WO2021135356A1 - 一种电子模块及电子设备 - Google Patents

一种电子模块及电子设备 Download PDF

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Publication number
WO2021135356A1
WO2021135356A1 PCT/CN2020/113830 CN2020113830W WO2021135356A1 WO 2021135356 A1 WO2021135356 A1 WO 2021135356A1 CN 2020113830 W CN2020113830 W CN 2020113830W WO 2021135356 A1 WO2021135356 A1 WO 2021135356A1
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WIPO (PCT)
Prior art keywords
terminals
terminal
component
circuit board
electronic module
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Application number
PCT/CN2020/113830
Other languages
English (en)
French (fr)
Inventor
李永耀
许仕彬
康伟
王峰
冯雪
朱江
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2022540550A priority Critical patent/JP7387007B2/ja
Publication of WO2021135356A1 publication Critical patent/WO2021135356A1/zh
Priority to US17/852,581 priority patent/US12114418B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • This application relates to the field of electronic technology, and in particular to an electronic module and electronic equipment.
  • the signal connection between the two components is realized through a plurality of terminals; and each terminal has a bending part, and the elastic contact with the component is realized through the bending part.
  • the angle between the extension direction of the bent portion of the terminal and the relative sliding direction of the two components during assembly is usually 45°, so that the bending of each terminal during the relative sliding of the two components
  • the part is prone to offset under the action of the friction of the components in contact, which leads to changes in the spacing between different terminals.
  • FIG. 1 is a schematic diagram of an electronic module in the prior art.
  • a component 10 includes a packaging substrate 12 and a chip 11 mounted on the packaging substrate 12, and the component 20 includes a circuit board 22 and a mounting base on the circuit board 22 21.
  • the package substrate 12 is electrically connected to the circuit board through a plurality of terminals 30 passing through the mounting base 21; wherein, referring to FIG.
  • each terminal 30 includes a main body 32 and a bent portion 31 connected to one end of the main body 32 , And a solder ball 33 connected to the other end of the main body portion 32, the main body portion 32 is fixed in the mounting base 21, the solder ball 33 is connected to the pad on the circuit board 22, and the bent portion 31 is on the mounting surface S1 of the circuit board 22
  • the extension direction of the orthographic projection is the extension direction T of the bent portion 31; before the package substrate 12 is installed, a top view of some of the terminals 30 in Figure 1 is shown in Figure 3a.
  • the present application provides an electronic module and electronic device to alleviate the technical problem of the change in the terminal spacing between the two components when the two components are sliding relative to each other, so that the two components pass through the terminal at a higher height. It has better signal integrity when transmitting data at a speed of 1%.
  • an electronic module is provided.
  • the electronic module is used in electronic devices such as mobile phones, computers, or switches, and includes a first component, a second component, and a plurality of terminals;
  • the first component is slidably fitted with the second component along the first preset direction and can be locked at the first set position relative to the second component, wherein the surface of the first component facing the second component has a plurality of first components.
  • each terminal corresponds to at least part of the plurality of first pads, each terminal includes a main body and a first bent portion connected to the main body, wherein the main body and the second The components are fixedly connected, and the first bending portion abuts against the corresponding first pad; when the first component slides relative to the second component along the first preset direction, the first bending applied to each terminal by the first component
  • the moment of friction of the main body is less than or equal to the torque applied by the main body to the first bending part; therefore, for each terminal, the first component is not easy to drive the first bending part to rotate around the corresponding main body.
  • the distance between the first bent parts of the terminals is not easy to change, the differential impedance of each terminal pair is not easy to become large, and the crosstalk between different terminal pairs is not easy to increase.
  • SI Signal Integrity
  • each terminal when the main body and the first bent part are made of common materials such as copper alloy and phosphor bronze, and the extension direction of the first bent part is in line with When the included angle of the straight line in the first preset direction is between 0° and 15°, it can be ensured that the friction force applied by the first component to the first bending part is relatively small, and the friction force is applied to each The moment of the first bending portion of each terminal is not sufficient to overcome the torque applied to the first bending portion by the main body portion.
  • the placement of the terminals affects the force of the first component.
  • a plurality of terminals are arranged in an array, and in each row of terminals distributed along the first preset direction, the first bent portion of a part of the terminals and The first bending part of the other part of the terminal is arranged opposite to or opposite to each other.
  • the first bending part faces the opposite terminal pair.
  • the friction of a component can cancel at least a part of each other to keep the force balance of the first component as much as possible, and the first bent portion of each terminal and the corresponding first pad in the first component are not prone to misalignment.
  • the number of terminals with the first bent portion facing the first preset direction is equal to the number of terminals with the first bent portion facing away from the first preset direction.
  • the numbers are equal to ensure that the first bent portions in the same row of terminals face different terminals to fully offset the frictional force of the first component.
  • the first bent portion faces the first preset
  • the terminals of the direction are continuously arranged, and the terminals of the first bending part away from the first preset direction are continuously arranged to ensure that the first bending part faces the same different terminal, and the distance between the main body parts and the distance between the first bending part The distance between them tends to be uniform.
  • the above-mentioned first component may have various forms.
  • the first component includes a packaging substrate and a chip
  • the packaging substrate includes a substrate body and a plurality of first pads, and the plurality of first pads and the chip are respectively It is arranged on two opposite surfaces of the substrate body; and the chip is electrically connected with a plurality of first pads.
  • the first component may also be a parasitic circuit board with a first pad.
  • the form of the second component can also have multiple forms.
  • the second component includes a circuit board and a mounting base, and the circuit board includes a circuit board body and a plurality of second solders arranged on the circuit board body. Plate; wherein a plurality of terminals and a plurality of second pads are connected in a one-to-one correspondence; the mounting base is connected with the circuit board, and the main body of the plurality of terminals penetrates the mounting base and is fixedly connected with the mounting base.
  • each terminal further includes a second bending portion connected to the end of the main body portion away from the first bending portion. Folding part, the second bending part of each terminal abuts against a second pad; the mounting base is slidably fitted with the circuit board body along the second preset direction, and can be locked at the second set position relative to the circuit board body When the mounting base slides relative to the circuit board body in the second preset direction, the moment of the friction force applied by the circuit board body to the second bending portion of each terminal is less than or equal to the moment of the friction force applied to the second bending portion of the main body The torque is used to prevent the second bending part from rotating relative to the main body part, which further ensures the SI performance of the terminal when transmitting signals.
  • each terminal when the main body part and the second bending part are made of common materials such as copper alloy and phosphor bronze, the extension direction of the second bending part of each terminal The angle between the line and the line in the second preset direction is between 0° and 15°, which can ensure that the friction force applied by the circuit board body to the second bending portion corresponds to a small force arm, and the friction force is applied to The moment of the second bending portion of each terminal is insufficient to overcome the torque applied to the second bending portion by the main body portion.
  • each terminal can be accurately aligned with the corresponding first and second pads.
  • the first bending The extending direction of the portion is opposite to the extending direction of the second bending portion.
  • the circuit board further includes a plurality of traces formed on the circuit board body, and the plurality of traces are signal-connected to at least some of the terminals in a one-to-one correspondence; wherein, when the plurality of terminals are distributed in an array, each A trace extends along the middle position between two adjacent rows and/or two rows of terminals, and is parallel to the arrangement direction of the terminals on both sides of the trace, which helps to avoid the trace from being too close to the terminal on one side. Affect the performance of this terminal.
  • the middle of each side is positioned and connected to the mounting base, and each terminal is closer to the corresponding positioning bump to reduce The cumulative error of the alignment between the terminal and the first pad.
  • an electronic device in a second aspect, is provided.
  • the electronic device may be a mobile phone, a computer, or a switch, and the electronic device includes a storage module and the electronic module described in the above technical solution, the first component of the electronic module and the storage module Electrical connection; when the first component is slid relative to the second component in the first preset direction, the moment of the friction force applied by the first component to the first bending part of each terminal is less than or equal to the moment of the friction force applied to the first bending part of the main body part For the torque of the bending part, for each terminal, the first component is not easy to drive the first bending part to rotate around the corresponding main body part, and the distance between the first bending parts of different terminals is not easy to change.
  • SI Signal Processing
  • Integrity Signal Integrity
  • Figure 1 shows a schematic diagram of an electronic module in the prior art
  • Figure 2 shows a schematic diagram of the structure of the terminal in Figure 1;
  • Fig. 3a shows an enlarged view of the top view of the terminals in column n1 in Fig. 1 when the package substrate is not installed on the mounting base;
  • Fig. 3b shows an enlarged view of the top view of the n1 row of terminals in Fig. 1 after the package substrate is installed on the mounting base;
  • Figure 4a shows a schematic diagram of an electronic module provided by an embodiment of the present application
  • Figure 4b shows a partial enlarged view of A in Figure 4a
  • Figure 4c shows a partial enlarged view at B in Figure 4a
  • Figure 5 shows a bottom view of the package substrate in Figure 4a
  • Figure 6 shows a schematic diagram of the structure of the mounting base in Figure 4a;
  • Figure 7 shows a top view of the circuit board in Figure 4a
  • Fig. 8 shows a schematic diagram of the structure of the terminal in Fig. 4a;
  • Fig. 9 shows an enlarged view of a top view of a plurality of terminals corresponding to the terminal fixing cavity in the E'area in Fig. 6;
  • FIG. 10 shows a top view of the assembly formed by the cooperation of the packaging substrate and the mounting base of the first component in FIG. 4a;
  • Figure 11a shows a partial schematic diagram of another electronic module provided by an embodiment of the present application.
  • Figure 11b shows a partial schematic diagram of another electronic module provided by an embodiment of the present application.
  • FIG. 12 shows a partial schematic diagram of another electronic module provided by an embodiment of the present application.
  • FIG. 13 shows the positional relationship diagram of some terminals in FIG. 4a and the wiring in the circuit board.
  • the electronic module may be in an electronic device such as a mobile phone, a computer, or a switch.
  • Fig. 1 shows a schematic diagram of a chip in an existing electronic module when the chip is assembled on a circuit board through a package substrate and a mounting base.
  • the existing electronic module includes a component 10, a component 20, and a plurality of terminals 30.
  • the component 10 includes a package.
  • the substrate 12 and the chip 11 mounted on the package substrate 12, the assembly 20 includes a circuit board 22 and a mounting base 21 on the circuit board 22.
  • the mounting base 21 has a mounting slot (ie Socket).
  • FIG. 2 shows a schematic diagram of the structure of the terminal 30 in FIG. 1. Referring to FIG.
  • each terminal 30 includes a main body 32, a bent portion 31 connected to one end of the main body 32, and a solder ball connected to the other end of the main body 32 33.
  • a plurality of terminals 30 are installed on the mounting base 21 through the main body portion 32, and usually, these terminals 30 are arranged in an array, wherein, in each terminal 30, the bent portion 31 and the packaging substrate A pad on the bottom surface of 12 (not shown in Figure 1, the surface of the pad is parallel to the XOY surface) abuts, the solder ball 33 and a pad on the circuit board 22 (not shown in Figure 1, the pad The surface is parallel to the XOY surface) welding.
  • Figure 3a shows an enlarged view of the top view (view viewed along the negative direction of the Z axis) of the terminals 30 in column n1 in Figure 1 when the package substrate 12 is not mounted on the mounting base 21.
  • the negative direction along the Y axis is shown.
  • the multiple terminals 30 in column n1 are ground terminal ground (Ground), signal terminal signal (Signal) 1P (+), signal terminal signal (Signal) 1N (-), ground terminal ground (Ground), signal terminal signal (Signal) 2P (+), signal terminal signal (Signal) 2N (-) and ground terminal ground (Ground).
  • the signal terminal signal (Signal) 1P (+) and the signal terminal signal (Signal) 1N (-) form a P/N terminal pair.
  • the signal terminal signal (Signal) 2P (+) and the signal terminal signal (Signal) 2N (-) form a P/N terminal pair.
  • the extension directions of the bent portions 31 of each terminal 30 in the n1 column are parallel to each other, and both are in the T direction. In this way, the bent portions 31 of every two adjacent terminals 30 in the n1 column of terminals 30 can be ensured The distance between them is moderate.
  • the bent portion 31 of each terminal 30 will be affected by the package substrate.
  • the frictional force of 12 along the mounting direction P due to the included angle between the extension direction T of the bent portion 31 of each terminal 30 and the mounting direction P in the prior art (for example, the included angle is 45°), the bent portion 31 is easy to lose balance, and it is easy to rotate under the action of the friction of the above-mentioned land (the rotation axis is parallel to the Z axis).
  • the bent portion 31 of each terminal 30 is under the action of the friction of the land on the package substrate 12, There will be different degrees of offset in different directions.
  • FIG. 3b shows an enlarged view of a top view of n1 rows of terminals when the package substrate 12 is slid to a set position relative to the mounting base 21 along the mounting direction P and is installed in the mounting groove.
  • the bent portion 31 of the signal terminal signal (Signal) 1P (+) and the bent portion 31 of the signal terminal signal (Signal) 1N (-) are far away from each other , Causing the signal terminal signal (Signal) 1P (+) and signal terminal signal (Signal) 1N (-) to form a terminal pair of differential impedance becomes larger, the signal terminal signal (Signal) 2P (+) bending part 31 and signal The terminal signal (Signal) 1N(-) bending parts 31 are close to each other, resulting in increased crosstalk between different P/N terminal pairs.
  • the above two factors will cause data transmission between the chip 11 and the circuit board 22 through the terminal 30 ,
  • the signal is prone to distortion, especially when high-speed data transmission, the more serious the signal distortion, that is, the degradation of SI (Signal Integrity) performance, which can only adapt to data transmission speeds below 25Gbps.
  • SI Signal Integrity
  • an embodiment of the present application provides an electronic module:
  • FIG. 4a shows a schematic diagram when the first component is assembled to the second component in the electronic module provided by the embodiment of the present application.
  • the electronic module provided by the embodiment of the present application includes a first component 100, a second component 200, and a plurality of terminals 300.
  • the first component 100 includes a chip 110 and a packaging substrate 120.
  • the chip 110 is located on the positive side of the Z-axis of the packaging substrate 120.
  • the chip 110 may be a CPU (Central Processing Unit), a cache, and the like.
  • the second assembly 200 includes a mounting base 210 and a circuit board 220.
  • the mounting base 210 is placed on the positive side of the Z-axis of the circuit board 220, and the package substrate 120 is mounted on the side of the mounting base 210 away from the circuit board 220.
  • Each terminal 300 penetrates the mounting base 210 to realize signal connection to the package substrate 120 and the circuit board 220.
  • FIG. 5 shows a bottom view (a view viewed along the Z-axis direction) of the package substrate 120 in FIG. 4a.
  • the package substrate 120 includes a substrate body 121 and is distributed on the bottom surface of the substrate body 121 (Z-axis The surface in the negative direction, which is exemplarily parallel to the first pads 122 of the XOY plane.
  • the above-mentioned plurality of first pads 122 are divided into four groups, and the four groups of first pads 122 are distributed in the E1 area, F1 area, G1 area, and H1 area at the corners of the bottom surface of the substrate body 121 in a one-to-one correspondence.
  • Each group of first pads 122 are distributed in an array, where the row direction is defined as the X-axis direction, and the column direction is the Y-axis direction.
  • each row of the first pads 122 in the E1 area and the first row of the F1 area are The pads 122 are aligned, each row of first pads 122 in the G1 area is aligned with a row of first pads 122 in the H1 area, and each column of the first pads 122 in the E1 area is aligned with a row of first pads in the G1 area.
  • the pads 122 are aligned, and each column of first pads 122 in the F1 area is aligned with a row of first pads 122 in the H1 area.
  • the distribution of the above groups of the first pads 122 is only an example, and it can also be distributed in other forms, for example, all the first pads 122 are continuously arranged and distributed in an array as a whole.
  • the chip 110 is mounted on the top surface of the substrate body 121 (the surface in the positive direction of the Z-axis), and the chip 110 is connected to some contacts on the substrate body 121 by means of pins or the like to realize the chip 110 and the substrate body 121.
  • the multiple first pads 122 on the side are electrically connected, and the electrical connection method between the chip 110 and the first pad 122 may be a commonly used connection method known in the prior art, which will not be repeated here.
  • the middle position of the two opposite sides of the substrate body 121 parallel to the X axis has positioning recesses (123a and 123b) recessed into the interior of the substrate body 121.
  • FIG. 6 shows a schematic structural diagram of the mounting base 210 in FIG. 4a.
  • the mounting base 210 includes a plate-shaped base body 211, and limit baffles (213e, 213f, 213g, and 213h) on the corner edges of the base body 211, which are located on two opposite sides parallel to the X axis
  • the positioning bumps (214a and 214b) in the middle position, and the reinforcing structures (215a and 215b) extending along two opposite sides parallel to the X-axis, the reinforcing structures (215a and 215b) can be positioned on the one hand
  • the structural strength of the bumps (214a and 214b) is strengthened, and on the other hand, it can also have a preliminary limiting effect on the substrate body 121.
  • the two opposite surfaces in the thickness direction of the base body 211 are both parallel to the XOY plane, where the base body 211 has an E2 area, a F2 area, a G2 area, and a H2 area at positions close to the four corners.
  • a group of terminal fixing cavities 212 are distributed in an array in each of the three regions.
  • FIG. 7 shows a top view of the circuit board 220 in FIG. 4a.
  • the circuit board 220 includes a circuit board body 221 and a plurality of second pads 222 distributed on the mounting surface S2 of the circuit board body 221 (for example, the mounting surface S2 is parallel to the XOY surface).
  • the circuit board body 221 has four areas: E3 area, F3 area, G3 area and H3 area.
  • the plurality of second pads 222 are divided into four groups, and each group of second pads 222 is arranged in an array in the four areas. An area.
  • the welding method of the second pad 222 adopts NSMD (copper foil defined pad), which can better improve the second pad compared to SMD (solder mask defined pad).
  • SMD solder mask defined pad
  • FIG. 8 shows a schematic diagram of the structure of the terminal 300 in FIG. 4a.
  • the terminal 300 includes a metal member 310 and a solder ball 320.
  • the metal member 310 includes a first bent portion 312 and a strip-shaped (only exemplary) main body portion 311.
  • the first bent portion 312 and the main body portion 311 The solder ball 320 is connected to the other end of the main body portion 311, and the solder ball 320 is connected to the other end of the main body 311.
  • Fig. 4b shows a partial enlarged view of A in Fig. 4a, combined with Fig. 4a, Fig. 4b, Fig. 6 and Fig. 8, exemplarily, when assembling the first component 100 and the second component 200, according to actual needs
  • a metal member 310 is placed in each terminal fixing cavity 212, wherein the main body portion 311 of the metal member 310 penetrates the corresponding terminal fixing cavity 212 to be fixedly connected with the base body 211,
  • the first bending portion 312 is exposed on the top surface of the base body 211 (a surface located on the Z-axis square of the base body 211.
  • the top surface is also referred to as the mounting surface S3 of the second component 200.
  • the mounting surface S3 is on the side opposite to the first assembly 100), and then the plurality of metal members 310 fixed to the base body 211 are implanted to make the main body 311 away from the end of the first bending portion 312.
  • Solder balls 320 place the mounting base 210 on the top surface of the circuit board 220 (the surface in the positive direction of the Z axis), so that the E2 area is opposite to the E3 area, the F2 area is opposite to the F3 area, the G2 area is opposite to the G3 area, and the H2 area is opposite. Opposite to H3 area.
  • the multiple terminal fixing cavities 212 in the E2 area are opposed to the multiple second pads 222 in the E3 area one by one, so that the solder balls 320 in each terminal 300 correspond to those in the E3 area Contact the second pad 222 ( Figure 4b), and then use heat treatment and other means to make the solder ball 320 and the corresponding second pad 222 fixedly connected, the terminal 300 setting method in other areas refer to the setting method of the terminal 300 in the area E2 .
  • the extension direction of the orthographic projection of the first bending portion 312 of each terminal 300 on the mounting surface S3 of the second assembly 200 is defined as the extension direction of the first bending portion 312 of the terminal 300 (indicated by R), where , The straight line where the extension direction R of the first bending portion 312 of each terminal 300 is located is parallel to the line where the first preset direction Q (exemplarily, the first preset direction Q is the negative direction of the X-axis) is located, that is, the extension The direction R is the same as or opposite to the first preset direction Q.
  • FIG. 9 shows an enlarged view of the top view of the plurality of terminals 300 corresponding to the terminal fixing cavity 212 in the area E'in FIG. 6. Taking FIG.
  • each The extension direction R of the first bending portion 312 of the terminal 300 is opposite to the first predetermined direction Q.
  • one end of the substrate body 121 needs to be put into the groove-shaped space formed by the stopper plate (213e, 213f, 213g, and 213h), and then Push the substrate body 121 along the first preset direction Q until the end of the substrate body 121 touches the limit baffle 213g and the limit baffle 213f, then lower the substrate body 121 to its bottom surface and the top of the base body 211 The surfaces are parallel.
  • the four corners of the substrate body 121 are in contact with the limiting baffles (213e, 213f, 213g, and 213h) one by one and are limited (refer to Figure 10), and the positioning protrusion 214a is fitted to the positioning recess 123a , The positioning protrusion 214b is fitted to the positioning recess 123b to realize the positioning connection between the substrate body 121 and the mounting base 210.
  • the positioning protrusions (214a and 214b) are arranged in the middle position of the corresponding side of the base body 211, relative to Set at the edge position of the corresponding side, each set of terminal fixing cavities 212 are closer to the corresponding positioning bumps (214a and 214b), which is beneficial to reduce the cumulative error of the alignment of the terminal 300 and the first pad 122.
  • the first bending portion 312 of each terminal 300 is precisely aligned with the corresponding first pad 122 (refer to FIG. 10).
  • the cross section of each positioning bump (214a and 214b) is semicircular.
  • the center of the cross section of the bump (214a and 214b) can be used as a reference to determine each
  • the precise position of the terminal fixing cavity 212 improves the position accuracy of the terminal fixing cavity 212, and in order to avoid reverse mounting of the package substrate 120 and the mounting base 210, the outer diameter of the positioning bumps (214a and 214b) can be set to one larger
  • positioning bumps can be provided at the middle positions of the two sets of opposite sides of the base body 211, and the positioning recesses on the substrate body 121 are similarly arranged; at this time, the position where the first component 100 is located is called the first Set position, and is locked in the first set position by the limit baffle (213e, 213f, 213g, and 213h) and positioning bumps (214a and 214b), and the E1 area is opposite to the E2 area, and the F1 area and the F2 area In contrast, the G1 area is opposite to the G2 area, and the H1 area is opposite to the H
  • the multiple terminal fixing cavities 212 in the E2 area are opposed to the multiple first pads 122 in the E3 area one by one, so that the solder balls 320 in each terminal 300 correspond to those in the E2 area
  • the first pad 122 is in contact with each other (FIG. 4b), and each terminal 300 makes a pair of opposite first pad 122 and second pad 222 electrically connected.
  • the first pad 122, the second pad 222, and the terminal fixing cavity 212 correspond one-to-one, that is, when the first module 100 and the second module are assembled as shown in FIG. 4a, each terminal is fixed
  • the terminals 300 in the cavity 212 are respectively connected to the first pad 122 and the second pad 222 in a one-to-one correspondence.
  • the substrate body 121 when the substrate body 121 is pushed along the first preset direction Q, the substrate body 121 is in direct contact with the first bending portion 312 exposed on the top surface of the base body 211, and the substrate body 121 In the process of moving in the first predetermined direction Q, the substrate body 121 will give the first bending portion 312 in contact with it a friction force along the first predetermined direction Q, and since the first bending portion 312 of each terminal 300 has a frictional force If the extension direction R is the same as or opposite to the first predetermined direction Q, the first bending portion 312 of each terminal 300 receives zero friction force from the substrate body 121, and the first bending portion 312 receives zero.
  • the moment of force is zero, so the first bending portion 312 is not easy to rotate around the main body portion 311, therefore, the distance between the first bending portion 312 of different terminals 300 is not easy to change, continue to take FIG. 9 as an example, in FIG. ,
  • the terminal 300 marked P is the P signal terminal
  • the terminal 300 marked N is the N signal terminal
  • the terminal marked G is the ground terminal.
  • the straight line where the extension direction R of the first bending portion 312 of each terminal 300 is parallel to the line where the first preset direction Q is located is only an exemplary description. As long as the following conditions are met, the same terminal The first bending portion 312 in 300 is not easy to rotate relative to the corresponding main body portion 311: the moment generated by the friction force applied to the first bending portion 312 by the substrate body 121 causes the first bending portion 312 to be applied to the main body
  • the torque of the portion 311 is less than or equal to the torque generated by the main body portion 311 due to its own material stress (mostly the main body portion 311 has certain elasticity), and the main body portion 311 is not easily twisted and deformed around its own axis; in other words, the substrate body 121 applies
  • the moment generated by the friction force to the first bending portion 312 is less than or equal to the torque applied to the first bending portion 312 by the main body portion 311; therefore, the first bending portion 312 does not easily occur around the axi
  • the metal member 310 is made of a common material such as copper alloy and phosphor bronze
  • the first bending portion 312 of each terminal 300 is made to be sandwiched between the line where the extension direction R of the first bending portion 312 is located and the line where the first predetermined direction Q is located.
  • the angle is between 0° and 15°.
  • the included angle may be 0°, 2°, 5°, 7°, 8°, 10°, 11°, 13° or 15°; at this time, Since the force arm corresponding to the friction force applied by the substrate body 121 to the first bending portion 312 is small, the moment generated by the friction force applied by the substrate body 121 to the first bending portion 312 is small, which is insufficient to cause the first bending portion 312 The torque applied by the folding portion 312 to the main body portion 311 overcomes the torque generated by the main body portion 311 due to its own material stress, and the first bending portion 312 is not easy to rotate relative to the main body portion 311.
  • Fig. 4c shows a partial enlarged view of B in Fig. 4a. Please combine Fig. 4a, Fig. 4b, Fig. 4c and Fig. 6.
  • the three terminals 300 in Fig. 4b correspond to the area H2 in Fig. 6 along the positive direction of the Y axis.
  • the three terminal fixing cavities 212 in the first row of Fig. 4c correspond to the three terminal fixing cavities 212 in the first row in the G2 area in Fig. 6 along the positive direction of the Y axis, and the three terminals 300 in Fig. 4b
  • the extension direction R of the first bent portion 312 of the terminal 300 is the same as the extension direction R of the first bent portion 312 of the three terminals 300 in FIG. 4c.
  • For each row of terminals 300 please refer to the terminals in FIGS. 4b and 4c. Set in the form of 300.
  • Fig. 11a shows a modification of the electronic module shown in Fig. 4a.
  • the difference between Fig. 11a and Fig. 4a lies in the three positions at A'(corresponding to A in Fig. 4a)
  • the first bent portion 312 of the terminal 300 is opposite to the first bent portion 312 of the three terminals 300 at B'(corresponding to the position B in FIG. 4a).
  • the three terminals 300 at A' The extension direction R of the first bending portion 312 and the extension direction R of the first bending portion 312 of the three terminals 300 at B′ are on the same straight line and opposite; when the package substrate 120 is installed in the mounting base 210 , The metal member 310 of each terminal 300 will be compressed and deformed by the first pad 122.
  • the first bending portion 312 slides along its extension direction R, and the main body portion 311 is The extension direction R of the portion 312 is arched in a direction opposite to the extension direction R. Due to the elasticity of the main body portion 311 and the first bending portion 312, the first bending portion 312 will give the corresponding first pad 122 a difference with the first bending portion.
  • Fig. 11b shows another modification of the electronic module shown in Fig. 4a.
  • the difference between Fig. 11b and Fig. 11a lies in the first bending of the three terminals 300 at A" (corresponding to A in Fig. 4a)
  • the portion 312 is arranged opposite to the first bending portion 312 of the three terminals 300 at B" (corresponding to the portion B in FIG. 4a), for example, the first bending portion 312 of the three terminals 300 at A"
  • the extension direction R and the extension direction R of the first bending portion 312 of the three terminals 300 at B" are on the same straight line and opposite; thus, similar to the electronic module in FIG. 11a, the packaging substrate 210 is affected as a whole The frictional forces of the terminals 300 in the two positions A" and B" cancel each other, and the force balance of the package substrate 210 is maintained.
  • the first bending portions 312 of the three terminals 300 at A'and the first bending portions 312 of the three terminals 300 at B' are arranged opposite to each other, and it can also be at A'
  • the line where the extension direction R of the first bending portion 312 of the three terminals 300 is located and the line where the extension direction R of the first bending portion 312 of the three terminals 300 is located at B′ are both the line where the first predetermined direction P is located A certain included angle (for example, any one of 5°, 10°, and 15° can be included); in this way, the frictional force applied to the package substrate 210 by the first bending portion 312 of the terminal 300 at A'and The frictional force applied to the package substrate 210 by the first bending portion 312 of the terminal 300 at B′ has opposite component forces in the X-axis direction and at least partially cancels each other out, which is also beneficial to maintaining the force balance of the package substrate 210.
  • the rows of terminals 300 in FIG. 11b can be arranged opposite to each other
  • the terminals 300 of the first bending portion 312 facing away from the first predetermined direction Q are also continuously arranged (for example, the terminal 300 at A'in FIG. 11a and the terminal 300 at B'in FIG. 11b), which is only An exemplary arrangement form, in this way, for the same row of terminals 300, it is beneficial to maintain the same extending direction R of the first bent portion 312 between the main body portions 311 of the terminals 300 and the first pad 122 when the first pads 122 are evenly spaced.
  • the gap of the first bent portion 312 is uniform, thereby helping to prevent the impedance of the same P/N terminal pair from increasing, or the crosstalk of different P/N terminal pairs from increasing, and further improving the SI performance of the electronic module.
  • the terminals 300 with different orientations of the first bending portion 312 are arranged at intervals, the effect of balancing the forces on the package substrate 210 can also be achieved to a certain extent.
  • Figure 12 shows another modification of the electronic module shown in Figure 4a.
  • the position A"' corresponds to the position A in Figure 4a.
  • the difference between the electronic module in Figure 12 and the electronic module in Figure 4a is that each The solder balls 320 in the terminals 300 are replaced by the second bent portions 313.
  • the first bent portions 312, the second bent portions 313, and the main body 311 included in each terminal 300 may be integrally formed metal members;
  • a bending portion 312 similarly defines the extension direction of the orthographic projection of the second bending portion 313 of each terminal 300 on the mounting surface S3 of the second component 200 as the extension of the second bending portion 313 of the terminal 300 Direction (indicated by V); when assembling the mounting base 210 to the circuit board 220, under normal circumstances, it is necessary to push the base body 211 to slide a certain distance relative to the circuit board body 221 along the second preset direction W (such as on the circuit board).
  • the body 221 is provided with a limiting wall extending along the second preset direction W, the base body 211 slides along the limiting wall, and the structure of the base body 211 and the circuit board body 221 slidingly fit can be commonly known in the art.
  • the moment of the frictional force is insufficient to make the second bending portion 313 rotates relative to the main body portion 311; in short, by using a material with better rigidity to make the terminal 300, or making the extension direction V of the second bending portion 313 in the terminal 300 meet certain requirements, the substrate body 121 is applied to The moment generated by the friction force of the second bending portion 313 is less than or equal to the torque applied to the second bending portion 313 by the main body portion 311, and the second bending portion 313 is not easy to rotate relative to the main body portion 311; for example, when the terminal 300 is made of common materials such as copper alloy and phosphor bronze, the angle between the straight line where the extension direction V of the second bent portion 313 of each terminal 300 is located and the line where the second predetermined direction W is located is between 0 ° to 15°, for example, the included angle may be 0°, 2°, 5°, 7°, 8°, 10°, 11°, 13° or 15°. At this time, the second bending part
  • the extension direction R of the first bending portion 312 in each terminal 300 may be opposite to the extension direction V of the second bending portion 313, for example, when the first predetermined direction Q and the second predetermined direction Q are opposite to the extension direction V of the second bending portion 313.
  • the direction P is opposite, the extrusion deformation direction of the first bending portion 312 is opposite to the extrusion deformation direction of the second bending portion 313, and the first bending portion 312 and the second bending portion 313 are reversed.
  • the direction of the frictional force is opposite, which is beneficial to the force balance of the terminal 300.
  • FIG. 13 shows the arrangement of the terminals 300 in the electronic module provided by the embodiment of the present application and the positional relationship diagram of the wiring (such as 223a and 223b) in the circuit board 220.
  • a plurality of terminals 300 are arrayed in the circuit On the surface of the board 220, taking the wiring 223a as an example, a pair of P signal terminals and N signal terminals are respectively electrically connected to the wiring 223a on the circuit board body 221.
  • the wiring 223a first extends along the positive direction of the X-axis and In the process of extending along the X-axis direction, it is parallel to the arrangement direction of the terminals on both sides (as shown in Figure 13, the arrangement direction of the P signal terminal in the 3 row and the first column and the ground terminal in the positive direction of the X axis of the P signal terminal) , Then the trace 223a extends along the positive direction of the Y-axis, and in the process of extending along the Y-axis, it is parallel to the arrangement direction of the terminals on both sides (as shown in the third row and the fourth row in the second row in the fourth row).
  • the arrangement direction of the two ground terminals in the row), and the two traces 223a as a whole always extend along the middle positions of the terminals on both sides, which is beneficial to avoid the trace 223a from being too close to the terminal 300 on one side, which will affect the The performance of the terminal 300, in turn, improves the SI performance of the electronic module.
  • the trace can also be fanned out in only one direction, such as trace 223b.
  • first component 100 is not limited to the combination of the chip 110 and the packaging substrate 120.
  • first component may also be a parasitic circuit board that cooperates with the circuit board 220 in the second component 200 through the terminal 300;
  • the second component 200 is not limited to the combination form of the circuit board 220 and the mounting base 210, and may also have other structures with pads (similar to the second pad 222) for transmitting signals.
  • inventions of the present application also provide an electronic device.
  • the electronic device may be a computer, a mobile phone, a server, etc.
  • the electronic device includes a storage module and the electronic module provided in the above-mentioned embodiments, wherein the storage module and the The first component in the electronic module is electrically connected (the "electrical connection" can be a direct connection or an indirect connection); for example, please refer to Figures 4a to 13, by setting the electronic module, because the first component When 100 slides relative to the second component 200 in the first predetermined direction Q, the moment of the friction force applied by the first component 100 to the first bending portion 312 of each terminal 300 is less than or equal to that applied to the first bending portion 311 of the main body portion 311.
  • the first bending portion 312 is not easy to rotate relative to the corresponding main body portion 311, which improves the SI performance of the electronic module, thereby improving the performance of the electronic device.
  • the CPU is electrically connected to the storage module, and can read data in the storage module or write data to the storage module.

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Abstract

本申请提供了一种电子模块及电子设备，该电子模块包含第一组件、第二组件和多个端子，其中，第一组件包括封装基板和安装于封装基板的芯片，第二组件包括电路板和安装于电路板上的安装底座，每个端子包括主体部，以及，分别连接于主体部相对的两端的第一弯折部和焊球；每个端子中，主体部贯穿并固定于安装底座，第一弯折部与封装基板上对应的第一焊盘抵接，焊球与电路板上对应的第二焊盘连接；在第一组件沿第一预设方向相对于第二组件滑动时，封装基板施加给第一弯折部的摩擦力的力矩小于或等于主体部施加给第一弯折部的扭矩，第一弯折部不易绕主体部转动，有利于保持端子之间的间距不变，提升通过端子在芯片和电路板之间传输信号时的信号完整性。

Description

一种电子模块及电子设备
相关申请的交叉引用
本申请要求在2019年12月30日提交中国专利局、申请号为201911398770.5、申请名称为“一种电子模块及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及到一种电子模块及电子设备。
背景技术
在组装电子模块中的两个组件时，有时需要将其中一个组件(如芯片安装于封装基板所形成的组件)沿着一定方向相对于另一个组件(如将封装基板滑动安装到电路板上)滑动至一个设定位置并锁定，通过多个端子实现两个组件之间的信号连接；而每个端子具有弯折部，并通过该弯折部实现与组件的弹性接触。
但是，现有技术中，端子的弯折部的延伸方向与两个组件在组装时的相对滑动方向的夹角通常为45°，使得两个组件在相对滑动过程中，每个端子的弯折部在所接触的组件的摩擦力作用下易发生偏移，导致不同的端子之间的间距发生变化，两个组件之间通过端子传输数据时，信号容易失真，导致信号完整性较差，特别是当高速传输数据时，影响明显。
图1为现有技术中一种电子模块的示意图，参考图1，组件10包括封装基板12和安装于封装基板12上的芯片11，组件20包括电路板22和位于电路板22上的安装底座21，封装基板12通过多个贯穿安装底座21的多个端子30与电路板实现电连接；其中，参考图2，每个端子30包括主体部32、连接于主体部32一端的弯折部31，以及连接于主体部32另一端的焊球33，主体部32固定于安装底座21中，焊球33与电路板22上的焊盘连接，弯折部31在电路板22的安装面S1上的正投影的延伸方向为弯折部31的延伸方向T；安装封装基板12前，图1中部分端子30的俯视图如图3a，结合图1和图3a，当使封装基板12沿着P方向滑动安装于安装底座21时，弯折部31的延伸方向T与P方向通常呈45°夹角；封装基板12安装好之后，图3a中的端子状态如图3b，不同的端子30的弯折部31之间距离发生变化，导致通过端子30传输信号时的信号完整性较差。
发明内容
本申请提供了一种电子模块及电子设备，用以缓解当两个组件在相对滑动时，两个组件之间的端子间距发生变化的技术问题，以使两个组件之间通过端子以较高的速度传输数据时具有较好的信号完整性。
第一方面，提供了一种电子模块，该电子模块应用于手机、电脑或交换机等电子设备中，并且包括第一组件、第二组件，以及，多个端子；在将第一组件与第二组件组装时，第一组件沿第一预设方向与第二组件滑动配合、并可相对于第二组件锁定在第一设定位置，其中，第一组件朝向第二组件的面具有多个第一焊盘；上述多个端子与上述多个第一焊盘 中的至少部分一一对应，每个端子包括主体部及与该主体部连接的第一弯折部，其中，主体部与第二组件固定连接，第一弯折部与对应的第一焊盘抵接；在第一组件沿第一预设方向相对于第二组件滑动时，第一组件施加给每个端子的第一弯折部的摩擦力的力矩小于或等于主体部施加给第一弯折部的扭矩；因此，对于每个端子来说，第一组件不容易带动第一弯折部绕对应的主体部转动，不同的端子的第一弯折部之间的距离不易发生改变，每个端子对的差分阻抗不易变大，不同端子对之间串扰不易增加，第一组件和第二组件之间通过端子传输信号时，在高速下也能够保持较好的SI(信号(Signal)Integrity，信号完整性)性能。
例如，在一个具体的实施方式中，在每个端子中，当主体部和第一弯折部的材质均为铜合金和磷青铜等常用材质，且第一弯折部的延伸方向所在直线与第一预设方向所在直线的夹角介于0°至15°之间时，可以确保第一组件施加给第一弯折部的摩擦力的对应的力臂较小，该摩擦力施加给每个端子的第一弯折部的力矩不足以克服主体部施加给第一弯折部的扭矩。
在具体设置端子时，端子的摆放方式影响第一组件的受力，例如，多个端子呈阵列分布，沿第一预设方向分布的每一行端子中，一部分端子的第一弯折部与另一部分端子的第一弯折部的相向设置或者相背设置，如此，同一行端子施加给第一组件的摩擦力的至少部分分力相反，因此，第一弯折部朝向相反的端子对第一组件的摩擦力可以相互抵消至少一部分，以尽量保持第一组件的受力平衡，每个端子的第一弯折部与第一组件中对应的第一焊盘之间不易发生错位。
在一个具体的实施方式中，沿第一预设方向分布的每一行端子中，第一弯折部朝向第一预设方向的端子数量与第一弯折部背离第一预设方向的端子的数量相等，以确保同一行端子中的第一弯折部朝向不同的端子对第一组件摩擦力能够充分抵消。
为了进一步提升第一组件和第二组件通过端子传输信号时的SI性能，在一个具体的实施方式中，沿第一预设方向分布的每一行端子中，第一弯折部朝向第一预设方向的端子连续设置，且第一弯折部背离第一预设方向的端子连续设置，以确保对于第一弯折部朝向相同的不同端子，主体部之间的距离和第一弯折部之间的距离都趋于均匀。
上述第一组件的形式可以有多种，在一个具体的实施方式中，第一组件包括封装基板和芯片，封装基板包括基板本体和多个第一焊盘，多个第一焊盘与芯片分别设置在基板本体相对的两个表面；且芯片与多个第一焊盘电连接。除此之外，第一组件还可以是具有第一焊盘的寄生电路板。
对应地，第二组件的形式也可以有多种，在一个具体的实施方式中，第二组件包括电路板和安装底座，电路板包括电路板本体以及设置在电路板本体的多个第二焊盘；其中，多个端子与多个第二焊盘一一对应连接；安装底座与电路板连接，多个端子的主体部贯穿安装底座且与安装底座固定连接。
除了在主体部的用于朝向第一组件的一端设置第一弯折部外，在一个具体的实施方式中，每个端子还包括连接于主体部远离第一弯折部的一端的第二弯折部，每个端子的第二弯折部与一个第二焊盘抵接；安装底座沿第二预设方向与电路板本体滑动配合、并可相对于电路板本体锁定在第二设定位置；当安装底座沿第二预设方向相对于电路板本体滑动时，电路板本体施加给每个端子的第二弯折部的摩擦力的力矩小于或等于主体部施加给第二弯折部的扭矩，以使第二弯折部不易相对于主体部发生转动，进一步确保端子在传输信号 时的SI性能。
例如，在一个具体的实施方式中，在每个端子中，当主体部和第二弯折部的材质均为铜合金和磷青铜等常用材质，每个端子的第二弯折部的延伸方向所在直线与第二预设方向所在直线的夹角介于0°至15°之间，可以确保电路板本体施加给第二弯折部的摩擦力对应的力臂较小，该摩擦力施加给每个端子的第二弯折部的力矩不足以克服主体部施加给第二弯折部的扭矩。
为了确保每个端子的受力平衡，使每个端子都能够与对应的第一焊盘和第二焊盘精准对位，在一个具体的实施方式中，在每个端子中，第一弯折部的延伸方向与第二弯折部的延伸方向相反。
在一个具体的实施方式中，电路板还包括形成于电路板本体的多条走线，多条走线与至少部分端子一一对应地信号连接；其中，当多个端子呈阵列分布时，每条走线沿相邻的两列和/或两列端子之间的中间位置延伸，并且平行于该走线两侧的端子的排列方向，有利于避免走线离其中一侧的端子过近，影响该端子的性能。
在一个具体的实施方式中，封装基板的至少一组相对的两个侧边中，每条侧边的中间与安装底座定位连接，每个端子距离对应的定位凸块距离更近，以减小端子与第一焊盘对位的累积误差。
第二方面，提供了一种电子设备，该电子设备可以是手机、电脑或交换机等，并且该电子设备包括存储模块和上述技术方案所述的电子模块，电子模块中的第一组件与存储模块电连接；通过使第一组件沿第一预设方向相对于第二组件滑动时，第一组件施加给每个端子的第一弯折部的摩擦力的力矩小于或等于主体部施加给第一弯折部的扭矩，对于每个端子来说，第一组件不容易带动第一弯折部绕对应的主体部转动，不同的端子的第一弯折部之间的距离不易发生改变，第一组件和第二组件之间通过端子传输信号时，在高速下也能够保持较好的SI(信号(Signal)Integrity，信号完整性)性能，从而，提升电子设备的性能。
附图说明
图1表示现有技术中电子模块的示意图；
图2表示图1中端子的结构示意图；
图3a表示出了封装基板未安装于安装底座时图1中n1列的端子的俯视图的放大图；
图3b表示出了封装基板安装于安装底座后图1中n1列端子的俯视图的放大图；
图4a表示出了本申请实施例提供的一种电子模块的示意图；
图4b表示出了图4a中A处局部放大图；
图4c表示出了图4a中B处的局部放大图；
图5表示出了图4a中封装基板的仰视图；
图6表示出了图4a中安装底座的结构示意图；
图7表示出了图4a中电路板的俯视图；
图8表示出了图4a中端子的结构示意图；
图9表示出了图6中E’区域中的端子固定腔对应的多个端子的俯视图的放大图；
图10表示出了图4a中的第一组件通过封装基板与安装底座配合形成的组合体的俯视图；
图11a表示出了本申请实施例提供的另一种电子模块的局部示意图；
图11b表示出了本申请实施例提供的另一种电子模块的局部示意图；
图12表示出了本申请实施例提供的另一种电子模块的局部示意图；
图13表示出了图4a中部分端子与电路板中走线的位置关系图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的电子模块，首先说明一下其应用场景，该电子模块可以是手机、电脑或交换机等电子设备中。
图1表示现有电子模块中芯片通过封装基板和安装底座装配于电路板上时的示意图，请参考图1，现有的电子模块包括组件10、组件20和多个端子30，组件10包括封装基板12和安装于封装基板12上的芯片11，组件20包括电路板22和位于电路板22上的安装底座21安装底座21具有安装槽(即Socket)。图2表示出了图1中端子30的结构示意图，参考图2，每个端子30包括主体部32、连接于主体部32一端的弯折部31，以及连接于主体部32另一端的焊球33。回到图1，多个端子30均通过主体部32贯穿安装于安装底座21，且通常情况下，这些端子30呈阵列式分布，其中，在每个端子30中，弯折部31与封装基板12底面的一个焊盘(图1中未示出，该焊盘的表面平行于XOY面)抵接，焊球33与电路板22上的一个焊盘(图1中未示出，该焊盘的表面平行于XOY面)焊接。
结合图1和图2，定义每个端子30中弯折部31在电路板22的安装面S1(安装面S1平行于XOY面)上的正投影的延伸方向为该端子30的弯折部31的延伸方向(用T表示)。在对组件10和组件20进行组装时，沿封装基板12相对于安装底座21的滑动方向，使封装基板12的一端下倾，并沿着安装方向P(图1中X轴正方向)推动封装基板12相对于安装底座21滑动至使封装基板12触碰到安装底座21的安装槽的槽壁，再将封装基板12另一端下压至安装底座21的安装槽中。
图3a表示出了当未将封装基板12安装于安装底座21时图1中n1列的端子30的俯视图(沿Z轴负方向观察的视图)的放大图，由图3a可知，沿Y轴负方向，n1列的多个端子30依次为接地端子地(Ground)、信号端子信号(Signal)1P(+)、信号端子信号(Signal)1N(-)、接地端子地(Ground)、信号端子信号(Signal)2P(+)、信号端子信号(Signal)2N(-)和接地端子地(Ground)。其中，信号端子信号(Signal)1P(+)和信号端子信号(Signal)1N(-)组成一个P/N端子对。信号端子信号(Signal)2P(+)和信号端子信号(Signal)2N(-)组成一个P/N端子对。在自然状态下，n1列的每个端子30的弯折部31的延伸方向相互平行，均为T方向，如此，可确保n1列端子30中的每相邻两个端子30的弯折部31之间的距离适中。同时结合图1，但当欲将封装基板12安装于安装底座21时，需要沿着安装方向P推动封装基板12相对于安装底座21滑动，每个端子30的弯折部31会受到来自封装基板12的沿安装方向P的摩擦力，由于现有技术中每个端子30的弯折部31的延伸方向T与安装方向P之间存在夹角(例如该夹角为45°)，弯折部31容易失去平衡，易在上述焊盘的摩擦力的作用下发生旋转(旋转轴平行于Z轴)，每个端子30的弯折部31在封装基板12上的焊盘的摩擦力作用下，会向不同方向发生不同程度的偏移。
图3b表示出了当封装基板12沿着安装方向P相对于安装底座21滑动至设定位置、并被安装到安装槽内后n1列端子的俯视图的放大图。参考图3b，图1中的n1列的多个端子30中，信号端子信号(Signal)1P(+)的弯折部31和信号端子信号(Signal)1N(-)的弯折部31相互远离，导致信号端子信号(Signal)1P(+)和信号端子信号(Signal)1N(-)组成的端子对的差分阻抗变大，信号端子信号(Signal)2P(+)的弯折部31和信号端子信号(Signal)1N(-)弯折部31相互靠近，导致不同的P/N端子对之间串扰增加，以上两个因素都会导致在芯片11和电路板22之间通过端子30传输数据时，信号容易失真，特别是当高速传输数据时，信号失真情况越严重，即SI(Signal Integrity，信号完整性)性能劣化，只能适应25Gbps以下速率的数据传输速度。
为了解决上述技术问题，本申请实施例提供了一种电子模块：
示例性地，图4a表示出了本申请实施例提供的电子模块中第一组件装配于第二组件时的示意图。请参考图4a，本申请实施例提供的电子模块包括第一组件100、第二组件200和多个端子300。第一组件100包括芯片110和封装基板120，芯片110位于封装基板120的Z轴正方向一侧，其中，该芯片110可以是CPU(中央处理器，Central Processing Unit)和缓存等。第二组件200包括安装底座210和电路板220，其中，安装底座210放置于电路板220的Z轴正方向一侧，封装基板120安装于安装底座210背离电路板220的一侧。每个端子300贯穿安装底座210以实现对封装基板120和电路板220的信号连接。
示例性地，图5表示出了图4a中封装基板120的仰视图(沿Z轴方向观察的视图)，请参考图5，封装基板120包括基板本体121和分布于基板本体121底面(Z轴负方向上的表面，该表面示例性地平行于XOY面)的多个第一焊盘122。示例性地，上述多个第一焊盘122分成四组，这四组第一焊盘122一一对应地分布于基板本体121底面角部的E1区域、F1区域、G1区域和H1区域内。每组第一焊盘122均呈阵列分布，其中，定义行方向为X轴方向，列方向为Y轴方向，其中，E1区域中的每行第一焊盘122与F1区域中的一行第一焊盘122对齐设置，G1区域中的每一行第一焊盘122与H1区域中的一行第一焊盘122对齐设置，E1区域中的每列第一焊盘122与G1区域中的一列第一焊盘122对齐设置，F1区域中的每一列第一焊盘122与H1区域中的一列第一焊盘122对齐设置。但以上各组第一焊盘122的分布方式仅仅是示例性地，也可以是以其他形式分布，如所有第一焊盘122连续设置，且整体呈阵列分布。其中，芯片110安装于基板本体121的顶面(Z轴正方向上的表面)，并且，芯片110通过引脚等方式与基板本体121上的一些触点连接，实现芯片110与基板本体121另一侧的多个第一焊盘122电连接，芯片110与第一焊盘122的电连接方式可以是现有技术中已知的常用的连接方式，在此不再赘述。基板本体121与X轴平行的两个相对的侧边中间位置具有向基板本体121内部凹陷的定位凹陷(123a和123b)。
示例性地，图6表示出了图4a中安装底座210的结构示意图。请参考图6，安装底座210包括板状的底座本体211、位于底座本体211角部边缘的限位挡板(213e、213f、213g和213h)，位于与X轴平行的两个相对的侧边中间位置上的定位凸块(214a和214b)，以及，沿与X轴平行的两个相对的侧边分别延伸的加强结构(215a和215b)，加强结构(215a和215b)一方面可以对定位凸块(214a和214b)的结构强度进行加强，另一方面也可以对基板本体121具有初步限位作用。示例性地，底座本体211厚度方向上相对的两个表面均平行于XOY面，其中，在底座本体211靠近四个角部的位置分别具有E2区域、F2区 域、G2区域和H2区域，这四个区域中的每个区域中分别阵列分布有一组端子固定腔212。
示例性地，图7表示出了图4a中电路板220的俯视图。请参考图7，电路板220包括电路板本体221和分布于电路板本体221的安装面S2(示例性地，该安装面S2平行于XOY面)的多个第二焊盘222。电路板本体221具有E3区域、F3区域、G3区域和H3区域四个区域，上述多个第二焊盘222分为四组，每组第二焊盘222阵列式分布于上述四个区域中的一个区域。其中，在一个具体的实施方式中，第二焊盘222的焊接方式采用NSMD(铜箔定义焊盘)的方式，相对于SMD(阻焊定义焊盘)，能更好地提高第二焊盘222的位置精度，并且降低端子300与第二焊盘222的焊接难度。
示例性地，图8表示出了图4a中端子300的结构示意图。示例性地，端子300包括金属构件310和焊球320，金属构件310包括第一弯折部312和条状(仅仅是示例性的)的主体部311，第一弯折部312与主体部311的一端连接(如一体式连接)，焊球320与主体部311的另一端连接。
图4b表示出了图4a中A处局部放大图，结合图4a、图4b、图6和图8，示例性地，在对第一组件100和第二组件200进行组装时，根据实际需要，在部分或者全部端子固定腔212中，每个端子固定腔212中放置一个金属构件310，其中，金属构件310的主体部311贯穿于对应的端子固定腔212中，以与底座本体211固定连接，第一弯折部312暴露于底座本体211顶面(位于底座本体211的Z轴正方的一表面，该顶面也称为第二组件200的安装面S3，当第一组件100安装于第二组件200时，该安装面S3与第一组件100相对)一侧，再对与底座本体211固定好的上述多个金属构件310植球，使主体部311远离第一弯折部312的一端形成焊球320。再结合图7，将安装底座210放置于电路板220的顶面(Z轴正方向上的表面)，使E2区域与E3区域相对，F2区域与F3区域相对，G2区域与G3区域相对，H2区域与H3区域相对。以E2区域和E3区域为例，E2区域中的多个端子固定腔212与E3区域中的多个第二焊盘222一一相对，使每个端子300中的焊球320与E3区域中对应的第二焊盘222接触(图4b)，再利用热处理等手段使焊球320与对应的第二焊盘222固定连接，其他区域中的端子300设置方式参考区域E2中的端子300的设置方式。定义每个端子300的第一弯折部312在第二组件200的安装面S3的上的正投影的延伸方向为该端子300的第一弯折部312的延伸方向(用R表示)，其中，每个端子300的第一弯折部312的延伸方向R所在直线均平行于第一预设方向Q(示例性地，第一预设方向Q为X轴负方向)所在直线，也就是延伸方向R与第一预设方向Q相同或者相反，图9表示出了图6中E’区域中的端子固定腔212对应的多个端子300的俯视图的放大图，以图9为例，每个端子300的第一弯折部312的延伸方向R均与第一预设方向Q相反。接下来，将安装有芯片110的封装基板120安装于安装底座210，首先，需要将基板本体121的一端放入限位挡板(213e、213f、213g和213h)形成的槽状空间内，再沿着第一预设方向Q推动基板本体121，直至基板本体121的端部触碰到限位挡板213g和限位挡板213f时，将基板本体121下放至其底面与底座本体211的顶面平行，此时，基板本体121的四个角部与限位挡板(213e、213f、213g和213h)一一接触并被限位(参考图10)，定位凸块214a配合于定位凹陷123a，定位凸块214b配合于定位凹陷123b，实现对基板本体121和安装底座210的定位连接，其中，由于定位凸块(214a和214b)是设置在底座本体211对应侧边的中间位置，相对于设置在对应侧边的边缘位置，每组端子固定腔212距离对应的定位凸块(214a和214b)距离更近，有利于减小端子300与第一焊盘122对位的累积误 差，实现每个端子300的第一弯折部312与对应第一焊盘122的精准对位(参考图10)。示例性地，每个定位凸块(214a和214b)的横截面呈半圆形，在具体制作安装底座210时，可以以凸块(214a和214b)的横截面的圆心为基准，确定每个端子固定腔212的精确位置，提高端子固定腔212的位置精准度，并且，为了避免封装基板120与安装底座210反装，可以将定位凸块(214a和214b)的外径设置为一大一小，而且，也可以在底座本体211的两组相对的侧边的中间位置均设置定位凸块，基板本体121上定位凹陷作类似设置；此时，第一组件100所处位置称为第一设定位置，并且被限位挡板(213e、213f、213g和213h)和定位凸块(214a和214b)锁定在该第一设定位置，且E1区域与E2区域相对，F1区域与F2区域相对，G1区域与G2区域相对，H1区域与H2区域相对。以E1区域和E2区域为例，E2区域中的多个端子固定腔212与E3区域中的多个第一焊盘122一一相对，使每个端子300中的焊球320与E2区域中对应的第一焊盘122接触(图4b)，每个端子300使一对相对的第一焊盘122和第二焊盘222实现电连接。在一些情况下，第一焊盘122、第二焊盘222和端子固定腔212一一对应，即当第一模块100和第二模块如图4a所示的形式组装好后，每个端子固定腔212中的端子300分别与第一焊盘122和第二焊盘222一一对应连接。
在上述过程中，当沿着第一预设方向Q推动基板本体121时，基板本体121由于与暴露于底座本体211的顶面一侧的第一弯折部312直接接触，在基板本体121沿第一预设方向Q移动的过程中，基板本体121会给与其接触的第一弯折部312沿第一预设方向Q的摩擦力，而由于每个端子300的第一弯折部312的延伸方向R与第一预设方向Q相同或者相反，则每个端子300的第一弯折部312所受到的来自基板本体121的摩擦力的力臂为零，第一弯折部312所受到的力矩为零，所以第一弯折部312不易绕主体部311转动，因此，不同的端子300的第一弯折部312之间的距离不易发生改变，继续以图9为例，图9中，标注P的端子300为P信号端子，标注N的端子300为N信号端子，标注为G的为接地端子，由图9可知，一个P/N端子对中的P信号端子和N信号端子之间的间隙不易发生变化，从而，P信号端子和N信号端子组成的端子对阻抗不易发生变化；并且，可以知晓的是，不同P/N端子对中的信号端子(P信号端子和N信号端子)之间的间隙也不易变化，从而，减少了不同P/N端子对之间的串扰；此外，继续以图9为例，在一个P/N端子对中，沿着P信号端子和N信号端子的排列方向，P信号端子到相邻的接地端子的距离D1与P信号端子到相邻的接地端子的距离D2相等或者相近，如图9中具有4条等间隔设置的行标准线(L1、L2、L3和L4)，每个端子300(如P信号端子)中心线相对于对应的行标准线(如L3)的偏移量d1小于或等于d2，其中，d2取P信号端子与N信号端子分别对应的第一焊盘122的中心线之间的距离、P信号端子与相邻的接地端子分别对应的第一焊盘122的中心线之间的距离，以及，N信号端子与相邻的接地端子分别对应的第一焊盘122的中心线之间的距离中的最小值的0.2倍；即便以较高的速度在第一组件100和电路板220之间通过端子300传输数据，信号也不容易失真，电子模块的SI性能得到提高。
需要说明的是，以上，每个端子300的第一弯折部312的延伸方向R所在直线平行于第一预设方向Q所在直线，仅仅是示例性的说明，只要满足如下条件，同一个端子300中的第一弯折部312就不容易相对于对应的主体部311旋转：基板本体121施加给第一弯折部312的摩擦力所产生的力矩，使第一弯折部312施加给主体部311的扭矩小于或等于主体部311因自身材料应力(主体部311多具有一定弹性)所产生的扭矩，主体部311不容 易绕自身轴线发生扭曲变形；也可以换句话说，基板本体121施加给第一弯折部312的摩擦力所产生的力矩小于或等于主体部311施加给第一弯折部312的扭矩；从而，第一弯折部312不容易绕第一主体部311的轴线发生旋转。
例如，当金属构件310的材质为铜合金和磷青铜等常用材质时，使每个端子300的第一弯折部312的延伸方向R所在直线与第一预设方向Q所在直线之间的夹角介于0°至15°之间，示例性地，该夹角可以是0°、2°、5°、7°、8°、10°、11°、13°或者15°；此时，由于基板本体121施加给第一弯折部312的摩擦力所对应的力臂很小，基板本体121施加给第一弯折部312的摩擦力所产生的力矩较小，不足以使第一弯折部312施加给主体部311的扭矩克服主体部311因自身材料应力所产生的扭矩，第一弯折部312也就不容易相对于主体部311旋转。
图4c表示出了图4a中B处的局部放大图，请结合图4a、图4b、图4c和图6，图4b中的3个端子300依次对应于图6中H2区域沿Y轴正方向上的第一排的三个端子固定腔212，图4c中的3个端子300依次对应于图6中G2区域沿Y轴正方向上的第一排的三个端子固定腔212，图4b中3个端子300的第一弯折部312的延伸方向R与图4c中3个端子300的第一弯折部312的延伸方向R一致，其他每一行端子300也可以参照图4b和图4c中的端子300的形式设置。
与上述形式形成对比的，图11a表示出了图4a所示的电子模块的一种变形，图11a相对于图4a的区别在于，A’处(对应于图4a中的A处)的3个端子300的第一弯折部312与B’处(对应于图4a中B处)的3个端子300的第一弯折部312相向设置，示例性地，A’处的3个端子300的第一弯折部312的延伸方向R与B’处的3个端子300的第一弯折部312的延伸方向R在同一条直线上且方向相反；当封装基板120安装在安装底座210中时，每个端子300的金属构件310都会被第一焊盘122压缩变形，具体地，对于每个端子300，第一弯折部312沿自身延伸方向R滑动，主体部311沿与第一弯折部312的延伸方向R相反的方向拱起，由于主体部311和第一弯折部312自身材料弹性，第一弯折部312会给对应的第一焊盘122一个与该第一弯折部312延伸方向R相反的摩擦力；而由于A’处的3个端子300与B’处的3个端子300位于同一行上，且A’和B’两处中端子300的第一弯折部312的延伸方向R方向相反，A’和B’两处中端子300的第一弯折部312分别施加给对应的第一焊盘122方向相反的摩擦力，使封装基板210整体受到的A’和B’两处中端子300的摩擦力相互抵消，有利于保持封装基板210的受力平衡，其中的每个第一焊盘122不易与对应端子300错位，而其他行的端子300也可以参考A’和B’两处中端子300的形式设置。
图11b表示出了图4a所示的电子模块的另一种变形，图11b与图11a的区别在于，A”处(对应于图4a中的A处)的3个端子300的第一弯折部312与B”处(对应于图4a中B处)的3个端子300的第一弯折部312相背设置，示例性地，A”处的3个端子300的第一弯折部312的延伸方向R与B”处的3个端子300的第一弯折部312的延伸方向R在同一条直线上且方向相反；从而，与图11a中的电子模块类似的，封装基板210整体受到的A”和B”两处中端子300的摩擦力相互抵消，保持封装基板210受力平衡。
应当说明的是，在图11a中，A’处的3个端子300的第一弯折部312与B’处的3个端子300的第一弯折部312相向设置，也可以是A’处的3个端子300的第一弯折部312的延伸方向R所在直线和B’处的3个端子300的第一弯折部312的延伸方向R所在直线 均与第一预设方向P所在直线形成一定夹角(如可以5°、10°和15°等角度中的任意一个夹角度数)；这样，A’处的端子300的第一弯折部312施加给封装基板210的摩擦力和B’处的端子300的第一弯折部312施加给封装基板210的摩擦力分别在X轴方向上的分力方向相反且至少部分相互抵消，也有利于保持封装基板210的受力平衡。图11b中的各行端子300也可以做类似设置。
无论是在图11a的中A’处和B’处，还是图11b中A”处和B”处，在同一行端子300中，并且，在每一行端子300中，当第一弯折部312朝向第一预设方向Q的端子300的数量等于第一弯折部312的背离第一预设方向Q的端子300的数量时，有利于同一行端子施加给封装基板210的摩擦力充分抵消，甚至完全抵消；此外，第一弯折部312的朝向第一预设方向Q的端子300连续设置(如，图11a中的B’处的端子300和图11b处中的A’处端子300)，第一弯折部312的背离第一预设方向Q的端子300也连续设置(如，图11a中的A’处的端子300和图11b处中的B’处端子300)，这仅仅是示例性的设置形式，这样，对于同一行端子300，有利于当第一焊盘122间隔均匀的情况下，保持第一弯折部312的延伸方向R相同的端子300的主体部311之间以及第一弯折部312的间隙均匀，从而，有利于避免同一P/N端子对的阻抗加大，或者不同P/N端子对的串扰加大，进一步提升电子模块的SI性能。但，应当理解的是，当第一弯折部312的朝向不同的端子300间隔设置时，也可以在一定程度上达到使封装基板210受力平衡的作用。
图12表示出了图4a所示的电子模块的另一种变形，A”’处对应于图4a中的A处，图12中的电子模块与图4a中的电子模块的区别在于，每个端子300中的焊球320替换为第二弯折部313，每个端子300所包括的第一弯折部312、第二弯折部313和主体部311可以是一体成型的金属构件；与第一弯折部312类似地，定义每个端子300的第二弯折部313在第二组件200的安装面S3的上的正投影的延伸方向为该端子300的第二弯折部313的延伸方向(用V表示)；在将安装底座210装配于电路板220时，通常情况下，需要推动底座本体211沿着第二预设方向W相对于电路板本体221滑动一定距离(如在电路板本体221上设置沿第二预设方向W延伸的限位壁，底座本体211沿着该限位壁滑动，底座本体211与电路板本体221滑动配合的结构形式可以是本领域已知的常用的现有技术，在此不再赘述)，再将底座本体211相对于电路板本体221锁定(可以是卡接)在第二设定位置；示例性地，使每个第二弯折部313的延伸方向V所在直线平行于第二预设方向W所在直线，也就是第二弯折部313的延伸方向V与第二预设方向W相同或者相反，此时，在推动底座本体211沿着第二预设方向W相对于电路板本体221运动时，电路板本体221施加给第二弯折部313的摩擦力的力臂为零，因此，该摩擦力的力矩不足以使第二弯折部313相对于主体部311发生旋转；总之，通过使用刚性较好的材料制作端子300，或者，使端子300中第二弯折部313的延伸方向V满足一定要求等方式，使基板本体121施加给第二弯折部313的摩擦力所产生的力矩小于或等于主体部311施加给第二弯折部313的扭矩，第二弯折部313就不易相对于主体部311旋转；例如，例如，当端子300的材质为铜合金和磷青铜等常用材料时，使每个端子300的第二弯折部313的延伸方向V所在直线与第二预设方向W所在直线之间的夹角介于0°至15°之间，如，该夹角可以是0°、2°、5°、7°、8°、10°、11°、13°或者15°，此时，第二弯折部313不容易相对于主体部311旋转；从而，提升电子模块的SI性能。
在一个具体的实施例中，可以使每个端子300中第一弯折部312的延伸方向R与第二 弯折部313的延伸方向V相反，如当第一预设方向Q和第二预设方向P方向相反时，第一弯折部312的挤压变形方向与第二弯折部313的挤压变形方向相反，第一弯折部312和第二弯折部313所受到的反向摩擦力方向相反，有利于该端子300的受力平衡。
图13表示出了本申请实施例提供的电子模块中端子300的排列方式与电路板220中走线(如223a和223b)的位置关系图，请参考图13，多个端子300阵列分布于电路板220表面，其中，以走线223a为例，一对P信号端子和N信号端子分别与电路板本体221上的走线223a电连接，走线223a先沿着X轴正方向延伸，且在沿X轴方向延伸的过程中，其平行于两侧的端子的排列方向(如图13中的3行第1列的P信号端子与该P信号端子X轴正方向上的接地端子的排列方向)，接着走线223a沿着Y轴正方向延伸，且在沿着Y轴延伸的过程中，其平行于两侧的端子的排列方向(如图13中第3行和第4行中的第2列的两个接地端子的排列方向)，并且，两个走线223a整体始终沿着其两侧的端子的中间位置延伸，有利于避免走线223a离其中一侧的端子300过近，影响该端子300的性能，进而，提升电子模块的SI性能。其中，走线也可以只沿着一个方向扇出，如走线223b。
需要说明的是，以上第一组件100不限于芯片110与封装基板120的组合形式，如第一组件也可以是寄生电路板通过端子300与第二组件200中的电路板220配合；此外，第二组件200也并不局限于电路板220与安装底座210的组合形式，也可以是其他具有用来传输信号的焊盘(类似于第二焊盘222)的结构。
基于相同的发明构思，本申请实施例还提供了一种电子设备，该电子设备可以是计算机、手机和服务器等，该电子设备包括存储模块和上述实施例提供的电子模块，其中，存储模块与电子模块中的第一组件电连接(该“电连接”可以是直接连接，也可以是间接连接)；示例性地，请结合图4a至图13，通过设置该电子模块，由于在第一组件100沿第一预设方向Q相对于第二组件200滑动时，第一组件100施加给每个端子300的第一弯折部312的摩擦力的力矩小于或等于主体部311施加给第一弯折部312的扭矩，第一弯折部312不容易相对于对应的主体部311旋转，提升电子模块的SI性能，从而，提升电子设备的性能。此外，芯片110为CPU时，该CPU与存储模块电连接，可读取存储模块中的数据或者向存储模块中写入数据。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种电子模块，其特征在于，包括：
    第一组件和第二组件，所述第一组件沿第一预设方向与所述第二组件滑动配合、并可相对于所述第二组件锁定在第一设定位置，其中，所述第一组件朝向所述第二组件的面具有多个第一焊盘；
    与所述多个第一焊盘中的至少部分一一对应的多个端子，每个端子包括主体部及与所述主体部连接的第一弯折部，其中，所述主体部与所述第二组件固定连接，所述第一弯折部与对应的第一焊盘抵接；
    在所述第一组件沿所述第一预设方向相对于所述第二组件滑动时，所述第一组件施加给每个端子的第一弯折部的摩擦力的力矩小于或等于所述主体部施加给所述第一弯折部的扭矩。
  2. 根据权利要求1所述的电子模块，其特征在于，每个端子的第一弯折部的延伸方向所在直线与所述第一预设方向所在直线的夹角介于0°至15°之间。
  3. 根据权利要求1或2所述的电子模块，其特征在于，所述多个端子呈阵列分布，沿所述第一预设方向分布的每一行端子中，一部分端子的第一弯折部与另一部分端子的第一弯折部的相向设置或者相背设置。
  4. 根据权利要求3所述的电子模块，其特征在于，沿所述第一预设方向分布的每一行端子中，第一弯折部朝向所述第一预设方向的端子数量与第一弯折部背离所述第一预设方向的端子的数量相等。
  5. 根据权利要求4所述的电子模块，其特征在于，沿所述第一预设方向分布的每一行端子中，第一弯折部朝向所述第一预设方向的端子连续设置，且第一弯折部背离所述第一预设方向的端子连续设置。
  6. 根据权利要求1至5任一项所述的电子模块，其特征在于，所述第一组件包括封装基板和芯片，所述封装基板包括基板本体和所述多个第一焊盘，所述多个第一焊盘与所述芯片分别设置在所述基板本体相对的两个表面；且所述芯片与所述多个第一焊盘电连接。
  7. 根据权利要求6所述的电子模块，其特征在于，所述第二组件包括电路板和安装底座，所述电路板包括电路板本体以及设置在所述电路板本体的多个第二焊盘；其中，
    所述多个端子与所述多个第二焊盘一一对应连接；
    所述安装底座与所述电路板连接，所述多个端子的主体部贯穿所述安装底座且与所述安装底座固定连接。
  8. 根据权利要求7所述的电子模块，其特征在于，每个端子还包括连接于主体部远离第一弯折部的一端的第二弯折部，每个端子的第二弯折部与一个第二焊盘抵接；
    所述安装底座沿第二预设方向与所述电路板本体滑动配合、并可相对于所述电路板本体锁定在第二设定位置；
    当所述安装底座沿所述第二预设方向相对于所述电路板本体滑动时，所述电路板本体施加给每个端子的第二弯折部的摩擦力的力矩小于或等于所述主体部施加给所述第二弯折部的扭矩。
  9. 根据权利要求8所述的电子模块，其特征在于，每个端子的第二弯折部的延伸方向所在直线与所述第二预设方向所在直线的夹角介于0°至15°之间。
  10. 根据权利要求8或9所述的电子模块，其特征在于，在每个端子中，第一弯折部的延伸方向与第二弯折部的延伸方向相反。
  11. 根据权利要求7至10任一项所述的电子模块，其特征在于，所述电路板还包括形成于所述电路板本体的多条走线，所述多条走线与至少部分端子一一对应地信号连接；
    其中，当所述多个端子呈阵列分布时，每条走线沿相邻的两列和/或两列端子之间的中间位置延伸，并且平行于该走线两侧的端子的排列方向。
  12. 根据权利要求7至11任一项所述的电子模块，其特征在于，所述封装基板的至少一组相对的两个侧边中，每条侧边的中间与所述安装底座定位连接。
  13. 一种电子设备，其特征在于，包括权利要求1至12任一项所述的电子模块和存储模块，所述第一组件与所述存储模块电连接。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057652A2 (en) * 2003-12-08 2005-06-23 Neoconix, Inc. Connector for making electrical contact at semiconductor scales and method for forming same
US20050236719A1 (en) * 2004-04-22 2005-10-27 Ted Ju IC module assembly
CN101944523A (zh) * 2009-07-03 2011-01-12 新光电气工业株式会社 具有连接端子的基板
US20120258636A1 (en) * 2011-04-11 2012-10-11 Shinko Electric Industries Co., Ltd. Connecting terminal structure, socket and electronic package

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013186Y2 (ja) * 1980-11-21 1985-04-26 日本電信電話株式会社 電気コネクタ
JPS5789284A (en) 1980-11-25 1982-06-03 Sharp Corp Semiconductor laser
JPH0431282A (ja) 1990-05-29 1992-02-03 Nec Corp 移動用車輪内蔵型電子交換機のコンテナ
JP2533490Y2 (ja) * 1990-07-06 1997-04-23 株式会社エンプラス Ｉｃソケット
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US6270357B1 (en) * 1999-05-06 2001-08-07 Wayne K. Pfaff Mounting for high frequency device packages
JP2002124742A (ja) 2000-10-17 2002-04-26 Canon Inc プリント配線板、接続部品、及び電子機器
CN101316014B (zh) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 电连接装置及其组装方法
JP5561470B2 (ja) 2010-02-19 2014-07-30 新光電気工業株式会社 ソケット、該ソケットと電子装置との接続構造、および半導体装置
CN202503139U (zh) * 2011-04-01 2012-10-24 番禺得意精密电子工业有限公司 电连接器
US8928134B2 (en) * 2012-12-28 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Package on package bonding structure and method for forming the same
US9832876B2 (en) 2014-12-18 2017-11-28 Intel Corporation CPU package substrates with removable memory mechanical interfaces
US9755335B2 (en) * 2015-03-18 2017-09-05 Hsio Technologies, Llc Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
US9788425B2 (en) * 2015-04-09 2017-10-10 Via Alliance Semiconductor Co., Ltd. Electronic package assembly
US10880994B2 (en) * 2016-06-02 2020-12-29 Intel Corporation Top-side connector interface for processor packaging
JP2018174018A (ja) 2017-03-31 2018-11-08 タイコエレクトロニクスジャパン合同会社 ソケット
US20190157253A1 (en) * 2019-01-22 2019-05-23 Intel Corporation Circuit Systems Having Memory Modules With Reverse Orientations

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057652A2 (en) * 2003-12-08 2005-06-23 Neoconix, Inc. Connector for making electrical contact at semiconductor scales and method for forming same
US20050236719A1 (en) * 2004-04-22 2005-10-27 Ted Ju IC module assembly
CN101944523A (zh) * 2009-07-03 2011-01-12 新光电气工业株式会社 具有连接端子的基板
US20120258636A1 (en) * 2011-04-11 2012-10-11 Shinko Electric Industries Co., Ltd. Connecting terminal structure, socket and electronic package

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CN113130432A (zh) 2021-07-16
JP2023509028A (ja) 2023-03-06

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