WO2021130600A1 - 半導体装置、半導体装置の作製方法 - Google Patents

半導体装置、半導体装置の作製方法 Download PDF

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Publication number
WO2021130600A1
WO2021130600A1 PCT/IB2020/061920 IB2020061920W WO2021130600A1 WO 2021130600 A1 WO2021130600 A1 WO 2021130600A1 IB 2020061920 W IB2020061920 W IB 2020061920W WO 2021130600 A1 WO2021130600 A1 WO 2021130600A1
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Prior art keywords
insulator
oxide
conductor
film
region
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English (en)
French (fr)
Japanese (ja)
Inventor
山崎舜平
掛端哲弥
神保安弘
恵木勇司
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to US17/786,271 priority Critical patent/US12414284B2/en
Priority to JP2021566379A priority patent/JP7710994B2/ja
Priority to KR1020227021362A priority patent/KR20220120577A/ko
Priority to CN202080090636.3A priority patent/CN114868255A/zh
Publication of WO2021130600A1 publication Critical patent/WO2021130600A1/ja
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    • H10B—ELECTRONIC MEMORY DEVICES
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
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    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
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    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
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    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
    • H10P14/6532—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour by exposure to a plasma
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2

Definitions

  • One aspect of the present invention relates to transistors, semiconductor devices, and electronic devices. Further, one aspect of the present invention relates to a method for manufacturing a semiconductor device. Further, one aspect of the present invention relates to a semiconductor wafer and a module.
  • the semiconductor device refers to all devices that can function by utilizing the semiconductor characteristics.
  • a semiconductor device such as a transistor, a semiconductor circuit, an arithmetic unit, and a storage device are one aspect of the semiconductor device.
  • Display devices liquid crystal display devices, light emitting display devices, etc.
  • projection devices lighting devices
  • electro-optical devices power storage devices
  • storage devices semiconductor circuits
  • image pickup devices electronic devices, and the like may be said to have semiconductor devices.
  • One aspect of the present invention is not limited to the above technical fields.
  • One aspect of the invention disclosed in the present specification and the like relates to a product, a method, or a manufacturing method. Also, one aspect of the invention relates to a process, machine, manufacture, or composition of matter.
  • a CPU is an aggregate of semiconductor elements having a semiconductor integrated circuit (at least a transistor and a memory) formed into a chip by processing a semiconductor wafer and having electrodes as connection terminals formed therein.
  • IC chips Semiconductor circuits (IC chips) such as LSIs, CPUs, and memories are mounted on circuit boards, for example, printed wiring boards, and are used as one of various electronic device components.
  • transistors are widely applied in electronic devices such as integrated circuits (ICs) and image display devices (also simply referred to as display devices).
  • ICs integrated circuits
  • image display devices also simply referred to as display devices.
  • Silicon-based semiconductor materials are widely known as semiconductor thin films applicable to transistors, but oxide semiconductors are attracting attention as other materials.
  • Patent Document 1 discloses a low power consumption CPU that applies the characteristic that the leakage current of a transistor using an oxide semiconductor is small.
  • Patent Document 2 discloses a storage device that can retain the storage contents for a long period of time by applying the characteristic that the leakage current of a transistor using an oxide semiconductor is small.
  • One aspect of the present invention is to provide a semiconductor device having little variation in transistor characteristics. Alternatively, one aspect of the present invention is to provide a semiconductor device having good reliability. Alternatively, one aspect of the present invention is to provide a semiconductor device having good electrical characteristics. Alternatively, one aspect of the present invention is to provide a semiconductor device having a large on-current. Alternatively, one aspect of the present invention is to provide a semiconductor device capable of miniaturization or high integration. Alternatively, one aspect of the present invention is to provide a semiconductor device having low power consumption.
  • a first insulator is formed, an oxide film is formed on the first insulator, a first heat treatment is performed, and a first conductive film is formed on the oxide film.
  • the first insulating film is formed in order, and the oxide film, the first conductive film, and the first insulating film are processed into an island shape to form an oxide, a conductive layer, and an insulating layer.
  • a second insulator is formed on the insulator, the oxide, the conductive layer, and the insulating layer of 1, and a third insulator is formed on the second insulator, and the conductive layer and the insulating layer are formed.
  • a second insulator, and a third insulator are formed with openings that reach the oxide, and by forming the openings, a first conductor and a second conductor are formed from the conductive layer, and the insulating layer is formed.
  • a fourth insulator and a fifth insulator are formed from the insulator, and a second heat treatment is performed to form a second insulating film on the third insulator and on the opening to form a second insulating film.
  • a third insulating film is formed on the film, microwave treatment is performed, a second conductive film is formed on the third insulating film, and the second insulating film, the third insulating film, and the third insulating film are formed.
  • the insulating film is a method for manufacturing a semiconductor device, which is formed by the PEALD method using a gas containing silicon and not containing hydrocarbons and an oxidizing gas.
  • the film formation by the PEALD method includes the first step of introducing a gas containing silicon and not containing a hydrocarbon and an oxidizing gas into the reaction chamber, and the gas containing silicon and not containing a hydrocarbon.
  • the second step is to stop the introduction of the gas and purge the gas containing silicon and not hydrocarbons remaining in the reaction chamber, and the third step is to apply high frequency power to generate plasma by the oxidizing gas.
  • the gas containing silicon and not containing hydrocarbon is selected from SiH 4 , Si 2 H 6 , SiF 4 , SiCl 4 , SiBr 4 , SiH 2 Cl 2 , and SiH 2 I 2. It preferably comprises one or more, and the oxidizing gas comprises any one or more selected from O 2 , O 3 , N 2 O, NO 2, and H 2 O.
  • the gas containing silicon and not containing hydrocarbon is SiH 4 and the oxidizing gas is N 2 O.
  • the pressure in the reaction chamber in the first step is preferably 400 Pa or more and 1000 Pa or less.
  • the temperature of the first heat treatment is higher than the temperature of the second heat treatment.
  • one aspect of the present invention is an oxide, a first conductor on the oxide, a second conductor, a first insulator on the first conductor, and a second conductor.
  • the third insulator has a region overlapping the oxide
  • the fifth insulator is an oxide, a first conductor, a second conductor, and a first insulator.
  • the fifth insulator is a semiconductor device containing nitrogen, oxygen, and silicon, each having a region in contact with the insulator to the fourth insulator.
  • the sixth insulator contains hafnium.
  • the film thickness of the sixth insulator is preferably 0.5 nm or more and 5.0 nm or less.
  • the film thickness of the fifth insulator is preferably 0.5 nm or more and 15.0 nm or less.
  • the oxide is preferably an oxide semiconductor containing any one or more selected from In, Ga, or Zn.
  • one aspect of the present invention it is possible to provide a semiconductor device having little variation in transistor characteristics.
  • one aspect of the present invention can provide a semiconductor device with good reliability.
  • one aspect of the present invention can provide a semiconductor device having good electrical characteristics.
  • one aspect of the present invention can provide a semiconductor device having a large on-current.
  • one aspect of the present invention can provide a semiconductor device with low power consumption.
  • FIG. 1A is a top view of a semiconductor device according to an aspect of the present invention.
  • 1B to 1D are cross-sectional views of a semiconductor device according to an aspect of the present invention.
  • FIG. 2A is a top view of a semiconductor device according to an aspect of the present invention.
  • 2B to 2D are cross-sectional views of a semiconductor device according to an aspect of the present invention.
  • FIG. 3 is a cross-sectional view of a semiconductor device according to an aspect of the present invention.
  • FIG. 4A is a diagram illustrating classification of the crystal structure of IGZO.
  • FIG. 4B is a diagram illustrating an XRD spectrum of a CAAC-IGZO film.
  • FIG. 4C is a diagram for explaining the microelectron diffraction pattern of the CAAC-IGZO film.
  • FIG. 5 is a diagram illustrating a process flow which is one aspect of the present invention.
  • 6A and 6B are diagrams illustrating a film formation sequence which is one aspect of the present invention.
  • FIG. 7A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 7B to 7D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 8A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 8B to 8D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 9A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 9B to 9D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 10A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 10B to 10D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 11A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 11B to 11D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 10A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 10B to 10D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 11A is
  • FIG. 12A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 12B to 12D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 13A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 13B to 13D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 14A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 14B to 14D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • 15A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 15B to 15D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 16A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 16B to 16D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 17A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 17B to 17D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • 18A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 18B to 18D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 19A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 19B to 19D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 20A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 20B to 20D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • 21A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 21B to 21D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 22A is a top view showing a method for manufacturing a semiconductor device according to an aspect of the present invention.
  • 22B to 22D are cross-sectional views showing a method of manufacturing a semiconductor device according to an aspect of the present invention.
  • FIG. 23 is a top view illustrating the microwave processing apparatus according to one aspect of the present invention.
  • FIG. 24 is a cross-sectional view illustrating a microwave processing apparatus according to an aspect of the present invention.
  • FIG. 25 is a cross-sectional view illustrating a microwave processing apparatus according to an aspect of the present invention.
  • FIG. 26 is a cross-sectional view illustrating a microwave processing apparatus according to an aspect of the present invention.
  • 27A and 27B are cross-sectional views of a semiconductor device according to an aspect of the present invention.
  • FIG. 28 is a cross-sectional view showing the configuration of a storage device according to one aspect of the present invention.
  • FIG. 29 is a cross-sectional view showing the configuration of the storage device according to one aspect of the present invention.
  • FIG. 30A is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • FIG. 30B is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • FIG. 31A is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • FIG. 31B is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • FIG. 32 is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • FIG. 33 is a cross-sectional view of the semiconductor device according to one aspect of the present invention.
  • 34A and 34B are block diagrams showing a configuration example of a storage device according to an aspect of the present invention.
  • 35A to 35H are circuit diagrams showing a configuration example of a storage device according to one aspect of the present invention.
  • 36A and 36B are schematic views of a semiconductor device according to one aspect of the present invention.
  • 37A and 37B are diagrams illustrating an example of an electronic component according to an aspect of the present invention.
  • 38A to 38E are schematic views of a storage device according to an aspect of the present invention.
  • 39A to 39H are diagrams showing an electronic device according to an aspect of the present invention.
  • FIG. 40 is a diagram illustrating an ALD window according to this embodiment.
  • FIG. 41 is a diagram plotting GPCs at each substrate temperature according to this embodiment.
  • FIG. 42A is a STEM cross-sectional photograph according to this embodiment.
  • FIG. 42B is a diagram summarizing the film thickness measurement results.
  • the size, layer thickness, or area may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale.
  • the drawings schematically show ideal examples, and are not limited to the shapes or values shown in the drawings. For example, in an actual manufacturing process, layers, resist masks, etc. may be unintentionally reduced due to processing such as etching, but they may not be reflected in the figure for the sake of easy understanding. Further, in the drawings, the same reference numerals may be used in common between different drawings for the same parts or parts having similar functions, and the repeated description thereof may be omitted. Further, when referring to the same function, the hatch pattern may be the same and no particular sign may be added.
  • a top view also referred to as a "plan view”
  • a perspective view etc.
  • the description of some components may be omitted.
  • some hidden lines may be omitted.
  • the ordinal numbers attached as the first, second, etc. are used for convenience, and do not indicate the process order or the stacking order. Therefore, for example, the "first” can be appropriately replaced with the “second” or “third” for explanation.
  • the ordinal numbers described in the present specification and the like may not match the ordinal numbers used to specify one aspect of the present invention.
  • X and Y are connected, the case where X and Y are electrically connected and the case where X and Y function. It is assumed that the case where X and Y are directly connected and the case where X and Y are directly connected are disclosed in the present specification and the like. Therefore, it is not limited to a predetermined connection relationship, for example, a connection relationship shown in a figure or a sentence, and a connection relationship other than the connection relationship shown in the figure or the sentence is also disclosed in the figure or the sentence.
  • X and Y are assumed to be objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).
  • a transistor is an element having at least three terminals including a gate, a drain, and a source. It also has a region (hereinafter, also referred to as a channel forming region) in which a channel is formed between the drain (drain terminal, drain region or drain electrode) and the source (source terminal, source region or source electrode). A current can flow between the source and the drain through the channel formation region.
  • the channel forming region means a region in which a current mainly flows.
  • source and drain functions may be interchanged when transistors with different polarities are used or when the direction of current changes during circuit operation. Therefore, in the present specification and the like, the terms source and drain may be used interchangeably.
  • the channel length is, for example, the source in the top view of the transistor, the region where the semiconductor (or the portion where the current flows in the semiconductor when the transistor is on) and the gate electrode overlap each other, or the channel formation region.
  • the channel length does not always take the same value in all regions. That is, the channel length of one transistor may not be fixed to one value. Therefore, in the present specification, the channel length is set to any one value, the maximum value, the minimum value, or the average value in the channel formation region.
  • the channel width is, for example, the channel length direction in the region where the semiconductor (or the portion where the current flows in the semiconductor when the transistor is on) and the gate electrode overlap each other in the top view of the transistor, or in the channel formation region. Refers to the length of the channel formation region in the vertical direction with reference to. In one transistor, the channel width does not always take the same value in all regions. That is, the channel width of one transistor may not be fixed to one value. Therefore, in the present specification, the channel width is set to any one value, the maximum value, the minimum value, or the average value in the channel formation region.
  • the channel width in the region where the channel is actually formed (hereinafter, also referred to as “effective channel width”) and the channel width shown in the top view of the transistor. (Hereinafter, also referred to as “apparent channel width”) and may be different.
  • the effective channel width may be larger than the apparent channel width, and the influence thereof may not be negligible.
  • the proportion of the channel forming region formed on the side surface of the semiconductor may be large. In that case, the effective channel width is larger than the apparent channel width.
  • channel width when simply described as a channel width, it may refer to an apparent channel width.
  • channel width may refer to an effective channel width.
  • the channel length, channel width, effective channel width, apparent channel width, and the like can be determined by analyzing a cross-sectional TEM image or the like.
  • the semiconductor impurities refer to, for example, other than the main components constituting the semiconductor.
  • an element having a concentration of less than 0.1 atomic% can be said to be an impurity.
  • the inclusion of impurities may result in, for example, an increase in the defect level density of the semiconductor, a decrease in crystallinity, and the like.
  • the impurities that change the characteristics of the semiconductor include, for example, Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, Group 15 elements, and oxide semiconductors.
  • transition metals other than the main component such as hydrogen, lithium, sodium, silicon, boron, phosphorus, carbon, and nitrogen. Water may also function as an impurity.
  • the oxide semiconductor to an oxygen vacancy V O: also referred to as oxygen vacancy
  • silicon oxide nitride has a higher oxygen content than nitrogen as its composition.
  • silicon nitride oxide has a higher nitrogen content than oxygen in its composition.
  • aluminum nitride has a higher oxygen content than nitrogen in its composition.
  • aluminum nitride has a higher nitrogen content than oxygen in its composition.
  • hafnium oxide nitriding has a higher oxygen content than nitrogen in its composition.
  • hafnium nitride has a higher nitrogen content than oxygen in its composition.
  • the term “insulator” can be paraphrased as an insulating film or an insulating layer.
  • the term “conductor” can be rephrased as a conductive film or a conductive layer.
  • semiconductor can be paraphrased as a semiconductor film or a semiconductor layer.
  • parallel means a state in which two straight lines are arranged at an angle of -10 degrees or more and 10 degrees or less. Therefore, the case of -5 degrees or more and 5 degrees or less is also included.
  • approximately parallel means a state in which two straight lines are arranged at an angle of -30 degrees or more and 30 degrees or less.
  • vertical means a state in which two straight lines are arranged at an angle of 80 degrees or more and 100 degrees or less. Therefore, the case of 85 degrees or more and 95 degrees or less is also included.
  • approximately vertical means a state in which two straight lines are arranged at an angle of 60 degrees or more and 120 degrees or less.
  • a metal oxide is a metal oxide in a broad sense. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also referred to as Oxide Semiconductor or simply OS) and the like. For example, when a metal oxide is used in the semiconductor layer of a transistor, the metal oxide may be referred to as an oxide semiconductor. That is, when it is described as an OS transistor, it can be rephrased as a transistor having a metal oxide or an oxide semiconductor.
  • normally off means that when a potential is not applied to the gate or a ground potential is applied to the gate, the drain current per 1 ⁇ m of the channel width flowing through the transistor is 1 ⁇ 10 ⁇ at room temperature. It means that it is 20 A or less, 1 ⁇ 10 -18 A or less at 85 ° C, or 1 ⁇ 10 -16 A or less at 125 ° C.
  • FIGS. 1A to 1D are a top view and a cross-sectional view of a semiconductor device having a transistor 200.
  • FIG. 1A is a top view of the semiconductor device.
  • 1B to 1D are cross-sectional views of the semiconductor device.
  • FIG. 1B is a cross-sectional view of the portion shown by the alternate long and short dash line of A1-A2 in FIG. 1A, and is also a cross-sectional view of the transistor 200 in the channel length direction.
  • FIG. 1C is a cross-sectional view of the portion shown by the alternate long and short dash line of A3-A4 in FIG.
  • FIG. 1A is also a cross-sectional view of the transistor 200 in the channel width direction.
  • FIG. 1D is a cross-sectional view of the portion shown by the alternate long and short dash line in FIG. 1A.
  • FIG. 1A In the top view of FIG. 1A, some elements are omitted for the purpose of clarifying the figure.
  • the semiconductor device of one aspect of the present invention includes an insulator 212 on a substrate (not shown), an insulator 214 on the insulator 212, a transistor 200 on the insulator 214, and an insulator 280 on the transistor 200.
  • Insulator 282 on Insulator 280 Insulator 282a and Insulator 282b
  • Insulator 283 on Insulator 282 Insulator 274 on Insulator 283, Insulator 283, and Insulator 274.
  • the insulator 212, the insulator 214, the insulator 280, the insulator 282, the insulator 283, the insulator 284, and the insulator 274 function as an interlayer film.
  • conductor 240 (conductor 240a and conductor 240b) that is electrically connected to the transistor 200 and functions as a plug.
  • An insulator 241 (insulator 241a and insulator 241b) is provided in contact with the side surface of the conductor 240 that functions as a plug.
  • a conductor 246 (conductor 246a and conductor 246b) that is electrically connected to the conductor 240 and functions as wiring is provided.
  • an insulator 286 is provided on the conductor 246 and the insulator 284.
  • the insulator 283 is in contact with a part of the upper surface of the insulator 214, the side surface of the insulator 216, the side surface of the insulator 222, the side surface of the insulator 272, the side surface of the insulator 280, and the side surface of the insulator 282.
  • the insulator 241a is provided in contact with the inner wall of the opening of the insulator 280, the insulator 282, the insulator 283, and the insulator 284, and the first conductor of the conductor 240a is provided in contact with the side surface of the insulator 241a. Further, a second conductor of the conductor 240a is provided inside. Further, the insulator 241b is provided in contact with the inner wall of the openings of the insulator 280, the insulator 282, the insulator 283, and the insulator 284, and the first conductor of the conductor 240b is in contact with the side surface of the insulator 241b. Is provided, and a second conductor of the conductor 240b is further provided inside.
  • the height of the upper surface of the conductor 240 and the height of the upper surface of the insulator 284 in the region overlapping the conductor 246 can be made about the same.
  • the configuration in which the first conductor of the conductor 240 and the second conductor of the conductor 240 are laminated is shown, but the present invention is not limited to this.
  • the conductor 240 may be provided as a single layer or a laminated structure having three or more layers. When the structure has a laminated structure, an ordinal number may be given in the order of formation to distinguish them.
  • the transistor 200 includes an insulator 216 on the insulator 214 and a conductor 205 (conductor 205a, conductive) arranged so as to be embedded in the insulator 214 and / or the insulator 216.
  • a conductor 205 conductor 205a, conductive
  • the conductor 260 (conductor 260a and conductor 260b) that overlaps the parts, and the insulator 222, the insulator 224, the oxide 230 (oxide 230a, and the oxide 230b), the oxide 243, and the conductor. It has an insulator 272 which is arranged on 242 (conductor 242a and insulator 242b) and on an insulator 271 (insulator 271a and insulator 271b).
  • the upper surface of the conductor 260 is arranged so as to substantially coincide with the upper surface of the insulator 250 and the upper surface of the insulator 280.
  • the insulator 282 is in contact with the upper surfaces of the conductor 260, the insulator 250, and the insulator 280, respectively.
  • the oxide 230a and the oxide 230b may be collectively referred to as the oxide 230.
  • the insulator 250a and the insulator 250b may be collectively referred to as an insulator 250.
  • the insulator 271a and the insulator 271b may be collectively referred to as an insulator 271.
  • the insulator 280 and the insulator 272 are provided with an opening reaching the oxide 230b.
  • An insulator 250 and a conductor 260 are arranged in the opening.
  • a conductor 260 and an insulator 250 are provided between the insulator 271a, the conductor 242a and the oxide 243a, and the insulator 271b, the conductor 242b and the oxide 243b.
  • the insulator 250 has a region in contact with the side surface of the conductor 260 and a region in contact with the bottom surface of the conductor 260.
  • the oxide 230 preferably has an oxide 230a arranged on the insulator 224 and an oxide 230b arranged on the oxide 230a.
  • the oxide 230a By having the oxide 230a under the oxide 230b, it is possible to suppress the diffusion of impurities into the oxide 230b from the structure formed below the oxide 230a.
  • the transistor 200 shows a configuration in which the oxide 230 is laminated with two layers of the oxide 230a and the oxide 230b
  • the present invention is not limited to this.
  • a single layer of the oxide 230b or a laminated structure of three or more layers may be provided, or each of the oxide 230a and the oxide 230b may have a laminated structure.
  • the conductor 260 functions as a first gate (also referred to as a top gate) electrode, and the conductor 205 functions as a second gate (also referred to as a back gate) electrode.
  • the insulator 250 functions as a first gate insulator, and the insulator 222 and the insulator 224 function as a second gate insulator.
  • the conductor 242a functions as one of the source and the drain, and the conductor 242b functions as the other of the source and the drain.
  • at least a part of the region of the oxide 230 that overlaps with the conductor 260 functions as a channel forming region.
  • the oxide 230b comprises a region 230bc that functions as a channel forming region of the transistor 200, and a region 230ba and a region 230bb that are provided so as to sandwich the region 230bc and function as a source region or a drain region.
  • the region 230bc overlaps with the conductor 260.
  • the region 230bc is provided in the region between the conductor 242a and the conductor 242b.
  • the region 230ba is provided so as to be superimposed on the conductor 242a, and the region 230bb is provided so as to be superimposed on the conductor 242b.
  • the region 230bc that functions as a channel forming region is a high resistance region having a low carrier concentration because it has less oxygen deficiency or a lower impurity concentration than the regions 230ba and 230bb.
  • the region 230ba and the region 230bb that function as the source region or the drain region are regions in which the carrier concentration is increased due to a large amount of oxygen deficiency or a high concentration of impurities such as hydrogen, nitrogen and metal elements, and the resistance is lowered. .. That is, the region 230ba and the region 230bb are regions having a high carrier concentration and low resistance as compared with the region 230bc.
  • the carrier concentration of the region 230 bc that functions as the channel forming region is preferably 1 ⁇ 10 18 cm -3 or less, more preferably less than 1 ⁇ 10 17 cm -3 , and 1 ⁇ 10 16 cm. It is more preferably less than -3 , still more preferably less than 1 ⁇ 10 13 cm -3 , and even more preferably less than 1 ⁇ 10 12 cm -3.
  • the lower limit of the carrier concentration in the region 230 bc that functions as the channel formation region is not particularly limited, but may be, for example, 1 ⁇ 10 -9 cm -3 .
  • the carrier concentration is equal to or lower than the carrier concentration of the region 230ba and the region 230bb, and equal to or higher than the carrier concentration of the region 230bb.
  • Regions may be formed. That is, the region functions as a junction region between the region 230bc and the region 230ba or the region 230bb.
  • the hydrogen concentration may be equal to or lower than the hydrogen concentration in the region 230ba and 230bb, and may be equal to or higher than the hydrogen concentration in the region 230bc.
  • the oxygen deficiency may be equal to or less than the oxygen deficiency of the region 230ba and the region 230bb, and may be equal to or greater than the oxygen deficiency of the region 230bc.
  • FIG. 3 shows an example in which the region 230ba, the region 230bb, and the region 230bc are formed on the oxide 230b, but the present invention is not limited to this.
  • each of the above regions may be formed not only with the oxide 230b but also with the oxide 230a.
  • concentrations of metal elements detected in each region and impurity elements such as hydrogen and nitrogen are not limited to gradual changes in each region, but may be continuously changed in each region. That is, the closer the region is to the channel formation region, the lower the concentration of the metal element and the impurity elements such as hydrogen and nitrogen is sufficient.
  • a metal oxide hereinafter, also referred to as an oxide semiconductor that functions as a semiconductor for the oxide 230 (oxide 230a and oxide 230b) containing the channel forming region.
  • the metal oxide that functions as a semiconductor it is preferable to use one having a band gap of 2 eV or more, and it is preferable to use one having a band gap of 2.5 eV or more. As described above, by using a metal oxide having a large bandgap, the off-current of the transistor can be reduced.
  • oxide 230 for example, an In-M-Zn oxide having indium, element M and zinc (element M is aluminum, gallium, yttrium, tin, copper, vanadium, beryllium, boron, titanium, iron, nickel, germanium). , Zinc, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, etc. (one or more) and other metal oxides may be used. Further, as the oxide 230, In—Ga oxide, In—Zn oxide, or indium oxide may be used.
  • the atomic number ratio of In to the element M in the metal oxide used for the oxide 230b is larger than the atomic number ratio of In to the element M in the metal oxide used for the oxide 230a.
  • the oxide 230a under the oxide 230b By arranging the oxide 230a under the oxide 230b in this way, it is possible to suppress the diffusion of impurities and oxygen from the structure formed below the oxide 230a to the oxide 230b. ..
  • the oxide 230a and the oxide 230b have a common element (main component) other than oxygen, the defect level density at the interface between the oxide 230a and the oxide 230b can be lowered. Since the defect level density at the interface between the oxide 230a and the oxide 230b can be lowered, the influence of interfacial scattering on carrier conduction is small, and a high on-current can be obtained.
  • each oxide 230b has crystallinity.
  • CAAC-OS c-axis aligned crystalline semiconductor semiconductor
  • CAAC-OS is highly crystalline, has a dense structure, impurities and defects (e.g. oxygen vacancies (V O: also referred to as oxygen vacancy), etc.) is less metal oxides.
  • the CAAC-OS is subjected to heat treatment at a temperature at which the metal oxide does not polycrystallize (for example, 400 ° C. or higher and 600 ° C. or lower), whereby CAAC-OS has a more crystalline and dense structure. Can be. In this way, by increasing the density of CAAC-OS, the diffusion of impurities or oxygen in the CAAC-OS can be further reduced.
  • the metal oxide having CAAC-OS has stable physical properties. Therefore, the metal oxide having CAAC-OS is resistant to heat and has high reliability.
  • Transistors using oxide semiconductors may have poor electrical characteristics and poor reliability if impurities and oxygen deficiencies are present in the region where channels are formed in the oxide semiconductor.
  • the hydrogen of oxygen vacancies near defects containing the hydrogen to the oxygen deficiency (hereinafter, may be referred to as V O H.)
  • V O H defects containing the hydrogen to the oxygen deficiency
  • the transistor has normal-on characteristics (the channel exists even if no voltage is applied to the gate electrode, and the current is applied to the transistor. Flowing characteristics). Therefore, in the region where a channel of the oxide semiconductor is formed, impurities, oxygen deficiency, and V O H it is preferred to be reduced as much as possible.
  • the region in which the channel is formed in the oxide semiconductor is preferably i-type (intrinsicized) or substantially i-type with a reduced carrier concentration.
  • excess oxygen oxygen desorbed by heating
  • the oxide semiconductor is separated from the insulator.
  • oxygen is supplied, it is possible to reduce oxygen vacancies, and V O H to.
  • the on-current of the transistor 200 may decrease or the field effect mobility may decrease.
  • the oxygen supplied to the source region or the drain region varies in the surface of the substrate, so that the characteristics of the semiconductor device having the transistor will vary.
  • the region 230bc that functions as a channel forming region preferably has a reduced carrier concentration and is i-type or substantially i-type, but the region 230ba that functions as a source region or drain region and
  • the region 230bb has a high carrier concentration and is preferably n-type.
  • the oxygen deficiency in the oxide semiconductor region 230Bc, and reduces V O H it is preferred that an excess amount of oxygen in the region 230ba and region 230bb to not be supplied.
  • the microwave processing refers to processing using, for example, a device having a power source that generates high-density plasma using microwaves.
  • oxygen gas By performing microwave treatment in an atmosphere containing oxygen, oxygen gas can be turned into plasma using microwaves or a high frequency such as RF (Radio Frequency), and the oxygen plasma can be allowed to act.
  • the region 230bc can be irradiated with a high frequency wave such as a microwave or RF.
  • Plasma by the action such as a microwave, and divide the V O H region 230Bc, hydrogen (H) is removed from the region 230Bc, oxygen deficient (V O) can be filled with oxygen. That is, in the region 230Bc, happening reaction of "V O H ⁇ H + V O", it is possible to reduce the hydrogen concentration in the regions 230Bc. Therefore, to reduce oxygen vacancies, and V O H in the region 230Bc, the carrier concentration can be decreased.
  • RF Radio Frequency
  • the action of microwaves, high frequencies such as RF, oxygen plasma, etc. is shielded by the conductors 242a and 242b and does not reach the regions 230ba and 230bb. .. Further, the action of the oxygen plasma can be reduced by the insulator 271 and the insulator 280 provided overlying the oxide 230b and the conductor 242.
  • the region 230ba and area 230Bb, reduction of V O H, and excessive amount of oxygen supply does not occur, it is possible to prevent a decrease in carrier concentration.
  • the above-mentioned effect is large when microwave treatment is performed in an atmosphere containing oxygen after the film of the insulating film to be the insulator 250b is formed. Further, it is preferable to perform microwave treatment in an oxygen-containing atmosphere after forming the insulating film to be the insulator 250a, and to perform microwave treatment in an oxygen-containing atmosphere after forming the insulating film to be the insulator 250b. By performing microwave treatment in an atmosphere containing oxygen through the insulator 250a or the insulator 250b in this way, oxygen can be efficiently injected into the region 230bc.
  • the oxygen injected into the region 230bc has various forms such as an oxygen atom, an oxygen molecule, and an oxygen radical (an atom or molecule having an unpaired electron, or an ion).
  • the oxygen injected into the region 230bc may be any one or more of the above-mentioned forms, and is particularly preferably an oxygen radical.
  • the oxide selectively oxygen deficiency in the semiconductor region 230Bc, a and V O H may be removed to an area 230Bc i-type or substantially i-type. Further, it is possible to suppress the supply of excess oxygen to the region 230ba and the region 230bb that function as the source region or the drain region, and maintain the n-type. As a result, fluctuations in the electrical characteristics of the transistor 200 can be suppressed, and fluctuations in the electrical characteristics of the transistor 200 can be suppressed within the substrate surface.
  • the side surface of the opening into which the conductor 260 and the like are embedded is substantially perpendicular to the surface to be formed of the oxide 230b, including the groove portion of the oxide 230b. It is not limited to this.
  • the bottom of the opening may have a gently curved surface and may have a U-shape.
  • the side surface of the opening may be inclined with respect to the surface to be formed of the oxide 230b.
  • a curved surface may be provided between the side surface of the oxide 230b and the upper surface of the oxide 230b in a cross-sectional view of the transistor 200 in the channel width direction. That is, the end portion of the side surface and the end portion of the upper surface may be curved (hereinafter, also referred to as a round shape).
  • the radius of curvature on the curved surface is preferably larger than 0 nm, smaller than the film thickness of the oxide 230b in the region overlapping the conductor 242, or smaller than half the length of the region having no curved surface.
  • the radius of curvature on the curved surface is larger than 0 nm and 20 nm or less, preferably 1 nm or more and 15 nm or less, and more preferably 2 nm or more and 10 nm or less. With such a shape, the coverage of the insulator 250 and the conductor 260 on the oxide 230b can be improved.
  • the oxide 230 preferably has a laminated structure of a plurality of oxide layers having different chemical compositions.
  • the atomic number ratio of the element M to the metal element as the main component is the ratio of the element M to the metal element as the main component in the metal oxide used for the oxide 230b. It is preferably larger than the atomic number ratio.
  • the atomic number ratio of the element M to In is preferably larger than the atomic number ratio of the element M to In in the metal oxide used for the oxide 230b.
  • the atomic number ratio of In to the element M is preferably larger than the atomic number ratio of In to the element M in the metal oxide used for the oxide 230a.
  • the oxide 230b is preferably an oxide having crystallinity such as CAAC-OS.
  • Crystalline oxides such as CAAC-OS have a dense structure with high crystallinity with few impurities and defects (oxygen deficiency, etc.). Therefore, it is possible to suppress the extraction of oxygen from the oxide 230b by the source electrode or the drain electrode. As a result, oxygen can be reduced from being extracted from the oxide 230b even if heat treatment is performed, so that the transistor 200 is stable against a high temperature (so-called thermal budget) in the manufacturing process.
  • the lower end of the conduction band changes gently.
  • the lower end of the conduction band at the junction between the oxide 230a and the oxide 230b is continuously changed or continuously bonded. In order to do so, it is preferable to reduce the defect level density of the mixed layer formed at the interface between the oxide 230a and the oxide 230b.
  • the oxide 230a and the oxide 230b have a common element other than oxygen as a main component, a mixed layer having a low defect level density can be formed.
  • the oxide 230b is an In-M-Zn oxide
  • the oxide 230a is an In-M-Zn oxide, an M-Zn oxide, an element M oxide, an In-Zn oxide, or an indium oxide. Etc. may be used.
  • a metal oxide having a composition in the vicinity thereof may be used.
  • a metal oxide having a composition may be used.
  • the composition in the vicinity includes a range of ⁇ 30% of the desired atomic number ratio. Further, it is preferable to use gallium as the element M.
  • the above atomic number ratio is not limited to the atomic number ratio of the formed metal oxide, but is the atomic number ratio of the sputtering target used for forming the metal oxide. It may be.
  • the defect level density at the interface between the oxide 230a and the oxide 230b can be lowered. Therefore, the influence of interfacial scattering on carrier conduction is reduced, and the transistor 200 can obtain a large on-current and high frequency characteristics.
  • At least one of the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, the insulator 284, and the insulator 286 has impurities such as water and hydrogen from the substrate side or , It is preferable to function as a barrier insulating film that suppresses diffusion from above the transistor 200 to the transistor 200. Therefore, at least one of insulator 212, insulator 214, insulator 271, insulator 272, insulator 282, insulator 283, insulator 284, and insulator 286 is a hydrogen atom, a hydrogen molecule, a water molecule, and a nitrogen atom.
  • molecular nitrogen, nitric oxide molecule (N 2 O, NO, etc. NO 2), it has a function of suppressing the diffusion of impurities such as copper atoms (hardly the impurity is transmitted) it is preferable to use an insulating material.
  • an insulating material having a function of suppressing the diffusion of oxygen for example, at least one oxygen atom, oxygen molecule, etc. (the oxygen is difficult to permeate).
  • the barrier insulating film refers to an insulating film having a barrier property.
  • the barrier property is a function of suppressing the diffusion of the corresponding substance (also referred to as low permeability).
  • the corresponding substance has a function of capturing and fixing (also called gettering).
  • the insulator 212, insulator 214, insulator 271, insulator 272, insulator 282, insulator 283, insulator 284, and insulator 286 have a function of suppressing the diffusion of impurities such as water and hydrogen, and oxygen. It is preferable to use an insulator having the above, and for example, aluminum oxide, magnesium oxide, hafnium oxide, gallium oxide, indium gallium zinc oxide, silicon nitride, silicon nitride and the like can be used. For example, as the insulator 212, the insulator 272, the insulator 283, and the insulator 286, it is preferable to use silicon nitride or the like having a higher hydrogen barrier property.
  • the insulator 214 it is preferable to use aluminum oxide or magnesium oxide having a high function of capturing hydrogen and fixing hydrogen.
  • impurities such as water and hydrogen from diffusing from the substrate side to the transistor 200 side via the insulator 212 and the insulator 214.
  • impurities such as water and hydrogen from diffusing to the transistor 200 side from the interlayer insulating film or the like arranged outside the insulator 286.
  • oxygen contained in the insulator 224 or the like from diffusing toward the substrate side via the insulator 212 and the insulator 214.
  • the transistor 200 is insulated from the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, and the insulator having a function of suppressing the diffusion of impurities such as water and hydrogen and oxygen. It is preferable that the structure is surrounded by the body 284 and the insulator 286.
  • a metal oxide such as AlO x (x is an arbitrary number larger than 0) or MgO y (y is an arbitrary number larger than 0).
  • an oxygen atom has a dangling bond, and the dangling bond may have a property of capturing or fixing hydrogen.
  • a metal oxide having such an amorphous structure as a component of the transistor 200 or providing it around the transistor 200, hydrogen contained in the transistor 200 or hydrogen existing around the transistor 200 is captured or fixed. be able to. In particular, it is preferable to capture or fix hydrogen contained in the channel forming region of the transistor 200.
  • a metal oxide having an amorphous structure as a component of the transistor 200 or providing it around the transistor 200, the transistor 200 having good characteristics and high reliability and a semiconductor device can be manufactured.
  • the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, the insulator 284, and the insulator 286 preferably have an amorphous structure, but some of them are polycrystal. Areas of structure may be formed. Further, the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, the insulator 284, and the insulator 286 have a layer having an amorphous structure and a layer having a polycrystalline structure. It may have a laminated multi-layer structure. For example, it may be a laminated structure in which a layer having a polycrystalline structure is formed on a layer having an amorphous structure.
  • the film formation of the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, the insulator 284, and the insulator 286 may be performed by using, for example, a sputtering method. Since hydrogen does not have to be used as the film forming gas in the sputtering method, hydrogen in the insulator 212, the insulator 214, the insulator 271, the insulator 272, the insulator 282, the insulator 283, the insulator 284, and the insulator 286. The concentration can be reduced.
  • the film forming method is not limited to the sputtering method, but is limited to a chemical vapor deposition (CVD) method, a molecular beam epitaxy (MBE) method, and a pulsed laser deposition (PLD) method.
  • CVD chemical vapor deposition
  • MBE molecular beam epitaxy
  • PLD pulsed laser deposition
  • Method, atomic layer deposition (ALD) method and the like may be appropriately used.
  • the resistivity of the insulator 212, the insulator 272, the insulator 283, and the insulator 286 it may be preferable to reduce the resistivity of the insulator 212, the insulator 272, the insulator 283, and the insulator 286.
  • the insulator 212 can be insulated in a process using plasma or the like in the process of manufacturing a semiconductor device.
  • the body 272, the insulator 283, and the insulator 286 can alleviate the charge-up of the conductor 205, the conductor 242, the conductor 260, or the conductor 246.
  • the resistivity of the insulator 212, the insulator 272, the insulator 283, and the insulator 286 is preferably 1 ⁇ 10 10 ⁇ cm or more and 1 ⁇ 10 15 ⁇ cm or less.
  • the insulator 216, the insulator 274, and the insulator 280 have a lower dielectric constant than the insulator 214.
  • the insulator 216, the insulator 274, and the insulator 280 have silicon oxide, silicon oxide nitride, silicon oxide added with fluorine, silicon oxide added with carbon, silicon oxide added with carbon and nitrogen, and pores. Silicon oxide or the like may be used as appropriate.
  • the conductor 205 is arranged so as to overlap the oxide 230 and the conductor 260.
  • the conductor 205 has a conductor 205a, a conductor 205b, and a conductor 205c.
  • the conductor 205a is provided in contact with the bottom surface and the side wall of the opening.
  • the conductor 205b is provided so as to be embedded in the recess formed in the conductor 205a.
  • the upper surface of the conductor 205b is lower than the upper surface of the conductor 205a and the upper surface of the insulator 216.
  • the conductor 205c is provided in contact with the upper surface of the conductor 205b and the side surface of the conductor 205a.
  • the height of the upper surface of the conductor 205c is substantially the same as the height of the upper surface of the conductor 205a and the height of the upper surface of the insulator 216. That is, the conductor 205b is wrapped in the conductor 205a and the conductor 205c.
  • the conductors 205a and conductors 205c are hydrogen atoms, hydrogen molecules, water molecules, nitrogen atom, a nitrogen molecule, nitric oxide molecule (N 2 O, NO, etc. NO 2), the diffusion of impurities such as copper atoms It is preferable to use a conductive material having a suppressing function. Alternatively, it is preferable to use a conductive material having a function of suppressing the diffusion of oxygen (for example, at least one oxygen atom, oxygen molecule, etc.).
  • the conductor 205a By using a conductive material having a function of reducing the diffusion of hydrogen for the conductor 205a and the conductor 205c, impurities such as hydrogen contained in the conductor 205b are transferred to the oxide 230 via the insulator 224 and the like. It can be prevented from spreading. Further, by using a conductive material having a function of suppressing the diffusion of oxygen for the conductor 205a and the conductor 205c, it is possible to prevent the conductor 205b from being oxidized and the conductivity from being lowered.
  • the conductive material having a function of suppressing the diffusion of oxygen for example, titanium, titanium nitride, tantalum, tantalum nitride, ruthenium, ruthenium oxide and the like are preferably used. Therefore, as the conductor 205a, the conductive material may be a single layer or a laminated material. For example, titanium nitride may be used for the conductor 205a.
  • the conductor 205b it is preferable to use a conductive material containing tungsten, copper, or aluminum as a main component.
  • tungsten may be used for the conductor 205b.
  • the conductor 205 may function as a second gate electrode.
  • the threshold voltage (Vth) of the transistor 200 can be controlled by changing the potential applied to the conductor 205 independently of the potential applied to the conductor 260 without interlocking with it.
  • Vth threshold voltage
  • the electrical resistivity of the conductor 205 is designed in consideration of the potential applied to the conductor 205, and the film thickness of the conductor 205 is set according to the electrical resistivity. Further, the film thickness of the insulator 216 is almost the same as that of the conductor 205. Here, it is preferable to reduce the film thickness of the conductor 205 and the insulator 216 within the range allowed by the design of the conductor 205. By reducing the film thickness of the insulator 216, the absolute amount of impurities such as hydrogen contained in the insulator 216 can be reduced, so that the impurities can be reduced from diffusing into the oxide 230. ..
  • the conductor 205 may be provided larger than the size of the region that does not overlap with the conductor 242a and the conductor 242b of the oxide 230.
  • the conductor 205 is also stretched in a region outside the ends of the oxide 230a and the oxide 230b in the channel width direction. That is, it is preferable that the conductor 205 and the conductor 260 are superposed on each other via an insulator on the outside of the side surface of the oxide 230 in the channel width direction.
  • the channel forming region of the oxide 230 is electrically surrounded by the electric field of the conductor 260 that functions as the first gate electrode and the electric field of the conductor 205 that functions as the second gate electrode. Can be done.
  • the structure of the transistor that electrically surrounds the channel formation region by the electric fields of the first gate and the second gate is referred to as a surroundd channel (S-channel) structure.
  • the transistor having the S-channel structure represents the structure of the transistor that electrically surrounds the channel formation region by the electric fields of one and the other of the pair of gate electrodes.
  • the S-channel structure disclosed in the present specification and the like is different from the Fin type structure and the planar type structure.
  • the conductor 205 is stretched to function as wiring.
  • the present invention is not limited to this, and a conductor that functions as wiring may be provided under the conductor 205. Further, it is not always necessary to provide one conductor 205 for each transistor. For example, the conductor 205 may be shared by a plurality of transistors.
  • the conductor 205 shows a configuration in which the conductor 205a, the conductor 205b, and the conductor 205c are laminated, but the present invention is not limited to this.
  • the conductor 205 may be provided as a single-layer, two-layer, or four-layer or higher laminated structure.
  • the insulator 222 and the insulator 224 function as a gate insulator.
  • the insulator 222 preferably has a function of suppressing the diffusion of hydrogen (for example, at least one hydrogen atom, hydrogen molecule, etc.). Further, the insulator 222 preferably has a function of suppressing the diffusion of oxygen (for example, at least one oxygen atom, oxygen molecule, etc.). For example, the insulator 222 preferably has a function of suppressing the diffusion of one or both of hydrogen and oxygen more than the insulator 224.
  • the insulator 222 it is preferable to use an insulator containing oxides of one or both of aluminum and hafnium, which are insulating materials.
  • the insulator it is preferable to use aluminum oxide, hafnium oxide, an oxide containing aluminum and hafnium (hafnium aluminate) and the like.
  • the insulator 222 releases oxygen from the oxide 230 to the substrate side and diffuses impurities such as hydrogen from the peripheral portion of the transistor 200 to the oxide 230. Functions as a layer that suppresses.
  • the insulator 222 impurities such as hydrogen can be suppressed from diffusing into the inside of the transistor 200, and the generation of oxygen deficiency in the oxide 230 can be suppressed. Further, it is possible to suppress the conductor 205 from reacting with the oxygen contained in the insulator 224 and the oxide 230.
  • aluminum oxide, bismuth oxide, germanium oxide, niobium oxide, silicon oxide, titanium oxide, tungsten oxide, yttrium oxide, or zirconium oxide may be added to the insulator.
  • these insulators may be nitrided.
  • the insulator 222 may be used by laminating silicon oxide, silicon oxide or silicon nitride on these insulators.
  • the insulator 222 includes, for example, aluminum oxide, hafnium oxide, tantalum oxide, zirconium oxide, lead zirconate titanate (PZT), strontium titanate (SrTiO 3 ), (Ba, Sr) TiO 3 (BST) and the like.
  • An insulator containing a so-called high-k material may be used in a single layer or in a laminated manner. As transistors become finer and more integrated, problems such as leakage current may occur due to the thinning of the gate insulator. By using a high-k material for an insulator that functions as a gate insulator, it is possible to reduce the gate potential during transistor operation while maintaining the physical film thickness.
  • silicon oxide, silicon oxide nitride, or the like may be appropriately used.
  • the heat treatment may be performed, for example, at 100 ° C. or higher and 600 ° C. or lower, more preferably 350 ° C. or higher and 550 ° C. or lower.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas.
  • the heat treatment is preferably performed in an oxygen atmosphere.
  • oxygen can be supplied to the oxide 230 to reduce oxygen deficiency (VO ).
  • the heat treatment may be performed in a reduced pressure state.
  • the heat treatment may be performed in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of oxidizing gas in order to supplement the desorbed oxygen after heat treatment in an atmosphere of nitrogen gas or an inert gas.
  • the heat treatment may be carried out in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of the oxidizing gas, and then the heat treatment may be continuously performed in an atmosphere of nitrogen gas or an inert gas.
  • the insulator 222 and the insulator 224 may have a laminated structure of two or more layers.
  • the laminated structure is not limited to the same material, and may be a laminated structure made of different materials.
  • the insulator 224 may be formed in an island shape by superimposing on the oxide 230a. In this case, the insulator 272 is in contact with the side surface of the insulator 224 and the upper surface of the insulator 222.
  • Oxide 243a and oxide 243b are provided on the oxide 230b.
  • the oxide 243a and the oxide 243b are provided so as to be separated from each other with the conductor 260 interposed therebetween.
  • Oxide 243 (oxide 243a and oxide 243b) preferably has a function of suppressing oxygen permeation.
  • an oxide 243 having a function of suppressing oxygen permeation between the conductor 242 functioning as a source electrode or a drain electrode and the oxide 230b electricity between the conductor 242 and the oxide 230b can be obtained. This is preferable because the resistance is reduced. With such a configuration, the electrical characteristics of the transistor 200 and the reliability of the transistor 200 can be improved. If the electrical resistance between the conductor 242 and the oxide 230b can be sufficiently reduced, the oxide 243 may not be provided.
  • a metal oxide having an element M may be used.
  • the element M aluminum, gallium, yttrium, or tin may be used.
  • Oxide 243 preferably has a higher concentration of element M than oxide 230b.
  • gallium oxide may be used as the oxide 243.
  • a metal oxide such as In—M—Zn oxide may be used.
  • the atomic number ratio of the element M to In is preferably larger than the atomic number ratio of the element M to In in the metal oxide used for the oxide 230b.
  • the film thickness of the oxide 243 is preferably 0.5 nm or more and 5 nm or less, more preferably 1 nm or more and 3 nm or less, and further preferably 1 nm or more and 2 nm or less. Further, the oxide 243 is preferably crystalline. When the oxide 243 has crystallinity, the release of oxygen in the oxide 230 can be suitably suppressed. For example, as the oxide 243, if it has a crystal structure such as a hexagonal crystal, the release of oxygen in the oxide 230 may be suppressed.
  • the conductor 242a is provided in contact with the upper surface of the oxide 243a, and the conductor 242b is provided in contact with the upper surface of the oxide 243b.
  • the conductor 242a and the conductor 242b function as a source electrode or a drain electrode of the transistor 200, respectively.
  • Examples of the conductor 242 include a nitride containing tantalum, a nitride containing titanium, a nitride containing molybdenum, a nitride containing tungsten, a nitride containing tantalum and aluminum, and the like. It is preferable to use a nitride containing titanium and aluminum. In one aspect of the invention, tantalum-containing nitrides are particularly preferred. Further, for example, ruthenium oxide, ruthenium nitride, an oxide containing strontium and ruthenium, an oxide containing lanthanum and nickel, and the like may be used. These materials are preferable because they are conductive materials that are difficult to oxidize or materials that maintain conductivity even when oxygen is absorbed.
  • hydrogen contained in the oxide 230b or the like may diffuse into the conductor 242a or the conductor 242b.
  • hydrogen contained in the oxide 230b or the like is easily diffused to the conductor 242a or the conductor 242b, and the diffused hydrogen is the conductor. It may bind to the nitrogen contained in the 242a or the conductor 242b. That is, hydrogen contained in the oxide 230b or the like may be absorbed by the conductor 242a or the conductor 242b.
  • the conductor 242 it is preferable that no curved surface is formed between the side surface of the conductor 242 and the upper surface of the conductor 242.
  • the cross-sectional area of the conductor 242 in the cross section in the channel width direction as shown in FIG. 1D can be increased.
  • the conductivity of the conductor 242 can be increased, and the on-current of the transistor 200 can be increased.
  • the insulator 271a is provided in contact with the upper surface of the conductor 242a, and the insulator 271b is provided in contact with the upper surface of the conductor 242b.
  • the insulator 271 preferably functions as a barrier insulating film against at least oxygen. Therefore, the insulator 271 preferably has a function of suppressing the diffusion of oxygen.
  • the insulator 271 preferably has a function of suppressing the diffusion of oxygen more than the insulator 280.
  • the insulator 271 for example, a nitride containing silicon such as silicon nitride may be used. Further, the insulator 271 preferably has a function of capturing impurities such as hydrogen.
  • a metal oxide having an amorphous structure for example, an insulator such as aluminum oxide or magnesium oxide may be used.
  • aluminum oxide having an amorphous structure or aluminum oxide having an amorphous structure as the insulator 271 because hydrogen may be captured or fixed more effectively. Thereby, the transistor 200 having good characteristics and high reliability and the semiconductor device can be manufactured.
  • the insulator 272 is provided so as to cover the insulator 224, the oxide 230a, the oxide 230b, the oxide 243, the conductor 242, and the insulator 271.
  • the insulator 272 preferably has a function of capturing hydrogen and fixing hydrogen.
  • the insulator 272 preferably contains an insulator such as silicon nitride or a metal oxide having an amorphous structure, for example, aluminum oxide or magnesium oxide.
  • the conductor 242 can be wrapped with an insulator having a barrier property against oxygen. That is, it is possible to prevent oxygen contained in the insulator 224 and the insulator 280 from diffusing into the conductor 242. As a result, it is possible to prevent the conductor 242 from being directly oxidized by the oxygen contained in the insulator 224 and the insulator 280 to increase the resistivity and reduce the on-current.
  • the insulator 250 functions as a gate insulator.
  • the insulator 250 is preferably arranged in contact with the upper surface of the oxide 230b.
  • the insulator 250 includes silicon oxide, silicon oxide, silicon nitride, silicon nitride, silicon oxide added with fluorine, silicon oxide added with carbon, silicon oxide added with carbon and nitrogen, silicon oxide having pores, and the like. Can be used. In particular, silicon oxide and silicon nitride nitride are preferable because they are stable against heat.
  • the insulator 250 (insulator 250a and insulator 250b) has a reduced concentration of impurities such as water and hydrogen in the insulator 250, similarly to the insulator 224.
  • the film thickness of the insulator 250 is preferably 1 nm or more and 20 nm or less.
  • the film thickness of the insulator 250a is preferably 0.5 nm or more and 15.0 nm or less.
  • the lower insulator 250a is formed by using an insulator that easily allows oxygen to pass through, and the upper insulator 250b. Is preferably formed using an insulator having a function of suppressing the diffusion of oxygen. With such a configuration, oxygen contained in the insulator 250a can be suppressed from diffusing into the conductor 260. That is, it is possible to suppress a decrease in the amount of oxygen supplied to the oxide 230. In addition, oxidation of the conductor 260 by oxygen contained in the insulator 250a can be suppressed.
  • the insulator 250a may be provided by using a material that can be used for the above-mentioned insulator 250, and the insulator 250b may be an insulator containing an oxide of one or both of aluminum and hafnium.
  • the insulator aluminum oxide, hafnium oxide, an oxide containing aluminum and hafnium (hafnium aluminate), an oxide containing aluminum and silicon (hafnium silicate), and the like can be used.
  • hafnium oxide is used as the insulator 250b.
  • the film thickness of the insulator 250b is 0.5 nm or more and 5.0 nm or less, preferably 1.0 nm or more and 5.0 nm or less, and more preferably 1.0 nm or more and 3.0 nm or less.
  • the insulator 250a is preferably formed by the PEALD method using a gas 401 (precursor) containing silicon and not containing a hydrocarbon and an oxidizing gas 402 (reactant). Further, a rare gas such as helium, neon, argon, krypton, or xenon may be added to the reactor.
  • a gas 401 precursor
  • a rare gas such as helium, neon, argon, krypton, or xenon may be added to the reactor.
  • the ALD method includes a thermal ALD (Thermal ALD) method in which the reaction of the precursor and the reactor is performed only by thermal energy, and a PEALD (Plasma Enhanced ALD) method using a plasma-excited reactor.
  • thermal ALD Thermal ALD
  • PEALD Pulsma Enhanced ALD
  • the ALD method utilizes the self-regulating properties of atoms to deposit atoms layer by layer, so ultra-thin film formation is possible, film formation into structures with a high aspect ratio is possible, and pins. It has the effects of being able to form a film with few defects such as holes, being able to form a film with excellent coverage, and being able to form a film at a low temperature.
  • the PEALD method it may be preferable to use plasma because it is possible to form a film at a lower temperature.
  • Some precursors used in the ALD method contain carbon and the like. Therefore, the film provided by the ALD method may contain a large amount of impurities such as carbon as compared with the film provided by other film forming methods.
  • the quantification of impurities can be performed by using secondary ion mass spectrometry (SIMS: Secondary Ion Mass Spectrometry) or X-ray photoelectron spectroscopy (XPS: X-ray Photoelectron Spectroscopy).
  • SIMS Secondary Ion Mass Spectrometry
  • XPS X-ray Photoelectron Spectroscopy
  • the PEALD method is used.
  • the gas 401 containing silicon and not containing hydrocarbons SiH 4 , Si 2 H 6 , SiF 4 , SiCl 4 , SiBr 4 , SiH 2 Cl 2 , SiH 2 I 2 and the like can be used.
  • the oxidizing gas 402 O 2 , O 3 , N 2 O, NO 2, H 2 O and the like can be used.
  • SiH 4 is used as the gas 401 containing silicon and not containing hydrocarbons
  • N 2 O is used as the oxidizing gas 402.
  • FIG. 5 shows a process flow for forming silicon oxide to be an insulator 250a by the PEALD method using SiH 4 as a gas 401 containing silicon and not containing a hydrocarbon and N 2 O as an oxidizing gas 402.
  • the film formation sequence is shown in 6A and FIG. 6B.
  • SiH 4 and N 2 O are introduced into the reaction chamber to keep the pressure in the reaction chamber constant (step S01).
  • Helium may be introduced here.
  • the flow rate ratio of SiH 4 and N 2 O is, assuming that the flow rate of SiH 4 is 1, N 2 O is 10 or more and 3000 or less, preferably 10 or more and 800 or less, and more preferably 50 or more and 400 or less. Further, when the value is 50 or more, the generation of NO x in the insulator 250a can be suppressed.
  • the pressure in the reaction chamber is 200 Pa or more and 1200 Pa or less, preferably 400 Pa or more and 1000 Pa or less, and more preferably 600 Pa or more and 800 Pa or less.
  • the substrate temperature is 100 ° C. or higher and 500 ° C. or lower, preferably 200 ° C. or higher and 400 ° C. or lower. Further, the substrate does not have to be heated, and a film may be formed at room temperature.
  • step S02 the introduction of SiH 4 is stopped, and the SiH 4 remaining in the reaction chamber is purged.
  • a high frequency power 403 is applied to the reaction chamber to generate plasma by N 2 O.
  • the high frequency is 13.56 MHz or more and 60 MHz or less.
  • step S04 the application of the high frequency power 403 is stopped.
  • silicon oxide to be the insulator 250a can be formed.
  • the number of cycles is 1 cycle or more and 500 cycles or less. However, the number of cycles may be appropriately determined according to the film thickness required by the insulator 250a.
  • a vacuuming step may be inserted in which the introduction of SiH 4 and N 2 O is stopped and the SiH 4 and N 2 O remaining in the reaction chamber are exhausted. ..
  • the introduction of the SiH 4, and N 2 O in the introduction may be stopped at the same time, after stopping the introduction of SiH 4, it may cease the introduction of N 2 O. Further, it is preferable to resume the introduction of N 2 O before the start of step S03.
  • SiH 4, and N PECVD method using 2 O is, SiH 4, and N 2 because O by applying a high frequency power in a state of being introduced to generate plasma, are decomposed SiH 4 is in the plasma, a large amount of Hydrogen radicals are generated, and hydrogen is mixed in the silicon oxide that becomes the insulator 250a. Further, as shown in FIG. 3, the insulator 250a, since in contact with the region 230bc which functions as a channel formation region, V O H are formed is withdrawn oxygen in region 230bc by reduction reaction of hydrogen radicals Then, the hydrogen concentration in the region 230bc becomes high.
  • high frequency power is not applied during the introduction of SiH 4 and N 2 O in step 01 described above, and step 02.
  • high-frequency power is applied to generate plasma in a state where only N 2 O is introduced in step 03, so that the generation of hydrogen radicals can be suppressed. Therefore, it is possible to suppress the mixing of hydrogen into the silicon oxide that becomes the insulator 250a and the region 230bc that is in contact with the silicon oxide that becomes the insulator 250a.
  • SiH 4 is used as a precursor, and a precursor containing impurities such as carbon, for example, an organic precursor having a CH group is not used. It is possible to prevent impurities such as carbon and hydrocarbons from being mixed into the silicon oxide. Since the silicon oxide thus formed has a reduced impurity concentration and is a denser film, it is possible to prevent the diffusion of In from the region 230bc of the oxide 230b to the silicon oxide serving as the insulator 250a.
  • Carbon concentration in the silicon oxide as the insulator 250a is in analysis by SIMS, preferably, 1 ⁇ 10 18 atoms / cm 3 or more 5 ⁇ 10 20 atoms / cm 3 or less, more preferably, 5 ⁇ 10 18 atoms / It is cm 3 or more and 1 ⁇ 10 20 atoms / cm 3 or less.
  • the silicon oxide serving as the insulator 250a has nitrogen, and the nitrogen concentration thereof is preferably 1 ⁇ 10 19 atoms / cm 3 or more and 1 ⁇ 10 21 atoms / cm 3 or less, more preferably 1 ⁇ 10 21 atoms / cm 3 or less in the SIMS analysis.
  • the In concentration contained in the silicon oxide serving as the insulator 250a is preferably 1.0 ⁇ 10 19 atoms / cm 3 or less, more preferably 1.0 ⁇ 10 18 atoms / cm 3 or less in the SIMS analysis. , More preferably 1.0 ⁇ 10 17 atoms / cm 3 or less.
  • the carbon concentration, the nitrogen concentration, and the In concentration in the insulator are the concentrations in the region 1 nm or more away from the interface with the oxide 230b. In some cases.
  • silicon oxide to be an insulator 250a is produced by the PEALD method.
  • the transistor By forming the transistor, it can be made into a transistor having excellent electrical characteristics and high reliability.
  • an insulating material which is a high-k material having a high relative permittivity may be used for the insulator 250b.
  • the gate insulator By forming the gate insulator into a laminated structure of the insulator 250a and the insulator 250b, it is possible to obtain a laminated structure that is stable against heat and has a high relative permittivity. Therefore, it is possible to reduce the gate potential applied during transistor operation while maintaining the physical film thickness of the gate insulator.
  • the equivalent oxide film thickness (EOT) of an insulator that functions as a gate insulator can be thinned.
  • a metal oxide may be provided between the insulator 250 and the conductor 260.
  • the metal oxide preferably suppresses the diffusion of oxygen from the insulator 250 to the conductor 260.
  • the diffusion of oxygen from the insulator 250 to the conductor 260 is suppressed. That is, it is possible to suppress a decrease in the amount of oxygen supplied to the oxide 230.
  • the oxidation of the conductor 260 by oxygen of the insulator 250 can be suppressed.
  • the metal oxide may be configured to function as a part of the first gate electrode.
  • a metal oxide that can be used as the oxide 230 can be used as the metal oxide.
  • the electric resistance value of the metal oxide can be lowered to form a conductor. This can be called an OC (Oxide Conductor) electrode.
  • the above metal oxide it is possible to improve the on-current of the transistor 200 without weakening the influence of the electric field from the conductor 260. Further, by keeping the distance between the conductor 260 and the oxide 230 due to the physical thickness of the insulator 250 and the metal oxide, the leakage current between the conductor 260 and the oxide 230 is maintained. Can be suppressed. Further, by providing the insulator 250 and the laminated structure with the metal oxide, the physical distance between the conductor 260 and the oxide 230 and the electric field strength applied from the conductor 260 to the oxide 230 can be determined. It can be easily adjusted as appropriate.
  • the conductor 260 functions as the first gate electrode of the transistor 200.
  • the conductor 260 preferably has a conductor 260a and a conductor 260b arranged on the conductor 260a.
  • the conductor 260a is preferably arranged so as to wrap the bottom surface and the side surface of the conductor 260b.
  • the upper surface of the conductor 260 substantially coincides with the upper surface of the insulator 250.
  • the conductor 260 is shown as a two-layer structure of the conductor 260a and the conductor 260b in FIGS. 1B and 1C, it may be a single-layer structure or a laminated structure of three or more layers.
  • the conductor 260a it is preferable to use a conductive material having a function of suppressing the diffusion of impurities such as hydrogen atom, hydrogen molecule, water molecule, nitrogen atom, nitrogen molecule, nitrogen oxide molecule and copper atom.
  • impurities such as hydrogen atom, hydrogen molecule, water molecule, nitrogen atom, nitrogen molecule, nitrogen oxide molecule and copper atom.
  • a conductive material having a function of suppressing the diffusion of oxygen for example, at least one oxygen atom, oxygen molecule, etc.
  • the conductor 260a has a function of suppressing the diffusion of oxygen, it is possible to prevent the conductor 260b from being oxidized by the oxygen contained in the insulator 250 and the conductivity from being lowered.
  • the conductive material having a function of suppressing the diffusion of oxygen for example, titanium, titanium nitride, tantalum, tantalum nitride, ruthenium, ruthenium oxide and the like are preferably used.
  • the conductor 260 also functions as wiring, it is preferable to use a conductor having high conductivity.
  • a conductor having high conductivity for example, as the conductor 260b, a conductive material containing tungsten, copper, or aluminum as a main component can be used.
  • the conductor 260b may have a laminated structure, for example, titanium or a laminated structure of titanium nitride and the conductive material.
  • the conductor 260 is self-aligned so as to fill the opening formed in the insulator 280 or the like.
  • the conductor 260 can be reliably arranged in the region between the conductor 242a and the conductor 242b without aligning the conductor 260.
  • the height is preferably lower than the height of the bottom surface of the oxide 230b.
  • the conductor 260 which functions as a gate electrode, covers the side surface and the upper surface of the channel forming region of the oxide 230b via an insulator 250 or the like, so that the electric field of the conductor 260 is covered with the channel forming region of the oxide 230b. It becomes easier to act on the whole. Therefore, the on-current of the transistor 200 can be increased and the frequency characteristics can be improved.
  • the difference is 0 nm or more and 100 nm or less, preferably 3 nm or more and 50 nm or less, and more preferably 5 nm or more and 20 nm or less.
  • the insulator 280 is provided on the insulator 272, and an opening is formed in the region where the insulator 250 and the conductor 260 are provided. Further, the upper surface of the insulator 280 may be flattened.
  • the insulator 280 that functions as an interlayer film preferably has a low dielectric constant.
  • a material having a low dielectric constant as an interlayer film, it is possible to reduce the parasitic capacitance generated between the wirings.
  • the insulator 280 is provided, for example, by using the same material as the insulator 216.
  • silicon oxide and silicon oxide nitride are preferable because they are thermally stable.
  • materials such as silicon oxide, silicon oxide nitride, and silicon oxide having pores are preferable because a region containing oxygen desorbed by heating can be easily formed.
  • the concentration of impurities such as water and hydrogen in the insulator 280 is reduced.
  • an oxide containing silicon such as silicon oxide and silicon oxide nitride may be appropriately used.
  • the insulator 282 and the insulator 284 preferably function as a barrier insulating film that suppresses impurities such as water and hydrogen from diffusing into the insulator 280 from above, and have a function of capturing impurities such as hydrogen. Is preferable. Further, the insulator 282 and the insulator 284 preferably function as a barrier insulating film that suppresses the permeation of oxygen. As the insulator 282 and the insulator 284, a metal oxide having an amorphous structure, for example, an insulator such as aluminum oxide may be used.
  • the insulator 282 which has a function of capturing impurities such as hydrogen in contact with the insulator 280 in the region sandwiched between the insulator 212 and the insulator 283, hydrogen contained in the insulator 280 and the like, etc. Impurities can be captured and the amount of hydrogen in the region can be kept constant.
  • the insulator 283 functions as a barrier insulating film that suppresses impurities such as water and hydrogen from diffusing into the insulator 280 from above.
  • the insulator 283 is placed on top of the insulator 282.
  • a nitride containing silicon such as silicon nitride or silicon nitride oxide.
  • silicon nitride formed by a sputtering method may be used as the insulator 283.
  • silicon nitride formed by the PEALD method or the CVD method may be further laminated on the silicon nitride formed by the sputtering method.
  • the conductor 240a and the conductor 240b it is preferable to use a conductive material containing tungsten, copper, or aluminum as a main component. Further, the conductor 240a and the conductor 240b may have a laminated structure.
  • the conductor in contact with the insulator 283, the insulator 284, the insulator 282, the insulator 280, the insulator 272, and the insulator 271 contains impurities such as water and hydrogen.
  • a conductive material having a function of suppressing permeation For example, tantalum, tantalum nitride, titanium, titanium nitride, ruthenium, ruthenium oxide and the like are preferably used.
  • the conductive material having a function of suppressing the permeation of impurities such as water and hydrogen may be used in a single layer or in a laminated state. Further, it is possible to prevent impurities such as water and hydrogen contained in the layer above the insulator 283 from being mixed into the oxide 230 through the conductor 240a and the conductor 240b.
  • an insulator such as silicon nitride, aluminum oxide, or silicon nitride may be used. Since the insulator 241a and the insulator 241b are provided in contact with the insulator 283, the insulator 284, the insulator 282, the insulator 280, the insulator 272, and the insulator 271, water and hydrogen contained in the insulator 280 and the like. It is possible to prevent impurities such as the above from being mixed into the oxide 230 through the conductor 240a and the conductor 240b. In particular, silicon nitride is suitable because it has a high blocking property against hydrogen. Further, it is possible to prevent oxygen contained in the insulator 280 from being absorbed by the conductor 240a and the conductor 240b.
  • the conductor 246 (conductor 246a and conductor 246b) which is in contact with the upper surface of the conductor 240a and the upper surface of the conductor 240b and functions as wiring may be arranged.
  • the conductor 246 it is preferable to use a conductive material containing tungsten, copper, or aluminum as a main component.
  • the conductor may have a laminated structure, for example, titanium or titanium nitride may be laminated with the conductive material.
  • the conductor may be formed so as to be embedded in an opening provided in the insulator.
  • the insulator 286 is provided on the conductor 246 and on the insulator 284. As a result, the upper surface of the conductor 246 and the side surface of the conductor 246 are in contact with the insulator 286, and the lower surface of the conductor 246 is in contact with the insulator 283. That is, the conductor 246 can be configured to be wrapped with the insulator 283 and the insulator 286. With such a configuration, it is possible to suppress the permeation of oxygen from the outside and prevent the oxidation of the conductor 246. Further, it is preferable because impurities such as water and hydrogen can be prevented from diffusing from the conductor 246 to the outside.
  • an insulator substrate for example, an insulator substrate, a semiconductor substrate, or a conductor substrate may be used.
  • the insulator substrate include a glass substrate, a quartz substrate, a sapphire substrate, a stabilized zirconia substrate (yttria-stabilized zirconia substrate, etc.), a resin substrate, and the like.
  • the semiconductor substrate include a semiconductor substrate made of silicon and germanium, and a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, and gallium oxide.
  • the conductor substrate includes a graphite substrate, a metal substrate, an alloy substrate, and a conductive resin substrate.
  • a substrate having a metal nitride a substrate having a metal oxide, and the like.
  • a substrate in which a conductor or a semiconductor is provided in an insulator substrate a substrate in which a conductor or an insulator is provided in a semiconductor substrate, a substrate in which a semiconductor or an insulator is provided in a conductor substrate, and the like.
  • those on which an element is provided may be used.
  • Elements provided on the substrate include a capacitance element, a resistance element, a switch element, a light emitting element, a storage element, and the like.
  • Insulator examples include oxides, nitrides, oxide nitrides, nitride oxides, metal oxides, metal oxide nitrides, metal nitride oxides and the like having insulating properties.
  • the material may be selected according to the function of the insulator.
  • Examples of the insulator having a high specific dielectric constant include gallium oxide, hafnium oxide, zirconium oxide, oxides having aluminum and hafnium, nitride oxides having aluminum and hafnium, oxides having silicon and hafnium, silicon and hafnium. There are oxide nitrides having, or nitrides having silicon and hafnium.
  • Examples of the insulator having a low relative permittivity include silicon oxide, silicon oxide, silicon nitride, silicon nitride, silicon oxide added with fluorine, silicon oxide added with carbon, silicon oxide added with carbon and nitrogen, and empty. There are silicon oxide having holes, resin, and the like.
  • the electric characteristics of the transistor can be stabilized by surrounding the transistor using the metal oxide with an insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen.
  • the insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen include boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, tantalum, and zirconium. Insulations containing, lanthanum, neodymium, hafnium, or tantalum may be used in single layers or in layers.
  • an insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen
  • Metal oxides such as tantalum oxide and metal nitrides such as aluminum nitride, silicon nitride and silicon nitride can be used.
  • the insulator that functions as a gate insulator is preferably an insulator having a region containing oxygen that is desorbed by heating.
  • the oxygen deficiency of the oxide 230 can be compensated.
  • Conductors include aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium, iridium, strontium, and lanthanum. It is preferable to use a metal element selected from the above, an alloy containing the above-mentioned metal element as a component, an alloy in which the above-mentioned metal element is combined, or the like.
  • tantalum nitride, titanium nitride, tungsten, nitrides containing titanium and aluminum, nitrides containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, oxides containing strontium and ruthenium, oxides containing lanthanum and nickel, etc. are used. Is preferable.
  • tantalum nitride, titanium nitride, nitrides containing titanium and aluminum, nitrides containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, oxides containing strontium and ruthenium, and oxides containing lanthanum and nickel are difficult to oxidize.
  • a plurality of conductive layers formed of the above materials may be laminated and used.
  • a laminated structure may be formed in which the above-mentioned material containing a metal element and a conductive material containing oxygen are combined.
  • a laminated structure may be formed in which the above-mentioned material containing a metal element and a conductive material containing nitrogen are combined.
  • a laminated structure may be formed in which the above-mentioned material containing a metal element, a conductive material containing oxygen, and a conductive material containing nitrogen are combined.
  • a laminated structure in which the above-mentioned material containing a metal element and a conductive material containing oxygen are combined is used for the conductor functioning as a gate electrode.
  • a conductive material containing oxygen may be provided on the channel forming region side.
  • a conductor that functions as a gate electrode it is preferable to use a conductive material containing a metal element and oxygen contained in a metal oxide in which a channel is formed.
  • the above-mentioned conductive material containing a metal element and nitrogen may be used.
  • a conductive material containing nitrogen such as titanium nitride and tantalum nitride may be used.
  • indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, and silicon were added.
  • Indium tin oxide may be used.
  • indium gallium zinc oxide containing nitrogen may be used.
  • Metal Oxide As the oxide 230, it is preferable to use a metal oxide (oxide semiconductor) that functions as a semiconductor.
  • a metal oxide oxide semiconductor
  • the metal oxide applicable to the oxide 230 according to the present invention will be described.
  • the metal oxide preferably contains at least indium or zinc. In particular, it preferably contains indium and zinc. In addition to them, it is preferable that aluminum, gallium, yttrium, tin and the like are contained. Further, one or more selected from boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt and the like may be contained.
  • the metal oxide is an In-M-Zn oxide having indium, the element M, and zinc.
  • the element M is aluminum, gallium, yttrium, or tin.
  • Other elements applicable to the element M include boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt and the like.
  • the element M a plurality of the above-mentioned elements may be combined in some cases.
  • a metal oxide having nitrogen may also be collectively referred to as a metal oxide. Further, a metal oxide having nitrogen may be referred to as a metal oxide nitride.
  • FIG. 4A is a diagram illustrating classification of crystal structures of oxide semiconductors, typically IGZO (metal oxides containing In, Ga, and Zn).
  • IGZO metal oxides containing In, Ga, and Zn
  • oxide semiconductors are roughly classified into “Amorphous”, “Crystalline”, and “Crystal”.
  • Amorphous includes complete amorphous.
  • “Crystalline” includes CAAC (c-axis-aligned crystalline), nc (nanocrystalline), and CAC (cloud-aligned crystal) (extracting single crystal and crystal).
  • single crystal, poly crystal, and single crystal amorphous are excluded from the classification of "Crystalline”.
  • “Crystal” includes single crystal and poly crystal.
  • the structure in the thick frame shown in FIG. 4A is an intermediate state between "Amorphous” and “Crystal", and belongs to a new boundary region (New crystal line phase). .. That is, the structure can be rephrased as a structure completely different from the energetically unstable "Amorphous” and "Crystal".
  • the crystal structure of the film or substrate can be evaluated using an X-ray diffraction (XRD: X-Ray Diffraction) spectrum.
  • XRD X-ray diffraction
  • FIG. 4B the XRD spectrum obtained by GIXD (Glazing-Incidence XRD) measurement of a CAAC-IGZO film classified as "Crystalline" is shown in FIG. 4B.
  • the GIXD method is also referred to as a thin film method or a Seemann-Bohlin method.
  • the XRD spectrum obtained by the GIXD measurement shown in FIG. 4B will be simply referred to as an XRD spectrum.
  • the thickness of the CAAC-IGZO film shown in FIG. 4B is 500 nm.
  • the horizontal axis is 2 ⁇ [deg. ], And the vertical axis is the intensity [a. u. ].
  • a peak showing clear crystallinity is detected in the XRD spectrum of the CAAC-IGZO film.
  • the crystal structure of the film or substrate can be evaluated by a diffraction pattern (also referred to as a microelectron diffraction pattern) observed by a micro electron diffraction method (NBED: Nano Beam Electron Diffraction).
  • the diffraction pattern of the CAAC-IGZO film is shown in FIG. 4C.
  • FIG. 4C is a diffraction pattern observed by the NBED in which the electron beam is incident parallel to the substrate.
  • electron diffraction is performed with the probe diameter set to 1 nm.
  • oxide semiconductors may be classified differently from FIG. 4A.
  • oxide semiconductors are divided into single crystal oxide semiconductors and other non-single crystal oxide semiconductors.
  • the non-single crystal oxide semiconductor include the above-mentioned CAAC-OS and nc-OS.
  • the non-single crystal oxide semiconductor includes a polycrystalline oxide semiconductor, a pseudo-amorphous oxide semiconductor (a-like OS: amorphous-like oxide semiconductor), an amorphous oxide semiconductor, and the like.
  • CAAC-OS CAAC-OS
  • nc-OS nc-OS
  • a-like OS the details of the above-mentioned CAAC-OS, nc-OS, and a-like OS will be described.
  • CAAC-OS is an oxide semiconductor having a plurality of crystal regions, and the plurality of crystal regions are oriented in a specific direction on the c-axis.
  • the specific direction is the thickness direction of the CAAC-OS film, the normal direction of the surface to be formed of the CAAC-OS film, or the normal direction of the surface of the CAAC-OS film.
  • the crystal region is a region having periodicity in the atomic arrangement. When the atomic arrangement is regarded as a lattice arrangement, the crystal region is also a region in which the lattice arrangement is aligned. Further, the CAAC-OS has a region in which a plurality of crystal regions are connected in the ab plane direction, and the region may have distortion.
  • the strain refers to a region in which a plurality of crystal regions are connected in which the orientation of the lattice arrangement changes between a region in which the lattice arrangement is aligned and a region in which another grid arrangement is aligned. That is, CAAC-OS is an oxide semiconductor that is c-axis oriented and not clearly oriented in the ab plane direction.
  • Each of the plurality of crystal regions is composed of one or a plurality of minute crystals (crystals having a maximum diameter of less than 10 nm).
  • the maximum diameter of the crystal region is less than 10 nm.
  • the size of the crystal region may be about several tens of nm.
  • CAAC-OS has indium (In) and oxygen. It tends to have a layered crystal structure (also referred to as a layered structure) in which a layer (hereinafter, In layer) and a layer having elements M, zinc (Zn), and oxygen (hereinafter, (M, Zn) layer) are laminated. There is. Indium and element M can be replaced with each other. Therefore, the (M, Zn) layer may contain indium. In addition, the In layer may contain the element M. The In layer may contain Zn.
  • the layered structure is observed as a lattice image in, for example, a high-resolution TEM image.
  • the position of the peak indicating the c-axis orientation may vary depending on the type and composition of the metal elements constituting CAAC-OS.
  • a plurality of bright spots are observed in the electron diffraction pattern of the CAAC-OS film.
  • a certain spot and another spot are observed at point-symmetrical positions with the spot of the incident electron beam passing through the sample (also referred to as a direct spot) as the center of symmetry.
  • the lattice arrangement in the crystal region is based on a hexagonal lattice, but the unit lattice is not limited to a regular hexagon and may be a non-regular hexagon. Further, in the above strain, it may have a lattice arrangement such as a pentagon or a heptagon.
  • a clear grain boundary cannot be confirmed even in the vicinity of strain. That is, it can be seen that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is because CAAC-OS can tolerate distortion due to the fact that the arrangement of oxygen atoms is not dense in the ab plane direction, the bond distance between atoms changes due to the substitution of metal atoms, and the like. It is thought that this is the reason.
  • CAAC-OS for which no clear crystal grain boundary is confirmed, is one of the crystalline oxides having a crystal structure suitable for the semiconductor layer of the transistor.
  • a configuration having Zn is preferable.
  • In-Zn oxide and In-Ga-Zn oxide are more suitable than In oxide because they can suppress the generation of grain boundaries.
  • CAAC-OS is an oxide semiconductor that has high crystallinity and no clear grain boundary is confirmed. Therefore, it can be said that CAAC-OS is unlikely to cause a decrease in electron mobility due to grain boundaries. Further, since the crystallinity of the oxide semiconductor may be lowered due to the mixing of impurities, the generation of defects, etc., CAAC-OS can be said to be an oxide semiconductor having few impurities and defects (oxygen deficiency, etc.). Therefore, the oxide semiconductor having CAAC-OS has stable physical properties. Therefore, the oxide semiconductor having CAAC-OS is resistant to heat and has high reliability. CAAC-OS is also stable against high temperatures (so-called thermal budgets) in the manufacturing process. Therefore, when CAAC-OS is used for the OS transistor, the degree of freedom in the manufacturing process can be expanded.
  • nc-OS has periodicity in the atomic arrangement in a minute region (for example, a region of 1 nm or more and 10 nm or less, particularly a region of 1 nm or more and 3 nm or less).
  • nc-OS has tiny crystals. Since the size of the minute crystal is, for example, 1 nm or more and 10 nm or less, particularly 1 nm or more and 3 nm or less, the minute crystal is also referred to as a nanocrystal.
  • nc-OS does not show regularity in crystal orientation between different nanocrystals. Therefore, no orientation is observed in the entire film.
  • nc-OS may be indistinguishable from a-like OS or amorphous oxide semiconductor depending on the analysis method.
  • a structural analysis is performed on an nc-OS film using an XRD apparatus, a peak indicating crystallinity is not detected in the Out-of-plane XRD measurement using a ⁇ / 2 ⁇ scan.
  • electron beam diffraction also referred to as limited field electron diffraction
  • a diffraction pattern such as a halo pattern is performed. Is observed.
  • electron diffraction also referred to as nanobeam electron diffraction
  • an electron beam having a probe diameter for example, 1 nm or more and 30 nm or less
  • An electron diffraction pattern in which a plurality of spots are observed in a ring-shaped region centered on a direct spot may be acquired.
  • the a-like OS is an oxide semiconductor having a structure between nc-OS and an amorphous oxide semiconductor.
  • the a-like OS has a void or low density region. That is, a-like OS has lower crystallinity than nc-OS and CAAC-OS. In addition, a-like OS has a higher hydrogen concentration in the membrane than nc-OS and CAAC-OS.
  • CAC-OS relates to the material composition.
  • CAC-OS is, for example, a composition of a material in which the elements constituting the metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 3 nm or less, or a size close thereto.
  • the metal oxide one or more metal elements are unevenly distributed, and the region having the metal element has a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 3 nm or less, or a size close thereto.
  • the mixed state is also called a mosaic shape or a patch shape.
  • CAC-OS has a structure in which the material is separated into a first region and a second region to form a mosaic shape, and the first region is distributed in the membrane (hereinafter, also referred to as a cloud shape). It says.). That is, CAC-OS is a composite metal oxide having a structure in which the first region and the second region are mixed.
  • the atomic number ratios of In, Ga, and Zn with respect to the metal elements constituting CAC-OS in the In-Ga-Zn oxide are expressed as [In], [Ga], and [Zn], respectively.
  • the first region is a region in which [In] is larger than [In] in the composition of the CAC-OS film.
  • the second region is a region in which [Ga] is larger than [Ga] in the composition of the CAC-OS film.
  • the first region is a region in which [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region.
  • the second region is a region in which [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.
  • the first region is a region in which indium oxide, indium zinc oxide, etc. are the main components.
  • the second region is a region in which gallium oxide, gallium zinc oxide, or the like is the main component. That is, the first region can be rephrased as a region containing In as a main component. Further, the second region can be rephrased as a region containing Ga as a main component.
  • a region containing In as a main component (No. 1) by EDX mapping acquired by using energy dispersive X-ray spectroscopy (EDX: Energy Dispersive X-ray spectroscopy). It can be confirmed that the region (1 region) and the region containing Ga as a main component (second region) have a structure in which they are unevenly distributed and mixed.
  • EDX Energy Dispersive X-ray spectroscopy
  • CAC-OS When CAC-OS is used for a transistor, the conductivity caused by the first region and the insulating property caused by the second region act in a complementary manner to switch the switching function (On / Off function). Can be added to CAC-OS. That is, the CAC-OS has a conductive function in a part of the material and an insulating function in a part of the material, and has a function as a semiconductor in the whole material. By separating the conductive function and the insulating function, both functions can be maximized. Therefore, by using CAC-OS as a transistor, high on-current ( Ion ), high field-effect mobility ( ⁇ ), and good switching operation can be realized.
  • Ion on-current
  • ⁇ high field-effect mobility
  • Oxide semiconductors have various structures, and each has different characteristics.
  • the oxide semiconductor of one aspect of the present invention has two or more of amorphous oxide semiconductor, polycrystalline oxide semiconductor, a-like OS, CAC-OS, nc-OS, and CAAC-OS. You may.
  • the oxide semiconductor as a transistor, a transistor with high field effect mobility can be realized. Moreover, a highly reliable transistor can be realized.
  • the carrier concentration in the channel formation region of the oxide semiconductor is 1 ⁇ 10 17 cm -3 or less, preferably 1 ⁇ 10 15 cm -3 or less, more preferably 1 ⁇ 10 13 cm -3 or less, more preferably 1 ⁇ . It is 10 11 cm -3 or less, more preferably 1 ⁇ 10 10 cm -3 or less, and 1 ⁇ 10 -9 cm -3 or more.
  • the impurity concentration in the oxide semiconductor film may be lowered to lower the defect level density.
  • a low impurity concentration and a low defect level density is referred to as high-purity intrinsic or substantially high-purity intrinsic.
  • An oxide semiconductor having a low carrier concentration may be referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor.
  • the trap level density may also be low.
  • the charge captured at the trap level of the oxide semiconductor takes a long time to disappear, and may behave as if it were a fixed charge. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor having a high trap level density may have unstable electrical characteristics.
  • Impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, silicon and the like.
  • the concentration of silicon or carbon in the channel formation region of the oxide semiconductor and the concentration of silicon or carbon near the interface with the channel formation region of the oxide semiconductor are set to 2 ⁇ 10 18 atoms /. It is cm 3 or less, preferably 2 ⁇ 10 17 atoms / cm 3 or less.
  • the oxide semiconductor contains an alkali metal or an alkaline earth metal
  • a defect level may be formed and carriers may be generated. Therefore, a transistor using an oxide semiconductor containing an alkali metal or an alkaline earth metal tends to have a normally-on characteristic. Therefore, the concentration of the alkali metal or alkaline earth metal in the channel formation region of the oxide semiconductor obtained by SIMS is set to 1 ⁇ 10 18 atoms / cm 3 or less, preferably 2 ⁇ 10 16 atoms / cm 3 or less. ..
  • the nitrogen concentration in the channel formation region of the oxide semiconductor obtained by SIMS is 5 ⁇ 10 19 atoms / cm 3 or less, preferably less than 5 ⁇ 10 18 atoms / cm 3 , more preferably 1 ⁇ 10 18 atoms. / Cm 3 or less, more preferably 5 ⁇ 10 17 atoms / cm 3 or less.
  • hydrogen contained in an oxide semiconductor reacts with oxygen bonded to a metal atom to become water, which may form an oxygen deficiency.
  • oxygen deficiency When hydrogen enters the oxygen deficiency, electrons that are carriers may be generated.
  • a part of hydrogen may be combined with oxygen that is bonded to a metal atom to generate an electron as a carrier. Therefore, a transistor using an oxide semiconductor containing hydrogen tends to have a normally-on characteristic. Therefore, it is preferable that hydrogen in the channel forming region of the oxide semiconductor is reduced as much as possible.
  • the hydrogen concentration obtained by SIMS is less than 1 ⁇ 10 20 atoms / cm 3 , preferably less than 5 ⁇ 10 19 atoms / cm 3 , more preferably 1 ⁇ 10. It should be less than 19 atoms / cm 3 , more preferably less than 5 ⁇ 10 18 atoms / cm 3 , and even more preferably less than 1 ⁇ 10 18 atoms / cm 3 .
  • the semiconductor material that can be used for the oxide 230 is not limited to the above-mentioned metal oxide.
  • a semiconductor material having a bandgap (a semiconductor material that is not a zero-gap semiconductor) may be used.
  • a semiconductor of a single element such as silicon, a compound semiconductor such as gallium arsenide, a layered substance (also referred to as an atomic layer substance, a two-dimensional material, or the like) that functions as a semiconductor as a semiconductor material.
  • a layered substance also referred to as an atomic layer substance, a two-dimensional material, or the like
  • the layered substance is a general term for a group of materials having a layered crystal structure.
  • a layered crystal structure is a structure in which layers formed by covalent or ionic bonds are laminated via bonds that are weaker than covalent or ionic bonds, such as van der Waals forces.
  • the layered material has high electrical conductivity in the unit layer, that is, high two-dimensional electrical conductivity.
  • Chalcogenides are compounds containing chalcogens.
  • chalcogen is a general term for elements belonging to Group 16, and includes oxygen, sulfur, selenium, tellurium, polonium, and livermorium.
  • Examples of chalcogenides include transition metal chalcogenides and group 13 chalcogenides.
  • oxide 230 for example, it is preferable to use a transition metal chalcogenide that functions as a semiconductor.
  • Specific transition metal chalcogenides applicable as oxide 230 include molybdenum sulfide (typically MoS 2 ), molybdenum disulfide (typically MoSe 2 ), and molybdenum tellurium (typically MoTe 2 ).
  • Tungsten sulfide typically WS 2
  • Tungsten disulfide typically WSe 2
  • Tungsten tellurium typically WTe 2
  • Hafnium sulfide typically HfS 2
  • Hafnium serene typically typically
  • Typical examples include HfSe 2 ), zirconium sulfide (typically ZrS 2 ), and zirconium selenium (typically ZrSe 2 ).
  • a in each figure shows a top view.
  • B in each figure is a cross-sectional view corresponding to the portion indicated by the alternate long and short dash line of A1-A2 shown in A in each figure, and is also a cross-sectional view in the channel length direction of the transistor 200.
  • C in each figure is a cross-sectional view corresponding to the portion indicated by the alternate long and short dash line in A3 to A4 in each figure, and is also a cross-sectional view in the channel width direction of the transistor 200.
  • D in each figure is a cross-sectional view of a portion indicated by a alternate long and short dash line in A5-A6 in each figure.
  • some elements are omitted for the purpose of clarifying the figure.
  • the insulating material for forming an insulator, the conductive material for forming a conductor, or the semiconductor material for forming a semiconductor is a sputtering method, a CVD method, an MBE method, a PLD method, or an ALD method. Etc. can be used as appropriate to form a film.
  • the sputtering method includes an RF sputtering method that uses a high-frequency power source as a sputtering power source, a DC sputtering method that uses a DC power source, and a pulse DC sputtering method that changes the voltage applied to the electrodes in a pulsed manner.
  • the RF sputtering method is mainly used when forming an insulating film
  • the DC sputtering method is mainly used when forming a metal conductive film.
  • the pulse DC sputtering method is mainly used when a compound such as an oxide, a nitride, or a carbide is formed into a film by the reactive sputtering method.
  • the CVD method can be classified into a plasma CVD (PECVD) method using plasma, a thermal CVD (TCVD: Thermal CVD) method using heat, an optical CVD (Photo CVD) method using light, and the like. Further, it can be divided into a metal CVD (MCVD: Metal CVD) method and an organometallic CVD (MOCVD: Metal Organic CVD) method depending on the raw material gas used.
  • PECVD plasma CVD
  • TCVD Thermal CVD
  • Photo CVD Photo CVD
  • MCVD Metal CVD
  • MOCVD Metal Organic CVD
  • the plasma CVD method can obtain a high quality film at a relatively low temperature. Further, since the thermal CVD method does not use plasma, it is a film forming method capable of reducing plasma damage to the object to be processed. For example, wiring, electrodes, elements (transistors, capacitive elements, etc.) and the like included in a semiconductor device may be charged up by receiving electric charges from plasma. At this time, the accumulated electric charge may destroy the wiring, electrodes, elements, and the like included in the semiconductor device. On the other hand, in the case of the thermal CVD method that does not use plasma, such plasma damage does not occur, so that the yield of the semiconductor device can be increased. Further, in the thermal CVD method, plasma damage during film formation does not occur, so that a film having few defects can be obtained.
  • thermal ALD Thermal ALD
  • PEALD plasma-excited reactor
  • the CVD method and the ALD method are different from the film forming method in which particles emitted from a target or the like are deposited, and are film forming methods in which a film is formed by a vapor phase reaction on the surface of an object to be treated. Therefore, it is a film forming method that is not easily affected by the shape of the object to be treated and has good step coverage.
  • the ALD method has excellent step covering property and excellent thickness uniformity, and is therefore suitable for covering the surface of an opening having a high aspect ratio.
  • the ALD method since the ALD method has a relatively slow film forming rate, it may be preferable to use it in combination with another film forming method such as a CVD method having a high film forming rate.
  • a film having an arbitrary composition can be formed depending on the flow rate ratio of the raw material gas.
  • a film having a continuously changed composition can be formed by changing the flow rate ratio of the raw material gas while forming the film.
  • the time required for the film formation is shortened because the time required for transport and pressure adjustment is not required as compared with the case where the film is formed using a plurality of film forming chambers. can do. Therefore, it may be possible to increase the productivity of the semiconductor device.
  • a plurality of precursors having different compositions are introduced at the same time, or a film having an arbitrary composition is formed by controlling the number of introductions of a plurality of precursors having different compositions in one cycle of each precursor. Can be done.
  • a substrate (not shown) is prepared, and an insulator 212 is formed on the substrate (see FIGS. 7A to 7D).
  • the film formation of the insulator 212 is preferably performed by using a sputtering method.
  • a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 212 can be reduced.
  • the film formation of the insulator 212 is not limited to the sputtering method, and a CVD method, an MBE method, a PLD method, an ALD method, or the like may be appropriately used.
  • silicon nitride is formed as the insulator 212 by the pulse DC sputtering method using a silicon target in an atmosphere containing nitrogen gas.
  • the pulse DC sputtering method it is possible to suppress the generation of particles due to the arcing of the target surface, so that the film thickness distribution can be made more uniform.
  • the pulse voltage the rise and fall of the discharge can be made steeper than the high frequency voltage. As a result, electric power can be supplied to the electrodes more efficiently to improve the sputtering rate and film quality.
  • an insulator such as silicon nitride that is difficult for impurities such as water and hydrogen to permeate it is possible to suppress the diffusion of impurities such as water and hydrogen contained in the layer below the insulator 212. Further, by using an insulator such as silicon nitride that does not easily allow copper to permeate as the insulator 212, even if a metal such as copper that easily diffuses is used for the conductor in the lower layer (not shown) of the insulator 212, the metal is used. Can be suppressed from diffusing upward through the insulator 212.
  • the insulator 214 is formed on the insulator 212 (see FIGS. 7A to 7D).
  • the film formation of the insulator 214 is preferably performed by using a sputtering method.
  • a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 214 can be reduced.
  • the film formation of the insulator 214 is not limited to the sputtering method, and a CVD method, an MBE method, a PLD method, an ALD method, or the like may be appropriately used.
  • aluminum oxide is formed as the insulator 214 by a pulse DC sputtering method using an aluminum target in an atmosphere containing oxygen gas.
  • the pulse DC sputtering method By using the pulse DC sputtering method, the film thickness distribution can be made more uniform, and the sputtering rate and the film quality can be improved.
  • RF (Radio Frequency) power may be applied to the substrate.
  • the amount of oxygen injected into the layer below the insulator 214 can be controlled by the magnitude of the RF power applied to the substrate.
  • the RF power 0 W / cm 2 or more, and 1.86W / cm 2 or less. That is, the amount of oxygen suitable for the characteristics of the transistor can be changed and injected by the RF power at the time of forming the insulator 214. Therefore, it is possible to inject an amount of oxygen suitable for improving the reliability of the transistor.
  • the RF frequency is preferably 10 MHz or higher. Typically, it is 13.56 MHz. The higher the RF frequency, the smaller
  • the insulator 214 it is preferable to use a metal oxide having an amorphous structure, for example, aluminum oxide, which has a high function of capturing hydrogen and fixing hydrogen. As a result, hydrogen contained in the insulator 216 or the like can be captured or fixed, and the hydrogen can be prevented from diffusing into the oxide 230.
  • a metal oxide having an amorphous structure or aluminum oxide having an amorphous structure as the insulator 214 because hydrogen may be captured or fixed more effectively. Thereby, the transistor 200 having good characteristics and high reliability and the semiconductor device can be manufactured.
  • the insulator 216 is formed on the insulator 214.
  • the film formation of the insulator 216 is preferably performed by using a sputtering method.
  • a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 216 can be reduced.
  • the film formation of the insulator 216 is not limited to the sputtering method, and a CVD method, an MBE method, a PLD method, an ALD method, or the like may be appropriately used.
  • silicon oxide is formed as the insulator 216 by a pulse DC sputtering method using a silicon target in an atmosphere containing oxygen gas.
  • the pulse DC sputtering method By using the pulse DC sputtering method, the film thickness distribution can be made more uniform, and the sputtering rate and the film quality can be improved.
  • the insulator 212, the insulator 214, and the insulator 216 are continuously formed without being exposed to the atmosphere.
  • a multi-chamber type film forming apparatus may be used.
  • the insulator 212, the insulator 214, and the insulator 216 are formed by reducing the amount of hydrogen in the film, and further, the amount of hydrogen mixed in the film between the film forming steps is reduced. Can be done.
  • an opening is formed in the insulator 216 to reach the insulator 214.
  • the opening also includes, for example, a groove, a slit, and the like. Further, the region where the opening is formed may be referred to as an opening. Although wet etching may be used to form the openings, it is preferable to use dry etching for microfabrication.
  • the insulator 214 it is preferable to select an insulator that functions as an etching stopper film when the insulator 216 is etched to form a groove. For example, when silicon oxide or silicon oxide nitride is used for the insulator 216 forming the groove, silicon nitride, aluminum oxide, or hafnium oxide may be used for the insulator 214.
  • a capacitively coupled plasma (CCP: Capacitively Coupled Plasma) etching apparatus having parallel plate type electrodes can be used.
  • the capacitive coupling type plasma etching apparatus having a parallel plate type electrode may be configured to apply a high frequency voltage to one of the parallel plate type electrodes. Alternatively, a plurality of different high frequency voltages may be applied to one of the parallel plate type electrodes. Alternatively, a high frequency voltage having the same frequency may be applied to each of the parallel plate type electrodes. Alternatively, a high frequency voltage having a different frequency may be applied to each of the parallel plate type electrodes.
  • a dry etching apparatus having a high-density plasma source can be used. As the dry etching apparatus having a high-density plasma source, for example, an inductively coupled plasma (ICP: Inductively Coupled Plasma) etching apparatus or the like can be used.
  • ICP Inductively Coupled Plasma
  • a conductive film 205A is formed (see FIGS. 7A to 7D). It is desirable that the conductive film 205A contains a conductor having a function of suppressing the permeation of oxygen.
  • a conductor having a function of suppressing the permeation of oxygen For example, tantalum nitride, tungsten nitride, titanium nitride and the like can be used. Alternatively, it can be a laminated film of a conductor having a function of suppressing oxygen permeation and a tantalum, tungsten, titanium, molybdenum, aluminum, copper or molybdenum tungsten alloy.
  • the film formation of the conductive film 205A can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • titanium nitride is formed as the conductive film 205A.
  • a metal nitride as the lower layer of the conductor 205b, it is possible to prevent the conductor 205b from being oxidized by the insulator 216 or the like. Further, even if a metal that easily diffuses such as copper is used as the conductor 205b, it is possible to prevent the metal from diffusing out from the conductor 205a.
  • the conductive film 205B is formed (see FIGS. 7A to 7D).
  • the conductive film 205B tantalum, tungsten, titanium, molybdenum, aluminum, copper, molybdenum-tungsten alloy and the like can be used.
  • the film formation of the conductive film 205B can be performed by using a plating method, a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • tungsten is formed as the conductive film 205B.
  • a part of the conductive film 205A and the conductive film 205B is removed, and the insulator 216 is exposed (see FIGS. 8A to 8D).
  • the conductor 205a and the conductor 205b remain only in the opening.
  • a part of the insulator 216 may be removed by the CMP treatment.
  • etching is performed to remove the upper part of the conductor 205b (see FIGS. 9A to 9D). As a result, the upper surface of the conductor 205b becomes lower than the upper surface of the conductor 205a and the upper surface of the insulator 216. Dry etching or wet etching may be used for etching the conductor 205b, but it is preferable to use dry etching for microfabrication.
  • the conductive film 205C is formed on the insulator 216, the conductor 205a, and the conductor 205b (see FIGS. 10A to 10D). It is desirable that the conductive film 205C contains a conductor having a function of suppressing the permeation of oxygen, similarly to the conductive film 205A.
  • titanium nitride is formed as the conductive film 205C.
  • a metal nitride as the upper layer of the conductor 205b, it is possible to prevent the conductor 205b from being oxidized by the insulator 222 or the like. Further, even if a metal that easily diffuses such as copper is used as the conductor 205b, it is possible to prevent the metal from diffusing out from the conductor 205c.
  • the conductor 205a, the conductor 205b, and the conductor 205c remain only in the opening.
  • the conductor 205 having a flat upper surface can be formed.
  • the conductor 205b is wrapped in the conductor 205a and the conductor 205c. Therefore, impurities such as hydrogen are prevented from diffusing from the conductor 205b to the outside of the conductor 205a and the conductor 205c, and oxygen is mixed from the outside of the conductor 205a and the conductor 205c to oxidize the conductor 205b. Can be prevented.
  • a part of the insulator 216 may be removed by the CMP treatment.
  • the insulator 222 is formed on the insulator 216 and the conductor 205.
  • an insulator containing an oxide of one or both of aluminum and hafnium may be formed.
  • the insulator containing one or both oxides of aluminum and hafnium it is preferable to use aluminum oxide, hafnium oxide, an oxide containing aluminum and hafnium (hafnium aluminate), and the like. Insulators containing oxides of one or both of aluminum and hafnium have barrier properties against oxygen, hydrogen, and water.
  • the insulator 222 has a barrier property against hydrogen and water, hydrogen and water contained in the structure provided around the transistor 200 are suppressed from diffusing into the inside of the transistor 200 through the insulator 222. , The formation of oxygen deficiency in the oxide 230 can be suppressed.
  • the film formation of the insulator 222 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • hafnium oxide is formed as the insulator 222 by using the ALD method.
  • the heat treatment may be carried out at 250 ° C. or higher and 650 ° C. or lower, preferably 300 ° C. or higher and 500 ° C. or lower, and more preferably 320 ° C. or higher and 450 ° C. or lower.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas.
  • the oxygen gas may be about 20%.
  • the heat treatment may be performed in a reduced pressure state.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, and then in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas to supplement the desorbed oxygen. You may.
  • the gas used in the above heat treatment is preferably highly purified.
  • the amount of water contained in the gas used in the heat treatment may be 1 ppb or less, preferably 0.1 ppb or less, and more preferably 0.05 ppb or less.
  • the flow rate ratio of nitrogen gas and oxygen gas is set to 4 slm: 1 slm, and the treatment is performed at a temperature of 400 ° C. for 1 hour.
  • impurities such as water and hydrogen contained in the insulator 222 can be removed.
  • an oxide containing hafnium is used as the insulator 222, a part of the insulator 222 may be crystallized by the heat treatment.
  • the heat treatment can be performed at a timing such as after the film formation of the insulator 224 is performed.
  • the insulator 224 is formed on the insulator 222.
  • the film formation of the insulator 224 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • silicon oxide is formed as the insulator 224 by using a sputtering method.
  • a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 224 can be reduced. Since the insulator 224 comes into contact with the oxide 230a in a later step, it is preferable that the hydrogen concentration is reduced in this way.
  • the oxide film 230A and the oxide film 230B are formed on the insulator 224 in this order (see FIGS. 12A to 12D). It is preferable that the oxide film 230A and the oxide film 230B are continuously formed without being exposed to the atmospheric environment. By forming the film without opening it to the atmosphere, it is possible to prevent impurities or moisture from the atmospheric environment from adhering to the oxide film 230A and the oxide film 230B, and the vicinity of the interface between the oxide film 230A and the oxide film 230B can be prevented. Can be kept clean.
  • the oxide film 230A and the oxide film 230B can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the oxide film 230A and the oxide film 230B are preferably formed by using the ALD method because a film having a uniform thickness can be formed even in a groove or an opening having a large aspect ratio. Further, it is preferable to use the PEALD method because the oxide film 230A and the oxide film 230B can be formed at a lower temperature than the thermal ALD method.
  • a sputtering method is used to form the oxide film 230A and the oxide film 230B.
  • the oxide film 230A and the oxide film 230B are formed by a sputtering method
  • oxygen or a mixed gas of oxygen and a rare gas is used as the sputtering gas.
  • excess oxygen in the oxide film formed can be increased.
  • the above oxide film is formed by a sputtering method
  • the above In—M—Zn oxide target or the like can be used.
  • the proportion of oxygen contained in the sputtering gas may be 70% or more, preferably 80% or more, and more preferably 100%.
  • the oxide film 230B is formed by a sputtering method, if the ratio of oxygen contained in the sputtering gas is more than 30% and 100% or less, preferably 70% or more and 100% or less, the oxygen excess type oxidation is performed. A physical semiconductor is formed. Transistors using oxygen-rich oxide semiconductors in the channel formation region can obtain relatively high reliability. However, one aspect of the present invention is not limited to this.
  • the oxide film 230B is formed by a sputtering method and the ratio of oxygen contained in the sputtering gas is 1% or more and 30% or less, preferably 5% or more and 20% or less, an oxygen-deficient oxide semiconductor is formed. To. Transistors using oxygen-deficient oxide semiconductors in the channel formation region can obtain relatively high field-effect mobilities. Further, the crystallinity of the oxide film can be improved by forming a film while heating the substrate.
  • an oxide film 243A is formed on the oxide film 230B (see FIGS. 12A to 12D).
  • the oxide film 243A can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the atomic number ratio of Ga to In is preferably larger than the atomic number ratio of Ga to In in the oxide film 230B.
  • the insulator 222, the insulator 224, the oxide film 230A, the oxide film 230B, and the oxide film 243A are formed by a sputtering method without being exposed to the atmosphere.
  • a multi-chamber type film forming apparatus may be used.
  • the insulator 222, the insulator 224, the oxide film 230A, the oxide film 230B, and the oxide film 243A are formed by reducing the amount of hydrogen in the film, and further, hydrogen is formed in the film between each film forming step. Can be reduced.
  • the heat treatment may be performed in a temperature range in which the oxide film 230A, the oxide film 230B, and the oxide film 243A do not crystallize, and may be performed at 250 ° C. or higher and 650 ° C. or lower, preferably 400 ° C. or higher and 600 ° C. or lower.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas.
  • the oxygen gas may be about 20%.
  • the heat treatment may be performed in a reduced pressure state.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, and then in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas to supplement the desorbed oxygen. You may.
  • the gas used in the above heat treatment is preferably highly purified.
  • the amount of water contained in the gas used in the heat treatment may be 1 ppb or less, preferably 0.1 ppb or less, and more preferably 0.05 ppb or less.
  • the treatment after performing the treatment at a temperature of 400 ° C. for 1 hour in a nitrogen atmosphere, the treatment is continuously performed at a temperature of 400 ° C. for 1 hour in an oxygen atmosphere.
  • impurities such as water and hydrogen in the oxide film 230A, the oxide film 230B, and the oxide film 243A can be removed.
  • the heat treatment can improve the crystallinity of the oxide film 230B to obtain a denser and more dense structure. Thereby, the diffusion of oxygen or impurities in the oxide film 230B can be reduced.
  • a conductive film 242A is formed on the oxide film 243A (see FIGS. 12A to 12D).
  • the film formation of the conductive film 242A can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • a sputtering method for example, as the conductive film 242A, tantalum nitride may be formed by using a sputtering method.
  • the heat treatment may be performed before the film formation of the conductive film 242A.
  • the heat treatment may be carried out under reduced pressure to continuously form a conductive film 242A without exposing it to the atmosphere.
  • the temperature of the heat treatment is preferably 100 ° C. or higher and 400 ° C. or lower. In this embodiment, the temperature of the heat treatment is set to 200 ° C.
  • an insulating film 271A is formed on the conductive film 242A (see FIGS. 12A to 12D).
  • the insulating film 271A can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • As the insulating film 271A it is preferable to use an insulating film having a function of suppressing the permeation of oxygen.
  • aluminum oxide or silicon nitride may be formed as the insulating film 271A by a sputtering method.
  • aluminum oxide is formed as the insulating film 271A by a pulse DC sputtering method using an aluminum target in an atmosphere containing oxygen gas.
  • the RF power applied to the substrate shall be 0.62 W / cm 2 or less.
  • the conductive film 242A and the insulating film 271A are formed by a sputtering method without being exposed to the atmosphere.
  • a multi-chamber type film forming apparatus may be used.
  • the conductive film 242A and the insulating film 271A can be formed by reducing the amount of hydrogen in the film, and further, it is possible to reduce the mixing of hydrogen in the film between each film forming step.
  • the film serving as the hard mask may be continuously formed without being exposed to the atmosphere.
  • the oxide film 230A, the oxide film 230B, the oxide film 243A, the conductive film 242A, the insulating film 271A, and the insulator 224 are processed into an island shape, and the oxide 230a, the oxide 230b, and the oxide are oxidized.
  • the material layer 243B, the conductive layer 242B, and the insulating layer 271B are formed (see FIGS. 13A to 13D). Further, a dry etching method or a wet etching method can be used for the processing. Processing by the dry etching method is suitable for microfabrication.
  • the oxide film 230A, the oxide film 230B, the oxide film 243A, the conductive film 242A, the insulating film 271A, and the insulator 224 may be processed under different conditions. In this step, the insulator 224 is superposed on the oxide 230a and processed into an island shape.
  • the resist is first exposed through a mask. Next, the exposed region is removed or left with a developer to form a resist mask. Next, a conductor, a semiconductor, an insulator, or the like can be processed into a desired shape by etching through the resist mask.
  • a resist mask may be formed by exposing the resist using KrF excimer laser light, ArF excimer laser light, EUV (Extreme Ultraviolet) light, or the like.
  • an immersion technique may be used in which a liquid (for example, water) is filled between the substrate and the projection lens for exposure.
  • an electron beam or an ion beam may be used instead of the above-mentioned light.
  • the resist mask can be removed by performing a dry etching process such as ashing, performing a wet etching process, performing a wet etching process after the dry etching process, or performing a dry etching process after the wet etching process.
  • a dry etching process such as ashing, performing a wet etching process, performing a wet etching process after the dry etching process, or performing a dry etching process after the wet etching process.
  • a hard mask made of an insulator or a conductor may be used under the resist mask.
  • a hard mask an insulating film or a conductive film to be a hard mask material is formed on the conductive film 242A, a resist mask is formed on the insulating film or a conductive film, and the hard mask material is etched to form a hard mask having a desired shape. can do.
  • Etching of the conductive film 242A or the like may be performed after removing the resist mask, or may be performed while leaving the resist mask. In the latter case, the resist mask may disappear during etching.
  • the hard mask may be removed by etching after etching the conductive film 242A or the like.
  • the material of the hard mask does not affect the post-process or can be used in the post-process, it is not always necessary to remove the hard mask.
  • the insulating layer 271B when used as a hard mask, it is preferable to appropriately adjust the film thickness of the insulating layer 271B to suppress the disappearance of the insulating layer 271B during etching of the conductive film 242A or the like.
  • the conductive layer 242B does not have a curved surface between the side surface and the upper surface as shown in FIGS. 13B to 13D.
  • the conductor 242a and the conductor 242b shown in FIGS. 1B and 1D have a square end at the intersection of the side surface and the upper surface. Since the end portion where the side surface and the upper surface of the conductor 242 intersect is angular, the cross-sectional area of the conductor 242 becomes larger than that in the case where the end portion has a curved surface. As a result, the resistance of the conductor 242 is reduced, so that the on-current of the transistor 200 can be increased.
  • the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B are formed so that at least a part thereof overlaps with the conductor 205. Further, it is preferable that the side surfaces of the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B are substantially perpendicular to the upper surface of the insulator 222.
  • a plurality of transistors 200 are provided so that the side surfaces of the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B are substantially perpendicular to the upper surface of the insulator 222. At the same time, it is possible to reduce the area and increase the density. Alternatively, the angle formed by the side surfaces of the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B and the upper surface of the insulator 222 may be low. ..
  • the angle formed by the side surfaces of the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B and the upper surface of the insulator 222 is preferably 60 degrees or more and less than 70 degrees. .. With such a shape, the covering property of the insulator 272 or the like can be improved and defects such as voids can be reduced in the subsequent steps.
  • the by-products generated in the etching step may be formed in layers on the side surfaces of the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B.
  • the layered by-product will be formed between the insulator 224, the oxide 230a, the oxide 230b, the oxide 243, the conductor 242, and the insulator 271 and the insulator 272.
  • layered by-products may be formed on the insulator 222. If the process is advanced to produce the transistor 200 in a state where the layered by-product is formed on the insulator 222, the reliability of the transistor 200 may deteriorate. Therefore, it is preferable to remove the layered by-product formed in contact with the upper surface of the insulator 222.
  • the insulator 272 is formed on the insulator 224, the oxide 230a, the oxide 230b, the oxide layer 243B, the conductive layer 242B, and the insulating layer 271B (see FIGS. 14A to 14D).
  • the film formation of the insulator 272 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • silicon nitride, aluminum oxide, or the like can be used.
  • the insulator 272 may have a laminated structure.
  • silicon nitride may be formed and aluminum oxide may be formed on the silicon nitride, or aluminum oxide may be formed and silicon nitride may be formed on the aluminum oxide.
  • silicon nitride is formed as the insulator 272 by a sputtering method.
  • the oxide 230a, the oxide 230b, the oxide layer 243B, and the conductive layer 242B can be covered with the insulator 272 and the insulating layer 271B having a function of suppressing the diffusion of oxygen. Thereby, it is possible to reduce the diffusion of oxygen into the oxide 230a, the oxide 230b, the oxide layer 243B, and the conductive layer 242B in a later step.
  • an insulating film to be the insulator 280 is formed on the insulator 272.
  • the insulating film can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • a silicon oxide film may be formed by using a sputtering method.
  • an insulator 280 containing excess oxygen can be formed.
  • the hydrogen concentration in the insulator 280 can be reduced.
  • heat treatment may be performed before the film formation of the insulating film.
  • the heat treatment may be performed under reduced pressure to continuously form the insulating film without exposing it to the atmosphere.
  • water and hydrogen adsorbed on the surface of the insulator 272 and the like are removed, and further, in the oxide 230a, in the oxide 230b, in the oxide layer 243B, and in the insulator 224.
  • the water concentration and hydrogen concentration can be reduced.
  • the above-mentioned heat treatment conditions can be used for the heat treatment.
  • the insulating film to be the insulator 280 is subjected to CMP treatment to form an insulator 280 having a flat upper surface (see FIGS. 14A to 14D).
  • silicon nitride may be formed on the insulator 280 by, for example, a sputtering method, and CMP treatment may be performed until the silicon nitride reaches the insulator 280.
  • a part of the insulator 280, a part of the insulator 272, a part of the insulating layer 271B, a part of the conductive layer 242B, and a part of the oxide layer 243B are processed to reach the oxide 230b.
  • the opening is preferably formed so as to overlap the conductor 205.
  • an insulator 271a, an insulator 271b, a conductor 242a, a conductor 242b, an oxide 243a, and an oxide 243b are formed (see FIGS. 15A to 15D).
  • the upper part of the oxide 230b may be removed. By removing a part of the oxide 230b, a groove is formed in the oxide 230b. Depending on the depth of the groove, the groove may be formed in the opening forming step, or may be formed in a step different from the opening forming step.
  • the processing of a part of the insulator 280, a part of the insulator 272, a part of the insulating layer 271B, a part of the conductive layer 242B, and a part of the oxide layer 243B is performed by a dry etching method or a wet etching method. Can be used. Processing by the dry etching method is suitable for microfabrication. Further, the processing may be performed under different conditions.
  • a part of the insulator 280 is processed by a dry etching method
  • a part of the insulator 272 and a part of the insulating layer 271B are processed by a wet etching method
  • a part of the conductive layer 242B and the oxide layer 243B are processed.
  • a part of the above may be processed by a dry etching method.
  • the processing of a part of the conductive layer 242B and a part of the oxide layer 243B may be performed under different conditions.
  • the impurities include an insulator 280, an insulator 272, a part of the insulating layer 271B, and a component contained in the conductive layer 242B, and a component contained in a member used in an apparatus used for forming the opening. Examples thereof include those caused by components contained in the gas or liquid used for etching. Examples of the impurities include aluminum, silicon, tantalum, fluorine, chlorine and the like.
  • impurities such as aluminum or silicon inhibit the conversion of oxide 230b to CAAC-OS. Therefore, it is preferable that impurity elements such as aluminum and silicon that hinder CAAC-OS conversion are reduced or removed.
  • the concentration of aluminum atoms in the oxide 230b and its vicinity may be 5.0 atomic% or less, preferably 2.0 atomic% or less, more preferably 1.5 atomic% or less, and 1.0. Atomic% or less is more preferable, and less than 0.3 atomic% is further preferable.
  • the region of the metal oxide that has become a pseudo-amorphous oxide semiconductor (a-like OS: amorphous-like oxide semiconductor) due to the inhibition of CAAC-OS by impurities such as aluminum or silicon is defined as the non-CAAC region. May be called.
  • the non CAAC region since the compactness of the crystal structure is reduced, V O H has a large amount of formation, the transistor tends to be normally on reduction. Therefore, the non-CAAC region of the oxide 230b is preferably reduced or removed.
  • the oxide 230b has a layered CAAC structure.
  • the conductor 242a or the conductor 242b and its vicinity function as a drain. That is, it is preferable that the oxide 230b near the lower end of the conductor 242a (conductor 242b) has a CAAC structure.
  • the cleaning method include wet cleaning using a cleaning liquid, plasma treatment using plasma, cleaning by heat treatment, and the like, and the above cleanings may be appropriately combined.
  • the cleaning treatment may deepen the groove.
  • the cleaning treatment may be performed using an aqueous solution obtained by diluting ammonia water, oxalic acid, phosphoric acid, hydrofluoric acid or the like with carbonated water or pure water, pure water, carbonated water or the like.
  • ultrasonic cleaning may be performed using these aqueous solutions, pure water, or carbonated water.
  • these washings may be appropriately combined.
  • a commercially available aqueous solution obtained by diluting hydrofluoric acid with pure water may be referred to as diluted hydrofluoric acid
  • a commercially available aqueous solution obtained by diluting ammonia water with pure water may be referred to as diluted ammonia water.
  • concentration, temperature, etc. of the aqueous solution may be appropriately adjusted depending on the impurities to be removed, the configuration of the semiconductor device to be washed, and the like.
  • the ammonia concentration of the diluted ammonia water may be 0.01% or more and 5% or less, preferably 0.1% or more and 0.5% or less.
  • the hydrogen fluoride concentration of the diluted hydrofluoric acid may be 0.01 ppm or more and 100 ppm or less, preferably 0.1 ppm or more and 10 ppm or less.
  • a frequency of 200 kHz or higher, preferably 900 kHz or higher is used. By using this frequency, damage to the oxide 230b and the like can be reduced.
  • the above cleaning treatment may be performed a plurality of times, and the cleaning liquid may be changed for each cleaning treatment.
  • a treatment using diluted hydrofluoric acid or diluted aqueous ammonia may be performed as the first cleaning treatment
  • a treatment using pure water or carbonated water may be performed as the second cleaning treatment.
  • wet cleaning is performed using diluted hydrofluoric acid, and then wet cleaning is performed using pure water or carbonated water.
  • impurities adhering to or diffused inside the surface such as oxide 230a and oxide 230b can be removed.
  • the crystallinity of the oxide 230b can be enhanced.
  • the heat treatment may be performed after the etching or the cleaning.
  • the heat treatment may be carried out at 100 ° C. or higher and 450 ° C. or lower, preferably 350 ° C. or higher and 400 ° C. or lower.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas.
  • the heat treatment is preferably performed in an oxygen atmosphere.
  • oxygen can be supplied to the oxide 230a and the oxide 230b to reduce the oxygen deficiency.
  • the heat treatment may be performed in a reduced pressure state.
  • the heat treatment may be continuously performed in a nitrogen atmosphere without being exposed to the atmosphere.
  • an insulating film 250A to be an insulator 250a is formed (see FIGS. 16A to 16D).
  • the heat treatment may be performed before the film formation of the insulating film 250A, and the heat treatment may be performed under reduced pressure to continuously form the insulating film 250A without exposure to the atmosphere. Moreover, it is preferable that the heat treatment is performed in an atmosphere containing oxygen. By performing such a treatment, it is possible to remove the water and hydrogen adsorbed on the surface of the oxide 230b and the like, and further reduce the water concentration and the hydrogen concentration in the oxide 230a and the oxide 230b. ..
  • the temperature of the heat treatment is preferably 100 ° C. or higher and 400 ° C. or lower.
  • the insulating film 250A can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Further, the insulating film 250A is preferably formed by a film forming method using a gas in which hydrogen atoms have been reduced or removed. Thereby, the hydrogen concentration of the insulating film 250A can be reduced. Since the insulating film 250A becomes an insulator 250 in contact with the oxide 230b in a later step, it is preferable that the hydrogen concentration is reduced in this way.
  • the insulating film 250A is preferably formed by the PEALD method using a gas containing silicon and not containing a hydrocarbon (precursor) and an oxidizing gas (reactant). It is necessary that the film thickness of the insulator 250 of the miniaturized transistor 200, which functions as the gate insulating film, is extremely thin (for example, about 0.5 nm or more and 15.0 nm or less) and the variation is small. ..
  • the PEALD method is a film-forming method in which a precursor and a reactor (oxidizing agent) are alternately introduced, and the film thickness can be adjusted by the number of times this cycle is repeated, so that the film thickness is precise. It can be adjusted.
  • the accuracy of the gate insulating film required by the miniaturized transistor 200 can be achieved.
  • the insulating film 250A needs to be formed on the bottom surface and the side surface of the opening formed by the insulator 280 or the like with good coverage. Since layers of atoms can be deposited layer by layer on the bottom surface and the side surface of the opening, the insulating film 250A can be formed with good coverage on the opening. Further, by using the PEALD method, it is possible to form a film at a relatively low substrate temperature.
  • a gas containing silicon and not containing a hydrocarbon (precursor) and an oxidizing gas (reactant) it is possible to suppress the mixing of hydrogen in the insulating film 250A and the oxide 230b.
  • a precursor containing impurities such as carbon for example, an organic precursor having a CH group is not used, impurities such as carbon and hydrocarbons can be suppressed from being mixed into the insulating film 250A.
  • a denser film containing no impurities or the like can be formed, it is possible to prevent the diffusion of In from the oxide 230b to the insulating film 250A.
  • SiH 4 is used as a precursor and N 2 O is used as a reactor.
  • the film thickness of the insulating film 250A is repeated in steps S01 to S04 as one cycle until a desired film thickness is reached according to the process flow shown in FIG. 5 and the sequence shown in FIGS. 6A and 6B.
  • an insulating film 250B to be an insulator 250b is formed (see FIGS. 17A to 17D).
  • the insulating film 250B can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the insulating film 250B is preferably formed by using an insulator having a function of suppressing the diffusion of oxygen. With such a configuration, oxygen contained in the insulator 250a can be suppressed from diffusing into the conductor 260. That is, it is possible to suppress a decrease in the amount of oxygen supplied to the oxide 230. In addition, oxidation of the conductor 260 by oxygen contained in the insulator 250a can be suppressed.
  • the insulating film 250A can be provided using a material that can be used for the above-mentioned insulator 250, and the insulating film 250B can be provided using the same material as the insulator 222.
  • the insulating film 250B is specifically a metal oxide containing one or more selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, magnesium and the like.
  • a metal oxide that can be used as the oxide 230 can be used.
  • silicon oxide is deposited as the insulating film 250A by the PECVD method, and hafnium oxide is deposited as the insulating film 250B by the thermal ALD method.
  • microwave treatment is performed in an atmosphere containing oxygen (see FIGS. 17A to 17D).
  • the dotted lines shown in FIGS. 17B, 17C, and 17D indicate microwaves, high frequencies such as RF, oxygen plasma, oxygen radicals, and the like.
  • the microwave processing apparatus may have a power source for applying RF to the substrate side.
  • high-density plasma high-density oxygen radicals can be generated.
  • oxygen ions generated by the high-density plasma can be efficiently guided into the oxide 230b.
  • the microwave treatment is preferably performed under reduced pressure, and the pressure may be 60 Pa or more, preferably 133 Pa or more, more preferably 200 Pa or more, and further preferably 400 Pa or more.
  • the oxygen flow rate ratio (O 2 / (O 2 + Ar)) is 50% or less, preferably 10% or more and 30% or less.
  • the treatment temperature may be 750 ° C. or lower, preferably 500 ° C. or lower, for example, about 400 ° C.
  • the heat treatment may be continuously performed without exposing to the outside air.
  • oxygen gas is turned into plasma using a high frequency such as microwave or RF, and the oxygen plasma is oxidized. It can act on the region between the conductor 242a and the conductor 242b of 230b.
  • the region 230bc can be irradiated with a high frequency wave such as a microwave or RF. That is, microwaves, high frequencies such as RF, oxygen plasma, and the like can be applied to the region 230bc shown in FIG. Plasma, by the action such as a microwave, and divide the V O H region 230Bc, hydrogen can be removed from the area 230Bc.
  • the carrier concentration can be decreased. Further, by supplying the oxygen radical generated by the oxygen plasma or the oxygen contained in the insulator 250 to the oxygen deficiency formed in the region 230 bc, the oxygen deficiency in the region 230 bc is further reduced and the carrier concentration is increased. Can be lowered.
  • the conductor 242a and the conductor 242b are provided on the region 230ba and the region 230bb shown in FIG.
  • the conductors 242a and 242b shield the action of microwaves, high frequencies such as RF, oxygen plasma, etc., so that these actions block the action of the region 230ba and the region. It is less than 230bb.
  • the microwave treatment, the region 230ba and area 230Bb, reduction of V O H, and excessive amount of oxygen supply does not occur, it is possible to prevent a decrease in carrier concentration.
  • the oxide selectively oxygen deficiency in the semiconductor region 230Bc, a and V O H may be removed to an area 230Bc i-type or substantially i-type. Further, it is possible to suppress the supply of excess oxygen to the region 230ba and the region 230bb that function as the source region or the drain region, and to maintain the n-type. As a result, fluctuations in the electrical characteristics of the transistor 200 can be suppressed, and fluctuations in the electrical characteristics of the transistor 200 can be suppressed within the substrate surface.
  • microwave treatment may be performed after the insulating film 250A is formed. Further, it is not necessary to perform the microwave treatment after the film formation of the insulating film 250A and not to perform the microwave treatment after the film formation of the insulating film 250B.
  • the heat treatment may be performed while maintaining the reduced pressure state after each microwave treatment.
  • hydrogen in the insulating film 250A, the insulating film 250B, the oxide 230b, and the oxide 230a can be efficiently removed.
  • a part of hydrogen may be gettered on the conductor 242 (conductor 242a and conductor 242b).
  • the step of performing the heat treatment may be repeated a plurality of times while maintaining the reduced pressure state after the microwave treatment. By repeating the heat treatment, hydrogen in the insulating film 250A, the oxide 230b, and the oxide 230a can be removed more efficiently.
  • the heat treatment temperature is preferably 300 ° C. or higher and 500 ° C. or lower.
  • the film quality of the insulating film 250A and the insulating film 250B by modifying the film quality of the insulating film 250A and the insulating film 250B by performing microwave treatment, diffusion of hydrogen, water, impurities and the like can be suppressed. Therefore, hydrogen, water, impurities, etc. are diffused to the oxide 230b, the oxide 230a, etc. through the insulator 250 by a post-process such as a film formation of a conductive film to be a conductor 260 or a post-treatment such as a heat treatment. Can be suppressed.
  • a post-process such as a film formation of a conductive film to be a conductor 260 or a post-treatment such as a heat treatment.
  • a conductive film to be the conductor 260a and a conductive film to be the conductor 260b are formed in this order.
  • the film formation of the conductive film to be the conductor 260a and the conductive film to be the conductor 260b can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the ALD method is used to form a conductive film to be the conductor 260a
  • the CVD method is used to form the conductive film to be the conductor 260b.
  • the insulating film 250A, the insulating film 250B, the conductive film to be the conductor 260a, and the conductive film to be the conductor 260b are polished until the insulator 280 is exposed, thereby forming the insulator 250a and the insulator.
  • 250b and conductor 260 are formed (see FIGS. 18A-18D).
  • the insulator 250 is arranged so as to cover the opening reaching the oxide 230b and the inner wall (side wall and bottom surface) of the groove portion of the oxide 230b.
  • the conductor 260 is arranged so as to embed the opening and the groove through the insulator 250.
  • the heat treatment may be performed under the same conditions as the above heat treatment.
  • the treatment is carried out in a nitrogen atmosphere at a temperature of 400 ° C. for 1 hour.
  • the heat treatment the water concentration and the hydrogen concentration in the insulator 250 and the insulator 280 can be reduced.
  • the insulator 282 may be continuously formed without being exposed to the atmosphere.
  • the insulator 282a and the insulator 282b are continuously formed on the insulator 250, the conductor 260, and the insulator 280 (see FIGS. 19A to 19D).
  • the film formation of the insulator 282a and the insulator 282b can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the film formation of the insulator 282a and the insulator 282b is preferably performed by using a sputtering method. By using a sputtering method in which hydrogen does not have to be used as the film forming gas, the hydrogen concentration in the insulator 282a and the insulator 282b can be reduced.
  • aluminum oxide is formed as the insulator 282a and the insulator 282b by a pulse DC sputtering method using an aluminum target in an atmosphere containing oxygen gas.
  • the RF power applied to the substrate shall be 1.86 W / cm 2 or less.
  • the insulator 282a is formed of RF power applied to the substrate as a 0 W / cm 2, the insulator 282b, the film of the RF power applied to the substrate as 0.31 W / cm 2.
  • the insulator 282a, the insulator 282b, the insulator 280, the insulator 272, the insulator 222, and the insulator 216 are processed until they reach the upper surface of the insulator 214 (see FIGS. 20A to 20D).
  • wet etching may be used for the processing, it is preferable to use dry etching for fine processing.
  • heat treatment may be performed.
  • the heat treatment may be carried out at 250 ° C. or higher and 650 ° C. or lower, preferably 400 ° C. or higher and 600 ° C. or lower. Further, the heat treatment is preferably lower than the heat treatment temperature performed after the oxide film 243A is formed.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas.
  • the insulator 280 is formed from the side surface of the insulator 280 formed by processing the insulator 282a, the insulator 282b, the insulator 280, the insulator 272, the insulator 222, and the insulator 216.
  • the oxygen contained and the hydrogen combined with the oxygen can be released to the outside.
  • the oxygen contained in the insulator 280 and the hydrogen bonded to the oxygen can be released to the outside. Hydrogen combined with oxygen is released as water. Therefore, unnecessary oxygen and hydrogen contained in the insulator 280 can be reduced.
  • the insulator 283 is formed on the insulator 282b (see FIGS. 21A to 21D).
  • the film formation of the insulator 283 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the film formation of the insulator 283 is preferably performed by using a sputtering method.
  • a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 283 can be reduced.
  • the insulator 283 may have a multi-layer structure.
  • silicon nitride may be deposited by using a sputtering method, and silicon nitride may be deposited on the silicon nitride by using the ALD method.
  • the transistor 200 By wrapping the transistor 200 with the insulator 283 and the insulator 214 having a high barrier property, it is possible to prevent moisture and hydrogen from entering from the outside.
  • the insulator 274 is formed on the insulator 283.
  • the film formation of the insulator 274 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • silicon oxide is formed as the insulator 274 by the CVD method.
  • the upper surface of the insulator 274 is flattened by polishing the insulator 274 until the insulator 283 is exposed by CMP treatment (see FIGS. 22A to 22D). A part of the upper surface of the insulator 283 may be removed by the CMP treatment.
  • the insulator 284 is formed on the insulator 274 and the insulator 283 (see FIGS. 22A to 22D).
  • the film formation of the insulator 284 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the film formation of the insulator 284 is preferably performed by using a sputtering method. By using a sputtering method that does not require hydrogen to be used as the film forming gas, the hydrogen concentration in the insulator 284 can be reduced.
  • aluminum oxide is formed as the insulator 284 by a pulse DC sputtering method using an aluminum target in an atmosphere containing oxygen gas.
  • the RF power applied to the substrate shall be 0.62 W / cm 2 or less.
  • the RF power applied to the substrate is larger than the RF power applied to the substrate at the time of forming the insulator 282.
  • an opening reaching the conductor 242 is formed in the insulator 271, the insulator 272, the insulator 280, the insulator 282, the insulator 283, and the insulator 284 (see FIGS. 22A and 22B).
  • the opening may be formed by using a lithography method.
  • the shape of the opening is circular in the top view, but the shape is not limited to this.
  • the opening may have a substantially circular shape such as an ellipse, a polygonal shape such as a quadrangle, or a polygonal shape such as a quadrangle with rounded corners in a top view.
  • an insulating film to be the insulator 241 is formed, and the insulating film is anisotropically etched to form the insulator 241.
  • the insulating film can be formed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • As the insulating film it is preferable to use an insulating film having a function of suppressing the permeation of oxygen. For example, it is preferable to form an aluminum oxide film by using the ALD method. Alternatively, it is preferable to form silicon nitride by using the PEALD method. Silicon nitride is preferable because it has a high blocking property against hydrogen.
  • the anisotropic etching of the insulating film to be the insulator 241 for example, a dry etching method or the like may be used.
  • a dry etching method or the like By providing the insulator 241 on the side wall portion of the opening, it is possible to suppress the permeation of oxygen from the outside and prevent the oxidation of the conductor 240a and the conductor 240b to be formed next. Further, it is possible to prevent impurities such as water and hydrogen from diffusing from the conductor 240a and the conductor 240b to the outside.
  • a conductive film to be a conductor 240a and a conductor 240b is formed. It is desirable that the conductive film has a laminated structure containing a conductor having a function of suppressing the permeation of impurities such as water and hydrogen.
  • impurities such as water and hydrogen.
  • tantalum nitride, titanium nitride, or the like can be laminated with tungsten, molybdenum, copper, or the like.
  • the film formation of the conductive film can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the conductor 240a and the conductor 240b having a flat upper surface can be formed by leaving the conductive film only in the opening (see FIG. 22B).
  • a part of the upper surface of the insulator 284 may be removed by the CMP treatment.
  • a conductive film to be a conductor 246 is formed.
  • the film formation of the conductive film can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the conductive film to be the conductor 246 is processed by a lithography method to form a conductor 246a in contact with the upper surface of the conductor 240a and a conductor 246b in contact with the upper surface of the conductor 240b.
  • a part of the insulator 284 in the region where the conductors 246a and 246b and the insulator 284 do not overlap may be removed.
  • the insulator 286 is formed on the conductor 246 and the insulator 284.
  • the film formation of the insulator 286 can be performed by using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the insulator 286 may have a multi-layer structure.
  • silicon nitride may be formed into a film by using a sputtering method, and silicon nitride may be formed on the silicon nitride by a CVD method.
  • the semiconductor device having the transistor 200 shown in FIGS. 1A to 1D can be manufactured.
  • the transistor 200 can be manufactured by using the method for manufacturing the semiconductor device shown in the present embodiment.
  • microwave processing device that can be used in the method for manufacturing the semiconductor device will be described.
  • FIG. 23 schematically shows a top view of the single-wafer multi-chamber manufacturing apparatus 2700.
  • the manufacturing apparatus 2700 has an atmospheric side substrate supply chamber 2701 including a cassette port 2761 for accommodating the substrate and an alignment port 2762 for aligning the substrate, and an atmospheric side substrate transport for transporting the substrate from the atmospheric side substrate supply chamber 2701.
  • Room 2702 and load lock chamber 2703a that carries in the substrate and switches the pressure in the room from atmospheric pressure to atmospheric pressure, or from reduced pressure to atmospheric pressure, and carries out the substrate and reduces the pressure in the room from reduced pressure to atmospheric pressure, or It has an unload lock chamber 2703b for switching from atmospheric pressure to depressurization, a transport chamber 2704 for transporting a substrate in vacuum, a chamber 2706a, a chamber 2706b, a chamber 2706c, and a chamber 2706d.
  • the atmospheric side substrate transport chamber 2702 is connected to the load lock chamber 2703a and the unload lock chamber 2703b, the load lock chamber 2703a and the unload lock chamber 2703b are connected to the transport chamber 2704, and the transport chamber 2704 is connected to the chamber 2706a.
  • Chamber 2706b, chamber 2706c and chamber 2706d are connected to the atmospheric side substrate transport chamber 2702.
  • a gate valve GV is provided at the connection portion of each chamber, and each chamber can be independently held in a vacuum state except for the atmospheric side substrate supply chamber 2701 and the atmospheric side substrate transport chamber 2702. Further, a transfer robot 2763a is provided in the atmospheric side substrate transfer chamber 2702, and a transfer robot 2763b is provided in the transfer chamber 2704. The transfer robot 2763a and the transfer robot 2763b can transfer the substrate in the manufacturing apparatus 2700.
  • the back pressure (total pressure) of the transport chamber 2704 and each chamber is, for example, 1 ⁇ 10 -4 Pa or less, preferably 3 ⁇ 10 -5 Pa or less, and more preferably 1 ⁇ 10 -5 Pa or less.
  • the partial pressure of gas molecules (atoms) having a mass-to-charge ratio (m / z) of 18 in the transport chamber 2704 and each chamber is, for example, 3 ⁇ 10 -5 Pa or less, preferably 1 ⁇ 10 -5 Pa or less. , More preferably 3 ⁇ 10 -6 Pa or less.
  • the partial pressure of the gas molecules (atoms) having an m / z of 28 in the transport chamber 2704 and each chamber is, for example, 3 ⁇ 10 -5 Pa or less, preferably 1 ⁇ 10 -5 Pa or less, more preferably 3. ⁇ 10-6 Pa or less.
  • the partial pressure of the gas molecules (atoms) having an m / z of 44 in the transport chamber 2704 and each chamber is, for example, 3 ⁇ 10 -5 Pa or less, preferably 1 ⁇ 10 -5 Pa or less, more preferably 3. ⁇ 10-6 Pa or less.
  • the total pressure and partial pressure in the transport chamber 2704 and each chamber can be measured using a mass spectrometer.
  • a mass spectrometer for example, a quadrupole mass spectrometer (also referred to as Q-mass) Qulee CGM-051 manufactured by ULVAC, Inc. may be used.
  • the transport chamber 2704 and each chamber have a configuration in which there are few external leaks or internal leaks.
  • the leak rate of the transport chamber 2704 and each chamber is 3 ⁇ 10 -6 Pa ⁇ m 3 / s or less, preferably 1 ⁇ 10 -6 Pa ⁇ m 3 / s or less.
  • the leak rate of the gas molecule (atom) having m / z of 18 is set to 1 ⁇ 10 -7 Pa ⁇ m 3 / s or less, preferably 3 ⁇ 10 -8 Pa ⁇ m 3 / s or less.
  • the leak rate of the gas molecule (atom) having m / z of 28 is 1 ⁇ 10-5 Pa ⁇ m 3 / s or less, preferably 1 ⁇ 10-6 Pa ⁇ m 3 / s or less.
  • the leak rate of the gas molecule (atom) having m / z of 44 is set to 3 ⁇ 10 -6 Pa ⁇ m 3 / s or less, preferably 1 ⁇ 10 -6 Pa ⁇ m 3 / s or less.
  • the leak rate may be derived from the total pressure and partial pressure measured using the above-mentioned mass spectrometer.
  • the leak rate depends on external and internal leaks.
  • An external leak is a gas flowing in from outside the vacuum system due to a minute hole, a defective seal, or the like.
  • the internal leak is caused by a leak from a partition such as a valve in the vacuum system or a gas released from an internal member. In order to keep the leak rate below the above value, it is necessary to take measures from both the external leak and the internal leak.
  • the transport chamber 2704 and the opening and closing parts of each chamber may be sealed with a metal gasket.
  • a metal gasket it is preferable to use a metal coated with iron fluoride, aluminum oxide, or chromium oxide.
  • the metal gasket has higher adhesion than the O-ring and can reduce external leakage. Further, by using the passivation of the metal coated with iron fluoride, aluminum oxide, chromium oxide or the like, the released gas containing impurities released from the metal gasket can be suppressed, and the internal leak can be reduced.
  • a member constituting the manufacturing apparatus 2700 aluminum, chromium, titanium, zirconium, nickel or vanadium containing impurities and having a small amount of emitted gas is used. Further, the above-mentioned metal containing a small amount of emission gas containing impurities may be coated on an alloy containing iron, chromium, nickel and the like. Alloys containing iron, chromium, nickel, etc. are rigid, heat resistant and suitable for processing. Here, if the surface unevenness of the member is reduced by polishing or the like in order to reduce the surface area, the released gas can be reduced.
  • the members of the manufacturing apparatus 2700 described above may be coated with iron fluoride, aluminum oxide, chromium oxide, or the like.
  • the members of the manufacturing apparatus 2700 are preferably made of only metal as much as possible.
  • the surface thereof is made of iron fluoride, aluminum oxide, or oxide in order to suppress emitted gas. It is recommended to coat it thinly with chrome or the like.
  • the adsorbents present in the transport chamber 2704 and each chamber do not affect the pressure of the transport chamber 2704 and each chamber because they are adsorbed on the inner wall, etc., but cause gas release when the transport chamber 2704 and each chamber are exhausted. It becomes. Therefore, although there is no correlation between the leak rate and the exhaust speed, it is important to use a pump having a high exhaust capacity to remove the adsorbents existing in the transport chamber 2704 and each chamber as much as possible and exhaust them in advance.
  • the transport chamber 2704 and each chamber may be baked in order to promote the desorption of adsorbed substances. By baking, the desorption rate of the adsorbent can be increased by about 10 times. Baking may be performed at 100 ° C. or higher and 450 ° C. or lower.
  • the desorption rate of water or the like which is difficult to desorb only by exhausting, can be further increased.
  • the desorption rate of the adsorbent can be further increased.
  • an inert gas such as a heated rare gas or oxygen
  • the adsorbents in the transport chamber 2704 and each chamber can be desorbed, and the impurities existing in the transport chamber 2704 and each chamber can be reduced. It is effective to repeat this treatment 2 times or more and 30 times or less, preferably 5 times or more and 15 times or less.
  • an inert gas or oxygen having a temperature of 40 ° C. or higher and 400 ° C. or lower, preferably 50 ° C. or higher and 200 ° C.
  • the pressure in the transport chamber 2704 and each chamber can be increased by 0.1 Pa or more and 10 kPa.
  • it may be preferably 1 Pa or more and 1 kPa or less, more preferably 5 Pa or more and 100 Pa or less, and the period for maintaining the pressure may be 1 minute or more and 300 minutes or less, preferably 5 minutes or more and 120 minutes or less.
  • the transfer chamber 2704 and each chamber are exhausted for a period of 5 minutes or more and 300 minutes or less, preferably 10 minutes or more and 120 minutes or less.
  • Chambers 2706b and 2706c are, for example, chambers capable of performing microwave treatment on an object to be processed. It should be noted that the chamber 2706b and the chamber 2706c differ only in the atmosphere when microwave processing is performed. Since other configurations are common, they will be described together below.
  • the chamber 2706b and the chamber 2706c have a slot antenna plate 2808, a dielectric plate 2809, a substrate holder 2812, and an exhaust port 2819. Further, outside the chamber 2706b and the chamber 2706c, there are a gas supply source 2801, a valve 2802, a high frequency generator 2803, a waveguide 2804, a mode converter 2805, a gas tube 2806, and a waveguide 2807. A matching box 2815, a high frequency power supply 2816, a vacuum pump 2817, and a valve 2818 are provided.
  • the high frequency generator 2803 is connected to the mode converter 2805 via a waveguide 2804.
  • the mode converter 2805 is connected to the slot antenna plate 2808 via a waveguide 2807.
  • the slot antenna plate 2808 is arranged in contact with the dielectric plate 2809.
  • the gas supply source 2801 is connected to the mode converter 2805 via a valve 2802. Then, gas is sent to the chamber 2706b and the chamber 2706c by the mode converter 2805, the waveguide 2807, and the gas tube 2806 passing through the dielectric plate 2809.
  • the vacuum pump 2817 has a function of exhausting gas or the like from the chamber 2706b and the chamber 2706c via the valve 2818 and the exhaust port 2819.
  • the high frequency power supply 2816 is connected to the substrate holder 2812 via the matching box 2815.
  • the board holder 2812 has a function of holding the board 2811. For example, it has a function of electrostatically chucking or mechanically chucking the substrate 2811. It also functions as an electrode to which power is supplied from the high frequency power supply 2816. Further, it has a heating mechanism 2813 inside and has a function of heating the substrate 2811.
  • the vacuum pump 2817 for example, a dry pump, a mechanical booster pump, an ion pump, a titanium sublimation pump, a cryopump, a turbo molecular pump, or the like can be used. Further, in addition to the vacuum pump 2817, a cryotrap may be used. It is particularly preferable to use a cryopump and a cryotrap because water can be efficiently exhausted.
  • the heating mechanism 2813 may be, for example, a heating mechanism that heats using a resistance heating element or the like. Alternatively, it may be a heating mechanism that heats by heat conduction or heat radiation from a medium such as a heated gas.
  • RTA Rapid Thermal Analing
  • GRTA Gas Rapid Thermal Annealing
  • LRTA Riv Rapid Thermal Annealing
  • GRTA heat-treats using a high-temperature gas. As the gas, an inert gas is used.
  • the gas supply source 2801 may be connected to the refiner via a mass flow controller.
  • the gas it is preferable to use a gas having a dew point of ⁇ 80 ° C. or lower, preferably ⁇ 100 ° C. or lower.
  • oxygen gas, nitrogen gas, and noble gas argon gas, etc. may be used.
  • the dielectric plate 2809 for example, silicon oxide (quartz), aluminum oxide (alumina), yttrium oxide (itria), or the like may be used. Further, another protective layer may be formed on the surface of the dielectric plate 2809. As the protective layer, magnesium oxide, titanium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silicon oxide, aluminum oxide, yttrium oxide and the like may be used. Since the dielectric plate 2809 is exposed to a particularly high-density region of the high-density plasma 2810 described later, damage can be mitigated by providing a protective layer. As a result, it is possible to suppress an increase in particles during processing.
  • the high frequency generator 2803 has, for example, a function of generating microwaves of 0.3 GHz or more and 3.0 GHz or less, 0.7 GHz or more and 1.1 GHz or less, or 2.2 GHz or more and 2.8 GHz or less.
  • the microwave generated by the high frequency generator 2803 is transmitted to the mode converter 2805 via the waveguide 2804.
  • the microwave transmitted as the TE mode is converted into the TEM mode.
  • the microwave is transmitted to the slot antenna plate 2808 via the waveguide 2807.
  • the slot antenna plate 2808 is provided with a plurality of slot holes, and microwaves pass through the slot holes and the dielectric plate 2809. Then, an electric field can be generated below the dielectric plate 2809 to generate high-density plasma 2810.
  • ions and radicals corresponding to the gas type supplied from the gas supply source 2801 are present. For example, there are oxygen radicals and the like.
  • the substrate 2811 can modify the film and the like on the substrate 2811 by the ions and radicals generated by the high-density plasma 2810. It may be preferable to apply a bias to the substrate 2811 side by using the high frequency power supply 2816.
  • the high frequency power supply 2816 for example, an RF (Radio Frequency) power supply having a frequency such as 13.56 MHz or 27.12 MHz may be used.
  • the ions in the high-density plasma 2810 can be efficiently reached to the depth of an opening such as a film on the substrate 2811.
  • oxygen radical treatment using the high-density plasma 2810 can be performed by introducing oxygen from the gas supply source 2801 in the chamber 2706b or the chamber 2706c.
  • Chambers 2706a and 2706d are, for example, chambers capable of irradiating an object to be processed with electromagnetic waves. It should be noted that the chamber 2706a and the chamber 2706d differ only in the type of electromagnetic wave. Since there are many common parts about other configurations, they will be explained together below.
  • Chambers 2706a and 2706d have one or more lamps 2820, a substrate holder 2825, a gas inlet 2823, and an exhaust port 2830. Further, a gas supply source 2821, a valve 2822, a vacuum pump 2828, and a valve 2829 are provided outside the chamber 2706a and the chamber 2706d.
  • the gas supply source 2821 is connected to the gas introduction port 2823 via a valve 2822.
  • the vacuum pump 2828 is connected to the exhaust port 2830 via a valve 2829.
  • the lamp 2820 is arranged to face the substrate holder 2825.
  • the substrate holder 2825 has a function of holding the substrate 2824. Further, the substrate holder 2825 has a heating mechanism 2826 inside, and has a function of heating the substrate 2824.
  • a light source having a function of radiating electromagnetic waves such as visible light or ultraviolet light
  • a light source having a function of emitting an electromagnetic wave having a peak at a wavelength of 10 nm or more and 2500 nm or less, 500 nm or more and 2000 nm or less, or 40 nm or more and 340 nm or less may be used.
  • a light source such as a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arc lamp, a high-pressure sodium lamp, or a high-pressure mercury lamp may be used.
  • the electromagnetic wave radiated from the lamp 2820 can be partially or completely absorbed by the substrate 2824 to modify the film or the like on the substrate 2824.
  • defects can be created or reduced, or impurities can be removed. If the substrate 2824 is heated, defects can be efficiently generated or reduced, or impurities can be removed.
  • the substrate holder 2825 may be heated by the electromagnetic waves radiated from the lamp 2820 to heat the substrate 2824. In that case, it is not necessary to have the heating mechanism 2826 inside the substrate holder 2825.
  • the vacuum pump 2828 refers to the description about the vacuum pump 2817.
  • the heating mechanism 2826 refers to the description about the heating mechanism 2813.
  • the gas supply source 2821 refers to the description about the gas supply source 2801.
  • the microwave processing device that can be used in this embodiment is not limited to the above.
  • the microwave processing apparatus 2900 shown in FIG. 26 can be used.
  • the microwave processing apparatus 2900 includes a quartz tube 2901, an exhaust port 2819, a gas supply source 2801, a valve 2802, a high frequency generator 2803, a waveguide 2804, a gas tube 2806, a vacuum pump 2817, and a valve 2818.
  • the microwave processing apparatus 2900 has a substrate holder 2902 that holds a plurality of substrates 2811 (2811_1 to 2811_n, n is an integer of 2 or more) in the quartz tube 2901.
  • the microwave processing apparatus 2900 may have the heating means 2903 on the outside of the quartz tube 2901.
  • the microwave generated by the high frequency generator 2803 is irradiated to the substrate provided in the quartz tube 2901 via the waveguide 2804.
  • the vacuum pump 2817 is connected to the exhaust port 2819 via a valve 2818, and the pressure inside the quartz tube 2901 can be adjusted.
  • the gas supply source 2801 is connected to the gas pipe 2806 via a valve 2802, and a desired gas can be introduced into the quartz pipe 2901.
  • the heating means 2903 can heat the substrate 2811 in the quartz tube 2901 to a desired temperature. Alternatively, the heating means 2903 may heat the gas supplied from the gas supply source 2801.
  • the microwave processing apparatus 2900 can simultaneously perform heat treatment and microwave treatment on the substrate 2811. Further, after heating the substrate 2811, microwave treatment can be performed. Further, the substrate 2811 can be heat-treated after being microwave-treated.
  • the substrates 2811_1 to 2811_n may all be processing substrates forming a semiconductor device or a storage device, or some of the substrates may be dummy substrates.
  • the substrate 2811_1 and the substrate 2811_n may be used as dummy substrates, and the substrates 2811_2 to 2811_n-1 may be used as processing substrates.
  • the substrate 2811_1, the substrate 2811_2, the substrate 2811_n-1, and the substrate 2811_n may be used as dummy substrates, and the substrates 2811_3 to 2811_n-2 may be used as processing substrates.
  • a dummy substrate it is preferable to use a dummy substrate because a plurality of treated substrates can be uniformly treated during microwave treatment or heat treatment, and variations between the treated substrates can be reduced. For example, by arranging the dummy substrate on the processing substrate closest to the high frequency generator 2803 and the waveguide 2804, it is possible to suppress the direct exposure of the processing substrate to microwaves, which is preferable.
  • FIG. 2A shows a top view of the semiconductor device.
  • FIG. 2B is a cross-sectional view corresponding to the portion indicated by the alternate long and short dash line of A1-A2 shown in FIG. 2A.
  • 2C is a cross-sectional view corresponding to the portion shown by the alternate long and short dash line in A3-A4 in FIG. 2A.
  • 2D is a cross-sectional view corresponding to the portion shown by the alternate long and short dash line in A5-A6 in FIG. 2A.
  • some elements are omitted for the sake of clarity.
  • the same reference numerals are added to the structures having the same functions as the structures constituting the semiconductor devices shown in ⁇ Semiconductor device configuration example>.
  • the materials described in detail in ⁇ Semiconductor device configuration example> can be used as the constituent materials of the semiconductor device.
  • the semiconductor device shown in FIGS. 2A to 2D is a modification of the semiconductor device shown in FIGS. 1A to 1D.
  • the semiconductor device shown in FIGS. 2A to 2D is different from the semiconductor device shown in FIGS. 1A to 1D in that the insulator 283 is in contact with a part of the upper surface of the insulator 212. Therefore, the transistor 200 is arranged in the region sealed by the insulator 283 and the insulator 212. With the above configuration, it is possible to prevent hydrogen contained outside the sealed region from being mixed into the sealed region. Further, in the transistor 200 shown in FIGS.
  • the configuration in which the insulator 212 and the insulator 283 are provided as a single layer is shown, but the present invention is not limited thereto.
  • the insulator 212 and the insulator 283 may each be provided as a laminated structure having two or more layers.
  • FIGS. 27A and 27B the transistor 200 according to one aspect of the present invention is provided, which is different from the ones shown in the above ⁇ Semiconductor device configuration example> and the above ⁇ Semiconductor device modification>.
  • An example of a semiconductor device will be described.
  • the same reference numerals are given to the structures having the same functions as the structures constituting the semiconductor devices (see FIGS. 1A to 1D) shown in ⁇ Semiconductor device configuration example>. I will add it.
  • the constituent material of the transistor 200 the material described in detail in ⁇ Semiconductor device configuration example> can be used.
  • FIG. 27A and 27B show a configuration in which transistors 200_1 to 200_n are comprehensively sealed with an insulator 283 and an insulator 214.
  • the transistors 200_1 to 200_n appear to be arranged in the channel length direction, but the transistor 200_1 to the transistor 200_n are not limited to this.
  • the transistors 200_1 to 200_1 may be arranged in the channel width direction or may be arranged in a matrix. Further, depending on the design, they may be arranged without regularity.
  • a portion where the insulator 283 and the insulator 214 are in contact with each other (hereinafter, may be referred to as a sealing portion 265) is formed outside the transistors 200_1 to 200_n.
  • the sealing portion 265 is formed so as to surround the transistor 200_1 to the transistor 200_n.
  • the transistor 200_1 to the transistor 200_n can be wrapped with the insulator 283 and the insulator 214. Therefore, a plurality of transistors (also referred to as transistor groups) surrounded by the sealing portion 265 are provided on the substrate.
  • a dicing line (sometimes referred to as a scribing line, a dividing line, or a cutting line) may be provided on the sealing portion 265. Since the substrate is divided at the dicing line, the transistor group surrounded by the sealing portion 265 is taken out as one chip.
  • FIG. 27A an example in which the transistors 200_1 to the transistors 200_n are surrounded by one sealing portion 265 is shown, but the present invention is not limited to this.
  • the transistor 200_1 to the transistor 200_n may be surrounded by a plurality of sealing portions.
  • the transistors 200_1 to 200_n are surrounded by the sealing portion 265a, and further surrounded by the outer sealing portion 265b.
  • the portion where the insulator 283 and the insulator 214 are in contact with each other increases, so that the adhesion between the insulator 283 and the insulator 214 is further improved. Can be made to. Thereby, the transistor 200_1 to the transistor 200_n can be sealed more reliably.
  • a dicing line may be provided so as to overlap the sealing portion 265a or the sealing portion 265b, or a dicing line may be provided between the sealing portion 265a and the sealing portion 265b.
  • FIGS. 27A and 27B an example of a configuration in which the insulator 283 and the insulator 214 are in contact with each other is shown, but as shown in FIG. 2 and ⁇ Modification example of the semiconductor device>, the insulator is insulated from the insulator 283.
  • the body 212 may be in contact with the body 212.
  • the present invention it is possible to provide a semiconductor device having little variation in transistor characteristics. Further, according to one aspect of the present invention, it is possible to provide a semiconductor device having good reliability. Further, according to one aspect of the present invention, it is possible to provide a semiconductor device having good electrical characteristics. Further, according to one aspect of the present invention, it is possible to provide a semiconductor device having a large on-current. Further, according to one aspect of the present invention, it is possible to provide a semiconductor device capable of miniaturization or high integration. Further, according to one aspect of the present invention, a semiconductor device having low power consumption can be provided.
  • FIG. 28 shows an example of a semiconductor device (storage device) according to one aspect of the present invention.
  • the semiconductor device of one aspect of the present invention has a configuration in which the transistor 200 is provided above the transistor 300, and the capacitive element 100 is provided above the transistor 300 and the transistor 200.
  • the transistor 200 the transistor 200 described in the previous embodiment can be used.
  • the transistor 200 is a transistor in which a channel is formed in a semiconductor layer having an oxide semiconductor. Since the transistor 200 has a small off-current, it is possible to retain the stored contents for a long period of time by using the transistor 200 as a storage device. That is, since the refresh operation is not required or the frequency of the refresh operation is extremely low, the power consumption of the storage device can be sufficiently reduced.
  • the wiring 1001 is electrically connected to the source of the transistor 300, and the wiring 1002 is electrically connected to the drain of the transistor 300. Further, the wiring 1003 is electrically connected to one of the source and drain of the transistor 200, the wiring 1004 is electrically connected to the first gate of the transistor 200, and the wiring 1006 is electrically connected to the second gate of the transistor 200. It is connected to the. Then, the gate of the transistor 300 and the other of the source and drain of the transistor 200 are electrically connected to one of the electrodes of the capacitance element 100, and the wiring 1005 is electrically connected to the other of the electrodes of the capacitance element 100. ..
  • the storage devices shown in FIG. 28 can form a memory cell array by arranging them in a matrix.
  • the transistor 300 is provided on the substrate 311 and functions as a conductor 316 that functions as a gate, an insulator 315 that functions as a gate insulator, a semiconductor region 313 that is a part of the substrate 311 and a low that functions as a source region or a drain region. It has a resistance region 314a and a low resistance region 314b.
  • the transistor 300 may be either a p-channel type or an n-channel type.
  • the semiconductor region 313 (a part of the substrate 311) on which the channel is formed has a convex shape. Further, the side surface and the upper surface of the semiconductor region 313 are provided so as to be covered with the conductor 316 via the insulator 315.
  • the conductor 316 may be made of a material that adjusts the work function. Since such a transistor 300 utilizes a convex portion of a semiconductor substrate, it is also called a FIN type transistor. It should be noted that an insulator that is in contact with the upper portion of the convex portion and functions as a mask for forming the convex portion may be provided. Further, although the case where a part of the semiconductor substrate is processed to form a convex portion is shown here, the SOI substrate may be processed to form a semiconductor film having a convex shape.
  • the transistor 300 shown in FIG. 28 is an example, and the transistor 300 is not limited to the structure thereof, and an appropriate transistor may be used according to the circuit configuration and the driving method.
  • the capacitive element 100 is provided above the transistor 200.
  • the capacitive element 100 has a conductor 110 that functions as a first electrode, a conductor 120 that functions as a second electrode, and an insulator 130 that functions as a dielectric.
  • the insulator 130 it is preferable to use an insulator that can be used as the insulator 286 shown in the above embodiment.
  • the conductor 112 and the conductor 110 can be formed at the same time.
  • the conductor 112 has a function as a plug or wiring that electrically connects to the capacitive element 100, the transistor 200, or the transistor 300.
  • the conductor 112 and the conductor 110 have a single-layer structure, but the structure is not limited to this, and a laminated structure of two or more layers may be used.
  • a conductor having a barrier property and a conductor having a high adhesion to a conductor having a high conductivity may be formed between a conductor having a barrier property and a conductor having a high conductivity.
  • the insulator 130 includes, for example, silicon oxide, silicon nitride, silicon nitride, silicon nitride, aluminum oxide, aluminum nitride, aluminum nitride, aluminum nitride, hafnium oxide, hafnium oxide, hafnium oxide, hafnium nitride. Etc. may be used, and it can be provided in a laminated or single layer.
  • the capacitive element 100 can secure a sufficient capacitance by having an insulator having a high dielectric constant (high-k), and by having an insulator having a large dielectric strength, the dielectric strength is improved and the capacitance is improved. Electrostatic destruction of the element 100 can be suppressed.
  • high-k materials materials having a high specific dielectric constant
  • examples of high-k materials include gallium oxide, hafnium oxide, zirconium oxide, oxides having aluminum and hafnium, nitride nitrides having aluminum and hafnium, silicon, and the like. There are oxides with hafnium, oxides with silicon and hafnium, or nitrides with silicon and hafnium.
  • silicon oxide, silicon oxide nitride, silicon nitride oxide, silicon nitride, silicon oxide with fluorine added, silicon oxide with carbon added, carbon and nitrogen are used as materials with high dielectric strength (materials with low relative permittivity).
  • silicon oxide, silicon oxide nitride, silicon nitride oxide, silicon nitride, silicon oxide with fluorine added, silicon oxide with carbon added, carbon and nitrogen are used as materials with high dielectric strength (materials with low relative permittivity).
  • silicon oxide, silicon oxide nitride, silicon nitride oxide, silicon nitride, silicon oxide with fluorine added, silicon oxide with carbon added, carbon and nitrogen are used as materials with high dielectric strength (materials with low relative permittivity).
  • silicon oxide, silicon oxide nitride, silicon nitride oxide, silicon nitride, silicon oxide with fluorine added, silicon oxide with carbon added, carbon and nitrogen are used as materials with high dielectric strength (materials with low relative permittivity).
  • a wiring layer provided with an interlayer film, wiring, a plug, or the like may be provided between the structures. Further, a plurality of wiring layers can be provided according to the design.
  • the conductor having a function as a plug or wiring may collectively give a plurality of structures the same reference numerals. Further, in the present specification and the like, the wiring and the plug electrically connected to the wiring may be integrated. That is, a part of the conductor may function as a wiring, and a part of the conductor may function as a plug.
  • an insulator 320, an insulator 322, an insulator 324, and an insulator 326 are laminated in this order on the transistor 300 as an interlayer film. Further, the insulator 320, the insulator 322, the insulator 324, and the insulator 326 are embedded with a capacitance element 100, a conductor 328 electrically connected to the transistor 200, a conductor 330, and the like. The conductor 328 and the conductor 330 function as plugs or wirings.
  • the insulator that functions as an interlayer film may function as a flattening film that covers the uneven shape below the insulator.
  • the upper surface of the insulator 322 may be flattened by a flattening treatment using a chemical mechanical polishing (CMP) method or the like in order to improve the flatness.
  • CMP chemical mechanical polishing
  • a wiring layer may be provided on the insulator 326 and the conductor 330.
  • the insulator 350, the insulator 352, and the insulator 354 are laminated in this order.
  • a conductor 356 is formed on the insulator 350, the insulator 352, and the insulator 354. The conductor 356 functions as a plug or wiring.
  • the insulator 210, the insulator 212, the insulator 214, and the insulator 216 are embedded with a conductor 218, a conductor (conductor 205) constituting the transistor 200, and the like.
  • the conductor 218 has a function as a plug or wiring for electrically connecting to the capacitance element 100 or the transistor 300.
  • an insulator 150 is provided on the conductor 120 and the insulator 130.
  • the insulator 217 is provided in contact with the side surface of the conductor 218 that functions as a plug.
  • the insulator 217 is provided in contact with the inner wall of the opening formed in the insulator 210, the insulator 212, the insulator 214, and the insulator 216. That is, the insulator 217 is provided between the conductor 218 and the insulator 210, the insulator 212, the insulator 214, and the insulator 216. Since the conductor 205 can be formed in parallel with the conductor 218, the insulator 217 may be formed in contact with the side surface of the conductor 205.
  • an insulator such as silicon nitride, aluminum oxide, or silicon nitride may be used. Since the insulator 217 is provided in contact with the insulator 210, the insulator 212, the insulator 214, and the insulator 222, impurities such as water or hydrogen from the insulator 210 or the insulator 216 or the like are oxidized through the conductor 218. It is possible to suppress mixing with the object 230. In particular, silicon nitride is suitable because it has a high blocking property against hydrogen. Further, it is possible to prevent oxygen contained in the insulator 210 or the insulator 216 from being absorbed by the conductor 218.
  • the insulator 217 can be formed in the same manner as the insulator 241.
  • the PEALD method may be used to form a film of silicon nitride, and anisotropic etching may be used to form an opening that reaches the conductor 356.
  • Examples of the insulator that can be used as the interlayer film include oxides, nitrides, oxide nitrides, nitride oxides, metal oxides, metal oxide nitrides, and metal nitride oxides having insulating properties.
  • the material may be selected according to the function of the insulator.
  • the insulator 150, the insulator 210, the insulator 352, the insulator 354, and the like have an insulator having a low relative permittivity.
  • the insulator preferably has silicon oxide to which fluorine has been added, silicon oxide to which carbon has been added, silicon oxide to which carbon and nitrogen have been added, silicon oxide having pores, or a resin.
  • the insulator may be silicon oxide, silicon oxide, silicon nitride, silicon nitride, silicon oxide added with fluorine, silicon oxide added with carbon, silicon oxide added with carbon and nitrogen, or silicon oxide having pores. And preferably have a laminated structure with a resin.
  • silicon oxide and silicon oxide nitride are thermally stable, they can be combined with a resin to form a laminated structure that is thermally stable and has a low relative permittivity.
  • the resin include polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, acrylic, and the like.
  • a transistor using an oxide semiconductor can stabilize the electrical characteristics of the transistor by surrounding it with an insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen. Therefore, as the insulator 214, the insulator 212, the insulator 350, and the like, an insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen may be used.
  • Examples of the insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen include boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, tantalum, and zirconium. Insulations containing, lanthanum, neodymium, hafnium or tantalum may be used in single layers or in layers.
  • an insulator having a function of suppressing the permeation of impurities such as hydrogen and oxygen aluminum oxide, magnesium oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide or Metal oxides such as tantalum oxide, silicon nitride oxide, silicon nitride and the like can be used.
  • Conductors that can be used for wiring and plugs include aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, and indium.
  • a material containing one or more metal elements selected from ruthenium and the like can be used.
  • a semiconductor having high electrical conductivity typified by polycrystalline silicon containing an impurity element such as phosphorus, and silicide such as nickel silicide may be used.
  • the conductor 328, the conductor 330, the conductor 356, the conductor 218, the conductor 112, and the like include a metal material, an alloy material, a metal nitride material, a metal oxide material, and the like formed of the above materials.
  • a metal material such as tungsten or molybdenum that has both heat resistance and conductivity, and it is preferable to use tungsten.
  • it is preferably formed of a low resistance conductive material such as aluminum or copper. Wiring resistance can be reduced by using a low resistance conductive material.
  • an insulator having an excess oxygen region may be provided in the vicinity of the oxide semiconductor. In that case, it is preferable to provide an insulator having a barrier property between the insulator having the excess oxygen region and the conductor provided in the insulator having the excess oxygen region.
  • the transistor 200 can be configured to be sealed by the insulator having a barrier property.
  • the insulator 241 it is possible to suppress the excess oxygen contained in the insulator 280 from being absorbed by the conductor 240. Further, by having the insulator 241, it is possible to prevent hydrogen, which is an impurity, from diffusing into the transistor 200 via the conductor 240.
  • an insulating material having a function of suppressing the diffusion of impurities such as water and hydrogen and oxygen it is preferable to use silicon nitride, silicon nitride oxide, aluminum oxide or hafnium oxide.
  • silicon nitride is preferable because it has a high blocking property against hydrogen.
  • metal oxides such as magnesium oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, and tantalum oxide can be used.
  • the transistor 200 may be configured to be sealed with an insulator 212, an insulator 214, an insulator 282, and an insulator 283. With such a configuration, it is possible to reduce the mixing of hydrogen contained in the insulator 274, the insulator 150 and the like into the insulator 280 and the like.
  • the conductor 240 penetrates the insulator 283 and the insulator 282, and the conductor 218 penetrates the insulator 214 and the insulator 212.
  • the insulator 241 is in contact with the conductor 240.
  • the insulator 217 is provided in contact with the conductor 218.
  • the transistor 200 is sealed with the insulator 212, the insulator 214, the insulator 282, the insulator 283, the insulator 241 and the insulator 217, and impurities such as hydrogen contained in the insulator 274 and the like are outside. It is possible to reduce contamination from.
  • a dicing line (sometimes referred to as a scribe line, a division line, or a cutting line) provided when a plurality of semiconductor devices are taken out in a chip shape by dividing a large-area substrate into semiconductor elements will be described. ..
  • a dividing method for example, there is a case where a groove (dicing line) for dividing a semiconductor element is first formed on a substrate, then the dicing line is cut, and the semiconductor device is divided (divided) into a plurality of semiconductor devices.
  • the region where the insulator 283 and the insulator 214 are in contact overlap with the dicing line it is preferable to design so that the region where the insulator 283 and the insulator 214 are in contact overlap with the dicing line. That is, openings are provided in the insulator 282, the insulator 280, the insulator 272, the insulator 222, and the insulator 216 in the vicinity of the region serving as the dicing line provided on the outer edge of the memory cell having the plurality of transistors 200.
  • the insulator 214 and the insulator 283 come into contact with each other at the openings provided in the insulator 282, the insulator 280, the insulator 272, the insulator 222, and the insulator 216.
  • openings may be provided in the insulator 282, the insulator 280, the insulator 272, the insulator 222, the insulator 216, and the insulator 214.
  • the insulator 212 and the insulator 283 come into contact with each other at the openings provided in the insulator 282, the insulator 280, the insulator 272, the insulator 222, the insulator 216, and the insulator 214. ..
  • the insulator 212 and the insulator 283 may be formed by using the same material and the same method. By providing the insulator 212 and the insulator 283 with the same material and the same method, the adhesion can be improved. For example, it is preferable to use silicon nitride.
  • the transistor 200 can be wrapped by the insulator 212, the insulator 214, the insulator 282, and the insulator 283. Since at least one of the insulator 212, the insulator 214, the insulator 282, and the insulator 283 has a function of suppressing the diffusion of oxygen, hydrogen, and water, the semiconductor element shown in the present embodiment is formed. By dividing the substrate for each circuit region, even if it is processed into a plurality of chips, impurities such as hydrogen or water are prevented from being mixed in from the side surface direction of the divided substrate and diffused to the transistor 200. Can be done.
  • the structure can prevent the excess oxygen of the insulator 280 and the insulator 224 from diffusing to the outside. Therefore, the excess oxygen of the insulator 280 and the insulator 224 is efficiently supplied to the oxide in which the channel is formed in the transistor 200.
  • the oxygen can reduce the oxygen deficiency of the oxide in which the channel is formed in the transistor 200.
  • the oxide in which the channel is formed in the transistor 200 can be made into an oxide semiconductor having a low defect level density and stable characteristics. That is, it is possible to suppress fluctuations in the electrical characteristics of the transistor 200 and improve reliability.
  • the shape of the capacitance element 100 is a planar type, but the storage device shown in the present embodiment is not limited to this.
  • the shape of the capacitance element 100 may be a cylinder type.
  • the storage device shown in FIG. 29 has the same configuration as the semiconductor device shown in FIG. 28 in the configuration below the insulator 150.
  • the capacitive element 100 shown in FIG. 29 is an insulator 150 on the insulator 130, an insulator 142 on the insulator 150, and a conductor 115 arranged in an opening formed in the insulator 150 and the insulator 142. It has an insulator 145 on the conductor 115 and the insulator 142, a conductor 125 on the insulator 145, and an insulator 152 on the insulator 125 and the insulator 145.
  • at least a part of the conductor 115, the insulator 145, and the conductor 125 is arranged in the openings formed in the insulator 150 and the insulator 142.
  • the conductor 115 functions as a lower electrode of the capacitance element 100
  • the conductor 125 functions as an upper electrode of the capacitance element 100
  • the insulator 145 functions as a dielectric of the capacitance element 100.
  • the capacitance element 100 has a configuration in which the upper electrode and the lower electrode face each other with a dielectric sandwiched not only on the bottom surface but also on the side surface at the openings of the insulator 150 and the insulator 142, and the capacitance per unit area.
  • the capacity can be increased. Therefore, the deeper the depth of the opening, the larger the capacitance of the capacitance element 100 can be.
  • an insulator that can be used for the insulator 280 may be used.
  • the insulator 142 preferably functions as an etching stopper when forming an opening of the insulator 150, and an insulator that can be used for the insulator 214 may be used.
  • the shape of the openings formed in the insulator 150 and the insulator 142 as viewed from above may be a quadrangle, a polygonal shape other than the quadrangle, or a polygonal shape with curved corners. , It may be a circular shape including an ellipse.
  • it is preferable that the area where the opening and the transistor 200 overlap is large. With such a configuration, the occupied area of the semiconductor device having the capacitance element 100 and the transistor 200 can be reduced.
  • the conductor 115 is arranged in contact with the insulator 142 and the opening formed in the insulator 150. It is preferable that the upper surface of the conductor 115 substantially coincides with the upper surface of the insulator 142. Further, the lower surface of the conductor 115 comes into contact with the conductor 110 through the opening of the insulator 130.
  • the conductor 115 is preferably formed by using an ALD method, a CVD method, or the like, and for example, a conductor that can be used for the conductor 205 may be used.
  • the insulator 145 is arranged so as to cover the conductor 115 and the insulator 142.
  • the insulator 145 is, for example, silicon oxide, silicon nitride, silicon nitride, silicon nitride, zirconium oxide, aluminum oxide, aluminum oxide, aluminum nitride, aluminum nitride, hafnium oxide, hafnium oxide, hafnium oxide, nitrided. Hafnium or the like may be used, and it can be provided in a laminated or single layer.
  • an insulating film in which zirconium oxide, aluminum oxide, and zirconium oxide are laminated in this order can be used.
  • a material having a large dielectric strength such as silicon oxide or a material having a high dielectric constant (high-k) as the insulator 145.
  • a laminated structure of a material having a large dielectric strength and a high dielectric constant (high-k) material may be used.
  • high-k materials materials having a high specific dielectric constant
  • examples of high-k materials include gallium oxide, hafnium oxide, zirconium oxide, oxides having aluminum and hafnium, nitride nitrides having aluminum and hafnium, silicon, and the like.
  • oxides having hafnium, nitrides having silicon and hafnium, nitrides having silicon and hafnium, and the like By using such a high-k material, it is possible to sufficiently secure the capacitance of the capacitance element 100 even if the insulator 145 is thickened. By increasing the thickness of the insulator 145, the leakage current generated between the conductor 115 and the conductor 125 can be suppressed.
  • silicon oxide, silicon oxide, silicon nitride, silicon nitride, silicon oxide added with fluorine, silicon oxide added with carbon, silicon oxide added with carbon and nitrogen, and vacancies are used as materials having high insulation strength.
  • silicon oxide, resin, etc. silicon nitride (SiN x ) formed by the PEALD method, silicon oxide (SiO x ) formed by the PEALD method, and silicon nitride (SiN x ) formed by the PEALD method are laminated in this order. An insulating film that has been formed can be used.
  • an insulating film laminated in the order of zirconium oxide, silicon oxide formed by using the ALD method, and zirconium oxide can be used.
  • an insulator having a large dielectric strength the dielectric strength can be improved and electrostatic breakdown of the capacitive element 100 can be suppressed.
  • the conductor 125 is arranged so as to fill the openings formed in the insulator 142 and the insulator 150. Further, the conductor 125 is electrically connected to the wiring 1005 via the conductor 140 and the conductor 153.
  • the conductor 125 is preferably formed by using an ALD method, a CVD method, or the like, and for example, a conductor that can be used for the conductor 205 may be used.
  • the conductor 153 is provided on the insulator 154 and is covered with the insulator 156.
  • a conductor that can be used for the conductor 112 may be used, and as the insulator 156, an insulator that can be used for the insulator 152 may be used.
  • the conductor 153 is in contact with the upper surface of the conductor 140, and functions as a terminal of the capacitive element 100, the transistor 200, or the transistor 300.
  • FIGS. 30A and 30B An example of the semiconductor device (storage device) according to one aspect of the present invention is shown in FIGS. 30A and 30B.
  • FIG. 30A is a cross-sectional view of a semiconductor device having a memory device 290.
  • the memory device 290 shown in FIG. 30A has a capacitive device 292 in addition to the transistor 200 shown in FIGS. 1A to 1D.
  • FIG. 30A corresponds to a cross-sectional view of the transistor 200 in the channel length direction.
  • the capacitive device 292 includes a conductor 242b, an insulator 271b provided on the conductor 242b, and an insulator 272 provided in contact with the upper surface of the insulator 271b, the side surface of the insulator 271b, and the side surface of the conductor 242b. , And a conductor 294 on the insulator 272. That is, the capacitance device 292 constitutes a MIM (Metal-Insulator-Metal) capacitance.
  • One of the pair of electrodes of the capacitive device 292, that is, the conductor 242b can also serve as the source electrode of the transistor.
  • the dielectric layer included in the capacitive device 292 can also serve as a protective layer provided on the transistor, that is, an insulator 271 and an insulator 272. Therefore, in the manufacturing process of the capacitive device 292, a part of the manufacturing process of the transistor can also be used, so that the semiconductor device can be highly productive. Further, since one of the pair of electrodes of the capacitive device 292, that is, the conductor 242b also serves as the source electrode of the transistor, it is possible to reduce the area where the transistor and the capacitive device are arranged.
  • the conductor 294 for example, a material that can be used for the conductor 242 may be used.
  • FIG. 30B is a cross-sectional view of a semiconductor device having a memory device 290, which is different from the structure shown in FIG. 30A.
  • the memory device 290 shown in FIG. 30B has a capacitive device 292 in addition to the transistor 200 shown in FIGS. 1A to 1D.
  • a part of the capacitance device 292 shown in FIG. 30B is provided in the insulator 280, the insulator 272, and the opening formed in the insulator 271b, unlike the capacitance device 292 shown in FIG. 30A.
  • FIG. 30B corresponds to a cross-sectional view of the transistor 200 in the channel length direction.
  • the capacitance device 292 includes a conductor 242b, an insulator 293 provided on the conductor 242b, and a conductor 294 provided on the insulator 293.
  • the insulator 293 and the conductor 294 are arranged in the openings formed in the insulator 280, the insulator 272, and the insulator 271b.
  • the insulator 293 is provided in contact with the bottom surface and the side wall of the opening. That is, the insulator 293 is in contact with the upper surface of the conductor 242b, the side surface of the insulator 271b, the side surface of the insulator 272, and the side surface of the insulator 280.
  • the insulator 293 is provided so as to form a recess along the shape of the opening.
  • the conductor 294 is arranged in contact with the upper surface and the side surface of the insulator 293 so as to embed the recess.
  • the heights of the upper surfaces of the insulator 293 and the conductor 294 may be substantially the same as the heights of the upper surfaces of the insulator 280, the insulator 250, and the conductor 260.
  • the conductor 242b functions as a lower electrode of the capacitance device 292
  • the conductor 294 functions as an upper electrode of the capacitance device 292
  • the insulator 293 functions as a dielectric of the capacitance device 292.
  • the capacitance device 292 constitutes the MIM capacitance.
  • One of the pair of electrodes of the capacitive device 292, that is, the conductor 242b, can also serve as the source electrode of the transistor. Therefore, in the manufacturing process of the capacitive device 292, a part of the manufacturing process of the transistor can also be used, so that the semiconductor device can be highly productive.
  • the insulator 293 can be provided separately from the configuration of the transistor 200, the structure and material of the insulator 293 can be appropriately selected according to the performance required for the capacitive device 292. Further, since one of the pair of electrodes of the capacitive device 292, that is, the conductor 242b also serves as the source electrode of the transistor, it is possible to reduce the area where the transistor and the capacitive device are arranged.
  • High dielectric constant (high-k) materials include gallium oxide, hafnium oxide, zirconium oxide, aluminum oxide, aluminum nitride oxide, aluminum nitride oxide, aluminum nitride, hafnium oxide, hafnium oxide.
  • Hafnium Nitride, Hafnium Nitride, Oxide with Aluminum and Hafnium, Oxide with Aluminum and Hafnium, Oxide with Silicon and Hafnium, Oxide with Silicon and Hafnium or Nitride with Silicon and Hafnium, etc. is there.
  • the insulator 293 one in which films of these high dielectric constant materials are laminated may be used.
  • the insulator 293, an insulating film in which zirconium oxide, aluminum oxide, and zirconium oxide are laminated in this order can be used.
  • the conductor 294 for example, a material that can be used for the conductor 260 may be used. Further, the conductor 294 may have a laminated structure like the conductor 260.
  • the insulator 293 and the conductor 294 may be formed before the film formation of the insulator 282, that is, before the step shown in FIG.
  • the formation of the insulator 293 and the conductor 294 can be performed in the same manner as the formation of the insulator 250 and the conductor 260. That is, openings are formed in the insulator 280, the insulator 272, and the insulator 271b, and a laminated film to be the insulator 293 and the conductor 294 is formed so as to be embedded in the openings, and a part of the laminated film is formed. May be removed using CMP treatment to form the insulator 293 and the conductor 294.
  • FIGS. 31A, 31B, 32, and 33 a transistor 200 and a capacitive device according to one aspect of the present invention, which are different from those shown in ⁇ Memory device configuration example 1> above.
  • An example of the semiconductor device having 292 will be described.
  • the semiconductor device shown in FIGS. 31A, 31B, 32, and 33 has the same structure as that of the semiconductor device (see FIG. 30A) shown in the previous embodiment and ⁇ Memory device configuration example 1>.
  • the same reference numerals are added to structures having a function.
  • the materials described in detail in the previous embodiment and ⁇ Memory device configuration example 1> can be used.
  • the memory device shown in FIG. 30A is used as the memory device, but the memory device is not limited to this.
  • the memory device shown in FIG. 30B may be used.
  • Memory device modification 1 an example of a semiconductor device 600 having a transistor 200a, a transistor 200b, a capacitive device 292a, and a capacitive device 292b according to one aspect of the present invention will be described with reference to FIG. 31A.
  • FIG. 31A is a cross-sectional view of a semiconductor device 600 having a transistor 200a, a transistor 200b, a capacitive device 292a, and a capacitive device 292b in the channel length direction.
  • the capacitive device 292a includes a conductor 242a, an insulator 271a on the conductor 242a, an insulator 272 in contact with the upper surface of the insulator 271a, the side surface of the insulator 271a, and the side surface of the conductor 242a, and the insulator 272. It has the above conductor 294a.
  • the capacitive device 292b includes a conductor 242b, an insulator 271b on the conductor 242b, an insulator 272 in contact with the upper surface of the insulator 271b, the side surface of the insulator 271b, and the side surface of the conductor 242b, and the insulator 272. It has the above conductor 294b.
  • the semiconductor device 600 has a line-symmetrical configuration with the alternate long and short dash line of A3-A4 as the axis of symmetry.
  • One of the source electrode or the drain electrode of the transistor 200a and one of the source electrode or the drain electrode of the transistor 200b are configured so that the conductor 242c also serves.
  • An insulator 271c is provided on the conductor 242c.
  • the conductor 246 that functions as wiring and the conductor 240 that also functions as a plug for connecting the transistor 200a and the transistor 200b are configured.
  • the connection between the two transistors, the two capacitive devices, the wiring and the plug as described above, it is possible to provide a semiconductor device capable of miniaturization or high integration.
  • the configuration example of the semiconductor device shown in FIG. 30A can be referred to.
  • the transistor 200a, the transistor 200b, the capacitive device 292a, and the capacitive device 292b have been mentioned as configuration examples of the semiconductor device, but the semiconductor device shown in the present embodiment is not limited to this.
  • the semiconductor device 600 and the semiconductor device having the same configuration as the semiconductor device 600 may be connected via a capacitance portion.
  • a semiconductor device having a transistor 200a, a transistor 200b, a capacitive device 292a, and a capacitive device 292b is referred to as a cell.
  • the above-mentioned description relating to the transistor 200a, the transistor 200b, the capacitive device 292a, and the capacitive device 292b can be referred to.
  • FIG. 31B is a cross-sectional view in which a semiconductor device 600 having a transistor 200a, a transistor 200b, a capacitance device 292a, and a capacitance device 292b and a cell having the same configuration as the semiconductor device 600 are connected via a capacitance section.
  • the conductor 294b that functions as one electrode of the capacitance device 292b included in the semiconductor device 600 also serves as one electrode of the capacitance device 601 having the same configuration as the semiconductor device 600. It has become.
  • the conductor 294a, which functions as one electrode of the capacitance device 292a of the semiconductor device 600 is on the left side of the semiconductor device 600, that is, in FIG. 31B, one of the capacitance devices of the semiconductor device adjacent to the semiconductor device 600 in the A1 direction. Also serves as an electrode.
  • the cell on the right side of the semiconductor device 601, that is, in FIG. 31B has the same configuration for the cell in the A2 direction.
  • a cell array (also referred to as a memory device layer) can be configured.
  • the spacing between adjacent cells can be reduced, so that the projected area of the cell array can be reduced, and high integration is possible.
  • a matrix-like cell array can be configured.
  • the cell area is reduced, and the semiconductor device having the cell array is miniaturized or increased. It can be integrated.
  • FIG. 32 shows a cross-sectional view of a configuration in which n layers of the cell array 610 are laminated. As shown in FIG. 32, by stacking a plurality of cell cells (series cell array 610_1 to cell array 610_n), cells can be integrated and arranged without increasing the occupied area of the cell array. That is, a 3D cell array can be constructed.
  • FIG. 33 shows an example in which the memory unit 470 has a transistor layer 413 having a transistor 200T and four memory device layers 415 (memory device layer 415_1 to memory device layer 415_4).
  • the memory device layer 415_1 to the memory device layer 415_1 each have a plurality of memory devices 420.
  • the memory device 420 is electrically connected to the memory device 420 of the different memory device layers 415 and the transistor 200T of the transistor layer 413 via the conductor 424 and the conductor 205.
  • the memory unit 470 is sealed by an insulator 212, an insulator 214, an insulator 282, and an insulator 283 (for convenience, hereinafter referred to as a sealing structure).
  • An insulator 274 is provided around the insulator 283. Further, the insulator 274, the insulator 283, and the insulator 212 are provided with a conductor 440, which is electrically connected to the element layer 411.
  • an insulator 280 is provided inside the sealing structure.
  • the insulator 280 has a function of releasing oxygen by heating.
  • the insulator 280 has an excess oxygen region.
  • the insulator 212 and the insulator 283 are preferably materials having a function of having a high blocking property against hydrogen. Further, the insulator 214 and the insulator 282 are preferably materials having a function of capturing hydrogen or fixing hydrogen.
  • examples of the material having a function of having a high blocking property against hydrogen include silicon nitride, silicon nitride and the like.
  • examples of the material having a function of capturing hydrogen or fixing hydrogen include aluminum oxide, hafnium oxide, and oxides containing aluminum and hafnium (hafnium aluminate).
  • the crystal structure of the materials used for the insulator 212, the insulator 214, the insulator 282, and the insulator 283 is not particularly limited, but may be an amorphous or crystalline structure.
  • Amorphous aluminum oxide may capture and adhere to hydrogen in greater amounts than highly crystalline aluminum oxide.
  • the excess oxygen in the insulator 280 can be considered as the following model for the diffusion of hydrogen in the oxide semiconductor in contact with the insulator 280.
  • Hydrogen present in the oxide semiconductor diffuses into other structures via the insulator 280 in contact with the oxide semiconductor. Due to the diffusion of the hydrogen, the excess oxygen in the insulator 280 reacts with the hydrogen in the oxide semiconductor to form an OH bond, and diffuses in the insulator 280.
  • a hydrogen atom having an OH bond reaches a material having a function of capturing hydrogen or fixing hydrogen (typically, an insulator 282)
  • the hydrogen atom becomes an atom in the insulator 282 (for example, an insulator 282). It reacts with oxygen atoms bonded to metal atoms, etc.) and is captured or fixed in the insulator 282.
  • an insulator 280 having excess oxygen is formed on an oxide semiconductor, and then an insulator 282 is formed. After that, it is preferable to perform heat treatment. Specifically, the heat treatment is carried out in an atmosphere containing oxygen, an atmosphere containing nitrogen, or a mixed atmosphere of oxygen and nitrogen at a temperature of 350 ° C. or higher, preferably 400 ° C. or higher.
  • the heat treatment time is 1 hour or longer, preferably 4 hours or longer, and more preferably 8 hours or longer.
  • an insulator 283 is formed. Since the insulator 283 is a material having a function of having a high blocking property against hydrogen, hydrogen diffused to the outside or hydrogen existing on the outside is transferred to the inside, specifically, an oxide semiconductor, or the insulator 280. It is possible to prevent it from entering the side.
  • the configuration performed after forming the insulator 282 has been illustrated, but the present invention is not limited to this.
  • the above heat treatment may be performed after the transistor layer 413 is formed or after the memory device layer 415_1 to the memory device layer 415_3 are formed.
  • hydrogen is diffused outward by the above heat treatment, hydrogen is diffused above or in the lateral direction of the transistor layer 413.
  • hydrogen is diffused upward or laterally.
  • the insulator 214 and the insulator 283 are adhered to each other to form the above-mentioned sealing structure.
  • an OS transistor a transistor using an oxide as a semiconductor
  • a storage device to which a capacitive element is applied hereinafter, may be referred to as an OS memory device
  • the OS memory device is a storage device having at least a capacitance element and an OS transistor that controls charging / discharging of the capacitance element. Since the off-current of the OS transistor is extremely small, the OS memory device has excellent holding characteristics and can function as a non-volatile memory.
  • FIG. 34A shows an example of the configuration of the OS memory device.
  • the storage device 1400 has a peripheral circuit 1411 and a memory cell array 1470.
  • the peripheral circuit 1411 includes a row circuit 1420, a column circuit 1430, an output circuit 1440, and a control logic circuit 1460.
  • the column circuit 1430 includes, for example, a column decoder, a precharge circuit, a sense amplifier, a writing circuit, and the like.
  • the precharge circuit has a function of precharging the wiring.
  • the sense amplifier has a function of amplifying a data signal read from a memory cell.
  • the wiring is the wiring connected to the memory cell of the memory cell array 1470, and will be described in detail later.
  • the amplified data signal is output to the outside of the storage device 1400 as a data signal RDATA via the output circuit 1440.
  • the row circuit 1420 has, for example, a row decoder, a word line driver circuit, and the like, and can select a row to be accessed.
  • the storage device 1400 is supplied with a low power supply voltage (VSS), a high power supply voltage (VDD) for the peripheral circuit 1411, and a high power supply voltage (VIL) for the memory cell array 1470 as power supply voltages from the outside. Further, a control signal (CE, WE, RE), an address signal ADDR, and a data signal WDATA are input to the storage device 1400 from the outside.
  • the address signal ADDR is input to the row decoder and column decoder, and the data signal WDATA is input to the write circuit.
  • the control logic circuit 1460 processes the control signals (CE, WE, RE) input from the outside to generate the control signals of the row decoder and the column decoder.
  • the control signal CE is a chip enable signal
  • the control signal WE is a write enable signal
  • the control signal RE is a read enable signal.
  • the signal processed by the control logic circuit 1460 is not limited to this, and other control signals may be input as needed.
  • the memory cell array 1470 has a plurality of memory cells MC arranged in a matrix and a plurality of wirings.
  • the number of wires connecting the memory cell array 1470 and the row circuit 1420 is determined by the configuration of the memory cell MC, the number of memory cell MCs in a row, and the like.
  • the number of wires connecting the memory cell array 1470 and the column circuit 1430 is determined by the configuration of the memory cell MC, the number of memory cell MCs in one row, and the like.
  • FIG. 34A shows an example in which the peripheral circuit 1411 and the memory cell array 1470 are formed on the same plane
  • the present embodiment is not limited to this.
  • the memory cell array 1470 may be provided so as to overlap a part of the peripheral circuit 1411.
  • a sense amplifier may be provided so as to overlap under the memory cell array 1470.
  • 35A to 35H show examples of memory cell configurations applicable to the above-mentioned memory cell MC.
  • [DOSRAM] 35A to 35C show an example of a circuit configuration of a DRAM memory cell.
  • a DRAM using a memory cell of a 1OS transistor 1 capacitance element type may be referred to as a DOSRAM (Dynamic Oxide Semiconductor Random Access Memory) (registered trademark).
  • the memory cell 1471 shown in FIG. 35A includes a transistor M1 and a capacitive element CA.
  • the transistor M1 has a gate (sometimes called a top gate) and a back gate.
  • the first terminal of the transistor M1 is connected to the first terminal of the capacitive element CA, the second terminal of the transistor M1 is connected to the wiring BIL, the gate of the transistor M1 is connected to the wiring WOL, and the back gate of the transistor M1. Is connected to the wiring BGL.
  • the second terminal of the capacitive element CA is connected to the wiring LL.
  • the wiring BIL functions as a bit line
  • the wiring WOL functions as a word line.
  • the wiring LL functions as wiring for applying a predetermined potential to the second terminal of the capacitive element CA. When writing and reading data, the wiring LL may have a ground potential or a low level potential.
  • the wiring BGL functions as wiring for applying a potential to the back gate of the transistor M1. The threshold voltage of the transistor M1 can be increased or decreased by applying an arbitrary potential to the wiring BGL.
  • the memory cell 1471 shown in FIG. 35A corresponds to the storage device shown in FIGS. 30A and 30B. That is, the transistor M1 corresponds to the transistor 200, and the capacitive element CA corresponds to the capacitive device 292.
  • the memory cell MC is not limited to the memory cell 1471, and the circuit configuration can be changed.
  • the memory cell MC may have a configuration in which the back gate of the transistor M1 is connected to the wiring WOL instead of the wiring BGL, as in the memory cell 1472 shown in FIG. 35B.
  • the memory cell MC may be a memory cell composed of a transistor having a single gate structure, that is, a transistor M1 having no back gate, as in the memory cell 1473 shown in FIG. 35C.
  • a transistor 200 can be used as the transistor M1 and a capacitance element 100 can be used as the capacitance element CA.
  • an OS transistor as the transistor M1
  • the leakage current of the transistor M1 can be made very small. That is, since the written data can be held by the transistor M1 for a long time, the frequency of refreshing the memory cells can be reduced. Alternatively, the memory cell refresh operation can be eliminated. Further, since the leak current is very small, it is possible to hold multi-valued data or analog data for the memory cell 1471, the memory cell 1472, and the memory cell 1473.
  • the sense amplifier is provided so as to overlap under the memory cell array 1470 as described above, the bit line can be shortened. As a result, the bit line capacity is reduced, and the holding capacity of the memory cell can be reduced.
  • NOSRAM 35D to 35G show an example of a circuit configuration of a gain cell type memory cell having two transistors and one capacitance element.
  • the memory cell 1474 shown in FIG. 35D includes a transistor M2, a transistor M3, and a capacitance element CB.
  • the transistor M2 has a top gate (sometimes referred to simply as a gate) and a back gate.
  • NOSRAM Nonvolatile Semiconductor RAM
  • the first terminal of the transistor M2 is connected to the first terminal of the capacitive element CB, the second terminal of the transistor M2 is connected to the wiring WBL, the gate of the transistor M2 is connected to the wiring WOL, and the back gate of the transistor M2. Is connected to the wiring BGL.
  • the second terminal of the capacitive element CB is connected to the wiring CAL.
  • the first terminal of the transistor M3 is connected to the wiring RBL, the second terminal of the transistor M3 is connected to the wiring SL, and the gate of the transistor M3 is connected to the first terminal of the capacitive element CB.
  • the wiring WBL functions as a write bit line
  • the wiring RBL functions as a read bit line
  • the wiring WOL functions as a word line.
  • the wiring CAL functions as wiring for applying a predetermined potential to the second terminal of the capacitance element CB.
  • the wiring BGL functions as wiring for applying an electric potential to the back gate of the transistor M2.
  • the threshold voltage of the transistor M2 can be increased or decreased by applying an arbitrary potential to the wiring BGL.
  • the memory cell 1474 shown in FIG. 35D corresponds to the storage device shown in FIGS. 28 and 29. That is, the transistor M2 is in the transistor 200, the capacitive element CB is in the capacitive element 100, the transistor M3 is in the transistor 300, the wiring WBL is in the wiring 1003, the wiring WOL is in the wiring 1004, the wiring BGL is in the wiring 1006, and the wiring CAL is in the wiring 1006.
  • the wiring RBL corresponds to the wiring 1002
  • the wiring SL corresponds to the wiring 1001.
  • the memory cell MC is not limited to the memory cell 1474, and the circuit configuration can be changed as appropriate.
  • the memory cell MC may have a configuration in which the back gate of the transistor M2 is connected to the wiring WOL instead of the wiring BGL, as in the memory cell 1475 shown in FIG. 35E.
  • the memory cell MC may be a memory cell composed of a transistor having a single gate structure, that is, a transistor M2 having no back gate, as in the memory cell 1476 shown in FIG. 35F.
  • the memory cell MC may have a configuration in which the wiring WBL and the wiring RBL are combined as one wiring BIL, as in the memory cell 1477 shown in FIG. 35G.
  • a transistor 200 can be used as the transistor M2
  • a transistor 300 can be used as the transistor M3
  • a capacitance element 100 can be used as the capacitance element CB.
  • OS transistor an OS transistor
  • the leakage current of the transistor M2 can be made very small.
  • the written data can be held by the transistor M2 for a long time, so that the frequency of refreshing the memory cells can be reduced.
  • the memory cell refresh operation can be eliminated.
  • the leak current is very small, multi-valued data or analog data can be held in the memory cell 1474. The same applies to the memory cells 1475 to 1477.
  • the transistor M3 may be a transistor having silicon in the channel forming region (hereinafter, may be referred to as a Si transistor).
  • the conductive type of the Si transistor may be an n-channel type or a p-channel type.
  • the Si transistor may have higher field effect mobility than the OS transistor. Therefore, a Si transistor may be used as the transistor M3 that functions as a readout transistor. Further, by using a Si transistor for the transistor M3, the transistor M2 can be provided by stacking the transistor M3 on the transistor M3, so that the occupied area of the memory cell can be reduced and the storage device can be highly integrated.
  • the transistor M3 may be an OS transistor.
  • an OS transistor is used for the transistor M2 and the transistor M3, the circuit can be configured by using only the n-type transistor in the memory cell array 1470.
  • FIG. 35H shows an example of a gain cell type memory cell having a 3-transistor and 1-capacity element.
  • the memory cell 1478 shown in FIG. 35H includes transistors M4 to M6 and a capacitive element CC.
  • the capacitive element CC is appropriately provided.
  • the memory cell 1478 is electrically connected to the wiring BIL, the wiring RWL, the wiring WWL, the wiring BGL, and the wiring GNDL.
  • Wiring GNDL is a wiring that gives a low level potential.
  • the memory cell 1478 may be electrically connected to the wiring RBL and the wiring WBL instead of the wiring BIL.
  • the transistor M4 is an OS transistor having a back gate, and the back gate is electrically connected to the wiring BGL.
  • the back gate and the gate of the transistor M4 may be electrically connected to each other. Alternatively, the transistor M4 does not have to have a back gate.
  • the transistor M5 and the transistor M6 may be an n-channel Si transistor or a p-channel Si transistor, respectively.
  • the transistor M4 to the transistor M6 may be an OS transistor.
  • the memory cell array 1470 can be configured as a circuit using only n-type transistors.
  • the transistor 200 can be used as the transistor M4
  • the transistor 300 can be used as the transistor M5 and the transistor M6, and the capacitance element 100 can be used as the capacitance element CC.
  • the leakage current of the transistor M4 can be made very small.
  • the configurations of the peripheral circuit 1411, the memory cell array 1470, and the like shown in the present embodiment are not limited to the above.
  • the arrangement or function of these circuits and the wiring, circuit elements, etc. connected to the circuits may be changed, deleted, or added as necessary.
  • the storage device of one aspect of the present invention has a high operating speed and can retain data for a long period of time.
  • FIGS. 36A and 36B An example of a chip 1200 on which the semiconductor device of the present invention is mounted is shown with reference to FIGS. 36A and 36B.
  • a plurality of circuits (systems) are mounted on the chip 1200.
  • SoC system on chip
  • the chip 1200 has a CPU 1211, GPU 1212, one or more analog arithmetic units 1213, one or more memory controllers 1214, one or more interfaces 1215, one or more network circuits 1216, and the like.
  • the chip 1200 is provided with a bump (not shown) and is connected to the first surface of a printed circuit board (Printed Circuit Board: PCB) 1201 as shown in FIG. 36B. Further, a plurality of bumps 1202 are provided on the back surface of the first surface of the PCB 1201 and are connected to the motherboard 1203.
  • a bump not shown
  • PCB printed circuit Board
  • the motherboard 1203 may be provided with a storage device such as a DRAM 1221 and a flash memory 1222.
  • a storage device such as a DRAM 1221 and a flash memory 1222.
  • the DOSRAM shown in the previous embodiment can be used for the DRAM 1221.
  • the NO SRAM shown in the previous embodiment can be used for the flash memory 1222.
  • the CPU 1211 preferably has a plurality of CPU cores.
  • the GPU 1212 preferably has a plurality of GPU cores.
  • the CPU 1211 and the GPU 1212 may each have a memory for temporarily storing data.
  • a memory common to the CPU 1211 and the GPU 1212 may be provided on the chip 1200.
  • the above-mentioned NOSRAM or DOSRAM can be used.
  • GPU1212 is suitable for parallel calculation of a large amount of data, and can be used for image processing and product-sum calculation. By providing the GPU 1212 with an image processing circuit using the oxide semiconductor of the present invention and a product-sum calculation circuit, it becomes possible to execute image processing and product-sum calculation with low power consumption.
  • the CPU 1211 and the GPU 1212 are provided on the same chip, the wiring between the CPU 1211 and the GPU 1212 can be shortened, and the data transfer from the CPU 1211 to the GPU 1212 and the data transfer between the memories of the CPU 1211 and the GPU 1212 can be achieved. And after the calculation on the GPU 1212, the calculation result can be transferred from the GPU 1212 to the CPU 1211 at high speed.
  • the analog arithmetic unit 1213 has one or both of an A / D (analog / digital) conversion circuit and a D / A (digital / analog) conversion circuit. Further, the product-sum calculation circuit may be provided in the analog calculation unit 1213.
  • the memory controller 1214 has a circuit that functions as a controller of the DRAM 1221 and a circuit that functions as an interface of the flash memory 1222.
  • the interface 1215 has an interface circuit with an externally connected device such as a display device, a speaker, a microphone, a camera, and a controller.
  • the controller includes a mouse, a keyboard, a game controller, and the like.
  • USB Universal Serial Bus
  • HDMI registered trademark
  • High-Definition Multimedia Interface High-Definition Multimedia Interface
  • the network circuit 1216 has a network circuit such as a LAN (Local Area Network). It may also have a circuit for network security.
  • LAN Local Area Network
  • the above circuit (system) can be formed on the chip 1200 by the same manufacturing process. Therefore, even if the number of circuits required for the chip 1200 increases, it is not necessary to increase the manufacturing process, and the chip 1200 can be manufactured at low cost.
  • the PCB 1201, the DRAM 1221 provided with the chip 1200 having the GPU 1212, and the motherboard 1203 provided with the flash memory 1222 can be referred to as the GPU module 1204.
  • the GPU module 1204 Since the GPU module 1204 has a chip 1200 using SoC technology, its size can be reduced. Further, since it is excellent in image processing, it is suitable for use in portable electronic devices such as smartphones, tablet terminals, laptop PCs, and portable (take-out) game machines.
  • a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a self-encoder, a deep Boltzmann machine (DBM), and a deep belief network (Deep belief network) are provided by a product-sum calculation circuit using GPU1212. Since a method such as DBN) can be executed, the chip 1200 can be used as an AI chip, or the GPU module 1204 can be used as an AI system module.
  • FIG. 37A shows a perspective view of the electronic component 700 and the substrate on which the electronic component 700 is mounted (mounting substrate 704).
  • the electronic component 700 shown in FIG. 37A has a storage device 720 in the mold 711. In FIG. 37A, a part is omitted in order to show the inside of the electronic component 700.
  • the electronic component 700 has a land 712 on the outside of the mold 711. The land 712 is electrically connected to the electrode pad 713, and the electrode pad 713 is electrically connected to the storage device 720 by a wire 714.
  • the electronic component 700 is mounted on, for example, the printed circuit board 702. A plurality of such electronic components are combined and electrically connected to each other on the printed circuit board 702 to complete the mounting board 704.
  • the storage device 720 has a drive circuit layer 721 and a storage circuit layer 722.
  • FIG. 37B shows a perspective view of the electronic component 730.
  • the electronic component 730 is an example of SiP (System in Package) or MCM (Multi Chip Module).
  • the electronic component 730 is provided with an interposer 731 on a package substrate 732 (printed circuit board), and a semiconductor device 735 and a plurality of storage devices 720 are provided on the interposer 731.
  • the electronic component 730 shows an example in which the storage device 720 is used as a wideband memory (HBM: High Bandwidth Memory). Further, as the semiconductor device 735, an integrated circuit (semiconductor device) such as a CPU, GPU, or FPGA can be used.
  • HBM High Bandwidth Memory
  • the package substrate 732 a ceramic substrate, a plastic substrate, a glass epoxy substrate, or the like can be used.
  • the interposer 731 a silicon interposer, a resin interposer, or the like can be used.
  • the interposer 731 has a plurality of wirings and has a function of electrically connecting a plurality of integrated circuits having different terminal pitches.
  • the plurality of wirings are provided in a single layer or multiple layers.
  • the interposer 731 has a function of electrically connecting the integrated circuit provided on the interposer 731 to the electrode provided on the package substrate 732.
  • the interposer may be referred to as a "rewiring board” or an "intermediate board”.
  • a through electrode may be provided on the interposer 731, and the integrated circuit and the package substrate 732 may be electrically connected using the through electrode.
  • a TSV Through Silicon Via
  • interposer 731 It is preferable to use a silicon interposer as the interposer 731. Since it is not necessary to provide an active element in the silicon interposer, it can be manufactured at a lower cost than an integrated circuit. On the other hand, since the wiring of the silicon interposer can be formed by a semiconductor process, it is easy to form fine wiring, which is difficult with a resin interposer.
  • the interposer on which the HBM is mounted is required to form fine and high-density wiring. Therefore, it is preferable to use a silicon interposer as the interposer on which the HBM is mounted.
  • the reliability is unlikely to decrease due to the difference in the expansion coefficient between the integrated circuit and the interposer. Further, since the surface of the silicon interposer is high, poor connection between the integrated circuit provided on the silicon interposer and the silicon interposer is unlikely to occur. In particular, in a 2.5D package (2.5-dimensional mounting) in which a plurality of integrated circuits are arranged side by side on an interposer, it is preferable to use a silicon interposer.
  • a heat sink heat dissipation plate
  • the heights of the integrated circuits provided on the interposer 731 are the same.
  • the heights of the storage device 720 and the semiconductor device 735 are the same.
  • an electrode 733 may be provided on the bottom of the package substrate 732.
  • FIG. 37B shows an example in which the electrode 733 is formed of solder balls. By providing solder balls in a matrix on the bottom of the package substrate 732, BGA (Ball Grid Array) mounting can be realized. Further, the electrode 733 may be formed of a conductive pin. By providing conductive pins in a matrix on the bottom of the package substrate 732, PGA (Pin Grid Array) mounting can be realized.
  • the electronic component 730 can be mounted on another substrate by using various mounting methods, not limited to BGA and PGA.
  • BGA Band-GPU
  • PGA Stimble Pin Grid Array
  • LGA Land-GPU
  • QFP Quad Flat Package
  • QFJ Quad Flat J-leaded package
  • QFN QuadFN
  • the semiconductor device shown in the above embodiment is, for example, a storage device for various electronic devices (for example, information terminals, computers, smartphones, electronic book terminals, digital cameras (including video cameras), recording / playback devices, navigation systems, etc.).
  • the computer includes a tablet computer, a notebook computer, a desktop computer, and a large computer such as a server system.
  • the semiconductor device shown in the above embodiment is applied to various removable storage devices such as a memory card (for example, an SD card), a USB memory, and an SSD (solid state drive).
  • 38A to 38E schematically show some configuration examples of the removable storage device.
  • the semiconductor device shown in the above embodiment is processed into a packaged memory chip and used for various storage devices and removable memories.
  • FIG. 38A is a schematic diagram of the USB memory.
  • the USB memory 1100 has a housing 1101, a cap 1102, a USB connector 1103, and a board 1104.
  • the substrate 1104 is housed in the housing 1101.
  • a memory chip 1105 and a controller chip 1106 are attached to the substrate 1104.
  • the semiconductor device shown in the previous embodiment can be incorporated into the memory chip 1105 or the like.
  • FIG. 38B is a schematic view of the appearance of the SD card
  • FIG. 38C is a schematic view of the internal structure of the SD card.
  • the SD card 1110 has a housing 1111 and a connector 1112 and a substrate 1113.
  • the substrate 1113 is housed in the housing 1111.
  • a memory chip 1114 and a controller chip 1115 are attached to the substrate 1113.
  • the capacity of the SD card 1110 can be increased.
  • a wireless chip having a wireless communication function may be provided on the substrate 1113.
  • data on the memory chip 1114 can be read and written by wireless communication between the host device and the SD card 1110.
  • the semiconductor device shown in the previous embodiment can be incorporated into the memory chip 1114 or the like.
  • FIG. 38D is a schematic view of the appearance of the SSD
  • FIG. 38E is a schematic view of the internal structure of the SSD.
  • the SSD 1150 has a housing 1151, a connector 1152 and a substrate 1153.
  • the substrate 1153 is housed in the housing 1151.
  • a memory chip 1154, a memory chip 1155, and a controller chip 1156 are attached to the substrate 1153.
  • the memory chip 1155 is a work memory of the controller chip 1156, and for example, a DOSRAM chip may be used.
  • the capacity of the SSD 1150 can be increased.
  • the semiconductor device shown in the previous embodiment can be incorporated into the memory chip 1154 or the like.
  • the semiconductor device according to one aspect of the present invention can be used for a processor such as a CPU or GPU, or a chip.
  • 39A to 39H show specific examples of electronic devices including a processor such as a CPU or GPU, or a chip according to one aspect of the present invention.
  • the GPU or chip according to one aspect of the present invention can be mounted on various electronic devices.
  • electronic devices include relatively large screens such as television devices, monitors for desktop or notebook information terminals, digital signage (electronic signage), and large game machines such as pachinko machines.
  • digital cameras, digital video cameras, digital photo frames, electronic book readers, mobile phones, portable game machines, personal digital assistants, sound reproduction devices, and the like can be mentioned.
  • artificial intelligence can be mounted on the electronic device.
  • the electronic device of one aspect of the present invention may have an antenna.
  • the display unit can display images, information, and the like.
  • the antenna may be used for non-contact power transmission.
  • the electronic device of one aspect of the present invention includes sensors (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, It may have the ability to measure voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays).
  • the electronic device of one aspect of the present invention can have various functions. For example, a function to display various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a function to display a calendar, date or time, a function to execute various software (programs), wireless communication. It can have a function, a function of reading a program or data recorded on a recording medium, and the like. 39A to 39H show examples of electronic devices.
  • FIG. 39A illustrates a mobile phone (smartphone) which is a kind of information terminal.
  • the information terminal 5100 has a housing 5101 and a display unit 5102, and as an input interface, a touch panel is provided in the display unit 5102 and buttons are provided in the housing 5101.
  • the information terminal 5100 can execute an application using artificial intelligence by applying the chip of one aspect of the present invention.
  • the application using artificial intelligence include an application that recognizes a conversation and displays the conversation content on the display unit 5102, and recognizes characters and figures input by the user on the touch panel provided in the display unit 5102.
  • Examples thereof include an application displayed on the display unit 5102 and an application for performing biometric authentication such as a fingerprint or a voice print.
  • FIG. 39B illustrates the notebook type information terminal 5200.
  • the notebook type information terminal 5200 includes a main body 5201 of the information terminal, a display unit 5202, and a keyboard 5203.
  • the notebook-type information terminal 5200 can execute an application using artificial intelligence by applying the chip of one aspect of the present invention.
  • applications using artificial intelligence include design support software, text correction software, and menu automatic generation software. Further, by using the notebook type information terminal 5200, it is possible to develop a new artificial intelligence.
  • a smartphone and a notebook-type information terminal are taken as examples of electronic devices, which are shown in FIGS. 39A and 39B, respectively, but information terminals other than the smartphone and the notebook-type information terminal can be applied.
  • information terminals other than smartphones and notebook-type information terminals include PDA (Personal Digital Assistant), desktop-type information terminals, workstations, and the like.
  • FIG. 39C shows a portable game machine 5300, which is an example of a game machine.
  • the portable game machine 5300 has a housing 5301, a housing 5302, a housing 5303, a display unit 5304, a connection unit 5305, an operation key 5306, and the like.
  • the housing 5302 and the housing 5303 can be removed from the housing 5301.
  • the connection unit 5305 provided in the housing 5301 to another housing (not shown)
  • the image output to the display unit 5304 can be output to another video device (not shown). it can.
  • the housing 5302 and the housing 5303 can each function as operation units.
  • a plurality of players can play the game at the same time.
  • the chips shown in the previous embodiment can be incorporated into the chips provided on the substrates of the housing 5301, the housing 5302, and the housing 5303.
  • FIG. 39D shows a stationary game machine 5400, which is an example of a game machine.
  • a controller 5402 is connected to the stationary game machine 5400 wirelessly or by wire.
  • a low power consumption game machine By applying the GPU or chip of one aspect of the present invention to a game machine such as a portable game machine 5300 or a stationary game machine 5400, a low power consumption game machine can be realized. Further, since the heat generation from the circuit can be reduced due to the low power consumption, the influence of the heat generation on the circuit itself, the peripheral circuit, and the module can be reduced.
  • the portable game machine 5300 having artificial intelligence can be realized.
  • expressions such as the progress of the game, the behavior of creatures appearing in the game, and the phenomena that occur in the game are defined by the program that the game has, but by applying artificial intelligence to the handheld game machine 5300.
  • Expressions that are not limited to game programs are possible. For example, it is possible to express what the player asks, the progress of the game, the time, and the behavior of the characters appearing in the game.
  • the game player can be constructed anthropomorphically by artificial intelligence. Therefore, by setting the opponent as a game player by artificial intelligence, even one person can play the game. You can play the game.
  • FIGS. 39C and 39D a portable game machine and a stationary game machine are illustrated as examples of the game machine, but the game machine to which the GPU or chip of one aspect of the present invention is applied is not limited to this.
  • Examples of the game machine to which the GPU or chip of one aspect of the present invention is applied include an arcade game machine installed in an entertainment facility (game center, amusement park, etc.), a pitching machine for batting practice installed in a sports facility, and the like. Can be mentioned.
  • the GPU or chip of one aspect of the present invention can be applied to a large computer.
  • FIG. 39E is a diagram showing a supercomputer 5500, which is an example of a large computer.
  • FIG. 39F is a diagram showing a rack-mounted computer 5502 included in the supercomputer 5500.
  • the supercomputer 5500 has a rack 5501 and a plurality of rack mount type computers 5502.
  • the plurality of computers 5502 are stored in the rack 5501. Further, the computer 5502 is provided with a plurality of substrates 5504, and the GPU or chip described in the above embodiment can be mounted on the substrate.
  • the supercomputer 5500 is a large computer mainly used for scientific and technological calculations. In scientific and technological calculations, it is necessary to process a huge amount of calculations at high speed, so power consumption is high and the heat generated by the chip is large.
  • the GPU or chip of one aspect of the present invention to the supercomputer 5500, a supercomputer having low power consumption can be realized. Further, since the heat generation from the circuit can be reduced due to the low power consumption, the influence of the heat generation on the circuit itself, the peripheral circuit, and the module can be reduced.
  • a supercomputer is illustrated as an example of a large computer, but the large computer to which the GPU or chip of one aspect of the present invention is applied is not limited to this.
  • Examples of the large-scale computer to which the GPU or chip of one aspect of the present invention is applied include a computer (server) that provides services and a large-scale general-purpose computer (mainframe).
  • the GPU or chip of one aspect of the present invention can be applied to a moving vehicle and around the driver's seat of the vehicle.
  • FIG. 39G is a diagram showing the periphery of the windshield in the interior of an automobile, which is an example of a moving body.
  • the display panel 5701 attached to the dashboard, the display panel 5702, the display panel 5703, and the display panel 5704 attached to the pillar are shown.
  • the display panel 5701 to the display panel 5703 can provide various information by displaying a speedometer, a tachometer, a mileage, a fuel gauge, a gear status, an air conditioner setting, and the like.
  • the display items and layouts displayed on the display panel can be appropriately changed according to the user's preference, and the design can be improved.
  • the display panel 5701 to 5703 can also be used as a lighting device.
  • the display panel 5704 can supplement the field of view (blind spot) blocked by the pillars by projecting an image from an image pickup device (not shown) provided in the automobile. That is, by displaying the image from the image pickup device provided on the outside of the automobile, the blind spot can be supplemented and the safety can be enhanced. In addition, by projecting an image that complements the invisible part, safety confirmation can be performed more naturally and without discomfort.
  • the display panel 5704 can also be used as a lighting device.
  • the GPU or chip of one aspect of the present invention can be applied as a component of artificial intelligence
  • the chip can be used, for example, in an automatic driving system of an automobile.
  • the chip can be used in a system for road guidance, danger prediction, and the like.
  • the display panel 5701 to the display panel 5704 may be configured to display information such as road guidance and danger prediction.
  • moving objects include trains, monorails, ships, flying objects (helicopters, unmanned aerial vehicles (drones), airplanes, rockets), etc., and the chip of one aspect of the present invention is applied to these moving objects. Therefore, a system using artificial intelligence can be provided.
  • FIG. 39H shows an electric refrigerator-freezer 5800, which is an example of an electric appliance.
  • the electric refrigerator-freezer 5800 has a housing 5801, a refrigerator door 5802, a freezer door 5803, and the like.
  • the electric refrigerator / freezer 5800 having artificial intelligence can be realized.
  • the electric refrigerator-freezer 5800 has a function of automatically generating a menu based on the ingredients stored in the electric refrigerator-freezer 5800, the expiration date of the ingredients, etc., and is stored in the electric refrigerator-freezer 5800. It can have a function of automatically adjusting the temperature according to the food material.
  • electric refrigerators and freezers have been described as an example of electric appliances
  • other electric appliances include, for example, vacuum cleaners, microwave ovens, microwave ovens, rice cookers, water heaters, IH cookers, water servers, air conditioners and air conditioners. Examples include washing machines, dryers, and audiovisual equipment.
  • the electronic device described in the present embodiment the function of the electronic device, the application example of artificial intelligence, the effect thereof, etc. can be appropriately combined with the description of other electronic devices.
  • SiH 4 is used as a gas (precursor) that does not contain hydrocarbons, using N 2 O as reactant and forming the silicon oxide by PEALD method was evaluated for ALD Window .
  • FIG. 40 is a diagram for explaining the ALD window, in which the vertical axis represents GPC (Growth Per Cycle), which is the film thickness formed when one cycle is performed, and the horizontal axis represents the substrate temperature.
  • GPC Gateth Per Cycle
  • the straight line in FIG. 40 shows an example of the behavior of GPC when only the film formation temperature is changed without changing the introduction time and the purge time of the precursor.
  • the GPC behaves ascending or descending on the low temperature side or the high temperature side.
  • the straight line shown by A in FIG. 40 is a region where the adsorption of the precursor to the substrate is unsaturated and the GPC increases as the substrate temperature rises.
  • the straight line indicated by C is a region where the adsorption of the precursor to the substrate is desorbed as the substrate temperature rises and the GPC drops.
  • the straight line indicated by D is due to the influence of physical adsorption of the precursor and depends on the material of the precursor.
  • the straight line indicated by E is due to the decomposition reaction on the substrate surface of the precursor and depends on the material of the precursor. In this way, the rising and falling behavior of GPC depends on the surface reaction of the precursor and the adsorption of the precursor, and as shown by the straight line shown by B, the influence of both is small and the GPC is constant. It is called ALD Window, which is the region of the substrate temperature at which ideal ALD film formation is performed.
  • the sample used for the evaluation of ALD Window will be described.
  • Samples on a silicon wafer the SiH 4 is used as precursor, using N 2 O as reactant and forming the silicon oxide by PEALD method.
  • the substrate temperature was 150 ° C., 200 ° C., 250 ° C., 300 ° C., 325 ° C., 350 ° C., 375 ° C., and 400 ° C., respectively. Further, for all the substrate temperatures, a film was formed using the steps shown in FIG. 5 and the sequence shown in FIG. 6B.
  • FIG. 41 shows a plot of GPC at each substrate temperature.
  • the vertical axis represents GPC [nm / cycle], and the horizontal axis represents the substrate temperature [° C.]. It was confirmed that the GPC increased by raising the substrate temperature above 150 ° C., and the GPC tended to become substantially constant and saturated between the substrate temperature of 300 ° C. and 400 ° C. From this result, it is considered that the substrate temperature of 300 ° C. to 400 ° C. is ALD Window.
  • a silicon oxide film was formed at a substrate temperature of 350 ° C., which is within the temperature range of ALD Window obtained in Example 1, and its coverage was evaluated.
  • a scanning transmission electron microscope (STEM: Scanning Transmission Electron Microscope) was used to evaluate the coating property.
  • the sample used for the evaluation of coverage will be described below.
  • the sample was prepared by using the transistor 200 shown in FIG. 1 according to the ⁇ method for manufacturing a semiconductor device> described in the first embodiment.
  • an insulator 250a was formed on the oxide 230 (oxide 230a and oxide 230b) by the PEALD method.
  • a silicon oxide film was formed at a substrate temperature of 350 ° C., which is within the temperature range of ALD Window obtained in Example 1.
  • the number of cycles in the sequence was set to 50.
  • a sample was prepared by the above.
  • the coverage was evaluated by observing the cross section in the channel width direction of the portion shown in FIG. 1C, that is, the channel formation region of the transistor 200 by STEM.
  • FIG. 42A shows a STEM cross-sectional photograph.
  • the film thickness of the insulator 250a at each of the points F to J (measurement points) given to the cross-sectional photograph was determined by length measurement.
  • FIG. 42B summarizes the film thickness measurement results at the measurement points F to J.
  • the film thickness of the insulator 250a was 2.0 nm or more and 2.5 nm or less at the locations F to J, and the film thickness variation of the insulator 250a was small.
  • the film thickness of 2.4 nm was obtained at the positions F and J where the insulator 250a was in contact with the side surface of the oxide 230, respectively, and it was confirmed that the coating property was excellent. Therefore, a silicon oxide film having excellent coating properties could be obtained by forming a film within the temperature range of ALD Window.

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