五、新型說明： 【新型所屬之技術領域】 本創作係關於背光模組，尤指一種使用發光二極體作為 發光源，且直接將發光二極體及金屬線路等元件，一體製作 於背光模組的燈罩上，以能加快背光模組的整體生產效=， 並節省傳統發光二極體之背光模組Ψ原先使用的電路基板元 件。 【先前技術】 按，傳統應用於液晶螢幕上的背光模組，大多使用冷陰 極燈管（Cold cathode fluorescent lamp，簡稱CCFL)作為 發光源’但由於冷陰極管的發光過程中，需利用汞蒸氣作為 放電介質，而汞會對人體及環境產生危害，故，在歐盟特定 有害物質管制指令（Restriction of the use certain Hazardous Substance)中，已明定汞為禁用物質，使得含汞 的冷陰極管的燈具，無法在歐盟地區銷售，因此，為能解決 前述問題，業者莫不致力於新的發光元件的開發，其中由於 發光二極體（Light-emitting diode，簡稱LED)不需使用到 汞，且其本身尚具有耗電量低、壽命長、無須暖燈時間及反 應速度快等優點，故能符合多數國家的環境法規，且能大幅 提咼使用上的便利性，除此之外，發光二極體的體積亦可製 作得極為細小，故，在現今電子產品皆追求「輕薄短小」的 設計理念下，發光二極體儼然已成為背光模組中，不可或缺 的重要發光元件。 請參閱第1圖所示，習知具有發光二極體的背光模組J， 包括一金屬燈罩11及一發光部13，其中該金屬燈罩丨丨之一側 凹設有一容置槽110，以使該發光部13能容納至該容置槽11〇 中，且該發光部13所發出之光源，能藉由該容置槽11〇的内側 表面的反射效果，而自該容置槽11〇的開口投射出去，另，該 發光部13係為一發光二極體燈條（LED Light Bar)，包括一 電路基板131、複數層黏著劑132、一金屬線路133及至少一發 光二極體135 ’該金屬線路133係藉由該黏著劑132披覆在該電 路基板131之一侧面上，並經過曝光、顯影、蝕刻等程序，形 成一電路板，該等發光二極體135則組裝至該電路基板131 上，並連接（如：焊接）至該金屬線路133上，以能接收該金 屬線路133傳來的電流，並發出光線，最後，該電路基板131 係藉由該黏著劑132固定至該容置槽no中，以避免晃動或位 移而影響該背光模組1的整體發光品質，如此，該背光模組1 即可作為液晶螢幕的發光源。 惟’復請參閱第1圖所示，由於發光二極體135在發出光 線時，係會產生大量的熱暈，因此，當背光模組的散熱效果 不佳時，係會造成金屬燈罩11内部空間的溫度過高，進而導 至鄰近該等發光二極體135的元件（如：導光板）容易發生老 化現象，且該等發光二極體135亦容易因高溫而損壞，但傳統 的電路基板131為能有效隔絕電流，以避免短路現象，故通常 使用塑膠或樹脂材質製成，而無較好的導熱性，使得該等發 光二極體135所產生的熱量必須依序經由該黏著劑132、電路 基板131及另一黏著劑132傳遞至金屬燈罩η上，造成該背光 M378404 模組1整體的散熱效率不佳；另，前述的製造方式中，該金屬 燈罩11及發光部13乃是分別製造，並進行組裴，因此，業者 在生產背光模組1時，必須使用;同的生產線製作該金屬燈罩 11及發光部13 ’並花費運送該金屬燈抑及發光部^費 用，以及庫存金屬燈罩11及發光部13的費用與倉庫空間，造 成該背光齡1的整财本上升，且延長該背絲組丨的生產 時間。 故’如何設計出-__背紐組，以能解決前述問 題，即成為目前相關背光模组業者，亟欲解決之一重要課題。 【新型内容】 有鑑於傳統使用發光二極體的背光模組，存在散熱不 易、生產效率低落等問題’造絲背光模組料產生元件老 化、及生產流程過長等問題，因此，創作人經過長久努力研 究與實驗’·開發輯棘鑛之-種-默發光二極體 之背光模組’以麟由本辦之問世，而能有效解決前述問 題。 本創作之一目的，係提供一種一體式發光二極體之背光 模組，其主要係在生產的過程中，將燈罩部及發光部一體製 作，以能節省材料，並縮短整體背光模組的生產時間，該背 光模組包括一燈罩部，該燈罩部係具有一斷面形狀，且其一 側形成有-容置槽’另’-發光部係容納在該容置槽，且能 藉由該容置槽的内側表面的反射效果，將自身產生的光源自 該容置槽的開口投射出去，又’該發光部包括一絕緣導熱膠、 5 =金屬線路及至少一發光二極體，各該發光二極體係分別與 該金屬線路相連接’以能接收該金屬線路傳來之電流，並發 出光線’ J·該金屬線路藉由魏轉娜細在該容置槽的 内2表面上，以能將該等發光二極體所產生之熱量，快速地 ，導至該燈罩部上，如此，即可大幅簡化發光二極體之背光 核組之整體結構及製作程序，以有效提高生產效率。 本創作之另—目的，係該金屬線路乃是透過絕緣導熱膠 黏貼至該燈罩部上，以將該燈罩部作為電路基板使用，且不 t發生短路等情況’如此’即可節省傳統發光二極體之背光 核組中原先使用的·基紐料，有餅低生產成本，且該 等，光一極體所產生的熱量關快速地傳遞至該燈罩部上， 以藉由大面積的燈罩部散熱，大幅提高該背光模組的整體散 熱效率’轴達财奴長燈具朗壽命之目的。 為便貴審查委員能縣創作目的、技術特徵及其功效， 做更進-步⑼識與瞭解，_實施例配合圖式，詳細說明 如下.V. New Description: [New Technology Field] This creation is about backlight modules, especially one that uses a light-emitting diode as a light source, and directly integrates components such as light-emitting diodes and metal lines into a backlight module. The lampshade of the group can speed up the overall production efficiency of the backlight module, and save the circuit board component originally used by the backlight module of the conventional light-emitting diode. [Prior Art] According to the conventional backlight module used on the LCD screen, most of the cold cathode fluorescent lamps (CCFLs) are used as the light source. However, due to the light-emitting process of the cold cathode tubes, mercury vapor is required. As a discharge medium, mercury can cause harm to the human body and the environment. Therefore, in the Restriction of the use certain Hazardous Substance, mercury has been identified as a banned substance, so that the lamp containing the cold cathode tube containing mercury , can not be sold in the EU region, therefore, in order to solve the above problems, the industry is not committed to the development of new light-emitting components, in which the light-emitting diode (LED) does not need to use mercury, and itself It has the advantages of low power consumption, long life, no need for warm-up time and fast response, so it can meet the environmental regulations of most countries, and can greatly improve the convenience of use. In addition, the light-emitting diodes The volume can also be made very small, so in today's electronic products are pursuing the "light and thin" design concept, Photo-diode has become an backlight module, the light emitting element is indispensable. As shown in FIG. 1 , a backlight module J having a light-emitting diode includes a metal lamp cover 11 and a light-emitting portion 13 , wherein one of the metal lamp cover is recessed with a receiving groove 110 The light-emitting portion 13 can be accommodated in the accommodating groove 11 ,, and the light source emitted from the light-emitting portion 13 can be reflected from the accommodating groove 11 by the reflection effect of the inner surface of the accommodating groove 11 〇 The light emitting portion 13 is a light emitting diode (LED Light Bar), and includes a circuit substrate 131, a plurality of layers of adhesive 132, a metal line 133, and at least one light emitting diode 135. The metal line 133 is coated on one side of the circuit board 131 by the adhesive 132, and subjected to exposure, development, etching, etc. to form a circuit board, and the light-emitting diodes 135 are assembled to the same. The circuit board 131 is connected (eg, soldered) to the metal line 133 to receive the current from the metal line 133 and emit light. Finally, the circuit board 131 is fixed to the circuit board 131 by the adhesive 132. The accommodating slot no to avoid sway or displacement Affect the overall quality of the light emission of the backlight module 1, so that the light emitting source can be a backlight module of the liquid crystal screen. However, as shown in Fig. 1, since the light-emitting diode 135 emits a large amount of heat when it emits light, when the heat dissipation effect of the backlight module is not good, the inside of the metal lamp cover 11 is caused. The temperature of the space is too high, and the components (such as the light guide plate) adjacent to the light-emitting diodes 135 are prone to aging, and the light-emitting diodes 135 are also easily damaged by high temperature, but the conventional circuit substrate 131 is effective in isolating the current to avoid the short circuit phenomenon, so it is usually made of plastic or resin material without good thermal conductivity, so that the heat generated by the light-emitting diodes 135 must pass through the adhesive 132 in sequence. The circuit board 131 and the other adhesive 132 are transferred to the metal lamp cover η, so that the heat dissipation efficiency of the whole module 1 of the backlight M378404 is not good. In the above manufacturing method, the metal lamp cover 11 and the light-emitting portion 13 are respectively Manufacture and assembly, therefore, the manufacturer must use the backlight module 1; the same production line produces the metal shade 11 and the light-emitting portion 13' and transports the metal lamp to the light-emitting portion. The cost, as well as the cost of the metal shade 11 and the light-emitting portion 13 and the warehouse space, increase the overall cost of the backlight age 1 and prolong the production time of the back-wire assembly. Therefore, how to design the -__ back group to solve the above problems has become an important issue for the relevant backlight module manufacturers. [New content] In view of the traditional backlight module using the light-emitting diode, there are problems such as difficulty in heat dissipation and low production efficiency. The problem of aging of the components of the wire-backed backlight module and the long production process are so long. Long-term efforts and research '·Development of the spine-type-light-emitting diode backlight module' is based on Lin, and can effectively solve the above problems. One of the purposes of this creation is to provide an integrated backlight module for a light-emitting diode, which is mainly used in the production process to integrally manufacture the lamp cover portion and the light-emitting portion to save material and shorten the overall backlight module. During the production time, the backlight module includes a lamp cover portion having a cross-sectional shape, and one side of the lamp cover portion is formed with a receiving groove, and the light-emitting portion is received in the receiving groove. The reflection effect of the inner surface of the accommodating groove projects the light source generated by itself from the opening of the accommodating groove, and the illuminating portion includes an insulating thermal conductive adhesive, 5 = metal wiring and at least one light emitting diode, each The light-emitting diode system is respectively connected to the metal line to receive the current from the metal line and emit light. J. The metal line is finely ground on the inner surface of the receiving groove by Wei Yuna. The heat generated by the light-emitting diodes can be quickly guided to the lamp cover portion, thereby greatly simplifying the overall structure and manufacturing procedure of the backlight core group of the light-emitting diodes, thereby effectively improving production efficiency. . Another purpose of the present invention is that the metal circuit is adhered to the lamp cover portion through an insulating thermal conductive adhesive to use the lampshade portion as a circuit substrate, and the short circuit is not generated, so that the conventional light-emitting device can be saved. The base material used in the backlight core group of the polar body has a low production cost of the cake, and the heat generated by the light body is quickly transmitted to the lamp cover portion to pass the large-area lamp cover portion. The heat dissipation greatly improves the overall heat dissipation efficiency of the backlight module. In order to facilitate the review of the purpose of the county, the technical characteristics and its efficacy, do more step-by-step (9) knowledge and understanding, _ example with the schema, detailed description is as follows.
本創作係-種-體式發光二極體之背光模組，請參 圖所不’前光雛2包括—燈罩部21及—發光 21係由-金屬片體經賴成-斷面做後，, 二ST設有—容置槽21G，該容置槽21。係能容知 該發光部23所發出的光源，能藉由該容置 6 的反射效果，而自該容置槽210的開口投射出去，惟，在本創 作之其它實施例中，為能提高反射效果，業者尚能在該燈罩部 中增設一反射片體，以提高該背光模組2的反射率，另，該發 光4 23包括一絶緣導熱膠231、一金屬線路233及至少一發 光二極體235 (Light-emitting diode，簡稱LED)，該金屬線路 233係藉由該絕緣導熱膠231貼附至該容置槽21〇的内侧表面 上，在該實施例中，該金屬線路233係以貼附至該容置槽210 的底面為例，但實際應用時，並不侷限於底面，而可為任一内 側表面，又，由於該絕緣導熱膠231無法傳遞電流，故可避免 該金屬線路233在接收到電流後，因接觸到該燈罩部21而發 生短路現象。 再者’復請參閱第2圖所示，各該發光二極體235係連接 (如：焊接）至該金屬線路233上，以能接收該金屬線路233 ，來的電流’並發出光線，且該等發光二極體235所產生的熱 里，月b透過該金屬線路233而快速地傳導至該燈罩部21，以 和用大面積的燈罩部21散熱，如此，藉由本發明的一體式發 光二極體之背光模組2，即能觸省傳統發光二極體之背光模 组^原先伽的電職錄餘#元件及㈣，且能增加 該月光模組2的整體散熱效率^為㈣確揭示前述整體的結構 特徵’茲僅就完成本創作之背紐組結制第-種製程方法進 行說明，請參閱第3圖所示： (101)首先，參閱第4圖，工作人員藉由一絕緣導熱膠231 將一銅落233A及一離形元件25 (如：離形紙、離形 膜…等）相互黏貼固定； (102)依印刷電路板的製程’對該鋼 以製作出所需的金屬線路233;及進仃相.序， (1〇3)將複數個發光二極體235電氣連接（如 金屬線路233上。 ~接）至該 孝者錢娜4嶋，麵辑的製程後， 業者即了在離形讀25上製作出所需 二極體235，又，辈去妒鈞古蛀收—拉为 吩夂^九The creative system is a backlight module of a seed-body type light-emitting diode, please refer to the figure, the front light 2 includes a lamp cover portion 21 and a light-emitting 21 system, and the metal sheet body is made by Lai Cheng-section. The second ST is provided with a receiving groove 21G, and the receiving groove 21. The light source emitted by the light-emitting portion 23 can be made to be projected from the opening of the accommodating groove 210 by the reflection effect of the accommodating portion 6. However, in other embodiments of the present invention, In the reflection effect, the manufacturer can add a reflective sheet to the shade portion to improve the reflectivity of the backlight module 2. The light-emitting layer 231 includes an insulating thermal conductive adhesive 231, a metal line 233, and at least one light-emitting diode. a light-emitting diode (LED) 235 is attached to the inner surface of the accommodating groove 21 by the insulating thermal conductive adhesive 231. In this embodiment, the metal wiring 233 is For example, the bottom surface of the accommodating groove 210 is attached to the bottom surface of the accommodating groove 210. However, in practice, it is not limited to the bottom surface, but may be any inner side surface. Moreover, since the insulating thermal conductive adhesive 231 cannot transmit current, the metal can be avoided. When the line 233 receives the current, a short circuit occurs due to contact with the shade portion 21. Furthermore, as shown in FIG. 2, each of the light-emitting diodes 235 is connected (eg, soldered) to the metal line 233 to receive the current from the metal line 233 and emit light. In the heat generated by the light-emitting diodes 235, the month b is quickly transmitted to the lamp cover portion 21 through the metal wires 233 to dissipate heat with the large-area lamp cover portion 21, so that the integrated light-emitting device of the present invention The backlight module 2 of the diode is capable of touching the backlight module of the conventional light-emitting diode, the electric component of the original gamma, and the component (4), and can increase the overall heat dissipation efficiency of the moonlight module 2 (4) It is true that the above-mentioned overall structural features are only described. Please refer to Figure 3 for the method of completing the first-stage process for completing the creation of this creation. (101) First, refer to Figure 4, the staff An insulating thermal conductive adhesive 231 adheres a copper drop 233A and a release member 25 (eg, a release paper, a release film, etc.) to each other; (102) according to a process of the printed circuit board, the steel is fabricated Required metal line 233; and entering the phase sequence, (1〇3) will be a plurality of light-emitting diodes 235 electrical connection (such as metal line 233. ~ connected) to the filial piety Qianna 4 嶋, after the process of the series, the industry has produced the required diode 235 on the off-line reading 25, and妒钧古蛀收—拉为夂夂九
Mm 科光二軸235及金屬 2形元件25上分離，條魏__ —寸至燈罩板體上，嗣，對該燈罩板體進行沖壓，以形成預 ==的燈罩部21 (如第2圖所示），使得該燈罩部η、該金 ^路233及該等發光二極體说能形成一背光模組2。如此， 料光模組2即可在生產的過程中，將發光部23及燈罩部21 體衣作，令業者不f為燈罩部21或發緋Μ而劃分為不同 ^產線，且能減傾運各個元件及倉儲的費用，有效提高該 j光模組2的整體生產效率及降低生產成本，且因該發光二極 _ =5係直接或僅透過絕緣導熱谬231接觸到該燈罩部以， 故月b將自身產生的熱量，快速地傳遞至該燈罩部u，大幅提 高該背光模組2的散熱效果。 另’在本創作之另-實施例中，若業者為能提高背光模組 的發光效率，而在燈罩部t增設反射片體（如：飽和多元醋的 塑料材質、錢有金屬反射層之塑料材質）的情況下，請參閱第 5圖所示，該背光模組3儀包括—燈罩部31及―發光部幻， =燈罩部31係由-金屬片體311及一反射片體312製成，或 業者亦能夠僅用反射片體犯作為燈罩部31，且該燈罩部 31的-側凹設有一容置槽31〇，另，該發光部33包括一絕緣 導熱膠331、金屬線路333及至少一發光二極體您，該金 屬線路333係藉由該絕緣導歸33111]定至該容置槽的内 侧表面各該發光二極體335肖連接至該金屬線路扭上， Μ能接收該金屬線路333傳來的電流，並發出光線。承前所 述’在背絲組3的燈罩部η中設有反射片體犯的情況下， 業者除雜㈣述的帛—種製程綠，先行在轉祕上製作 出金屬線路333及發光二極體335外，尚可改為另一種製程方 法，即將第一種製程方法中的離形元件代換為反射片體312， 而直接在反射片體312上製作出金屬線路333及發光二極體 335，並生產出本創作的背光模組3。如此，由於業者能快速 地將該金屬線路333及發光二極體335 一體地製作在反射片體 312上，即可省去傳統背光模組中電路基板的材料，另，當業 者直接在反射片體312上製作出金屬線路333及發光二極體 335後，便能夠依產品的生產設計，而將該反射片體312黏貼 至一金屬片體311上，並沖壓成預定形狀，以形成本創作之燈 罩部31，或者先行彎折該反射片體312，並將其置入一預定形 狀的金屬片體311中，以形成本創作之燈罩部31，或者業者 能直接以該反射片體312作為本創作之燈罩部31，令本創作 之背光模組能夠具有更大的產業利用性，以提高業者的市場競 爭力。 再者，在本創作之再一實施例中，業者亦可改變反射片體 與金屬片體的接合方式，而形成另一樣式的燈罩部，請參閱第 6圖所示’該背光模组4係包括一燈罩部41及一發光部43， 該燈罩部41係由一金屬片體411及一反射片體412製成，該 金屬片體411的一侧凹設有一容置槽41〇，該發光部43包括 一絕緣導熱膠431、一金屬線路433及至少一發光二極體435， 該金屬線路433係藉由該絕緣導熱膠431固定至該金屬片體 4Π的内侧表面，且各該發光二極體435尚連接至該金屬線路 433上，該反射片體412係容納至該容納槽41〇中，且其上對 應該發光二極體435的位置設有一孔洞4120，以供該發光二 極體435穿過’並反射該發光二極體435所發出的光線，如此， 該發光部43即能夠快填地將自身的熱量傳遞至該金屬片體 411 ’並具有良好的反射效果。 綜上所述可知’由於本創狀背光模組上並不需額外使用 電路基板，因此’能具有下列的優點： 0)燈罩部及發光部係—難作，大巾!簡化該f光模組之整 體結構及製作程序’進而提高背賴組的整體生產效率； (2) 發光部不需使用電路基板，有效降低生產成本； (3) 業者不需針對燈罩部、發光部劃分不同的生產線； ⑷業者不需額外規劃單獨存放燈罩部、發光部等元件的倉 儲空間；及 (5)發光二極體的熱量能快速地傳導至燈罩部，提高該背光 模組的整體散熱效率。 ° 在此特別-提者’本創作之金屬線路在貝占附至料部後， 業者能藉由電線、軟性電路板或使用其它線路配置，連接至該 金屬線路’以供應電源’由於供給電源至金屬線路，係存有多 種連接方式’在此不-—㈣，但不論制何種電路配置方 M378404 法’只要該金屬線路能接收到電源，並將所收之電源傳遞至發 光二極體，即為本創作所述之金屬電路。按，以上所述，僅係 本創作之雛實麵，惟’本娜駐張之湖範圍，並不偈 ，於此’按凡熟悉該項聽人士，鎌本_所揭露之技術内 谷’可輕易思及之等效變化，均應屬不脫離本創作之保護範疇。 【圖式簡單說明】 第1圖係傳統的背光模組剖面圖； 第2圖係本創作之背光模組立體示意圖； =3圖係本創作之第—種製程流程圖； 第4圖係本創作之第一種製程示意圖； 第5圖係本創作之另—背光模組剖㈣意圖；及 第6圖係本創作之再-背光模組剖面示意圖。 【主要元件符號說明】 2、3、4 2 卜 31、41 210、310、410 23、33、43 231 ^ 331 ' 431 233、333、433 233A 235、335、435 25 背光模組 燈罩部 .... 容置槽 .... 發光部 ... 絕緣導熱膠 .... 金屬線路 .... 鋼箔 發光二極體 .... 離形元件 .. 11 M378404 金屬片體 …… 3H、 反射片體 …… 312、 孔洞 …… 4120 411 412 12Mm Keguang two-axis 235 and metal 2-shaped element 25 are separated, and the strip is __-inch onto the lamp cover plate, and the lamp cover plate is stamped to form a pre-== lamp cover portion 21 (as shown in Fig. 2) As shown in the figure, the lamp cover portion η, the gold circuit 233 and the light-emitting diodes can be said to form a backlight module 2. In this way, the light-emitting module 2 can be used to fabricate the light-emitting portion 23 and the lamp cover portion 21 during the production process, so that the operator can be divided into different production lines without being the lamp cover portion 21 or the hairpin, and can be reduced. The cost of dumping each component and storage effectively increases the overall production efficiency of the j-light module 2 and reduces the production cost, and the light-emitting diode _=5 is directly or only transmitted through the insulating heat-conducting 231 to the lampshade portion. Therefore, the heat generated by the month b is quickly transmitted to the shade portion u, thereby greatly improving the heat dissipation effect of the backlight module 2. In addition, in another embodiment of the present invention, if the manufacturer can improve the luminous efficiency of the backlight module, a reflective sheet body is added to the lamp cover portion (for example, a plastic material of saturated multi-vinegar, a plastic having a metal reflective layer) In the case of the material, as shown in FIG. 5, the backlight module 3 includes a lamp cover portion 31 and a "light-emitting portion", and the lamp cover portion 31 is made of a metal sheet body 311 and a reflection sheet body 312. Or the operator can also use the reflective sheet body as the lamp cover portion 31, and the cover portion 31 is recessed with a receiving groove 31〇, and the light-emitting portion 33 includes an insulating thermal conductive adhesive 331 and a metal line 333. At least one light-emitting diode, the metal line 333 is fixed to the inner side surface of the accommodating groove by the insulating guide 33111], and the light-emitting diode 335 is connected to the metal line twist, and the Μ can receive the The current from the metal line 333 emits light. In the case where the reflection sheet body is provided in the shade portion η of the back yarn group 3, the manufacturer removes the green-type process green described in (4), and firstly creates a metal line 333 and a light-emitting diode on the transfer. In addition to the body 335, it can be changed to another process method, that is, the release element in the first process method is replaced by the reflection sheet 312, and the metal line 333 and the light-emitting diode are directly formed on the reflection sheet body 312. 335, and produced the backlight module 3 of the present creation. In this way, since the metal line 333 and the light-emitting diode 335 can be integrally formed on the reflective sheet 312, the material of the circuit substrate in the conventional backlight module can be omitted, and the operator directly in the reflective sheet. After the metal line 333 and the light-emitting diode 335 are formed on the body 312, the reflective sheet body 312 can be adhered to a metal sheet body 311 according to the production design of the product, and punched into a predetermined shape to form the present creation. The lamp cover portion 31, or the reflection sheet body 312 is bent first, and placed in a predetermined shape of the metal sheet body 311 to form the lamp cover portion 31 of the present invention, or the reflection sheet body 312 can be directly used by the manufacturer. The lampshade part 31 of the present invention enables the backlight module of the present invention to have greater industrial utilization to enhance the market competitiveness of the industry. Furthermore, in still another embodiment of the present invention, the manufacturer can also change the manner in which the reflective sheet and the metal sheet are joined to form another type of shade portion. Please refer to FIG. 6 for the backlight module 4 The lamp cover portion 41 is formed by a metal plate body 411 and a reflective sheet body 412. One side of the metal plate body 411 is recessed with a receiving groove 41? The light-emitting portion 43 includes an insulating thermal conductive adhesive 431, a metal wiring 433, and at least one light-emitting diode 435. The metal wiring 433 is fixed to the inner surface of the metal foil body 4 by the insulating thermal conductive adhesive 431, and each of the light-emitting portions The diode 435 is still connected to the metal line 433, and the reflective sheet 412 is received in the receiving groove 41, and a hole 4120 is disposed at a position corresponding to the light emitting diode 435 for the light emitting The polar body 435 passes through 'and reflects the light emitted by the light-emitting diode 435. Thus, the light-emitting portion 43 can transfer its own heat to the metal sheet body 411' with a quick filling and has a good reflection effect. In summary, it can be seen that 'there is no additional use of the circuit board on the inventive backlight module, so 'the following advantages can be obtained: 0) The lamp cover portion and the light-emitting portion are difficult to make, the large towel! Simplify the f-mode The overall structure and production process of the group' further improve the overall production efficiency of the group; (2) The light-emitting part does not need to use the circuit board, which effectively reduces the production cost; (3) The manufacturer does not need to divide the production line for the lampshade part and the light-emitting part. (4) The operator does not need to additionally plan to store the storage space of the lamp cover, the light-emitting part and the like separately; and (5) the heat of the light-emitting diode can be quickly transmitted to the lamp cover portion, thereby improving the overall heat dissipation efficiency of the backlight module. ° In this special - mentioning that the metal line of this creation is attached to the material department, the industry can be connected to the metal line by the wire, flexible circuit board or other line configuration to supply power. To the metal line, there are a variety of connection methods 'not here--(four), but regardless of the circuit configuration method M378404 method' as long as the metal line can receive the power, and the received power is transmitted to the light-emitting diode , which is the metal circuit described in this creation. According to the above, it is only the solid face of this creation, but 'Benna’s range in Zhangzhi Lake is not awkward. Here, 'following the person who is familiar with the subject, 镰本_Uncovered the technology inside the valley' Equivalent changes that can be easily considered are not subject to the protection of this creation. [Simple diagram of the diagram] Figure 1 is a sectional view of a conventional backlight module; Figure 2 is a three-dimensional diagram of the backlight module of the present invention; =3 diagram is the first process flow chart of the creation; Figure 4 is a diagram The first process schematic diagram of the creation; the fifth figure is the other part of the creation - the backlight module section (four) intention; and the sixth figure is the schematic diagram of the re-backlight module of the present creation. [Description of main component symbols] 2, 3, 4 2 Bu 31, 41 210, 310, 410 23, 33, 43 231 ^ 331 ' 431 233, 333, 433 233A 235, 335, 435 25 backlight module lamp cover.. .. accommodating groove.... illuminating part... Insulation thermal conductive adhesive.... Metal wiring.... Steel foil light emitting diode.... Release component: 11 M378404 Metal sheet body... 3H , reflective sheet... 312, holes... 4120 411 412 12