WO2021098635A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021098635A1
WO2021098635A1 PCT/CN2020/128947 CN2020128947W WO2021098635A1 WO 2021098635 A1 WO2021098635 A1 WO 2021098635A1 CN 2020128947 W CN2020128947 W CN 2020128947W WO 2021098635 A1 WO2021098635 A1 WO 2021098635A1
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WO
WIPO (PCT)
Prior art keywords
light
substrate
hole
shielding layer
electronic device
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Application number
PCT/CN2020/128947
Other languages
English (en)
French (fr)
Inventor
黄凯
何宗文
朱华胜
朱盼盼
杨尚明
胡令
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP20889914.6A priority Critical patent/EP4064676A4/en
Publication of WO2021098635A1 publication Critical patent/WO2021098635A1/zh
Priority to US17/746,898 priority patent/US11968438B2/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/63Control of cameras or camera modules by using electronic viewfinders

Definitions

  • the present invention relates to the technical field of communication equipment, and in particular to an electronic device.
  • the camera module can be arranged below the display module, and the display module is provided with a light hole to ensure that the camera module can work normally.
  • the camera module mainly includes a bracket, a lens assembly, a shading layer and other devices.
  • the lens assembly is installed in the bracket, the shading layer is installed on the bracket, and the shading layer is located above the lens assembly.
  • the light-through hole opened on the display module needs to be larger than the inner diameter of the light-shielding layer.
  • there is an assembly error between the display module and the camera module so when opening a hole on the display module, it is necessary to consider this assembly error to further enlarge the size of the light-passing hole. Therefore, the light-through holes opened on the existing display module are relatively large, resulting in a relatively small screen-to-body ratio of the electronic device.
  • the invention discloses an electronic device to solve the problem of relatively small screen-to-body ratio of the electronic device.
  • the present invention adopts the following technical solutions:
  • An electronic device including:
  • a display module includes a first substrate, a second substrate, and a wiring structure, the first substrate and the second substrate are stacked, and the wiring structure is disposed on the second substrate facing the On one side surface of the first substrate, the wiring structure has a first light through hole;
  • a camera module comprising a camera body and a light shielding layer, the camera body is provided with a light entrance hole, the second substrate is located between the first substrate and the camera body, and the light shielding layer is disposed on A surface of the first substrate facing away from the second substrate, and a second light through hole is formed in the light shielding layer;
  • the first light-through hole, the second light-through hole, and the light-inlet hole are arranged in the direction of the optical axis of the camera module, and the first light-through hole and the second light-through hole are arranged in the direction of the optical axis of the camera module.
  • the orthographic projections on the plane perpendicular to the optical axis direction are all located within the orthographic projections of the light inlet hole on the plane perpendicular to the optical axis direction.
  • the light-shielding layer of the camera module is arranged on the surface of the first substrate facing away from the second substrate.
  • the design makes the distance between the light-shielding layer and the display module almost zero.
  • the light-passing hole can be smaller; on the other hand, there is no assembly error between the display module and the light-shielding layer, so there is no need to consider the assembly error when opening the first light-passing hole, and the size of the first light-passing hole can be further reduced. Makes the screen-to-body ratio of electronic devices higher.
  • FIG. 1 is a cross-sectional view of a partial structure of an electronic device disclosed in an embodiment of the present invention.
  • 100-display module 110-first substrate, 120-second substrate, 130-wiring structure, 140-light emitting part, 150-transparent cover, 160-optical glue, 170-polarizer, 180-foam , 200-camera module, 210-camera body, 211-light inlet, 212-bracket, 213-photosensitive chip, 220-shading layer.
  • an embodiment of the present invention discloses an electronic device, which may specifically include a display module 100 and a camera module 200.
  • the display module 100 may specifically include a first substrate 110, a second substrate 120, and a wiring structure 130.
  • the first substrate 110 and the second substrate 120 are stacked, and the wiring structure 130 is disposed on the second substrate 120 facing the first substrate.
  • Both the first substrate 110 and the second substrate 120 may be glass plates, and the second substrate 120 may be provided with thin film transistors.
  • the wiring structure 130 may be a ring structure, and the wiring structure 130 defines a first light through hole through which light can pass, so that light in the external environment can enter the camera module 200.
  • the display module 100 may further include a light-emitting part 140, a transparent cover 150, an optical glue 160, a polarizer 170, and a foam 180.
  • the light-emitting part 140 may be disposed between the first substrate 110 and the second substrate 120.
  • the light-emitting part 140 may be an organic light-emitting layer;
  • the polarizer 170 may be disposed on the surface of the first substrate 110 away from the second substrate 120;
  • the light-transmitting cover 150 is located on the side of the first substrate 110 away from the second substrate 120, and transmits light
  • the cover 150 can be connected to the polarizer 170 through the optical glue 160;
  • the foam 180 can be arranged on the side of the second substrate 120 away from the first substrate 110, the foam 180 can be bonded to the second substrate 120, and can be provided on it.
  • Avoidance hole at least a part of the camera module 200 can be located in the avoidance hole, so as to prevent the stray light in the display module 100 from affecting the normal operation of the camera module 200, and at the same time, can reduce the space occupied by the camera module 200, thereby reducing The thickness of small electronic devices.
  • the camera module 200 may specifically include a camera body 210 and a light shielding layer 220.
  • the camera body 210 is provided with a light inlet 211, the second substrate 120 is located between the first substrate 110 and the camera body 210, and the light shielding layer 220 is provided on the first substrate 110 away from On one side surface of the second substrate 120, the light shielding layer 220 defines a second light through hole.
  • the camera body 210 may specifically include a bracket 212, a lens assembly, and a photosensitive chip 213.
  • the lens assembly is arranged on the bracket 212.
  • the lens assembly may include lenses such as a convex lens and a concave lens to achieve the effect of light convergence.
  • the photosensitive chip 213 may be arranged on the bracket.
  • the photosensitive chip 213 has a photosensitive area for photosensitive, and the photosensitive chip 213 can convert light signals into electrical signals, thereby obtaining corresponding image information.
  • the second light-passing hole here can also allow light to pass through, so that light from the external environment can enter the camera module 200 and reach the photosensitive area of the photosensitive chip 213, thereby realizing the shooting function.
  • the above-mentioned wiring structure 130 and the light-shielding layer 220 can both play a role of light-shielding.
  • the above-mentioned first light through hole, second light through hole and light entrance hole 211 are arranged in the direction of the optical axis of the camera module 200, so the external environment The light in the light can pass through the second light-passing hole and the first light-passing hole in sequence, and finally enter the camera module 200 through the light inlet 211, so that the camera module 200 can realize the shooting function.
  • the orthographic projection of the first light-passing hole on the surface perpendicular to the optical axis direction of the camera module 200 and the orthographic projection of the second light-passing hole on the surface perpendicular to the optical axis direction are both located at the light entrance hole 211 in the direction perpendicular to the optical axis.
  • the outline size of the first light-passing hole and the outline size of the second light-passing hole are both smaller than the outline size of the light entrance hole 211.
  • the size of the light inlet 211 is slightly larger, so that the setting will not affect the screen-to-body ratio of the display module 100, and can ensure that the light in the external environment enters the camera module 200 as much as possible.
  • the first light-through hole and the second light-through hole will affect the screen-to-body ratio of the display module 100. Therefore, under the premise of meeting the shooting requirements of the camera module 200, the first light-through hole and the second light-through hole can be used as much as possible
  • the light-passing hole is set to be smaller, so as to reduce the occupancy rate of the wiring structure 130 and the light shielding layer 220 to the display area, and achieve the purpose of increasing the screen-to-body ratio of the electronic device.
  • the light shielding layer 220 of the camera module 200 is disposed on the display module 100.
  • This design makes the distance between the light shielding layer 220 and the display module 100 almost zero on the one hand, so the first light through hole can be more
  • there is no assembly error between the display module 100 and the light-shielding layer 220 so there is no need to consider the assembly error when opening the first light-through hole.
  • the size of the first light-through hole can be further reduced, so that the electronic device The screen-to-body ratio is higher.
  • the appearance and texture of the electronic device are improved, and the user experience is also improved.
  • At least a part of the light shielding layer 220 may be located between the first substrate 110 and the polarizer 170.
  • the light-shielding layer 220, the first substrate 110 and the polarizer 170 can be stacked and arranged. At this time, the positions of the light-shielding layer 220, the first substrate 110 and the polarizer 170 are relatively independent, so it is more convenient to mold the display module 100. .
  • the polarizer 170 is provided with a third light-passing hole, and the light shielding layer 220 is located in the third light-passing hole.
  • the third light-passing hole allows light to pass through, thereby increasing the light transmittance of the area corresponding to the camera module 200, thereby improving the shooting quality of the camera module 200.
  • a part of the optical glue 160 may extend into the third light-passing hole, thereby filling the space of the third light-passing hole where the light-shielding layer 220 is removed, so this part of the optical glue 160 may be away from the first substrate 110
  • One side surface of the second substrate 120 is in contact with the first substrate 110, so that the structural strength of the display module 100 is higher.
  • the light-shielding layer 220 can be arranged using the space occupied by the polarizer 170, so the light-shielding layer 220 does not occupy additional space, making the thickness of the entire display module 100 smaller; in addition, The portion of the polarizer 170 that is not perforated has a certain light-shielding effect. Therefore, when viewed in the direction of the optical axis of the camera module 200, the light-shielding layer 220 and the polarizer 170 can form a seamlessly butted light-shielding structure, so the size of the light-shielding layer 220 It is smaller, thereby reducing the manufacturing cost of the light shielding layer 220.
  • the above-mentioned light shielding layer 220 may be in contact with the inner wall of the third light through hole.
  • the light shielding layer 220 and The positions of the polarizer 170 can be referred to each other, thereby facilitating rapid prototyping of the display module 100 and improving the molding efficiency of the display module.
  • the first light-through hole and the second light-through hole will affect the screen-to-body ratio of the display module 100, so the first light-through hole and the second light-through hole can be set as small as possible.
  • the orthographic projection of the first light-passing hole on the surface perpendicular to the optical axis direction of the camera module 200 and the orthographic projection of the second light-passing hole on the surface perpendicular to the optical axis direction Can overlap.
  • the shape of the first light-passing hole and the shape of the second light-passing hole are the same, and the sizes of the two are the same. This arrangement can make the size of the first light-passing hole and the second light-passing hole as small as possible.
  • the relative positions of the two can be referred to each other when the display module 100 is formed, thereby making it easier to process the display module 100.
  • the outer contour shape of the wiring structure 130 and the light shielding layer 220 can be flexibly set.
  • the outer contour shape can be a rectangle, a circle, or an ellipse.
  • the first light-passing hole and the second light-passing hole The shape of the can also be flexibly selected, for example, rectangular holes, round holes, oval holes and so on.
  • the wiring structure 130 and The light-shielding layers 220 are all arranged in a circular ring structure.
  • the radial width of the light-shielding layer 220 can be smaller than the radial width of the wiring structure 130, so as to prevent the radial width of the light-shielding layer 220 from being too large and causing the light-shielding area to be too large. , And then achieve the aforementioned purpose.
  • H A+D*2, where: H is the size of the hole that cannot be used for display on the appearance surface of the display module 100, and A is the aperture of the second light-passing hole (or the first pass) The aperture of the light hole), and D is the width of the wiring structure 130. Since the field of view ⁇ of the camera module 200 is a constant value, A is basically a constant value, and D is also a basically constant value. At this time, the size of H is not affected by factors such as assembly errors, so H can be set smaller.
  • the distance between the focal point of the camera body 210 and the light shielding layer 220 in the aforementioned optical axis direction may be a preset value. That is, when the position of the light shielding layer 220 changes, the position of the camera body 210 changes accordingly to ensure that the focal point of the camera body 210 and the light shielding layer 220 maintain a matching position, thereby achieving the purpose of improving the shooting effect.
  • the distance between the camera body 210 and the display module 100 can be further reduced, making the distribution of the display module 100 and the camera module 200 more compact , Which is more conducive to the stacking of components in electronic equipment.
  • the light-shielding layer 220 can be formed by a coating process, that is, the light-shielding layer 220 can be a coating structure, which is easy to form.
  • the thickness of the formed light shielding layer 220 is small, which is more beneficial to control the thickness of the electronic device.
  • the light-shielding layer 220 can be plated after the vapor deposition process and the bonding process of the first substrate 110 and the second substrate 120 are performed, or the light-shielding layer 220 can be plated first, and then the vapor deposition process and the first substrate 110 and the second substrate 120 fitting process.
  • the light-shielding layer 220 can also be made by other processes, such as a printing process, so that the light-shielding layer 220 has a printing structure.
  • the alignment and fixation between the light shielding layer 220 and the camera body 210 can be achieved through the precise positioning of the charge-coupled device (CCD) camera and the dynamic adjustment and alignment of the micro-motor-driven camera module 200. Therefore, the relative position accuracy of the light-shielding layer 220 and the camera body 210 is higher, which not only ensures the imaging effect of the camera module 200, but also increases the size of the first light-passing hole without considering the alignment error, thereby improving the performance of the electronic device. Screen-to-body ratio.
  • CCD charge-coupled device
  • the electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an e-book reader, or a wearable device.
  • the electronic device may also be other devices, which is not limited in the embodiment of the present invention.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

本发明公开一种电子设备,包括:显示模组,显示模组包括第一基板、第二基板和走线结构,第一基板和第二基板层叠设置,走线结构设置于第二基板朝向第一基板的一侧表面,走线结构开设第一通光孔;摄像头模组,摄像头模组包括摄像头本体和遮光层,摄像头本体开设进光孔,第二基板位于第一基板和摄像头本体之间,遮光层设置于第一基板背离第二基板的一侧表面,遮光层开设第二通光孔;第一通光孔、第二通光孔和进光孔在摄像头模组的光轴方向上排布,第一通光孔在垂直于光轴方向的面上的正投影和第二通光孔在垂直于光轴方向的面上的正投影均位于进光孔的正投影内。

Description

电子设备
相关申请的交叉引用
本申请主张在2019年11月18日在中国提交的中国专利申请号No.201911130039.4的优先权,其全部内容通过引用包含于此。
技术领域
本发明涉及通信设备技术领域,尤其涉及一种电子设备。
背景技术
智能手机、平板电脑等电子设备已经成为人们生活中不可或缺的产品,电子设备的屏占比是影响用户体验的重要因素之一,因此如何提高电子设备的屏占比已经成为本领域技术人员重点关注的设计方向。
现有的电子设备为了提升屏占比,可以将摄像头模组设置于显示模组的下方,显示模组上开设通光孔,以保证摄像头模组可以正常工作。摄像头模组主要包括支架、镜片组件、遮光层等器件,镜片组件安装于支架内,遮光层安装在支架上,且遮光层位于镜片组件的上方。
由于遮光层与显示模组之间存在一定的距离,因此显示模组上开设的通光孔需要大于遮光层的内径。同时,显示模组和摄像头模组之间存在装配误差,所以在显示模组上开孔时,需要考虑这一装配误差而将通光孔的尺寸进一步扩大。因此,现有的显示模组上开设的通光孔比较大,导致电子设备的屏占比比较小。
发明内容
本发明公开一种电子设备,以解决电子设备的屏占比比较小的问题。
为了解决上述问题,本发明采用下述技术方案:
一种电子设备,包括:
显示模组,所述显示模组包括第一基板、第二基板和走线结构,所述第一基板和所述第二基板层叠设置,所述走线结构设置于所述第二基板朝向所 述第一基板的一侧表面,所述走线结构开设第一通光孔;
摄像头模组,所述摄像头模组包括摄像头本体和遮光层,所述摄像头本体开设进光孔,所述第二基板位于所述第一基板和所述摄像头本体之间,所述遮光层设置于所述第一基板背离所述第二基板的一侧表面,所述遮光层开设第二通光孔;
所述第一通光孔、所述第二通光孔和所述进光孔在所述摄像头模组的光轴方向上排布,所述第一通光孔和所述第二通光孔在垂直于所述光轴方向的面上的正投影均位于所述进光孔在垂直于所述光轴方向的面上的正投影内。
本发明采用的技术方案能够达到以下有益效果:
本发明公开的电子设备中,摄像头模组的遮光层设置于第一基板背离第二基板的一侧表面,这样设计一方面使得遮光层与显示模组之间的距离几乎为零,因此第一通光孔可以更小;另一方面,显示模组和遮光层之间不存在装配误差,因此开设第一通光孔时不需要考虑该装配误差,第一通光孔的尺寸可以进一步缩小,使得电子设备的屏占比更高。
附图说明
此处所说明的附图用来提供对本发明的进一步理解,构成本发明的一部分,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:
图1为本发明实施例公开的电子设备的部分结构的剖视图。
附图标记说明:
100-显示模组、110-第一基板、120-第二基板、130-走线结构、140-发光部、150-透光盖板、160-光学胶、170-偏光片、180-泡棉、200-摄像头模组、210-摄像头本体、211-进光孔、212-支架、213-感光芯片、220-遮光层。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中 的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
以下结合附图,详细说明本发明各个实施例公开的技术方案。
如图1所示,本发明实施例公开一种电子设备,其具体可以包括显示模组100和摄像头模组200。
显示模组100具体可以包括第一基板110、第二基板120和走线结构130,其中,第一基板110和第二基板120层叠设置,走线结构130设置于第二基板120朝向第一基板110的一侧表面。第一基板110和第二基板120均可以为玻璃板,第二基板120上可以设置薄膜晶体管。走线结构130可以是环形结构,该走线结构130开设第一通光孔,该第一通光孔可供光线穿过,以使得外部环境中的光线可以进入摄像头模组200。显示模组100还可以包括发光部140、透光盖板150、光学胶160、偏光片170和泡棉180,其中:发光部140可以设置于第一基板110和第二基板120之间,该发光部140可以是有机发光层;偏光片170可以设置于第一基板110背离第二基板120的一侧表面;透光盖板150位于第一基板110背离第二基板120的一侧,透光盖板150可以通过光学胶160与偏光片170连接;泡棉180可以设置于第二基板120背离第一基板110的一侧,该泡棉180可以与第二基板120粘接,其上可以开设避让孔,摄像头模组200的至少一部分可以位于该避让孔内,从而防止显示模组100中的杂光影响摄像头模组200的正常工作,同时可以减小摄像头模组200占用的空间,从而减小电子设备的厚度。
摄像头模组200具体可以包括摄像头本体210和遮光层220,摄像头本体210开设进光孔211,第二基板120位于第一基板110和摄像头本体210之间,遮光层220设置于第一基板110背离第二基板120的一侧表面上,遮光层220开设第二通光孔。摄像头本体210具体可以包括支架212、镜片组件和感光芯片213,镜片组件设置于支架212上,该镜片组件可以包括凸透镜、凹透镜等镜片,以实现光线的汇聚等效果;感光芯片213可以设置于支架212内,该感光芯片213具有用于感光的感光区域,该感光芯片213可以将光信号转换为电信号,从而得到对应的图像信息。这里的第二通光孔同样可供光线穿过,以使得外部环境中的光线可以进入摄像头模组200内并到达感光芯 片213的感光区域,从而实现拍摄功能。
上述走线结构130和遮光层220均可以起到遮光的作用,上述第一通光孔、第二通光孔和进光孔211在摄像头模组200的光轴方向上排布,因此外部环境中的光线可以依次穿过第二通光孔和第一通光孔,最终通过进光孔211进入摄像头模组200内,使得摄像头模组200可以实现拍摄功能。第一通光孔在垂直于摄像头模组200的光轴方向的面上的正投影和第二通光孔在垂直于该光轴方向的面上的正投影均位于进光孔211在垂直于该光轴方向的面上的正投影内。也就是说,在摄像头模组200的光轴方向上观察时,第一通光孔的轮廓尺寸和第二通光孔的轮廓尺寸均小于进光孔211的轮廓尺寸。进光孔211的尺寸稍大一些,这样设置既不会影响显示模组100的屏占比,又可以保证外部环境的中的光线尽量多地进入摄像头模组200内。而第一通光孔和第二通光孔会对显示模组100的屏占比产生影响,因此在满足摄像头模组200的拍摄要求的前提下,可以尽量将第一通光孔和第二通光孔设置得小一些,以此降低走线结构130和遮光层220对显示区域的占用率,达到提升电子设备的屏占比的目的。
上述电子设备中,摄像头模组200的遮光层220设置于显示模组100上,这样设计一方面使得遮光层220与显示模组100之间的距离几乎为零,因此第一通光孔可以更小;另一方面,显示模组100和遮光层220之间不存在装配误差,因此开设第一通光孔时不需要考虑该装配误差,第一通光孔的尺寸可以进一步缩小,使得电子设备的屏占比更高。同时,第一通光孔的尺寸减小后,电子设备的外观质感有所提升,用户体验感随之得到改善。
一种可选的实施例中,遮光层220的至少一部分可以位于第一基板110与偏光片170之间。也就是说,遮光层220、第一基板110和偏光片170可以层叠设置,此时,遮光层220、第一基板110和偏光片170的位置相对比较独立,因此更便于成型该显示模组100。
另一种可选的实施例中,偏光片170开设有第三通光孔,遮光层220位于该第三通光孔内。该第三通光孔可供光线穿过,从而提升摄像头模组200所对应区域的透光率,从而改善摄像头模组200的拍摄质量。此时,光学胶160的一部分可以延伸至第三通光孔内,从而填充该第三通光孔中除去遮光层220 的部分的空间,因此光学胶160的该部分可以与第一基板110背离第二基板120的一侧表面接触,从而与第一基板110连接,使得显示模组100的结构强度更高。更为重要的是,采用该结构时,遮光层220可以利用偏光片170所占用的空间来设置,因此该遮光层220不会额外占用空间,使得整个显示模组100的厚度更小;另外,偏光片170未开孔的部分具有一定的遮光效果,因此在摄像头模组200的光轴方向上观察时,遮光层220和偏光片170可以形成无缝对接的遮光结构,因此遮光层220的尺寸更小,从而降低遮光层220的制造成本。
进一步地,上述遮光层220可以与第三通光孔的内壁接触。相比于遮光层220与第三通光孔的内壁之间存在一定间隔的方案,遮光层220与第三通光孔的内壁接触时,在加工显示模组100的过程中,遮光层220和偏光片170的位置可以相互参考,从而便于实现显示模组100的快速成型,以提升显示模组的成型效率。
如前所述,第一通光孔和第二通光孔对显示模组100的屏占比会产生影响,因此第一通光孔和第二通光孔可以尽量设置得小一些。一种可选的实施例中,第一通光孔在垂直于摄像头模组200的光轴方向的面上的正投影与第二通光孔在垂直于该光轴方向的面上的正投影可以重合。换言之,第一通光孔的形状和第二通光孔的形状相同,且两者的尺寸相等。如此设置可以使得第一通光孔和第二通光孔的尺寸都尽量小,同时还可以在成型显示模组100时使得两者的相对位置可以互相参考,从而更便于加工显示模组100。
本发明实施例中,走线结构130和遮光层220的外轮廓形状可以灵活设置,例如该外轮廓形状可以是矩形、圆形、椭圆形,同时,第一通光孔和第二通光孔的形状也可以灵活选择,例如可以是矩形孔、圆孔、椭圆形孔等。可选的实施例中,考虑到摄像头模组200的视场范围的形状通常为圆形,因此为了适配摄像头模组200,从而进一步提升电子设备的屏占比,可以将走线结构130和遮光层220均设置为圆环形结构,此时遮光层220的径向宽度可以小于走线结构130的径向宽度,从而防止遮光层220的径向宽度过大而导致遮光面积过大的情况,进而达到前述目的。
参考图1所示,H=A+D*2,其中:H为显示模组100的外观面上无法用 于显示的孔的尺寸,A为第二通光孔的孔径(或者是第一通光孔的孔径),D为走线结构130的宽度。由于摄像头模组200的视场角β是定值,因此A基本为定值,同时D基本也是定值。此时,H的大小不受装配误差等因素的影响,因此H可以设置得更小。
为了改善摄像头模组200的拍摄效果,可以使摄像头本体210的焦点与遮光层220在前述光轴方向上的距离为预设值。也就是说,当遮光层220的位置发生变化时,摄像头本体210的位置随之发生变化,以保证摄像头本体210的焦点与遮光层220保持相互匹配的位置,从而达到改善拍摄效果的目的。本发明实施例中,由于遮光层220上移至显示模组100中,因此摄像头本体210与显示模组100之间的距离可以进一步缩小,使得显示模组100和摄像头模组200的分布更加紧凑,从而更有利于电子设备内零部件的堆叠。
上述遮光层220的成型方式有多种实施方案,一种可选的实施例中,可以采用镀膜工艺成型遮光层220,也就是说,遮光层220可以为镀膜结构,此种镀膜结构便于成型,且所形成的遮光层220的厚度较小,从而更有利于控制电子设备的厚度。具体地,由于遮光层220设置于第一基板110背离第二基板120的一侧表面上,而第一基板110朝向第二基板120的一侧表面上可能还需要通过蒸镀工艺设置其他结构,因此可以在实施蒸镀工艺以及第一基板110和第二基板120贴合的工艺之后再镀遮光层220,也可以先镀遮光层220,再实施蒸镀工艺以及第一基板110和第二基板120贴合的工艺。采用前一种实施方式时,需要对应增加防止第一基板110和第二基板120被划伤的保护措施。当然,遮光层220也可以采用其他工艺制成,例如可以是印刷工艺,使得遮光层220为印刷结构。
在装配电子设备时,可以通过电荷耦合器件(Charge-coupled Device,CCD)相机精确定位、微型马达驱动摄像头模组200动态调整对位等方式实现遮光层220与摄像头本体210之间的对位固定,从而使得遮光层220与摄像头本体210的相对位置精度更高,既保证摄像头模组200的成像效果,又无需考虑对位误差而增大第一通光孔的尺寸,从而可以提升电子设备的屏占比。
本发明实施例所公开的电子设备可以为智能手机、平板电脑、电子书阅读器或可穿戴设备。当然,该电子设备也可以是其他设备,本发明实施例对 此不做限制。
本发明上文实施例中重点描述的是各个实施例之间的不同,各个实施例之间不同的优化特征只要不矛盾,均可以组合形成更优的实施例,考虑到行文简洁,在此则不再赘述。
以上所述仅为本发明的实施例而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等,均应包含在本发明的权利要求范围之内。

Claims (8)

  1. 一种电子设备,包括:
    显示模组(100),所述显示模组(100)包括第一基板(110)、第二基板(120)和走线结构(130),所述第一基板(110)和所述第二基板(120)层叠设置,所述走线结构(130)设置于所述第二基板(120)朝向所述第一基板(110)的一侧表面,所述走线结构(130)开设第一通光孔;
    摄像头模组(200),所述摄像头模组(200)包括摄像头本体(210)和遮光层(220),所述摄像头本体(210)开设进光孔(211),所述第二基板(120)位于所述第一基板(110)和所述摄像头本体(210)之间,所述遮光层(220)设置于所述第一基板(110)背离所述第二基板(120)的一侧表面,所述遮光层(220)开设第二通光孔;
    所述第一通光孔、所述第二通光孔和所述进光孔(211)在所述摄像头模组(200)的光轴方向上排布,所述第一通光孔和所述第二通光孔在垂直于所述光轴方向的面上的正投影均位于所述进光孔(211)在垂直于所述光轴方向的面上的正投影内。
  2. 根据权利要求1所述的电子设备,其中,所述显示模组(100)还包括偏光片(170),所述偏光片(170)设置于所述第一基板(110)背离所述第二基板(120)的一侧表面,所述遮光层(220)的至少一部分位于所述第一基板(110)与所述偏光片(170)之间。
  3. 根据权利要求1所述的电子设备,其中,所述显示模组(100)还包括偏光片(170),所述偏光片(170)设置于所述第一基板(110)背离所述第二基板(120)的一侧表面,所述偏光片(170)开设有第三通光孔,所述遮光层(220)位于所述第三通光孔内。
  4. 根据权利要求3所述的电子设备,其中,所述遮光层(220)与所述第三通光孔的内壁接触。
  5. 根据权利要求1所述的电子设备,其中,所述第一通光孔在垂直于所述光轴方向的面上的正投影与所述第二通光孔在垂直于所述光轴方向的面上的正投影重合。
  6. 根据权利要求1所述的电子设备,其中,所述走线结构(130)和所述遮光层(220)均为圆环形结构,所述遮光层(220)的径向宽度小于所述走线结构(130)的径向宽度。
  7. 根据权利要求1所述的电子设备,其中,所述摄像头本体(210)的焦点与所述遮光层(220)在所述光轴方向上的距离为预设值。
  8. 根据权利要求1所述的电子设备,其中,所述遮光层(220)为镀膜结构。
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