WO2021098625A1 - 一种发声装置单体及电子设备 - Google Patents

一种发声装置单体及电子设备 Download PDF

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Publication number
WO2021098625A1
WO2021098625A1 PCT/CN2020/128905 CN2020128905W WO2021098625A1 WO 2021098625 A1 WO2021098625 A1 WO 2021098625A1 CN 2020128905 W CN2020128905 W CN 2020128905W WO 2021098625 A1 WO2021098625 A1 WO 2021098625A1
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WIPO (PCT)
Prior art keywords
pad
housing
diaphragm
melting point
voice coil
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PCT/CN2020/128905
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English (en)
French (fr)
Inventor
唐长超
刘华伟
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歌尔股份有限公司
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021098625A1 publication Critical patent/WO2021098625A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion devices, and more specifically, to a single sound generating device and electronic equipment.
  • the sound generating device is an important acoustic component in electronic equipment, which is a transducer device that converts electrical signals into acoustic signals.
  • the generator unit generally includes a housing and a magnetic circuit system and a vibration system arranged in the housing.
  • the diaphragm is an important part of the vibration system and the main component of vibration and sound. The diaphragm needs to be fixedly connected to the housing.
  • the connection between the diaphragm and the housing mainly includes glue bonding and laser welding.
  • glue bonding is relatively narrower than that of coated tape, and the glue can not guarantee good sealing performance.
  • the melting point of the shell material should not be too high, so that the pad connecting the centering support piece and the shell, that is, the first one It is easy to damage the shell when the chip pad and the shell are welded, and the shell will be deformed after welding.
  • An object of the present invention is to provide a new technical solution for a single sound device and electronic equipment.
  • a single sound generating device including:
  • a housing, the housing is made of a first material
  • a vibration system the vibration system includes a voice coil and a diaphragm, and the edge of the diaphragm is fixedly connected to the housing by means of laser fusion welding;
  • the pad assembly is arranged on the housing, the pad assembly includes a base body and a pad body, the pad body is injection molded on the base body, the base body is made of a second material, and the first The melting point of the material is lower than the melting point of the second material; the vibration system has an electrical connection point, and the electrical connection point is welded to the pad assembly.
  • the vibration system further includes a centering support plate, the center area of the diaphragm and the voice coil are connected to the center area of the centering support plate, and the edge of the centering support plate is fixedly connected to the housing,
  • the edge of the centering support piece is provided with a first support piece pad;
  • the pad assembly is arranged on the housing at a position corresponding to the first support piece pad, and the first support piece pad is connected to the The pad body is welded and connected.
  • the centering branch has a signal trace
  • the voice coil is electrically connected to the signal trace
  • the first branch pad is electrically connected to the signal trace
  • the The through hole of the centering support piece is sleeved and connected to the outside of the voice coil, and the voice coil is connected to the pad assembly through the signal wiring.
  • the first material is a PC material
  • the second material is a PPA material
  • the melting point of the diaphragm is higher than the melting point of the PC material and lower than the melting point of the PPA material.
  • the pad assembly and the shell are injection molded.
  • the housing is rectangular, and the at least two pad components are located at two vertex corners of the housing along the length direction, or the at least two pad components are located at two vertex corners of the housing along the width direction. Location.
  • At least two pad components are provided.
  • the first branch pad and the pad body are welded by laser fusion.
  • an electronic device which includes the above-mentioned sound emitting device monomer.
  • a pad assembly is provided on the shell, wherein the shell is made of a first material, and the welding assembly is composed of a base of the second material and a pad body injection molded on the base.
  • the melting point of the first material is lower than The melting point of the second material; since other components of the sound device, such as the voice coil lead, are welded to the pad assembly, the housing will not be damaged during welding, and will not cause the housing to flash and deform.
  • Fig. 1 is a schematic diagram of an exploded structure of a single unit of a sound generating device of the present invention
  • Figure 2 is a schematic diagram of the overall structure of a single unit of a sound generating device of the present invention
  • FIG. 3 is a schematic diagram of the structure of a pad assembly in a single unit of a sound generating device of the present invention
  • FIG. 4 is a schematic diagram of the connection between the bonding pad assembly and the bonding pad of the first support piece in a single sounding device of the present invention.
  • the embodiment of the present invention provides a single unit of a sound emitting device
  • the single unit of the sound emitting device includes: a housing 1, a vibration system, and a pad assembly 2, and the housing 1 is made of a first material
  • the vibration system includes a voice coil and a diaphragm 3, the edge of the diaphragm 3 is fixedly connected to the housing 1 by means of laser fusion welding; the pad assembly is provided on the housing 1, as shown in FIG. 3,
  • the pad assembly includes a base 21 and a pad body 22.
  • the pad body 22 is injection molded on the base 21.
  • the base 21 is made of a second material, and the melting point of the first material is lower than that of the second material. The melting point of the material; the vibration system has an electrical connection point, and the electrical connection point is soldered to the pad assembly.
  • the electrical connection point of the vibration system is welded to the pad assembly, and the second material of the base 21 of the pad assembly has a higher melting point than the first material forming the housing 1, if the electrical connection point of the vibration system is directly welded to the housing 1.
  • the casing 1 may be damaged, but after the soldering pad component is set on the casing 1, the electrical connection point of the vibration system is soldered to the soldering pad component, so the casing will not be damaged during welding, and the casing will not be deformed by flashing.
  • the first material is a PC material
  • the second material is a PPA material, that is, a metal pad body 22 is injection molded on a PPA material base 21.
  • the Chinese name of PPA material is polyphthalamide resin, which is a semi-aromatic polyamide made of terephthalic acid or isophthalic acid.
  • PPA has both semi-crystalline and non-crystalline, and its glass transition temperature is around 255°F.
  • Amorphous PPA is mainly used for occasions requiring barrier properties; semi-crystalline PPA resin is mainly used for injection molding, but also for other melt processing processes.
  • the embodiments provided by the present invention mainly involve the latter-semi-crystalline PPA resin.
  • the melting point of semi-crystalline PPAS is about 590°F.
  • the pad body 22 is first injected into the PPA material.
  • a pad assembly 2 is formed on the base 21, and the pad assembly 2 is arranged between the housing 1 and the edge of the centering support piece 4. Specifically, the first pad 6 of the centering support piece 4 is welded to the pad assembly 2 Connection, so as to ensure that the shell 1 will not be damaged during welding, and will not cause the shell 1 to overflow and deform.
  • the integral injection molding of the pad body 22 and the base 21 can ensure the reliable and firmness of the connection between the pad body 22 and the base 21.
  • the vibration system further includes a centering support plate 4, the center area of the diaphragm 3 and the voice coil are connected to the center area of the centering support plate 4, and the edge of the centering support plate 4 It is fixedly connected to the housing 1, and a first support pad 6 is provided on the edge of the centering support piece 4; the pad assembly is provided on the housing 1 corresponding to the first support pad 6 Position, the first branch pad 6 is connected to the pad body 22 by welding. Specifically, referring to FIG. 4, a first support pad 6 is provided between the pad assembly 2 and the centering support sheet 4, and the first support sheet pad 6 is connected to the pad of the pad assembly 2. The body 22 is welded and connected.
  • the central area of the diaphragm 3 and the voice coil are connected to the central area of the centering support piece 4, and the edges of the diaphragm 3 and the centering support piece 4 are both fixedly connected to the housing 1 on;
  • the diaphragm 3 is a ring structure, the diaphragm 3 includes a central portion, a folding ring portion surrounding the central portion, and a fixed portion surrounding the folding ring portion.
  • the central area of the diaphragm 3 refers to the diaphragm
  • the central part of 3 and the edge where the diaphragm 3 is fixedly connected to the housing 1 generally refers to the outermost fixed part of the diaphragm 3.
  • the centering support piece 4 is also a ring structure.
  • the centering support piece 4 includes a center portion, a wave-shaped vibration pattern portion arranged around the center portion, and an edge portion provided around the wave-shaped vibration pattern portion.
  • the central area of 4 is the central part of the designated core piece 4, and the edge of the centering piece 4 fixedly connected to the housing 1 is generally the outermost edge of the centering piece 4.
  • the voice coil includes a voice coil main body and a voice coil lead connected to the voice coil main body, the centering support piece 4 has signal wiring, and the center area of the centering support piece 4 is provided with
  • the second leg pad is electrically connected to the signal trace, one end of the voice coil lead is wound on the voice coil main body, and the other end of the voice coil lead is welded to the second leg
  • the first branch pad 6 is also electrically connected to the signal trace, the through hole of the centering support sheet 4 is sleeved and connected to the outside of the voice coil main body, and the sound
  • the loop lead is welded and conducted to the pad body 22 through the second branch pad, the signal wiring, and the first branch pad 6.
  • the centering support piece 4 includes an insulating substrate layer and a conductive layer for electrical conduction; the material of the insulating substrate layer is a polyimide film; the material of the conductive layer is copper Foil, the voice coil is electrically connected to an external circuit through the conductive layer of the centering support piece 4.
  • the insulating substrate layer of the centering support piece 4 is not limited to the above-mentioned polyimide film, and other polymer material films other than polyimide can also be selected, and the conductive layer is not limited to the above-mentioned copper foil. It can be other metal layers or graphene conductive layers, etc., and the specific materials are not limited.
  • the pad body 22 is injection-molded at the middle position of the base body 21, so that the positioning of the first pad pad 6 is facilitated when the first pad pad 6 is welded; and because the pad body The periphery of 22 is surrounded by the base body 21 made of PPA material, so it can be ensured that when the first brace pad 6 is welded, the soldering tin will not easily overflow onto the housing 1 when it overflows to the periphery.
  • the housing 1 is made of PC material, and the melting point of the diaphragm 3 is higher than the melting point of the PC material and lower than the melting point of the PPA material.
  • the diaphragm 3 and the housing 1 and the first pad 6 and the pad body 22 are welded by laser fusion.
  • shell materials PPA and PC:
  • PPA shells because the melting point of PPA material is higher than the melting point of the diaphragm, it is very easy to damage the diaphragm and the case when laser welding is performed.
  • Diaphragm resulting in the unreliable welding state of the diaphragm; for the PC material case, although the melting point of the PC material is lower than the melting point of the diaphragm, a good welding state can be achieved when the diaphragm and the case are laser welded, but due to the fixed connection The melting point of the pad of the core support piece 4 and the shell is higher than that of the PC material, so it is easy to cause the sound of the PC shell to be deformed during welding.
  • the housing 1 is designed as a PC material housing, in which the melting point of the diaphragm 3 is higher than the melting point of the PC material and lower than the melting point of the PPA material, which can ensure that the diaphragm and the housing 1 perform laser A good welding state can be achieved during welding; at the same time, the first support pad 6 is welded on the housing 1 through the pad assembly 2.
  • the pad assembly 2 is made of a base 21 made of PPA material with a higher melting point and an injection molded on the base 21
  • the pad body 22 is composed of, and the first branch pad 6 is specifically welded to the pad body 22.
  • the pad assembly 2 and the housing 1 are injection molded.
  • the pad assembly 2 is directly injection-molded on the housing 1.
  • the injection molding method can ensure the fastening reliability of the connection between the pad assembly 2 and the housing 1, and welding
  • the disk assembly 2 is basically flush with the surface of the housing 1 instead of protruding from the surface of the housing 1, so that the size of the housing 1 and the assembly requirements of the housing 1 will not be affected due to the provision of the pad assembly 2.
  • the housing 1 is rectangular, the pad components 2 are provided with at least two, and the at least two pad components 2 are located at two vertex positions along the length of the housing 1, or At least two pad assemblies 2 are located at two vertex positions of the housing 1 in the width direction.
  • two separate pad assemblies 2 may be respectively arranged at two vertex positions along the length of the housing 1; or two separate pad assemblies 2 may be respectively arranged on the housing 1 At the two corner positions along the width direction; or it can also be a land assembly in which two land assemblies 2 are connected as a whole by a connecting part, when the integral land assembly is set on the housing 1 , The two pad assemblies 2 at both ends are respectively located at two vertex positions of the casing 1 along the length direction or respectively located at two vertex positions of the casing 1 along the width direction.
  • the number of pad components 2 can also be three or four. If three pad components 2 are provided, then the three pad components 2 are located in the three parts of the housing 1. At the top corner position; if four pad components 2 are provided, the four pad components 2 are located at the four top corner positions of the housing 1 respectively.
  • the edge of the centering support piece 4 and the housing 1 are connected by an adhesive. Specifically, the periphery of the outermost edge of the centering support piece 4 and the housing 1 are bonded together with an adhesive.
  • the first branch pad 6 is connected to the pad body 22 by welding.
  • the first pad 6 and the pad body 22 are welded and electrically connected, and are used for welding leads to realize electrical connection; one of the two pad bodies 22 is a positive electrode and the other is a negative electrode.
  • the sound device unit further includes a magnetic conductive plate 5, the magnetic conductive plate 5 has a ring structure, and the magnetic conductive plate 5 is disposed on the surface of the casing opposite to the diaphragm 3. That is, on the two opposite surfaces of the housing 1, one surface is connected to the diaphragm 3, and the other surface is connected to the magnetic conductive plate 5.
  • the magnetic conductive plate is generally divided into a central magnetic conductive plate and a side magnetic conductive plate.
  • the magnetic conductive plate 5 is specifically a side magnetic conductive plate.
  • the magnetic conductive plate 5 forms an outer surface with the voice coil.
  • the magnetic gap and the magnetic conductive plate 5 can also support and strengthen the shell, increasing the shell's ability to be lower than the impact of external force.
  • An embodiment of the present invention provides a single sound generating device, which includes the housing 1 as described above.
  • the shell 1 and the front cover combined with the shell 1 belong to an auxiliary system.
  • the front cover is provided with a sound hole, or the sound hole is formed between the front cover and the shell 1, which is enclosed by the front cover and the shell 1.
  • the cavity contains a vibration system and a magnetic circuit system;
  • the magnetic circuit system includes, for example, a basin frame fixedly connected to the housing 1, a central magnet fixedly connected to the bottom of the basin frame, and a central magnetic conductor fixedly connected to the central magnet
  • the plate further includes a magnetic conductive plate 5 which is a side magnetic conductive plate connected to the housing 1, and a magnetic gap for the voice coil is formed between the side wall of the basin frame and the central magnet.
  • the vibration system mainly includes a voice coil arranged in the above-mentioned magnetic gap and a diaphragm fixedly connected to the voice coil, wherein the diaphragm is fixedly connected to the housing 1 through a fixed portion on the outer peripheral edge, thereby connecting the cavity of the electroacoustic transducer It is divided into a rear acoustic cavity with a voice coil and a front acoustic cavity communicating with the sound hole.
  • the working principle of the electroacoustic converter is: when the voice coil receives an audio signal, it will vibrate under the action of the magnetic circuit system, and then drive the diaphragm to vibrate and inspire the surrounding air to sound through the front acoustic cavity.
  • An embodiment of the present invention also provides an electronic device, which includes the above-mentioned sound emitting device monomer.
  • the electronic device may be a mobile phone, a computer, a smart wearable device, and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开了一种发声装置单体及电子设备，该发声装置单体包括外外壳、振动系统及焊盘组件，所述外壳采用第一材料制成；所述振动系统包括音圈及振膜，所述振膜的边缘通过激光熔融焊接的方式固定连接在外壳上；所述焊盘组件设置在外壳上，所述焊盘组件包括基体与焊盘本体，所述焊盘本体注塑在基体上，所述基体采用第二材料制成，所述第一材料的熔点低于所述第二材料的熔点；所述振动系统具有电连接点，所述电连接点与焊盘组件焊接。

Description

一种发声装置单体及电子设备 技术领域
本发明涉及电声转换装置技术领域，更具体地，涉及一种发声装置单体及电子设备。
背景技术
发声装置是电子设备中的重要声学部件，其为一种把电信号转变为声信号的换能器件。发生装置单体一般包括外壳以及设置在外壳内的磁路系统及振动系统，振膜是振动系统的重要组成部分，是振动发声的主要元件，振膜需要与外壳固定连接。
目前，振膜与外壳的连接主要有胶水粘接以及激光熔接两种方式。其中，胶水粘接的方式相对于涂胶带较窄的外壳，则涂胶无法保证良好的密封性。而对于激光熔接的方案，为了保证振膜与外壳的熔接状态牢固可靠能够满足客户防水的要求，外壳材质的熔点不能过高，这样在连接定心支片与外壳的焊盘，即第一支片焊盘与外壳进行焊接时很容易损伤外壳，焊接后会导致外壳溢料变形。
有鉴于此，需要提供一种新的技术方案以解决上述技术问题。
发明内容
本发明的一个目的是提供一种发声装置单体及电子设备的新技术方案。
根据本发明的第一方面，提供了一种发声装置单体，包括：
外壳，所述外壳采用第一材料制成；
振动系统，所述振动系统包括音圈及振膜，所述振膜的边缘通过激光 熔融焊接的方式固定连接在外壳上；
焊盘组件，所述焊盘组件设置在外壳上，所述焊盘组件包括基体与焊盘本体，所述焊盘本体注塑在基体上，所述基体采用第二材料制成，所述第一材料的熔点低于所述第二材料的熔点；；所述振动系统具有电连接点，所述电连接点与焊盘组件焊接。
可选地，所述振动系统还包括定心支片，所述振膜的中心区域和音圈连接在所述定心支片的中心区域，所述定心支片的边缘固定连接在外壳上，所述定心支片的边缘上设置有第一支片焊盘；所述焊盘组件设置在所述外壳上与第一支片焊盘相对应的位置，所述第一支片焊盘与所述焊盘本体焊接连接。
可选地，所述定心支片内具有信号走线，所述音圈与所述信号走线形成电连接，所述第一支片焊盘与所述信号走线形成电连接，所述定心支片的通孔套设连接于所述音圈的外部，所述音圈通过所述信号走线与所述焊盘组件导通。
可选地，所述第一材料为PC材质，所述第二材料为PPA材质。
可选地，所述振膜的熔点高于PC材质的熔点且低于PPA材质的熔点。
可选地，所述焊盘组件与外壳注塑成型。
可选地，所述外壳为矩形，所述至少两个焊盘组件位于外壳沿长度方向的两个顶角位置处，或者所述至少两个焊盘组件位于外壳沿宽度方向的两个顶角位置处。
可选地，所述焊盘组件至少设置两个。
可选地，所述第一支片焊盘与所述焊盘本体之间通过激光熔融焊接。
根据本发明的另一方面，还提供了一种电子设备，其包括如上所述的发声装置单体。
本发明通过在外壳上设置焊盘组件，其中所述外壳采用第一材料制成，所述焊接组件由第二材料的基体及注塑在基体上的焊盘本体组成，第一材 料的熔点低于所述第二材料的熔点；由于发声装置单体的其他部件例如音圈引线是与焊盘组件焊接，因此在焊接时不会损伤外壳，不会导致外壳溢料变形。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1为本发明一种发声装置单体的分解结构示意图；
图2为本发明一种发声装置单体的整体结构示意图；
图3为本发明一种发声装置单体中焊盘组件的结构示意图；
图4为本发明一种发声装置单体中焊盘组件与第一支片焊盘的连接示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1、图2所示，本发明实施例提供了一种发声装置单体，该发声装置单体包括：外壳1、振动系统及焊盘组件2，所述外壳1采用第一材料制成；所述振动系统包括音圈及振膜3，所述振膜3的边缘通过激光熔融焊接的方式固定连接在外壳1上；所述焊盘组件设置在外壳1上，参考图3所示，所述焊盘组件包括基体21与焊盘本体22，所述焊盘本体22注塑在基体21上，所述基体21采用第二材料制成，所述第一材料的熔点低于所述第二材料的熔点；所述振动系统具有电连接点，所述电连接点与焊盘组件焊接。
由于振动系统的电连接点是与焊盘组件焊接，而组成焊盘组件的基体21的第二材料比形成外壳1的第一材料熔点高，如果振动系统的电连接点是直接与外壳1焊接则可能会损伤外壳1，但是在外壳1上设置焊盘组件后，振动系统的电连接点是与焊盘组件焊接，因此在焊接时不会损伤外壳，不会导致外壳溢料变形。
在一个实施例中，所述第一材料为PC材质，所述第二材料为PPA材质，即在PPA材质的基体21上注塑成型金属材质的焊盘本体22。PPA材质的中文名称为聚邻苯二甲酰胺树脂，其是以对苯二甲酸或间苯二甲酸为原料的半芳香族聚酰胺。PPA既有半结晶态的，也有非结晶态的，其玻璃化温度在255°F左右。非结晶态的PPA主要用于要求阻隔性能的场合；半结晶态的PPA树脂主要用于注塑加工，也用于其它熔融加工工艺。本发明提供的实施例中主要涉及后者——半结晶态PPA树脂，半结晶态PPAS的熔点约为590°F，由于PPA的熔点较高，因此将焊盘本体22首先注塑在PPA材质的基体21上构成焊盘组件2，焊盘组件2设置在外壳1与定心支片4的边缘之间，具体是将定心支片4的第一支片焊盘6与焊盘组件2 焊接连接，这样能够确保在焊接时不会损伤外壳1，不会导致外壳1溢料变形。焊盘本体22与基体21注塑成型为一体能够保证焊盘本体22与基体21连接的可靠牢固性。
在一个实施例中，所述振动系统还包括定心支片4，所述振膜3的中心区域和音圈连接在所述定心支片4的中心区域，所述定心支片4的边缘固定连接在外壳1上，所述定心支片4的边缘上设置有第一支片焊盘6；所述焊盘组件设置在所述外壳1上与第一支片焊盘6相对应的位置，所述第一支片焊盘6与所述焊盘本体22焊接连接。具体地，参考图4所示，所述焊盘组件2与定心支片4之间设置有第一支片焊盘6，所述第一支片焊盘6与焊盘组件2的焊盘本体22焊接连接。
可以理解的是，所述振膜3的中心区域和音圈连接在所述定心支片4的中心区域，所述振膜3的边缘及所述定心支片4的边缘均固定连接在外壳1上；所述振膜3为环状结构，所述振膜3包括中心部、围绕中心部设置的折环部以及围绕折环部设置的固定部，振膜3的中心区域是指振膜3的中心部，振膜3与外壳1固定连接的边缘一般是指振膜3最外围的固定部。所述定心支片4也为环状结构，所述定心支片4包括中心部、围绕中心部设置的波浪形振纹部以及围绕波浪形振纹部设置的边缘部，定心支片4的中心区域是指定心支片4的中心部，定心支片4与外壳1固定连接的边缘一般是定心支片4最外围的边缘部。
在一个实施例中，所述音圈包括音圈主体和与音圈主体连接的音圈引线，所述定心支片4内具有信号走线，所述定心支片4的中心区域设置有第二支片焊盘，所述第二支片焊盘与信号走线形成电连接，所述音圈引线的一端缠绕在音圈主体上，所述音圈引线的另一端焊接在第二支片焊盘上，所述第一支片焊盘6也与所述信号走线形成电连接，所述定心支片4的通孔套设连接于所述音圈主体的外部，所述音圈引线通过第二支片焊盘、信号走线以及第一支片焊盘6与所述焊盘本体22焊接导通。
通常情况下，所述定心支片4包括绝缘基材层以及用于电性导通的导电层；所述绝缘基材层的材料为聚酰亚胺膜；所述导电层的材料为铜箔，音圈通过所述定心支片4的所述导电层与外界电路电连接。定心支片4的绝缘基材层并不限于上述的聚酰亚胺膜，还可以选用除聚酰亚胺之外的其他高分子材料膜，而导电层也不限于上述的铜箔，还可以是其他的金属层或者石墨烯导电层等，具体材料不受限制。
在一个可选的实施例中，焊盘本体22注塑成型在基体21的中部位置处，这样在焊接第一支片焊盘6时便于第一支片焊盘6的定位；并且由于焊盘本体22的四周被PPA材质的基体21所环绕，因此能够保证在焊接第一支片焊盘6时，焊接熔锡向四周溢出时不容易溢出到外壳1上。
在一个实施例中，所述外壳1为PC材质，所述振膜3的熔点高于PC材质的熔点且低于PPA材质的熔点。所述振膜3与外壳1之间，以及所述第一支片焊盘6与所述焊盘本体22之间通过激光熔融焊接。一般来说，外壳的材质主要有PPA材质及PC材质两种：对于PPA材质的外壳，由于PPA材质的熔点高于振膜的熔点，因此在将振膜与外壳进行激光熔接时，极容易损伤振膜，导致振膜的熔接状态不可靠；对于PC材质的外壳，虽然PC材质的熔点低于振膜的熔点，在振膜与外壳进行激光熔接时能够达到良好的熔接状态，但是由于连接定心支片4与外壳的焊盘的熔点高于PC材质，因此在焊接时容易导致PC材质的外壳发声溢料变形。因此，在本发明的实施例中，将外壳1设计为PC材质的外壳，其中振膜3的熔点高于PC材质的熔点且低于PPA材质的熔点，这样能够确保振膜与外壳1进行激光熔接时能够达到良好的熔接状态；同时在外壳1上通过焊盘组件2来焊接第一支片焊盘6，焊盘组件2由熔点较高的PPA材质的基体21以及注塑在基体21上的焊盘本体22组成，第一支片焊盘6具体是与焊盘本体22焊接，即便焊接熔锡向四周溢出也只会溢出到PPA材质的基体21上，而不容易溢出到外壳1上，因此能够保证在焊接第一支片焊盘6时不会损伤外壳1。
在一个实施例中，所述焊盘组件2与外壳1注塑成型。将焊盘组件2直接注塑成型在外壳1上，相比将单独的焊盘组件2连接到外壳1上，注塑成型的方式能够确保焊盘组件2与外壳1连接的紧固可靠性，并且焊盘组件2基本与外壳1的表面齐平而非凸出于外壳1的表面，这样不会因为设置了焊盘组件2而影响外壳1的尺寸及外壳1的装配要求。
在一个实施例中，所述外壳1为矩形，所述焊盘组件2至少设置两个，所述至少两个焊盘组件2位于外壳1沿长度方向的两个顶角位置处，或者所述至少两个焊盘组件2位于外壳1沿宽度方向的两个顶角位置处。在可选的实施例中，可以是将单独的两个焊盘组件2分别设置在外壳1沿长度方向的两个顶角位置处；或者是将单独的两个焊盘组件2分别设置在外壳1沿宽度方向的两个顶角位置处；或者还可以是两个焊盘组件2之间由连接部连接为一个整体的焊盘组件，在将该整体的焊盘组件设置在外壳1上时，两端的两个焊盘组件2分别位于外壳1沿长度方向的两个顶角位置处或者分别位于外壳1沿宽度方向的两个顶角位置处。当然，在其他可选的实施例中，焊盘组件2的数量还可以是三个或者四个，如果是设置三个焊盘组件2，则三个焊盘组件2分别位于外壳1的三个顶角位置处；如果是设置四个焊盘组件2，则四个焊盘组件2分别位于外壳1的四个顶角位置处。
在一个实施例中，所述定心支片4的边缘与外壳1通过粘接剂连接。具体是将定心支片4最外围的边缘部一周与外壳1通过粘接剂粘接到一起。
在一个实施例中，所述第一支片焊盘6与焊盘本体22焊接连接。第一支片焊盘6与焊盘本体22焊接导通，用于焊接引线实现电连接；两个焊盘本体22一个为正极，另一个为负极。
在一个实施例中，所述发声装置单体还包括导磁板5，所述导磁板5为环状结构，所述导磁板5设置在壳体上与振膜3相对的表面处。即在外壳1相对的两个表面上，一个表面与振膜3连接，另一个表面与导磁板5 连接。导磁板一般分为中心导磁板与边导磁板，在本发明的实施例中，所述导磁板5具体为边导磁板，所述导磁板5一方面与音圈构成外磁间隙，同时导磁板5还可以对外壳起到支撑与加强的作用，增加外壳低于外力冲击的能力。
本发明实施例提供的一种发声装置单体，其包括如上所述的外壳1。其中，外壳1和与外壳1结合在一起的前盖属于辅助系统，前盖上设置有声孔，或者在前盖与外壳1之间形成该声孔，由前盖和外壳1所围合形成的空腔内收容有振动系统和磁路系统；磁路系统例如包括固定连接在外壳1上的盆架、固定连接在盆架的底部上的中心磁铁、及固定连接在中心磁铁上的中心导磁板，还包括与外壳1连接的属于边导磁板的导磁板5，所述盆架的侧壁部与中心磁铁之间形成供音圈置入的磁间隙。振动系统主要包括设置在上述磁间隙中的音圈和与音圈固定连接的振膜，其中，振膜通过其外周边沿的固定部固定连接在外壳1上，进而将电声转换器的空腔分隔为具有音圈的后声腔及与声孔相通的前声腔。基于上述结构，电声转换器的工作原理是：音圈在接收到音频信号时将在磁路系统的作用下振动，进而带动振膜振动而策动周围空气通过前声腔发声。
本发明实施例还提供了一种电子设备，其包括如上所述的发声装置单体。所述电子设备可以是手机、电脑、智能穿戴设备等。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种发声装置单体，其特征在于，包括：
    外壳，所述外壳采用第一材料制成；
    振动系统，所述振动系统包括音圈及振膜，所述振膜的边缘通过激光熔融焊接的方式固定连接在外壳上；
    焊盘组件，所述焊盘组件设置在外壳上，所述焊盘组件包括基体与焊盘本体，所述焊盘本体注塑在基体上，所述基体采用第二材料制成，所述第一材料的熔点低于所述第二材料的熔点；所述振动系统具有电连接点，所述电连接点与焊盘组件焊接。
  2. 根据权利要求1所述的发声装置单体，其特征在于，所述振动系统还包括定心支片，所述振膜的中心区域和音圈连接在所述定心支片的中心区域，所述定心支片的边缘固定连接在外壳上，所述定心支片的边缘上设置有第一支片焊盘；
    所述焊盘组件设置在所述外壳上与第一支片焊盘相对应的位置，所述第一支片焊盘与所述焊盘本体焊接连接。
  3. 根据权利要求2所述的发声装置单体，其特征在于，所述定心支片内具有信号走线，所述音圈与所述信号走线形成电连接，所述第一支片焊盘与所述信号走线形成电连接，所述定心支片的通孔套设连接于所述音圈的外部，所述音圈通过所述信号走线与所述焊盘组件导通。
  4. 根据权利要求1所述的发声装置单体，其特征在于，所述第一材料为PC材质，所述第二材料为PPA材质。
  5. 根据权利要求4所述的发声装置单体，其特征在于，所述振膜的熔点高于PC材质的熔点且低于PPA材质的熔点。
  6. 根据权利要求1所述的发声装置单体，其特征在于，所述焊盘组件与外壳注塑成型。
  7. 根据权利要求1所述的发声装置单体，其特征在于，所述外壳为矩形，所述至少两个焊盘组件位于外壳沿长度方向的两个顶角位置处，或者所述至少两个焊盘组件位于外壳沿宽度方向的两个顶角位置处。
  8. 根据权利要求1-7中任一项所述的发声装置单体，其特征在于，所述焊盘组件至少设置两个。
  9. 根据权利要求1-7中任一项所述的发声装置单体，其特征在于，所述第一支片焊盘与所述焊盘本体之间通过激光熔融焊接。
  10. 一种电子设备，其特征在于，其包括如1-9任一项所述的发声装置单体。
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Publication number Priority date Publication date Assignee Title
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022867A1 (en) * 2012-07-19 2014-01-23 Geospace Technologies, Lp Micro-geophone
CN105992111A (zh) * 2016-05-27 2016-10-05 歌尔股份有限公司 一种扬声器模组
CN110418261A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 发声单体、发声模组及电子终端
CN110418257A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 发声装置
CN110418251A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 一种发声单体、发声模组及电子终端
CN110996232A (zh) * 2019-11-22 2020-04-10 歌尔股份有限公司 一种发声装置单体及电子设备

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961347A (en) * 1987-11-25 1990-10-09 Ishikawajima-Harima Heavy Industries Co., Ltd. Probe for ultrasonic flaw detectors
JP3598564B2 (ja) * 1995-03-16 2004-12-08 富士通株式会社 バンプ形成方法
JP2000208916A (ja) * 1999-01-13 2000-07-28 Victor Co Of Japan Ltd 部品実装基板
JP4923336B2 (ja) * 2001-04-10 2012-04-25 日本電気株式会社 回路基板及び該回路基板を用いた電子機器
CN200944665Y (zh) * 2006-08-26 2007-09-05 潍坊东科电讯有限公司 贴片式驻极体电容传声器
CN101524780A (zh) * 2007-12-25 2009-09-09 陈国伟 一种在炉焊中使壁厚不均匀焊件均匀受热的方法
CN101977339A (zh) * 2010-10-13 2011-02-16 瑞声声学科技(深圳)有限公司 磁框与盆架的固定方法
CN201946393U (zh) * 2010-12-28 2011-08-24 索尔思光电（成都）有限公司 一种绝缘保护垫片及其包含该绝缘保护垫片的光器件
JP6222909B2 (ja) * 2011-10-07 2017-11-01 キヤノン株式会社 積層型半導体装置、プリント回路板、及びプリント配線板の接合構造
CN104364899B (zh) * 2012-06-22 2017-11-24 株式会社村田制作所 电子部件模块
JP5970316B2 (ja) * 2012-09-26 2016-08-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20140047935A (ko) * 2012-10-15 2014-04-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN203674515U (zh) * 2013-11-06 2014-06-25 广德宝达精密电路有限公司 一种印制板导热插座
CN103846541B (zh) * 2014-03-12 2017-05-03 王子延 金属液固态界面热挤压焊接方法
CN104681691A (zh) * 2014-11-14 2015-06-03 易美芯光（北京）科技有限公司 一种低光衰的覆晶封装的led集成光源结构及其制备方法
CN104811889B (zh) * 2015-03-26 2021-08-10 华天科技（西安）有限公司 一种mems麦克风封装器件的组装方法
CN106028648B (zh) * 2016-06-28 2019-03-01 北京中讯四方科技股份有限公司 一种使声表器件在高温条件下能正常工作的装置及方法
WO2018022773A1 (en) * 2016-07-27 2018-02-01 Knowles Electronics, Llc Microelectromechanical system (mems) device packaging
CN206024251U (zh) * 2016-08-23 2017-03-15 江西盛泰光学有限公司 一种用于摄像头模组的片式元器件的焊盘
CN106735969B (zh) * 2016-12-09 2018-10-16 重庆理工大学 异种材料复合焊接方法
CN208190929U (zh) * 2018-06-11 2018-12-04 吉林航盛宏宇塑胶有限公司 一种扬声器定位圈焊片印压装置
CN109104663A (zh) * 2018-09-20 2018-12-28 苏州逸巛声学科技有限公司 一种薄型受话器
CN209017294U (zh) * 2018-11-30 2019-06-21 歌尔科技有限公司 发声装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022867A1 (en) * 2012-07-19 2014-01-23 Geospace Technologies, Lp Micro-geophone
CN105992111A (zh) * 2016-05-27 2016-10-05 歌尔股份有限公司 一种扬声器模组
CN110418261A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 发声单体、发声模组及电子终端
CN110418257A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 发声装置
CN110418251A (zh) * 2018-04-27 2019-11-05 歌尔股份有限公司 一种发声单体、发声模组及电子终端
CN110996232A (zh) * 2019-11-22 2020-04-10 歌尔股份有限公司 一种发声装置单体及电子设备

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