WO2021212434A1 - 板对板连接结构及其制作方法 - Google Patents

板对板连接结构及其制作方法 Download PDF

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Publication number
WO2021212434A1
WO2021212434A1 PCT/CN2020/086492 CN2020086492W WO2021212434A1 WO 2021212434 A1 WO2021212434 A1 WO 2021212434A1 CN 2020086492 W CN2020086492 W CN 2020086492W WO 2021212434 A1 WO2021212434 A1 WO 2021212434A1
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WO
WIPO (PCT)
Prior art keywords
layer
connector
board
outer conductive
conductive circuit
Prior art date
Application number
PCT/CN2020/086492
Other languages
English (en)
French (fr)
Inventor
郝建一
李艳禄
Original Assignee
宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏启胜精密电子(秦皇岛)有限公司, 鹏鼎控股(深圳)股份有限公司 filed Critical 宏启胜精密电子(秦皇岛)有限公司
Priority to PCT/CN2020/086492 priority Critical patent/WO2021212434A1/zh
Priority to CN202080063204.3A priority patent/CN114391304B/zh
Priority to US17/764,402 priority patent/US12028976B2/en
Priority to TW109113967A priority patent/TWI754268B/zh
Publication of WO2021212434A1 publication Critical patent/WO2021212434A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the application relates to the field of circuit boards, and in particular to a board-to-board connection structure and a manufacturing method thereof.
  • connection process is: install the connector male seat and the connector female seat on the two circuit boards respectively, and connect them The connection of the connector male seat and the connector female seat connects the two circuit boards.
  • connection method will increase the height of the connector between the two circuit boards, so that the height of the final electronic product is relatively large, which cannot meet actual needs.
  • the connector since the connector is barely exposed, the connector is easily damaged and oxidized.
  • the present application provides a method for manufacturing a low-height board-to-board connection structure.
  • This application provides a method for manufacturing a board-to-board connection structure, including:
  • the first circuit board including a first base layer and a first outer conductive circuit layer and a second outer conductive circuit layer formed on both sides of the first base layer;
  • a first through hole is opened in the first circuit board, and a region of the first outer conductive circuit layer adjacent to the first through hole forms a first bonding pad;
  • the second circuit board including a second base layer and a third outer conductive circuit layer formed on one side of the second base layer, the third outer conductive circuit layer including a second bonding pad;
  • the first connector and the second connector are electrically connected to obtain the board-to-board connection structure.
  • the application also provides a board-to-board connection structure, including:
  • the first circuit board includes a first base layer and a first outer conductive circuit layer and a second outer conductive circuit layer formed on both sides of the first base layer.
  • a first through hole is opened, a first solder pad is formed in a region of the first outer conductive circuit layer adjacent to the first through hole, and a first conductive paste is formed on the first solder pad;
  • a first connector, the first connector is accommodated in the first through hole and electrically connected to the first solder pad through the first conductive paste;
  • a second circuit board, the second circuit board and the first circuit board are stacked, and the second circuit board includes a second base layer and a third outer conductive circuit layer formed on one side of the second base layer,
  • the third outer conductive circuit layer includes a second solder pad, and a second conductive paste is formed on the second solder pad;
  • a second connector the second connector is electrically connected to the second solder pad through the second conductive paste, and is disposed opposite to and electrically connected to the first connector.
  • the first through hole is opened in the first circuit board, the first connector is accommodated in the first through hole through the first conductive paste, and is connected to the first through hole.
  • the second circuit board of the second connector is connected, thereby realizing the connection of the two circuit boards, and reducing the height after the two circuit boards are connected, that is, reducing the height of the board-to-board connection structure.
  • the first connector since the first connector is accommodated in the first through hole, the first connector is not easily damaged and oxidized.
  • FIG. 1 is a schematic structural diagram of a first copper-clad substrate provided by a preferred embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a circuit substrate provided by a preferred embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a second copper-clad substrate provided by a preferred embodiment of the present application.
  • FIG. 4 is a schematic diagram of the structure after the first copper-clad substrate shown in FIG. 1, the circuit substrate shown in FIG. 2 and the second copper-clad substrate shown in FIG. 3 are laminated and pressed together.
  • FIG. 5 is a schematic diagram of the structure of the first copper foil layer and the second copper foil layer shown in FIG. 4 after being etched separately.
  • FIG. 6 is a schematic diagram of the structure after the first through hole and the second through hole are opened in the first circuit board shown in FIG. 5.
  • FIG. 7 is a schematic diagram of the structure after the first solder mask layer and the second solder mask layer are respectively formed on the first outer conductive circuit layer and the second outer conductive circuit layer shown in FIG. 6.
  • FIG. 8 is a schematic diagram of the structure after forming a first conductive paste and a third conductive paste on the first solder pad and the third solder pad shown in FIG. 7 respectively.
  • FIG. 9 is a schematic diagram of the structure after the first connector and the third connector are respectively installed in the first through hole and the second through hole shown in FIG. 8.
  • FIG. 10 is a schematic structural diagram of a second circuit board provided by a preferred embodiment of the present application.
  • FIG. 11 is a schematic diagram of the structure after forming a third solder resist layer on the third outer conductive circuit layer shown in FIG. 10.
  • FIG. 12 is a schematic diagram of the structure after forming a second conductive paste on the second solder pad shown in FIG. 11.
  • FIG. 13 is a schematic diagram of the structure after the second connector is installed on the second soldering pad shown in FIG. 12.
  • FIG. 14 is a schematic structural diagram of a board-to-board connection structure obtained by electrically connecting the first connector and the third connector shown in FIG. 9 to the second connector and the fourth connector shown in FIG. 13.
  • the first adhesive layer 101 is the first adhesive layer 101
  • the first community level 201 The first staff level 201
  • Inner conductive circuit layer 202 Inner conductive circuit layer 202
  • the second copper foil layer 302 is the second copper foil layer 302
  • the first solder mask 50 is the first solder mask 50
  • the second community level 701 is the second community level 701
  • the third circuit board 80 is the third circuit board 80
  • the third facility level 801 is the third facility level 801
  • an element when an element is referred to as being “fixed to” another element, it can be directly on the other element or a central element may also be present.
  • an element When an element is considered to be “connected” to another element, it can be directly connected to the other element or an intermediate element may be present at the same time.
  • an element When an element is considered to be “disposed on” another element, it can be directly disposed on the other element or a centered element may exist at the same time.
  • a preferred embodiment of the present application provides a method for manufacturing a board-to-board connection structure, which includes the following steps:
  • Step S11 please refer to FIG. 1 to provide a first copper-clad substrate 10, the first copper-clad substrate 10 including a first adhesive layer 101 and a first copper foil layer 102 formed on the first adhesive layer 101 .
  • the material of the first adhesive layer 101 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (polyimide). , PI), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) One of the other resins.
  • the material of the first adhesive layer 101 is polyimide.
  • the circuit substrate 20 includes a first base layer 201 and an inner conductive circuit layer 202 formed on the first base layer 201.
  • the material of the first base layer 201 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the first base layer 201 is butadiene-styrene copolymer.
  • a second copper-clad substrate 30 is provided.
  • the second copper-clad substrate 30 includes a second adhesive layer 301 and a second copper foil layer 302 formed on the second adhesive layer 301 .
  • the material of the second adhesive layer 301 can be the same as the material of the first adhesive layer 101, which will not be repeated here.
  • Step S14 referring to FIG. 4, the first copper-clad substrate 10, the circuit substrate 20, and the second copper-clad substrate 30 are sequentially laminated and pressed together.
  • Step S15 referring to FIG. 5, etching the first copper foil layer 102 and the second copper foil layer 302 to form a first outer conductive circuit layer 103 and a second outer conductive circuit layer 303, respectively, thereby obtaining First circuit board 40.
  • the number of the inner conductive circuit layer 202 is one, and the number of the first outer conductive circuit layer 103 and the number of the second outer conductive circuit layer 303 is one respectively.
  • the number of the inner conductive circuit layer 202 may also be more than one.
  • other inner conductive circuit layers can be continuously formed on the circuit substrate 20 by the build-up method, and then the first copper-clad substrate 10 and the second copper-clad substrate 30 can be covered and carried out. By etching, the first outer conductive circuit layer 103 and the second outer conductive circuit layer 303 are obtained.
  • the outermost first copper foil layer 102 forms the first outer conductive circuit layer 103
  • the outermost second copper foil layer 302 forms the second outer conductive circuit layer 303
  • the inner The first copper foil layer 102 and the inner second copper foil layer 302 both form an inner conductive circuit layer.
  • first outer conductive circuit layer 103, the second outer conductive circuit layer 303, and the inner conductive circuit layer 202 can all be formed by etching through exposure and development.
  • Step S16 referring to FIG. 6, at least one first through hole 41 and at least one second through hole 42 are opened in the first circuit board 40.
  • first through hole 41 and the second through hole 42 can be formed by laser drilling.
  • first through hole 41 and the second through hole 42 sequentially penetrate the first outer conductive circuit layer 103, the first adhesive layer 101, the inner conductive circuit layer 202, and the The first base layer 201, the second adhesive layer 301 and the second outer conductive circuit layer 303.
  • step S17 referring to FIG. 7, a first solder mask 50 and a second solder mask 51 are formed on the first outer conductive circuit layer 103 and the second outer conductive circuit layer 303, respectively.
  • the first solder mask 50 is also filled in the gaps of the first outer conductive circuit layer 103, and the second solder mask 51 is also filled in the gaps of the second outer conductive circuit layer 303 middle.
  • the first solder mask 50 is used to protect the first outer conductive circuit layer 103, and the second solder mask 51 is used to protect the second outer conductive circuit layer 303.
  • the material of the first solder mask 50 and the second solder mask 51 can be solder mask ink, such as green oil.
  • the region of the first outer conductive circuit layer 103 adjacent to the first through hole 41 is exposed to the first solder mask 50 to form the first solder pad 52, and the second outer conductive circuit layer The area 303 adjacent to the second through hole 42 is exposed to the second solder mask 51 to form the third solder pad 53.
  • Step S18 referring to FIG. 8, a first conductive paste 54 is formed on the first solder pad 52, and a third conductive paste 55 is formed on the third solder pad 53.
  • Step S19 referring to FIG. 9, a first connector 60 and a third connector 61 are provided, and the first connector 60 is accommodated in the first through hole 41 and electrically connected through the first conductive paste 54 It is connected to the first solder pad 52, and the third connector 61 is received in the second through hole 42 and is electrically connected to the third solder pad 53 through the third conductive paste 55.
  • the first conductive paste 54 is used to bond and fix the first connector 60 to the first through hole 41 and electrically connect the first connector 60 and the first solder pad 52;
  • the third conductive paste 55 is used to bond and fix the third connector 61 in the second through hole 42, and electrically connect the third connector 61 and the third solder pad 53.
  • the first connector 60 and the third connector 61 may be connector male sockets or connector female sockets. In this embodiment, the first connector 60 and the third connector 61 are connector male sockets.
  • the second circuit board 70 includes a second base layer 701 and a third outer conductive circuit layer 702 respectively formed on both sides of the second base layer 701.
  • the material of the second base layer 701 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the second base layer 701 is polyimide.
  • the second circuit board 70 may be a multilayer circuit layer.
  • the second circuit board 70 may include only one third outer conductive circuit layer 702. That is, the second circuit board 70 is a single-layer circuit board.
  • Step S21 referring to FIG. 11, a third solder mask 71 is formed on one of the third outer conductive circuit layers 702.
  • the third solder mask layer 71 is also filled in the gaps of the third outer conductive circuit layer 702.
  • the third solder mask layer 71 is used to protect the third outer conductive circuit layer 702.
  • the material of the third solder mask layer 71 may be solder mask ink, such as green oil.
  • the area of the third outer conductive circuit layer 702 exposed to the third solder mask layer 71 forms a second solder pad 72.
  • Step S22 referring to FIG. 12, a second conductive paste 73 is formed on the second solder pad 72.
  • Step S23 referring to FIG. 13, a second connector 74 is provided, and the second connector 74 is electrically connected to the second solder pad 72 through the second conductive paste 73.
  • the second conductive paste 73 is used to bond and fix the second connector 74 on the third outer conductive circuit layer 702, and electrically connect the second connector 74 and the first Two soldering pad 72.
  • the second connector 74 is a male connector or a female connector. In this embodiment, the second connector 74 is a connector female seat.
  • the third circuit board 80 includes a third base layer 801 and fourth outer conductive circuit layers 802 respectively formed on both sides of the third base layer 801.
  • the material of the third base layer 801 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the third base layer 801 is polyimide.
  • the third circuit board 80 may be a multilayer circuit layer.
  • the third circuit board 80 may include only one fourth outer conductive circuit layer 802. That is, the third circuit board 80 is a single-layer circuit board.
  • step S25 a fourth solder mask 81 is formed on one of the fourth outer conductive circuit layers 802.
  • the fourth solder mask layer 81 is also filled in the gap of the fourth outer conductive circuit layer 802.
  • the fourth solder mask layer 81 is used to protect the fourth outer conductive circuit layer 802.
  • the material of the fourth solder mask layer 81 may be solder mask ink, such as green oil.
  • the area of the fourth outer conductive circuit layer 802 exposed to the fourth solder mask layer 81 forms a fourth solder pad 82.
  • step S26 a fourth conductive paste 83 is formed on the fourth solder pad 82.
  • step S27 a fourth connector 90 is provided, and the fourth connector 90 is electrically connected to the fourth solder pad 82 through the fourth conductive paste 83.
  • the fourth conductive paste 83 is used to bond and fix the fourth connector 90 on the fourth outer conductive circuit layer 802, and electrically connect the fourth connector 90 and the first Four soldering pad 82.
  • the fourth connector 90 is a male connector or a female connector. In this embodiment, the fourth connector 90 is a connector female seat.
  • Step S28 stacking the second circuit board 70, the first circuit board 40, and the third circuit board 80 in sequence so that the first connector 60 is opposite to the second connector 74, and The third connector 61 is opposite to the fourth connector 90.
  • Step S29 electrically connecting the first connector 60 and the second connector 74, and electrically connecting the third connector 61 and the fourth connector 90, thereby obtaining the board-to-board connection Structure 100.
  • the connector male seat and the connector female seat are of the existing structure, that is, the connector male seat and the connector female seat can be plugged into each other to realize electrical connection, and the specific structure is not repeated here.
  • the present application also provides a board-to-board connection structure 100, including a first circuit board 40, a first solder mask 50, a second solder mask 51, a first connector 60, and a third connector 61 , The second circuit board 70, the third solder mask 71, the second connector 74, the third circuit board 80, the fourth solder mask 81 and the fourth connector 90.
  • the first circuit board 40 includes a first base layer 201 and a first outer conductive circuit layer 103 and a second outer conductive circuit layer 303 respectively formed on both sides of the first base layer 201.
  • the material of the first base layer 201 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the first base layer 201 is butadiene-styrene copolymer.
  • the first circuit board 40 further includes at least one inner conductive circuit layer 202 located between the first outer conductive circuit layer 103 and the second outer conductive circuit layer 303.
  • a first adhesive layer 101 is provided between the inner conductive circuit layer 202 and the first outer conductive circuit layer 103, and the inner conductive circuit layer 202 and the second outer conductive circuit layer 303
  • a second adhesive layer 301 is provided in between.
  • the number of the inner conductive circuit layer 202 is one layer.
  • the material of the first adhesive layer 101 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (polyimide). , PI), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) One of the other resins.
  • the material of the first adhesive layer 101 is polyimide.
  • the material of the second adhesive layer 301 can be the same as the material of the first adhesive layer 101, which will not be repeated here.
  • At least one first through hole 41 and at least one second through hole 42 are opened in the first circuit board 40.
  • first through hole 41 and the second through hole 42 sequentially penetrate the first outer conductive circuit layer 103, the first adhesive layer 101, the inner conductive circuit layer 202, and the The first base layer 201, the second adhesive layer 301 and the second outer conductive circuit layer 303.
  • the first solder mask 50 is formed on the first outer conductive circuit layer 103, and the second solder mask 51 is formed on the second outer conductive circuit layer 303.
  • the first solder mask 50 is also filled in the gaps of the first outer conductive circuit layer 103, and the second solder mask 51 is also filled in the gaps of the second outer conductive circuit layer 303 middle.
  • the first solder mask 50 is used to protect the first outer conductive circuit layer 103, and the second solder mask 51 is used to protect the second outer conductive circuit layer 303.
  • the material of the first solder mask 50 and the second solder mask 51 can be solder mask ink, such as green oil.
  • the region of the first outer conductive circuit layer 103 adjacent to the first through hole 41 is exposed to the first solder mask 50 to form a first solder pad 52, and the second outer conductive circuit layer 303 The area adjacent to the second through hole 42 is exposed to the second solder mask 51 to form a third solder pad 53.
  • a first conductive paste 54 is formed on the first solder pad 52, and a third conductive paste 55 is formed on the third solder pad 53.
  • the first connector 60 is received in the first through hole 41 and is electrically connected to the first soldering pad 52 through the first conductive paste 54, and the third connector 61 is received in the first through hole 41.
  • the two through holes 42 are electrically connected to the third solder pad 53 through the third conductive paste 55.
  • the first conductive paste 54 is used to bond and fix the first connector 60 to the first through hole 41 and electrically connect the first connector 60 and the first solder pad 52;
  • the third conductive paste 55 is used to bond and fix the third connector 61 in the second through hole 42, and electrically connect the third connector 61 and the third solder pad 53.
  • the first connector 60 and the third connector 61 may be connector male sockets or connector female sockets. In this embodiment, the first connector 60 and the third connector 61 are connector male sockets.
  • the second circuit board 70 and the first circuit board 40 are laminated and arranged.
  • the second circuit board 70 includes a second base layer 701 and a third outer conductive circuit layer formed on both sides of the second base layer 701. 702.
  • the material of the second base layer 701 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the second base layer 701 is polyimide.
  • the second circuit board 70 may be a multilayer circuit layer.
  • the second circuit board 70 may include only one third outer conductive circuit layer 702. That is, the second circuit board 70 is a single-layer circuit board.
  • the third solder mask layer 71 is formed on one of the third outer conductive circuit layers 702. Wherein, the third solder mask layer 71 is also filled in the gaps of the third outer conductive circuit layer 702. The third solder mask layer 71 is used to protect the third outer conductive circuit layer 702. Wherein, the material of the third solder mask layer 71 may be solder mask ink, such as green oil.
  • the area of the third outer conductive circuit layer 702 exposed to the third solder mask layer 71 forms a second solder pad 72.
  • a second conductive paste 73 is formed on the second solder pad 72.
  • the second connector 74 is electrically connected to the second solder pad 72 through the second conductive paste 73, and is disposed opposite to and electrically connected to the first connector 60.
  • the second conductive paste 73 is used to bond and fix the second connector 74 on the third outer conductive circuit layer 702, and electrically connect the second connector 74 and the first Two soldering pad 72.
  • the second connector 74 is a male connector or a female connector. In this embodiment, the second connector 74 is a connector female seat.
  • the third circuit board 80 and the first circuit board 40 are stacked.
  • the third circuit board 80 includes a third base layer 801 and fourth outer conductive circuit layers 802 respectively formed on both sides of the third base layer 801.
  • the material of the third base layer 801 can be selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI) ), Polyethylene Terephthalate (PET), Butadiene Styrene Copolymer (BS) and Polyethylene Naphthalate (PEN) and other resins One of them.
  • the material of the third base layer 801 is polyimide.
  • the third circuit board 80 may be a multilayer circuit layer.
  • the third circuit board 80 may include only one fourth outer conductive circuit layer 802. That is, the third circuit board 80 is a single-layer circuit board.
  • the fourth solder mask layer 81 is formed on one of the fourth outer conductive circuit layers 802. Wherein, the fourth solder mask layer 81 is also filled in the gap of the fourth outer conductive circuit layer 802. The fourth solder mask layer 81 is used to protect the fourth outer conductive circuit layer 802. Wherein, the material of the fourth solder mask layer 81 may be solder mask ink, such as green oil.
  • the area of the fourth outer conductive circuit layer 802 exposed to the fourth solder mask layer 81 forms a fourth solder pad 82.
  • a fourth conductive paste 83 is formed on the fourth solder pad 82.
  • the fourth connector 90 is electrically connected to the fourth solder pad 82 through the fourth conductive paste 83, and is disposed opposite to and electrically connected to the third connector 61.
  • the fourth conductive paste 83 is used to bond and fix the fourth connector 90 on the fourth outer conductive circuit layer 802, and electrically connect the fourth connector 90 and the first Four soldering pad 82.
  • the fourth connector 90 is a male connector or a female connector. In this embodiment, the fourth connector 90 is a connector female seat.
  • the connector male seat and the connector female seat are of the existing structure, that is, the connector male seat and the connector female seat can be plugged into each other to realize electrical connection, and the specific structure is not repeated here.
  • the first through hole 41 is opened in the first circuit board 40, the first connector 60 is accommodated in the first through hole 41 through the first conductive paste 54, and the Connect with the second circuit board 70 on which the second connector 74 is installed, thereby realizing the connection of the two circuit boards, and reducing the height after the two circuit boards are connected, that is, reducing the board-to-board The height of the connection structure 100.
  • the first connector 60 is accommodated in the first through hole 41, the first connector 60 is not easily damaged and oxidized.

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Abstract

本申请提出一种板对板连接结构的制作方法，该方法通过在所述第一线路板中开设所述第一通孔，将第一连接器通过所述第一导电膏容置于所述第一通孔中，并将其与安装有所述第二连接器的所述第二线路板连接，从而实现了两个电路板的连接，并降低了两个电路板连接之后的高度，即降低了所述板对板连接结构的高度。另，由于所述第一连接器容置于所述第一通孔中，从而使得所述第一连接器不易损伤及氧化。本申请还提供一种由所述方法制作的板对板连接结构。

Description

板对板连接结构及其制作方法 技术领域
本申请涉及电路板领域，尤其涉及一种板对板连接结构及其制作方法。
背景技术
随着科技的进步，手机以及笔记本电脑等电子产品向轻薄化的方向发展。在电子产品的制作过程中，通常需要将两个电路板通过连接器连接，其连接过程为：将连接器公座和连接器母座分别安装在两个电路板的板面上，并通过连接器公座和连接器母座的连接使得两个电路板连接。
然而，这种连接方式将在两个电路板之间增加连接器的高度，使得最终的电子产品的高度较大，不能满足实际的需求。此外，由于连接器祼露在外，使得连接器易损伤及氧化。
发明内容
有鉴于此，本申请提供一种高度较低的板对板连接结构的制作方法。
另，还有必要提供一种上述方法制作的板对板连接结构。
本申请提供一种板对板连接结构的制作方法，包括：
提供第一线路板，所述第一线路板包括第一基层以及分别形成于所述第一基层两侧的第一外层导电线路层以及第二外层导电线路层；
在所述第一线路板中开设第一通孔，所述第一外层导电线路层临近所述第一通孔的区域形成第一焊垫；
在所述第一焊垫上形成第一导电膏；
提供第一连接器，将所述第一连接器容置于所述第一通孔中并通过所述 第一导电膏电连接至所述第一焊垫；
提供第二线路板，所述第二线路板包括第二基层以及形成于所述第二基层一侧的第三外层导电线路层，所述第三外层导电线路层包括第二焊垫；
在所述第二焊垫上形成第二导电膏；
提供第二连接器，将所述第二连接器通过所述第二导电膏电连接至所述第二焊垫；
将所述第一线路板与所述第二线路板层叠设置，使所述第一连接器与所述第二连接器相对；以及
将所述第一连接器与所述第二连接器电连接，从而得到所述板对板连接结构。
本申请还提供一种板对板连接结构，包括：
第一线路板，所述第一线路板包括第一基层以及分别形成于所述第一基层两侧的第一外层导电线路层以及第二外层导电线路层，所述第一线路板中开设有第一通孔，所述第一外层导电线路层临近所述第一通孔的区域形成有第一焊垫，所述第一焊垫上形成有第一导电膏；
第一连接器，所述第一连接器容置于所述第一通孔中并通过所述第一导电膏电连接所述第一焊垫；
第二线路板，所述第二线路板与所述第一线路板层叠设置，所述第二线路板包括第二基层以及形成于所述第二基层一侧的第三外层导电线路层，所述第三外层导电线路层包括第二焊垫，所述第二焊垫上形成有第二导电膏；以及
第二连接器，所述第二连接器通过所述第二导电膏电连接所述第二焊垫，且与所述第一连接器相对设置并电连接。
本申请通过在所述第一线路板中开设所述第一通孔，将第一连接器通过所述第一导电膏容置于所述第一通孔中，并将其与安装有所述第二连接器的所述第二线路板连接，从而实现了两个电路板的连接，并降低了两个电路板 连接之后的高度，即降低了所述板对板连接结构的高度。另，由于所述第一连接器容置于所述第一通孔中，从而使得所述第一连接器不易损伤及氧化。
附图说明
图1是本申请较佳实施例提供的第一覆铜基板的结构示意图。
图2是本申请较佳实施例提供的线路基板的结构示意图。
图3是本申请较佳实施例提供的第二覆铜基板的结构示意图。
图4是将图1所示的第一覆铜基板、图2所示的线路基板以及图3所示的第二覆铜基板层叠并压合后的结构示意图。
图5是将图4所示的第一铜箔层以及第二铜箔层分别蚀刻后的结构示意图。
图6是在图5所示的第一线路板中开设第一通孔以及第二通孔后的结构示意图。
图7是在图6所示的第一外层导电线路层以及第二外层导电线路层上分别形成第一防焊层以及第二防焊层后的结构示意图。
图8是在图7所示的第一焊垫以及第三焊垫上分别形成第一导电膏以及第三导电膏后的结构示意图。
图9是在图8所示的第一通孔以及第二通孔中分别安装第一连接器以及第三连接器后的结构示意图。
图10是本申请较佳实施例提供的第二线路板的结构示意图。
图11是在图10所示的第三外层导电线路层上形成第三防焊层后的结构示意图。
图12是在图11所示的第二焊垫上形成第二导电膏后的结构示意图。
图13是在图12所示的第二焊垫上安装第二连接器后的结构示意图。
图14是将图9所示的第一连接器与第三连接器分别与图13所示的第二连接器以及第四连接器电连接后得到的板对板连接结构的结构示意图。
主要元件符号说明
板对板连接结构            100
第一覆铜基板              10
第一胶粘层                101
第一铜箔层                102
第一外层导电线路层        103
线路基板                  20
第一基层                  201
内层导电线路层            202
第二覆铜基板              30
第二胶粘层                301
第二铜箔层                302
第二外层导电线路层        303
第一线路板                40
第一通孔                  41
第二通孔                  42
第一防焊层                50
第二防焊层                51
第一焊垫                  52
第三焊垫                  53
第一导电膏                54
第三导电膏                55
第一连接器                60
第三连接器                61
第二线路板                70
第二基层                  701
第三外层导电线路层        702
第三防焊层                71
第二焊垫                  72
第二导电膏                73
第二连接器                74
第三线路板                80
第三基层                  801
第四外层导电线路层        802
第四防焊层                81
第四焊垫                  82
第四导电膏                83
第四连接器                90
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。当一个元件被认为是“设置于”另一个元件，它可以是直接设置在另一个元件上或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技 术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
为能进一步阐述本申请达成预定目的所采取的技术手段及功效，以下结合附图及较佳实施方式，对本申请作出如下详细说明。
本申请较佳实施例提供一种板对板连接结构的制作方法，包括以下步骤：
步骤S11，请参阅图1，提供第一覆铜基板10，所述第一覆铜基板10包括第一胶粘层101以及形成于所述第一胶粘层101上的第一铜箔层102。
其中，所述第一胶粘层101的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第一胶粘层101的材质为聚酰亚胺。
步骤S12，请参阅图2，提供线路基板20，所述线路基板20包括第一基层201以及形成于所述第一基层201上的内层导电线路层202。
其中，所述第一基层201的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第一基层201的材质为丁二烯-苯乙烯共聚物。
步骤S13，请参阅图3，提供第二覆铜基板30，所述第二覆铜基板30包括第二胶粘层301以及形成于所述第二胶粘层301上的第二铜箔层302。
其中，所述第二胶粘层301的材质可与所述第一胶粘层101的材质相同，此不赘述。
步骤S14，请参阅图4，将所述第一覆铜基板10、所述线路基板20以及 所述第二覆铜基板30依次层叠并压合。
步骤S15，请参阅图5，蚀刻所述第一铜箔层102以及所述第二铜箔层302，以分别形成第一外层导电线路层103以及第二外层导电线路层303，从而得到第一线路板40。
如图5所示，所述内层导电线路层202的数量为一个，所述第一外层导电线路层103以及所述第二外层导电线路层303的数量分别为一个。然而，在其它实施方式中，所述内层导电线路层202的数量还可以为多个。例如，可以通过增层法在所述线路基板20上继续形成其它内层导电线路层(图未示)，然后再覆盖所述第一覆铜基板10以及所述第二覆铜基板30并进行蚀刻，从而得到所述第一外层导电线路层103以及第二外层导电线路层303。
具体地，最外侧的所述第一铜箔层102形成所述第一外层导电线路层103，最外侧的所述第二铜箔层302形成所述第二外层导电线路层303，内侧的所述第一铜箔层102以及内侧的所述第二铜箔层302均形成内层导电线路层。
其中，所述第一外层导电线路层103、第二外层导电线路层303以及所述内层导电线路层202均可通过曝光显影方式蚀刻形成。
步骤S16，请参阅图6，在第一线路板40中开设至少一第一通孔41以及至少一第二通孔42。
其中，所述第一通孔41以及所述第二通孔42可通过激光打孔的方式形成。
其中，所述第一通孔41以及所述第二通孔42依次贯穿所述第一外层导电线路层103、所述第一胶粘层101、所述内层导电线路层202、所述第一基层201、所述第二胶粘层301以及所述第二外层导电线路层303。
步骤S17，请参阅图7，在所述第一外层导电线路层103以及所述第二外层导电线路层303上分别形成第一防焊层50以及第二防焊层51。
其中，所述第一防焊层50还填充于所述第一外层导电线路层103的间隙 中，所述第二防焊层51还填充于所述第二外层导电线路层303的间隙中。所述第一防焊层50用于保护所述第一外层导电线路层103，所述第二防焊层51用于保护所述第二外层导电线路层303。其中，所述第一防焊层50以及所述第二防焊层51的材质均可为防焊油墨，如绿油。
其中，所述第一外层导电线路层103临近所述第一通孔41的区域暴露于所述第一防焊层50形成所述第一焊垫52，所述第二外层导电线路层303临近所述第二通孔42的区域暴露于所述第二防焊层51形成所述第三焊垫53。
步骤S18，请参阅图8，在所述第一焊垫52上形成第一导电膏54，在所述第三焊垫53上形成第三导电膏55。
步骤S19，请参阅图9，提供第一连接器60以及第三连接器61，将所述第一连接器60容置于所述第一通孔41中并通过所述第一导电膏54电连接至所述第一焊垫52，以及将所述第三连接器61容置于所述第二通孔42中并通过所述第三导电膏55电连接至所述第三焊垫53。
其中，所述第一导电膏54用于将所述第一连接器60粘结固定在所述第一通孔41孔，且电性连接所述第一连接器60以及所述第一焊垫52；所述第三导电膏55用于将所述第三连接器61粘结固定在所述第二通孔42中，且电性连接所述第三连接器61以及所述第三焊垫53。所述第一连接器60以及所述第三连接器61可为连接器公座或连接器母座。在本实施方式中，所述第一连接器60以及所述第三连接器61为连接器公座。
步骤S20，请参阅图10，提供第二线路板70，所述第二线路板70包括第二基层701以及分别形成于所述第二基层701两侧的第三外层导电线路层702。
其中，所述第二基层701的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙 二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第二基层701的材质为聚酰亚胺。
可以理解的，两个所述第三外层导电线路层702之间还可包括其他的电路层。即所述第二线路板70可为多层电路层。此外，所述第二线路板70可仅包括一个所述第三外层导电线路层702。即所述第二线路板70为单层电路板。
步骤S21，请参阅图11，在其中一所述第三外层导电线路层702上形成第三防焊层71。
其中，所述第三防焊层71还填充于所述第三外层导电线路层702的间隙中。所述第三防焊层71用于保护所述第三外层导电线路层702。其中，所述第三防焊层71的材质可为防焊油墨，如绿油。
其中，所述第三外层导电线路层702暴露于所述第三防焊层71的区域形成第二焊垫72。
步骤S22，请参阅图12，在所述第二焊垫72上形成第二导电膏73。
步骤S23，请参阅图13，提供第二连接器74，将所述第二连接器74通过所述第二导电膏73电连接至所述第二焊垫72。
其中，所述第二导电膏73用于将所述第二连接器74粘结固定在所述第三外层导电线路层702上，且电性连接所述第二连接器74以及所述第二焊垫72。所述第二连接器74为连接器公座或连接器母座。在本实施方式中，所述第二连接器74为连接器母座。
步骤S24，请参阅图14，提供第三线路板80，所述第三线路板80包括第三基层801以及分别形成于所述第三基层801两侧的第四外层导电线路层802。
其中，所述第三基层801的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、 丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第三基层801的材质为聚酰亚胺。
可以理解的，两个所述第四外层导电线路层802之间还可包括其他的电路层。即所述第三线路板80可为多层电路层。此外，所述第三线路板80可仅包括一个所述第四外层导电线路层802。即所述第三线路板80为单层电路板。
步骤S25，在其中一所述第四外层导电线路层802上形成第四防焊层81。
其中，所述第四防焊层81还填充于所述第四外层导电线路层802的间隙中。所述第四防焊层81用于保护所述第四外层导电线路层802。其中，所述第四防焊层81的材质可为防焊油墨，如绿油。
其中，所述第四外层导电线路层802暴露于所述第四防焊层81的区域形成第四焊垫82。
步骤S26，在所述第四焊垫82上形成第四导电膏83。
步骤S27，提供第四连接器90，将所述第四连接器90通过所述第四导电膏83电连接至所述第四焊垫82。
其中，所述第四导电膏83用于将所述第四连接器90粘结固定在所述第四外层导电线路层802上，且电性连接所述第四连接器90以及所述第四焊垫82。所述第四连接器90为连接器公座或连接器母座。在本实施方式中，所述第四连接器90为连接器母座。
步骤S28，将所述第二线路板70、所述第一线路板40以及所述第三线路板80依次层叠设置，使所述第一连接器60与所述第二连接器74相对，以及所述第三连接器61与所述第四连接器90相对。
步骤S29，将所述第一连接器60与所述第二连接器74电连接，以及将所述第三连接器61与所述第四连接器90电连接，从而得到所述板对板连接结构100。
其中，连接器公座和连接器母座为现有结构，即连接器公座和连接器母座可相互插接实现电连接，其具体结构在此不再赘述。
请参阅图14，本申请还提供一种板对板连接结构100，包括第一线路板40、第一防焊层50、第二防焊层51、第一连接器60、第三连接器61、第二线路板70、第三防焊层71、第二连接器74、第三线路板80、第四防焊层81以及第四连接器90。
所述第一线路板40包括第一基层201以及分别形成于所述第一基层201两侧的第一外层导电线路层103以及第二外层导电线路层303。
其中，所述第一基层201的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第一基层201的材质为丁二烯-苯乙烯共聚物。
所述第一线路板40还包括位于所述第一外层导电线路层103以及第二外层导电线路层303之间的至少一内层导电线路层202。所述内层导电线路层202与所述第一外层导电线路层103之间设置有第一胶粘层101，所述内层导电线路层202与所述第二外层导电线路层303之间设置有第二胶粘层301。在本实施方式中，所述内层导电线路层202的数量为一层。
其中，所述第一胶粘层101的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第一胶粘层101的材质为聚酰亚胺。
其中，所述第二胶粘层301的材质可与所述第一胶粘层101的材质相同， 此不赘述。
所述第一线路板40中开设有至少一第一通孔41以及至少一第二通孔42。
其中，所述第一通孔41以及所述第二通孔42依次贯穿所述第一外层导电线路层103、所述第一胶粘层101、所述内层导电线路层202、所述第一基层201、所述第二胶粘层301以及所述第二外层导电线路层303。
所述第一防焊层50形成于所述第一外层导电线路层103上，所述第二防焊层51形成于所述第二外层导电线路层303上。
其中，所述第一防焊层50还填充于所述第一外层导电线路层103的间隙中，所述第二防焊层51还填充于所述第二外层导电线路层303的间隙中。所述第一防焊层50用于保护所述第一外层导电线路层103，所述第二防焊层51用于保护所述第二外层导电线路层303。其中，所述第一防焊层50以及所述第二防焊层51的材质均可为防焊油墨，如绿油。
其中，所述第一外层导电线路层103临近所述第一通孔41的区域暴露于所述第一防焊层50形成有第一焊垫52，所述第二外层导电线路层303临近所述第二通孔42的区域暴露于所述第二防焊层51形成有第三焊垫53。所述第一焊垫52上形成有第一导电膏54，所述第三焊垫53上形成有第三导电膏55。
所述第一连接器60容置于所述第一通孔41中并通过所述第一导电膏54电连接所述第一焊垫52，所述第三连接器61容置于所述第二通孔42中并通过所述第三导电膏55电连接所述第三焊垫53。
其中，所述第一导电膏54用于将所述第一连接器60粘结固定在所述第一通孔41孔，且电性连接所述第一连接器60以及所述第一焊垫52；所述第三导电膏55用于将所述第三连接器61粘结固定在所述第二通孔42中，且电性连接所述第三连接器61以及所述第三焊垫53。所述第一连接器60以及所述第三连接器61可为连接器公座或连接器母座。在本实施方式中，所述第一连接器60以及所述第三连接器61为连接器公座。
所述第二线路板70与所述第一线路板40层叠设置，所述第二线路板70包括第二基层701以及分别形成于所述第二基层701两侧的第三外层导电线路层702。
其中，所述第二基层701的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第二基层701的材质为聚酰亚胺。
可以理解的，两个所述第三外层导电线路层702之间还可包括其他的电路层。即所述第二线路板70可为多层电路层。此外，所述第二线路板70可仅包括一个所述第三外层导电线路层702。即所述第二线路板70为单层电路板。
所述第三防焊层71形成于其中一所述第三外层导电线路层702上。其中，所述第三防焊层71还填充于所述第三外层导电线路层702的间隙中。所述第三防焊层71用于保护所述第三外层导电线路层702。其中，所述第三防焊层71的材质可为防焊油墨，如绿油。
其中，所述第三外层导电线路层702暴露于所述第三防焊层71的区域形成第二焊垫72。所述第二焊垫72上形成有第二导电膏73。
所述第二连接器74通过所述第二导电膏73电连接所述第二焊垫72，且与所述第一连接器60相对设置并电连接。
其中，所述第二导电膏73用于将所述第二连接器74粘结固定在所述第三外层导电线路层702上，且电性连接所述第二连接器74以及所述第二焊垫72。所述第二连接器74为连接器公座或连接器母座。在本实施方式中，所述第二连接器74为连接器母座。
所述第三线路板80与所述第一线路板40层叠设置。所述第三线路板80 包括第三基层801以及分别形成于所述第三基层801两侧的第四外层导电线路层802。
其中，所述第三基层801的材质可以选自环氧树脂(epoxy resin)、聚丙烯(polypropylene，PP)、BT树脂、聚苯醚(Polyphenylene Oxide，PPO)、聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)、丁二烯-苯乙烯共聚物(Butadiene styrene copolymer，BS)以及聚萘二甲酸乙二醇酯(Polyethylene Naphthalate，PEN)等树脂中的一种。在本实施例中，所述第三基层801的材质为聚酰亚胺。
可以理解的，两个所述第四外层导电线路层802之间还可包括其他的电路层。即所述第三线路板80可为多层电路层。此外，所述第三线路板80可仅包括一个所述第四外层导电线路层802。即所述第三线路板80为单层电路板。
所述第四防焊层81形成于其中一所述第四外层导电线路层802上。其中，所述第四防焊层81还填充于所述第四外层导电线路层802的间隙中。所述第四防焊层81用于保护所述第四外层导电线路层802。其中，所述第四防焊层81的材质可为防焊油墨，如绿油。
其中，所述第四外层导电线路层802暴露于所述第四防焊层81的区域形成第四焊垫82。所述第四焊垫82上形成有第四导电膏83。
所述第四连接器90通过所述第四导电膏83电连接所述第四焊垫82，且与所述第三连接器61相对设置并电连接。
其中，所述第四导电膏83用于将所述第四连接器90粘结固定在所述第四外层导电线路层802上，且电性连接所述第四连接器90以及所述第四焊垫82。所述第四连接器90为连接器公座或连接器母座。在本实施方式中，所述第四连接器90为连接器母座。
其中，连接器公座和连接器母座为现有结构，即连接器公座和连接器母座可相互插接实现电连接，其具体结构在此不再赘述。
本申请通过在所述第一线路板40中开设所述第一通孔41，将第一连接器60通过所述第一导电膏54容置于所述第一通孔41中，并将其与安装有所述第二连接器74的所述第二线路板70连接，从而实现了两个电路板的连接，并降低了两个电路板连接之后的高度，即降低了所述板对板连接结构100的高度。另，由于所述第一连接器60容置于所述第一通孔41中，从而使得所述第一连接器60不易损伤及氧化。
以上说明仅仅是对本申请一种优化的具体实施方式，但在实际的应用过程中不能仅仅局限于这种实施方式。对本领域的普通技术人员来说，根据本申请的技术构思做出的其他变形和改变，都应该属于本申请的保护范围。

Claims (10)

  1. 一种板对板连接结构的制作方法，其特征在于，包括：
    提供第一线路板，所述第一线路板包括第一基层以及分别形成于所述第一基层两侧的第一外层导电线路层以及第二外层导电线路层；
    在所述第一线路板中开设第一通孔，所述第一外层导电线路层临近所述第一通孔的区域形成第一焊垫；
    在所述第一焊垫上形成第一导电膏；
    提供第一连接器，将所述第一连接器容置于所述第一通孔中并通过所述第一导电膏电连接至所述第一焊垫；
    提供第二线路板，所述第二线路板包括第二基层以及形成于所述第二基层一侧的第三外层导电线路层，所述第三外层导电线路层包括第二焊垫；
    在所述第二焊垫上形成第二导电膏；
    提供第二连接器，将所述第二连接器通过所述第二导电膏电连接至所述第二焊垫；
    将所述第一线路板与所述第二线路板层叠设置，使所述第一连接器与所述第二连接器相对；以及
    将所述第一连接器与所述第二连接器电连接，从而得到所述板对板连接结构。
  2. 如权利要求1所述的板对板连接结构的制作方法，其特征在于，所述第一线路板中还开设有第二通孔，所述第二外层导电线路层临近所述第二通孔的区域形成第三焊垫；
    所述制作方法还包括：
    在所述第三焊垫上形成第三导电膏；
    提供第三连接器，将所述第三连接器容置于所述第二通孔中并通过所述第三导电膏电连接至所述第三焊垫；
    提供第三线路板，所述第三线路板包括第三基层以及形成于所述第三基 层一侧的第四外层导电线路层，所述第四外层导电线路层包括第四焊垫；
    在所述第四焊垫上形成第四导电膏；
    提供第四连接器，将所述第四连接器通过所述第四导电膏电连接至所述第四焊垫；
    将所述第三线路板与所述第一线路板层叠设置，使所述第四连接器与所述第三连接器相对；以及
    将所述第四连接器与所述第三连接器电连接。
  3. 如权利要求2所述的板对板连接结构的制作方法，其特征在于，所述第一线路板还包括位于所述第一外层导电线路层以及第二外层导电线路层之间的至少一内层导电线路层，所述内层导电线路层与所述第一外层导电线路层之间设置有第一胶粘层，所述内层导电线路层与所述第二外层导电线路层之间设置有第二胶粘层。
  4. 如权利要求3所述的板对板连接结构的制作方法，其特征在于，在开设所述第一通孔以及所述第二通孔之后，并在形成所述第一导电膏以及所述第二导电膏之前，所述制作方法还包括：
    在所述第一外层导电线路层上形成第一防焊层；以及
    在所述第二外层导电线路层上形成第二防焊层；
    其中，所述第一外层导电线路层临近所述第一通孔的区域暴露于所述第一防焊层形成所述第一焊垫，所述第二外层导电线路层临近所述第二通孔的区域暴露于所述第二防焊层形成所述第三焊垫。
  5. 如权利要求3所述的板对板连接结构的制作方法，其特征在于，所述第一线路板的制作包括：
    提供至少一第一覆铜基板，每一所述第一覆铜基板包括所述第一胶粘层以及形成于所述第一胶粘层上的第一铜箔层；
    提供线路基板，所述线路基板包括所述第一基层以及形成于所述第一基层上的所述内层导电线路层；
    提供至少一第二覆铜基板，每一所述第二覆铜基板包括所述第二胶粘层 以及形成于所述第二胶粘层上的第二铜箔层；
    将每一所述第一覆铜基板、所述线路基板以及每一所述第二覆铜基板依次层叠并压合；以及
    蚀刻所述第一铜箔层以及所述第二铜箔层，以分别形成所述第一外层导电线路层以及所述第二外层导电线路层，从而得到所述第一线路板。
  6. 一种板对板连接结构，其特征在于，包括：
    第一线路板，所述第一线路板包括第一基层以及分别形成于所述第一基层两侧的第一外层导电线路层以及第二外层导电线路层，所述第一线路板中开设有第一通孔，所述第一外层导电线路层临近所述第一通孔的区域形成有第一焊垫，所述第一焊垫上形成有第一导电膏；
    第一连接器，所述第一连接器容置于所述第一通孔中并通过所述第一导电膏电连接所述第一焊垫；
    第二线路板，所述第二线路板与所述第一线路板层叠设置，所述第二线路板包括第二基层以及形成于所述第二基层一侧的第三外层导电线路层，所述第三外层导电线路层包括第二焊垫，所述第二焊垫上形成有第二导电膏；以及
    第二连接器，所述第二连接器通过所述第二导电膏电连接所述第二焊垫，且与所述第一连接器相对设置并电连接。
  7. 如权利要求6所述的板对板连接结构，其特征在于，所述第一线路板中还开设有第二通孔，所述第二外层导电线路层临近所述第二通孔的区域形成有第三焊垫，所述第三焊垫上形成有第三导电膏；
    所述板对板连接结构还包括：
    第三连接器，所述第三连接器容置于所述第二通孔中并通过所述第三导电膏电连接所述第三焊垫；
    第三线路板，所述第三线路板与所述第一线路板层叠设置，所述第三线路板包括第三基层以及形成于所述第三基层一侧的第四外层导电线路层，所述第四外层导电线路层包括第四焊垫，所述第四焊垫上形成有第四导电膏； 以及
    第四连接器，所述第四连接器通过所述第四导电膏电连接所述第四焊垫，且与所述第三连接器相对设置并电连接。
  8. 如权利要求7所述的板对板连接结构，其特征在于，所述第一线路板还包括位于所述第一外层导电线路层以及第二外层导电线路层之间的至少一内层导电线路层，所述内层导电线路层与所述第一外层导电线路层之间设置有第一胶粘层，所述内层导电线路层与所述第二外层导电线路层之间设置有第二胶粘层。
  9. 如权利要求8所述的板对板连接结构，其特征在于，所述板对板连接结构还包括：
    第一防焊层，所述第一防焊层形成于所述第一外层导电线路层上；以及
    第二防焊层，所述第二防焊层形成于所述第二外层导电线路层上；
    其中，所述第一外层导电线路层临近所述第一通孔的区域暴露于所述第一防焊层形成所述第一焊垫，所述第二外层导电线路层临近所述第二通孔的区域暴露于所述第二防焊层形成所述第三焊垫。
  10. 如权利要求7所述的板对板连接结构，其特征在于，所述第一连接器和所述第三连接器为连接器公座，所述第二连接器和所述第四连接器为连接器母座。
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