面，即所述主柔性电路板远离所述显示基板的表面与所述驱动控制电路远离所述显示基板的表面齐平。进一步的，由于主柔性电路板60在显示基板10上的正投影与触控柔性电路板30在显示基板10上的正投影部分重叠，触控柔性电路板30可以绑定在主柔性电路板60上，所述触控柔性电路板30和所述主柔性电路板60的绑定位置62位于所述主柔性电路板和所述显示基板的绑定位置61的内侧。更具体的，触控柔性电路板30上的触控控制电路35可以位于主柔性电路板和所述显示基板的绑定位置61的内侧，而主柔性电路板60上的功能元件63(如电容元件等)和触控控制电路35分别位于触控柔性电路板30和所述主柔性电路板60的绑定位置62相对的两侧。由此，产生热量较高的元件间隔开分布，更利于散热以避免局部热量集中。该显示模组中，Driver IC用于为显示模组提供信号，触控柔性电路板为触控模组提供信号，而主柔性电路板用于靠近弯折区域的一侧与主板相连，用于整体控制显示模组和含有该显示模组的显示装置的工作。由此，三者结构设计合理，占用空间较小，散热效果较好，不会局部过热，且三者之间可以独立工作，不会互相影响。
在本公开的另一方面，本公开提供了一种显示装置。根据本公开的实施例，该显示装置包括前面所述的显示模组。该显示装置在实现窄边框的同时，不存在局部过热导致Panel灼烧的问题，同时可以有效改善TFPC和Driver IC之间的信号干扰，另外，TFPC、Driver IC、MFPC和SCF空间位置设置合理，在有效保证各部件功能实现、互不干扰的同时，可以占据较小的空间，符合电子设备轻薄化和小型化的趋势。
根据本公开的实施例，该限制装置的具体种类没有特别限制，可以为手机、电视机、平板电脑、广告屏幕、画屏、游戏机、可穿戴设备等等，且可以理解，除了前面所述的显示模组之外，该显示装置还可以包括常规显示装置必备的结构和部件，以手机为例，其还可以包括触控模组、指纹识别模组、摄像模组、电池、主板、储存器、外壳等等，具体均可参照常规技术进行，在此不再一一赘述。其中，触控模组的具体设置方式没有特别限制，可以为in-cell方式、on-cell方式等等，在此也不再一一描述。
在本公开的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本公开的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本公开的限制，本领域的普通技术人员在本公开的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (12)

  1. 一种显示模组，其特征在于，包括：
    显示基板，所述显示基板包括显示区、弯折区和绑定区，所述弯折区位于所述显示区和所述绑定区之间；
    驱动控制电路，所述驱动控制电路设在所述显示基板上，且落在所述绑定区中；
    主柔性电路板，所述主柔性电路板设在所述显示基板上，落在所述绑定区中，且位于所述驱动控制电路的内侧；
    触控柔性电路板，所述触控柔性电路板设在所述驱动控制电路和所述主柔性电路板远离所述显示基板的一侧，且落在所述绑定区中；
    散热金属层，所述散热金属层设在所述驱动控制电路和所述触控柔性电路板之间，且与所述驱动控制电路和所述触控柔性电路板相接触；
    散热膜，所述散热膜设在所述显示基板远离所述驱动控制电路的一侧。
  2. 根据权利要求1所述的显示模组，其特征在于，所述散热金属层的材料包括银、铜、金、铝、钼、钨、锌、镍、铁、铂、锡和铅中的至少一种。
  3. 根据权利要求1或2所述的显示模组，其特征在于，所述散热金属层的材料为铜。
  4. 根据权利要求1-3中任一项所述的显示模组，其特征在于，所述散热金属层的厚度为0.02～1mm。
  5. 根据权利要求1-4中任一项所述的显示模组，其特征在于，所述散热金属层在所述显示基板上的正投影与所述触控柔性电路板在所述显示基板上的正投影重叠。
  6. 根据权利要求1-5中任一项所述的显示模组，其特征在于，所述驱动控制电路在所述显示基板上的正投影与所述触控柔性电路板在所述显示基板上的正投影存在重叠区域，所述散热金属层在所述显示基板上的正投影与所述重叠区域重叠。
  7. 根据权利要求1-6中任一项所述的显示模组，其特征在于，所述触控柔性电路板包括：
    基材，所述基材具有相对设置的第一表面和第二表面；
    第一导线层和第二，所述第一导线层设在所述第一表面上，所述第二导线层设在所述第二表面上；
    第一胶层和第二胶层，所述第一胶层设在所述第一导线层远离所述基材的表面上，所述第二胶层设在所述第二导线层远离所述基材的表面上；
    第一绝缘保护层和第二绝缘保护层，所述第一绝缘保护层设在所述第一胶层远离所述基材的表面上，所述第二绝缘保护层设在所述第二胶层远离所述基材的表面上；
    触控控制电路层，所述触控控制电路层设在所述第一绝缘保护层远离所述基材的表面上；
    保护胶带，所述保护胶带设在所述触控电路层远离所述基材的表面上；
    柔性保护层，所述柔性保护层设在所述第二导线层远离所述基材的表面上；
    连接端子，所述连接端子设在所述第二导线层远离所述基材的表面上，
    其中，所述第二绝缘层和所述散热金属层相接触。
  8. 根据权利要求7所述的显示模组，其特征在于，所述触控柔性电路板还包括：
    电磁屏蔽层，所述电磁屏蔽层设在所述第一绝缘保护层远离所述基材的表面上。
  9. 根据权利要求1-8中任一项所述的显示模组，其特征在于，所述主柔性电路板远离所述显示基板的表面与所述驱动控制电路远离所述显示基板的表面齐平。
  10. 根据权利要求1-9中任一项所述的显示模组，其特征在于，所述触控柔性电路板绑定在所述主柔性电路板上，且所述触控柔性电路板和所述主柔性电路板的绑定位置位于所述主柔性电路板和所述显示基板的绑定位置的内侧。
  11. 根据权利要求1-10中任一项所述的显示模组，其特征在于，所述散热膜落在所述显示区和所述绑定区中。
  12. 一种显示装置，其特征在于，包括权利要求1-11中任一项所述的显示模组。
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