2〇l〇19〇〇9_w 24__ 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組及使用此光源模組之 顯示裝置，且特別是有關於一種背光模組(backlight module) 及使用此背光模組之液晶顯示裝置(liquid crystal display， LCD)。 【先前技術】 ^ 隨著現代視訊技術的進步，液晶顯示裝置已被大量地 使用於手機(mobile phone)、筆記型電腦(notebook personal computer)、個人電腦(personal computer, PC)及個人數位助 理(personal digital assistant，PDA)等消費性電子產品的顯 示螢幕上。然而，由於液晶顯示裝置之液晶顯示面板(LCD panel)本身並不具有發光的功能’因此需要於液晶顯示面 板下方配置背光模組以提供液晶顯示面板所需要之光源， 進而使液晶顯示面板達到顯示的效果。 圖1為一種習知背光模組的局部剖示圖。請參照圖1， ❹ 習知背光模組100包括一導光板110、——光源載具12〇以 及一光源元件130。光源載具120位於導光板no之入光 面112旁而構成一容納空間122。光源元件13〇配置於容 納空間122中。隨著液晶顯示裝置對於亮度的要求不斷提 升，設計上也傾向以更大的電流來驅動光源元件13〇以獲 得更高亮度。 然而，由於光源元件130被封閉於容納空間122中， 因此光源元件13G在鋪電流越來越大的_，由於散熱 iviZITW 24604twf.doc/n 201019009 效率差而降低發光效率的情形更顯嚴重。甚至，光源元件 130的使用奇命也會隨著工作溫度的升高而縮短。因此， 如何提升背光模組之亮度並延長其使用壽命，已成為亟待 解決的課題。 【發明内容】 本發明提供一種背光模組，可解決散熱效率不佳所造 成的發光效率與使用壽命不理想的問題。 本發明再提供一種液晶顯示裝置，可解決因背光模組 之散熱效率不佳所造成的亮度與使用壽命不理想的問題。 本發明之背光模組包括一導光板、一光源載具以及〆 光源元件。導光板具有一入光面、一底面與一出光面。入 光面連接底面與出光面，而底面與出光面相對。光源載具 位於導光板之入光面旁而構成一容納空間，且具有至少〆 第-散熱開π。容納空間之開吨向人光面。光源元件齡 置於容納空間中。 參 本發明之液晶顯示裝置包括前述之背光模組以及〆 液晶顯不面板’其中液晶顯示面板配置於背光模組之出光 面之一側。 在此背光模組與液晶顯示裳置的一實施例中光源元 件包括至少-魏板以衫鱗光H電路板配置於 =間中，而發光二極體配置於電路板上且與電路板電 ΐ連接。此外，電路板例如實質上平行於出絲。或者， 電路板例如實質上平行於入光面。 在此背光模組與液晶顯示裝置的—實施例中，光源元2〇l〇19〇〇9_w 24__ IX. Description of the Invention: [Technical Field] The present invention relates to a light source module and a display device using the same, and more particularly to a backlight module ( Backlight module) and a liquid crystal display (LCD) using the backlight module. [Prior Art] ^ With the advancement of modern video technology, liquid crystal display devices have been widely used in mobile phones, notebook personal computers, personal computers (PCs), and personal digital assistants ( Personal digital assistant, PDA) and other consumer electronic products on the display screen. However, since the liquid crystal display panel (LCD panel) of the liquid crystal display device does not have the function of emitting light itself, it is necessary to configure a backlight module under the liquid crystal display panel to provide a light source required for the liquid crystal display panel, thereby enabling the liquid crystal display panel to display. Effect. FIG. 1 is a partial cross-sectional view of a conventional backlight module. Referring to FIG. 1, the conventional backlight module 100 includes a light guide plate 110, a light source carrier 12A, and a light source component 130. The light source carrier 120 is located beside the light incident surface 112 of the light guide plate no to form a receiving space 122. The light source element 13A is disposed in the accommodation space 122. As the demand for brightness of liquid crystal display devices continues to increase, it is also designed to drive the light source elements 13 with a larger current to obtain higher brightness. However, since the light source element 130 is enclosed in the accommodating space 122, the illuminating efficiency of the light source element 13G is more severe due to the inefficiency of the heat dissipation iviZITW 24604 twf.doc/n 201019009. Even the use of the light source element 130 is shortened as the operating temperature increases. Therefore, how to improve the brightness of the backlight module and prolong its service life has become an urgent problem to be solved. SUMMARY OF THE INVENTION The present invention provides a backlight module that can solve the problem of unsatisfactory luminous efficiency and service life caused by poor heat dissipation efficiency. The present invention further provides a liquid crystal display device which can solve the problem that the brightness and the service life are not ideal due to the poor heat dissipation efficiency of the backlight module. The backlight module of the present invention comprises a light guide plate, a light source carrier and a light source component. The light guide plate has a light incident surface, a bottom surface and a light exit surface. The entrance surface connects the bottom surface to the light exit surface, and the bottom surface is opposite to the light exit surface. The light source carrier is located adjacent to the light incident surface of the light guide plate to form a receiving space, and has at least a first heat dissipation opening π. The opening of the accommodation space is smooth to the people. The light source component is placed in the accommodation space. The liquid crystal display device of the present invention includes the backlight module and the liquid crystal display panel, wherein the liquid crystal display panel is disposed on one side of the light emitting surface of the backlight module. In an embodiment in which the backlight module and the liquid crystal display are disposed, the light source component comprises at least a black plate disposed in the frame, and the light emitting diode is disposed on the circuit board and electrically connected to the circuit board. ΐ Connect. Furthermore, the circuit board is for example substantially parallel to the wire. Alternatively, the circuit board is, for example, substantially parallel to the light incident surface. In the embodiment of the backlight module and the liquid crystal display device, the light source element
YiZlTW 24604twf.doc/n 201019009 件包括至少一冷陰極螢光燈管。 在此背光模組與液晶顯示裝置的一實施例中，背光模 組更包括一膠框與一背板。膠框與導光板配置於背板上， 且膠框圍繞導光板。此外，膠框可具有對應第一散熱開口 的一第二散熱開口。另外，背板也可具有對應第一散熱開 口的一第二散熱開口。再者，背光模組可更包括一導熱材 料，其填充於容納空間中而接觸光源元件，並經由散熱開 口而接觸背板。此外，背光模組可更包括一鋼箔，配置於 光源元件之表面並接觸導熱材料。 在此背光模組與液晶顯示裝置的一實施例中，背光模 組更包括一反射片，其配置於導光板之底面。 綜上所述，在本發明之背光模組與液晶顯示裝置中， 由於光源載具具有散熱開口，因此光源元件在工作時所產 生的熱量可經由散熱開口而快速散逸。藉此，本發明之背 光模組與液晶顯示裝置的亮度與使用壽命可獲得改善。 為讓本發明之上述和其他目的、特徵和優點能更明顯 粵 易懂，下文特舉較佳實施例’並配合所附圖式，作詳細說 明如下。 ' Π 【實施方式】 圖2為本發明一實施例之背光模組的局部剖示圖。請 參照圖2 ’本實施例之背光模組200包括一導光板21〇、二 光源载具220以及一光源元件23〇。導光板21〇具有一入 光面212、一底面214與一出光面216。入光面212連接底 面214與出光面216，而底面214與出光面216相對。光 24604twf.doc/nYiZlTW 24604twf.doc/n 201019009 pieces include at least one cold cathode fluorescent tube. In an embodiment of the backlight module and the liquid crystal display device, the backlight module further includes a plastic frame and a back plate. The plastic frame and the light guide plate are disposed on the back plate, and the plastic frame surrounds the light guide plate. In addition, the bezel may have a second heat dissipation opening corresponding to the first heat dissipation opening. In addition, the backboard may also have a second heat dissipation opening corresponding to the first heat dissipation opening. Furthermore, the backlight module may further comprise a heat conductive material filled in the receiving space to contact the light source component and contact the backing plate via the heat dissipation opening. In addition, the backlight module may further include a steel foil disposed on the surface of the light source component and in contact with the heat conductive material. In an embodiment of the backlight module and the liquid crystal display device, the backlight module further includes a reflective sheet disposed on a bottom surface of the light guide plate. In summary, in the backlight module and the liquid crystal display device of the present invention, since the light source carrier has a heat dissipation opening, heat generated by the light source element during operation can be quickly dissipated through the heat dissipation opening. Thereby, the brightness and service life of the backlight module and the liquid crystal display device of the present invention can be improved. The above and other objects, features and advantages of the present invention will become more apparent from Π Embodiments FIG. 2 is a partial cross-sectional view of a backlight module according to an embodiment of the present invention. Referring to FIG. 2, the backlight module 200 of the present embodiment includes a light guide plate 21, two light source carriers 220, and a light source element 23A. The light guide plate 21A has a light incident surface 212, a bottom surface 214 and a light exit surface 216. The light incident surface 212 is connected to the bottom surface 214 and the light exit surface 216, and the bottom surface 214 is opposite to the light exit surface 216. Light 24604twf.doc/n
201019009 iZ1TW =载具220位於導光板2i〇之入光面212旁而構成一容納 空間222 ’且光源載具220具有至少一散熱開口 224。容納 空間222之開口是朝向入光面212的，亦即導光板210之 入光面212位於容納空間222之開口處。光源元件230配 置於容納空間222中，以提供光線並讓光線由入光面212 入射至導光板210中而由出光面216射出。 在本實施例之背光模組2〇〇中，光源元件230在工作 φ 時所產生的熱量可從散熱開口 224向外散逸’因此可避免 光源元件230因過熱而導致發光效率降低，進而延長光源 兀件230的使用壽命。同時，在背光模組2〇〇的散熱效率 獲得提升後’也可進一步調高光源元件23〇的發光亮度而 不需擔心過度縮短光源元件230的使用壽命。 此外，在本實施例中，光源元件23〇包括至少一電路 板232以及多個發光二極體234。由於圖2為剖面圖，因 此只能見到一個發光二極體234。電路板232配置於容納 空間222中，而發光二極體234配置於電路板232上且與 • 電路板232電性連接。另外，電路板232的擺放方式例如 是實質上平行於出光面216，而發光二極體234的發光方 向則以朝向入光面212為主。若要進一步提升背光模組2〇〇 所k供之面光源的亮度，還可在容納空間222中配置更多 個電路板232，以便增加發光二極體234的數量。但是， 所增加之電路板232的擺放方式則不侷限於平行於出光面 216，而以能夠善用容納空間222為主。由於發光二極體 234屬於指向性的光源，因此發光二極體234所提供的光 201019009 1Z1TW 24604twf.doc/n 線幾乎不會由散熱開口 224射出。再者，散熱開口 224的 數量可選擇配合發光二極體234的數量，或者也可直接將 散熱開口 224設計為單一的長條狀開口。 ' 在本實施例中’背光模組200更包括一膠框240與一 背板250。膠框240與導光板21〇配置於背板250上，且 膠框240圍繞導光板210。膠框240與背板250是用於固 定背光模組200中的各項構件，且背板250還可選擇金屬 或其他導熱性佳的材料以提升整體散熱效率。導光板21〇 與膠框240之間可能是直接接觸或存在有其他構件。此 外，膠框240可選擇性地具有對應光源載具220之散熱開 口 224的一散熱開口 242，以使容納空間222内的熱空氣 月έ由散熱開口 224與242向外散出而進一步提升散熱效率。 另外’背光模組200還可更包括一反射片26〇,其配 置於導光板210之底面214,以將光線反射而從出光面216 射出。再者，光源載具220可採用具有光反射性的材料， 或是在光源載具220的内表面上配置一層光反射材料，藉 參 以提高光線的利用率。此外，本實施例之背光模組2〇〇以 單邊入光為例，即導光板210具有單一入光面212，但背 光模組200也可採用雙邊或多邊入光的設計。另外，背光 模組200還可更包括一或多個光學膜片270，這些光學膜 片270例如是增光片、擴散片、其他適當光學臈片或是這 些光學膜片之組合。 圖3為本發明另一實施例之背光模組的局部剖示圖。 請參照圖3 ’本實施例之背光模組3〇〇與圖2之背光模組 201019009, LZ1TW 24604twf.doc/n 200相似’在此僅介紹其差異處。本實施例中，光源载具 320之散熱開口 324位於發光二極體234後方。此外，背 光模組300還可選擇性地更包括一導熱材料380，其填充 於容納空間322中而接觸光源元件230，並經由散熱開口 324而接觸背板250。因此，光源元件230所產生的熱量可 藉由導熱速度快的導熱材料380而直接傳遞至背板250， 再由背板250將熱量導出。其中，本實施例之導熱材料380 是接觸光源元件230之電路板232與發光二極體234，但 參 導熱材料380也可以僅接觸電路板232或發光二極體 234。另外’背光模組300還可選擇性地更包括一銅箔390， 其配置於光源元件230之表面並接觸導熱材料380。亦即 是’銅箔390是位於光源元件230與導熱材料380的接觸 面’用以更進一步提升導熱速度。銅箔390也可由鋁箔或 其他適當材料取代。另外值得一提的是’除本實施例外， 光源載具320之散熱開口 324也可位於電路板232下方。 圖4為本發明再一實施例之背光模組的局部剖示圖。 ❹ 請參照圖4 ’本實施例之背光模組400與圖2之背光模組 200相似，在此僅介紹其差異處。本實施例中，光源載具 420具有兩個散熱開口 424,而背板450與膠框440分別具 有對應散熱開口 424的散熱開口 452與442。同時，其中 一個散熱開口 424還延伸到發光二極體234的上方。由於 圖4為剖面圖，因此只能見到兩個散熱開口 424，光源載 具420在圖4中未繪示的部分還可具有更多散熱開口 424。 圖5與圖6為本發明另外兩種實施例之背光模組的局 201019009身w 24604twf.doc/n 部剖示圖。請參照圖5，本實施例之背光模組500與圖2 之背光模組200相似，在此僅介紹其差異處。本實施例中， 光源元件之電路板532的擺放方式是實質上平行於導光板 210之入光面212。接著請參照圖6，本實施例之背光模組 600與圖5之背光模組500的差異在於，光源元件是由兩 個冷陰極螢光燈管632所構成，但冷陰極螢光燈管632之 數量可依需求增減。201019009 iZ1TW=The carrier 220 is located beside the light incident surface 212 of the light guide plate 2i to form a receiving space 222' and the light source carrier 220 has at least one heat dissipation opening 224. The opening of the accommodating space 222 is directed toward the light incident surface 212, that is, the light incident surface 212 of the light guide plate 210 is located at the opening of the accommodating space 222. The light source element 230 is disposed in the accommodating space 222 to provide light and to be incident on the light guide plate 210 from the light incident surface 212 to be emitted from the light exit surface 216. In the backlight module 2 of the embodiment, the heat generated by the light source element 230 when working φ can be dissipated outward from the heat dissipation opening 224. Therefore, the light source element 230 can be prevented from being lowered due to overheating, thereby extending the light source. The service life of the device 230. At the same time, after the heat dissipation efficiency of the backlight module 2 is improved, the light-emitting luminance of the light source element 23 can be further increased without worrying about excessively shortening the life of the light source element 230. Further, in the present embodiment, the light source element 23A includes at least one circuit board 232 and a plurality of light emitting diodes 234. Since Fig. 2 is a cross-sectional view, only one light-emitting diode 234 can be seen. The circuit board 232 is disposed in the receiving space 222, and the light emitting diode 234 is disposed on the circuit board 232 and electrically connected to the circuit board 232. Further, the layout of the circuit board 232 is, for example, substantially parallel to the light-emitting surface 216, and the light-emitting direction of the light-emitting diode 234 is mainly toward the light-incident surface 212. To further increase the brightness of the surface light source provided by the backlight module 2, more circuit boards 232 may be disposed in the receiving space 222 to increase the number of the light emitting diodes 234. However, the manner in which the added circuit board 232 is placed is not limited to being parallel to the light exit surface 216, but is mainly used to make good use of the accommodation space 222. Since the light-emitting diode 234 is a directional light source, the light provided by the light-emitting diode 234 is almost never emitted by the heat-dissipating opening 224 by the 201019009 1Z1TW 24604 twf.doc/n line. Furthermore, the number of heat dissipation openings 224 can be selected to match the number of light-emitting diodes 234, or the heat dissipation openings 224 can be directly designed as a single elongated opening. In the present embodiment, the backlight module 200 further includes a plastic frame 240 and a back plate 250. The plastic frame 240 and the light guide plate 21 are disposed on the back plate 250, and the plastic frame 240 surrounds the light guide plate 210. The plastic frame 240 and the back plate 250 are used to fix various components in the backlight module 200, and the back plate 250 may also select metal or other materials with good thermal conductivity to improve the overall heat dissipation efficiency. There may be direct contact or other components between the light guide plate 21A and the bezel 240. In addition, the plastic frame 240 can selectively have a heat dissipation opening 242 corresponding to the heat dissipation opening 224 of the light source carrier 220 to further dissipate the hot air moon in the accommodation space 222 from the heat dissipation openings 224 and 242 to further enhance heat dissipation. effectiveness. In addition, the backlight module 200 further includes a reflective sheet 26 配 disposed on the bottom surface 214 of the light guide plate 210 to reflect light and be emitted from the light exit surface 216. Furthermore, the light source carrier 220 may be made of a material having light reflectivity, or a light reflecting material may be disposed on the inner surface of the light source carrier 220 to improve the utilization of light. In addition, the backlight module 2 of the embodiment is exemplified by a single-sided light input, that is, the light guide plate 210 has a single light-incident surface 212, but the backlight module 200 can also adopt a bilateral or multilateral light-input design. In addition, the backlight module 200 may further include one or more optical films 270, such as a brightness enhancement sheet, a diffusion sheet, other suitable optical cymbals, or a combination of these optical films. FIG. 3 is a partial cross-sectional view of a backlight module according to another embodiment of the present invention. Referring to FIG. 3, the backlight module 3 of the present embodiment is similar to the backlight module of FIG. 2 201019009, LZ1TW 24604twf.doc/n 200. Here, only the difference is introduced. In this embodiment, the heat dissipation opening 324 of the light source carrier 320 is located behind the light emitting diode 234. In addition, the backlight module 300 can further include a heat conductive material 380 that fills the receiving space 322 to contact the light source component 230 and contacts the backing plate 250 via the heat dissipation opening 324. Therefore, the heat generated by the light source element 230 can be directly transmitted to the backing plate 250 by the heat conductive material 380 having a high heat conduction rate, and the heat is discharged from the backing plate 250. The heat conductive material 380 of the embodiment is the circuit board 232 and the light emitting diode 234 contacting the light source component 230. However, the heat conductive material 380 may also only contact the circuit board 232 or the light emitting diode 234. In addition, the backlight module 300 can further include a copper foil 390 disposed on the surface of the light source component 230 and contacting the heat conductive material 380. That is, the 'copper foil 390 is located at the contact surface of the light source element 230 and the heat conductive material 380' to further increase the heat conduction speed. Copper foil 390 may also be replaced by aluminum foil or other suitable material. It is also worth mentioning that the heat dissipation opening 324 of the light source carrier 320 may also be located below the circuit board 232 except for the present embodiment. 4 is a partial cross-sectional view of a backlight module according to still another embodiment of the present invention. ❹ Referring to FIG. 4, the backlight module 400 of the present embodiment is similar to the backlight module 200 of FIG. 2, and only the differences are described herein. In this embodiment, the light source carrier 420 has two heat dissipation openings 424, and the back plate 450 and the plastic frame 440 have heat dissipation openings 452 and 442 corresponding to the heat dissipation openings 424, respectively. At the same time, one of the heat dissipation openings 424 also extends above the light emitting diode 234. Since FIG. 4 is a cross-sectional view, only two heat dissipation openings 424 can be seen, and the light source carrier 420 may have more heat dissipation openings 424 in portions not shown in FIG. FIG. 5 and FIG. 6 are cross-sectional views showing a portion of a backlight module of another two embodiments of the present invention, 201019009, FIG. 24 24 twtw.doc/n. Referring to FIG. 5, the backlight module 500 of the present embodiment is similar to the backlight module 200 of FIG. 2, and only the differences are described herein. In this embodiment, the circuit board 532 of the light source component is disposed substantially parallel to the light incident surface 212 of the light guide plate 210. Referring to FIG. 6 , the difference between the backlight module 600 of the embodiment and the backlight module 500 of FIG. 5 is that the light source component is composed of two cold cathode fluorescent tubes 632 , but the cold cathode fluorescent tube 632 The quantity can be increased or decreased according to demand.
圖7為本發明一實施例之液晶顯示裂置的局部剖开 , ·· ·. - 圖。請參照圖7,本實施例之液晶顯示裝置700包括如圖： 之背光模組200以及一液晶顯示面板710，而液晶顯示面 板710配置於背光模組2〇〇之出光面216之一側。當然， 背光模組200也可以前述其他實施例之背光模組或本發明 之背光模組的其他變化實施例取代。 綜上所述，在本發明之背光模組與液晶顯示裝置中， 由於光源載具上設計有散熱開口，因此光源元件在工作時Figure 7 is a partial cross-sectional view showing a liquid crystal display split according to an embodiment of the present invention. Referring to FIG. 7, the liquid crystal display device 700 of the present embodiment includes a backlight module 200 and a liquid crystal display panel 710, and the liquid crystal display panel 710 is disposed on one side of the light-emitting surface 216 of the backlight module 2b. Of course, the backlight module 200 can also be replaced by the backlight module of the other embodiments or other modified embodiments of the backlight module of the present invention. In summary, in the backlight module and the liquid crystal display device of the present invention, since the light source carrier is provided with a heat dissipation opening, the light source component is in operation
所產生的熱1可經由散熱開口而快速散逸。此外，也可選 擇性地在光源載具之容納空財填充導熱材料還可在 板與膠㈣對應處設計散觸口。藉此，本制 、、且與液aa顯不裝置的亮度與使用壽命可獲得改善。 〜雖然本發明已哺佳實補揭露如上，然i並非用 之=所屬技術領域中具有通常知識者，在 天月之才、月砷和範圍内，當可作些 ^本發明之保護範圍當視後附之申請專利範圍^定 11 201019009』TW 24604twf.doc/n 【圖式簡單說明】… 圖1為一種習知背光模組的局部剖示圖。 圖2為本發明一實施例之背光模組的局部刮_、 圖3為本發明另一實施例之背光模組的局二。 圖4為本發明再一實施例之背光模組的局部剖^圖 圖5與圖6為本發明另外兩種實施例之背光模級 部剖示圖。 ° 圖7為本發明一實施例之液晶顯示裝置的局部剖示 ❹圖。 Π不 【主要元件符號說明】 100 :背光模組 110 :導光板 112 :入光面 120 :光源載具 122 :容納空間 130 :光源元件 φ 200、300、400、500、600 :背光模組 210:導光板 212 :入光面 214 :底面 216 :出光面 220、320、420 :光源載具 222、322 :容納空間 224、242、324、424、442、452 :散熱開口 12 201019009 …Z1TW 24604twf.doc/n 230 :光源元件 232、532 :電路板 234 :發光二極體 240、440 :膠框 250、450 :背板 260 :反射片 380 .導熱材料 390 :銅箔 • 632 :冷陰極螢光燈管 700 :液晶顯示裝置 710 ·液晶顯不面板The generated heat 1 can be quickly dissipated via the heat dissipation opening. In addition, it is also optional to fill the heat-conducting material in the light source carrier, and to design the contact port at the corresponding position of the plate and the glue (4). Thereby, the brightness and service life of the device and the liquid aa display device can be improved. ~ Although the present invention has been supplemented by the above disclosure, i is not used = the general knowledge in the technical field, in the days and months, the arsenic and the scope, when the scope of protection of the invention can be made PCT Application No. 11 201019009 TW 24604twf.doc/n [Simplified Schematic] FIG. 1 is a partial cross-sectional view of a conventional backlight module. 2 is a partial shaving of a backlight module according to an embodiment of the present invention. FIG. 3 is a second embodiment of a backlight module according to another embodiment of the present invention. 4 is a partial cross-sectional view of a backlight module according to still another embodiment of the present invention. FIG. 5 and FIG. 6 are cross-sectional views of a backlight module of another two embodiments of the present invention. Figure 7 is a partial cross-sectional view showing a liquid crystal display device in accordance with an embodiment of the present invention. ΠNot [Main component symbol description] 100: backlight module 110: light guide plate 112: light incident surface 120: light source carrier 122: accommodation space 130: light source element φ 200, 300, 400, 500, 600: backlight module 210 Light guide plate 212: light incident surface 214: bottom surface 216: light exit surface 220, 320, 420: light source carrier 222, 322: accommodation space 224, 242, 324, 424, 442, 452: heat dissipation opening 12 201019009 ... Z1TW 24604twf. Doc/n 230: light source elements 232, 532: circuit board 234: light-emitting diodes 240, 440: plastic frame 250, 450: back plate 260: reflective sheet 380. thermal conductive material 390: copper foil • 632: cold cathode fluorescent Lamp 700: liquid crystal display device 710 · liquid crystal display panel
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