WO2021157262A1 - コンデンサ - Google Patents

コンデンサ Download PDF

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Publication number
WO2021157262A1
WO2021157262A1 PCT/JP2020/049228 JP2020049228W WO2021157262A1 WO 2021157262 A1 WO2021157262 A1 WO 2021157262A1 JP 2020049228 W JP2020049228 W JP 2020049228W WO 2021157262 A1 WO2021157262 A1 WO 2021157262A1
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WO
WIPO (PCT)
Prior art keywords
bus bar
capacitor
electrode
capacitor element
case
Prior art date
Application number
PCT/JP2020/049228
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智香 薮内
正仁 佐野
綾華 中田
喜 劉
柏林 丁
晃弘 尾崎
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2021575663A priority Critical patent/JP7611516B2/ja
Priority to CN202080095183.3A priority patent/CN115039188B/zh
Publication of WO2021157262A1 publication Critical patent/WO2021157262A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Definitions

  • the present invention relates to a capacitor.
  • the capacitor element When the capacitor is energized, the capacitor element generates heat.
  • the capacitor element since the capacitor element is embedded in the filling resin, heat is not easily released from the capacitor element.
  • both end faces of the capacitor element can be covered by the portions of the bus bar connected to the electrodes, the heat generated from both end faces is easily released by moving the bus bar having good thermal conductivity. Since the peripheral surface of the capacitor element is rarely covered by the bus bar portion, it is difficult to dissipate heat.
  • a capacitor having the above configuration can be mounted on an inverter device for driving an electric motor.
  • a large current tends to flow from the power supply device to the inverter device, a large current tends to flow to the capacitor element, and the heat generation of the capacitor element tends to increase. Therefore, if the heat dissipation from the capacitor element is insufficient as described above, there is a possibility that the capacitor element may have a problem such as thermal damage.
  • an object of the present invention is to provide a capacitor capable of enhancing heat dissipation from a capacitor element.
  • the main aspect of the present invention relates to a capacitor.
  • the capacitor according to this embodiment includes a capacitor element, a first bus bar and a second bus bar connected to each electrode provided on both end surfaces of the capacitor element, a case in which the capacitor element is housed, and a case in which the capacitor element is housed. It is provided with a filling resin to be filled in.
  • the first bus bar and the second bus bar cover the electrode, extend out of the filling resin from the electrode connecting portion connected to the electrode and one end of the electrode connecting portion, and fill the filling resin.
  • a first extending portion having a connection terminal connected to an external terminal in a portion exposed from the resin is included.
  • At least one of the first bus bar and the second bus bar is provided with a second extending portion extending along the peripheral surface of the capacitor element from an end different from the one end of the electrode connecting portion.
  • FIG. 1A is a perspective view of the film capacitor according to the embodiment
  • FIG. 1B is a side sectional view of the film capacitor according to the embodiment in which the filling resin is omitted.
  • 2A and 2B are perspective views of the capacitor element unit as viewed from the front upper side and the rear lower side, respectively, according to the embodiment.
  • 3 (a) and 3 (b) are perspective views of the first bus bar and the second bus bar according to the embodiment, respectively.
  • FIG. 4A is a perspective view of the case viewed from the front upper side according to the embodiment
  • FIG. 4B is a perspective view of the case viewed from the front lower side according to the embodiment.
  • FIG. 5 (a) and 5 (b) are side sectional views of the film capacitor in which the filling resin is omitted according to the modified example.
  • FIG. 6 is a side sectional view of the film capacitor in which the filling resin is omitted according to the modified example.
  • FIG. 7A is a side sectional view of the film capacitor according to another embodiment.
  • 7 (b) and 7 (c) are a front view and a rear view of the capacitor element unit according to another embodiment, respectively.
  • 8 (a) and 8 (b) are side views of a capacitor element unit according to a modified example of another embodiment.
  • the film capacitor 1 which is an embodiment of the capacitor of the present invention, will be described with reference to the drawings.
  • each figure is appropriately marked with front-back, left-right, and up-down directions.
  • the direction shown is only a relative direction of the film capacitor 1 and does not indicate an absolute direction.
  • names may be given according to the directions shown in the drawings.
  • the film capacitor 1 corresponds to the "capacitor” described in the claims.
  • the first electrode 110 and the second electrode 120 correspond to the “electrode” described in the claims.
  • the electrode terminal portions 210 and 310 correspond to the “electrode connection portion” described in the claims.
  • the terminal forming portions 220 and 320 correspond to the "first extending portion” described in the claims.
  • the heat dissipation unit 330 corresponds to the "second extension unit” described in the claims.
  • FIG. 1A is a perspective view of the film capacitor 1
  • FIG. 1B is a side sectional view of the film capacitor 1 in which the filling resin 500 is omitted.
  • the film capacitor 1 includes five capacitor elements 100, a first bus bar 200, a second bus bar 300, a case 400, and a filling resin 500.
  • the condenser element unit 10 is configured by assembling the five condenser elements 100, the first bus bar 200, and the second bus bar 300 so as to be integrated.
  • the capacitor element unit 10 is housed in the case 400, and the filling resin 500 is filled in the case 400.
  • the filling resin 500 is a thermosetting resin, for example, an epoxy resin. The portion of the capacitor element unit 10 buried in the filling resin 500 is protected from moisture and impact by the case 400 and the filling resin 500.
  • FIGS. 2 (a) and 2 (b) are perspective views of the capacitor element unit 10 as viewed from the front upper side and the rear lower side, respectively.
  • 3A and 3B are perspective views of the first bus bar 200 and the second bus bar 300, respectively.
  • the five capacitor elements 100 are formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or laminating the stacked metallized films, and pressing them in a flat shape.
  • the capacitor element 100 has a shape close to a flat long cylinder.
  • the first electrode 110 is formed on one end face 101 by spraying a metal such as zinc
  • the second electrode 120 is formed on the other end face 102 by spraying a metal such as zinc.
  • NS a metal such as zinc
  • the capacitor element 100 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, metallization in which other metals such as zinc and magnesium are vapor-deposited. It may be formed of a film. Alternatively, the capacitor element 100 may be formed of a metallized film in which a plurality of metals are vapor-deposited among these metals, or may be formed of a metallized film in which an alloy of these metals is vapor-deposited. ..
  • one end surface 101 that is, the first electrode 110 of the five capacitor elements 100 faces upward
  • the other end surface 102 that is, the second electrode 120 faces downward
  • the peripheral surfaces 103 of each other are arranged in a row in the left-right direction so that they are next to each other.
  • the first bus bar 200 and the second bus bar 300 are electrically connected to the first electrode 110 and the second electrode 120 of the five capacitor elements 100, respectively.
  • the first bus bar 200 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which the electrode terminal portion 210 and the terminal forming portion 220 are integrated.
  • the first bus bar 200 is an N-pole bus bar.
  • the electrode terminal portion 210 has a rectangular plate shape, and is in contact with the first electrode 110 of the five capacitor elements 100 so as to cover almost the entire first electrode 110 from above. That is, the front and rear ends of the electrode terminal portion 210 extend to the front and rear ends of the five capacitor elements 100. Further, the left end of the electrode terminal portion 210 extends to the vicinity of the left end of the capacitor element 100 at the left end, and the right end of the electrode terminal portion 210 extends to the vicinity of the right end of the capacitor element 100 at the right end.
  • the electrode terminal portion 210 is formed with five openings 211 arranged in the left-right direction so as to correspond to each first electrode 110.
  • a pair of connecting pins 212 are formed on the trailing edge of each opening 211.
  • a pair of corresponding connection pins 212 come into contact with each first electrode 110 and are joined by a joining method such as soldering. Since the thickness of each connection pin 212 is smaller than the thickness of other portions of the electrode terminal portion 210, heat is less likely to be absorbed by the connection pin 212, and soldering or the like is facilitated.
  • the terminal forming portion 220 has the same left-right width as the electrode terminal portion 210, extends straight upward from the rear end of the electrode terminal portion 210, then bends, and extends rearward so as to tilt slightly upward.
  • Connection terminals 221 are formed at three locations at the tip of the terminal forming portion 220.
  • Each connection terminal 221 has a shape in which the tip portion is bent upward after being extended rearward while maintaining the same angle as the tip portion of the terminal forming portion 220.
  • a circular mounting hole 221a is formed at the tip of each connection terminal 221.
  • the portion of the terminal forming portion 220 other than the three connection terminals 221 is a relay portion 222 that connects the electrode terminal portion 210 and the three connection terminals 221.
  • the first bus bar 200 four U-shaped notches 231 arranged in the left-right direction are formed at the front end portion of the electrode terminal portion 210.
  • the second bus bar 300 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which an electrode terminal portion 310, a terminal forming portion 320, and a heat radiating portion 330 are integrated.
  • the second bus bar 300 is a P-pole bus bar.
  • the electrode terminal portion 310 has a rectangular plate shape and contacts the second electrode 120 of the five capacitor elements 100 so as to cover almost the entire second electrode 120 from below. That is, the front and rear ends of the electrode terminal portion 310 extend to the front and rear ends of the five capacitor elements 100. Further, the left end of the electrode terminal portion 310 extends to the vicinity of the left end of the capacitor element 100 at the left end, and the right end of the electrode terminal portion 310 extends to the vicinity of the right end of the capacitor element 100 at the right end.
  • the electrode terminal portion 310 is formed with five openings 311 arranged in the left-right direction so as to correspond to each second electrode 120.
  • a pair of connecting pins 312 are formed on the trailing edge of each opening 311.
  • a pair of corresponding connection pins 312 come into contact with each of the second electrodes 120 and are joined by a joining method such as soldering. Since the thickness of each connection pin 312 is smaller than the thickness of the other portion of the electrode terminal portion 310, heat is less likely to be absorbed by the connection pin 312, and soldering or the like is facilitated.
  • the terminal forming portion 320 has the same left-right width as the electrode terminal portion 310, extends upward from the rear end of the electrode terminal portion 310 along the peripheral surface 103 on the rear side of the five capacitor elements 100, and extends upward along the peripheral surface 103. It bends forward above, extends slightly upward, then bends, and extends backward so that it tilts slightly upward.
  • Connection terminals 321 are formed at three locations at the tip of the terminal forming portion 320. Each connection terminal 321 has a shape in which the tip portion is bent upward after being extended rearward while maintaining the same angle as the tip portion of the terminal forming portion 320.
  • a circular mounting hole 321a is formed at the tip of each connection terminal 321.
  • Each connection terminal 321 is located to the right of each connection terminal 221 of the first bus bar 200.
  • the portion of the terminal forming portion 320 other than the three connection terminals 321 is a relay portion 322 that connects the electrode terminal portion 310 and the three connection terminals 321.
  • the heat radiating portion 330 has a rectangular plate shape having the same width on the left and right as the electrode terminal portion 310, and extends upward from the front end of the electrode terminal portion 310 along the peripheral surface 103 on the front side of the five capacitor elements 100. ..
  • the front end of the electrode terminal portion 310 is an end (end edge along the alignment direction) in a direction orthogonal to the direction in which the five capacitor elements 100 are arranged, and is different from the end (rear end) in which the terminal forming portion 320 extends. ..
  • the heat radiating unit 330 displays the peripheral surfaces 103 of the five capacitor elements 100 by more than half from the end face 102 side, that is, the second electrode 120 side. More specifically, it covers almost two-thirds (see FIG. 1 (b)).
  • the peripheral surface 103 of the capacitor element 100 is equally divided into three regions of the end surface 101 side, the central portion, and the end surface 102 side in the thickness direction, the central region is covered by the heat radiating portion 330.
  • the heat radiating unit 330 covers the entire peripheral surface 103 of the three inner capacitor elements 100 in the direction in which the capacitor elements 100 are arranged, and more than half of the peripheral surfaces 103 of the capacitor elements 100 on the left and right ends, more specifically, Cover almost two-thirds.
  • the heat radiating unit 330 is close to the peripheral surface 103 of each capacitor element 100 with a slight gap (see FIG. 1 (b)).
  • the heat radiating unit 330 may be in close contact with the peripheral surface 103 of each capacitor element 100 in a state of being in contact with the peripheral surface 103.
  • a predetermined distance L equal to or larger than the space distance (insulation distance) required for insulation is provided between the position of the tip of the heat radiating portion 330 and the position of the first electrode 110 (see FIG. 1 (b)).
  • the distance L be close to the spatial distance so that the peripheral surface 103 of the capacitor element 100 is covered with the heat radiating portion 330 more.
  • the second bus bar 300 In the second bus bar 300, four circular openings 341 arranged in the left-right direction are formed in the relay portion 322 of the terminal forming portion 320. Further, in the second bus bar 300, four oval-shaped openings 342 arranged in the left-right direction are formed at a corner between the electrode terminal portion 310 and the terminal forming portion 320, and the electrode terminal portion 310 and the heat radiating portion are formed. At the corner between the 330 and the 330, four square openings 343 arranged in the left-right direction are formed. Further, in the second bus bar 300, square fitting pieces 344 are formed at the left and right ends of the relay portion 322.
  • the relay portion 222 of the first bus bar 200 and the upper portion of the relay portion 322 of the second bus bar 300 overlap in the thickness direction thereof. This is expected to reduce the ESL (equivalent series inductance) in the capacitor element unit 10.
  • the first insulating sheet 610 is sandwiched between the overlapping portion of the relay portion 222 of the first bus bar 200 and the relay portion 322 of the second bus bar 300. Further, the relay portion 222 of the first bus bar 200 is covered with three second insulating sheets 620 from above. Further, the relay portion 322 of the second bus bar 300 is covered with the third insulating sheet 630 from below.
  • the first insulating sheet 610, the second insulating sheet 620, and the third insulating sheet 630 are formed of an insulating paper or a resin material having electrical insulating properties such as acrylic and silicon.
  • the first insulating sheet 610 secures the insulating property between the first bus bar 200 and the second bus bar 300, the insulating property between the second bus bar 300 and the first electrode 110 of the capacitor element 100, and the like. Further, in a state where the film capacitor 1 is installed in an external device such as an inverter device by the second insulating sheet 620 and the third insulating sheet 630, between the first bus bar 200 and the second bus bar 300 and the surrounding electrical components. Insulation is ensured.
  • FIG. 4A is a perspective view of the case 400 viewed from the front upper side
  • FIG. 4B is a perspective view of the case 400 viewed from the front lower part.
  • the case 400 is made of resin and is formed of, for example, polyphenylene sulfide (PPS) which is a thermoplastic resin.
  • PPS polyphenylene sulfide
  • the case 400 is formed in a box shape having a substantially rectangular parallelepiped shape, and has a bottom surface portion 401, a front side surface portion 402 rising from the bottom surface portion 401, a rear side surface portion 403, a left side surface portion 404, and a right side surface portion 405, and the upper surface is open.
  • First mounting tabs 410 are provided at the left and right ends of the left side surface portion 404, the right side surface portion 405, and the bottom surface portion 401.
  • An insertion hole 411 is formed in each first mounting tab 410.
  • a metal collar 412 is fitted into the insertion hole 411 to increase the strength of the hole.
  • second mounting tabs 420 are provided at the central portion and the left and right end portions.
  • a metal nut 421 is embedded in the second mounting tab 420. The first mounting tab 410 and the second mounting tab 420 are used when the film capacitor 1 is fixed to the installation portion of the external device.
  • a fitting groove 430 extending in the vertical direction is formed by a pair of ribs at the lower part of the rear end of the left side surface portion 404 and the right side surface portion 405.
  • the width of the fitting groove 430 is substantially equal to the thickness of the fitting piece 344 of the second bus bar 300. Note that FIG. 4A shows only the fitting groove 430 on the left side.
  • the capacitor element unit 10 When the film capacitor 1 is assembled, the capacitor element unit 10 is housed in the case 400 as shown in FIG. 1 (b). At this time, the left and right fitting pieces 344 of the second bus bar 300 are fitted into the left and right fitting grooves 430 of the case 400. As a result, the capacitor element unit 10 is not tilted in the front-back, left-right, and up-down directions with respect to the case 400.
  • one end surface 101 that is, the first electrode 110 and the electrode terminal portion 210 of the first bus bar 200 face the opening 400a side of the case 400
  • the other end surface 102 that is, the second electrode 120 and the second electrode 100. 2
  • the electrode terminal portion 310 of the bus bar 300 faces the bottom surface portion 401 of the case 400.
  • the relay portion 322 of the terminal forming portion 320 of the second bus bar 300 approaches the inner wall surface of the rear side surface portion 403 of the case 400 with a slight gap. Further, the heat radiating portion 330 of the second bus bar 300 is along the inner wall surface of the front side surface portion 402 of the case 400 and is close to the inner wall surface with a slight gap. The relay unit 322 and the heat radiating unit 330 may be configured to come into contact with the inner wall surface.
  • the filling resin 500 in the liquid phase state is injected into the case 400.
  • the filling resin 500 passes through the notch 231 of the first bus bar 200 and the openings 341, 342, and 343 of the second bus bar 300, the filling resin 500 can be easily distributed throughout the inside of the case 400.
  • the case 400 is heated. As a result, the filling resin 500 in the case 400 is cured.
  • the film capacitor 1 is completed as shown in FIG. 1 (a).
  • the terminal forming portion 220 of the first bus bar 200 extends out of the filling resin 500, and its three connection terminals 221 are exposed from the filling resin 500.
  • the terminal forming portion 320 of the second bus bar 300 extends out of the filling resin 500, and its three connection terminals 321 are exposed from the filling resin 500.
  • the film capacitor 1 can be mounted on, for example, an inverter device for driving an electric motor in an electric vehicle.
  • DC power is supplied to the Invar device from the power supply device (battery).
  • the inverter device includes an inverter circuit including an IGBT (Insulated Gate Bipolar transistor), converts DC power into three-phase AC power, and supplies it to an electric motor.
  • IGBT Insulated Gate Bipolar transistor
  • External terminals (not shown) connected to the power supply device corresponding to the connection terminal 221 at the right end of the first bus bar 200 and the connection terminal 321 at the right end of the second bus bar 300 are screwed using mounting holes 221a and 321a, respectively. Connected by.
  • external terminals (not shown) connected to the inverter circuit corresponding to each of the three first connection terminal portions 220 of the first bus bar 200 and the three first connection terminal portions 320 of the second bus bar 300 are attached. It is connected by screwing using holes 221a and 321a. External terminals of both the power supply device and the inverter device are connected to the connection terminal 221 at the right end of the first bus bar 200 and the connection terminal 321 at the right end of the second bus bar 300.
  • a cooler 2 is attached to the rear side surface portion 403 of the case 400 in order to enhance the heat dissipation effect of the film capacitor 1 installed in the inverter device (see FIG. 1 (b)).
  • the cooler 2 for example, a water-cooled cooler can be used.
  • the five capacitor elements 100 When the film capacitor 1 is energized by the operation of the inverter device, the five capacitor elements 100 generate heat. In the five capacitor elements 100, the three capacitor elements 100 inside the left and right end capacitor elements 100, particularly the central capacitor element 100, tend to become hot due to the heat generation.
  • each capacitor element 100 The heat generated from the end face 101 of each capacitor element 100 is transferred to the electrode terminal portion 210 of the first bus bar 200, and most of the heat is transferred from the electrode terminal portion 210 to the relay portion 222 of the terminal forming portion 220 and relayed. It is discharged to the outside from the exposed portion from the filling resin 500 of the portion 222. Part of the heat transferred to the electrode terminal portion 210 may be released to the outside from the opening 400a of the case 400 via the filling resin 500 above the electrode terminal portion 210.
  • the heat generated from the end surface 102, the front peripheral surface 103, and the rear peripheral surface 103 of each capacitor element 100 is the relay portion of the electrode terminal portion 310, the heat radiating portion 330, and the terminal forming portion 320 of the second bus bar 300, respectively. It is transmitted to 322.
  • the relay portion 322 close to the rear side surface portion 403 of the case 400 is cooled by the cooler 2, that is, endothermic. Therefore, the heat transferred to the relay unit 322 is released to the cooler 2, and most of the heat transferred to the electrode terminal unit 310 and the heat radiating unit 330 moves to the relay unit 322 and is released to the cooler 2.
  • NS A part of the heat transferred to the electrode terminal portion 310 and the heat radiating portion can be transferred to the bottom surface portion 401 and the front side surface portion 402, respectively, and can be released to the outside from the bottom surface portion 401 and the front side surface portion 402, respectively.
  • the cooler 2 may be mounted on the bottom surface 401.
  • the electrode terminal portion 310 of the second bus bar 300 is cooled by the cooler 2, and the heat transferred to the heat radiating portion 330 and the relay portion 322 is transferred to the electrode terminal portion 310.
  • the cooler 2 may not be attached to the film condenser 1.
  • most of the heat transferred to the electrode terminal portion 310, the heat radiating portion 330, and the relay portion 322 of the second bus bar 300 is released to the outside from the portion exposed from the filling resin 500 of the relay portion 322, and the remaining heat is released to the outside.
  • the bottom surface portion 401, the front side surface portion 402, and the rear side surface portion 403 of the case 400 are discharged to the outside.
  • the film capacitor 1 is filled from the electrode terminal portions 210 and 310 in which the first bus bar 200 and the second bus bar 300 cover the electrodes 110 and 120 and are connected to the electrodes 110 and 120, and from the rear ends of the electrode terminal portions 210 and 310.
  • the second bus bar 300 includes an electrode terminal, which includes terminal forming portions 220 and 320 having connection terminals 221, 321 connected to an external terminal in a portion exposed from the filling resin 500 while extending to the outside of the resin 500.
  • a heat radiating portion 330 extending from the front end of the portion 310 along the peripheral surface 103 of the capacitor element 100 is provided.
  • the heat radiating portion 330 is provided on the second bus bar 300, heat is easily radiated not only from both end surfaces 101 and 102 of the capacitor element 100 but also from the peripheral surface 103, so that the film capacitor 1 is energized. It is possible to prevent the capacitor element 100 from becoming hot at times, and to prevent thermal damage to the capacitor element 100.
  • the film capacitor 1 is configured such that the heat radiating portion 330 is aligned with the inner wall surface of the case 400.
  • the heat transferred to the heat radiating unit 330 is easily transferred to the inner wall surface and is easily released to the outside of the case 400 through the inner wall surface, so that the heat is more easily radiated from the capacitor element 100.
  • the film capacitor 1 is configured such that the heat radiating portion 330 extends from the front end which is the end of the electrode connecting portion 310 in the direction orthogonal to the direction in which the capacitor elements 100 are arranged.
  • the peripheral surface 103 of the inner capacitor element 100 which tends to become hot because it is sandwiched between the capacitor elements 100 at the left and right ends, can be covered by the heat radiating portion 330, the inner capacitor element 100 can be covered.
  • the heat dissipation can be improved and the high temperature can be suppressed.
  • the film capacitor 1 is configured such that a predetermined distance L is provided between the position of the tip of the heat radiating portion 330 of the second bus bar 300 and the position of the first electrode 110 to which the first bus bar 200 is connected. There is.
  • the heat dissipation of the capacitor element 100 can be improved while ensuring the insulation between the second bus bar 300 and the first electrode 110.
  • the capacitor element 100 is housed in the case 400 so that the second electrode 120 to which the second bus bar 300 is connected faces the bottom surface 401 of the case 400, and the terminal of the second bus bar 300 is formed.
  • the portion 320 is exposed from the filling resin 500 after extending along the peripheral surface 103 of the capacitor element 100, and the heat radiating portion 330 is provided on the second bus bar 300 of the first bus bar 200 and the second bus bar 300. It is composed.
  • the film capacitor 1 when installed in an external device, it is cooled to a side surface portion (rear side surface portion 403) facing a portion along the peripheral surface 103 of the bottom surface portion 401 of the case 400 or the terminal forming portion 320.
  • the second bus bar 300 can be cooled (heat absorbed) by mounting the container 2, and the heat transferred to the heat radiating section 330 is transferred to the heat radiating section 330 by providing the heat radiating section 330 on the side of the second bus bar 300 that can be cooled by the cooler 2. Effectively released. As a result, heat can be effectively dissipated from the peripheral surface 103 of the capacitor element 100, so that the temperature of the capacitor element 100 is less likely to become high.
  • the first bus bar 200 is not provided with the heat radiating unit
  • the second bus bar 300 is provided with the heat radiating unit 330.
  • the second bus bar 300 may not be provided with the heat radiating unit 330
  • the first bus bar 200 may be provided with the same heat radiating unit 230 as the heat radiating unit 330.
  • the heat radiating portion 230 extends downward from the front end of the electrode terminal portion 210 of the first bus bar 200 along the peripheral surface 103 of the capacitor element 100, and for insulation between the position of the tip thereof and the position of the second electrode 120. Distance L is provided.
  • heat radiating portions 230 and 330 are provided on both the first bus bar 200 and the second bus bar 300, respectively.
  • the peripheral surface 103 of the capacitor element 100 is covered by more than half of the heat radiating portions 230 and 330 of both.
  • the tips of both heat radiating portions 230 and 330 hang on the central region of the peripheral surface 103, and a part of the central region is covered by the heat radiating portions 230 and 330.
  • a distance L for insulation is provided between the tips of both heat radiating portions 230 and 330, and the insulating property between the first bus bar 200 and the second bus bar 300 is ensured.
  • the lengths of both heat radiating portions 230 and 330 in the thickness direction of the capacitor element 100 may be the same or different.
  • both the first bus bar 200 and the second bus bar 300 can be cooled by the cooler 2 by mounting the cooler 2 on the front side surface portion 402 of the case 400. ..
  • a predetermined distance L is provided between the position of the tip of the heat radiating portion 330 of the second bus bar 300 and the first electrode 110 of the capacitor element 100.
  • the tip of the heat radiating portion 330 is extended to the position of the first electrode 110, that is, the entire peripheral surface 103 is covered with the radiating portion 330 in the thickness direction of the capacitor element 100, and the radiating portion A configuration may be adopted in which the fourth insulating sheet 640 is sandwiched between the tip portion of the 330 and the capacitor element 100. In this configuration, the fourth insulating sheet 640 ensures the insulating property between the second bus bar 300 and the first electrode 110.
  • the tip of the heat radiating portion 230 is extended to the position of the second electrode 120 as in the configuration of FIG. 4 A configuration may be adopted in which the insulating sheet 640 is sandwiched.
  • FIG. 7A is a side sectional view of the film capacitor 1A according to another embodiment.
  • 7 (b) and 7 (c) are a front view and a rear view of the capacitor element unit 20 according to another embodiment, respectively.
  • the film capacitor 1A corresponds to the "capacitor” described in the claims.
  • the first electrode 711 and the second electrode 712 correspond to the “electrode” described in the claims.
  • the electrode terminal portions 721 and 731 correspond to the "electrode connection portion” described in the claims.
  • the terminal forming portions 722 and 732 correspond to the "first extending portion” described in the claims.
  • the heat dissipation unit 723 corresponds to the "second extension unit” described in the claims.
  • the film capacitor 1A is filled in a capacitor element unit 20 in which a first bus bar 720 and a second bus bar 730 are connected to five capacitor elements 710, a rectangular parallelepiped case 740 in which the capacitor element unit 20 is housed, and a case 740.
  • the filling resin 750 to be used is provided.
  • the case 740 is made of a resin such as PPS, and the filling resin 750 is made of a thermosetting resin such as an epoxy resin.
  • the capacitor element unit 20 is housed in the case 740 so that the first electrode 711 and the second electrode 712 of the five capacitor elements 710 face the front side surface portion 741 and the rear side surface portion 742 of the case 740, respectively.
  • the first bus bar 720 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which an electrode terminal portion 721, a terminal forming portion 722, and a heat radiating portion 723 are integrated.
  • the electrode terminal portion 721 has a rectangular plate shape, and contacts the first electrode 711 of the five capacitor elements 710 so as to cover the entire first electrode 711 from the front.
  • the electrode terminal portion 721 is formed with five openings 724 arranged in the left-right direction so as to correspond to each first electrode 710.
  • a pair of connecting pins 725 are formed on the upper edge of each opening 724.
  • a pair of corresponding connection pins 725 come into contact with each first electrode 711 and are joined by a joining method such as soldering.
  • the terminal forming portion 722 extends rearward from the upper end of the electrode terminal portion 721, then bends and extends upward.
  • Square connection terminals 726 are formed at three locations at the tip of the terminal forming portion 722.
  • a circular mounting hole 726a is formed at the tip of each connection terminal 726.
  • the heat radiating portion 723 has a rectangular plate shape having the same width on the left and right as the electrode terminal portion 721, and is rearward along the lower peripheral surface 710a of the five capacitor elements 710 from the lower end of the electrode terminal portion 721. Extend.
  • the lower end of the electrode terminal portion 721 is an end in a direction orthogonal to the direction in which the five capacitor elements 710 are arranged, and is different from the end (upper end) where the terminal forming portion 722 extends.
  • the heat radiating unit 723 covers the peripheral surfaces 710a of the five capacitor elements 710 in the thickness direction of the capacitor element 100 from the first electrode 711 side by more than half, more specifically, about two-thirds. Further, the heat radiating unit 723 covers the entire peripheral surface 710a of the five capacitor elements 710 in the direction in which the capacitor elements 710 are lined up. Further, the heat radiating unit 723 comes into contact with the peripheral surface 103 of each capacitor element 710.
  • a predetermined distance L equal to or larger than the space distance (insulation distance) required for insulation is provided between the position of the tip of the heat radiating portion 723 and the position of the second electrode 712. As a result, the insulating property between the first bus bar 720 and the second electrode 712 is ensured.
  • the heat radiating portion 723 is along the inner wall surface of the front side surface portion 741 of the case 740 and is close to the inner wall surface with a slight gap.
  • the second bus bar 730 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which the electrode terminal portion 731 and the terminal forming portion 732 are integrated.
  • the electrode terminal portion 731 has a rectangular plate shape, and contacts the second electrode 712 of the five capacitor elements 710 so as to cover the entire second electrode 712 from the rear.
  • the electrode terminal portion 731 is formed with five openings 733 arranged in the left-right direction so as to correspond to each second electrode 712.
  • a pair of connecting pins 734 are formed on the upper edge of each opening 733.
  • a pair of corresponding connection pins 734 come into contact with each second electrode 712 and are joined by a joining method such as soldering.
  • the terminal forming portion 732 extends upward from the upper end of the electrode terminal portion 731.
  • Square connection terminals 735 are formed at three locations at the tip of the terminal forming portion 732.
  • a circular mounting hole 735a is formed at the tip of each connection terminal 735.
  • Each connection terminal 735 is located to the left of each connection terminal 726 of the first bus bar 720.
  • An insulating sheet 760 is sandwiched between the terminal forming portion 722 of the first bus bar 720 and the terminal forming portion 732 of the second bus bar 730. As a result, the insulation between the first bus bar 200 and the second bus bar 300 is ensured.
  • the film capacitor 1A is installed in an external device such as an inverter device. At this time, the cooler 2 is mounted on the front side surface portion 741 of the case 740 of the film capacitor 1A.
  • the film capacitor 1A of the present embodiment also has the same effect as the film capacitor 1 of the above embodiment.
  • the first bus bar 720 is not provided with the heat radiating unit 723, and the second bus bar 730 has the same heat radiating unit 723 as the heat radiating unit 723. 736 may be provided. Further, as shown in FIG. 8B, heat dissipation units 723 and 736 may be provided on both the first bus bar 720 and the second bus bar 730, respectively.
  • the tip of the heat radiating portion 723 is extended to the position of the second electrode 712, and between the tip portion of the heat radiating portion 723 and the capacitor element 710.
  • a configuration may be adopted in which an insulating sheet is sandwiched.
  • the peripheral surfaces 103 of all five capacitor elements 100 are covered by the heat radiating unit 330.
  • the capacitor elements 100 at both the left and right ends are less likely to reach a high temperature. Therefore, when the heat dissipation of the capacitor elements 100 at both the left and right ends is good, a configuration may be adopted in which only the peripheral surfaces 103 of the three inner capacitor elements 100 are covered by the heat dissipation unit 330.
  • first bus bar 200 and the second bus bar 300 are provided with three connection terminal portions 221 and 321.
  • the number of connection terminals 221 and 321 may be changed as appropriate.
  • the first bus bar 200 is an N-pole bus bar
  • the second bus bar 300 is a P-pole bus bar
  • the first bus bar 200 may be a P-pole bus bar
  • the second bus bar 300 may be an N-pole bus bar.
  • the film capacitor 1 is provided with four capacitor elements 100.
  • the number of the capacitor elements 100 can be changed as appropriate, including the case where the number of the capacitor elements is one.
  • the capacitor element 100 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, and winding or laminating the stacked metallized films.
  • these capacitor elements 100 may be formed by laminating a metallized film in which aluminum is vapor-deposited on both sides of a dielectric film and an insulating film, and winding or laminating them.
  • the film capacitor 1 is mentioned as an example of the capacitor of the present invention.
  • the present invention can also be applied to capacitors other than the film capacitor 1.
  • the terms such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and indicate the vertical direction and the horizontal direction. It does not indicate the absolute direction such as.
  • the present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, electrical components of vehicles, and the like.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2020/049228 2020-02-07 2020-12-28 コンデンサ WO2021157262A1 (ja)

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WO2024106227A1 (ja) * 2022-11-18 2024-05-23 株式会社デンソー コンデンサ装置
WO2025089220A1 (ja) * 2023-10-26 2025-05-01 株式会社デンソー 電気機器

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JPS62134225U (enrdf_load_stackoverflow) * 1986-02-19 1987-08-24
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JPS58150823U (ja) * 1982-04-01 1983-10-08 株式会社村田製作所 積み重ね形セラミツクコンデンサ
JPS62134225U (enrdf_load_stackoverflow) * 1986-02-19 1987-08-24
JP2014203893A (ja) * 2013-04-02 2014-10-27 トヨタ自動車株式会社 コンデンサモジュール
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US20190108945A1 (en) * 2016-08-29 2019-04-11 Bayerische Motoren Werke Aktiengesellschaft Electrode Cooled Capacitor Assembly
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WO2024106227A1 (ja) * 2022-11-18 2024-05-23 株式会社デンソー コンデンサ装置
WO2025089220A1 (ja) * 2023-10-26 2025-05-01 株式会社デンソー 電気機器

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CN115039188A (zh) 2022-09-09
JP7611516B2 (ja) 2025-01-10
JPWO2021157262A1 (enrdf_load_stackoverflow) 2021-08-12

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