WO2021068332A1 - 电路板抗震性能测试装置 - Google Patents
电路板抗震性能测试装置 Download PDFInfo
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- WO2021068332A1 WO2021068332A1 PCT/CN2019/117479 CN2019117479W WO2021068332A1 WO 2021068332 A1 WO2021068332 A1 WO 2021068332A1 CN 2019117479 W CN2019117479 W CN 2019117479W WO 2021068332 A1 WO2021068332 A1 WO 2021068332A1
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- vibration
- circuit board
- support plate
- vibration component
- seat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
Definitions
- the invention belongs to a test fixture, and in particular relates to a test device for the anti-vibration performance of a circuit board.
- the built-in circuit board of power equipment is an important core component, and the circuit board itself is often composed of a number of electronic components.
- the anti-vibration performance of the circuit board also has a great influence on the service life of power equipment.
- some anti-seismic structures will be installed in the power equipment to improve the anti-seismic performance of the circuit board.
- the seismic performance of the circuit board itself is still very important to power equipment. Especially in some areas with high earthquake occurrence, it is especially important.
- the present invention proposes a circuit board seismic performance test device.
- Circuit board seismic performance test equipment including:
- the rack includes: a bottom plate, a support plate arranged above the bottom plate, a left longitudinal plate and a right longitudinal plate.
- the bottom plate is fixedly connected to the left and right longitudinal plates, and the support plate slides with the left and right longitudinal plates respectively. connection;
- the first vibration component is arranged on the support plate, the first vibration component is in transmission connection with the clamping component, and the first vibration component is used to drive the circuit board to be tested to swing left and right;
- the second vibration component is arranged between the support plate and the bottom plate, the second vibration component is connected to the support plate in transmission, and the second vibration component is used to drive the support plate to move in the vertical direction;
- the test device is electrically connected to the circuit board to be tested, and is used to test the performance of the circuit board to be tested.
- the invention discloses a circuit board anti-vibration performance test device. Its structure is simple.
- the first vibration component gives the circuit board to be tested swinging left and right, and the second vibration component gives the circuit board to be tested vertical vibration, which is multi-directional.
- the vibration method can monitor the seismic performance of the circuit board in all aspects.
- the clamping assembly includes: a U-shaped clamping portion and an elastic pad installed on the clamping side of the U-shaped clamping portion.
- the U-shaped clamping portion is used to clamp the two ends of the circuit board, and the additional elastic pads ensure that the damage to the circuit board is minimized when the circuit board is shaken.
- the first vibration component includes: at least one set of left vibration components and at least one set of right vibration components;
- Both the left vibration component and the right vibration component include:
- the guide rod is installed on the support plate
- the sleeve is sleeved on the guide rod, and the sleeve can slide along the guide rod;
- the connecting plate, the two ends of the connecting plate are respectively connected to the sleeve and the clamping assembly in rotation;
- a sleeve driving mechanism, the sleeve driving mechanism and the sleeve are in transmission connection, and the sleeve driving mechanism drives the sleeve to slide along the guide rod.
- a limit block is provided at the top end and/or the bottom end of the guide rod.
- the guide rod is slidably connected to the support plate.
- the position of the clamping assembly is adjusted to facilitate clamping of the circuit board.
- a third vibration component which is drivingly connected to the circuit board to be tested, and the third vibration component is used to vibrate the circuit board to be tested.
- the third vibration component vibrates the circuit board to be tested with vibration, and the vibration mode is more diversified.
- the third vibration component includes: a vibration motor provided on the support plate, a vibration connector connected to the vibration motor, and a plurality of vibration claws connected to the vibration connector, and the vibration claws are in contact with the circuit board to be tested.
- the vibration claw is used to support the circuit board to be tested, and the third vibration component can realize the vibration in the vertical direction with a small vibration amplitude but a slightly faster vibration speed.
- the second vibration component includes:
- the upper vibration block, the upper vibration block is installed on the bottom surface of the support plate, and the upper vibration block is provided with a first protrusion with a sawtooth cross section;
- the lower vibration block, the lower vibration block is slidably connected with the surface of the bottom plate, and a second protrusion with a sawtooth cross-section is provided on the lower vibration block, and the second protrusion can engage with the first protrusion;
- the lower vibrating block drives the cylinder, the lower vibrating block driving cylinder is in transmission connection with the lower vibrating block, and the lower vibrating block driving cylinder pushes the lower vibrating block to slide, thereby driving the support plate to move in the vertical direction.
- the second vibration component can be used to achieve jitter vibration in the vertical direction with a large vibration amplitude but a slightly slow vibration speed.
- the air vent of the lower vibrating block driving cylinder is connected to an external air device through an air flow adjusting device, and the air flow is adjusted by the air flow adjusting device, thereby adjusting the operating speed of the output end of the lower vibrating block driving cylinder.
- the vertical shaking speed of the circuit board to be tested is adjusted by adjusting the operating speed of the output end of the lower vibrating block driving cylinder.
- the airflow size adjustment device includes:
- the air flow seat is provided with a first through hole on the air flow seat, and a regular polygonal sliding groove is provided on the outer side of the first through hole;
- the guide seat is arranged on one side of the airflow seat, a second through hole corresponding to the first through hole is provided on the guide seat, and a plurality of guide grooves are provided on the outer side of the second through hole on the guide seat;
- a plurality of baffles are arranged between the airflow seat and the guide seat, and a first protrusion and a second protrusion are respectively provided on opposite sides of the baffle, and the first protrusion extends into the sliding groove, The second protrusion extends into the guide groove;
- the driving device is respectively connected with the airflow seat and the guide seat, and the driving device drives the airflow seat and the guide seat to rotate to change the position of the baffle, thereby changing the size of the exposed hole after the first through hole and the second through hole are matched.
- the airflow size adjusting device can effectively adjust the size of the exposed hole after the first through hole and the second through hole are matched, thereby adjusting the size of the airflow, with low noise, low power, and low cost.
- FIG. 1 is one of the structural schematic diagrams of a circuit board seismic performance testing device provided by an embodiment of the present invention.
- FIG. 2 is the second structural diagram of the device for testing seismic performance of a circuit board provided by an embodiment of the present invention.
- FIG. 3 is the third structural diagram of the device for testing seismic performance of a circuit board provided by an embodiment of the present invention.
- Fig. 4 is a schematic structural diagram of a vibrating claw provided by an embodiment of the present invention.
- Fig. 5 is a schematic structural diagram of an airflow seat provided by an embodiment of the present invention.
- Fig. 6 is a schematic diagram of the structure of the airflow seat and the baffle provided by the embodiment of the present invention.
- Fig. 7 is a schematic structural diagram of a guide seat provided by an embodiment of the present invention.
- the circuit board seismic performance testing device includes:
- the rack includes: a bottom plate, a support plate 2, a left longitudinal plate 3 and a right longitudinal plate 4 arranged above the bottom plate.
- the bottom plate is fixedly connected to the left longitudinal plate 3 and the right longitudinal plate 4, and the support plate 2 is respectively connected to the left longitudinal plate.
- the board 3 and the right longitudinal board 4 are slidingly connected;
- the clamping assembly 5 is used to clamp the circuit board 10 to be tested
- the first vibration component is arranged on the support plate 2, and the first vibration component is in transmission connection with the clamping component 5, and the first vibration component is used to drive the circuit board 10 to be tested to swing left and right;
- the second vibration component is arranged between the support plate 2 and the bottom plate, the second vibration component is connected to the support plate 2 in transmission, and the second vibration component is used to drive the support plate 2 to move in the vertical direction;
- a test device (not shown in the figure), which is electrically connected to the circuit board 10 to be tested, and is used to test the performance of the circuit board 10 to be tested.
- the test device is used to detect the circuit board in or after the shock to check whether the performance of the circuit board is perfect.
- the invention discloses a circuit board seismic performance testing device, which has a simple structure.
- the first vibration component gives the circuit board 10 to be tested swinging left and right, and the second vibration component gives the circuit board 10 to be tested vertical vibration.
- the azimuth vibration method can monitor the seismic performance of the circuit board in all aspects.
- the remaining feature technology is the same, the difference is that the clamping assembly 5 includes: a U-shaped clamping portion 51 and a clamping portion mounted on the U-shaped clamping portion 51 The side of the elastic cushion 52.
- the U-shaped clamping portion 51 is used to clamp the two ends of the circuit board, and the additional elastic pads ensure that the damage to the circuit board is minimized when the circuit board is shaken.
- the remaining characteristic technologies are the same, except that the first vibration component includes: at least one set of left vibration components and at least one set of right vibration components;
- Both the left vibration component and the right vibration component include:
- the guide rod 61 is installed on the support plate 2;
- the sleeve 62 is sleeved on the guide rod 61, and the sleeve 62 can slide along the guide rod 61;
- a connecting plate 63, the two ends of the connecting plate 63 are respectively rotatably connected with the sleeve 62 and the clamping assembly 5;
- the sleeve 62 driving mechanism (not shown in the figure), the sleeve 62 driving mechanism and the sleeve 62 are drivingly connected, and the sleeve 62 driving mechanism drives the sleeve 62 to slide along the guide rod 61.
- a limiting block 64 is provided at the top end and/or the bottom end of the guide rod 61.
- the remaining characteristic technologies are the same, except that the guide rod 61 is slidably connected to the support plate 2.
- the position of the clamping assembly 5 is adjusted to facilitate clamping of the circuit board.
- a third vibration component which is in transmission connection with the circuit board 10 to be tested, and the third vibration component is used to vibrate the circuit board 10 to be tested.
- the third vibration component vibrates the circuit board 10 to be tested by shaking, and the vibration modes are more diverse.
- the third vibration assembly includes: a vibration motor 71 arranged on the support plate 2, a vibration connector 72 that is connected to the vibration motor 71 in transmission, and a plurality of vibration claws 73 connected to the vibration connector 72.
- the vibration claws 73 and the to-be-tested The circuit board 10 is in contact.
- the vibration claw 73 is used to support the circuit board 10 to be tested, and the third vibration component can realize the vibration in the vertical direction with a small vibration amplitude but a slightly faster vibration speed.
- the clamping component 5 is first released to hold the circuit board, and only the vibration claw 73 is required to support the circuit board.
- the second vibration component includes:
- the upper vibration block, the upper vibration block is installed on the bottom surface of the support plate 2, and the upper vibration block is provided with a first protrusion 82 with a serrated cross section;
- the lower vibration block 83 is slidably connected to the surface of the bottom plate.
- the lower vibration block 83 is provided with a second protrusion 84 with a sawtooth cross-section, and the second protrusion 84 can be engaged with the first protrusion 82;
- the lower vibrating block drives the air cylinder 85, the lower vibrating block driving air cylinder 85 is in transmission connection with the lower vibrating block 83, and the lower vibrating block driving air cylinder 85 pushes the lower vibrating block 83 to slide, thereby driving the support plate 2 to move in the vertical direction.
- the second vibration component can be used to achieve jitter vibration in the vertical direction with a large vibration amplitude but a slightly slow vibration speed.
- the air vent of the lower vibrating block driving cylinder 85 is connected to an external air device through the air flow size adjusting device 9, and the air flow is adjusted by the air flow size adjusting device 9 to adjust the operating speed of the output end of the lower vibrating block driving cylinder 85.
- the vertical shaking speed of the circuit board 10 to be tested is adjusted by adjusting the operating speed of the output end of the lower vibrating block driving cylinder 85 to realize variable speed motion.
- the airflow size adjustment device 9 includes:
- the airflow seat 91 is provided with a first through hole 92 on the airflow seat 91, and a regular polygonal sliding groove 93 is provided on the outer side of the first through hole 92;
- the guide seat 94 is arranged on one side of the air flow seat 91.
- the guide seat 94 is provided with a second through hole 95 corresponding to the first through hole 92, and a plurality of second through holes 95 are provided on the guide seat 94 outside of the second through hole 95 Guide groove 96;
- a plurality of baffles are arranged between the airflow seat 91 and the guide seat 94.
- the first and second projections 99 are respectively provided on the opposite sides of the baffle. The first projections extend into the sliding recess. In the groove 93, the second protrusion 99 extends into the guide groove 96;
- the driving device is respectively connected with the airflow seat 91 and the guide seat 94.
- the driving device drives the airflow seat 91 and the guide seat 94 to rotate, changing the position of the baffle, thereby changing the exposed hole after the first through hole 92 and the second through hole 95 are matched the size of.
- the air flow adjusting device 9 can effectively adjust the size of the exposed hole after the first through hole 92 and the second through hole 95 are matched, thereby adjusting the air flow with low noise, low power and low cost.
- the sleeve 62 driving mechanism drives the sleeve 62 to slide along the guide rod 61, so that the circuit board moves left and right, and the lower vibration block drives the cylinder 85 to push the lower vibration block 83. Sliding, thereby driving the support plate 2 to move in the vertical direction, these two movement modes can operate at the same time.
- the vibration motor 71 drives the circuit board to move in a rapid and small range in the vertical direction
- the lower vibration block drives the cylinder 85 to push and vibrate.
- the block 83 slides, thereby driving the support plate 2 to move in the vertical direction at a variable speed, and these two movement modes can also operate at the same time.
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Abstract
电路板（10）抗震性能测试装置包括：机架，机架包括：底板（1）、设置于底板（1）上方的支撑板（2）、左纵向板（3）以及右纵向板（4），底板（1）分别与左纵向板（3）和右纵向板（4）固定连接，支撑板（2）分别与左纵向板（3）和右纵向板（4）滑动连接；夹持组件（5），用于对待测试电路板（10）进行夹持；第一震动组件，设置于支撑板（2）上，第一震动组件用于带动待测试电路板（10）进行左右摆动；第二震动组件，第二震动组件用于带动支撑板（2）沿竖直方向运动；测试装置，用于测试待测试电路板（10）的性能。多方位的震动方式可以对待测试电路板（10）的抗震性能进行全方面的监测。
Description
本发明属于测试治具，具体涉及一种电路板抗震性能测试装置。
电力设备内置的电路板是其重要的核心组成部分，而电路板本身常由若干电子元器件构成。电路板抗震性能的好快也对电力设备的使用寿命有很大的影响。虽然，在电力设备内会设置一些抗震结构来提高电路板的抗震性能。但是，电路板本身抗震性能的好坏对电力设备而言还是很重要。尤其在一些地震高发地带，就显得尤其重要。
而现有的装置中没有对电路板抗震性能的检测，故一种电路板抗震性能测试装置亟需提出。
发明内容
为了解决上述技术问题，本发明提出了一种电路板抗震性能测试装置。
为了达到上述目的，本发明的技术方案如下：
电路板抗震性能测试装置，包括：
机架，机架包括：底板、设置于底板上方的支撑板、左纵向板以及右纵向板，底板分别与左纵向板和右纵向板固定连接，支撑板分别与左纵向板和右纵向板滑动连接；
夹持组件，用于对待测试电路板进行夹持；
第一震动组件，设置于支撑板上，第一震动组件与夹持组件传动连接，第一震动组件用于带动待测试电路板进行左右摆动；
第二震动组件，设置于支撑板与底板之间，第二震动组件与支撑板传动连接，第二震动组件用于带动支撑板沿竖直方向运动；
测试装置，测试装置与待测试电路板电连接，用于测试待测试电 路板的性能。
本发明公开一种电路板抗震性能测试装置，其结构简单，第一震动组件给待测试电路板以左右摆动的震动，第二震动组件给待测试电路板以竖直方向的震动，多方位的震动方式可以对电路板的抗震性能进行全方面的监测。
在上述技术方案的基础上，还可做如下改进：
作为优选的方案，夹持组件包括：U形夹持部以及安装于U形夹持部夹持侧的弹力垫。
采用上述优选的方案，采用U形夹持部对电路板的两端进行夹持，且增设的弹性垫保证电路板在震动时，对其的损伤降到最低。
作为优选的方案，第一震动组件包括：至少一组左震动组件和至少一组右震动组件；
左震动组件和右震动组件均包括：
导杆，导杆安装于支撑板上；
套筒，套筒套设于导杆上，且套筒可沿导杆滑动；
连接板，连接板的两端分别与套筒和夹持组件转动连接；
套筒驱动机构，套筒驱动机构与套筒传动连接，套筒驱动机构驱动套筒沿导杆滑动。
采用上述优选的方案，实现电路板的左右摆动。
作为优选的方案，在导杆的顶端和/或其底端设有限位块。
采用上述优选的方案，限制电路板的摆动幅度。
作为优选的方案，导杆与支撑板滑动连接。
采用上述优选的方案，调整夹持组件的位置，便于对电路板进行夹持。
作为优选的方案，还包括：第三震动组件，第三震动组件与待测试电路板传动连接，第三震动组件用于对待测试电路板进行震动。
采用上述优选的方案，第三震动组件对待测试电路板以抖动震 动，震动方式更多样化。
作为优选的方案，第三震动组件包括：设置与支撑板上的震动电机、与震动电机传动连接的震动连接件以及与震动连接件连接的多个震动爪，震动爪与待测试电路板接触。
采用上述优选的方案，采用震动爪对待测试电路板进行支撑，且第三震动组件可实现震动幅度小但是震动速度稍快的竖直方向上的抖动震动。
作为优选的方案，第二震动组件包括：
上震动块，上震动块安装于支撑板的底面，且在上震动块上设有截面呈锯齿状的第一凸起；
下震动块，下震动块与底板表面呈滑动连接，在下震动块上设有截面呈锯齿状的第二凸起，且第二凸起与第一凸起可啮合；
下震动块驱动气缸，下震动块驱动气缸与下震动块传动连接，下震动块驱动气缸推动下震动块滑动，从而带动支撑板沿竖直方向运动。
采用上述优选的方案，利用第二震动组件可实现震动幅度大但是震动速度稍缓慢的竖直方向上的抖动震动。
作为优选的方案，下震动块驱动气缸的通气口通过气流大小调节装置与外接空气设备连接，通过气流大小调节装置调节气流大小，从而调节下震动块驱动气缸输出端的运行速度。
采用上述优选的方案，通过调整下震动块驱动气缸输出端的运行速度来调整待测试电路板竖直方向上的抖动速度。
作为优选的方案，气流大小调节装置包括：
气流座，在气流座上设有第一通孔，在第一通孔的外侧设有正多边形的滑动凹槽；
导向座，设置于气流座的一侧，在导向座上设有与第一通孔对应的第二通孔，在导向座上第二通孔的外侧设有多个导向槽；
多个挡片，设置于气流座和导向座之间，在挡片的正反相对两面分别设有第一凸出部和第二凸出部，第一凸出部伸入滑动凹槽内，第二凸出部伸入导向槽内；
驱动装置，分别与气流座和导向座连接，驱动装置驱动气流座和导向座转动，改变挡片的位置，从而改变第一通孔和第二通孔配合后的裸露孔的大小。
采用上述优选的方案，气流大小调节装置可以有效调节第一通孔和第二通孔配合后的裸露孔的大小，从而调节气流大小，低噪音，低功率，成本小。
图1为本发明实施例提供的电路板抗震性能测试装置的结构示意图之一。
图2为本发明实施例提供的电路板抗震性能测试装置的结构示意图之二。
图3为本发明实施例提供的电路板抗震性能测试装置的结构示意图之三。
图4为本发明实施例提供的震动爪的结构示意图。
图5为本发明实施例提供的气流座的结构示意图。
图6为本发明实施例提供的气流座和挡片的结构示意图。
图7为本发明实施例提供的导向座的结构示意图。
其中：1、底板，2、支撑板，3、左纵向板，4、右纵向板，5、夹持组件，51、U形夹持部，52、弹力垫，61、导杆，62、套筒，63、连接板，64、限位块，71、震动电机，72、震动连接件，73、震动爪，81、上震动块，82、第一凸起，83、下震动块，84、第二凸起，85、下震动块驱动气缸，9、气流大小调节装置，91、气流座，92、第一通孔，93、滑动凹槽，94、导向座，95、第二通孔，96、导向槽，97、 挡片98、第一凸出部，99、第二凸出部，10、待测试电路板。
下面结合附图详细说明本发明的优选实施方式。
为了达到本发明的目的，电路板抗震性能测试装置的其中一些实施例中，如图1所示，电路板抗震性能测试装置，包括：
机架，机架包括：底板、设置于底板上方的支撑板2、左纵向板3以及右纵向板4，底板分别与左纵向板3和右纵向板4固定连接，支撑板2分别与左纵向板3和右纵向板4滑动连接；
夹持组件5，用于对待测试电路板10进行夹持；
第一震动组件，设置于支撑板2上，第一震动组件与夹持组件5传动连接，第一震动组件用于带动待测试电路板10进行左右摆动；
第二震动组件，设置于支撑板2与底板之间，第二震动组件与支撑板2传动连接，第二震动组件用于带动支撑板2沿竖直方向运动；
测试装置(图中未示出)，测试装置与待测试电路板10电连接，用于测试待测试电路板10的性能。
测试装置用于对震动中或震动后的电路板进行检测，检查电路板的性能是否完善。
本发明公开一种电路板抗震性能测试装置，其结构简单，第一震动组件给待测试电路板10以左右摆动的震动，第二震动组件给待测试电路板10以竖直方向的震动，多方位的震动方式可以对电路板的抗震性能进行全方面的监测。
为了进一步地优化本发明的实施效果，在另外一些实施方式中，其余特征技术相同，不同之处在于，夹持组件5包括：U形夹持部51以及安装于U形夹持部51夹持侧的弹力垫52。
采用上述优选的方案，采用U形夹持部51对电路板的两端进行夹持，且增设的弹性垫保证电路板在震动时，对其的损伤降到最低。
为了进一步地优化本发明的实施效果，在另外一些实施方式中，其余特征技术相同，不同之处在于，第一震动组件包括：至少一组左震动组件和至少一组右震动组件；
左震动组件和右震动组件均包括：
导杆61，导杆61安装于支撑板2上；
套筒62，套筒62套设于导杆61上，且套筒62可沿导杆61滑动；
连接板63，连接板63的两端分别与套筒62和夹持组件5转动连接；
套筒62驱动机构(图中未示出)，套筒62驱动机构与套筒62传动连接，套筒62驱动机构驱动套筒62沿导杆61滑动。
采用上述优选的方案，实现电路板的左右摆动，摆动后如图2所示。
进一步，在导杆61的顶端和/或其底端设有限位块64。
采用上述优选的方案，限制电路板的摆动幅度。
为了进一步地优化本发明的实施效果，在另外一些实施方式中，其余特征技术相同，不同之处在于，导杆61与支撑板2滑动连接。
采用上述优选的方案，调整夹持组件5的位置，便于对电路板进行夹持。
进一步，还包括：第三震动组件，第三震动组件与待测试电路板10传动连接，第三震动组件用于对待测试电路板10进行震动。
采用上述优选的方案，第三震动组件对待测试电路板10以抖动震动，震动方式更多样化。
进一步，第三震动组件包括：设置与支撑板2上的震动电机71、与震动电机71传动连接的震动连接件72以及与震动连接件72连接的多个震动爪73，震动爪73与待测试电路板10接触。
采用上述优选的方案，采用震动爪73对待测试电路板10进行支撑，且第三震动组件可实现震动幅度小但是震动速度稍快的竖直方向 上的抖动震动。
如图3和4所示，当第三震动组件需要对待测试电路板10进行震动时，首先松开夹持组件5对电路板的夹持，仅需要震动爪73即可对电路板进行支撑。
为了进一步地优化本发明的实施效果，在另外一些实施方式中，其余特征技术相同，不同之处在于，第二震动组件包括：
上震动块，上震动块安装于支撑板2的底面，且在上震动块上设有截面呈锯齿状的第一凸起82；
下震动块83，下震动块83与底板表面呈滑动连接，在下震动块83上设有截面呈锯齿状的第二凸起84，且第二凸起84与第一凸起82可啮合；
下震动块驱动气缸85，下震动块驱动气缸85与下震动块83传动连接，下震动块驱动气缸85推动下震动块83滑动，从而带动支撑板2沿竖直方向运动。
采用上述优选的方案，利用第二震动组件可实现震动幅度大但是震动速度稍缓慢的竖直方向上的抖动震动。
进一步，下震动块驱动气缸85的通气口通过气流大小调节装置9与外接空气设备连接，通过气流大小调节装置9调节气流大小，从而调节下震动块驱动气缸85输出端的运行速度。
采用上述优选的方案，通过调整下震动块驱动气缸85输出端的运行速度来调整待测试电路板10竖直方向上的抖动速度，实现变速运动。
如图5-7所示，进一步，气流大小调节装置9包括：
气流座91，在气流座91上设有第一通孔92，在第一通孔92的外侧设有正多边形的滑动凹槽93；
导向座94，设置于气流座91的一侧，在导向座94上设有与第一通孔92对应的第二通孔95，在导向座94上第二通孔95的外侧设有 多个导向槽96；
多个挡片，设置于气流座91和导向座94之间，在挡片的正反相对两面分别设有第一凸出部和第二凸出部99，第一凸出部伸入滑动凹槽93内，第二凸出部99伸入导向槽96内；
驱动装置，分别与气流座91和导向座94连接，驱动装置驱动气流座91和导向座94转动，改变挡片的位置，从而改变第一通孔92和第二通孔95配合后的裸露孔的大小。
采用上述优选的方案，气流大小调节装置9可以有效调节第一通孔92和第二通孔95配合后的裸露孔的大小，从而调节气流大小，低噪音，低功率，成本小。
以上多种实施方式可交叉并行实现。
同时，当夹持组件5对电路板进行夹持时，套筒62驱动机构驱动套筒62沿导杆61滑动，从而使得电路板左右搬动，与下震动块驱动气缸85推动下震动块83滑动，从而带动支撑板2沿竖直方向运动，这两种运动方式可以同时运作。
当夹持组件5不对电路板进行夹持，而是震动爪73对电路板进行支撑时，震动电机71驱动电路板进行竖直方向上快速小幅度运动，与下震动块驱动气缸85推动下震动块83滑动，从而带动支撑板2沿竖直方向上变速大幅度运动，这两种运动方式也可以同时运作。
对于本发明的优选实施方式，应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。
Claims (10)
- 电路板抗震性能测试装置，其特征在于，包括：机架，所述机架包括：底板、设置于所述底板上方的支撑板、左纵向板以及右纵向板，所述底板分别与所述左纵向板和右纵向板固定连接，所述支撑板分别与所述左纵向板和右纵向板滑动连接；夹持组件，用于对待测试电路板进行夹持；第一震动组件，设置于所述支撑板上，所述第一震动组件与所述夹持组件传动连接，所述第一震动组件用于带动待测试电路板进行左右摆动；第二震动组件，设置于所述支撑板与底板之间，所述第二震动组件与所述支撑板传动连接，所述第二震动组件用于带动所述支撑板沿竖直方向运动；测试装置，所述测试装置与待测试电路板电连接，用于测试待测试电路板的性能。
- 根据权利要求1所述的电路板抗震性能测试装置，其特征在于，所述夹持组件包括：U形夹持部以及安装于所述U形夹持部夹持侧的弹力垫。
- 根据权利要求2所述的电路板抗震性能测试装置，其特征在于，所述第一震动组件包括：至少一组左震动组件和至少一组右震动组件；所述左震动组件和右震动组件均包括：导杆，所述导杆安装于所述支撑板上；套筒，所述套筒套设于所述导杆上，且所述套筒可沿所述导杆滑动；连接板，所述连接板的两端分别与所述套筒和夹持组件转动连接；套筒驱动机构，所述套筒驱动机构与所述套筒传动连接，所述套筒驱动机构驱动所述套筒沿所述导杆滑动。
- 根据权利要求3所述的电路板抗震性能测试装置，其特征在于，在所述导杆的顶端和/或其底端设有限位块。
- 根据权利要求3所述的电路板抗震性能测试装置，其特征在于，所述导杆与所述支撑板滑动连接。
- 根据权利要求5所述的电路板抗震性能测试装置，其特征在于，还包括：第三震动组件，所述第三震动组件与待测试电路板传动连接，所述第三震动组件用于对待测试电路板进行震动。
- 根据权利要求6所述的电路板抗震性能测试装置，其特征在于，所述第三震动组件包括：设置与所述支撑板上的震动电机、与所述震动电机传动连接的震动连接件以及与所述震动连接件连接的多个震动爪，所述震动爪与待测试电路板接触。
- 根据权利要求1-7任一项所述的电路板抗震性能测试装置，其特征在于，所述第二震动组件包括：上震动块，所述上震动块安装于所述支撑板的底面，且在所述上震动块上设有截面呈锯齿状的第一凸起；下震动块，所述下震动块与所述底板表面呈滑动连接，在所述下震动块上设有截面呈锯齿状的第二凸起，且所述第二凸起与第一凸起可啮合；下震动块驱动气缸，所述下震动块驱动气缸与所述下震动块传动连接，所述下震动块驱动气缸推动所述下震动块滑动，从而带动所述支撑板沿竖直方向运动。
- 根据权利要求8所述的电路板抗震性能测试装置，其特征在于，所述下震动块驱动气缸的通气口通过气流大小调节装置与外接空气设备连接，通过气流大小调节装置调节气流大小，从而调节所述下震动块驱动气缸输出端的运行速度。
- 根据权利要求9所述的电路板抗震性能测试装置，其特征在于，所述气流大小调节装置包括：气流座，在所述气流座上设有第一通孔，在所述第一通孔的外侧设有正多边形的滑动凹槽；导向座，设置于所述气流座的一侧，在所述导向座上设有与所述第一通孔对应的第二通孔，在所述导向座上第二通孔的外侧设有多个导向槽；多个挡片，设置于所述气流座和所述导向座之间，在所述挡片的正反相对两面分别设有第一凸出部和第二凸出部，所述第一凸出部伸入所述滑动凹槽内，所述第二凸出部伸入所述导向槽内；驱动装置，分别与所述气流座和所述导向座连接，所述驱动装置驱动所述气流座和所述导向座转动，改变所述挡片的位置，从而改变所述第一通孔和第二通孔配合后的裸露孔的大小。
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