WO2021200742A1 - Matériau de câblage et son procédé de production - Google Patents

Matériau de câblage et son procédé de production Download PDF

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Publication number
WO2021200742A1
WO2021200742A1 PCT/JP2021/013088 JP2021013088W WO2021200742A1 WO 2021200742 A1 WO2021200742 A1 WO 2021200742A1 JP 2021013088 W JP2021013088 W JP 2021013088W WO 2021200742 A1 WO2021200742 A1 WO 2021200742A1
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WIPO (PCT)
Prior art keywords
resin
polypropylene
mass
wiring material
component
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PCT/JP2021/013088
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English (en)
Japanese (ja)
Inventor
瞳 遠藤
西口　雅己
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古河電気工業株式会社
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Publication of WO2021200742A1 publication Critical patent/WO2021200742A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/14—Insulating conductors or cables by extrusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables

Definitions

  • the present invention relates to a wiring material having an insulator layer made of a resin composition containing a polypropylene resin and a method for producing the same.
  • Patent Document 1 discloses an electrically insulating composition obtained by blending a polyolefin resin such as polyethylene, a silicone compound, and an organic peroxide.
  • organic peroxide crosslinking a mixed material containing polyethylene and an organic peroxide is extruded and coated on the outer peripheral surface of a conductor or the like, and then polyethylene is subjected to a crosslinking reaction in a high-temperature and high-pressure crosslinking reaction tube. It takes a long time to set and stabilize the conditions of the cross-linking reaction, and maintenance of the cross-linking reaction tube is not easy, which is a factor that hinders the improvement of productivity. Further, depending on the type of organic peroxide used, a degassing step for removing by-products of the cross-linking reaction (for example, decomposition products of organic peroxide) is required, which increases the production cost.
  • a wiring material using a reactor blend type material as a material for an insulator layer does not require cross-linking of the material, so that a cross-linking step is not required for manufacturing the cross-linking material, which causes the above-mentioned problem when cross-linked polyethylene is used. It has the advantages of excellent productivity and manufacturing cost, and recyclability. Therefore, attention is being paid to wiring materials that use a reactor blend type material instead of cross-linked polyethylene.
  • Patent Document 2 a heat-resistant wiring material using a resin composition containing a reactor-blended polyolefin-based thermoplastic resin containing 51 to 85 mol% of crystalline polypropylene in a monomer unit and a random-type polypropylene resin as an insulator layer has been proposed.
  • Patent Document 2 a resin composition containing a reactor-blended polyolefin-based thermoplastic resin containing 51 to 85 mol% of crystalline polypropylene in a monomer unit and a random-type polypropylene resin as an insulator layer has been proposed.
  • the obtained wiring material is excellent in heat resistance but inferior in flexibility and in addition, inferior in molding stability (process of forming the insulator layer).
  • the insulator layer is deformed in the above, and the shape is not uniform).
  • an object of the present invention is to provide a method for producing the wiring material, which can be produced without the cross-linking step required for the method using polyethylene.
  • the present inventors have conducted a reactor blend of a polypropylene component (b1) composed of polypropylene resin, homopolypropylene or random polypropylene and an ethylene- ⁇ -olefin copolymer rubber component (b2) as resin components.
  • a polypropylene component (b1) composed of polypropylene resin, homopolypropylene or random polypropylene
  • an ethylene- ⁇ -olefin copolymer rubber component (b2) as resin components.
  • an insulator layer made of a resin composition containing a specific amount of a type polyolefin thermoplastic resin (B) and a polypropylene resin and substantially no filler
  • heat resistance, flexibility and withstand voltage characteristics are adopted. It is possible to obtain a wiring material having excellent molding stability and excellent molding stability, and this wiring material is excellent in manufacturing cost, is recyclable, and can be manufactured by omitting the conventional bridging step. , Found that it can be manufactured with high productivity.
  • the present inventors have made repeated studies based
  • the resin composition is contained in 100% by mass of the resin component.
  • the polypropylene component (b1) is made of homopolypropylene or random polypropylene.
  • a wiring material in which the resin composition does not substantially contain a filler.
  • the reactor-blended polyolefin-based thermoplastic resin (B) is (i) a reactor-blended polyolefin-based thermoplastic resin (B-1) in which the polypropylene component (b1) is homopolypropylene, or (ii). Described in [1], which is a mixture of the reactor-blended polyolefin-based thermoplastic resin (B-1) and the reactor-blended-type polyolefin-based thermoplastic resin (B-2) in which the polypropylene component (b1) is random polypropylene. Wiring material.
  • the reactor-blended polyolefin-based thermoplastic resin (B) is a mixture of the reactor-blended-type polyolefin-based thermoplastic resin (B-1) and the reactor-blended-type polyolefin-based thermoplastic resin (B-2).
  • the resin composition contains 10 to 35% by mass of the polypropylene resin (A), 55 to 80% by mass of the reactor blend type polyolefin-based thermoplastic resin (B), and the polyethylene resin (B) in 100% by mass of the resin component.
  • the polypropylene component (b1) is made of homopolypropylene or random polypropylene. How to manufacture wiring materials.
  • the resin composition is prepared by dry-blending the polypropylene resin (A), the reactor-blended polyolefin-based thermoplastic resin (B), and the polyethylene resin (C), and then melt-mixing the resin composition, according to [7]. How to manufacture wiring materials.
  • the numerical range represented by using “-” means a range including the numerical values before and after "-" as the lower limit value and the upper limit value.
  • the wiring material of the present invention is excellent in heat resistance, flexibility, withstand voltage characteristics, and excellent molding stability.
  • the wiring material can be produced without the cross-linking step required for the production method using cross-linked polyethylene.
  • FIG. 1 is an end view showing an example of the structure of a high-voltage cable, which is one aspect of the wiring material of the present invention.
  • the wiring material of the present invention has an insulator layer formed of the resin composition on the outer peripheral surface of the conductor, and the resin composition contains 10 to 50% by mass of polypropylene resin (A) in 100% by mass of the resin component.
  • Reactor blend type polyolefin-based thermoplastic resin (B) 30 to 85% by mass and polyethylene resin (C) 5 to 25% by mass of polypropylene component (b1) and ethylene- ⁇ -olefin copolymer rubber component (b2) It is contained and the polypropylene component (b1) is composed of homopolypropylene or random polypropylene.
  • the resin composition is substantially free of filler.
  • the wiring material provided with this insulator layer is excellent in heat resistance, flexibility, and withstand voltage characteristics, and is excellent in molding stability in the manufacturing process.
  • Examples of the wiring material include insulated wires, cables, cords, optical fiber core wires or optical fiber cords used for internal wiring or external wiring of electrical / electronic equipment, and insulated wires or cables are preferable. Among them, a high voltage cable is preferable.
  • the wiring material may have at least one insulator layer formed of the resin composition on the outer peripheral surface of the conductor, and the other configurations may be the same as the normal configuration of the wiring material.
  • the wiring material of the present invention is preferably an insulated wire.
  • the insulated wire can be an insulated wire having at least one insulator layer on the outer peripheral surface of the conductor, and at least one of the insulator layers is an insulator layer made of the above resin composition.
  • "consisting of a resin composition” means that the insulator layer is formed of the resin composition.
  • the conductor to be used a normal one can be used, and it may be a single wire or a stranded wire (including a aligned wire in which a plurality of conductors are bundled without being twisted), and a bare wire or a tin-plated or enamel-coated one. It may be.
  • the metal material forming the conductor include copper, copper alloy, aluminum and the like.
  • the insulator layer made of the resin composition may be provided directly on the outer peripheral surface of the conductor, or may be indirectly provided via another member or layer.
  • the thickness of the insulator layer made of the above resin composition is the same as that of a normal wiring material.
  • the wall thickness of the insulator layer is not particularly limited, but is usually about 0.1 to 10 mm.
  • the cable as a wiring material of the present invention may have at least an insulator layer formed of the above resin composition as its insulator layer, and other configurations are the same as those of a normal cable. be able to.
  • the insulator layer may be provided directly on the outer peripheral surface of the conductor, or may be provided indirectly via another member or layer.
  • the cable is a cable in which an insulator layer is formed on the outer peripheral surface of a conductor or a bundle of a plurality of bundles thereof (including a stranded wire bundle and a aligned wire bundle), and the insulator layer is formed of the above resin composition. It can be a cable.
  • the cable is a cable having an internal semiconductor layer, an insulator layer, and an outer semiconductor layer on the outer peripheral surface of a conductor or a bundle obtained by bundling a plurality of the conductors, and the insulator layer is formed of the above resin composition.
  • It can be a cable.
  • the cable may have an insulator layer formed on the outer peripheral surface of an electric wire or a bundle obtained by bundling a plurality of the electric wires, and the insulator layer may be a cable formed of the above resin composition.
  • the electric wire used at this time may have an insulator layer formed of the above resin composition.
  • the term "conductor" means that a bundle of a plurality of conductors is included unless otherwise specified.
  • the high-voltage cable preferably has an inner semi-conductive layer, an insulator layer formed of the above resin composition, and an outer semi-conductive layer on the outer peripheral surface of the conductor.
  • the insulator layer refers to a coating layer exhibiting insulation (10 12 to 10 17 ⁇ cm in volume resistivity measurement (JISC2139)), and the semiconductor layer is semi-conductive (volume resistivity measurement (JISK7194)). in say a coating layer showing a 10 0 ⁇ 10 2 ⁇ cm).
  • those described above can be used.
  • those usually used can be used, and for example, cross-linked polyethylene, polyolefin elastomer, ethylene-based copolymer (including ethylene-octene-based copolymer), polyolefin rubber and the like are preferable.
  • the material of the outer semi-conductive layer those usually used can be used, and for example, cross-linked polyethylene, polyolefin elastomer, ethylene-based copolymer (including ethylene-vinyl acetate copolymer), polyolefin rubber and the like are preferable.
  • the wall thickness of the insulator layer is not particularly limited, but is usually about 0.2 to 20 mm.
  • the wall thickness of the insulator layer is not particularly limited, but is usually about 0.8 to 20 mm.
  • a preferred embodiment of the high-voltage cable, the end face of which is shown in FIG. 1, is a three-layer cable, which is a single conductor 1, an internal semi-conductive layer 2 covering the outer peripheral surface of the conductor 1, and an internal semi-conductive.
  • the cable 101 has an insulator layer 3 that covers the outer peripheral surface of the layer 2 and an outer semi-conductive layer 4 that covers the outer peripheral surface of the insulator layer 3.
  • the insulator layer 3 is formed of the above resin composition.
  • the conductor 1, the inner semi-conductive layer 2 and the outer semi-conductive layer 4 are made of the above materials.
  • the cable 101 is provided with the internal semi-conductive layer 2 directly on the outer peripheral surface of the conductor 1, and the internal semi-conductive layer 2, the insulator layer 3 and the outer semi-conductive layer 4 are in contact with each other in this order.
  • another member or another layer may be provided between the conductor and the internal semi-conductive layer 2, and further between each layer.
  • the wiring material of the present invention is excellent in molding stability in the manufacturing process.
  • the molding stability in the manufacturing process means the shape of the resin composition molded in the molten state until the resin composition molded in the molten state solidifies into the insulator layer in the process of forming the insulator layer.
  • the property (dimensions) that is not easily deformed and that the shape of the resin composition molded in the molten state can be maintained even after solidification (identity between the shape of the resin composition immediately after molding and the shape of the insulator layer).
  • This molding stability is achieved by exhibiting the property that the resin composition can maintain the shape immediately after molding, and means that an insulator layer that maintains the shape immediately after molding can be formed.
  • the insulator layer is usually formed through a process of covering an outer peripheral surface of a conductor or the like with a melt-mixed resin composition and then cooling.
  • the cross-sectional shape of the insulator layer may change from the shape immediately after coating (for example, circular to elliptical) in the time until the insulator layer cools.
  • the wiring material of the present invention can suppress deformation of such a resin composition to form an insulator layer. Therefore, the wiring material of the present invention is an insulator that maintains a predetermined molding shape immediately after molding without undergoing a step of adjusting the outer shape of the resin composition solidified on the outer peripheral surface of a conductor or the like (for example, polishing).
  • the molding stability of the wiring material of the present invention (maintaining the shape immediately after molding) can be evaluated by the method described in Examples described later.
  • the wiring material of the present invention is excellent in flexibility and heat resistance. These properties can be evaluated by the methods described in the examples.
  • the resin composition is a reactor blend type polyolefin-based heat of a polypropylene resin (A) as a resin component, a polypropylene component (b1) composed of homopolypropylene or random polypropylene, and an ethylene- ⁇ -olefin copolymer rubber component (b2). It contains a plastic resin (B) and a polypropylene resin (C).
  • the resin composition is usually a homogeneous mixture of each resin component, but the mixing uniformity does not matter as long as the effects of the present invention are not impaired. When each resin component contains a plurality of constituent components, these constituent components may be present in the resin composition, and the state of existence thereof does not matter.
  • the resin component is contained as an uncrosslinked resin.
  • This resin composition is substantially free of fillers. Since the resin composition does not substantially contain a filler, it has excellent withstand voltage resistance.
  • the filler usually refers to a filler used in the field of wiring materials, and includes a flame retardant. In the present invention, it is preferable that the filler does not substantially contain a flame retardant. In the present invention, substantially not containing or blending the filler means that the filler is allowed to be contained or blended in the amount of 0.05 parts by mass with respect to 100 parts by mass of the resin composition.
  • the polypropylene resin (A) imparts heat resistance to the resin composition.
  • the polypropylene resin (A) may be a resin whose main component is a propylene component, and corresponds to a homopolymer of propylene, random polypropylene, and block polypropylene (reactor blend type polyolefin-based thermoplastic resin (B) described later). Includes (excluding those that do).
  • block polypropylene refers to a composition (mixture) in which a rubber component is dispersed in polypropylene (homopolypropylene (h-PP) or r-PP).
  • Block polypropylene contains 1 to 20% by mass of a rubber component.
  • the amount of the rubber component is preferably 5 to 20% by mass.
  • examples of the rubber component include polymers such as ethylene, octene, butene, and hexene.
  • the content of the rubber component in the block polypropylene can be measured by Fourier transform infrared spectroscopy (FT-IR) or the like.
  • the polypropylene resin (A) preferably has a tensile elastic modulus of 600 to 2400 MPa, more preferably 800 to 1800 MPa, as measured by the method described in JIS K7161-1.
  • the polypropylene resin (A) preferably has a melting point of 125 to 165 ° C, more preferably 140 to 160 ° C.
  • As the polypropylene resin (A) one type may be used alone or two or more types may be used.
  • the polypropylene resin (A) is preferably block polypropylene or random polypropylene from the viewpoint of emphasizing molding stability among heat resistance, flexibility, and molding stability.
  • reactor blend type resin (B) (Reactor blend type resin (B))- Since the reactor blend type resin (B) has high compatibility with the polypropylene resin (A), a uniform resin composition can be obtained. As a result, when used in a specific amount, shape stability and flexibility can be imparted without significantly impairing the inherent properties such as heat resistance of the polypropylene resin (A).
  • the reactor blend type resin (B) used in the present invention is not particularly limited as long as it is usually used, but in general, at least ethylene and ⁇ -olefin are copolymerized in the presence of the polypropylene component (b1).
  • the composition obtained by subjecting the mixture to the above can be said to be a composition (mixture) in which an ethylene- ⁇ -olefin copolymer rubber component (b2) is dispersed in a polypropylene component (b1).
  • the polypropylene component (b1) and the ethylene- ⁇ -olefin copolymer rubber component (b2) are preferably dispersed in a state in which they cannot be mechanically separated.
  • the reactor blend type resin (B) usually contains 40 to 80% by mass of the ethylene- ⁇ -olefin copolymer rubber component (b2).
  • the content of the ethylene- ⁇ -olefin copolymer rubber component (b2) is preferably 50 to 65% by mass, more preferably 55 to 65% by mass in the reactor blend type resin (B).
  • the content of the ethylene- ⁇ -olefin copolymer rubber component (b2) in the reactor blend type resin (B) can be measured by Fourier transform infrared spectroscopy (FT-IR) or the like.
  • the polypropylene component (b1) is composed of homopolypropylene (h-PP) or random polypropylene (r-PP).
  • being composed of homopolypropylene (h-PP) or random polypropylene (r-PP) means that the entire polypropylene component (b1) is homopolypropylene (h-PP) or random polypropylene (r-PP). It includes aspects that include h-PP or r-PP as part of the polypropylene component (b1).
  • the reactor blend type resin (B) has a form in which the polypropylene component (b1) is a homopolypropylene resin (reactor blend type resin (B-1)) and a polypropylene component (b1). It can be classified into a form of random polypropylene (reactor blend type resin (B-2)).
  • the reactor blend type resin (B) may be a reactor blend type resin (B-1) or a reactor blend type resin (B-2), and the reactor blend type resin (B-1) and the reactor blend type resin (B-2). It may be a mixture with.
  • Examples of the ethylene- ⁇ -olefin copolymer rubber component (b2) include a binary copolymer rubber of ethylene and ⁇ -olefin, and a ternary copolymer rubber of ethylene, ⁇ -olefin and diene.
  • a binary copolymer rubber of ethylene and ⁇ -olefin and a ternary copolymer rubber of ethylene, ⁇ -olefin and diene.
  • the ⁇ -olefin component each ⁇ -olefin component having 3 to 12 carbon atoms is preferable.
  • the diene component of the ternary copolymer rubber may be a conjugated diene component or a non-conjugated diene component, but a non-conjugated diene component is preferable.
  • conjugated diene component examples include butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene and the like, and butadiene component and the like are preferable.
  • specific examples of the non-conjugated diene component include each component such as dicyclopentadiene (DCPD), ethylidene norbornene (ENB), and 1,4-hexadiene.
  • Ethylene-propylene rubber (EPM) is preferable as the binary copolymer rubber
  • EPDM ethylene-propylene-diene rubber
  • the reactor blend type resin (B) preferably has a tensile elastic modulus of 50 to 500 MPa, more preferably 100 to 450 MPa, as measured by the method described in JIS K7161-1.
  • the reactor blend type resin (B) preferably has a melting point of 125 to 165 ° C, more preferably 140 to 160 ° C.
  • the polyethylene resin (C) can suppress deformation after molding.
  • the polyethylene resin (C) has high compatibility with the polypropylene resin (A)
  • a uniform resin composition can be obtained.
  • molding stability can be imparted without significantly impairing the inherent properties such as heat resistance of the polypropylene resin (A).
  • the polyethylene resin (C) may be a resin whose main component is an ethylene component, and is a homopolymer composed only of ethylene, a copolymer of ethylene and an ⁇ -olefin (excluding propylene) of 5 mol% or less, and Polymers of ethylene and up to 1 mol% non-olefin having only carbon, oxygen and hydrogen atoms as functional groups are included (eg, JIS K 6748).
  • ⁇ -olefin and non-olefin known ones conventionally used as a copolymerization component of polyethylene are used without particular limitation.
  • PE polyethylene
  • HDPE high-density polyethylene
  • LDPE low-density polyethylene
  • UHMW-PE ultra-high molecular weight polyethylene
  • LLDPE linear low-density polyethylene
  • VLDPE ultra-low-density polyethylene
  • HDPE high-density polyethylene
  • PE is preferable from the viewpoint of maintaining heat resistance.
  • One type of polyethylene (PE) may be used alone, or two or more types may be used in combination.
  • the resin composition can contain various additives and the like that are generally used in the resin composition used for the wiring material as long as the object of the present invention is not impaired.
  • additives and the like that are generally used in the resin composition used for the wiring material as long as the object of the present invention is not impaired.
  • antioxidants, carbon black and the like can be mentioned.
  • the resin composition contains 10 to 50% by mass of polypropylene resin (A), 30 to 85% by mass of reactor blend type resin (B), and 5 to 25% by mass of polyethylene resin (C) in a total of 100% by mass of resin components. Contains.
  • the total amount of the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) is 100% by mass. From the viewpoint of further improving the flexibility and withstand voltage characteristics, the content of the polypropylene resin (A) is preferably 10 to 35% by mass in the total 100% by mass of the resin components.
  • the content of the reactor blend type resin (B) is preferably 55 to 80% by mass in the total 100% by mass of the resin components.
  • the content of the polyethylene resin (C) is preferably 5 to 20% by mass based on 100% by mass of the total resin components.
  • the resin composition contains 10 to 35% by mass of polypropylene resin (A), 55 to 80% by mass of reactor blend type resin (B), and 5 to 25% by mass of polyethylene resin (C) in a total of 100% by mass of resin components. (Preferably, 5 to 20% by mass) is contained.
  • the reactor blend type resin (B-1) is more preferably 50% by mass or more in the resin component. From the viewpoint of increasing flexibility, it is preferable to contain the reactor blend type resin (B-2) as the reactor blend type resin (B).
  • the reactor blend type resin (B-2) is more preferably 20% by mass or more in the resin component. From the viewpoint of heat resistance, the reactor blend type resin (B-1) is used as the reactor blend type resin (B), or the reactor blend type resin (B-1) and the reactor blend type resin (B-2) are used. It is preferable to use a mixture with the above, and it is more preferable that the mixture contains the reactor blend type resin (B-1) in an amount of 40% by mass or more in the resin component.
  • the resin composition can be produced by melting and mixing the above resin components.
  • the conditions for melt-mixing will be described later in a method for manufacturing a wiring material.
  • the wiring material can be produced by a usual method for producing a wiring material, except that the resin composition is used for forming the insulator layer. Specifically, a method of forming an insulator layer by covering the outer peripheral surface of the conductor with the above resin composition to obtain a wiring material can be mentioned. A more specific description of the method for manufacturing the wiring material is as follows. A method for manufacturing a wiring material having an insulator layer formed of a resin composition on the outer peripheral surface of a conductor. Polypropylene resin (A) 10 to 50% by mass, reactor blend type resin (B) 30 to 85% by mass of polypropylene component (b1) and ethylene- ⁇ -olefin copolymer component (b2), and polyethylene resin (C).
  • the polypropylene component (b1) is composed of homopolypropylene or random polypropylene. How to manufacture wiring materials.
  • mixing means obtaining a uniform mixture.
  • melting and mixing in the absence of a filler means melting and mixing without substantially blending the filler.
  • the conditions for melting and mixing may be the temperature and conditions at which each resin component melts. It is preferable to melt and mix at a temperature of 210 to 240 ° C.
  • the mixing method is not particularly limited as long as it is a method usually used for rubber, plastic and the like.
  • a single-screw extruder, a twin-screw extruder, a roll, a Banbury mixer, various kneaders, or the like can be used.
  • the above mixing can be carried out continuously with the coating described later, or can be carried out separately after a time before the coating.
  • At least a part or all of the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) may or may not be dry-blended in advance. It is preferable to dry-blend the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C). That is, it is preferable to prepare the resin composition by dry-blending the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C), and then melting and mixing them.
  • the dry blending may be performed at a temperature at which each resin component does not melt, may be performed using a mixer, or may be performed by mixing in a molding machine such as an extruder. Mixing in the mixer may be performed by the mixer attached to the extruder, or may be performed by a mixer different from the extruder.
  • the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) is preliminarily applied without or after the dry blending. It may or may not be granulated.
  • granulation is a means adopted to improve the dispersibility of a resin component that is difficult to mix, and refers to a step of adding an additive or the like to the resin component as necessary and melting and mixing it in advance to pelletize it. ..
  • each resin component can be uniformly mixed without performing granulation. From the viewpoint of making a wiring material having excellent withstand voltage characteristics, it is preferable not to perform granulation.
  • a granulator is provided with a container for melting and mixing resin components and the like, blades rotating in the container, a cutter for cutting the obtained melt mixture into pellets of a predetermined size, and the like.
  • a container for melting and mixing resin components and the like blades rotating in the container
  • a cutter for cutting the obtained melt mixture into pellets of a predetermined size and the like.
  • metal parts in the granulator may come into contact with each other to form metal pieces, and metal foreign matter may be mixed into the resin composition.
  • By omitting granulation it is possible to reduce the number of situations where metallic foreign matter can be mixed.
  • the coating can be performed separately after the melt mixing or after the melt mixing.
  • the method of covering the outer peripheral surface of the conductor may be any method as long as the outer peripheral surface of the conductor can be covered with the resin composition, and an appropriate molding method is applied.
  • examples of the molding method include extrusion molding using an extruder, injection molding using an injection molding machine, and molding using another molding machine.
  • extrusion molding in which the conductor and the resin composition are coextruded is preferable.
  • Extrusion molding can be performed using a general-purpose extrusion molding machine.
  • the extrusion molding temperature is appropriately set according to various conditions such as the type of resin and the extrusion speed (take-up speed), and is preferably set to, for example, 200 to 220 ° C. From the viewpoint of continuous production of the wiring material over a long length, extrusion molding is preferable.
  • the wiring material of the present invention is excellent in heat resistance, flexibility, and withstand voltage characteristics. Therefore, it can be used as a wiring material for power transmission lines, communication lines, electronic devices, and automobiles. For example, it can be used as a high-voltage cable for indoor wiring cables.
  • the wiring material of the present invention is excellent in heat resistance, flexibility, and withstand voltage characteristics, and is excellent in molding stability in the manufacturing process.
  • the reason is not clear yet, but it can be considered as follows.
  • the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) in a specific amount, the polypropylene resin (A) and the reactor blend type resin (B) act in a complementary manner. Therefore, heat resistance and flexibility can be obtained in a well-balanced manner.
  • the reactor blend type resin (B) imparts rubber elasticity, and the polyethylene resin (C) acts as a core of crystallization to increase the crystallization rate, so that the insulator layer after molding is used.
  • Block polypropylene 1 "VB170A” (trade name), manufactured by SunAllomer Ltd., rubber component amount 20% by mass, tensile elastic modulus 1100 MPa, melting point 155 ° C.
  • Homopolypropylene 1 "VA200A” (trade name, manufactured by SunAllomer Ltd.)
  • Random polypropylene 1 “PB222A” (trade name), manufactured by SunAllomer Ltd.
  • Reactor blend type resin (B)> Reactor blend type resin 1: "Adflex Q200F” (trade name), manufactured by Lyondell Basell, block copolymer of polypropylene and ethylene- ⁇ -olefin copolymer rubber (polypropylene component is homopolypropylene), tensile elasticity 200 MPa, melting point 155 °C Reactor blend type resin 2: "Adflex Q100F” (trade name), manufactured by Lyondell Basell, block copolymer of polypropylene and ethylene- ⁇ -olefin copolymer rubber (polypropylene component is random polypropylene), tensile elasticity 100 MPa, melting point 145 °C ⁇ Polyethylene resin (C)> Polyethylene resin 1: "HIZEX 5100E” (trade name), manufactured by Prime Polymer Co., Ltd., HDPE
  • Polyethylene resin for cross-linking 1 "NUC9060” (trade name), manufactured by NUC, LDPE Organic Peroxide 1: Park Mill D (trade name), manufactured by NOF Corporation, Dikmyl Peroxide Flame Retardant 1: "SAYTEX 8010” (trade name), manufactured by Japan Albemarle, ethylene bis (pentabromophenyl)
  • the following insulated wires and 3-layer cables were prepared as wiring materials having an insulator layer formed of the resin composition, and the characteristics of each were evaluated.
  • Examples 1 to 10 The polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) shown in Table 1 were dry-blended in advance in a separate container at the mass ratio shown in Table 1 to obtain a dry blend product.
  • This dry blend is put into an extruder (screw diameter: 25 mm), and the screw rotation is 30 to 40 rpm, the extrusion temperature is 220 ° C., and the single core conductor is placed on the outer peripheral surface of a single core conductor having a diameter of 0.8 mm made of bare annealed copper wire.
  • An insulated wire having an insulator layer was obtained by extruding and coating the ring with an annular cross section having a thickness of about 1 mm through a die having an opening having an opening similar to the outer shape of the above.
  • the resin composition is prepared by melting and mixing in the extruder (hereinafter, the same applies).
  • a multi-core conductor (twisted) having a cross-sectional area of 14 mm 2 composed of seven annealed copper wires plated with an inner semi-conductive layer, an insulator layer, and an outer semi-conductive layer, respectively.
  • a three-layer cable was obtained by extruding and coating it on the outer peripheral surface of the wire) and then cooling it with water.
  • the following composition for an internal semi-conductive layer is made into a thickness of about 0.4 mm at an extrusion temperature of 230 ° C. with a screw rotation of 12 rpm on the outer peripheral surface of a multi-core conductor by an extruder (screw diameter 65 mm).
  • the dry blend is extruded and coated on the internal semiconductor layer obtained above with an extruder (screw diameter 150 mm) to a thickness of about 4 mm at a screw rotation of 7 rpm and an extrusion temperature of 235 ° C., and then water-cooled for insulation. Formed a body layer.
  • the composition for the external semi-conductive layer is extruded and coated on the insulator layer obtained above with an extruder (screw diameter 90 mm) to a thickness of about 0.5 mm at a screw rotation of 6 rpm and an extrusion temperature of 240 ° C. Then, it was cooled with water to form an external semiconductor layer.
  • compositions were used for the internal semi-conductive layer.
  • “Plascon 100B” (trade name), manufactured by Plastrade, main component; ethylene-octene copolymer
  • the composition for the external semi-conductive layer used was as follows.
  • “Plascon 100S” (trade name), manufactured by Plastrade, main component; ethylene-vinyl acetate copolymer
  • Example 11 and 12 Insulation was carried out in the same manner as in Example 1 except that instead of the dry blended product in Example 1, a granulated product having a resin component granulated as follows was introduced into an extruder to form an insulator layer. An electric wire and a three-layer cable were obtained.
  • the resin components shown in Table 1 are put into a Banbury mixer at the mass ratio shown in Table 1, melt-mixed for 3 minutes under mixed conditions at a tank temperature of 210 ° C., and then about 5 mm square using a pelletizer. The granulated product was obtained by granulating to the size of.
  • Comparative Example 1 The polyethylene resin 1 for cross-linking and the organic peroxide 1 are extruded and coated on the single-core conductor at the mass ratio shown in Table 1 using the extruder at a screw rotation of 30 to 40 rpm and an extrusion temperature of 150 ° C. A body was formed, and this uncrosslinked coating was introduced into a crosslinked reaction tube (temperature: 200 ° C., time: 10 minutes) and crosslinked to obtain an insulated wire of Comparative Example 1. A crosslinked polyethylene resin 1 and an organic peroxide 1 are extruded and coated on the internal semiconductor layer at a screw rotation of 10 rpm and an extrusion temperature of 140 ° C. using the extruder at the mass ratio shown in Table 1 to obtain an uncrosslinked coating.
  • Comparative Example 1 was formed in the same manner as in Example 1 except that the uncrosslinked coating was introduced into a crosslinked reaction tube (temperature: 200 ° C., time: 10 minutes) and crosslinked to form an insulator layer. Obtained a 3-layer cable.
  • Comparative Example 2 An insulated wire and a three-layer cable of Comparative Example 2 were obtained in the same manner as in Example 1 except that the insulator layer was formed using the polypropylene resin (A) shown in Table 1.
  • Comparative Example 3 An insulated wire and a three-layer cable of Comparative Example 3 were obtained in the same manner as in Example 1 except that the insulator layer was formed using the reactor blend type resin (B) shown in Table 1.
  • Comparative Examples 4 to 8 The same as in Example 1 except that the polypropylene resin (A), the reactor blend type resin (B), and the polyethylene resin (C) shown in Table 1 were used in the mass ratios shown in Table 1 to form an insulator layer. Insulated electric wires and three-layer cables of Comparative Examples 4 to 8 were obtained.
  • Comparative Example 9 Insulated electric wires of Comparative Example 9 in the same manner as in Example 1 except that the insulator layer was formed by using the reactor blend type resin (B) and the polyethylene resin (C) shown in Table 1 at the mass ratios shown in Table 1. And a three-layer cable was obtained.
  • Comparative Example 10 In the same manner as in Example 1 except that the polypropylene resin (A) and the polyethylene resin (C) shown in Table 1 were used in the mass ratios shown in Table 1 to form an insulator layer, the insulated wires and 3 of Comparative Example 10 Obtained a layered cable.
  • Comparative Example 11 Comparative Example 11 in the same manner as in Example 1 except that the polypropylene resin (A), the reactor blend type resin (B), and the flame retardant shown in Table 1 were used in the mass ratios shown in Table 1 to form an insulator layer. Insulated wire and 3-layer cable were obtained.
  • Comparative Example 12 Same as in Example 1 except that the polypropylene resin (A), the reactor blend type resin (B), the polyethylene resin (C), and the flame retardant shown in Table 1 were used in the mass ratio shown in Table 1 to form an insulator layer. The insulated electric wire and the three-layer cable of Comparative Example 12 were obtained.
  • -Molding stability test The molding stability was evaluated based on the degree of deformation of the cross-sectional shape of the insulated wire.
  • the insulated wire obtained above was cut perpendicular to the longitudinal direction, and the cross section of the insulated wire was observed with a microscope. In the above cross section, the distance between the line segment passing through the center of the conductor and the two intersections of the insulator layer with the outer periphery on the opposite side of the conductor is measured, and the maximum value (d1) and the minimum value (d2) are measured. Asked.
  • Heat resistance test- The heat resistance was evaluated using the heat deformation rate as an index. Using the insulated wire obtained above, the heat deformation rate (decrease rate) was determined according to the method described in JIS C3005. The test temperature was 150 ° C., a weight was installed so that a force of 5N was applied, and the heating time was 30 minutes. The reduction rate was determined from the thickness of the insulator layer after heating and the thickness before heating. A heat deformation rate of 40% or less is a passing level of this test.
  • the withstand voltage test was a commercial frequency withstand voltage test. An AC voltage of 17 kV was applied to the 3-layer cable for 10 minutes, and the presence or absence of dielectric breakdown was confirmed. After that, if there was no dielectric breakdown, the voltage was boosted by 10 kV and applied for another 30 minutes, and the operation of confirming the presence or absence of dielectric breakdown was repeated. The AC voltage applied when dielectric breakdown occurs is defined as the dielectric breakdown voltage. A breakdown voltage of 77 kV or higher is the passing level of this test.
  • the insulated wire or three-layer cable of Comparative Example 1 having an insulator layer made of cross-linked polyethylene on the outer peripheral surface of the conductor required a cross-linking step as a manufacturing process.
  • the insulated wires or three-layer cables of Comparative Examples 2 to 12 which have an insulating layer formed of a resin composition that does not satisfy the composition specified in the present invention on the outer peripheral surface of the conductor, are subjected to heat resistance test, flexibility test, and so on. Either the withstand voltage characteristic test or the molding stability test failed, and it was inferior in any of heat resistance, flexibility, withstand voltage characteristics, and molding stability.
  • an insulated wire or a three-layer cable having an insulating layer formed of a resin composition satisfying the composition specified in the present invention on the outer peripheral surface of a conductor has a heat resistance test, a flexibility test, and a withstand voltage characteristic. It has passed both the test and the molding stability test, and is excellent in heat resistance, flexibility, withstand voltage characteristics, and molding stability.
  • the wiring material of the present invention exhibits high heat resistance, exhibits the withstand voltage characteristics required for a high-voltage cable, and is also excellent in flexibility.
  • the molding stability is excellent, and the manufacturing can be performed by omitting the step of adjusting the outer shape of the wiring material. Further, according to the method for manufacturing a wiring material of the present invention, the wiring material can be manufactured by omitting the steps of cross-linking and adjusting the outer shape of the wiring material.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Insulated Conductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)

Abstract

L'invention concerne un matériau de câblage comprenant un conducteur et, disposée sur la surface périphérique de celui-ci, une couche isolante constituée d'une composition de résine, la composition de résine comprenant des ingrédients de résine qui comprennent, par rapport à 100 % en masse des ingrédients de résine, de 10 à 50 % en masse de résine de polypropylène (A), 30 à 85 % en masse d'une résine thermoplastique à base de polyoléfine de type mélange de réacteur (B) obtenue à partir d'un ingrédient de polypropylène (b1) et d'un ingrédient de caoutchouc copolymère d'éthylène/α-oléfine (b2), et de 5 à 25 % en masse de résine de polyéthylène (C), l'ingrédient de polypropylène (b1) comprenant de l'homopolypropylène ou du polypropylène aléatoire, et la composition de résine ne contenant sensiblement pas de charge; et un procédé de production du matériau de câblage.
PCT/JP2021/013088 2020-03-31 2021-03-26 Matériau de câblage et son procédé de production WO2021200742A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08180737A (ja) * 1994-12-23 1996-07-12 Kurabe Ind Co Ltd 難燃性電気絶縁組成物及び難燃性絶縁電線
JP2000188015A (ja) * 1991-04-26 2000-07-04 Sumitomo Electric Ind Ltd 耐熱性直流用高圧リ―ド線
JP2001325834A (ja) * 2000-05-15 2001-11-22 Furukawa Electric Co Ltd:The 直流電力ケーブル
JP2006321934A (ja) * 2005-05-20 2006-11-30 Sunallomer Ltd 難燃性熱可塑性樹脂組成物、その成形品および電線

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ES2663149T3 (es) 2015-11-04 2018-04-11 Borealis Ag Composición de polipropileno-polietileno con fluidez mejorada
KR101957049B1 (ko) 2017-10-11 2019-03-11 한화토탈 주식회사 전력 케이블 절연체용 폴리프로필렌 수지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188015A (ja) * 1991-04-26 2000-07-04 Sumitomo Electric Ind Ltd 耐熱性直流用高圧リ―ド線
JPH08180737A (ja) * 1994-12-23 1996-07-12 Kurabe Ind Co Ltd 難燃性電気絶縁組成物及び難燃性絶縁電線
JP2001325834A (ja) * 2000-05-15 2001-11-22 Furukawa Electric Co Ltd:The 直流電力ケーブル
JP2006321934A (ja) * 2005-05-20 2006-11-30 Sunallomer Ltd 難燃性熱可塑性樹脂組成物、その成形品および電線

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