WO2021106119A1 - Dispositif de gestion de composants et procédé de gestion de composants - Google Patents

Dispositif de gestion de composants et procédé de gestion de composants Download PDF

Info

Publication number
WO2021106119A1
WO2021106119A1 PCT/JP2019/046460 JP2019046460W WO2021106119A1 WO 2021106119 A1 WO2021106119 A1 WO 2021106119A1 JP 2019046460 W JP2019046460 W JP 2019046460W WO 2021106119 A1 WO2021106119 A1 WO 2021106119A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
wafer
parts
cavity
carrier tape
Prior art date
Application number
PCT/JP2019/046460
Other languages
English (en)
Japanese (ja)
Inventor
清水　浩二
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to CN201980102452.1A priority Critical patent/CN114731778B/zh
Priority to PCT/JP2019/046460 priority patent/WO2021106119A1/fr
Priority to KR1020227013774A priority patent/KR102598549B1/ko
Priority to JP2021560833A priority patent/JP7359863B2/ja
Publication of WO2021106119A1 publication Critical patent/WO2021106119A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders

Definitions

  • This specification discloses the technology related to the parts management device and the parts management method.
  • the information management device described in Patent Document 1 includes a collection source information acquisition means, a mounting destination information acquisition means, and a storage means.
  • the collection source information acquisition means acquires collection source information including identification information for identifying the wafer and collection position information regarding the collection position of parts on the wafer.
  • the mounting destination information acquisition means acquires mounting destination information including identification information for identifying the base material and mounting position information regarding the mounting position of the component on the base material.
  • the storage means stores the mounting record information in which the collection source information of the mounted mounting component and the mounting destination information of the mounting component are associated with each other.
  • the electronic component transporting device described in Patent Document 2 includes a transport table that forms a transport path, an accommodating body holding means that holds an accommodating body of electronic components, an observation means that observes electronic components in the transport path, and a transport table. It is equipped with a plurality of carrier tape traveling devices arranged around the.
  • the housing holding means is a wafer ring holding unit that holds a wafer ring in which electronic components are arranged in an array, or a tray holding unit that holds a tray in which electronic components are arranged in an array by partitioning a plane in a grid pattern. Is.
  • the electronic component transfer device described in Patent Document 2 classifies each electronic component of the wafer ring into a non-defective product or a non-good product.
  • the carrier tape traveling device for non-defective products the electronic components are stored in the pockets of the carrier tape and sealed with the sealing tape while the carrier tape is traveled in the transport direction of the reel. The reel winds up a carrier tape sealed with sealing tape.
  • the non-defective electronic components are re-inspected.
  • the worker checks the data obtained by the observation device and re-determines the electronic components classified as non-defective products as non-defective products and non-defective products.
  • the method of supplying parts includes a wafer supply in which parts are supplied from a wafer as in the invention described in Patent Document 1 and a reel supply in which parts are supplied from a reel. It is also known that, as in the invention described in Patent Document 2, the parts arranged on the wafer are transferred to a reel to supply the reel. Conventionally, in reel supply, parts to be supplied in reel units are managed, which is not sufficient as traceability information. Specifically, it is necessary to trace all the parts supplied from the reel accommodating the parts to be traced, and the tracing work is complicated.
  • this specification discloses a parts management device and a parts management method capable of improving traceability for reel-supplied parts in which parts are sequentially supplied from a carrier tape.
  • a parts management device including an acquisition unit and a storage unit.
  • the acquisition unit acquires position information of the cavity in which the component is housed when the component is sequentially supplied from a carrier tape having a plurality of cavities containing the component to be mounted on the substrate.
  • the storage unit stores the position information of the cavity acquired by the acquisition unit and the identification information for identifying the reel around which the carrier tape is wound in the storage device in association with each other.
  • this specification discloses a parts management method including an acquisition process and a storage process.
  • the acquisition step when the parts are sequentially supplied from a carrier tape having a plurality of cavities containing the parts to be mounted on the substrate, the position information of the cavities containing the parts is acquired.
  • the storage step the position information of the cavity acquired by the acquisition step and the identification information for identifying the reel on which the carrier tape is wound are stored in the storage device in association with each other.
  • the parts management device has an acquisition unit and a storage unit.
  • the parts management device can store the position information of the cavity in which the supplied parts are housed in the storage device in association with the identification information for identifying the reel. Therefore, the user of the parts management device can easily narrow down the parts to be traced based on the position information of the cavity from the parts supplied from the carrier tape of the reel, and the traceability is improved.
  • the above-mentioned matters regarding the parts management device can be applied to the parts management method as well.
  • the component mounting machine 10 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.
  • the substrate transfer device 11 is composed of a belt conveyor or the like, and conveys the substrate 90 in the transfer direction (X-axis direction).
  • the substrate 90 is a circuit board and forms at least one of an electronic circuit and an electric circuit.
  • the board transfer device 11 carries the board 90 into the machine of the component mounting machine 10 and positions the board 90 at a predetermined position in the machine.
  • the board transfer device 11 carries out the board 90 to the outside of the component mounting machine 10 after the mounting process of the component 91 by the component mounting machine 10 is completed.
  • the component supply device 12 sequentially supplies the components 91 to be mounted on the substrate 90.
  • the component supply device 12 includes a plurality of feeders 121 provided along the transport direction (X-axis direction) of the substrate 90.
  • Each of the plurality of feeders 121 includes a reel RL0, and a carrier tape 80 is wound around the reel RL0.
  • the feeder 121 pitch-feeds the carrier tape 80 containing the plurality of parts 91, and supplies the parts 91 so that the parts 91 can be collected at the collection position PP1 provided on the tip end side of the feeder 121.
  • the parts transfer device 13 includes a head drive device 131 and a moving table 132.
  • the head driving device 131 is configured so that the moving table 132 can be moved in the X-axis direction and the Y-axis direction by a linear motion mechanism.
  • a mounting head 20 is detachably (replaceably) provided on the moving table 132 by a clamp member.
  • the mounting head 20 uses at least one holding member 30 to collect and hold the component 91 supplied by the component supply device 12, and mounts the component 91 on the substrate 90 positioned by the substrate transfer device 11.
  • the holding member 30 for example, a suction nozzle, a chuck, or the like can be used.
  • a known imaging device can be used for the component camera 14 and the substrate camera 15.
  • the component camera 14 is fixed to the base of the component mounting machine 10 so that the optical axis faces upward (vertically upward) in the Z-axis direction.
  • the component camera 14 can take an image of the component 91 held by the holding member 30 from below.
  • the board camera 15 is provided on the moving table 132 of the component transfer device 13 so that the optical axis faces downward (vertically downward) in the Z-axis direction.
  • the substrate camera 15 can image the substrate 90 from above.
  • the board camera 15 can also take an image of the component 91 from above at the sampling position PP1 of the component 91.
  • the component camera 14 and the substrate camera 15 perform imaging based on a control signal transmitted from the control device 16.
  • the image data captured by the component camera 14 and the substrate camera 15 is transmitted to the control device 16.
  • the control device 16 includes a known arithmetic unit and a storage device DS0, and constitutes a control circuit. Information, image data, and the like output from various sensors provided in the component mounting machine 10 are input to the control device 16. The control device 16 sends a control signal to each device based on a control program, a predetermined mounting condition set in advance, and the like.
  • control device 16 causes the board camera 15 to image the board 90 positioned by the board transfer device 11.
  • the control device 16 processes the image captured by the substrate camera 15 to recognize the positioning state of the substrate 90.
  • control device 16 causes the holding member 30 to collect and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to image the component 91 held by the holding member 30.
  • the control device 16 processes the image captured by the component camera 14 to recognize the suitability of the component 91 and the holding posture of the component 91.
  • the control device 16 moves the holding member 30 toward the upper side of the planned mounting position set in advance by a control program or the like. Further, the control device 16 corrects the planned mounting position based on the positioning state of the board 90, the holding posture of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted.
  • the planned mounting position and the mounting position include the rotation angle in addition to the position (X coordinate and Y coordinate).
  • the control device 16 corrects the target position (X coordinate and Y coordinate) and rotation angle of the holding member 30 according to the mounting position.
  • the control device 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position, and mounts the component 91 on the substrate 90.
  • the control device 16 executes a mounting process for mounting the plurality of components 91 on the substrate 90.
  • the parts management device 40 of the present embodiment is provided in the control device 16 of the parts mounting machine 10.
  • the parts management device 40 can be formed, for example, on a line management device that manages a board production line including a plurality of component mounting machines 10, a host computer that manages a plurality of board production lines, a cloud, or the like.
  • the parts management device 40 includes an acquisition unit 41 and a storage unit 42 when regarded as a control block.
  • the parts management device 40 may further include a discriminating unit 43.
  • the parts management device 40 of the present embodiment includes an acquisition unit 41, a storage unit 42, and a discrimination unit 43.
  • the parts management device 40 executes the control program according to the flowchart shown in FIG.
  • the acquisition unit 41 performs the process shown in step S11.
  • the storage unit 42 performs the processes shown in steps S12 and S13.
  • the determination unit 43 performs the determination and processing shown in steps S14 to S16.
  • Acquisition unit 41 When the parts 91 are sequentially supplied from the carrier tape 80 having a plurality of cavities 81 containing the parts 91 to be mounted on the substrate 90, the acquisition unit 41 obtains the position information of the cavities 81 containing the parts 91. Acquire (step S11 shown in FIG. 3).
  • the carrier tape 80 includes a plurality of cavities 81, a plurality of feed holes 82, and a cover tape 83.
  • Each of the plurality of cavities 81 houses a component 91.
  • the plurality of feed holes 82 are formed at predetermined intervals in the transport direction of the carrier tape 80 (longitudinal direction of the carrier tape 80).
  • a cover tape 83 is adhered to the upper surface of the carrier tape 80, and the openings of the plurality of cavities 81 are closed.
  • the cover tape 83 of the carrier tape 80 transported to the collection position PP1 shown in FIGS. 1 and 4 is peeled off so that the holding member 30 can collect the component 91.
  • the feeder 121 peels off the cover tape 83 while conveying the carrier tape 80, and positions the plurality of cavities 81 in order at the collection position PP1.
  • the component 91 housed in the cavity 81 positioned at the sampling position PP1 can be sampled by the holding member 30, and the component 91 can be supplied.
  • the plurality of cavities 81 are formed at predetermined intervals in the transport direction of the carrier tape 80.
  • the interval T1 of the cavities 81 is appropriately set according to the dimensions of the component 91 to be accommodated and the like. As shown in FIG. 4, in the present embodiment, the interval T1 of the cavity 81 is set to an integral multiple (twice in the figure) of the interval T2 of the feed hole 82.
  • the feeder 121 feeds the carrier tape 80 by a predetermined amount (twice the interval T2 of the feed holes 82 in the figure) and pitch feeds, the cavity 81 is positioned at the sampling position PP1 and one component 91 is supplied. The number of remaining parts 91 remaining on the carrier tape 80 is reduced by one.
  • the acquisition unit 41 can acquire the position information of the cavity 81 in the carrier tape 80 based on the number of the parts 91 supplied from the carrier tape 80.
  • the number of parts 91 to be supplied can be obtained from the feed amount of the feeder 121 pitch-feeding the carrier tape 80.
  • the acquisition unit 41 moves the position of the leading (first) cavity 81 of the carrier tape 80. Acquire the position information indicating.
  • the acquisition unit 41 acquires the position information indicating the position of the second cavity 81 from the beginning of the carrier tape 80. The same can be said for the position information indicating the positions of the cavities 81 after the third from the beginning of the carrier tape 80.
  • the operator when the operator attaches the reel RL0 on which the carrier tape 80 is wound to the feeder 121, the operator reads the identification code attached to the reel RL0 using a reading device. Further, when the feeder 121 is installed in the slot of the component supply device 12, the operator reads the identification code attached to the feeder 121 by using the reading device.
  • the feeder 121 When the feeder 121 is installed in the slot, electric power is supplied from the component mounting machine 10 via the connector, and the feeder 121 is in a state of being able to communicate with the component mounting machine 10.
  • the slot of the component supply device 12 the identification information of the feeder 121 installed in the slot, and the identification information of the reel RL0 attached to the feeder 121 are associated with each other, and the storage device DS0 of the control device 16 is associated with the slot. Is remembered in. Further, the storage device DS0 records the initial number of components 91 in the carrier tape 80 and the number of remaining components 91 remaining in the carrier tape 80.
  • the acquisition unit 41 acquires the position information indicating the position of the second cavity 81 from the beginning of the carrier tape 80.
  • the acquisition unit 41 acquires the position information indicating the position of the cavity 81 (NI0-NR0 + 1) th from the beginning of the carrier tape 80.
  • the storage unit 42 stores the position information of the cavity 81 acquired by the acquisition unit 41 and the identification information for identifying the reel RL0 around which the carrier tape 80 is wound in the storage device DS0 in association with each other (shown in FIG. 3). Step S12).
  • the slot of the component supply device 12, the identification information of the feeder 121 installed in the slot, and the identification information of the reel RL0 attached to the feeder 121 are associated with each other to form the control device 16. It is stored in the storage device DS0. Therefore, the storage unit 42 can store the position information of the cavity 81 acquired by the acquisition unit 41 and the identification information for identifying the reel RL0 around which the carrier tape 80 is wound in the storage device DS0 in association with each other. ..
  • the storage unit 42 can store at least one of the board information, the device information, the holding information, and the mounting information in the storage device DS0 in association with the position information of the cavity 81 and the identification information of the reel RL0.
  • the board information refers to information about the board 90 on which the component 91 is mounted.
  • the board information includes identification information for identifying the board 90, the type of the board 90, information for specifying the mounting position where the component 91 is mounted (for example, a circuit symbol), and the like.
  • the types of the substrate 90 include, for example, a multi-chamfered substrate in which a plurality of substrates 90 are divisible, a single-sided mounting substrate in which the component 91 is mounted on only one of the front surface and the back surface of the substrate 90, and a substrate.
  • a double-sided mounting board on which the component 91 is mounted on both sides (front surface and back surface) of the 90 is included.
  • the device information refers to the information related to the device DD0 used for mounting the component 91.
  • the device DD0 includes a device that is detachably provided on the component mounting machine 10 such as the mounting head 20, the holding member 30, and the feeder 121. Further, in a substrate production line including a plurality of component mounting machines 10, it is necessary to identify the component mounting machines 10.
  • the device DD0 includes, for example, the component mounting machine 10.
  • the device information includes identification information for identifying the device DD0, usage conditions of the device DD0, and the like.
  • the holding information refers to information regarding the holding state of the part 91 when the part 91 is collected and held by the holding member 30.
  • the holding information includes the amount of deviation of the component 91 collected and held by the holding member 30 with respect to the regular holding position, the rotation angle with respect to the regular holding posture, the determination result of the holding state, the location of the image data, and the like. ..
  • the determination result of the holding state is determined by whether or not the deviation amount and the rotation angle of the component 91 collected and held by the holding member 30 are included in the allowable range.
  • the holding information can be obtained by performing image processing on the image captured by the component camera 14, for example.
  • the mounting information refers to information regarding the mounting state of the component 91 when the component 91 is mounted on the substrate 90 by the holding member 30.
  • the mounting information includes the amount of deviation of the component 91 mounted on the substrate 90 with respect to the regular mounting position, the rotation angle with respect to the regular mounting state, the determination result of the mounting state, the location of the image data, and the like.
  • the determination result of the mounting state is determined by whether or not the deviation amount and the rotation angle of the component 91 mounted on the substrate 90 are included in the allowable range.
  • the mounting information can be obtained, for example, by a visual inspection machine that inspects the component 91 mounted on the substrate 90.
  • FIG. 5 schematically shows an example of information stored in the storage device DS0.
  • the position information of the cavity 81 of the carrier tape 80 wound around the reel RL0 of the identification information DID1 is indicated by "1", "2", and "3" from the beginning of the carrier tape 80.
  • the component 91 housed in the cavity 81 at the top (first) of the carrier tape 80 is mounted at the mounting position indicated by the circuit symbol R1 on the substrate 90 of the identification information BID1. Further, the component 91 is collected (suctioned) by the holding member 30 (suction nozzle) identified by the nozzle number NZ1 and held and mounted on the substrate 90. Further, the determination results of the holding state and the mounting state of the component 91 are both good (OK).
  • the component 91 housed in the second and subsequent cavities 81 of the carrier tape 80 can be said for the component 91 housed in the carrier tape 80 wound around the reel RL0 of the identification information DID2.
  • the component 91 mounted at the mounting position indicated by the circuit symbol R10 on the board 90 of the identification information BID1 has a defective (NG) determination result in both the holding state and the mounting state.
  • the operator traces all the components 91 housed in the reel RL0 of the identification information DID1. It is necessary and the tracing work is complicated.
  • the user of the parts management device 40 uses the carrier tape 80 in which the parts 91 whose determination result is defective are wound around the reel RL0 of the identification information DID1 based on the information shown in FIG. It can be known that it was housed in the second cavity 81 from the beginning.
  • the user of the parts management device 40 can easily narrow down the parts 91 to be traced based on the position information of the cavity 81 from the parts 91 supplied from the reel RL0 of the identification information DID1, and the traceability is improved. To do. Further, for example, it is assumed that the component 91 whose determination result is poor is often housed in the cavity 81 on the tail side of the carrier tape 80. The component 91 housed in the cavity 81 on the tail side of the carrier tape 80 has a longer elapsed time from the start of use of the carrier tape 80.
  • the cause of the defect of the component 91 is, for example, the defect of the storage state of the carrier tape 80.
  • the component 91 housed in the cavity 81 on the tail side of the carrier tape 80 is more susceptible to the pressure of the carrier tape 80 when the carrier tape 80 is wound. Therefore, it can be estimated that the cause of the defect of the component 91 is, for example, the defect of the wound state of the carrier tape 80.
  • the method of supplying the component 91 includes a wafer supply in which the component 91 is supplied from the wafer WF0 and a reel supply in which the component 91 is supplied from the reel RL0.
  • the wafer WF0 has a part (island) that is partially defective in the manufacturing process, and a part that does not satisfy a predetermined quality is managed as a defective die (Bad Die) on a map. Defective dies are detected in advance by optical inspection or the like, but dies that are not determined to be defective dies may later be found to be defective dies.
  • the dies may be concentrated in a specific region of the wafer WF0.
  • the manufacturer modifies the determination condition for determining the quality of the die so that the die can be detected to reduce the omission of detection of the defective die.
  • the parts supply device corresponding to wafer supply is generally more expensive than the parts supply device 12 corresponding to reel supply, the types and number of parts 91 that can be supplied are small, and the replenishment work of the parts 91 is complicated. It is easy to become. Therefore, it is known that the parts 91 arranged on the wafer WF0 are transferred to the reel RL0 to supply the reels.
  • the carrier tape 80 of the present embodiment accommodates the wafer component 91W, which is the component 91 arranged on the wafer WF0.
  • the XW axis and the YW axis shown in FIG. 6 show an example of orthogonal coordinate axes in the wafer WF0.
  • the wafer parts 91W are arranged, for example, by a predetermined number of minutes in the XW axis direction from a predetermined region (arrangement order is 1) on the origin side of the orthogonal coordinate axes.
  • the wafer parts 91W are arranged in the XW axis direction for a predetermined number of minutes from the region in which the coordinates of the YW axis are increased by one from the predetermined region.
  • the parts 91 (wafer parts 91W) arranged on the wafer WF0 can be specified by the above-mentioned arrangement order.
  • the wafer-related information shown in FIG. 7 includes identification information of the wafer WF0, array information (arrangement order) of the wafer component 91W, array information (coordinate information) of the wafer component 91W, and wafer component information.
  • the wafer component 91W arranged in the predetermined region (arrangement order is 1)
  • the coordinates in the XW axis direction are indicated by the coordinates XW1
  • the coordinates in the YW axis direction are indicated by the coordinates YW1.
  • the wafer component 91W is, for example, a wafer component 91W whose quality is not specified.
  • the wafer component 91W is, for example, a reference member RM0 indicating a reference position of the wafer WF0.
  • the reference member RM0 is provided at a predetermined position on the wafer WF0, and indicates a reference position when the wafer component 91W is taken from the wafer WF0.
  • the reference member RM0 is usually not housed in the carrier tape 80 in order to prevent erroneous mounting.
  • the coordinates in the XW axis direction are indicated by the coordinates XW3, and the coordinates in the YW axis direction are the coordinates YW1. It is indicated by.
  • the wafer component 91W is, for example, a defective wafer component 91W (defective component BM0).
  • the defective component BM0 is a component found in the manufacturing process of the wafer component 91W, and is usually not accommodated in the carrier tape 80 in order to prevent erroneous mounting.
  • the coordinates in the XW axis direction are indicated by the coordinates XWA1
  • the coordinates in the YW axis direction are indicated by the coordinates YWA1.
  • the wafer component 91W is, for example, a wafer component 91WA having a quality of A rank.
  • the coordinates in the XW axis direction are indicated by the coordinates XWA2
  • the coordinates in the YW axis direction are indicated by the coordinates YWA2.
  • the wafer component 91W is, for example, a wafer component 91WB having a quality of B rank.
  • the coordinates in the XW axis direction are indicated by the coordinates XWA3, and the coordinates in the YW axis direction are indicated by the coordinates YWA3.
  • the wafer component 91W is, for example, a wafer component 91WC having a quality of C rank. In this specification, for example, it is assumed that the quality of the wafer component 91W deteriorates in the order of the A-rank wafer component 91WA, the B-rank wafer component 91WB, and the C-rank wafer component 91WC. Further, the method of setting the quality of the wafer component 91W is not limited.
  • the wafer WF0 includes various wafer parts 91W. Therefore, in the supply of the component 91 using the carrier tape 80 accommodating the wafer component 91W, there is a request to know the arrangement information of the wafer component 91W in the wafer WF0.
  • the storage unit 42 stores the arrangement information of the wafer component 91W in the wafer WF0 and the position information of the cavity 81 in which the wafer component 91W is housed in the carrier tape 80 in advance in association with each other before supplying the component 91. It is good to store it in the device DS0.
  • the storage unit 42 accommodates the arrangement information of the wafer parts 91W whose arrangement order is arranged in the region of the order AJ1, the position information of the cavity 81 in which the wafer parts 91W are housed, and the wafer parts 91W.
  • the identification information of the reel RL0 of the carrier tape 80 is stored in the storage device DS0 in association with the identification information.
  • the user of the component management device 40 finds that the supplied component 91 is a wafer component 91W, and the wafer component 91W is located in the area of the XW axis coordinate XWA1 and the YW axis coordinate YWA1 on the wafer WF0. It can be known that it was arranged. Further, the user of the parts management device 40 can know that the arrangement order of the wafer parts 91W is the order AJ1 and the quality is the wafer parts 91WA of rank A.
  • the storage unit 42 identifies the position information of the cavity 81 containing the wafer component 91W and the reel RL0 of the carrier tape 80 containing the wafer component 91W.
  • the information can be further associated and stored in the storage device DS0.
  • the wafer parts 91W are arranged in a predetermined order on the wafer WF0, and are housed in the carrier tape 80 in the arrangement order on the wafer WF0. Therefore, it is sufficient for the storage unit 42 to store the predetermined wafer component 91W housed in the carrier tape 80 in the storage device DS0. Further, the wafer component 91W may be accommodated in a plurality of carrier tapes 80 in the arrangement order in the wafer WF0.
  • the storage unit 42 provides the identification information for identifying the wafer WF0, the identification information for identifying the plurality of reels RL0 around which the carrier tape 80 is wound, and the predetermined arrangement information before supplying the component 91. It can be associated in advance and stored in the storage device DS0.
  • the predetermined arrangement information refers to the arrangement information including the arrangement order in the wafer WF0 of the predetermined wafer component 91W housed in each carrier tape 80.
  • the wafer parts 91W arranged on the wafer WF0 of the identification information WID1 are housed in, for example, the carrier tape 80 of a plurality of (five) reels RL0. Therefore, the identification information WID1 of the wafer WF0 and the identification information DID1 to the identification information DID5 of the plurality of (five) reels RL0 are associated and stored in the storage device DS0. Further, for example, in the reel RL0 of the identification information DID1, the arrangement order of the wafer parts 91W housed in the cavity 81 at the head (first) of the carrier tape 80 is 1, and the wafer parts 91W are in the XW axis direction. The coordinates are indicated by the coordinates XW1, and the coordinates in the YW axis direction are indicated by the coordinates YW1.
  • the arrangement order of the wafer parts 91W housed in the cavity 81 at the head (first) of the carrier tape 80 is the order BJ1
  • the coordinates of the wafer parts 91W in the XW axis direction are the coordinates. It is indicated by XWB1
  • the coordinates in the YW axis direction are indicated by the coordinates YWB1.
  • the arrangement order of the wafer parts 91W housed in the cavity 81 at the head (first) of the carrier tape 80 is the order CJ1
  • the coordinates of the wafer parts 91W in the XW axis direction are the coordinates. It is indicated by XWC1
  • the coordinates in the YW axis direction are indicated by the coordinates YWC1.
  • the carrier tape 80 of the reel RL0 of the identification information DID2 accommodates (CJ1-BJ1) wafer parts 91W. The same can be said for the reels RL0 of the identification information DID3 to the identification information DID5.
  • the storage unit 42 separately stores the number of wafer parts 91W accommodated in the reel RL0 in the storage device DS0. Further, the storage unit 42 can store the arrangement information of the wafer component 91W housed in the arbitrary cavity 81 of each carrier tape 80. Further, the storage unit 42 can also store the arrangement information including the arrangement order of the cumulative wafer parts 91W up to the immediately preceding carrier tape 80. In this case, the reel RL0 of the identification information DID1 which is the first reel RL0 has zero arrangement order of the cumulative wafer parts 91W and does not include the arrangement information.
  • a defective wafer component 91W (defective component BM0) included in the wafer WF0, a wafer component 91W having a quality of a predetermined rank or less, and a reference member RM0 indicating a reference position of the wafer WF0 is specified.
  • the defective wafer component 91W (defective component BM0) and the reference member RM0 indicating the reference position of the wafer WF0 are usually not accommodated in the carrier tape 80 in order to prevent erroneous mounting.
  • the wafer component 91W having a quality of a predetermined rank or lower (in this case, the wafer component 91WC of the C rank) is erroneously mounted.
  • the carrier tape 80 may not be accommodated.
  • the carrier tape 80 in which the wafer component 91W following the specific member SM0 in the arrangement order of the wafer WF0 is carried up and accommodated in the specific cavity 81S, which is the cavity 81 in which the specific member SM0 is scheduled to be housed included.
  • the third cavity 81 shown in FIG. 9 is the specific cavity 81S.
  • the wafer component 91W to be accommodated in the No. 4 cavity 81 is accommodated in the No. 3 specific cavity 81S.
  • the wafer component 91W to be housed in the cavity 81 of No. 5 is housed in the cavity 81 of No. 4.
  • the wafer component 91W following the specific member SM0 in the arrangement order of the wafer WF0 is moved up and accommodated in the cavity 81.
  • the storage unit 42 may store the specific cavity information including the position and the number of the specific cavities 81S in the storage device DS0 in advance before supplying the component 91.
  • the component management device 40 can match the arrangement information of the wafer component 91W on the wafer WF0 with the position information of the cavity 81 in which the wafer component 91W is housed on the carrier tape 80.
  • the position of the specific cavity 81S is the third cavity 81, and the number of the specific cavities 81S is one.
  • the carrier tape 80 includes a carrier tape 80 in which the specific cavity 81S scheduled to accommodate the specific member SM0 is set in the empty cavity 81E.
  • the third cavity 81 shown in FIG. 9 is the specific cavity 81S.
  • the third specific cavity 81S is set to the empty cavity 81E.
  • the empty cavity 81E is an unaccommodated cavity 81 that does not accommodate the wafer component 91W and the specific member SM0.
  • the wafer component 91W to be accommodated in the No. 4 cavity 81 is accommodated in the No. 4 cavity 81.
  • the same applies and the above-mentioned wafer component 91W is not carried forward and accommodated.
  • the storage unit 42 may store the empty cavity information including the position and the number of the empty cavities 81E in the storage device DS0 in advance before supplying the component 91.
  • the component supply device 12 can pitch-feed the carrier tape 80 to the cavity 81 in which the wafer component 91W is housed, and can supply the wafer component 91W.
  • the position of the empty cavity 81E is the third cavity 81, and the number of empty cavities 81E is one.
  • the carrier tape 80 may not be conveyed even if the carrier tape 80 is pitch-fed due to improper installation of the reel RL0. Further, when a mistake in collecting the part 91 occurs, the operator may rewind the carrier tape 80. In these cases, the arrangement information of the wafer component 91W on the wafer WF0 and the position information of the cavity 81 in which the wafer component 91W is housed on the carrier tape 80 do not match.
  • the carrier tape 80 includes a carrier tape 80 in which a predetermined cavity 81 for accommodating the wafer component 91W is set in the empty cavity 81E.
  • the empty cavity 81E may be set at a predetermined cycle (for example, for each supply of a predetermined number of parts 91).
  • the storage unit 42 may store the empty cavity information including the position and the number of the empty cavities 81E in the storage device DS0 in advance before supplying the component 91.
  • the component management device 40 can periodically check whether or not the arrangement information of the wafer component 91W and the position information of the cavity 81 in which the wafer component 91W is housed in the carrier tape 80 are consistent. it can. Also in this case, the component supply device 12 can pitch-feed the carrier tape 80 to the cavity 81 in which the wafer component 91W is housed, and can supply the wafer component 91W.
  • Discriminating unit 43 The determination unit 43 pitch-feeds the carrier tape 80 and supplies the components 91 in order.
  • the discriminating unit 43 causes the substrate camera 15 to image the cavity 81 while the component supply device 12 is supplying the component 91, and the cavity 81 is an empty cavity based on the image captured by the substrate camera 15. It can be determined whether or not it is 81E. Specifically, the discriminating unit 43 determines that the cavity 81 to accommodate the component 91 is an empty cavity 81E when the component 91 is not imaged in the above image.
  • the discrimination unit 43 continues the supply of the component 91 by the component supply device 12 when the empty cavity information matches, and stops the supply of the component 91 by the component supply device 12 when the empty cavity information does not match. Specifically, the determination unit 43 determines whether or not the empty cavity information matches (step S14 shown in FIG. 3). When the empty cavity information matches (Yes in step S14), the discriminating unit 43 continues the supply of the component 91 by the component supply device 12 (step S15).
  • the discriminating unit 43 stops the supply of the component 91 by the component supply device 12 (step S16).
  • the component management device 40 warns the operator that the arrangement information of the wafer component 91W and the position information of the cavity 81 in which the wafer component 91W is housed in the carrier tape 80 do not match. As a result, the operator can confirm the misalignment of the carrier tape 80 and correct the misalignment of the carrier tape 80.
  • the component supply device 12 can also convey the carrier tape 80 so that the nearest empty cavity 81E reaches the sampling position PP1 when the determination unit 43 determines that the empty cavity information does not match.
  • the arrangement information of the wafer component 91W and the position information of the cavity 81 in which the wafer component 91W is housed in the carrier tape 80 are matched, and the misalignment of the carrier tape 80 is corrected.
  • the discriminating unit 43 causes the component camera 14 to image the holding member 30, and the cavity 81 is empty based on the image captured by the component camera 14. It is also possible to determine whether or not the cavity is 81E. Specifically, when the component 91 is not imaged in the above image (the holding member 30 does not hold the component 91), the discriminating unit 43 uses an empty cavity 81E for the cavity 81 to accommodate the component 91. It can be judged that there is.
  • the carrier tape 80 of the embodiment does not contain the specific member SM0.
  • the component supply device 12 can also supply the wafer component 91W from the carrier tape 80 in which the specific member SM0 is housed. In this case, when the cavity 81 containing the specific member SM0 is detected, the component supply device 12 pitch-feeds the carrier tape 80 to the cavity 81 containing the wafer component 91W, and the wafer component 91W. Can be supplied.
  • the wafer component 91W can also be applied to the component 91 produced in the same production lot. Specifically, it is assumed that the parts 91 produced in the same production lot are housed in a plurality of carrier tapes 80 in the production order.
  • the storage unit 42 provides the identification information for identifying the production lot, the identification information for identifying the plurality of reels RL0 around which the carrier tape 80 is wound, and the predetermined production information before supplying the component 91. It is preferable to store the information in the storage device DS0 in advance.
  • the predetermined production information includes the production order of the predetermined parts 91 housed in each carrier tape 80.
  • the predetermined component 91 can be, for example, a component 91 housed in the head (first) cavity 81 of each carrier tape 80.
  • a predetermined cavity 81 for accommodating the component 91 may be set in the empty cavity 81E.
  • the storage unit 42 can store the empty cavity information including the position and the number of the empty cavities 81E in the storage device DS0 in advance before supplying the component 91.
  • the determination unit 43 determines whether or not the empty cavity information detected when the component supply device 12 supplies the component 91 and the empty cavity information stored in the storage device DS0 match. You can also do it. Further, the discriminating unit 43 continues the supply of the component 91 by the component supply device 12 when the empty cavity information matches, and stops the supply of the component 91 by the component supply device 12 when the empty cavity information does not match. You can also do it.
  • the parts management method includes an acquisition process and a storage process.
  • the acquisition process corresponds to the control performed by the acquisition unit 41.
  • the storage step corresponds to the control performed by the storage unit 42.
  • the parts management method can further include a discrimination step.
  • the discrimination step corresponds to the control performed by the discrimination unit 43.
  • the acquisition unit 41 and the storage unit 42 are provided.
  • the component management device 40 can store the position information of the cavity 81 in which the supplied component 91 is housed in the storage device DS0 in association with the identification information that identifies the reel RL0. Therefore, the user of the parts management device 40 can easily narrow down the parts 91 to be traced based on the position information of the cavity 81 from the parts 91 supplied from the carrier tape 80 of the reel RL0, and the traceability is improved. To do. The same can be said for the parts management device 40 as described above for the parts management method.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Le dispositif de gestion de composants selon l'invention est équipé d'une unité d'acquisition et d'une unité de stockage. L'unité d'acquisition, lorsque des composants sont fournis successivement à partir d'une bande de support ayant une pluralité de cavités recevant des composants à monter sur un substrat, acquiert des informations de position concernant les cavités recevant les composants. L'unité de stockage amène les informations de position de cavité acquises par l'unité d'acquisition et des informations d'identification identifiant une bobine sur laquelle est enroulée la bande de support à être associées les unes aux autres et stockées dans un dispositif de stockage.
PCT/JP2019/046460 2019-11-27 2019-11-27 Dispositif de gestion de composants et procédé de gestion de composants WO2021106119A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980102452.1A CN114731778B (zh) 2019-11-27 2019-11-27 元件管理装置及元件管理方法
PCT/JP2019/046460 WO2021106119A1 (fr) 2019-11-27 2019-11-27 Dispositif de gestion de composants et procédé de gestion de composants
KR1020227013774A KR102598549B1 (ko) 2019-11-27 2019-11-27 부품 관리 장치 및 부품 관리 방법
JP2021560833A JP7359863B2 (ja) 2019-11-27 2019-11-27 部品管理装置および部品管理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/046460 WO2021106119A1 (fr) 2019-11-27 2019-11-27 Dispositif de gestion de composants et procédé de gestion de composants

Publications (1)

Publication Number Publication Date
WO2021106119A1 true WO2021106119A1 (fr) 2021-06-03

Family

ID=76130405

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/046460 WO2021106119A1 (fr) 2019-11-27 2019-11-27 Dispositif de gestion de composants et procédé de gestion de composants

Country Status (4)

Country Link
JP (1) JP7359863B2 (fr)
KR (1) KR102598549B1 (fr)
CN (1) CN114731778B (fr)
WO (1) WO2021106119A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010428A (ja) * 2008-10-10 2009-01-15 Fuji Mach Mfg Co Ltd 回路部品供給用のフィーダおよび回路部品装着システム
JP4789857B2 (ja) * 2007-05-16 2011-10-12 ヤマハ発動機株式会社 表面実装装置
JP6086671B2 (ja) * 2012-08-07 2017-03-01 富士機械製造株式会社 ダイ部品供給装置
JP2017224720A (ja) * 2016-06-15 2017-12-21 富士機械製造株式会社 電子部品供給システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100549255B1 (ko) 2001-03-16 2006-02-03 다니 덴끼 고교 가부시끼가이샤 식별표 및 식별물
US6914771B2 (en) * 2002-05-29 2005-07-05 Hirokazu Ono Tray for electronic components
CN1286353C (zh) * 2003-11-03 2006-11-22 Tdk株式会社 用于安装电子元件的装置和方法
JP4271721B2 (ja) * 2008-05-10 2009-06-03 富士機械製造株式会社 回路部品供給用のフィーダ
ITUD20110079A1 (it) * 2011-06-06 2012-12-07 Applied Materials Italia Srl Unita' di supporto e trasporto di un substrato di stampa per un impianto di deposizione di tracce di stampa, e relativo procedimento di deposizione
JP5835825B1 (ja) 2014-11-19 2015-12-24 上野精機株式会社 キャリアテープ走行装置及び電子部品搬送装置
WO2016157436A1 (fr) * 2015-03-31 2016-10-06 富士機械製造株式会社 Appareil d'épissage automatique
CN109315088B (zh) * 2016-06-21 2020-07-31 株式会社富士 拼接单元
JP6803710B2 (ja) 2016-09-28 2020-12-23 株式会社Ｆｕｊｉ 情報管理装置及び情報管理方法
US11683923B2 (en) * 2017-03-30 2023-06-20 Fuji Corporation Maintenance management device
US11362025B2 (en) * 2017-08-29 2022-06-14 Daewon Semiconductor Packaging Industrial Company Tape carrier assemblies having an integrated adhesive film
JP7300593B2 (ja) 2018-01-22 2023-06-30 パナソニックＩｐマネジメント株式会社 部品実装装置およびトレースデータの取得方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789857B2 (ja) * 2007-05-16 2011-10-12 ヤマハ発動機株式会社 表面実装装置
JP2009010428A (ja) * 2008-10-10 2009-01-15 Fuji Mach Mfg Co Ltd 回路部品供給用のフィーダおよび回路部品装着システム
JP6086671B2 (ja) * 2012-08-07 2017-03-01 富士機械製造株式会社 ダイ部品供給装置
JP2017224720A (ja) * 2016-06-15 2017-12-21 富士機械製造株式会社 電子部品供給システム

Also Published As

Publication number Publication date
CN114731778B (zh) 2023-07-25
CN114731778A (zh) 2022-07-08
KR20220066394A (ko) 2022-05-24
JP7359863B2 (ja) 2023-10-11
JPWO2021106119A1 (fr) 2021-06-03
KR102598549B1 (ko) 2023-11-03

Similar Documents

Publication Publication Date Title
EP2214467B1 (fr) Procédé et dispositif pour le remplissage de rubans transporteurs avec des composants électroniques
JP4425855B2 (ja) 対回路基板作業機およびそれに対する構成要素の供給方法
US20180116079A1 (en) Feeder management device
WO2015079843A1 (fr) Dispositif de classification, procédé de classification, programme de classification, dispositif de transfert, procédé de transfert, et programme de transfert
KR20140016789A (ko) 부품 실장 시스템, 부품 실장 장치 및 부품 검사 장치
JP2010171208A (ja) 電子部品装着方法及び電子部品装着装置
JP7407151B2 (ja) 部品実装システム
US11516952B2 (en) Tape incorrect mounting detection system
US11490552B2 (en) Component verification system
JP5602648B2 (ja) 回収部品の選別支援装置及び部品実装装置
JP5808160B2 (ja) 電子部品実装装置
CN110800391A (zh) 在通过贴装头进行拾取之前对元件的测量
WO2021106119A1 (fr) Dispositif de gestion de composants et procédé de gestion de composants
EP3346816B1 (fr) Machine de montage de composants
JP2010050380A (ja) 部品実装装置および部品実装方法
JP7440606B2 (ja) 部品実装機および部品実装システム
US10334769B2 (en) Method for allocating electronic component and electronic component mounting system
WO2023139789A1 (fr) Dispositif de préparation, dispositif de montage, système de montage et procédé de traitement d'informations
WO2023007740A1 (fr) Système de montage de composants et procédé de montage de composants
CN116615021A (zh) 异常判定装置以及异常判定方法
JP7110318B2 (ja) 部品実装システム及び、部品保持方法
EP3740054B1 (fr) Machine de travail et procédé permettant de déterminer une polarité
JP2023133485A (ja) 対策情報案内装置および対策情報案内方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19954093

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021560833

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227013774

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19954093

Country of ref document: EP

Kind code of ref document: A1