JP5429321B2 - ライトモジュール及びそのライトコンポーネント - Google Patents
ライトモジュール及びそのライトコンポーネント Download PDFInfo
- Publication number
- JP5429321B2 JP5429321B2 JP2012092768A JP2012092768A JP5429321B2 JP 5429321 B2 JP5429321 B2 JP 5429321B2 JP 2012092768 A JP2012092768 A JP 2012092768A JP 2012092768 A JP2012092768 A JP 2012092768A JP 5429321 B2 JP5429321 B2 JP 5429321B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal substrate
- light
- copper foil
- light component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 134
- 239000002184 metal Substances 0.000 claims description 134
- 239000000758 substrate Substances 0.000 claims description 80
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 239000011889 copper foil Substances 0.000 claims description 36
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 16
- 238000013461 design Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Description
Claims (9)
- 金属基板を有するプリント回路基板と、
前記プリント回路基板に配置され、複数の発光ダイオード(LED)と
を備え、
前記金属基板は、対向する2つの縁部が前記複数の発光ダイオードの光の射出方向へ向くように、前記対向する2つの縁部の各々から所定の距離の箇所が曲げられて、対向する2つの金属クランプが形成され、
前記2つの金属クランプの各々は、導光板の互いに対向する表面を直接保持すべく、一部分が前記LEDに向かうように曲がっている、ライトコンポーネント。
- 前記金属基板の前記2つの金属クランプを形成しない部分の厚さは、前記2つの金属クランプのそれぞれの厚さ以上である請求項1に記載のライトコンポーネント。
- 前記プリント回路基板は、
銅箔層と、
前記銅箔層及び前記金属基板の両者に直接に接触するように、前記銅箔層及び前記金属基板の間に配置される絶縁層と
を含む請求項2に記載のライトコンポーネント。 - 前記銅箔層及び前記絶縁層は、前記金属基板を部分的に被覆する請求項3に記載のライトコンポーネント。
- 前記銅箔層及び前記絶縁層は、前記2つの金属クランプを被覆しない請求項3に記載のライトコンポーネント。
- 前記2つの金属クランプの何れも、弾力部を有する請求項1から請求項5の何れか一項に記載のライトコンポーネント。
- 前記金属基板は、0.1mm〜4mmの厚さ範囲を有する請求項1から請求項6の何れか一項に記載のライトコンポーネント。
- 前記金属基板は、アルミニウム、銅、アルミニウム合金、銅合金又はそれらの如何なる組み合わせを含む請求項1から請求項7の何れか一項に記載のライトコンポーネント。
- 導光板と、
請求項1から請求項8の何れか一項に記載のライトコンポーネントと
を備え、
前記2つの金属クランプは、前記導光板の外縁部を保持する、ライトモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100143405 | 2011-11-25 | ||
TW100143405A TWI438375B (zh) | 2011-11-25 | 2011-11-25 | 光源模組及其光源組件 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013115040A JP2013115040A (ja) | 2013-06-10 |
JP5429321B2 true JP5429321B2 (ja) | 2014-02-26 |
Family
ID=45976643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012092768A Active JP5429321B2 (ja) | 2011-11-25 | 2012-04-16 | ライトモジュール及びそのライトコンポーネント |
Country Status (6)
Country | Link |
---|---|
US (1) | US8860042B2 (ja) |
EP (1) | EP2597499A3 (ja) |
JP (1) | JP5429321B2 (ja) |
KR (1) | KR101376288B1 (ja) |
CN (1) | CN103133915A (ja) |
TW (1) | TWI438375B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210092121A (ko) * | 2020-01-15 | 2021-07-23 | 최승진 | 방수기능을 위한 조립성을 향상시킨 엘이디 등기구 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102132928B1 (ko) * | 2013-07-02 | 2020-07-10 | 엘지이노텍 주식회사 | 조명장치 및 상기 조명장치를 포함하는 평판 디스플레이 |
TWI613490B (zh) * | 2013-08-09 | 2018-02-01 | 隆達電子股份有限公司 | 發光裝置、平板燈及平面顯示器 |
US9938165B2 (en) | 2013-10-28 | 2018-04-10 | The University Of British Columbia | UV-LED collimated radiation photoreactor |
WO2016163176A1 (ja) * | 2015-04-06 | 2016-10-13 | ソニー株式会社 | 照明装置および表示装置 |
DE102015216662A1 (de) * | 2015-09-01 | 2017-03-02 | Osram Gmbh | Leuchtmittel mit LEDs |
EP3405284B1 (en) * | 2016-01-19 | 2024-08-28 | The University Of British Columbia | Heat dissipation apparatus for uv-led photoreactors |
CN109690394A (zh) * | 2016-09-13 | 2019-04-26 | 夏普株式会社 | 照明装置以及显示装置 |
DE102017114235B4 (de) | 2017-06-27 | 2020-01-02 | Bjb Gmbh & Co. Kg | Leuchte für die Raum- und Gebäudebeleuchtung |
CN113302552A (zh) * | 2018-11-14 | 2021-08-24 | 堺显示器制品株式会社 | 背光源装置 |
Family Cites Families (24)
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US6906863B2 (en) | 2001-04-24 | 2005-06-14 | Mitsui Chemicals Inc. | Lamp reflector and reflector |
JP2003036707A (ja) | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | 照明装置とその製造方法 |
TW591990B (en) * | 2001-07-25 | 2004-06-11 | Sanyo Electric Co | Method for making an illumination device |
JP2004022901A (ja) * | 2002-06-18 | 2004-01-22 | Seiko Epson Corp | 光インターコネクション集積回路、光インターコネクション集積回路の製造方法、電気光学装置および電子機器 |
US7146106B2 (en) * | 2002-08-23 | 2006-12-05 | Amkor Technology, Inc. | Optic semiconductor module and manufacturing method |
US7148078B2 (en) * | 2004-02-23 | 2006-12-12 | Avago Technologies Egbu Ip (Singapore) Pte. Ltd. | Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities |
DE202004014555U1 (de) * | 2004-09-16 | 2006-02-02 | Halemeier Gmbh & Co. Kg | Glasplattenleuchte |
JP2006202921A (ja) * | 2005-01-19 | 2006-08-03 | Sharp Corp | 半導体装置及びそれを用いた表示用モジュール |
JP5104490B2 (ja) * | 2007-04-16 | 2012-12-19 | 豊田合成株式会社 | 発光装置及びその製造方法 |
TWI375077B (en) | 2007-05-22 | 2012-10-21 | Chimei Innolux Corp | Backlight module and liquid crystal display using the same |
TWM339084U (en) | 2007-07-25 | 2008-08-21 | Sensitive Electronic Co Ltd | Soft thin circuit substrate for LED and LED light bar |
EP2101309B1 (de) * | 2008-03-13 | 2011-06-29 | Burri public elements AG | Leuchtkasten für Werbeflächen |
TW200944711A (en) | 2008-04-16 | 2009-11-01 | Harvatek Corp | LED chip package structure using a substrate as a lampshade and its manufacturing method |
US20100079989A1 (en) * | 2008-09-27 | 2010-04-01 | Kuang-Chao Yeh | Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip |
TWI363234B (en) * | 2008-11-18 | 2012-05-01 | Au Optronics Corp | Backlight module and lcd panel display using the same |
TWI371996B (en) | 2008-11-25 | 2012-09-01 | Chimei Innolux Corp | Flexible print circuit and backlight module |
CN101424376B (zh) * | 2008-11-26 | 2010-07-21 | 友达光电股份有限公司 | 用以夹持导光板的背光模块及应用此背光模块的显示装置 |
JP5526622B2 (ja) | 2009-06-29 | 2014-06-18 | 日亜化学工業株式会社 | バックライトユニット用の可撓性基板、及びそれを用いたバックライトユニット |
JP5372653B2 (ja) | 2009-08-07 | 2013-12-18 | 電気化学工業株式会社 | 発光素子搭載用基板および発光装置 |
TWM378404U (en) * | 2009-11-12 | 2010-04-11 | Kocam Int Co Ltd | Back-light module for all-in-one light-emitting diodes |
KR20110086648A (ko) | 2010-01-15 | 2011-07-29 | 엘지이노텍 주식회사 | 발광 모듈, 백라이트 유닛 및 표시 장치 |
CN201696950U (zh) * | 2010-06-22 | 2011-01-05 | 京东方科技集团股份有限公司 | 背光模组 |
KR20120042425A (ko) | 2010-10-25 | 2012-05-03 | 삼성전자주식회사 | 백라이트 어셈블리 및 이를 갖는 표시 장치 |
KR101074716B1 (ko) | 2011-02-09 | 2011-10-19 | (주)성안엘이디 | 측면조사방식의 엘이디 장착구조 |
-
2011
- 2011-11-25 TW TW100143405A patent/TWI438375B/zh active
- 2011-12-30 CN CN201110461247XA patent/CN103133915A/zh active Pending
-
2012
- 2012-03-05 EP EP12158019.5A patent/EP2597499A3/en not_active Withdrawn
- 2012-03-05 US US13/411,640 patent/US8860042B2/en active Active
- 2012-03-08 KR KR1020120024066A patent/KR101376288B1/ko active IP Right Grant
- 2012-04-16 JP JP2012092768A patent/JP5429321B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210092121A (ko) * | 2020-01-15 | 2021-07-23 | 최승진 | 방수기능을 위한 조립성을 향상시킨 엘이디 등기구 |
KR102325940B1 (ko) | 2020-01-15 | 2021-11-15 | 최승진 | 방수기능을 위한 조립성을 향상시킨 엘이디 등기구 |
Also Published As
Publication number | Publication date |
---|---|
CN103133915A (zh) | 2013-06-05 |
TWI438375B (zh) | 2014-05-21 |
KR101376288B1 (ko) | 2014-03-20 |
JP2013115040A (ja) | 2013-06-10 |
US8860042B2 (en) | 2014-10-14 |
EP2597499A2 (en) | 2013-05-29 |
TW201321658A (zh) | 2013-06-01 |
US20130134448A1 (en) | 2013-05-30 |
KR20130058580A (ko) | 2013-06-04 |
EP2597499A3 (en) | 2018-01-24 |
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