WO2019128389A1 - 扬声器模组及电子设备 - Google Patents

扬声器模组及电子设备 Download PDF

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Publication number
WO2019128389A1
WO2019128389A1 PCT/CN2018/110213 CN2018110213W WO2019128389A1 WO 2019128389 A1 WO2019128389 A1 WO 2019128389A1 CN 2018110213 W CN2018110213 W CN 2018110213W WO 2019128389 A1 WO2019128389 A1 WO 2019128389A1
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WO
WIPO (PCT)
Prior art keywords
module
steel sheet
injection
speaker
hot melt
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Application number
PCT/CN2018/110213
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English (en)
French (fr)
Inventor
李兆鹏
Original Assignee
歌尔科技有限公司
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Publication date
Application filed by 歌尔科技有限公司 filed Critical 歌尔科技有限公司
Priority to US16/957,773 priority Critical patent/US11159863B2/en
Publication of WO2019128389A1 publication Critical patent/WO2019128389A1/zh

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/022Cooling arrangements

Definitions

  • the utility model belongs to the technical field of electroacoustic conversion devices. Specifically, the utility model relates to a speaker module and an electronic device.
  • the pursuit of speaker devices can be thinner and thinner.
  • the outer casing of the speaker device uses a steel sheet instead of a part of the plastic, and at the same time improves the structural strength of the outer casing.
  • the steel sheet is separated from the plastic during the injection molding cooling process, and a slit is generated, which affects the audio performance of the speaker device.
  • the main way to solve such problems is nano-injection, which is complicated in process and high in cost.
  • a speaker module including: a speaker unit, a steel sheet, and a module housing;
  • the speaker unit is fixed in the module casing, and divides an inner space of the module casing into a front cavity and a rear cavity;
  • the steel sheet is injection molded on the module casing
  • a hot melt bonding medium is disposed at a position of the steel sheet combined with the module outer casing.
  • the module housing has a partition wall between the front cavity and the rear cavity, and the steel sheet spans the front cavity and the rear cavity and is injection-molded with the partition wall, the steel The hot melt bonding medium is provided at a position of the sheet in combination with the partition wall.
  • the steel sheet includes a bottom plate and a plurality of first injection portions disposed at an edge of the bottom plate;
  • the hot melt bonding medium is disposed on a joint surface of the bottom plate and the module casing, and the plurality of first injection portions are injection-molded in the module casing, and the bottom plate is injection-molded in the mold On the set of shells.
  • the bottom plate edge is further provided with a plurality of second injection portions
  • the plurality of second injection portions include: a straight segment extending toward the module housing and a flat segment extending parallel to the bottom plate from the straight segment away from the bottom plate;
  • the plurality of second injection portions are injection molded in the module housing or injection molded on the module housing.
  • the plurality of first injection portions and the plurality of second injection portions form a zigzag structure.
  • the steel sheet has a front cavity steel sheet portion corresponding to the front cavity, and a periphery of the front cavity steel sheet portion and the module outer casing are provided with a ring-shaped hot-melt bonding medium.
  • the module housing includes a body portion and a sidewall located at an outer edge of the body portion;
  • the sound wall is provided on the side wall
  • the hot melt adhesive medium is provided with an opening at a position corresponding to the sound hole.
  • the speaker unit has a rectangular structure
  • the hot melt bonding medium is a rectangular ring structure having an opening.
  • the hot melt adhesive medium is a hot melt double-sided tape.
  • the present invention also provides an electronic device comprising the speaker module according to any one of the above.
  • the hot-melt bonding medium can improve the bonding state between the module shell and the steel sheet, and improve the steel sheet and the mold.
  • the combination of the outer casings prevents the occurrence of slits between the module casing and the steel sheet during injection molding, thereby preventing the audio performance of the speaker module from being affected.
  • FIG. 1 is a schematic view of a speaker module provided by the present invention
  • Figure 2 is a partial cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is an enlarged view of A in Figure 2;
  • FIG. 5 is a flow chart of the installation of the steel sheet and the module casing provided by the utility model.
  • the utility model provides a speaker module.
  • a speaker unit (not shown), a steel sheet 10 and a module shell 20 are provided.
  • the speaker unit is fixed in the module housing 20, and the internal space of the module housing 20 is divided into a front cavity and a rear cavity (not shown in the front cavity and the rear cavity).
  • the steel sheet 10 is injection molded on the module housing 20.
  • a hot melt adhesive medium 30 is provided at a position where the steel sheet 10 is combined with the module outer casing 20.
  • One technical effect of the present invention is that by providing a hot-melt adhesive medium 30 between the steel sheet 10 and the module outer casing 20, the bonding state between the module outer casing 20 and the steel sheet 10 can be improved by hot-melting the adhesive medium 30.
  • the hot melt adhesive medium 30 includes, but is not limited to, a hot melt double sided tape.
  • the module casing 20 has a partition wall between the front cavity and the rear cavity (not shown in the partition wall), and the steel sheet 10 spans the front cavity and the rear cavity and is injection-molded with the partition wall, and the steel sheet 10 and the partition wall A hot melt bonding medium 30 is provided at the combined position.
  • the hot melt adhesive medium 30 is disposed at a position where the steel sheet 10 is combined with the partition wall, and the shrinkage rate of the steel sheet 10 and the partition wall is reduced by the hot melt adhesive medium 30. The difference is to prevent a slit from being formed between the partition wall and the steel sheet 10 at the time of injection molding.
  • the steel sheet 10 includes a bottom plate 11 and a plurality of first injection portions 12 disposed at the edges of the bottom plate 11.
  • the plurality of first injection portions 12 extend toward the module housing 20.
  • the hot melt bonding medium 30 is disposed on the bonding surface of the bottom plate 11 and the module housing 20, and the plurality of first injection portions 12 are injection-molded in the module housing 20, and the bottom plate 11 is injection-molded on the module housing 20.
  • One function of the first injection portion 12 is to increase the bonding strength between the steel sheet 10 and the module casing 20, and it is possible to effectively prevent the steel sheet 10 from being detached from the module casing 20.
  • a plurality of second injection portions 13 are further provided at the edge of the bottom plate 11.
  • the plurality of second injection portions 13 include a straight section extending toward the module housing 20 and a flat section extending from the straight section in a direction away from the bottom plate 11 in parallel with the bottom plate 11.
  • the plurality of second injection portions 13 are injection molded in the module housing 20 or injection molded on the module housing 20.
  • the straight portion and the flat portion of the second injection portion 13 are combined with the module housing 20, and the second injection portion 13 can be compared with the first injection portion 12
  • the detachment of the steel sheet 10 from the module housing 20 in both directions is prevented.
  • the flat portion of the second injection portion 13 may be a rounded hem structure. The smooth hem structure enables the joint between the steel sheet 10 and the module housing 20 to be smooth after the module housing 20 is cooled, and the steel sheet 10 does not damage the module housing 20.
  • the plurality of first injection portions 12 and the plurality of second injection portions 13 form a zigzag structure.
  • the hot-melt adhesive medium 30 is disposed in different manners.
  • the hot-melt adhesive medium 30 is disposed on the joint surface of the bottom plate 11 and the module outer casing 20.
  • the upper and outer portions may be disposed on the joint surface of the first injection portion 12 and the second injection portion 13 and the module housing 20.
  • the hot-melt bonding medium 30 may be disposed only between the sealing surface of the steel sheet 10 and the module housing 20, respectively.
  • the steel sheet 10 has a front cavity steel sheet portion corresponding to the front chamber, and a heat-melting adhesive medium 30 having an annular structure is disposed at a position where the periphery of the front chamber steel sheet portion is combined with the module outer casing 20.
  • the hot-melt bonding medium 30 it is possible to prevent the steel sheet 10 from being slit with the position of the module casing 20 corresponding to the front cavity.
  • the module housing 20 includes a body portion 21 and a side wall 22 at an outer edge of the body portion 21.
  • the side wall 22 is provided with an acoustic hole 23.
  • the sound hole 23 allows the sound of the speaker module to radiate out.
  • the joint of the steel sheet 10 and the module outer casing 20 at the position corresponding to the sound hole 23 does not need to be sealed.
  • the hot melt adhesive medium 30 is in the sound hole.
  • An opening is provided at the corresponding position of 23.
  • the hot melt bonding medium 30 is omitted at the opening, which saves cost.
  • the shape of the hot melt adhesive medium 30 can be set according to the shape of the speaker unit, for example, the speaker unit has a rectangular structure.
  • the hot melt bonding medium 30 is a rectangular ring structure having an opening. The opening corresponds to the position of the sound hole 23.
  • the speaker unit is not shown in the figure.
  • the speaker unit comprises a unitary front cover and a single housing combined together, a single front cover and a single outer casing.
  • the space contains a vibration system and a magnetic circuit system.
  • the vibration system includes a diaphragm fixed at an edge between the front cover of the unit and the outer casing of the unit, a side of the diaphragm adjacent to the front cover of the unit is fixed with a dome, and the other side of the diaphragm is fixed with a voice coil, the voice coil
  • the winding tap is a voice coil lead, and the voice coil lead is electrically connected to the electrical connector through a pad provided on the single housing, and is electrically connected to an external circuit of the speaker module through the electrical connector.
  • the magnetic circuit system includes a magnetic conductive plate fixed on the single-shell, and an inner magnet and a inner washer are sequentially fixed at an inner position of the inner side of the magnetic conductive plate, and an outer magnet and an outer washer are sequentially fixed at an edge position of the inner side of the magnetic conductive plate.
  • the inner magnet and the inner slab together form an inner magnetic circuit
  • the outer magnet and the outer huaxi jointly form an outer magnetic circuit
  • a magnetic gap is disposed between the inner magnetic circuit and the outer magnetic circuit
  • the end of the voice coil is located in the magnetic gap.
  • the voice coil moves up and down in the magnetic gap according to the magnitude and direction of the acoustic electric signal passing through the winding.
  • the diaphragm vibrates with the up and down movement of the voice coil, and the air is uttered to complete the energy conversion between the electric sounds.
  • the speaker module further includes an electrical connector for electrically connecting the speaker unit to an external circuit.
  • the two ends of the side of the speaker unit near the side of the steel sheet 10 are respectively provided with a pad for soldering the electrical connector, and the electrical connector includes two solders for the speaker unit.
  • the two first conductive portions are connected together by a connecting portion, wherein one of the first conductive portions is connected with a second conductive portion electrically connected to an external circuit of the speaker module, and the second conductive portion is located at the speaker The exterior of the module.
  • the electrical connector is an FPCB (Flexible Printed Circuit Board). This structure of the electrical connector effectively saves the internal space of the module while also ensuring the performance of the speaker module.
  • the hot melt adhesive medium 30 is bonded to the position where the steel sheet 10 is combined with the module outer casing 20, and in Fig. 5, the hot melt adhesive medium 30 is bonded to the bottom plate 11 of the steel sheet 10. on;
  • the steel sheet 10 is injection molded on the module casing 20, wherein the hot melt bonding medium 30 is melted by the residual temperature before the module casing 20 is cooled;
  • the steel sheet 10 is injection molded with the hot melt bonding medium 30 on the module housing 20.
  • the present invention also provides an electronic device including the above speaker module.
  • Electronic devices include electronic devices that provide sounding functions such as headphones, computers, and mobile phones.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本实用新型涉及扬声器模组及电子设备。扬声器模组,包括:扬声器单体、钢片及模组外壳;其中,所述扬声器单体固定在所述模组外壳内,并将所述模组外壳内部空间分割为前腔和后腔;所述钢片注塑于所述模组外壳上;所述钢片的与所述模组外壳相结合的位置设有热熔粘接介质。本实用新型所要解决的一个技术问题是提高钢片及模组外壳的结合力度的同时,能够防止在注塑时,模组外壳与钢片之间产生狭缝,避免扬声器模组的音频性能受到影响。

Description

扬声器模组及电子设备 技术领域
本实用新型属于电声转换装置技术领域,具体地,本实用新型涉及一种扬声器模组及电子设备。
背景技术
目前,人们对电子产品中的扬声装置在追求高性能的情况下,同时又追求扬声装置能够越来越薄。为了节省厚度方向空间,扬声装置的外壳多使用钢片代替部分塑胶,同时提高外壳的结构强度。
但是,由于钢片与塑胶冷却时收缩率具有差异,造成外壳注塑成型冷却过程中钢片与塑胶分离,产生狭缝,影响扬声装置的音频性能。目前解决这类问题主要途径为纳米注塑,工艺复杂,成本较高。
实用新型内容
本实用新型的一个目的是提供一种防止在注塑时,模组外壳与钢片之间产生狭缝的方案。
根据本实用新型的一个方面,提供了一种扬声器模组,包括:扬声器单体、钢片及模组外壳;其中,
所述扬声器单体固定在所述模组外壳内,并将所述模组外壳内部空间分割为前腔和后腔;
所述钢片注塑于所述模组外壳上;
所述钢片的与所述模组外壳相结合的位置设有热熔粘接介质。
可选地,所述模组外壳在所述前腔和所述后腔之间具有隔壁,所述钢片横跨所述前腔和所述后腔并与所述隔壁注塑结合,所述钢片的与所述隔壁相结合的位置设有所述热熔粘接介质。
可选地,所述钢片包括底板及设置在所述底板边缘处的多个第一注塑 部;
多个所述第一注塑部朝所述模组外壳方向延伸;
所述热熔粘接介质设置在所述底板与所述模组外壳的结合面上,所述多个第一注塑部注塑结合在所述模组外壳中,所述底板注塑结合在所述模组外壳上。
可选地,所述底板边沿还设有多个第二注塑部;
所述多个第二注塑部包括:朝所述模组外壳方向延伸出的直段以及自所述直段起向远离所述底板的方向伸出与所述底板平行的平段;
所述多个第二注塑部注塑结合在所述模组外壳中,或注塑结合在所述模组外壳上。
可选地,所述多个第一注塑部及所述多个第二注塑部形成锯齿状结构。
可选地,所述钢片具有与所述前腔对应的前腔钢片部分,所述前腔钢片部分的周边与所述模组外壳结合位置设有环形结构的热熔粘接介质。
可选地,所述模组外壳包括本体部及位于所述本体部外边缘的侧壁;
所述侧壁上设有出声孔;
所述热熔粘接介质在所述出声孔对应的位置处设有开口。
可选地,所述扬声器单体为矩形结构;
所述热熔粘接介质为具有开口的矩形环结构。
可选地,所述热熔粘接介质为热熔双面胶。
本实用新型还提供了一种电子设备,包括上述中任一项所述的扬声器模组。
本实用新型的一个技术效果在于通过在钢片及模组外壳之间设置热熔粘接介质,通过热熔粘接介质能改善模组外壳与钢片之间的结合状态,提高钢片及模组外壳的结合力度的同时,能够防止在注塑时,模组外壳与钢片之间产生狭缝,避免扬声器模组的音频性能受到影响。
通过以下参照附图对本实用新型的示例性实施例的详细描述,本实用新型的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本实用新型的实施例,并且连同说明书一起用于解释本实用新型的原理。
图1是本实用新型提供的扬声器模组的示意图;
图2是图1中沿A-A方向的剖面局部示意图;
图3是图2中A处的放大图;
图4是本实用新型提供的扬声器模组的爆炸图;
图5是本实用新型提供的钢片与模组外壳的安装流程图。
具体实施方式
现在将参照附图来详细描述本实用新型的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本实用新型的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本实用新型及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论,但在适当情况下,所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。
本实用新型提供了一种扬声器模组,参见图1至图3,包括:扬声器单体(图中未示出)、钢片10及模组外壳20。
其中,扬声器单体固定在模组外壳20内,并将模组外壳20内部空间分割为前腔和后腔(前腔和后腔图中未示出)。
钢片10注塑于模组外壳20上。
钢片10的与模组外壳20相结合的位置设有热熔粘接介质30。
本实用新型的一个技术效果在于通过在钢片10及模组外壳20之间设置热熔粘接介质30,通过热熔粘接介质30能改善模组外壳20与钢片10之间的结合状态,例如,能够减少钢片10与塑胶冷却时收缩率的差异,从而能够提高钢片10及模组外壳20的结合力度的同时,能够防止在注塑时,模组外壳20与钢片10之间产生狭缝,避免扬声器模组的音频性能受到影响。热熔粘接介质30包括但不限于为热熔双面胶。
本实用新型中,模组外壳20在前腔和后腔之间具有隔壁(隔壁图中未示出),钢片10横跨前腔和后腔并与隔壁注塑结合,钢片10的与隔壁相结合的位置设有热熔粘接介质30。
前腔及后腔共用钢片10时,如果钢片10与模组外壳20产生狭缝或与隔壁产生狭缝,会有前腔及后腔导通漏气的风险,影响扬声器模组的音频性能。因此,为防止前腔及后腔导通漏气,热熔粘接介质30设置在钢片10的与隔壁相结合位置,通过热熔粘接介质30减少钢片10与隔壁冷却时收缩率的差异,防止在注塑时,隔壁与钢片10之间产生狭缝。
参见图4,钢片10包括底板11及设置在底板11边缘处的多个第一注塑部12。多个第一注塑部12朝模组外壳20方向延伸。
热熔粘接介质30设置在底板11与模组外壳20的结合面上,多个第一注塑部12注塑结合在模组外壳20中,底板11注塑结合在模组外壳20上。第一注塑部12的一个作用是可增加钢片10与模组外壳20的结合力度,能够有效防止钢片10与模组外壳20之间脱离。
为了增加钢片10与模组外壳20的结合力度,除了设置第一注塑部12外,本实用新型中,底板11边沿还设有多个第二注塑部13。多个第二注塑部13包括:朝模组外壳20方向延伸出的直段以及自直段起向远离底板11的方向伸出与底板11平行的平段。
多个第二注塑部13注塑结合在模组外壳20中,或注塑结合在模组外壳20上。其中,多个第二注塑部13注塑结合在模组外壳20中时,通过第二注塑部13的直段及平段与模组外壳20结合,相比第一注塑部12,第二注塑部13可防止钢片10与模组外壳20朝两个方向上的脱离。多个第二注塑部13注塑结合在模组外壳20上时,第二注塑部13的平段可为圆滑折边 结构。圆滑折边结构可使得在模组外壳20冷却后,钢片10与模组外壳20结合部较为平滑,钢片10不会对模组外壳20造成损坏。
在一具体实现实例中,多个第一注塑部12及多个第二注塑部13形成锯齿状结构。
根据钢片10与模组外壳20不同结合需求,热熔粘接介质30的设置方式也不相同,本实用新型中,热熔粘接介质30除设置在底板11与模组外壳20的结合面上外,还可以设置在第一注塑部12及第二注塑部13与模组外壳20的结合面上。
相应地,基于对模组外壳20与钢片10之间的结合处密封要求的不同,相应地,热熔粘接介质30可仅设置在钢片10与模组外壳20的密封结合面之间。例如,在一具体实现实例中,钢片10具有与前腔对应的前腔钢片部分,前腔钢片部分的周边与模组外壳20结合位置设有环形结构的热熔粘接介质30。此时,通过热熔粘接介质30可防止钢片10与模组外壳20的与前腔对应位置产生狭缝。
继续参见图4,模组外壳20包括本体部21及位于本体部21外边缘的侧壁22,侧壁22上设有出声孔23。出声孔23可使得扬声器模组的声音辐射出去。与出声孔23相应的位置的钢片10与模组外壳20的结合处不需要进行密封,为了有效利用热熔粘接介质30,本实用新型中,热熔粘接介质30在出声孔23对应的位置处设有开口。开口处省去了热熔粘接介质30,节约了成本。
热熔粘接介质30的形状可根据扬声器单体的形状进行设置,例如,扬声器单体为矩形结构。热熔粘接介质30为具有开口的矩形环结构。开口对应出声孔23的位置。
本实用新型中,扬声器单体未在图中示出,在一具体实现实例中,扬声器单体包括结合在一起的单体前盖和单体外壳,单体前盖和单体外壳围成的空间内收容有振动系统和磁路系统。振动系统包括边缘部固定在单体前盖与单体外壳之间的振膜,振膜靠近单体前盖的一侧固定有球顶,振膜的另一侧固定有音圈,音圈的绕线抽头为音圈引线,音圈引线通过设置在单体外壳上的焊盘与电连接件电连接,并通过电连接件与扬声器模组外部 电路电连接。磁路系统包括固定在单体外壳上的导磁板,导磁板内侧的中间位置依次固定有内磁铁和内华司,导磁板内侧的边缘位置依次固定有外磁铁和外华司。内磁铁和内华司共同构成内磁路,外磁铁和外华司共同构成外磁路,内磁路和外磁路之间设有磁间隙,音圈的端部位于磁间隙内。音圈根据通过其绕线内的声波电信号的大小和方向在磁间隙内做上下运动,振膜随着音圈的上下运动而振动,策动空气发声,从而完成电声之间的能量转换。
本实用新型中,扬声器模组还包括用于电连接扬声器单体与外部电路的电连接件。
在一具体实现实例中,扬声器单体靠近钢片10侧部的侧边的两端各设有一个用于焊接电连接件的焊盘,电连接件包括两个用于与扬声器单体的焊盘焊接的第一导电部,两个第一导电部通过连接部连接在一起,其中的一个第一导电部连接有与扬声器模组外部电路电连接的第二导电部,第二导电部位于扬声器模组的外部。
当两个第一导电部与扬声器单体上的焊盘焊接后,连接部会悬在扬声器单体的外侧,为了节省扬声器模组的内部空间,将连接部向下弯折并通过背胶粘贴在扬声器单体的侧壁上,防止连接部脱离扬声器单体的侧壁,且钢片10侧部为连接部避让出了足够的空间。电连接件为FPCB(Flexible Printed Circuit Board,柔性印刷线路板)。电连接件的此种结构有效的节省了模组内部空间,同时还保证了扬声器模组的性能。
下面对模组外壳20及钢片10如何结合做介绍。
参见图5,首先,将热熔粘接介质30粘接在钢片10与模组外壳20相结合的位置上,图5中是将热熔粘接介质30粘接在钢片10的底板11上;
其次,将钢片10注塑于模组外壳20上,其中,热熔粘接介质30受模组外壳20冷却前的余温熔化;
最后,冷却后,钢片10与热熔粘接介质30注塑结合在模组外壳20上。
进一步地,本实用新型还提供了一种电子设备,包括上述的扬声器模组。电子设备包括耳机、电脑、手机等可提供发声功能的电子设备。
虽然已经通过示例对本实用新型的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上示例仅是为了进行说明,而不是为了限制本实用新型的范围。本领域的技术人员应该理解,可在不脱离本实用新型的范围和精神的情况下,对以上实施例进行修改。本实用新型的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组,其特征在于,包括:扬声器单体、钢片及模组外壳;其中,
    所述扬声器单体固定在所述模组外壳内,并将所述模组外壳内部空间分割为前腔和后腔;
    所述钢片注塑于所述模组外壳上;
    所述钢片的与所述模组外壳相结合的位置设有热熔粘接介质。
  2. 根据权利要求1所述的扬声器模组,其特征在于,所述模组外壳在所述前腔和所述后腔之间具有隔壁,所述钢片横跨所述前腔和所述后腔并与所述隔壁注塑结合,所述钢片的与所述隔壁相结合的位置设有所述热熔粘接介质。
  3. 根据权利要求1所述的扬声器模组,其特征在于,所述钢片包括底板及设置在所述底板边缘处的多个第一注塑部;
    多个所述第一注塑部朝所述模组外壳方向延伸;
    所述热熔粘接介质设置在所述底板与所述模组外壳的结合面上,所述多个第一注塑部注塑结合在所述模组外壳中,所述底板注塑结合在所述模组外壳上。
  4. 根据权利要求3所述的扬声器模组,其特征在于,所述底板边沿还设有多个第二注塑部;
    所述多个第二注塑部包括:朝所述模组外壳方向延伸出的直段以及自所述直段起向远离所述底板的方向伸出与所述底板平行的平段;
    所述多个第二注塑部注塑结合在所述模组外壳中,或注塑结合在所述模组外壳上。
  5. 根据权利要求4所述的扬声器模组,其特征在于,所述多个第一注塑部及所述多个第二注塑部形成锯齿状结构。
  6. 根据权利要求1至5中任一项所述的扬声器模组,其特征在于,所述钢片具有与所述前腔对应的前腔钢片部分,所述前腔钢片部分的周边与所述模组外壳结合位置设有环形结构的热熔粘接介质。
  7. 根据权利要求1至5中任一项所述的扬声器模组,其特征在于,所述模组外壳包括本体部及位于所述本体部外边缘的侧壁;
    所述侧壁上设有出声孔;
    所述热熔粘接介质在所述出声孔对应的位置处设有开口。
  8. 根据权利要求7所述的扬声器模组,其特征在于,所述扬声器单体为矩形结构;
    所述热熔粘接介质为具有开口的矩形环结构。
  9. 根据权利要求1至5中任一项所述的扬声器模组,其特征在于,所述热熔粘接介质为热熔双面胶。
  10. 一种电子设备,其特征在于,包括如权利要求1至9任一项所述的扬声器模组。
PCT/CN2018/110213 2017-12-25 2018-10-15 扬声器模组及电子设备 WO2019128389A1 (zh)

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