JP7321282B2 - 回路基板および電子装置 - Google Patents
回路基板および電子装置 Download PDFInfo
- Publication number
- JP7321282B2 JP7321282B2 JP2021550486A JP2021550486A JP7321282B2 JP 7321282 B2 JP7321282 B2 JP 7321282B2 JP 2021550486 A JP2021550486 A JP 2021550486A JP 2021550486 A JP2021550486 A JP 2021550486A JP 7321282 B2 JP7321282 B2 JP 7321282B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrodes
- pair
- resistors
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000012986 modification Methods 0.000 description 20
- 230000004048 modification Effects 0.000 description 20
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000009966 trimming Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910025794 LaB6 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019178968 | 2019-09-30 | ||
| JP2019178968 | 2019-09-30 | ||
| PCT/JP2020/033497 WO2021065329A1 (ja) | 2019-09-30 | 2020-09-03 | 回路基板および電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021065329A1 JPWO2021065329A1 (enrdf_load_stackoverflow) | 2021-04-08 |
| JP7321282B2 true JP7321282B2 (ja) | 2023-08-04 |
Family
ID=75337264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021550486A Active JP7321282B2 (ja) | 2019-09-30 | 2020-09-03 | 回路基板および電子装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7321282B2 (enrdf_load_stackoverflow) |
| WO (1) | WO2021065329A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113199B (zh) * | 2021-04-14 | 2022-09-06 | 南京萨特科技发展有限公司 | 一种大功率合金箔电阻器及制造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288981A (ja) | 2003-03-24 | 2004-10-14 | Mitsubishi Materials Corp | 薄膜抵抗材料、これを用いた抵抗器、及び抵抗器の製造方法 |
| US20130335106A1 (en) | 2011-02-25 | 2013-12-19 | Abb Ag | Resistive voltage divider made of a resistive film material on an insulating substrate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62118401U (enrdf_load_stackoverflow) * | 1986-01-17 | 1987-07-28 | ||
| JPS62169301A (ja) * | 1987-01-13 | 1987-07-25 | ニチコン株式会社 | 厚膜抵抗体の温度係数調整方法 |
| JPH05299213A (ja) * | 1992-04-22 | 1993-11-12 | Murata Mfg Co Ltd | 厚膜抵抗集合体の形成方法 |
-
2020
- 2020-09-03 JP JP2021550486A patent/JP7321282B2/ja active Active
- 2020-09-03 WO PCT/JP2020/033497 patent/WO2021065329A1/ja active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288981A (ja) | 2003-03-24 | 2004-10-14 | Mitsubishi Materials Corp | 薄膜抵抗材料、これを用いた抵抗器、及び抵抗器の製造方法 |
| US20130335106A1 (en) | 2011-02-25 | 2013-12-19 | Abb Ag | Resistive voltage divider made of a resistive film material on an insulating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021065329A1 (enrdf_load_stackoverflow) | 2021-04-08 |
| WO2021065329A1 (ja) | 2021-04-08 |
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