1333686 P060402SBZ1TW 22585twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源組，且特別是有關於一種散 熱效率較佳的光源組及具有此光源組的背光模組 (backlight module)與液晶顯示裝置(liquid crystal display)。 【先前技術】 隨著現代視訊技術的進步，液晶顯示器已被大量地使 用於手機（mobile phone)、筆記型電腦（n〇teb〇〇k computer)、個人電腦(personai c〇mpUter，pc)及個人數位助 理(personal digital assistant)等消費性電子產品的顯示螢幕 上。然而’由於液晶顯示器之液晶顯示面板(LCDpanel)本 身並不具有發光的功能，因此需要於液晶顯示面板下方配 置背光模組以提供液晶顯示面板所需要之面光源，進而使 液晶顯示面板達到顯示的效果。目前，背光模組比較常見 的有冷陰極螢光燈管（c〇ld cathode fluorescence lamp， CCFL)月光模組以及發光二極體eniitting diode, LED) 背光模組等。 圖1A為一種習知發光二極體背光模組的局部剖面示 意圖’而圖1Β為圖ία中所繪示之光源組的立體圖。請參 閱圖1Α及圖1Β，習知發光二極體背光模組1〇〇包括一光 源級 11〇、一 導光板(light guide plate) 120 及一燈罩 130。 光源組110包括一電路板112及配置於電路板in上的多 個表面黏著型（surface mount device，SMD)發光二極體 5 1333686 P060402SBZ1TW 22585twf.doc/n 114 ’其中表面黏著型發光二極體114是配置於導光板120 • 的入光面122旁。導光板120之鄰近入光面122的部分以 及光源組110配置於燈罩130中。 在習知發光二極體背光模組1〇〇中，表面黏著型發光 二極體114除了底部與電路板n2接觸外，其餘部分均被 空氣所圍繞。由於空氣的導熱性差，因此發光二極體114 所產生的熱主要是透過配置於其底部的導腳(未繪示)傳遞 • 至電路板112中，並進一步藉由燈罩130散逸至外界。由 於大部分的熱僅能從表面黏著型發光二極體114的底部散 出，所以容易導致散熱不足而使得表面黏著型發光二極體 114之整體及接面(P-N junction)的溫度過高，這會造 成表面黏著型發光二極體114的發光效率變差及壽命減 少，並會使其所發出的光產生色偏。如此，將導致發光二 極體背光模組！00所提供的顯示光源之品質不佳。 _ 【發明内容】 本發明k供一種光源組，其散熱效率較佳。 本發明提供-種背光H其散熱效率較佳。 率較^發明提供一種液晶顯示裝置，其背光模組的散熱效 本發明提出-種光源組，包括—電路板、—導叙框、 二，元件及-導熱膠。導熱框配置於電路板上，並呈有 谷置開口。發光70件配置於容_ σ中，錢 性連接。導熱膠連接於發光元件與電路板之間以及發光元 1333686 P060402SBZ1TW 22585twf.doc/n 件與導熱框之間。 、…在本發明之一實施例中，發光元件之_表面具有—出 ，區域，而光源組可更包括—導熱蓋，覆蓋此表面，並暴 露出此出光區域。其中，導熱蓋的材質可為金屬。 本發明更提出一種光源組，包括一電路板、—導熱 框、多個發光元件及多個導熱膠。導熱框配置於電路板上， 並具有多個谷置開口。每—發光元件分別配置於其中—容 置開口中，並與電路板電性連接。每一導熱膠分別連接ς 其中一發光元件與電路板之間以及發光元件與導熱框之1333686 P060402SBZ1TW 22585twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a light source group, and more particularly to a light source group having better heat dissipation efficiency and a backlight module having the same (backlight module) and liquid crystal display (liquid crystal display). [Prior Art] With the advancement of modern video technology, liquid crystal displays have been widely used in mobile phones, notebook computers (personal c〇mpUter, pc) and personal computers (personai c〇mpUter, pc). On the display screen of consumer electronic products such as personal digital assistants. However, since the liquid crystal display panel (LCD panel) of the liquid crystal display does not have the function of emitting light, it is necessary to configure a backlight module under the liquid crystal display panel to provide a surface light source required for the liquid crystal display panel, thereby enabling the liquid crystal display panel to display. effect. At present, the backlight module is more commonly used with a cold cathode fluorescent lamp (CCFL) moonlight module and a light emitting diode eniitting diode (LED) backlight module. 1A is a partial cross-sectional view of a conventional light-emitting diode backlight module, and FIG. 1A is a perspective view of a light source group illustrated in FIG. Referring to FIG. 1A and FIG. 1A, the conventional LED backlight module 1 includes a light source stage 11A, a light guide plate 120 and a lamp cover 130. The light source group 110 includes a circuit board 112 and a plurality of surface mount device (SMD) light-emitting diodes disposed on the circuit board in. 5 1333686 P060402SBZ1TW 22585twf.doc/n 114 'the surface-adhesive light-emitting diode 114 is disposed beside the light incident surface 122 of the light guide plate 120. A portion of the light guide plate 120 adjacent to the light incident surface 122 and the light source group 110 are disposed in the globe 130. In the conventional light-emitting diode backlight module, the surface-adhesive light-emitting diode 114 is surrounded by air except that the bottom is in contact with the circuit board n2. Since the thermal conductivity of the air is poor, the heat generated by the LEDs 114 is mainly transmitted to the circuit board 112 through the guide pins (not shown) disposed at the bottom thereof, and is further dissipated to the outside by the lamp cover 130. Since most of the heat can only be dissipated from the bottom of the surface-adhesive light-emitting diode 114, it is easy to cause insufficient heat dissipation to make the temperature of the surface-adhesive LED 114 and the PN junction too high. This causes the surface-adhesive light-emitting diode 114 to have a reduced luminous efficiency and a reduced lifetime, and causes a color shift in the light emitted therefrom. In this way, it will lead to a light-emitting diode backlight module! The quality of the display light source provided by 00 is not good. SUMMARY OF THE INVENTION The present invention provides a light source group with better heat dissipation efficiency. The invention provides a backlight H which has better heat dissipation efficiency. The invention provides a liquid crystal display device, and the heat dissipation effect of the backlight module. The invention provides a light source group, including a circuit board, a guide frame, a component, and a heat conductive adhesive. The heat conducting frame is disposed on the circuit board and has a valley opening. 70 pieces of light are arranged in the capacity _ σ, and the money is connected. The thermal paste is connected between the light-emitting element and the circuit board and between the light-emitting element 1333686 P060402SBZ1TW 22585twf.doc/n and the heat-conducting frame. In one embodiment of the invention, the surface of the light-emitting element has an - out region, and the light source group may further include a heat-conducting cover covering the surface and exposing the light-emitting region. The material of the heat conductive cover may be metal. The invention further provides a light source set comprising a circuit board, a heat conducting frame, a plurality of light emitting elements and a plurality of heat conducting glues. The heat conducting frame is disposed on the circuit board and has a plurality of valley openings. Each of the light-emitting elements is disposed therein - in the receiving opening, and is electrically connected to the circuit board. Each of the thermal conductive adhesives is respectively connected to one of the light-emitting elements and the circuit board, and between the light-emitting elements and the heat-conducting frame
Fal 〇 …、 在本發明之一實施例中，每一發光元件之—表面具有 一出光區域，而光源組可更包括一導熱蓋，覆蓋這些表面， 並暴露出這些出光區域。其中，導熱蓋的材質可為金屬。 以下之實施例可適用於上述兩種光源組。 在本發明之一實施例中，導熱框的材質例如為金屬。 在本發明之一實施例t，導熱膠的材質可包括一電性 絕緣基材及一摻雜物。其中，電性絕緣基材可包括矽樹脂 (silicone)、環氧樹脂(epoxy)或其之組合，而摻雜物可包括 氣化蝴(boron nitride)、二氧化石夕(smcon dioxide)、氮化銘 (aluminum nitride)、氧化銘(aluminum oxide)或其之組合。 在本發明之一實施例中，發光元件例如為發光二極 體。 本發明再提出一種背光模組，包括上述任一種光源組 及一導光單元(light guide unit)。導光單元具有—入光面， 7 1333686 P060402SBZ1TW 22585twf.doc/n 而光源組適於提供光線至入光面。 在本發明之一實施例中，導光單元可為一導光板。 在本發明之一實施例中，導光單元可為一擴散板 (diffuser plate)。Fal 〇 ..., in an embodiment of the invention, the surface of each of the illuminating elements has a light exiting region, and the light source group further includes a heat conducting cover covering the surfaces and exposing the light exiting regions. The material of the heat conductive cover may be metal. The following embodiments are applicable to the above two light source groups. In an embodiment of the invention, the material of the heat conducting frame is, for example, metal. In an embodiment t of the present invention, the material of the thermal conductive adhesive may include an electrically insulating substrate and a dopant. Wherein, the electrically insulating substrate may comprise silicone, epoxy or a combination thereof, and the dopant may include boron nitride, smcon dioxide, nitrogen Aluminum nitride, aluminum oxide or a combination thereof. In an embodiment of the invention, the illuminating element is, for example, a light emitting diode. The invention further provides a backlight module comprising any one of the above light source groups and a light guide unit. The light guiding unit has a light-incident surface, 7 1333686 P060402SBZ1TW 22585twf.doc/n and the light source group is adapted to provide light to the light-incident surface. In an embodiment of the invention, the light guiding unit can be a light guide plate. In an embodiment of the invention, the light guiding unit may be a diffuser plate.
在本發明之一實施例中，背光模組可更包括一光學膜 片’配置於導光單元之一出光面旁。其中，光學膜片可包 括一擴散片（diffuser film)、一 增光膜（brightness enhancement film)或其之組合。 本發明又提出一種液晶顯示裝置，包括一液晶顯示面 板(LCD panel)及上述背光模組。背光模組配置於液晶顯示 面板之一側，以提供一光源至液晶顯示面板。 在本發明之光源組中，由於利用配置於發光元件周圍 的導熱框及導歸來增加發光元件所產生的熱之傳導途 徑’所以本發明之光源組的散熱效率較佳。如此In an embodiment of the invention, the backlight module may further include an optical film disposed at a light emitting surface of one of the light guiding units. Wherein, the optical film may comprise a diffuser film, a brightness enhancement film or a combination thereof. The present invention further provides a liquid crystal display device comprising a liquid crystal display panel (LCD panel) and the above backlight module. The backlight module is disposed on one side of the liquid crystal display panel to provide a light source to the liquid crystal display panel. In the light source group of the present invention, since the heat conduction path generated by the light-emitting elements is increased by the heat conduction frame and the guide disposed around the light-emitting elements, the heat radiation efficiency of the light source group of the present invention is preferable. in this way
件的發光效較可提升’且其使用壽命亦可延長，㈣所 發出的光狀㈣程度柯财效㈣。附祕 源組的背光模組可提供品質較佳的 、吏用此光 裝置能提供品質較佳的顯示晝面。"、’以使液晶顯示 為讓本發明之上述特徵和優點能 舉較佳實施例’並配合所_式，作詳細說明=下了文特 【實施方式】 V固❿在圖2B中省略導熱谬。 8 1333686 P060402SB21TW 22585twf.doc/n 請參閱圖2A與圖2B ’本實施例之光源組200包括一電略 板210、一導熱框220、一發光元件230及一導熱膠240。 導熱框220配置於電路板210上，並具有一容置開口 222。 發光元件230配置於容置開口 222中，且與電路板210電 性連接。導熱膠240連接於發光元件230與電路板210之 間以及發光元件230與導熱框220之間。The luminous efficacy of the piece can be improved and its service life can be extended. (4) The light (4) emitted by the device is (4). The backlight module of the source group can provide better quality, and the light device can provide a better quality display surface. ", 'In order to make the liquid crystal display the preferred features of the present invention and the advantages and advantages of the present invention, and in conjunction with the formula, the detailed description is given below. [Embodiment] V-solid is omitted in FIG. 2B. Thermal conductivity. 8 1333686 P060402SB21TW 22585twf.doc/n Referring to FIG. 2A and FIG. 2B, the light source unit 200 of the present embodiment includes an electrical board 210, a heat conducting frame 220, a light emitting element 230, and a thermal conductive paste 240. The heat conducting frame 220 is disposed on the circuit board 210 and has a receiving opening 222. The light emitting element 230 is disposed in the receiving opening 222 and electrically connected to the circuit board 210. The thermal paste 240 is connected between the light emitting element 230 and the circuit board 210 and between the light emitting element 230 and the heat conducting frame 220.
在本實施例中’發光元件230例如為發光二極體，其 例如是藉由兩導腳(未缯'示）而電性連接至電路板21〇。導熱 框220的材質可為具有高導熱係數的金屬，如銘、鐵、銅、 金、鎳、銀或其合金。導熱膠240可包括一電性絕緣基材 及一摻雜物。其中，電性絕緣基材的材質例如為矽樹脂、 環氧樹脂、其他適當絕緣膠材或這些材質之組合，而摻雜 物例如為氮化硼、二氧化矽、氮化鋁、氧化鋁、其他適當 摻雜物或這些材貝之組合。此外，導熱膠24〇亦可僅為電 性絕緣基材’而不摻雜摻雜物。In the present embodiment, the light-emitting element 230 is, for example, a light-emitting diode, which is electrically connected to the circuit board 21 by, for example, two lead pins (not shown). The material of the heat conducting frame 220 may be a metal having a high thermal conductivity such as ingot, iron, copper, gold, nickel, silver or an alloy thereof. The thermally conductive adhesive 240 can include an electrically insulating substrate and a dopant. The material of the electrically insulating substrate is, for example, enamel resin, epoxy resin, other suitable insulating rubber or a combination of these materials, and the dopants are, for example, boron nitride, cerium oxide, aluminum nitride, aluminum oxide, Other suitable dopants or combinations of these materials. In addition, the thermally conductive adhesive 24 can also be merely an electrically insulating substrate' without doping dopants.
、·本實施例之光驗200利用配置於發光元件230周圍 的導熱框220及導熱膠24〇來增加發光元彳23〇所產生的 熱之傳導途徑’以使熱除了從發光元件23〇的底部經由導 熱膠240及導腳而傳遞至電路板21〇之外，亦可從發光元 ^ 230的側面經由導熱膠24G轉遞至導熱框22()/所以， 本實施例之光源組200的散埶蚪* # a ^ 而可以在較低的溫度下’發光元件23。因 效率便可提升，且其使用1^，發光元件230的發光 線之色偏程度亦可被有效^；，。、可延長，而其所發出的光 9 1333686 P060402SBZ1TW 22585twf.doc/n 此外’由於導熱膠240具有彈性，因此可緩衝發光元 件230所受到的外力，以降低發光元件23〇被外力破枣的 機會’尤其當發光元件230為發光二極體時，更可因而保 護其中之發光二極體晶粒。再者，導熱膠24〇亦可用以保 護發光二極體之導腳，以避免導腳受濕氣侵蝕而造成短 路’如此便可提升光源組200的可靠度。 在本實施例中’發光元件230之一表面232具有一出 光區域A，而光源組200可更包括一導熱蓋25〇，豆覆罢 此表，232，並暴露出出光區域A。此外，導熱蓋25〇 ^ 可覆盍導熱框220的頂部。如此_來，發光元件23〇所產 生的熱還可從經由導熱蓋，而散逸至外界，而使光源组 的散熱效果更佳。此外，導熱蓋25G的材f例如是上 述可用來作為導熱框220的材質。 雖然光源組200之發光元件23〇是頂部發光型的發光 兀件’ ^而在本發明中，發光元件亦可為側邊發光型的發 光几件I請參關3,錄示本發明另—實施例之光源組 的。j面不思圖。本發明另一實施例之光源組加的發光元 =230a為側邊發光型的發光元件，其具有出光區域a,之 表面的法向量例如是平行於電路板210。導熱蓋250a 則覆蓋^ 232a，且暴露出出规域A，。 值得主思的是，本發明之光源組中，亦可多個發光元 件配，於同—電路板上，而這些發光元件可沿-直線排 列主面陣列排列或以其他適當方式排列。以下將說明具 有多個發光元件之光馳的實施例。 1333686 P060402SBZ1T W 22585twf.doc/n 圖4A為本發明又一實施例之光源組的剖面示意圖。 圖4B為圖4A之光源組的爆炸圖，而在圖4B中省略導熱 膠。請參閱圖4A與圖4B，光源組200b之導熱框220b具 有多個容置開口 222。此外，光源組200b具有多個發光元 件230與多個導熱膠240。每一發光元件230分別配置於 其中一容置開口 222中，並與電路板210電性連接。每一 導熱膠240分別連接於其中一發光元件230與電路板210 之間以及此發光元件230與導熱框240之間。再者，在本 實施例中，可利用一導熱蓋250b覆蓋這些發光元件23〇 的表面232’而此導熱蓋250b具有多個與容置開口 222對 應之開口 252 ’以暴露出這些發光元件230的出光區域a。 上述這些發光元件230可沿一直線排列、呈面陣列排 列或以其他適當方式排列。圖5A與圖53繪示本發明另二 實施例之光源組的導熱框與導熱蓋。請先參閱圖5A，當發 光元件沿一直線排列時，導熱框22〇b，具有多個沿一直線 排列的容置開口 222,而導熱蓋250b，亦具有多個^ 一直線 =列的開口 252。請參關5B，當發光元件呈面陣列排列 吩導熱框220b具有多個呈面陣列排列的容置開口 ， 而V熱盖250b”亦具有多個呈面陣列排列的開口 μ】。 雖虹述具衫個發光元件的統組，其發光元件為 、邛發光型的發光元件，但任何所屬技術 知識者在參照上文後當可推知，光㈣之：具有通吊 可為側邊發光型的發光元件，在二=發先元件亦 圖6為本發明-實施例之背光模組的局部剖面示意 1333686 P060402SBZ1TW 22585twf.doc/n 圖。請參閱圖6，本實施例之背光模組300包括一導光單 元310及一光源組320。其中，導光單元310例如為一導 光板，其具有一出光面312、一背面314及一連接出光面 312與背面314的一入光面316,而光源組320適於提供光 線至入光面316。此光線由入光面316進入導光單元310 後，會被引導至出光面312，並由出光面312出射，以形 成一面光源。The photodetector 200 of the present embodiment uses the heat conducting frame 220 and the thermal conductive paste 24 配置 disposed around the light emitting element 230 to increase the heat conduction path generated by the illuminating element 彳 23 以 so that the heat is removed from the illuminating element 23 The bottom portion is transferred to the circuit board 21〇 via the thermal conductive paste 240 and the lead pins, and can also be transferred from the side of the light emitting element 230 to the heat conducting frame 22 via the thermal conductive adhesive 24G. Therefore, the light source group 200 of the embodiment is Dimming * # a ^ can be 'lighting element 23' at a lower temperature. Since the efficiency can be improved, and the use thereof is 1^, the degree of color shift of the light-emitting line of the light-emitting element 230 can also be effective. It can be extended, and the light emitted by it is 9 1333686 P060402SBZ1TW 22585twf.doc/n. In addition, since the thermal conductive adhesive 240 has elasticity, the external force received by the light-emitting element 230 can be buffered to reduce the chance of the light-emitting element 23 being broken by external force. In particular, when the light-emitting element 230 is a light-emitting diode, the light-emitting diode crystal grains therein can be further protected. Furthermore, the thermal conductive adhesive 24 〇 can also be used to protect the guide pins of the light-emitting diodes, so as to avoid the short-circuit caused by the erosion of the guide legs. Thus, the reliability of the light source group 200 can be improved. In the present embodiment, one surface 232 of the light-emitting element 230 has a light-emitting area A, and the light source set 200 may further include a heat-conducting cover 25, which is covered by the watch, 232, and exposes the light-emitting area A. In addition, the heat conductive cover 25 〇 ^ can cover the top of the heat conductive frame 220. In this way, the heat generated by the light-emitting element 23 can be dissipated to the outside through the heat-conducting cover, and the heat dissipation effect of the light source group is further improved. Further, the material f of the heat transfer cover 25G is, for example, the material which can be used as the heat transfer frame 220 as described above. Although the light-emitting element 23 of the light source group 200 is a top-emitting type of light-emitting element '^ in the present invention, the light-emitting element may also be a side-emitting type of light-emitting part I, please refer to 3, and the present invention is recorded. The light source group of the embodiment. j face does not think. In the light source group of the other embodiment of the present invention, the light-emitting element = 230a is a side-emitting type light-emitting element having a light-emitting region a, and the normal vector of the surface is, for example, parallel to the circuit board 210. The heat conductive cover 250a covers the ^ 232a and exposes the area A. It is worth noting that in the light source group of the present invention, a plurality of light-emitting elements may be disposed on the same circuit board, and the light-emitting elements may be arranged along the line-arranged main surface array or in other suitable manners. An embodiment having a plurality of light-emitting elements will be described below. 1333686 P060402SBZ1T W 22585twf.doc/n FIG. 4A is a schematic cross-sectional view of a light source group according to still another embodiment of the present invention. Fig. 4B is an exploded view of the light source group of Fig. 4A, and the thermal conductive adhesive is omitted in Fig. 4B. Referring to FIG. 4A and FIG. 4B, the heat conducting frame 220b of the light source group 200b has a plurality of receiving openings 222. Further, the light source group 200b has a plurality of light emitting elements 230 and a plurality of thermal conductive pastes 240. Each of the light-emitting elements 230 is disposed in one of the receiving openings 222 and electrically connected to the circuit board 210. Each of the heat conductive adhesives 240 is connected between one of the light emitting elements 230 and the circuit board 210 and between the light emitting element 230 and the heat conducting frame 240. Furthermore, in the embodiment, the surface 232 ′ of the light-emitting elements 23 覆盖 can be covered by a heat-conducting cover 250 b. The heat-conducting cover 250 b has a plurality of openings 252 ′ corresponding to the accommodating openings 222 to expose the light-emitting elements 230 . Light exit area a. The light-emitting elements 230 described above may be arranged in a line, arranged in a planar array, or arranged in other suitable manners. 5A and 53 illustrate a heat conducting frame and a heat conducting cover of a light source group according to another embodiment of the present invention. Referring to FIG. 5A, when the light-emitting elements are arranged along a straight line, the heat-conducting frame 22b has a plurality of accommodating openings 222 arranged in a line, and the heat-conducting cover 250b also has a plurality of openings 252. Referring to FIG. 5B, when the light-emitting elements are arranged in a surface array, the heat-conducting frame 220b has a plurality of receiving openings arranged in a planar array, and the V-hot cover 250b" also has a plurality of openings arranged in a surface array. A group of light-emitting elements having a light-emitting element is a light-emitting element of a light-emitting type, but any person skilled in the art can refer to the above, and it can be inferred that the light (4) has a side-lighting type. FIG. 6 is a partial cross-sectional view of a backlight module of the present invention. FIG. 6 is a schematic diagram of a backlight module 300 of the present embodiment. The light guiding unit 310 and a light source group 320. The light guiding unit 310 is, for example, a light guiding plate, and has a light emitting surface 312, a back surface 314, and a light incident surface 316 connecting the light emitting surface 312 and the back surface 314, and the light source. The group 320 is adapted to provide light to the light incident surface 316. After entering the light guiding unit 310, the light is guided to the light emitting surface 312 and emitted from the light emitting surface 312 to form a light source.
上述之光源組320例如由多個圖3之光源組200a沿 一直線排列而成。此外，這些光源組2〇〇a可共用一塊電路 板，導熱框220a可整合為一體，而導熱蓋25〇a亦可整合 為一體。值得注意的是，應用於背光模組3⑻中的光源組 320亦可以是上述其他實施例之光源組。 "月光模組300可更包括一光 —14〜y·*口 /匕于狀幻 ，酉己置The above-described light source group 320 is formed, for example, by a plurality of light source groups 200a of Fig. 3 arranged in a line. In addition, the light source groups 2a can share a circuit board, the heat conductive frame 220a can be integrated, and the heat conductive cover 25a can be integrated. It should be noted that the light source group 320 applied to the backlight module 3 (8) may also be the light source group of the other embodiments described above. "Moonlight module 300 can further include a light - 14 ~ y * mouth / 匕 状 状 酉 酉
^導光單7L310之出光面312上方。光學膜片33〇例如為 一擴散片、一增光膜、其他適當之光學膜片或這些膜^ 組合。再者’背光模組3〇〇可更包括一背框％及 ==背框3則以承載導光單元與光源組32〇二 月 =50用以固定導光單元31〇與光學膜片 出出光面312。 I泰路 兩奉發明另 請參閱圖7,本實施例之背光模組包意圖。 及一光源組畑。其中，光源組例= 早元楊 (請參閱圖4Α)。在本實施财，導光單以 散板’其具有相對之-入光面412及—出光面I j 12 1333686 P060402SBZ1TW 22585twf.doc/n 源組420適於提供光線至入光面412。光線由入光面412 . 進入導光單元410後會均勻地擴散開來，並從出光面414 出射，以形成一面光源。 此外’在本實施例之背光模組400中’可在出光面414 上方配置如上述背光模組300(請參閱圖6)的光學膜片 330。再者，背光模組4〇〇可更包括一背框43〇以及—前樞 440。背框430用以承載導光單元410與光源組42〇，而前 φ 框44〇用以固定導光單元410與光學膜片330，並暴露出 出光面414。值得注意的是，應用於背光模組4〇〇中的光 源組420亦可以是上述其他實施例之光源組。 由於为光模組300及400的光源組320及420具有車 佳的散熱效率，所以發光效率較高且其所發出的光^之^ 偏程度較小，因此背光模組300及4〇〇可提供品質較 面光源。 ' 圖8為本發明一實施例之液晶顯示裝置的爆炸圖。請 參閱@ 8，本實施例之液晶顯示裝置，包括—液晶顯^ 面板510及一背光模組520，其中背光模.組520例如為上 述任貝知例之背光模組。背光模組520配置於液晶顯示 面板510之-側’以提供面光源至液晶顯示面板51〇。由 於背光模組520能提供品質較佳的面光源，所以本實施例 之液晶顯示裝置500的顯示品質較佳。 一一絲上所述’在本發明之光源組中，由於利用配置於發 光几件周圍的導熱框及導熱夥來增加發光元件所產生的軌 之傳導途徑，所以本發明之光源組的散熱效率較佳。如此， 13 1333686 P060402SBZ1TW 22585twf.doc/n 發光元件的發光效率便可提升，且其使用壽命亦可 而其所發㈣光叙色偏程度亦可被有效抑制。因此^ 用此光源_背光馳可提供品質較佳的面統 ^ 發明之m裝置能提供品質較佳的顯示晝面。， 導熱膠亦可賴發光元件，崎低其被外力破壞备，’ 並可避免其用以電性連接電路板的導腳遭濕氣所侵餘 此，本發明之光源組的可靠度較高。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在^ 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定 為準。 百 【圖式簡單說明】 圖1A為一種習知發光二極體背光模組的局部剖面 意圖。 • 圖1B為圖1A所繪示之光源組的立體圖。 圖2A為本發明一實施例之光源組的剖面示意圖。 圖2B為圖2A之光源組的爆炸圖。 圖3為本發明另—實施例之光源組的剖面示意圖。 圖4A為本發明又—實施例之光源組的剖面示意圖。 圖4B為圖4A之光源組的爆炸圖。 圖5A與圖5B繪示本發明另二實施例之光源組的導 框與導熱蓋。 1333686 P060402SBZ1TW 22585twf.doc/n 圖6為本發明一實施例之背光模組的局部剖面示意 圖。 圖7為本發明另一實施例之背光模組的剖面示意圖。 圖8為本發明一實施例之液晶顯示裝置的爆炸圖。 【主要元件符號說明】 100 :發光二極體背光模組 110、200、200a、200b、320、420 :光源組 112、210 :電路板 114 :表面黏著型發光二極體 120 :導光板 122、316、412 :入光面 130 :燈罩 220、220a、220b、220b，、220b” ：導熱框 222 :容置開口 230、230a :發光元件 232、232a :表面 240 :導熱膠 250、250a、250b、250b，、250b” ：導熱蓋 252 :開口 300、400、520 :背光模組 310、410 :導光單元 312、414 :出光面 314 :背面 15 1333686 P060402SBZ1TW 22585twf doc/n^ Above the light exit surface 312 of the light guide sheet 7L310. The optical film 33 is, for example, a diffusion sheet, a brightness enhancement film, other suitable optical film or a combination of these films. Furthermore, the backlight module 3 can further include a back frame % and == the back frame 3 to carry the light guiding unit and the light source group 32 〇 February = 50 for fixing the light guiding unit 31 and the optical film. Light emitting surface 312. I Tai Lu, two inventors, please refer to FIG. 7, the backlight module package of this embodiment is intended. And a light source group 畑. Among them, the light source group example = early Yuan Yang (see Figure 4Α). In the present implementation, the light guide sheet has a diffusing plate ‘having a relative-light-in surface 412 and a light-emitting surface I j 12 1333686 P060402SBZ1 TW 22585 twf.doc/n The source group 420 is adapted to provide light to the light-incident surface 412. The light passes through the light incident surface 412. After entering the light guiding unit 410, it spreads evenly and exits from the light emitting surface 414 to form a light source. In the backlight module 400 of the present embodiment, an optical film 330 such as the backlight module 300 (see FIG. 6) can be disposed above the light-emitting surface 414. Furthermore, the backlight module 4 can further include a back frame 43A and a front pivot 440. The back frame 430 is configured to carry the light guiding unit 410 and the light source group 42A, and the front φ frame 44 is used to fix the light guiding unit 410 and the optical film 330, and expose the light surface 414. It should be noted that the light source group 420 applied to the backlight module 4 can also be the light source group of the other embodiments described above. Since the light source groups 320 and 420 of the optical modules 300 and 400 have the heat dissipation efficiency of the vehicle, the luminous efficiency is high and the degree of light emitted by the light modules is small, so the backlight modules 300 and 4 can be Provide quality light source. Figure 8 is an exploded view of a liquid crystal display device according to an embodiment of the present invention. The liquid crystal display device of the present embodiment includes a liquid crystal display panel 510 and a backlight module 520. The backlight module group 520 is, for example, a backlight module as described above. The backlight module 520 is disposed on the side of the liquid crystal display panel 510 to provide a surface light source to the liquid crystal display panel 51A. Since the backlight module 520 can provide a surface light source of better quality, the display quality of the liquid crystal display device 500 of the present embodiment is better. In the light source group of the present invention, the heat dissipation efficiency of the light source group of the present invention is increased by utilizing a heat conduction frame and a heat conduction member disposed around the light-emitting components to increase the conduction path of the rails generated by the light-emitting elements. Preferably. Thus, 13 1333686 P060402SBZ1TW 22585twf.doc/n The luminous efficiency of the light-emitting element can be improved, and the service life thereof can also be effectively suppressed by the (4) light color deviation degree. Therefore, using this light source _ backlight can provide a better quality surface ^ The invention of the m device can provide a better quality display surface. The thermal conductive adhesive can also rely on the light-emitting component, and it can be destroyed by external force, and can avoid the use of the guide pin for electrically connecting the circuit board to be invaded by moisture, and the reliability of the light source group of the present invention is high. . Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make a few changes and refinements within the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a partial cross-sectional view of a conventional light-emitting diode backlight module. • FIG. 1B is a perspective view of the light source group illustrated in FIG. 1A. 2A is a schematic cross-sectional view of a light source group according to an embodiment of the present invention. Figure 2B is an exploded view of the light source set of Figure 2A. 3 is a cross-sectional view showing a light source group according to another embodiment of the present invention. 4A is a cross-sectional view showing a light source group according to still another embodiment of the present invention. Figure 4B is an exploded view of the light source set of Figure 4A. 5A and 5B illustrate a guide frame and a heat conductive cover of a light source unit according to another embodiment of the present invention. 1333686 P060402SBZ1TW 22585twf.doc/n FIG. 6 is a partial cross-sectional schematic view of a backlight module according to an embodiment of the present invention. FIG. 7 is a cross-sectional view of a backlight module according to another embodiment of the present invention. Fig. 8 is an exploded view of a liquid crystal display device according to an embodiment of the present invention. [Main component symbol description] 100: Light-emitting diode backlight module 110, 200, 200a, 200b, 320, 420: light source group 112, 210: circuit board 114: surface-adhesive light-emitting diode 120: light guide plate 122, 316, 412: light-incident surface 130: lampshade 220, 220a, 220b, 220b, 220b": heat-conducting frame 222: accommodation opening 230, 230a: light-emitting elements 232, 232a: surface 240: thermal paste 250, 250a, 250b, 250b, 250b": heat-conducting cover 252: opening 300, 400, 520: backlight module 310, 410: light-guiding unit 312, 414: light-emitting surface 314: back surface 15 1333686 P060402SBZ1TW 22585twf doc/n
330 :光學膜片 340、430 :背框 350、440 :前框 500 :液晶顯示裝置 510 ·液晶顯不面板 A、A’ ：出光區域 16330: Optical film 340, 430: Back frame 350, 440: Front frame 500: Liquid crystal display device 510 • Liquid crystal display panel A, A': Light-emitting area 16