WO2021210478A1 - 金属被覆液晶ポリマーフィルム - Google Patents

金属被覆液晶ポリマーフィルム Download PDF

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Publication number
WO2021210478A1
WO2021210478A1 PCT/JP2021/014854 JP2021014854W WO2021210478A1 WO 2021210478 A1 WO2021210478 A1 WO 2021210478A1 JP 2021014854 W JP2021014854 W JP 2021014854W WO 2021210478 A1 WO2021210478 A1 WO 2021210478A1
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Prior art keywords
metal
metal layer
polymer film
liquid crystal
crystal polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/014854
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English (en)
French (fr)
Japanese (ja)
Inventor
紀久雄 有本
澤田　貴文
雄一 馬場
秀司 長野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Oike and Co Ltd
Original Assignee
Kuraray Co Ltd
Oike and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd, Oike and Co Ltd filed Critical Kuraray Co Ltd
Priority to CN202180028891.XA priority Critical patent/CN115461216B/zh
Priority to JP2022515334A priority patent/JP7378107B2/ja
Priority to EP21789225.6A priority patent/EP4137311A4/en
Priority to KR1020227036481A priority patent/KR102727739B1/ko
Publication of WO2021210478A1 publication Critical patent/WO2021210478A1/ja
Priority to US18/046,280 priority patent/US12089327B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/02—Liquid crystal materials characterised by optical, electrical or physical properties of the components, in general
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/0332—Structure of the conductor
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    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
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Definitions

  • a metal having a metal layer formed on the surface of a base material made of a polymer film (hereinafter, abbreviated as thermoplastic liquid crystal polymer film or liquid crystal polymer film) capable of forming an optically anisotropic molten layer.
  • the present invention relates to a coated liquid crystal polymer film and a metal-clad laminate including the coated liquid crystal polymer film in the laminated structure.
  • a flexible circuit board using a liquid crystal polymer film as an insulating base material can reduce transmission loss as compared with a conventional circuit board using polyimide or the like as an insulating base material.
  • Various metal-clad laminates with laminated metal layers have been developed.
  • Various types of metal-clad laminates, in which a metal foil such as a copper foil is pressure-bonded to a liquid crystal polymer film via an adhesive layer or directly, have been developed and are commercially available.
  • a method for manufacturing a metal-clad laminate As a method for manufacturing a metal-clad laminate, a method of forming a metal thin film on a resin film by dry plating is also being studied.
  • the base metal layer contains oxygen atoms.
  • a two-layer flexible substrate characterized by mainly containing 1 to 3.8 atomic% solid-dissolved nickel-chromium or nickel-chromium-molybdenum is described, and a vacuum deposition method and a sputtering method are described as a method for producing a base metal layer.
  • the base layer is formed by a dry plating method such as an ion plating method.
  • Patent Document 2 relates to a method for producing a composite film having a layer structure composed of a resin film / metal layer, and continuously performs a step of forming a metal layer by sputtering after performing a degassing step and a vacuum discharge treatment step on the resin film. The method of carrying out these steps in an inert gas stream having an oxygen concentration of 0.01% or less is described.
  • a circuit pattern is processed by etching the metal layer on the surface, but at that time, the film thickness of the metal foil is a constraint on the miniaturization of the circuit.
  • a process of printing using metal nanoparticles has also been studied, but the electrical resistance is larger than that of using a metal foil, and at high frequencies. The current situation is that it cannot withstand the use of.
  • Patent Document 1 describes that in the metallizing method by dry plating, the oxygen atom that dissolves in the base metal layer is controlled to 3.1 to 3.8 atom%, so that the adhesion of the copper conductor layer is high and the insulation reliability is high. It is described that a two-layer flexible circuit board having a property can be provided.
  • a liquid crystal polymer film is also mentioned as an option of the insulating layer, but in the embodiment, a polyimide film having a larger transmission loss than the liquid crystal polymer film is used, and a substrate and a copper layer are formed by sputtering. Reduction of transmission loss has not been studied.
  • Patent Document 2 describes all steps from the conventional method of performing glow discharge and sputtering in the presence of oxygen to degassing of a resin film, surface treatment by vacuum discharge, and formation of a metal layer by sputtering. It is stated that the peeling strength between the resin film and the metal layer is improved by performing the process under a vacuum in which the above is eliminated as much as possible. However, Patent Document 2 does not describe that the reaction between oxygen derived from the resin film itself and the metal layer is suppressed. Further, in the examples, a polyimide film is used as the resin film, and reduction of transmission loss has not been studied.
  • the present invention provides a metal-coated liquid crystal polymer film suitable for microcircuit processing and capable of reducing circuit transmission loss by thinning the conductor layer (metal layer) formed on the surface of the liquid crystal polymer film.
  • the purpose is.
  • the metal-coated liquid crystal polymer film of the present invention A polymer film body made of a polymer (thermoplastic liquid crystal polymer) capable of forming an optically anisotropic molten phase, A first metal layer (first metal layer) laminated on at least one side of the polymer film body, A second metal layer (second metal layer) laminated on the first metal layer is provided.
  • the average oxygen concentration of the first metal layer is 2.5 atomic% or less (preferably 2.0 atomic% or less). It is a metal-coated liquid crystal polymer film.
  • the peak value of oxygen concentration in the thickness direction of the first metal layer is preferably 4.5 atomic% or less (preferably 4.0 atomic% or less).
  • the first metal layer may contain one or more selected from the group consisting of chromium, tin, iron, copper, cobalt, zinc, molybdenum, and nickel.
  • the second metal layer may be one selected from the group consisting of copper, gold, silver, and aluminum, or an alloy containing any of copper, gold, silver, and aluminum.
  • the polymer film body may have a coefficient of linear expansion in the plane direction of 0 to 24 ppm / ° C.
  • the metal-clad laminate of the present invention includes the metal-coated liquid crystal polymer film in the laminated structure.
  • the metal-clad laminate may include the metal-coated liquid crystal polymer film and a third metal layer (third metal layer) further laminated on the second metal layer.
  • the method for producing the metal-coated liquid crystal polymer film may include a step of forming the first metal layer on at least one side (one side or both sides) of the polymer film body by sputtering.
  • the metal-coated liquid crystal polymer film of the present invention is the first laminated on at least one side of a film body (thermoplastic liquid crystal polymer film) made of a polymer (thermoplastic liquid crystal polymer) capable of forming an optically anisotropic molten layer.
  • the metal layer and the second metal layer laminated on the first metal layer are provided, and in the analysis of the oxygen concentration in the thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atoms. % Or less.
  • the peak value of the oxygen concentration in the thickness direction of the first metal layer is preferably 4.5 atomic% or less.
  • Such a metal-coated liquid crystal polymer film may be a metal-plated liquid crystal polymer film in which a first metal layer is formed by sputtering and a second metal layer is formed by dry plating or wet plating.
  • the metal-coated liquid crystal polymer film was formed by sputtering on a first metal layer (first sputtered film) formed on the surface of the thermoplastic liquid crystal polymer film and on the surface of the first metal layer. It may be provided with a second metal layer (second sputtered film).
  • Patent Document 1 exemplifies a metal-coated resin film in which a metal layer to be a base layer is formed on the surface of a resin film to be an insulating base material by a dry plating method, and a metal layer to be a conductor layer is laminated on the base layer.
  • the present inventors use a thermoplastic liquid crystal polymer film as a resin film and limit the oxygen concentration of the base layer to a predetermined value or less to process a circuit in a conductor layer. It was found that the transmission loss in the high frequency region of the above can be reduced.
  • the inventors need to suppress the contamination of oxygen derived from the resin film itself because it is not enough to use an oxygen-free atmosphere at the time of dry plating in order to suppress the oxygen concentration of the underlying layer. I found that there is.
  • the metal layer formed on the insulating base material is an ultrathin metal layer having a thickness on the order of submicrons.
  • etching fine circuit processing becomes possible. Therefore, it is possible to achieve both the two problems of miniaturization of the circuit pattern in the flexible circuit board and reduction of transmission loss.
  • a thermoplastic liquid crystal polymer film is used as an insulating base material. It is known that a flexible circuit board using a thermoplastic liquid crystal polymer film as an insulating base material can reduce transmission loss during circuit processing as compared with a flexible circuit board using polyimide as an insulating base material. If necessary, a single-sided metal-clad laminate in which a metal layer is formed on one side of a thermoplastic liquid crystal polymer film by a known method is used as a base material, and the following first metal layer is formed on the other side (film surface). You may.
  • the liquid crystal polymer film used in the present invention is formed from a polymer capable of forming an optically anisotropic molten phase.
  • the chemical composition of this polymer is not particularly limited as long as it is a liquid crystal polymer that can be melt-molded, but it is preferably made of, for example, a thermoplastic liquid crystal polymer.
  • the thermoplastic liquid crystal polymer include thermoplastic liquid crystal polyester and thermoplastic liquid crystal polyester amide having an amide bond introduced therein.
  • thermoplastic liquid crystal polymer may be a polymer in which an imide bond, a carbonate bond, an isocyanate-derived bond such as a carbodiimide bond or an isocyanurate bond is further introduced into an aromatic polyester or an aromatic polyester amide.
  • thermoplastic liquid crystal polymer used in the present invention include known thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polyesteramides derived from the compounds classified into (1) to (4) and their derivatives exemplified below. Can be mentioned. However, it goes without saying that there is an appropriate range in the combination of various raw material compounds in order to form a polymer capable of forming an optically anisotropic molten phase.
  • Aromatic or aliphatic diols (see Table 1 for typical examples)
  • Aromatic diamine, aromatic hydroxyamine or aromatic aminocarboxylic acid (see Table 4 for typical examples).
  • thermoplastic liquid crystal polymers obtained from these raw material compounds include copolymers having the structural units shown in Tables 5 and 6.
  • polymers containing p-hydroxybenzoic acid and / or 6-hydroxy-2-naphthoic acid as at least a repeating unit are preferable, and (i) p-hydroxybenzoic acid and 6-hydroxy-are particularly preferable.
  • a copolymer containing a repeating unit of the aromatic diol of the above and at least one aromatic dicarboxylic acid is preferable.
  • the p-hydroxybenzoic acid of the repeating unit (A) when the thermoplastic liquid crystal polymer contains at least a repeating unit of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, the p-hydroxybenzoic acid of the repeating unit (A).
  • At least one aromatic hydroxycarboxylic acid (C) selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid and 4,4'-.
  • aromatic diol (D) selected from the group consisting of dihydroxybiphenyl, hydroquinone, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether, and the group consisting of terephthalic acid, isophthalic acid and 2,6-naphthalenedicarboxylic acid.
  • the molar ratio of the repeating unit derived from 6-hydroxy-2-naphthoic acid in the aromatic hydroxycarboxylic acid (C) may be, for example, 85 mol% or more, preferably 90 mol% or more. It may be preferably 95 mol% or more.
  • the molar ratio of the repeating unit derived from 2,6-naphthalenedicarboxylic acid in the aromatic dicarboxylic acid (E) may be, for example, 85 mol% or more, preferably 90 mol% or more, and more preferably 95 mol%. It may be% or more.
  • optically anisotropic molten phase referred to in the present invention can be formed can be determined, for example, by placing the sample on a hot stage, heating the sample in a nitrogen atmosphere, and observing the transmitted light of the sample. ..
  • a preferred thermoplastic liquid crystal polymer has a melting point (hereinafter referred to as Tm 0 ), for example, in the range of 200 to 360 ° C, more preferably in the range of 240 to 350 ° C, and further preferably in the range of Tm 0. Is 260-330 ° C.
  • Tm 0 melting point
  • the melting point can be obtained by observing the thermal behavior of the thermoplastic liquid crystal polymer sample using a differential scanning calorimeter. That is, after heating the thermoplastic liquid crystal polymer sample at a rate of 10 ° C./min to completely melt it, the melt is cooled to 50 ° C. at a rate of 10 ° C./min and then raised again at a rate of 10 ° C./min. The position of the endothermic peak that appears after heating is determined as the melting point of the thermoplastic liquid crystal polymer sample.
  • thermoplastic liquid crystal polymer includes thermoplastic polymers such as polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylate, polyamide, polyphenylene sulfide, polyetheretherketone, and fluororesin, as long as the effects of the present invention are not impaired. , Various additives, fillers and the like may be added.
  • thermoplastic liquid crystal polymer film used in the production method of the present invention is obtained, for example, by extrusion-molding a melt-kneaded product of the thermoplastic liquid crystal polymer.
  • Any method is used as the extrusion molding method, but the well-known T-die method, inflation method and the like are industrially advantageous.
  • the inflation method stress is applied not only in the mechanical axis direction (hereinafter abbreviated as MD direction) of the thermoplastic liquid crystal polymer film but also in the direction orthogonal to this (hereinafter abbreviated as TD direction), and the MD direction and TD direction are applied. Since it can be uniformly stretched in the direction, a thermoplastic liquid crystal polymer film having controlled molecular orientation, dielectric properties, etc. in the MD direction and the TD direction can be obtained.
  • MD direction mechanical axis direction
  • TD direction direction orthogonal to this
  • the melt sheet extruded from the T-die may be stretched not only in the MD direction of the thermoplastic liquid crystal polymer film but also in both the MD direction and the TD direction at the same time to form a film.
  • the melt sheet extruded from the T die may be once stretched in the MD direction and then stretched in the TD direction to form a film.
  • a predetermined draw ratio corresponding to the stretching ratio in the MD direction
  • a blow ratio corresponding to the stretching ratio in the TD direction
  • the draw ratio of such extrusion molding may be, for example, about 1.0 to 10 as the draw ratio (or draw ratio) in the MD direction, preferably about 1.2 to 7, and more preferably 1. It may be about 3 to 7. Further, the stretching ratio (or blow ratio) in the TD direction may be, for example, about 1.5 to 20, preferably about 2 to 15, and more preferably about 2.5 to 14.
  • thermoplastic liquid crystal polymer film may be a known or conventional heat treatment to adjust the melting point and / or the coefficient of thermal expansion of the thermoplastic liquid crystal polymer film.
  • the heat treatment conditions can be appropriately set according to the purpose. For example, with respect to the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer, (Tm 0-10 ) ° C. or higher (for example, (Tm 0-10 ) to (Tm 0 +30)).
  • the melting point (Tm) of the thermoplastic liquid crystal polymer film may be raised by heating at about ° C., preferably (Tm 0 ) to (Tm 0 +20) ° C.) for several hours.
  • the melting point (Tm) of the thermoplastic liquid crystal polymer film may be, for example, 270 to 380 ° C., preferably 280 to 370 ° C.
  • the melting point (Tm) of the thermoplastic liquid crystal polymer film can be obtained by observing the thermal behavior of the thermoplastic liquid crystal polymer film sample using a differential scanning calorimeter. That is, the position of the endothermic peak that appears when the temperature of the thermoplastic liquid crystal polymer film sample is raised at a rate of 10 ° C./min can be determined as the melting point (Tm) of the thermoplastic liquid crystal polymer film.
  • thermoplastic liquid crystal polymer film may have a linear expansion coefficient adjusted to about 0 to 24 ppm / ° C. in the plane direction of the film. Circuit board manufacturers use a liquid crystal polymer film having a coefficient of linear expansion within this range as an insulating base material. The coefficient of linear expansion can be measured by, for example, the TMA method.
  • the thickness of the thermoplastic liquid crystal polymer film can be appropriately set according to the application. For example, considering that it is used as a material for an insulating layer of a multilayer circuit board, it may be 10 to 500 ⁇ m, preferably 15 to. It may be 250 ⁇ m, more preferably 25 to 180 ⁇ m.
  • the metal-coated liquid crystal polymer film of the present invention may be one in which the above-mentioned thermoplastic liquid crystal polymer film is used as a base material and the following first metal layer and second metal layer are formed on one side or both sides thereof.
  • a single-sided metal-clad laminate in which a metal layer is formed on one side of the thermoplastic liquid crystal polymer film by a known method is used as a base material, and the following first metal layer is formed on the other surface on which the thermoplastic liquid crystal polymer is exposed.
  • a second metal layer may be formed.
  • the single-sided metal-clad laminate used as the base material may be a surface of a thermoplastic liquid crystal polymer film thermocompression bonded with a metal foil directly or via an adhesive layer.
  • the first metal layer may contain one or more selected from the group consisting of chromium, tin, iron, copper, cobalt, zinc, molybdenum, and nickel. For example, it may be an alloy of two or more kinds of these metals, or an alloy to which another metal is added.
  • the first metal layer may contain unavoidable impurities, but oxygen needs to be controlled to a predetermined concentration or less.
  • the first metal layer can be formed by sputtering using the laminated metal as a target.
  • the gas used for sputtering is preferably oxygen-free argon gas.
  • the oxygen contained in the metal layer is considered to be derived from the liquid crystal polymer film to be sputtered.
  • contamination derived from the liquid crystal polymer film can be suppressed and the first metal layer can be used.
  • the oxygen concentration in the film can be suppressed within a predetermined value.
  • the output (current, voltage) during sputtering is not particularly limited, but is preferably 10 to 1000 kW, more preferably 50 to 800 kW, and even more preferably 100 to 700 kW, for example.
  • the energization interval (duty ratio) is also not particularly limited, but for example, 1.1 to 50% is preferable, 1.5 to 30% is more preferable, and 2.0 to 20% is further preferable.
  • the first metal layer preferably has an average oxygen concentration of 2.5 atomic% or less in the analysis of the oxygen concentration in the thickness direction using XPS (X-ray photoelectron spectroscopy analyzer).
  • XPS X-ray photoelectron spectroscopy analyzer
  • the average oxygen concentration is more preferably 2.0 atomic% or less.
  • the first metal layer preferably has a peak oxygen concentration of 4.5 atomic% or less in the thickness direction. Furthermore, the peak value of oxygen concentration is more preferably 4.0 atomic% or less.
  • the thickness of the first metal layer is not particularly limited, but is preferably 5 nm or more, and preferably 50 nm or less. If the thickness is too thin, the effect of improving the adhesion of the second metal layer cannot be obtained, and it becomes difficult to control the average oxygen concentration to be low. On the other hand, when a metal having a conductivity different from that of the second metal layer is used as the first metal layer, if the first metal layer is made too thick, it becomes difficult to suppress the transmission loss.
  • the thickness of the first metal layer is more preferably 30 nm or less, and further preferably 20 nm or less.
  • the second metal layer is laminated on the first metal layer.
  • the second metal layer may be one selected from the group consisting of copper, gold, silver, and aluminum, or may be made of an alloy containing any of copper, gold, silver, and aluminum.
  • the method for producing the second metal layer is not particularly limited, but it is preferable that the second metal layer is formed as a plating layer by plating.
  • the plating method may be dry plating such as sputtering, ion plating, vacuum vapor deposition, or CVD, or wet plating (electrolytic plating).
  • the second metal layer may be formed by sputtering in the same manner as the first metal layer.
  • the thickness of the second metal layer is not particularly limited, but is preferably 50 nm or more, 400 nm or less, and more preferably 300 nm or less, for example.
  • a metal-clad laminate formed by heat-bonding a metal foil (for example, rolled copper foil) to a base material such as a liquid crystal polymer film the thickness of the metal foil becomes a constraint, and a conductor layer having a thickness of a certain level or less is obtained.
  • the conductor layer can be formed with an arbitrary thickness. Even when circuit processing is performed by a known method such as chemical etching, fine circuit processing can be performed if the conductor layer is thin.
  • the metal-clad laminate of the present invention comprises the above-mentioned metal-coated liquid crystal polymer film, or the above-mentioned metal-coated liquid crystal polymer film.
  • a schematic cross-sectional view of a part of the structure of the metal-clad laminate 30 is shown in FIGS. 1A, 1B, and 1C. It should be noted that the figure is merely a schematic view for explaining the laminated structure, and the width of the figure and the thickness ratio of each part do not indicate the actual ratio.
  • the metal-coated liquid crystal polymer film 20 of the present invention can be used as a circuit board material by forming the second metal layer 2 to a desired thickness. Therefore, the metal-clad laminate 30 provided by the present invention may be composed of the thermoplastic liquid crystal polymer film 10, the first metal layer 1, and the second metal layer 2 (FIG. 1A).
  • the metal-clad laminate 30 may be a metal-clad laminate 30 in which a third metal layer 3 (hereinafter, a third metal layer) is further laminated on the second metal layer 2 (FIG. 1B).
  • the third metal layer may also be formed by either dry plating or wet plating.
  • the third metal layer 3 may be formed on the second metal layer 2 by electrolytic plating.
  • the third metal layer 3 may be one selected from copper, gold, silver, and aluminum as in the second metal layer 2, and is made of an alloy containing any one of copper, gold, silver, and aluminum. It may be.
  • the third metal layer 3 may be formed from the same metal as the second metal layer 2.
  • the metal-clad laminate 30 in which the conductor layer (second metal layer) 2 of the metal-coated liquid crystal polymer film 20 is thickened can be obtained.
  • the third metal layer 3 is formed only on the second metal layer 2 on one side.
  • a third metal layer 3 may be formed on each of the second metal layers 2 on both sides.
  • the thickness of the third metal layer is not particularly limited, but may be 1 to 20 ⁇ m, more preferably 1 to 5 ⁇ m.
  • a first metal layer 1, a second metal layer 2, and a third metal layer 3 are formed on one side of the thermoplastic liquid crystal polymer film, and if necessary, a third metal layer 3 is formed, and a metal foil 4 is thermocompression bonded on the other side.
  • a metal layer provided by a known method is also included in the metal-clad laminate 30 of the present invention (FIG. 1C).
  • the first metal layer 1, the second metal layer 2, and the other surface are made of a single-sided metal-clad laminate manufactured by a known method such as thermal pressure bonding of the metal foil 4 as a base material.
  • a third metal layer 3 may be provided if necessary, or a first metal layer 1, a second metal layer 2, and a third metal layer 3 may be provided on one side of the thermoplastic liquid crystal polymer film 10. After that, a metal layer may be provided on the other surface by a known method such as thermal pressure bonding of the metal foil 4.
  • Film can be provided.
  • a circuit is formed by a known method such as chemical etching, fine circuit processing is possible with a thin conductor layer. Therefore, by using the metal-coated liquid crystal polymer film of the present invention, transmission loss is reduced. It is possible to provide a flexible circuit board (excellent in high frequency characteristics) and also having a reduced size.
  • liquid crystal polymer film As a liquid crystal polymer film, "Vexter” (registered trademark) manufactured by Kuraray Co., Ltd. (melting point 310 ° C. by DSC, thickness 50 ⁇ m, linear expansion coefficient 15 ppm / ° C. by TMA method) is used as an insulating base material, and is a roll-to-roll type.
  • a sputtered film (first metal layer) with a film thickness of 15 nm is formed on the film by sputtering a NiCr target (Ni80 wt% Cr20 wt%) using oxygen-free high-purity argon gas, which is installed in a sputtering device and evacuated. Filmed.
  • the target was changed to Cu, and a Cu film (second metal layer) having a thickness of 120 nm was formed on the first metal layer.
  • the metal-coated liquid crystal polymer film thus obtained is subjected to (Ar) ions from the surface of the second metal layer to the surface of the base film by an X-ray photoelectron spectroscopy analyzer (XPS) (manufactured by ULVAC-PHI, Inc./PHI5000VersaProbe2).
  • XPS X-ray photoelectron spectroscopy analyzer
  • the analysis was performed in the depth direction while etching with, and the average oxygen concentration in the first metal layer and the maximum value (peak value) of the oxygen concentration were obtained.
  • the average oxygen concentration is defined as the region where the nickel alloy is present is defined as the nickel alloy layer, and the oxygen abundance ratio in the nickel alloy layer is averaged.
  • the Cu layer was thickened to 12 ⁇ m by electrolytic plating to form a metal-clad laminate, and a microstrip line with a width of 100 to 120 ⁇ m was processed by chemical etching.
  • Product name: 8722ES Product name: 8722ES
  • a probe manufactured by Cascade Microtech Co., Ltd., product name: ACP40-250
  • the losses were compared.
  • comparisons were carried out for each microstrip line width, and since the same tendency was shown in all cases, a numerical value with a microstrip line width of 110 ⁇ m was used as a representative.
  • Comparative Example 2 in which sputtering was constantly performed at a low output, the oxygen concentration of the first metal layer was out of the range of the present invention.
  • Comparative Example 1 since the maximum output was made too large, contamination from the liquid crystal polymer film occurred at the start of sputtering, the oxygen concentration of the first metal layer was not reduced, and the transmission loss was significant as compared with Comparative Example 2. There was no difference. On the other hand, in Examples 1 and 2, the effect of reducing transmission loss was confirmed.
  • the transmission loss of the flexible circuit board can be reduced, the line width can be miniaturized, and the utility as a high-frequency circuit board material is high.

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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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EP21789225.6A EP4137311A4 (en) 2020-04-17 2021-04-08 METAL COATED LIQUID CRYSTAL POLYMER FILM
KR1020227036481A KR102727739B1 (ko) 2020-04-17 2021-04-08 금속 피복 액정 폴리머 필름
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