WO2021093727A1 - 封装结构、显示面板及显示装置 - Google Patents

封装结构、显示面板及显示装置 Download PDF

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Publication number
WO2021093727A1
WO2021093727A1 PCT/CN2020/127790 CN2020127790W WO2021093727A1 WO 2021093727 A1 WO2021093727 A1 WO 2021093727A1 CN 2020127790 W CN2020127790 W CN 2020127790W WO 2021093727 A1 WO2021093727 A1 WO 2021093727A1
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Prior art keywords
inorganic layer
light
refractive index
emitting device
layer
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PCT/CN2020/127790
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English (en)
French (fr)
Inventor
文平
曾扬
蒋志亮
王格
何宝轲
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/419,687 priority Critical patent/US20220085333A1/en
Publication of WO2021093727A1 publication Critical patent/WO2021093727A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • This application relates to the field of display technology, and in particular to a packaging structure, a display panel and a display device.
  • Organic Light-Emitting Diode (English: Organic Light-Emitting Diode; abbreviation: OLED) devices have the advantages of all-solid-state structure, high brightness, full viewing angle, fast response speed, and flexible display, and are widely used in the display industry.
  • the embodiments of the present application provide a packaging structure, a display panel, and a display device.
  • the technical solution is as follows:
  • an encapsulation structure including: a laminated first inorganic layer and a second inorganic layer covering the outside of a light emitting device, the first inorganic layer being far away from the second inorganic layer relative to the second inorganic layer.
  • the thickness of the first inorganic layer is smaller than the thickness of the second inorganic layer, and the refractive index of the first inorganic layer is smaller than the refractive index of the second inorganic layer;
  • the first inorganic layer is used to make the optical path difference between the first light and the second light approximately an integer multiple of the target wavelength
  • the first light is the light emitted from the light emitting device in the packaging structure
  • the second light is the light emitted from the packaging structure that is not reflected in the packaging structure among the light emitted from the light emitting device
  • the first light is The and wavelength and the wavelength of the second light are both the target wavelength.
  • both the first light and the second light are blue light.
  • the range of the refractive index of the first inorganic layer is [1.3, 1.7], and the range of the refractive index of the second inorganic layer is [1.6, 1.9].
  • the thickness of the first inorganic layer ranges from 20 nanometers to 120 nanometers
  • the thickness of the second inorganic layer ranges from 500 nanometers to 1000 nanometers.
  • the packaging structure further includes: a stacked third inorganic layer and an organic layer covering the outside of the light emitting device, the third inorganic layer is close to the light emitting device relative to the organic layer, and the The organic layer is close to the light emitting device with respect to the second inorganic layer.
  • the refractive index of the third inorganic layer is greater than the refractive index of the organic layer, and the refractive index of the third inorganic layer is smaller than the refractive index of the second inorganic layer.
  • the material of the first inorganic layer includes silicon oxynitride
  • the material of the second inorganic layer includes silicon nitride
  • the material of the third inorganic layer includes silicon oxynitride.
  • the first light and the second light are both blue light
  • the range of the refractive index of the first inorganic layer is [1.3, 1.7], and the range of the refractive index of the second inorganic layer is [1.6, 1.9];
  • the thickness of the first inorganic layer ranges from 20 nanometers to 120 nanometers, and the thickness of the second inorganic layer ranges from 500 nanometers to 1000 nanometers;
  • the packaging structure further includes: a stacked third inorganic layer and an organic layer covering the outside of the light emitting device, the third inorganic layer is close to the light emitting device with respect to the organic layer, and the organic layer is opposite to The second inorganic layer is close to the light emitting device;
  • the refractive index of the third inorganic layer is greater than the refractive index of the organic layer, and the refractive index of the third inorganic layer is smaller than the refractive index of the second inorganic layer.
  • a display panel including: a substrate, a light emitting device on the substrate, and a packaging structure covering the outside of the light emitting device, the packaging structure being claims 1 to 9. Any of the packaging structures described above.
  • the display panel further includes: a connecting film layer located between the light emitting device and the packaging structure.
  • the packaging structure includes: a third inorganic layer, an organic layer, a second inorganic layer, and a first inorganic layer that are sequentially wrapped on the outside of the light-emitting device in a direction away from the substrate.
  • the inorganic layer is close to the light emitting device relative to the organic layer, and the refractive index of the third inorganic layer is greater than the refractive index of the connecting film layer.
  • the refractive index of the third inorganic layer is greater than the refractive index of the organic layer, and the refractive index of the third inorganic layer is smaller than the refractive index of the second inorganic layer.
  • the material of the first inorganic layer includes silicon oxynitride
  • the material of the second inorganic layer includes silicon nitride
  • the material of the third inorganic layer includes silicon oxynitride
  • the third inorganic layer, the second inorganic layer, and the first inorganic layer are formed by a chemical vapor deposition method.
  • the organic layer is formed by an inkjet printing process.
  • the material of the connecting film layer includes lithium fluoride.
  • the light emitting device includes an organic light emitting diode.
  • the display panel further includes: a connection film layer located between the light emitting device and the packaging structure;
  • the packaging structure includes: a third inorganic layer, an organic layer, a second inorganic layer, and a first inorganic layer sequentially covering the outside of the light-emitting device in a direction away from the substrate, and the third inorganic layer is opposite to The organic layer is close to the light emitting device, and the refractive index of the third inorganic layer is greater than the refractive index of the connecting film layer;
  • the refractive index of the third inorganic layer is greater than the refractive index of the organic layer, and the refractive index of the third inorganic layer is smaller than the refractive index of the second inorganic layer.
  • a display device including: any of the above-mentioned display panels.
  • FIG. 1 is a schematic structural diagram of a package structure provided by an embodiment of the present application.
  • FIG. 2 is an optical path diagram of light emitted by a light-emitting device provided by an embodiment of the present application transmitted in the packaging structure shown in FIG. 1;
  • FIG. 2 is an optical path diagram of light emitted by a light-emitting device provided by an embodiment of the present application transmitted in the packaging structure shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of another package structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a comparison diagram of the relationship curve between the degree of color deviation of the display panel and the viewing angle provided by an embodiment of the present application, and the relationship curve between the degree of color deviation of the display panel and the viewing angle in the related art;
  • FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the encapsulation structure may include a plurality of encapsulation film layers covering the outside of the OLED device, the plurality of encapsulation film layers including an inorganic layer and an organic layer that are alternately superimposed.
  • the light emitted by the OLED device passes through the packaging structure, it will be reflected and refracted between the packaging film layers, and the light energy will be lost when the light is reflected and refracted, resulting in low light extraction efficiency of the OLED device.
  • the embodiments of the present application provide a packaging structure, which is used to package a light-emitting device, and the light-emitting device may be an OLED device.
  • FIG. 1 is a schematic structural diagram of a package structure provided by an embodiment of the present application.
  • the packaging structure 100 may include: a stacked first inorganic layer 11 and a second inorganic layer 12 covering the outside of the light emitting device 200.
  • the first inorganic layer 11 is far away from the light emitting device 200 relative to the second inorganic layer 12.
  • the thickness of the first inorganic layer 11 is smaller than the thickness of the second inorganic layer 12, and the refractive index of the first inorganic layer 11 is smaller than the refractive index of the second inorganic layer 12.
  • the first inorganic layer 11 is used to adjust the optical path of the first light so that the optical path difference between the first light and the second light is approximately an integer multiple of the target wavelength (optionally, the first The optical path difference between the light and the second light is about 0.8-1.2 times the target wavelength).
  • the first light and the second light meet the interference condition, and the first light and the second light can interfere constructively.
  • the first light is light emitted from the packaging structure 100 after being reflected in the packaging structure 100 among the light emitted from the light emitting device 200 (that is, the first light is the light that has undergone at least one reflection and at least one refraction in the packaging structure). After that, the light emitted from the package structure).
  • the second light is light emitted from the packaging structure 100 that is not reflected in the packaging structure 100 among the light emitted from the light emitting device 200.
  • the first light and the second light have the same wavelength, and both of them can be the target wavelength.
  • FIG. 2 is a light path diagram of the light emitted by a light emitting device provided by an embodiment of the present application transmitted in the package structure shown in FIG. 1.
  • the arrow in the solid line represents the first light
  • the arrow in the dashed line represents the second light.
  • the first inorganic layer 11 can adjust the optical path of the first light so that the first light and the second light meet the interference condition, and since the optical path difference between the first light and the second light is an integer multiple of the wavelength, the first light The light and the second light can interfere constructively, and the light intensity of the light emitted after passing through the packaging structure 100 is increased.
  • the packaging structure includes: a first inorganic layer and a second inorganic layer covering the outside of the light-emitting device.
  • the first inorganic layer is used to adjust the optical path of the first light in the light emitted from the light emitting device, so that the first light and the second light in the light emitted from the light emitting device will constructively interfere with each other, thereby improving the passage through the packaging structure.
  • the light intensity of the light emitted later improves the light-emitting efficiency of the light-emitting device.
  • the first light and the second light are both blue light
  • the target wavelength may be the wavelength of blue light.
  • the first light and the second light belong to the light emitted by the light emitting device for emitting blue light.
  • the first inorganic layer 11 can effectively improve the light extraction efficiency of the light emitting device for emitting blue light.
  • the wavelength of the blue light ranges from 400 nanometers to 480 nanometers.
  • the range of the refractive index of the first inorganic layer 11 is [1.3, 1.7]
  • the range of the refractive index of the second inorganic layer 12 is [1.6, 1.9].
  • the thickness of the first inorganic layer 11 is in the range of [20, 120] in nanometers
  • the thickness of the second inorganic layer 12 is in the range of [500, 1000] in nanometers.
  • FIG. 3 is a schematic structural diagram of another package structure provided by an embodiment of the present application.
  • the packaging structure 100 may further include: a stacked third inorganic layer 13 and an organic layer 14 covering the outside of the light emitting device 200.
  • the third inorganic layer 13 is close to the light emitting device 200 relative to the organic layer 14, and the third inorganic layer 13 and the organic layer 14 are both close to the light emitting device 200 relative to the second inorganic layer 12. That is, the third inorganic layer 13, the organic layer 14, the second inorganic layer 12 and the first inorganic layer 11 in the packaging structure 100 are sequentially arranged along the direction F away from the light emitting device 200.
  • the refractive index of the third inorganic layer 13 is greater than the refractive index of the organic layer 14, and the refractive index of the third inorganic layer 13 is smaller than the refractive index of the second inorganic layer 12.
  • the third inorganic layer 13 stacked in a direction away from the light emitting device 200 is a high refractive index layer
  • the organic layer 14 is a low refractive index layer
  • the second inorganic layer 12 is a high refractive index layer
  • the first inorganic layer 12 is a high refractive index layer.
  • the layer 11 is a low refractive index layer, that is, the packaging structure 100 includes a plurality of high refractive index layers and a plurality of low refractive index layers alternately arranged, which can further improve the light output efficiency of the light emitting device 200.
  • the material of the first inorganic layer 11 is silicon oxynitride
  • the material of the second inorganic layer 12 is silicon nitride
  • the material of the third inorganic layer 13 is silicon oxynitride
  • the wavelength of the first light and the wavelength of the second light in the light emitted by the light emitting device 200 are the same, and the wavelength of the first light and the wavelength of the second light may both be the target wavelength.
  • the first inorganic layer 11 is used to adjust the optical path of the first light so that the optical path difference between the optical path of the first light and the optical path of the second light is an integer multiple of the target wavelength. At this time, the first light and the second light meet the condition of constructive interference, and the first light and the second light can interfere constructively.
  • the packaging structure provided by the embodiment of the present application may be a thin-film encapsulation (TFE) structure.
  • TFE thin-film encapsulation
  • the packaging structure provided by the embodiments of the present application includes: a laminated first inorganic layer and a second inorganic layer covering the outside of the light-emitting device.
  • the first inorganic layer is used to adjust the optical path of the first light in the light emitted from the light emitting device, so that the first light and the second light in the light emitted from the light emitting device will constructively interfere with each other, thereby improving the passage through the packaging structure.
  • the light intensity of the light emitted later improves the light-emitting efficiency of the light-emitting device.
  • the embodiment of the present application also provides a display panel.
  • FIG. 4 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel may include:
  • the packaging structure 100 may be the packaging structure 100 shown in FIG. 1 or the packaging structure 100 shown in FIG. 3.
  • the light-emitting device may be an OLED device.
  • the display panel may further include: a connection film layer 400 between the light emitting device 200 and the packaging structure 100.
  • the connection film layer 400 is used to connect the light emitting device 200 and the packaging structure 100.
  • the material of the connection film layer 400 may be lithium fluoride.
  • the refractive index of the connecting film layer 400 is smaller than the refractive index of the third inorganic layer 13 in the packaging structure 100.
  • the substrate 300 has a plurality of pixel areas, and each pixel area has three sub-pixel areas, which are respectively a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area.
  • the light emitting device 200 located on the substrate 300 may include a light emitting device located in the red sub-pixel area for emitting red light, a light emitting device located in the green sub-pixel area for emitting green light, and a light emitting device located in the blue sub-pixel area. Light-emitting devices used to emit blue light in the area.
  • the luminous efficiency of blue light (also referred to as blue light efficiency) of the OLED device used to emit blue light in the display panel is 130.5 candela per ampere, and the light emitted by the OLED device in the display panel is only about 20% of the light. After successfully passing through the packaging structure, it is led out, resulting in low light extraction efficiency of the display panel.
  • the first inorganic layer 11 in the packaging structure 100 in the embodiment of the present application can increase the blue light efficiency of the light emitting device for emitting blue light to more than 137.3 candela per ampere.
  • the blue light efficiency of the OLED device used to emit blue light is increased by more than 5%, which effectively improves the light output efficiency of the light emitting device used to emit blue light.
  • the light-emitting efficiency of the light-emitting device used to emit red light in the display panel is basically the same as that of the OLED device used to emit red light in the related art, and the light-emitting efficiency of the green light of the light-emitting device used to emit green light is related to
  • the light extraction efficiency of the OLED device used for emitting green light in the technology is basically the same. Therefore, the light extraction efficiency of the display panel can be effectively improved through the packaging structure 100 in the embodiment of the present application.
  • the packaging structure 100 in the embodiment of the present application can also reduce the probability of color shift in the display panel.
  • FIG. 5 is a comparison diagram of the relationship curve between the degree of color deviation of the display panel and the viewing angle provided by an embodiment of the present application, and the relationship curve between the degree of color deviation of the display panel and the viewing angle in the related art .
  • the solid line represents the relationship curve between the degree of color deviation of the display panel and the viewing angle provided by the embodiments of the present application
  • the dotted line represents the relationship curve between the degree of color deviation of the display panel and the viewing angle in the related art.
  • the horizontal axis represents the viewing angle, and the unit can be degrees. 0 degrees means that the viewing direction is perpendicular to the light-emitting surface of the display panel; the viewing angle is a positive angle, which means that the display panel is viewed from one side of the display panel (for example, the right side), and the viewing direction It is an acute angle with the light-emitting surface of the display panel; a negative observation angle means that the display panel is viewed from the other side (for example, the left side) of the display panel, and the observation direction is an acute angle with the light-emitting surface of the display panel.
  • the vertical axis represents the degree of color deviation, and its unit can be JNCD (English: just noticeable color difference).
  • the OLED device may be a phosphorescent OLED device
  • the phosphorescent OLED device is a device that emits light through a phosphorescent material, and its internal quantum efficiency ((Internal Quantum Efficiency, IQE), internal quantum Efficiency is one of the basic performance indicators of optoelectronic devices) Theoretically, it can be as high as 100%, which is much higher than that of fluorescent OLED devices.
  • IQE Internal Quantum Efficiency
  • the OLED device may also be a fluorescent OLED, which is not limited in the embodiment of the present application.
  • the optical path of the first light in the light emitted from the light emitting device is adjusted by the first inorganic layer covering the outer side of the light emitting device, so that the first light is different from the light emitting device.
  • the second light of the light emitted by the device interferes constructively, which increases the light intensity of the light emitted after passing through the packaging structure, thereby improving the light-emitting efficiency of the light-emitting device, and further improving the light-emitting efficiency of the display panel.
  • the display panel provided by the embodiments of the present application has a low probability of color shift.
  • the embodiment of the present application also provides a packaging method.
  • FIG. 6, is a method flowchart of a packaging method provided by an embodiment of the present application.
  • the method is used to package the light-emitting device to form a packaging structure outside the light-emitting device, and the method may include:
  • a plurality of packaging film layers are formed on the outside of the light emitting device.
  • the multiple packaging film layers can constitute a packaging structure.
  • the multiple encapsulation film layers include: a first inorganic layer and a second inorganic layer stacked on the outermost side.
  • the first inorganic layer is far from the light emitting device relative to the second inorganic layer, and the thickness of the first inorganic layer is smaller than that of the second inorganic layer. Thickness, the refractive index of the first inorganic layer is smaller than the refractive index of the second inorganic layer;
  • the first inorganic layer is used to adjust the optical path of the first light to cause constructive interference between the first light and the second light.
  • the first light is the light emitted from the light emitting device and is reflected in the packaging structure and then exits from the packaging structure. (That is, the first light is the light emitted from the packaging structure after at least one reflection and at least one refraction in the packaging structure), and the second light is the light emitted from the light-emitting device that is not in the packaging structure Light reflected and emitted from the package structure.
  • forming a plurality of encapsulation film layers on the outside of the light emitting device includes: sequentially forming a third inorganic layer, an organic layer, a second inorganic layer, and a first inorganic layer on the outside of the light emitting device.
  • the refractive index of the third inorganic layer is greater than the refractive index of the organic layer, and the refractive index of the third inorganic layer is smaller than the refractive index of the second inorganic layer.
  • the third inorganic layer stacked in the direction away from the light-emitting device is a high refractive index layer
  • the organic layer is a low refractive index layer
  • the second inorganic layer is a high refractive index layer
  • the first inorganic layer is a low refractive index layer.
  • the layer, that is, the packaging structure includes a plurality of high refractive index layers and a plurality of low refractive index layers alternately arranged, which can further improve the light extraction efficiency of the light emitting device.
  • the third inorganic layer can be formed by chemical vapor deposition (English: Chemical Vapor Deposition; abbreviated as: CVD) on the outside of the light-emitting device; then, an organic layer can be formed on the third inorganic layer by an inkjet printing process; Two CVDs respectively form a second inorganic layer and a first inorganic layer on the organic layer.
  • CVD Chemical Vapor Deposition
  • the first light and the second light are both blue light
  • the target wavelength may be the wavelength of blue light.
  • the first light and the second light belong to the light emitted by the light emitting device for emitting blue light.
  • the first inorganic layer 11 can effectively improve the light extraction efficiency of the light emitting device for emitting blue light.
  • the wavelength of the blue light ranges from 400 nanometers to 480 nanometers.
  • the range of the refractive index of the first inorganic layer 11 is [1.3, 1.7]
  • the range of the refractive index of the second inorganic layer 12 is [1.6, 1.9].
  • the thickness of the first inorganic layer 11 is in the range of [20, 120] in nanometers
  • the thickness of the second inorganic layer 12 is in the range of [500, 1000] in nanometers.
  • the material of the first inorganic layer is silicon oxynitride
  • the material of the second inorganic layer is silicon nitride
  • the material of the third inorganic layer is silicon oxynitride
  • the wavelength of the first light and the wavelength of the second light in the light emitted by the light emitting device are the same, and the wavelength of the first light and the wavelength of the second light may both be the target wavelength.
  • the first inorganic layer is used to adjust the optical path of the first light so that the optical path difference between the optical path of the first light and the optical path of the second light is an integer multiple of the target wavelength. At this time, the first light and the second light meet the condition of constructive interference, and the first light and the second light can interfere constructively.
  • multiple packaging film layers are formed on the outside of the light emitting device, and the multiple packaging film layers may include the first and second inorganic layers stacked on the outermost side.
  • the first inorganic layer is used to adjust the optical path of the first light in the light emitted from the light emitting device, so that the first light and the second light in the light emitted from the light emitting device will constructively interfere with each other, thereby improving the passage through the packaging structure.
  • the light intensity of the light emitted later improves the light-emitting efficiency of the light-emitting device.
  • the embodiment of the present application also provides a display device, which may include the display panel shown in FIG. 4.
  • the display device can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device includes any one of the above-mentioned display panels, and the display area of the display panel includes sub-pixel regions Px arranged in rows and columns.
  • the above-mentioned display area may have multiple data lines, and each of the data lines may be between two adjacent columns of sub-pixel areas Px to transmit the accessed data signal or test signal to each sub-pixel area Px.

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Abstract

本申请公开了一种封装结构、显示面板及显示装置，属于显示技术领域。该封装结构(100)包括：包覆在发光器件(200)外侧的层叠的第一无机层(11)和第二无机层(12)。该第一无机层(11)用于调整从发光器件(200)出射的光线中的第一光线的光程，使得该第一光线与从发光器件(200)出射的光线中的第二光线发生干涉，提高了经过封装结构(100)后出射的光线的光强，从而提高了发光器件(200)的出光效率。

Description

封装结构、显示面板及显示装置
本申请要求于2019年11月14日提交的申请号为201911115546.0、发明名称为“封装结构、显示面板及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别涉及一种封装结构、显示面板及显示装置。
背景技术
有机发光二极管(英文：Organic Light-Emitting Diode；简称：OLED)器件具有全固态结构、高亮度、全视角、响应速度快以及可柔性显示等优点，广泛应用于显示行业。
由于空气中的水和氧气等成分对OLED器件的使用寿命影响很大，因此，通常需要采用封装结构对OLED器件进行封装，使OLED器件与空气中的水和氧气等成分隔离，从而延长OLED器件的使用寿命。
发明内容
本申请实施例提供了一种封装结构、显示面板及显示装置。所述技术方案如下：
本申请的一方面，提供一种封装结构，包括：包覆在发光器件外侧的层叠的第一无机层和第二无机层，所述第一无机层相对于所述第二无机层远离所述发光器件，所述第一无机层的厚度小于所述第二无机层的厚度，所述第一无机层的折射率小于所述第二无机层的折射率；
其中，所述第一无机层用于使第一光线与第二光线的光程差约为目标波长的整数倍，所述第一光线为从所述发光器件出射的光线中在所述封装结构内反射后从所述封装结构出射的光线，所述第二光线为从所述发光器件出射的光线中未在所述封装结构内反射且从所述封装结构出射的光线，所述第一光线与波长与所述第二光线的波长均为所述目标波长。
可选地，所述第一光线与所述第二光线均为蓝光。
可选地，所述第一无机层的折射率的范围为[1.3，1.7]，所述第二无机层的折射率的范围为[1.6，1.9]。
可选地，所述第一无机层的厚度的范围为20纳米至120纳米，所述第二无机层的厚度的范围为500纳米至1000纳米。
可选地，所述封装结构还包括：包覆在所述发光器件外侧的层叠的第三无机层和有机层，所述第三无机层相对于所述有机层靠近所述发光器件，所述有机层相对于所述第二无机层靠近所述发光器件。
可选地，所述第三无机层的折射率大于所述有机层的折射率，所述第三无机层的折射率小于所述第二无机层的折射率。
可选地，所述第一无机层的材料包括氮氧化硅，所述第二无机层的材料包括氮化硅。
可选地，所述第三无机层的材料包括氮氧化硅。
可选地，所述第一光线与所述第二光线均为蓝光；
所述第一无机层的折射率的范围为[1.3，1.7]，所述第二无机层的折射率的范围为[1.6，1.9]；
所述第一无机层的厚度的范围为20纳米至120纳米，所述第二无机层的厚度的范围为500纳米至1000纳米；
所述封装结构还包括：包覆在所述发光器件外侧的层叠的第三无机层和有机层，所述第三无机层相对于所述有机层靠近所述发光器件，所述有机层相对于所述第二无机层靠近所述发光器件；
所述第三无机层的折射率大于所述有机层的折射率，所述第三无机层的折射率小于所述第二无机层的折射率。
本申请的另一方面，提供一种显示面板，包括：衬底，位于所述衬底上的发光器件，以及包覆在所述发光器件外侧的封装结构，所述封装结构为权利要求1至9任一所述的封装结构。
可选地，所述显示面板还包括：位于所述发光器件与所述封装结构之间的连接膜层。
可选地，所述封装结构包括：沿远离所述衬底的方向依次包覆在所述发光器件外侧的第三无机层、有机层、第二无机层和第一无机层，所述第三无机层相对于所述有机层靠近所述发光器件，所述第三无机层的折射率大于所述连接膜层的折射率。
可选地，所述第三无机层的折射率大于所述有机层的折射率，所述第三无机层的折射率小于所述第二无机层的折射率。
可选地，所述第一无机层的材料包括氮氧化硅，所述第二无机层的材料包括氮化硅，所述第三无机层的材料包括氮氧化硅。
可选地，所述第三无机层、所述第二无机层以及所述第一无机层由化学气相沉积法形成。
可选地，所述有机层由喷墨打印工艺形成。
可选地，所述连接膜层的材料包括氟化锂。
可选地，所述发光器件包括有机发光二极管。
可选地，所述显示面板还包括：位于所述发光器件与所述封装结构之间的连接膜层；
所述封装结构包括：沿远离所述衬底的方向依次包覆在所述发光器件外侧的第三无机层、有机层、第二无机层和第一无机层，所述第三无机层相对于所述有机层靠近所述发光器件，所述第三无机层的折射率大于所述连接膜层的折射率；
所述第三无机层的折射率大于所述有机层的折射率，所述第三无机层的折射率小于所述第二无机层的折射率。
本申请的另一方面，提供一种显示装置，包括：上述任一所述的显示面板。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种封装结构的结构示意图；
图2是本申请实施例提供的一种发光器件出射的光线在图1示出的封装结构中传输的光路图；
图3是本申请实施例提供的另一种封装结构的结构示意图；
图4是本申请实施例提供的一种显示面板的结构示意图；
图5是本申请实施例提供的显示面板色彩偏差的程度与观察角度的关系曲线，和相关技术中的显示面板色彩偏差的程度与观察角度的关系曲线的对比图；
图6是本申请实施例提供的一种显示装置的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
目前，封装结构可以包括：包覆在OLED器件外侧的多个封装膜层，该多个封装膜层包括交替叠加的无机层和有机层。
但是，OLED器件发出的光线在经过封装结构时，会在封装膜层之间发生反射和折射，光线在进行反射和折射时会存在光能损失的问题，导致OLED器件的出光效率较低。
本申请实施例提供了一种封装结构，该封装结构用于对发光器件进行封装，该发光器件可以为OLED器件。请参考图1，图1是本申请实施例提供的一种封装结构的结构示意图。该封装结构100可以包括：包覆在发光器件200外侧的层叠的第一无机层11和第二无机层12。该第一无机层11相对于第二无机层12远离发光器件200。该第一无机层11的厚度小于第二无机层12的厚度，该第一无机层11的折射率小于第二无机层12的折射率。
在本申请实施例中，该第一无机层11用于调整第一光线的光程，使该第一光线与第二光线的光程差约为目标波长的整数倍(可选地，第一光线与第二光线的光程差约为目标波长的0.8-1.2倍)，此时，第一光线与第二光线满足干涉条件，该第一光线与第二光线即可发生相长干涉。
在波的叠加原理中，若两波的波峰(或波谷)同时抵达同一位置点，称两波在该点同相，干涉波会产生最大的振幅，称为相长干涉(constructive interference)。两束光的光光程差(path difference)等于波长的整数倍时，即可以发生相长干涉。
其中，该第一光线为从发光器件200出射的光线中在封装结构100内反射后从封装结构100出射的光线(也即是该第一光线为在封装结构内经过至少一次反射和至少一次折射后，从封装结构中射出的光线)。该第二光线为从发光器件200出射的光线中未在封装结构100内反射且从封装结构100出射的光线。且该第一光线与第二光线的波长相同，其均可以为目标波长。
示例的，请参考图2，图2是本申请实施例提供的一种发光器件出射的光线在图1示出的封装结构中传输的光路图。其中，实线的箭头表示第一光线，虚线的箭头表示第二光线。第一无机层11能够调整第一光线的光程，使得该第一光线与第二光线满足干涉条件，且由于第一光线和第二光线的光程差为波长的整数倍，进而使得第一光线与第二光线能够发生相长干涉，提高了经过封装结构100后出射的光线的光强。
综上所述，本申请实施例提供的封装结构，包括：包覆在发光器件外侧的第一无机层和第二无机层。该第一无机层用于调整从发光器件出射的光线中的第一光线的光程，使得该第一光线与从发光器件出射的光线中的第二光线发生相长干涉，提高了经过封装结构后出射的光线的光强，从而提高了发光器件的出光效率。
可选地，在本申请实施例中，该第一光线与第二光线均为蓝光，目标波长可以为蓝光的波长。该第一光线与第二光线属于用于发蓝光的发光器件发出的光线。此时，通过第一无机层11能够有效的提高用于发蓝光的发光器件的出光效率。该蓝光的波长的范围为400纳米至480纳米。
示例的，第一无机层11的折射率的范围为[1.3，1.7]，第二无机层12的折射率的范围为[1.6，1.9]。第一无机层11的厚度的范围为[20，120]，单位为纳米，第二无机层12的厚度的范围为[500，1000]，单位为纳米。
可选地，请参考图3，图3是本申请实施例提供的另一种封装结构的结构示意图。封装结构100还可以包括：包覆在发光器件200外侧的层叠的第三无机层13和有机层14。该第三无机层13相对于有机层14靠近发光器件200，且该第三无机层13和有机层14相对于第二无机层12均靠近发光器件200。也即是，封装结构100中的第三无机层13、有机层14、第二无机层12和第一无机层11沿远离发光器件200的方向F依次排布。
在本申请实施例中，第三无机层13的折射率大于有机层14的折射率，且该第三无机层13的折射率小于第二无机层12的折射率。在封装结构100中，沿远离发光器件200的方向依次叠加的第三无机层13属于高折射率层，有机层14属于低折射率层，第二无机层12属于高折射率层，第一无机层11属于低折射率层，也即是，封装结构100包括交替排布的多个高折射率层和多个低折射率层，可以进一步的提高发光器件200的出光效率。
可选地，第一无机层11的材料为氮氧化硅，第二无机层12的材料为氮化硅，第三无机层13的材料为氮氧化硅。
可选地，发光器件200出射的光线中的第一光线的波长与第二光线的波长相同，且第一光线的波长与第二光线的波长可以均为目标波长。第一无机层11用于调整第一光线的光程，使该第一光线的光程与第二光线的光程的光程差为目标波长的整数倍。此时，第一光线与第二光线满足相长干涉条件，该第一光线与第二光线既可发生相长干涉。
本申请实施例提供的封装结构可以是一种薄膜封装(Thin-Film Encapsulation，TFE)结构。
综上所述，本申请实施例提供的封装结构，包括：包覆在发光器件外侧的层叠的第一无机层和第二无机层。该第一无机层用于调整从发光器件出射的光线中的第一光线的光程，使得该第一光线与从发光器件出射的光线中的第二光线发生相长干涉，提高了经过封装结构后出射的光线的光强，从而提高了发光器件的出光效率。
本申请实施例还提供了一种显示面板。请参考图4，图4是本申请实施例提供的一种显示面板的结构示意图。该显示面板可以包括：
衬底300，位于衬底300上的发光器件200，以及包覆在发光器件200外侧的封装结构100。该封装结构100可以为图1示出的封装结构100或图3示出的封装结构100。示例的，该发光器件可以为OLED器件。
可选地，该显示面板还可以包括：位于发光器件200与封装结构100之间的连接膜层400。该连接膜层400用于连接发光器件200和封装结构100。该连接膜层400的材料可以为氟化锂。该连接膜层400的折射率小于封装结构100中的第三无机层13的折射率。
在本申请实施例中，衬底300具有多个像素区域，每个像素区域具有三个子像素区域，其分别为红色子像素区域、绿色子像素区域和蓝色子像素区域。位于衬底300上的发光器件200可以包括：位于红色子像素区域内的用于发红光的发光器件，位于绿色子像素区域内的用于发绿光的发光器件，以及位于蓝色子像素区域内的用于发蓝光的发光器件。
在相关技术中，显示面板中用于发蓝光的OLED器件的蓝光的发光效率(也称为蓝光效率)为130.5坎德拉每安，显示面板中的OLED器件发出的光线仅有 20％左右的光线能够成功穿过封装结构后导出，导致显示面板的出光效率较低。
而在本申请实施例中，通过本申请实施例中的封装结构100中的第一无机层11可以将用于发蓝光的发光器件的蓝光效率提升至137.3坎德拉每安以上，相对于相关技术中的用于发蓝光的OLED器件的蓝光效率提升了5％以上，有效的提高了用于发蓝光的发光器件的出光效率。而显示面板中用于发红光的发光器件的出光效率与相关技术中的用于发红光的OLED器件的出光效率基本相同，用于发绿光的发光器件的绿光的出光效率与相关技术中的用于发绿光的OLED器件的出光效率基本相同，因此，通过本申请实施例中的封装结构100能够有效的提高显示面板的出光效率。
同时，通过本申请实施例中的封装结构100还能够降低显示面板出现色偏的概率。
示例的，请参考图5，图5是本申请实施例提供的显示面板色彩偏差的程度与观察角度的关系曲线，和相关技术中的显示面板色彩偏差的程度与观察角度的关系曲线的对比图。其中，实线代表本申请实施例提供的显示面板色彩偏差的程度与观察角度的关系曲线，虚线代表相关技术中的显示面板色彩偏差的程度与观察角度的关系曲线。
横轴表示观察角度，单位可以为度，0度代表观察方向与显示面板的出光面垂直；观察角度为正的角度，代表从显示面板的一侧(例如右侧)观察显示面板，且观察方向与显示面板的出光面呈锐角；观察角度为负的角度，代表从显示面板的另一侧(例如左侧)观察显示面板，且观察方向与显示面板的出光面呈锐角。纵轴表示色彩偏差的程度，其单位可以为JNCD(英文：just noticeable color difference)。
根据图4可知，在观察角度大于45度时，本申请实施例提供的显示面板的色彩偏差的程度明显小于相关技术的显示面板的色彩偏差的程度，因此，本申请实施例中的显示面板出现色偏的概率较低。
可选地，本申请实施例提供的显示面板中，OLED器件可以为磷光OLED器件，磷光OLED器件为一种通过磷光材料发光的器件，其内量子效率((Internal Quantum Efficiency，IQE)，内量子效率是光电器件的基本性能指标之一)理论上能够高达100％，远高于荧光OLED器件。
当然，本申请实施例提供的显示面板中，OLED器件也可以为荧光OLED，本申请实施例对此不进行限制。
综上所述，本申请实施例提供的显示面板，通过包覆在发光器件外侧的第一无机层调整从发光器件出射的光线中的第一光线的光程，使得该第一光线与从发光器件出射的光线中的第二光线发生相长干涉，提高了经过封装结构后出射的光线的光强，从而提高了发光器件的出光效率，进而提高了显示面板的出光效率。同时，通过本申请实施例提供的显示面板的出现色偏的概率较低。
本申请实施例还提供了一种封装方法。请参考图6，图6是本申请实施例提供的一种封装方法的方法流程图。该方法用于对发光器件进行封装，以在发光器件外侧形成封装结构，该方法可以包括：
在发光器件外侧形成多个封装膜层。这多个封装膜层可以构成封装结构。
该多个封装膜层包括：位于最外侧的层叠的第一无机层和第二无机层，第一无机层相对于第二无机层远离发光器件，第一无机层的厚度小于第二无机层的厚度，第一无机层的折射率小于第二无机层的折射率；
其中，第一无机层用于调整第一光线的光程，使第一光线与第二光线发生相长干涉，第一光线为从发光器件出射的光线中在封装结构中反射后从封装结构出射的光线(也即是该第一光线为在封装结构内经过至少一次反射和至少一次折射后，从封装结构中射出的光线)，第二光线为从发光器件出射的光线中未在封装结构中反射且从封装结构出射的光线。
可选地，在发光器件外侧形成多个封装膜层，包括：在发光器件外侧依次形成第三无机层、有机层、第二无机层和第一无机层。
其中，第三无机层的折射率大于有机层的折射率，且该第三无机层的折射率小于第二无机层的折射率。在封装结构中，沿远离发光器件的方向依次叠加的第三无机层属于高折射率层，有机层属于低折射率层，第二无机层属于高折射率层，第一无机层属于低折射率层，也即是，封装结构包括交替排布的多个高折射率层和多个低折射率层，可以进一步的提高发光器件的出光效率。
示例的，可以在发光器件的外侧通过化学气相沉积(英文：Chemical Vapor Deposition；简称：CVD)形成第三无机层；然后，通过喷墨打印工艺在第三无机层上形成有机层；之后，通过两次CVD在有机层上分别形成第二无机层和第一无机层。
可选地，在本申请实施例中，该第一光线与第二光线均为蓝光，目标波长可以为蓝光的波长。该第一光线与第二光线属于用于发蓝光的发光器件发出的 光线。此时，通过第一无机层11能够有效的提高用于发蓝光的发光器件的出光效率。该蓝光的波长的范围为400纳米至480纳米。
示例的，第一无机层11的折射率的范围为[1.3，1.7]，第二无机层12的折射率的范围为[1.6，1.9]。第一无机层11的厚度的范围为[20，120]，单位为纳米，第二无机层12的厚度的范围为[500，1000]，单位为纳米。
可选地，第一无机层的材料为氮氧化硅，第二无机层的材料为氮化硅，第三无机层的材料为氮氧化硅。
可选地，发光器件出射的光线中的第一光线的波长与第二光线的波长相同，且第一光线的波长与第二光线的波长可以均为目标波长。第一无机层用于调整第一光线的光程，使该第一光线的光程与第二光线的光程的光程差为目标波长的整数倍。此时，第一光线与第二光线满足相长干涉条件，该第一光线与第二光线既可发生相长干涉。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的封装方法形成的封装结构具体原理，可以参考前述封装结构的实施例中的对应内容，在此不再赘述。
综上所述，本申请实施例提供的封装方法，在发光器件外侧形成多个封装膜层，该多个封装膜层可以包括位于最外侧的层叠的第一无机层和第二无机层。该第一无机层用于调整从发光器件出射的光线中的第一光线的光程，使得该第一光线与从发光器件出射的光线中的第二光线发生相长干涉，提高了经过封装结构后出射的光线的光强，从而提高了发光器件的出光效率。
本申请实施例还提供了一种显示装置，该显示装置可以包括图4示出的显示面板。该显示装置可以为：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
图6是本申请实施例提供的一种显示装置的结构示意图。显示装置包括上述任意一种显示面板，该显示面板的显示区内包括行列设置的子像素区域Px。上述显示区中可以具有多条数据线，数据线中的每一条可以在相邻两列子像素区域Px之间，以将所接入的数据信号或测试信号传输至每个子像素区域Px之中。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。 而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间惟一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
在本申请中，术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
以上所述仅为本申请的可选地实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种封装结构，包括：包覆在发光器件(200)外侧的层叠的第一无机层(11)和第二无机层(12)，所述第一无机层(11)相对于所述第二无机层(12)远离所述发光器件(200)，所述第一无机层(11)的厚度小于所述第二无机层(12)的厚度，所述第一无机层(11)的折射率小于所述第二无机层(12)的折射率；
    其中，所述第一无机层(11)用于使第一光线与第二光线的光程差为目标波长的整数倍，所述第一光线为从所述发光器件(200)出射的光线中在所述封装结构(100)内反射后从所述封装结构(100)出射的光线，所述第二光线为从所述发光器件(200)出射的光线中未在所述封装结构(100)内反射且从所述封装结构(100)出射的光线，所述第一光线与波长与所述第二光线的波长均为所述目标波长。
  2. 根据权利要求1所述的封装结构，所述第一光线与所述第二光线均为蓝光。
  3. 根据权利要求1所述的封装结构，所述第一无机层(11)的折射率的范围为[1.3，1.7]，所述第二无机层(12)的折射率的范围为[1.6，1.9]。
  4. 根据权利要求1所述的封装结构，所述第一无机层(11)的厚度的范围为20纳米至120纳米，所述第二无机层(12)的厚度的范围为500纳米至1000纳米。
  5. 根据权利要求1-4任一所述的封装结构，所述封装结构(100)还包括：包覆在所述发光器件(200)外侧的层叠的第三无机层(13)和有机层(14)，所述第三无机层(13)相对于所述有机层(14)靠近所述发光器件(200)，所述有机层(14)相对于所述第二无机层(12)靠近所述发光器件(200)。
  6. 根据权利要求5所述的封装结构，所述第三无机层(13)的折射率大于所述有机层(14)的折射率，所述第三无机层(13)的折射率小于所述第二无 机层(12)的折射率。
  7. 根据权利要求1-4任一所述的封装结构，所述第一无机层(11)的材料包括氮氧化硅，所述第二无机层(12)的材料包括氮化硅。
  8. 根据权利要求5所述的封装结构，所述第三无机层(13)的材料包括氮氧化硅。
  9. 根据权利要求1所述的封装结构，所述第一光线与所述第二光线均为蓝光；
    所述第一无机层(11)的折射率的范围为[1.3，1.7]，所述第二无机层(12)的折射率的范围为[1.6，1.9]；
    所述第一无机层(11)的厚度的范围为20纳米至120纳米，所述第二无机层(12)的厚度的范围为500纳米至1000纳米；
    所述封装结构(100)还包括：包覆在所述发光器件(200)外侧的层叠的第三无机层(13)和有机层(14)，所述第三无机层(13)相对于所述有机层(14)靠近所述发光器件(200)，所述有机层(14)相对于所述第二无机层(12)靠近所述发光器件(200)；
    所述第三无机层(13)的折射率大于所述有机层(14)的折射率，所述第三无机层(13)的折射率小于所述第二无机层(12)的折射率。
  10. 一种显示面板，包括：衬底，位于所述衬底上的发光器件(200)，以及包覆在所述发光器件(200)外侧的封装结构(100)，所述封装结构(100)为权利要求1至9任一所述的封装结构(100)。
  11. 根据权利要求10所述的显示面板，所述显示面板还包括：位于所述发光器件(200)与所述封装结构(100)之间的连接膜层(400)。
  12. 根据权利要求11所述的显示面板，所述封装结构(100)包括：沿远离所述衬底的方向依次包覆在所述发光器件(200)外侧的第三无机层(13)、 有机层(14)、第二无机层(12)和第一无机层(11)，所述第三无机层(13)相对于所述有机层(14)靠近所述发光器件(200)，所述第三无机层(13)的折射率大于所述连接膜层(400)的折射率。
  13. 根据权利要求12所述的显示面板，所述第三无机层(13)的折射率大于所述有机层(14)的折射率，所述第三无机层(13)的折射率小于所述第二无机层(12)的折射率。
  14. 根据权利要求12所述的显示面板，所述第一无机层(11)的材料包括氮氧化硅，所述第二无机层(12)的材料包括氮化硅，所述第三无机层(13)的材料包括氮氧化硅。
  15. 根据权利要求12所述的显示面板，所述第三无机层(13)、所述第二无机层(12)以及所述第一无机层(11)由化学气相沉积法形成。
  16. 根据权利要求12所述的显示面板，所述有机层(14)由喷墨打印工艺形成。
  17. 根据权利要求11或12所述的显示面板，所述连接膜层(400)的材料包括氟化锂。
  18. 根据权利要求10-17任一所述的显示面板，所述发光器件(200)包括有机发光二极管。
  19. 根据权利要求10所述的显示面板，所述显示面板还包括：位于所述发光器件(200)与所述封装结构(100)之间的连接膜层(400)；
    所述封装结构(100)包括：沿远离所述衬底的方向依次包覆在所述发光器件(200)外侧的第三无机层(13)、有机层(14)、第二无机层(12)和第一无机层(11)，所述第三无机层(13)相对于所述有机层(14)靠近所述发光器件(200)，所述第三无机层(13)的折射率大于所述连接膜层(400)的折射率；
    所述第三无机层(13)的折射率大于所述有机层(14)的折射率，所述第三无机层(13)的折射率小于所述第二无机层(12)的折射率。
  20. 一种显示装置，包括：权利要求10至19任一所述的显示面板。
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