WO2021077873A1 - 电致发光显示基板和显示装置 - Google Patents

电致发光显示基板和显示装置 Download PDF

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Publication number
WO2021077873A1
WO2021077873A1 PCT/CN2020/109286 CN2020109286W WO2021077873A1 WO 2021077873 A1 WO2021077873 A1 WO 2021077873A1 CN 2020109286 W CN2020109286 W CN 2020109286W WO 2021077873 A1 WO2021077873 A1 WO 2021077873A1
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WIPO (PCT)
Prior art keywords
touch
layer
base substrate
light
display
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PCT/CN2020/109286
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English (en)
French (fr)
Inventor
高永益
黄炜赟
曾超
黄一桢
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/309,474 priority Critical patent/US11910641B2/en
Publication of WO2021077873A1 publication Critical patent/WO2021077873A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates

Definitions

  • the present disclosure relates to the field of display technology, and in particular to an electroluminescent display substrate and a display device.
  • an electroluminescent display substrate including: a base substrate; a display light-emitting element disposed on the base substrate, the display light-emitting element including a light-emitting layer for emitting light; an encapsulation structure , Arranged on the base substrate and covering the display light-emitting element; a light-shielding structure arranged on the side of the packaging structure away from the base substrate; and an opening, the opening at least penetrating the packaging structure,
  • the orthographic projection of the light-shielding structure on the base substrate is the orthographic projection of the light-emitting layer of the display light-emitting element on the base substrate and the orthographic projection of the opening on the base substrate
  • the light-shielding structure includes a continuously extending first light-shielding part and a second light-shielding part
  • the base substrate includes a first surface close to the display light-emitting element and the light-shielding structure, the first light-
  • the light-emitting layer of the display light-emitting element includes a first surface close to the base substrate, and a vertical distance between at least a part of the second light-shielding portion and the first surface of the base substrate It is smaller than the vertical distance between the first surface of the light-emitting layer and the first surface of the base substrate.
  • the electroluminescent display substrate further includes a touch structure disposed on a side of the packaging structure away from the base substrate, wherein the touch structure includes: disposed away from the packaging structure A first touch layer on one side of the base substrate; and a second touch layer disposed on a side of the first touch layer away from the base substrate, the first touch layer includes A first touch structure with an opening, and the first touch structure constitutes the light shielding structure.
  • the electroluminescent display substrate further includes a touch structure disposed on a side of the packaging structure away from the base substrate, wherein the touch structure includes: disposed away from the packaging structure A first touch layer on one side of the base substrate; and a second touch layer disposed on a side of the first touch layer away from the base substrate, and the second touch layer includes A second touch structure with an opening, and the second touch structure constitutes the light shielding structure.
  • the first touch layer includes a plurality of first touch traces arranged in the same layer, and the first touch structure is one of the plurality of first touch traces close to the A first touch trace of the opening.
  • the second touch layer includes a plurality of second touch traces arranged in the same layer, and the width of the first touch structure is greater than the width of the second touch trace.
  • the first touch layer includes a plurality of first touch traces arranged in the same layer, and the first touch structure is arranged in the same layer as the plurality of first touch traces.
  • a first pseudo touch trace close to the opening.
  • the second touch layer includes a plurality of second touch traces arranged in the same layer, and the width of the first pseudo touch trace is greater than the width of the second touch trace.
  • the second touch layer includes a plurality of second touch traces arranged in the same layer, and the second touch structure is one of the plurality of second touch traces close to the A second touch trace with an opening.
  • the first touch layer includes a plurality of first touch traces arranged in the same layer, and the width of the second touch structure is greater than the width of the first touch trace.
  • the second touch layer includes a plurality of second touch traces disposed in the same layer, and the second touch structure is disposed in the same layer as the plurality of second touch traces.
  • a second pseudo touch trace close to the opening.
  • the first touch layer includes a plurality of first touch traces arranged in the same layer, and the width of the second pseudo touch trace is greater than the width of the first touch trace.
  • the touch control structure further includes a touch insulation layer disposed on a side of the first touch layer away from the base substrate, and the touch insulation layer covers the first touch structure .
  • the touch structure further includes a touch cover layer disposed on a side of the second touch layer away from the base substrate, and the touch cover layer covers the second touch structure .
  • the packaging structure includes: a first inorganic packaging layer disposed on a side of the display light emitting element away from the base substrate; and a first inorganic packaging layer disposed on the first inorganic packaging layer away from the base substrate. And a second inorganic encapsulation layer disposed on the side of the organic encapsulation layer away from the base substrate, wherein the area of the orthographic projection of the organic encapsulation layer on the base substrate is smaller than the The area of the orthographic projection of each of the first inorganic encapsulation layer and the second inorganic encapsulation layer on the base substrate, the orthographic projection of the first light-shielding portion on the base substrate and the The orthographic projection of the organic packaging layer on the base substrate overlaps, and the orthographic projection of the second light shielding portion on the base substrate does not overlap with the orthographic projection of the organic packaging layer on the base substrate .
  • the electroluminescence display substrate further includes: an isolation structure provided on the base substrate, and the orthographic projection of the isolation structure on the base substrate is located in the light emitting of the display light-emitting element. Between the orthographic projection of the layer on the base substrate and the orthographic projection of the opening on the base substrate, the orthographic projection of the light shielding structure on the base substrate and the isolation structure are in the same position. The orthographic projections on the base substrate overlap.
  • the orthographic projection of the second shading portion on the base substrate and the orthographic projection of the isolation structure on the base substrate at least partially overlap.
  • the electroluminescent display substrate further includes: a barrier layer disposed between the packaging structure and the touch structure, wherein the light-shielding structure is located on the barrier layer away from the substrate On the surface of the substrate.
  • a display device including the electroluminescent display substrate described above.
  • Fig. 1 is a schematic cross-sectional view of an electroluminescence display substrate in the related art around an opening;
  • FIG. 2 is a plan view of an electroluminescence display substrate according to an exemplary embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of the electroluminescence display substrate according to an exemplary embodiment of the present disclosure, taken along the line A-A' in FIG. 2;
  • FIG. 4 is a plan view of an electroluminescent display substrate according to an exemplary embodiment of the present disclosure, in which a touch structure included in the electroluminescent display substrate according to an exemplary embodiment of the present disclosure is schematically shown;
  • FIG. 5 is a schematic cross-sectional view of the electroluminescence display substrate according to an exemplary embodiment of the present disclosure, taken along the line B-B' in FIG. 4;
  • FIG. 6 is a schematic cross-sectional view of the electroluminescence display substrate according to an exemplary embodiment of the present disclosure, taken along the line B-B' in FIG. 4;
  • FIG. 7 is a flowchart of a method for manufacturing an electroluminescent display substrate according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a display device according to an embodiment of the present disclosure.
  • the "on”, “formed on” and “disposed on” in this article can mean that one layer is directly formed or disposed on another layer, or it can mean that a layer is directly formed or disposed on another layer.
  • a layer is formed indirectly or arranged on another layer, that is, there are other layers between the two layers.
  • first the terms “first”, “second”, etc. may be used herein to describe various components, components, elements, regions, layers and/or parts, these components, components, elements, regions, and layers And/or part should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and/or section from another.
  • first part, the first member, the first element, the first region, the first layer, and/or the first part discussed below may be referred to as the second part, the second member, the second element, the second region , The second layer and/or the second part without departing from the teachings of the present disclosure.
  • the expressions "located on the same layer”, “same layer arrangement” and the like used mean that two layers, parts, components, structures, elements or parts can be formed by the same patterning process, and this Two layers, parts, components, structures, elements or parts are generally formed of the same material.
  • patterning process generally includes the steps of photoresist coating, exposure, development, etching, and photoresist stripping.
  • one-time patterning process means a process of forming patterned layers, parts, components, etc., using one mask.
  • touch trace refers to a trace that is electrically connected to the touch electrode and used to transmit touch signals
  • the expression “pseudo-touch trace” refers to a trace that is electrically connected to the touch electrode and used to transmit touch signals
  • the touch traces that transmit touch signals are set in the same layer but are not used to transmit actual touch signals.
  • the expression “continuously extending” means that the two parts extend continuously without interruption, that is, the two parts are a whole structure.
  • FIG. 1 is a schematic cross-sectional view of an electroluminescence display substrate in the related art around an opening.
  • the display substrate may include: a base substrate 1, and a thin film transistor (TFT for short) 2, a display light-emitting element 3, an encapsulation structure 4, and a thin film transistor (TFT for short) sequentially arranged on the base substrate 1.
  • the opening 7 may penetrate each film layer on the base substrate 1 and the display substrate in a direction perpendicular to the base substrate 1.
  • the display substrate may further include an isolation column 6 between the opening 7 and the display light-emitting element 3 to prevent water vapor and oxygen from entering the display light-emitting element 3 through the side surface of the opening 7 (for example, the side HS indicated in FIG. 1 ).
  • the display light-emitting element 3 may include an OLED device, that is, it may include an anode, a cathode, and an organic light-emitting layer sandwiched between the anode and the cathode.
  • the light shielding structure 5 may be made of a metal material that does not transmit light.
  • the light emitted from the organic light-emitting layer of the display light-emitting element 3 will be emitted from the opening 7 so that human eyes can observe the phenomenon of light leakage at the edge of the opening.
  • a common practice in the related art is to expand the coverage area of the light shielding structure 5. As shown in FIG. 1, the width of the light shielding structure 5 is increased so that the light shielding structure 5 extends toward the side HS of the opening 7. In this way, a part of the light emitted from the organic light-emitting layer and directed toward the opening 7 (for example, the light L1 in FIG. 1) will be blocked by the light-shielding structure 5 to prevent it from being emitted from the opening 7.
  • FIG. 1 the width of the light shielding structure 5 is increased so that the light shielding structure 5 extends toward the side HS of the opening 7.
  • FIG. 2 is a plan view of an electroluminescence display substrate according to an exemplary embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view of the electroluminescence display substrate according to an exemplary embodiment of the present disclosure taken along line AA′ in FIG. 2 See schematic diagram.
  • the electroluminescent display substrate includes a display area AA and at least one opening 70 located in the display area AA.
  • two openings 70 are provided as an example for illustration. It should be understood that the embodiments of the present disclosure are not limited thereto. In other embodiments, fewer (for example, one) or more openings 70 may be provided.
  • the opening refers to the area on the display substrate used to install the hardware structure.
  • this article will call it an opening, but the opening includes but is not limited to the following forms: Through holes, grooves, openings, etc.
  • the hardware structure may include one or more of the following structures: a front camera, a HOME button, an earpiece, or a speaker.
  • the installation method of the hardware structure is not limited in the embodiment of the present disclosure.
  • the shape of the opening can be determined according to the shape of the hardware structure to be installed.
  • the cross section of the opening in the direction parallel to the base substrate of the display substrate can have one or more of the following shapes: Species: round, oval, rectangle, rounded rectangle, square, diamond, trapezoid, etc.
  • an electroluminescent display substrate such as an OLED display substrate may include: a base substrate 10, a thin film transistor (TFT) 20, a display light-emitting element, and a thin film transistor (TFT) 20 sequentially disposed on the base substrate 10 30.
  • the opening 70 may penetrate each film layer on the base substrate 10 and the display substrate in a direction perpendicular to the base substrate 10.
  • the embodiment of the present disclosure is not limited to this, and the opening 70 may also be provided as needed to penetrate through each film layer except the base substrate 10 in the thickness direction of the base substrate 10.
  • the portion through which the opening 70 penetrates can be set as required, and is not limited herein.
  • the electroluminescent display substrate may further include an insulating layer 21, a pixel defining layer 22, a conductive layer 23, an insulating layer 24 and other film layers.
  • These film layers can refer to the film layers in the related art, and will not be repeated here.
  • the display substrate may further include an isolation structure 60 between the opening 70 and the display light emitting element 30 to prevent water vapor and oxygen from entering through the side of the opening 70 (for example, the side HS indicated in FIG. 3)
  • the light emitting element 30 is shown.
  • the opening 70 includes a closed ring pattern
  • the isolation structure 60 is arranged around the opening 70. Therefore, the isolation structure 60 also includes a closed ring pattern.
  • the shape of the isolation structure 60 is consistent with the shape of the opening 70.
  • the lower opening 70 in FIG. 2 is circular
  • the corresponding isolation structure 60 is also circular
  • the upper opening 70 is rectangular
  • the corresponding isolation structure 60 is also rectangular.
  • the display light-emitting element 30 may include an OLED device, that is, it may include an anode 31, a cathode 33, and an organic light-emitting layer 32 sandwiched between the anode 31 and the cathode 33.
  • the conductive layer 23 may be electrically connected to the source or drain of the thin film transistor 20 through a via 211 formed in the insulating layer 21, and the anode 31 may be electrically connected to the conductive layer 23 through a via 241 formed in the insulating layer 24 , Thereby achieving electrical connection with the source or drain of the thin film transistor 20.
  • the encapsulation structure 40 may include film layers formed alternately of inorganic layers and organic layers.
  • the encapsulation structure 40 may include a first inorganic encapsulation layer 41, an organic encapsulation layer 42, and a second inorganic encapsulation layer 43 arranged in sequence.
  • the organic encapsulation layer 42 is located between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43.
  • the first inorganic encapsulation layer 41, the organic encapsulation layer 42, and the second inorganic encapsulation layer 43 all cover the display light-emitting element 30 to protect the display light-emitting element 30 from water vapor and oxygen. As shown in FIG.
  • the first inorganic encapsulation layer 41 is formed on the side of the display light-emitting element 30 away from the base substrate 10.
  • the organic encapsulation layer 42 is formed on the side of the first inorganic encapsulation layer 41 away from the base substrate 10.
  • the inorganic encapsulation layer 43 is formed on the side of the organic encapsulation layer 42 away from the base substrate 10.
  • the isolation structure 60 may include a first isolation column 61 and a second isolation column 62, that is, more than two isolation columns are provided on one side of the opening 70 to better block water vapor and Oxygen enters the display light-emitting element through the side surface of the opening 70.
  • the first isolation pillar 61 and the second isolation pillar 62 are both disposed between the opening 70 and the display light emitting element 30, and the first isolation pillar 61 is closer to the opening 70 than the second isolation pillar 62.
  • the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 not only cover the display light emitting element 30, but also cover the first isolation pillar 61 and the second isolation pillar 62, the first inorganic encapsulation layer 41 and the second The two inorganic encapsulation layers 43 extend to the side HS of the opening 70.
  • the organic encapsulation layer 42 covers the display light-emitting element 30, but it does not cover the first isolation pillar 61 and the second isolation pillar 62, that is, the organic encapsulation layer 42 extends to the inner side of the second isolation pillar 62 (that is, the second isolation pillar 62 is far away One side of hole 70). With this arrangement, water vapor and oxygen can be prevented from entering the display light emitting element 30 through the side HS of the opening 70.
  • the area of the orthographic projection of the organic encapsulation layer 42 on the base substrate 10 is smaller than that of each of the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 on the base substrate 10.
  • the area of the orthographic projection As shown in FIG. 3, the thickness of the organic encapsulation layer 42 may decrease as it extends toward the opening 70. In this way, the height of the upper surface of the organic encapsulation layer 42 gradually decreases in the direction toward the opening 70.
  • the amount of the organic material layer is increased, so that the organic encapsulation layer 42 having a sufficient thickness can be formed on the edge of the display area. However, in this case, the amount of reflux of the organic material increases.
  • the organic encapsulation layer 42 may be formed all the way to the outside of the first isolation pillar 61 and the second isolation pillar 62, and therefore, the probability that the organic encapsulation layer 42 is exposed on the side HS of the opening 70 increases. As a result, water vapor and oxygen may permeate through the exposed organic encapsulation layer 42 and penetrate into the display light emitting element 30, thereby possibly reducing the reliability of the display device. Therefore, in order not to extend the organic encapsulation layer 42 to the outside of the first isolation pillar 61 and the second isolation pillar 62, the thickness of the organic encapsulation layer 42 may be reduced on the edge of the display area without increasing the amount of the organic material layer.
  • the upper surface of the organic encapsulation layer 42 has a larger thickness to better cover the display light-emitting element 30; in the transition area between the display light-emitting element 30 and the isolation structure 60, the organic encapsulation layer 42 The height of the upper surface gradually decreases, and the organic encapsulation layer 42 is not provided outside the second isolation pillar 62 to prevent the organic encapsulation layer 42 from being exposed on the side HS of the opening 70.
  • the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 extend to the side HS of the opening 70, and the organic encapsulation layer 42 extends to the inner side of the second isolation pillar 62.
  • the packaging structure 40 has a height difference near the isolation structure 60, and the surface of the second inorganic packaging layer 43 away from the base substrate 10 has a height difference near the isolation structure 60.
  • the orthographic projection of the light-shielding structure 50 on the base substrate 10 is located where the orthographic projection of the organic light-emitting layer 32 of the display light-emitting element 30 on the base substrate 10 and the opening 70 are located. Between the orthographic projections on the base substrate 10.
  • the light shielding structure 50 is disposed on the packaging structure 40, that is, on the surface of the packaging structure 40 away from the base substrate 10.
  • the light shielding structure 50 may be disposed on the surface of the second inorganic encapsulation layer 43 away from the base substrate 10.
  • the surface of the second inorganic encapsulation layer 43 away from the base substrate 10 has a height difference near the isolation structure 60.
  • the position of the light emitting element 30 extends to be lower than the position of the display light emitting element 30.
  • the light-emitting layer 32 of the display light-emitting element 30 includes a first surface (ie, the lower surface in the figure) close to the base substrate 10 and a second surface (ie, the upper surface in the figure) far from the base substrate 10, as shown in FIG.
  • the dotted line HL is used to indicate the height position of the first surface of the light-emitting layer 32
  • the dotted line HH is used to indicate the height position of the second surface of the light-emitting layer 32.
  • the light shielding structure 50 when it extends on the surface of the second inorganic encapsulation layer 43 away from the base substrate 10, it extends from a position higher than the light-emitting layer 32 to a position lower than the light-emitting layer 32.
  • a part of the light shielding structure 50 is located at a position higher than the dotted line HH, and another part of the light shielding structure 50 is located at a position lower than the dotted line HH.
  • the light-shielding structure 50 may include a first light-shielding portion 51 and a second light-shielding portion 52 that extend continuously.
  • the orthographic projection of the first light shielding portion 51 on the base substrate 10 overlaps with the orthographic projection of the organic encapsulation layer 42 on the base substrate 10.
  • the orthographic projection of the second light-shielding portion 52 on the base substrate 10 and the orthographic projection of the organic encapsulation layer 42 on the base substrate 10 do not overlap, and the orthographic projection of the second light-shielding portion 52 on the base substrate 10 falls into the first inorganic
  • Each of the encapsulation layer 41 and the second inorganic encapsulation layer 43 is in the orthographic projection on the base substrate 10, and the orthographic projection of the second light shielding portion 52 on the base substrate 10 is located on the organic encapsulation layer 42 on the base substrate 10.
  • the first light-shielding portion 51 is located higher than the organic light-emitting layer 32 of the display light-emitting element 30, and the second light-shielding portion 52 is located lower than the organic light-emitting layer 32 of the display light-emitting element 30, for example, At least a part of the second light shielding portion 52 is located at a position lower than the first surface of the organic light emitting layer 32.
  • the vertical distance between the first light shielding portion 51 and the base substrate 10 is greater than the vertical distance between the display light emitting element 30 and the base substrate 10, and the vertical distance between the second light shielding portion 52 and the base substrate 10 It is smaller than the vertical distance between the display light emitting element 30 and the base substrate 10.
  • the base substrate 10 includes a first surface (hereinafter also referred to as an "upper surface”) close to the display light emitting element 30 and the light shielding structure 50.
  • the vertical distance between the first light shielding portion 51 and the upper surface of the base substrate 10 is greater than the vertical distance between the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10.
  • the vertical distance between the first light shielding portion 51 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire first light shielding portion 51 and the upper surface of the base substrate 10.
  • the vertical distance H1 in FIG. 3 can represent the average value.
  • the vertical distance between the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10.
  • the distance is represented, for example, as shown by the vertical distance H2 in FIG. 3.
  • the vertical distance between the second light shielding portion 52 and the upper surface of the base substrate 10 is smaller than the vertical distance between the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10.
  • the vertical distance between the second light shielding portion 52 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire second light shielding portion 52 and the upper surface of the base substrate 10.
  • the vertical distance H3 in FIG. 3 can represent the average value.
  • the vertical distance between the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 32 of the display light emitting element 30 and the upper surface of the base substrate 10. The distance is represented by H2.
  • the vertical distance between at least a part of the second light shielding portion 52 and the upper surface of the base substrate 10 is smaller than the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 32 and the upper surface of the base substrate 10 .
  • at least a part of the second light shielding portion 52 may include a portion of the second light shielding portion 52 lower than the position HL, and the vertical distance between at least a portion of the second light shielding portion 52 and the upper surface of the base substrate 10 may be determined by the first The average value of a plurality of vertical distances between the portion of the two light-shielding portions 52 lower than the position HL and the upper surface of the base substrate 10 is represented.
  • the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 32 and the upper surface of the base substrate 10 may be as shown in the vertical distance H4 in FIG. 3.
  • the light emitted from the organic light-emitting layer 32 and directed toward the opening 70 are shielded to prevent it from being emitted from the opening 70.
  • the light L2 and L3 in FIG. 3 can be shielded by the second light-shielding portion 52 lower than the organic light-emitting layer 32, so as to prevent these light rays from being emitted from the opening 70. In this way, the light leakage phenomenon existing at the edge of the opening can be reduced or even avoided.
  • FIG. 4 is a plan view of an electroluminescence display substrate according to an exemplary embodiment of the present disclosure, in which the touch structure included in the electroluminescence display substrate according to an exemplary embodiment of the present disclosure is schematically shown
  • FIG. 5 is according to A schematic cross-sectional view of the electroluminescence display substrate of an exemplary embodiment of the present disclosure taken along the line BB′ in FIG. 4.
  • the touch structure 150 may include a plurality of touch electrodes 80 and a plurality of touch wires 90 electrically connected to the plurality of touch electrodes 80.
  • the touch electrode 80 may include a first touch electrode 81 and a second touch electrode 82.
  • the first touch electrodes 81 and the second touch electrodes 82 may be alternately arranged so that they may not overlap each other in the display area.
  • the first touch electrode 81 and the second touch electrode 82 may be disposed on different layers.
  • the first touch electrode 81 and the second touch electrode 82 may be arranged on the same layer.
  • the first touch electrode 81 may be one of a touch driving electrode and a touch sensing electrode
  • the second touch electrode 82 may be the other of a touch driving electrode and a touch sensing electrode.
  • the touch trace 90 may include a first touch trace 91 and a second touch trace 92.
  • the first touch electrode 81 may be electrically connected to the first touch wire 91
  • the second touch electrode 82 may be electrically connected to the second touch wire 92.
  • the first touch trace 91 and the first touch electrode 81 may be provided on the same layer
  • the second touch trace 92 and the second touch electrode 82 may be provided on the same layer. The embodiment is not limited to this.
  • the first touch electrode 81 and the second touch electrode 82 may have a certain transmittance, so that the light emitted from the organic light-emitting layer 32 may be transmitted through the first touch electrode 81 and the second touch electrode 82.
  • the first touch electrode 81 and the second touch electrode 82 may be made of a thin metal layer such as indium tin oxide (ITO), indium zinc oxide (IZO), or silver nanowires, or a transparent conductive layer such as metal grids or carbon nanotubes. It is made of materials, but the embodiments of the present disclosure are not limited thereto.
  • the first touch trace 91 and the second touch trace 92 may be made of low-resistance metal materials such as molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), and aluminum (Al) , That is, they are made of opaque conductive metal materials.
  • Mo molybdenum
  • Ag silver
  • Ti titanium
  • Cu copper
  • Al aluminum
  • the electroluminescent display substrate may include a base substrate 10, a thin film transistor 20 disposed on the base substrate 10, a first insulating layer 110, a conductive layer 120, a second insulating layer 130, and a display light emitting element 300 , The packaging structure 40, the touch structure 150 and the isolation structure 60.
  • the first insulating layer 110 may be at least one layer selected from an interlayer insulating layer, a gate insulating layer, a buffer layer, and a barrier layer.
  • the first insulating layer 110 may be a single-layer or multi-layer structure including silicon oxide or silicon nitride.
  • the thin film transistor 20 is disposed on the base substrate 10, and it may include an active layer, a gate electrode, a source electrode, and a drain electrode.
  • the structure of the thin film transistor 20 may refer to the structure of an existing thin film transistor, which will not be repeated here.
  • the conductive layer 120 is disposed on the side of the first insulating layer 110 away from the base substrate 10. For example, it may be electrically connected to the source or drain of the thin film transistor 20. As shown in FIG. 5, a via 1101 is formed in the first insulating layer 110, and the conductive layer 120 may be electrically connected to the source or drain of the thin film transistor 20 through the via 1101. For another example, the source or drain of the thin film transistor 20 may constitute the conductive layer 120. The embodiments of the present disclosure do not specifically limit this.
  • the second insulating layer 130 is disposed on a side of the conductive layer 120 away from the base substrate 10, and the second insulating layer 130 may also be a single-layer or multi-layer structure including silicon oxide or silicon nitride. As shown in FIG. 5, a via 1301 is formed in the second insulating layer 130.
  • the display light-emitting element 300 is disposed on the side of the second insulating layer 130 away from the base substrate 10.
  • the display light-emitting element 300 may include a first electrode 311, a second electrode 333 and sandwiched between the first electrode and the second electrode.
  • a via 1301 may be formed in the second insulating layer 130, and the first electrode 311 is electrically connected to the conductive layer 120 through the via 1301.
  • the first electrode 311 may be one of an anode and a cathode
  • the second electrode 333 may be the other of an anode and a cathode.
  • the first electrode 311 may be electrically connected to the conductive layer 120 via the via 1301, so as to be electrically connected to the source or drain of the thin film transistor 20.
  • the encapsulation structure 40 may include film layers formed alternately of inorganic and organic layers.
  • the encapsulation structure 40 may include a first inorganic encapsulation layer 41, an organic encapsulation layer 42, and a second inorganic encapsulation layer 43 that are sequentially arranged.
  • the packaging structure 40 can be referred to the above detailed description, which will not be repeated here.
  • the electroluminescent display substrate further includes a touch control structure 150 disposed on the side of the packaging structure 40 away from the base substrate 10. 4 and 5, the touch structure 150 may include a first touch layer 151, a touch insulation layer 153, a second touch layer 152, and a touch cover layer 154.
  • the first touch layer 151 may include a plurality of first touch wires 91 arranged in the same layer
  • the second touch layer 152 may include a plurality of second touch wires 92 arranged in the same layer.
  • the electroluminescent display substrate may further include a barrier layer 160 disposed between the packaging structure 40 and the touch structure 150.
  • the barrier layer 160 is disposed on the surface of the second inorganic packaging layer 43 of the packaging structure 40 away from the base substrate 10, and the orthographic projection of the barrier layer 160 on the base substrate 10 covers the second inorganic packaging layer 43 on the base substrate 10. Orthographic projection on.
  • the barrier layer 160 may include a polymer material. It should be understood that due to the height difference of the packaging structure 40, the barrier layer 160 disposed on the packaging structure 40 will also extend from a position higher than the display light-emitting element 300 to a position lower than the display light-emitting element 300.
  • the first touch layer 151 is disposed on the surface of the barrier layer 160 away from the base substrate 10
  • the touch insulating layer 153 is disposed on the side of the first touch layer 151 away from the base substrate 10
  • the second The touch layer 152 is disposed on the side of the touch insulating layer 153 away from the base substrate 10
  • the touch cover layer 154 is disposed on the side of the second touch layer 152 away from the base substrate 10.
  • the orthographic projection of the touch insulating layer 153 on the base substrate 10 covers the orthographic projection of the first touch layer 151 on the base substrate 10.
  • the touch insulating layer 153 may be a single layer including silicon oxide or silicon nitride. Or multilayer structure.
  • the touch cover layer 154 covers both the first touch layer 151 and the second touch layer 152 to protect touch traces.
  • the bonding force between the touch trace and the inorganic packaging layer is poor, and there is a risk of the touch trace falling off the inorganic packaging layer.
  • the barrier layer 160 By disposing the barrier layer 160 between the packaging structure 40 and the touch structure 150, the touch trace is formed on the barrier layer 160, which increases the bonding force between the two, thereby reducing the risk of the touch trace falling off.
  • the first touch layer 151 includes a first touch structure close to the opening 70, and the first touch structure constitutes a light-shielding structure 50.
  • the first touch layer 151 includes a plurality of first touch traces 91 arranged in the same layer, and the first touch structure is one of the plurality of first touch traces 91 that is close to the opening 70 The first touch trace.
  • the first touch trace close to the opening 70 can transmit touch signals, that is, a first touch trace close to the opening 70 is used to transmit touch signals and to block light. .
  • the first touch structure may be a first pseudo touch trace that is disposed on the same layer as the plurality of first touch traces 91 and is close to the opening 70.
  • a first touch trace close to the opening 70 may be a first dummy touch trace, that is, no actual touch signal is transmitted thereon.
  • a first pseudo touch trace close to the opening 70 is provided in the same layer as the first touch trace 91 for transmitting touch signals, so as to block light.
  • the light-shielding structure 50 includes a first touch trace provided close to the opening 70 or a first pseudo touch trace provided in the same layer as the first touch trace 91.
  • the width of the first touch trace 91 or the first pseudo touch trace used for the light shielding structure 50 is greater than the width of the second touch trace 92. That is, the width of the first touch trace 91 for the light shielding structure 50 is set wide enough so that it extends from a position higher than the display light-emitting element 300 to a position lower than the display light-emitting element 300.
  • a first touch trace 91 for shielding light includes a first portion 911 and a second portion 912 that extend continuously.
  • the first portion 911 of the first touch trace 91 is located on the base substrate 10.
  • the projection overlaps with the orthographic projection of the organic packaging layer 42 on the base substrate 10.
  • the orthographic projection of the second portion 912 of the first touch trace 91 on the base substrate 10 is the same as that of the organic packaging layer 42 on the base substrate 10.
  • the orthographic projections do not overlap, and the orthographic projection of the second portion 912 of the first touch trace 91 on the base substrate 10 falls into each of the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 on the base substrate 10 in the orthographic projection.
  • the first part 911 of the first touch trace 91 is located higher than the display light-emitting element 300, and the second part 912 of the first touch trace 91 is located lower than the display light-emitting element 300.
  • the light-emitting layer 322 of the display light-emitting element 300 includes a first surface close to the base substrate 10 (ie, the lower surface in the figure) and a second surface away from the base substrate 10 (ie, the upper surface in the figure).
  • the dashed line HL is used to indicate the height position of the first surface of the light-emitting layer 322, and the dashed line HH is used to indicate the height position of the second surface of the light-emitting layer 322.
  • the base substrate 10 includes a first surface (hereinafter also referred to as an "upper surface") close to the display light emitting element 300 and the light shielding structure 50.
  • a part of the light shielding structure 50 is located at a position higher than the dotted line HH, and another part of the light shielding structure 50 is located at a position lower than the dotted line HH.
  • the vertical distance between the first portion 911 of the first touch trace 91 and the upper surface of the base substrate 10 is greater than that between the organic light-emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10
  • the vertical distance between the second portion 912 of the first touch trace 91 and the upper surface of the base substrate 10 is less than the vertical distance between the organic light-emitting layer 322 of the display light-emitting element 300 and the upper surface of the base substrate 10 vertical distance.
  • the vertical distance between the first portion 911 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire first portion 911 and the upper surface of the base substrate 10, for example, FIG.
  • the vertical distance H1 in can represent the average value.
  • the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 The distance is represented, for example, as shown by the vertical distance H2 in FIG. 5.
  • the vertical distance between the second portion 912 and the upper surface of the base substrate 10 is smaller than the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10.
  • the vertical distance between the second portion 912 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire second portion 912 and the upper surface of the base substrate 10, for example,
  • the vertical distance H3 in FIG. 5 can represent the average value.
  • the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 The distance is represented by H2.
  • the vertical distance between at least a part of the second portion 912 and the upper surface of the base substrate 10 is smaller than the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 322 and the upper surface of the base substrate 10.
  • at least a portion of the second portion 912 may include a portion of the second portion 912 lower than the position HL, and the vertical distance between at least a portion of the second portion 912 and the upper surface of the base substrate 10 may be determined by the second portion 912.
  • the average value of a plurality of vertical distances between the portion lower than the position HL and the upper surface of the base substrate 10 is represented.
  • the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 322 and the upper surface of the base substrate 10 may be as shown in the vertical distance H4 in FIG. 5.
  • the first part 911 of a first touch trace 91 disposed close to the opening 70 constitutes the first light shielding portion 51
  • the second part of a first touch trace 91 disposed close to the opening 70 912 constitutes the above-mentioned second light shielding portion 52, that is, a first touch trace 91 disposed close to the opening 70 can constitute the light shielding structure 50.
  • the light emitted from the organic light-emitting layer 322 and directed toward the opening 70 (for example, the light L1, L2, L3 in FIG. 5) will be set close to the first touch trace 91 of the opening 70. Block it to prevent it from ejecting from the opening 70.
  • the light-shielding structure 50 can be connected to the first touch trace.
  • the line 91 is formed by the same patterning process, so the number of patterning processes will not be increased, and the manufacturing cost will be saved.
  • the display substrate according to the embodiment of the present disclosure is assembled with a cover substrate such as a color filter substrate, the light emitted by the light-emitting layer can be completely blocked in the opening 70 because it is provided on the display substrate. Therefore, there is no need to additionally install black ink and other light-shielding elements on the cover substrate, which can simplify the manufacturing process of the cover substrate, reduce the manufacturing cost of the cover substrate, and does not require the display substrate and the cover substrate to be boxed. It requires high bonding accuracy, which is beneficial to the entire manufacturing process.
  • the orthographic projection of the isolation structure 60 on the base substrate 10 is located on the orthographic projection of the organic light-emitting layer 322 of the display light-emitting element 300 on the base substrate 10 and the opening 70 is in the Between the orthographic projections on the base substrate 10, and the orthographic projection of the shading structure 50 on the base substrate 10 overlaps with the orthographic projection of the isolation structure 60 on the base substrate 10.
  • the isolation structure 60 may include at least one isolation column and at least one cofferdam structure.
  • the second light shielding portion 52 is on the base substrate 10
  • the orthographic projection and the orthographic projection of the cofferdam structures 63 and 64 on the base substrate 10 at least partially overlap.
  • the embodiment of the present disclosure is not limited thereto, and the isolation structure 60 may include a greater number of isolation columns and a greater number of cofferdam structures.
  • the orthographic projection of the second shading portion 52 of the shading structure 50 on the base substrate 10 and the orthographic projection of the isolation structure 60 on the base substrate 10 at least partially overlap.
  • the material of the isolation column and the cofferdam structure may be photoresist, and the isolation column and the cofferdam structure can be obtained through a photolithography process.
  • the material of the isolation column and the cofferdam structure may be inorganic materials such as silicon nitride, silicon oxide, etc., and the isolation column and the cofferdam structure can be obtained by a dry etching process.
  • the isolation column and the cofferdam structure can be made by the same patterning process as other film layers.
  • the isolation column and the cofferdam structure can be made of a layer of film. The layer structure can also be formed by stacking multiple film layers.
  • FIG. 6 is a schematic cross-sectional view of the electroluminescence display substrate according to an exemplary embodiment of the present disclosure, taken along the line B-B' in FIG. 4. The following mainly describes the differences between the embodiment shown in FIG. 6 and the embodiment shown in FIG. 5. For other structures in the embodiment shown in FIG. 6, reference may be made to the above description of the embodiment shown in FIG. 5.
  • the touch insulating layer 153 is disposed on the side of the blocking layer 160 away from the base substrate 10 and covers the first touch layer 151. Due to the height difference of the packaging structure 40, the touch insulating layer 153 disposed on the packaging structure 40 will also extend from a position higher than the display light-emitting element 300 to a position lower than the display light-emitting element 300.
  • the second touch layer 152 includes a second touch structure close to the opening 70, and the second touch structure constitutes the light shielding structure 50.
  • the second touch layer 152 includes a plurality of second touch traces 92 arranged in the same layer, and the second touch structure is one of the plurality of second touch traces 92 close to the opening 70 The second touch trace.
  • the second touch trace 92 close to the opening 70 can transmit touch signals, that is, the second touch trace 92 close to the opening 70 is used to transmit touch signals and to shield Light.
  • the second touch structure may be a second pseudo touch trace that is disposed on the same layer as the plurality of second touch traces 92 and is close to the opening 70.
  • the second touch trace 92 near the opening 70 may be a second dummy touch trace, that is, no actual touch signal is transmitted thereon.
  • the second pseudo touch trace close to the opening 70 is arranged in the same layer as the second touch trace 92 for transmitting touch signals, so as to block light.
  • the light-shielding structure 50 includes a second touch wire 92 disposed close to the opening 70 or a second pseudo touch wire 92 disposed on the same layer as the second touch wire 92.
  • the width of the second touch trace 92 or the second pseudo touch trace used as the light shielding structure 50 is greater than the width of the first touch trace 91. That is, the width of the second touch trace 92 used as the light shielding structure 50 is set wide enough so that it extends from a position higher than the display light-emitting element 300 to a position lower than the display light-emitting element 300.
  • the second touch trace 92 used as the light shielding structure 50 includes a first portion 921 and a second portion 922 that extend continuously, and the first portion 921 of the second touch trace 92 is on the base substrate 10.
  • the orthographic projection of the above overlaps with the orthographic projection of the organic packaging layer 42 on the base substrate 10.
  • the orthographic projection of the second part 922 of the second touch trace 92 on the base substrate 10 is the same as the orthographic projection of the organic packaging layer 42 on the base substrate.
  • the orthographic projection on 10 does not overlap, and the orthographic projection of the second part 922 of the second touch trace 92 on the base substrate 10 falls into each of the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 on the lining.
  • the first part 921 of the second touch trace 92 is located at a position higher than the display light emitting element 300, and the second part 922 of the second touch trace 92 is located at a position lower than the display light emitting element 300.
  • the light-emitting layer 322 of the display light-emitting element 300 includes a first surface close to the base substrate 10 (ie, the lower surface in the figure) and a second surface away from the base substrate 10 (ie, the upper surface in the figure).
  • the dashed line HL is used to indicate the height position of the first surface of the light-emitting layer 322, and the dashed line HH is used to indicate the height position of the second surface of the light-emitting layer 322.
  • the base substrate 10 includes a first surface (hereinafter also referred to as an "upper surface") close to the display light emitting element 300 and the light shielding structure 50.
  • a part of the light shielding structure 50 is located at a position higher than the dotted line HH, and another part of the light shielding structure 50 is located at a position lower than the dotted line HH.
  • the vertical distance between the first portion 921 of the second touch trace 92 and the upper surface of the base substrate 10 is greater than that between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10
  • the vertical distance between the second portion 922 of the second touch trace 92 and the upper surface of the base substrate 10 is smaller than the distance between the organic light-emitting layer 322 of the display light-emitting element 300 and the upper surface of the base substrate 10 vertical distance.
  • the vertical distance between the first portion 921 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire first portion 921 and the upper surface of the base substrate 10, for example, FIG.
  • the vertical distance H1 in can represent the average value.
  • the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 The distance is represented, for example, as shown by the vertical distance H2 in FIG. 6.
  • the vertical distance between the second portion 922 and the upper surface of the base substrate 10 is smaller than the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10.
  • the vertical distance between the second portion 922 and the upper surface of the base substrate 10 may be represented by the average value of a plurality of vertical distances between the entire second portion 922 and the upper surface of the base substrate 10, for example,
  • the vertical distance H3 in FIG. 6 can represent the average value.
  • the vertical distance between the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 can be determined by the vertical distance between the second surface HH of the organic light emitting layer 322 of the display light emitting element 300 and the upper surface of the base substrate 10 The distance is represented by H2.
  • the vertical distance between at least a part of the second portion 922 and the upper surface of the base substrate 10 is smaller than the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 322 and the upper surface of the base substrate 10.
  • at least a portion of the second portion 922 may include a portion of the second portion 922 lower than the position HL, and the vertical distance between at least a portion of the second portion 922 and the upper surface of the base substrate 10 may be determined by the second portion 922
  • the average value of a plurality of vertical distances between the portion lower than the position HL and the upper surface of the base substrate 10 is represented.
  • the vertical distance between the first surface (ie, the lower surface) of the organic light emitting layer 322 and the upper surface of the base substrate 10 may be as shown in the vertical distance H4 in FIG. 6.
  • the first portion 921 of the second touch trace 92 disposed near the opening 70 constitutes the first light shielding portion 51
  • the second portion 922 of the second touch trace 92 disposed near the opening 70 constitutes
  • the above-mentioned second light-shielding portion 52, that is, the second touch trace 92 disposed close to the opening 70 may constitute the light-shielding structure 50.
  • the light emitted from the organic light-emitting layer 322 and directed toward the opening 70 (for example, the light L1, L2, L3 in FIG. 6) will be blocked by the second touch traces disposed close to the opening 70. It is prevented from ejecting from the opening 70.
  • the light shielding structure and the second touch trace can pass through the same composition The process is formed, so the number of patterning processes will not be increased, and the manufacturing cost will be saved.
  • FIG. 7 is a flowchart of a method for preparing an electroluminescent display substrate according to an embodiment of the present disclosure.
  • the preparation method can be performed according to the following steps. It should be noted that, according to some embodiments of the present disclosure, some of the following steps can be executed individually or in combination, and can be executed in parallel or sequentially, and are not limited to the operation sequence described below.
  • each film layer of the thin film transistor is sequentially formed on the base substrate 10 to form the thin film transistor 20, the first insulating layer 110, the conductive layer 120, the second insulating layer 130, and the isolation structure shown in FIG. 60.
  • step S102 a display light emitting element is formed on the base substrate 10.
  • step S103 an encapsulation structure 40 is formed on the base substrate 10, so that the encapsulation structure 40 encapsulates the display light-emitting element.
  • a barrier layer 160 is formed on the side of the packaging structure 40 away from the base substrate 10.
  • step S105 the touch structure 150 is formed on the side of the barrier layer 160 away from the base substrate 10.
  • a first touch layer 151, a touch insulation layer 153, a second touch layer 152 and a touch cover layer 154 are sequentially formed on the surface of the barrier layer 160 away from the base substrate 10.
  • the first touch layer 151 includes a plurality of first touch traces 91 arranged in the same layer, and one of the plurality of first touch traces 91 close to the opening 70 is formed to be wide enough , So that the first touch trace 91 includes a continuously extending first portion 911 and a second portion 912, the first portion 911 of the first touch trace 91 is located higher than the display light emitting element 300, the first touch The second portion 912 of the wiring 91 is located at a position lower than the display light emitting element 300 to form the light shielding structure 50.
  • step S106 an opening 70 penetrating through the base substrate 10 and each film layer on the base substrate 10 is formed in the area surrounded by the isolation structure 60.
  • laser, stamping, or other cutting methods may be used to remove the respective film layers and portions of the base substrate in the area surrounded by the isolation structure 60 to form the opening 70.
  • the packaging reliability of the display substrate can be improved without changing the existing process flow.
  • the above-mentioned preparation method provided by the embodiment of the present disclosure should have the same characteristics and advantages as the display substrate provided by the embodiment of the present disclosure. Therefore, the characteristics and advantages of the above-mentioned preparation method provided by the embodiment of the present disclosure can be referred to above. The characteristics and advantages of the display substrate described in the article will not be repeated here.
  • the embodiments of the present disclosure also provide a display device, including the electroluminescent display substrate provided in the above embodiments.
  • the display device 1000 may include any of the above display substrates, which may be a display device with at least one opening.
  • the display device 1000 may be any device with a display function, such as a smart phone, a wearable smart watch, smart glasses, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a car monitor, an e-book, etc. Products or parts.

Abstract

提供了一种电致发光显示基板和显示装置。所述显示基板包括：衬底基板；设置在所述衬底基板上的显示发光元件，所述显示发光元件包括用于发出光线的发光层；设置在所述衬底基板上且覆盖所述显示发光元件的封装结构；设置在所述封装结构远离所述衬底基板一侧的遮光结构；和开孔，所述开孔至少贯穿所述封装结构。遮光结构包括连续延伸的第一遮光部分和第二遮光部分，所述第一遮光部分与所述衬底基板之间的垂直距离大于所述显示发光元件的发光层与所述衬底基板之间的垂直距离，所述第二遮光部分的至少一部分与所述衬底基板之间的垂直距离小于所述显示发光元件的发光层与所述衬底基板之间的垂直距离。

Description

电致发光显示基板和显示装置
相关申请的交叉引用
本申请要求于2019年10月22日提交的、申请号为201911009276.5的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种电致发光显示基板和显示装置。
背景技术
随着科技的进步，近年来，异形屏以及全面屏已经逐渐走入大家的视野。不论是异形屏还是全面屏目的都是为了提升显示设备的屏占比。那么，为了实现更高的屏占比，在显示屏的一些位置上需要为一些附加部件(例如摄像头、传感器等等)预留一些开孔。
发明内容
在第一方面，提供了一种电致发光显示基板，包括：衬底基板；显示发光元件，设置在所述衬底基板上，所述显示发光元件包括用于发出光线的发光层；封装结构，设置在所述衬底基板上且覆盖所述显示发光元件；遮光结构，设置在所述封装结构远离所述衬底基板一侧；和开孔，所述开孔至少贯穿所述封装结构，其中，所述遮光结构在所述衬底基板上的正投影位于所述显示发光元件的发光层在所述衬底基板上的正投影与所述开孔在所述衬底基板上的正投影之间，所述遮光结构包括连续延伸的第一遮光部分和第二遮光部分，所述衬底基板包括靠近所述显示发光元件和所述遮光结构的第一表面，所述第一遮光部分与所述衬底基板的第一表面之间的垂直距离大于所述显示发光元件的发光层与所述衬底基板的第一表面之间的垂直距离，所述第二遮光部分的至少一部分与所述衬底基板的第一表面之间的垂直距离小于所述显示发光元件的发光层与所述衬底基板的第一表面之间的垂直距离。
在一些实施例中，所述显示发光元件的发光层包括靠近所述衬底基板的第一表面，所述第二遮光部分的至少一部分与所述衬底基板的第一表面之间的垂直距离小于所述发光层的第一表面与所述衬底基板的第一表面之间的垂直距离。
在一些实施例中，所述电致发光显示基板还包括设置在所述封装结构远离所述衬底基板一侧的触控结构，其中，所述触控结构包括：设置在所述封装结构远离所述衬底基板一侧的第一触控层；和设置在所述第一触控层远离所述衬底基板一侧的第二触控层，所述第一触控层包括靠近所述开孔的第一触控结构，所述第一触控结构构成所述遮光结构。
在一些实施例中，所述电致发光显示基板还包括设置在所述封装结构远离所述衬底基板一侧的触控结构，其中，所述触控结构包括：设置在所述封装结构远离所述衬底基板一侧的第一触控层；和设置在所述第一触控层远离所述衬底基板一侧的第二触控层，所述第二触控层包括靠近所述开孔的第二触控结构，所述第二触控结构构成所述遮光结构。
在一些实施例中，所述第一触控层包括同层设置的多条第一触控走线，所述第一触控结构为所述多条第一触控走线中的靠近所述开孔的一条第一触控走线。
在一些实施例中，所述第二触控层包括同层设置的多条第二触控走线，所述第一触控结构的宽度大于所述第二触控走线的宽度。
在一些实施例中，所述第一触控层包括同层设置的多条第一触控走线，所述第一触控结构为与所述多条第一触控走线同层设置且靠近所述开孔的一条第一伪触控走线。
在一些实施例中，所述第二触控层包括同层设置的多条第二触控走线，所述第一伪触控走线的宽度大于所述第二触控走线的宽度。
在一些实施例中，所述第二触控层包括同层设置的多条第二触控走线，所述第二触控结构为所述多条第二触控走线中的靠近所述开孔的一条第二触控走线。
在一些实施例中，所述第一触控层包括同层设置的多条第一触控走线，所述第二触控结构的宽度大于所述第一触控走线的宽度。
在一些实施例中，所述第二触控层包括同层设置的多条第二触控走线，所述第二触控结构为与所述多条第二触控走线同层设置且靠近所述开孔的一条第二伪触控走线。
在一些实施例中，所述第一触控层包括同层设置的多条第一触控走线，所述第二伪触控走线的宽度大于所述第一触控走线的宽度。
在一些实施例中，所述触控结构还包括设置在所述第一触控层远离所述衬底基板一侧的触控绝缘层，所述触控绝缘层覆盖所述第一触控结构。
在一些实施例中，所述触控结构还包括设置在所述第二触控层远离所述衬底基板一 侧的触控覆盖层，所述触控覆盖层覆盖所述第二触控结构。
在一些实施例中，所述封装结构包括：设置在所述显示发光元件远离所述衬底基板一侧的第一无机封装层；设置在所述第一无机封装层远离所述衬底基板一侧的有机封装层；和设置在所述有机封装层远离所述衬底基板一侧的第二无机封装层，其中，所述有机封装层在所述衬底基板上的正投影的面积小于所述第一无机封装层和所述第二无机封装层中的每一个在所述衬底基板上的正投影的面积，所述第一遮光部分在所述衬底基板上的正投影与所述有机封装层在所述衬底基板上的正投影重叠，并且所述第二遮光部分在所述衬底基板上的正投影与所述有机封装层在所述衬底基板上的正投影不重叠。
在一些实施例中，所述电致发光显示基板还包括：设置在所述衬底基板上的隔离结构，所述隔离结构在所述衬底基板上的正投影位于所述显示发光元件的发光层在所述衬底基板上的正投影与所述开孔在所述衬底基板上的正投影之间，所述遮光结构在所述衬底基板上的正投影与所述隔离结构在所述衬底基板上的正投影重叠。
在一些实施例中，所述第二遮光部分在所述衬底基板上的正投影与所述隔离结构在所述衬底基板上的正投影至少部分地重叠。
在一些实施例中，所述电致发光显示基板还包括：设置在所述封装结构与所述触控结构之间的阻挡层，其中，所述遮光结构位于所述阻挡层远离所述衬底基板的表面上。
在第二方面，提供了一种显示装置，包括上述所述的电致发光显示基板。
附图说明
为了更清楚地说明本公开的示例性实施例的技术方案，下面将对实施例的附图进行简要说明，应当知道，以下描述的附图涉及本公开的一些示例性实施例，而非对本公开的限制，其中：
图1是相关技术中的电致发光显示基板在开孔周围处的剖视示意图；
图2是根据本公开的示例性实施例的电致发光显示基板的平面图；
图3是根据本公开的示例性实施例的电致发光显示基板沿图2中的线A-A’截取的剖视示意图；
图4是根据本公开的示例性实施例的电致发光显示基板的平面图，其中示意性示出了根据本公开的示例性实施例的电致发光显示基板包括的触控结构；
图5是根据本公开的示例性实施例的电致发光显示基板沿图4中的线B-B’截取的 剖视示意图；
图6是根据本公开的示例性实施例的电致发光显示基板沿图4中的线B-B’截取的剖视示意图；
图7是根据本公开实施例的电致发光显示基板的制备方法的流程图；以及
图8是根据本公开实施例的显示装置的示意图。
需要注意的是，为了清晰起见，在用于描述本公开的实施例的附图中，层、结构或区域的尺寸可能被放大或缩小，即这些附图并非按照实际的比例绘制。
具体实施方式
下面通过实施例，并结合附图，对本公开的技术方案作进一步的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本公开实施方式的说明旨在对本公开的总体发明构思进行解释，而不应当理解为对本公开的一种限制。
另外，在下面的详细描述中，为便于解释，阐述了许多细节以提供对本公开实施例的全面理解。然而明显地，一个或多个实施例在没有这些细节的情况下也可以被实施。
需要说明的是，本文中所述的“在……上”、“在……上形成”和“设置在……上”可以表示一层直接形成或设置在另一层上，也可以表示一层间接形成或设置在另一层上，即两层之间还存在其它的层。
需要说明的是，虽然术语“第一”、“第二”等可以在此用于描述各种部件、构件、元件、区域、层和/或部分，但是这些部件、构件、元件、区域、层和/或部分不应受到这些术语限制。而是，这些术语用于将一个部件、构件、元件、区域、层和/或部分与另一个相区分。因而，例如，下面讨论的第一部件、第一构件、第一元件、第一区域、第一层和/或第一部分可以被称为第二部件、第二构件、第二元件、第二区域、第二层和/或第二部分，而不背离本公开的教导。
在本文中，除非另有说明，采用的“位于同一层”、“同层设置”等表述指的是两个层、部件、构件、结构、元件或部分可以通过同一构图工艺形成，并且，这两个层、部件、构件、结构、元件或部分一般由相同的材料形成。
在本文中，除非另有说明，表述“构图工艺”一般包括光刻胶的涂布、曝光、显影、刻蚀、光刻胶的剥离等步骤。表述“一次构图工艺”意指使用一块掩模板形成图案化的层、部件、构件等的工艺。
在本文中，除非另有说明，表述“触控走线”指的是与触控电极电连接并且用于传输触控信号的走线；表述“伪触控走线”指的是与用于传输触控信号的触控走线同层设置但不用于传输实际的触控信号的走线。
在本文中，除非另有说明，表述“连续延伸”表示的意思是：两个部分连续地、无间断地延伸，即，两个部分为一个整体的结构。
图1是相关技术中的电致发光显示基板在开孔周围处的剖视示意图。如图1所示，所述显示基板可以包括：衬底基板1、以及依次设置在衬底基板1上的薄膜晶体管(thin film transistor，简称为TFT)2、显示发光元件3、封装结构4和遮光结构5。例如，开孔7可以在垂直于衬底基板1的方向上贯穿衬底基板1和显示基板上的各个膜层。所述显示基板还可以包括位于开孔7与显示发光元件3之间的隔离柱6，以阻挡水汽和氧气通过开孔7的侧面(例如图1中指示的侧面HS)侵入显示发光元件3。
例如，所述显示发光元件3可以包括OLED器件，即可以包括阳极、阴极和夹设在阳极与阴极之间的有机发光层。
例如，所述遮光结构5可以由不透光的金属材料制成。
所述显示发光元件3的有机发光层发出的光线会从开孔7射出，导致人眼能观察到开孔的边缘存在漏光的现象。为了缓解这种漏光现象，相关技术中通常采取的做法是扩大遮光结构5的覆盖面积。如图1所示，增大遮光结构5的宽度，使得遮光结构5朝向开孔7的侧面HS延伸。这样，从有机发光层发出且朝向开孔7射出的一部分光线(例如图1中的光线L1)会被遮光结构5遮挡，避免其从开孔7射出。然而，如图1所示，从有机发光层发出且朝向开孔7射出的一部分光线(例如图1中的光线L2、L3)没有被遮光结构5遮挡，它们仍可以从开孔7射出，导致人眼仍能观察到开孔7的边缘存在漏光的现象。
图2是根据本公开的示例性实施例的电致发光显示基板的平面图，图3是根据本公开的示例性实施例的电致发光显示基板沿图2中的线A-A’截取的剖视示意图。如图2 所示，所述电致发光显示基板包括显示区域AA，以及位于显示区域AA中的至少一个开孔70。图2中以设置两个开孔70为例进行示意，应该理解，本公开的实施例不局限于此，在其他实施例中，可以设置更少(例如一个)或更多个开孔70。
需要说明的是，本文中所述的“开孔”是显示基板上用来安装硬件结构的区域，为了方便说明，本文将其称为开孔，但所述开孔包括但不限于如下形式：通孔、凹槽、开口等。在一些实施例中，所述硬件结构可以包括下列结构中的一种或多种：前置摄像头、HOME键、听筒或扬声器。所述硬件结构的安装方式，本公开实施例不做限定。另外，可以根据需要安装的所述硬件结构的形状确定所述开孔的形状，例如，所述开孔在平行于显示基板的衬底基板的方向上的截面可以具有下列形状的一种或多种：圆形、椭圆形、矩形、圆角矩形、正方形、菱形、梯形等。
如图3所示，例如OLED显示基板的电致发光显示基板可以包括：衬底基板10，以及依次设置在衬底基板10上的薄膜晶体管(thin film transistor，简称为TFT)20、显示发光元件30、封装结构40和遮光结构50。例如，开孔70可以在垂直于衬底基板10的方向上贯穿衬底基板10和显示基板上的各个膜层。当然，本公开的实施例不局限于此，所述开孔70也可以根据需要设置为在衬底基板10的厚度方向上贯穿除衬底基板10之外的其它各个膜层。所述开孔70贯穿的部分，可以根据需要进行设置，在此不作限定。另外，所述电致发光显示基板还可以包括绝缘层21、像素界定层22、导电层23、绝缘层24等膜层，这些膜层可以参照相关技术中的膜层，在此不再赘述。
继续参照图3，所述显示基板还可以包括位于开孔70与显示发光元件30之间的隔离结构60，以阻挡水汽和氧气通过开孔70的侧面(例如图3中指示的侧面HS)侵入显示发光元件30。在图2的平面图中，开孔70包括封闭的环状图形，隔离结构60围绕开孔70设置，所以，隔离结构60也包括封闭的环状图形。并且，从平面图来看，隔离结构60的形状与开孔70的形状一致。例如，图2中靠下的开孔70为圆形，对应的隔离结构60也为圆形，靠上的开孔70为长方形，对应的隔离结构60也为长方形。
例如，所述显示发光元件30可以包括OLED器件，即可以包括阳极31、阴极33和夹设在阳极31与阴极33之间的有机发光层32。例如，导电层23可以通过形成在绝缘层21中的过孔211与薄膜晶体管20的源极或漏极电连接，阳极31可以通过形成在绝 缘层24中的过孔241与导电层23电连接，从而实现与薄膜晶体管20的源极或漏极电连接。
例如，封装结构40可以包括由无机层和有机层交替形成的膜层，例如封装结构40可以包括依次设置的第一无机封装层41、有机封装层42以及第二无机封装层43。有机封装层42位于第一无机封装层41与第二无机封装层43之间。第一无机封装层41、有机封装层42以及第二无机封装层43均覆盖显示发光元件30，以保护显示发光元件30免受水汽和氧气的侵蚀。如图3所示，第一无机封装层41形成在显示发光元件30远离衬底基板10的一侧，有机封装层42形成在第一无机封装层41远离衬底基板10的一侧，第二无机封装层43形成在有机封装层42远离衬底基板10的一侧。
如图3所示，所述隔离结构60可以包括第一隔离柱61和第二隔离柱62，即，在开孔70的一侧设置有2个以上的隔离柱，以较好地阻挡水汽和氧气通过开孔70的侧面侵入显示发光元件。例如，第一隔离柱61和第二隔离柱62均设置在开孔70与显示发光元件30之间，第一隔离柱61比第二隔离柱62更靠近开孔70。
例如，如图3所示，第一无机封装层41和第二无机封装层43不仅覆盖显示发光元件30，还覆盖第一隔离柱61和第二隔离柱62，第一无机封装层41和第二无机封装层43延伸至开孔70的侧面HS。有机封装层42覆盖显示发光元件30，但它不覆盖第一隔离柱61和第二隔离柱62，即，有机封装层42延伸至第二隔离柱62的内侧(即第二隔离柱62远离开孔70的一侧)。通过这样的设置，可以阻挡水汽和氧气通过开孔70的侧面HS侵入显示发光元件30。
例如，所述有机封装层42在所述衬底基板10上的正投影的面积小于所述第一无机封装层41和所述第二无机封装层43中的每一个在所述衬底基板10上的正投影的面积。如图3所示，有机封装层42的厚度可随着其朝向开孔70的方向延伸而减小，这样，有机封装层42的上表面的高度沿朝向开孔70的方向逐渐地减小。在实施时，当形成有机封装层42时，增加有机材料层的量，使得可在显示区域的边缘上形成具有足够厚度的有机封装层42。然而，在此情况下，有机材料的回流量增加。然后，有机封装层42可一直形成至第一隔离柱61和第二隔离柱62的外侧，且因此，有机封装层42在开孔70的侧面HS上暴露的概率增加。结果，水汽和氧气可渗透通过暴露的有机封装层42而侵 入显示发光元件30，从而可能降低显示设备的可靠性。因此，为了不使有机封装层42一直延伸至第一隔离柱61和第二隔离柱62的外侧，可不增加有机材料层的量而在显示区域的边缘上减小有机封装层42的厚度。因此，在显示发光元件30上方，有机封装层42的上表面的厚度较大，以较好地覆盖显示发光元件30；在显示发光元件30与隔离结构60之间的过渡区域，有机封装层42的上表面的高度逐渐减小，并且，在第二隔离柱62外侧，不设置有机封装层42，以避免有机封装层42在开孔70的侧面HS上暴露。
如图3所示，第一无机封装层41和第二无机封装层43延伸至开孔70的侧面HS，有机封装层42延伸至第二隔离柱62的内侧。这样，封装结构40在隔离结构60附近存在高度差，第二无机封装层43远离衬底基板10的表面在隔离结构60的附近存在高度差。
继续参照图3，遮光结构50在所述衬底基板10上的正投影位于所述显示发光元件30的有机发光层32在所述衬底基板10上的正投影与所述开孔70在所述衬底基板10上的正投影之间。遮光结构50设置在封装结构40上，即位于封装结构40远离衬底基板10的表面上。遮光结构50可以设置在第二无机封装层43远离衬底基板10的表面上。第二无机封装层43远离衬底基板10的表面在隔离结构60附近存在高度差，这样，遮光结构50在第二无机封装层43远离衬底基板10的表面上延伸时，可以从高于显示发光元件30的位置延伸至低于显示发光元件30的位置。显示发光元件30的发光层32包括靠近衬底基板10的第一表面(即图中的下表面)和远离衬底基板10的第二表面(即图中的上表面)，如图3所示，用虚线HL表示发光层32的第一表面所处的高度位置，用虚线HH表示发光层32的第二表面所处的高度位置。在图3所示的实施例中，遮光结构50在第二无机封装层43远离衬底基板10的表面上延伸时，从高于发光层32的位置延伸至低于发光层32的位置。例如，遮光结构50的一部分位于高于虚线HH的位置，遮光结构50的另一部分位于低于虚线HH的位置。
如图3所示，遮光结构50可以包括连续延伸的第一遮光部分51和第二遮光部分52。第一遮光部分51在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影重叠。第二遮光部分52在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影不重叠，第二遮光部分52在衬底基板10上的正投影落入第一无机封装层41 和第二无机封装层43中的每一个在衬底基板10上的正投影内，第二遮光部分52在衬底基板10上的正投影位于有机封装层42在衬底基板10上的正投影与所述开孔70在衬底基板10上的正投影之间。这样，如图3所示，第一遮光部分51位于高于显示发光元件30的有机发光层32的位置，第二遮光部分52位于低于显示发光元件30的有机发光层32的位置，例如，第二遮光部分52的至少一部分位于低于有机发光层32的第一表面的位置。换句话说，第一遮光部分51与衬底基板10之间的垂直距离大于显示发光元件30与衬底基板10之间的垂直距离，第二遮光部分52与衬底基板10之间的垂直距离小于显示发光元件30与衬底基板10之间的垂直距离。
如图3所示，所述衬底基板10包括靠近所述显示发光元件30和所述遮光结构50的第一表面(以下又称为“上表面”)。
例如，第一遮光部分51与衬底基板10的上表面之间的垂直距离大于显示发光元件30的有机发光层32与衬底基板10的上表面之间的垂直距离。在此处，第一遮光部分51与衬底基板10的上表面之间的垂直距离可以由整个第一遮光部分51与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图3中的垂直距离H1可以表示该平均值。显示发光元件30的有机发光层32与衬底基板10的上表面之间的垂直距离可以由显示发光元件30的有机发光层32的第二表面HH与衬底基板10的上表面之间的垂直距离表示，例如，图3中的垂直距离H2所示。
第二遮光部分52与衬底基板10的上表面之间的垂直距离小于显示发光元件30的有机发光层32与衬底基板10的上表面之间的垂直距离。在此处，第二遮光部分52与衬底基板10的上表面之间的垂直距离可以由整个第二遮光部分52与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图3中的垂直距离H3可以表示该平均值。显示发光元件30的有机发光层32与衬底基板10的上表面之间的垂直距离可以由显示发光元件30的有机发光层32的第二表面HH与衬底基板10的上表面之间的垂直距离H2表示。
例如，第二遮光部分52的至少一部分与衬底基板10的上表面之间的垂直距离小于有机发光层32的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离。在此处，第二遮光部分52的至少一部分可以包括第二遮光部分52低于位置HL的部分，第 二遮光部分52的至少一部分与衬底基板10的上表面之间的垂直距离可以由第二遮光部分52低于位置HL的部分与衬底基板10的上表面之间的多个垂直距离的平均值表示。例如，有机发光层32的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离可以如图3中的垂直距离H4所示。
通过这样的设置方式，如图3所示，从有机发光层32发出且朝向开孔70射出的光线(例如图3中的光线L1、L2、L3)均会被遮光结构50(包括第一遮光部分51和第二遮光部分52)遮挡，避免其从开孔70射出。例如图3中的光线L2、L3可以被低于有机发光层32的第二遮光部分52遮挡，而避免这些光线从开孔70射出。这样，能够减轻、甚至避免开孔的边缘处存在的漏光现象。
图4是根据本公开的示例性实施例的电致发光显示基板的平面图，其中示意性示出了根据本公开的示例性实施例的电致发光显示基板包括的触控结构，图5是根据本公开的示例性实施例的电致发光显示基板沿图4中的线B-B’截取的剖视示意图。
参照图4，触控结构150可以包括多个触控电极80以及电连接至多个触控电极80的多根触控走线90。示例性地，触控电极80可包括第一触控电极81和第二触控电极82。第一触控电极81和第二触控电极82可交替地设置，使得它们可在显示区域中彼此不重叠。例如，第一触控电极81和第二触控电极82可设置在不同的层上。当然，在其他实施例中，第一触控电极81和第二触控电极82可设置在相同的层上。例如，第一触控电极81可以是触控驱动电极和触控感应电极中的一者，第二触控电极82可以是触控驱动电极和触控感应电极中的另一者。
继续参照图4，触控走线90可以包括第一触控走线91和第二触控走线92。第一触控电极81可以电连接至第一触控走线91，并且第二触控电极82可以电连接至第二触控走线92。例如，第一触控走线91和第一触控电极81可以设置在相同的层上，第二触控走线92和第二触控电极82可以设置在相同的层上，但是本公开的实施例不限于此。
例如，第一触控电极81和第二触控电极82可具有确定的透射率，使得从有机发光层32发出的光可通过第一触控电极81和第二触控电极82透射。例如，第一触控电极81和第二触控电极82可由诸如氧化铟锡(ITO)、氧化铟锌(IZO)或银纳米线的薄金属层或诸如金属网格或碳纳米管的透明导电材料制成，但是本公开的实施例不限于此。
例如，第一触控走线91和第二触控走线92可由诸如钼(Mo)、银(Ag)、钛(Ti)、铜(Cu)、铝(Al)的低电阻金属材料制成，即，它们由不透光的导电金属材料制成。
参照图5，所述电致发光显示基板可以包括衬底基板10、设置在衬底基板10上的薄膜晶体管20、第一绝缘层110、导电层120、第二绝缘层130、显示发光元件300、封装结构40、触控结构150和隔离结构60。
例如，第一绝缘层110可以是从层间绝缘层、栅绝缘层、缓冲层和阻挡层中的选择的至少一层。例如，第一绝缘层110可为包括氧化硅或氮化硅的单层或多层结构。
薄膜晶体管20设置在衬底基板10上，它可以包括有源层、栅极、源极和漏极，其结构可以参照已有的薄膜晶体管的结构，在此不再赘述。
导电层120设置在第一绝缘层110远离衬底基板10的一侧。例如，它可以电连接至薄膜晶体管20的源极或漏极。如图5所示，第一绝缘层110中形成有过孔1101，导电层120可以经由过孔1101电连接至薄膜晶体管20的源极或漏极。再例如，薄膜晶体管20的源极或漏极可以构成所述导电层120。本公开的实施例不对此做特别的限定。
第二绝缘层130设置在导电层120远离衬底基板10的一侧，第二绝缘层130也可以为包括氧化硅或氮化硅的单层或多层结构。如图5所示，第二绝缘层130中形成有过孔1301。
显示发光元件300设置在第二绝缘层130远离衬底基板10的一侧，所述显示发光元件300可以包括第一电极311、第二电极333和夹设在第一电极与第二电极之间的有机发光层322。如图5所示，第二绝缘层130中可以形成有过孔1301，第一电极311经由过孔1301与导电层120电连接。例如，第一电极311可以为阳极和阴极中的一个，第二电极333可以为阳极和阴极中的另一个。第一电极311可以经由过孔1301与导电层120电连接，从而实现与薄膜晶体管20的源极或漏极电连接。
封装结构40可以包括由无机层和有机层交替形成的膜层，例如，封装结构40可以包括依次设置的第一无机封装层41、有机封装层42以及第二无机封装层43。封装结构40可以参照上文的详细描述，在此不再赘述。
所述电致发光显示基板还包括触控结构150，设置在封装结构40远离衬底基板10的一侧。结合图4和图5，触控结构150可以包括第一触控层151、触控绝缘层153、第 二触控层152和触控覆盖层154。其中，第一触控层151可以包括同层设置的多条第一触控走线91，第二触控层152可以包括同层设置的多条第二触控走线92。
如图5所示，所述电致发光显示基板还可以包括设置在封装结构40与触控结构150之间的阻挡层160。阻挡层160设置在封装结构40的第二无机封装层43远离衬底基板10的表面上，并且，阻挡层160在衬底基板10上的正投影覆盖第二无机封装层43在衬底基板10上的正投影。例如，阻挡层160可以包括聚合物材料。应该理解，由于封装结构40存在高度差，所以设置在封装结构40上的阻挡层160也会从高于显示发光元件300的位置延伸至低于显示发光元件300的位置。
如图5所示，第一触控层151设置在阻挡层160远离衬底基板10的表面上，触控绝缘层153设置在第一触控层151远离衬底基板10的一侧，第二触控层152设置在触控绝缘层153远离衬底基板10的一侧，触控覆盖层154设置在第二触控层152远离衬底基板10的一侧。触控绝缘层153在衬底基板10上的正投影覆盖第一触控层151在衬底基板10上的正投影，例如，触控绝缘层153可为包括氧化硅或氮化硅的单层或多层结构。触控覆盖层154覆盖第一触控层151和第二触控层152两者，以保护触控走线。
将触控走线直接形成在封装结构的无机封装层上，触控走线与无机封装层之间的结合力较差，存在触控走线从无机封装层上脱落的风险。通过在封装结构40与触控结构150之间设置阻挡层160，使得触控走线形成在阻挡层160上，增加了二者之间的结合力，从而降低了触控走线脱落的风险。
继续参照图5，所述第一触控层151包括靠近开孔70的第一触控结构，所述第一触控结构构成遮光结构50。例如，第一触控层151包括同层设置的多条第一触控走线91，所述第一触控结构为多条第一触控走线91中的靠近所述开孔70的一条第一触控走线。需要说明的是，靠近开孔70的第一触控走线上可以传输触控信号，即，靠近开孔70的一条第一触控走线既用于传输触控信号，又用于遮挡光线。
在一些实施例中，所述第一触控结构可以为与所述多条第一触控走线91同层设置且靠近所述开孔70的一条第一伪触控走线。也就是说，靠近开孔70的一条第一触控走线可以是第一伪(dummy)触控走线，即，其上不传输实际的触控信号。在此情况下，靠近开孔70的一条第一伪触控走线与用于传输触控信号的第一触控走线91同层设置， 以用于遮挡光线。
也就是说，所述遮光结构50包括靠近开孔70设置的一条第一触控走线或与第一触控走线91同层设置的一条第一伪触控走线。如图5所示，用于所述遮光结构50的第一触控走线91或第一伪触控走线的宽度大于第二触控走线92的宽度。即，用于所述遮光结构50的第一触控走线91的宽度设置得足够宽，使得其从高于显示发光元件300的位置延伸至低于显示发光元件300的位置。
如图5所示，用于遮光的一条第一触控走线91包括连续延伸的第一部分911和第二部分912，第一触控走线91的第一部分911在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影重叠，第一触控走线91的第二部分912在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影不重叠，并且第一触控走线91的第二部分912在衬底基板10上的正投影落入第一无机封装层41和第二无机封装层43中的每一个在衬底基板10上的正投影内。这样，第一触控走线91的第一部分911位于高于显示发光元件300的位置，第一触控走线91的第二部分912位于低于显示发光元件300的位置。如图5所示，显示发光元件300的发光层322包括靠近衬底基板10的第一表面(即图中的下表面)和远离衬底基板10的第二表面(即图中的上表面)，用虚线HL表示发光层322的第一表面所处的高度位置，用虚线HH表示发光层322的第二表面所处的高度位置。所述衬底基板10包括靠近所述显示发光元件300和所述遮光结构50的第一表面(以下又称为“上表面”)。例如，遮光结构50的一部分位于高于虚线HH的位置，遮光结构50的另一部分位于低于虚线HH的位置。
在一些实施例中，第一触控走线91的第一部分911与衬底基板10的上表面之间的垂直距离大于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离，第一触控走线91的第二部分912与衬底基板10的上表面之间的垂直距离小于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离。在此处，第一部分911与衬底基板10的上表面之间的垂直距离可以由整个第一部分911与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图5中的垂直距离H1可以表示该平均值。显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离可以由显示发光元件300的有机发光层322的第二表面HH与衬底基板10的上表面之间 的垂直距离表示，例如，图5中的垂直距离H2所示。
第二部分912与衬底基板10的上表面之间的垂直距离小于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离。在此处，第二部分912与衬底基板10的上表面之间的垂直距离可以由整个第二部分912与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图5中的垂直距离H3可以表示该平均值。显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离可以由显示发光元件300的有机发光层322的第二表面HH与衬底基板10的上表面之间的垂直距离H2表示。
例如，第二部分912的至少一部分与衬底基板10的上表面之间的垂直距离小于有机发光层322的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离。在此处，第二部分912的至少一部分可以包括第二部分912低于位置HL的部分，第二部分912的至少一部分与衬底基板10的上表面之间的垂直距离可以由第二部分912低于位置HL的部分与衬底基板10的上表面之间的多个垂直距离的平均值表示。例如，有机发光层322的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离可以如图5中的垂直距离H4所示。
在该实施例中，靠近开孔70设置的一条第一触控走线91的第一部分911构成上述第一遮光部分51，靠近开孔70设置的一条第一触控走线91的第二部分912构成上述第二遮光部分52，即，靠近开孔70设置的一条第一触控走线91可以构成所述遮光结构50。通过这样的设置方式，从有机发光层322发出且朝向开孔70射出的光线(例如图5中的光线L1、L2、L3)均会被靠近开孔70设置的一条第一触控走线91遮挡，避免其从开孔70射出。例如图5中的光线L2、L3可以被低于有机发光层322的第二部分912遮挡，而避免这些光线从开孔70射出。这样，能够减轻、甚至避免开孔的边缘处存在的漏光现象。此外，通过将靠近所述开孔70的一条第一触控走线91或第一伪触控走线设置为所述遮光结构50，可以使得所述遮光结构50与所述第一触控走线91通过同一构图工艺形成，所以，不会额外增加构图工艺的次数，并且有利于节省制造成本。另外，当将根据本公开实施例的显示基板与例如彩膜基板等的覆盖基板对盒组装时，由于设置在所述显示基板可以完全遮挡所述发光层发出的光线在所述开孔70内传播，所以，不需 要再额外地在覆盖基板上设置黑色油墨等遮光元件，可以简化覆盖基板的制造工艺，降低覆盖基板的制造成本，并且无需要求所述显示基板与所述覆盖基板对盒时需要较高的贴合精度，从而有利于整个制造工艺。
如图5所示，隔离结构60在所述衬底基板10上的正投影位于显示发光元件300的有机发光层322在所述衬底基板10上的正投影与所述开孔70在所述衬底基板10上的正投影之间，并且遮光结构50在所述衬底基板10上的正投影与隔离结构60在所述衬底基板10上的正投影重叠。例如，隔离结构60可以包括至少一个隔离柱和至少一个围堰结构。在图5示出的实施例中，示例性地示出了2个隔离柱61、62和2个围堰结构63、64，并且所述第二遮光部分52在所述衬底基板10上的正投影与所述围堰结构63、64在所述衬底基板10上的正投影至少部分地重叠。然而，本公开的实施例不局限于此，所述隔离结构60可以包括更多数量的隔离柱和更多数量的围堰结构。在一些实施例中，所述遮光结构50的第二遮光部分52在所述衬底基板10上的正投影与所述隔离结构60在所述衬底基板10上的正投影至少部分地重叠。
在一些实施例中，所述隔离柱和所述围堰结构的材料可以为光刻胶，可以通过光刻工艺得到所述隔离柱和所述围堰结构。再例如，所述隔离柱和所述围堰结构的材料可以为氮化硅、氧化硅等无机材料，可以通过干法刻蚀工艺得到所述隔离柱和所述围堰结构。在实际的制造过程中，为了节省工艺，所述隔离柱和所述围堰结构可以与其他膜层通过同一构图工艺制成，例如，所述隔离柱和所述围堰结构可以由一层膜层构成，也可以由多层膜层堆叠而成。通过设置所述隔离柱和所述围堰结构，进一步延长了水汽和氧气侵入显示发光元件的路径，从而提高了封装信赖性。
图6是根据本公开的示例性实施例的电致发光显示基板沿图4中的线B-B’截取的剖视示意图。下面主要描述图6所示的实施例与图5所示的实施例的不同之处，图6所示的实施例中的其他结构可以参照上文针对图5所示的实施例的描述。
参照图6，触控绝缘层153设置在阻挡层160远离衬底基板10的一侧并且覆盖第一触控层151。由于封装结构40存在高度差，所以设置在封装结构40上的触控绝缘层153也会从高于显示发光元件300的位置延伸至低于显示发光元件300的位置。
继续参照图6，所述第二触控层152包括靠近开孔70的第二触控结构，所述第二 触控结构构成遮光结构50。例如，第二触控层152包括同层设置的多条第二触控走线92，所述第二触控结构为多条第二触控走线92中的靠近所述开孔70的一条第二触控走线。需要说明的是，靠近开孔70的第二触控走线92上可以传输触控信号，即，靠近开孔70的第二触控走线92既用于传输触控信号，又用于遮挡光线。
在一些实施例中，所述第二触控结构可以为与所述多条第二触控走线92同层设置且靠近所述开孔70的一条第二伪触控走线。也就是说，靠近开孔70的第二触控走线92可以是第二伪(dummy)触控走线，即，其上不传输实际的触控信号。在此情况下，靠近开孔70的第二伪触控走线与用于传输触控信号的第二触控走线92同层设置，以用于遮挡光线。
也就是说，所述遮光结构50包括靠近开孔70设置的一条第二触控走线92或与第二触控走线92同层设置的一条第二伪触控走线。如图6所示，用作所述遮光结构50的第二触控走线92或第二伪触控走线的宽度大于第一触控走线91的宽度。即，用作所述遮光结构50的第二触控走线92的宽度设置得足够宽，使得其从高于显示发光元件300的位置延伸至低于显示发光元件300的位置。
如图6所示，用作所述遮光结构50的第二触控走线92包括连续延伸的第一部分921和第二部分922，第二触控走线92的第一部分921在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影重叠，第二触控走线92的第二部分922在衬底基板10上的正投影与有机封装层42在衬底基板10上的正投影不重叠，第二触控走线92的第二部分922在衬底基板10上的正投影落入第一无机封装层41和第二无机封装层43中的每一个在衬底基板10上的正投影内。这样，第二触控走线92的第一部分921位于高于显示发光元件300的位置，第二触控走线92的第二部分922位于低于显示发光元件300的位置。如图6所示，显示发光元件300的发光层322包括靠近衬底基板10的第一表面(即图中的下表面)和远离衬底基板10的第二表面(即图中的上表面)，用虚线HL表示发光层322的第一表面所处的高度位置，用虚线HH表示发光层322的第二表面所处的高度位置。所述衬底基板10包括靠近所述显示发光元件300和所述遮光结构50的第一表面(以下又称为“上表面”)。例如，遮光结构50的一部分位于高于虚线HH的位置，遮光结构50的另一部分位于低于虚线HH的位置。
在一些实施例中，第二触控走线92的第一部分921与衬底基板10的上表面之间的垂直距离大于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离，第二触控走线92的第二部分922与衬底基板10的上表面之间的垂直距离小于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离。在此处，第一部分921与衬底基板10的上表面之间的垂直距离可以由整个第一部分921与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图6中的垂直距离H1可以表示该平均值。显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离可以由显示发光元件300的有机发光层322的第二表面HH与衬底基板10的上表面之间的垂直距离表示，例如，图6中的垂直距离H2所示。
第二部分922与衬底基板10的上表面之间的垂直距离小于显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离。在此处，第二部分922与衬底基板10的上表面之间的垂直距离可以由整个第二部分922与衬底基板10的上表面之间的多个垂直距离的平均值表示，例如，图6中的垂直距离H3可以表示该平均值。显示发光元件300的有机发光层322与衬底基板10的上表面之间的垂直距离可以由显示发光元件300的有机发光层322的第二表面HH与衬底基板10的上表面之间的垂直距离H2表示。
例如，第二部分922的至少一部分与衬底基板10的上表面之间的垂直距离小于有机发光层322的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离。在此处，第二部分922的至少一部分可以包括第二部分922低于位置HL的部分，第二部分922的至少一部分与衬底基板10的上表面之间的垂直距离可以由第二部分922低于位置HL的部分与衬底基板10的上表面之间的多个垂直距离的平均值表示。例如，有机发光层322的第一表面(即下表面)与衬底基板10的上表面之间的垂直距离可以如图6中的垂直距离H4所示。
在该实施例中，靠近开孔70设置的第二触控走线92的第一部分921构成上述第一遮光部分51，靠近开孔70设置的第二触控走线92的第二部分922构成上述第二遮光部分52，即，靠近开孔70设置的第二触控走线92可以构成所述遮光结构50。通过这样的设置方式，从有机发光层322发出且朝向开孔70射出的光线(例如图6中的光线L1、 L2、L3)均会被靠近开孔70设置的第二触控走线遮挡，避免其从开孔70射出。例如图6中的光线L2、L3可以被低于有机发光层322的第二部分922遮挡，而避免这些光线从开孔70射出。这样，能够减轻、甚至避免开孔的边缘处存在的漏光现象。此外，通过将靠近所述开孔的一条第二触控走线或第二伪触控走线设置为所述遮光结构，可以使得所述遮光结构与所述第二触控走线通过同一构图工艺形成，所以，不会额外增加构图工艺的次数，并且有利于节省制造成本。
图7是根据本公开实施例的电致发光显示基板的制备方法的流程图。结合图5和图7，所述制备方法可以按照以下步骤执行。需要说明的是，根据本公开的一些实施例，下面的一些步骤可以单独执行或组合执行，以及可以并行执行或顺序执行，并不局限于下文描述的操作顺序。
在步骤S101中，在衬底基板10上依次形成薄膜晶体管的各个膜层，以形成图5中所示的薄膜晶体管20、第一绝缘层110、导电层120、第二绝缘层130和隔离结构60。
在步骤S102中，在衬底基板10上形成显示发光元件。
在步骤S103中，在衬底基板10上形成封装结构40，使得封装结构40封装显示发光元件。
在步骤S104中，在封装结构40远离衬底基板10的一侧形成阻挡层160。
在步骤S105中，在阻挡层160远离衬底基板10的一侧形成触控结构150。
例如，如图5所示，在阻挡层160远离衬底基板10的表面上依次形成第一触控层151、触控绝缘层153、第二触控层152和触控覆盖层154。第一触控层151包括同层设置的多条第一触控走线91，多条第一触控走线91中的靠近所述开孔70的一条第一触控走线形成得足够宽，使得该第一触控走线91包括连续延伸的第一部分911和第二部分912，该第一触控走线91的第一部分911位于高于显示发光元件300的位置，该第一触控走线91的第二部分912位于低于显示发光元件300的位置，以形成所述遮光结构50。
在步骤S106中，在隔离结构60包围的区域中形成贯穿衬底基板10和衬底基板10上的各个膜层的开孔70。
例如，可以采用激光、冲压或者其他切削加工的方式去除隔离结构60围绕的区域内的各个膜层和衬底基板的部分，以形成开孔70。
在上述制备方法中，可以在不改变现有工艺流程的情况下提高显示基板的封装信赖性。
需要说明的是，上述实施例为对根据本公开实施例的制备方法的示例性说明，在不背离本公开技术构思的情况下，可以对各个步骤的执行过程或步骤之间的顺序进行改变。
应理解，本公开实施例的提供的上述制备方法应该具备与本公开实施例提供的显示基板具有相同的特点和优点，所以，本公开实施例的提供的上述制备方法的特点和优点可以参照上文描述的显示基板的特点和优点，在此不再赘述。
本公开的实施例还提供一种显示装置，包括上述实施例所提供的电致发光显示基板。如图8所示，其示出了根据本公开实施例的显示装置的平面图，显示装置1000可以包括以上任一项所述的显示基板，其可以是一种带有至少一个开孔的显示装置。例如，所述显示装置1000可以是例如智能手机、可穿戴式智能手表、智能眼镜、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、车载显示器、电子书等任何具有显示功能的产品或部件。
虽然本公开总体构思的一些实施例已被图示和说明，本领域普通技术人员将理解，在不背离本公开的总体构思的原则和精神的情况下，可对这些实施例做出改变，本公开的范围以权利要求和它们的等同物限定。

Claims (19)

  1. 一种电致发光显示基板，包括：
    衬底基板；
    显示发光元件，设置在所述衬底基板上，所述显示发光元件包括用于发出光线的发光层；
    封装结构，设置在所述衬底基板上且覆盖所述显示发光元件；
    遮光结构，设置在所述封装结构远离所述衬底基板一侧；和
    开孔，所述开孔至少贯穿所述封装结构，
    其中，所述遮光结构在所述衬底基板上的正投影位于所述显示发光元件的发光层在所述衬底基板上的正投影与所述开孔在所述衬底基板上的正投影之间，
    所述遮光结构包括连续延伸的第一遮光部分和第二遮光部分，所述衬底基板包括靠近所述显示发光元件和所述遮光结构的第一表面，所述第一遮光部分与所述衬底基板的第一表面之间的垂直距离大于所述显示发光元件的发光层与所述衬底基板的第一表面之间的垂直距离，所述第二遮光部分的至少一部分与所述衬底基板的第一表面之间的垂直距离小于所述显示发光元件的发光层与所述衬底基板的第一表面之间的垂直距离。
  2. 根据权利要求1所述的电致发光显示基板，其中，所述显示发光元件的发光层包括靠近所述衬底基板的第一表面，所述第二遮光部分的至少一部分与所述衬底基板的第一表面之间的垂直距离小于所述发光层的第一表面与所述衬底基板的第一表面之间的垂直距离。
  3. 根据权利要求1或2所述的电致发光显示基板，还包括设置在所述封装结构远离所述衬底基板一侧的触控结构，其中，所述触控结构包括：设置在所述封装结构远离所述衬底基板一侧的第一触控层；和设置在所述第一触控层远离所述衬底基板一侧的第二触控层，
    所述第一触控层包括靠近所述开孔的第一触控结构，所述第一触控结构构成所述遮光结构。
  4. 根据权利要求1或2所述的电致发光显示基板，还包括设置在所述封装结构远离所述衬底基板一侧的触控结构，其中，所述触控结构包括：设置在所述封装结构远离所述衬底基板一侧的第一触控层；和设置在所述第一触控层远离所述衬底基板一侧的第二触控层，所述第二触控层包括靠近所述开孔的第二触控结构，所述第二触控结构构成所述遮光结构。
  5. 根据权利要求3所述的电致发光显示基板，其中，所述第一触控层包括同层设置的多条第一触控走线，所述第一触控结构为所述多条第一触控走线中的靠近所述开孔的一条第一触控走线。
  6. 根据权利要求5所述的电致发光显示基板，其中，所述第二触控层包括同层设置的多条第二触控走线，所述第一触控结构的宽度大于所述第二触控走线的宽度。
  7. 根据权利要求3所述的电致发光显示基板，其中，所述第一触控层包括同层设置的多条第一触控走线，所述第一触控结构为与所述多条第一触控走线同层设置且靠近所述开孔的一条第一伪触控走线。
  8. 根据权利要求7所述的电致发光显示基板，其中，所述第二触控层包括同层设置的多条第二触控走线，所述第一伪触控走线的宽度大于所述第二触控走线的宽度。
  9. 根据权利要求4所述的电致发光显示基板，其中，所述第二触控层包括同层设置的多条第二触控走线，所述第二触控结构为所述多条第二触控走线中的靠近所述开孔的一条第二触控走线。
  10. 根据权利要求9所述的电致发光显示基板，其中，所述第一触控层包括同层设置的多条第一触控走线，所述第二触控结构的宽度大于所述第一触控走线的宽度。
  11. 根据权利要求4所述的电致发光显示基板，其中，所述第二触控层包括同 层设置的多条第二触控走线，所述第二触控结构为与所述多条第二触控走线同层设置且靠近所述开孔的一条第二伪触控走线。
  12. 根据权利要求11所述的电致发光显示基板，其中，所述第一触控层包括同层设置的多条第一触控走线，所述第二伪触控走线的宽度大于所述第一触控走线的宽度。
  13. 根据权利要求1-2和5-12中任一项所述的电致发光显示基板，其中，所述触控结构还包括设置在所述第一触控层远离所述衬底基板一侧的触控绝缘层，所述触控绝缘层覆盖所述第一触控结构。
  14. 根据权利要求4和9-12中任一项所述的电致发光显示基板，其中，所述触控结构还包括设置在所述第二触控层远离所述衬底基板一侧的触控覆盖层，所述触控覆盖层覆盖所述第二触控结构。
  15. 根据权利要求1-2和5-12中任一项所述的电致发光显示基板，其中，所述封装结构包括：
    设置在所述显示发光元件远离所述衬底基板一侧的第一无机封装层；
    设置在所述第一无机封装层远离所述衬底基板一侧的有机封装层；和
    设置在所述有机封装层远离所述衬底基板一侧的第二无机封装层，
    其中，所述有机封装层在所述衬底基板上的正投影的面积小于所述第一无机封装层和所述第二无机封装层中的每一个在所述衬底基板上的正投影的面积，
    所述第一遮光部分在所述衬底基板上的正投影与所述有机封装层在所述衬底基板上的正投影重叠，并且所述第二遮光部分在所述衬底基板上的正投影与所述有机封装层在所述衬底基板上的正投影不重叠。
  16. 根据权利要求15所述的电致发光显示基板，还包括：设置在所述衬底基板上的隔离结构，所述隔离结构在所述衬底基板上的正投影位于所述显示发光元件的发光层在所述衬底基板上的正投影与所述开孔在所述衬底基板上的正投影之间，
    所述遮光结构在所述衬底基板上的正投影与所述隔离结构在所述衬底基板上的正投影重叠。
  17. 根据权利要求16所述的电致发光显示基板，其中，所述第二遮光部分在所述衬底基板上的正投影与所述隔离结构在所述衬底基板上的正投影至少部分地重叠。
  18. 根据权利要求1-2和5-12中任一项所述的电致发光显示基板，还包括：设置在所述封装结构与所述触控结构之间的阻挡层，其中，所述遮光结构位于所述阻挡层远离所述衬底基板的表面上。
  19. 一种显示装置，包括上述任一项权利要求所述的电致发光显示基板。
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