WO2021065329A1 - 回路基板および電子装置 - Google Patents

回路基板および電子装置 Download PDF

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Publication number
WO2021065329A1
WO2021065329A1 PCT/JP2020/033497 JP2020033497W WO2021065329A1 WO 2021065329 A1 WO2021065329 A1 WO 2021065329A1 JP 2020033497 W JP2020033497 W JP 2020033497W WO 2021065329 A1 WO2021065329 A1 WO 2021065329A1
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WO
WIPO (PCT)
Prior art keywords
resistor
electrodes
pair
resistors
circuit board
Prior art date
Application number
PCT/JP2020/033497
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English (en)
French (fr)
Japanese (ja)
Inventor
嘉雄 倉元
Original Assignee
京セラ株式会社
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Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2021550486A priority Critical patent/JP7321282B2/ja
Publication of WO2021065329A1 publication Critical patent/WO2021065329A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • This disclosure relates to circuit boards and electronic devices.
  • a substrate made of ceramics has excellent insulation and thermal conductivity, it may be used as a circuit board for a lighting device such as an in-vehicle lamp.
  • the circuit board is provided with a resistor for adjusting the current flowing through a light emitting element such as an LED (Light Emitting Diode) (see, for example, Patent Document 1).
  • a light emitting element such as an LED (Light Emitting Diode) (see, for example, Patent Document 1).
  • the circuit board includes a substrate main body made of ceramics, wiring located on the substrate main body, and a resistor interposed in the wiring and having a higher electric resistance than the wiring.
  • the wiring has a pair of electrodes that are spaced apart from each other.
  • the resistor is located between the pair of electrodes so as to be in contact with both of the pair of electrodes, and the first resistor that electrically connects the pair of electrodes and the pair of electrodes between the pair of electrodes. It has a second resistor that is spaced apart and has at least a portion covered by a first resistor and has a lower electrical resistance than the first resistor.
  • FIG. 1 is a schematic side view of the lighting device according to the embodiment.
  • FIG. 2 is a schematic perspective view of the socket according to the embodiment.
  • FIG. 3 is a schematic plan view of the circuit board according to the embodiment.
  • FIG. 4 is a schematic plan view of the resistor according to the embodiment.
  • FIG. 5 is a cross-sectional view taken along the line VV shown in FIG.
  • FIG. 6 is a schematic plan view of the resistor according to the comparative example.
  • FIG. 7 is a schematic plan view showing an example of a method for reducing the electrical resistance of the resistor.
  • FIG. 8 is a schematic plan view of the resistor according to the first modification.
  • FIG. 9 is a schematic plan view of the resistor according to the second modification.
  • FIG. 10 is a schematic enlarged view of the second resistor according to the second modification.
  • FIG. 11 is a schematic plan view of the resistor according to the third modification.
  • FIG. 12 is a schematic plan view of the resistor according to the fourth modification.
  • FIG. 13 is a schematic plan view of the resistor according to the fifth modification.
  • the embodiment a mode for carrying out the circuit board and the electronic device according to the present disclosure (hereinafter, referred to as “the embodiment”) will be described in detail with reference to the drawings. It should be noted that this embodiment does not limit the circuit board and the electronic device according to the present disclosure. In addition, each embodiment can be appropriately combined as long as the processing contents do not contradict each other. Further, in each of the following embodiments, the same parts are designated by the same reference numerals, and duplicate description is omitted.
  • circuit board according to the present disclosure is applied to a lighting device which is an example of an electronic device.
  • FIG. 1 is a schematic side view of the lighting device according to the embodiment.
  • FIG. 2 is a schematic perspective view of the socket according to the embodiment.
  • FIG. 3 is a schematic plan view of the circuit board according to the embodiment.
  • the lighting device 1 includes a circuit board 10, a socket 20 for accommodating the circuit board 10, and a plurality of conductive terminals 30 connected to the circuit board 10.
  • the lighting device 1 according to the embodiment is used, for example, as a vehicle-mounted lighting device.
  • the lighting device 1 is used as a light source for a rear lamp, a turn lamp, a position lamp, a fog lamp, and the like.
  • the socket 20 has an accommodating portion 21, a flange portion 22, and a plurality of heat radiating fins 23.
  • the accommodating portion 21 is, for example, a bottomed tubular portion having a substantially circular outer shape in a plan view, and is located on a surface of the flange portion 22 described later, which is opposite to the surface on which the plurality of heat radiation fins 23 are located.
  • the accommodating portion 21 has a recess 210 that is recessed from one end surface of the socket 20, specifically, a surface opposite to the surface of the accommodating portion 21 in contact with the flange portion 22 toward the other end side of the socket 20.
  • the circuit board 10 is housed in such a recess 210.
  • the recess 210 has a plurality of side wall portions 211.
  • the plurality of side wall portions 211 have, for example, a plan-viewing bow shape, and are arranged along the circumferential direction around the circuit board 10 so as to surround the circuit board 10.
  • a gap 212 is provided between the two side wall portions 211 adjacent to each other in the circumferential direction.
  • the flange portion 22 is, for example, a disk-shaped portion, and is located between the accommodating portion 21 and the plurality of heat radiation fins 23.
  • the flange portion 22 has a larger diameter than the accommodating portion 21, and is adapted to hit the peripheral edge of the mounting hole when the lighting device 1 is inserted into the mounting hole provided in the vehicle body, for example.
  • a bayonet for twist lock (not shown) is located on the outer peripheral surface of the accommodating portion 21, and the bayonet is formed by rotating the socket 20 with the flange portion 22 in contact with the peripheral edge of the mounting hole.
  • the lighting device 1 is fixed to the vehicle body by being fitted into the groove on the vehicle body side.
  • the plurality of heat radiation fins 23 are located on the surface of the flange portion 22 opposite to the surface on which the accommodating portion 21 is located.
  • the heat generated in the circuit board 10 is mainly released from the plurality of heat radiation fins 23.
  • the socket 20 has four heat radiation fins 23, but the number of heat radiation fins 23 included in the socket 20 is not limited to four.
  • a heat transfer member (not shown) made of a metal such as aluminum is located between the bottom of the recess 210 and the circuit board 10.
  • the heat transfer member is located so as to be in contact with the circuit board 10 and the bottom of the recess 210, and transfers the heat generated in the circuit board 10 to the heat radiating fins 23.
  • the circuit board 10 has a substrate body 11 made of ceramics.
  • the substrate main body 11 is a flat plate having a first surface which is a circuit forming surface, a second surface located opposite to the first surface, and a plurality of third surfaces (side surfaces) connected to each of the first surface and the second surface. It is a member.
  • the substrate main body 11 is housed in the accommodating portion 21 with the second surface facing the bottom surface of the recess 210, in other words, with the first surface, which is the circuit forming surface, facing the front.
  • the substrate main body 11 for example, ceramics such as aluminum oxide ceramics, zirconium oxide ceramics, composite ceramics of aluminum oxide and zirconium oxide, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics or mulite ceramics are used. be able to.
  • the substrate body 11 made of aluminum oxide ceramics is excellent in workability while having the mechanical strength required for the substrate body 11. Further, since the substrate body 11 made of aluminum nitride ceramics has high thermal conductivity, it is excellent in heat dissipation.
  • the wiring 40 is electrically connected to the conductive terminal 30 via a conductive joining member (not shown) such as a brazing material and solder.
  • a light emitting element 50 which is an example of an electronic component, is located on the wiring 40.
  • the light emitting element 50 is, for example, an LED (Light Emitting Diode), an LD (Laser Diode), or the like.
  • the wiring 40 electrically connects the conductive terminal 30 and the light emitting element 50.
  • a pair of electrodes 41 and 42 are located in the middle of the wiring 40 (a part between the conductive terminal 30 and the light emitting element 50).
  • the pair of electrodes 41 and 42 are located on the substrate main body 11 at intervals from each other. Further, the pair of electrodes 41 and 42 extend in parallel with each other.
  • an example is shown in which the pair of electrodes 41 and 42 extend along the Y-axis direction.
  • the pair of electrodes 41, 42 are, for example, a part of the wiring 40 and are made of the same material as the wiring 40 (for example, copper and silver).
  • a resistor 60 is located between the pair of electrodes 41 and 42.
  • the resistor 60 has a higher electric resistance than the wiring 40, and can adjust the current flowing through the light emitting element 50.
  • FIG. 4 is a schematic plan view of the resistor 60 according to the embodiment.
  • FIG. 5 is a cross-sectional view taken along the line VV shown in FIG.
  • the resistor 60 includes a first resistor 61 and a plurality of (here, two) second resistors 62.
  • the first resistor 61 and the second resistor 62 are thin-film resistors printed on the substrate main body 11.
  • the first resistor 61 has a rectangular shape in a plan view.
  • the first resistor 61 is located between the pair of electrodes 41 and 42 so as to be in contact with both of the pair of electrodes 41 and 42, and electrically connects the pair of electrodes 41 and 42.
  • the first resistor 61 contains, for example, an insulating material and a conductive material.
  • the insulating material is, for example, glass.
  • the conductive material is, for example, a LaB6 (lanthanum boride) -based material.
  • the first resistor 61 has a higher electrical resistance than the wiring 40.
  • the plurality of second resistors 62 have a long shape extending in a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction), and the pair of electrodes 41 and 42 are sandwiched between the pair of electrodes 41 and 42. It is located at intervals of 41 and 42.
  • the plurality of second resistors 62 are arranged at intervals from each other along a direction (X-axis direction) orthogonal to the pair of electrodes 41 and 42.
  • the second resistor 62 is covered with the first resistor 61 and is electrically connected to the pair of electrodes 41 and 42 via the first resistor 61.
  • the second resistor 62 contains, for example, an insulating material and a conductive material.
  • the insulating material is, for example, glass.
  • the conductive material is, for example, a CuNi (copper nickel) -based material.
  • the second resistor 62 has an electrical resistance higher than that of the wiring 40 and lower than that of the first resistor 61.
  • the electrical resistance of the second resistor 62 may be the same as that of the wiring 40.
  • FIG. 6 is a schematic plan view of the resistor according to the comparative example. Further, FIG. 7 is a schematic plan view showing an example of a method for reducing the electric resistance of the resistor.
  • the resistor 60X1 generally comprises, for example, a single resistor 61X1 having a rectangular shape in a plan view.
  • the resistor 60X1 As a method for lowering the electrical resistance of the resistor 60X1, for example, the length of the resistor 61X1 in the direction orthogonal to the pair of electrodes 41X and 42X (the direction in which the pair of electrodes are arranged) (hereinafter, referred to as "resistance length").
  • resistor 60X1 the length of the resistor 61X1 in the direction orthogonal to the pair of electrodes 41X and 42X (the direction in which the pair of electrodes are arranged) (hereinafter, referred to as "resistance length").
  • FIG. 6 shows a resistor 60X1 having a resistor 61X1 having a resistance length of D
  • FIG. 7 shows a resistor 60X2 having a resistor 61X2 having a resistance length of D / 2.
  • the electric resistance of the resistor 60X2 shown in FIG. 7 is half the electric resistance of the resistor 60X1 shown in FIG.
  • the area of the resistor 61X2 is halved as compared with the resistor 61X1, whereby the heat dissipation region H2 of the resistor 61X2 is compared with the heat dissipation region H1 of the resistor 61X1. And it will be halved. Since the electrical resistance of the resistor 61X2 changes depending on the temperature of the resistor 61X2, it is not preferable that the heat dissipation of the resistor 61X2 is lowered from the viewpoint of the operational stability of the circuit board.
  • the wiring 40, the electrodes 41 and 42, and the resistor 60 may be covered with a glass layer.
  • the glass layer is formed, for example, for the purpose of protecting the surfaces of the wiring 40, the electrodes 41, 42 and the resistor 60.
  • Glass layer R 2 O-B 2 O 3 -SiO 2 system (R: alkali metal element), R 2 O-SiO 2 -B 2 O 3 -Bi 2 O 3 system (R: alkali metal element), R It may be mainly composed of any one of the'OB 2 O 3- SiO 2 system (R': alkaline earth component notation).
  • the main component in the glass layer is a component contained in an amount of 60% by mass or more out of a total of 100% by mass of all the components constituting the glass layer.
  • the glass layer may contain at least one of titanium oxide and zirconium oxide in order to improve the reflectance of the glass layer with respect to visible light.
  • the resistor 60 includes a second resistor 62 whose electrical resistance is smaller than that of the first resistor 61.
  • the second resistor 62 is arranged in the middle of the current path formed by the first resistor 61.
  • the second resistor 62 extends in parallel with the pair of electrodes 41 and 42, the heat generation location is compared with the case where the second resistor 62 extends diagonally with respect to the pair of electrodes 41 and 42. Is unlikely to be biased. Therefore, since the resistor 60 can generate heat more uniformly, it is effective from the viewpoint of ensuring heat dissipation.
  • the second resistor 62 is longer than the first resistor 61 in the direction parallel to the pair of electrodes 41 and 42 (Y-axis direction), and both ends protrude from the first resistor 61. As a result, the heat generated in the resistor 60 can be efficiently released from both ends of the second resistor 62.
  • the thickness of the first resistor 61 located on the second resistor 62 is thinner than that of the second resistor 62.
  • the resistor 60 may have at least one second resistor 62.
  • FIG. 8 is a schematic plan view of the resistor according to the first modification.
  • the circuit board 10A has a resistor 60A.
  • the resistor 60A has a plurality of first resistors 61A and a plurality of second resistors 62.
  • the plurality of first resistors 61A are positioned so as to straddle any one of the pair of electrodes 41 and 42 and the second resistor 62, or straddle the two second resistors 62.
  • the resistor 60A includes a first resistor 61A straddling the electrode 41 and the second resistor 62, a first resistor 61A straddling the electrode 42 and the second resistor 62, and two second resistors.
  • first resistors 61A which are first resistors 61A straddling the body 62.
  • the first resistors 61A are not in contact with each other, and a part of the upper surface of the second resistor 62 is exposed from the first resistor 61A.
  • the second resistor 62 may have a portion exposed from the first resistor 61A in addition to both end portions. By exposing the second resistor 62 from the first resistor 61A in this way, heat dissipation can be improved.
  • FIG. 9 is a schematic plan view of the resistor according to the second modification.
  • FIG. 10 is a schematic enlarged view of the second resistor according to the second modification.
  • the circuit board 10B according to the second modification has a resistor 60B.
  • the resistor 60B has a first resistor 61 and a plurality of second resistors 62B.
  • the plurality of second resistors 62B are arranged at intervals from each other along a direction (X-axis direction) orthogonal to the pair of electrodes.
  • the second resistor 62B according to the second modification extends in parallel with the pair of electrodes 41 and 42 while meandering, that is, repeatedly approaching and separating from the pair of electrodes 41 and 42.
  • laser trimming may be performed to fine-tune the resistance value.
  • Laser trimming is a method of increasing the resistance value of a resistor by forming a linear groove in the direction parallel to the electrode to narrow the resistance width of the resistor.
  • the resistor 60B according to the second modification has two types of resistors (first resistor 61 and second resistor 62B) having different electric resistances, when only the first resistor 61 is trimmed. There may be a difference in the amount of adjustment of the resistance value between the case where only the second resistor 62 is trimmed and the case where only the second resistor 62 is trimmed.
  • the resistor 60B according to the second modification since the second resistor 62B meanders, when laser trimming is performed, the laser is applied to both the first resistor 61 and the second resistor 62B. A linear groove is likely to be formed. By meandering the second resistor 62B in this way, both the first resistor 61 and the second resistor 62B are easily trimmed, so that the amount of adjustment of the resistance value when laser trimming is performed varies. It can be suppressed.
  • the plurality of second resistors 62B are arranged close to each other. Specifically, as shown in FIG. 10, in the plurality of second resistors 62B, the meandering portion of another adjacent second resistor enters the gap R formed in the meandering portion of the second resistor 62B. Arranged like this. By arranging in this way, the region where only the first resistor 61 is trimmed can be reduced as much as possible. Therefore, the stability of laser trimming can be further improved.
  • FIG. 11 is a schematic plan view of the resistor according to the third modification.
  • the circuit board 10C according to the third modification has a resistor 60C.
  • the resistor 60C has a first resistor 61 and a plurality of second resistors 62C.
  • the plurality of second resistors 62C has a plurality of first resistor groups G1C and a plurality of second resistor groups G2C.
  • the plurality of first resistor groups G1C are composed of two or more second resistors 62C1 arranged along a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the plurality of second resistor groups G2C are composed of two or more second resistors 62C2 arranged along a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the second resistor group G2C is adjacent to the first resistor group G1C in a direction orthogonal to the pair of electrodes 41 and 42.
  • the plurality of first resistor groups G1C and the plurality of second resistor groups G2C are alternately arranged along a direction (X-axis direction) orthogonal to the pair of electrodes 41 and 42.
  • the first resistor group G1C and the second resistor group G2C are arranged so as to be offset in a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction). Specifically, the plurality of second resistors 62C2 included in the second resistor group G2C are shifted to the Y-axis negative direction side with respect to the plurality of second resistors 62C1 included in the first resistor group G1C. Is placed.
  • first resistor group G1C and the second resistor group G2C are arranged at positions where they overlap each other when viewed from a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the plurality of second resistors 62C2 included in the second resistor group G2C are first resistors. It is arranged so as to partially overlap with the plurality of second resistors 62C1 included in the group G1C.
  • both the first resistor 61 and the second resistor 62C can be easily trimmed evenly, so that it is possible to suppress variations in the amount of resistance value adjustment when laser trimming is performed. Therefore, the stability of laser trimming can be improved.
  • FIG. 12 is a schematic plan view of the resistor according to the fourth modification.
  • the shape of the plurality of second resistors 62D may be circular in a plan view, as in the resistor 60D included in the circuit board 10D shown in FIG.
  • the plurality of second resistors 62D has a plurality of first resistor groups G1D and a plurality of second resistor groups G2D.
  • the plurality of first resistor groups G1D are composed of two or more second resistors 62D1 arranged along a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction). Further, it is composed of two or more second resistors 62D2 arranged along a direction (Y-axis direction) parallel to the pair of electrodes 41 and 42 of the plurality of second resistors G2D.
  • the second resistor group G2D is adjacent to the first resistor group G1D in a direction orthogonal to the pair of electrodes 41 and 42. Further, the plurality of first resistor groups G1D and the plurality of second resistor groups G2D are alternately arranged along a direction (X-axis direction) orthogonal to the pair of electrodes 41 and 42.
  • the first resistor group G1D and the second resistor group G2D are arranged so as to be offset in a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction). Specifically, the plurality of second resistors 62D2 included in the second resistor group G2D are shifted to the Y-axis negative direction side with respect to the plurality of second resistors 62D1 included in the first resistor group G1D. Is placed.
  • first resistor group G1D and the second resistor group G2D are arranged at positions where they overlap each other when viewed from a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the plurality of second resistors 62D2 included in the second resistor group G2D are first resistors. It is arranged so as to partially overlap with the plurality of second resistors 62D1 included in the group G1D.
  • both the first resistor 61 and the second resistor 62D can be easily trimmed evenly, so that it is possible to suppress variations in the amount of resistance value adjustment when laser trimming is performed. Therefore, the stability of laser trimming can be improved.
  • FIG. 13 is a schematic plan view of the resistor according to the fifth modification.
  • the shape of the plurality of second resistors 62E is a rhombus having corners in the directions parallel to and orthogonal to the pair of electrodes 41 and 42, respectively. You may.
  • the plurality of second resistors 62E have a plurality of first resistor groups G1E and a plurality of second resistor groups G2E.
  • the plurality of first resistor groups G1E are composed of two or more second resistors 62E1 arranged along a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the plurality of second resistor groups G2E are composed of two or more second resistors 62E2 arranged along a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the second resistor group G2E is adjacent to the first resistor group G1E in a direction orthogonal to the pair of electrodes 41 and 42.
  • the plurality of first resistor groups G1E and the plurality of second resistor groups G2E are alternately arranged along a direction (X-axis direction) orthogonal to the pair of electrodes 41 and 42.
  • the first resistor group G1E and the second resistor group G2E are arranged so as to be offset in a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction). Specifically, the plurality of second resistors 62E2 included in the second resistor group G2E are shifted to the Y-axis negative direction side with respect to the plurality of second resistors 62E1 included in the first resistor group G1E. Is placed.
  • first resistor group G1E and the second resistor group G2E are arranged at positions where they overlap each other when viewed from a direction parallel to the pair of electrodes 41 and 42 (Y-axis direction).
  • the plurality of second resistors 62E2 included in the second resistor group G2E are first resistors. It is arranged so as to partially overlap with the plurality of second resistors 62E1 included in the group G1E.
  • both the first resistor 61 and the second resistor 62E can be easily trimmed evenly, so that it is possible to suppress variations in the amount of resistance value adjustment when laser trimming is performed. Therefore, the stability of laser trimming can be improved.
  • the circuit board for example, circuit boards 10, 10A to 10E
  • the circuit board includes a substrate body made of ceramics (as an example, the board body 11) and wiring located on the board body (example).
  • a wiring 40 there are resistors (resistors 60, 60A to 60E, for example) that are interposed in the wiring and have higher electric resistance than the wiring.
  • the wiring has a pair of electrodes (for example, a pair of electrodes 41, 42) located spaced apart from each other. Further, the resistor is located between the pair of electrodes so as to be in contact with both of the pair of electrodes, and the first resistor (for example, the first resistors 61, 61A) that electrically connects the pair of electrodes.
  • a second resistor (for example, a first resistor) having a lower electrical resistance than the first resistor, which is located between the pair of electrodes at a distance from the pair of electrodes and is at least partially covered with the first resistor. It has two resistors 62, 62B to 62E).
  • circuit board it is possible to reduce the electric resistance of the resistor while ensuring heat dissipation.
  • the electronic device on which the circuit board according to the present disclosure is mounted is not limited to the lighting device, and can be applied to various electronic devices other than the lighting device.
  • the electronic devices include flow meters, display monitors mounted on smart watches and the like, power modules such as inverters and converters, power semiconductors such as in-vehicle power control units, battery parts, secondary battery parts, air conditioners ( Especially for in-vehicle use), optical communication devices, laser projectors such as laser cinema machines, laser processing machines, various sensor parts, optical pickup parts used for reading and writing DVDs (Digital Versatile Disk) and CDs (Compact Disk), laser diodes It can be applied to parts, CPU (Central Processing Unit), GPU (Graphics Processing Unit), TPU (Tensor Processing Unit), and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
PCT/JP2020/033497 2019-09-30 2020-09-03 回路基板および電子装置 WO2021065329A1 (ja)

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JP2019178968 2019-09-30
JP2019-178968 2019-09-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113113199A (zh) * 2021-04-14 2021-07-13 南京萨特科技发展有限公司 一种大功率合金箔电阻器及制造方法

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Publication number Priority date Publication date Assignee Title
JPS62169301A (ja) * 1987-01-13 1987-07-25 ニチコン株式会社 厚膜抵抗体の温度係数調整方法
JPS62118401U (enrdf_load_stackoverflow) * 1986-01-17 1987-07-28
JPH05299213A (ja) * 1992-04-22 1993-11-12 Murata Mfg Co Ltd 厚膜抵抗集合体の形成方法

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Publication number Priority date Publication date Assignee Title
JP2004288981A (ja) 2003-03-24 2004-10-14 Mitsubishi Materials Corp 薄膜抵抗材料、これを用いた抵抗器、及び抵抗器の製造方法
EP2492925B1 (en) 2011-02-25 2013-08-07 Abb Ag Resistive voltage divider made of a resistive film material on an insulating substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118401U (enrdf_load_stackoverflow) * 1986-01-17 1987-07-28
JPS62169301A (ja) * 1987-01-13 1987-07-25 ニチコン株式会社 厚膜抵抗体の温度係数調整方法
JPH05299213A (ja) * 1992-04-22 1993-11-12 Murata Mfg Co Ltd 厚膜抵抗集合体の形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113113199A (zh) * 2021-04-14 2021-07-13 南京萨特科技发展有限公司 一种大功率合金箔电阻器及制造方法
WO2022217750A1 (zh) * 2021-04-14 2022-10-20 南京萨特科技发展有限公司 一种大功率合金箔电阻器及制造方法

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JP7321282B2 (ja) 2023-08-04

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