WO2021193916A1 - Manufacturing method for semiconductor device manufacturing sheet - Google Patents

Manufacturing method for semiconductor device manufacturing sheet Download PDF

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Publication number
WO2021193916A1
WO2021193916A1 PCT/JP2021/012844 JP2021012844W WO2021193916A1 WO 2021193916 A1 WO2021193916 A1 WO 2021193916A1 JP 2021012844 W JP2021012844 W JP 2021012844W WO 2021193916 A1 WO2021193916 A1 WO 2021193916A1
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WO
WIPO (PCT)
Prior art keywords
film
adhesive
pressure
sensitive adhesive
manufacturing
Prior art date
Application number
PCT/JP2021/012844
Other languages
French (fr)
Japanese (ja)
Inventor
一政 安達
渉 岩屋
陽輔 佐藤
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to CN202180007066.1A priority Critical patent/CN115210075A/en
Priority to JP2022510735A priority patent/JPWO2021193916A1/ja
Priority to KR1020227016262A priority patent/KR20220156513A/en
Publication of WO2021193916A1 publication Critical patent/WO2021193916A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Definitions

  • the present invention relates to a method for manufacturing a sheet for manufacturing a semiconductor device.
  • the present application claims priority based on Japanese Patent Application No. 2020-058734 filed in Japan on March 27, 2020, the contents of which are incorporated herein by reference.
  • a semiconductor chip with a film-like adhesive including a semiconductor chip and a film-like adhesive provided on the back surface thereof is used.
  • Examples of the method for manufacturing a semiconductor chip with a film-like adhesive include those shown below.
  • a dicing die bonding sheet is attached to the back surface of the semiconductor wafer.
  • the dicing die bonding sheet include a support sheet and a film-like adhesive provided on the surface of the support sheet.
  • the support sheet can be used as a dicing sheet.
  • the support sheet for example, there are a plurality of types having different configurations, such as one provided with a base material and an adhesive layer provided on the surface of the base material; and one composed of only the base material.
  • the outermost surface on the pressure-sensitive adhesive layer side is the surface on which the film-like adhesive is provided.
  • the dicing die bonding sheet is attached to the back surface of the semiconductor wafer by the film-like adhesive in the dicing die bonding sheet.
  • the semiconductor wafer and the film-like adhesive on the support sheet are cut together by blade dicing.
  • the "cutting" of a semiconductor wafer is also referred to as “splitting", whereby the semiconductor wafer is fragmented into a target semiconductor chip.
  • the film-like adhesive is cut along the outer circumference of the semiconductor chip.
  • a semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive after cutting provided on the back surface thereof can be obtained, and a plurality of these film-like adhesives can be obtained on a support sheet.
  • a group of semiconductor chips with a film-like adhesive, in which the attached semiconductor chips are held in an aligned state, can be obtained.
  • the semiconductor chip with the film-like adhesive is pulled away from the support sheet and picked up.
  • a support sheet provided with a curable pressure-sensitive adhesive layer is used, picking up is facilitated by curing the pressure-sensitive adhesive layer to reduce the adhesiveness at this time. From the above, a semiconductor chip with a film-like adhesive used for manufacturing a semiconductor device can be obtained.
  • a back grind tape (sometimes referred to as "surface protection tape") is attached to the circuit forming surface of the semiconductor wafer.
  • a region to be divided is set inside the semiconductor wafer, and a modified layer is formed inside the semiconductor wafer by irradiating a laser beam so as to focus on the region included in this focal point.
  • the thickness of the semiconductor wafer is adjusted to a desired value by grinding the back surface of the semiconductor wafer using a grinder. By utilizing the grinding force applied to the semiconductor wafer at this time, the semiconductor wafer is divided (individualized) at the formation site of the modified layer to produce a plurality of semiconductor chips.
  • stealth dicing registered trademark
  • one die bonding sheet is attached to the back surface (in other words, the ground surface) of all these semiconductor chips fixed on the back grind tape after the above-mentioned grinding.
  • the die bonding sheet include those similar to the above dicing die bonding sheet.
  • the die bonding sheet may be designed to have the same configuration as the dicing die bonding sheet without being used when dicing the semiconductor wafer.
  • the die bonding sheet is also attached to the back surface of the semiconductor chip by the film-like adhesive therein.
  • the die bonding sheet is stretched in a direction parallel to its surface (for example, the surface on which the film-like adhesive is attached to the semiconductor chip) while being cooled, so-called expand (so-called expand).
  • the film-like adhesive is cut along the outer periphery of the semiconductor chip.
  • the semiconductor chip with the film-like adhesive is separated from the support sheet and picked up to obtain the semiconductor chip with the film-like adhesive used for manufacturing the semiconductor device. Be done.
  • Both the dicing die bonding sheet and the die bonding sheet can be used for manufacturing a semiconductor chip with a film-like adhesive, and finally, the target semiconductor device can be manufactured.
  • the dicing die bonding sheet and the die bonding sheet are collectively referred to as "semiconductor device manufacturing sheet".
  • the sheet for manufacturing a semiconductor device includes, for example, a dicing die bonding tape (described above) having a structure in which a base material layer (corresponding to the support sheet) and an adhesive layer (corresponding to the film-like adhesive) are directly contacted and laminated.
  • a dicing die bonding sheet (corresponding to a dicing die bonding sheet) is disclosed (see Patent Document 1).
  • this dicing die bonding tape since the 90-degree peeling force of the base material layer and the adhesive layer at -15 ° C is adjusted to a specific range, it is said that the adhesive layer can be accurately divided by expanding. .. Further, since the 90-degree peeling force of the base material layer and the adhesive layer at 23 ° C.
  • An object of the present invention is to provide a method for manufacturing a semiconductor device manufacturing sheet, which can easily form a film of a film-like adhesive and can manufacture a semiconductor device manufacturing sheet having excellent mounting process suitability at the time of use.
  • a method for manufacturing a sheet for manufacturing a semiconductor device includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a second release film, and includes the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the above.
  • the film-like adhesive and the second release film are laminated in this order.
  • a cut portion C is formed at a position corresponding to the outer periphery, and at least a part of the intermediate layer and the film-like adhesive located outside from the cut portion C is removed to remove the second intermediate laminate processed product.
  • the first processing process to obtain The base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are obtained by laminating the first intermediate laminate having the base material and the pressure-sensitive adhesive layer and the processed product of the second intermediate laminate.
  • a cut portion C' is formed at a position corresponding to the outer periphery of the base material and the pressure-sensitive adhesive layer of the semiconductor device manufacturing sheet with respect to the base material and the pressure-sensitive adhesive layer of the second laminate, and the cut portion is formed.
  • a second processing step of removing at least a part of the base material and the pressure-sensitive adhesive layer located on the outside starting from the part C'and obtaining a sheet for manufacturing a semiconductor device is included.
  • the pressure-sensitive adhesive is obtained by applying a pressure-sensitive adhesive composition to the peel-processed surface of the first release film and drying it to form a single-layer pressure-sensitive adhesive layer having a thickness of 10 ⁇ m.
  • the composition comprises 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
  • the pressure-sensitive adhesive layer of the first test piece and the peeled-processed surfaces of the first peeling film form an angle of 180 °.
  • the peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the first peeling film, which is measured by 180 ° peeling to peel the first peeling film from the agent layer, is more than 180 mN / 50 mm.
  • a single-layer pressure-sensitive adhesive layer having a thickness of 10 ⁇ m is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the second release film and drying the pressure-sensitive adhesive composition.
  • the second test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
  • an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.)
  • BXX 5640 cross-linking agent manufactured by Toyochem Co., Ltd.
  • the pressure-sensitive adhesive layer of the second test piece and the peeled-processed surfaces of the second peeling film form an angle of 180 °.
  • the peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the second release film measured by 180 ° peeling of the second release film from the agent layer is 180 mN / 50 mm or less.
  • a method for manufacturing a semiconductor device manufacturing sheet which can easily form a film of a film-like adhesive and can manufacture a semiconductor device manufacturing sheet having excellent mounting process suitability at the time of use.
  • FIG. It is sectional drawing which shows typically the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. It is a top view of the sheet for manufacturing a semiconductor device shown in FIG. It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention.
  • the sheet for manufacturing semiconductor devices includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a release film, and the base material.
  • the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive, and the release film are laminated in this order.
  • the intermediate layer preferably contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
  • the blade When the semiconductor device manufacturing sheet of the present embodiment is used as a dicing die bonding sheet and blade dicing is performed, the blade reaches the base material because the semiconductor device manufacturing sheet includes the intermediate layer. This can be easily avoided, and the generation of whisker-like cutting chips (also known as Whiskers, hereinafter, not limited to those derived from the base material, but also simply referred to as "cutting chips") from the base material can be generated. Can be suppressed.
  • the main component of the intermediate layer cut by the blade is a non-silicon resin having a weight average molecular weight of 100,000 or less, and in particular, the cutting chips from the intermediate layer because the weight average molecular weight is 100,000 or less. Can also be suppressed.
  • the semiconductor device manufacturing sheet of the present embodiment is used as a die bonding sheet and dicing (stealth dicing (registered trademark)) accompanied by formation of a modified layer on a semiconductor wafer is performed
  • the semiconductor device manufacturing sheet is used. Since the sheet includes the intermediate layer, the sheet for manufacturing a semiconductor device is subsequently stretched in a direction parallel to its surface (for example, the surface on which the film-like adhesive is attached to the semiconductor chip), that is, so-called expansion is performed. As a result, the film-like adhesive can be cut accurately at the target location, and cutting defects can be suppressed. It is considered that this is because the stress of the expand can be efficiently used for expanding the distance between chips by providing the intermediate layer.
  • the semiconductor device manufacturing sheet of the present embodiment suppresses the generation of cutting chips from the base material and the intermediate layer during blade dicing, and suppresses cutting defects of the film-like adhesive during the expansion. , It has the property of suppressing the occurrence of defects when the semiconductor wafer is divided, and is excellent in the division suitability of the semiconductor wafer.
  • the "weight average molecular weight” is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.
  • the semiconductor device manufacturing sheet of the present embodiment will be described in detail with reference to the drawings.
  • the main part may be enlarged for convenience, and the dimensional ratio of each component is the same as the actual one. Is not always the case.
  • FIG. 1 is a cross-sectional view schematically showing a semiconductor device manufacturing sheet according to an embodiment of the present invention
  • FIG. 2 is a plan view of the semiconductor device manufacturing sheet shown in FIG.
  • the same components as those shown in the already explained figures are designated by the same reference numerals as in the case of the already explained figures, and detailed description thereof will be omitted.
  • the semiconductor device manufacturing sheet 101 shown here includes a base material 11, and the pressure-sensitive adhesive layer 12, the intermediate layer 13, and the film-like adhesive 14 are laminated in this order on the base material 11.
  • the sheet 101 for manufacturing a semiconductor device is further peeled off on a surface (hereinafter, may be referred to as “first surface”) 14a opposite to the side on which the intermediate layer 13 of the film-like adhesive 14 is provided.
  • the film 15 is provided.
  • the pressure-sensitive adhesive layer 12 is provided on one surface of the base material 11 (sometimes referred to as the "first surface” in the present specification) 11a.
  • the intermediate layer 13 is provided on the surface (sometimes referred to as the "first surface” in the present specification) 12a of the pressure-sensitive adhesive layer 12 opposite to the side on which the base material 11 is provided.
  • the film-like adhesive 14 is provided on the surface (sometimes referred to as the "first surface” in the present specification) 13a of the intermediate layer 13 opposite to the side on which the pressure-sensitive adhesive layer 12 is provided. ..
  • a release film 15 is provided on the first surface 14a of the film-like adhesive 14.
  • the sheet 101 for manufacturing a semiconductor device is composed of a base material 11, an adhesive layer 12, an intermediate layer 13, a film-like adhesive 14, and a release film 15 laminated in this order in the thickness direction thereof. There is.
  • the first surface 14a of the film-like adhesive 14 in the sheet 101 is a semiconductor wafer, a semiconductor chip, or a semiconductor wafer in which the film-like adhesive 14 is not completely divided. It is used by being attached to the back surface of (not shown).
  • circuit forming surface the surface on the side where the circuit is formed
  • back surface the surface opposite to the circuit forming surface
  • a laminate having a structure in which the base material and the pressure-sensitive adhesive layer are laminated in the thickness direction thereof and the intermediate layer is not laminated may be referred to as a "support sheet".
  • a support sheet is indicated by reference numeral 1.
  • a laminate having a structure in which a base material, an adhesive layer and an intermediate layer are laminated in this order in the thickness direction thereof may be referred to as a "laminated sheet”.
  • a laminated sheet is indicated by reference numeral 10. The support sheet and the laminate of the intermediate layer are included in the laminate sheet.
  • the intermediate layer 13 and the film-like adhesive 14 are viewed in a plan view from above, they are both circular in shape, and the diameter of the intermediate layer 13 and the diameter of the film-like adhesive 14 are the same. .. Then, in the semiconductor device manufacturing sheet 101, the intermediate layer 13 and the film-like adhesive 14 have their centers aligned with each other, in other words, the positions of the outer circumferences of the intermediate layer 13 and the film-like adhesive 14 are aligned with each other. They are arranged so that they all match in the radial direction.
  • Both the first surface 13a of the intermediate layer 13 and the first surface 14a of the film-like adhesive 14 have a smaller area than the first surface 12a of the pressure-sensitive adhesive layer 12.
  • the maximum value (that is, diameter) of the width W 13 of the intermediate layer 13 and the maximum value (that is, diameter) of the width W 14 of the film-like adhesive 14 are both the maximum value of the width of the pressure-sensitive adhesive layer 12 and the maximum value. It is smaller than the maximum width of the base material 11. Therefore, in the semiconductor device manufacturing sheet 101, a part of the first surface 12a of the pressure-sensitive adhesive layer 12 is not covered with the intermediate layer 13 and the film-like adhesive 14.
  • the release film 15 is directly contacted and laminated, and the release film 15 is laminated. In the removed state, this region is exposed (hereinafter, this region may be referred to as a "non-stacked region" in the present specification).
  • this region In the sheet 101 for manufacturing a semiconductor device provided with the release film 15, the area of the pressure-sensitive adhesive layer 12 not covered by the intermediate layer 13 and the film-like adhesive 14 is the release film 15 as shown here. There may or may not be areas where are not laminated.
  • the semiconductor device manufacturing sheet 101 in which the film-like adhesive 14 is uncut and is attached to the above-mentioned semiconductor wafer, semiconductor chip, or the like by the film-like adhesive 14 is the non-cutting material in the pressure-sensitive adhesive layer 12.
  • a part of the laminated region can be fixed by attaching it to a jig such as a ring frame for fixing a semiconductor wafer. Therefore, it is not necessary to separately provide the jig adhesive layer for fixing the semiconductor device manufacturing sheet 101 to the jig on the semiconductor device manufacturing sheet 101. Since it is not necessary to provide the adhesive layer for the jig, the sheet 101 for manufacturing the semiconductor device can be manufactured inexpensively and efficiently.
  • the sheet 101 for manufacturing a semiconductor device has an advantageous effect because it does not include the adhesive layer for jigs, but may include an adhesive layer for jigs.
  • the jig adhesive layer is provided in a region near the peripheral edge of the surface of any of the layers constituting the semiconductor device manufacturing sheet 101. Examples of such a region include the non-laminated region on the first surface 12a of the pressure-sensitive adhesive layer 12.
  • the adhesive layer for jigs may be a known one.
  • it may have a single-layer structure containing an adhesive component, or layers containing an adhesive component are laminated on both sides of a sheet serving as a core material. It may have a multi-layer structure.
  • the so-called expanding in which the sheet 101 for manufacturing a semiconductor device is stretched in a direction parallel to the surface thereof (for example, the first surface 12a of the pressure-sensitive adhesive layer 12), the first surface of the pressure-sensitive adhesive layer 12 is expanded.
  • the presence of the non-laminated region on one surface 12a makes it possible to easily expand the sheet 101 for manufacturing a semiconductor device. Not only can the film-like adhesive 14 be easily cut, but the peeling of the intermediate layer 13 and the film-like adhesive 14 from the pressure-sensitive adhesive layer 12 may be suppressed.
  • Both the first surface 12a of the pressure-sensitive adhesive layer 12 of the support sheet 1 and the first surface 11a of the base material 11 have a smaller area than the first surface 15a of the release film 15.
  • the maximum value (that is, diameter) of the width of the pressure-sensitive adhesive layer 12 and the maximum value (that is, diameter) of the base material 11 are both smaller than the maximum value of the width of the release film 15. Therefore, in the semiconductor device manufacturing sheet 101, a part of the release film 15 is not covered with the pressure-sensitive adhesive layer 12 and the base material 11.
  • the plane shape is circular, and the diameters of the pressure-sensitive adhesive layer 12 and the base material 11 are the same. Then, in the semiconductor device manufacturing sheet 101, the positions of the outer periphery of the pressure-sensitive adhesive layer 12 and the base material 11 are in the radial direction so that the centers of the pressure-sensitive adhesive layer 12 and the base material 11 coincide with each other. They are arranged so that they all match.
  • the intermediate layer 13 contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
  • the sheet for manufacturing a semiconductor device of the present embodiment is not limited to the one shown in FIGS. 1 and 2, and a part of the configurations shown in FIGS. 1 and 2 are changed within the range not impairing the effect of the present invention. , May have been deleted or added.
  • the sheet for manufacturing a semiconductor device of the present embodiment does not correspond to any of a base material, an adhesive layer, an intermediate layer, a film-like adhesive, a release film, and an adhesive layer for jigs. , Other layers may be provided.
  • the semiconductor device manufacturing sheet of the present embodiment is provided with the pressure-sensitive adhesive layer in direct contact with the base material and the intermediate layer in direct contact with the pressure-sensitive adhesive layer, and is in the form of a film. It is preferable that the adhesive is provided in direct contact with the intermediate layer and the release film is provided in direct contact with the film-like adhesive.
  • the planar shapes of the intermediate layer and the film-like adhesive may be shapes other than the circular shape, and the planar shapes of the intermediate layer and the film-like adhesive are the same as each other. It may be, or it may be different. Further, the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive are both the areas of the layers on the substrate side (for example, the first surface of the pressure-sensitive adhesive layer). It is preferably smaller than, and may be the same as or different from each other. The positions of the outer periphery of the intermediate layer and the film-like adhesive may or may not be the same in these radial directions.
  • each layer constituting the semiconductor device manufacturing sheet of the present embodiment will be described in more detail.
  • the base material is in the form of a sheet or a film.
  • the constituent material of the base material is preferably various resins, and specifically, for example, polyethylene (low density polyethylene (LDPE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE, etc.)).
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • HDPE high density polyethylene
  • (meth) acrylic acid is a concept including both “acrylic acid” and “methacrylic acid”.
  • (meth) acrylate is a concept that includes both “acrylate” and “methacrylate”, and is a "(meth) acryloyl group”. Is a concept that includes both an "acryloyl group” and a “methacryloyl group”.
  • the resin constituting the base material may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the base material may be composed of one layer (single layer) or may be composed of two or more layers.
  • the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.
  • "a plurality of layers may be the same or different from each other” means “all layers may be the same or all layers are different”. It may mean that only a part of the layers may be the same, and further, "a plurality of layers are different from each other" means that "at least one of the constituent materials and the thickness of each layer is different from each other”. means.
  • the thickness of the base material can be appropriately selected depending on the intended purpose, but is preferably 50 to 300 ⁇ m, more preferably 60 to 150 ⁇ m. When the thickness of the base material is at least the above lower limit value, the structure of the base material is more stabilized. When the thickness of the base material is not more than the upper limit value, the film-like adhesive can be more easily cut at the time of blade dicing and at the time of expanding the sheet for manufacturing a semiconductor device.
  • the "thickness of the base material” means the thickness of the entire base material, and for example, the thickness of the base material composed of a plurality of layers means the total thickness of all the layers constituting the base material. means. In the present specification, "thickness" is a constant pressure thickness measuring device according to JIS K7130 as a value represented by an average of thickness measured at five randomly selected points unless otherwise specified. Can be obtained using.
  • the base material is roughened by sandblasting, solvent treatment, embossing, etc. in order to improve adhesion to other layers such as the pressure-sensitive adhesive layer provided on it; corona discharge treatment, electron beam irradiation treatment, etc. , Plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment and other oxidation treatments; etc. may be applied to the surface. Further, the surface of the base material may be primed. Further, the base material is an antistatic coat layer; a layer that prevents the base material from adhering to other sheets or adhering to the adsorption table when the die bonding sheets are superposed and stored; etc. May have.
  • the base material contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). You may.
  • the optical properties of the base material are not particularly limited as long as the effects of the present invention are not impaired.
  • the base material may be, for example, one that transmits laser light or energy rays.
  • the base material can be produced by a known method.
  • a base material containing a resin (using a resin as a constituent material) can be produced by molding the resin or a resin composition containing the resin.
  • the adhesive layer is in the form of a sheet or a film and contains an adhesive.
  • the pressure-sensitive adhesive layer can be formed by using a pressure-sensitive adhesive composition containing the pressure-sensitive adhesive.
  • the pressure-sensitive adhesive layer can be formed on a target portion by applying the pressure-sensitive adhesive composition to the surface to be formed of the pressure-sensitive adhesive layer and drying it if necessary.
  • the pressure-sensitive adhesive composition may be applied by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater.
  • a method using various coaters such as a Meyer bar coater and a knife coater.
  • the drying conditions of the pressure-sensitive adhesive composition are not particularly limited, but when the pressure-sensitive adhesive composition contains a solvent described later, it is preferably heat-dried. In this case, for example, at 70 to 130 ° C. for 10 seconds to It is preferable to dry under the condition of 5 minutes.
  • the pressure-sensitive adhesive examples include adhesive resins such as acrylic resin, urethane resin, rubber-based resin, silicone resin, epoxy-based resin, polyvinyl ether, polycarbonate, and ester-based resin, and acrylic resin is preferable.
  • the "adhesive resin” includes both a resin having adhesiveness and a resin having adhesiveness.
  • the adhesive resin includes not only the resin itself having adhesiveness, but also a resin showing adhesiveness when used in combination with other components such as additives, and adhesiveness due to the presence of a trigger such as heat or water. Also included are resins and the like.
  • the pressure-sensitive adhesive layer may be either curable or non-curable, and may be, for example, either energy ray-curable or non-energy ray-curable.
  • the physical properties of the curable pressure-sensitive adhesive layer before and after curing can be easily adjusted.
  • energy ray means an electromagnetic wave or a charged particle beam having an energy quantum.
  • energy rays include ultraviolet rays, radiation, electron beams and the like.
  • Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source.
  • the electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
  • energy ray curable means a property of being cured by irradiating with energy rays
  • non-energy ray curable is a property of not being cured by irradiating with energy rays.
  • the pressure-sensitive adhesive layer may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other.
  • the combination of these plurality of layers is not particularly limited.
  • the thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 ⁇ m, more preferably 1 to 60 ⁇ m, and particularly preferably 1 to 30 ⁇ m.
  • the "thickness of the pressure-sensitive adhesive layer” means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers is the sum of all the layers constituting the pressure-sensitive adhesive layer. Means the thickness of.
  • the base material and the pressure-sensitive adhesive layer may have the same shape, and it is preferable that the base material and the pressure-sensitive adhesive layer are laminated so that the outer circumferences of their plan-view shapes coincide with each other.
  • the optical properties of the pressure-sensitive adhesive layer are not particularly limited as long as the effects of the present invention are not impaired.
  • the pressure-sensitive adhesive layer may be one that allows energy rays to pass through.
  • the pressure-sensitive adhesive composition will be described.
  • the following pressure-sensitive adhesive composition can contain, for example, one or more of the following components so that the total content (% by mass) does not exceed 100% by mass.
  • the pressure-sensitive adhesive composition containing the energy ray-curable pressure-sensitive adhesive that is, the energy ray-curable pressure-sensitive adhesive composition, for example, is a non-energy ray-curable pressure-sensitive adhesive.
  • a pressure-sensitive adhesive composition (I-2) containing may be abbreviated); a pressure-sensitive adhesive composition (I-3) containing the pressure-sensitive resin (I-2a) and an energy ray-curable compound, etc. Can be mentioned.
  • the pressure-sensitive adhesive composition (I-1) contains a non-energy ray-curable pressure-sensitive adhesive resin (I-1a) and an energy ray-curable compound.
  • the adhesive resin (I-1a) is preferably an acrylic resin.
  • the acrylic resin include an acrylic polymer having a structural unit derived from at least a (meth) acrylic acid alkyl ester.
  • the structural unit of the acrylic resin may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when two or more types are used.
  • the combination and ratio can be selected arbitrarily.
  • the ratio of the content of the pressure-sensitive adhesive resin (I-1a) to the total mass of the pressure-sensitive adhesive composition (I-1) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
  • Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) include monomers or oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays.
  • examples of the monomer include trimethylpropantri (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4.
  • Multivalent (meth) acrylates such as -butylene glycol di (meth) acrylate, 1,6-hexanediol (meth) acrylate; urethane (meth) acrylate; polyester (meth) acrylate; polyether (meth) acrylate; epoxy ( Meta) Acrylate and the like can be mentioned.
  • the energy ray-curable compounds examples include an oligomer obtained by polymerizing the monomers exemplified above.
  • the energy ray-curable compound has a relatively large molecular weight, and urethane (meth) acrylate and urethane (meth) acrylate oligomer are preferable in that the storage elastic modulus of the pressure-sensitive adhesive layer is unlikely to be lowered.
  • the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
  • the ratio of the content of the energy ray-curable compound to the total mass of the pressure-sensitive adhesive composition (I-1) is preferably 1 to 95% by mass, and 5 It is more preferably to 90% by mass, and particularly preferably 10 to 85% by mass.
  • the pressure-sensitive adhesive composition (I) -1) preferably further contains a cross-linking agent.
  • the cross-linking agent reacts with the functional group, for example, to cross-link the adhesive resins (I-1a) with each other.
  • the cross-linking agent include isocyanate-based cross-linking agents such as tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates (cross-linking agents having an isocyanate group); and epoxy-based cross-linking agents such as ethylene glycol glycidyl ether (cross-linking agents).
  • Cross-linking agent having a glycidyl group Isocyanate-based cross-linking agent such as hexa [1- (2-methyl) -aziridinyl] triphosphatriazine (cross-linking agent having an aziridinyl group); Metal chelate-based cross-linking agent such as aluminum chelate (metal) A cross-linking agent having a chelate structure); an isocyanurate-based cross-linking agent (a cross-linking agent having an isocyanurate skeleton) and the like can be mentioned.
  • the cross-linking agent is preferably an isocyanate-based cross-linking agent from the viewpoints of improving the cohesive force of the pressure-sensitive adhesive to improve the adhesive force of the pressure-sensitive adhesive layer and being easily available.
  • the cross-linking agent contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
  • the content of the cross-linking agent in the pressure-sensitive adhesive composition (I-1) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
  • the pressure-sensitive adhesive composition (I-1) may further contain a photopolymerization initiator.
  • the pressure-sensitive adhesive composition (I-1) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
  • photopolymerization initiator examples include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal; acetophenone and 2-hydroxy.
  • benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal; acetophenone and 2-hydroxy.
  • Acetphenone compounds such as -2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6-trimethylbenzoyl) phenylphosphine
  • Acylphosphine oxide compounds such as oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide
  • sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide
  • ⁇ -ketol compounds such as 1-hydroxycyclohexylphenylketone
  • azo Azo compounds such as bisisobutyronitrile
  • titanocene compounds such as titanosen
  • thioxanthone compounds such as thioxanthone
  • peroxide compounds diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethylthioxanthone
  • the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
  • the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-1) is 0.01 to 20 mass by mass with respect to 100 parts by mass of the content of the energy ray-curable compound.
  • the amount is preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
  • the pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
  • the other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust preventives, colorants (pigments, dyes), sensitizers, and tackifiers.
  • Known additives such as reaction retarders and cross-linking accelerators (catalysts).
  • the reaction retarder means, for example, that an unintended cross-linking reaction occurs in the pressure-sensitive adhesive composition (I-1) being stored due to the action of the catalyst mixed in the pressure-sensitive adhesive composition (I-1). It is a component for suppressing the progress.
  • the other additives contained in the pressure-sensitive adhesive composition (I-1) may be only one kind, two or more kinds, and when there are two or more kinds, the combination and ratio thereof are It can be selected arbitrarily.
  • the content of the other additives in the pressure-sensitive adhesive composition (I-1) is not particularly limited, and may be appropriately selected depending on the type thereof.
  • the pressure-sensitive adhesive composition (I-1) may contain a solvent. Since the pressure-sensitive adhesive composition (I-1) contains a solvent, the suitability for coating on the surface to be coated is improved.
  • the solvent is preferably an organic solvent.
  • the pressure-sensitive adhesive composition (I-2) is an energy ray-curable pressure-sensitive adhesive resin in which an unsaturated group is introduced into the side chain of the non-energy ray-curable pressure-sensitive adhesive resin (I-1a). (I-2a) is contained.
  • the adhesive resin (I-2a) can be obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.
  • the unsaturated group-containing compound can be bonded to the adhesive resin (I-1a) by further reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group.
  • a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group.
  • It is a compound having a group.
  • the energy ray-polymerizable unsaturated group include (meth) acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like, and (meth) acryloyl group is preferable.
  • Examples of the group that can be bonded to the functional group in the adhesive resin (I-1a) include an isocyanate group and a glycidyl group that can be bonded to a hydroxyl group or an amino group, and a hydroxyl group and an amino group that can be bonded to a carboxy group or an epoxy group. And so on.
  • Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, and glycidyl (meth) acrylate.
  • the pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when two or more types are used.
  • the combination and ratio can be selected arbitrarily.
  • the ratio of the content of the pressure-sensitive adhesive resin (I-2a) to the total mass of the pressure-sensitive adhesive composition (I-2) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 10 to 90% by mass.
  • the pressure-sensitive adhesive composition (I) -2) may further contain a cross-linking agent.
  • Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
  • the cross-linking agent contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
  • the content of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
  • the pressure-sensitive adhesive composition (I-2) may further contain a photopolymerization initiator.
  • the pressure-sensitive adhesive composition (I-2) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
  • Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
  • the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
  • the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) is 0.01 to 100 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
  • the pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired. Further, the pressure-sensitive adhesive composition (I-2) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1). Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-2) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively.
  • the other additives and solvents contained in the pressure-sensitive adhesive composition (I-2) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable.
  • the contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-2) are not particularly limited, and may be appropriately selected depending on the type thereof.
  • the pressure-sensitive adhesive composition (I-3) contains the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound.
  • the ratio of the content of the pressure-sensitive adhesive resin (I-2a) to the total mass of the pressure-sensitive adhesive composition (I-3) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
  • Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) include monomers and oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays, and the pressure-sensitive adhesive composition. Examples thereof include the same energy ray-curable compounds contained in the substance (I-1).
  • the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
  • the content of the energy ray-curable compound is 0.01 to 300 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass.
  • the pressure-sensitive adhesive composition (I-3) may further contain a photopolymerization initiator.
  • the pressure-sensitive adhesive composition (I-3) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
  • Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
  • the photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
  • the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) is 100 parts by mass of the total content of the pressure-sensitive adhesive resin (I-2a) and the energy ray-curable compound. On the other hand, it is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
  • the pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired. Further, the pressure-sensitive adhesive composition (I-3) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1). Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-3) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively. The other additives and solvents contained in the pressure-sensitive adhesive composition (I-3) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable. The contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-3) are not particularly limited, and may be appropriately selected depending on the type thereof.
  • Examples of the pressure-sensitive adhesive composition other than the pressure-sensitive adhesive compositions (I-1) to (I-3) include non-energy ray-curable pressure-sensitive adhesive compositions in addition to the energy-ray-curable pressure-sensitive adhesive composition.
  • Examples of the non-energy ray-curable pressure-sensitive adhesive composition include non-energy ray-curable pressure-sensitive adhesives such as acrylic resin, urethane resin, rubber-based resin, silicone resin, epoxy-based resin, polyvinyl ether, polycarbonate, and ester-based resin. Examples thereof include a pressure-sensitive adhesive composition (I-4) containing a sex resin (I-1a), and those containing an acrylic resin are preferable.
  • the pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) preferably contain one or more cross-linking agents, and the content thereof is the above-mentioned pressure-sensitive adhesive composition. The same can be applied to the case of (I-1) and the like.
  • Preferred adhesive composition (I-4) includes, for example, the adhesive resin (I-1a) and a cross-linking agent.
  • Adhesive resin (I-1a) examples of the adhesive resin (I-1a) in the pressure-sensitive adhesive composition (I-4) include the same adhesive resin (I-1a) as in the pressure-sensitive adhesive composition (I-1).
  • the pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when two or more types are used. The combination and ratio can be selected arbitrarily.
  • the ratio of the content of the pressure-sensitive adhesive resin (I-1a) to the total mass of the pressure-sensitive adhesive composition (I-4) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
  • the pressure-sensitive adhesive composition (I) -4) preferably further contains a cross-linking agent.
  • Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-4) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
  • the cross-linking agent contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. You can choose.
  • the content of the cross-linking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is more preferably 0.1 to 25 parts by mass, and particularly preferably 0.1 to 10 parts by mass.
  • the pressure-sensitive adhesive composition (I-4) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired. Further, the pressure-sensitive adhesive composition (I-4) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1). Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-4) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively. The other additives and solvents contained in the pressure-sensitive adhesive composition (I-4) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable. The contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-4) are not particularly limited, and may be appropriately selected depending on the type thereof.
  • the pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) and the pressure-sensitive adhesive compositions (I-1) to (I-3) such as the pressure-sensitive adhesive composition (I-4) are obtained by blending each component for forming a pressure-sensitive adhesive composition.
  • the order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
  • a solvent it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or diluting any of the compounding components other than the solvent in advance.
  • the method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
  • the temperature and time at the time of adding and mixing each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.
  • the intermediate layer is in the form of a sheet or a film, and contains the non-silicon resin as a main component.
  • the intermediate layer may contain only a non-silicon resin (consisting of a non-silicon resin), or may contain a non-silicon resin and other components.
  • the intermediate layer can be formed, for example, by using the composition for forming an intermediate layer containing the non-silicon resin.
  • the intermediate layer can be formed by applying the composition for forming an intermediate layer to the surface to be formed of the intermediate layer and drying it if necessary.
  • the weight average molecular weight of the non-silicon resin is 100,000 or less.
  • the weight average molecular weight of the non-silicon resin may be, for example, 80,000 or less, 60,000 or less, or 40,000 or less. good.
  • the lower limit of the weight average molecular weight of the non-silicon resin is not particularly limited.
  • the non-silicon resin having a weight average molecular weight of 5000 or more is more easily available.
  • the weight average molecular weight of the non-silicon resin can be appropriately adjusted within a range set by arbitrarily combining the above-mentioned lower limit value and any upper limit value.
  • the weight average molecular weight may be, for example, any of 5000-100,000, 5000-80,000, 5000-60,000, and 5000-40,000.
  • the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component
  • the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less. It means that the non-silicon resin is contained in an amount sufficient to exert the effect of the above.
  • the ratio of the content of the non-silicon resin to the total mass of the intermediate layer in other words, in the composition for forming the intermediate layer, with respect to the total content of all components other than the solvent).
  • the content ratio of the non-silicon resin is preferably 50% by mass or more, more preferably 80% by mass or more, further preferably 90% by mass or more, for example, 95% by mass. It may be any of% or more, 97% by mass or more, and 99% by mass or more. On the other hand, the ratio is 100% by mass or less.
  • the non-silicon resin having a weight average molecular weight of 100,000 or less is not particularly limited as long as it does not have a silicon atom as a constituent atom and has a weight average molecular weight of 100,000 or less.
  • the non-silicon resin may be, for example, either a polar resin having a polar group or a non-polar resin having no polar group.
  • the non-silicon resin is preferably a polar resin in that it has high solubility in the intermediate layer forming composition and higher coating suitability of the intermediate layer forming composition.
  • non-silicon resin means the above-mentioned non-silicon resin having a weight average molecular weight of 100,000 or less.
  • the non-silicon resin may be, for example, a copolymer of one kind of monomer (in other words, having only one kind of constituent unit), or a polymer of two or more kinds of monomers. In other words, it may be a copolymer (having two or more kinds of constituent units).
  • the polar resin may have only a structural unit having a polar group, or may have both a structural unit having a polar group and a structural unit having no polar group.
  • Examples of the structural unit having a polar group include a structural unit derived from vinyl acetate. Examples of the structural unit having no polar group include a structural unit derived from ethylene.
  • the term "induced" as used herein means that the monomer has undergone a structural change necessary for polymerization.
  • the ratio of the mass of the structural unit having a polar group to the total mass of all the structural units is preferably 5 to 70% by mass, for example, 7.5 to 55% by mass, 10 to 40. It may be either 1% by mass and 10 to 30% by mass.
  • the ratio of the mass of the structural unit having no polar group to the total mass of all the structural units is preferably 30 to 95% by mass, for example, 45 to 92.5% by mass. , 60-90% by mass, and 70-90% by mass.
  • the mass ratio of the structural unit having a polar group is equal to or more than the lower limit value, the polar resin has a more remarkable characteristic of having a polar group.
  • the mass ratio of the structural unit having a polar group is not more than the upper limit value, the polar resin has a more appropriate characteristic of not having a polar group.
  • the polar resin examples include ethylene-vinyl acetate copolymer and the like.
  • the ratio of the content of the ethylene-vinyl acetate copolymer to the total mass of the non-silicon resin contained in the intermediate layer may be, for example, 50 to 100% by mass, and 80 to 100% by mass. It may be 90 to 100% by mass.
  • the preferred polar resin for example, in an ethylene-vinyl acetate copolymer, the ratio of the mass of the structural unit derived from vinyl acetate to the total mass of all the structural units (in the present specification, "acetic acid".
  • the content of the structural unit derived from vinyl is sometimes referred to as "content" of 40% by mass or less, 30% by mass or less, 10 to 40% by mass, or 10 to 30% by mass. Some are mentioned.
  • the preferred polar resin for example, in an ethylene-vinyl acetate copolymer, the ratio of the mass of the constituent units derived from ethylene to the total mass of all the constituent units is 60% by mass or more. Examples thereof include those having a mass of 70% by mass or more, those having a mass of 70 to 90% by mass, and those having a mass of 60 to 90% by mass.
  • the ratio of the content of the structural unit derived from vinyl acetate is not more than the above upper limit value, even if cutting chips are generated from the intermediate layer when cutting the film-like adhesive, the adhesive force of the generated cutting chips is increased. It is moderately lowered, and cutting chips can be easily removed from the chip by cleaning or the like.
  • non-polar resin examples include low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), metallocene-catalyzed linear low-density polyethylene (metallocene LLDPE), medium-density polyethylene (MDPE), and high-density polyethylene ( Examples include polyethylene (PE) such as HDPE); polypropylene (PP) and the like.
  • LDPE low-density polyethylene
  • LLDPE linear low-density polyethylene
  • MDPE medium-density polyethylene
  • high-density polyethylene examples include polyethylene (PE) such as HDPE); polypropylene (PP) and the like.
  • the composition for forming an intermediate layer and the non-silicon resin contained in the intermediate layer may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
  • the composition for forming an intermediate layer and the intermediate layer may contain one or more types of non-silicon-based resin which is a polar resin, and may not contain a non-silicon-based resin which is a non-polar resin. However, it does not have to contain one or more non-silicon resin which is a non-polar resin and does not contain the non-silicon resin which is a polar resin, and the non-silicon resin which is a polar resin and the non-silicon resin. , A non-silicon resin which is a non-polar resin, and one or more of them may be contained together.
  • the composition for forming the intermediate layer and the intermediate layer preferably contain at least a non-silicon resin which is a polar resin.
  • the ratio of the content of the non-silicon resin, which is a polar resin, to the total content of the non-silicon resin is preferably 50% by mass or more, preferably 80% by mass. % Or more, more preferably 90% by mass or more, and for example, 95% by mass or more, 97% by mass or more, and 99% by mass or more may be used.
  • the ratio is at least the lower limit value, the effect of using the polar resin can be obtained more remarkably. On the other hand, the ratio is 100% by mass or less.
  • the ratio of the content of the non-silicon resin, which is a non-polar resin, to the total content of the non-silicon resin is preferably 20% by mass or less. It is more preferably 10% by mass or less, and may be, for example, 5% by mass or less, 3% by mass or less, and 1% by mass or less. On the other hand, the ratio is 0% by mass or more.
  • the composition for forming an intermediate layer preferably contains a solvent in addition to the non-silicon resin from the viewpoint of good handleability, and both the non-silicon resin and the solvent It may contain a component that does not apply (sometimes referred to as an "additive" in the present specification).
  • the intermediate layer may contain only the non-silicon resin, or may contain both the non-silicon resin and the additive.
  • the additive may be either a resin component (in the present specification, it may be referred to as "another resin component") or a non-resin component.
  • Examples of the other resin component include a non-silicon resin having a weight average molecular weight (Mw) of more than 100,000 and a silicon resin.
  • the non-silicon resin having a weight average molecular weight of more than 100,000 is not particularly limited as long as these conditions are satisfied.
  • the intermediate layer containing the silicon-based resin makes it easier to pick up a semiconductor chip with a film-like adhesive, as will be described later.
  • the silicon-based resin is not particularly limited as long as it is a resin component having a silicon atom as a constituent atom.
  • the weight average molecular weight of the silicon-based resin is not particularly limited.
  • Preferred silicon-based resins include, for example, a resin component having a mold-releasing action on a pressure-sensitive adhesive component, and both a siloxane-based resin (a resin component having a siloxane bond (-Si-O-Si-) and a siloxane-based compound). ) Is more preferable.
  • siloxane-based resin examples include polydialkylsiloxane and the like.
  • the alkyl group of the polydialkylsiloxane preferably has 1 to 20 carbon atoms.
  • examples of the polydialkylsiloxane include polydimethylsiloxane.
  • the non-resin component may be, for example, an organic compound or an inorganic compound, and is not particularly limited.
  • the composition for forming an intermediate layer and the additive contained in the intermediate layer may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.
  • the composition for forming an intermediate layer and the intermediate layer may contain one or more resin components as the additive and may not contain a non-resin component, or may contain one non-resin component. It may contain seeds or two or more kinds and may not contain a resin component, or may contain one kind or two or more kinds of both a resin component and a non-resin component.
  • the ratio of the content of the non-silicon resin to the total mass of the intermediate layer in the intermediate layer is preferably 90 to 99.99% by mass, for example, 90 to 97.5% by mass, 90. It may be any of ⁇ 95% by mass and 90-92.5% by mass, 92.5-99.99% by mass, 95-99.99% by mass, and 97.5-99.99% by mass. It may be any of%, and it may be 92.5 to 97.5% by mass.
  • the ratio of the content of the additive to the total mass of the intermediate layer in the intermediate layer is preferably 0.01 to 10% by mass, for example, 2.5 to 10% by mass, 5 to 10% by mass. , And any of 7.5 to 10% by mass, 0.01 to 7.5% by mass, 0.01 to 5% by mass, and 0.01 to 2.5% by mass. It may be 2.5 to 7.5% by mass.
  • the solvent contained in the composition for forming an intermediate layer is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; methanol, ethanol, 2-propanol and isobutyl alcohol (2-methylpropan-1). -All), alcohols such as 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond) and the like. ..
  • the solvent contained in the intermediate layer forming composition may be only one kind, two or more kinds, and when two or more kinds, the combination and the ratio thereof can be arbitrarily selected.
  • the solvent contained in the intermediate layer forming composition is preferably tetrahydrofuran or the like from the viewpoint that the components contained in the intermediate layer forming composition can be mixed more uniformly.
  • the content of the solvent in the composition for forming the intermediate layer is not particularly limited, and may be appropriately selected depending on the type of the component other than the solvent, for example.
  • preferred intermediate layers are, for example, the ethylene-vinyl acetate copolymer, which is a non-silicon resin, and the additive, in that a semiconductor chip with a film-like adhesive can be picked up more easily.
  • the ratio of the content of the ethylene-vinyl acetate copolymer (the non-silicon resin) to the total mass of the intermediate layer in the intermediate layer containing the siloxane compound is in any of the above numerical ranges.
  • the ratio of the content of the siloxane-based compound (the additive) to the total mass of the intermediate layer in the intermediate layer is in any of the above-mentioned numerical ranges.
  • such an intermediate layer contains the ethylene-vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and is based on the total mass of the intermediate layer in the intermediate layer.
  • the content ratio of the ethylene-vinyl acetate copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane-based compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 99.99% by mass.
  • the one which is 10 mass% is mentioned.
  • this is an example of a preferred intermediate layer.
  • the intermediate layer contains the ethylene vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and the ethylene vinyl acetate copolymer is contained.
  • the ratio of the mass of the structural unit derived from vinyl acetate in other words, the content of the structural unit derived from vinyl acetate
  • the ratio of the content of the ethylene-vinyl acetate copolymer to the total mass of the intermediate layer is 90 to 99.99 mass%
  • the said Examples thereof include those in which the content ratio of the siloxane-based compound is 0.01 to 10% by mass.
  • this is an example of a more preferred intermediate layer.
  • X-ray Photoelectron Spectroscopy (X-ray Photoelectron Spectroscopy, the present specification) is used for the surface of the intermediate layer on the film-like adhesive side (for example, the first surface 13a of the intermediate layer 13 in FIG. 1).
  • ratio of silicon concentration Is preferably 1 to 20% on a molar basis of the element.
  • the ratio of the silicon concentration is calculated by the following formula: [Measured value of silicon concentration in XPS analysis (atomic%)] / ⁇ [Measured value of carbon concentration in XPS analysis (atomic%)] + [Measured value of oxygen concentration in XPS analysis (atomic%)) ] + [Measured value of nitrogen concentration in XPS analysis (atomic%)] + [Measured value of silicon concentration in XPS analysis (atomic%)] ⁇ x 100
  • XPS analysis is performed on the surface of the intermediate layer on the film-like adhesive side using an X-ray photoelectron spectroscopy analyzer (for example, "Quantra SXM” manufactured by ULVAC, Inc.) at an irradiation angle of 45 ° and an X-ray beam diameter of 20 ⁇ m ⁇ . This can be done under the condition of an output of 4.5 W.
  • an X-ray photoelectron spectroscopy analyzer for example, "Quantra SXM” manufactured by ULVAC, Inc.
  • the ratio of the silicon concentration may be, for example, any of 4 to 20%, 8 to 20%, and 12 to 20% on a molar basis of the element. However, it may be any one of 1 to 16%, 1 to 12%, and 1 to 8%, and may be any of 4 to 16% and 8 to 12%.
  • the intermediate layer may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other.
  • the combination of these plurality of layers is not particularly limited.
  • the maximum width of the intermediate layer is preferably smaller than the maximum width of the pressure-sensitive adhesive layer and the maximum width of the base material.
  • the maximum value of the width of the intermediate layer can be appropriately selected in consideration of the size of the semiconductor wafer.
  • the maximum width of the intermediate layer may be 150 to 160 mm, 200 to 210 mm, or 300 to 310 mm. These three numerical ranges correspond to a semiconductor wafer having a maximum width of 150 mm, a semiconductor wafer of 200 mm, or a semiconductor wafer having a width of 300 mm in a direction parallel to the attachment surface with a sheet for manufacturing a semiconductor device. doing.
  • the "width of the intermediate layer” means, for example, “the width of the intermediate layer in a direction parallel to the first surface of the intermediate layer".
  • the maximum width of the intermediate layer is the diameter of the circular shape.
  • semiconductor wafer width means "the width of the semiconductor wafer in a direction parallel to the attachment surface of the semiconductor wafer to the semiconductor device manufacturing sheet".
  • the maximum width of the above-mentioned semiconductor wafer is the diameter of the circular shape.
  • the maximum value of the width of the intermediate layer of 150 to 160 mm means that it is equal to or larger than the maximum value of the width of the semiconductor wafer of 150 mm within a range not exceeding 10 mm.
  • the maximum width of the intermediate layer of 200 to 210 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 200 mm within a range not exceeding 10 mm.
  • the maximum width of the intermediate layer of 300 to 310 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 300 mm within a range not exceeding 10 mm.
  • the difference between the maximum value of the width of the intermediate layer and the maximum value of the width of the semiconductor wafer is, for example, whether the maximum value of the width of the semiconductor wafer is 150 mm, 200 mm, or 300 mm. Also, it may be 0 to 10 mm.
  • the thickness of the intermediate layer can be appropriately selected depending on the intended purpose, but is preferably 5 to 150 ⁇ m, more preferably 5 to 120 ⁇ m, and is, for example, 10 to 90 ⁇ m or 10 to 60 ⁇ m. It may be either 30 to 120 ⁇ m and 60 to 120 ⁇ m.
  • the thickness of the intermediate layer is equal to or greater than the lower limit, the structure of the intermediate layer is more stabilized.
  • the thickness of the intermediate layer is not more than the upper limit value, the film-like adhesive can be cut more easily at the time of blade dicing and at the time of the expansion of the semiconductor device manufacturing sheet.
  • the "thickness of the intermediate layer” means the thickness of the entire intermediate layer, and for example, the thickness of the intermediate layer composed of a plurality of layers is the total thickness of all the layers constituting the intermediate layer. means.
  • the intermediate layer contains the silicon-based resin, particularly when the compatibility between the silicon-based resin and the non-silicon-based resin which is the main component is low, in the sheet for manufacturing a semiconductor device, the intermediate layer is contained.
  • the silicon-based resin tends to be unevenly distributed on both sides of the intermediate layer (the first surface and the surface opposite to the first surface) and the region in the vicinity thereof. The stronger this tendency, the easier it is for the film-like adhesive adjacent to (directly in contact with) the intermediate layer to peel off from the intermediate layer, and as will be described later, the semiconductor chip with the film-like adhesive is used. It can be picked up more easily.
  • these intermediate layers are silicon-based with respect to the total mass of the intermediate layers.
  • the proportions (mass%) of the resin content are the same as each other.
  • the content (parts by mass) of the silicon-based resin in the intermediate layer is higher in the thick intermediate layer than in the thin intermediate layer. Therefore, when the silicon-based resin is likely to be unevenly distributed in the intermediate layer as described above, the thick intermediate layer is more double-sided (the first surface and the opposite side) than the thin intermediate layer. The amount of silicon-based resin unevenly distributed in the surface) and the region in the vicinity thereof increases.
  • the semiconductor chip with a film-like adhesive it is possible to adjust the pickup suitability of the semiconductor chip with a film-like adhesive by adjusting the thickness of the intermediate layer in the semiconductor device manufacturing sheet without changing the ratio. For example, by increasing the thickness of the intermediate layer in the semiconductor device manufacturing sheet, the semiconductor chip with a film-like adhesive can be picked up more easily.
  • the intermediate layer can be formed by using an adhesive composition containing the constituent material.
  • the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary.
  • the coating of the intermediate layer forming composition can be carried out in the same manner as in the case of the above-mentioned coating of the pressure-sensitive adhesive composition.
  • the drying conditions of the composition for forming the intermediate layer are not particularly limited.
  • the composition for forming an intermediate layer contains the solvent, it is preferably dried by heating. In this case, for example, it is preferably dried at 60 to 130 ° C. for 1 to 6 minutes.
  • the film-like adhesive preferably has curability and thermosetting property, and preferably has pressure-sensitive adhesive property.
  • the film-like adhesive having both thermosetting property and pressure-sensitive adhesive property can be attached by lightly pressing against various adherends in an uncured state. Further, the film-like adhesive may be one that can be attached to various adherends by heating and softening.
  • the film-like adhesive eventually becomes a cured product having high impact resistance by curing, and this cured product can retain sufficient adhesive properties even under severe high temperature and high humidity conditions.
  • the area of the base material (that is, the area of the first surface) is close to the area of the semiconductor wafer before division (that is, the area of the first surface). That is, it is preferable that the area is set smaller than the area of the first surface) and the area of the pressure-sensitive adhesive layer (that is, the area of the first surface).
  • a region that is, the non-laminated region
  • the sheet for manufacturing a semiconductor device can be expanded more easily, and the force applied to the film-like adhesive at the time of expansion is not dispersed, so that the film-like adhesive can be cut more easily.
  • the film-like adhesive can be formed by using an adhesive composition containing the constituent material.
  • the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary.
  • the coating of the adhesive composition can be performed by the same method as in the case of coating the adhesive composition described above.
  • the drying conditions of the adhesive composition are not particularly limited.
  • the adhesive composition contains a solvent described later, it is preferably dried by heating. In this case, for example, it is preferably dried at 70 to 130 ° C. for 10 seconds to 5 minutes.
  • the film-like adhesive may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers are the same as each other. However, they may be different, and the combination of these multiple layers is not particularly limited.
  • the maximum width of the film-like adhesive is preferably smaller than the maximum width of the pressure-sensitive adhesive layer and the maximum width of the base material.
  • the maximum width of the film-like adhesive may be the same as the maximum width of the intermediate layer described above with respect to the size of the semiconductor wafer. That is, the maximum width of the film-like adhesive can be appropriately selected in consideration of the size of the semiconductor wafer.
  • the maximum width of the film-like adhesive may be 150 to 160 mm, 200 to 210 mm, or 300 to 310 mm.
  • These three numerical ranges correspond to a semiconductor wafer having a maximum width of 150 mm, a semiconductor wafer of 200 mm, or a semiconductor wafer having a width of 300 mm in a direction parallel to the attachment surface with a sheet for manufacturing a semiconductor device. doing.
  • the "width of the film-like adhesive” means, for example, "the width of the film-like adhesive in a direction parallel to the first surface of the film-like adhesive”. means.
  • the maximum width of the film-like adhesive described above is the diameter of the circle having a planar shape.
  • the "width of the film-like adhesive” is not the width of the film-like adhesive after cutting in the process of manufacturing a semiconductor chip with a film-like adhesive, which will be described later, but “before cutting (not yet). Width of film-like adhesive (cut) "means.
  • the maximum width of the film-like adhesive of 150 to 160 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 150 mm within a range not exceeding 10 mm.
  • the maximum width of the film-like adhesive of 200 to 210 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 200 mm within a range not exceeding 10 mm.
  • the maximum width of the film-like adhesive of 300 to 310 mm means that it is equal to or large in the range not exceeding 10 mm with respect to the maximum width of the semiconductor wafer of 300 mm.
  • the difference between the maximum width of the film-like adhesive and the maximum width of the semiconductor wafer is, for example, when the maximum width of the semiconductor wafer is 150 mm, 200 mm, or 300 mm. Even if there is, it may be 0 to 10 mm.
  • the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive may both be in any of the above-mentioned numerical ranges. That is, as an example of the semiconductor device manufacturing sheet of the present embodiment, the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive are both 150 to 160 mm, 200 to 210 mm, or 300 to 300. The one which is 310 mm is mentioned.
  • the thickness of the film-like adhesive is not particularly limited, but is preferably 1 to 30 ⁇ m, more preferably 2 to 20 ⁇ m, and particularly preferably 3 to 10 ⁇ m.
  • the thickness of the film-like adhesive is at least the above lower limit value, a higher adhesive force to the adherend (semiconductor chip) can be obtained.
  • the thickness of the film-shaped adhesive is not more than the upper limit value, the film-shaped adhesive can be cut more easily at the time of blade dicing and at the time of expanding the sheet for manufacturing a semiconductor device.
  • the "thickness of the film-like adhesive” means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers is all that constitute the film-like adhesive. Means the total thickness of the layers of.
  • the intermediate layer and the film-like adhesive preferably have an area in which the first surface of the intermediate layer has an area equal to or larger than the first surface of the film-like adhesive, and may have the same shape as each other, and the intermediate layer and the film may have the same shape. It is preferable that the shape adhesives are laminated so that the outer circumferences of their plan views match.
  • the following adhesive composition can contain, for example, one or more of the following components so that the total content (% by mass) does not exceed 100% by mass. Next, the adhesive composition will be described.
  • Adhesive compositions include, for example, those containing a polymer component (a) and a thermosetting component (b). Hereinafter, each component will be described.
  • the adhesive composition shown below is an example of a preferable one, and the adhesive composition in the present embodiment is not limited to the one shown below.
  • the polymer component (a) is a component that can be regarded as being formed by a polymerization reaction of a polymerizable compound, and imparts film-forming property, flexibility, etc. to the film-like adhesive and is attached to an object to be adhered to a semiconductor chip or the like. It is a polymer compound for improving adhesiveness (in other words, adhesiveness).
  • the polymer component (a) has thermoplasticity and does not have thermosetting property.
  • the polymer component (a) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
  • polymer component (a) examples include acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin and the like.
  • the polymer component (a) is preferably an acrylic resin.
  • the ratio of the content of the polymer component (a) to the total content of all the components other than the solvent is preferably 20 to 75% by mass, more preferably 30 to 65% by mass.
  • thermosetting component (b) has thermosetting property and is a component for thermosetting the film-like adhesive.
  • the thermosetting component (b) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof when two or more types are used. And the ratio can be selected arbitrarily.
  • thermosetting component (b) examples include epoxy-based thermosetting resins, polyimide resins, unsaturated polyester resins, and the like.
  • thermosetting component (b) is preferably an epoxy-based thermosetting resin.
  • Epoxy-based thermosetting resin is composed of an epoxy resin (b1) and a thermosetting agent (b2).
  • the epoxy-based thermosetting resin contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types. The ratio can be selected arbitrarily.
  • epoxy resin (b1) examples include known ones, such as polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, and the like.
  • Biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin, and other bifunctional or higher functional epoxy compounds can be mentioned.
  • an epoxy resin having an unsaturated hydrocarbon group may be used as the epoxy resin (b1).
  • Epoxy resins having unsaturated hydrocarbon groups have higher compatibility with acrylic resins than epoxy resins having no unsaturated hydrocarbon groups. Therefore, by using an epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using the film-like adhesive is improved.
  • the epoxy resin (b1) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
  • thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1).
  • thermosetting agent (b2) include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule.
  • the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group is annealed, and the like, and the phenolic hydroxyl group, an amino group, or an acid group is annealed. It is preferably a group, more preferably a phenolic hydroxyl group or an amino group.
  • examples of the phenol-based curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolak-type phenol resins, dicyclopentadiene-type phenol resins, and aralkyl-type phenol resins. ..
  • examples of the thermosetting agents (b2) examples of the amine-based curing agent having an amino group include dicyandiamide (DICY) and the like.
  • thermosetting agent (b2) may have an unsaturated hydrocarbon group.
  • thermosetting agent (b2) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types.
  • the ratio can be selected arbitrarily.
  • the content of the heat-curing agent (b2) is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of the content of the epoxy resin (b1). It is more preferably 1 to 200 parts by mass, and may be, for example, 1 to 100 parts by mass, 1 to 50 parts by mass, or 1 to 25 parts by mass.
  • the content of the thermosetting agent (b2) is at least the lower limit value, the curing of the film-like adhesive becomes easier to proceed.
  • the content of the thermosetting agent (b2) is not more than the upper limit value, the hygroscopicity of the film-like adhesive is reduced, and the reliability of the package obtained by using the film-like adhesive is further improved. ..
  • the content of the thermosetting component (b) (for example, the total content of the epoxy resin (b1) and the thermosetting agent (b2)) is the content of the polymer component (a).
  • the content is preferably 5 to 100 parts by mass, more preferably 5 to 75 parts by mass, particularly preferably 5 to 50 parts by mass, and for example, 5 to 35 parts by mass with respect to 100 parts by mass. It may be any of parts and 5 to 20 parts by mass.
  • the adhesive composition and the film-like adhesive correspond to these in addition to the polymer component (a) and the thermosetting component (b), if necessary, in order to improve various physical properties of the film-like adhesive. May contain other ingredients that do not.
  • Other components contained in the adhesive composition and the film-like adhesive are preferably, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a cross-linking agent (f), and energy. Examples thereof include a linear curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i).
  • the curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition.
  • Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole.
  • 2-Phenyl-4-methylimidazole 2-Phenyl-4,5-dihydroxymethylimidazole, 2-Phenyl-4-methyl-5-hydroxymethylimidazole and other imidazoles (one or more hydrogen atoms other than hydrogen atoms) (Imidazole substituted with an organic group); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (phosphenyl in which one or more hydrogen atoms are substituted with an organic group); tetraphenylphosphonium tetraphenylborate, triphenylphosphine Examples thereof include tetraphenylborone salts such as tetraphenylborate.
  • the curing accelerator (c) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
  • the content of the curing accelerator (c) in the adhesive composition and the film-like adhesive is 0 with respect to 100 parts by mass of the content of the thermosetting component (b). It is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass.
  • the content of the curing accelerator (c) is at least the lower limit value, the effect of using the curing accelerator (c) can be obtained more remarkably.
  • the content of the curing accelerator (c) is not more than the above upper limit value, for example, the highly polar curing accelerator (c) is attached to the adherend in the film-like adhesive under high temperature and high humidity conditions. The effect of suppressing segregation by moving to the bonding interface side is enhanced, and the reliability of the package obtained by using the film-like adhesive is further improved.
  • the film-like adhesive By containing the filler (d), the film-like adhesive further improves its cutting property by expanding. Further, since the film-like adhesive contains the filler (d), it becomes easy to adjust the thermal expansion coefficient, and by optimizing this thermal expansion coefficient with respect to the object to which the film-like adhesive is attached. , The reliability of the package obtained by using the film-like adhesive is further improved. Further, when the film-like adhesive contains the filler (d), it is possible to reduce the hygroscopicity of the film-like adhesive after curing and improve the heat dissipation.
  • the filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
  • Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride and the like; spherical beads of these inorganic fillers; surface modification of these inorganic fillers. Goods; Single crystal fibers of these inorganic fillers; Glass fibers and the like.
  • the inorganic filler is preferably silica or alumina.
  • the filler (d) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
  • the ratio of the content of the filler (d) to the total content of all the components other than the solvent in the adhesive composition is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and particularly preferably 20 to 60% by mass. preferable. When the ratio is in such a range, the effect of using the filler (d) can be obtained more remarkably.
  • the coupling agent (e) By containing the coupling agent (e) in the film-like adhesive, the adhesiveness and adhesion to the adherend are improved. Further, when the film-like adhesive contains the coupling agent (e), the cured product has improved water resistance without impairing heat resistance.
  • the coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.
  • the coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional groups of the polymer component (a), the thermosetting component (b) and the like, and is preferably a silane coupling agent. More preferred.
  • the coupling agent (e) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types.
  • the ratio can be selected arbitrarily.
  • the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is the total content of the polymer component (a) and the thermosetting component (b). It is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to 100 parts by mass.
  • the content of the coupling agent (e) is at least the lower limit value, the dispersibility of the filler (d) in the resin is improved, the adhesiveness of the film-like adhesive to the adherend is improved, and the like. , The effect of using the coupling agent (e) is more remarkable.
  • the content of the coupling agent (e) is not more than the upper limit value, the generation of outgas is further suppressed.
  • Cross-linking agent (f) As the polymer component (a), one having a functional group such as a vinyl group capable of binding to another compound, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group, an isocyanate group, etc., such as the above-mentioned acrylic resin, is used.
  • the adhesive composition and the film-like adhesive may contain a cross-linking agent (f).
  • the cross-linking agent (f) is a component for bonding the functional group in the polymer component (a) with another compound to cross-link, and by cross-linking in this way, the initial adhesive force of the film-like adhesive is obtained. And the cohesive force can be adjusted.
  • cross-linking agent (f) examples include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate-based cross-linking agent (a cross-linking agent having a metal chelate structure), an aziridine-based cross-linking agent (a cross-linking agent having an aziridinyl group), and the like. Can be mentioned.
  • the cross-linking agent (f) When an organic multivalent isocyanate compound is used as the cross-linking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a).
  • a hydroxyl group-containing polymer When the cross-linking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the cross-linking structure is simplified into a film-like adhesive by the reaction between the cross-linking agent (f) and the polymer component (a). Can be introduced in.
  • the cross-linking agent (f) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
  • the content of the cross-linking agent (f) in the adhesive composition is 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the polymer component (a). It is preferably 0.1 to 10 parts by mass, and particularly preferably 0.3 to 5 parts by mass.
  • the content of the cross-linking agent (f) is at least the lower limit value, the effect of using the cross-linking agent (f) can be obtained more remarkably.
  • the content of the cross-linking agent (f) is not more than the upper limit value, the excessive use of the cross-linking agent (f) is suppressed.
  • the energy ray-curable resin (g) is obtained from an energy ray-curable compound.
  • the energy ray-curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylate-based compounds having a (meth) acryloyl group are preferable.
  • the energy ray-curable resin (g) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.
  • the ratio of the content of the energy ray-curable resin (g) to the total mass of the adhesive composition in the adhesive composition is 1 to 95% by mass. Is more preferable, 5 to 90% by mass is more preferable, and 10 to 85% by mass is particularly preferable.
  • the photopolymerization initiator (h) is used in order to efficiently proceed with the polymerization reaction of the energy ray-curable resin (g). It may be contained.
  • Examples of the photopolymerization initiator (h) in the adhesive composition include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal.
  • benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal.
  • Acetphenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6) -Trimethylbenzoyl) Acylphosphine oxide compounds such as phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; 1-hydroxycyclohexylphenylketone and the like.
  • ⁇ -Ketol compounds examples include a photosensitizer such as amine.
  • the photopolymerization initiator (h) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
  • the content of the photopolymerization initiator (h) in the adhesive composition is 0.1 with respect to 100 parts by mass of the content of the energy ray-curable resin (g). It is preferably about 20 parts by mass, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass.
  • the general-purpose additive (i) may be a known one, and may be arbitrarily selected depending on the intended purpose, and is not particularly limited, but preferred ones are, for example, a plasticizer, an antistatic agent, an antioxidant, and a colorant (dye). , Pigments), gettering agents and the like.
  • the general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
  • the contents of the adhesive composition and the film-like adhesive are not particularly limited and may be appropriately selected depending on the intended purpose.
  • the adhesive composition preferably further contains a solvent.
  • the adhesive composition containing a solvent has good handleability.
  • the solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
  • the solvent contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.
  • the content of the solvent in the adhesive composition is not particularly limited, and may be appropriately selected depending on the type of component other than the solvent, for example.
  • the adhesive composition is obtained by blending each component for constituting the adhesive composition.
  • the adhesive composition can be produced, for example, by the same method as in the case of the pressure-sensitive adhesive composition described above, except that the types of compounding components are different.
  • the constituent material of the release film is preferably various resins, and examples thereof include those exemplified for the above-mentioned base material, and polyethylene terephthalate (PET) is preferable.
  • PET polyethylene terephthalate
  • the thickness of the release film can be appropriately selected depending on the intended purpose, and may be 10 ⁇ m or more and 200 ⁇ m or less, 20 ⁇ m or more and 150 ⁇ m or less, and 30 ⁇ m or more and 80 ⁇ m or less.
  • the "thickness of the release film” means the thickness of the entire release film, for example, the thickness of the release film composed of a plurality of layers is the total thickness of all the layers constituting the release film. means.
  • the release film contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). You may.
  • the bonding surface of the release film with the film-like adhesive is preferably a release-treated surface treated with the release agent.
  • the peeling surface may contain a peeling agent.
  • the release agent include alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based, and silicone-based release agents containing silicone are preferable.
  • the release agent is used as it is without solvent, or after being diluted or emulsified with a solvent, and applied with a gravure coater, a Mayer bar coater, an air knife coater, a roll coater, etc., and peeled.
  • the film coated with the agent is subjected to normal temperature or heating, or cured by an electron beam, or a laminate is formed by wet lamination, dry lamination, heat melting lamination, melt extrusion lamination, coextrusion processing, or the like. The method can be mentioned.
  • the release film 15 described in the above-mentioned semiconductor device manufacturing sheet 101 can be read as the second release film 15 in the method for manufacturing a semiconductor device manufacturing sheet of the embodiment described later.
  • the sheet for manufacturing a semiconductor device can be manufactured by laminating the above-mentioned layers so as to have a corresponding positional relationship.
  • the method of forming each layer is as described above.
  • a base material, an adhesive layer, an intermediate layer and a film-like adhesive are prepared in advance, and these are used as a base material, an adhesive layer, an intermediate layer and a film-like adhesive. It can be manufactured by laminating and laminating in the order of. However, this is an example of a method for manufacturing a sheet for manufacturing a semiconductor device.
  • two or more types of intermediate laminates which are formed by laminating a plurality of layers to form the sheet, are prepared in advance, and the intermediate laminates are bonded to each other. It can also be manufactured.
  • the configuration of the intermediate laminate can be arbitrarily selected as appropriate.
  • a first intermediate laminate having a structure in which a base material and an adhesive layer are laminated (corresponding to the support sheet), and a second intermediate laminate having a structure in which an intermediate layer and a film-like adhesive are laminated.
  • a first intermediate laminate having a structure in which a base material and an adhesive layer are laminated corresponding to the support sheet
  • a second intermediate laminate having a structure in which an intermediate layer and a film-like adhesive are laminated.
  • the adhesive layer in the first intermediate laminate and the intermediate layer in the second intermediate laminate are bonded to each other to produce a sheet for manufacturing a semiconductor device.
  • this is also an example of a method for manufacturing a sheet for manufacturing a semiconductor device.
  • the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive are both the first surface of the pressure-sensitive adhesive layer.
  • a step of processing the intermediate layer and the film-like adhesive into a desired size is performed at any stage of the above-mentioned manufacturing method. , May be added.
  • a semiconductor device is manufactured by additionally performing a step of processing the intermediate layer and the film-like adhesive in the second intermediate laminate to a desired size. Sheets may be manufactured.
  • the area of the first surface of the base material and the area of the first surface of the pressure-sensitive adhesive layer are both larger than the area of the first surface of the release film.
  • an additional step of processing the base material and the pressure-sensitive adhesive layer into a desired size may be performed at any stage of the above-mentioned production method.
  • a sheet for manufacturing a semiconductor device in which a release film is provided on a film-like adhesive
  • a film-like adhesive is produced on the release film, and the remaining layers are formed while maintaining this state.
  • a sheet for manufacturing a semiconductor device may be laminated, or a base material, an adhesive layer, an intermediate layer and a film-like adhesive may all be laminated, and then a release film may be laminated on the film-like adhesive.
  • a sheet for manufacturing a semiconductor device may be manufactured. The release film may be removed at a necessary stage by the time the semiconductor device manufacturing sheet is used.
  • a sheet for manufacturing a semiconductor device provided with another layer other than the base material, the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive and the release film forms this other layer at an appropriate timing in the above-mentioned manufacturing method. It can be manufactured by adding a step of laminating.
  • Each layer of the semiconductor device manufacturing sheet can be processed by, for example, punching to have an arbitrary shape.
  • punching can be performed in a circular shape using a punching blade having a corresponding shape.
  • the following can be exemplified as a method for manufacturing a sheet for manufacturing a semiconductor device according to an embodiment of the present invention.
  • the sheet for manufacturing a semiconductor device includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a second release film, and includes the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the above.
  • the film-like adhesive and the second release film are laminated in this order.
  • a cut portion C is formed at a position corresponding to the outer periphery, and at least a part of the intermediate layer and the film-like adhesive located outside from the cut portion C is removed to remove the second intermediate laminate processed product.
  • the first processing process to obtain The base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are obtained by laminating the first intermediate laminate having the base material and the pressure-sensitive adhesive layer and the processed product of the second intermediate laminate.
  • a cut portion C' is formed at a position corresponding to the outer periphery of the base material and the pressure-sensitive adhesive layer of the semiconductor device manufacturing sheet with respect to the base material and the pressure-sensitive adhesive layer of the second laminate, and the cut portion is formed.
  • a second processing step of removing at least a part of the base material and the pressure-sensitive adhesive layer located on the outside starting from the part C'and obtaining a sheet for manufacturing a semiconductor device is included.
  • the semiconductor device manufacturing sheet of the above embodiment can be manufactured.
  • FIG. 3 is a cross-sectional view schematically showing a method for manufacturing a sheet for manufacturing a semiconductor device according to an embodiment of the invention.
  • the semiconductor device manufacturing sheet shown in FIG. 3 is turned upside down from the semiconductor device manufacturing sheet shown in FIG.
  • the second intermediate laminate 102 shown in FIG. 3A includes a film-like adhesive 14 and an intermediate layer 13, and the first release film 17, the film-like adhesive 14, the intermediate layer 13, and the third release film 16 are in this order. It has a laminated structure. From the surface on the side where the third release film 16 is laminated with respect to the third release film 16, the intermediate layer 13, and the film-like adhesive 14 of the second intermediate laminate 102, the intermediate layer of the sheet 101 for manufacturing a semiconductor device The first punching is performed to form the cut portion C at the position corresponding to the outer periphery of the 13 and the film-like adhesive 14. In punching, the first release film 17 may be cut, and the cut portion C may be formed in the first release film 17.
  • a part of the intermediate layer and the film-like adhesive located outside with the cut portion C as a starting point is removed to obtain a second intermediate laminated body processed product 103 (FIG. 3B).
  • the outside is a position outside the region surrounded by the notch C in a direction parallel to the surface of the film-like adhesive.
  • the third release film 16 is removed from the second intermediate laminate work piece 103 obtained above to expose one surface of the intermediate layer 13. Further, the release film (not shown) is removed from the first intermediate laminate with the release film provided with the base material 11 and the pressure-sensitive adhesive layer 12 provided on one surface of the base material 11, and the pressure-sensitive adhesive is used. One surface of layer 12 is exposed. Next, a laminating step is performed in which the exposed surface of the pressure-sensitive adhesive layer 12 of the first intermediate laminated body 104 and the exposed surface of the intermediate layer 13 of the second intermediate laminated body processed product 103 are bonded together. The first intermediate laminate 104 is laminated so as to cover the intermediate layer 13 and the film-like adhesive 14 of the second intermediate laminate processed product 103. In this way, the first laminate 105 including the first release film 17, the film-like adhesive 14, the intermediate layer 13, the pressure-sensitive adhesive layer 12, and the base material 11 is obtained (FIG. 3C).
  • the first release film 17 of the first laminate 105 obtained above is peeled off and replaced with the second release film 15 to obtain the second laminate 107.
  • the second laminate 107 has a structure in which the second release film 15, the film-like adhesive 14, the intermediate layer 13, the pressure-sensitive adhesive layer 12, and the base material 11 are laminated in this order (FIG. 3D).
  • the newly attached second release film 15 does not have a notch C along the outer periphery of the intermediate layer 13 and the film-like adhesive 14.
  • the base material 11 and the pressure-sensitive adhesive layer 12 of the semiconductor device manufacturing sheet 101 are viewed from the surface on which the base material 11 is laminated with respect to the base material 11 and the pressure-sensitive adhesive layer 12 of the second laminate 107 obtained above.
  • a second punching is performed to form a notch C'at a position corresponding to the outer periphery of the.
  • the cut portion C'of the punched portion here is concentric with the cut portion C and is arranged outside the cut portion C.
  • the second release film 15 may be cut, and the cut portion C'may be formed in the second release film 15.
  • the semiconductor device manufacturing sheet 101 is obtained by removing at least a part of the base material 11 and the pressure-sensitive adhesive layer 12 located outside from the cut portion C'(FIG. 3E).
  • the outside is a position outside the region surrounded by the notch C'in a direction parallel to the surface of the film-like adhesive.
  • the maximum value (that is, the diameter) of the width W 13 of the intermediate layer 13 of the semiconductor device manufacturing sheet 101 and the width W 14 of the film-like adhesive 14 The maximum value (that is, the diameter) of can be made smaller than the maximum value of the width of the pressure-sensitive adhesive layer 12 and the maximum value of the width of the base material 11.
  • an adhesive composition is applied to the peeled surface of the first release film and dried to form a film-like adhesive.
  • a composition for forming an intermediate layer is applied to the peeled surface of the release film and dried to form an intermediate layer, and the exposed surface of the film-like adhesive is bonded to the exposed surface of the intermediate layer.
  • a second intermediate laminate manufacturing step of obtaining a second intermediate laminate with a release film can be further included.
  • a pressure-sensitive adhesive composition is applied to the peeled surface of the release film and dried to form a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is formed.
  • the first intermediate laminate manufacturing step of obtaining the first intermediate laminate by laminating the exposed surface with the base material can be further included.
  • the peeling force between the first release film and the film-like adhesive is higher than the peeling force between the second release film and the film-like adhesive. Is also expensive. That is, in the reattachment step, the first release film is reattached to the second release film 15 having a lower peeling force. By making the peeling force of the first release film higher than the peeling force of the second release film, the film-forming property of the film-like adhesive becomes good at the time of forming the layer of the film-like adhesive.
  • the release film is subjected to a release treatment with a release treatment agent for the purpose of reducing the release force between the adherends and facilitating the release.
  • the film-forming property of the film-like adhesive is inferior. I found that there is. It is considered that this is because a release film having a low release force is likely to cause repelling to the adhesive composition. Therefore, when the film-like adhesive is produced, a uniform film-like adhesive layer can be easily formed by using the first release film having a high peeling force.
  • the release film of the first laminate 105 is reattached.
  • the first intermediate laminate 104 is laminated so as to cover the second intermediate laminate processed product 103. Therefore, there is an advantage that the layer structure of the first laminate 105 does not easily collapse when the reattachment is performed.
  • the sheet for manufacturing a semiconductor device provided with the first release film having a high release force is left as it is, it may be difficult to remove the first release film from the film-like adhesive at the time of use.
  • the release film is usually automated, it is difficult to adjust the conditions for peeling the release film (such as the peeling angle and the peeling speed in the mounter) in the device used for the mounting process, which is a problem. Is likely to occur.
  • the first release film is peeled off and replaced with the second release film 15 having a lower peeling force, whereby a semiconductor device for manufacturing a semiconductor device having a second release film having a lower peeling force is provided.
  • Seats can be provided.
  • the semiconductor manufacturing sheet manufactured through the reattachment process in this way is excellent in mounting process suitability when the semiconductor device manufacturing sheet is used.
  • the peeling force between the adhesive layer and the pressure-sensitive adhesive layer obtained in the following peeling test can be adopted.
  • a single-layer pressure-sensitive adhesive layer having a thickness of 10 ⁇ m is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the first release film and drying the pressure-sensitive adhesive composition.
  • the first test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
  • the pressure-sensitive adhesive layer of the first test piece and the peeled-processed surfaces of the first peeling film form an angle of 180 °.
  • the peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the first peeling film, which is measured by 180 ° peeling of the first peeling film from the agent layer, is determined.
  • the peeling force between the pressure-sensitive adhesive layer and the first release film in the first test piece is preferably more than 180 mN / 50 mm, preferably more than 180 mN / 50 mm and more than 300 mN / 50 mm, and more than 200 mN /.
  • the peeling force of the first release film in the first test piece exceeds or exceeds the above lower limit value, and further preferably 230 mN / 50 mm or more and 270 mN / 50 mm or less.
  • the peeling force of the first release film in the first test piece exceeds or exceeds the above lower limit value, the quality of the film-like adhesive layer formed on the first release film is further improved. It is possible.
  • the peeling force of the first release film in the first test piece is equal to or less than the above upper limit value, the first release film can be easily replaced in the replacement step.
  • a single-layer pressure-sensitive adhesive layer having a thickness of 10 ⁇ m is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the second release film and drying the pressure-sensitive adhesive composition.
  • the second test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
  • the pressure-sensitive adhesive layer of the second test piece and the peeled-processed surfaces of the second peeling film form an angle of 180 °.
  • the peeling force between the pressure-sensitive adhesive layer and the second release film which is measured by 180 ° peeling of the second release film from the agent layer, is determined.
  • the peeling force between the pressure-sensitive adhesive layer and the second release film in the second test piece is preferably 180 mN / 50 mm or less, preferably 100 mN / 50 mm or more and 180 mN / 50 mm or less, and 120 mN / It is more preferably 50 mm or more and 170 mN / 50 mm or less, and further preferably 130 mN / 50 mm or more and 160 mN / 50 mm or less.
  • the length of the test piece to be measured is not particularly limited as long as the peeling force can be stably measured, but it is preferably 100 mm to 300 mm.
  • the peeling force between the first release film and the film-like adhesive and the peeling force between the second release film and the film-like adhesive are also measured by the same method as the above-mentioned peeling test. It is possible.
  • the pressure-sensitive adhesive composition of the test piece is replaced with the adhesive composition, and the pressure-sensitive adhesive layer is replaced with the film-like adhesive to obtain the peeling force between the release film and the film-like adhesive. can.
  • the configurations exemplified in the description of the release film of the above-described embodiment can be adopted, and detailed description of the configuration and constituent materials will be omitted.
  • a commercially available release film can be used, and a release film having a desired release force can be appropriately used. Further, by appropriately adjusting the type and content (for example, silicone content) of the release agent on the release-treated surface, it is possible to produce a first release film and a second release film having a desired release force.
  • the method for manufacturing a semiconductor device manufacturing sheet of the embodiment it is possible to provide a semiconductor device manufacturing sheet provided with a high-quality film-like adhesive and excellent in mounting process suitability.
  • the sheet for manufacturing a semiconductor device can be used in the manufacturing process of a semiconductor device when manufacturing a semiconductor chip with a film-like adhesive.
  • a semiconductor wafer or a semiconductor chip is laminated on the side of the film-like adhesive of the semiconductor device manufacturing sheet of the embodiment to obtain a laminate.
  • a semiconductor with a film-like adhesive which comprises a step of cutting the film-like adhesive or the semiconductor wafer and the film-like adhesive along the outer periphery of the semiconductor chip to obtain a semiconductor chip with the film-like adhesive.
  • a method for manufacturing a chip is provided.
  • the back surface of the semiconductor wafer is attached to the exposed surface of the film-like adhesive of a sheet for manufacturing a semiconductor device, and the base material, the pressure-sensitive adhesive layer, and the intermediate are attached.
  • the process includes a step of pulling the semiconductor chip with a film-like adhesive from the base material, the pressure-sensitive adhesive layer, and the intermediate layer and picking them up.
  • FIG. 4 is a cross-sectional view for schematically explaining an example of how to use the semiconductor device manufacturing sheet, and shows a case where the semiconductor device manufacturing sheet is used after being attached to a semiconductor wafer.
  • a semiconductor device manufacturing sheet is used as a dicing die bonding sheet.
  • the semiconductor device manufacturing sheet 101 shown in FIG. 1 will be taken as an example, and a method of using the sheet 101 will be described.
  • Reference numeral 9a' indicates a circuit forming surface of the semiconductor wafer 9'.
  • the heating temperature at the time of sticking the semiconductor device manufacturing sheet 101 is not particularly limited, but is preferably 40 to 70 ° C. from the viewpoint of further improving the heating sticking stability of the semiconductor device manufacturing sheet 101.
  • the laminate of the semiconductor device manufacturing sheet 101 and the semiconductor wafer 9'obtained above is cut with a blade from the circuit forming surface 9a'side of the semiconductor wafer 9'(blade dicing is performed) to form a semiconductor.
  • the wafer 9' is divided and the film-like adhesive 14 is cut.
  • Blade dicing can be performed by a known method.
  • a region (the non-laminated region) near the peripheral edge portion where the intermediate layer 13 and the film-like adhesive 14 are not laminated is set as a ring.
  • the semiconductor wafer 9' can be divided and the film-like adhesive 14 can be cut by using a blade.
  • a plurality of semiconductor chips 914 with a film-like adhesive provided with the semiconductor chip 9 and the film-like adhesive 140 after cutting provided on the back surface 9b thereof are obtained. Be done.
  • the semiconductor chips 914 with a film-like adhesive are aligned and fixed on the intermediate layer 13 in the laminated sheet 10, and constitute the semiconductor chip group 910 with a film-like adhesive.
  • the back surface 9b of the semiconductor chip 9 corresponds to the back surface 9b'of the semiconductor wafer 9'.
  • reference numeral 9a indicates a circuit forming surface of the semiconductor chip 9, and corresponds to the circuit forming surface 9a'of the semiconductor wafer 9'.
  • the semiconductor wafer 9' is divided by cutting the entire area in the thickness direction by the blade, and the semiconductor device manufacturing sheet 101 is divided into an intermediate layer from the first surface 14a of the film-like adhesive 14. It is preferable that the film-like adhesive 14 is cut over the entire area in the thickness direction by cutting up to the region in the middle of 13, and the pressure-sensitive adhesive layer 12 is not cut. That is, at the time of blade dicing, a laminate of the semiconductor device manufacturing sheet 101 and the semiconductor wafer 9'is formed by the blade from the circuit forming surface 9a'of the semiconductor wafer 9'in at least the intermediate layer 13th. It is preferable that the cut is made to the first surface 13a and not to the surface of the intermediate layer 13 opposite to the first surface 13a (that is, the contact surface with the pressure-sensitive adhesive layer 12).
  • the main component of the intermediate layer 13 cut by the blade is a non-silicon resin having a weight average molecular weight of 100,000 or less, and in particular, cutting chips from the intermediate layer 13 due to the weight average molecular weight of 100,000 or less. Can also be suppressed.
  • the conditions for blade dicing may be appropriately adjusted according to the intended purpose, and are not particularly limited.
  • the rotation speed of the blade is preferably 15,000 to 50,000 rpm, and the moving speed of the blade is preferably 5 to 75 mm / sec.
  • the semiconductor chip 914 with the film-like adhesive is separated from the intermediate layer 13 in the laminated sheet 10 and picked up.
  • a case is shown in which the semiconductor chip 914 with a film-like adhesive is pulled away in the direction of arrow P by using a pulling means 7 such as a vacuum collet.
  • the pulling means 7 is not displayed in cross section.
  • the semiconductor chip 914 with a film-like adhesive can be picked up by a known method.
  • the intermediate layer 13 contains, for example, the ethylene vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and the ethylene vinyl acetate with respect to the total mass of the intermediate layer in the intermediate layer.
  • the ratio of the content of the copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 10% by mass.
  • the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
  • a film-like structure including, for example, a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip.
  • a method for manufacturing semiconductor chips with adhesive The sheet for manufacturing a semiconductor device includes the base material, an adhesive layer, an intermediate layer, and a film-like adhesive.
  • the manufacturing method includes a step of attaching a film-like adhesive therein to the back surface of the semiconductor wafer while heating the semiconductor device manufacturing sheet, and the semiconductor wafer to which the film-like adhesive is attached.
  • a semiconductor chip is manufactured by cutting and dividing the entire area in the thickness direction from the circuit forming surface side, and the sheet for manufacturing the semiconductor device is formed from the film-like adhesive side in the thickness direction.
  • the plurality of semiconductor chips with the film-like adhesive can be formed in the middle. It has a step of obtaining a group of semiconductor chips with a film-like adhesive aligned on a layer, and a step of pulling the semiconductor chip with a film-like adhesive from the intermediate layer and picking it up (in the present specification). May be referred to as "manufacturing method 1").
  • a back surface of a group of semiconductor chips in which a plurality of the semiconductor chips are aligned is formed on an exposed surface of the film-like adhesive of a semiconductor device manufacturing sheet.
  • a step of cutting the film-like adhesive to obtain a semiconductor chip with the film-like adhesive includes a step of pulling the semiconductor chip with a film-like adhesive from the base material, the pressure-sensitive adhesive layer, and the intermediate layer and picking them up.
  • FIG. 5 is a cross-sectional view for schematically explaining an example of a method for manufacturing a semiconductor chip, which is a target for using a sheet for manufacturing a semiconductor device, and dicing is performed with formation of a modified layer on a semiconductor wafer. The case where a semiconductor chip is manufactured is shown.
  • FIG. 6 is a cross-sectional view for schematically explaining another example of how to use the semiconductor device manufacturing sheet, and shows a case where the semiconductor device manufacturing sheet is used after being attached to a semiconductor chip. .. In this method, a semiconductor device manufacturing sheet is used as a die bonding sheet.
  • the semiconductor device manufacturing sheet 101 shown in FIG. 1 will be taken as an example, and a method of using the sheet 101 will be described.
  • a semiconductor wafer 9' is prepared, and a back grind tape (sometimes referred to as "surface protection tape") is provided on the circuit forming surface 9a'.
  • a back grind tape (sometimes referred to as "surface protection tape") is provided on the circuit forming surface 9a'.
  • Attach 8 In FIG. 5, reference numeral W 9 ', the semiconductor wafer 9' indicates the width of the.
  • the modified layer 90' is inside the semiconductor wafer 9'as shown in FIG. 5B.
  • the laser beam irradiates the semiconductor wafer 9'from the back surface 9b' side of the semiconductor wafer 9'.
  • the focal position at this time is the planned division (dicing) position of the semiconductor wafer 9', and is set so that the desired size, shape, and number of semiconductor chips can be obtained from the semiconductor wafer 9'.
  • the back surface 9b'of the semiconductor wafer 9' is ground using a grinder (not shown).
  • the thickness of the semiconductor wafer 9' is adjusted to the desired value, and by utilizing the grinding force applied to the semiconductor wafer 9'at this time, the thickness of the modified layer 90'is formed at the site where the modified layer 90'is formed.
  • the semiconductor wafer 9' is divided to produce a plurality of semiconductor chips 9 as shown in FIG. 5C.
  • the modified layer 90'of the semiconductor wafer 9' has been altered by irradiation with laser light, and its strength is weakened. Therefore, by applying a force to the semiconductor wafer 9'on which the modified layer 90'is formed, the force is applied to the modified layer 90', and the semiconductor wafer 9'is cracked at the portion of the modified layer 90', and the semiconductor wafer 9'is cracked. A plurality of semiconductor chips 9 can be obtained.
  • the semiconductor chip 9 to be used for the semiconductor device manufacturing sheet 101 can be obtained. More specifically, by this step, a semiconductor chip group 901 in a state in which a plurality of semiconductor chips 9 are aligned and fixed on the back grind tape 8 is obtained.
  • a planar shape formed by connecting the outermost parts of the semiconductor chip group 901 (in the present specification, such a planar shape is simply referred to as "semiconductor".
  • the planar shape of the chip group is exactly the same as the planar shape when the semiconductor wafer 9'is similarly viewed in a planar view, or the differences between these planar shapes are negligible. It can be said that the planar shape of the semiconductor chip group 901 is substantially the same as the planar shape of the semiconductor wafer 9'. Therefore, the width of the planar shape of the semiconductor chip group 901, as shown in FIG. 5C, ⁇ cause appears to be the same as 'the width W 9 of' the semiconductor wafer 9. Then, the maximum value of the width of the planar shape of the semiconductor chip group 901, ⁇ causes appear to be the same as the maximum value of the 'width W 9 of' the semiconductor wafer 9.
  • the semiconductor chip 9 can be manufactured from the semiconductor wafer 9'as intended is shown, but depending on the conditions at the time of grinding the back surface 9b'of the semiconductor wafer 9', a part of the semiconductor wafer 9'. In this region, the semiconductor chip 9 may not be divided.
  • the semiconductor chip 9 (semiconductor chip group 901) obtained above is used to manufacture a semiconductor chip with a film-like adhesive.
  • the film-like adhesive 14 in the sheet is applied to all the sheets in the semiconductor chip group 901. It is attached to the back surface 9b of the semiconductor chip 9.
  • the target of the film-like adhesive 14 at this time may be a semiconductor wafer that is not completely divided.
  • the maximum value of the width W 13 of the intermediate layer 13 and the maximum value of the width W 14 of the film-like adhesive 14 in the semiconductor device manufacturing sheet 101 are both the width W 9'of the semiconductor wafer 9' (in other words, the width W 9'(in other words,). It is exactly the same as or not the same as the maximum value of the semiconductor chip group 901), but the error is slight and almost the same.
  • the film-like adhesive 14 (semiconductor device manufacturing sheet 101) is attached to the semiconductor chip group 901 according to the manufacturing method 1 except that the semiconductor chip group 901 is used instead of the semiconductor wafer 9'. It can be carried out in the same manner as in the case of attaching the film-like adhesive 14 (semiconductor device manufacturing sheet 101) to the semiconductor wafer 9'.
  • the back grind tape 8 is removed from the semiconductor chip group 901 in the fixed state.
  • the semiconductor device manufacturing sheet 101 is expanded while being cooled by stretching it in a direction parallel to its surface (for example, the first surface 12a of the pressure-sensitive adhesive layer 12).
  • an expanding direction of the semiconductor device producing sheet 101 in the arrow E 1. By expanding in this way, the film-like adhesive 14 is cut along the outer circumference of the semiconductor chip 9.
  • a plurality of semiconductor chips 914 with a film-like adhesive including the semiconductor chip 9 and the film-like adhesive 140 after cutting provided on the back surface 9b thereof are obtained.
  • the semiconductor chips 914 with a film-like adhesive are aligned and fixed on the intermediate layer 13 in the laminated sheet 10, and constitute the semiconductor chip group 910 with a film-like adhesive.
  • the semiconductor chip 914 with a film-like adhesive and the semiconductor chip group 910 with a film-like adhesive obtained here are both the semiconductor chip 914 with a film-like adhesive and the film-like adhesive obtained by the manufacturing method 1 described above. It is substantially the same as the agent-containing semiconductor chip group 910.
  • this region can be obtained by performing this step. It is divided into semiconductor chips.
  • the semiconductor device manufacturing sheet 101 is preferably expanded at a temperature of ⁇ 5 to 5 ° C. By cooling and expanding the semiconductor device manufacturing sheet 101 in this way (performing cool expansion), the film-like adhesive 14 can be cut more easily and with high accuracy.
  • the expansion of the semiconductor device manufacturing sheet 101 can be performed by a known method.
  • a region (the non-laminated region) near the peripheral edge portion where the intermediate layer 13 and the film-like adhesive 14 are not laminated is set as a ring.
  • a jig such as a frame
  • the entire region where the intermediate layer 13 and the film-like adhesive 14 of the semiconductor device manufacturing sheet 101 are laminated is directed from the base material 11 to the pressure-sensitive adhesive layer 12.
  • the semiconductor device manufacturing sheet 101 can be expanded.
  • the non-laminated region in which the intermediate layer 13 and the film-like adhesive 14 are not laminated is substantially parallel to the first surface 13a of the intermediate layer 13.
  • the non-laminated region is different from the above-mentioned pushing direction as it approaches the outer periphery of the pressure-sensitive adhesive layer 12. Includes an inclined surface whose height descends in the opposite direction.
  • the semiconductor device manufacturing sheet 101 is provided with the intermediate layer 13 (in other words, the film-like adhesive 14 before cutting is provided on the intermediate layer 13), so that the film-like adhesive 14 is formed. It can be accurately cut at a target location (in other words, along the outer periphery of the semiconductor chip 9), and cutting defects can be suppressed.
  • the semiconductor chip 914 with the film-like adhesive is separated from the intermediate layer 13 in the laminated sheet 10 and picked up.
  • the pickup at this time can be performed by the same method as the pickup in the manufacturing method 1 described above, and the pickup suitability is also the same as the pickup suitability in the manufacturing method 1.
  • the intermediate layer 13 contains, for example, the ethylene-vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and is ethylene with respect to the total mass of the intermediate layer in the intermediate layer.
  • the ratio of the content of the vinyl acetate copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 10% by mass.
  • the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
  • a film-like structure including, for example, a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip.
  • a method for manufacturing semiconductor chips with adhesive includes the base material, an adhesive layer, an intermediate layer, and a film-like adhesive.
  • the manufacturing method includes a step of forming a modified layer inside the semiconductor wafer by irradiating a laser beam so as to focus on a focal point set inside the semiconductor wafer, and after forming the modified layer.
  • the semiconductor wafer is divided at the formation site of the modified layer, and a plurality of semiconductor chips are aligned.
  • the film-like adhesive is cut along the outer periphery of the semiconductor chip by stretching the sheet for manufacturing the semiconductor device after being attached to the semiconductor chip in a direction parallel to the surface thereof while cooling.
  • the usage method has been described by taking the semiconductor device manufacturing sheet 101 shown in FIG. 1 as an example, but other semiconductors according to the present embodiment have been described.
  • the device manufacturing sheet can be used in the same manner. In that case, if necessary, based on the difference in configuration between the semiconductor device manufacturing sheet and the semiconductor device manufacturing sheet 101, other steps are appropriately added to use the semiconductor device manufacturing sheet. You may.
  • the laminated sheet is subjected to the pressure-sensitive adhesive.
  • the semiconductor chip with a film-like adhesive (film-like adhesive) among the laminated sheets is expanded in a direction parallel to the surface (first surface) of the layer on the intermediate layer side, and while maintaining this state.
  • the peripheral portion on which the attached semiconductor chip group) is not mounted may be heated. By doing so, the distance between adjacent semiconductor chips, that is, the calf width can be maintained with sufficiently wide and high uniformity on the laminated sheet while shrinking the peripheral edge portion. Then, the semiconductor chip with the film-like adhesive can be picked up more easily.
  • Example 1 ⁇ Manufacturing of Sheets for Manufacturing Semiconductor Devices >> ⁇ Manufacturing of base material>
  • LDPE low-density polyethylene
  • T-die method By melting low-density polyethylene (LDPE, "Sumikasen L705" manufactured by Sumitomo Chemical Co., Ltd.) using an extruder, extruding the melt by the T-die method, and stretching the extruded product in two shafts using a cooling roll.
  • a substrate made of LDPE was obtained.
  • An energy ray-curable pressure-sensitive adhesive composition was produced.
  • the pressure-sensitive adhesive composition obtained above is applied to the release-treated surface and dried by heating at 100 ° C. for 2 minutes to obtain a non-energy ray-curable pressure-sensitive adhesive.
  • An agent layer (thickness 20 ⁇ m) was prepared.
  • the above-mentioned composition for forming an intermediate layer is applied to the release-treated surface, and the mixture is heat-dried at 70 ° C. for 5 minutes to obtain an intermediate layer (thickness 20 ⁇ m). Was produced.
  • thermosetting adhesive composition containing (75 parts by mass), a coupling agent (e) -1 (0.5 parts by mass), and a cross-linking agent (f) -1 (0.5 parts by mass) is produced. bottom.
  • the adhesive composition obtained above is applied to the release-treated surface, and heat-dried at 80 ° C. for 2 minutes to heat.
  • a curable film-like adhesive (thickness 7 ⁇ m) was prepared.
  • the second intermediate laminate with the release film is punched from the light release film on the intermediate layer side to the film-like adhesive using a cutting blade to remove unnecessary parts to form a film.
  • a film-like adhesive (thickness 7 ⁇ m) having a circular planar shape (diameter 305 mm), an intermediate layer (thickness 20 ⁇ m), and a heavy release film are laminated in this order in these thickness directions.
  • a second intermediate laminated body processed product with a heavy-release film was produced.
  • the light release film was removed from the first intermediate laminate with the light release film obtained above to expose one surface of the pressure-sensitive adhesive layer. Further, the circular light release film was removed from the second intermediate laminate work piece with the release film obtained above to expose one surface of the intermediate layer. Next, the newly generated exposed surface of the pressure-sensitive adhesive layer in the first intermediate laminate and the newly generated exposed surface of the intermediate layer in the second intermediate laminate processed product were bonded together. Then, the heavy release film (first release film) is removed from the laminate of the first intermediate laminate and the second intermediate laminate processed product, and a light release film (second release film) is attached instead. rice field.
  • the planar shape of these (support sheets) is circular (diameter 370 mm), and the circular film-like adhesive and the intermediate.
  • An unnecessary portion was removed by punching from the base material side using a cutting blade (diameter 370 mm) so as to be concentric with the layer (diameter 305 mm).
  • the base material thinness 110 ⁇ m
  • the pressure-sensitive adhesive layer thinness 10 ⁇ m
  • the intermediate layer thickness 20 ⁇ m
  • the release film are formed in this order in these thickness directions.
  • the semiconductor device is manufactured by the same method as in Example 1 except that the heavy release film is not replaced with the light release film. Manufactured a sheet for.
  • the first intermediate laminate with the release film (with the release film) by the same method as the above-mentioned preparation of the first intermediate laminate (however, the thickness of the adhesive layer after heating and drying is changed to 10 ⁇ m). Support sheet) was prepared.
  • the first intermediate laminate with the release film after production was immediately allowed to stand for 30 minutes in an environment of 23 ° C. and 50% RH, and then the first intermediate laminate was cut out to a width of 50 mm and used as a test piece. ..
  • the release film of the test piece at this time was used as each release film (light release film, heavy release film, or medium release film) to be measured for the release force between the test piece and the pressure-sensitive adhesive layer.
  • the release film is peeled off from the support sheet by fixing the support sheet side so that the surfaces of the adhesive layer and the release film that were in contact with each other form an angle of 180 °. (MN / 50 mm) was measured.
  • the measurement conditions were a peeling speed: 1000 mm / min, 23 ° C., and a humidity of 50% RH.
  • the semiconductor device manufacturing sheet according to the embodiment does not need to have a structure in which the pressure-sensitive adhesive layer and the corresponding release film are in direct contact with each other.
  • the evaluation of the peeling force here is an evaluation for specifying the properties of the release film.
  • a film-like adhesive was prepared by the same method as the above-mentioned preparation of the film-like adhesive, and the film-forming property of the film-like adhesive was evaluated.
  • the solid content concentration of the adhesive composition was set to 15% by mass, and the adhesive composition was applied using an applicator so that the thickness of the film-like adhesive after heat drying was 7 ⁇ m.
  • the appearance of the surface of the portion of the obtained film-like adhesive that was in contact with the release film of the adhesive composition was visually observed to form a film of the film-like adhesive.
  • Gender was evaluated according to the following criteria.
  • A No repelling of the adhesive composition having a diameter of 3 mm or more was observed on the release film, and the surface condition was good.
  • B On the release film, 1 to 5 repellents of the adhesive composition having a diameter of 3 mm or more were observed.
  • C More than 5 repellents of the adhesive composition having a diameter of 3 mm or more were observed on the release film.
  • a tape mounter (RAD-2700 manufactured by Lintec Corporation) was used to apply a film-like adhesive to the back surface of a 12-inch semiconductor wafer and a ring frame (manufactured by DISCO). ) was continuously performed for 30 sheets. This step was performed while peeling the release film of the semiconductor device manufacturing sheet from the sheet. The condition of the release film after the release film was peeled off from the film-like adhesive was confirmed.
  • Table 1 shows the above evaluation results.
  • Example 1 the heavy-release film having a high peeling force was used when producing the film-like adhesive, and then the heavy-release film was replaced with the light-release film having a low peeling force.
  • the film-forming property of the film-like adhesive was good when the layer of the film-like adhesive was formed, and the suitability of the mounting process was good when the sheet for manufacturing a semiconductor device was used.
  • the present invention can be used in the manufacture of semiconductor devices.
  • 101 Sheet for manufacturing semiconductor devices, 1 ... Support sheet, 10 ... Laminated sheet, 11 ... Base material, 12 ... Adhesive layer, 13 ... Middle class, 13a ... the first surface of the middle layer, 14 ... Film-like adhesive, 15 ... Release film (second release film), 16 ... Third release film, 17 ... 1st release film, W 13 ... Width of intermediate layer W 14 ... Width of film-like adhesive 102 ... Second intermediate laminate, 103 ... Second intermediate laminate work piece, 104 ... First intermediate laminate, 105 ... 1st laminate, 107 ... Second laminate, C, C'... notch, 8 ... Back grind tape, 9'... Semiconductor wafer, 90'... Modified layer, 9a'...

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Abstract

Provided is a manufacturing method for a semiconductor device manufacturing sheet. The semiconductor device manufacturing sheet comprises a base material, an adhesive layer, an intermediate layer, a film-like bonding agent, and a second peeling film that are stacked in the stated order. The manufacturing method comprises: a first machining step for removing at least a portion of the intermediate layer and the film-like bonding agent from a second intermediate laminate comprising the intermediate layer, the film-like bonding agent, and a first peeling film, thereby attaining a second intermediate laminate machining product; a laminating step for bonding the first intermediate laminate comprising the base material and the adhesive layer together with the second intermediate laminate machining product, thereby attaining a first laminate; a re-pasting step for peeling the first peeling film from the first laminate and pasting the first peeling film onto the second peeling film, thereby attaining a second laminate; and a second machining step for eliminating at least a portion of the base material and the adhesive layer from the second laminate, thereby attaining the semiconductor device manufacturing sheet. The peeling force between the first peeling film and the film-like bonding agent is greater than the peeling force between the second peeling film and the film-like bonding agent.

Description

半導体装置製造用シートの製造方法Manufacturing method of sheets for manufacturing semiconductor devices
　本発明は、半導体装置製造用シートの製造方法に関する。
　本願は、２０２０年３月２７日に、日本に出願された特願２０２０－０５８７３４号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a method for manufacturing a sheet for manufacturing a semiconductor device.
The present application claims priority based on Japanese Patent Application No. 2020-058734 filed in Japan on March 27, 2020, the contents of which are incorporated herein by reference.
　半導体装置の製造時には、半導体チップと、その裏面に設けられたフィルム状接着剤と、を備えたフィルム状接着剤付き半導体チップが使用される。
　フィルム状接着剤付き半導体チップの製造方法の一例としては、例えば、以下に示すものが挙げられる。 At the time of manufacturing a semiconductor device, a semiconductor chip with a film-like adhesive including a semiconductor chip and a film-like adhesive provided on the back surface thereof is used.
Examples of the method for manufacturing a semiconductor chip with a film-like adhesive include those shown below.
　まず、半導体ウエハの裏面にダイシングダイボンディングシートを貼付する。
　ダイシングダイボンディングシートとしては、例えば、支持シートと、前記支持シートの面上に設けられたフィルム状接着剤と、を備えたものが挙げられる。支持シートはダイシングシートとして利用可能となっている。支持シートとしては、例えば、基材と、前記基材の面上に設けられた粘着剤層と、を備えたもの；基材のみからなるもの等、構成の異なるものが複数種存在する。粘着剤層を備えた支持シートは、その粘着剤層側の最表面が、フィルム状接着剤が設けられる面となる。ダイシングダイボンディングシートは、その中のフィルム状接着剤によって、半導体ウエハの裏面に貼付される。 First, a dicing die bonding sheet is attached to the back surface of the semiconductor wafer.
Examples of the dicing die bonding sheet include a support sheet and a film-like adhesive provided on the surface of the support sheet. The support sheet can be used as a dicing sheet. As the support sheet, for example, there are a plurality of types having different configurations, such as one provided with a base material and an adhesive layer provided on the surface of the base material; and one composed of only the base material. In the support sheet provided with the pressure-sensitive adhesive layer, the outermost surface on the pressure-sensitive adhesive layer side is the surface on which the film-like adhesive is provided. The dicing die bonding sheet is attached to the back surface of the semiconductor wafer by the film-like adhesive in the dicing die bonding sheet.
　次いで、ブレードダイシングによって、支持シート上の半導体ウエハとフィルム状接着剤をともに切断する。半導体ウエハの「切断」は「分割」とも称され、これにより半導体ウエハは目的とする半導体チップへと個片化される。フィルム状接着剤は、半導体チップの外周に沿って切断される。これにより、半導体チップと、その裏面に設けられた切断後のフィルム状接着剤と、を備えたフィルム状接着剤付き半導体チップが得られるとともに、支持シート上で、複数個のこれらフィルム状接着剤付き半導体チップが整列した状態で保持された、フィルム状接着剤付き半導体チップ群が得られる。 Next, the semiconductor wafer and the film-like adhesive on the support sheet are cut together by blade dicing. The "cutting" of a semiconductor wafer is also referred to as "splitting", whereby the semiconductor wafer is fragmented into a target semiconductor chip. The film-like adhesive is cut along the outer circumference of the semiconductor chip. As a result, a semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive after cutting provided on the back surface thereof can be obtained, and a plurality of these film-like adhesives can be obtained on a support sheet. A group of semiconductor chips with a film-like adhesive, in which the attached semiconductor chips are held in an aligned state, can be obtained.
　次いで、フィルム状接着剤付き半導体チップを、支持シートから引き離して、ピックアップする。硬化性の粘着剤層を備えた支持シートを用いた場合には、このとき、粘着剤層を硬化させて粘着性を低下させておくことで、ピックアップが容易となる。
　以上により、半導体装置の製造に使用するフィルム状接着剤付き半導体チップが得られる。 Next, the semiconductor chip with the film-like adhesive is pulled away from the support sheet and picked up. When a support sheet provided with a curable pressure-sensitive adhesive layer is used, picking up is facilitated by curing the pressure-sensitive adhesive layer to reduce the adhesiveness at this time.
From the above, a semiconductor chip with a film-like adhesive used for manufacturing a semiconductor device can be obtained.
　フィルム状接着剤付き半導体チップの製造方法の他の例としては、例えば、以下に示すものが挙げられる。
　まず、半導体ウエハの回路形成面に、バックグラインドテープ（「表面保護テープ」と称することもある）を貼付する。
　次いで、半導体ウエハの内部において、分割予定箇所を設定し、この箇所に含まれる領域を焦点として、この焦点に集束するように、レーザー光を照射することにより、半導体ウエハの内部に改質層を形成する。次いで、グラインダーを用いて、半導体ウエハの裏面を研削することにより、半導体ウエハの厚さを目的とする値に調節する。このときの半導体ウエハに加えられる研削時の力を利用することによって、改質層の形成部位において、半導体ウエハを分割（個片化）し、複数個の半導体チップを作製する。このように改質層の形成を伴う半導体ウエハの分割方法は、ステルスダイシング（登録商標）と呼ばれており、半導体ウエハにレーザー光を照射することにより、照射部位の半導体ウエハを削り取りながら、半導体ウエハをその表面から切断していくレーザーダイシングとは、本質的に全く異なる。 Other examples of the method for manufacturing a semiconductor chip with a film-like adhesive include those shown below.
First, a back grind tape (sometimes referred to as "surface protection tape") is attached to the circuit forming surface of the semiconductor wafer.
Next, a region to be divided is set inside the semiconductor wafer, and a modified layer is formed inside the semiconductor wafer by irradiating a laser beam so as to focus on the region included in this focal point. Form. Next, the thickness of the semiconductor wafer is adjusted to a desired value by grinding the back surface of the semiconductor wafer using a grinder. By utilizing the grinding force applied to the semiconductor wafer at this time, the semiconductor wafer is divided (individualized) at the formation site of the modified layer to produce a plurality of semiconductor chips. The method of dividing a semiconductor wafer that involves the formation of a modified layer in this way is called stealth dicing (registered trademark). By irradiating the semiconductor wafer with laser light, the semiconductor wafer at the irradiation site is scraped off and the semiconductor is semiconductor. It is essentially completely different from laser dicing, which cuts a wafer from its surface.
　次いで、バックグラインドテープ上で固定化されているこれらすべての半導体チップの、上述の研削を行った裏面（換言すると研削面）に、１枚のダイボンディングシートを貼付する。ダイボンディングシートとしては、上記のダイシングダイボンディングシートと同様のものが挙げられる。ダイボンディングシートは、このように、半導体ウエハのダイシング時には使用しないだけで、ダイシングダイボンディングシートと同様の構成を有するように設計することが可能な場合がある。ダイボンディングシートも、その中のフィルム状接着剤によって、半導体チップの裏面に貼付される。 Next, one die bonding sheet is attached to the back surface (in other words, the ground surface) of all these semiconductor chips fixed on the back grind tape after the above-mentioned grinding. Examples of the die bonding sheet include those similar to the above dicing die bonding sheet. As described above, the die bonding sheet may be designed to have the same configuration as the dicing die bonding sheet without being used when dicing the semiconductor wafer. The die bonding sheet is also attached to the back surface of the semiconductor chip by the film-like adhesive therein.
　次いで、半導体チップからバックグラインドテープを取り除いた後、ダイボンディングシートを、冷却しながらその表面（例えば、フィルム状接着剤の半導体チップへの貼付面）に対して平行な方向に引き伸ばす、いわゆるエキスパンド（クールエキスパンド）を行うことにより、フィルム状接着剤を半導体チップの外周に沿って切断する。
　以上により、半導体チップと、その裏面に設けられた切断後のフィルム状接着剤と、を備えたフィルム状接着剤付き半導体チップが得られる。 Next, after removing the back grind tape from the semiconductor chip, the die bonding sheet is stretched in a direction parallel to its surface (for example, the surface on which the film-like adhesive is attached to the semiconductor chip) while being cooled, so-called expand (so-called expand). By performing cool expansion), the film-like adhesive is cut along the outer periphery of the semiconductor chip.
As described above, a semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive after cutting provided on the back surface thereof can be obtained.
　次いで、上記のブレードダイシングを採用した場合と同様に、フィルム状接着剤付き半導体チップを、支持シートから引き離して、ピックアップすることにより、半導体装置の製造に使用するフィルム状接着剤付き半導体チップが得られる。 Next, as in the case of adopting the above-mentioned blade dicing, the semiconductor chip with the film-like adhesive is separated from the support sheet and picked up to obtain the semiconductor chip with the film-like adhesive used for manufacturing the semiconductor device. Be done.
　ダイシングダイボンディングシート及びダイボンディングシートは、いずれも、フィルム状接着剤付き半導体チップの製造のために使用でき、最終的には、目的とする半導体装置の製造を可能とする。本明細書においては、ダイシングダイボンディングシート及びダイボンディングシートを包括して、「半導体装置製造用シート」と称する。 Both the dicing die bonding sheet and the die bonding sheet can be used for manufacturing a semiconductor chip with a film-like adhesive, and finally, the target semiconductor device can be manufactured. In the present specification, the dicing die bonding sheet and the die bonding sheet are collectively referred to as "semiconductor device manufacturing sheet".
　半導体装置製造用シートとしては、例えば、基材層（前記支持シートに相当）と接着剤層（前記フィルム状接着剤に相当）が直接接触して積層された構成を有するダイシングダイボンディングテープ（前記ダイシングダイボンディングシートに相当）が開示されている（特許文献１参照）。このダイシングダイボンディングテープにおいては、基材層及び接着剤層の－１５℃での９０度剥離力が特定範囲に調節されているため、エキスパンドによって接着剤層を精度よく分断できる、とされている。また、基材層及び接着剤層の２３℃での９０度剥離力が特定範囲に調節されているため、このダイシングダイボンディングテープを用いた場合に、接着剤層付きの半導体チップ（前記フィルム状接着剤付き半導体チップに相当）を困難無くピックアップでき、かつピックアップまでの過程で、半導体ウエハ及び半導体チップの接着剤層からの剥離を抑制できる、とされている。 The sheet for manufacturing a semiconductor device includes, for example, a dicing die bonding tape (described above) having a structure in which a base material layer (corresponding to the support sheet) and an adhesive layer (corresponding to the film-like adhesive) are directly contacted and laminated. A dicing die bonding sheet (corresponding to a dicing die bonding sheet) is disclosed (see Patent Document 1). In this dicing die bonding tape, since the 90-degree peeling force of the base material layer and the adhesive layer at -15 ° C is adjusted to a specific range, it is said that the adhesive layer can be accurately divided by expanding. .. Further, since the 90-degree peeling force of the base material layer and the adhesive layer at 23 ° C. is adjusted to a specific range, when this dicing die bonding tape is used, a semiconductor chip with an adhesive layer (the film-like form). It is said that (corresponding to a semiconductor chip with an adhesive) can be picked up without difficulty, and peeling of the semiconductor wafer and the semiconductor chip from the adhesive layer can be suppressed in the process up to the pick-up.
特開２０１８－５６２８９号公報JP-A-2018-56289
　しかし、特許文献１で開示されているようなダイシングダイボンディングテープの製造にあたり、接着剤層（フィルム状接着剤に相当）の造膜性については、検討されていない。 However, in the production of the dicing die bonding tape as disclosed in Patent Document 1, the film-forming property of the adhesive layer (corresponding to the film-like adhesive) has not been studied.
　本発明は、フィルム状接着剤の造膜が容易であり、使用時にはマウントプロセス適性に優れる半導体装置製造用シートを製造可能な、半導体装置製造用シートの製造方法の提供を目的とする。 An object of the present invention is to provide a method for manufacturing a semiconductor device manufacturing sheet, which can easily form a film of a film-like adhesive and can manufacture a semiconductor device manufacturing sheet having excellent mounting process suitability at the time of use.
（１）　半導体装置製造用シートの製造方法であって、
　前記半導体装置製造用シートは、基材と、粘着剤層と、中間層と、フィルム状接着剤と、第２剥離フィルムと、を備え、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第２剥離フィルムがこの順に積層されて構成され、
　前記中間層、前記フィルム状接着剤及び第１剥離フィルムを備える第２中間積層体の前記中間層及び前記フィルム状接着剤に対し、半導体装置製造用シートの前記中間層及び前記フィルム状接着剤の外周に対応する位置に切込部Ｃを形成し、該切込部Ｃを起点として外側に位置する前記中間層及び前記フィルム状接着剤の少なくとも一部を除去し、第２中間積層体加工物を得る第１加工工程と、
　前記基材及び前記粘着剤層を備える第１中間積層体と、前記第２中間積層体加工物と、を貼り合わせて、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第１剥離フィルムを備える第１積層物を得る積層工程と、
　前記第１積層物の前記第１剥離フィルムを剥がし、第２剥離フィルムへと貼替えて第２積層物を得る貼替工程と、
　前記第２積層物の前記基材及び前記粘着剤層に対し、半導体装置製造用シートの前記基材及び前記粘着剤層の外周に対応する位置に切込部Ｃ’を形成し、該切込部Ｃ’を起点として外側に位置する前記基材及び前記粘着剤層の少なくとも一部を除去し、半導体装置製造用シートを得る第２加工工程と、を含み、
　前記第１剥離フィルムと前記フィルム状接着剤との間の剥離力が、前記第２剥離フィルムと前記フィルム状接着剤との間の剥離力よりも高い、半導体装置製造用シートの製造方法。
（２）　前記第１剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第１試験片において、
　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第１試験片の前記粘着剤層及び前記第１剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第１剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第１剥離フィルムとの間の剥離力（ｍＮ／５０ｍｍ）が、１８０ｍＮ/５０ｍｍ超であり、
　前記第２剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第２試験片において、
　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第２試験片の前記粘着剤層及び前記第２剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第２剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第２剥離フィルムとの間の剥離力（ｍＮ／５０ｍｍ）が、１８０ｍＮ/５０ｍｍ以下である、前記（１）に記載の半導体装置製造用シートの製造方法。
（３）　前記中間層が、重量平均分子量が１０００００以下の非ケイ素系樹脂を主成分として含有する、前記（１）又は（２）に記載の半導体装置製造用シートの製造方法。 (1) A method for manufacturing a sheet for manufacturing a semiconductor device.
The sheet for manufacturing a semiconductor device includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a second release film, and includes the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the above. The film-like adhesive and the second release film are laminated in this order.
With respect to the intermediate layer and the film-like adhesive of the second intermediate laminate including the intermediate layer, the film-like adhesive and the first release film, the intermediate layer and the film-like adhesive of the sheet for manufacturing a semiconductor device A cut portion C is formed at a position corresponding to the outer periphery, and at least a part of the intermediate layer and the film-like adhesive located outside from the cut portion C is removed to remove the second intermediate laminate processed product. The first processing process to obtain
The base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are obtained by laminating the first intermediate laminate having the base material and the pressure-sensitive adhesive layer and the processed product of the second intermediate laminate. And the laminating step of obtaining the first laminated product including the first release film, and
A reattachment step of peeling off the first release film of the first laminate and reattaching it to a second release film to obtain a second laminate.
A cut portion C'is formed at a position corresponding to the outer periphery of the base material and the pressure-sensitive adhesive layer of the semiconductor device manufacturing sheet with respect to the base material and the pressure-sensitive adhesive layer of the second laminate, and the cut portion is formed. A second processing step of removing at least a part of the base material and the pressure-sensitive adhesive layer located on the outside starting from the part C'and obtaining a sheet for manufacturing a semiconductor device is included.
A method for manufacturing a sheet for manufacturing a semiconductor device, wherein the peeling force between the first release film and the film-like adhesive is higher than the peeling force between the second release film and the film-like adhesive.
(2) The pressure-sensitive adhesive is obtained by applying a pressure-sensitive adhesive composition to the peel-processed surface of the first release film and drying it to form a single-layer pressure-sensitive adhesive layer having a thickness of 10 μm. In the first test piece, the composition comprises 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the first test piece and the peeled-processed surfaces of the first peeling film form an angle of 180 °. The peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the first peeling film, which is measured by 180 ° peeling to peel the first peeling film from the agent layer, is more than 180 mN / 50 mm.
A single-layer pressure-sensitive adhesive layer having a thickness of 10 μm is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the second release film and drying the pressure-sensitive adhesive composition. In the second test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the second test piece and the peeled-processed surfaces of the second peeling film form an angle of 180 °. The peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the second release film measured by 180 ° peeling of the second release film from the agent layer is 180 mN / 50 mm or less. The method for manufacturing a sheet for manufacturing a semiconductor device according to (1).
(3) The method for producing a semiconductor device manufacturing sheet according to (1) or (2) above, wherein the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
　本態様によれば、フィルム状接着剤の造膜が容易であり、使用時にはマウントプロセス適性に優れる半導体装置製造用シートを製造可能な、半導体装置製造用シートの製造方法が提供される。 According to this aspect, there is provided a method for manufacturing a semiconductor device manufacturing sheet, which can easily form a film of a film-like adhesive and can manufacture a semiconductor device manufacturing sheet having excellent mounting process suitability at the time of use.
本発明の一実施形態に係る半導体装置製造用シートを模式的に示す断面図である。It is sectional drawing which shows typically the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 図１に示す半導体装置製造用シートの平面図である。It is a top view of the sheet for manufacturing a semiconductor device shown in FIG. 本発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。It is sectional drawing which shows typically the manufacturing method of the sheet for manufacturing the semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the method of using the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the method of using the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the method of using the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention. 半導体チップの製造方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the manufacturing method of a semiconductor chip. 半導体チップの製造方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the manufacturing method of a semiconductor chip. 半導体チップの製造方法の一例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining an example of the manufacturing method of a semiconductor chip. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の他の例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining another example of the use method of the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の他の例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining another example of the use method of the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る半導体装置製造用シートの使用方法の他の例を、模式的に説明するための断面図である。It is sectional drawing for schematically explaining another example of the use method of the sheet for manufacturing a semiconductor device which concerns on one Embodiment of this invention.
◇半導体装置製造用シート
　本発明の一実施形態に係る半導体装置製造用シートは、基材と、粘着剤層と、中間層と、フィルム状接着剤と、剥離フィルムと、を備え、前記基材、粘着剤層、中間層、フィルム状接着剤及び前記剥離フィルムがこの順に積層されて構成されている。前記中間層は、重量平均分子量が１０００００以下の非ケイ素系樹脂を主成分として含有することが好ましい。 -Sheet for manufacturing semiconductor devices The sheet for manufacturing semiconductor devices according to an embodiment of the present invention includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a release film, and the base material. , The pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive, and the release film are laminated in this order. The intermediate layer preferably contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
　本実施形態の半導体装置製造用シートをダイシングダイボンディングシートとして用い、ブレードダイシングを行った場合には、前記半導体装置製造用シートが前記中間層を備えていることで、ブレードが基材に到達することを容易に回避でき、基材からのヒゲ状の切削屑（別名：ウイスカ（Ｗｈｉｓｋｅｒ）、以下、基材に由来するものに限らず、単に「切削屑」と称することがある）の発生を抑制できる。そして、ブレードによって切断される前記中間層の主成分が、重量平均分子量が１０００００以下の非ケイ素系樹脂であること、特に、重量平均分子量が１０００００以下であることによって、中間層からの前記切削屑の発生も抑制できる。 When the semiconductor device manufacturing sheet of the present embodiment is used as a dicing die bonding sheet and blade dicing is performed, the blade reaches the base material because the semiconductor device manufacturing sheet includes the intermediate layer. This can be easily avoided, and the generation of whisker-like cutting chips (also known as Whiskers, hereinafter, not limited to those derived from the base material, but also simply referred to as "cutting chips") from the base material can be generated. Can be suppressed. The main component of the intermediate layer cut by the blade is a non-silicon resin having a weight average molecular weight of 100,000 or less, and in particular, the cutting chips from the intermediate layer because the weight average molecular weight is 100,000 or less. Can also be suppressed.
　一方、本実施形態の半導体装置製造用シートをダイボンディングシートとして用い、半導体ウエハでの改質層の形成を伴うダイシング（ステルスダイシング（登録商標））を行った場合には、前記半導体装置製造用シートが前記中間層を備えていることで、引き続き半導体装置製造用シートを、その表面（例えば、フィルム状接着剤の半導体チップへの貼付面）に対して平行な方向に引き伸ばす、いわゆるエキスパンドを行うことによって、フィルム状接着剤が目的とする箇所で精度よく切断され、切断不良を抑制できる。これは、中間層を備えることで、エキスパンドの応力をチップ間距離拡張に効率よく利用できるためと考えられる。 On the other hand, when the semiconductor device manufacturing sheet of the present embodiment is used as a die bonding sheet and dicing (stealth dicing (registered trademark)) accompanied by formation of a modified layer on a semiconductor wafer is performed, the semiconductor device manufacturing sheet is used. Since the sheet includes the intermediate layer, the sheet for manufacturing a semiconductor device is subsequently stretched in a direction parallel to its surface (for example, the surface on which the film-like adhesive is attached to the semiconductor chip), that is, so-called expansion is performed. As a result, the film-like adhesive can be cut accurately at the target location, and cutting defects can be suppressed. It is considered that this is because the stress of the expand can be efficiently used for expanding the distance between chips by providing the intermediate layer.
　このように、本実施形態の半導体装置製造用シートは、ブレードダイシング時には、基材及び中間層からの切削屑の発生を抑制し、前記エキスパンド時には、フィルム状接着剤の切断不良を抑制するのであり、半導体ウエハの分割時に不具合の発生を抑制する特性を有しており、半導体ウエハの分割適性に優れる。 As described above, the semiconductor device manufacturing sheet of the present embodiment suppresses the generation of cutting chips from the base material and the intermediate layer during blade dicing, and suppresses cutting defects of the film-like adhesive during the expansion. , It has the property of suppressing the occurrence of defects when the semiconductor wafer is divided, and is excellent in the division suitability of the semiconductor wafer.
　本明細書において、「重量平均分子量」とは、特に断りのない限り、ゲル・パーミエーション・クロマトグラフィー（ＧＰＣ）法により測定されるポリスチレン換算値である。 In the present specification, the "weight average molecular weight" is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.
　本実施形態の半導体装置製造用シートの製造方法及び使用方法については、後ほど詳しく説明する。 The manufacturing method and usage method of the semiconductor device manufacturing sheet of the present embodiment will be described in detail later.
　以下、図面を参照しながら、本実施形態の半導体装置製造用シートについて詳細に説明する。なお、以下の説明で用いる図は、実施形態の特徴を分かり易くするために、便宜上、要部となる部分を拡大して示している場合があり、各構成要素の寸法比率等が実際と同じであるとは限らない。 Hereinafter, the semiconductor device manufacturing sheet of the present embodiment will be described in detail with reference to the drawings. In addition, in the figure used in the following description, in order to make it easy to understand the features of the embodiment, the main part may be enlarged for convenience, and the dimensional ratio of each component is the same as the actual one. Is not always the case.
　図１は、本発明の一実施形態に係る半導体装置製造用シートを模式的に示す断面図であり、図２は、図１に示す半導体装置製造用シートの平面図である。
　なお、図２以降の図において、既に説明済みの図に示すものと同じ構成要素には、その説明済みの図の場合と同じ符号を付し、その詳細な説明は省略する。 FIG. 1 is a cross-sectional view schematically showing a semiconductor device manufacturing sheet according to an embodiment of the present invention, and FIG. 2 is a plan view of the semiconductor device manufacturing sheet shown in FIG.
In the drawings after FIG. 2, the same components as those shown in the already explained figures are designated by the same reference numerals as in the case of the already explained figures, and detailed description thereof will be omitted.
　ここに示す半導体装置製造用シート１０１は、基材１１を備え、基材１１上に、粘着剤層１２、中間層１３及びフィルム状接着剤１４がこの順に積層されて、構成されている。半導体装置製造用シート１０１は、さらに、フィルム状接着剤１４の中間層１３が設けられている側とは反対側の面（以下、「第１面」と称することがある）１４ａ上に、剥離フィルム１５を備えている。 The semiconductor device manufacturing sheet 101 shown here includes a base material 11, and the pressure-sensitive adhesive layer 12, the intermediate layer 13, and the film-like adhesive 14 are laminated in this order on the base material 11. The sheet 101 for manufacturing a semiconductor device is further peeled off on a surface (hereinafter, may be referred to as “first surface”) 14a opposite to the side on which the intermediate layer 13 of the film-like adhesive 14 is provided. The film 15 is provided.
　半導体装置製造用シート１０１においては、基材１１の一方の面（本明細書においては、「第１面」と称することがある）１１ａ上に、粘着剤層１２が設けられる。粘着剤層１２の基材１１が設けられている側とは反対側の面（本明細書においては、「第１面」と称することがある）１２ａ上に、中間層１３が設けられる。中間層１３の粘着剤層１２が設けられている側とは反対側の面（本明細書においては、「第１面」と称することがある）１３ａ上に、フィルム状接着剤１４が設けられる。フィルム状接着剤１４の第１面１４ａ上に、剥離フィルム１５が設けられている。このように、半導体装置製造用シート１０１は、基材１１、粘着剤層１２、中間層１３、フィルム状接着剤１４及び剥離フィルム１５がこの順に、これらの厚さ方向において積層されて構成されている。 In the semiconductor device manufacturing sheet 101, the pressure-sensitive adhesive layer 12 is provided on one surface of the base material 11 (sometimes referred to as the "first surface" in the present specification) 11a. The intermediate layer 13 is provided on the surface (sometimes referred to as the "first surface" in the present specification) 12a of the pressure-sensitive adhesive layer 12 opposite to the side on which the base material 11 is provided. The film-like adhesive 14 is provided on the surface (sometimes referred to as the "first surface" in the present specification) 13a of the intermediate layer 13 opposite to the side on which the pressure-sensitive adhesive layer 12 is provided. .. A release film 15 is provided on the first surface 14a of the film-like adhesive 14. As described above, the sheet 101 for manufacturing a semiconductor device is composed of a base material 11, an adhesive layer 12, an intermediate layer 13, a film-like adhesive 14, and a release film 15 laminated in this order in the thickness direction thereof. There is.
　半導体装置製造用シート１０１は、剥離フィルム１５が取り除かれた状態で、その中のフィルム状接着剤１４の第１面１４ａが、半導体ウエハ、半導体チップ、又は、完全には分割されていない半導体ウエハ（図示略）の裏面に貼付されて、使用される。 In the semiconductor device manufacturing sheet 101, in a state where the release film 15 is removed, the first surface 14a of the film-like adhesive 14 in the sheet 101 is a semiconductor wafer, a semiconductor chip, or a semiconductor wafer in which the film-like adhesive 14 is not completely divided. It is used by being attached to the back surface of (not shown).
　本明細書においては、半導体ウエハ及び半導体チップのいずれの場合も、その回路が形成されている側の面を「回路形成面」と称し、回路形成面とは反対側の面を「裏面」と称する。 In the present specification, in the case of both the semiconductor wafer and the semiconductor chip, the surface on the side where the circuit is formed is referred to as a "circuit forming surface", and the surface opposite to the circuit forming surface is referred to as a "back surface". Refer to.
　本明細書においては、基材及び粘着剤層が、これらの厚さ方向において積層され、かつ中間層が積層されていない構成を有する積層物を「支持シート」と称することがある。図１においては、符号１を付して支持シートを示している。
　また、基材、粘着剤層及び中間層がこの順に、これらの厚さ方向において積層された構成を有する積層物を、「積層シート」と称することがある。図１においては、符号１０を付して積層シートを示している。前記支持シート及び中間層の積層物は、前記積層シートに含まれる。 In the present specification, a laminate having a structure in which the base material and the pressure-sensitive adhesive layer are laminated in the thickness direction thereof and the intermediate layer is not laminated may be referred to as a "support sheet". In FIG. 1, a support sheet is indicated by reference numeral 1.
Further, a laminate having a structure in which a base material, an adhesive layer and an intermediate layer are laminated in this order in the thickness direction thereof may be referred to as a "laminated sheet". In FIG. 1, a laminated sheet is indicated by reference numeral 10. The support sheet and the laminate of the intermediate layer are included in the laminate sheet.
　中間層１３及びフィルム状接着剤１４を、これらの上方から見下ろして平面視したときの平面形状は、いずれも円形状であり、中間層１３の直径とフィルム状接着剤１４の直径は同じである。
　そして、半導体装置製造用シート１０１において、中間層１３及びフィルム状接着剤１４は、これらの中心が一致するように、換言すると、中間層１３及びフィルム状接着剤１４の外周の位置が、これらの径方向においていずれも一致するように、配置されている。 When the intermediate layer 13 and the film-like adhesive 14 are viewed in a plan view from above, they are both circular in shape, and the diameter of the intermediate layer 13 and the diameter of the film-like adhesive 14 are the same. ..
Then, in the semiconductor device manufacturing sheet 101, the intermediate layer 13 and the film-like adhesive 14 have their centers aligned with each other, in other words, the positions of the outer circumferences of the intermediate layer 13 and the film-like adhesive 14 are aligned with each other. They are arranged so that they all match in the radial direction.
　中間層１３の第１面１３ａと、フィルム状接着剤１４の第１面１４ａは、いずれも、粘着剤層１２の第１面１２ａよりも面積が小さくなっている。そして、中間層１３の幅Ｗ１３の最大値（すなわち直径）と、フィルム状接着剤１４の幅Ｗ１４の最大値（すなわち直径）は、いずれも、粘着剤層１２の幅の最大値と、基材１１の幅の最大値よりも小さくなっている。したがって、半導体装置製造用シート１０１において、粘着剤層１２の第１面１２ａの一部は、中間層１３及びフィルム状接着剤１４によって覆われていない。このような、粘着剤層１２の第１面１２ａにおける、中間層１３及びフィルム状接着剤１４が積層されていない領域には、剥離フィルム１５が直接接触して積層されており、剥離フィルム１５が取り除かれた状態では、この領域は露出している（以下、本明細書においては、この領域を「非積層領域」と称することがある）。
　なお、剥離フィルム１５を備えた半導体装置製造用シート１０１においては、粘着剤層１２の、中間層１３及びフィルム状接着剤１４によって覆われていない領域には、ここに示すように、剥離フィルム１５が積層されていない領域があってもよいし、なくてもよい。 Both the first surface 13a of the intermediate layer 13 and the first surface 14a of the film-like adhesive 14 have a smaller area than the first surface 12a of the pressure-sensitive adhesive layer 12. The maximum value (that is, diameter) of the width W 13 of the intermediate layer 13 and the maximum value (that is, diameter) of the width W 14 of the film-like adhesive 14 are both the maximum value of the width of the pressure-sensitive adhesive layer 12 and the maximum value. It is smaller than the maximum width of the base material 11. Therefore, in the semiconductor device manufacturing sheet 101, a part of the first surface 12a of the pressure-sensitive adhesive layer 12 is not covered with the intermediate layer 13 and the film-like adhesive 14. In such a region of the first surface 12a of the pressure-sensitive adhesive layer 12 where the intermediate layer 13 and the film-like adhesive 14 are not laminated, the release film 15 is directly contacted and laminated, and the release film 15 is laminated. In the removed state, this region is exposed (hereinafter, this region may be referred to as a "non-stacked region" in the present specification).
In the sheet 101 for manufacturing a semiconductor device provided with the release film 15, the area of the pressure-sensitive adhesive layer 12 not covered by the intermediate layer 13 and the film-like adhesive 14 is the release film 15 as shown here. There may or may not be areas where are not laminated.
　フィルム状接着剤１４が未切断であり、かつフィルム状接着剤１４によって上述の半導体ウエハ又は半導体チップ等に貼付された状態の半導体装置製造用シート１０１は、その中の粘着剤層１２における前記非積層領域の一部を、半導体ウエハ固定用のリングフレーム等の治具に貼付することで、固定できる。したがって、半導体装置製造用シート１０１を前記治具に固定するための治具用接着剤層を、半導体装置製造用シート１０１に別途設ける必要がない。そして、治具用接着剤層を設ける必要がないため、半導体装置製造用シート１０１を安価かつ効率的に製造できる。 The semiconductor device manufacturing sheet 101 in which the film-like adhesive 14 is uncut and is attached to the above-mentioned semiconductor wafer, semiconductor chip, or the like by the film-like adhesive 14 is the non-cutting material in the pressure-sensitive adhesive layer 12. A part of the laminated region can be fixed by attaching it to a jig such as a ring frame for fixing a semiconductor wafer. Therefore, it is not necessary to separately provide the jig adhesive layer for fixing the semiconductor device manufacturing sheet 101 to the jig on the semiconductor device manufacturing sheet 101. Since it is not necessary to provide the adhesive layer for the jig, the sheet 101 for manufacturing the semiconductor device can be manufactured inexpensively and efficiently.
　このように、半導体装置製造用シート１０１は、治具用接着剤層を備えていないことにより、有利な効果を奏するが、治具用接着剤層を備えていてもよい。この場合、治具用接着剤層は、半導体装置製造用シート１０１を構成するいずれかの層の表面のうち、周縁部近傍の領域に設けられる。このような領域としては、粘着剤層１２の第１面１２ａにおける前記非積層領域等が挙げられる。 As described above, the sheet 101 for manufacturing a semiconductor device has an advantageous effect because it does not include the adhesive layer for jigs, but may include an adhesive layer for jigs. In this case, the jig adhesive layer is provided in a region near the peripheral edge of the surface of any of the layers constituting the semiconductor device manufacturing sheet 101. Examples of such a region include the non-laminated region on the first surface 12a of the pressure-sensitive adhesive layer 12.
　治具用接着剤層は、公知のものでよく、例えば、接着剤成分を含有する単層構造であってもよいし、芯材となるシートの両面に接着剤成分を含有する層が積層された複数層構造であってもよい。 The adhesive layer for jigs may be a known one. For example, it may have a single-layer structure containing an adhesive component, or layers containing an adhesive component are laminated on both sides of a sheet serving as a core material. It may have a multi-layer structure.
　また、後述するように、半導体装置製造用シート１０１をその表面（例えば、粘着剤層１２の第１面１２ａ）に対して平行な方向に引き伸ばす、所謂エキスパンドを行うときには、粘着剤層１２の第１面１２ａに前記非積層領域が存在することで、半導体装置製造用シート１０１を容易にエキスパンドできる。そして、フィルム状接着剤１４を容易に切断できるだけでなく、中間層１３及びフィルム状接着剤１４の粘着剤層１２からの剥離が抑制されることもある。 Further, as will be described later, when the so-called expanding, in which the sheet 101 for manufacturing a semiconductor device is stretched in a direction parallel to the surface thereof (for example, the first surface 12a of the pressure-sensitive adhesive layer 12), the first surface of the pressure-sensitive adhesive layer 12 is expanded. The presence of the non-laminated region on one surface 12a makes it possible to easily expand the sheet 101 for manufacturing a semiconductor device. Not only can the film-like adhesive 14 be easily cut, but the peeling of the intermediate layer 13 and the film-like adhesive 14 from the pressure-sensitive adhesive layer 12 may be suppressed.
　支持シート１の粘着剤層１２の第１面１２ａと、基材１１の第１面１１ａは、いずれも、剥離フィルム１５の第１面１５ａよりも面積が小さくなっている。そして、粘着剤層１２の幅の最大値（すなわち直径）と、基材１１の最大値（すなわち直径）は、いずれも、剥離フィルム１５の幅の最大値よりも小さくなっている。したがって、半導体装置製造用シート１０１において、剥離フィルム１５の一部は、粘着剤層１２及び基材１１によって覆われていない。 Both the first surface 12a of the pressure-sensitive adhesive layer 12 of the support sheet 1 and the first surface 11a of the base material 11 have a smaller area than the first surface 15a of the release film 15. The maximum value (that is, diameter) of the width of the pressure-sensitive adhesive layer 12 and the maximum value (that is, diameter) of the base material 11 are both smaller than the maximum value of the width of the release film 15. Therefore, in the semiconductor device manufacturing sheet 101, a part of the release film 15 is not covered with the pressure-sensitive adhesive layer 12 and the base material 11.
　粘着剤層１２及び基材１１を、これらの上方から見下ろして平面視したときの平面形状は、いずれも円形状であり、粘着剤層１２及び基材１１の直径は同じである。
　そして、半導体装置製造用シート１０１において、粘着剤層１２及び基材１１は、これらの中心が一致するように、換言すると、粘着剤層１２及び基材１１の外周の位置が、これらの径方向においていずれも一致するように、配置されている。 When the pressure-sensitive adhesive layer 12 and the base material 11 are viewed in a plan view from above, the plane shape is circular, and the diameters of the pressure-sensitive adhesive layer 12 and the base material 11 are the same.
Then, in the semiconductor device manufacturing sheet 101, the positions of the outer periphery of the pressure-sensitive adhesive layer 12 and the base material 11 are in the radial direction so that the centers of the pressure-sensitive adhesive layer 12 and the base material 11 coincide with each other. They are arranged so that they all match.
　半導体装置製造用シート１０１においては、中間層１３が、重量平均分子量が１０００００以下の非ケイ素系樹脂を主成分として含有することが好ましい。 In the semiconductor device manufacturing sheet 101, it is preferable that the intermediate layer 13 contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
　本実施形態の半導体装置製造用シートは、図１及び図２に示すものに限定されず、本発明の効果を損なわない範囲内において、図１及び図２に示すものにおいて一部の構成が変更、削除又は追加されたものであってもよい。 The sheet for manufacturing a semiconductor device of the present embodiment is not limited to the one shown in FIGS. 1 and 2, and a part of the configurations shown in FIGS. 1 and 2 are changed within the range not impairing the effect of the present invention. , May have been deleted or added.
　例えば、本実施形態の半導体装置製造用シートは、基材と、粘着剤層と、中間層と、フィルム状接着剤と、剥離フィルムと、治具用接着剤層と、のいずれにも該当しない、他の層を備えていてもよい。ただし、本実施形態の半導体装置製造用シートは、図１に示すように、粘着剤層を基材に直接接触した状態で備え、中間層を粘着剤層に直接接触した状態で備え、フィルム状接着剤を中間層に直接接触した状態で備え、剥離フィルムをフィルム状接着剤に直接接触した状態で備えていることが好ましい。 For example, the sheet for manufacturing a semiconductor device of the present embodiment does not correspond to any of a base material, an adhesive layer, an intermediate layer, a film-like adhesive, a release film, and an adhesive layer for jigs. , Other layers may be provided. However, as shown in FIG. 1, the semiconductor device manufacturing sheet of the present embodiment is provided with the pressure-sensitive adhesive layer in direct contact with the base material and the intermediate layer in direct contact with the pressure-sensitive adhesive layer, and is in the form of a film. It is preferable that the adhesive is provided in direct contact with the intermediate layer and the release film is provided in direct contact with the film-like adhesive.
　例えば、本実施形態の半導体装置製造用シートにおいて、中間層及びフィルム状接着剤の平面形状は、円形状以外の形状であってもよく、中間層及びフィルム状接着剤の平面形状は、互いに同一であってもよいし、異なっていてもよい。また、中間層の第１面の面積と、フィルム状接着剤の第１面の面積は、いずれも、これらよりも基材側の層の面（例えば、粘着剤層の第１面）の面積よりも小さいことが好ましく、互いに同一であってもよいし、異なっていてもよい。そして、中間層及びフィルム状接着剤の外周の位置は、これらの径方向においていずれも一致していてもよいし、一致していなくてもよい。
　次に、本実施形態の半導体装置製造用シートを構成する各層について、より詳細に説明する。 For example, in the sheet for manufacturing a semiconductor device of the present embodiment, the planar shapes of the intermediate layer and the film-like adhesive may be shapes other than the circular shape, and the planar shapes of the intermediate layer and the film-like adhesive are the same as each other. It may be, or it may be different. Further, the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive are both the areas of the layers on the substrate side (for example, the first surface of the pressure-sensitive adhesive layer). It is preferably smaller than, and may be the same as or different from each other. The positions of the outer periphery of the intermediate layer and the film-like adhesive may or may not be the same in these radial directions.
Next, each layer constituting the semiconductor device manufacturing sheet of the present embodiment will be described in more detail.
○基材
　前記基材は、シート状又はフィルム状である。
　前記基材の構成材料は、各種樹脂であることが好ましく、具体的には、例えば、ポリエチレン（低密度ポリエチレン（ＬＤＰＥ）、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）、高密度ポリエチレン（ＨＤＰＥ等））、ポリプロピレン（ＰＰ）、ポリブテン、ポリブタジエン、ポリメチルペンテン、スチレン・エチレンブチレン・スチレンブロック共重合体、ポリ塩化ビニル、塩化ビニル共重合体、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）、ポリウレタン、ポリウレタンアクリレート、ポリイミド（ＰＩ）、アイオノマー樹脂、エチレン・（メタ）アクリル酸共重合体、エチレン・（メタ）アクリル酸エステル共重合体、エチレン・（メタ）アクリル酸共重合体及びエチレン・（メタ）アクリル酸エステル共重合体以外のエチレン共重合体、ポリスチレン、ポリカーボネート、フッ素樹脂、これらのいずれかの樹脂の水添加物、変性物、架橋物又は共重合物等が挙げられる。 ○ Base material The base material is in the form of a sheet or a film.
The constituent material of the base material is preferably various resins, and specifically, for example, polyethylene (low density polyethylene (LDPE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE, etc.)). , Polypropylene (PP), Polybutene, Polybutadiene, Polymethylpentene, styrene / ethylenebutylene / styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyurethane, Polyurethane acrylate, polyimide (PI), ionomer resin, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, ethylene / (meth) acrylic acid copolymer and ethylene / (meth) Examples thereof include ethylene copolymers other than acrylic ester copolymers, polystyrenes, polycarbonates, fluororesins, water additives, modified products, crosslinked products or copolymers of any of these resins.
　なお、本明細書において、「（メタ）アクリル酸」とは、「アクリル酸」及び「メタクリル酸」の両方を包含する概念とする。（メタ）アクリル酸と類似の用語につても同様であり、例えば、「（メタ）アクリレート」とは、「アクリレート」及び「メタクリレート」の両方を包含する概念であり、「（メタ）アクリロイル基」とは、「アクリロイル基」及び「メタクリロイル基」の両方を包含する概念である。 In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid, for example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is a "(meth) acryloyl group". Is a concept that includes both an "acryloyl group" and a "methacryloyl group".
　基材を構成する樹脂は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The resin constituting the base material may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
　基材は１層（単層）からなるものでもあってよいし、２層以上の複数層からなるものであってもよい。基材が複数層からなる場合、これら複数層は互いに同一でも異なっていてもよく、これら複数層の組み合わせは、本発明の効果を損なわない限り、特に限定されない。
　本明細書においては、基材の場合に限らず、「複数層が互いに同一でも異なっていてもよい」とは、「すべての層が同一であってもよいし、すべての層が異なっていてもよいし、一部の層のみが同一であってもよい」ことを意味し、さらに「複数層が互いに異なる」とは、「各層の構成材料及び厚さの少なくとも一方が互いに異なる」ことを意味する。 The base material may be composed of one layer (single layer) or may be composed of two or more layers. When the base material is composed of a plurality of layers, the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.
In the present specification, not only in the case of a base material, "a plurality of layers may be the same or different from each other" means "all layers may be the same or all layers are different". It may mean that only a part of the layers may be the same, and further, "a plurality of layers are different from each other" means that "at least one of the constituent materials and the thickness of each layer is different from each other". means.
　基材の厚さは、目的に応じて適宜選択できるが、５０～３００μｍであることが好ましく、６０～１５０μｍであることがより好ましい。基材の厚さが前記下限値以上であることで、基材の構造がより安定化する。基材の厚さが前記上限値以下であることで、ブレードダイシング時と半導体装置製造用シートの前記エキスパンド時において、フィルム状接着剤をより容易に切断できる。
　ここで、「基材の厚さ」とは、基材全体の厚さを意味し、例えば、複数層からなる基材の厚さとは、基材を構成するすべての層の合計の厚さを意味する。
　本明細書において、「厚さ」は、特に断りの無い限り、無作為に選出された５箇所で厚さを測定した平均で表される値として、ＪＩＳ　Ｋ７１３０に準じて、定圧厚さ測定器を用いて取得できる。 The thickness of the base material can be appropriately selected depending on the intended purpose, but is preferably 50 to 300 μm, more preferably 60 to 150 μm. When the thickness of the base material is at least the above lower limit value, the structure of the base material is more stabilized. When the thickness of the base material is not more than the upper limit value, the film-like adhesive can be more easily cut at the time of blade dicing and at the time of expanding the sheet for manufacturing a semiconductor device.
Here, the "thickness of the base material" means the thickness of the entire base material, and for example, the thickness of the base material composed of a plurality of layers means the total thickness of all the layers constituting the base material. means.
In the present specification, "thickness" is a constant pressure thickness measuring device according to JIS K7130 as a value represented by an average of thickness measured at five randomly selected points unless otherwise specified. Can be obtained using.
　基材は、その上に設けられる粘着剤層等の他の層との密着性を向上させるために、サンドブラスト処理、溶剤処理、エンボス加工処理等による凹凸化処理；コロナ放電処理、電子線照射処理、プラズマ処理、オゾン・紫外線照射処理、火炎処理、クロム酸処理、熱風処理等の酸化処理；等が表面に施されていてもよい。
　また、基材の表面は、プライマー処理されていてもよい。
　また、基材は、帯電防止コート層；ダイボンディングシートを重ね合わせて保存する際に、基材が他のシートに接着することや、基材が吸着テーブルに接着することを防止する層；等を有していてもよい。 The base material is roughened by sandblasting, solvent treatment, embossing, etc. in order to improve adhesion to other layers such as the pressure-sensitive adhesive layer provided on it; corona discharge treatment, electron beam irradiation treatment, etc. , Plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment and other oxidation treatments; etc. may be applied to the surface.
Further, the surface of the base material may be primed.
Further, the base material is an antistatic coat layer; a layer that prevents the base material from adhering to other sheets or adhering to the adsorption table when the die bonding sheets are superposed and stored; etc. May have.
　基材は、前記樹脂等の主たる構成材料以外に、充填材、着色剤、帯電防止剤、酸化防止剤、有機滑剤、触媒、軟化剤（可塑剤）等の公知の各種添加剤を含有していてもよい。 In addition to the main constituent materials such as the resin, the base material contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). You may.
　基材の光学特性は、本発明の効果を損なわない範囲内において、特に限定されない。基材は、例えば、レーザー光又はエネルギー線を透過させるものであってよい。 The optical properties of the base material are not particularly limited as long as the effects of the present invention are not impaired. The base material may be, for example, one that transmits laser light or energy rays.
　基材は、公知の方法で製造できる。例えば、樹脂を含有する（樹脂を構成材料とする）基材は、前記樹脂又は前記樹脂を含有する樹脂組成物を成形することで製造できる。 The base material can be produced by a known method. For example, a base material containing a resin (using a resin as a constituent material) can be produced by molding the resin or a resin composition containing the resin.
○粘着剤層
　前記粘着剤層は、シート状又はフィルム状であり、粘着剤を含有する。
　粘着剤層は、前記粘着剤を含有する粘着剤組成物を用いて形成できる。例えば、粘着剤層の形成対象面に粘着剤組成物を塗工し、必要に応じて乾燥させることで、目的とする部位に粘着剤層を形成できる。 ○ Adhesive layer The adhesive layer is in the form of a sheet or a film and contains an adhesive.
The pressure-sensitive adhesive layer can be formed by using a pressure-sensitive adhesive composition containing the pressure-sensitive adhesive. For example, the pressure-sensitive adhesive layer can be formed on a target portion by applying the pressure-sensitive adhesive composition to the surface to be formed of the pressure-sensitive adhesive layer and drying it if necessary.
　粘着剤組成物の塗工は、公知の方法で行えばよく、例えば、エアーナイフコーター、ブレードコーター、バーコーター、グラビアコーター、ロールコーター、ロールナイフコーター、カーテンコーター、ダイコーター、ナイフコーター、スクリーンコーター、マイヤーバーコーター、キスコーター等の各種コーターを用いる方法が挙げられる。 The pressure-sensitive adhesive composition may be applied by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater. , A method using various coaters such as a Meyer bar coater and a knife coater.
　粘着剤組成物の乾燥条件は、特に限定されないが、粘着剤組成物は、後述する溶媒を含有している場合、加熱乾燥させることが好ましく、この場合、例えば、７０～１３０℃で１０秒～５分の条件で乾燥させることが好ましい。 The drying conditions of the pressure-sensitive adhesive composition are not particularly limited, but when the pressure-sensitive adhesive composition contains a solvent described later, it is preferably heat-dried. In this case, for example, at 70 to 130 ° C. for 10 seconds to It is preferable to dry under the condition of 5 minutes.
　前記粘着剤としては、例えば、アクリル樹脂、ウレタン樹脂、ゴム系樹脂、シリコーン樹脂、エポキシ系樹脂、ポリビニルエーテル、ポリカーボネート、エステル系樹脂等の粘着性樹脂が挙げられ、アクリル樹脂が好ましい。 Examples of the pressure-sensitive adhesive include adhesive resins such as acrylic resin, urethane resin, rubber-based resin, silicone resin, epoxy-based resin, polyvinyl ether, polycarbonate, and ester-based resin, and acrylic resin is preferable.
　なお、本明細書において、「粘着性樹脂」には、粘着性を有する樹脂と、接着性を有する樹脂と、の両方が包含される。例えば、前記粘着性樹脂には、樹脂自体が粘着性を有するものだけでなく、添加剤等の他の成分との併用により粘着性を示す樹脂や、熱又は水等のトリガーの存在によって接着性を示す樹脂等も含まれる。 In the present specification, the "adhesive resin" includes both a resin having adhesiveness and a resin having adhesiveness. For example, the adhesive resin includes not only the resin itself having adhesiveness, but also a resin showing adhesiveness when used in combination with other components such as additives, and adhesiveness due to the presence of a trigger such as heat or water. Also included are resins and the like.
　粘着剤層は、硬化性及び非硬化性のいずれであってもよく、例えば、エネルギー線硬化性及び非エネルギー線硬化性のいずれであってもよい。硬化性の粘着剤層は、その硬化前及び硬化後での物性を、容易に調節できる。 The pressure-sensitive adhesive layer may be either curable or non-curable, and may be, for example, either energy ray-curable or non-energy ray-curable. The physical properties of the curable pressure-sensitive adhesive layer before and after curing can be easily adjusted.
　本明細書において、「エネルギー線」とは、電磁波又は荷電粒子線の中でエネルギー量子を有するものを意味する。エネルギー線の例としては、紫外線、放射線、電子線等が挙げられる。紫外線は、例えば、紫外線源として高圧水銀ランプ、ヒュージョンランプ、キセノンランプ、ブラックライト又はＬＥＤランプ等を用いることで照射できる。電子線は、電子線加速器等によって発生させたものを照射できる。
　また、本明細書において、「エネルギー線硬化性」とは、エネルギー線を照射することにより硬化する性質を意味し、「非エネルギー線硬化性」とは、エネルギー線を照射しても硬化しない性質を意味する。 As used herein, the term "energy ray" means an electromagnetic wave or a charged particle beam having an energy quantum. Examples of energy rays include ultraviolet rays, radiation, electron beams and the like. Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
Further, in the present specification, "energy ray curable" means a property of being cured by irradiating with energy rays, and "non-energy ray curable" is a property of not being cured by irradiating with energy rays. Means.
　粘着剤層は１層（単層）からなるものであってもよいし、２層以上の複数層からなるものであってもよく、複数層からなる場合、これら複数層は、互いに同一でも異なっていてもよく、これら複数層の組み合わせは特に限定されない。 The pressure-sensitive adhesive layer may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other. The combination of these plurality of layers is not particularly limited.
　粘着剤層の厚さは１～１００μｍであることが好ましく、１～６０μｍであることがより好ましく、１～３０μｍであることが特に好ましい。
　ここで、「粘着剤層の厚さ」とは、粘着剤層全体の厚さを意味し、例えば、複数層からなる粘着剤層の厚さとは、粘着剤層を構成するすべての層の合計の厚さを意味する。 The thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 μm, more preferably 1 to 60 μm, and particularly preferably 1 to 30 μm.
Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers is the sum of all the layers constituting the pressure-sensitive adhesive layer. Means the thickness of.
　基材及び粘着剤層とは、同形状であってよく、基材及び粘着剤層とが、それらの平面視形状の外周が一致するよう積層されていることが好ましい。 The base material and the pressure-sensitive adhesive layer may have the same shape, and it is preferable that the base material and the pressure-sensitive adhesive layer are laminated so that the outer circumferences of their plan-view shapes coincide with each other.
　粘着剤層の光学特性は、本発明の効果を損なわない範囲内において、特に限定されない。例えば、粘着剤層はエネルギー線を透過させるものであってもよい。
　次に、前記粘着剤組成物について説明する。
　下記粘着剤組成物は、例えば、下記の１種以上の成分を、含有量（質量％）の合計が１００質量％を超えないように含有することができる。 The optical properties of the pressure-sensitive adhesive layer are not particularly limited as long as the effects of the present invention are not impaired. For example, the pressure-sensitive adhesive layer may be one that allows energy rays to pass through.
Next, the pressure-sensitive adhesive composition will be described.
The following pressure-sensitive adhesive composition can contain, for example, one or more of the following components so that the total content (% by mass) does not exceed 100% by mass.
＜＜粘着剤組成物＞＞
　粘着剤層がエネルギー線硬化性である場合、エネルギー線硬化性粘着剤を含有する粘着剤組成物、すなわち、エネルギー線硬化性の粘着剤組成物としては、例えば、非エネルギー線硬化性の粘着性樹脂（Ｉ－１ａ）（以下、「粘着性樹脂（Ｉ－１ａ）」と略記することがある）と、エネルギー線硬化性化合物と、を含有する粘着剤組成物（Ｉ－１）；非エネルギー線硬化性の粘着性樹脂（Ｉ－１ａ）の側鎖に不飽和基が導入されたエネルギー線硬化性の粘着性樹脂（Ｉ－２ａ）（以下、「粘着性樹脂（Ｉ－２ａ）」と略記することがある）を含有する粘着剤組成物（Ｉ－２）；前記粘着性樹脂（Ｉ－２ａ）と、エネルギー線硬化性化合物と、を含有する粘着剤組成物（Ｉ－３）等が挙げられる。 << Adhesive composition >>
When the pressure-sensitive adhesive layer is energy ray-curable, the pressure-sensitive adhesive composition containing the energy ray-curable pressure-sensitive adhesive, that is, the energy ray-curable pressure-sensitive adhesive composition, for example, is a non-energy ray-curable pressure-sensitive adhesive. Adhesive composition (I-1) containing a resin (I-1a) (hereinafter, may be abbreviated as "adhesive resin (I-1a)") and an energy ray-curable compound; non-energy An energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the linear curable adhesive resin (I-1a) (hereinafter referred to as "adhesive resin (I-2a)"). A pressure-sensitive adhesive composition (I-2) containing (may be abbreviated); a pressure-sensitive adhesive composition (I-3) containing the pressure-sensitive resin (I-2a) and an energy ray-curable compound, etc. Can be mentioned.
＜粘着剤組成物（Ｉ－１）＞
　前記粘着剤組成物（Ｉ－１）は、上述の様に、非エネルギー線硬化性の粘着性樹脂（Ｉ－１ａ）と、エネルギー線硬化性化合物と、を含有する。 <Adhesive composition (I-1)>
As described above, the pressure-sensitive adhesive composition (I-1) contains a non-energy ray-curable pressure-sensitive adhesive resin (I-1a) and an energy ray-curable compound.
［粘着性樹脂（Ｉ－１ａ）］
　前記粘着性樹脂（Ｉ－１ａ）は、アクリル樹脂であることが好ましい。
　前記アクリル樹脂としては、例えば、少なくとも（メタ）アクリル酸アルキルエステル由来の構成単位を有するアクリル重合体が挙げられる。
　前記アクリル樹脂が有する構成単位は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 [Adhesive resin (I-1a)]
The adhesive resin (I-1a) is preferably an acrylic resin.
Examples of the acrylic resin include an acrylic polymer having a structural unit derived from at least a (meth) acrylic acid alkyl ester.
The structural unit of the acrylic resin may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
　粘着剤組成物（Ｉ－１）が含有する粘着性樹脂（Ｉ－１ａ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when two or more types are used. The combination and ratio can be selected arbitrarily.
　粘着剤組成物（Ｉ－１）において、粘着剤組成物（Ｉ－１）の総質量に対する、粘着性樹脂（Ｉ－１ａ）の含有量の割合は、５～９９質量％であることが好ましく、１０～９５質量％であることがより好ましく、１５～９０質量％であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-1), the ratio of the content of the pressure-sensitive adhesive resin (I-1a) to the total mass of the pressure-sensitive adhesive composition (I-1) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
［エネルギー線硬化性化合物］
　粘着剤組成物（Ｉ－１）が含有する前記エネルギー線硬化性化合物としては、エネルギー線重合性不飽和基を有し、エネルギー線の照射により硬化可能なモノマー又はオリゴマーが挙げられる。
　エネルギー線硬化性化合物のうち、モノマーとしては、例えば、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトール（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、１，４－ブチレングリコールジ（メタ）アクリレート、１，６－へキサンジオール（メタ）アクリレート等の多価（メタ）アクリレート；ウレタン（メタ）アクリレート；ポリエステル（メタ）アクリレート；ポリエーテル（メタ）アクリレート；エポキシ（メタ）アクリレート等が挙げられる。
　エネルギー線硬化性化合物のうち、オリゴマーとしては、例えば、上記で例示したモノマーが重合してなるオリゴマー等が挙げられる。
　エネルギー線硬化性化合物は、分子量が比較的大きく、粘着剤層の貯蔵弾性率を低下させにくいという点では、ウレタン（メタ）アクリレート、ウレタン（メタ）アクリレートオリゴマーが好ましい。 [Energy ray curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) include monomers or oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays.
Among the energy ray-curable compounds, examples of the monomer include trimethylpropantri (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4. Multivalent (meth) acrylates such as -butylene glycol di (meth) acrylate, 1,6-hexanediol (meth) acrylate; urethane (meth) acrylate; polyester (meth) acrylate; polyether (meth) acrylate; epoxy ( Meta) Acrylate and the like can be mentioned.
Among the energy ray-curable compounds, examples of the oligomer include an oligomer obtained by polymerizing the monomers exemplified above.
The energy ray-curable compound has a relatively large molecular weight, and urethane (meth) acrylate and urethane (meth) acrylate oligomer are preferable in that the storage elastic modulus of the pressure-sensitive adhesive layer is unlikely to be lowered.
　粘着剤組成物（Ｉ－１）が含有する前記エネルギー線硬化性化合物は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
　粘着剤組成物（Ｉ－１）において、粘着剤組成物（Ｉ－１）の総質量に対する、前記エネルギー線硬化性化合物の含有量の割合は、１～９５質量％であることが好ましく、５～９０質量％であることがより好ましく、１０～８５質量％であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-1), the ratio of the content of the energy ray-curable compound to the total mass of the pressure-sensitive adhesive composition (I-1) is preferably 1 to 95% by mass, and 5 It is more preferably to 90% by mass, and particularly preferably 10 to 85% by mass.
［架橋剤］
　粘着性樹脂（Ｉ－１ａ）として、（メタ）アクリル酸アルキルエステル由来の構成単位以外に、さらに、官能基含有モノマー由来の構成単位を有する前記アクリル重合体を用いる場合、粘着剤組成物（Ｉ－１）は、さらに架橋剤を含有することが好ましい。 [Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester is used as the adhesive resin (I-1a), the pressure-sensitive adhesive composition (I) -1) preferably further contains a cross-linking agent.
　前記架橋剤は、例えば、前記官能基と反応して、粘着性樹脂（Ｉ－１ａ）同士を架橋する。
　架橋剤としては、例えば、トリレンジイソシアネート、ヘキサメチレンジイソシアネート、キシリレンジイソシアネート、これらジイソシアネートのアダクト体等のイソシアネート系架橋剤（イソシアネート基を有する架橋剤）；エチレングリコールグリシジルエーテル等のエポキシ系架橋剤（グリシジル基を有する架橋剤）；ヘキサ［１－（２－メチル）－アジリジニル］トリフオスファトリアジン等のアジリジン系架橋剤（アジリジニル基を有する架橋剤）；アルミニウムキレート等の金属キレート系架橋剤（金属キレート構造を有する架橋剤）；イソシアヌレート系架橋剤（イソシアヌル酸骨格を有する架橋剤）等が挙げられる。
　粘着剤の凝集力を向上させて粘着剤層の粘着力を向上させる点、及び入手が容易である等の点から、架橋剤はイソシアネート系架橋剤であることが好ましい。 The cross-linking agent reacts with the functional group, for example, to cross-link the adhesive resins (I-1a) with each other.
Examples of the cross-linking agent include isocyanate-based cross-linking agents such as tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates (cross-linking agents having an isocyanate group); and epoxy-based cross-linking agents such as ethylene glycol glycidyl ether (cross-linking agents). Cross-linking agent having a glycidyl group); Isocyanate-based cross-linking agent such as hexa [1- (2-methyl) -aziridinyl] triphosphatriazine (cross-linking agent having an aziridinyl group); Metal chelate-based cross-linking agent such as aluminum chelate (metal) A cross-linking agent having a chelate structure); an isocyanurate-based cross-linking agent (a cross-linking agent having an isocyanurate skeleton) and the like can be mentioned.
The cross-linking agent is preferably an isocyanate-based cross-linking agent from the viewpoints of improving the cohesive force of the pressure-sensitive adhesive to improve the adhesive force of the pressure-sensitive adhesive layer and being easily available.
　粘着剤組成物（Ｉ－１）が含有する架橋剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The cross-linking agent contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
　架橋剤を用いる場合、前記粘着剤組成物（Ｉ－１）において、架橋剤の含有量は、粘着性樹脂（Ｉ－１ａ）の含有量１００質量部に対して、０．０１～５０質量部であることが好ましく、０．１～２０質量部であることがより好ましく、０．３～１５質量部であることが特に好ましい。 When a cross-linking agent is used, the content of the cross-linking agent in the pressure-sensitive adhesive composition (I-1) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
［光重合開始剤］
　粘着剤組成物（Ｉ－１）は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物（Ｉ－１）は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。 [Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-1) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-1) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
　前記光重合開始剤としては、例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル、ベンゾイン安息香酸、ベンゾイン安息香酸メチル、ベンゾインジメチルケタール等のベンゾイン化合物；アセトフェノン、２－ヒドロキシ－２－メチル－１－フェニル－プロパン－１－オン、２，２－ジメトキシ－１，２－ジフェニルエタン－１－オン等のアセトフェノン化合物；ビス（２，４，６－トリメチルベンゾイル）フェニルフォスフィンオキサイド、２，４，６－トリメチルベンゾイルジフェニルフォスフィンオキサイド等のアシルフォスフィンオキサイド化合物；ベンジルフェニルスルフィド、テトラメチルチウラムモノスルフィド等のスルフィド化合物；１－ヒドロキシシクロヘキシルフェニルケトン等のα－ケトール化合物；アゾビスイソブチロニトリル等のアゾ化合物；チタノセン等のチタノセン化合物；チオキサントン等のチオキサントン化合物；パーオキサイド化合物；ジアセチル等のジケトン化合物；ベンジル；ジベンジル；ベンゾフェノン；２，４－ジエチルチオキサントン；１，２－ジフェニルメタン；２－ヒドロキシ－２－メチル－１－［４－（１－メチルビニル）フェニル］プロパノン；２－クロロアントラキノン等が挙げられる。
　また、前記光重合開始剤としては、例えば、１－クロロアントラキノン等のキノン化合物；アミン等の光増感剤等を用いることもできる。 Examples of the photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal; acetophenone and 2-hydroxy. Acetphenone compounds such as -2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6-trimethylbenzoyl) phenylphosphine Acylphosphine oxide compounds such as oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; α-ketol compounds such as 1-hydroxycyclohexylphenylketone; azo Azo compounds such as bisisobutyronitrile; titanocene compounds such as titanosen; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethylthioxanthone; 1,2-diphenylmethane 2-Hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone; 2-chloroanthraquinone and the like can be mentioned.
Further, as the photopolymerization initiator, for example, a quinone compound such as 1-chloroanthraquinone; a photosensitizer such as amine can also be used.
　粘着剤組成物（Ｉ－１）が含有する光重合開始剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
　光重合開始剤を用いる場合、粘着剤組成物（Ｉ－１）において、光重合開始剤の含有量は、前記エネルギー線硬化性化合物の含有量１００質量部に対して、０．０１～２０質量部であることが好ましく、０．０３～１０質量部であることがより好ましく、０．０５～５質量部であることが特に好ましい。 When a photopolymerization initiator is used, the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-1) is 0.01 to 20 mass by mass with respect to 100 parts by mass of the content of the energy ray-curable compound. The amount is preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
［その他の添加剤］
　粘着剤組成物（Ｉ－１）は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
　前記その他の添加剤としては、例えば、帯電防止剤、酸化防止剤、軟化剤（可塑剤）、充填材（フィラー）、防錆剤、着色剤（顔料、染料）、増感剤、粘着付与剤、反応遅延剤、架橋促進剤（触媒）等の公知の添加剤が挙げられる。 [Other additives]
The pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Examples of the other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust preventives, colorants (pigments, dyes), sensitizers, and tackifiers. , Known additives such as reaction retarders and cross-linking accelerators (catalysts).
　なお、反応遅延剤とは、例えば、粘着剤組成物（Ｉ－１）中に混入している触媒の作用によって、保存中の粘着剤組成物（Ｉ－１）において、目的としない架橋反応が進行するのを抑制するための成分である。反応遅延剤としては、例えば、触媒に対するキレートによってキレート錯体を形成するものが挙げられ、より具体的には、１分子中にカルボニル基（－Ｃ（＝Ｏ）－）を２個以上有するものが挙げられる。 The reaction retarder means, for example, that an unintended cross-linking reaction occurs in the pressure-sensitive adhesive composition (I-1) being stored due to the action of the catalyst mixed in the pressure-sensitive adhesive composition (I-1). It is a component for suppressing the progress. Examples of the reaction retarder include those that form a chelate complex by chelating to a catalyst, and more specifically, those having two or more carbonyl groups (-C (= O)-) in one molecule. Can be mentioned.
　粘着剤組成物（Ｉ－１）が含有するその他の添加剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The other additives contained in the pressure-sensitive adhesive composition (I-1) may be only one kind, two or more kinds, and when there are two or more kinds, the combination and ratio thereof are It can be selected arbitrarily.
　粘着剤組成物（Ｉ－１）のその他の添加剤の含有量は特に限定されず、その種類に応じて適宜選択すればよい。 The content of the other additives in the pressure-sensitive adhesive composition (I-1) is not particularly limited, and may be appropriately selected depending on the type thereof.
［溶媒］
　粘着剤組成物（Ｉ－１）は、溶媒を含有していてもよい。粘着剤組成物（Ｉ－１）は、溶媒を含有していることで、塗工対象面への塗工適性が向上する。 [solvent]
The pressure-sensitive adhesive composition (I-1) may contain a solvent. Since the pressure-sensitive adhesive composition (I-1) contains a solvent, the suitability for coating on the surface to be coated is improved.
　前記溶媒は有機溶媒であることが好ましい。 The solvent is preferably an organic solvent.
＜粘着剤組成物（Ｉ－２）＞
　前記粘着剤組成物（Ｉ－２）は、上述の様に、非エネルギー線硬化性の粘着性樹脂（Ｉ－１ａ）の側鎖に不飽和基が導入されたエネルギー線硬化性の粘着性樹脂（Ｉ－２ａ）を含有する。 <Adhesive composition (I-2)>
As described above, the pressure-sensitive adhesive composition (I-2) is an energy ray-curable pressure-sensitive adhesive resin in which an unsaturated group is introduced into the side chain of the non-energy ray-curable pressure-sensitive adhesive resin (I-1a). (I-2a) is contained.
［粘着性樹脂（Ｉ－２ａ）］
　前記粘着性樹脂（Ｉ－２ａ）は、例えば、粘着性樹脂（Ｉ－１ａ）中の官能基に、エネルギー線重合性不飽和基を有する不飽和基含有化合物を反応させることで得られる。 [Adhesive resin (I-2a)]
The adhesive resin (I-2a) can be obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.
　前記不飽和基含有化合物は、前記エネルギー線重合性不飽和基以外に、さらに粘着性樹脂（Ｉ－１ａ）中の官能基と反応することで、粘着性樹脂（Ｉ－１ａ）と結合可能な基を有する化合物である。
　前記エネルギー線重合性不飽和基としては、例えば、（メタ）アクリロイル基、ビニル基（エテニル基）、アリル基（２－プロペニル基）等が挙げられ、（メタ）アクリロイル基が好ましい。
　粘着性樹脂（Ｉ－１ａ）中の官能基と結合可能な基としては、例えば、水酸基又はアミノ基と結合可能なイソシアネート基及びグリシジル基、並びにカルボキシ基又はエポキシ基と結合可能な水酸基及びアミノ基等が挙げられる。 The unsaturated group-containing compound can be bonded to the adhesive resin (I-1a) by further reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group. It is a compound having a group.
Examples of the energy ray-polymerizable unsaturated group include (meth) acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like, and (meth) acryloyl group is preferable.
Examples of the group that can be bonded to the functional group in the adhesive resin (I-1a) include an isocyanate group and a glycidyl group that can be bonded to a hydroxyl group or an amino group, and a hydroxyl group and an amino group that can be bonded to a carboxy group or an epoxy group. And so on.
　前記不飽和基含有化合物としては、例えば、（メタ）アクリロイルオキシエチルイソシアネート、（メタ）アクリロイルイソシアネート、グリシジル（メタ）アクリレート等が挙げられる。 Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, and glycidyl (meth) acrylate.
　粘着剤組成物（Ｉ－２）が含有する粘着性樹脂（Ｉ－２ａ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when two or more types are used. The combination and ratio can be selected arbitrarily.
　粘着剤組成物（Ｉ－２）において、粘着剤組成物（Ｉ－２）の総質量に対する、粘着性樹脂（Ｉ－２ａ）の含有量の割合は、５～９９質量％であることが好ましく、１０～９５質量％であることがより好ましく、１０～９０質量％であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-2), the ratio of the content of the pressure-sensitive adhesive resin (I-2a) to the total mass of the pressure-sensitive adhesive composition (I-2) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 10 to 90% by mass.
［架橋剤］
　粘着性樹脂（Ｉ－２ａ）として、例えば、粘着性樹脂（Ｉ－１ａ）におけるものと同様の、官能基含有モノマー由来の構成単位を有する前記アクリル重合体を用いる場合、粘着剤組成物（Ｉ－２）は、さらに架橋剤を含有していてもよい。 [Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer similar to that in the adhesive resin (I-1a) is used as the adhesive resin (I-2a), for example, the pressure-sensitive adhesive composition (I) -2) may further contain a cross-linking agent.
　粘着剤組成物（Ｉ－２）における前記架橋剤としては、粘着剤組成物（Ｉ－１）における架橋剤と同じものが挙げられる。
　粘着剤組成物（Ｉ－２）が含有する架橋剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
The cross-linking agent contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
　架橋剤を用いる場合、前記粘着剤組成物（Ｉ－２）において、架橋剤の含有量は、粘着性樹脂（Ｉ－２ａ）の含有量１００質量部に対して、０．０１～５０質量部であることが好ましく、０．１～２０質量部であることがより好ましく、０．３～１５質量部であることが特に好ましい。 When a cross-linking agent is used, the content of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) is 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.
［光重合開始剤］
　粘着剤組成物（Ｉ－２）は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物（Ｉ－２）は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。 [Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-2) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-2) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
　粘着剤組成物（Ｉ－２）における前記光重合開始剤としては、粘着剤組成物（Ｉ－１）における光重合開始剤と同じものが挙げられる。
　粘着剤組成物（Ｉ－２）が含有する光重合開始剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
　光重合開始剤を用いる場合、粘着剤組成物（Ｉ－２）において、光重合開始剤の含有量は、粘着性樹脂（Ｉ－２ａ）の含有量１００質量部に対して、０．０１～２０質量部であることが好ましく、０．０３～１０質量部であることがより好ましく、０．０５～５質量部であることが特に好ましい。 When a photopolymerization initiator is used, the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) is 0.01 to 100 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
［その他の添加剤、溶媒］
　粘着剤組成物（Ｉ－２）は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
　また、粘着剤組成物（Ｉ－２）は、粘着剤組成物（Ｉ－１）の場合と同様の目的で、溶媒を含有していてもよい。
　粘着剤組成物（Ｉ－２）における、前記その他の添加剤及び溶媒としては、それぞれ、粘着剤組成物（Ｉ－１）における、その他の添加剤及び溶媒と同じものが挙げられる。
　粘着剤組成物（Ｉ－２）が含有する、その他の添加剤及び溶媒は、それぞれ、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　粘着剤組成物（Ｉ－２）の、その他の添加剤及び溶媒の含有量は、それぞれ、特に限定されず、その種類に応じて適宜選択すればよい。 [Other additives and solvents]
The pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Further, the pressure-sensitive adhesive composition (I-2) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-2) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively.
The other additives and solvents contained in the pressure-sensitive adhesive composition (I-2) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable.
The contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-2) are not particularly limited, and may be appropriately selected depending on the type thereof.
＜粘着剤組成物（Ｉ－３）＞
　前記粘着剤組成物（Ｉ－３）は、上述の様に、前記粘着性樹脂（Ｉ－２ａ）と、エネルギー線硬化性化合物と、を含有する。 <Adhesive composition (I-3)>
As described above, the pressure-sensitive adhesive composition (I-3) contains the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound.
　粘着剤組成物（Ｉ－３）において、粘着剤組成物（Ｉ－３）の総質量に対する、粘着性樹脂（Ｉ－２ａ）の含有量の割合は、５～９９質量％であることが好ましく、１０～９５質量％であることがより好ましく、１５～９０質量％であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-3), the ratio of the content of the pressure-sensitive adhesive resin (I-2a) to the total mass of the pressure-sensitive adhesive composition (I-3) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
［エネルギー線硬化性化合物］
　粘着剤組成物（Ｉ－３）が含有する前記エネルギー線硬化性化合物としては、エネルギー線重合性不飽和基を有し、エネルギー線の照射により硬化可能なモノマー及びオリゴマーが挙げられ、粘着剤組成物（Ｉ－１）が含有するエネルギー線硬化性化合物と同じものが挙げられる。
　粘着剤組成物（Ｉ－３）が含有する前記エネルギー線硬化性化合物は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 [Energy ray curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) include monomers and oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays, and the pressure-sensitive adhesive composition. Examples thereof include the same energy ray-curable compounds contained in the substance (I-1).
The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
　前記粘着剤組成物（Ｉ－３）において、前記エネルギー線硬化性化合物の含有量は、粘着性樹脂（Ｉ－２ａ）の含有量１００質量部に対して、０．０１～３００質量部であることが好ましく、０．０３～２００質量部であることがより好ましく、０．０５～１００質量部であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-3), the content of the energy ray-curable compound is 0.01 to 300 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass.
［光重合開始剤］
　粘着剤組成物（Ｉ－３）は、さらに光重合開始剤を含有していてもよい。光重合開始剤を含有する粘着剤組成物（Ｉ－３）は、紫外線等の比較的低エネルギーのエネルギー線を照射しても、十分に硬化反応が進行する。 [Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-3) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-3) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.
　粘着剤組成物（Ｉ－３）における前記光重合開始剤としては、粘着剤組成物（Ｉ－１）における光重合開始剤と同じものが挙げられる。
　粘着剤組成物（Ｉ－３）が含有する光重合開始剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are It can be selected arbitrarily.
　光重合開始剤を用いる場合、粘着剤組成物（Ｉ－３）において、光重合開始剤の含有量は、粘着性樹脂（Ｉ－２ａ）及び前記エネルギー線硬化性化合物の総含有量１００質量部に対して、０．０１～２０質量部であることが好ましく、０．０３～１０質量部であることがより好ましく、０．０５～５質量部であることが特に好ましい。 When a photopolymerization initiator is used, the content of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) is 100 parts by mass of the total content of the pressure-sensitive adhesive resin (I-2a) and the energy ray-curable compound. On the other hand, it is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.
［その他の添加剤、溶媒］
　粘着剤組成物（Ｉ－３）は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
　また、粘着剤組成物（Ｉ－３）は、粘着剤組成物（Ｉ－１）の場合と同様の目的で、溶媒を含有していてもよい。
　粘着剤組成物（Ｉ－３）における、前記その他の添加剤及び溶媒としては、それぞれ、粘着剤組成物（Ｉ－１）における、その他の添加剤及び溶媒と同じものが挙げられる。　粘着剤組成物（Ｉ－３）が含有する、その他の添加剤及び溶媒は、それぞれ、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　粘着剤組成物（Ｉ－３）の、その他の添加剤及び溶媒の含有量は、それぞれ、特に限定されず、その種類に応じて適宜選択すればよい。 [Other additives and solvents]
The pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Further, the pressure-sensitive adhesive composition (I-3) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-3) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively. The other additives and solvents contained in the pressure-sensitive adhesive composition (I-3) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable.
The contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-3) are not particularly limited, and may be appropriately selected depending on the type thereof.
＜粘着剤組成物（Ｉ－１）～（Ｉ－３）以外の粘着剤組成物＞
　ここまでは、粘着剤組成物（Ｉ－１）、粘着剤組成物（Ｉ－２）及び粘着剤組成物（Ｉ－３）について主に説明したが、これらの含有成分として説明したものは、これら３種の粘着剤組成物以外の全般的な粘着剤組成物（本明細書においては、「粘着剤組成物（Ｉ－１）～（Ｉ－３）以外の粘着剤組成物」と称する）でも、同様に用いることができる。 <Adhesive compositions other than adhesive compositions (I-1) to (I-3)>
Up to this point, the pressure-sensitive adhesive composition (I-1), the pressure-sensitive adhesive composition (I-2), and the pressure-sensitive adhesive composition (I-3) have been mainly described. General pressure-sensitive adhesive compositions other than these three types of pressure-sensitive adhesive compositions (referred to in the present specification as "pressure-sensitive adhesive compositions other than pressure-sensitive adhesive compositions (I-1) to (I-3)"). However, it can be used in the same way.
　粘着剤組成物（Ｉ－１）～（Ｉ－３）以外の粘着剤組成物としては、エネルギー線硬化性の粘着剤組成物以外に、非エネルギー線硬化性の粘着剤組成物も挙げられる。
　非エネルギー線硬化性の粘着剤組成物としては、例えば、アクリル樹脂、ウレタン樹脂、ゴム系樹脂、シリコーン樹脂、エポキシ系樹脂、ポリビニルエーテル、ポリカーボネート、エステル系樹脂等の、非エネルギー線硬化性の粘着性樹脂（Ｉ－１ａ）を含有する粘着剤組成物（Ｉ－４）が挙げられ、アクリル樹脂を含有するものが好ましい。 Examples of the pressure-sensitive adhesive composition other than the pressure-sensitive adhesive compositions (I-1) to (I-3) include non-energy ray-curable pressure-sensitive adhesive compositions in addition to the energy-ray-curable pressure-sensitive adhesive composition.
Examples of the non-energy ray-curable pressure-sensitive adhesive composition include non-energy ray-curable pressure-sensitive adhesives such as acrylic resin, urethane resin, rubber-based resin, silicone resin, epoxy-based resin, polyvinyl ether, polycarbonate, and ester-based resin. Examples thereof include a pressure-sensitive adhesive composition (I-4) containing a sex resin (I-1a), and those containing an acrylic resin are preferable.
　粘着剤組成物（Ｉ－１）～（Ｉ－３）以外の粘着剤組成物は、１種又は２種以上の架橋剤を含有することが好ましく、その含有量は、上述の粘着剤組成物（Ｉ－１）等の場合と同様とすることができる。 The pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) preferably contain one or more cross-linking agents, and the content thereof is the above-mentioned pressure-sensitive adhesive composition. The same can be applied to the case of (I-1) and the like.
＜粘着剤組成物（Ｉ－４）＞
　粘着剤組成物（Ｉ－４）で好ましいものとしては、例えば、前記粘着性樹脂（Ｉ－１ａ）と、架橋剤と、を含有するものが挙げられる。 <Adhesive composition (I-4)>
Preferred adhesive composition (I-4) includes, for example, the adhesive resin (I-1a) and a cross-linking agent.
［粘着性樹脂（Ｉ－１ａ）］
　粘着剤組成物（Ｉ－４）における粘着性樹脂（Ｉ－１ａ）としては、粘着剤組成物（Ｉ－１）における粘着性樹脂（Ｉ－１ａ）と同じものが挙げられる。
　粘着剤組成物（Ｉ－４）が含有する粘着性樹脂（Ｉ－１ａ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 [Adhesive resin (I-1a)]
Examples of the adhesive resin (I-1a) in the pressure-sensitive adhesive composition (I-4) include the same adhesive resin (I-1a) as in the pressure-sensitive adhesive composition (I-1).
The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when two or more types are used. The combination and ratio can be selected arbitrarily.
　粘着剤組成物（Ｉ－４）において、粘着剤組成物（Ｉ－４）の総質量に対する、粘着性樹脂（Ｉ－１ａ）の含有量の割合は、５～９９質量％であることが好ましく、１０～９５質量％であることがより好ましく、１５～９０質量％であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-4), the ratio of the content of the pressure-sensitive adhesive resin (I-1a) to the total mass of the pressure-sensitive adhesive composition (I-4) is preferably 5 to 99% by mass. It is more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass.
［架橋剤］
　粘着性樹脂（Ｉ－１ａ）として、（メタ）アクリル酸アルキルエステル由来の構成単位以外に、さらに、官能基含有モノマー由来の構成単位を有する前記アクリル重合体を用いる場合、粘着剤組成物（Ｉ－４）は、さらに架橋剤を含有することが好ましい。 [Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester is used as the adhesive resin (I-1a), the pressure-sensitive adhesive composition (I) -4) preferably further contains a cross-linking agent.
　粘着剤組成物（Ｉ－４）における架橋剤としては、粘着剤組成物（Ｉ－１）における架橋剤と同じものが挙げられる。
　粘着剤組成物（Ｉ－４）が含有する架橋剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-4) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
The cross-linking agent contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. You can choose.
　前記粘着剤組成物（Ｉ－４）において、架橋剤の含有量は、粘着性樹脂（Ｉ－１ａ）の含有量１００質量部に対して、０．０１～５０質量部であることが好ましく、０．１～２５質量部であることがより好ましく、０．１～１０質量部であることが特に好ましい。 In the pressure-sensitive adhesive composition (I-4), the content of the cross-linking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is more preferably 0.1 to 25 parts by mass, and particularly preferably 0.1 to 10 parts by mass.
［その他の添加剤、溶媒］
　粘着剤組成物（Ｉ－４）は、本発明の効果を損なわない範囲内において、上述のいずれの成分にも該当しない、その他の添加剤を含有していてもよい。
　また、粘着剤組成物（Ｉ－４）は、粘着剤組成物（Ｉ－１）の場合と同様の目的で、溶媒を含有していてもよい。
　粘着剤組成物（Ｉ－４）における、前記その他の添加剤及び溶媒としては、それぞれ、粘着剤組成物（Ｉ－１）における、その他の添加剤及び溶媒と同じものが挙げられる。　粘着剤組成物（Ｉ－４）が含有する、その他の添加剤及び溶媒は、それぞれ、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　粘着剤組成物（Ｉ－４）の、その他の添加剤及び溶媒の含有量は、それぞれ、特に限定されず、その種類に応じて適宜選択すればよい。 [Other additives and solvents]
The pressure-sensitive adhesive composition (I-4) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Further, the pressure-sensitive adhesive composition (I-4) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the other additives and solvents in the pressure-sensitive adhesive composition (I-4) include the same as the other additives and solvents in the pressure-sensitive adhesive composition (I-1), respectively. The other additives and solvents contained in the pressure-sensitive adhesive composition (I-4) may be only one type, two or more types, or two or more types, if they are two or more types. The combination and ratio of are arbitrarily selectable.
The contents of the other additives and the solvent in the pressure-sensitive adhesive composition (I-4) are not particularly limited, and may be appropriately selected depending on the type thereof.
＜＜粘着剤組成物の製造方法＞＞
　粘着剤組成物（Ｉ－１）～（Ｉ－３）や、粘着剤組成物（Ｉ－４）等の粘着剤組成物（Ｉ－１）～（Ｉ－３）以外の粘着剤組成物は、前記粘着剤と、必要に応じて前記粘着剤以外の成分等の、粘着剤組成物を構成するための各成分を配合することで得られる。
　各成分の配合時における添加順序は特に限定されず、２種以上の成分を同時に添加してもよい。
　溶媒を用いる場合には、溶媒を溶媒以外のいずれかの配合成分と混合してこの配合成分を予め希釈しておくことで用いてもよいし、溶媒以外のいずれかの配合成分を予め希釈しておくことなく、溶媒をこれら配合成分と混合することで用いてもよい。
　配合時に各成分を混合する方法は特に限定されず、撹拌子又は撹拌翼等を回転させて混合する方法；ミキサーを用いて混合する方法；超音波を加えて混合する方法等、公知の方法から適宜選択すればよい。
　各成分の添加及び混合時の温度並びに時間は、各配合成分が劣化しない限り特に限定されず、適宜調節すればよいが、温度は１５～３０℃であることが好ましい。 << Manufacturing method of adhesive composition >>
The pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) and the pressure-sensitive adhesive compositions (I-1) to (I-3) such as the pressure-sensitive adhesive composition (I-4) , The pressure-sensitive adhesive and, if necessary, components other than the pressure-sensitive adhesive, and the like, are obtained by blending each component for forming a pressure-sensitive adhesive composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or diluting any of the compounding components other than the solvent in advance. You may use it by mixing the solvent with these compounding components without leaving.
The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of adding and mixing each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.
○中間層、中間層形成用組成物
　前記中間層は、シート状又はフィルム状であり、前記非ケイ素系樹脂を主成分として含有する。
　中間層は、非ケイ素系樹脂のみを含有するもの（非ケイ素系樹脂からなるもの）であってもよいし、非ケイ素系樹脂とそれ以外の成分を含有するものであってもよい。 -Composition for forming an intermediate layer and an intermediate layer The intermediate layer is in the form of a sheet or a film, and contains the non-silicon resin as a main component.
The intermediate layer may contain only a non-silicon resin (consisting of a non-silicon resin), or may contain a non-silicon resin and other components.
　中間層は、例えば、前記非ケイ素系樹脂を含有する中間層形成用組成物を用いて形成できる。例えば、中間層は、中間層の形成対象面に、前記中間層形成用組成物を塗工し、必要に応じて乾燥させることで形成できる。 The intermediate layer can be formed, for example, by using the composition for forming an intermediate layer containing the non-silicon resin. For example, the intermediate layer can be formed by applying the composition for forming an intermediate layer to the surface to be formed of the intermediate layer and drying it if necessary.
　前記非ケイ素系樹脂の重量平均分子量は、１０００００以下である。
　前記半導体装置製造用シートの上述の半導体ウエハの分割適性が、さらに向上する点では、前記非ケイ素系樹脂の重量平均分子量は、例えば、８００００以下、６００００以下及び４００００以下のいずれかであってもよい。 The weight average molecular weight of the non-silicon resin is 100,000 or less.
In terms of further improving the splitting suitability of the above-mentioned semiconductor wafer of the semiconductor device manufacturing sheet, the weight average molecular weight of the non-silicon resin may be, for example, 80,000 or less, 60,000 or less, or 40,000 or less. good.
　前記非ケイ素系樹脂の重量平均分子量の下限値は、特に限定されない、例えば、重量平均分子量が５０００以上の前記非ケイ素系樹脂は、入手がより容易である。 The lower limit of the weight average molecular weight of the non-silicon resin is not particularly limited. For example, the non-silicon resin having a weight average molecular weight of 5000 or more is more easily available.
　前記非ケイ素系樹脂の重量平均分子量は、上述の下限値と、いずれかの上限値と、を任意に組み合わせて設定される範囲内に、適宜調節できる。例えば、一実施形態において、前記重量平均分子量は、例えば、５０００～１０００００、５０００～８００００、５０００～６００００、及び５０００～４００００のいずれかであってもよい。 The weight average molecular weight of the non-silicon resin can be appropriately adjusted within a range set by arbitrarily combining the above-mentioned lower limit value and any upper limit value. For example, in one embodiment, the weight average molecular weight may be, for example, any of 5000-100,000, 5000-80,000, 5000-60,000, and 5000-40,000.
　本実施形態において、「中間層が、重量平均分子量が１０００００以下の非ケイ素系樹脂を主成分として含有する」とは、「中間層が、重量平均分子量が１０００００以下の非ケイ素系樹脂を含有していることによる効果を十分に発揮できる程度の量で、前記非ケイ素系樹脂を含有している」ことを意味する。このような観点で、中間層において、中間層の総質量に対する、前記非ケイ素系樹脂の含有量の割合（換言すると、中間層形成用組成物において、溶媒以外の全ての成分の総含有量に対する、前記非ケイ素系樹脂の含有量の割合）は、５０質量％以上であることが好ましく、８０質量％以上であることがより好ましく、９０質量％以上であることがさらに好ましく、例えば、９５質量％以上、９７質量％以上、及び９９質量％以上のいずれかであってもよい。
　一方、前記割合は、１００質量％以下である。 In the present embodiment, "the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component" means "the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less". It means that the non-silicon resin is contained in an amount sufficient to exert the effect of the above. " From this point of view, in the intermediate layer, the ratio of the content of the non-silicon resin to the total mass of the intermediate layer (in other words, in the composition for forming the intermediate layer, with respect to the total content of all components other than the solvent). , The content ratio of the non-silicon resin) is preferably 50% by mass or more, more preferably 80% by mass or more, further preferably 90% by mass or more, for example, 95% by mass. It may be any of% or more, 97% by mass or more, and 99% by mass or more.
On the other hand, the ratio is 100% by mass or less.
　重量平均分子量が１０００００以下の前記非ケイ素系樹脂は、構成原子としてケイ素原子を有しない、重量平均分子量が１０００００以下の樹脂成分であれば、特に限定されない。
　前記非ケイ素系樹脂は、例えば、極性基を有する極性樹脂、及び極性基を有しない非極性樹脂、のいずれであってもよい。
　例えば、前記非ケイ素系樹脂は、前記中間層形成用組成物での溶解性が高く、前記中間層形成用組成物の塗工適性がより高い点では、極性樹脂であることが好ましい。 The non-silicon resin having a weight average molecular weight of 100,000 or less is not particularly limited as long as it does not have a silicon atom as a constituent atom and has a weight average molecular weight of 100,000 or less.
The non-silicon resin may be, for example, either a polar resin having a polar group or a non-polar resin having no polar group.
For example, the non-silicon resin is preferably a polar resin in that it has high solubility in the intermediate layer forming composition and higher coating suitability of the intermediate layer forming composition.
　本明細書においては、特に断りのない限り、「非ケイ素系樹脂」とは、上述の重量平均分子量が１０００００以下の非ケイ素系樹脂を意味する。 In the present specification, unless otherwise specified, the "non-silicon resin" means the above-mentioned non-silicon resin having a weight average molecular weight of 100,000 or less.
　前記非ケイ素系樹脂は、例えば、１種のモノマーの重合体である（換言すると、構成単位を１種のみ有する）単独重合体であってもよいし、２種以上のモノマーの重合体である（換言すると、構成単位を２種以上有する）共重合体であってもよい。 The non-silicon resin may be, for example, a copolymer of one kind of monomer (in other words, having only one kind of constituent unit), or a polymer of two or more kinds of monomers. In other words, it may be a copolymer (having two or more kinds of constituent units).
　前記極性基としては、例えば、カルボニルオキシ基（－Ｃ（＝Ｏ）－Ｏ－）、オキシカルボニル基（－Ｏ－Ｃ（＝Ｏ）－）等が挙げられる。 Examples of the polar group include a carbonyloxy group (-C (= O) -O-), an oxycarbonyl group (-OC (= O)-) and the like.
　前記極性樹脂は、極性基を有する構成単位のみを有してもよいし、極性基を有する構成単位と、極性基を有しない構成単位と、の両方を有していてもよい。 The polar resin may have only a structural unit having a polar group, or may have both a structural unit having a polar group and a structural unit having no polar group.
　前記極性基を有する構成単位としては、例えば、酢酸ビニルから誘導された構成単位等が挙げられる。
　前記極性基を有しない構成単位としては、例えば、エチレンから誘導された構成単位等が挙げられる。
　ここでいう「誘導された」とは、前記モノマーが重合するのに必要な構造の変化を受けたことを意味する。 Examples of the structural unit having a polar group include a structural unit derived from vinyl acetate.
Examples of the structural unit having no polar group include a structural unit derived from ethylene.
The term "induced" as used herein means that the monomer has undergone a structural change necessary for polymerization.
　前記極性樹脂において、全ての構成単位の合計質量に対する、極性基を有する構成単位の質量の割合は、５～７０質量％であることが好ましく、例えば、７．５～５５質量％、１０～４０質量％、及び１０～３０質量％のいずれかであってもよい。換言すると、前記極性樹脂において、全ての構成単位の合計質量に対する、極性基を有しない構成単位の質量の割合は、３０～９５質量％であることが好ましく、例えば、４５～９２．５質量％、６０～９０質量％、及び７０～９０質量％のいずれかであってもよい。極性基を有する構成単位の質量の割合が、前記下限値以上であることで、前記極性樹脂は、極性基を有することの特性を、より顕著に有する。極性基を有する構成単位の質量の割合が、前記上限値以下であることで、前記極性樹脂は、極性基を有しないことの特性を、より適度に有する。 In the polar resin, the ratio of the mass of the structural unit having a polar group to the total mass of all the structural units is preferably 5 to 70% by mass, for example, 7.5 to 55% by mass, 10 to 40. It may be either 1% by mass and 10 to 30% by mass. In other words, in the polar resin, the ratio of the mass of the structural unit having no polar group to the total mass of all the structural units is preferably 30 to 95% by mass, for example, 45 to 92.5% by mass. , 60-90% by mass, and 70-90% by mass. When the mass ratio of the structural unit having a polar group is equal to or more than the lower limit value, the polar resin has a more remarkable characteristic of having a polar group. When the mass ratio of the structural unit having a polar group is not more than the upper limit value, the polar resin has a more appropriate characteristic of not having a polar group.
　前記極性樹脂としては、例えば、エチレン酢酸ビニル共重合体等が挙げられる。
　前記中間層に含有される前記非ケイ素系樹脂の総質量に対する、エチレン酢酸ビニル共重合体の含有量の割合は、例えば、５０～１００質量％であってよく、８０～１００質量％であってよく、９０～１００質量％であってよい。
　なかでも、好ましい前記極性樹脂としては、例えば、エチレン酢酸ビニル共重合体において、全ての構成単位の合計質量に対する、酢酸ビニルから誘導された構成単位の質量の割合（本明細書においては、「酢酸ビニルから誘導された構成単位の含有量」と称することがある）が、４０質量％以下であるもの、３０質量％以下であるもの、１０～４０質量％であるもの、１０～３０質量％であるものが挙げられる。換言すると、好ましい前記極性樹脂としては、例えば、エチレン酢酸ビニル共重合体において、全ての構成単位の合計質量に対する、エチレンから誘導された構成単位の質量の割合が、６０質量％以上であるもの、７０質量％以上であるもの、７０～９０質量％であるもの、６０～９０質量％であるものが挙げられる。
　酢酸ビニルから誘導された構成単位の含有量の割合が、前記上限値以下であることで、フィルム状接着剤の切断時に中間層から切削屑が発生しても、発生した切削屑の粘着力が適度に低下し、洗浄等によって、切削屑をチップ上から容易に除去可能である。 Examples of the polar resin include ethylene-vinyl acetate copolymer and the like.
The ratio of the content of the ethylene-vinyl acetate copolymer to the total mass of the non-silicon resin contained in the intermediate layer may be, for example, 50 to 100% by mass, and 80 to 100% by mass. It may be 90 to 100% by mass.
Among them, as the preferred polar resin, for example, in an ethylene-vinyl acetate copolymer, the ratio of the mass of the structural unit derived from vinyl acetate to the total mass of all the structural units (in the present specification, "acetic acid". The content of the structural unit derived from vinyl is sometimes referred to as "content" of 40% by mass or less, 30% by mass or less, 10 to 40% by mass, or 10 to 30% by mass. Some are mentioned. In other words, as the preferred polar resin, for example, in an ethylene-vinyl acetate copolymer, the ratio of the mass of the constituent units derived from ethylene to the total mass of all the constituent units is 60% by mass or more. Examples thereof include those having a mass of 70% by mass or more, those having a mass of 70 to 90% by mass, and those having a mass of 60 to 90% by mass.
When the ratio of the content of the structural unit derived from vinyl acetate is not more than the above upper limit value, even if cutting chips are generated from the intermediate layer when cutting the film-like adhesive, the adhesive force of the generated cutting chips is increased. It is moderately lowered, and cutting chips can be easily removed from the chip by cleaning or the like.
　前記非極性樹脂としては、例えば、低密度ポリエチレン（ＬＤＰＥ）、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）、メタロセン触媒直鎖状低密度ポリエチレン（メタロセンＬＬＤＰＥ）、中密度ポリエチレン（ＭＤＰＥ）、高密度ポリエチレン（ＨＤＰＥ）等のポリエチレン（ＰＥ）；ポリプロピレン（ＰＰ）等が挙げられる。 Examples of the non-polar resin include low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), metallocene-catalyzed linear low-density polyethylene (metallocene LLDPE), medium-density polyethylene (MDPE), and high-density polyethylene ( Examples include polyethylene (PE) such as HDPE); polypropylene (PP) and the like.
　中間層形成用組成物及び中間層が含有する前記非ケイ素系樹脂は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　例えば、中間層形成用組成物及び中間層は、極性樹脂である非ケイ素系樹脂を１種又は２種以上含有し、かつ、非極性樹脂である非ケイ素系樹脂を含有していなくてもよいし、非極性樹脂である非ケイ素系樹脂を１種又は２種以上含有し、かつ、極性樹脂である非ケイ素系樹脂を含有していなくてもよいし、極性樹脂である非ケイ素系樹脂と、非極性樹脂である非ケイ素系樹脂と、をともに１種又は２種以上含有してもよい。
　中間層形成用組成物及び中間層は、少なくとも極性樹脂である非ケイ素系樹脂を含有していることが好ましい。 The composition for forming an intermediate layer and the non-silicon resin contained in the intermediate layer may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
For example, the composition for forming an intermediate layer and the intermediate layer may contain one or more types of non-silicon-based resin which is a polar resin, and may not contain a non-silicon-based resin which is a non-polar resin. However, it does not have to contain one or more non-silicon resin which is a non-polar resin and does not contain the non-silicon resin which is a polar resin, and the non-silicon resin which is a polar resin and the non-silicon resin. , A non-silicon resin which is a non-polar resin, and one or more of them may be contained together.
The composition for forming the intermediate layer and the intermediate layer preferably contain at least a non-silicon resin which is a polar resin.
　中間層形成用組成物及び中間層において、前記非ケイ素系樹脂の総含有量に対する、極性樹脂である前記非ケイ素系樹脂の含有量の割合は、５０質量％以上であることが好ましく、８０質量％以上であることが好ましく、９０質量％以上であることがより好ましく、例えば、９５質量％以上、９７質量％以上、及び９９質量％以上のいずれかであってもよい。前記割合が前記下限値以上であることで、前記極性樹脂を用いたことによる効果が、より顕著に得られる。
　一方、前記割合は、１００質量％以下である。 In the composition for forming the intermediate layer and the intermediate layer, the ratio of the content of the non-silicon resin, which is a polar resin, to the total content of the non-silicon resin is preferably 50% by mass or more, preferably 80% by mass. % Or more, more preferably 90% by mass or more, and for example, 95% by mass or more, 97% by mass or more, and 99% by mass or more may be used. When the ratio is at least the lower limit value, the effect of using the polar resin can be obtained more remarkably.
On the other hand, the ratio is 100% by mass or less.
　すなわち、中間層形成用組成物及び中間層において、前記非ケイ素系樹脂の総含有量に対する、非極性樹脂である前記非ケイ素系樹脂の含有量の割合は、２０質量％以下であることが好ましく、１０質量％以下であることがより好ましく、例えば、５質量％以下、３質量％以下、及び１質量％以下のいずれかであってもよい。
　一方、前記割合は、０質量％以上である。 That is, in the intermediate layer forming composition and the intermediate layer, the ratio of the content of the non-silicon resin, which is a non-polar resin, to the total content of the non-silicon resin is preferably 20% by mass or less. It is more preferably 10% by mass or less, and may be, for example, 5% by mass or less, 3% by mass or less, and 1% by mass or less.
On the other hand, the ratio is 0% by mass or more.
　中間層形成用組成物は、その取り扱い性が良好である点では、前記非ケイ素系樹脂以外に、溶媒を含有していることが好ましく、前記非ケイ素系樹脂と、溶媒と、のいずれにも該当しない成分（本明細書においては、「添加剤」と称することがある）を含有していてもよい。
　中間層は、前記非ケイ素系樹脂のみを含有していてもよいし、前記非ケイ素系樹脂と、前記添加剤と、をともに含有していてもよい。 The composition for forming an intermediate layer preferably contains a solvent in addition to the non-silicon resin from the viewpoint of good handleability, and both the non-silicon resin and the solvent It may contain a component that does not apply (sometimes referred to as an "additive" in the present specification).
The intermediate layer may contain only the non-silicon resin, or may contain both the non-silicon resin and the additive.
　前記添加剤は、樹脂成分（本明細書においては、「他の樹脂成分」と称することがある）と、非樹脂成分と、のいずれであってもよい。 The additive may be either a resin component (in the present specification, it may be referred to as "another resin component") or a non-resin component.
　前記他の樹脂成分としては、例えば、重量平均分子量（Ｍｗ）が１０００００超の非ケイ素系樹脂と、ケイ素系樹脂と、が挙げられる。 Examples of the other resin component include a non-silicon resin having a weight average molecular weight (Mw) of more than 100,000 and a silicon resin.
　重量平均分子量が１０００００超の非ケイ素系樹脂は、このような条件を満たせば、特に限定されない。 The non-silicon resin having a weight average molecular weight of more than 100,000 is not particularly limited as long as these conditions are satisfied.
　前記ケイ素系樹脂を含有する中間層は、後述するように、フィルム状接着剤付き半導体チップのピックアップを、より容易とする。 The intermediate layer containing the silicon-based resin makes it easier to pick up a semiconductor chip with a film-like adhesive, as will be described later.
　前記ケイ素系樹脂は、構成原子としてケイ素原子を有する樹脂成分であれば、特に限定されない。例えば、ケイ素系樹脂の重量平均分子量は、特に限定されない。 The silicon-based resin is not particularly limited as long as it is a resin component having a silicon atom as a constituent atom. For example, the weight average molecular weight of the silicon-based resin is not particularly limited.
　好ましいケイ素系樹脂としては、例えば、粘着剤成分に対して離型作用を示す樹脂成分が挙げられ、シロキサン系樹脂（シロキサン結合（－Ｓｉ－Ｏ－Ｓｉ－）を有する樹脂成分、シロキサン系化合物ともいう）であることがより好ましい。 Preferred silicon-based resins include, for example, a resin component having a mold-releasing action on a pressure-sensitive adhesive component, and both a siloxane-based resin (a resin component having a siloxane bond (-Si-O-Si-) and a siloxane-based compound). ) Is more preferable.
　前記シロキサン系樹脂としては、例えば、ポリジアルキルシロキサン等が挙げられる。
　前記ポリジアルキルシロキサンが有するアルキル基の炭素数は、１～２０であることが好ましい。
　前記ポリジアルキルシロキサンとしては、ポリジメチルシロキサン等が挙げられる。 Examples of the siloxane-based resin include polydialkylsiloxane and the like.
The alkyl group of the polydialkylsiloxane preferably has 1 to 20 carbon atoms.
Examples of the polydialkylsiloxane include polydimethylsiloxane.
　前記非樹脂成分は、例えば、有機化合物及び無機化合物のいずれであってもよく、特に限定されない。 The non-resin component may be, for example, an organic compound or an inorganic compound, and is not particularly limited.
　中間層形成用組成物及び中間層が含有する前記添加剤は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　例えば、中間層形成用組成物及び中間層は、前記添加剤として、樹脂成分を１種又は２種以上含有し、かつ、非樹脂成分を含有していなくてもよいし、非樹脂成分を１種又は２種以上含有し、かつ、樹脂成分を含有していなくてもよいし、樹脂成分及び非樹脂成分をともに、１種又は２種以上含有していてもよい。 The composition for forming an intermediate layer and the additive contained in the intermediate layer may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.
For example, the composition for forming an intermediate layer and the intermediate layer may contain one or more resin components as the additive and may not contain a non-resin component, or may contain one non-resin component. It may contain seeds or two or more kinds and may not contain a resin component, or may contain one kind or two or more kinds of both a resin component and a non-resin component.
　中間層形成用組成物及び中間層が前記添加剤を含有する場合、中間層において、中間層の総質量に対する、前記非ケイ素系樹脂の含有量の割合（換言すると、中間層形成用組成物において、溶媒以外の全ての成分の総含有量に対する、前記非ケイ素系樹脂の含有量の割合）は、９０～９９．９９質量％であることが好ましく、例えば、９０～９７．５質量％、９０～９５質量％、及び９０～９２．５質量％のいずれかであってもよいし、９２．５～９９．９９質量％、９５～９９．９９質量％、及び９７．５～９９．９９質量％のいずれかであってもよいし、９２．５～９７．５質量％であってもよい。
　中間層形成用組成物及び中間層が前記添加剤を含有する場合、中間層において、中間層の総質量に対する、前記添加剤の含有量の割合（換言すると、中間層形成用組成物において、溶媒以外の全ての成分の総含有量に対する、前記添加剤の含有量の割合）は、０．０１～１０質量％であることが好ましく、例えば、２．５～１０質量％、５～１０質量％、及び７．５～１０質量％のいずれかであってもよいし、０．０１～７．５質量％、０．０１～５質量％、及び０．０１～２．５質量％のいずれかであってもよいし、２．５～７．５質量％であってもよい。 When the composition for forming an intermediate layer and the intermediate layer contain the additive, the ratio of the content of the non-silicon resin to the total mass of the intermediate layer in the intermediate layer (in other words, in the composition for forming the intermediate layer). , The ratio of the content of the non-silicon resin to the total content of all the components other than the solvent) is preferably 90 to 99.99% by mass, for example, 90 to 97.5% by mass, 90. It may be any of ~ 95% by mass and 90-92.5% by mass, 92.5-99.99% by mass, 95-99.99% by mass, and 97.5-99.99% by mass. It may be any of%, and it may be 92.5 to 97.5% by mass.
When the intermediate layer forming composition and the intermediate layer contain the additive, the ratio of the content of the additive to the total mass of the intermediate layer in the intermediate layer (in other words, in the intermediate layer forming composition, the solvent. The ratio of the content of the additive to the total content of all the components other than the above) is preferably 0.01 to 10% by mass, for example, 2.5 to 10% by mass, 5 to 10% by mass. , And any of 7.5 to 10% by mass, 0.01 to 7.5% by mass, 0.01 to 5% by mass, and 0.01 to 2.5% by mass. It may be 2.5 to 7.5% by mass.
　中間層形成用組成物が含有する前記溶媒は、特に限定されないが、好ましいものとしては、例えば、トルエン、キシレン等の炭化水素；メタノール、エタノール、２－プロパノール、イソブチルアルコール（２－メチルプロパン－１－オール）、１－ブタノール等のアルコール；酢酸エチル等のエステル；アセトン、メチルエチルケトン等のケトン；テトラヒドロフラン等のエーテル；ジメチルホルムアミド、Ｎ－メチルピロリドン等のアミド（アミド結合を有する化合物）等が挙げられる。
　中間層形成用組成物が含有する溶媒は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The solvent contained in the composition for forming an intermediate layer is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; methanol, ethanol, 2-propanol and isobutyl alcohol (2-methylpropan-1). -All), alcohols such as 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond) and the like. ..
The solvent contained in the intermediate layer forming composition may be only one kind, two or more kinds, and when two or more kinds, the combination and the ratio thereof can be arbitrarily selected.
　中間層形成用組成物が含有する溶媒は、中間層形成用組成物中の含有成分をより均一に混合できる点から、テトラヒドロフラン等であることが好ましい。 The solvent contained in the intermediate layer forming composition is preferably tetrahydrofuran or the like from the viewpoint that the components contained in the intermediate layer forming composition can be mixed more uniformly.
　中間層形成用組成物の溶媒の含有量は、特に限定されず、例えば、溶媒以外の成分の種類に応じて適宜選択すればよい。 The content of the solvent in the composition for forming the intermediate layer is not particularly limited, and may be appropriately selected depending on the type of the component other than the solvent, for example.
　後述するように、フィルム状接着剤付き半導体チップを、より容易にピックアップできる点では、好ましい中間層としては、例えば、前記非ケイ素系樹脂であるエチレン酢酸ビニル共重合体と、前記添加剤であるシロキサン系化合物と、を含有し、中間層における、中間層の総質量に対する、前記エチレン酢酸ビニル共重合体（前記非ケイ素系樹脂）の含有量の割合が、上述のいずれかの数値範囲であり、中間層における、中間層の総質量に対する、前記シロキサン系化合物（前記添加剤）の含有量の割合が、上述のいずれかの数値範囲であるものが挙げられる。
　例えば、このような中間層としては、前記非ケイ素系樹脂であるエチレン酢酸ビニル共重合体と、前記添加剤であるシロキサン系化合物と、を含有し、中間層における、中間層の総質量に対する、前記エチレン酢酸ビニル共重合体の含有量の割合が、９０～９９．９９質量％であり、中間層における、中間層の総質量に対する、前記シロキサン系化合物の含有量の割合が、０．０１～１０質量％であるものが挙げられる。ただし、これは、好ましい中間層の一例である。 As will be described later, preferred intermediate layers are, for example, the ethylene-vinyl acetate copolymer, which is a non-silicon resin, and the additive, in that a semiconductor chip with a film-like adhesive can be picked up more easily. The ratio of the content of the ethylene-vinyl acetate copolymer (the non-silicon resin) to the total mass of the intermediate layer in the intermediate layer containing the siloxane compound is in any of the above numerical ranges. , The ratio of the content of the siloxane-based compound (the additive) to the total mass of the intermediate layer in the intermediate layer is in any of the above-mentioned numerical ranges.
For example, such an intermediate layer contains the ethylene-vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and is based on the total mass of the intermediate layer in the intermediate layer. The content ratio of the ethylene-vinyl acetate copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane-based compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 99.99% by mass. The one which is 10 mass% is mentioned. However, this is an example of a preferred intermediate layer.
　より好ましい中間層としては、例えば、前記中間層が、前記非ケイ素系樹脂であるエチレン酢酸ビニル共重合体と、前記添加剤であるシロキサン系化合物と、を含有し、前記エチレン酢酸ビニル共重合体において、全ての構成単位の合計質量に対する、酢酸ビニルから誘導された構成単位の質量の割合（換言すると、酢酸ビニルから誘導された構成単位の含有量）が、１０～４０質量％であり、前記中間層において、前記中間層の総質量に対する、前記エチレン酢酸ビニル共重合体の含有量の割合が、９０～９９．９９質量％であり、前記中間層において、前記中間層の総質量に対する、前記シロキサン系化合物の含有量の割合が、０．０１～１０質量％であるものが挙げられる。ただし、これは、より好ましい中間層の一例である。 As a more preferable intermediate layer, for example, the intermediate layer contains the ethylene vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and the ethylene vinyl acetate copolymer is contained. In the above, the ratio of the mass of the structural unit derived from vinyl acetate (in other words, the content of the structural unit derived from vinyl acetate) to the total mass of all the structural units is 10 to 40% by mass. In the intermediate layer, the ratio of the content of the ethylene-vinyl acetate copolymer to the total mass of the intermediate layer is 90 to 99.99 mass%, and in the intermediate layer, the said Examples thereof include those in which the content ratio of the siloxane-based compound is 0.01 to 10% by mass. However, this is an example of a more preferred intermediate layer.
　半導体装置製造用シートにおいて、中間層のフィルム状接着剤側の面（例えば、図１においては、中間層１３の第１面１３ａ）について、Ｘ線光電子分光法（Ｘ－ｒａｙ　Ｐｈｏｔｏｅｌｅｃｔｒｏｎ　Ｓｐｅｃｔｒｏｓｃｏｐｙ、本明細書においては「ＸＰＳ」と称することがある）によって分析を行ったとき、炭素、酸素、窒素及びケイ素の合計濃度に対するケイ素の濃度の割合（本明細書においては、「ケイ素濃度の割合」と略記することがある）は、元素のモル基準で、１～２０％であることが好ましい。このような中間層を備えた半導体装置製造用シートを用いることにより、後述するように、フィルム状接着剤付き半導体チップを、より容易にピックアップできる。 In the sheet for manufacturing a semiconductor device, X-ray Photoelectron Spectroscopy (X-ray Photoelectron Spectroscopy, the present specification) is used for the surface of the intermediate layer on the film-like adhesive side (for example, the first surface 13a of the intermediate layer 13 in FIG. 1). When analyzed by "XPS" in the book), the ratio of the concentration of silicon to the total concentration of carbon, oxygen, nitrogen and silicon (in this specification, abbreviated as "ratio of silicon concentration"). Is preferably 1 to 20% on a molar basis of the element. By using a semiconductor device manufacturing sheet provided with such an intermediate layer, a semiconductor chip with a film-like adhesive can be more easily picked up, as will be described later.
　前記ケイ素濃度の割合は、下記式：
　［ＸＰＳ分析でのケイ素の濃度の測定値（ａｔｏｍｉｃ　％）］／｛［ＸＰＳ分析での炭素の濃度の測定値（ａｔｏｍｉｃ　％）］＋［ＸＰＳ分析での酸素の濃度の測定値（ａｔｏｍｉｃ　％）］＋［ＸＰＳ分析での窒素の濃度の測定値（ａｔｏｍｉｃ　％）］＋［ＸＰＳ分析でのケイ素の濃度の測定値（ａｔｏｍｉｃ　％）］｝×１００
により、算出できる。 The ratio of the silicon concentration is calculated by the following formula:
[Measured value of silicon concentration in XPS analysis (atomic%)] / {[Measured value of carbon concentration in XPS analysis (atomic%)] + [Measured value of oxygen concentration in XPS analysis (atomic%)) ] + [Measured value of nitrogen concentration in XPS analysis (atomic%)] + [Measured value of silicon concentration in XPS analysis (atomic%)]} x 100
Can be calculated by
　ＸＰＳ分析は、フィルム状接着剤側の中間層の表面に対して、Ｘ線光電子分光分析装置（例えば、アルバック社製「Ｑｕａｎｔｒａ　ＳＸＭ」）を用いて、照射角度４５°、Ｘ線ビーム径２０μｍφ、出力４．５Ｗの条件で行うことができる。 XPS analysis is performed on the surface of the intermediate layer on the film-like adhesive side using an X-ray photoelectron spectroscopy analyzer (for example, "Quantra SXM" manufactured by ULVAC, Inc.) at an irradiation angle of 45 ° and an X-ray beam diameter of 20 μmφ. This can be done under the condition of an output of 4.5 W.
　このような効果がより顕著となる点では、前記ケイ素濃度の割合は、例えば、元素のモル基準で、４～２０％、８～２０％、及び１２～２０％のいずれかであってもよいし、１～１６％、１～１２％、及び１～８％、のいずれかであってもよいし、４～１６％、及び８～１２％のいずれかであってもよい。 In that such an effect becomes more remarkable, the ratio of the silicon concentration may be, for example, any of 4 to 20%, 8 to 20%, and 12 to 20% on a molar basis of the element. However, it may be any one of 1 to 16%, 1 to 12%, and 1 to 8%, and may be any of 4 to 16% and 8 to 12%.
　上述のとおりＸＰＳ分析を行ったときには、中間層の前記面（ＸＰＳの分析対称面）において、炭素と、酸素と、窒素と、ケイ素と、のいずれにも該当しない他の元素が検出される可能性がある。しかし通常は、前記他の元素が検出されたとしても、その濃度は微量であるため、前記ケイ素濃度の割合を算出するときには、炭素、酸素、窒素及びケイ素の濃度の測定値を使用すれば、前記ケイ素濃度の割合を高精度に算出できる。 When XPS analysis is performed as described above, other elements that do not correspond to any of carbon, oxygen, nitrogen, and silicon can be detected in the plane (analytical plane of XPS) of the intermediate layer. There is sex. However, usually, even if the other element is detected, its concentration is very small. Therefore, when calculating the ratio of the silicon concentration, the measured values of the concentrations of carbon, oxygen, nitrogen and silicon can be used. The ratio of the silicon concentration can be calculated with high accuracy.
　中間層は、１層（単層）からなるものであってもよいし、２層以上の複数層からなるものであってもよく、複数層からなる場合、これら複数層は、互いに同一でも異なっていてもよく、これら複数層の組み合わせは特に限定されない。 The intermediate layer may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other. The combination of these plurality of layers is not particularly limited.
　先の説明のとおり、中間層の幅の最大値は、粘着剤層の幅の最大値と、基材の幅の最大値よりも小さくなっていることが好ましい。
　中間層の幅の最大値は、半導体ウエハの大きさを考慮して、適宜選択できる。例えば、中間層の幅の最大値は、１５０～１６０ｍｍ、２００～２１０ｍｍ、又は３００～３１０ｍｍであってもよい。これら３つの数値範囲は、半導体装置製造用シートとの貼付面に対して平行な方向における幅の最大値が、１５０ｍｍである半導体ウエハ、２００ｍｍである半導体ウエハ、又は３００ｍｍである半導体ウエハ、に対応している。ただし、先の説明のように、半導体ウエハでの改質層の形成を伴うダイシングを行った後に、半導体装置製造用シートをエキスパンドすることによって、フィルム状接着剤を切断する場合には、後述するように、ダイシング後の多数の半導体チップ（半導体チップ群）を一纏めとして、これら半導体チップに半導体装置製造用シートを貼付する。 As described above, the maximum width of the intermediate layer is preferably smaller than the maximum width of the pressure-sensitive adhesive layer and the maximum width of the base material.
The maximum value of the width of the intermediate layer can be appropriately selected in consideration of the size of the semiconductor wafer. For example, the maximum width of the intermediate layer may be 150 to 160 mm, 200 to 210 mm, or 300 to 310 mm. These three numerical ranges correspond to a semiconductor wafer having a maximum width of 150 mm, a semiconductor wafer of 200 mm, or a semiconductor wafer having a width of 300 mm in a direction parallel to the attachment surface with a sheet for manufacturing a semiconductor device. doing. However, as described above, when the film-like adhesive is cut by expanding the semiconductor device manufacturing sheet after dicing with the formation of the modified layer on the semiconductor wafer, it will be described later. As described above, a large number of semiconductor chips (semiconductor chip group) after dicing are put together, and a sheet for manufacturing a semiconductor device is attached to these semiconductor chips.
　本明細書においては、特に断りのない限り、「中間層の幅」とは、例えば、「中間層の第１面に対して平行な方向における、中間層の幅」を意味する。例えば、平面形状が円形状である中間層の場合、上述の中間層の幅の最大値は、前記平面形状である円の直径となる。
　これは、半導体ウエハの場合も同様である。すなわち、「半導体ウエハの幅」とは、「半導体ウエハの半導体装置製造用シートとの貼付面に対して平行な方向における、半導体ウエハの幅」を意味する。例えば、平面形状が円形状である半導体ウエハの場合、上述の半導体ウエハの幅の最大値は、前記平面形状である円の直径となる。 In the present specification, unless otherwise specified, the "width of the intermediate layer" means, for example, "the width of the intermediate layer in a direction parallel to the first surface of the intermediate layer". For example, in the case of an intermediate layer having a circular shape, the maximum width of the intermediate layer is the diameter of the circular shape.
This also applies to semiconductor wafers. That is, the "semiconductor wafer width" means "the width of the semiconductor wafer in a direction parallel to the attachment surface of the semiconductor wafer to the semiconductor device manufacturing sheet". For example, in the case of a semiconductor wafer having a circular shape, the maximum width of the above-mentioned semiconductor wafer is the diameter of the circular shape.
　１５０～１６０ｍｍという中間層の幅の最大値は、１５０ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　同様に、２００～２１０ｍｍという中間層の幅の最大値は、２００ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　同様に、３００～３１０ｍｍという中間層の幅の最大値は、３００ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　すなわち、本実施形態においては、中間層の幅の最大値と、半導体ウエハの幅の最大値と、の差は、例えば、半導体ウエハの幅の最大値が１５０ｍｍ、２００ｍｍ及び３００ｍｍのいずれであっても、０～１０ｍｍであってよい。 The maximum value of the width of the intermediate layer of 150 to 160 mm means that it is equal to or larger than the maximum value of the width of the semiconductor wafer of 150 mm within a range not exceeding 10 mm.
Similarly, the maximum width of the intermediate layer of 200 to 210 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 200 mm within a range not exceeding 10 mm.
Similarly, the maximum width of the intermediate layer of 300 to 310 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 300 mm within a range not exceeding 10 mm.
That is, in the present embodiment, the difference between the maximum value of the width of the intermediate layer and the maximum value of the width of the semiconductor wafer is, for example, whether the maximum value of the width of the semiconductor wafer is 150 mm, 200 mm, or 300 mm. Also, it may be 0 to 10 mm.
　中間層の厚さは、目的に応じて適宜選択できるが、５～１５０μｍであることが好ましく、５～１２０μｍであることがより好ましく、例えば、１０～９０μｍ、及び１０～６０μｍのいずれかであってもよいし、３０～１２０μｍ、及び６０～１２０μｍのいずれかであってもよい。中間層の厚さが前記下限値以上であることで、中間層の構造がより安定化する。中間層の厚さが前記上限値以下であることで、ブレードダイシング時と半導体装置製造用シートの前記エキスパンド時において、フィルム状接着剤をより容易に切断できる。
　ここで、「中間層の厚さ」とは、中間層全体の厚さを意味し、例えば、複数層からなる中間層の厚さとは、中間層を構成するすべての層の合計の厚さを意味する。 The thickness of the intermediate layer can be appropriately selected depending on the intended purpose, but is preferably 5 to 150 μm, more preferably 5 to 120 μm, and is, for example, 10 to 90 μm or 10 to 60 μm. It may be either 30 to 120 μm and 60 to 120 μm. When the thickness of the intermediate layer is equal to or greater than the lower limit, the structure of the intermediate layer is more stabilized. When the thickness of the intermediate layer is not more than the upper limit value, the film-like adhesive can be cut more easily at the time of blade dicing and at the time of the expansion of the semiconductor device manufacturing sheet.
Here, the "thickness of the intermediate layer" means the thickness of the entire intermediate layer, and for example, the thickness of the intermediate layer composed of a plurality of layers is the total thickness of all the layers constituting the intermediate layer. means.
　中間層が前記ケイ素系樹脂を含有する場合、特に、ケイ素系樹脂と、主成分である前記非ケイ素系樹脂と、の相溶性が低い場合には、半導体装置製造用シートにおいて、中間層中のケイ素系樹脂は、中間層の両面（第１面とその反対側の面）とその近傍領域に偏在し易い。そして、このような傾向が強いほど、中間層に隣接している（直接接触している）フィルム状接着剤は、中間層から剥離し易く、後述するように、フィルム状接着剤付き半導体チップをより容易にピックアップできる。
　例えば、厚さだけが互いに異なり、組成、前記両面の面積など、厚さ以外の点が互いに同じである中間層同士を比較した場合、これら中間層においては、中間層の総質量に対する、ケイ素系樹脂の含有量の割合（質量％）は、互いに同じである。しかし、中間層のケイ素系樹脂の含有量（質量部）は、厚さが厚い中間層の方が、厚さが薄い中間層よりも多い。したがって、ケイ素系樹脂が中間層中で上記のように偏在し易い場合には、厚さが厚い中間層の方が、厚さが薄い中間層よりも、両面（第１面とその反対側の面）とその近傍領域に偏在するケイ素系樹脂の量が多くなる。そのため、前記割合を変更しなくても、半導体装置製造用シート中の中間層の厚さを調節することにより、フィルム状接着剤付き半導体チップのピックアップ適性を調節することが可能である。例えば、半導体装置製造用シート中の中間層の厚さを厚くすることにより、フィルム状接着剤付き半導体チップをより容易にピックアップできる。 When the intermediate layer contains the silicon-based resin, particularly when the compatibility between the silicon-based resin and the non-silicon-based resin which is the main component is low, in the sheet for manufacturing a semiconductor device, the intermediate layer is contained. The silicon-based resin tends to be unevenly distributed on both sides of the intermediate layer (the first surface and the surface opposite to the first surface) and the region in the vicinity thereof. The stronger this tendency, the easier it is for the film-like adhesive adjacent to (directly in contact with) the intermediate layer to peel off from the intermediate layer, and as will be described later, the semiconductor chip with the film-like adhesive is used. It can be picked up more easily.
For example, when comparing intermediate layers in which only the thickness is different from each other and the points other than the thickness such as the composition and the areas of both sides are the same, these intermediate layers are silicon-based with respect to the total mass of the intermediate layers. The proportions (mass%) of the resin content are the same as each other. However, the content (parts by mass) of the silicon-based resin in the intermediate layer is higher in the thick intermediate layer than in the thin intermediate layer. Therefore, when the silicon-based resin is likely to be unevenly distributed in the intermediate layer as described above, the thick intermediate layer is more double-sided (the first surface and the opposite side) than the thin intermediate layer. The amount of silicon-based resin unevenly distributed in the surface) and the region in the vicinity thereof increases. Therefore, it is possible to adjust the pickup suitability of the semiconductor chip with a film-like adhesive by adjusting the thickness of the intermediate layer in the semiconductor device manufacturing sheet without changing the ratio. For example, by increasing the thickness of the intermediate layer in the semiconductor device manufacturing sheet, the semiconductor chip with a film-like adhesive can be picked up more easily.
　中間層は、その構成材料を含有する接着剤組成物を用いて形成できる。例えば、フィルム状接着剤の形成対象面に接着剤組成物を塗工し、必要に応じて乾燥させることで、目的とする部位にフィルム状接着剤を形成できる。 The intermediate layer can be formed by using an adhesive composition containing the constituent material. For example, the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary.
　中間層形成用組成物の塗工は、上述の粘着剤組成物の塗工の場合と同じ方法で行うことができる。 The coating of the intermediate layer forming composition can be carried out in the same manner as in the case of the above-mentioned coating of the pressure-sensitive adhesive composition.
　中間層形成用組成物の乾燥条件は、特に限定されない。中間層形成用組成物は、前記溶媒を含有している場合、加熱乾燥させることが好ましく、この場合、例えば、６０～１３０℃で１～６分の条件で乾燥させることが好ましい。 The drying conditions of the composition for forming the intermediate layer are not particularly limited. When the composition for forming an intermediate layer contains the solvent, it is preferably dried by heating. In this case, for example, it is preferably dried at 60 to 130 ° C. for 1 to 6 minutes.
○フィルム状接着剤
　前記フィルム状接着剤は、硬化性を有し、熱硬化性を有するものが好ましく、感圧接着性を有するものが好ましい。熱硬化性及び感圧接着性をともに有するフィルム状接着剤は、未硬化状態では各種被着体に軽く押圧することで貼付できる。また、フィルム状接着剤は、加熱して軟化させることで各種被着体に貼付できるものであってもよい。フィルム状接着剤は、硬化によって最終的には耐衝撃性が高い硬化物となり、この硬化物は、厳しい高温・高湿度条件下においても十分な接着特性を保持し得る。 ○ Film-like adhesive The film-like adhesive preferably has curability and thermosetting property, and preferably has pressure-sensitive adhesive property. The film-like adhesive having both thermosetting property and pressure-sensitive adhesive property can be attached by lightly pressing against various adherends in an uncured state. Further, the film-like adhesive may be one that can be attached to various adherends by heating and softening. The film-like adhesive eventually becomes a cured product having high impact resistance by curing, and this cured product can retain sufficient adhesive properties even under severe high temperature and high humidity conditions.
　半導体装置製造用シートを上方から見下ろして平面視したときに、フィルム状接着剤の面積（すなわち第１面の面積）は、分割前の半導体ウエハの面積に近くなるように、基材の面積（すなわち第１面の面積）及び粘着剤層の面積（すなわち第１面の面積）よりも小さく設定されていることが好ましい。このような半導体装置製造用シートでは、粘着剤層の第１面の一部に、中間層及びフィルム状接着剤と接触していない領域（すなわち、前記非積層領域）が存在する。これにより、半導体装置製造用シートのエキスパンドがより容易になるとともに、エキスパンド時にフィルム状接着剤に加えられる力が分散しないため、フィルム状接着剤をより容易に切断できる。 When the sheet for manufacturing a semiconductor device is viewed from above in a plan view, the area of the base material (that is, the area of the first surface) is close to the area of the semiconductor wafer before division (that is, the area of the first surface). That is, it is preferable that the area is set smaller than the area of the first surface) and the area of the pressure-sensitive adhesive layer (that is, the area of the first surface). In such a sheet for manufacturing a semiconductor device, a region (that is, the non-laminated region) that is not in contact with the intermediate layer and the film-like adhesive is present on a part of the first surface of the pressure-sensitive adhesive layer. As a result, the sheet for manufacturing a semiconductor device can be expanded more easily, and the force applied to the film-like adhesive at the time of expansion is not dispersed, so that the film-like adhesive can be cut more easily.
　フィルム状接着剤は、その構成材料を含有する接着剤組成物を用いて形成できる。例えば、フィルム状接着剤の形成対象面に接着剤組成物を塗工し、必要に応じて乾燥させることで、目的とする部位にフィルム状接着剤を形成できる。 The film-like adhesive can be formed by using an adhesive composition containing the constituent material. For example, the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary.
　接着剤組成物の塗工は、上述の粘着剤組成物の塗工の場合と同じ方法で行うことができる。 The coating of the adhesive composition can be performed by the same method as in the case of coating the adhesive composition described above.
　接着剤組成物の乾燥条件は、特に限定されない。接着剤組成物は、後述する溶媒を含有している場合、加熱乾燥させることが好ましく、この場合、例えば、７０～１３０℃で１０秒～５分の条件で乾燥させることが好ましい。 The drying conditions of the adhesive composition are not particularly limited. When the adhesive composition contains a solvent described later, it is preferably dried by heating. In this case, for example, it is preferably dried at 70 to 130 ° C. for 10 seconds to 5 minutes.
　フィルム状接着剤は、１層（単層）からなるものであってもよいし、２層以上の複数層からなるものであってもよく、複数層からなる場合、これら複数層は、互いに同一でも異なっていてもよく、これら複数層の組み合わせは特に限定されない。 The film-like adhesive may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers are the same as each other. However, they may be different, and the combination of these multiple layers is not particularly limited.
　先の説明のとおり、フィルム状接着剤の幅の最大値は、粘着剤層の幅の最大値と、基材の幅の最大値よりも小さくなっていることが好ましい。
　フィルム状接着剤の幅の最大値は、半導体ウエハの大きさに対して、先に説明した中間層の幅の最大値と同様であってよい。
　すなわち、フィルム状接着剤の幅の最大値は、半導体ウエハの大きさを考慮して、適宜選択できる。例えば、フィルム状接着剤の幅の最大値は、１５０～１６０ｍｍ、２００～２１０ｍｍ、又は３００～３１０ｍｍであってもよい。これら３つの数値範囲は、半導体装置製造用シートとの貼付面に対して平行な方向における幅の最大値が、１５０ｍｍである半導体ウエハ、２００ｍｍである半導体ウエハ、又は３００ｍｍである半導体ウエハ、に対応している。 As described above, the maximum width of the film-like adhesive is preferably smaller than the maximum width of the pressure-sensitive adhesive layer and the maximum width of the base material.
The maximum width of the film-like adhesive may be the same as the maximum width of the intermediate layer described above with respect to the size of the semiconductor wafer.
That is, the maximum width of the film-like adhesive can be appropriately selected in consideration of the size of the semiconductor wafer. For example, the maximum width of the film-like adhesive may be 150 to 160 mm, 200 to 210 mm, or 300 to 310 mm. These three numerical ranges correspond to a semiconductor wafer having a maximum width of 150 mm, a semiconductor wafer of 200 mm, or a semiconductor wafer having a width of 300 mm in a direction parallel to the attachment surface with a sheet for manufacturing a semiconductor device. doing.
　本明細書においては、特に断りのない限り、「フィルム状接着剤の幅」とは、例えば、「フィルム状接着剤の第１面に対して平行な方向における、フィルム状接着剤の幅」を意味する。例えば、平面形状が円形状であるフィルム状接着剤の場合、上述のフィルム状接着剤の幅の最大値は、前記平面形状である円の直径となる。
　また、特に断りのない限り、「フィルム状接着剤の幅」とは、後述するフィルム状接着剤付き半導体チップの製造過程における、切断後のフィルム状接着剤の幅ではなく、「切断前（未切断）のフィルム状接着剤の幅」を意味する。 In the present specification, unless otherwise specified, the "width of the film-like adhesive" means, for example, "the width of the film-like adhesive in a direction parallel to the first surface of the film-like adhesive". means. For example, in the case of a film-like adhesive having a circular plane shape, the maximum width of the film-like adhesive described above is the diameter of the circle having a planar shape.
Unless otherwise specified, the "width of the film-like adhesive" is not the width of the film-like adhesive after cutting in the process of manufacturing a semiconductor chip with a film-like adhesive, which will be described later, but "before cutting (not yet). Width of film-like adhesive (cut) "means.
　１５０～１６０ｍｍというフィルム状接着剤の幅の最大値は、１５０ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　同様に、２００～２１０ｍｍというフィルム状接着剤の幅の最大値は、２００ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　同様に、３００～３１０ｍｍというフィルム状接着剤の幅の最大値は、３００ｍｍという半導体ウエハの幅の最大値に対して、同等であるか、又は１０ｍｍを超えない範囲で大きいことを意味する。
　すなわち、本実施形態においては、フィルム状接着剤の幅の最大値と、半導体ウエハの幅の最大値と、の差は、例えば、半導体ウエハの幅の最大値が１５０ｍｍ、２００ｍｍ及び３００ｍｍのいずれであっても、０～１０ｍｍであってよい。 The maximum width of the film-like adhesive of 150 to 160 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 150 mm within a range not exceeding 10 mm.
Similarly, the maximum width of the film-like adhesive of 200 to 210 mm means that it is equal to or larger than the maximum width of the semiconductor wafer of 200 mm within a range not exceeding 10 mm.
Similarly, the maximum width of the film-like adhesive of 300 to 310 mm means that it is equal to or large in the range not exceeding 10 mm with respect to the maximum width of the semiconductor wafer of 300 mm.
That is, in the present embodiment, the difference between the maximum width of the film-like adhesive and the maximum width of the semiconductor wafer is, for example, when the maximum width of the semiconductor wafer is 150 mm, 200 mm, or 300 mm. Even if there is, it may be 0 to 10 mm.
　本実施形態においては、中間層の幅の最大値と、フィルム状接着剤の幅の最大値と、はいずれも、上述の数値範囲のいずれかであってもよい。
　すなわち、本実施形態の半導体装置製造用シートの一例としては、中間層の幅の最大値と、フィルム状接着剤の幅の最大値と、がともに、１５０～１６０ｍｍ、２００～２１０ｍｍ、又は３００～３１０ｍｍであるものが挙げられる。 In the present embodiment, the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive may both be in any of the above-mentioned numerical ranges.
That is, as an example of the semiconductor device manufacturing sheet of the present embodiment, the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive are both 150 to 160 mm, 200 to 210 mm, or 300 to 300. The one which is 310 mm is mentioned.
　フィルム状接着剤の厚さは、特に限定されないが、１～３０μｍであることが好ましく、２～２０μｍであることがより好ましく、３～１０μｍであることが特に好ましい。フィルム状接着剤の厚さが前記下限値以上であることで、被着体（半導体チップ）に対してより高い接着力が得られる。フィルム状接着剤の厚さが前記上限値以下であることで、ブレードダイシング時と半導体装置製造用シートの前記エキスパンド時において、フィルム状接着剤をより容易に切断できる。
　ここで、「フィルム状接着剤の厚さ」とは、フィルム状接着剤全体の厚さを意味し、例えば、複数層からなるフィルム状接着剤の厚さとは、フィルム状接着剤を構成するすべての層の合計の厚さを意味する。 The thickness of the film-like adhesive is not particularly limited, but is preferably 1 to 30 μm, more preferably 2 to 20 μm, and particularly preferably 3 to 10 μm. When the thickness of the film-like adhesive is at least the above lower limit value, a higher adhesive force to the adherend (semiconductor chip) can be obtained. When the thickness of the film-shaped adhesive is not more than the upper limit value, the film-shaped adhesive can be cut more easily at the time of blade dicing and at the time of expanding the sheet for manufacturing a semiconductor device.
Here, the "thickness of the film-like adhesive" means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers is all that constitute the film-like adhesive. Means the total thickness of the layers of.
　中間層及びフィルム状接着剤は、中間層の第１面がフィルム状接着剤の第１面と同等以上の大きさの面積を有することが好ましく、互いに同形状であってよく、中間層及びフィルム状接着剤とが、それらの平面視形状の外周が一致するよう積層されていることが好ましい。 The intermediate layer and the film-like adhesive preferably have an area in which the first surface of the intermediate layer has an area equal to or larger than the first surface of the film-like adhesive, and may have the same shape as each other, and the intermediate layer and the film may have the same shape. It is preferable that the shape adhesives are laminated so that the outer circumferences of their plan views match.
　下記接着剤組成物は、例えば、下記の１種以上の成分を、含有量（質量％）の合計が１００質量％を超えないように含有することができる。
　次に、前記接着剤組成物について説明する。 The following adhesive composition can contain, for example, one or more of the following components so that the total content (% by mass) does not exceed 100% by mass.
Next, the adhesive composition will be described.
＜＜接着剤組成物＞＞
　好ましい接着剤組成物としては、例えば、重合体成分（ａ）及び熱硬化性成分（ｂ）を含有するものが挙げられる。以下、各成分について説明する。
　なお、以下に示す接着剤組成物は、好ましいものの一例であり、本実施形態における接着剤組成物は、以下に示すものに限定されない。 << Adhesive composition >>
Preferred adhesive compositions include, for example, those containing a polymer component (a) and a thermosetting component (b). Hereinafter, each component will be described.
The adhesive composition shown below is an example of a preferable one, and the adhesive composition in the present embodiment is not limited to the one shown below.
［重合体成分（ａ）］
　重合体成分（ａ）は、重合性化合物が重合反応して形成されたとみなせる成分であり、フィルム状接着剤に造膜性や可撓性等を付与するとともに、半導体チップ等の接着対象への接着性（換言すると貼付性）を向上させるための重合体化合物である。重合体成分（ａ）は、熱可塑性を有し、熱硬化性を有しない。 [Polymer component (a)]
The polymer component (a) is a component that can be regarded as being formed by a polymerization reaction of a polymerizable compound, and imparts film-forming property, flexibility, etc. to the film-like adhesive and is attached to an object to be adhered to a semiconductor chip or the like. It is a polymer compound for improving adhesiveness (in other words, adhesiveness). The polymer component (a) has thermoplasticity and does not have thermosetting property.
　接着剤組成物及びフィルム状接着剤が含有する重合体成分（ａ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The polymer component (a) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
　重合体成分（ａ）としては、例えば、アクリル樹脂、ウレタン樹脂、フェノキシ樹脂、シリコーン樹脂、飽和ポリエステル樹脂等が挙げられる。
　これらの中でも、重合体成分（ａ）は、アクリル樹脂であることが好ましい。 Examples of the polymer component (a) include acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin and the like.
Among these, the polymer component (a) is preferably an acrylic resin.
　接着剤組成物において、溶媒以外の全ての成分の総含有量に対する、重合体成分（ａ）の含有量の割合（すなわち、フィルム状接着剤における、フィルム状接着剤の総質量に対する、重合体成分（ａ）の含有量の割合）は、２０～７５質量％であることが好ましく、３０～６５質量％であることがより好ましい。 In the adhesive composition, the ratio of the content of the polymer component (a) to the total content of all the components other than the solvent (that is, the polymer component with respect to the total mass of the film-like adhesive in the film-like adhesive). The content ratio of (a)) is preferably 20 to 75% by mass, more preferably 30 to 65% by mass.
［熱硬化性成分（ｂ）］
　熱硬化性成分（ｂ）は、熱硬化性を有し、フィルム状接着剤を熱硬化させるための成分である。
　接着剤組成物及びフィルム状接着剤が含有する熱硬化性成分（ｂ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 [Thermosetting component (b)]
The thermosetting component (b) has thermosetting property and is a component for thermosetting the film-like adhesive.
The thermosetting component (b) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof when two or more types are used. And the ratio can be selected arbitrarily.
　熱硬化性成分（ｂ）としては、例えば、エポキシ系熱硬化性樹脂、ポリイミド樹脂、不飽和ポリエステル樹脂等が挙げられる。
　これらの中でも、熱硬化性成分（ｂ）は、エポキシ系熱硬化性樹脂であることが好ましい。 Examples of the thermosetting component (b) include epoxy-based thermosetting resins, polyimide resins, unsaturated polyester resins, and the like.
Among these, the thermosetting component (b) is preferably an epoxy-based thermosetting resin.
〇エポキシ系熱硬化性樹脂
　エポキシ系熱硬化性樹脂は、エポキシ樹脂（ｂ１）及び熱硬化剤（ｂ２）からなる。
　接着剤組成物及びフィルム状接着剤が含有するエポキシ系熱硬化性樹脂は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 〇 Epoxy-based thermosetting resin The epoxy-based thermosetting resin is composed of an epoxy resin (b1) and a thermosetting agent (b2).
The epoxy-based thermosetting resin contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types. The ratio can be selected arbitrarily.
・エポキシ樹脂（ｂ１）
　エポキシ樹脂（ｂ１）としては、公知のものが挙げられ、例えば、多官能系エポキシ樹脂、ビフェニル化合物、ビスフェノールＡジグリシジルエーテル及びその水添物、オルソクレゾールノボラックエポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、フェニレン骨格型エポキシ樹脂等、２官能以上のエポキシ化合物が挙げられる。 -Epoxy resin (b1)
Examples of the epoxy resin (b1) include known ones, such as polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, and the like. Biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin, and other bifunctional or higher functional epoxy compounds can be mentioned.
　エポキシ樹脂（ｂ１）としては、不飽和炭化水素基を有するエポキシ樹脂を用いてもよい。不飽和炭化水素基を有するエポキシ樹脂は、不飽和炭化水素基を有しないエポキシ樹脂よりもアクリル樹脂との相溶性が高い。そのため、不飽和炭化水素基を有するエポキシ樹脂を用いることで、フィルム状接着剤を用いて得られたパッケージの信頼性が向上する。 As the epoxy resin (b1), an epoxy resin having an unsaturated hydrocarbon group may be used. Epoxy resins having unsaturated hydrocarbon groups have higher compatibility with acrylic resins than epoxy resins having no unsaturated hydrocarbon groups. Therefore, by using an epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using the film-like adhesive is improved.
　接着剤組成物及びフィルム状接着剤が含有するエポキシ樹脂（ｂ１）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The epoxy resin (b1) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
・熱硬化剤（ｂ２）
　熱硬化剤（ｂ２）は、エポキシ樹脂（ｂ１）に対する硬化剤として機能する。
　熱硬化剤（ｂ２）としては、例えば、１分子中にエポキシ基と反応し得る官能基を２個以上有する化合物が挙げられる。前記官能基としては、例えば、フェノール性水酸基、アルコール性水酸基、アミノ基、カルボキシ基、酸基が無水物化された基等が挙げられ、フェノール性水酸基、アミノ基、又は酸基が無水物化された基であることが好ましく、フェノール性水酸基又はアミノ基であることがより好ましい。 ・ Thermosetting agent (b2)
The thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1).
Examples of the thermosetting agent (b2) include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group is annealed, and the like, and the phenolic hydroxyl group, an amino group, or an acid group is annealed. It is preferably a group, more preferably a phenolic hydroxyl group or an amino group.
　熱硬化剤（ｂ２）のうち、フェノール性水酸基を有するフェノール系硬化剤としては、例えば、多官能フェノール樹脂、ビフェノール、ノボラック型フェノール樹脂、ジシクロペンタジエン型フェノール樹脂、アラルキル型フェノール樹脂等が挙げられる。
　熱硬化剤（ｂ２）のうち、アミノ基を有するアミン系硬化剤としては、例えば、ジシアンジアミド（ＤＩＣＹ）等が挙げられる。 Among the heat-curing agents (b2), examples of the phenol-based curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolak-type phenol resins, dicyclopentadiene-type phenol resins, and aralkyl-type phenol resins. ..
Among the thermosetting agents (b2), examples of the amine-based curing agent having an amino group include dicyandiamide (DICY) and the like.
　熱硬化剤（ｂ２）は、不飽和炭化水素基を有していてもよい。 The thermosetting agent (b2) may have an unsaturated hydrocarbon group.
　接着剤組成物及びフィルム状接着剤が含有する熱硬化剤（ｂ２）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The thermosetting agent (b2) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types. The ratio can be selected arbitrarily.
　接着剤組成物及びフィルム状接着剤において、熱硬化剤（ｂ２）の含有量は、エポキシ樹脂（ｂ１）の含有量１００質量部に対して、０．１～５００質量部であることが好ましく、１～２００質量部であることがより好ましく、例えば、１～１００質量部、１～５０質量部、及び１～２５質量部のいずれかであってもよい。熱硬化剤（ｂ２）の前記含有量が前記下限値以上であることで、フィルム状接着剤の硬化がより進行し易くなる。熱硬化剤（ｂ２）の前記含有量が前記上限値以下であることで、フィルム状接着剤の吸湿率が低減されて、フィルム状接着剤を用いて得られたパッケージの信頼性がより向上する。 In the adhesive composition and the film-like adhesive, the content of the heat-curing agent (b2) is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of the content of the epoxy resin (b1). It is more preferably 1 to 200 parts by mass, and may be, for example, 1 to 100 parts by mass, 1 to 50 parts by mass, or 1 to 25 parts by mass. When the content of the thermosetting agent (b2) is at least the lower limit value, the curing of the film-like adhesive becomes easier to proceed. When the content of the thermosetting agent (b2) is not more than the upper limit value, the hygroscopicity of the film-like adhesive is reduced, and the reliability of the package obtained by using the film-like adhesive is further improved. ..
　接着剤組成物及びフィルム状接着剤において、熱硬化性成分（ｂ）の含有量（例えば、エポキシ樹脂（ｂ１）及び熱硬化剤（ｂ２）の総含有量）は、重合体成分（ａ）の含有量１００質量部に対して、５～１００質量部であることが好ましく、５～７５質量部であることがより好ましく、５～５０質量部であることが特に好ましく、例えば、５～３５質量部、及び５～２０質量部のいずれかであってもよい。熱硬化性成分（ｂ）の前記含有量がこのような範囲であることで、中間層とフィルム状接着剤との間の剥離力が、より安定する。 In the adhesive composition and the film-like adhesive, the content of the thermosetting component (b) (for example, the total content of the epoxy resin (b1) and the thermosetting agent (b2)) is the content of the polymer component (a). The content is preferably 5 to 100 parts by mass, more preferably 5 to 75 parts by mass, particularly preferably 5 to 50 parts by mass, and for example, 5 to 35 parts by mass with respect to 100 parts by mass. It may be any of parts and 5 to 20 parts by mass. When the content of the thermosetting component (b) is in such a range, the peeling force between the intermediate layer and the film-like adhesive becomes more stable.
　接着剤組成物及びフィルム状接着剤は、フィルム状接着剤の各種物性を改良するために、重合体成分（ａ）及び熱硬化性成分（ｂ）以外に、さらに必要に応じて、これらに該当しない他の成分を含有していてもよい。
　接着剤組成物及びフィルム状接着剤が含有する他の成分で好ましいものとしては、例えば、硬化促進剤（ｃ）、充填材（ｄ）、カップリング剤（ｅ）、架橋剤（ｆ）、エネルギー線硬化性樹脂（ｇ）、光重合開始剤（ｈ）、汎用添加剤（ｉ）等が挙げられる。 The adhesive composition and the film-like adhesive correspond to these in addition to the polymer component (a) and the thermosetting component (b), if necessary, in order to improve various physical properties of the film-like adhesive. May contain other ingredients that do not.
Other components contained in the adhesive composition and the film-like adhesive are preferably, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a cross-linking agent (f), and energy. Examples thereof include a linear curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i).
［硬化促進剤（ｃ）］
　硬化促進剤（ｃ）は、接着剤組成物の硬化速度を調節するための成分である。
　好ましい硬化促進剤（ｃ）としては、例えば、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス（ジメチルアミノメチル）フェノール等の第３級アミン；２－メチルイミダゾール、２－フェニルイミダゾール、２－フェニル－４－メチルイミダゾール、２－フェニル－４，５－ジヒドロキシメチルイミダゾール、２－フェニル－４－メチル－５－ヒドロキシメチルイミダゾール等のイミダゾール類（１個以上の水素原子が水素原子以外の基で置換されたイミダゾール）；トリブチルホスフィン、ジフェニルホスフィン、トリフェニルホスフィン等の有機ホスフィン類（１個以上の水素原子が有機基で置換されたホスフィン）；テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレート等のテトラフェニルボロン塩等が挙げられる。 [Curing accelerator (c)]
The curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition.
Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole. , 2-Phenyl-4-methylimidazole, 2-Phenyl-4,5-dihydroxymethylimidazole, 2-Phenyl-4-methyl-5-hydroxymethylimidazole and other imidazoles (one or more hydrogen atoms other than hydrogen atoms) (Imidazole substituted with an organic group); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (phosphenyl in which one or more hydrogen atoms are substituted with an organic group); tetraphenylphosphonium tetraphenylborate, triphenylphosphine Examples thereof include tetraphenylborone salts such as tetraphenylborate.
　接着剤組成物及びフィルム状接着剤が含有する硬化促進剤（ｃ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The curing accelerator (c) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
　硬化促進剤（ｃ）を用いる場合、接着剤組成物及びフィルム状接着剤において、硬化促進剤（ｃ）の含有量は、熱硬化性成分（ｂ）の含有量１００質量部に対して、０．０１～１０質量部であることが好ましく、０．１～５質量部であることがより好ましい。硬化促進剤（ｃ）の前記含有量が前記下限値以上であることで、硬化促進剤（ｃ）を用いたことによる効果がより顕著に得られる。硬化促進剤（ｃ）の含有量が前記上限値以下であることで、例えば、高極性の硬化促進剤（ｃ）が、高温・高湿度条件下でフィルム状接着剤中において被着体との接着界面側に移動して偏析することを抑制する効果が高くなり、フィルム状接着剤を用いて得られたパッケージの信頼性がより向上する。 When the curing accelerator (c) is used, the content of the curing accelerator (c) in the adhesive composition and the film-like adhesive is 0 with respect to 100 parts by mass of the content of the thermosetting component (b). It is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass. When the content of the curing accelerator (c) is at least the lower limit value, the effect of using the curing accelerator (c) can be obtained more remarkably. When the content of the curing accelerator (c) is not more than the above upper limit value, for example, the highly polar curing accelerator (c) is attached to the adherend in the film-like adhesive under high temperature and high humidity conditions. The effect of suppressing segregation by moving to the bonding interface side is enhanced, and the reliability of the package obtained by using the film-like adhesive is further improved.
［充填材（ｄ）］
　フィルム状接着剤は、充填材（ｄ）を含有することにより、エキスパンドによるその切断性がより向上する。また、フィルム状接着剤は、充填材（ｄ）を含有することにより、その熱膨張係数の調整が容易となり、この熱膨張係数をフィルム状接着剤の貼付対象物に対して最適化することで、フィルム状接着剤を用いて得られたパッケージの信頼性がより向上する。また、フィルム状接着剤が充填材（ｄ）を含有することにより、硬化後のフィルム状接着剤の吸湿率を低減したり、放熱性を向上させたりすることもできる。 [Filler (d)]
By containing the filler (d), the film-like adhesive further improves its cutting property by expanding. Further, since the film-like adhesive contains the filler (d), it becomes easy to adjust the thermal expansion coefficient, and by optimizing this thermal expansion coefficient with respect to the object to which the film-like adhesive is attached. , The reliability of the package obtained by using the film-like adhesive is further improved. Further, when the film-like adhesive contains the filler (d), it is possible to reduce the hygroscopicity of the film-like adhesive after curing and improve the heat dissipation.
　充填材（ｄ）は、有機充填材及び無機充填材のいずれであってもよいが、無機充填材であることが好ましい。
　好ましい無機充填材としては、例えば、シリカ、アルミナ、タルク、炭酸カルシウム、チタンホワイト、ベンガラ、炭化ケイ素、窒化ホウ素等の粉末；これら無機充填材を球形化したビーズ；これら無機充填材の表面改質品；これら無機充填材の単結晶繊維；ガラス繊維等が挙げられる。
　これらの中でも、無機充填材は、シリカ又はアルミナであることが好ましい。 The filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride and the like; spherical beads of these inorganic fillers; surface modification of these inorganic fillers. Goods; Single crystal fibers of these inorganic fillers; Glass fibers and the like.
Among these, the inorganic filler is preferably silica or alumina.
　接着剤組成物及びフィルム状接着剤が含有する充填材（ｄ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The filler (d) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
　充填材（ｄ）を用いる場合、接着剤組成物において、溶媒以外の全ての成分の総含有量に対する充填材（ｄ）の含有量の割合（すなわち、フィルム状接着剤における、フィルム状接着剤の総質量に対する、充填材（ｄ）の含有量の割合）は、５～８０質量％であることが好ましく、１０～７０質量％であることがより好ましく、２０～６０質量％であることが特に好ましい。前記割合がこのような範囲であることで、上記の充填材（ｄ）を用いたことによる効果がより顕著に得られる。 When the filler (d) is used, the ratio of the content of the filler (d) to the total content of all the components other than the solvent in the adhesive composition (that is, the film-like adhesive in the film-like adhesive). The ratio of the content of the filler (d) to the total mass) is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and particularly preferably 20 to 60% by mass. preferable. When the ratio is in such a range, the effect of using the filler (d) can be obtained more remarkably.
［カップリング剤（ｅ）］
　フィルム状接着剤は、カップリング剤（ｅ）を含有することにより、その被着体に対する接着性及び密着性が向上する。また、フィルム状接着剤がカップリング剤（ｅ）を含有することにより、その硬化物は耐熱性を損なうことなく、耐水性が向上する。カップリング剤（ｅ）は、無機化合物又は有機化合物と反応可能な官能基を有する。 [Coupling agent (e)]
By containing the coupling agent (e) in the film-like adhesive, the adhesiveness and adhesion to the adherend are improved. Further, when the film-like adhesive contains the coupling agent (e), the cured product has improved water resistance without impairing heat resistance. The coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.
　カップリング剤（ｅ）は、重合体成分（ａ）、熱硬化性成分（ｂ）等が有する官能基と反応可能な官能基を有する化合物であることが好ましく、シランカップリング剤であることがより好ましい。 The coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional groups of the polymer component (a), the thermosetting component (b) and the like, and is preferably a silane coupling agent. More preferred.
　接着剤組成物及びフィルム状接着剤が含有するカップリング剤（ｅ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The coupling agent (e) contained in the adhesive composition and the film-like adhesive may be only one type, two or more types, or a combination thereof and two or more types. The ratio can be selected arbitrarily.
　カップリング剤（ｅ）を用いる場合、接着剤組成物及びフィルム状接着剤において、カップリング剤（ｅ）の含有量は、重合体成分（ａ）及び熱硬化性成分（ｂ）の総含有量１００質量部に対して、０．０３～２０質量部であることが好ましく、０．０５～１０質量部であることがより好ましく、０．１～５質量部であることが特に好ましい。カップリング剤（ｅ）の前記含有量が前記下限値以上であることで、充填材（ｄ）の樹脂への分散性の向上や、フィルム状接着剤の被着体との接着性の向上など、カップリング剤（ｅ）を用いたことによる効果がより顕著に得られる。カップリング剤（ｅ）の前記含有量が前記上限値以下であることで、アウトガスの発生がより抑制される。 When the coupling agent (e) is used, the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is the total content of the polymer component (a) and the thermosetting component (b). It is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to 100 parts by mass. When the content of the coupling agent (e) is at least the lower limit value, the dispersibility of the filler (d) in the resin is improved, the adhesiveness of the film-like adhesive to the adherend is improved, and the like. , The effect of using the coupling agent (e) is more remarkable. When the content of the coupling agent (e) is not more than the upper limit value, the generation of outgas is further suppressed.
［架橋剤（ｆ）］
　重合体成分（ａ）として、上述のアクリル樹脂等の、他の化合物と結合可能なビニル基、（メタ）アクリロイル基、アミノ基、水酸基、カルボキシ基、イソシアネート基等の官能基を有するものを用いる場合、接着剤組成物及びフィルム状接着剤は、架橋剤（ｆ）を含有していてもよい。架橋剤（ｆ）は、重合体成分（ａ）中の前記官能基を他の化合物と結合させて架橋するための成分であり、このように架橋することにより、フィルム状接着剤の初期接着力及び凝集力を調節できる。 [Crosslinking agent (f)]
As the polymer component (a), one having a functional group such as a vinyl group capable of binding to another compound, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group, an isocyanate group, etc., such as the above-mentioned acrylic resin, is used. In this case, the adhesive composition and the film-like adhesive may contain a cross-linking agent (f). The cross-linking agent (f) is a component for bonding the functional group in the polymer component (a) with another compound to cross-link, and by cross-linking in this way, the initial adhesive force of the film-like adhesive is obtained. And the cohesive force can be adjusted.
　架橋剤（ｆ）としては、例えば、有機多価イソシアネート化合物、有機多価イミン化合物、金属キレート系架橋剤（金属キレート構造を有する架橋剤）、アジリジン系架橋剤（アジリジニル基を有する架橋剤）等が挙げられる。 Examples of the cross-linking agent (f) include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate-based cross-linking agent (a cross-linking agent having a metal chelate structure), an aziridine-based cross-linking agent (a cross-linking agent having an aziridinyl group), and the like. Can be mentioned.
　架橋剤（ｆ）として有機多価イソシアネート化合物を用いる場合、重合体成分（ａ）としては、水酸基含有重合体を用いることが好ましい。架橋剤（ｆ）がイソシアネート基を有し、重合体成分（ａ）が水酸基を有する場合、架橋剤（ｆ）と重合体成分（ａ）との反応によって、フィルム状接着剤に架橋構造を簡便に導入できる。 When an organic multivalent isocyanate compound is used as the cross-linking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a). When the cross-linking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the cross-linking structure is simplified into a film-like adhesive by the reaction between the cross-linking agent (f) and the polymer component (a). Can be introduced in.
　接着剤組成物及びフィルム状接着剤が含有する架橋剤（ｆ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The cross-linking agent (f) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, a combination and ratio thereof. Can be selected arbitrarily.
　架橋剤（ｆ）を用いる場合、接着剤組成物において、架橋剤（ｆ）の含有量は、重合体成分（ａ）の含有量１００質量部に対して、０．０１～２０質量部であることが好ましく、０．１～１０質量部であることがより好ましく、０．３～５質量部であることが特に好ましい。架橋剤（ｆ）の前記含有量が前記下限値以上であることで、架橋剤（ｆ）を用いたことによる効果がより顕著に得られる。架橋剤（ｆ）の前記含有量が前記上限値以下であることで、架橋剤（ｆ）の過剰使用が抑制される。 When the cross-linking agent (f) is used, the content of the cross-linking agent (f) in the adhesive composition is 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the polymer component (a). It is preferably 0.1 to 10 parts by mass, and particularly preferably 0.3 to 5 parts by mass. When the content of the cross-linking agent (f) is at least the lower limit value, the effect of using the cross-linking agent (f) can be obtained more remarkably. When the content of the cross-linking agent (f) is not more than the upper limit value, the excessive use of the cross-linking agent (f) is suppressed.
［エネルギー線硬化性樹脂（ｇ）］
　接着剤組成物及びフィルム状接着剤が、エネルギー線硬化性樹脂（ｇ）を含有していることにより、フィルム状接着剤は、エネルギー線の照射によって、その特性を変化させることができる。 [Energy ray curable resin (g)]
Since the adhesive composition and the film-like adhesive contain the energy ray-curable resin (g), the properties of the film-like adhesive can be changed by irradiation with energy rays.
　エネルギー線硬化性樹脂（ｇ）は、エネルギー線硬化性化合物から得られたものである。
　前記エネルギー線硬化性化合物としては、例えば、分子内に少なくとも１個の重合性二重結合を有する化合物が挙げられ、（メタ）アクリロイル基を有するアクリレート系化合物が好ましい。 The energy ray-curable resin (g) is obtained from an energy ray-curable compound.
Examples of the energy ray-curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylate-based compounds having a (meth) acryloyl group are preferable.
　接着剤組成物が含有するエネルギー線硬化性樹脂（ｇ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The energy ray-curable resin (g) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.
　エネルギー線硬化性樹脂（ｇ）を用いる場合、接着剤組成物において、接着剤組成物の総質量に対する、エネルギー線硬化性樹脂（ｇ）の含有量の割合は、１～９５質量％であることが好ましく、５～９０質量％であることがより好ましく、１０～８５質量％であることが特に好ましい。 When the energy ray-curable resin (g) is used, the ratio of the content of the energy ray-curable resin (g) to the total mass of the adhesive composition in the adhesive composition is 1 to 95% by mass. Is more preferable, 5 to 90% by mass is more preferable, and 10 to 85% by mass is particularly preferable.
［光重合開始剤（ｈ）］
　接着剤組成物及びフィルム状接着剤は、エネルギー線硬化性樹脂（ｇ）を含有する場合、エネルギー線硬化性樹脂（ｇ）の重合反応を効率よく進めるために、光重合開始剤（ｈ）を含有していてもよい。 [Photopolymerization Initiator (h)]
When the adhesive composition and the film-like adhesive contain the energy ray-curable resin (g), the photopolymerization initiator (h) is used in order to efficiently proceed with the polymerization reaction of the energy ray-curable resin (g). It may be contained.
　接着剤組成物における光重合開始剤（ｈ）としては、例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル、ベンゾイン安息香酸、ベンゾイン安息香酸メチル、ベンゾインジメチルケタール等のベンゾイン化合物；アセトフェノン、２－ヒドロキシ－２－メチル－１－フェニル－プロパン－１－オン、２，２－ジメトキシ－１，２－ジフェニルエタン－１－オン等のアセトフェノン化合物；ビス（２，４，６－トリメチルベンゾイル）フェニルフォスフィンオキサイド、２，４，６－トリメチルベンゾイルジフェニルフォスフィンオキサイド等のアシルフォスフィンオキサイド化合物；ベンジルフェニルスルフィド、テトラメチルチウラムモノスルフィド等のスルフィド化合物；１－ヒドロキシシクロヘキシルフェニルケトン等のα－ケトール化合物；アゾビスイソブチロニトリル等のアゾ化合物；チタノセン等のチタノセン化合物；チオキサントン等のチオキサントン化合物；パーオキサイド化合物；ジアセチル等のジケトン化合物；ベンジル；ジベンジル；ベンゾフェノン；２，４－ジエチルチオキサントン；１，２－ジフェニルメタン；２－ヒドロキシ－２－メチル－１－［４－（１－メチルビニル）フェニル］プロパノン；１－クロロアントラキノン、２－クロロアントラキノン等のキノン化合物等が挙げられる。
　また、光重合開始剤（ｈ）としては、例えば、アミン等の光増感剤等も挙げられる。 Examples of the photopolymerization initiator (h) in the adhesive composition include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal. Compounds; Acetphenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6) -Trimethylbenzoyl) Acylphosphine oxide compounds such as phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; 1-hydroxycyclohexylphenylketone and the like. Α-Ketol compounds; azo compounds such as azobisisobutyronitrile; titanosen compounds such as titanosen; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethyl Thioxanthone; 1,2-diphenylmethane; 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone; quinone compounds such as 1-chloroanthraquinone and 2-chloroanthraquinone can be mentioned.
Further, examples of the photopolymerization initiator (h) include a photosensitizer such as amine.
　接着剤組成物が含有する光重合開始剤（ｈ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 The photopolymerization initiator (h) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.
　光重合開始剤（ｈ）を用いる場合、接着剤組成物において、光重合開始剤（ｈ）の含有量は、エネルギー線硬化性樹脂（ｇ）の含有量１００質量部に対して、０．１～２０質量部であることが好ましく、１～１０質量部であることがより好ましく、２～５質量部であることが特に好ましい。 When the photopolymerization initiator (h) is used, the content of the photopolymerization initiator (h) in the adhesive composition is 0.1 with respect to 100 parts by mass of the content of the energy ray-curable resin (g). It is preferably about 20 parts by mass, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass.
［汎用添加剤（ｉ）］
　汎用添加剤（ｉ）は、公知のものでよく、目的に応じて任意に選択でき、特に限定されないが、好ましいものとしては、例えば、可塑剤、帯電防止剤、酸化防止剤、着色剤（染料、顔料）、ゲッタリング剤等が挙げられる。 [General-purpose additive (i)]
The general-purpose additive (i) may be a known one, and may be arbitrarily selected depending on the intended purpose, and is not particularly limited, but preferred ones are, for example, a plasticizer, an antistatic agent, an antioxidant, and a colorant (dye). , Pigments), gettering agents and the like.
　接着剤組成物及びフィルム状接着剤が含有する汎用添加剤（ｉ）は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。
　接着剤組成物及びフィルム状接着剤の含有量は、特に限定されず、目的に応じて適宜選択すればよい。 The general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be only one kind, two or more kinds, and when two or more kinds, a combination thereof and The ratio can be selected arbitrarily.
The contents of the adhesive composition and the film-like adhesive are not particularly limited and may be appropriately selected depending on the intended purpose.
［溶媒］
　接着剤組成物は、さらに溶媒を含有することが好ましい。溶媒を含有する接着剤組成物は、取り扱い性が良好となる。
　前記溶媒は特に限定されないが、好ましいものとしては、例えば、トルエン、キシレン等の炭化水素；メタノール、エタノール、２－プロパノール、イソブチルアルコール（２－メチルプロパン－１－オール）、１－ブタノール等のアルコール；酢酸エチル等のエステル；アセトン、メチルエチルケトン等のケトン；テトラヒドロフラン等のエーテル；ジメチルホルムアミド、Ｎ－メチルピロリドン等のアミド（アミド結合を有する化合物）等が挙げられる。
　接着剤組成物が含有する溶媒は、１種のみであってもよいし、２種以上であってもよく、２種以上である場合、それらの組み合わせ及び比率は任意に選択できる。 [solvent]
The adhesive composition preferably further contains a solvent. The adhesive composition containing a solvent has good handleability.
The solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
The solvent contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
　接着剤組成物が含有する溶媒は、接着剤組成物中の含有成分をより均一に混合できる点から、メチルエチルケトン等であることが好ましい。 The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.
　接着剤組成物の溶媒の含有量は、特に限定されず、例えば、溶媒以外の成分の種類に応じて適宜選択すればよい。 The content of the solvent in the adhesive composition is not particularly limited, and may be appropriately selected depending on the type of component other than the solvent, for example.
＜＜接着剤組成物の製造方法＞＞
　接着剤組成物は、これを構成するための各成分を配合することで得られる。
　接着剤組成物は、例えば、配合成分の種類が異なる点以外は、先に説明した粘着剤組成物の場合と同じ方法で製造できる。 << Manufacturing method of adhesive composition >>
The adhesive composition is obtained by blending each component for constituting the adhesive composition.
The adhesive composition can be produced, for example, by the same method as in the case of the pressure-sensitive adhesive composition described above, except that the types of compounding components are different.
〇剥離フィルム
　剥離フィルムの構成材料は、各種樹脂であることが好ましく、前記の基材で例示したものが挙げられ、ポリエチレンテレフタレート（ＰＥＴ）が好ましい。 〇 Release film The constituent material of the release film is preferably various resins, and examples thereof include those exemplified for the above-mentioned base material, and polyethylene terephthalate (PET) is preferable.
　剥離フィルムの厚さは、目的に応じて適宜選択でき、１０μｍ以上２００μｍ以下であってよく、２０μｍ以上１５０μｍ以下であってよく、３０μｍ以上８０μｍ以下であってよい。 The thickness of the release film can be appropriately selected depending on the intended purpose, and may be 10 μm or more and 200 μm or less, 20 μm or more and 150 μm or less, and 30 μm or more and 80 μm or less.
　ここで、「剥離フィルムの厚さ」とは、剥離フィルム全体の厚さを意味し、例えば、複数層からなる剥離フィルムの厚さとは、剥離フィルムを構成するすべての層の合計の厚さを意味する。 Here, the "thickness of the release film" means the thickness of the entire release film, for example, the thickness of the release film composed of a plurality of layers is the total thickness of all the layers constituting the release film. means.
　剥離フィルムは、前記樹脂等の主たる構成材料以外に、充填材、着色剤、帯電防止剤、酸化防止剤、有機滑剤、触媒、軟化剤（可塑剤）等の公知の各種添加剤を含有していてもよい。 In addition to the main constituent materials such as the resin, the release film contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). You may.
　剥離フィルムのフィルム状接着剤との接合面は、剥離剤で処理された剥離処理面であることが好ましい。前記剥離処理面は、剥離剤を含有することができる。剥離剤としては、例えば、アルキッド系、シリコーン系、フッ素系、不飽和ポリエステル系、ポリオレフィン系、ワックス系などが挙げられ、シリコーンを含有するシリコーン系剥離剤が好ましい。 The bonding surface of the release film with the film-like adhesive is preferably a release-treated surface treated with the release agent. The peeling surface may contain a peeling agent. Examples of the release agent include alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based, and silicone-based release agents containing silicone are preferable.
　上記の剥離剤を用いて剥離処理するためには、剥離剤をそのまま無溶剤で、又は溶剤希釈やエマルション化して、グラビアコーター、メイヤーバーコーター、エアーナイフコーター、ロールコーターなどにより塗布して、剥離剤が塗布されたフィルムを常温下又は加熱下に供するか、又は電子線により硬化させたり、ウェットラミネーションやドライラミネーション、熱溶融ラミネーション、溶融押出ラミネーション、共押出加工などで積層体を形成したりする方法が挙げられる。 In order to perform the peeling treatment using the above-mentioned release agent, the release agent is used as it is without solvent, or after being diluted or emulsified with a solvent, and applied with a gravure coater, a Mayer bar coater, an air knife coater, a roll coater, etc., and peeled. The film coated with the agent is subjected to normal temperature or heating, or cured by an electron beam, or a laminate is formed by wet lamination, dry lamination, heat melting lamination, melt extrusion lamination, coextrusion processing, or the like. The method can be mentioned.
　上記の半導体装置製造用シート１０１で説明した剥離フィルム１５は、後述の実施形態の半導体装置製造用シートの製造方法における、第２剥離フィルム１５と読みかえることができる。 The release film 15 described in the above-mentioned semiconductor device manufacturing sheet 101 can be read as the second release film 15 in the method for manufacturing a semiconductor device manufacturing sheet of the embodiment described later.
◇半導体装置製造用シートの製造方法
　前記半導体装置製造用シートは、上述の各層を対応する位置関係となるように積層することで製造できる。各層の形成方法は、先に説明したとおりである。 -Method of manufacturing a sheet for manufacturing a semiconductor device The sheet for manufacturing a semiconductor device can be manufactured by laminating the above-mentioned layers so as to have a corresponding positional relationship. The method of forming each layer is as described above.
　例えば、前記半導体装置製造用シートは、基材、粘着剤層、中間層及びフィルム状接着剤を、それぞれあらかじめ用意しておき、これらを、基材、粘着剤層、中間層及びフィルム状接着剤の順となるように貼り合わせて積層することにより、製造できる。
　ただし、これは、半導体装置製造用シートの製造方法の一例である。 For example, in the sheet for manufacturing a semiconductor device, a base material, an adhesive layer, an intermediate layer and a film-like adhesive are prepared in advance, and these are used as a base material, an adhesive layer, an intermediate layer and a film-like adhesive. It can be manufactured by laminating and laminating in the order of.
However, this is an example of a method for manufacturing a sheet for manufacturing a semiconductor device.
　前記半導体装置製造用シートは、例えば、これを構成するための、複数の層が積層されて構成された、２種以上の中間積層体をあらかじめ作製しておき、これら中間積層体同士を貼り合わせることでも、製造できる。中間積層体の構成は、適宜任意に選択できる。例えば、基材及び粘着剤層が積層された構成を有する第１中間積層体（前記支持シートに相当）と、中間層及びフィルム状接着剤が積層された構成を有する第２中間積層体と、をあらかじめ作製しておき、第１中間積層体中の粘着剤層と、第２中間積層体中の中間層と、を貼り合わせることで、半導体装置製造用シートを製造できる。
　ただし、これも、半導体装置製造用シートの製造方法の一例である。 For the semiconductor device manufacturing sheet, for example, two or more types of intermediate laminates, which are formed by laminating a plurality of layers to form the sheet, are prepared in advance, and the intermediate laminates are bonded to each other. It can also be manufactured. The configuration of the intermediate laminate can be arbitrarily selected as appropriate. For example, a first intermediate laminate having a structure in which a base material and an adhesive layer are laminated (corresponding to the support sheet), and a second intermediate laminate having a structure in which an intermediate layer and a film-like adhesive are laminated. Can be manufactured in advance, and the adhesive layer in the first intermediate laminate and the intermediate layer in the second intermediate laminate are bonded to each other to produce a sheet for manufacturing a semiconductor device.
However, this is also an example of a method for manufacturing a sheet for manufacturing a semiconductor device.
　前記半導体装置製造用シートとして、例えば、図１に示すような、中間層の第１面の面積と、フィルム状接着剤の第１面の面積が、いずれも、粘着剤層の第１面と、基材の第１面の面積よりも小さいものを製造する場合には、上述の製造方法でのいずれかの段階で、中間層とフィルム状接着剤を目的とする大きさに加工する工程を、追加して行ってもよい。例えば、前記第２中間積層体を用いる製造方法において、第２中間積層体中の中間層及びフィルム状接着剤を、目的とする大きさに加工する工程を追加して行うことで、半導体装置製造用シートを製造してもよい。 As the sheet for manufacturing a semiconductor device, for example, as shown in FIG. 1, the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive are both the first surface of the pressure-sensitive adhesive layer. In the case of manufacturing a material smaller than the area of the first surface of the base material, a step of processing the intermediate layer and the film-like adhesive into a desired size is performed at any stage of the above-mentioned manufacturing method. , May be added. For example, in the manufacturing method using the second intermediate laminate, a semiconductor device is manufactured by additionally performing a step of processing the intermediate layer and the film-like adhesive in the second intermediate laminate to a desired size. Sheets may be manufactured.
　前記半導体装置製造用シートとして、例えば、図１に示すような、基材の第１面の面積と、粘着剤層の第１面の面積が、いずれも、剥離フィルムの第１面の面積よりも小さいものを製造する場合には、上述の製造方法でのいずれかの段階で、基材と粘着剤層を目的とする大きさに加工する工程を、追加して行ってもよい。 As the sheet for manufacturing a semiconductor device, for example, as shown in FIG. 1, the area of the first surface of the base material and the area of the first surface of the pressure-sensitive adhesive layer are both larger than the area of the first surface of the release film. In the case of producing a small product, an additional step of processing the base material and the pressure-sensitive adhesive layer into a desired size may be performed at any stage of the above-mentioned production method.
　フィルム状接着剤上に剥離フィルムを備えた状態の半導体装置製造用シートを製造する場合には、例えば、剥離フィルム上にフィルム状接着剤を作製し、この状態を維持したまま、残りの層を積層して、半導体装置製造用シートを作製してもよいし、基材、粘着剤層、中間層及びフィルム状接着剤をすべて積層した後に、フィルム状接着剤上に剥離フィルムを積層して、半導体装置製造用シートを作製してもよい。剥離フィルムは、半導体装置製造用シートの使用時までに、必要な段階で取り除けばよい。 When manufacturing a sheet for manufacturing a semiconductor device in which a release film is provided on a film-like adhesive, for example, a film-like adhesive is produced on the release film, and the remaining layers are formed while maintaining this state. A sheet for manufacturing a semiconductor device may be laminated, or a base material, an adhesive layer, an intermediate layer and a film-like adhesive may all be laminated, and then a release film may be laminated on the film-like adhesive. A sheet for manufacturing a semiconductor device may be manufactured. The release film may be removed at a necessary stage by the time the semiconductor device manufacturing sheet is used.
　基材、粘着剤層、中間層、フィルム状接着剤及び剥離フィルム以外の別の層を備えている半導体装置製造用シートは、上述の製造方法において、適切なタイミングで、この別の層を形成し、積層する工程を追加して行うことで、製造できる。 A sheet for manufacturing a semiconductor device provided with another layer other than the base material, the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive and the release film forms this other layer at an appropriate timing in the above-mentioned manufacturing method. It can be manufactured by adding a step of laminating.
　半導体装置製造用シートの各層は、例えば、打ち抜き加工により加工して、任意の形状とすることができる。例えば、中間層１３及びフィルム状接着剤１４を、円形とする場合、対応する形状の打ち抜き刃を用いて、円形に打ち抜き加工を行うことができる。 Each layer of the semiconductor device manufacturing sheet can be processed by, for example, punching to have an arbitrary shape. For example, when the intermediate layer 13 and the film-like adhesive 14 are made circular, the punching process can be performed in a circular shape using a punching blade having a corresponding shape.
　本発明の一実施形態の半導体装置製造用シートの製造方法として、以下を例示できる。
　半導体装置製造用シートの製造方法であって、
　前記半導体装置製造用シートは、基材と、粘着剤層と、中間層と、フィルム状接着剤と、第２剥離フィルムと、を備え、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第２剥離フィルムがこの順に積層されて構成され、
　前記中間層、前記フィルム状接着剤及び第１剥離フィルムを備える第２中間積層体の前記中間層及び前記フィルム状接着剤に対し、半導体装置製造用シートの前記中間層及び前記フィルム状接着剤の外周に対応する位置に切込部Ｃを形成し、該切込部Ｃを起点として外側に位置する前記中間層及び前記フィルム状接着剤の少なくとも一部を除去し、第２中間積層体加工物を得る第１加工工程と、
　前記基材及び前記粘着剤層を備える第１中間積層体と、前記第２中間積層体加工物と、を貼り合わせて、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第１剥離フィルムを備える第１積層物を得る積層工程と、
　前記第１積層物の前記第１剥離フィルムを剥がし、第２剥離フィルムへと貼替えて第２積層物を得る貼替工程と、
　前記第２積層物の前記基材及び前記粘着剤層に対し、半導体装置製造用シートの前記基材及び前記粘着剤層の外周に対応する位置に切込部Ｃ’を形成し、該切込部Ｃ’を起点として外側に位置する前記基材及び前記粘着剤層の少なくとも一部を除去し、半導体装置製造用シートを得る第２加工工程と、を含み、
　前記第１剥離フィルムと前記フィルム状接着剤との間の剥離力が、前記第２剥離フィルムと前記フィルム状接着剤との間の剥離力よりも大きい、半導体装置製造用シートの製造方法。 The following can be exemplified as a method for manufacturing a sheet for manufacturing a semiconductor device according to an embodiment of the present invention.
A method for manufacturing sheets for manufacturing semiconductor devices.
The sheet for manufacturing a semiconductor device includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a second release film, and includes the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the above. The film-like adhesive and the second release film are laminated in this order.
With respect to the intermediate layer and the film-like adhesive of the second intermediate laminate including the intermediate layer, the film-like adhesive and the first release film, the intermediate layer and the film-like adhesive of the sheet for manufacturing a semiconductor device A cut portion C is formed at a position corresponding to the outer periphery, and at least a part of the intermediate layer and the film-like adhesive located outside from the cut portion C is removed to remove the second intermediate laminate processed product. The first processing process to obtain
The base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are obtained by laminating the first intermediate laminate having the base material and the pressure-sensitive adhesive layer and the processed product of the second intermediate laminate. And the laminating step of obtaining the first laminated product including the first release film, and
A reattachment step of peeling off the first release film of the first laminate and reattaching it to a second release film to obtain a second laminate.
A cut portion C'is formed at a position corresponding to the outer periphery of the base material and the pressure-sensitive adhesive layer of the semiconductor device manufacturing sheet with respect to the base material and the pressure-sensitive adhesive layer of the second laminate, and the cut portion is formed. A second processing step of removing at least a part of the base material and the pressure-sensitive adhesive layer located on the outside starting from the part C'and obtaining a sheet for manufacturing a semiconductor device is included.
A method for manufacturing a sheet for manufacturing a semiconductor device, wherein the peeling force between the first release film and the film-like adhesive is larger than the peeling force between the second release film and the film-like adhesive.
　実施形態の半導体装置製造用シートの製造方法によれば、上記実施形態の半導体装置製造用シートを製造可能である。 According to the method for manufacturing a semiconductor device manufacturing sheet of the embodiment, the semiconductor device manufacturing sheet of the above embodiment can be manufactured.
　図３は、発明の一実施形態に係る半導体装置製造用シートの製造方法を模式的に示す断面図である。なお、図３に示す半導体装置製造用シートは、図１に示す半導体装置製造用シートから、上下を反転させている。 FIG. 3 is a cross-sectional view schematically showing a method for manufacturing a sheet for manufacturing a semiconductor device according to an embodiment of the invention. The semiconductor device manufacturing sheet shown in FIG. 3 is turned upside down from the semiconductor device manufacturing sheet shown in FIG.
（第１加工工程）
　図３Ａに示される第２中間積層体１０２は、フィルム状接着剤１４及び中間層１３を備え、第１剥離フィルム１７、フィルム状接着剤１４、中間層１３、及び第３剥離フィルム１６がこの順に積層された構成を有する。
　第２中間積層体１０２の第３剥離フィルム１６、中間層１３、及びフィルム状接着剤１４に対して、第３剥離フィルム１６が積層された側の面から、半導体装置製造用シート１０１の中間層１３及びフィルム状接着剤１４の外周に対応する位置に切込部Ｃを形成する第１の打ち抜きを行う。打ち抜きでは、第１剥離フィルム１７まで切り込まれてよく、第１剥離フィルム１７に切込部Ｃが形成されてよい。次いで、切込部Ｃを起点として外側に位置する前記中間層及び前記フィルム状接着剤の少なくとも一部を除去して、第２中間積層体加工物１０３を得る（図３Ｂ）。ここでの外側とは、フィルム状接着剤の表面に対して平行な方向においての、切込部Ｃに囲まれた領域の外側の位置である。 (1st processing process)
The second intermediate laminate 102 shown in FIG. 3A includes a film-like adhesive 14 and an intermediate layer 13, and the first release film 17, the film-like adhesive 14, the intermediate layer 13, and the third release film 16 are in this order. It has a laminated structure.
From the surface on the side where the third release film 16 is laminated with respect to the third release film 16, the intermediate layer 13, and the film-like adhesive 14 of the second intermediate laminate 102, the intermediate layer of the sheet 101 for manufacturing a semiconductor device The first punching is performed to form the cut portion C at the position corresponding to the outer periphery of the 13 and the film-like adhesive 14. In punching, the first release film 17 may be cut, and the cut portion C may be formed in the first release film 17. Next, at least a part of the intermediate layer and the film-like adhesive located outside with the cut portion C as a starting point is removed to obtain a second intermediate laminated body processed product 103 (FIG. 3B). The outside here is a position outside the region surrounded by the notch C in a direction parallel to the surface of the film-like adhesive.
（積層工程）
　上記で得られた第２中間積層体加工物１０３から、第３剥離フィルム１６を取り除き、中間層１３の一方の面を露出させる。
　また、基材１１と、基材１１の一方の面上に設けられた粘着剤層１２と、を備えた剥離フィルム付きの第１中間積層体から、剥離フィルム（不図示）を取り除き、粘着剤層１２の一方の面を露出させる。次いで、第１中間積層体１０４の粘着剤層１２の露出面と、第２中間積層体加工物１０３の中間層１３の露出面とを貼り合わせる積層工程を行う。第１中間積層体１０４は、第２中間積層体加工物１０３の中間層１３及びフィルム状接着剤１４を覆うよう積層される。このようにして、第１剥離フィルム１７、フィルム状接着剤１４、中間層１３、粘着剤層１２、及び基材１１を備える第１積層物１０５を得る（図３Ｃ）。 (Laminating process)
The third release film 16 is removed from the second intermediate laminate work piece 103 obtained above to expose one surface of the intermediate layer 13.
Further, the release film (not shown) is removed from the first intermediate laminate with the release film provided with the base material 11 and the pressure-sensitive adhesive layer 12 provided on one surface of the base material 11, and the pressure-sensitive adhesive is used. One surface of layer 12 is exposed. Next, a laminating step is performed in which the exposed surface of the pressure-sensitive adhesive layer 12 of the first intermediate laminated body 104 and the exposed surface of the intermediate layer 13 of the second intermediate laminated body processed product 103 are bonded together. The first intermediate laminate 104 is laminated so as to cover the intermediate layer 13 and the film-like adhesive 14 of the second intermediate laminate processed product 103. In this way, the first laminate 105 including the first release film 17, the film-like adhesive 14, the intermediate layer 13, the pressure-sensitive adhesive layer 12, and the base material 11 is obtained (FIG. 3C).
（貼替工程）
　上記で得られた第１積層物１０５の第１剥離フィルム１７を剥がし、第２剥離フィルム１５へと貼替えて第２積層物１０７を得る。第２積層物１０７は、第２剥離フィルム１５、フィルム状接着剤１４、中間層１３、粘着剤層１２、及び基材１１がこの順に積層された構成を有する（図３Ｄ）。 (Replacement process)
The first release film 17 of the first laminate 105 obtained above is peeled off and replaced with the second release film 15 to obtain the second laminate 107. The second laminate 107 has a structure in which the second release film 15, the film-like adhesive 14, the intermediate layer 13, the pressure-sensitive adhesive layer 12, and the base material 11 are laminated in this order (FIG. 3D).
　新たに貼られた第２剥離フィルム１５は、中間層１３及びフィルム状接着剤１４の外周に沿った切込部Ｃを有さない。 The newly attached second release film 15 does not have a notch C along the outer periphery of the intermediate layer 13 and the film-like adhesive 14.
（第２加工工程）
　上記で得られた第２積層物１０７の基材１１、粘着剤層１２に対して、基材１１が積層された側の面から、半導体装置製造用シート１０１の基材１１及び粘着剤層１２の外周に対応する位置に切込部Ｃ’を形成する第２の打ち抜きを行う。ここでの打ち抜き箇所の切込部Ｃ’は、切込部Ｃと同心円状で、切込部Ｃの外側に配置される。打ち抜きでは、第２剥離フィルム１５まで切り込まれてよく、第２剥離フィルム１５に切込部Ｃ’が形成されてよい。次いで、該切込部Ｃ’を起点として外側に位置する基材１１及び粘着剤層１２の少なくとも一部を除去することにより、半導体装置製造用シート１０１を得る（図３Ｅ）。ここでの外側とは、フィルム状接着剤の表面に対して平行な方向においての、切込部Ｃ’に囲まれた領域の外側の位置である。 (Second processing process)
The base material 11 and the pressure-sensitive adhesive layer 12 of the semiconductor device manufacturing sheet 101 are viewed from the surface on which the base material 11 is laminated with respect to the base material 11 and the pressure-sensitive adhesive layer 12 of the second laminate 107 obtained above. A second punching is performed to form a notch C'at a position corresponding to the outer periphery of the. The cut portion C'of the punched portion here is concentric with the cut portion C and is arranged outside the cut portion C. In the punching, the second release film 15 may be cut, and the cut portion C'may be formed in the second release film 15. Next, the semiconductor device manufacturing sheet 101 is obtained by removing at least a part of the base material 11 and the pressure-sensitive adhesive layer 12 located outside from the cut portion C'(FIG. 3E). The outside here is a position outside the region surrounded by the notch C'in a direction parallel to the surface of the film-like adhesive.
　上記の切込部Ｃ’の位置での切込みを行うことで、半導体装置製造用シート１０１の、中間層１３の幅Ｗ１３の最大値（すなわち直径）と、フィルム状接着剤１４の幅Ｗ１４の最大値（すなわち直径）を、いずれも、粘着剤層１２の幅の最大値と、基材１１の幅の最大値よりも小さくすることができる。 By making the cut at the position of the cut portion C', the maximum value (that is, the diameter) of the width W 13 of the intermediate layer 13 of the semiconductor device manufacturing sheet 101 and the width W 14 of the film-like adhesive 14 The maximum value (that is, the diameter) of can be made smaller than the maximum value of the width of the pressure-sensitive adhesive layer 12 and the maximum value of the width of the base material 11.
　実施形態の半導体装置製造用シートの製造方法は、前記第１加工工程に先立ち、第１剥離フィルムの剥離処理面に接着剤組成物を塗工し、乾燥させてフィルム状接着剤を形成し、剥離フィルムの剥離処理面に中間層形成用組成物を塗工し、乾燥させて中間層を形成し、前記フィルム状接着剤の露出面を、前記中間層の露出面と貼り合わせることにより、第１剥離フィルム付きの第２中間積層体を得る、第２中間積層体製造工程を、更に含むことができる。 In the method for manufacturing a sheet for manufacturing a semiconductor device according to the embodiment, prior to the first processing step, an adhesive composition is applied to the peeled surface of the first release film and dried to form a film-like adhesive. A composition for forming an intermediate layer is applied to the peeled surface of the release film and dried to form an intermediate layer, and the exposed surface of the film-like adhesive is bonded to the exposed surface of the intermediate layer. A second intermediate laminate manufacturing step of obtaining a second intermediate laminate with a release film can be further included.
　実施形態の半導体装置製造用シートの製造方法は、前記積層工程に先立ち、剥離フィルムの剥離処理面に粘着剤組成物を塗工し、乾燥させて粘着剤層を形成し、前記粘着剤層の露出面を、基材と貼り合わせることにより、第１中間積層体を得る、第１中間積層体製造工程を、更に含むことができる。 In the method for manufacturing a sheet for manufacturing a semiconductor device according to the embodiment, prior to the laminating step, a pressure-sensitive adhesive composition is applied to the peeled surface of the release film and dried to form a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is formed. The first intermediate laminate manufacturing step of obtaining the first intermediate laminate by laminating the exposed surface with the base material can be further included.
　実施形態の半導体装置製造用シートの製造方法において、前記第１剥離フィルムと前記フィルム状接着剤との間の剥離力が、前記第２剥離フィルムと前記フィルム状接着剤との間の剥離力よりも高い。即ち、貼替工程にて、第１剥離フィルムを、より剥離力の低い第２剥離フィルム１５へと貼替える。
　第１剥離フィルムの前記剥離力を、第２剥離フィルムの前記剥離力よりも高くすることで、フィルム状接着剤の層形成時にはフィルム状接着剤の造膜性が良好となる。
　一般的に、剥離フィルムには、被着体間の剥離力を低下させ、剥離を容易とする目的で、剥離処理剤による剥離処理が施されている。しかし、発明者らの検討により、剥離力の低い剥離フィルム上に、上記の接着剤組成物を塗工してフィルム状接着剤を形成しようとすると、フィルム状接着剤の造膜性が劣る場合があることを見出だした。これは、剥離力の低い剥離フィルムでは、接着剤組成物に対するハジキも生じ易くなるためと考えられる。
　そこで、フィルム状接着剤の作製時には、剥離力の高い第１剥離フィルムを使用することで、均一なフィルム状接着剤の層を容易に形成することができる。 In the method for manufacturing a sheet for manufacturing a semiconductor device according to the embodiment, the peeling force between the first release film and the film-like adhesive is higher than the peeling force between the second release film and the film-like adhesive. Is also expensive. That is, in the reattachment step, the first release film is reattached to the second release film 15 having a lower peeling force.
By making the peeling force of the first release film higher than the peeling force of the second release film, the film-forming property of the film-like adhesive becomes good at the time of forming the layer of the film-like adhesive.
Generally, the release film is subjected to a release treatment with a release treatment agent for the purpose of reducing the release force between the adherends and facilitating the release. However, according to the studies by the inventors, when the above adhesive composition is applied onto a release film having a low release force to form a film-like adhesive, the film-forming property of the film-like adhesive is inferior. I found that there is. It is considered that this is because a release film having a low release force is likely to cause repelling to the adhesive composition.
Therefore, when the film-like adhesive is produced, a uniform film-like adhesive layer can be easily formed by using the first release film having a high peeling force.
　貼替工程として、第１積層物１０５の剥離フィルムに対して貼替えを行うことは、第１積層物１０５では、第１中間積層体１０４が第２中間積層体加工物１０３を覆うよう積層されているため、貼替えを行う際に第１積層物１０５の層構造が崩れ難いという利点がある。 As a reattachment step, the release film of the first laminate 105 is reattached. In the first laminate 105, the first intermediate laminate 104 is laminated so as to cover the second intermediate laminate processed product 103. Therefore, there is an advantage that the layer structure of the first laminate 105 does not easily collapse when the reattachment is performed.
　一方で、剥離力の高い第１剥離フィルムを備える半導体装置製造用シートのままでは、使用時にはフィルム状接着剤から第１剥離フィルムが剥離され難い場合がある。例えば、剥離フィルムを剥離して、フィルム状接着剤と半導体ウエハとを貼り合わせるマウントプロセスにて、半導体製造用シートがスムーズに供給されないという不具合が生じる場合がある。ここでの剥離フィルムの剥離は、通常、自動化されているので、マウントプロセスに使用される装置内で剥離フィルムを剥離する条件（マウンターにおける剥離角度や剥離速度など）を調節することが難しく、不具合が生じ易いと考えられる。
　そこで、上記の貼替工程にて、第１剥離フィルムを剥がし、より剥離力の低い第２剥離フィルム１５へと貼替えを行うことで、剥離力の低い第２剥離フィルムを備える半導体装置製造用シートを提供できる。このように貼替工程を経て製造された半導体製造用シートは、半導体装置製造用シートの使用時にはマウントプロセス適性に優れている。 On the other hand, if the sheet for manufacturing a semiconductor device provided with the first release film having a high release force is left as it is, it may be difficult to remove the first release film from the film-like adhesive at the time of use. For example, in the mounting process in which the release film is peeled off and the film-like adhesive and the semiconductor wafer are bonded together, there may be a problem that the semiconductor manufacturing sheet is not smoothly supplied. Since the peeling of the release film here is usually automated, it is difficult to adjust the conditions for peeling the release film (such as the peeling angle and the peeling speed in the mounter) in the device used for the mounting process, which is a problem. Is likely to occur.
Therefore, in the above-mentioned reattachment step, the first release film is peeled off and replaced with the second release film 15 having a lower peeling force, whereby a semiconductor device for manufacturing a semiconductor device having a second release film having a lower peeling force is provided. Seats can be provided. The semiconductor manufacturing sheet manufactured through the reattachment process in this way is excellent in mounting process suitability when the semiconductor device manufacturing sheet is used.
　第１剥離フィルム及び第２剥離フィルムの剥離力の指標として、下記剥離試験で求められた粘着剤層との間の剥離力を採用することができる。 As an index of the peeling force of the first peeling film and the second peeling film, the peeling force between the adhesive layer and the pressure-sensitive adhesive layer obtained in the following peeling test can be adopted.
（剥離試験）
　前記第１剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第１試験片において、
　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第１試験片の前記粘着剤層及び前記第１剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第１剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第１剥離フィルムとの間の剥離力（ｍＮ／５０ｍｍ）を求める。
　第１試験片における、前記粘着剤層と前記第１剥離フィルムとの間の剥離力は、１８０ｍＮ/５０ｍｍ超であることが好ましく、１８０ｍＮ/５０ｍｍ超３００ｍＮ/５０ｍｍ以下であることが好ましく、２００ｍＮ/５０ｍｍ以上２８０ｍＮ/５０ｍｍ以下であることがより好ましく、２３０ｍＮ/５０ｍｍ以上２７０ｍＮ/５０ｍｍ以下であることがさらに好ましい。
　第１試験片における、上記の第１剥離フィルムの剥離力が上記の下限値超又は以上であることにより、第１剥離フィルム上に形成されるフィルム状接着剤の層の品質を、より一層向上可能である。第１試験片における、上記の第１剥離フィルムの剥離力が上記の上限値以下であることにより、貼替工程での第１剥離フィルムの貼替えが容易となる。 (Peeling test)
A single-layer pressure-sensitive adhesive layer having a thickness of 10 μm is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the first release film and drying the pressure-sensitive adhesive composition. In the first test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the first test piece and the peeled-processed surfaces of the first peeling film form an angle of 180 °. The peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the first peeling film, which is measured by 180 ° peeling of the first peeling film from the agent layer, is determined.
The peeling force between the pressure-sensitive adhesive layer and the first release film in the first test piece is preferably more than 180 mN / 50 mm, preferably more than 180 mN / 50 mm and more than 300 mN / 50 mm, and more than 200 mN /. It is more preferably 50 mm or more and 280 mN / 50 mm or less, and further preferably 230 mN / 50 mm or more and 270 mN / 50 mm or less.
When the peeling force of the first release film in the first test piece exceeds or exceeds the above lower limit value, the quality of the film-like adhesive layer formed on the first release film is further improved. It is possible. When the peeling force of the first release film in the first test piece is equal to or less than the above upper limit value, the first release film can be easily replaced in the replacement step.
　前記第２剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第２試験片において、
　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第２試験片の前記粘着剤層及び前記第２剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第２剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第２剥離フィルムとの間の剥離力を求める。
　第２試験片における、前記粘着剤層と前記第２剥離フィルムとの間の剥離力は、１８０ｍＮ/５０ｍｍ以下であることが好ましく、１００ｍＮ/５０ｍｍ以上１８０ｍＮ/５０ｍｍ以下であることが好ましく、１２０ｍＮ/５０ｍｍ以上１７０ｍＮ/５０ｍｍ以下であることがより好ましく、１３０ｍＮ/５０ｍｍ以上１６０ｍＮ/５０ｍｍ以下であることがさらに好ましい。
　第２試験片における、上記の第２剥離フィルムの剥離力が上記の下限値以上であることにより、第２剥離フィルムの意図しない剥離が防止される。第１試験片における、上記の第１剥離フィルムの剥離力が上記の上限値以下であることにより、マウントプロセス適性がより一層向上された半導体製造用シートが得られる。 A single-layer pressure-sensitive adhesive layer having a thickness of 10 μm is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the second release film and drying the pressure-sensitive adhesive composition. In the second test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the second test piece and the peeled-processed surfaces of the second peeling film form an angle of 180 °. The peeling force between the pressure-sensitive adhesive layer and the second release film, which is measured by 180 ° peeling of the second release film from the agent layer, is determined.
The peeling force between the pressure-sensitive adhesive layer and the second release film in the second test piece is preferably 180 mN / 50 mm or less, preferably 100 mN / 50 mm or more and 180 mN / 50 mm or less, and 120 mN / It is more preferably 50 mm or more and 170 mN / 50 mm or less, and further preferably 130 mN / 50 mm or more and 160 mN / 50 mm or less.
When the peeling force of the second release film in the second test piece is equal to or more than the above lower limit value, unintentional peeling of the second release film is prevented. When the peeling force of the first release film in the first test piece is equal to or less than the above upper limit value, a semiconductor manufacturing sheet with further improved mounting process suitability can be obtained.
　測定に供する前記試験片の長さは、剥離力を安定して測定できる範囲であれば、特に限定されないが、１００ｍｍ～３００ｍｍであることが好ましい。 The length of the test piece to be measured is not particularly limited as long as the peeling force can be stably measured, but it is preferably 100 mm to 300 mm.
　前記第１剥離フィルムと前記フィルム状接着剤との間の剥離力、及び前記第２剥離フィルムと前記フィルム状接着剤との間の剥離力についても、上記の剥離試験と同様の方法にて測定可能である。上記の剥離試験において、試験片の粘着剤組成物を接着剤組成物に代え、粘着剤層をフィルム状接着剤に代えて、剥離フィルムとフィルム状接着剤との間の剥離力を求めることができる。 The peeling force between the first release film and the film-like adhesive and the peeling force between the second release film and the film-like adhesive are also measured by the same method as the above-mentioned peeling test. It is possible. In the above peeling test, the pressure-sensitive adhesive composition of the test piece is replaced with the adhesive composition, and the pressure-sensitive adhesive layer is replaced with the film-like adhesive to obtain the peeling force between the release film and the film-like adhesive. can.
　第１剥離フィルム及び第２剥離フィルムとしては、前記の実施形態の剥離フィルムの説明にて例示した構成を採用でき、構成及び構成材料についての詳細な説明を省略する。
　第１剥離フィルム及び第２剥離フィルムは、市販の剥離フィルムを用いることができ、所望の剥離力を有する剥離フィルムを適宜用いることができる。また、剥離処理面の剥離剤の種類及び含有量（例えば、シリコーン含有量）を適宜調整することで、所望の剥離力を備える第１剥離フィルム及び第２剥離フィルムを製造可能である。 As the first release film and the second release film, the configurations exemplified in the description of the release film of the above-described embodiment can be adopted, and detailed description of the configuration and constituent materials will be omitted.
As the first release film and the second release film, a commercially available release film can be used, and a release film having a desired release force can be appropriately used. Further, by appropriately adjusting the type and content (for example, silicone content) of the release agent on the release-treated surface, it is possible to produce a first release film and a second release film having a desired release force.
　実施形態の半導体装置製造用シートの製造方法によれば、高品質なフィルム状接着剤を備え、且つマウントプロセス適性に優れた半導体装置製造用シートを提供できる。 According to the method for manufacturing a semiconductor device manufacturing sheet of the embodiment, it is possible to provide a semiconductor device manufacturing sheet provided with a high-quality film-like adhesive and excellent in mounting process suitability.
◇半導体装置製造用シートの使用方法（フィルム状接着剤付き半導体チップの製造方法）
　前記半導体装置製造用シートは、半導体装置の製造過程において、フィルム状接着剤付き半導体チップの製造時に使用できる。
　本発明の一実施形態に係るフィルム状接着剤付き半導体チップの製造方法として、実施形態の半導体装置製造用シートの前記フィルム状接着剤の側に半導体ウエハ又は半導体チップを積層して積層体を得る工程と、
　前記フィルム状接着剤、又は前記半導体ウエハ及び前記フィルム状接着剤を、前記半導体チップの外周に沿って切断し、フィルム状接着剤付き半導体チップを得る工程と、を有する、フィルム状接着剤付き半導体チップの製造方法を提供する。 ◇ How to use sheets for manufacturing semiconductor devices (Manufacturing methods for semiconductor chips with film-like adhesive)
The sheet for manufacturing a semiconductor device can be used in the manufacturing process of a semiconductor device when manufacturing a semiconductor chip with a film-like adhesive.
As a method for manufacturing a semiconductor chip with a film-like adhesive according to an embodiment of the present invention, a semiconductor wafer or a semiconductor chip is laminated on the side of the film-like adhesive of the semiconductor device manufacturing sheet of the embodiment to obtain a laminate. Process and
A semiconductor with a film-like adhesive, which comprises a step of cutting the film-like adhesive or the semiconductor wafer and the film-like adhesive along the outer periphery of the semiconductor chip to obtain a semiconductor chip with the film-like adhesive. A method for manufacturing a chip is provided.
　以下、図面を参照しながら、前記半導体装置製造用シートの使用方法（フィルム状接着剤付き半導体チップの製造方法）について、詳細に説明する。 Hereinafter, a method of using the sheet for manufacturing a semiconductor device (a method of manufacturing a semiconductor chip with a film-like adhesive) will be described in detail with reference to the drawings.
　実施形態のフィルム状接着剤付き半導体チップの製造方法は、半導体装置製造用シートの前記フィルム状接着剤の露出面に半導体ウエハの裏面を貼付して、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記半導体ウエハがこの順に積層されて構成された積層物を得る工程と、
　前記半導体ウエハを分割するとともに、前記フィルム状接着剤を切断して、フィルム状接着剤付き半導体チップを得る工程と、
　前記基材、前記粘着剤層及び前記中間層から、前記フィルム状接着剤付き半導体チップを引き離して、ピックアップする工程と、を含む。 In the method for manufacturing a semiconductor chip with a film-like adhesive according to the embodiment, the back surface of the semiconductor wafer is attached to the exposed surface of the film-like adhesive of a sheet for manufacturing a semiconductor device, and the base material, the pressure-sensitive adhesive layer, and the intermediate are attached. A step of obtaining a laminate composed of layers, the film-like adhesive, and the semiconductor wafer laminated in this order, and
A step of dividing the semiconductor wafer and cutting the film-like adhesive to obtain a semiconductor chip with the film-like adhesive.
The process includes a step of pulling the semiconductor chip with a film-like adhesive from the base material, the pressure-sensitive adhesive layer, and the intermediate layer and picking them up.
　図４は、半導体装置製造用シートの使用方法の一例を、模式的に説明するための断面図であり、半導体装置製造用シートを半導体ウエハに貼付してから使用する場合について示している。この方法では、半導体装置製造用シートをダイシングダイボンディングシートとして使用する。ここでは、図１に示す半導体装置製造用シート１０１を例に挙げて、その使用方法について説明する。 FIG. 4 is a cross-sectional view for schematically explaining an example of how to use the semiconductor device manufacturing sheet, and shows a case where the semiconductor device manufacturing sheet is used after being attached to a semiconductor wafer. In this method, a semiconductor device manufacturing sheet is used as a dicing die bonding sheet. Here, the semiconductor device manufacturing sheet 101 shown in FIG. 1 will be taken as an example, and a method of using the sheet 101 will be described.
　まず、図４Ａに示すように、剥離フィルム１５を取り除いた状態の、半導体装置製造用シート１０１を加熱しながら、その中のフィルム状接着剤１４を、半導体ウエハ９’の裏面９ｂ’に貼付する。
　符号９ａ’は、半導体ウエハ９’の回路形成面を示している。 First, as shown in FIG. 4A, while heating the semiconductor device manufacturing sheet 101 with the release film 15 removed, the film-like adhesive 14 therein is attached to the back surface 9b'of the semiconductor wafer 9'. ..
Reference numeral 9a'indicates a circuit forming surface of the semiconductor wafer 9'.
　半導体装置製造用シート１０１の貼付時の加熱温度は、特に限定されないが、半導体装置製造用シート１０１の加熱貼付安定性がより向上する点から、４０～７０℃であることが好ましい。 The heating temperature at the time of sticking the semiconductor device manufacturing sheet 101 is not particularly limited, but is preferably 40 to 70 ° C. from the viewpoint of further improving the heating sticking stability of the semiconductor device manufacturing sheet 101.
　半導体装置製造用シート１０１中の中間層１３の幅Ｗ１３の最大値と、フィルム状接着剤１４の幅Ｗ１４の最大値は、いずれも、半導体ウエハ９’の幅Ｗ９’の最大値と全く同じであるか、又は、同じではないが、誤差が軽微で、ほぼ同等となっている。 The maximum value of the width W 13 of the intermediate layer 13 of the semiconductor device in manufacturing sheet 101, the maximum value of the width W 14 of the film-like adhesive 14, the maximum value of both, 'width W 9 of' the semiconductor wafer 9 Exactly the same, or not the same, but with minor errors and nearly equality.
　次いで、上記で得られた、半導体装置製造用シート１０１と半導体ウエハ９’との積層物を、半導体ウエハ９’の回路形成面９ａ’側からブレードで切り込む（ブレードダイシングを行う）ことにより、半導体ウエハ９’を分割するとともに、フィルム状接着剤１４を切断する。 Next, the laminate of the semiconductor device manufacturing sheet 101 and the semiconductor wafer 9'obtained above is cut with a blade from the circuit forming surface 9a'side of the semiconductor wafer 9'(blade dicing is performed) to form a semiconductor. The wafer 9'is divided and the film-like adhesive 14 is cut.
　ブレードダイシングは、公知の方法で行うことできる。例えば、半導体装置製造用シート１０１中の粘着剤層１２の第１面１２ａのうち、中間層１３及びフィルム状接着剤１４が積層されていない周縁部近傍の領域（前記非積層領域）を、リングフレーム等の治具（図示略）に固定した後、ブレードを用いて、半導体ウエハ９’の分割と、フィルム状接着剤１４の切断を行うことができる。 Blade dicing can be performed by a known method. For example, in the first surface 12a of the pressure-sensitive adhesive layer 12 in the semiconductor device manufacturing sheet 101, a region (the non-laminated region) near the peripheral edge portion where the intermediate layer 13 and the film-like adhesive 14 are not laminated is set as a ring. After fixing to a jig (not shown) such as a frame, the semiconductor wafer 9'can be divided and the film-like adhesive 14 can be cut by using a blade.
　本工程により、図４Ｂに示すように、半導体チップ９と、その裏面９ｂに設けられた切断後のフィルム状接着剤１４０と、を備えた複数個のフィルム状接着剤付き半導体チップ９１４が、得られる。これらフィルム状接着剤付き半導体チップ９１４は、積層シート１０中の中間層１３上で整列して固定された状態となっており、フィルム状接着剤付き半導体チップ群９１０を構成している。
　半導体チップ９の裏面９ｂは、半導体ウエハ９’の裏面９ｂ’に対応している。また、図４中、符号９ａは、半導体チップ９の回路形成面を示しており、半導体ウエハ９’の回路形成面９ａ’に対応している。 By this step, as shown in FIG. 4B, a plurality of semiconductor chips 914 with a film-like adhesive provided with the semiconductor chip 9 and the film-like adhesive 140 after cutting provided on the back surface 9b thereof are obtained. Be done. The semiconductor chips 914 with a film-like adhesive are aligned and fixed on the intermediate layer 13 in the laminated sheet 10, and constitute the semiconductor chip group 910 with a film-like adhesive.
The back surface 9b of the semiconductor chip 9 corresponds to the back surface 9b'of the semiconductor wafer 9'. Further, in FIG. 4, reference numeral 9a indicates a circuit forming surface of the semiconductor chip 9, and corresponds to the circuit forming surface 9a'of the semiconductor wafer 9'.
　ブレードダイシング時には、ブレードによって、半導体ウエハ９’については、その厚さ方向の全域を切り込むことで分割するとともに、半導体装置製造用シート１０１については、フィルム状接着剤１４の第１面１４ａから中間層１３の途中の領域までを切り込むことにより、フィルム状接着剤１４をその厚さ方向の全域で切断し、かつ粘着剤層１２までは切り込まないことが好ましい。
　すなわち、ブレードダイシング時には、ブレードによって、半導体装置製造用シート１０１と半導体ウエハ９’との積層物を、これらの積層方向において、半導体ウエハ９’の回路形成面９ａ’から、少なくとも中間層１３の第１面１３ａまで切り込み、かつ、中間層１３の第１面１３ａとは反対側の面（すなわち、粘着剤層１２との接触面）までは切り込まないことが好ましい。 At the time of blade dicing, the semiconductor wafer 9'is divided by cutting the entire area in the thickness direction by the blade, and the semiconductor device manufacturing sheet 101 is divided into an intermediate layer from the first surface 14a of the film-like adhesive 14. It is preferable that the film-like adhesive 14 is cut over the entire area in the thickness direction by cutting up to the region in the middle of 13, and the pressure-sensitive adhesive layer 12 is not cut.
That is, at the time of blade dicing, a laminate of the semiconductor device manufacturing sheet 101 and the semiconductor wafer 9'is formed by the blade from the circuit forming surface 9a'of the semiconductor wafer 9'in at least the intermediate layer 13th. It is preferable that the cut is made to the first surface 13a and not to the surface of the intermediate layer 13 opposite to the first surface 13a (that is, the contact surface with the pressure-sensitive adhesive layer 12).
　本工程においては、このようにブレードが基材１１に到達することを容易に回避でき、それにより、基材１１からの切削屑の発生を抑制できる。そして、ブレードによって切断される中間層１３の主成分が、重量平均分子量が１０００００以下の非ケイ素系樹脂であること、特に、重量平均分子量が１０００００以下であることによって、中間層１３からの切削屑の発生も抑制できる。 In this step, it is possible to easily prevent the blade from reaching the base material 11 in this way, and thereby it is possible to suppress the generation of cutting chips from the base material 11. The main component of the intermediate layer 13 cut by the blade is a non-silicon resin having a weight average molecular weight of 100,000 or less, and in particular, cutting chips from the intermediate layer 13 due to the weight average molecular weight of 100,000 or less. Can also be suppressed.
　ブレードダイシングの条件は、目的に応じて適宜調節すればよく、特に限定されない。
　通常、ブレードの回転速度は、１５０００～５００００ｒｐｍであることが好ましく、ブレードの移動速度は、５～７５ｍｍ／ｓｅｃであることが好ましい。 The conditions for blade dicing may be appropriately adjusted according to the intended purpose, and are not particularly limited.
Generally, the rotation speed of the blade is preferably 15,000 to 50,000 rpm, and the moving speed of the blade is preferably 5 to 75 mm / sec.
　ブレードダイシング後は、図４Ｃに示すように、フィルム状接着剤付き半導体チップ９１４を、積層シート１０中の中間層１３から引き離して、ピックアップする。ここでは、真空コレット等の引き離し手段７を用いて、フィルム状接着剤付き半導体チップ９１４を矢印Ｐ方向に引き離す場合を示している。なお、ここでは、引き離し手段７を断面表示していない。
　フィルム状接着剤付き半導体チップ９１４は、公知の方法でピックアップできる。 After the blade dicing, as shown in FIG. 4C, the semiconductor chip 914 with the film-like adhesive is separated from the intermediate layer 13 in the laminated sheet 10 and picked up. Here, a case is shown in which the semiconductor chip 914 with a film-like adhesive is pulled away in the direction of arrow P by using a pulling means 7 such as a vacuum collet. Here, the pulling means 7 is not displayed in cross section.
The semiconductor chip 914 with a film-like adhesive can be picked up by a known method.
　中間層１３の第１面１３ａにおいて、前記ケイ素濃度の割合が１～２０％である場合には、フィルム状接着剤付き半導体チップ９１４を、より容易にピックアップできる。
　中間層１３が、例えば、前記非ケイ素系樹脂であるエチレン酢酸ビニル共重合体と、前記添加剤であるシロキサン系化合物と、を含有し、中間層における、中間層の総質量に対する、エチレン酢酸ビニル共重合体の含有量の割合が、９０～９９．９９質量％であり、中間層における、中間層の総質量に対する、前記シロキサン系化合物の含有量の割合が、０．０１～１０質量％である場合には、フィルム状接着剤付き半導体チップ９１４を、より容易にピックアップできる。 When the ratio of the silicon concentration on the first surface 13a of the intermediate layer 13 is 1 to 20%, the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
The intermediate layer 13 contains, for example, the ethylene vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and the ethylene vinyl acetate with respect to the total mass of the intermediate layer in the intermediate layer. The ratio of the content of the copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 10% by mass. In some cases, the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
　ここまでで説明した前記フィルム状接着剤付き半導体チップの製造方法で、好ましい実施形態としては、例えば、半導体チップと、前記半導体チップの裏面に設けられたフィルム状接着剤と、を備えたフィルム状接着剤付き半導体チップの製造方法であって、
　前記半導体装置製造用シートは、前記基材、粘着剤層、中間層及びフィルム状接着剤を備えており、
　前記製造方法は、前記半導体装置製造用シートを加熱しながら、その中のフィルム状接着剤を、前記半導体ウエハの裏面に貼付する工程と、前記フィルム状接着剤が貼付された前記半導体ウエハを、その回路形成面側から、その厚さ方向の全域を切り込んで分割することにより、半導体チップを作製するとともに、前記半導体装置製造用シートを、その厚さ方向において、その前記フィルム状接着剤側から、前記中間層の途中の領域までを切り込んで、前記フィルム状接着剤を切断し、かつ前記粘着剤層までは切り込まないことにより、複数個の前記フィルム状接着剤付き半導体チップが、前記中間層上で整列した状態のフィルム状接着剤付き半導体チップ群を得る工程と、前記中間層から、前記フィルム状接着剤付き半導体チップを引き離して、ピックアップする工程と、を有するもの（本明細書においては、「製造方法１」と称することがある）が挙げられる。 In the method for manufacturing a semiconductor chip with a film-like adhesive described so far, as a preferred embodiment, a film-like structure including, for example, a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip. A method for manufacturing semiconductor chips with adhesive.
The sheet for manufacturing a semiconductor device includes the base material, an adhesive layer, an intermediate layer, and a film-like adhesive.
The manufacturing method includes a step of attaching a film-like adhesive therein to the back surface of the semiconductor wafer while heating the semiconductor device manufacturing sheet, and the semiconductor wafer to which the film-like adhesive is attached. A semiconductor chip is manufactured by cutting and dividing the entire area in the thickness direction from the circuit forming surface side, and the sheet for manufacturing the semiconductor device is formed from the film-like adhesive side in the thickness direction. By cutting a region in the middle of the intermediate layer, cutting the film-like adhesive, and not cutting the adhesive layer, the plurality of semiconductor chips with the film-like adhesive can be formed in the middle. It has a step of obtaining a group of semiconductor chips with a film-like adhesive aligned on a layer, and a step of pulling the semiconductor chip with a film-like adhesive from the intermediate layer and picking it up (in the present specification). May be referred to as "manufacturing method 1").
　別の実施形態のフィルム状接着剤付き半導体チップの製造方法は、半導体装置製造用シートの前記フィルム状接着剤の露出面に、複数個の前記半導体チップが整列した状態の半導体チップ群の裏面を貼付して、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記半導体チップ群がこの順に積層されて構成された積層物を得る工程と、
　前記フィルム状接着剤を切断して、フィルム状接着剤付き半導体チップを得る工程と、
　前記基材、前記粘着剤層及び前記中間層から、前記フィルム状接着剤付き半導体チップを引き離して、ピックアップする工程と、を含む。 In another method of manufacturing a semiconductor chip with a film-like adhesive, a back surface of a group of semiconductor chips in which a plurality of the semiconductor chips are aligned is formed on an exposed surface of the film-like adhesive of a semiconductor device manufacturing sheet. A step of attaching the substrate, the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive, and the semiconductor chip group in this order to obtain a laminate.
A step of cutting the film-like adhesive to obtain a semiconductor chip with the film-like adhesive,
The process includes a step of pulling the semiconductor chip with a film-like adhesive from the base material, the pressure-sensitive adhesive layer, and the intermediate layer and picking them up.
　図５は、半導体装置製造用シートの使用対象である半導体チップの製造方法の一例を、模式的に説明するための断面図であり、半導体ウエハでの改質層の形成を伴うダイシングを行うことによって、半導体チップを製造する場合について示している。
　図６は、半導体装置製造用シートの使用方法の他の例を、模式的に説明するための断面図であり、半導体装置製造用シートを半導体チップに貼付してから使用する場合について示している。この方法では、半導体装置製造用シートをダイボンディングシートとして使用する。ここでは、図１に示す半導体装置製造用シート１０１を例に挙げて、その使用方法について説明する。 FIG. 5 is a cross-sectional view for schematically explaining an example of a method for manufacturing a semiconductor chip, which is a target for using a sheet for manufacturing a semiconductor device, and dicing is performed with formation of a modified layer on a semiconductor wafer. The case where a semiconductor chip is manufactured is shown.
FIG. 6 is a cross-sectional view for schematically explaining another example of how to use the semiconductor device manufacturing sheet, and shows a case where the semiconductor device manufacturing sheet is used after being attached to a semiconductor chip. .. In this method, a semiconductor device manufacturing sheet is used as a die bonding sheet. Here, the semiconductor device manufacturing sheet 101 shown in FIG. 1 will be taken as an example, and a method of using the sheet 101 will be described.
　まず、半導体装置製造用シート１０１の使用に先立ち、図５Ａに示すように、半導体ウエハ９’を用意し、その回路形成面９ａ’に、バックグラインドテープ（「表面保護テープ」と称することもある）８を貼付する。
　図５中、符号Ｗ９’は、半導体ウエハ９’の幅を示している。 First, prior to the use of the semiconductor device manufacturing sheet 101, as shown in FIG. 5A, a semiconductor wafer 9'is prepared, and a back grind tape (sometimes referred to as "surface protection tape") is provided on the circuit forming surface 9a'. ) Attach 8.
In FIG. 5, reference numeral W 9 ', the semiconductor wafer 9' indicates the width of the.
　次いで、半導体ウエハ９’の内部に設定された焦点に集束するように、レーザー光（図示略）を照射することにより、図５Ｂに示すように、半導体ウエハ９’の内部に改質層９０’を形成する。
　前記レーザー光は、半導体ウエハ９’の裏面９ｂ’側から、半導体ウエハ９’に照射することが好ましい。 Next, by irradiating a laser beam (not shown) so as to focus on the focal point set inside the semiconductor wafer 9', the modified layer 90' is inside the semiconductor wafer 9'as shown in FIG. 5B. To form.
It is preferable that the laser beam irradiates the semiconductor wafer 9'from the back surface 9b' side of the semiconductor wafer 9'.
　このときの焦点の位置は、半導体ウエハ９’の分割（ダイシング）予定位置であり、半導体ウエハ９’から目的とする大きさ、形状及び個数の半導体チップが得られるように設定される。 The focal position at this time is the planned division (dicing) position of the semiconductor wafer 9', and is set so that the desired size, shape, and number of semiconductor chips can be obtained from the semiconductor wafer 9'.
　次いで、グラインダー（図示略）を用いて、半導体ウエハ９’の裏面９ｂ’を研削する。これにより、半導体ウエハ９’の厚さを目的とする値に調節するとともに、このときの半導体ウエハ９’に加えられる研削時の力を利用することによって、改質層９０’の形成部位において、半導体ウエハ９’を分割し、図５Ｃに示すように、複数個の半導体チップ９を作製する。 Next, the back surface 9b'of the semiconductor wafer 9'is ground using a grinder (not shown). As a result, the thickness of the semiconductor wafer 9'is adjusted to the desired value, and by utilizing the grinding force applied to the semiconductor wafer 9'at this time, the thickness of the modified layer 90'is formed at the site where the modified layer 90'is formed. The semiconductor wafer 9'is divided to produce a plurality of semiconductor chips 9 as shown in FIG. 5C.
　半導体ウエハ９’の改質層９０’は、半導体ウエハ９’の他の箇所とは異なり、レーザー光の照射によって変質しており、強度が弱くなっている。そのため、改質層９０’が形成された半導体ウエハ９’に力を加えることにより、改質層９０’に力が加えられ、この改質層９０’の部位において半導体ウエハ９’が割れて、複数個の半導体チップ９が得られる。 Unlike other parts of the semiconductor wafer 9', the modified layer 90'of the semiconductor wafer 9'has been altered by irradiation with laser light, and its strength is weakened. Therefore, by applying a force to the semiconductor wafer 9'on which the modified layer 90'is formed, the force is applied to the modified layer 90', and the semiconductor wafer 9'is cracked at the portion of the modified layer 90', and the semiconductor wafer 9'is cracked. A plurality of semiconductor chips 9 can be obtained.
　以上により、半導体装置製造用シート１０１の使用対象である半導体チップ９が得られる。より具体的には、本工程により、バックグラインドテープ８上で複数個の半導体チップ９が整列して固定された状態の半導体チップ群９０１が得られる。 From the above, the semiconductor chip 9 to be used for the semiconductor device manufacturing sheet 101 can be obtained. More specifically, by this step, a semiconductor chip group 901 in a state in which a plurality of semiconductor chips 9 are aligned and fixed on the back grind tape 8 is obtained.
　半導体チップ群９０１を、その上方から見下ろして平面視したときに、半導体チップ群９０１の最も外側の部位を結んで形成される平面形状（本明細書においては、このような平面形状を単に「半導体チップ群の平面形状」と称することがある）は、半導体ウエハ９’を同様に平面視したときの平面形状と全く同じであるか、又は、これら平面形状同士の相違点は無視し得るほどに軽微であって、半導体チップ群９０１の前記平面形状は、半導体ウエハ９’の前記平面形状と概ね同じであるといえる。
　したがって、半導体チップ群９０１の前記平面形状の幅は、図５Ｃに示すように、半導体ウエハ９’の幅Ｗ９’と同じであると見做せる。そして、半導体チップ群９０１の前記平面形状の幅の最大値は、半導体ウエハ９’の幅Ｗ９’の最大値と同じであると見做せる。 When the semiconductor chip group 901 is viewed in a plan view from above, a planar shape formed by connecting the outermost parts of the semiconductor chip group 901 (in the present specification, such a planar shape is simply referred to as "semiconductor". The planar shape of the chip group) is exactly the same as the planar shape when the semiconductor wafer 9'is similarly viewed in a planar view, or the differences between these planar shapes are negligible. It can be said that the planar shape of the semiconductor chip group 901 is substantially the same as the planar shape of the semiconductor wafer 9'.
Therefore, the width of the planar shape of the semiconductor chip group 901, as shown in FIG. 5C,做cause appears to be the same as 'the width W 9 of' the semiconductor wafer 9. Then, the maximum value of the width of the planar shape of the semiconductor chip group 901,做causes appear to be the same as the maximum value of the 'width W 9 of' the semiconductor wafer 9.
　なお、ここでは、半導体ウエハ９’から半導体チップ９を目的どおりに作製できた場合について示しているが、半導体ウエハ９’の裏面９ｂ’の研削時の条件によっては、半導体ウエハ９’の一部の領域において、半導体チップ９への分割が行われないこともある。 Here, the case where the semiconductor chip 9 can be manufactured from the semiconductor wafer 9'as intended is shown, but depending on the conditions at the time of grinding the back surface 9b'of the semiconductor wafer 9', a part of the semiconductor wafer 9'. In this region, the semiconductor chip 9 may not be divided.
　次いで、上記で得られた半導体チップ９（半導体チップ群９０１）を用いて、フィルム状接着剤付き半導体チップを製造する。
　まず、図６Ａに示すように、剥離フィルム１５を取り除いた状態の、１枚の半導体装置製造用シート１０１を加熱しながら、その中のフィルム状接着剤１４を、半導体チップ群９０１中のすべての半導体チップ９の裏面９ｂに貼付する。このときのフィルム状接着剤１４の貼付対象は、完全には分割されていない半導体ウエハであってもよい。 Next, the semiconductor chip 9 (semiconductor chip group 901) obtained above is used to manufacture a semiconductor chip with a film-like adhesive.
First, as shown in FIG. 6A, while heating one sheet 101 for manufacturing a semiconductor device in a state where the release film 15 is removed, the film-like adhesive 14 in the sheet is applied to all the sheets in the semiconductor chip group 901. It is attached to the back surface 9b of the semiconductor chip 9. The target of the film-like adhesive 14 at this time may be a semiconductor wafer that is not completely divided.
　半導体装置製造用シート１０１中の中間層１３の幅Ｗ１３の最大値と、フィルム状接着剤１４の幅Ｗ１４の最大値は、いずれも、半導体ウエハ９’の幅Ｗ９’（換言すると、半導体チップ群９０１の幅）の最大値と全く同じであるか、又は、同じではないが、誤差が軽微で、ほぼ同等となっている。 The maximum value of the width W 13 of the intermediate layer 13 and the maximum value of the width W 14 of the film-like adhesive 14 in the semiconductor device manufacturing sheet 101 are both the width W 9'of the semiconductor wafer 9' (in other words, the width W 9'(in other words,). It is exactly the same as or not the same as the maximum value of the semiconductor chip group 901), but the error is slight and almost the same.
　このときの半導体チップ群９０１へのフィルム状接着剤１４（半導体装置製造用シート１０１）の貼付は、半導体ウエハ９’に代えて半導体チップ群９０１を用いる点を除けば、前記製造方法１における、半導体ウエハ９’へのフィルム状接着剤１４（半導体装置製造用シート１０１）の貼付の場合と同じ方法で行うことができる。 At this time, the film-like adhesive 14 (semiconductor device manufacturing sheet 101) is attached to the semiconductor chip group 901 according to the manufacturing method 1 except that the semiconductor chip group 901 is used instead of the semiconductor wafer 9'. It can be carried out in the same manner as in the case of attaching the film-like adhesive 14 (semiconductor device manufacturing sheet 101) to the semiconductor wafer 9'.
　次いで、この固定した状態の半導体チップ群９０１からバックグラインドテープ８を取り除く。そして、図６Ｂに示すように、半導体装置製造用シート１０１を、冷却しながら、その表面（例えば、粘着剤層１２の第１面１２ａ）に対して平行な方向に引き伸ばすことにより、エキスパンドする。ここでは、半導体装置製造用シート１０１のエキスパンドの方向を矢印Ｅ１で示している。このようにエキスパンドすることにより、フィルム状接着剤１４を半導体チップ９の外周に沿って切断する。 Next, the back grind tape 8 is removed from the semiconductor chip group 901 in the fixed state. Then, as shown in FIG. 6B, the semiconductor device manufacturing sheet 101 is expanded while being cooled by stretching it in a direction parallel to its surface (for example, the first surface 12a of the pressure-sensitive adhesive layer 12). Here, an expanding direction of the semiconductor device producing sheet 101 in the arrow E 1. By expanding in this way, the film-like adhesive 14 is cut along the outer circumference of the semiconductor chip 9.
　本工程により、半導体チップ９と、その裏面９ｂに設けられた切断後のフィルム状接着剤１４０と、を備えた複数個のフィルム状接着剤付き半導体チップ９１４が、得られる。これらフィルム状接着剤付き半導体チップ９１４は、積層シート１０中の中間層１３上で整列して固定された状態となっており、フィルム状接着剤付き半導体チップ群９１０を構成している。
　ここで得られる、フィルム状接着剤付き半導体チップ９１４及びフィルム状接着剤付き半導体チップ群９１０は、いずれも、先に説明した製造方法１で得られるフィルム状接着剤付き半導体チップ９１４及びフィルム状接着剤付き半導体チップ群９１０と実質的に同じである。 By this step, a plurality of semiconductor chips 914 with a film-like adhesive including the semiconductor chip 9 and the film-like adhesive 140 after cutting provided on the back surface 9b thereof are obtained. The semiconductor chips 914 with a film-like adhesive are aligned and fixed on the intermediate layer 13 in the laminated sheet 10, and constitute the semiconductor chip group 910 with a film-like adhesive.
The semiconductor chip 914 with a film-like adhesive and the semiconductor chip group 910 with a film-like adhesive obtained here are both the semiconductor chip 914 with a film-like adhesive and the film-like adhesive obtained by the manufacturing method 1 described above. It is substantially the same as the agent-containing semiconductor chip group 910.
　先の説明のとおり、半導体ウエハ９’の分割時に、半導体ウエハ９’の一部の領域において、半導体チップ９への分割が行われなかった場合には、本工程を行うことにより、この領域は半導体チップへ分割される。 As described above, when the semiconductor wafer 9'is divided, if the semiconductor wafer 9'is not divided into the semiconductor chip 9 in a part of the region, this region can be obtained by performing this step. It is divided into semiconductor chips.
　半導体装置製造用シート１０１は、その温度を－５～５℃としてエキスパンドすることが好ましい。半導体装置製造用シート１０１を、このように冷却してエキスパンドする（クールエキスパンドを行う）ことにより、フィルム状接着剤１４をより容易かつ高精度に切断できる。 The semiconductor device manufacturing sheet 101 is preferably expanded at a temperature of −5 to 5 ° C. By cooling and expanding the semiconductor device manufacturing sheet 101 in this way (performing cool expansion), the film-like adhesive 14 can be cut more easily and with high accuracy.
　半導体装置製造用シート１０１のエキスパンドは、公知の方法で行うことできる。例えば、半導体装置製造用シート１０１中の粘着剤層１２の第１面１２ａのうち、中間層１３及びフィルム状接着剤１４が積層されていない周縁部近傍の領域（前記非積層領域）を、リングフレーム等の治具（図示略）に固定した後、半導体装置製造用シート１０１の中間層１３及びフィルム状接着剤１４が積層されている領域全体を、基材１１から粘着剤層１２へ向かう方向に、基材１１側から突き上げることにより、半導体装置製造用シート１０１をエキスパンドできる。 The expansion of the semiconductor device manufacturing sheet 101 can be performed by a known method. For example, in the first surface 12a of the pressure-sensitive adhesive layer 12 in the semiconductor device manufacturing sheet 101, a region (the non-laminated region) near the peripheral edge portion where the intermediate layer 13 and the film-like adhesive 14 are not laminated is set as a ring. After fixing to a jig (not shown) such as a frame, the entire region where the intermediate layer 13 and the film-like adhesive 14 of the semiconductor device manufacturing sheet 101 are laminated is directed from the base material 11 to the pressure-sensitive adhesive layer 12. By pushing up from the base material 11 side, the semiconductor device manufacturing sheet 101 can be expanded.
　図６Ｂでは、粘着剤層１２の第１面１２ａのうち、中間層１３及びフィルム状接着剤１４が積層されていない前記非積層領域は、中間層１３の第１面１３ａに対してほぼ平行となっているが、上述のように、半導体装置製造用シート１０１の突き上げによりエキスパンドしている状態では、前記非積層領域は、粘着剤層１２の外周に近付くにしたがって、上記の突き上げの方向とは逆方向に高さが下降する傾斜面を含む。 In FIG. 6B, of the first surface 12a of the pressure-sensitive adhesive layer 12, the non-laminated region in which the intermediate layer 13 and the film-like adhesive 14 are not laminated is substantially parallel to the first surface 13a of the intermediate layer 13. However, as described above, in the state of being expanded by pushing up the semiconductor device manufacturing sheet 101, the non-laminated region is different from the above-mentioned pushing direction as it approaches the outer periphery of the pressure-sensitive adhesive layer 12. Includes an inclined surface whose height descends in the opposite direction.
　本工程では、半導体装置製造用シート１０１が中間層１３を備えている（換言すると、切断前のフィルム状接着剤１４が中間層１３上に設けられている）ことにより、フィルム状接着剤１４が目的とする箇所で（換言すると、半導体チップ９の外周に沿って）精度よく切断され、切断不良を抑制できる。 In this step, the semiconductor device manufacturing sheet 101 is provided with the intermediate layer 13 (in other words, the film-like adhesive 14 before cutting is provided on the intermediate layer 13), so that the film-like adhesive 14 is formed. It can be accurately cut at a target location (in other words, along the outer periphery of the semiconductor chip 9), and cutting defects can be suppressed.
　エキスパンド後は、図６Ｃに示すように、フィルム状接着剤付き半導体チップ９１４を、積層シート１０中の中間層１３から引き離して、ピックアップする。
　このときのピックアップは、先に説明した製造方法１におけるピックアップと同じ方法で行うことができ、ピックアップ適性も、製造方法１におけるピックアップ適性と同様である。 After the expansion, as shown in FIG. 6C, the semiconductor chip 914 with the film-like adhesive is separated from the intermediate layer 13 in the laminated sheet 10 and picked up.
The pickup at this time can be performed by the same method as the pickup in the manufacturing method 1 described above, and the pickup suitability is also the same as the pickup suitability in the manufacturing method 1.
　例えば、本工程においても、中間層１３の第１面１３ａにおいて、前記ケイ素濃度の割合が１～２０％である場合には、フィルム状接着剤付き半導体チップ９１４を、より容易にピックアップできる。
　また、中間層１３が、例えば、前記非ケイ素系樹脂であるエチレン酢酸ビニル共重合体と、前記添加剤であるシロキサン系化合物と、を含有し、中間層における、中間層の総質量に対する、エチレン酢酸ビニル共重合体の含有量の割合が、９０～９９．９９質量％であり、中間層における、中間層の総質量に対する、前記シロキサン系化合物の含有量の割合が、０．０１～１０質量％である場合には、フィルム状接着剤付き半導体チップ９１４を、より容易にピックアップできる。 For example, also in this step, when the ratio of the silicon concentration on the first surface 13a of the intermediate layer 13 is 1 to 20%, the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
Further, the intermediate layer 13 contains, for example, the ethylene-vinyl acetate copolymer which is the non-silicon resin and the siloxane compound which is the additive, and is ethylene with respect to the total mass of the intermediate layer in the intermediate layer. The ratio of the content of the vinyl acetate copolymer is 90 to 99.99% by mass, and the ratio of the content of the siloxane compound to the total mass of the intermediate layer in the intermediate layer is 0.01 to 10% by mass. When it is%, the semiconductor chip 914 with a film-like adhesive can be picked up more easily.
　ここまでで説明した前記フィルム状接着剤付き半導体チップの製造方法で、好ましい実施形態としては、例えば、半導体チップと、前記半導体チップの裏面に設けられたフィルム状接着剤と、を備えたフィルム状接着剤付き半導体チップの製造方法であって、
　前記半導体装置製造用シートは、前記基材、粘着剤層、中間層及びフィルム状接着剤を備えており、
　前記製造方法は、半導体ウエハの内部に設定された焦点に集束するように、レーザー光を照射することにより、前記半導体ウエハの内部に改質層を形成する工程と、前記改質層を形成後の前記半導体ウエハの裏面を研削するとともに、前記半導体ウエハに加えられる研削時の力を利用することにより、前記改質層の形成部位において、前記半導体ウエハを分割し、複数個の半導体チップが整列した状態の半導体チップ群を得る工程と、前記半導体装置製造用シートを加熱しながら、その中のフィルム状接着剤を、前記半導体チップ群中のすべての半導体チップの裏面に貼付する工程と、前記半導体チップに貼付した後の前記半導体装置製造用シートを、冷却しながら、その表面に対して平行な方向に引き伸ばすことにより、前記フィルム状接着剤を前記半導体チップの外周に沿って切断し、複数個の前記フィルム状接着剤付き半導体チップが、前記中間層上で整列した状態のフィルム状接着剤付き半導体チップ群を得る工程と、前記中間層から、前記フィルム状接着剤付き半導体チップを引き離して、ピックアップする工程と、を有するもの（本明細書においては、「製造方法２」と称することがある）が挙げられる。 In the method for manufacturing a semiconductor chip with a film-like adhesive described so far, as a preferred embodiment, a film-like structure including, for example, a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip. A method for manufacturing semiconductor chips with adhesive.
The sheet for manufacturing a semiconductor device includes the base material, an adhesive layer, an intermediate layer, and a film-like adhesive.
The manufacturing method includes a step of forming a modified layer inside the semiconductor wafer by irradiating a laser beam so as to focus on a focal point set inside the semiconductor wafer, and after forming the modified layer. By grinding the back surface of the semiconductor wafer and utilizing the grinding force applied to the semiconductor wafer, the semiconductor wafer is divided at the formation site of the modified layer, and a plurality of semiconductor chips are aligned. A step of obtaining a semiconductor chip group in a state of being in a state of being in the state, a step of attaching a film-like adhesive therein to the back surface of all the semiconductor chips in the semiconductor chip group while heating the semiconductor device manufacturing sheet, and the above-mentioned The film-like adhesive is cut along the outer periphery of the semiconductor chip by stretching the sheet for manufacturing the semiconductor device after being attached to the semiconductor chip in a direction parallel to the surface thereof while cooling. The step of obtaining the semiconductor chip group with the film-like adhesive in a state where the semiconductor chips with the film-like adhesive are aligned on the intermediate layer, and the step of separating the semiconductor chip with the film-like adhesive from the intermediate layer. , And a step of picking up (in this specification, it may be referred to as "manufacturing method 2").
　ここまでは、製造方法１及び製造方法２のいずれの場合も、図１に示す半導体装置製造用シート１０１を例に挙げて、その使用方法について説明したが、それ以外の本実施形態に係る半導体装置製造用シートも、同様に使用できる。その場合、必要に応じて、この半導体装置製造用シートと、半導体装置製造用シート１０１と、の構成の相違点に基づいて、他の工程を適宜追加して、半導体装置製造用シートを使用してもよい。 Up to this point, in both the manufacturing method 1 and the manufacturing method 2, the usage method has been described by taking the semiconductor device manufacturing sheet 101 shown in FIG. 1 as an example, but other semiconductors according to the present embodiment have been described. The device manufacturing sheet can be used in the same manner. In that case, if necessary, based on the difference in configuration between the semiconductor device manufacturing sheet and the semiconductor device manufacturing sheet 101, other steps are appropriately added to use the semiconductor device manufacturing sheet. You may.
　製造方法１及び製造方法２の場合に限らず、前記フィルム状接着剤付き半導体チップ群を得た後は、前記フィルム状接着剤付き半導体チップをピックアップする前に、前記積層シートを、前記粘着剤層の前記中間層側の面（第１面）に対して平行な方向にエキスパンドし、さらにこの状態を維持したまま、前記積層シートのうち、前記フィルム状接着剤付き半導体チップ（フィルム状接着剤付き半導体チップ群）が載っていない周縁部を加熱してもよい。
　このようにすることで、前記周縁部を収縮させつつ、前記積層シート上においては、隣接する半導体チップ間の距離、すなわちカーフ幅を、十分に広くかつ高い均一性で保持できる。そして、フィルム状接着剤付き半導体チップをより容易にピックアップできる。 Not limited to the cases of the manufacturing method 1 and the manufacturing method 2, after obtaining the film-shaped adhesive-attached semiconductor chip group, before picking up the film-shaped adhesive-attached semiconductor chip, the laminated sheet is subjected to the pressure-sensitive adhesive. The semiconductor chip with a film-like adhesive (film-like adhesive) among the laminated sheets is expanded in a direction parallel to the surface (first surface) of the layer on the intermediate layer side, and while maintaining this state. The peripheral portion on which the attached semiconductor chip group) is not mounted may be heated.
By doing so, the distance between adjacent semiconductor chips, that is, the calf width can be maintained with sufficiently wide and high uniformity on the laminated sheet while shrinking the peripheral edge portion. Then, the semiconductor chip with the film-like adhesive can be picked up more easily.
　以下、具体的実施例により、本発明についてより詳細に説明する。ただし、本発明は、以下に示す実施例に、何ら限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.
＜＜接着剤組成物の製造原料＞＞
　接着剤組成物の製造に用いた原料を以下に示す。
［重合体成分（ａ）］
　（ａ）－１：アクリル酸メチル（９５質量部）及びアクリル酸－２－ヒドロキシエチル（５質量部）を共重合してなるアクリル樹脂（重量平均分子量８０００００、ガラス転移温度９℃）。
［エポキシ樹脂（ｂ１）］
　（ｂ１）－１：アクリロイル基が付加されたクレゾールノボラック型エポキシ樹脂（日本化薬社製「ＣＮＡ１４７」、エポキシ当量５１８ｇ／ｅｑ、数平均分子量２１００、不飽和基含有量はエポキシ基と等量）。
［熱硬化剤（ｂ２）］
　（ｂ２）－１：アラルキル型フェノール樹脂（三井化学社製「ミレックスＸＬＣ－４Ｌ」、数平均分子量１１００、軟化点６３℃）
［充填材（ｄ）］
　（ｄ）－１：球状シリカ（アドマテックス社製「ＹＡ０５０Ｃ－ＭＪＥ」、平均粒径５０ｎｍ、メタクリルシラン処理品）
［カップリング剤（ｅ）］
　（ｅ）－１：シランカップリング剤、３－グリシドキシプロピルメチルジエトキシシラン（信越シリコーン社製「ＫＢＥ－４０２」）
［架橋剤（ｆ）］
　（ｆ）－１：トリレンジイソシアナート系架橋剤（東ソー社製「コロネートＬ」） << Raw materials for manufacturing adhesive compositions >>
The raw materials used in the production of the adhesive composition are shown below.
[Polymer component (a)]
(A) -1: An acrylic resin obtained by copolymerizing methyl acrylate (95 parts by mass) and -2-hydroxyethyl acrylate (5 parts by mass) (weight average molecular weight 800,000, glass transition temperature 9 ° C.).
[Epoxy resin (b1)]
(B1) -1: Cresol novolac type epoxy resin to which an acryloyl group is added (“CNA147” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 518 g / eq, number average molecular weight 2100, unsaturated group content is equal to that of epoxy group) ..
[Thermosetting agent (b2)]
(B2) -1: Aralkyl type phenol resin (“Millex XLC-4L” manufactured by Mitsui Chemicals, Inc., number average molecular weight 1100, softening point 63 ° C.)
[Filler (d)]
(D) -1: Spherical silica ("YA050C-MJE" manufactured by Admatex, average particle size 50 nm, methacrylic silane treated product)
[Coupling agent (e)]
(E) -1: Silane coupling agent, 3-glycidoxypropylmethyldiethoxysilane ("KBE-402" manufactured by Shinetsu Silicone Co., Ltd.)
[Crosslinking agent (f)]
(F) -1: Torisocyanate-based cross-linking agent ("Coronate L" manufactured by Tosoh Corporation)
［実施例１］
＜＜半導体装置製造用シートの製造＞＞
＜基材の製造＞
　押出機を用いて、低密度ポリエチレン（ＬＤＰＥ、住友化学社製「スミカセンＬ７０５」）を溶融させ、Ｔダイ法により溶融物を押し出し、冷却ロールを用いて押し出し物を２軸で延伸することにより、ＬＤＰＥ製の基材（厚さ１１０μｍ）を得た。 [Example 1]
<< Manufacturing of Sheets for Manufacturing Semiconductor Devices >>
<Manufacturing of base material>
By melting low-density polyethylene (LDPE, "Sumikasen L705" manufactured by Sumitomo Chemical Co., Ltd.) using an extruder, extruding the melt by the T-die method, and stretching the extruded product in two shafts using a cooling roll. A substrate made of LDPE (thickness 110 μm) was obtained.
＜剥離フィルム＞
［軽剥離フィルム］
　ポリエチレンテレフタレート製フィルムの片面がシリコーン剥離剤で剥離処理されたフィルム（リンテック株式会社製、製品名「ＳＰ－ＰＥＴ３８１０３１」）を使用した。
［重剥離フィルム］
　ポリエチレンテレフタレート製フィルムの片面がシリコーン剥離剤で剥離処理されたＰＥＴフィルム（リンテック株式会社製、製品名「ＳＰ－ＰＥＴ３８２１５０」）を使用した。
［中剥離フィルム］
　ポリエチレンテレフタレート製フィルムの片面がシリコーン剥離剤で剥離処理されたＰＥＴフィルム（リンテック株式会社製、製品名「ＳＰ－ＰＥＴ３８２０５１」）を使用した。 <Release film>
[Light release film]
A film (manufactured by Lintec Corporation, product name "SP-PET38131") in which one side of a polyethylene terephthalate film was peeled off with a silicone release agent was used.
[Heavy release film]
A PET film (manufactured by Lintec Corporation, product name "SP-PET382150") in which one side of a polyethylene terephthalate film was peeled off with a silicone release agent was used.
[Medium release film]
A PET film (manufactured by Lintec Corporation, product name "SP-PET382501") in which one side of a polyethylene terephthalate film was peeled off with a silicone release agent was used.
＜粘着剤層の作製＞
　粘着性樹脂（Ｉ－１ａ）としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）（１００質量部）と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）（１質量部）と、を含有する非エネルギー線硬化性の粘着剤組成物を製造した。 <Preparation of adhesive layer>
Non-adhesive resin (I-1a) containing an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) (100 parts by mass) and a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) (1 part by mass). An energy ray-curable pressure-sensitive adhesive composition was produced.
　次いで、上記の軽剥離フィルムを用い、その前記剥離処理面に、上記で得られた粘着剤組成物を塗工し、１００℃で２分、加熱乾燥させることにより、非エネルギー線硬化性の粘着剤層（厚さ２０μｍ）を作製した。 Next, using the above-mentioned light release film, the pressure-sensitive adhesive composition obtained above is applied to the release-treated surface and dried by heating at 100 ° C. for 2 minutes to obtain a non-energy ray-curable pressure-sensitive adhesive. An agent layer (thickness 20 μm) was prepared.
＜中間層の作製＞
　常温下で、エチレン酢酸ビニル共重合体（ＥＶＡ、重量平均分子量３００００、酢酸ビニルから誘導された構成単位の含有量２５質量％）（１５ｇ）をテトラヒドロフラン８５ｇに溶解させ、得られた溶液に、シロキサン系化合物（ポリジメチルシロキサン、ビックケミー・ジャパン社製「ＢＹＫ－３３３」、１分子中の式「－Ｓｉ（－ＣＨ３）２－Ｏ－」で表される構成単位の数が４５～２３０）（１．５ｇ）を添加し、撹拌することにより、中間層形成用組成物を作製した。 <Preparation of intermediate layer>
At room temperature, an ethylene-vinyl acetate copolymer (EVA, weight average molecular weight of 30,000, content of a structural unit derived from vinyl acetate of 25% by mass) (15 g) was dissolved in 85 g of tetrahydrofuran, and siloxane was added to the obtained solution. System compounds (polydimethylsiloxane, "BYK-333" manufactured by Big Chemie Japan Co., Ltd., and the number of structural units represented by the formula "-Si (-CH 3 ) 2-O-" in one molecule is 45 to 230) ( 1.5 g) was added and stirred to prepare a composition for forming an intermediate layer.
　上記の軽剥離フィルムを用い、その前記剥離処理面に、上記で得られた中間層形成用組成物を塗工し、７０℃で５分、加熱乾燥させることにより、中間層（厚さ２０μｍ）を作製した。 Using the above-mentioned light release film, the above-mentioned composition for forming an intermediate layer is applied to the release-treated surface, and the mixture is heat-dried at 70 ° C. for 5 minutes to obtain an intermediate layer (thickness 20 μm). Was produced.
＜フィルム状接着剤の作製＞
　重合体成分（ａ）－１（１００質量部）、エポキシ樹脂（ｂ１）－１（１０質量部）、熱硬化剤（ｂ２）－１（１．５質量部）、充填材（ｄ）－１（７５質量部）、カップリング剤（ｅ）－１（０．５質量部）、及び架橋剤（ｆ）－１（０．５質量部）を含有する熱硬化性の接着剤組成物を製造した。 <Making a film-like adhesive>
Polymer component (a) -1 (100 parts by mass), epoxy resin (b1) -1 (10 parts by mass), thermosetting agent (b2) -1 (1.5 parts by mass), filler (d) -1 A thermosetting adhesive composition containing (75 parts by mass), a coupling agent (e) -1 (0.5 parts by mass), and a cross-linking agent (f) -1 (0.5 parts by mass) is produced. bottom.
　次いで、上記の重剥離フィルム（第１剥離フィルム）を用い、その前記剥離処理面に、上記で得られた接着剤組成物を塗工し、８０℃で２分、加熱乾燥させることにより、熱硬化性のフィルム状接着剤（厚さ７μｍ）を作製した。 Next, using the above-mentioned heavy-release film (first release film), the adhesive composition obtained above is applied to the release-treated surface, and heat-dried at 80 ° C. for 2 minutes to heat. A curable film-like adhesive (thickness 7 μm) was prepared.
＜半導体装置製造用シートの製造＞
　上記で得られた粘着剤層の、剥離フィルムを備えている側とは反対側の露出面を、上記で得られた基材の一方の表面と貼り合わせることにより、剥離フィルム付きの第１中間積層体（換言すると、剥離フィルム付きの支持シート）を作製した。
　上記で得られたフィルム状接着剤の、重剥離フィルムを備えている側とは反対側の露出面を、上記で得られた中間層の、軽剥離フィルムを備えている側とは反対側の露出面と貼り合わせることにより、剥離フィルム付きの第２中間積層体（軽剥離フィルム、中間層、フィルム状接着剤及び重剥離フィルムの積層物）を作製した。 <Manufacturing of sheets for manufacturing semiconductor devices>
By bonding the exposed surface of the pressure-sensitive adhesive layer obtained above on the side opposite to the side provided with the release film to one surface of the base material obtained above, the first intermediate with the release film is attached. A laminate (in other words, a support sheet with a release film) was produced.
The exposed surface of the film-like adhesive obtained above on the side opposite to the side with the heavy release film is on the side opposite to the side of the intermediate layer obtained above on the side with the light release film. By bonding to the exposed surface, a second intermediate laminate with a release film (a laminate of a light release film, an intermediate layer, a film-like adhesive, and a heavy release film) was produced.
　次いで、この剥離フィルム付きの第２中間積層体に対して、中間層側の軽剥離フィルムからフィルム状接着剤まで、切断刃を用いて打ち抜き加工を行い、不要部分を除去することにより、フィルム状接着剤側の剥離フィルム上に、平面形状が円形（直径３０５ｍｍ）のフィルム状接着剤（厚さ７μｍ）、中間層（厚さ２０μｍ）及び重剥離フィルムがこの順に、これらの厚さ方向において積層されて構成された、重剥離フィルム付きの第２中間積層体加工物を作製した。 Next, the second intermediate laminate with the release film is punched from the light release film on the intermediate layer side to the film-like adhesive using a cutting blade to remove unnecessary parts to form a film. On the release film on the adhesive side, a film-like adhesive (thickness 7 μm) having a circular planar shape (diameter 305 mm), an intermediate layer (thickness 20 μm), and a heavy release film are laminated in this order in these thickness directions. A second intermediate laminated body processed product with a heavy-release film was produced.
　次いで、上記で得られた、軽剥離フィルム付きの第１中間積層体から、軽剥離フィルムを取り除き、粘着剤層の一方の面を露出させた。
　さらに、上記で得られた、剥離フィルム付きの第２中間積層体加工物から、円形の軽剥離フィルムを取り除き、中間層の一方の面を露出させた。
　次いで、第１中間積層体中の粘着剤層の、新たに生じた露出面と、第２中間積層体加工物中の中間層の、新たに生じた露出面と、を貼り合わせた。そして、第１中間積層体と第２中間積層体加工物との積層物から重剥離フィルム（第１剥離フィルム）を取り除き、代わりに軽剥離フィルム（第２剥離フィルム）を貼り合わせる貼替えを行った。
　これにより得られた積層物中の基材及び粘着剤層（すなわち支持シート）に対して、これら（支持シート）の平面形状が円形（直径３７０ｍｍ）となり、かつ、円形のフィルム状接着剤及び中間層（直径３０５ｍｍ）と同心円状となるように、切断刃（直径３７０ｍｍ）を用いて基材側から打ち抜き加工を行い、不要部分を除去した。
　以上により、基材（厚さ１１０μｍ）、粘着剤層（厚さ１０μｍ）、中間層（厚さ２０μｍ）、フィルム状接着剤（厚さ７μｍ）及び剥離フィルムがこの順に、これらの厚さ方向において積層されて構成された、剥離フィルム付きの半導体装置製造用シートを得た。 Next, the light release film was removed from the first intermediate laminate with the light release film obtained above to expose one surface of the pressure-sensitive adhesive layer.
Further, the circular light release film was removed from the second intermediate laminate work piece with the release film obtained above to expose one surface of the intermediate layer.
Next, the newly generated exposed surface of the pressure-sensitive adhesive layer in the first intermediate laminate and the newly generated exposed surface of the intermediate layer in the second intermediate laminate processed product were bonded together. Then, the heavy release film (first release film) is removed from the laminate of the first intermediate laminate and the second intermediate laminate processed product, and a light release film (second release film) is attached instead. rice field.
With respect to the base material and the pressure-sensitive adhesive layer (that is, the support sheet) in the laminate thus obtained, the planar shape of these (support sheets) is circular (diameter 370 mm), and the circular film-like adhesive and the intermediate. An unnecessary portion was removed by punching from the base material side using a cutting blade (diameter 370 mm) so as to be concentric with the layer (diameter 305 mm).
As described above, the base material (thickness 110 μm), the pressure-sensitive adhesive layer (thickness 10 μm), the intermediate layer (thickness 20 μm), the film-like adhesive (thickness 7 μm), and the release film are formed in this order in these thickness directions. A sheet for manufacturing a semiconductor device with a release film, which was formed by laminating, was obtained.
［参考例１］
　第１中間積層体と第２中間積層体加工物との積層物において、重剥離フィルムから軽剥離フィルムへの貼替えを行わない点以外は、実施例１の場合と同じ方法で、半導体装置製造用シートを製造した。 [Reference example 1]
In the laminate of the first intermediate laminate and the second intermediate laminate processed product, the semiconductor device is manufactured by the same method as in Example 1 except that the heavy release film is not replaced with the light release film. Manufactured a sheet for.
［参考例２］
　上記のフィルム状接着剤の作製において、剥離フィルムへの接着剤組成物を塗工する際に、重剥離フィルムの代わりに軽剥離フィルムを用い、第１中間積層体と第２中間積層体加工物との積層物において、軽剥離フィルムの貼替えを行わない点以外は、実施例１の場合と同じ方法で、半導体装置製造用シートを製造した。 [Reference example 2]
In the production of the above film-like adhesive, when the adhesive composition is applied to the release film, a light release film is used instead of the heavy release film, and the first intermediate laminate and the second intermediate laminate processed product are used. A sheet for manufacturing a semiconductor device was manufactured by the same method as in Example 1 except that the light release film was not reattached in the laminate with.
［参考例３］
　上記のフィルム状接着剤の作製において、剥離フィルムへの接着剤組成物を塗工する際に、重剥離フィルムの代わりに軽剥離フィルムを用い、第１中間積層体と第２中間積層体加工物との積層物において、軽剥離フィルムを取り除き、代わりに重剥離フィルムを貼り合わせた点以外は、実施例１の場合と同じ方法で、半導体装置製造用シートを製造した。 [Reference example 3]
In the production of the above film-like adhesive, when the adhesive composition is applied to the release film, a light release film is used instead of the heavy release film, and the first intermediate laminate and the second intermediate laminate processed product are used. A sheet for manufacturing a semiconductor device was manufactured by the same method as in Example 1 except that the light release film was removed and a heavy release film was bonded instead.
［参考例４］
　上記のフィルム状接着剤の作製において、剥離フィルムへの接着剤組成物を塗工する際に、重剥離フィルムの代わりに中剥離フィルムを用い、第１中間積層体と第２中間積層体加工物との積層物において、中剥離フィルムの貼替えを行わない点以外は、実施例１の場合と同じ方法で、半導体装置製造用シートを製造した。 [Reference example 4]
In the production of the above film-like adhesive, when the adhesive composition is applied to the release film, a medium release film is used instead of the heavy release film, and the first intermediate laminate and the second intermediate laminate processed product are used. A sheet for manufacturing a semiconductor device was manufactured by the same method as in the case of Example 1 except that the intermediate release film was not replaced in the laminate with.
＜＜評価＞＞
＜剥離フィルムの粘着剤層との間の剥離力＞
　上記の第１中間積層体の作製と同じ方法（ただし、加熱乾燥後の粘着剤層の厚さは１０μｍになるように変更）にて、剥離フィルム付きの第１中間積層体（剥離フィルム付きの支持シート）を作製した。作製後の剥離フィルム付きの第１中間積層体を直ちに、２３℃、５０％ＲＨの環境下で３０分静置した後、この第１中間積層体を幅５０ｍｍに切り抜き、これを試験片とした。
　このときの試験片の剥離フィルムを、粘着剤層との間の剥離力の測定対象の各剥離フィルム（軽剥離フィルム、重剥離フィルム、又は中剥離フィルム）とした。
　支持シート側を固定し、粘着剤層及び剥離フィルムの互いに接触していた面同士が１８０°の角度を為すようにして、支持シートから剥離フィルムを剥離する、いわゆる１８０°剥離を行い、剥離力（ｍＮ／５０ｍｍ）を測定した。測定条件は、剥離速度：１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨ条件下とした。
　なお、実施形態に係る半導体装置製造用シートでは、粘着剤層と該当する剥離フィルムとが直接に接する構成を有する必要はない。ここでの剥離力の評価は、剥離フィルムの性質を特定するための評価である。 << Evaluation >>
<Peeling force between the release film and the adhesive layer>
The first intermediate laminate with the release film (with the release film) by the same method as the above-mentioned preparation of the first intermediate laminate (however, the thickness of the adhesive layer after heating and drying is changed to 10 μm). Support sheet) was prepared. The first intermediate laminate with the release film after production was immediately allowed to stand for 30 minutes in an environment of 23 ° C. and 50% RH, and then the first intermediate laminate was cut out to a width of 50 mm and used as a test piece. ..
The release film of the test piece at this time was used as each release film (light release film, heavy release film, or medium release film) to be measured for the release force between the test piece and the pressure-sensitive adhesive layer.
The release film is peeled off from the support sheet by fixing the support sheet side so that the surfaces of the adhesive layer and the release film that were in contact with each other form an angle of 180 °. (MN / 50 mm) was measured. The measurement conditions were a peeling speed: 1000 mm / min, 23 ° C., and a humidity of 50% RH.
The semiconductor device manufacturing sheet according to the embodiment does not need to have a structure in which the pressure-sensitive adhesive layer and the corresponding release film are in direct contact with each other. The evaluation of the peeling force here is an evaluation for specifying the properties of the release film.
＜フィルム状接着剤の造膜性＞
　上述のフィルム状接着剤の作製と同じ方法にて、フィルム状接着剤を作製し、フィルム状接着剤の造膜性を評価した。この際、接着剤組成物の固形分濃度を１５質量％とし、アプリケーターを用いて加熱乾燥後のフィルム状接着剤の厚さが７μｍになるように、接着剤組成物を塗工した。
　接着剤組成物の塗工乾燥後、得られたフィルム状接着剤の、接着剤組成物の剥離フィルムへ接触していた部位の表面について、外観を目視観察して、フィルム状接着剤の造膜性を下記基準に従って評価した。
　Ａ：剥離フィルム上に、直径３ｍｍ以上の接着剤組成物のハジキが認められず、表面状態が良好であった。
　Ｂ：剥離フィルム上に、直径３ｍｍ以上の接着剤組成物のハジキが１～５個認められた。
　Ｃ：剥離フィルム上に、直径３ｍｍ以上の接着剤組成物のハジキが５個超認められた。 <Film-forming property of film-like adhesive>
A film-like adhesive was prepared by the same method as the above-mentioned preparation of the film-like adhesive, and the film-forming property of the film-like adhesive was evaluated. At this time, the solid content concentration of the adhesive composition was set to 15% by mass, and the adhesive composition was applied using an applicator so that the thickness of the film-like adhesive after heat drying was 7 μm.
After coating and drying of the adhesive composition, the appearance of the surface of the portion of the obtained film-like adhesive that was in contact with the release film of the adhesive composition was visually observed to form a film of the film-like adhesive. Gender was evaluated according to the following criteria.
A: No repelling of the adhesive composition having a diameter of 3 mm or more was observed on the release film, and the surface condition was good.
B: On the release film, 1 to 5 repellents of the adhesive composition having a diameter of 3 mm or more were observed.
C: More than 5 repellents of the adhesive composition having a diameter of 3 mm or more were observed on the release film.
＜マウントプロセス適性＞
　上記の実施例及び参考例で得た半導体装置製造用シートについて、テープマウンタ（リンテック製　ＲＡＤ－２７００）を用いて、そのフィルム状接着剤を、１２インチの半導体ウエハ裏面及びリングフレーム（ＤＩＳＣＯ社製）に貼りつける工程を、連続して３０枚分行った。この工程は、半導体装置製造用シートの剥離フィルムを当該シートから剥離しながら行った。
　フィルム状接着剤から剥離フィルムを剥がした後の剥離フィルムの状況について確認した。 <Mount process suitability>
With respect to the semiconductor device manufacturing sheets obtained in the above Examples and Reference Examples, a tape mounter (RAD-2700 manufactured by Lintec Corporation) was used to apply a film-like adhesive to the back surface of a 12-inch semiconductor wafer and a ring frame (manufactured by DISCO). ) Was continuously performed for 30 sheets. This step was performed while peeling the release film of the semiconductor device manufacturing sheet from the sheet.
The condition of the release film after the release film was peeled off from the film-like adhesive was confirmed.
　Ａ：３０枚の全てで、剥離フィルムからフィルム状接着剤の全面を剥離できていた。
　Ｂ：３０枚の中に、剥離フィルムからフィルム状接着剤の全面が剥離できずに、剥離フィルムにフィルム状接着剤の一部が付着していたものが認められた。 A: With all 30 sheets, the entire surface of the film-like adhesive could be peeled off from the release film.
Among the B: 30 sheets, it was observed that the entire surface of the film-like adhesive could not be peeled off from the release film, and a part of the film-like adhesive was adhered to the release film.
　上記の評価結果を表１に示す。 Table 1 shows the above evaluation results.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　上記結果から明らかなように、フィルム状接着剤の作製時には前記剥離力の高い重剥離フィルムを使用し、その後、該重剥離フィルムから前記剥離力の低い軽剥離フィルムへの貼替えを実施した実施例１では、フィルム状接着剤の層形成時にはフィルム状接着剤の造膜性が良好であり、半導体装置製造用シートの使用時にはマウントプロセス適性が良好であった。 As is clear from the above results, the heavy-release film having a high peeling force was used when producing the film-like adhesive, and then the heavy-release film was replaced with the light-release film having a low peeling force. In Example 1, the film-forming property of the film-like adhesive was good when the layer of the film-like adhesive was formed, and the suitability of the mounting process was good when the sheet for manufacturing a semiconductor device was used.
　各実施形態における各構成及びそれらの組み合わせ等は一例であり、本発明の趣旨を逸脱しない範囲で、構成の付加、省略、置換、およびその他の変更が可能である。また、本発明は各実施形態によって限定されることはなく、請求項（クレーム）の範囲によってのみ限定される。 Each configuration in each embodiment and a combination thereof are examples, and the configuration can be added, omitted, replaced, and other changes are possible without departing from the spirit of the present invention. Moreover, the present invention is not limited to each embodiment, but is limited only to the scope of claims.
　本発明は、半導体装置の製造に利用可能である。 The present invention can be used in the manufacture of semiconductor devices.
１０１・・・半導体装置製造用シート、
１・・・支持シート、
１０・・・積層シート、
１１・・・基材、
１２・・・粘着剤層、
１３・・・中間層、
１３ａ・・・中間層の第１面、
１４・・・フィルム状接着剤、
１５・・・剥離フィルム（第２剥離フィルム）、
１６・・・第３剥離フィルム、
１７・・・第１剥離フィルム、
Ｗ１３・・・中間層の幅
Ｗ１４・・・フィルム状接着剤の幅
１０２・・・第２中間積層体、
１０３・・・第２中間積層体加工物、
１０４・・・第１中間積層体、
１０５・・・第１積層物、
１０７・・・第２積層物、
Ｃ，Ｃ’・・・切込部、
８・・・バックグラインドテープ、
９’・・・半導体ウエハ、
９０’・・・改質層、
９ａ’・・・半導体ウエハの回路形成面、
９ｂ’・・・半導体ウエハの裏面、
９０１・・・半導体チップ群、
９・・・半導体チップ、
９ａ・・・半導体チップの回路形成面
９ｂ・・・半導体チップの裏面、
１４０…切断後のフィルム状接着剤
９１０・・・フィルム状接着剤付き半導体チップ群、
９１４・・・フィルム状接着剤付き半導体チップ、
Ｅ１・・・エキスパンドの方向 101 ... Sheet for manufacturing semiconductor devices,
1 ... Support sheet,
10 ... Laminated sheet,
11 ... Base material,
12 ... Adhesive layer,
13 ... Middle class,
13a ... the first surface of the middle layer,
14 ... Film-like adhesive,
15 ... Release film (second release film),
16 ... Third release film,
17 ... 1st release film,
W 13 ... Width of intermediate layer W 14 ... Width of film-like adhesive 102 ... Second intermediate laminate,
103 ... Second intermediate laminate work piece,
104 ... First intermediate laminate,
105 ... 1st laminate,
107 ... Second laminate,
C, C'... notch,
8 ... Back grind tape,
9'... Semiconductor wafer,
90'... Modified layer,
9a'... Circuit forming surface of semiconductor wafer,
9b'... the back side of the semiconductor wafer,
901 ... Semiconductor chip group,
9 ... Semiconductor chip,
9a ... Circuit forming surface of semiconductor chip 9b ... Back surface of semiconductor chip,
140 ... Film-like adhesive after cutting 910 ... Semiconductor chip group with film-like adhesive,
914 ... Semiconductor chip with film-like adhesive,
E 1・ ・ ・ Direction of expansion

Claims (3)

  1. 　半導体装置製造用シートの製造方法であって、
    　前記半導体装置製造用シートは、基材と、粘着剤層と、中間層と、フィルム状接着剤と、第２剥離フィルムと、を備え、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第２剥離フィルムがこの順に積層されて構成され、
    　前記中間層、前記フィルム状接着剤及び第１剥離フィルムを備える第２中間積層体の前記中間層及び前記フィルム状接着剤に対し、半導体装置製造用シートの前記中間層及び前記フィルム状接着剤の外周に対応する位置に切込部Ｃを形成し、該切込部Ｃを起点として外側に位置する前記中間層及び前記フィルム状接着剤の少なくとも一部を除去し、第２中間積層体加工物を得る第１加工工程と、
    　前記基材及び前記粘着剤層を備える第１中間積層体と、前記第２中間積層体加工物と、を貼り合わせて、前記基材、前記粘着剤層、前記中間層、前記フィルム状接着剤及び前記第１剥離フィルムを備える第１積層物を得る積層工程と、
    　前記第１積層物の前記第１剥離フィルムを剥がし、第２剥離フィルムへと貼替えて第２積層物を得る貼替工程と、
    　前記第２積層物の前記基材及び前記粘着剤層に対し、半導体装置製造用シートの前記基材及び前記粘着剤層の外周に対応する位置に切込部Ｃ’を形成し、該切込部Ｃ’を起点として外側に位置する前記基材及び前記粘着剤層の少なくとも一部を除去し、半導体装置製造用シートを得る第２加工工程と、を含み、
    　前記第１剥離フィルムと前記フィルム状接着剤との間の剥離力が、前記第２剥離フィルムと前記フィルム状接着剤との間の剥離力よりも高い、半導体装置製造用シートの製造方法。     A method for manufacturing sheets for manufacturing semiconductor devices.
    The sheet for manufacturing a semiconductor device includes a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a second release film, and includes the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the above. The film-like adhesive and the second release film are laminated in this order.
    With respect to the intermediate layer and the film-like adhesive of the second intermediate laminate including the intermediate layer, the film-like adhesive and the first release film, the intermediate layer and the film-like adhesive of the sheet for manufacturing a semiconductor device A cut portion C is formed at a position corresponding to the outer periphery, and at least a part of the intermediate layer and the film-like adhesive located outside from the cut portion C is removed to remove the second intermediate laminate processed product. The first processing process to obtain
    The base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are obtained by laminating the first intermediate laminate having the base material and the pressure-sensitive adhesive layer and the processed product of the second intermediate laminate. And the laminating step of obtaining the first laminated product including the first release film, and
    A reattachment step of peeling off the first release film of the first laminate and reattaching it to a second release film to obtain a second laminate.
    A cut portion C'is formed at a position corresponding to the outer periphery of the base material and the pressure-sensitive adhesive layer of the semiconductor device manufacturing sheet with respect to the base material and the pressure-sensitive adhesive layer of the second laminate, and the cut portion is formed. A second processing step of removing at least a part of the base material and the pressure-sensitive adhesive layer located on the outside starting from the part C'and obtaining a sheet for manufacturing a semiconductor device is included.
    A method for manufacturing a sheet for manufacturing a semiconductor device, wherein the peeling force between the first release film and the film-like adhesive is higher than the peeling force between the second release film and the film-like adhesive.
  2. 　前記第１剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第１試験片において、
    　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第１試験片の前記粘着剤層及び前記第１剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第１剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第１剥離フィルムとの間の剥離力（ｍＮ／５０ｍｍ）が、１８０ｍＮ/５０ｍｍ超であり、
    　前記第２剥離フィルムの剥離処理面に、粘着剤組成物を塗工して乾燥させることにより、厚さが１０μｍである単層の粘着剤層を形成して得られ、前記粘着剤組成物が、固形分としてアクリル樹脂（トーヨーケム社製「オリバインＢＰＳ　６３６７Ｘ」）１００質量部と、架橋剤（トーヨーケム社製「ＢＸＸ　５６４０」）１質量部とからなる第２試験片において、
    　剥離速度１０００ｍｍ／ｍｉｎ、２３℃、湿度５０％ＲＨにて、前記第２試験片の前記粘着剤層及び前記第２剥離フィルムの剥離処理面同士が１８０°の角度を為すようにして、前記粘着剤層から前記第２剥離フィルムを剥離する１８０°剥離により測定される、前記粘着剤層と前記第２剥離フィルムとの間の剥離力（ｍＮ／５０ｍｍ）が、１８０ｍＮ/５０ｍｍ以下である、請求項１に記載の半導体装置製造用シートの製造方法。     A single-layer pressure-sensitive adhesive layer having a thickness of 10 μm is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the first release film and drying the pressure-sensitive adhesive composition. In the first test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
    At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the first test piece and the peeled-processed surfaces of the first peeling film form an angle of 180 °. The peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the first peeling film, which is measured by 180 ° peeling to peel the first peeling film from the agent layer, is more than 180 mN / 50 mm.
    A single-layer pressure-sensitive adhesive layer having a thickness of 10 μm is formed by applying the pressure-sensitive adhesive composition to the peel-processed surface of the second release film and drying the pressure-sensitive adhesive composition. In the second test piece composed of 100 parts by mass of an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.) and 1 part by mass of a cross-linking agent (“BXX 5640” manufactured by Toyochem Co., Ltd.) as a solid content.
    At a peeling speed of 1000 mm / min, 23 ° C., and a humidity of 50% RH, the pressure-sensitive adhesive layer of the second test piece and the peeled-processed surfaces of the second peeling film form an angle of 180 °. Claimed that the peeling force (mN / 50 mm) between the pressure-sensitive adhesive layer and the second peeling film, measured by 180 ° peeling to peel the second peeling film from the agent layer, is 180 mN / 50 mm or less. Item 2. The method for manufacturing a sheet for manufacturing a semiconductor device according to Item 1.
  3. 　前記中間層が、重量平均分子量が１０００００以下の非ケイ素系樹脂を主成分として含有する、請求項１又は２に記載の半導体装置製造用シートの製造方法。 The method for manufacturing a sheet for manufacturing a semiconductor device according to claim 1 or 2, wherein the intermediate layer contains a non-silicon resin having a weight average molecular weight of 100,000 or less as a main component.
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