CN113518814B - Method for manufacturing die-attach sheet and semiconductor chip with film-like adhesive - Google Patents
Method for manufacturing die-attach sheet and semiconductor chip with film-like adhesive Download PDFInfo
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- CN113518814B CN113518814B CN202080018319.0A CN202080018319A CN113518814B CN 113518814 B CN113518814 B CN 113518814B CN 202080018319 A CN202080018319 A CN 202080018319A CN 113518814 B CN113518814 B CN 113518814B
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- Prior art keywords
- adhesive
- film
- layer
- intermediate layer
- semiconductor chip
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- 239000004065 semiconductor Substances 0.000 title claims description 333
- 238000000034 method Methods 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 239000010410 layer Substances 0.000 claims abstract description 384
- 239000000463 material Substances 0.000 claims abstract description 167
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A solid wafer (101) is provided with a base material (11) and is configured by laminating an adhesive layer (12), an intermediate layer (13), and a film-like adhesive (14) in this order on the base material (11), wherein the value of [ the tensile elastic modulus of the intermediate layer (13) at 0 ℃ per [ the tensile elastic modulus of the base material (11) at 0 ℃ is 0.5 or less in the solid wafer (101).
Description
Technical Field
The present invention relates to a die bonding sheet and a method for manufacturing a semiconductor chip with a film-like adhesive. The present application claims priority based on japanese patent application publication No. 2019-041886 of the application filed in japan at 3/7 of 2019, and the contents thereof are incorporated herein.
Background
In manufacturing a semiconductor device, a film-adhesive-attached semiconductor chip including a semiconductor chip and a film-adhesive provided on the back surface thereof can be used. Here, the back surface of the semiconductor chip is a surface opposite to a surface of the semiconductor chip on which the circuit is formed (hereinafter, may be abbreviated as a "circuit formation surface").
The semiconductor chip with the film-like adhesive can be manufactured by the following method, for example.
That is, first, a back grinding tape (referred to as a surface protection tape) is attached to a surface of a semiconductor wafer on which a circuit is formed (in this specification, the surface is sometimes abbreviated as a "circuit forming surface").
Next, a laser beam is irradiated so as to focus on a focal point set in the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer. Next, the surface of the semiconductor wafer opposite to the circuit forming surface (sometimes abbreviated as "back surface" in this specification) is polished by a polishing machine, whereby the thickness of the semiconductor wafer is adjusted to a target value, and the semiconductor wafer is divided at the formation site of the modified layer by using a polishing force applied to the semiconductor wafer at this time, thereby forming a plurality of semiconductor chips. The method of dividing a semiconductor wafer accompanied by the formation of a modified layer is called "step dividing (registered trademark"), and is basically completely different from laser Dicing in which a semiconductor wafer is irradiated with laser light to cut off an irradiated portion and the semiconductor wafer is cut off from the surface thereof.
Next, 1 wafer of the semiconductor chips fixed on the back grinding tape was attached to the back surface (in other words, the ground surface) on which the above grinding was performed. Here, examples of the solid wafer include a solid wafer including a base material and an adhesive layer and a film-like adhesive agent laminated in this order on the base material. At this time, the film-like adhesive in the die-bonding sheet is heated to a suitable temperature and softened, and then attached to the back surface of the semiconductor chip. Thus, the die attach sheet can be stably attached to the semiconductor chip.
Next, after the back grinding tape is removed from the semiconductor chip, the die-attach sheet is cooled and stretched in a direction parallel to the surface (for example, the surface of the film-like adhesive attached to the semiconductor chip) thereof, so-called spreading is performed, whereby the film-like adhesive is separated along the outer side Zhou Qieduan of the semiconductor chip.
In summary, a film-adhesive-attached semiconductor chip including a semiconductor chip and a film-adhesive after cutting provided on the back surface thereof can be obtained.
After the semiconductor chip with the film-like adhesive is obtained, the laminate of the base material and the adhesive layer is stretched (spread) in a direction parallel to the surface of the semiconductor chip with the film-like adhesive placed thereon. Further, in order to maintain this state, the peripheral edge portion of the semiconductor chip on which the film-like adhesive is not placed in the laminate sheet is heated. In summary, the peripheral edge portion is contracted, and thereafter, the distance between adjacent semiconductor chips (in this specification, sometimes referred to as "kerf width") is appropriately maintained on the laminate sheet.
Next, the semiconductor chips with the film-like adhesive are separated from the laminate sheet and picked up. At this time, when the adhesive layer is curable, the adhesive layer is cured to lower the adhesiveness, thereby facilitating pickup.
In summary, a semiconductor chip with a film-like adhesive for use in the manufacture of semiconductor devices can be stably obtained.
The picked-up semiconductor chip is die-bonded to the circuit formation surface of the substrate by a film-like adhesive provided on the back surface thereof, and if necessary, 1 or more other semiconductor chips are further stacked on the semiconductor chip, wire bonding (wire bonding) is performed, and then the whole is sealed with a resin. Using the semiconductor package obtained in this way, the target semiconductor device can be manufactured finally.
As a die bond sheet having a film-like adhesive that can be cut by expansion, a dicing die bond tape (corresponding to the die bond sheet) is disclosed, which is configured by sequentially stacking a base material, an adhesive layer, a base material layer (corresponding to an intermediate layer), and an adhesive layer (corresponding to the film-like adhesive), the base material layer having a stretch characteristic in a specific range (see patent document 1). Since the solid wafer has the base material layer corresponding to the intermediate layer, it is considered that the solid wafer can be cut with high accuracy when the film-like adhesive is spread.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5946650
Disclosure of Invention
Technical problem to be solved by the invention
As described above, when the wafer is cooled and expanded, the region between the semiconductor chips, that is, the kerf width, is required to be sufficiently wide with respect to the elongation of the base material, further, the film-like adhesive can be stably divided along the outer sides Zhou Qieduan of the semiconductor chips.
In this regard, it is not clear whether the solid wafer disclosed in patent document 1 sufficiently has such characteristics.
The present invention aims to provide a die-bonding sheet comprising a base material, an adhesive layer and a film-like adhesive, wherein when the die-bonding sheet is cooled and expanded, the slit width is sufficiently wide with respect to the elongation of the base material, and the film-like adhesive can be stably divided along the outer sides Zhou Qieduan of a semiconductor chip.
Technical means for solving the technical problems
The invention provides a solid wafer, which comprises a substrate, and is formed by sequentially laminating an adhesive layer, an intermediate layer and a film-shaped adhesive on the substrate, wherein the value of the tensile elastic modulus Ei 'of the intermediate layer at 0 ℃/[ the tensile elastic modulus Eb' of the substrate at 0 ℃ is below 0.5.
In the wafer holder of the present invention, the maximum value of the width of the intermediate layer may be 150 to 160mm, 200 to 210mm, or 300 to 310mm.
The present invention provides a method for manufacturing a semiconductor chip with a film-like adhesive, the semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive provided on a back surface of the semiconductor chip, the method comprising: a step of forming a modified layer inside a semiconductor wafer by irradiating laser light so as to focus on a focal point set inside the semiconductor wafer; a step of dividing the semiconductor wafer at a formation portion of the modified layer by polishing a back surface of the semiconductor wafer after the modified layer is formed, and simultaneously by using a polishing force applied to the semiconductor wafer, thereby obtaining a semiconductor chip set in which a plurality of semiconductor chips are aligned; attaching a film-like adhesive to the back surfaces of all the semiconductor chips in the semiconductor chip set while heating the die-bonding sheet; a step of stretching the die attach sheet attached to the semiconductor chip set in a direction parallel to the surface thereof while cooling the die attach sheet, thereby obtaining a film-adhesive-attached semiconductor chip set in which a plurality of semiconductor chips attached with the film-adhesive are aligned along the outer side Zhou Qieduan of the semiconductor chips; a step of expanding a laminate sheet of the base material, the adhesive layer, and the intermediate layer, which is derived from the die-attach sheet after the semiconductor chip set with the film-like adhesive is obtained, in a direction parallel to the surface of the adhesive layer, and further heating a peripheral edge portion of the semiconductor chip with the film-like adhesive, which is not placed in the laminate sheet, so as to maintain the state; and separating the semiconductor chip with the film-like adhesive from the intermediate layer in the laminated sheet after the peripheral edge portion is heated, thereby picking up the semiconductor chip with the film-like adhesive, wherein a difference between a maximum value of a width of the intermediate layer and a maximum value of a width of the semiconductor wafer is 0 to 10mm.
Effects of the invention
According to the present invention, there can be provided a die-bonding sheet comprising a base material, an adhesive layer and a film-like adhesive, wherein when the die-bonding sheet is cooled and expanded, the slit width is sufficiently wide with respect to the elongation of the base material, and the film-like adhesive can be stably divided along the outer sides Zhou Qieduan of the semiconductor chips.
Drawings
Fig. 1 is a sectional view schematically showing a wafer holder according to an embodiment of the present invention.
Fig. 2 is a top view of the wafer holder shown in fig. 1.
Fig. 3A is a cross-sectional view schematically illustrating a method for manufacturing a semiconductor chip as an object of use of a wafer carrier according to an embodiment of the present invention.
Fig. 3B is a cross-sectional view schematically illustrating a method for manufacturing a semiconductor chip as an object of use of a wafer carrier according to an embodiment of the present invention.
Fig. 3C is a cross-sectional view schematically illustrating a method for manufacturing a semiconductor chip as an object of use of a wafer carrier according to an embodiment of the present invention.
Fig. 4A is a cross-sectional view for schematically illustrating a method of using a wafer holder according to an embodiment of the present invention.
Fig. 4B is a cross-sectional view for schematically illustrating a method of using a wafer holder according to an embodiment of the present invention.
Fig. 4C is a cross-sectional view for schematically illustrating a method of using a wafer holder according to an embodiment of the present invention.
Fig. 5 is a plan view schematically showing an object to be evaluated in order to explain the measurement position of the incision width when evaluating the incision retention in the example.
Detailed Description
O-die
The solid wafer according to one embodiment of the present invention comprises a substrate, and is formed by sequentially laminating an adhesive layer, an intermediate layer, and a film-like adhesive on the substrate, wherein the value of [ the tensile elastic modulus Ei '] of the intermediate layer at 0 ℃/[ the tensile elastic modulus Eb' ] of the substrate at 0 ℃ is 0.5 or less.
When the value of [ the tensile elastic modulus Ei '] of the intermediate layer at 0 ℃/[ the tensile elastic modulus Eb' ] of the base material at 0 ℃ of the solid wafer of the present embodiment is equal to or less than the upper limit value, the slit width can be sufficiently wide with respect to the elongation of the base material, and therefore, the film-like adhesive can be stably divided (divided) along the outer side Zhou Qieduan of the semiconductor chip when the solid wafer is expanded.
In addition, unless otherwise specified, the term "laminate" in the present specification refers to a laminate having a structure in which the above-described base material, adhesive layer, and intermediate layer are laminated.
A preferable object of the die bonding of the present embodiment is a diced semiconductor wafer. Here, as the semiconductor wafer after dicing, there may be mentioned: a semiconductor wafer in which a plurality of semiconductor chips are arranged in order in advance; or a semiconductor wafer including a plurality of semiconductor chips aligned in this manner and regions of the other semiconductor wafer which are not divided into semiconductor chips.
Such a use object of the die is obtained by dicing a semiconductor wafer, for example, as described below.
That is, first, a back grinding tape (surface protection tape) is attached to a surface of a semiconductor wafer on which a circuit is formed (i.e., a "circuit forming surface").
Then, a laser beam is irradiated so as to focus on a focal point set in the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer. The position of the focal point at this time is a position at which the semiconductor wafer is divided (diced) in advance, and the position is set so that the semiconductor wafer can obtain semiconductor chips of a target size, shape, and number.
Next, a surface (i.e., a back surface) of the semiconductor wafer opposite to the circuit-forming surface is polished by using a polishing machine. Thus, the thickness of the semiconductor wafer is adjusted to a target value, and the semiconductor wafer is divided at the formation portion of the modified layer by using the force applied to the semiconductor wafer at the time of polishing, thereby forming a plurality of semiconductor chips. Unlike other positions of the semiconductor wafer, the modified layer of the semiconductor wafer is modified by irradiation with laser light, and the strength thereof becomes weak. Therefore, by applying a force to the semiconductor wafer having the modified layer formed therein, the modified layer in the semiconductor wafer is applied, and the semiconductor wafer is broken at the modified layer, whereby a plurality of semiconductor chips can be obtained.
In addition, depending on the polishing conditions, a partial region of the semiconductor wafer may not be divided into semiconductor chips.
Hereinafter, the solid wafer will be described in detail with reference to the accompanying drawings. In order to facilitate understanding of the features of the present invention, important parts of the drawings used in the following description may be enlarged and displayed, and the dimensional ratios of the respective constituent elements and the like are not necessarily the same as those in actual cases.
Fig. 1 is a sectional view schematically showing a wafer holder according to an embodiment of the present invention, and fig. 2 is a plan view of the wafer holder shown in fig. 1.
In the drawings subsequent to fig. 2, the same components as those shown in the already described drawings are denoted by the same reference numerals as those in the already described drawings, and detailed description thereof is omitted.
The wafer carrier 101 shown here includes a base material 11, and is configured by sequentially laminating an adhesive layer 12, an intermediate layer 13, and a film-like adhesive 14 on the base material 11. The wafer carrier 101 further includes a release film 15 on the film-like adhesive 14.
In the solid wafer 101, the adhesive layer 12 is provided on one surface (hereinafter, sometimes referred to as "first surface") 11a of the base material 11, the intermediate layer 13 is provided on a surface (hereinafter, sometimes referred to as "first surface") 12a of the adhesive layer 12 opposite to the side on which the base material 11 is provided, the film-like adhesive 14 is provided on a surface (hereinafter, sometimes referred to as "first surface") 13a of the intermediate layer 13 opposite to the side on which the adhesive layer 12 is provided, and the release film 15 is provided on a surface (hereinafter, sometimes referred to as "first surface") 14a of the film-like adhesive 14 opposite to the side on which the intermediate layer 13 is provided. In this way, the wafer carrier 101 is formed by stacking the base material 11, the adhesive layer 12, the intermediate layer 13, and the film-like adhesive 14 in this order in the thickness direction thereof.
The wafer holder 101 is used in the following manner: with the release film 15 removed, the first surface 14a of the film-like adhesive 14 is attached to a surface (i.e., back surface) of the semiconductor chip or the semiconductor wafer (not shown) that is not completely divided, which is opposite to the circuit-forming surface.
In this specification, a laminate including a base material and an adhesive layer is sometimes referred to as a "support sheet". In fig. 1, reference numeral 1 denotes a support sheet.
When the intermediate layer 13 and the film-like adhesive 14 are viewed from above and below the intermediate layer 13 and the film-like adhesive 14, the planar shapes of the intermediate layer 13 and the film-like adhesive 14 are circular, and the diameter of the intermediate layer 13 is the same as the diameter of the film-like adhesive 14.
In the wafer carrier 101, the intermediate layer 13 and the film-like adhesive 14 are disposed so that the centers thereof coincide with each other, in other words, so that the positions of the outer circumferences of the intermediate layer 13 and the film-like adhesive 14 coincide with each other in the radial direction thereof.
The first side 13a of the intermediate layer 13 and the first side 14a of the film-like adhesive 14 are smaller in area than the first side 12a of the adhesive layer 12. Also, the width W of the intermediate layer 13 13 Maximum value (i.e., diameter) of (i) and width W of film-like adhesive 14 14 The maximum value (i.e., diameter) of (a) is smaller than the maximum value of the width of the adhesive layer 12 and the maximum value of the width of the base material 11. Therefore, in the die-bond sheet 101, a part of the first face 12a of the adhesive layer 12 is not covered with the intermediate layer 13 and the film-like adhesive 14. The release film 15 is directly in contact with and laminated on such a region of the first surface 12a of the adhesive layer 12 where the intermediate layer 13 and the film-like adhesive 14 are not laminated, and this region is exposed in a state where the release film 15 is removed (hereinafter, this region may be referred to as a "non-laminated region" in this specification).
In the wafer carrier 101 provided with the release film 15, the adhesive layer 12 may have a region where the release film 15 is not laminated, as shown here, in a region where the intermediate layer 13 and the film-like adhesive 14 are not covered.
The die bonding sheet 101 can be fixed by attaching a part of the non-laminated region of the adhesive layer 12 to a jig such as a ring frame for fixing a semiconductor wafer in a state where the film-like adhesive 14 is not cut and is attached to the semiconductor chip or the like. Therefore, it is not necessary to provide a separate adhesive layer for jig for fixing the wafer carrier 101 to the jig on the wafer carrier 101. Further, since the adhesive layer for jigs does not need to be provided, the wafer carrier 101 can be manufactured at low cost and efficiently.
In this way, the wafer carrier 101 has an advantageous effect by not having the adhesive layer for jigs, but may have an adhesive layer for jigs. At this time, the adhesive layer for jigs is provided in an area near the peripheral edge portion in the surface of any layer constituting the wafer holder 101. Such a region includes a region of the first surface 12a of the adhesive layer 12 that is not covered with the intermediate layer 13 and the film-like adhesive 14.
The pressure-sensitive adhesive layer for jigs may be a known pressure-sensitive adhesive layer for jigs, and may have a single-layer structure containing a pressure-sensitive adhesive component, or may have a multilayer structure in which layers containing a pressure-sensitive adhesive component are laminated on both surfaces of a sheet as a core material.
In addition, as will be described later, when so-called expansion is performed in which the wafer carrier 101 is stretched in a direction parallel to the surface thereof (for example, the first face 12a of the adhesive layer 12), the wafer carrier 101 can be easily expanded by the presence of the non-laminated region on the first face 12a of the adhesive layer 12. In addition, not only the film-like adhesive 14 can be easily cut, but also peeling of the intermediate layer 13 and the film-like adhesive 14 from the adhesive layer 12 may be suppressed.
As described later, the solid sheet 101 satisfies the condition that [ the tensile elastic modulus Ei '] of the intermediate layer 13 at 0 ℃/[ the tensile elastic modulus Eb' ] of the base material 11 at 0 ℃ is 0.5 or less.
When a thermal mechanical analysis (sometimes referred to as "TMA" in this specification) is performed on a test piece having a size of 4.5mm×15mm produced from the base material 11, the solid wafer 101 preferably has the following characteristics.
That is, first, using a thermo-mechanical analyzer, TMA was performed so that the load was set to 2g and the temperature of the test piece was not changed, and the displacement X of the test piece at 23℃was measured 0 。X 0 Typically 0 (zero), or a value near 0.
Next, TMA was continued, the heating rate was set at 20℃per minute, the load was set at 2g, and X was measured 0 The temperature of the test piece after that was raised to 70℃and the maximum X of the displacement of the test piece at that time was measured 1 。X 1 The displacement of the test piece at a temperature of 70℃is typical. In addition, X is generally satisfied 1 ≥X 0 Is a condition of (2).
Next, TMA was continued, the load was set to 2g, and X was measured at a temperature of 23 ℃ 1 The test piece after cooling down, and the minimum value X of the displacement of the test piece at this time is measured 2 。X 2 Generally, the temperature of the test piece is not changed (in other words, is the lowest) by the cooling.
X 0 、X 1 X is X 2 Since the measurement was performed continuously by a series of TMAs, the measurement directions were all the same. Furthermore, the application of The load applied to the test piece was a constant value.
Regarding the stationary wafer 101, X obtained in this way is used 0 X is X 1 And using formula (1): (X) 1 -X 0 ) The rate of change in the displacement of the test piece upon heating calculated by 15X 100 is preferably 0 to 2%.
Furthermore, X obtained in this way is used 1 X is X 2 And using formula (2): (X) 2 -X 1 ) The rate of change in the displacement of the test piece calculated by 15X 100 upon cooling is preferably-2 to 0%.
Furthermore, X obtained in this way is used 2 X is X 0 And using formula (3): (X) 2 -X 0 ) The total rate of change in the displacement of the test piece calculated by 15X 100 is preferably-2 to 1%.
The fixed wafer of the present embodiment is not limited to the fixed wafer shown in fig. 1 and 2, and the partial structure of the fixed wafer shown in fig. 1 and 2 may be changed, deleted, or added within a range that does not impair the effects of the present invention.
For example, the wafer carrier of the present embodiment may include other layers not belonging to any one of the base material, the adhesive layer, the intermediate layer, the film-like adhesive, the release film, and the adhesive layer for jigs. As shown in fig. 1, the wafer carrier of the present invention preferably includes an adhesive layer in direct contact with a substrate, an intermediate layer in direct contact with the adhesive layer, and a film-like adhesive in direct contact with the intermediate layer.
For example, in the wafer carrier of the present embodiment, the planar shapes of the intermediate layer and the film-like adhesive may be other than circular, and the planar shapes of the intermediate layer and the film-like adhesive may be the same or different from each other. It is preferable that the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive are smaller than the area of the surface of the layer on the substrate side (for example, the first surface of the adhesive layer), and the area of the first surface of the intermediate layer and the area of the first surface of the film-like adhesive may be the same as or different from each other. The positions of the outer peripheries of the intermediate layer and the film-like adhesive may or may not coincide with each other in the radial direction.
Next, the respective layers constituting the wafer holder of the present invention will be described in more detail.
Base material
The substrate is in the form of a sheet or film.
The constituent materials of the base material are preferably various resins, and specifically include, for example, polyethylene (low density polyethylene (LDPE), linear Low Density Polyethylene (LLDPE), high Density Polyethylene (HDPE), and the like), polypropylene, polybutene, polybutadiene, polymethylpentene, styrene-ethylene butene-styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyurethane, urethane acrylate, polyimide (PI), ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, ethylene copolymers other than ethylene- (meth) acrylic acid copolymer and ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, fluororesin, hydrogenated, modified, crosslinked or copolymerized product of any of the above resins, and the like.
In the present specification, "(meth) acrylic acid" is a concept including "acrylic acid" and "methacrylic acid". Similar terms to (meth) acrylic acid are also the same, for example, "(meth) acrylate" is a concept including "acrylate" and "methacrylate", and "(meth) acryl" is a concept including "acryl" and "methacryl".
The resin constituting the base material may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
The constituent material of the base material is preferably polyethylene, more preferably Low Density Polyethylene (LDPE), in terms of easier adjustment of the change rate upon heating, the change rate upon cooling, and the integrated change rate.
The substrate may be composed of one layer (single layer) or may be composed of a plurality of two or more layers. When the base material is composed of a plurality of layers, the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effect of the present invention is not impaired.
In this specification, not only the base material, "the plurality of layers may be identical to each other, but also" the plurality of layers may be different from each other "means" all the layers may be identical to each other, all the layers may be different from each other, or only a part of the layers may be identical to each other ", and further" the plurality of layers are different from each other "means" at least one of the constituent materials and thicknesses of the respective layers is different from each other ".
The thickness of the base material may be appropriately selected depending on the purpose, and is preferably 50 to 300. Mu.m, more preferably 60 to 150. Mu.m. By setting the thickness of the base material to the lower limit value or more, the structure of the base material is more stable. When the thickness of the base material is equal to or less than the upper limit value, the film-like adhesive is further improved in cutting property when the fixed wafer is expanded. Further, when the die-bonding sheet after cutting the film-like adhesive is spread (in other words, when the laminate sheet is spread), the effect of making the slit width sufficiently wide and maintaining the slit width with high uniformity is further increased.
Here, "thickness of the substrate" refers to thickness of the entire substrate, for example, thickness of the substrate composed of a plurality of layers refers to total thickness of all layers constituting the substrate.
In order to improve adhesion between the substrate and other layers such as an adhesive layer provided thereon, the surface of the substrate may be subjected to a roughening treatment such as a blasting treatment, a solvent treatment, or an embossing treatment; corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, and other oxidation treatments.
In addition, the surface of the substrate may be primer treated (primer treatment).
The substrate may further have: an antistatic coating; and a layer for preventing adhesion of the base material to other sheets or adhesion of the base material to an adsorption table (suction table) when the wafers are stacked and stored.
In addition to the main constituent materials such as the resin, the base material may contain various known additives such as a filler, a colorant, an antistatic agent, an antioxidant, an organic lubricant, a catalyst, and a softener (plasticizer).
Films or sheets made of resins have anisotropy according to their production methods. For example, it is known that a film or sheet produced by molding a resin generally has characteristics that change in the direction (Machine Direction) of the resin flow and the direction (Transverse Direction) perpendicular to the resin flow during resin molding. In the present specification, the flow direction of the resin may be referred to as "MD" and the direction perpendicular to the flow direction of the resin may be referred to as "TD".
That is, when the MD is a processed film or sheet, the TD is a direction perpendicular to the flow direction of the film or sheet. When a film or sheet is subjected to stretching, MD is the stretching direction of the film or sheet, and TD is the direction orthogonal to the stretching direction of such film or sheet. The MD and TD of each layer can be distinguished from each other by optical analysis such as analysis of an X-ray two-dimensional diffraction image.
In this embodiment, a film or sheet produced by molding a resin including a base material, an intermediate layer, an adhesive layer, a film-like adhesive, and the like may have MD and TD.
Of the above-mentioned solid wafers, it is preferable that the MD of the base material (the base material 11 in the case of the solid wafer 101 shown in fig. 1) matches the MD of an intermediate layer (the intermediate layer 13 in the case of the solid wafer 101 shown in fig. 1) described later. In other words, in the solid wafer, it is preferable that the TD of the base material coincides with the TD of the intermediate layer. The ease of expansion (expansibility) of the solid wafer in which the base material and the intermediate layer are disposed in this manner is more uniform in any direction. Further, by using such a die bond sheet, the cutting performance of the film-like adhesive by the expansion is further improved, and when the film-like adhesive is cut, a region between semiconductor chips, that is, a so-called notch, is further stably formed, and the uniformity of the width of the region (that is, the notch width) is further improved. Further, by increasing the uniformity of the slit width in this way, the effect of suppressing occurrence of process defects is remarkably improved when picking up a semiconductor chip with a film-like adhesive, which will be described later.
< rate of change in displacement of test piece made of base material upon heating >
The rate of change in the test piece produced from the base material (the base material 11 in the case of the solid wafer 101 shown in fig. 1) at the time of heating may be, for example, 0 to 3%, preferably 0 to 2%, for example, 0 to 1.6%, 0 to 1.2%, or 0 to 0.9%, or 0.2 to 2%, or 0.4 to 2%, or 0.6 to 2%, or 0.2 to 1.6%, or 0.4 to 1.2%, or 0.6 to 0.9%, as described above.
The rates of change in the test piece in the measurement direction in the 2 or more measurement directions may be the same or different from each other. Here, the "measurement directions of 2 or more of the change rate at the time of heating" means 2 or more different directions from one another in the direction parallel to the first surface (corresponding to the first surface of the base material) of the test piece. For example, when the test piece has MD and TD, the rate of change in MD during heating and the rate of change in TD during heating of the test piece may be the same as or different from each other.
In this embodiment, the rate of change in the test piece upon heating in any measurement direction may be, for example, 0 to 3%, and preferably 0 to 2%. For example, when the test piece has MD and TD, the rate of change in heating may be, for example, 0 to 3%, preferably 0 to 2% in either or both of MD and TD, and may be any of the 11 numerical ranges exemplified above. In this case, the combination of the numerical range of the rate of change in the MD during heating and the numerical range of the rate of change in the TD during heating is arbitrary.
< rate of change in displacement of test piece made of base material upon cooling >
As described above, the change rate of the test piece made of the base material (the base material 11 in the case of the wafer carrier 101 shown in fig. 1) upon cooling is preferably from-2% to-0.4%, and may be any of-2% to-0.8%, 2% to-1.2%, and 2% to-1.6%, for example.
The rates of change in the cooling time in the measurement directions of 2 or more of the test pieces may be the same or different from each other. Here, the "measurement direction of 2 or more of the change rate at the time of cooling" is the same as the "measurement direction of 2 or more of the change rate at the time of heating" described above. For example, when the test piece has MD and TD, the rate of change of the MD of the test piece upon cooling and the rate of change of the TD of the test piece upon cooling may be the same or different from each other.
In this embodiment, the rate of change upon cooling in any measurement direction of the test piece is preferably-2 to 0%. For example, when the test piece has MD and TD, the rate of change upon cooling is preferably-2 to 0% in either or both of the MD and TD, and may be any of the 4 numerical ranges exemplified above. In this case, the combination of the numerical range of the change rate in the cooling operation of MD and the numerical range of the change rate in the cooling operation of TD is arbitrary.
< comprehensive rate of change in the amount of displacement of test piece made of base Material >
The total change rate of the test piece produced from the base material (the base material 11 in the case of the solid wafer 101 shown in fig. 1) may be, for example, -2 to 1.8%, preferably, -2 to 1%, as described above, and may be, for example, -2 to 0.6%, or-2 to 0.3%, or-2 to 0.6%, or-1.8 to 1%, or-1.6 to 1%, or-1.4 to 1%, or-1.8 to 0.6%, or-1.8 to 0.3%, or-1.8 to 0%, or-1.6 to-0.3%, or-1.4 to-0.6%.
Wherein the overall rate of change of the test piece is more preferably-2 to 0%.
The above-mentioned comprehensive change rates in the measurement directions of 2 or more of the test pieces may be the same or different from each other. Here, the "measurement directions of 2 or more of the overall change rate" are the same as the "measurement directions of 2 or more of the change rate at the time of heating" described above. For example, when the test piece has MD and TD, the overall rate of change of MD of the test piece and the overall rate of change of TD of the test piece may be the same as each other or different from each other.
In this embodiment, the overall change rate in any measurement direction of the test piece may be, for example, -2 to 1.8%, and preferably, -2 to 1%. For example, when the test piece has MD and TD, the overall change rate may be, for example, -2 to 1.8%, preferably, -2 to 1%, in either or both of the MD and TD, and may be any of the 15 numerical ranges exemplified above. In this case, the combination of the numerical range of the overall change rate of MD and the numerical range of the overall change rate of TD is arbitrary.
In the test piece made of a base material, it is preferable that: the change rate at heating is any one of the 11 number ranges, the change rate at cooling is any one of the 5 number ranges, and the integrated change rate is any one of the 15 number ranges.
Examples of such a test piece include a test piece having a change rate of 0.6 to 0.9% in the heating in either one or both of the MD and the TD, a change rate of-2 to-1.6% in the cooling in either one or both of the MD and the TD, and a total change rate of-1.4 to-0.6% in either one or both of the MD and the TD. However, this is only one example of the test piece.
The thickness of the test piece to be measured for the rate of change during heating, the rate of change during cooling, and the rate of change during total is not particularly limited, and may be any thickness that allows the measurement with high accuracy. For example, the test piece may have a thickness of 10 to 200. Mu.m.
The rate of change in the test piece produced from the base material during heating, the rate of change in the test piece during cooling, and the rate of change in the test piece during cooling can be adjusted by adjusting the content of the base material, for example, the type and content of the resin.
< tensile elastic modulus Eb' >, of test piece made of substrate
For a test piece having a width of 15mm and a length of more than 100mm, which is produced from the base material (the base material 11 in the case of the wafer carrier 101 shown in fig. 1), when a tensile test is performed by stretching at a stretching speed of 200mm/min using TENSILON with a collet pitch of 100mm and a temperature of 0 ℃, the tensile elastic modulus Eb' of the test piece at 0 ℃ in the elastic deformation region may be, for example, any one of 10 to 200MPa, 50 to 150MPa, and 70 to 120 MPa. By making Eb ' be in the above range, the tensile elastic modulus becomes easier to adjust than Ei '/Eb '. In addition, if Eb' is 50MPa or more, it is easier to attach the die to a semiconductor wafer.
The cutting of the film-like adhesive by the expansion of the die-bonding sheet is preferably performed at a temperature of 0 ℃ or around 0 ℃ from the viewpoint of improving the cutting property of the film-like adhesive. Therefore, in the above-mentioned solid wafer, the tensile elastic modulus Eb' of the test piece produced from the base material was defined as a value at 0 ℃. In this embodiment, important physical properties highly related to the suitability for extension of the wafer are defined under temperature conditions at or near the temperature at which the extension is actually performed.
Eb's of the test piece in the measurement direction of 2 or more may be the same or different from each other. Here, the "measurement directions of 2 or more of Eb' means different 2 or more directions among directions parallel to the first surface (corresponding to the first surface of the base material) of the test piece. For example, when the test piece has MD and TD, eb 'of the MD of the test piece and Eb' of the TD of the test piece may be the same or different from each other.
In the present embodiment, for example, the tensile elastic modulus Eb' of the test piece in any measurement direction may be any of the 3 numerical ranges exemplified above. For example, when the test piece has MD and TD, eb' may be any one of the 3 numerical ranges exemplified above in either or both of the MD and TD. In this case, the combination of the numerical range of Eb 'of MD and the numerical range of Eb' of TD is arbitrary.
The thickness of the test piece to be measured for the tensile elastic modulus Eb' is not particularly limited as long as the thickness can be measured with high accuracy. For example, the test piece may have a thickness of 10 to 200. Mu.m.
Eb' of the test piece produced from the base material can be adjusted by adjusting the content of the base material, for example, the kind and content of the resin.
The optical characteristics of the substrate are not particularly limited insofar as the effects of the present invention are not impaired. The substrate may be, for example, a substrate that transmits laser light or energy rays.
The substrate can be produced by a known method. For example, a resin-containing base material (composed of a resin) can be produced by molding the resin or a resin composition containing the resin.
< surface resistivity >
The surface resistivity of the surface of the base material on the opposite side of the adhesive layer side in the solid wafer may be 1.0X10 11 Ω/≡or less.
By using a substrate having an antistatic layer formed thereon or an antistatic substrate as a substrate, the surface resistivity of the surface of the substrate on the side opposite to the adhesive layer side can be set to 1.0X10 11 Omega/≡below, details will be described later.
The surface of the substrate on which the antistatic layer is formed on the side opposite to the adhesive layer side is sometimes referred to as the "outermost layer of the wafer". The surface of the antistatic base material on the side opposite to the adhesive layer side is sometimes referred to as the "outermost layer of the wafer".
Adhesive layer
The adhesive layer is in the form of a sheet or film and contains an adhesive.
The adhesive layer may be formed using an adhesive composition containing the adhesive. For example, the adhesive composition is applied to a target surface on which an adhesive layer is to be formed, and the adhesive composition is dried as necessary, whereby an adhesive layer can be formed at a target site.
The adhesive composition may be applied by a known method, and examples thereof include a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll knife coater, a curtain coater, a die coater, a blade coater, a screen coater, a meyer bar coater, and a kiss coater.
The drying condition of the adhesive composition is not particularly limited, but in the case where the adhesive composition contains a solvent described later, it is preferable to heat and dry it, and in this case, it is preferable to dry it at 70 to 130 ℃ for 10 seconds to 5 minutes, for example.
Examples of the adhesive include adhesive resins such as acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, and ester resins, and acrylic resins are preferable.
In addition, in the present specification, the "adhesive resin" includes a resin having an adhesive property and a resin having an adhesive property. For example, the adhesive resin includes not only a resin having an adhesive property of the resin itself but also a resin exhibiting an adhesive property by being used together with other components such as an additive or a resin exhibiting an adhesive property due to the presence of a trigger such as heat or water.
The adhesive layer may be any of curable and non-curable, and may be any of energy ray curable and non-energy ray curable, for example. The curable adhesive layer can easily adjust physical properties before and after curing.
In the present specification, the "energy ray" refers to a ray having energy quanta in an electromagnetic wave or a charged particle beam. Examples of the energy ray include ultraviolet rays, radiation rays, and electron beams. For example, ultraviolet rays may be irradiated by using a high-pressure mercury lamp, a fusion lamp (fusion lamp), a xenon lamp, a black light lamp, an LED lamp, or the like as an ultraviolet source. The electron beam can irradiate an electron beam generated by an electron beam accelerator or the like.
In the present specification, "energy ray curability" refers to a property of curing by irradiation with energy rays, and "non-energy ray curability" refers to a property of not curing even when irradiation with energy rays is performed.
The adhesive layer may be composed of one layer (single layer) or two or more layers, and when composed of a plurality of layers, the layers may be the same or different from each other, and the combination of the layers is not particularly limited.
The thickness of the adhesive layer is preferably 1 to 100. Mu.m, more preferably 1 to 60. Mu.m, particularly preferably 1 to 30. Mu.m.
The "thickness of the adhesive layer" refers to the thickness of the entire adhesive layer, and for example, the thickness of the adhesive layer composed of a plurality of layers refers to the total thickness of all the layers constituting the adhesive layer.
The optical characteristics of the adhesive layer are not particularly limited insofar as the effects of the present invention are not impaired. For example, the adhesive layer may be a layer that transmits energy rays.
Next, the adhesive composition will be described.
Adhesive composition
When the adhesive layer is energy ray-curable, examples of the adhesive composition containing an energy ray-curable adhesive, that is, an energy ray-curable adhesive composition, include: an adhesive composition (I-1) comprising a non-energy ray-curable adhesive resin (I-1 a) (hereinafter, sometimes abbreviated as "adhesive resin (I-1 a)") and an energy ray-curable compound; an adhesive composition (I-2) comprising an energy ray-curable adhesive resin (I-2 a) (hereinafter, sometimes abbreviated as "adhesive resin (I-2 a)") having an unsaturated group introduced into a side chain of the non-energy ray-curable adhesive resin (I-1 a); an adhesive composition (I-3) containing the adhesive resin (I-2 a) and an energy ray-curable compound.
Adhesive composition (I-1)
As described above, the adhesive composition (I-1) contains the non-energy ray-curable adhesive resin (I-1 a) and the energy ray-curable compound.
[ adhesive resin (I-1 a) ]
Preferably, the adhesive resin (I-1 a) is an acrylic resin.
Examples of the acrylic resin include acrylic polymers having at least a structural unit derived from an alkyl (meth) acrylate.
The structural units of the acrylic resin may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
The adhesive resin (I-1 a) contained in the adhesive composition (I-1) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-1), the content of the adhesive resin (I-1 a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass, based on the total mass of the adhesive composition (I-1).
[ energy ray-curable Compound ]
The energy ray-curable compound contained in the adhesive composition (I-1) includes a monomer or oligomer having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays.
Examples of the monomer in the energy ray-curable compound include polyvalent (meth) acrylates such as trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, and 1, 6-hexanediol (meth) acrylate; urethane (meth) acrylates; polyester (meth) acrylates; polyether (meth) acrylates; epoxy (meth) acrylates, and the like.
Examples of the oligomer in the energy ray-curable compound include oligomers obtained by polymerizing the monomers exemplified above.
The energy ray-curable compound is preferably urethane (meth) acrylate or urethane (meth) acrylate oligomer in terms of having a large molecular weight and being less likely to lower the storage modulus of the adhesive layer.
The energy ray-curable compound contained in the adhesive composition (I-1) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-1), the content of the energy ray-curable compound is preferably 1 to 95% by mass, more preferably 5 to 90% by mass, and particularly preferably 10 to 85% by mass, based on the total mass of the adhesive composition (I-1).
[ Cross-linking agent ]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from an alkyl (meth) acrylate is used as the adhesive resin (I-1 a), it is preferable that the adhesive composition (I-1) further contains a crosslinking agent.
The crosslinking agent crosslinks the adhesive resins (I-1 a) to each other, for example, by reacting with the functional groups.
Examples of the crosslinking agent include isocyanate crosslinking agents (crosslinking agents having an isocyanate group) such as toluene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates; epoxy-based crosslinking agents (crosslinking agents having a glycidyl group) such as ethylene glycol glycidyl ether; aziridine-based crosslinking agents (crosslinking agents having an aziridinyl group) such as hexa [1- (2-methyl) -aziridinyl ] triphosphatriazine; metal chelate crosslinking agents (crosslinking agents having a metal chelate structure) such as aluminum chelates; isocyanurate-based crosslinking agents (crosslinking agents having an isocyanuric acid skeleton), and the like.
The crosslinking agent is preferably an isocyanate-based crosslinking agent from the viewpoint of improving the cohesive force of the adhesive agent and thereby improving the adhesive force of the adhesive layer, from the viewpoint of easy availability, and the like.
The crosslinking agent contained in the adhesive composition (I-1) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When a crosslinking agent is used, the content of the crosslinking agent in the adhesive composition (I-1) is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass, based on 100 parts by mass of the content of the adhesive resin (I-1 a).
[ photopolymerization initiator ]
The adhesive composition (I-1) may further contain a photopolymerization initiator. Even if the adhesive composition (I-1) containing the photopolymerization initiator is irradiated with energy rays of relatively low energy such as ultraviolet rays, it sufficiently undergoes curing reaction.
Examples of the photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2-dimethoxy-1, 2-diphenylethan-1-one, and the like; acylphosphine oxide compounds such as phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide and 2,4, 6-trimethylbenzoyl diphenyl phosphine oxide; sulfides such as benzyl phenyl sulfide and tetramethyl thiuram monosulfide; alpha-ketol compounds such as 1-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; a titanocene compound such as titanocene; thioxanthone compounds such as thioxanthone; a peroxide compound; diketone compounds such as butanedione; benzil; a dibenzoyl group; benzophenone; 2, 4-diethylthioxanthone; 1, 2-diphenylmethane; 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl ] propanone; 2-chloroanthraquinone, and the like.
As the photopolymerization initiator, for example, a quinone compound such as 1-chloroanthraquinone can be used; amine and the like.
The photopolymerization initiator contained in the adhesive composition (I-1) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the photopolymerization initiator is used, the content of the photopolymerization initiator in the adhesive composition (I-1) is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the content of the energy ray-curable compound.
[ other additives ]
The adhesive composition (I-1) may further contain other additives than any of the above components within a range not impairing the effects of the present invention.
Examples of the other additives include known additives such as antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments and dyes), sensitizers, tackifiers, reaction retarders, and crosslinking accelerators (catalysts).
The reaction retarder is, for example, a component for inhibiting an unintended crosslinking reaction in the adhesive composition (I-1) during storage due to the action of the catalyst mixed into the adhesive composition (I-1). Examples of the reaction retarder include a reaction retarder that forms a chelate complex (chelate complex) with a chelate compound corresponding to a catalyst, and more specifically, a reaction retarder having two or more carbonyl groups (-C (=o) -) in one molecule.
The other additives contained in the adhesive composition (I-1) may be one or two or more, and when two or more are used, the combination and ratio thereof may be arbitrarily selected.
The content of the other additives of the adhesive composition (I-1) is not particularly limited, and may be appropriately selected according to the kind thereof.
[ solvent ]
The adhesive composition (I-1) may contain a solvent. By containing the solvent, the adhesive composition (I-1) has improved coating suitability for the surface to be coated.
The solvent is preferably an organic solvent.
Adhesive composition (I-2)
As described above, the adhesive composition (I-2) contains the energy ray-curable adhesive resin (I-2 a) having an unsaturated group introduced into a side chain of the non-energy ray-curable adhesive resin (I-1 a).
[ adhesive resin (I-2 a) ]
The adhesive resin (I-2 a) is obtained, for example, by reacting an unsaturated group-containing compound having an energy ray polymerizable unsaturated group with a functional group in the adhesive resin (I-1 a).
The unsaturated group-containing compound is a compound having, in addition to the energy ray-polymerizable unsaturated group, a group that can bond to the adhesive resin (I-1 a) by reacting with a functional group in the adhesive resin (I-1 a).
Examples of the energy ray-polymerizable unsaturated group include a (meth) acryloyl group, a vinyl (ethylene) group, and an allyl (2-propenyl) group, and a (meth) acryloyl group is preferable.
Examples of the group capable of bonding to the functional group in the adhesive resin (I-1 a) include an isocyanate group and a glycidyl group capable of bonding to a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding to a carboxyl group or an epoxy group.
Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyloxyisocyanate, and glycidyl (meth) acrylate.
The adhesive resin (I-2 a) contained in the adhesive composition (I-2) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-2), the content of the adhesive resin (I-2 a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 10 to 90% by mass, based on the total mass of the adhesive composition (I-2).
[ Cross-linking agent ]
For example, when the acrylic polymer having a structural unit derived from a functional group-containing monomer as in the adhesive resin (I-1 a) is used as the adhesive resin (I-2 a), the adhesive composition (I-2) may further contain a crosslinking agent.
The crosslinking agent in the adhesive composition (I-2) may be the same as the crosslinking agent in the adhesive composition (I-1).
The crosslinking agent contained in the adhesive composition (I-2) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When a crosslinking agent is used, the content of the crosslinking agent in the adhesive composition (I-2) is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass, based on 100 parts by mass of the content of the adhesive resin (I-2 a).
[ photopolymerization initiator ]
The adhesive composition (I-2) may further contain a photopolymerization initiator. Even if the adhesive composition (I-2) containing the photopolymerization initiator is irradiated with energy rays of relatively low energy such as ultraviolet rays, the curing reaction proceeds sufficiently.
The photopolymerization initiator in the adhesive composition (I-2) may be the same as the photopolymerization initiator in the adhesive composition (I-1).
The photopolymerization initiator contained in the adhesive composition (I-2) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the photopolymerization initiator is used, the content of the photopolymerization initiator in the adhesive composition (I-2) is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, based on 100 parts by mass of the adhesive resin (I-2 a).
[ other additives, solvents ]
The adhesive composition (I-2) may further contain other additives than any of the above components within a range not impairing the effects of the present invention.
In addition, the adhesive composition (I-2) may also contain a solvent for the same purpose as the adhesive composition (I-1).
The other additives and solvents in the adhesive composition (I-2) are the same as those in the adhesive composition (I-1), respectively. The other additives and solvents contained in the adhesive composition (I-2) may be either one or two or more, and the combination and ratio thereof may be arbitrarily selected.
The content of the other additives and the solvent in the adhesive composition (I-2) is not particularly limited, and may be appropriately selected according to the kind thereof.
Adhesive composition (I-3)
As described above, the adhesive composition (I-3) contains the adhesive resin (I-2 a) and an energy ray-curable compound.
In the adhesive composition (I-3), the content of the adhesive resin (I-2 a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass, based on the total mass of the adhesive composition (I-3).
[ energy ray-curable Compound ]
The energy ray-curable compound contained in the adhesive composition (I-3) includes monomers and oligomers having an energy ray-polymerizable unsaturated group and being curable by irradiation with energy rays, and includes the same energy ray-curable compound as the energy ray-curable compound contained in the adhesive composition (I-1).
The energy ray-curable compound contained in the adhesive composition (I-3) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-3), the content of the energy ray-curable compound is preferably 0.01 to 300 parts by mass, more preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass, relative to 100 parts by mass of the content of the adhesive resin (I-2 a).
[ photopolymerization initiator ]
The adhesive composition (I-3) may further contain a photopolymerization initiator. Even if the adhesive composition (I-3) containing the photopolymerization initiator is irradiated with energy rays of relatively low energy such as ultraviolet rays, it sufficiently undergoes curing reaction.
The photopolymerization initiator in the adhesive composition (I-3) may be the same as the photopolymerization initiator in the adhesive composition (I-1).
The photopolymerization initiator contained in the adhesive composition (I-3) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the photopolymerization initiator is used, the content of the photopolymerization initiator in the adhesive composition (I-3) is preferably 0.01 to 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass, relative to 100 parts by mass of the total content of the adhesive resin (I-2 a) and the energy ray-curable compound.
[ other additives, solvents ]
The adhesive composition (I-3) may further contain other additives than any of the above components within a range not impairing the effects of the present invention.
In addition, the adhesive composition (I-3) may also contain a solvent for the same purpose as the adhesive composition (I-1).
The other additives and solvents in the adhesive composition (I-3) are the same as those in the adhesive composition (I-1), respectively. The other additives and solvents contained in the adhesive composition (I-3) may be either one or two or more, and when two or more are used, the combination and ratio thereof may be arbitrarily selected.
The content of the other additives and the solvent of the adhesive composition (I-3) is not particularly limited, and may be appropriately selected according to the kind thereof.
Adhesive compositions other than the adhesive compositions (I-1) to (I-3)
The adhesive composition (I-1), the adhesive composition (I-2) and the adhesive composition (I-3) have been mainly described so far, but the components described as the components contained therein can be used in all the adhesive compositions other than the three adhesive compositions (in this specification, referred to as "adhesive compositions other than the adhesive compositions (I-1) to (I-3)").
The adhesive compositions other than the adhesive compositions (I-1) to (I-3) include non-energy ray-curable adhesive compositions other than the energy ray-curable adhesive compositions.
Examples of the non-energy ray-curable adhesive composition include an adhesive composition (I-4) containing a non-energy ray-curable adhesive resin (I-1 a) such as an acrylic resin, a urethane resin, a rubber-based resin, a silicone resin, an epoxy-based resin, a polyvinyl ether, a polycarbonate, and an ester-based resin, and a non-energy ray-curable adhesive composition containing an acrylic resin is preferable.
The adhesive compositions other than the adhesive compositions (I-1) to (I-3) preferably contain one or more crosslinking agents, and the content thereof may be set to be the same as that of the adhesive composition (I-1) or the like.
Adhesive composition (I-4)
As a preferred adhesive composition (I-4), for example, an adhesive composition containing the adhesive resin (I-1 a) and a crosslinking agent can be mentioned.
[ adhesive resin (I-1 a) ]
As the adhesive resin (I-1 a) in the adhesive composition (I-4), the same adhesive resin (I-1 a) as that in the adhesive composition (I-1) can be mentioned.
The adhesive resin (I-1 a) contained in the adhesive composition (I-4) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-4), the content of the adhesive resin (I-1 a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and particularly preferably 15 to 90% by mass, based on the total mass of the adhesive composition (I-4).
[ Cross-linking agent ]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to a structural unit derived from an alkyl (meth) acrylate is used as the adhesive resin (I-1 a), it is preferable that the adhesive composition (I-4) further contains a crosslinking agent.
The crosslinking agent in the adhesive composition (I-4) may be the same as the crosslinking agent in the adhesive composition (I-1).
The crosslinking agent contained in the adhesive composition (I-4) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-4), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 25 parts by mass, and particularly preferably 0.1 to 10 parts by mass, relative to 100 parts by mass of the content of the adhesive resin (I-1 a).
[ other additives, solvents ]
The adhesive composition (I-4) may further contain other additives than any of the above components within a range not impairing the effects of the present invention.
In addition, the adhesive composition (I-4) may also contain a solvent for the same purpose as the adhesive composition (I-1).
The other additives and solvents in the adhesive composition (I-4) are the same as those in the adhesive composition (I-1), respectively. The other additives and solvents contained in the adhesive composition (I-4) may be either one or two or more, and the combination and ratio thereof may be arbitrarily selected.
The content of the other additives and solvents in the adhesive composition (I-4) is not particularly limited, and may be appropriately selected according to the kind thereof.
Method for producing adhesive composition
The adhesive compositions other than the adhesive compositions (I-1) to (I-3), such as the adhesive compositions (I-1) to (I-3) and the adhesive composition (I-4), can be obtained by blending the components for constituting the adhesive composition, that is, by blending the adhesive with the components other than the adhesive as needed, and the like.
The order of addition in blending the components is not particularly limited, and two or more components may be added simultaneously.
When a solvent is used, the solvent may be mixed with any blend component other than the solvent to dilute the blend component in advance, or the solvent may be mixed with any blend component other than the solvent to use the blend component without diluting the blend component in advance.
The method of mixing the components at the time of blending is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer, a stirring blade, or the like; a method of mixing using a mixer (mixer); and a method of mixing by applying ultrasonic waves.
The temperature and time at the time of adding and mixing the components are not particularly limited as long as the components to be blended are not degraded, and the temperature is preferably 15 to 30 ℃.
Middle layer
The intermediate layer is sheet-like or film-like and contains a resin.
The intermediate layer may be made of a resin, or may contain a resin and a component other than the resin.
The intermediate layer may be formed, for example, by molding the resin or the intermediate layer-forming composition containing the resin. The intermediate layer may be formed by applying the intermediate layer-forming composition to the surface of the intermediate layer to be formed and drying the intermediate layer-forming composition as necessary.
The resin as a constituent material of the intermediate layer is not particularly limited.
Preferable examples of the resin in the intermediate layer include ethylene-vinyl acetate copolymer (EVA), polypropylene (PP), polyethylene (PE), urethane Acrylate (UA), and the like.
The content of the resin in the intermediate layer-forming composition is not particularly limited, and may be, for example, 80 mass% or more, 90 mass% or more, 95 mass% or more, or the like, but this is only an example.
The intermediate layer may be formed of one layer (single layer) or two or more layers, and when the intermediate layer is formed of a plurality of layers, the plurality of layers may be the same as or different from each other, and the combination of the plurality of layers is not particularly limited.
< shear modulus Ei' >, of test piece made of intermediate layer
For a test piece having a width of 15mm and a length exceeding 100mm, which is produced from an intermediate layer (intermediate layer 13 in the case of solid wafer 101 shown in fig. 1), when a tensile test is performed at a tensile speed of 200mm/min by using TENSILON with a collet pitch of 100mm and a temperature of 0 ℃, the tensile elastic modulus Ei' of the test piece at 0 ℃ in the elastic deformation region may be measured, for example, at any one of 10 to 150MPa, 10 to 100MPa, and 10 to 50 MPa. By making Ei ' be in the above range, the tensile elastic modulus becomes easier to adjust than Ei '/Eb '.
In the above-mentioned solid wafer, the tensile elastic modulus Ei' of the test piece produced from the intermediate layer was also defined as a value at 0 ℃.
Ei' in the measurement directions of 2 or more of the test pieces may be the same or different from each other. Here, the "measurement directions of 2 or more of Ei' means different directions of 2 or more of directions parallel to the first surface (corresponding to the first surface of the intermediate layer) of the test piece. For example, when the test piece has MD and TD, ei 'of the MD of the test piece and Ei' of the TD of the test piece may be the same or different from each other.
In the present embodiment, for example, the tensile elastic modulus Ei' in any measurement direction of the test piece may be any of the 3 numerical ranges exemplified above. For example, when the test piece has MD and TD, ei' may be any one of the 3 numerical ranges exemplified above in either or both of the MD and TD. In this case, the combination of the numerical range of Ei 'of MD and the numerical range of Ei' of TD is arbitrary.
The thickness of the test piece to be measured for the tensile elastic modulus Ei' is not particularly limited as long as the thickness can be measured with high accuracy. For example, the test piece may have a thickness of 10 to 200. Mu.m.
The Ei' of the test piece produced from the intermediate layer can be adjusted by adjusting the content of the intermediate layer, for example, the kind and content of the resin.
< tensile elastic modulus ratio Ei '/Eb' >
In the present embodiment, the tensile elastic modulus ratio Ei '/Eb' calculated using the tensile elastic modulus Eb 'of the test piece made of the base material and the tensile elastic modulus Ei' of the test piece made of the intermediate layer is 0.5 or less, and may be, for example, any one of 0.45 or less, 0.4 or less, and 0.35 or less. When the tensile elastic modulus ratio Ei '/Eb' is equal to or less than the upper limit value, the notch width becomes sufficiently wide with respect to the elongation of the base material at the time of expanding the die bond sheet, and the film-like adhesive can be stably divided along the outer sides Zhou Qieduan of the semiconductor chip.
As described above, each of Eb 'and Ei' may differ depending on the measurement direction of the test piece to be measured (the test piece of the base material in the case of Eb 'and the test piece of the intermediate layer in the case of Ei'). In the present embodiment, as Ei 'and Eb' used for calculation of the tensile elastic modulus ratio Ei '/Eb', ei 'and Eb' reflecting the arrangement direction of the base material and the intermediate layer in the solid wafer are used.
For example, when the test piece of the base material and the test piece of the intermediate layer each have MD and TD, and the MD of the base material and the MD of the intermediate layer in the solid wafer (in other words, the TD of the base material and the TD of the intermediate layer are the same), the tensile elastic modulus ratio Ei '/Eb' may be 0.5 or less in either or both of the MD and the TD, for example, may be any one of 0.45 or less, 0.4 or less, and 0.35 or less. At this time, the combination of the numerical range of Ei '/Eb' of MD and the numerical range of Ei '/Eb' of TD is arbitrary.
The lower limit value of the tensile elastic modulus ratio Ei '/Eb' is not particularly limited as long as it is greater than 0. For example, the tensile elastic modulus ratio Ei '/Eb' may be 0.05 or more from the viewpoint of calculation from a combination of 200MPa as one example of the preferable upper limit value of Eb 'and 10MPa as one example of the preferable lower limit value of Ei'.
The tensile elastic modulus ratio Ei '/Eb' may be appropriately adjusted within a range set by arbitrarily combining the above lower limit value with an arbitrary upper limit value. For example, in one embodiment, the tensile elastic modulus ratio Ei '/Eb' may be any one of 0.05 to 0.5, 0.05 to 0.45, 0.05 to 0.4, and 0.05 to 0.35.
When the test piece of the base material and the test piece of the intermediate layer each have MD and TD, and the MD of the base material and the MD of the intermediate layer (in other words, the TD of the base material and the TD of the intermediate layer are the same), the tensile elastic modulus ratio Ei '/Eb' may be 0.5 or less in either or both of the MD and the TD, and may be any one of 0.05 to 0.5, 0.05 to 0.45, 0.05 to 0.4, and 0.05 to 0.35. At this time, the combination of the numerical range of Ei '/Eb' of MD and the numerical range of Ei '/Eb' of TD is arbitrary.
As described hereinabove, the maximum value of the width of the intermediate layer is smaller than the maximum value of the width of the adhesive layer and the maximum value of the width of the substrate.
The maximum value of the width of the intermediate layer may be appropriately selected in consideration of the size of the semiconductor wafer. For example, the maximum width of the intermediate layer may be 150 to 160mm, 200 to 210mm, or 300 to 310mm. These three numerical ranges correspond to semiconductor wafers having a maximum value of 150mm, 200mm or 300mm in width in the direction parallel to the face to which the die is attached. In this embodiment, the die is attached to the diced semiconductor wafer as described above. The "diced semiconductor wafer" is synonymous with the "semiconductor chip set" described later.
In the present specification, unless otherwise specified, "width of the intermediate layer" means, for example, "width in a direction parallel to the first face of the intermediate layer". For example, in the case of an intermediate layer having a circular planar shape, the maximum value of the width of the intermediate layer is the diameter of the circle that is the planar shape.
This is also the case with semiconductor wafers. That is, the "width of the semiconductor wafer" refers to the aforementioned "width of the semiconductor wafer in the direction parallel to the surface to which the semiconductor wafer is attached to the die. For example, in the case of a semiconductor wafer having a circular planar shape, the maximum value of the width of the semiconductor wafer is the diameter of the circle having the planar shape.
The maximum value of the width of the intermediate layer of 150 to 160mm is the maximum value of the width of the semiconductor wafer of 150mm or more in the range of not more than 10 mm.
Similarly, the maximum value of the width of the intermediate layer of 200 to 210mm means the maximum value of the width of the semiconductor wafer of greater than 200mm in a range of not more than 10 mm.
Similarly, the maximum value of the width of the intermediate layer of 300 to 310mm means the maximum value of the width of the semiconductor wafer of 300mm or more in a range of not more than 10 mm.
That is, in this embodiment, the difference between the maximum value of the width of the intermediate layer and the maximum value of the width of the semiconductor wafer may be, for example, 0 to 10mm, regardless of whether the maximum value of the width of the semiconductor wafer is 150mm, 200mm, or 300 mm.
When the maximum value of the width of the intermediate layer satisfies the above condition, the effect of suppressing scattering other than the object of the film-like adhesive after cutting is enhanced when the film-like adhesive is cut by the expansion of the die-bonding sheet, which will be described later.
The thickness of the intermediate layer may be appropriately selected depending on the purpose, but is preferably 20 to 150. Mu.m, more preferably 50 to 120. Mu.m. By setting the thickness of the intermediate layer to the lower limit value or more, the structure of the intermediate layer is more stable. When the thickness of the intermediate layer is equal to or less than the upper limit value, the film-like adhesive is further improved in cutting property when the die-bonding sheet is expanded. Further, when the die-bonding sheet after cutting the film-like adhesive is spread (in other words, when the laminate sheet is spread), the effect of making the slit width sufficiently wide and maintaining the slit width with high uniformity is further increased.
Here, the "thickness of the intermediate layer" refers to the thickness of the entire intermediate layer, and for example, the thickness of the intermediate layer composed of a plurality of layers refers to the total thickness of all the layers constituting the intermediate layer.
The intermediate layer is preferably softer than the substrate. For example, an intermediate layer having an Ei 'smaller than Eb' (Ei '< Eb') satisfies this condition, and as described above, an intermediate layer having a tensile elastic modulus ratio Ei '/Eb' of 0.5 or less is preferable.
O film-like adhesive
The film-like adhesive has curability, preferably a film-like adhesive having thermosetting properties, preferably a film-like adhesive having pressure-sensitive adhesiveness. Film adhesives having both thermosetting and pressure-sensitive adhesiveness can be attached to various adherends in an uncured state by gentle pressing. The film-like adhesive may be an adhesive that can be applied to various adherends by softening by heating. The film-like adhesive is cured to finally form a cured product having high impact resistance, and the cured product can maintain sufficient adhesive properties even under severe high-temperature and high-humidity conditions.
When the die is fixed in a top-down plan view, the area of the film-like adhesive (i.e., the area of the first surface) is preferably set smaller than the area of the substrate (i.e., the area of the first surface) and the area of the adhesive layer (i.e., the area of the first surface) so as to approach the area of the semiconductor wafer before dicing. In such a solid wafer, a region which is not in contact with the film-like adhesive exists in a part of the first surface of the adhesive layer. This makes it easier to expand the die-bonding sheet, and the force applied to the film-like adhesive during expansion is not dispersed, so that the film-like adhesive is more easily cut.
The film-like adhesive can be formed using an adhesive composition containing its constituent materials. For example, the adhesive composition may be applied to a surface to be formed of the film-like adhesive, and dried as necessary, thereby forming the film-like adhesive at the target site.
The application of the adhesive composition can be performed by the same method as the application of the adhesive composition described above.
The drying conditions of the adhesive composition are not particularly limited. When the adhesive composition contains a solvent to be described later, it is preferable to perform heat drying, and in this case, it is preferable to perform drying at 70 to 130℃for 10 seconds to 5 minutes, for example.
The film-like pressure-sensitive adhesive may be composed of one layer (single layer) or two or more layers, and when composed of a plurality of layers, the layers may be the same or different from each other, and the combination of the layers is not particularly limited.
As described hereinabove, the maximum value of the width of the film-like adhesive is smaller than the maximum value of the width of the adhesive layer and the maximum value of the width of the substrate.
The maximum value of the width of the film-like adhesive may be the same as the maximum value of the width of the intermediate layer described above with respect to the size of the semiconductor wafer.
That is, the maximum value of the width of the film-like adhesive can be appropriately selected in consideration of the size of the semiconductor wafer. For example, the maximum value of the width of the film-like adhesive may be 150 to 160mm, 200 to 210mm, or 300 to 310mm. These three numerical ranges correspond to semiconductor wafers having a maximum value of 150mm, 200mm or 300mm in width in the direction parallel to the face to which the die is attached.
In the present specification, unless otherwise indicated, "width of film-like adhesive" means, for example
"width of the film-like adhesive in a direction parallel to the first face of the film-like adhesive". For example, in the case of a film-like adhesive having a circular planar shape, the maximum value of the width of the film-like adhesive is the diameter of the circle that is the planar shape.
In addition, unless otherwise specified, "width of the film-like adhesive" refers to "width of the film-like adhesive before cutting (without cutting)" and is not the width of the film-like adhesive after cutting in the manufacturing process of the semiconductor chip with the film-like adhesive described later.
The maximum value of the width of the film-like adhesive of 150 to 160mm means the maximum value of the width of the semiconductor wafer of 150mm or more in a range of not more than 10mm.
The maximum value of the width of the film-like adhesive of 200 to 210mm means the maximum value of the width of the semiconductor wafer of 200mm or more in the range of not more than 10mm.
Similarly, the maximum value of the width of the film-like adhesive of 300 to 310mm means the maximum value of the width of the semiconductor wafer of 300mm or more in a range of not more than 10mm.
That is, in this embodiment, the difference between the maximum value of the width of the film-like adhesive and the maximum value of the width of the semiconductor wafer may be, for example, 0 to 10mm, regardless of whether the maximum value of the width of the semiconductor wafer is 150mm, 200mm or 300 mm.
By making the maximum value of the width of the film-like adhesive satisfy the above condition, when the film-like adhesive is cut by the expansion of the die-bonding sheet, the effect of suppressing scattering other than the object of the film-like adhesive after cutting, which will be described later, is increased.
In this embodiment, the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive may be any of the above numerical ranges.
That is, as an example of the solid wafer of the present embodiment, a solid wafer in which the maximum value of the width of the intermediate layer and the maximum value of the width of the film-like adhesive are 150 to 160mm, 200 to 210mm, or 300 to 310mm is given.
The thickness of the film-like pressure-sensitive adhesive is not particularly limited, but is preferably 1 to 30. Mu.m, more preferably 2 to 20. Mu.m, particularly preferably 3 to 10. Mu.m. By setting the thickness of the film-like adhesive to the above lower limit value or more, a higher adhesive force to an adherend (semiconductor chip) can be obtained. When the thickness of the film-like adhesive is equal to or less than the upper limit value, the cutting performance of the film-like adhesive due to the expansion is further improved, and the amount of the generated cutting pieces of the film-like adhesive can be further reduced.
The "thickness of the film-like adhesive" refers to the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers refers to the total thickness of all the layers constituting the film-like adhesive.
Next, the adhesive composition will be described.
Adhesive composition
Preferable examples of the adhesive composition include adhesive compositions containing a polymer component (a) and a thermosetting component (b). The components will be described below.
In addition, the adhesive composition shown below is one example of a preferable adhesive composition, and the adhesive composition of the present embodiment is not limited to the adhesive composition shown below.
[ Polymer component (a) ]
The polymer component (a) may be regarded as a component formed by polymerization of a polymerizable compound, which is a polymer compound for imparting film-forming property, flexibility, and the like to a film-like adhesive agent, and at the same time, improving the adhesiveness (in other words, adhesiveness) to an adhesion object such as a semiconductor chip. The polymer component (a) is not a component of the epoxy resin (b 1) and the thermosetting agent (b 2) described later.
The polymer component (a) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
Examples of the polymer component (a) include acrylic resins, urethane resins, phenoxy resins, silicone resins, saturated polyester resins, and the like, with acrylic resins being preferred.
In the adhesive composition, the ratio of the content of the polymer component (a) to the total content of all components except the solvent (i.e., the ratio of the content of the polymer component (a) in the film-like adhesive to the total mass of the film-like adhesive) is preferably 20 to 75 mass%, more preferably 30 to 65 mass%.
[ thermosetting component (b) ]
The thermosetting component (b) is a component having thermosetting properties for thermosetting the film-like adhesive.
The thermosetting component (b) is composed of an epoxy resin (b 1) and a thermosetting agent (b 2).
The thermosetting component (b) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
Epoxy resin (b 1)
The epoxy resin (b 1) may be a known epoxy resin, and examples thereof include epoxy compounds having a functionality of not less than a difunctional degree such as a polyfunctional epoxy resin, a biphenyl compound, bisphenol a diglycidyl ether and a hydride thereof, an o-cresol novolac (novolak) epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, and a phenylene skeleton type epoxy resin.
As the epoxy resin (b 1), an epoxy resin having an unsaturated hydrocarbon group may be used. The compatibility of an epoxy resin having an unsaturated hydrocarbon group with an acrylic resin is greater than that of an epoxy resin having no unsaturated hydrocarbon group. Therefore, by using an epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using a film-like adhesive is improved.
The epoxy resin (b 1) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
Thermosetting agent (b 2)
The thermosetting agent (b 2) functions as a curing agent for the epoxy resin (b 1).
Examples of the thermosetting agent (b 2) include compounds having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and a group obtained by acid anhydride, preferably a phenolic hydroxyl group, an amino group, or a group obtained by acid anhydride, and more preferably a phenolic hydroxyl group or an amino group.
Examples of the phenolic curing agent having a phenolic hydroxyl group in the thermosetting agent (b 2) include polyfunctional phenol resins, biphenol, novolak-type phenol resins, dicyclopentadiene-type phenol resins, aralkyl-type phenol resins, and the like.
Examples of amine curing agents having an amino group in the thermosetting agent (b 2) include Dicyandiamide (DICY).
The thermosetting agent (b 2) may have an unsaturated hydrocarbon group.
The thermosetting agent (b 2) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition and the film-like adhesive, the content of the thermosetting agent (b 2) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, and for example, may be any one of 1 to 100 parts by mass, 1 to 50 parts by mass, and 1 to 25 parts by mass, relative to 100 parts by mass of the content of the epoxy resin (b 1). By setting the content of the thermosetting agent (b 2) to the lower limit value or more, the film-like adhesive is more easily cured. By setting the content of the thermosetting agent (b 2) to the upper limit value or less, the moisture absorption rate of the film-like adhesive is reduced, and the reliability of the package obtained by using the film-like adhesive is further improved.
In the adhesive composition and the film-like adhesive, the content of the thermosetting component (b) (i.e., the total content of the epoxy resin (b 1) and the thermosetting agent (b 2)) is preferably 5 to 100 parts by mass, more preferably 5 to 75 parts by mass, particularly preferably 5 to 50 parts by mass, and for example, may be any one of 5 to 35 parts by mass and 5 to 20 parts by mass, relative to 100 parts by mass of the content of the polymer component (a). By making the content of the thermosetting component (b) within the above range, the peeling force between the intermediate layer and the film-like adhesive is more stable.
In order to improve various physical properties of the film-like adhesive, the film-like adhesive may further contain other components other than the polymer component (a) and the thermosetting component (b) as needed, in addition to the polymer component (a) and the thermosetting component (b).
Preferable components among other components contained in the film-like adhesive include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray-curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i).
[ curing accelerator (c) ]
The curing accelerator (c) is a component for adjusting the curing speed of the adhesive composition.
Preferable curing accelerators (c) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; imidazoles (imidazoles in which one or more hydrogen atoms are substituted with a group other than a hydrogen atom) such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4, 5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines (phosphines in which one or more hydrogen atoms are replaced with an organic group) such as tributylphosphine, diphenylphosphine, and triphenylphosphine; tetraphenylboron salts such as tetraphenylboron tetraphenylphosphorus (tetraphenyl phosphonium tetraphenyl borate) and triphenylphosphine tetraphenylborate (triphenylphosphine tetraphenyl borate).
The curing accelerator (c) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the curing accelerator (c) is used, the content of the curing accelerator (c) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the content of the thermosetting component (b) in the adhesive composition and the film-like adhesive. By setting the content of the curing accelerator (c) to the above lower limit value or more, the effect of using the curing accelerator (c) can be more remarkably obtained. By setting the content of the curing accelerator (c) to the above-described upper limit value or less, for example, the effect of inhibiting the high-polarity curing accelerator (c) from moving to the adhesion interface side with the adherend in the film-like adhesive under high-temperature and high-humidity conditions to cause segregation is increased, and the reliability of the package obtained by using the film-like adhesive is further improved.
[ Filler (d) ]
By containing the filler (d) in the film-like adhesive, the cutting performance of the film-like adhesive by the expansion is further improved. In addition, by including the filler (d) in the film-like adhesive, adjustment of the thermal expansion coefficient of the film-like adhesive becomes easy, and by optimizing the thermal expansion coefficient for the object to which the film-like adhesive is attached, the reliability of the package obtained by using the film-like adhesive is further improved. In addition, by containing the filler (d) in the film-like adhesive, the moisture absorption rate of the cured film-like adhesive can be reduced or the heat dissipation property can be improved.
The filler (d) may be any of an organic filler and an inorganic filler, and is preferably an inorganic filler.
Preferable examples of the inorganic filler include powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, and the like; beads (beads) obtained by spheroidizing these inorganic fillers; surface modifications of these inorganic filler materials; single crystal fibers of these inorganic filler materials; glass fiber, and the like.
Among them, the inorganic filler is preferably silica or alumina.
The filler (d) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the filler (d) is used, the proportion of the content of the filler (d) relative to the total content of all components except the solvent (i.e., the proportion of the content of the filler (d) relative to the total mass of the film-like adhesive) in the adhesive composition is preferably 5 to 80 mass%, more preferably 10 to 70 mass%, particularly preferably 20 to 60 mass%. By setting the ratio to the above range, the effect of using the filler (d) can be more remarkably obtained.
[ coupling agent (e) ]
By containing the coupling agent (e) in the film-like pressure-sensitive adhesive, the adhesion to an adherend is improved. In addition, by containing the coupling agent (e) in the film-like adhesive, the water resistance of the cured product of the film-like adhesive is improved without impairing the heat resistance. The coupling agent (e) has a functional group that can react with an inorganic compound or an organic compound.
The coupling agent (e) is preferably a compound having a functional group capable of reacting with a functional group of the polymer component (a), the thermosetting component (b), or the like, and more preferably a silane coupling agent.
The coupling agent (e) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the coupling agent (e) is used, the content of the coupling agent (e) is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the total content of the polymer component (a) and the thermosetting component (b), in the adhesive composition and the film-like adhesive. By setting the content of the coupling agent (e) to the above lower limit value or more, the effect of using the coupling agent (e), that is, the improvement of the dispersibility of the filler (d) in the resin, the improvement of the adhesiveness between the film-like adhesive and the adherend, and the like can be obtained more remarkably. By making the content of the coupling agent (e) be the upper limit value or less, the generation of degassing (outgas) can be further suppressed.
[ Cross-linking agent (f) ]
When a substance having a functional group such as a vinyl group, (meth) acryl group, amino group, hydroxyl group, carboxyl group, isocyanate group, or the like capable of bonding with other compounds, such as the acrylic resin, is used as the polymer component (a), the adhesive composition and the film-like adhesive may contain a crosslinking agent (f). The crosslinking agent (f) is a component for bonding and crosslinking the functional group in the polymer component (a) with other compounds, and by crosslinking in this way, the initial adhesive force and cohesive force of the film-like adhesive can be adjusted.
Examples of the crosslinking agent (f) include an organic polyisocyanate (polyisocyanate) compound, an organic polyimide compound, a metal chelate crosslinking agent (crosslinking agent having a metal chelate structure), an aziridine crosslinking agent (crosslinking agent having an aziridine group), and the like.
When the organic polyisocyanate compound is used as the crosslinking agent (f), a hydroxyl group-containing polymer is preferably used as the polymer component (a). When the crosslinking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the crosslinking structure can be easily introduced into the film-like adhesive by the reaction of the crosslinking agent (f) with the polymer component (a).
The crosslinking agent (f) contained in the adhesive composition and the film-like adhesive may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the crosslinking agent (f) is used, the content of the crosslinking agent (f) in the adhesive composition is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and particularly preferably 0.3 to 5 parts by mass, relative to 100 parts by mass of the content of the polymer component (a). By setting the content of the crosslinking agent (f) to the lower limit value or more, the effect of using the crosslinking agent (f) can be more remarkably obtained. By setting the content of the crosslinking agent (f) to the upper limit value or less, excessive use of the crosslinking agent (f) can be suppressed.
[ energy ray-curable resin (g) ]
When the adhesive composition and the film-like adhesive contain the energy ray-curable resin (g), the film-like adhesive can be changed in characteristics by irradiation with energy rays.
The energy ray-curable resin (g) is a resin obtained by polymerizing (curing) an energy ray-curable compound.
Examples of the energy ray-curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylic compounds having a (meth) acryloyl group are preferable.
The energy ray-curable resin (g) contained in the adhesive composition may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
When the energy ray-curable resin (g) is used, the content of the energy ray-curable resin (g) in the adhesive composition is preferably 1 to 95% by mass, more preferably 5 to 90% by mass, and particularly preferably 10 to 85% by mass, based on the total mass of the adhesive composition.
[ photopolymerization initiator (h) ]
When the adhesive composition and the film-like adhesive contain the energy ray-curable resin (g), a photopolymerization initiator (h) may be contained in order to efficiently promote the polymerization reaction of the energy ray-curable resin (g).
Examples of the photopolymerization initiator (h) in the pressure-sensitive adhesive composition include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal; acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2-dimethoxy-1, 2-diphenylethan-1-one, and the like; acylphosphine oxide compounds such as phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide and 2,4, 6-trimethylbenzoyl diphenyl phosphine oxide; sulfides such as benzyl phenyl sulfide and tetramethyl thiuram monosulfide; alpha-ketol compounds such as 1-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; a titanocene compound such as titanocene; thioxanthone compounds such as thioxanthone; a peroxide compound; diketone compounds such as butanedione; benzil; a dibenzoyl group; benzophenone; 2, 4-diethylthioxanthone; 1, 2-diphenylmethane; 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl ] propanone; quinone compounds such as 1-chloroanthraquinone and 2-chloroanthraquinone.
Examples of the photopolymerization initiator (h) include photosensitizers such as amines.
The photopolymerization initiator (h) may be contained in the adhesive composition in any one kind, or in any two or more kinds, and the combination and ratio thereof may be arbitrarily selected.
When the photopolymerization initiator (h) is used, the content of the photopolymerization initiator (h) is preferably 0.1 to 20 parts by mass, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass, relative to 100 parts by mass of the content of the energy ray-curable resin (g) in the adhesive composition.
General purpose additive (i)
The general-purpose additive (I) may be a known additive, and may be arbitrarily selected according to the purpose, but is not particularly limited, and examples of preferable additives include plasticizers, antistatic agents, antioxidants, colorants (dyes, pigments), getters (coloring agents), and the like.
The general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be one or two or more, and when two or more are used, the combination and ratio thereof may be arbitrarily selected.
The content of the adhesive composition and the film-like adhesive is not particularly limited, and may be appropriately selected according to the purpose.
[ solvent ]
Preferably, the adhesive composition further contains a solvent. The solvent-containing adhesive composition has good handleability.
The solvent is not particularly limited, but examples of the preferable solvent include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutanol (2-methylpropan-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone.
The solvent contained in the adhesive composition may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like, from the viewpoint of more uniformly mixing the components contained in the adhesive composition.
The content of the solvent in the adhesive composition is not particularly limited, and may be appropriately selected according to the kind of the component other than the solvent, for example.
Method for producing adhesive composition
The adhesive composition may be obtained by blending the components used to construct the composition.
For example, the adhesive composition can be prepared by the same method as the adhesive composition described above except that the kinds of the blend components are different.
Antistatic layer
In the die, any one of the layers may be set as an antistatic layer.
In this case, as a preferable solid wafer, for example, a solid wafer is mentioned which is provided with the base material and is constituted by sequentially laminating an adhesive layer, an intermediate layer and a film-like adhesive on the base material, and the base material is provided with an antistatic layer (in this specification, abbreviated as "back surface antistatic layer" in some cases) on a surface located on the opposite side from the adhesive layer side.
Further, as a preferable solid wafer, for example, a solid wafer is mentioned which is provided with the base material and is constituted by laminating an adhesive layer, an intermediate layer and a film-like adhesive in this order on the base material, and the base material has antistatic properties (in this specification, the base material is sometimes abbreviated as "antistatic base material").
Further, as a preferable solid wafer, for example, a solid wafer is mentioned which is provided with the base material, is constituted by sequentially laminating an adhesive layer, an intermediate layer and a film-like adhesive on the base material, and is provided with an antistatic layer (in this specification, abbreviated as "surface antistatic layer" in some cases) as an antistatic layer on a surface of the base material on the adhesive layer side.
The antistatic layers (back antistatic layer, antistatic substrate and surface antistatic layer) all contain antistatic agents. Among them, a die-bonding sheet having a back surface antistatic layer or an antistatic base material is preferable.
The surface resistivity of the solid wafer may be 1.0X10 11 Ω/≡or less. By making the surface resistivity 1.0X10 as follows 11 And (3) the damage of the circuit in the semiconductor chip is suppressed.
The die of the present invention is attached to the back surface of a semiconductor group to form a laminate composed of the die and the semiconductor group, and the substrate-side surface of the laminate is fixed to a dicing table.
Next, the semiconductor wafer is divided into a plurality of layers and the film-like adhesive is cut into a laminate (hereinafter, abbreviated as "divided laminate") including, in this order, a substrate, an adhesive layer, an intermediate layer, the cut film-like adhesive, and the divided semiconductor wafer (i.e., semiconductor chip) in the state of being fixed to a dicing table.
Then, the divided laminate is released from the fixing state on the dicing table, and the laminate is conveyed to the cleaning table and fixed on the table.
Next, the laminate in the state of being fixed to the cleaning table is washed with water, and the chips generated and adhered during cutting in the previous step are rinsed and removed. The cutting chips originate from the semiconductor wafer and the film-like adhesive. Generally, cleaning is performed while rotating a cleaning table.
Then, the fixing state of the cleaned divided laminate on the cleaning stage is released, and the laminate is conveyed to the drying stage and fixed on the stage.
Next, the laminate in a state of being fixed to the drying table is dried, and water adhering to the laminate during cleaning in the previous step is removed. In general, drying is performed while rotating a drying table.
Next, the dried divided laminate is released from the fixed state on the drying table, and the laminate is conveyed to a device for performing the next step, and the next step is performed. Then, the semiconductor chip having the cut film-like adhesive on the back surface (semiconductor chip with film-like adhesive) is finally separated from the intermediate layer, and picked up.
As described above, the divided laminated body is fixed to any one of the tables, and after the work is performed, the fixed state is released and the laminated body is conveyed to a position where the next step is performed. These stacks are fixed by suction on any one of the tables, separated from the table after the suction is released, and transported to the next position. In general, each of these tables has a void portion penetrating through the thickness direction thereof, and the laminated body is adsorbed and fixed on the table by depressurizing the side of the table opposite to the side in contact with the laminated body.
As described above, in manufacturing a semiconductor chip having a film-like adhesive on the back surface using a semiconductor wafer and the die, the following operations are performed: the laminate is fixed to a table, and then the laminate is separated from the fixed surface on the table. In the solid wafer, the surface resistivity of the outermost layer of the base material is set to be 1.0X10 11 Omega/≡or less, electrification at the time of separating the laminate (in this specification, sometimes referred to as "electrification at the time of separation") is suppressed. As a result, the destruction of the circuit in the semiconductor chip at the time of the separation is suppressed.
As described later, in the examples, the surface resistivity of the solid wafer may be measured by using a surface resistivity meter with the surface layer on the substrate side of the solid wafer as the measurement target and setting the applied voltage to 100V.
O back antistatic layer
The back antistatic layer is sheet-like or film-like and contains an antistatic agent.
The back antistatic layer may contain a resin in addition to the antistatic agent.
The back surface antistatic layer may be formed of one layer (single layer) or two or more layers, and when the back surface antistatic layer is formed of a plurality of layers, the plurality of layers may be the same as or different from each other, and the combination of the plurality of layers is not particularly limited.
The thickness of the back surface antistatic layer is preferably 200nm or less, more preferably 180nm or less, and may be, for example, 100nm or less. In the back surface antistatic layer having a thickness of 200nm or less, the cost of the solid wafer having such a back surface antistatic layer can be reduced because the amount of antistatic agent used can be reduced while maintaining sufficient antistatic ability. Further, when the thickness of the back surface antistatic layer is 100nm or less, in addition to the above effects, an effect that variation in characteristics of the wafer can be suppressed to a minimum by providing the back surface antistatic layer can be obtained. As the characteristics, for example, extensibility can be cited.
Here, the "thickness of the back antistatic layer" refers to the thickness of the entire back antistatic layer, and for example, the thickness of the back antistatic layer composed of a plurality of layers refers to the total thickness of all the layers constituting the back antistatic layer.
The thickness of the back surface antistatic layer is preferably 10nm or more, and may be any of 20nm or more, 30nm or more, 40nm or more, and 65nm or more, for example. The formation of the back antistatic layer having a thickness of the lower limit value or more is easier and the structure is more stable.
The thickness of the back surface antistatic layer can be appropriately adjusted within a range set by arbitrarily combining the above-described preferable lower limit value and upper limit value. For example, in one embodiment, the thickness of the back antistatic layer is preferably 10 to 200nm, and may be, for example, any one of 20nm to 200nm, 30 to 200nm, 40 to 180nm, and 65 to 100 nm. However, this is only one example of the thickness of the backside antistatic layer.
The back antistatic layer may be transparent or opaque, or may be colored according to the purpose.
For example, when the film-like adhesive has energy ray curability, it is preferable that the back antistatic layer transmits energy rays.
For example, in order to optically inspect the film-like adhesive in the die-bonding sheet via the back surface antistatic layer, the back surface antistatic layer is preferably transparent.
Antistatic compositions (VI-1)
The back antistatic layer may be formed using the antistatic composition (VI-1) containing the antistatic agent. For example, the antistatic composition (VI-1) can be applied to a target surface on which a back surface antistatic layer is to be formed, and dried as needed, whereby a back surface antistatic layer can be formed at a target site. The content ratio of components that do not vaporize at ordinary temperature in the antistatic composition (VI-1) to each other is generally the same as the content ratio of the components to each other in the back surface antistatic layer.
A more specific method of forming the back surface antistatic layer will be described in detail later together with a method of forming other layers.
The antistatic composition (VI-1) may be applied by a known method, and for example, the same method as the adhesive composition described above may be used.
When the back surface antistatic layer is provided on the substrate, for example, the antistatic composition (VI-1) may be applied to the substrate and dried as necessary, thereby laminating the back surface antistatic layer on the substrate. In addition, when the back surface antistatic layer is provided on the substrate, for example, the antistatic composition (VI-1) may be applied to a release film and dried as necessary to form a back surface antistatic layer on the release film, and the exposed surface of the back surface antistatic layer may be bonded to one surface of the substrate, whereby the back surface antistatic layer is laminated on the substrate. The release film at this time may be removed at any timing during the process of manufacturing or using the wafer.
The drying condition of the antistatic composition (VI-1) is not particularly limited, but when the antistatic composition (VI-1) contains a solvent described later, it is preferable to carry out heat drying. The solvent-containing antistatic composition (VI-1) is preferably dried at 40 to 130℃for 10 seconds to 5 minutes, for example.
The antistatic composition (VI-1) may contain the resin in addition to the antistatic agent.
[ antistatic agent ]
The antistatic agent may be a known antistatic agent such as a conductive compound, and is not particularly limited. The antistatic agent may be, for example, any of a low molecular compound and a high molecular compound (in other words, an oligomer or a polymer).
Examples of the low molecular weight compound in the antistatic agent include various ionic liquids.
Examples of the ionic liquid include known ionic liquids such as a pyrimidinium salt, a pyridinium salt, a piperidinium salt, a pyrrolidinium salt, an imidazolium salt, a morpholinium salt, a sulfonium salt, a phosphonium salt, and an ammonium salt.
Examples of the polymer compound in the antistatic agent include poly (3, 4-ethylenedioxythiophene)/poly (styrenesulfonic acid) (sometimes referred to as "PEDOT/PSS" in the present specification), polypyrrole, and carbon nanotubes. The polypyrrole is an oligomer or polymer having multiple (bulk) pyrrole backbones.
The antistatic agent contained in the antistatic composition (VI-1) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the antistatic composition (VI-1), the ratio of the content of the antistatic agent to the total content of all components except the solvent (i.e., the ratio of the content of the antistatic agent in the back surface antistatic layer to the total mass of the back surface antistatic layer) may be, for example, any one of 0.1 to 30 mass% and 0.5 to 15 mass%. When the ratio is equal to or greater than the lower limit, the effect of suppressing peeling electrification of the die is increased, and as a result, the effect of suppressing the mixing of foreign matters between the film-like adhesive and the semiconductor wafer is increased. When the ratio is equal to or less than the upper limit value, the strength of the back surface antistatic layer is further increased.
[ resin ]
The resin contained in the antistatic composition (VI-1) and the back antistatic layer may be any of curable and non-curable, and may be any of energy ray curable and thermosetting when curable.
The resin may be, for example, a resin that functions as a binder resin.
More specifically, for example, an acrylic resin or the like is cited, and an energy ray curable acrylic resin is preferable.
The acrylic resin in the antistatic composition (VI-1) and the back surface antistatic layer may be, for example, the same acrylic resin as that in the adhesive layer. The energy ray-curable acrylic resin in the antistatic composition (VI-1) and the back antistatic layer may be, for example, the same acrylic resin as the adhesive resin (I-2 a) in the adhesive layer.
The resin contained in the antistatic composition (VI-1) and the back surface antistatic layer may be one kind only, or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the antistatic composition (VI-1), the ratio of the content of the resin to the total content of all components except the solvent (i.e., the ratio of the content of the resin in the back surface antistatic layer to the total mass of the back surface antistatic layer) may be, for example, any one of 30 to 99.9 mass%, 35 to 98 mass%, 60 to 98 mass%, and 85 to 98 mass%. By setting the ratio to the lower limit value or more, the strength of the back surface antistatic layer is further improved. By setting the ratio to the upper limit value or less, the content of the antistatic agent in the antistatic layer can be further increased.
[ energy ray-curable Compound, photopolymerization initiator ]
When the antistatic composition (VI-1) contains the resin having energy ray curability, it may further contain an energy ray curable compound.
In addition, when the antistatic composition (VI-1) contains the resin having energy ray curability, a photopolymerization initiator may be contained in order to efficiently advance the polymerization reaction of the resin.
Examples of the energy ray-curable compound and the photopolymerization initiator contained in the antistatic composition (VI-1) include the same energy ray-curable compound and photopolymerization initiator as those contained in the adhesive composition (I-1), respectively.
The energy ray-curable compound and the photopolymerization initiator contained in the antistatic composition (VI-1) may be either one or two or more, and when two or more are used, the combination and ratio thereof may be arbitrarily selected.
The contents of the energy ray-curable compound and the photopolymerization initiator in the antistatic composition (VI-1) are not particularly limited, and may be appropriately selected according to the types of the resin, the energy ray-curable compound, and the photopolymerization initiator.
[ other additives, solvents ]
The antistatic composition (VI-1) may further contain other additives than any of the above components within a range not impairing the effects of the present invention.
In addition, the antistatic composition (VI-1) may also contain a solvent for the same purpose as the above-mentioned adhesive composition (I-1).
The other additives and solvents contained in the antistatic composition (VI-1) include the same additives and solvents as those contained in the adhesive composition (I-1) (excluding antistatic agents). Further, the other additives contained in the antistatic composition (VI-1) include, in addition to the above components, emulsifiers. Further, as the solvent contained in the antistatic composition (VI-1), other alcohols such as ethanol may be mentioned in addition to the above-mentioned components; alkoxy alcohols such as 2-methoxyethanol (ethylene glycol monomethyl ether), 2-ethoxyethanol (ethylene glycol monoethyl ether), and 1-methoxy-2-propanol (propylene glycol monomethyl ether).
The other additives and solvents contained in the antistatic composition (VI-1) may be either one or two or more, and when two or more are used, the combination and ratio thereof may be arbitrarily selected.
The content of the other additives and the solvent of the antistatic composition (VI-1) is not particularly limited, and may be appropriately selected according to the kind thereof.
Process for the preparation of antistatic compositions (VI-1)
The antistatic composition (VI-1) can be obtained by blending the respective components for constituting the antistatic composition (VI-1), that is, by blending the antistatic agent with components other than the antistatic agent as needed, and the like.
Except for the point that the blending components are different, the antistatic composition (VI-1) can be prepared by the same method as the above-described adhesive composition.
Antistatic base material
The antistatic base material is in the form of a sheet or film, has antistatic properties, and further has the same function as the base material.
In the above-described solid wafer, the antistatic base material has the same function as the laminate of the base material and the back surface antistatic layer described above, and may be disposed instead of the laminate.
The antistatic base material contains an antistatic agent and a resin, and is the same as the base material described above except that the antistatic agent is further contained.
The antistatic base material may be composed of one layer (single layer) or two or more layers, and when composed of a plurality of layers, the layers may be the same or different from each other, and the combination of the layers is not particularly limited.
The thickness of the antistatic substrate may be, for example, the same as the thickness of the substrate described above. By setting the thickness of the antistatic base material to the above range, the flexibility of the die bond and the adhesion to the semiconductor wafer or the semiconductor chip are further improved.
Here, the "thickness of the antistatic base material" refers to the thickness of the entire antistatic base material, and for example, the thickness of the antistatic base material composed of a plurality of layers refers to the total thickness of all layers constituting the antistatic base material.
The antistatic base material may be transparent or opaque, or may be colored according to the purpose.
For example, when the film-like adhesive has energy ray curability, it is preferable that the back antistatic layer transmits energy rays.
For example, in order to optically inspect a film-like adhesive in a solid wafer via an antistatic substrate, the antistatic substrate is preferably transparent.
In order to improve the adhesion between the antistatic substrate and a layer (for example, an adhesive layer, an intermediate layer, or a film-like adhesive) provided thereon, the surface of the antistatic substrate may be subjected to a concavity and convexity treatment by sand blasting, solvent treatment, or the like; corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, and other oxidation treatments. In addition, the surface of the antistatic substrate may be also subjected to primer treatment.
Antistatic compositions (VI-2)
The antistatic base material can be produced, for example, by molding an antistatic composition (VI-2) containing the antistatic agent and the resin. The content ratio of the components which do not vaporize at ordinary temperature in the antistatic composition (VI-2) to each other is generally the same as the content ratio of the components to each other in the antistatic base material.
The antistatic composition (VI-2) may be molded by a known method, for example, in the production of the base material, by the same method as in the molding of the resin composition.
[ antistatic agent ]
The antistatic agent contained in the antistatic composition (VI-2) may be the same as the antistatic agent contained in the back surface antistatic layer.
The antistatic agent contained in the antistatic composition (VI-2) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the antistatic composition (VI-2) and the antistatic base material, the ratio of the content of the antistatic agent to the total content of the antistatic agent and the resin is preferably 7.5 mass% or more, more preferably 8.5 mass% or more. When the ratio is equal to or greater than the lower limit, the effect of suppressing peeling electrification of the die is increased, and as a result, the effect of suppressing the mixing of foreign matters between the film-like adhesive and the semiconductor wafer is increased.
In the antistatic composition (VI-2) and the antistatic base material, the upper limit of the ratio of the content of the antistatic agent to the total content of the antistatic agent and the resin is not particularly limited. For example, the ratio is preferably 20 mass% or less in terms of the compatibility of the antistatic agent becoming more excellent.
The proportion of the antistatic agent may be appropriately adjusted within a range set by arbitrarily combining the above-mentioned preferable lower limit value and upper limit value. For example, in one embodiment, the ratio is preferably 7.5 to 20 mass%, more preferably 8.5 to 20 mass%. However, this is just one example of the ratio.
[ resin ]
The antistatic composition (VI-2) and the resin contained in the antistatic base material include the same resins as those contained in the base material.
The resin contained in the antistatic composition (VI-2) and the antistatic base material may be one kind only, or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
In the antistatic composition (VI-2), the ratio of the content of the resin to the total content of all components except the solvent (i.e., the ratio of the content of the resin in the antistatic base material to the total mass of the antistatic base material) is preferably 30 to 99.9% by mass, more preferably 35 to 98% by mass, still more preferably 60 to 98% by mass, and particularly preferably 85 to 98% by mass. When the ratio is not less than the lower limit, the strength of the antistatic base material is further improved. By setting the ratio to the upper limit value or less, the content of the antistatic agent in the antistatic base material can be further increased.
[ photopolymerization initiator ]
When the antistatic composition (VI-2) contains the resin having energy ray curability, a photopolymerization initiator may be contained in order to efficiently advance the polymerization reaction of the resin.
Examples of the photopolymerization initiator contained in the antistatic composition (VI-2) include the same photopolymerization initiator as that contained in the adhesive composition (I-1).
The photopolymerization initiator contained in the antistatic composition (VI-2) may be one kind or two or more kinds, and when two or more kinds are used, the combination and ratio thereof may be arbitrarily selected.
The content of the photopolymerization initiator in the antistatic composition (VI-2) is not particularly limited, and may be appropriately selected according to the kind of the resin or the photopolymerization initiator.
[ additive, solvent ]
In addition to the antistatic agent, the resin and the photopolymerization initiator, the antistatic composition (VI-2) may contain various known additives such as a filler, a colorant, an antioxidant, an organic lubricant, a catalyst, and a softener (plasticizer) which are not the antistatic agent, the resin, and the photopolymerization initiator.
The additives contained in the antistatic composition (VI-2) include the same additives as those contained in the adhesive composition (I-1) (excluding antistatic agents).
In addition, in order to improve the fluidity of the antistatic composition (VI-2), the antistatic composition (VI-2) may contain a solvent.
The solvent contained in the antistatic composition (VI-2) is the same as the solvent contained in the adhesive composition (I-1).
The antistatic agent and the resin contained in the antistatic composition (VI-2) may be either one or two or more, and when two or more are used, the combination and the ratio thereof may be arbitrarily selected.
The content of the additive and the solvent of the antistatic composition (VI-2) is not particularly limited, and may be appropriately selected according to the kind thereof.
Process for the preparation of antistatic compositions (VI-2)
The antistatic composition (VI-2) can be obtained by blending the respective components for constituting the antistatic composition (VI-2), that is, by blending the antistatic agent, the resin, and, if necessary, components other than the antistatic agent and the resin, etc.
Except for the point that the blending components are different, the antistatic composition (VI-2) can be prepared by the same method as the above-described adhesive composition.
Surface antistatic layer
The surface antistatic layer is arranged in a different position in the solid wafer from the back antistatic layer, but has the same structure as the back antistatic layer. For example, the surface antistatic layer may be formed using the antistatic composition (VI-1) by the same method as the method for forming the back surface antistatic layer described above. Therefore, a detailed description of the surface antistatic layer is omitted.
When the solid chip has both the surface antistatic layer and the back antistatic layer, the surface antistatic layer and the back antistatic layer may be the same or different.
One embodiment of the die-bonding sheet is, for example, a die-bonding sheet comprising a base material and, laminated thereon in this order, an adhesive layer, an intermediate layer and a film-like adhesive,
[ tensile elastic modulus of the intermediate layer at 0 ]]The tensile elastic modulus of the substrate at 0 DEG C]The substrate has an antistatic layer on one or both surfaces of the substrate or the substrate has antistatic properties, and the surface resistivity of the outermost layer on the substrate side is 1.0X10 11 Ω/≡or less.
One embodiment of the die-bonding sheet is, for example, a die-bonding sheet comprising a base material and, laminated thereon in this order, an adhesive layer, an intermediate layer and a film-like adhesive,
[ tensile elastic modulus of the intermediate layer at 0 ]]The tensile elastic modulus of the substrate at 0 DEG C]The substrate having an antistatic layer on a surface thereof opposite to the adhesive layer side, the outermost layer of the substrate having a surface resistivity of 1.0X10 11 Ω/≡or less.
One embodiment of the die-bonding sheet is, for example, a die-bonding sheet comprising a base material and, laminated thereon in this order, an adhesive layer, an intermediate layer and a film-like adhesive,
[ tensile elastic modulus of the intermediate layer at 0 ]]The tensile elastic modulus of the substrate at 0 DEG C]The substrate having an antistatic property and the outermost layer of the substrate having a surface resistivity of 1.0X10 11 Ω/≡or less.
One embodiment of the die-bonding sheet is, for example, a die-bonding sheet comprising a base material and, laminated thereon in this order, an adhesive layer, an intermediate layer and a film-like adhesive,
[ tensile elastic modulus of the intermediate layer at 0 ]]The tensile elastic modulus of the substrate at 0 DEG C]The substrate has an antistatic layer on the surface on the adhesive layer side, and the surface resistivity of the outermost layer of the substrate is 1.0X10 11 Ω/≡or less.
Method for manufacturing solid wafer
The solid wafer can be manufactured by laminating the layers so that the layers are in a corresponding positional relationship. The formation method of each layer is the same as described above.
The solid wafer can be manufactured, for example, by: the base material, the adhesive layer, the intermediate layer, and the film-like adhesive are prepared in advance, and the base material, the adhesive layer, the intermediate layer, and the film-like adhesive are laminated in this order. At this time, the arrangement direction of the base material and the intermediate layer is adjusted as necessary so that the MD or TD of the base material and the intermediate layer becomes the target direction.
In addition, the stationary wafer can be manufactured by: more than 2 kinds of intermediate laminates each comprising a plurality of layers constituting a wafer are prepared in advance, and these intermediate laminates are bonded to each other. The structure of the intermediate laminate may be arbitrarily selected as appropriate. For example, a first intermediate laminate having a structure in which a base material and an adhesive agent are laminated, and a second intermediate laminate having a structure in which an intermediate layer and a film-like adhesive agent are laminated can be manufactured in advance, and the adhesive agent layer in the first intermediate laminate is bonded to the intermediate layer in the second intermediate laminate, thereby manufacturing a solid wafer. However, this manufacturing method is only one example.
In the case of producing a wafer carrier having a release film on a film-like adhesive, for example, the film-like adhesive may be produced on the release film, and the remaining layers may be laminated while maintaining the state of the film-like adhesive, thereby producing a wafer carrier; the base material, the adhesive layer, the intermediate layer, and the film-like adhesive may all be laminated, and then a release film may be laminated on the film-like adhesive to produce a solid wafer. The release film is removed at a necessary stage before the wafer is fixed.
The solid wafer having the layers other than the base material, the adhesive layer, the intermediate layer, the film-like adhesive and the release film can be produced by additionally forming the other layers at appropriate timing and laminating them in the above production method.
Method for using solid wafer (method for producing semiconductor chip with film-like adhesive)
In the manufacturing process of the semiconductor device, the die bond sheet may be used in manufacturing a semiconductor chip with a film-like adhesive.
Hereinafter, a method of using the die attach sheet (a method of manufacturing a semiconductor chip with a film-like adhesive) will be described in detail with reference to the accompanying drawings.
Fig. 3 is a cross-sectional view schematically illustrating a method for manufacturing a semiconductor chip as a use target of a die bonding sheet. Fig. 4 is a sectional view schematically illustrating a method of using the wafer holder. Here, a method of using the die bond 101 shown in fig. 1 will be described as an example.
First, before using the die bonding 101, as shown in fig. 3A, a semiconductor wafer 9 'is prepared, and a back grinding tape (surface protection tape) 8 is attached to the circuit forming surface 9 a'.
In FIG. 3, reference numeral W 9’ The width of the semiconductor wafer 9' is shown.
Next, as shown in fig. 3B, a laser beam (not shown) is irradiated so as to be focused on a focal point set in the semiconductor wafer 9', whereby a modified layer 90' is formed in the semiconductor wafer 9'.
Preferably, the laser light is irradiated toward the semiconductor wafer 9' from the back surface 9b ' side of the semiconductor wafer 9'.
Next, the rear surface 9b 'of the semiconductor wafer 9' is polished by a polishing machine (not shown). By this, the thickness of the semiconductor wafer 9 'is adjusted to the target value, and the semiconductor wafer 9' is divided at the formation portion of the modified layer 90 'by the force applied to the semiconductor wafer 9' at this time during polishing, thereby forming a plurality of semiconductor chips 9 as shown in fig. 3C.
In fig. 3, reference numeral 9a denotes a circuit forming surface of the semiconductor chip 9, corresponding to the circuit forming surface 9a 'of the semiconductor wafer 9'. Further, reference numeral 9b denotes a back surface of the semiconductor chip 9, corresponding to the polished back surface 9b 'of the semiconductor wafer 9'.
In summary, the semiconductor chip 9 as the object of use of the die bond sheet 101 can be obtained. More specifically, in this step, the semiconductor chip set 901 in which the plurality of semiconductor chips 9 are aligned and fixed can be obtained on the back grinding tape 8.
When the semiconductor chip set 901 is viewed from above and downward, a planar shape formed by connecting the outermost portions of the semiconductor chip set 901 (in this specification, such a planar shape is sometimes simply referred to as a "planar shape of the semiconductor chip set") is identical to a planar shape when the semiconductor wafer 9 'is viewed in the same manner, or a difference between the planar shapes is so slight as to be negligible that the planar shape of the semiconductor chip set 901 is substantially identical to the planar shape of the semiconductor wafer 9'.
Therefore, as shown in FIG. 3C, the width of the planar shape of the semiconductor chip set 901 can be regarded as the width W of the semiconductor wafer 9 9’ The same applies. Also, the maximum value of the width of the planar shape of the semiconductor chip set 901 can be regarded as the width W of the semiconductor wafer 9 9’ Is the same.
Although the semiconductor wafer 9 'is used to form the semiconductor chips 9 according to the purpose, a partial region of the semiconductor wafer 9' may not be divided into the semiconductor chips 9 depending on the conditions when the back surface 9b 'of the semiconductor wafer 9' is polished.
Next, using the semiconductor chip 9 (semiconductor chip set 901) obtained as described above, a semiconductor chip with a film-like adhesive was manufactured.
First, as shown in fig. 4A, while heating one wafer 101 from which the release film 15 is removed, the film-like adhesive 14 is attached to the back surfaces 9b of all the semiconductor chips 9 in the semiconductor chip set 901.
In this step, by using the die bond sheet 101, the die bond sheet 101 can be stably attached to the semiconductor chip 9 by the film-like adhesive 14 while being heated.
Width W of intermediate layer 13 in wafer 101 13 Maximum value of (2) and width W of film-like adhesive 14 14 Is equal to the width W of the semiconductor wafer 9 9’ The maximum values (in other words, the widths of the semiconductor chip sets 901) are identical or the errors are slight to almost identical although they are different.
More specifically, relative to W 13 Maximum value of (2) and W 14 Maximum value of W 9’ The maximum value of (2) is preferably 0.88 to 1.12 times, more preferably 0.9 to 1.1 times, particularly preferably 0.92 to 1.08 times. That is, [ W ] 9’ Maximum value of (2)]/[W 13 Maximum value of (2)]Values of [ W ] 9’ Maximum of (2)Value of]/[W 14 Maximum value of (2)]The values of (2) are each preferably from 0.88 to 1.12, more preferably from 0.9 to 1.1, particularly preferably from 0.92 to 1.08.
W 13 Maximum value and width W 9’ The difference ([ W ] between the maximum values of (a) 13 Maximum value of (2)]- [ width W ] 9’ Maximum value of (2)]) Preferably 0 to 10mm, W 14 Maximum value of (2) and W 9’ The difference ([ W ] between the maximum values of (a) 14 Maximum value of (2)]- [ width W ] 9’ Maximum value of (2)]) Preferably 0 to 10mm.
The heating temperature at the time of attaching the fixed wafer 101 is not particularly limited, but is preferably 40 to 70 ℃ in view of further improving the heat attaching stability of the fixed wafer 101.
Next, the back grinding tape 8 is removed from the semiconductor chip set in this fixed state. Then, as shown in fig. 4B, the edge-cooled solid wafer 101 is stretched in a direction parallel to the surface thereof (for example, the first face 12a of the adhesive layer 12), thereby expanding. Here, arrow E is used 1 Showing the direction of expansion of the wafer carrier 101. By expanding in this way, the film-like adhesive 14 can be cut along the outer periphery of the semiconductor chip 9.
According to this step, a film-adhesive semiconductor chip set 910 is obtained in which a plurality of film-adhesive semiconductor chips 914 are aligned and fixed on the intermediate layer 13, and the film-adhesive semiconductor chips 914 include the semiconductor chips 9 and the cut film-adhesive 140 provided on the back surface 9b of the semiconductor chips 9.
As described above, when the semiconductor wafer 9 'is divided, if a partial region of the semiconductor wafer 9' is not divided into the semiconductor chips 9, the region can be divided into the semiconductor chips by performing the present step.
The temperature of the wafer carrier 101 is preferably set to-5 to 5 ℃. By thus cooling and expanding the die carrier 101, the film-like adhesive 14 can be cut more easily and with high accuracy.
The expansion of the wafer 101 can be performed by a known method. For example, after fixing the region of the first surface 12a of the adhesive layer 12 of the die-bonding sheet 101 near the peripheral edge portion where the intermediate layer 13 and the film-like adhesive 14 are not laminated to a jig such as a ring frame, the entire region of the die-bonding sheet 101 where the intermediate layer 13 and the film-like adhesive 14 are laminated is pushed up from the substrate 11 side in the direction from the substrate 11 toward the adhesive layer 12, whereby the die-bonding sheet 101 can be expanded.
In fig. 4B, the non-laminated region of the first surface 12a of the adhesive layer 12, in which the intermediate layer 13 and the film-like adhesive 14 are not laminated, is almost parallel to the first surface 13a of the intermediate layer 13, but as described above, in a state in which the non-laminated region is expanded by pushing up the die carrier 101, the non-laminated region includes an inclined surface whose height gradually decreases as approaching the outer periphery of the adhesive layer 12 in a direction opposite to the pushing-up direction.
In this step, the width W of the intermediate layer 13 13 Maximum value of (2) and width W of semiconductor wafer 9 9’ When the difference between the maximum values is 0 to 10mm, a high effect of suppressing scattering beyond the purpose of the film-like adhesive 140 after cutting can be obtained. Here, the term "scattering of the cut film-like adhesive 140 out of the purpose" refers to a problem that the film-like adhesive 14, which is not originally attached to the semiconductor wafer 9' in the cut film-like adhesive 140 (such a peripheral portion is not shown in fig. 4), is scattered and attached to the circuit forming surface 9a of the semiconductor chip 9.
In this step, in the die bond sheet 101, the notch width can be sufficiently widened with respect to the elongation of the base material by setting the tensile elastic modulus ratio Ei '/Eb' to 0.5 or less, so that the film-like adhesive can be stably divided along the outer sides Zhou Qieduan of the semiconductor chips when the die bond sheet is expanded.
Next, as shown in fig. 4C, the laminate sheet of the base material 11, the adhesive layer 12, and the intermediate layer 13 derived from the wafer 101 is expanded in the direction parallel to the first surface 12a of the adhesive layer 12, and the peripheral edge portion of the semiconductor chip 914 (the semiconductor chip set 910 with a film-like adhesive) on which the film-like adhesive is not mounted in the laminate sheet is heated so as to maintain the state.
Here, arrow E is used 2 Representing the layerThe direction of expansion of the laminations. The direction of expansion of the laminate sheet is the same as the direction of expansion of the solid wafer 101 described above.
Here, the peripheral edge portion of the laminate sheet, which is the object of heating, is indicated by an arrow H. The peripheral edge portion as a heating target is included in the non-laminated region.
In the present embodiment, it is preferable that: after the expansion of the fixed wafer 101 at the time of cutting the film-like adhesive 14 is released, the expansion of the laminated sheet in this step is performed.
In this step, the laminate sheet can be expanded by the same method as that of the solid wafer 101 described above. For example, after fixing the region of the first surface 12a of the adhesive layer 12 in the laminate near the peripheral edge portion where the intermediate layer 13 is not laminated to a jig, the entire region of the laminate where the intermediate layer 13 is laminated is pushed up from the substrate 11 side in the direction from the substrate 11 toward the adhesive layer 12, whereby the laminate is expanded.
In fig. 4C, the non-laminated region (region including the peripheral edge indicated by arrow H) of the first surface 12a of the adhesive layer 12, where the intermediate layer 13 and the film-like adhesive 14 are not laminated, is almost parallel to the first surface 13a of the intermediate layer 13, but in a state where the laminated sheet is pushed up and expanded, the non-laminated region includes an inclined surface whose height gradually decreases as approaching the outer periphery of the adhesive layer 12 in a direction opposite to the push-up direction, as described above.
In this step, by using the die bond sheet 101, the peripheral edge portion can be contracted, and the distance between adjacent semiconductor chips 9, that is, the slit width can be sufficiently wide in the laminated sheet, and the slit width can be maintained with high uniformity. For example, in the present embodiment, the slit width after the step may be 10 μm or more, or all the slit widths may be 10 μm or more. Further, the difference between the maximum value and the minimum value among the plurality of slit widths can be set to 100 μm or less.
In this way, by making the slit width sufficiently wide and maintaining the slit width with high uniformity, as described later, the semiconductor chip with the film-like adhesive can be easily picked up.
The temperature of the semiconductor chip set 910 with the film-like adhesive is preferably set to a low temperature, for example, -15 to 0 ℃. By expanding the semiconductor chip set 910 with the film-like adhesive at such a temperature, the effect of making the kerf width wide enough and being able to maintain the kerf width with high uniformity is further improved.
After cutting the film-like adhesive 14, the semiconductor chip 914 with the film-like adhesive is separated from the intermediate layer 13 in the laminate sheet, and is picked up. At this time, as described above, by making the slit width sufficiently wide and having high uniformity, the semiconductor chip 914 with the film-like adhesive can be easily picked up. The semiconductor chip 914 with the film-like adhesive can be picked up by a known method.
The method of using the wafer holder 101 shown in fig. 1 is described here as an example, but the wafer holder of this embodiment may be used in the same manner. In this case, other steps may be added as needed based on the difference between the structures of the fixed wafer and the fixed wafer 101, and the method may be used.
As a preferred embodiment of the method for producing a semiconductor chip with a film-like adhesive, for example, a method for producing a semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip, the method comprising the steps of: a step of forming a modified layer inside a semiconductor wafer by irradiating laser light so as to focus on a focal point set inside the semiconductor wafer; a step of dividing the semiconductor wafer at a formation portion of the modified layer by polishing a back surface of the semiconductor wafer after the modified layer is formed, and simultaneously by using a polishing force applied to the semiconductor wafer, thereby obtaining a semiconductor chip set in which a plurality of semiconductor chips are aligned; attaching a film-like adhesive to the back surfaces of all the semiconductor chips in the semiconductor chip set while heating the die-bonding sheet; a step of stretching the die attach sheet attached to the semiconductor chip set in a direction parallel to the surface thereof while cooling the die attach sheet, thereby obtaining a film-adhesive-attached semiconductor chip set in which a plurality of semiconductor chips attached with the film-adhesive are aligned along the outer side Zhou Qieduan of the semiconductor chips; a step of expanding a laminate sheet of the base material, the adhesive layer, and the intermediate layer, which is derived from the die-attach sheet after the semiconductor chip set with the film-like adhesive is obtained, in a direction parallel to the surface of the adhesive layer, and further heating a peripheral edge portion of the semiconductor chip with the film-like adhesive, which is not placed in the laminate sheet, so as to maintain the state; and separating the semiconductor chip with the film-like adhesive from the intermediate layer in the laminated sheet after the peripheral edge portion is heated, thereby picking up the semiconductor chip with the film-like adhesive, wherein a difference between a maximum value of a width of the intermediate layer and a maximum value of a width of the semiconductor wafer is 0 to 10mm.
Examples
Hereinafter, the present invention will be described in more detail with reference to specific examples. The present invention is not limited to the examples shown below.
Preparation of adhesive composition
The raw materials used for preparing the adhesive composition are shown below.
[ Polymer component (a) ]
(a) -1: acrylic resin (weight average molecular weight 800000, glass transition temperature 9 ℃) obtained by copolymerizing methyl acrylate (95 parts by mass) and 2-hydroxyethyl acrylate (5 parts by mass).
[ epoxy resin (b 1) ]
(b1) -1: acryl-added cresol novolak type epoxy resin (Nippon Kayaku Co., ltd. "CNA147", epoxy equivalent 518g/eq, number average molecular weight 2100, unsaturated group content equivalent to epoxy group)
[ Heat curing agent (b 2) ]
(b2) -1: aralkyl type phenol resin (Mitsui Chemicals, inc. "Milex XLC-4L", number average molecular weight 1100, softening point 63 ℃ C.)
[ Filler (d) ]
(d) -1: spherical silica ("YA 050C-MJE", average particle size 50nm, methacryloylsilane treated product, manufactured by Admatech Co., ltd.)
[ coupling agent (e) ]
(e) -1: silane coupling agent, 3-glycidoxypropyl methyl diethoxysilane (KBE-402 manufactured by Xinyue organosilicon Co., ltd.)
[ Cross-linking agent (f) ]
(f) -1: toluene diisocyanate-based crosslinking agent (CORONATE L manufactured by TOSOH CORPORATION)
[ antistatic composition (as) ]
(as) -1: polypyrrole is emulsified by a reactive emulsifier and dissolved in an organic solvent to obtain a polypyrrole solution.
(as) -2: idemitsu Kosan Co., ltd., "UVH515"
Example 1
Manufacture of solid wafers
< manufacturing of substrate >)
A low-density polyethylene (LDPE, sumitomo Chemical co., ltd., "SUMIKATHENE L705"), manufactured by ltd. Was melted using an extruder, the melt was extruded by a T-die method, and the extrudate was biaxially stretched using a cooling roll, thereby obtaining a substrate (thickness 110 μm) made of LDPE.
< preparation of intermediate layer >)
An ethylene-vinyl acetate copolymer ("Ultrathene 636" manufactured by TOSOH CORPORATION) was melted using an extruder, the melt was extruded by a T-die method, the extrudate was biaxially stretched using a cooling roll, and a part was further cut, thereby obtaining an EVA intermediate layer (thickness 80 μm) having a circular planar shape (diameter 305 mm).
< preparation of adhesive layer >
An energy-free radiation curable adhesive composition containing an acrylic resin (TOYOCHEM co., ltd. Manufactured "oriband BPS 6367X") (100 parts by mass) and a crosslinking agent (TOYOCHEM co., ltd. Manufactured "BXX 5640") (1 part by mass) as the adhesive resin (I-1 a) was prepared.
Next, a release film obtained by subjecting one surface of a polyethylene terephthalate film to release treatment by silicone treatment was used, and the adhesive composition obtained above was applied to the release treated surface of the release film, and was dried by heating at 100 ℃ for 2 minutes, thereby producing a non-energy-ray-curable adhesive layer (thickness 10 μm).
< preparation of film-like adhesive >
A thermosetting adhesive composition containing a polymer component (a) -1 (100 parts by mass), an epoxy resin (b 1) -1 (10 parts by mass), a thermosetting agent (b 2) -1 (1.5 parts by mass), a filler (d) -1 (75 parts by mass), a coupling agent (e) -1 (0.5 part by mass), and a crosslinking agent (f) -1 (0.5 part by mass) was prepared.
Next, a release film obtained by subjecting one surface of a polyethylene terephthalate film to release treatment by silicone treatment was used, the adhesive composition obtained above was applied to the release treated surface of the release film, and the film was dried by heating at 80 ℃ for 2 minutes, and a part of the film was further cut, whereby a thermosetting film-like adhesive (thickness 20 μm) having a circular planar shape (diameter 305 mm) was obtained.
< manufacturing of solid chip >
An exposed surface of the adhesive layer obtained above, which is opposite to the side provided with the release film, is bonded to one surface of the base material obtained above.
And bonding an exposed surface of the obtained film-like adhesive on the opposite side to the side provided with the release film to one surface of the obtained intermediate layer. At this time, the film-like adhesive and the intermediate layer are concentrically arranged.
Next, the release film was removed from the laminate of the release film, the adhesive layer, and the base material (corresponding to the first intermediate laminate with release film described above), and the newly produced exposed surface of the adhesive layer was bonded to the exposed surface of the intermediate layer in the laminate of the release film, the film-like adhesive, and the intermediate layer (corresponding to the second intermediate laminate with release film described above). At this time, the arrangement direction of the base material and the intermediate layer is adjusted so that the MD of the base material coincides with the MD of the intermediate layer (in other words, the TD of the base material coincides with the TD of the intermediate layer). In summary, a wafer with a release film was obtained, which was composed of a base material (thickness 110 μm), an adhesive layer (thickness 10 μm), an intermediate layer (thickness 80 μm), a film-like adhesive (thickness 20 μm) and a release film laminated in this order along the thickness direction thereof.
Manufacture of semiconductor chips with film-like adhesive
A semiconductor wafer having a circular planar shape, a diameter of 300mm and a thickness of 775 μm was used, and a back grinding tape ("Adwill E-3100TN" manufactured by LINTEC Corporation) was attached to the circuit forming surface of the semiconductor wafer.
Next, a laser irradiation device (a "DFL73161" manufactured by DISCO Corporation) is used to irradiate a laser beam so as to focus on a focal point set in the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer. In this case, the focal point is set so that a plurality of semiconductor chips having a size of 8mm×8mm can be obtained from the semiconductor wafer. The semiconductor wafer 9 is irradiated with laser light from the back surface side of the semiconductor wafer.
Then, the back surface of the semiconductor wafer was polished by using a polishing machine so that the thickness of the semiconductor wafer became 30 μm, and the semiconductor wafer was divided at the formation site of the modified layer by using the polishing force applied to the semiconductor wafer at this time, thereby forming a plurality of semiconductor chips. Thus, a semiconductor chip set in which a plurality of semiconductor chips are aligned and fixed is obtained on the back grinding tape.
Next, a film-like adhesive was attached to the back surfaces of all the semiconductor chips (semiconductor chip sets) while heating one solid wafer obtained as described above to 60 ℃ using a tape bonder (LINTEC Corporation, "Adwill RAD 2500"). Next, the peripheral edge portion included in the non-laminated region in the adhesive layer of the die-bonding sheet attached to the semiconductor chip set is attached to the ring-shaped frame, whereby the semiconductor chip set having the back grinding tape on the circuit forming surface and the die-bonding sheet on the back surface is fixed.
Next, the back grinding tape is removed from the semiconductor chip set in the fixed state. Then, the film-like adhesive was cut along the outer periphery of the semiconductor chip by expanding the die-bonding sheet in a direction parallel to the surface thereof while cooling the die-bonding sheet in an environment of 0 ℃ using a fully automatic die-cutting machine (DDS 2300 manufactured by DISCO Corporation). At this time, the peripheral edge portion of the die-bonding sheet was fixed, and the entire region of the die-bonding sheet in which the intermediate layer and the film-like adhesive were laminated was pushed up by a height of only 15mm from the substrate side of the die-bonding sheet, thereby expanding the die-bonding sheet.
Thus, a semiconductor chip set with film adhesive is obtained in which a plurality of semiconductor chips with film adhesive including the semiconductor chips and the film adhesive after cutting provided on the back surface thereof are aligned and fixed on the intermediate layer.
Then, after the spread of the die-bonding sheet is temporarily released, the laminated sheet composed of the laminated base material, the adhesive layer and the intermediate layer is spread in a direction parallel to the first surface of the adhesive layer at room temperature. Further, the peripheral edge portion of the semiconductor chip with the film-like adhesive is heated in the laminate sheet so as to maintain the expanded state. Thereby, the peripheral edge portion is contracted, and the slit width between adjacent semiconductor chips is kept at a constant value or more in the laminated sheet.
Evaluation of substrate
Calculation of the heating-time change Rate, the Cooling-time change Rate and the comprehensive Change Rate of Displacement
The substrate obtained above was subjected to thermomechanical analysis (TMA) by using a thermomechanical analysis device ("TMA 4000SA" manufactured by Bruker AXS corporation) according to the procedure shown below.
That is, first, a test piece was produced by cutting the base material into a size of 4.5mm×15 mm.
Next, the test piece was set in the thermal mechanical analyzer, and TMA was performed so as not to change the temperature of the test piece, with the load applied to the test piece being set at 2g, whereby the MD displacement X was measured when the temperature of the test piece was 23 ℃ 0 . The temperature rise rate was set at 20℃per minute and the load was set at 2g, and the displacement was measuredX 0 The temperature of the test piece after the temperature rise to 70 ℃ and TMA was performed before the temperature rise was completed, thereby measuring the maximum value X of the MD displacement amount of the test piece during the temperature rise 1 . The load was set to 2g, and the displacement X was measured 1 Cooling the test piece at 23deg.C, and performing TMA before cooling, thereby measuring minimum value X of MD displacement of the test piece during cooling 2 。
Next, the above X is used 0 、X 1 X is X 2 Based on the above equations (1), (2) and (3), the change rate at heating, the change rate at cooling and the overall change rate of the displacement amount of the MD of the test piece are calculated.
Further, in the TD of the test piece, the change rate at heating, the change rate at cooling, and the integrated change rate of the displacement amount were calculated in the same manner.
The results are shown in Table 1.
< determination of tensile elastic modulus Eb)
From the base material obtained above, test pieces having a width of 15mm were cut.
Then, the temperature of the installation position of the test piece of the testing machine was maintained at 0 ℃ in advance, and the test piece was installed at the installation position.
Next, the tensile modulus Eb' of the test piece in the elastic deformation region at 0 ℃ was measured by stretching the test piece with the collet pitch set at 100mm, the temperature maintained at 0 ℃ and the stretching speed set at 200mm/min using tenston.
Further, in the TD of the test piece at 0 ℃, the tensile elastic modulus Eb' was also measured in the same manner.
The results are shown in Table 1.
Evaluation of intermediate layer
< determination of tensile elastic modulus Ei)
From the intermediate layer obtained above, test pieces having a width of 15mm were cut.
Next, the tensile elastic modulus Ei' of MD and TD at 0 ℃ was measured on the test piece of the intermediate layer by the same method as the test piece of the base material.
The results are shown in Table 1.
Calculation of the tensile elastic modulus ratio Ei'/Eb
The tensile elastic modulus ratio Ei '/Eb' in both directions of MD of the base material and the intermediate layer and TD of the base material and the intermediate layer was calculated using the tensile elastic modulus Eb 'and the measured value of the tensile elastic modulus Ei' obtained as described above.
The results are shown in Table 1.
Evaluation of solid wafer
< cutting Property of film-like adhesive >
In manufacturing the above-described semiconductor chip with a film-like adhesive, the obtained semiconductor chip set with a film-like adhesive was observed from above the semiconductor chip side of the semiconductor chip set using a digital microscope (manufactured by KEYENCE CORPORATION, "VH-Z100"). Then, it was confirmed that, when the film-like adhesive was normally cut by the expansion of the die-bonding sheet, the number of actually formed cut lines and the number of incompletely formed cut lines were among the cut lines of the film-like adhesive extending in the MD of the intermediate layer and the cut lines of the film-like adhesive extending in the TD of the intermediate layer, which should be formed, and the cutting property of the film-like adhesive was evaluated according to the following evaluation criteria. The results are shown in Table 1.
(evaluation criterion)
A: the total number of cut lines of the practically non-formed film-like adhesive and cut lines of the incompletely formed film-like adhesive is 5 or less.
B: the total number of the cut lines of the practically non-formed film-like adhesive and the cut lines of the incompletely formed film-like adhesive is 6 or more.
< fly-away inhibition of film-like adhesive >
In evaluating the cutting property of the film-like adhesive, the semiconductor chip set with the film-like adhesive was visually observed from above the semiconductor chip side of the semiconductor chip set. Then, whether or not the scattered film-like adhesive after cutting was adhered to the circuit-forming surface of the semiconductor chip was confirmed, and the scattering suppression property of the film-like adhesive was evaluated according to the following evaluation criteria. The results are shown in Table 1.
(evaluation criterion)
A: the number of semiconductor chips on which the film-like adhesive was attached to the circuit-forming surface was found to be 0.
B: the number of semiconductor chips on the circuit-forming surface to which the film-like adhesive was attached was observed to be 1 or more.
Incision retention >
In manufacturing the semiconductor chip with the film-like adhesive, the laminate was expanded at normal temperature, and the peripheral edge portion of the laminate was heated, and thereafter, notch retention was evaluated by the following method.
That is, when the film-like adhesive is normally cut by the expansion of the die bond sheet, in the semiconductor chip set with the film-like adhesive after the expansion, the plurality of cuts extending in the MD of the intermediate layer and the plurality of cuts extending in the TD of the intermediate layer are formed in a grid shape. The slit width in MD and the slit width in TD of the intermediate layer were measured from above the semiconductor chip side of the semiconductor chip set with the film-like adhesive using a digital microscope (manufactured by KEYENCE CORPORATION) at 5 positions in total: a central intersection (also referred to as a "first intersection" in this specification) corresponding to a substantially central portion of the silicon wafer before dicing, among intersection (in other words, orthogonal portions) of the slit extending in the MD of the intermediate layer and the slit extending in the TD of the intermediate layer; 2 intersecting portions (in this specification, also referred to as "second intersecting portions" and "fourth intersecting portions" respectively) located closest to the outer periphery of the silicon wafer before division and located at the same position as the central intersecting portion (first intersecting portion) in the TD of the intermediate layer; and 2 intersecting portions (also referred to as "third intersecting portions" and "fifth intersecting portions" in the present specification) located closest to the outer periphery of the silicon wafer before division and located at the same position as the central intersecting portion (first intersecting portion) in the MD of the intermediate layer. That is, the number of measured values of the slit width at each intersection was 1 and 2 in each of the MD and TD, and the total number of measured values of the slit width was 10 at 5 intersections.
Fig. 5 shows the measurement position of the slit width at this time. In fig. 5, reference numeral 7 denotes a semiconductor chip, reference numeral 79a denotes a slit extending along the MD of the intermediate layer, and reference numeral 79b denotes a slit extending along the TD of the intermediate layer. When the die bond used is the die bond shown in fig. 1, the first surface 13a of the intermediate layer 13 is exposed in the notch 79a and the notch 79 b. Also, reference numeral W a1 、W a2 、W a3 、W a4 W and W a5 Each represents the width of the slit extending in the MD of the intermediate layer (in other words, the slit width of the TD at the intersection), reference numeral W b1 、W b2 、W b3 、W b4 W and W b5 Each represents the width of the slit extending along the TD of the intermediate layer (in other words, the slit width of the MD at the intersection). Determination of incision width W a1 W and W b1 Is the first intersection. In addition, the slit width W was measured a2 W and W b2 The intersection of (1) is the second intersection, and the incision width W is measured a4 W and W b4 The intersection of (2) is the fourth intersection. In addition, the slit width W was measured a3 W and W b3 The intersection of the pair of slits is the third intersection, and the slit width W is measured a5 W and W b5 Is the fifth intersection.
Fig. 5 is a plan view schematically showing a semiconductor chip set with a film-like adhesive for explaining the measurement position of the slit width, and shows a case where the slit width is constant wherever it is, but this is merely an example. Even in the same semiconductor chip set with a film-like adhesive, the kerf width may vary depending on the kerf position, and in each of the examples and comparative examples, even in the same semiconductor chip set with a film-like adhesive, the kerf width may vary.
Then, based on the above 10 incision width measurement values, incision retention was evaluated according to the following evaluation criteria. The results are shown in Table 1.
(evaluation criterion)
A: the slit widths are measured to be 10 μm or more, and the difference between the maximum value and the minimum value of the measured values is 100 μm or less.
B: a measured value of 1 or more slit widths of less than 10 μm; or the measured value of the incision width is more than 10 mu m, and the difference between the maximum value and the minimum value of the measured value exceeds 100 mu m.
< surface resistivity >
The film-like adhesive in the cured wafer was thermally cured at 130 ℃ for 2 hours.
Next, the surface resistivity was measured on the surface of the substrate on the side opposite to the adhesive layer side using a surface resistivity meter (R12704 Resistivity chamber manufactured by ADVANTEST CORPORATION) with an applied voltage of 100V. The results are shown in the column of "surface resistivity (Ω/≡)", in table 1.
< semiconductor chip with film-like adhesive, floating between intermediate layers >)
The semiconductor chip set with a film adhesive obtained after the process of the full-automatic die bonder (DDS 2300 manufactured by DISCO Corporation) was visually inspected from the substrate side (non-semiconductor chip side) to confirm whether or not the semiconductor chip with a film adhesive was lifted from the middle.
(evaluation criterion)
A: semiconductor chip with film-like adhesive does not float
B: of 100 semiconductor chips with film-like adhesive, some slightly developed floating
Example 2
Production of solid wafer, production of semiconductor chip with film-like adhesive, evaluation of substrate, evaluation of intermediate layer, and evaluation of solid wafer
A solid wafer and a semiconductor chip with a film-like adhesive were produced in the same manner as in example 1 except that the diameter of the intermediate layer was changed to 310mm instead of 305mm, and the substrate, the intermediate layer and the solid wafer were evaluated. The results are shown in Table 1.
Example 3
Manufacture of solid wafers
< manufacturing of substrate >)
Polypropylene (PP, prime Polymer co., ltd. Manufactured "Prime Polypro F-744 NP") was melted using an extruder, the melt was extruded using a T-die method, and the extrudate was biaxially stretched using a cooling roll, thereby obtaining a PP-made substrate (thickness 50 μm).
Manufacture of semiconductor chips with film-like adhesive
A die bond sheet and a film-like adhesive-attached semiconductor chip were produced in the same manner as in example 1, except that the PP base material obtained above was used instead of the LDPE base material.
Evaluation of substrate and evaluation of solid wafer
The substrate and the solid wafer obtained above were evaluated by the same method as in example 1. The results are shown in Table 1.
Example 4
A die and a semiconductor chip with a film-like adhesive were manufactured in the same manner as in example 1 except that the diameter of the intermediate layer was 320mm instead of 305mm, and the intermediate layer and the die were evaluated. The results are shown in Table 1.
Example 5
Manufacture of solid wafers
< manufacturing of substrate >)
The antistatic composition (AS) -1 was applied to the surface of the substrate obtained in example 1 on the side opposite to the adhesive layer side, and dried at 100 ℃ for 2 minutes, thereby producing a substrate having a back antistatic layer (AS 1) formed on the substrate to a thickness of 75 nm.
A solid wafer with a release film was produced by laminating an antistatic layer, a substrate, an adhesive layer, an intermediate layer, a film-like adhesive and a release film in this order in the thickness direction by the same method AS in example 1, except that the substrate having the back surface antistatic layer (AS 1) obtained above was used instead of the substrate made of LDPE.
Manufacture of semiconductor chips with film-like adhesive
Using the obtained solid wafer, a semiconductor chip with a film-like adhesive was manufactured in the same manner as in example 1.
Evaluation of substrate, evaluation of intermediate layer and evaluation of solid wafer
The substrate, intermediate layer and solid wafer were evaluated in the same manner as in example 1. The results are shown in Table 2.
Example 6
< manufacturing of substrate >)
Using the antistatic composition (AS) -2 instead of the antistatic composition (AS) -1, a substrate having a back antistatic layer (AS 2) formed with a thickness of 170nm was manufactured.
Using this base material, a solid wafer with a release film was produced in the same manner as in example 5.
Manufacture of semiconductor chips with film-like adhesive
Using the obtained solid wafer, a semiconductor chip with a film-like adhesive was manufactured in the same manner as in example 5.
Evaluation of substrate, evaluation of intermediate layer and evaluation of solid wafer
The substrate, intermediate layer and solid wafer were evaluated in the same manner as in example 1. The results are shown in Table 2.
Example 7
Manufacture of solid wafers
< manufacturing of antistatic substrate >
To a composition containing a urethane acrylate resin and a photopolymerization initiator in a ratio of the content of the photopolymerization initiator to the content of the urethane acrylate resin of 3.0 mass%, a phosphonium ionic liquid (ionic liquid formed of a phosphonium salt) was blended as an antistatic agent, and the resultant was stirred to obtain an energy ray-curable antistatic composition. In this case, the antistatic composition had a content of the antistatic agent of 9.0% by mass based on the total content of the antistatic agent and the urethane acrylate resin.
Next, the antistatic composition obtained above was applied to a process film made of polyethylene terephthalate (produced by TORAY INDUSTRIES, INC., "Lumiror T60 PET 50T-60 Torry", product having a thickness of 50 μm) by a fountain die (fountain die) method to form a coating film having a thickness of 80. Mu.m. Then, an antistatic substrate made of an antistatic agent and a urethane acrylate resin was obtained by ultraviolet curing the substrate using an ultraviolet irradiation device (EYE GRAPHICS co., ltd., "ECS-401 GX") and a high-pressure mercury lamp (EYE GRAPHICS co., ltd., "H04-L41").
A solid wafer with a release film was produced in the same manner as in example 1, except that the antistatic substrate obtained above was used instead of the substrate made of LDPE.
Manufacture of semiconductor chips with film-like adhesive
Using the obtained solid wafer, a semiconductor chip with a film-like adhesive was manufactured in the same manner as in example 1.
Evaluation of substrate, evaluation of intermediate layer and evaluation of solid wafer
The substrate, intermediate layer and solid wafer were evaluated in the same manner as in example 1. The results are shown in Table 2.
Comparative example 1
Manufacture of solid wafers
< manufacturing of substrate >)
An ethylene-vinyl acetate copolymer ("Ultrathene 636" manufactured by TOSOH CORPORATION) was melted using an extruder, the melt was extruded using a T-die method, and the extrudate was biaxially stretched using a cooling roll, thereby obtaining an EVA-made substrate (thickness 120 μm).
Manufacture of semiconductor chips with film-like adhesive
A die bond sheet and a film-like adhesive semiconductor chip were produced in the same manner as in example 1, except that the EVA substrate obtained above was used instead of the LDPE substrate.
Evaluation of substrate and evaluation of solid wafer
The substrate and the solid wafer obtained above were evaluated by the same method as in example 1. The results are shown in Table 2.
Comparative example 2
< preparation of intermediate layer >)
An intermediate layer (thickness 70 μm) of a polymer alloy of PE and EVA (hereinafter referred to as "PE/EVA") having a circular planar shape (diameter 305 mm) was obtained by melting a low-density polyethylene (LDPE, sumitomo Chemical co., ltd. Manufactured by SUMIKATHENE L705, 50 parts by mass) and an ethylene-vinyl acetate copolymer (EVA, manufactured by TOSOH CORPORATION, "Ultrathene 636",20 parts by mass) using an extruder, extruding the melt by a T-die method, biaxially stretching the extrudate using a cooling roll, and further cutting a part.
Manufacture of semiconductor chips with film-like adhesive
A die and a semiconductor chip with a film-like adhesive were manufactured in the same manner as in example 1, except that the intermediate layer made of PE/EVA obtained as described above was used instead of the intermediate layer made of EVA.
Evaluation of intermediate layer and solid wafer
The intermediate layer and the solid wafer obtained above were evaluated by the same method as in example 1. The results are shown in Table 2.
TABLE 1
TABLE 2
From the above results, it is clear that in examples 1 to 7, the film-like adhesive in the wafer carrier was excellent in both the cutting property and the notch holding property.
In examples 1 to 2 and 4 to 6, eb' was 90MPa in MD and 104MPa in TD. Ei' is 25MPa in MD and 33MPa in TD. As a result, ei '/Eb' was 0.28 in MD and 0.32 in TD.
In example 3, eb' was 65MPa in MD and 67MPa in TD. Ei' is 25MPa in MD and 33MPa in TD. As a result, ei '/Eb' was 0.38 in MD and 0.49 in TD.
In example 7, eb' was 100MPa in MD and 100MPa in TD. Ei' is 25MPa in MD and 33MPa in TD. As a result, ei '/Eb' was 0.25 in MD and 0.33 in TD.
In examples 1 to 2 and 4 to 6, the rate of change in displacement of the base material (test piece) upon heating was 0.8% in MD and 0.7% in TD. In example 7, the rate of change in displacement of the substrate (test piece) upon heating was 0.8% in MD and 0.8% in TD.
In examples 1 to 2 and 4 to 6, the change rate of the displacement amount of the base material (test piece) upon cooling was-1.9% in both MD and TD. In example 7, the rate of change in displacement of the base material (test piece) upon cooling was-1.8% in both MD and TD.
In examples 1 to 2 and 4 to 6, the overall change rate of the displacement amount of the base material (test piece) was-1.1% in the MD and-1.2% in the TD. In example 7, the overall rate of change in the displacement of the base material (test piece) was-1.0% in both MD and TD.
Among them, since the difference was larger than 10mm (20 mm) in example 4, the film-like adhesive was inferior in the scattering suppression property in example 4.
On the other hand, in examples 1 to 3 and 5 to 7, the difference between the diameter of the intermediate layer and the diameter of the semiconductor wafer was 10mm or less (5 to 10 mm), and therefore the film-like adhesive was excellent in the scattering suppression property.
In example 3, the rate of change in displacement of the substrate (test piece) upon heating was 2.9% in TD.
In example 3, the overall rate of change in the displacement amount of the base material (test piece) was 1.5% in TD.
In contrast, in comparative examples 1 and 2, the film-like adhesive in the wafer carrier had poor cutting properties and notch retention properties.
In comparative example 1, eb' was 25MPa in MD and 33MPa in TD. Ei' is 25MPa in MD and 33MPa in TD. As a result, ei '/Eb' was 1.00 in both MD and TD.
In comparative example 2, eb' was 90MPa in MD and 104MPa in TD. Ei' was 63MPa in MD and 55MPa in TD. As a result, ei '/Eb' was 0.70 in MD and 0.53 in TD.
In comparative example 1, the rate of change in displacement of the base material (test piece) upon cooling was-2.8% in MD.
In comparative example 1, the overall rate of change in the displacement amount of the base material (test piece) was-2.6% in MD.
In examples 5 to 7, since the substrate having the back surface antistatic layer formed thereon or the antistatic substrate was used as the substrate, the surface resistivity was 1.0X10 11 Ω/≡or less.
In contrast, in examples 1 to 4, comparative examples 1 and 2, since the substrate having the back surface antistatic layer formed thereon or the antistatic substrate was not used as the substrate, the surface resistivity was larger than 1.0X10 11 Ω/□。
In examples 1 to 4, comparative example 1 and comparative example 2, which were not provided with antistatic properties, foreign substances were mixed between the stage and the die holder due to the influence of static electricity or the like in the process of the "DDS2300" manufactured by the fully automatic die bonder (DISCO Corporation), a step was generated between the portion where the foreign substances were present and the portion where the foreign substances were not present, and the semiconductor chip with the film-like adhesive was peeled off from the intermediate layer, and as a result, the chip was lifted locally, and finally the chip was scattered.
In contrast, in examples 5 to 7 to which antistatic properties were imparted, foreign substances were not likely to be mixed between the stage and the die holder, and chip floating was not generated.
Industrial applicability
The invention can be used for manufacturing semiconductor devices.
Description of the reference numerals
101: fixing the wafer; 11: a substrate; 12: an adhesive layer; 13: an intermediate layer; 14: a film-like adhesive; w (W) 13 : the width of the intermediate layer; w (W) 14 : width of the film-like adhesive.
Claims (3)
1. A die set comprising a base material, an adhesive layer, an intermediate layer and a film-like adhesive laminated in this order on the base material,
the value of [ the tensile elastic modulus of the intermediate layer at 0 ℃ per the tensile elastic modulus of the base material at 0 ℃ is 0.5 or less,
the intermediate layer is made of ethylene-vinyl acetate copolymer.
2. A solid wafer according to claim 1, wherein the intermediate layer has a maximum width of 150 to 160mm, 200 to 210mm or 300 to 310mm.
3. A method for manufacturing a semiconductor chip with a film-like adhesive, the semiconductor chip with a film-like adhesive comprising a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip, the method comprising the steps of:
A step of forming a modified layer inside a semiconductor wafer by irradiating laser light so as to focus on a focal point set inside the semiconductor wafer;
a step of dividing the semiconductor wafer at a formation portion of the modified layer by polishing a back surface of the semiconductor wafer after the modified layer is formed, and simultaneously by using a polishing force applied to the semiconductor wafer, thereby obtaining a semiconductor chip set in which a plurality of semiconductor chips are aligned;
attaching a film-like adhesive to the back surfaces of all the semiconductor chips in the semiconductor chip set while heating the die holder sheet according to claim 1 or 2;
a step of stretching the die attach sheet attached to the semiconductor chip set in a direction parallel to the surface thereof while cooling the die attach sheet, thereby obtaining a film-adhesive-attached semiconductor chip set in which a plurality of semiconductor chips attached with the film-adhesive are aligned along the outer side Zhou Qieduan of the semiconductor chips;
a step of expanding a laminate sheet of the base material, the adhesive layer, and the intermediate layer, which is derived from the die-attach sheet after the semiconductor chip set with the film-like adhesive is obtained, in a direction parallel to the surface of the adhesive layer, and further heating a peripheral edge portion of the semiconductor chip with the film-like adhesive, which is not placed in the laminate sheet, so as to maintain the state; and
A step of separating the film-adhesive-attached semiconductor chip from the intermediate layer in the laminate sheet after the peripheral edge portion is heated, thereby picking up the film-adhesive-attached semiconductor chip,
the difference between the maximum value of the width of the intermediate layer and the maximum value of the width of the semiconductor wafer is 0 to 10mm.
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| JP2019041886 | 2019-03-07 | ||
| JP2019-041886 | 2019-03-07 | ||
| PCT/JP2020/009580 WO2020179897A1 (en) | 2019-03-07 | 2020-03-06 | Die-bonding sheet and method for manufacturing semiconductor chip with film-like adhesive |
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| JP2009231699A (en) * | 2008-03-25 | 2009-10-08 | Furukawa Electric Co Ltd:The | Wafer processing tape |
| JP2013172021A (en) * | 2012-02-21 | 2013-09-02 | Sekisui Chem Co Ltd | Dicing-die bonding tape and manufacturing method of semiconductor chip with adhesive layer |
| CN108028190A (en) * | 2015-10-29 | 2018-05-11 | 古河电气工业株式会社 | The processing method of semiconductor wafer surface protection adhesive tape and semiconductor crystal wafer |
| WO2018083982A1 (en) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | Dicing die bonding sheet and method for producing semiconductor chip |
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| JPS5946650B2 (en) * | 1976-05-18 | 1984-11-14 | 株式会社サンノ− | Livestock manure solid-liquid separator |
| JPS5946650U (en) | 1982-09-20 | 1984-03-28 | 株式会社ダイフク | pallet feeder |
| JP2011174042A (en) * | 2010-02-01 | 2011-09-08 | Nitto Denko Corp | Film for producing semiconductor device and method for producing semiconductor device |
| JP6012602B2 (en) * | 2011-07-25 | 2016-10-25 | リンテック株式会社 | Base film for semiconductor processed sheet, semiconductor processed sheet, and method for manufacturing semiconductor device |
| JP5117629B1 (en) | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | Adhesive tape for wafer processing |
| JP6077922B2 (en) | 2012-12-10 | 2017-02-08 | 日東電工株式会社 | Dicing tape integrated adhesive sheet, semiconductor device manufacturing method using dicing tape integrated adhesive sheet, and semiconductor device |
| JP6875865B2 (en) * | 2017-01-12 | 2021-05-26 | リンテック株式会社 | Manufacturing method for semiconductor processing sheets and semiconductor devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231699A (en) * | 2008-03-25 | 2009-10-08 | Furukawa Electric Co Ltd:The | Wafer processing tape |
| JP2013172021A (en) * | 2012-02-21 | 2013-09-02 | Sekisui Chem Co Ltd | Dicing-die bonding tape and manufacturing method of semiconductor chip with adhesive layer |
| CN108028190A (en) * | 2015-10-29 | 2018-05-11 | 古河电气工业株式会社 | The processing method of semiconductor wafer surface protection adhesive tape and semiconductor crystal wafer |
| WO2018083982A1 (en) * | 2016-11-01 | 2018-05-11 | リンテック株式会社 | Dicing die bonding sheet and method for producing semiconductor chip |
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| JP7141515B2 (en) | 2022-09-22 |
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| JP2022125110A (en) | 2022-08-26 |
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| JPWO2020179897A1 (en) | 2020-09-10 |
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