WO2021098631A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021098631A1
WO2021098631A1 PCT/CN2020/128942 CN2020128942W WO2021098631A1 WO 2021098631 A1 WO2021098631 A1 WO 2021098631A1 CN 2020128942 W CN2020128942 W CN 2020128942W WO 2021098631 A1 WO2021098631 A1 WO 2021098631A1
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WO
WIPO (PCT)
Prior art keywords
light
substrate
hole
optical axis
shielding layer
Prior art date
Application number
PCT/CN2020/128942
Other languages
English (en)
French (fr)
Inventor
黄凯
何宗文
朱华胜
朱盼盼
杨尚明
胡令
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP20891006.7A priority Critical patent/EP4064255A4/en
Publication of WO2021098631A1 publication Critical patent/WO2021098631A1/zh
Priority to US17/746,902 priority patent/US20220279104A1/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to the technical field of communication equipment, and in particular to an electronic device.
  • the camera module can be arranged below the display module, and the display module is provided with a light hole to ensure that the camera module can work normally.
  • the camera module mainly includes a bracket, a lens assembly, a shading layer and other devices.
  • the lens assembly is installed in the bracket, the shading layer is installed on the bracket, and the shading layer is located above the lens assembly.
  • the light-through hole opened on the display module needs to be larger than the inner diameter of the light-shielding layer.
  • there is an assembly error between the display module and the camera module so when opening a hole on the display module, it is necessary to consider this assembly error to further enlarge the size of the light-passing hole. Therefore, the light-through holes opened on the existing display module are relatively large, resulting in a relatively small screen-to-body ratio of the electronic device.
  • the invention discloses an electronic device to solve the problem of relatively small screen-to-body ratio of the electronic device.
  • the present invention adopts the following technical solutions:
  • An electronic device including:
  • a display module includes a first substrate, a second substrate, and a wiring structure, the first substrate and the second substrate are stacked, and the wiring structure is disposed on the second substrate facing the On one side surface of the first substrate, the wiring structure has a first light through hole;
  • the camera module includes a camera body and a light-shielding layer, the camera body is provided with a light inlet, the second substrate is located between the first substrate and the camera body, and the light-shielding layer is disposed on On a surface of the second substrate facing the camera body, a second light through hole is formed in the light shielding layer;
  • the first light-passing hole, the second light-passing hole, and the light-inlet hole are arranged in the direction of the optical axis of the camera module, and the second light-passing hole is arranged in a direction perpendicular to the optical axis.
  • the orthographic projection of the surface is located within the orthographic projection of the light entrance hole on the plane perpendicular to the optical axis direction, and the orthographic projection of the second light-passing hole on the plane perpendicular to the optical axis direction It is located in the orthographic projection of the first light through hole on a plane perpendicular to the optical axis direction.
  • the light-shielding layer of the camera module is arranged on the display module.
  • the design makes the distance between the light-shielding layer and the display module almost zero, so the first light-through hole can be smaller;
  • there is no assembly error between the display module and the light-shielding layer so there is no need to consider the assembly error when opening the first light-through hole.
  • the size of the first light-through hole can be further reduced, so that the screen-to-body ratio of the electronic device higher.
  • FIG. 1 is a cross-sectional view of a partial structure of an electronic device disclosed in an embodiment of the present invention.
  • 100-display module 110-first substrate, 120-second substrate, 130-wiring structure, 140-light emitting part, 150-transparent cover, 160-optical glue, 170-polarizer, 180-foam , 200-camera module, 210-camera body, 211-light inlet, 212-bracket, 213-photosensitive chip, 220-shading layer, 221-second light-passing hole.
  • an embodiment of the present invention discloses an electronic device, which may specifically include a display module 100 and a camera module 200.
  • the display module 100 may specifically include a first substrate 110, a second substrate 120, and a wiring structure 130.
  • the first substrate 110 and the second substrate 120 are stacked, and the wiring structure 130 is disposed on the second substrate 120 facing the first substrate.
  • Both the first substrate 110 and the second substrate 120 may be glass plates, and the second substrate 120 may be provided with thin film transistors.
  • the wiring structure 130 may be a ring structure, and the wiring structure 130 defines a first light through hole through which light can pass, so that light in the external environment can enter the camera module 200.
  • the display module 100 may further include a light-emitting part 140, a transparent cover 150, an optical glue 160, a polarizer 170, and a foam 180.
  • the light-emitting part 140 may be disposed between the first substrate 110 and the second substrate 120.
  • the light-emitting part 140 may be an organic light-emitting layer;
  • the polarizer 170 may be disposed on the surface of the first substrate 110 away from the second substrate 120;
  • the light-transmitting cover 150 is located on the side of the first substrate 110 away from the second substrate 120, and transmits light
  • the cover 150 can be connected to the polarizer 170 through the optical glue 160;
  • the foam 180 can be arranged on the side of the second substrate 120 away from the first substrate 110, the foam 180 can be bonded to the second substrate 120, and can be provided on it.
  • Avoidance hole at least a part of the camera module 200 can be located in the avoidance hole, so as to prevent the stray light in the display module 100 from affecting the normal operation of the camera module 200, and at the same time, can reduce the space occupied by the camera module 200, thereby reducing The thickness of small electronic devices.
  • the camera module 200 may specifically include a camera body 210 and a light shielding layer 220.
  • the camera body 210 is provided with a light entrance hole 211, the second substrate 120 is located between the first substrate 110 and the camera body 210, and the light shielding layer 220 is disposed on the second substrate 120 facing toward On one side surface of the camera body 210, the light shielding layer 220 defines a second light through hole 221.
  • the camera body 210 may specifically include a bracket 212, a lens assembly, and a photosensitive chip 213.
  • the lens assembly is arranged on the bracket 212.
  • the lens assembly may include lenses such as a convex lens and a concave lens to achieve the effect of light convergence.
  • the photosensitive chip 213 may be arranged on the bracket.
  • the photosensitive chip 213 has a photosensitive area for photosensitive, and the photosensitive chip 213 can convert light signals into electrical signals, thereby obtaining corresponding image information.
  • the second light-passing hole 221 here also allows light to pass through, so that light from the external environment can enter the camera module 200 and reach the photosensitive area of the photosensitive chip 213, thereby realizing the shooting function.
  • the above-mentioned wiring structure 130 and the light-shielding layer 220 can both play a role of light-shielding.
  • the above-mentioned first light-passing hole, second light-passing hole 221 and light-inlet hole 211 are arranged in the direction of the optical axis of the camera module 200, so the external The light in the environment can sequentially pass through the first light-passing hole and the second light-passing hole 221, and finally enter the camera module 200 through the light entrance 211, so that the camera module 200 can realize the shooting function.
  • the orthographic projection of the second light-passing hole 221 on the surface perpendicular to the optical axis direction of the camera module 200 is located in the orthographic projection of the light-inlet hole 211 on the surface perpendicular to the optical axis direction, and the second light-passing hole 221
  • the orthographic projection on the plane perpendicular to the optical axis direction is located within the orthographic projection of the first light through hole on the plane perpendicular to the optical axis direction. That is, when viewed in the direction of the optical axis of the camera module 200, the outline size of the first light-passing hole and the outline size of the light-inlet hole 211 are both larger than the outline size of the second light-passing hole 221.
  • the size of the light inlet 211 is slightly larger, so that the setting will not affect the screen-to-body ratio of the display module 100, and can ensure that the light in the external environment enters the camera module 200 as much as possible.
  • the second light-passing hole 221 will affect the screen-to-body ratio of the display module 100. Therefore, under the premise of meeting the shooting requirements of the camera module 200, the second light-passing hole 221 can be set as small as possible.
  • the occupancy rate of the light shielding layer 220 on the display area is reduced, so as to achieve the purpose of increasing the screen-to-body ratio of the electronic device.
  • the first light-passing hole is located above the second light-passing hole 221, so the first light-passing hole is slightly larger than the second light-passing hole 221, so that more light can enter the second light-passing hole through the first light-passing hole 221, so as to better ensure the shooting effect of the camera module 200.
  • the light shielding layer 220 of the camera module 200 is disposed on the display module 100.
  • This design makes the distance between the light shielding layer 220 and the display module 100 almost zero on the one hand, so the first light through hole can be more
  • there is no assembly error between the display module 100 and the light-shielding layer 220 so there is no need to consider the assembly error when opening the first light-through hole.
  • the size of the first light-through hole can be further reduced, so that the electronic device The screen-to-body ratio is higher.
  • the appearance and texture of the electronic device are improved, and the user experience is also improved.
  • H A+(B+D)*2, where: H is the size of the hole that cannot be used for display on the appearance surface of the display module 100, A is the aperture of the second light-passing hole 221, and B Is the difference between the apertures of the first light-passing hole and the second light-passing hole 221, and D is the width of the wiring structure 130.
  • A is basically a fixed value; since the light-shielding layer 220 is disposed on the display module 100, the distance Z between the wiring structure 130 and the light-shielding layer 220 is smaller than in the background art The distance between the wiring structure 130 and the light shielding layer 220, and the field of view ⁇ of the camera module 200 is also a fixed value. Therefore, according to the Pythagorean theorem, B is reduced compared to the background technology, that is, the first The aperture of a light hole can be set smaller.
  • the size of the first light through hole can be further reduced, and the specific reduction range can be flexibly selected according to actual conditions.
  • the size of the first light-passing hole is just enough to meet the need for light entering the camera module 200 to be able to propagate through the first light-passing hole to the second light-passing hole 221, and it will not be too small to cause entering the camera module.
  • the light of the group 200 is reduced, and the hole that cannot be used for display in the appearance of the display module 100 becomes larger. Therefore, this setting method can not only meet the shooting requirements of the camera module 200, but also further improve the electronics.
  • the screen-to-body ratio of the device is just enough to meet the need for light entering the camera module 200 to be able to propagate through the first light-passing hole to the second light-passing hole 221, and it will not be too small to cause entering the camera module.
  • the light of the group 200 is reduced, and the hole that cannot be used for display in the appearance of the display module 100 becomes larger. Therefore, this setting method can not only meet the shooting requirements of the camera module 200, but also further improve the electronics.
  • the screen-to-body ratio of the device is just
  • the outer contour shape of the wiring structure 130 and the light shielding layer 220 can be flexibly set.
  • the outer contour shape can be a rectangle, a circle, or an ellipse.
  • the first light-passing hole and the second light-passing hole The shape of the can also be flexibly selected, for example, rectangular holes, round holes, oval holes and so on.
  • the wiring structure 130 and The light-shielding layers 220 are all arranged in a circular ring structure.
  • the radial width of the light-shielding layer 220 can be smaller than the radial width of the wiring structure 130, so as to prevent the radial width of the light-shielding layer 220 from being too large and causing the light-shielding area to be too large. , And then achieve the aforementioned purpose.
  • the orthographic projection of the light entrance hole 211 on the plane perpendicular to the aforementioned optical axis direction may be located within the orthographic projection of the first light through hole on the plane perpendicular to the optical axis direction, or the first light through hole is perpendicular to the plane.
  • the orthographic projection on the surface in the optical axis direction may be within the orthographic projection of the light entrance hole 211 on the surface perpendicular to the aforementioned optical axis direction.
  • the orthographic projection of the light entrance hole 211 on the surface perpendicular to the aforementioned optical axis direction is located on the front of the first light hole on the surface perpendicular to the optical axis direction.
  • the size of the light entrance hole 211 can also be appropriately reduced, so that the overall size of the camera module 200 is reduced accordingly, which is more conducive to the installation in the electronic device.
  • the distance between the focal point of the camera body 210 and the light shielding layer 220 in the aforementioned optical axis direction may be a preset value. That is, when the position of the light shielding layer 220 changes, the position of the camera body 210 changes accordingly to ensure that the focal point of the camera body 210 and the light shielding layer 220 maintain a matching position, thereby achieving the purpose of improving the shooting effect.
  • the distance between the camera body 210 and the display module 100 can be further reduced, making the distribution of the display module 100 and the camera module 200 more compact , Which is more conducive to the stacking of components in electronic equipment.
  • the light-shielding layer 220 can be formed by a coating process, that is, the light-shielding layer 220 can be a coating structure, which is easy to form.
  • the thickness of the formed light shielding layer 220 is small, which is more beneficial to control the thickness of the electronic device. Specifically, since the light shielding layer 220 is provided on the surface of the second substrate 120 facing the camera body 210, and the surface of the second substrate 120 facing away from the camera body 210 needs to be provided with structures such as thin film transistors through an evaporation process.
  • the light-shielding layer 220 may be plated after the vapor deposition process and the bonding process of the first substrate 110 and the second substrate 120 are performed, or the light-shielding layer 220 may be plated first, and then the vapor deposition process and the first substrate 110 and the second substrate 120 may be applied. Fitting process.
  • the former implementation it is necessary to correspondingly increase protective measures to prevent the first substrate 110 and the second substrate 120 from being scratched.
  • the light shielding layer 220 may also be a printed structure. That is, the light shielding layer 220 can be formed on the side surface of the second substrate 120 facing the camera body 210 through a printing process. This method also has the advantages of being easy to implement and the formed light shielding layer 220 has a small thickness.
  • the light-shielding layer 220 may be printed after the vapor deposition process described above and the bonding process of the first substrate 110 and the second substrate 120 are performed, or the light-shielding layer 220 may be printed first, and then the vapor deposition process and the first The process of bonding the substrate 110 and the second substrate 120 together.
  • the alignment and fixation between the light shielding layer 220 and the camera body 210 can be achieved through the precise positioning of the charge-coupled device (CCD) camera and the dynamic adjustment and alignment of the micro-motor-driven camera module 200. Therefore, the relative position accuracy of the light-shielding layer 220 and the camera body 210 is higher, which not only ensures the imaging effect of the camera module 200, but also increases the size of the first light-passing hole without considering the alignment error, thereby improving the performance of the electronic device. Screen-to-body ratio.
  • CCD charge-coupled device
  • the electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an e-book reader, or a wearable device.
  • the electronic device may also be other devices, which is not limited in the embodiment of the present invention.

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  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本发明公开一种电子设备，包括：显示模组，其包括第一基板、第二基板和走线结构，第一基板和第二基板层叠设置，走线结构设置于第二基板朝向第一基板的一侧表面，走线结构开设第一通光孔；摄像头模组，其包括摄像头本体和遮光层，摄像头本体开设进光孔，第二基板位于第一基板和摄像头本体之间，遮光层设置于第二基板朝向摄像头本体的一侧表面上，遮光层开设第二通光孔；第一通光孔、第二通光孔和进光孔在摄像头模组的光轴方向上排布，第二通光孔在垂直于光轴方向的面上的正投影位于进光孔在垂直于光轴方向的面上的正投影内，第二通光孔在垂直于光轴方向的面上的正投影位于第一通光孔在垂直于光轴方向的面上的正投影内。

Description

电子设备
相关申请的交叉引用
本申请主张在2019年11月18日在中国提交的中国专利申请号No.201911130035.6的优先权，其全部内容通过引用包含于此。
技术领域
本发明涉及通信设备技术领域，尤其涉及一种电子设备。
背景技术
智能手机、平板电脑等电子设备已经成为人们生活中不可或缺的产品，电子设备的屏占比是影响用户体验的重要因素之一，因此如何提高电子设备的屏占比已经成为本领域技术人员重点关注的设计方向。
现有的电子设备为了提升屏占比，可以将摄像头模组设置于显示模组的下方，显示模组上开设通光孔，以保证摄像头模组可以正常工作。摄像头模组主要包括支架、镜片组件、遮光层等器件，镜片组件安装于支架内，遮光层安装在支架上，且遮光层位于镜片组件的上方。
由于遮光层与显示模组之间存在一定的距离，因此显示模组上开设的通光孔需要大于遮光层的内径。同时，显示模组和摄像头模组之间存在装配误差，所以在显示模组上开孔时，需要考虑这一装配误差而将通光孔的尺寸进一步扩大。因此，现有的显示模组上开设的通光孔比较大，导致电子设备的屏占比比较小。
发明内容
本发明公开一种电子设备，以解决电子设备的屏占比比较小的问题。
为了解决上述问题，本发明采用下述技术方案：
一种电子设备，包括：
显示模组，所述显示模组包括第一基板、第二基板和走线结构，所述第一基板和所述第二基板层叠设置，所述走线结构设置于所述第二基板朝向所 述第一基板的一侧表面，所述走线结构开设第一通光孔；
摄像头模组，所述摄像头模组包括摄像头本体和遮光层，所述摄像头本体开设进光孔，所述第二基板位于所述第一基板和所述摄像头本体之间，所述遮光层设置于所述第二基板朝向所述摄像头本体的一侧表面上，所述遮光层开设第二通光孔；
所述第一通光孔、所述第二通光孔和所述进光孔在所述摄像头模组的光轴方向上排布，所述第二通光孔在垂直于所述光轴方向的面上的正投影位于所述进光孔在垂直于所述光轴方向的面上的正投影内，且所述第二通光孔在垂直于所述光轴方向的面上的正投影位于所述第一通光孔在垂直于所述光轴方向的面上的正投影内。
本发明采用的技术方案能够达到以下有益效果：
本发明公开的电子设备中，摄像头模组的遮光层设置于显示模组上，这样设计一方面使得遮光层与显示模组之间的距离几乎为零，因此第一通光孔可以更小；另一方面，显示模组和遮光层之间不存在装配误差，因此开设第一通光孔时不需要考虑该装配误差，第一通光孔的尺寸可以进一步缩小，使得电子设备的屏占比更高。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为本发明实施例公开的电子设备的部分结构的剖视图。
附图标记说明：
100-显示模组、110-第一基板、120-第二基板、130-走线结构、140-发光部、150-透光盖板、160-光学胶、170-偏光片、180-泡棉、200-摄像头模组、210-摄像头本体、211-进光孔、212-支架、213-感光芯片、220-遮光层、221-第二通光孔。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
如图1所示，本发明实施例公开一种电子设备，其具体可以包括显示模组100和摄像头模组200。
显示模组100具体可以包括第一基板110、第二基板120和走线结构130，其中，第一基板110和第二基板120层叠设置，走线结构130设置于第二基板120朝向第一基板110的一侧表面。第一基板110和第二基板120均可以为玻璃板，第二基板120上可以设置薄膜晶体管。走线结构130可以是环形结构，该走线结构130开设第一通光孔，该第一通光孔可供光线穿过，以使得外部环境中的光线可以进入摄像头模组200。显示模组100还可以包括发光部140、透光盖板150、光学胶160、偏光片170和泡棉180，其中：发光部140可以设置于第一基板110和第二基板120之间，该发光部140可以是有机发光层；偏光片170可以设置于第一基板110背离第二基板120的一侧表面；透光盖板150位于第一基板110背离第二基板120的一侧，透光盖板150可以通过光学胶160与偏光片170连接；泡棉180可以设置于第二基板120背离第一基板110的一侧，该泡棉180可以与第二基板120粘接，其上可以开设避让孔，摄像头模组200的至少一部分可以位于该避让孔内，从而防止显示模组100中的杂光影响摄像头模组200的正常工作，同时可以减小摄像头模组200占用的空间，从而减小电子设备的厚度。
摄像头模组200具体可以包括摄像头本体210和遮光层220，摄像头本体210开设进光孔211，第二基板120位于第一基板110和摄像头本体210之间，遮光层220设置于第二基板120朝向摄像头本体210的一侧表面上，遮光层220开设第二通光孔221。摄像头本体210具体可以包括支架212、镜片组件和感光芯片213，镜片组件设置于支架212上，该镜片组件可以包括凸透镜、凹透镜等镜片，以实现光线的汇聚等效果；感光芯片213可以设置于 支架212内，该感光芯片213具有用于感光的感光区域，该感光芯片213可以将光信号转换为电信号，从而得到对应的图像信息。这里的第二通光孔221同样可供光线穿过，以使得外部环境中的光线可以进入摄像头模组200内并到达感光芯片213的感光区域，从而实现拍摄功能。
上述走线结构130和遮光层220均可以起到遮光的作用，上述第一通光孔、第二通光孔221和进光孔211在摄像头模组200的光轴方向上排布，因此外部环境中的光线可以依次穿过第一通光孔和第二通光孔221，最终通过进光孔211进入摄像头模组200内，使得摄像头模组200可以实现拍摄功能。第二通光孔221在垂直于摄像头模组200的光轴方向的面上的正投影位于进光孔211在垂直于该光轴方向的面上的正投影内，且第二通光孔221在垂直于该光轴方向的面上的正投影位于第一通光孔在垂直于该光轴方向的面上的正投影内。也就是说，在摄像头模组200的光轴方向上观察时，第一通光孔的轮廓尺寸和进光孔211的轮廓尺寸均大于第二通光孔221的轮廓尺寸。进光孔211的尺寸稍大一些，这样设置既不会影响显示模组100的屏占比，又可以保证外部环境的中的光线尽量多地进入摄像头模组200内。而第二通光孔221会对显示模组100的屏占比产生影响，因此在满足摄像头模组200的拍摄要求的前提下，可以尽量将第二通光孔221设置得小一些，以此降低遮光层220对显示区域的占用率，达到提升电子设备的屏占比的目的。第一通光孔位于第二通光孔221的上方，因此第一通光孔比第二通光孔221稍大，以使得更多的光线可以通过第一通光孔进入第二通光孔221，从而更好地保证摄像头模组200的拍摄效果。
上述电子设备中，摄像头模组200的遮光层220设置于显示模组100上，这样设计一方面使得遮光层220与显示模组100之间的距离几乎为零，因此第一通光孔可以更小；另一方面，显示模组100和遮光层220之间不存在装配误差，因此开设第一通光孔时不需要考虑该装配误差，第一通光孔的尺寸可以进一步缩小，使得电子设备的屏占比更高。同时，第一通光孔的尺寸减小后，电子设备的外观质感有所提升，用户体验感随之得到改善。
参考图1所示，H＝A+(B+D)*2，其中：H为显示模组100的外观面上无法用于显示的孔的尺寸，A为第二通光孔221的孔径，B为第一通光孔与第 二通光孔221的孔径差值，D为走线结构130的宽度。由于摄像头模组200的视场角β是定值，A基本为定值；由于遮光层220设置于显示模组100上，因此走线结构130与遮光层220之间的距离Z小于背景技术中的走线结构130与遮光层220之间的距离，同时摄像头模组200的视场角β也是定值，因此根据勾股定理，B相比于背景技术有所减小，也就是说，第一通光孔的孔径可以设置得更小。
如上所述，第一通光孔的尺寸可以进一步减小，具体减小的幅度可以根据实际情况灵活选择。为了使得第一通光孔的尺寸在不影响光线传播的基础上尽量小，可选的实施例中，在过摄像头模组200的光轴的截面内，第一通光孔的孔壁与第二通光孔221的孔壁在垂直于该光轴的方向上的距离S＝h*tanα，其中，h为第二基板120的厚度，α为光线经过第二基板120时的折射角。也就是说，第一通光孔的尺寸刚刚好可以满足需要进入摄像头模组200的光线能够通过该第一通光孔传播至第二通光孔221，既不会过小而导致进入摄像头模组200的光线变少，也不会过大而导致显示模组100的外观上无法用于显示的孔变大，因此该设置方式既能满足摄像头模组200的拍摄要求，还能够进一步提升电子设备的屏占比。
本发明实施例中，走线结构130和遮光层220的外轮廓形状可以灵活设置，例如该外轮廓形状可以是矩形、圆形、椭圆形，同时，第一通光孔和第二通光孔的形状也可以灵活选择，例如可以是矩形孔、圆孔、椭圆形孔等。可选的实施例中，考虑到摄像头模组200的视场范围的形状通常为圆形，因此为了适配摄像头模组200，从而进一步提升电子设备的屏占比，可以将走线结构130和遮光层220均设置为圆环形结构，此时遮光层220的径向宽度可以小于走线结构130的径向宽度，从而防止遮光层220的径向宽度过大而导致遮光面积过大的情况，进而达到前述目的。
进一步地，进光孔211在垂直于前述光轴方向的面上的正投影可以位于第一通光孔在垂直于该光轴方向的面上的正投影内，或者第一通光孔在垂直于该光轴方向的面上的正投影可以位于进光孔211在垂直于前述光轴方向的面上的正投影内。考虑到光线以逐渐汇聚的方式进入进光孔211，当进光孔211在垂直于前述光轴方向的面上的正投影位于第一通光孔在垂直于该光轴 方向的面上的正投影内时，既可以保证足够的光线进入摄像头模组200，还可以适当减小进光孔211的尺寸，从而使得摄像头模组200的整体尺寸随之减小，这样设置更有利于电子设备内零部件的堆叠。
为了改善摄像头模组200的拍摄效果，可以使摄像头本体210的焦点与遮光层220在前述光轴方向上的距离为预设值。也就是说，当遮光层220的位置发生变化时，摄像头本体210的位置随之发生变化，以保证摄像头本体210的焦点与遮光层220保持相互匹配的位置，从而达到改善拍摄效果的目的。本发明实施例中，由于遮光层220上移至显示模组100中，因此摄像头本体210与显示模组100之间的距离可以进一步缩小，使得显示模组100和摄像头模组200的分布更加紧凑，从而更有利于电子设备内零部件的堆叠。
上述遮光层220的成型方式有多种实施方案，一种可选的实施例中，可以采用镀膜工艺成型遮光层220，也就是说，遮光层220可以为镀膜结构，此种镀膜结构便于成型，且所形成的遮光层220的厚度较小，从而更有利于控制电子设备的厚度。具体地，由于遮光层220设置于第二基板120朝向摄像头本体210的一侧表面上，而第二基板120背离摄像头本体210的一侧表面上还需要通过蒸镀工艺设置薄膜晶体管等结构，因此可以在实施蒸镀工艺以及第一基板110和第二基板120贴合的工艺之后再镀遮光层220，也可以先镀遮光层220，再实施蒸镀工艺以及第一基板110和第二基板120贴合的工艺。采用前一种实施方式时，需要对应增加防止第一基板110和第二基板120被划伤的保护措施。
当然，遮光层220也可以为印刷结构。即，遮光层220可以通过印刷工艺成型于第二基板120朝向摄像头本体210的一侧表面上，此种方式同样具备便于实施，且所形成的遮光层220的厚度较小的优点。具体地，可以在实施前文所述蒸镀工艺以及第一基板110和第二基板120贴合的工艺之后再印刷遮光层220，也可以先印刷遮光层220，再实施该蒸镀工艺以及第一基板110和第二基板120贴合的工艺。
在装配电子设备时，可以通过电荷耦合器件(Charge-coupled Device，CCD)相机精确定位、微型马达驱动摄像头模组200动态调整对位等方式实现遮光层220与摄像头本体210之间的对位固定，从而使得遮光层220与摄像头本 体210的相对位置精度更高，既保证摄像头模组200的成像效果，又无需考虑对位误差而增大第一通光孔的尺寸，从而可以提升电子设备的屏占比。
本发明实施例所公开的电子设备可以为智能手机、平板电脑、电子书阅读器或可穿戴设备。当然，该电子设备也可以是其他设备，本发明实施例对此不做限制。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (7)

  1. 一种电子设备，包括：
    显示模组(100)，所述显示模组(100)包括第一基板(110)、第二基板(120)和走线结构(130)，所述第一基板(110)和所述第二基板(120)层叠设置，所述走线结构(130)设置于所述第二基板(120)朝向所述第一基板(110)的一侧表面，所述走线结构(130)开设第一通光孔；
    摄像头模组(200)，所述摄像头模组(200)包括摄像头本体(210)和遮光层(220)，所述摄像头本体(210)开设进光孔(211)，所述第二基板(120)位于所述第一基板(110)和所述摄像头本体(210)之间，所述遮光层(220)设置于所述第二基板(120)朝向所述摄像头本体(210)的一侧表面上，所述遮光层(220)开设第二通光孔(221)；
    所述第一通光孔、所述第二通光孔(221)和所述进光孔(211)在所述摄像头模组(200)的光轴方向上排布，所述第二通光孔(221)在垂直于所述光轴方向的面上的正投影位于所述进光孔(211)在垂直于所述光轴方向的面上的正投影内，且所述第二通光孔(221)在垂直于所述光轴方向的面上的正投影位于所述第一通光孔在垂直于所述光轴方向的面上的正投影内。
  2. 根据权利要求1所述的电子设备，其中，在过所述光轴的截面内，所述第一通光孔的孔壁与所述第二通光孔(221)的孔壁在垂直于所述光轴的方向上的距离S＝h*tanα，其中，h为所述第二基板(120)的厚度，α为光线经过所述第二基板(120)时的折射角。
  3. 根据权利要求1所述的电子设备，其中，所述走线结构(130)和所述遮光层(220)均为圆环形结构，所述遮光层(220)的径向宽度小于所述走线结构(130)的径向宽度。
  4. 根据权利要求1所述的电子设备，其中，所述进光孔(211)在垂直于所述光轴方向的面上的正投影位于所述第一通光孔在垂直于所述光轴方向的面上的正投影内。
  5. 根据权利要求1所述的电子设备，其中，所述摄像头本体(210)的焦点与所述遮光层(220)在所述光轴方向上的距离为预设值。
  6. 根据权利要求1所述的电子设备，其中，所述遮光层(220)为镀膜结构。
  7. 根据权利要求1所述的电子设备，其中，所述遮光层(220)为印刷结构。
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