CN202209603U - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN202209603U CN202209603U CN2011203659737U CN201120365973U CN202209603U CN 202209603 U CN202209603 U CN 202209603U CN 2011203659737 U CN2011203659737 U CN 2011203659737U CN 201120365973 U CN201120365973 U CN 201120365973U CN 202209603 U CN202209603 U CN 202209603U
- Authority
- CN
- China
- Prior art keywords
- heat
- backlight module
- radiating substrate
- light emitting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000013459 approach Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a backlight module. The backlight module comprises a heat dissipation substrate, a light emitting source and a heat conduction layer. The heat dissipation substrate has an L-shaped structure, wherein the heat dissipation substrate has a bottom and a side. The light emitting source is arranged on the side part of the heat dissipation substrate. The light source comprises a circuit board and a light emitting diode chip, the light emitting diode chip is arranged on the circuit board, and the heat conduction layer is arranged between the circuit board of the light source and the side part of the heat dissipation substrate, so that heat energy generated by the light emitting diode chip can be discharged to the heat dissipation substrate through the heat conduction layer.
Description
Technical field
The utility model relates to a kind of backlight module, and particularly relevant for a kind of backlight module with good radiating effect.
Background technology
Because liquid crystal indicator has characteristics such as frivolous, low power consumption and low radiation, therefore be widely used in the consumption electronic products such as display, LCD TV, mobile phone and notebook.Yet liquid crystal itself can be not luminous, so general liquid crystal indicator all needs backlight module to come for it light source to be provided.The light emitting source of backlight module mainly adopts cold cathode ray tube or light emitting diode; Characteristic such as light-emitting diodes pipe high color saturation, not mercurous, high life wherein; So light emitting diode replaces cold cathode ray tube gradually, and extensively is used in the backlight module.
When the user uses this liquid crystal indicator, after light emitting diode receives electric energy, can convert the part electric energy into luminous energy and luminous, all the other most of electric energy all can change the heat energy loss into and go out.So electric energy that light emitting diode received; Nearly all be converted into heat energy dissipation; Will make and cause accumulation of heat liquid crystal indicator integrated circuit temperature to rise, and then it electrically is affected; Also can shorten the service life of light emitting diode, and the heat dissipation problem that therefore how to solve light emitting diode just becomes an important problem.
Yet, when existing making is the backlight module of light source with the light emitting diode, only be to utilize the circuit board of bottom to dispel the heat easily, though this way is easy and directly perceived, make heat effectively to discharge.
Therefore, how to develop a kind of backlight module that improves the known technology disappearance, real in pressing for the problem of research and development at present.
The utility model content
The one side of the utility model is to be provided in a kind of backlight module with good radiating effect, influences service life and influences problems such as electrical because of the integrated circuit temperature increase avoiding.
According to an embodiment of the utility model, this backlight module comprises heat-radiating substrate, light emitting source and heat-conducting layer.Heat-radiating substrate has L type structure, and wherein heat-radiating substrate has bottom and sidepiece.Light emitting source is to be arranged on the sidepiece of heat-radiating substrate, and wherein light emitting source comprises circuit board and light-emitting diode chip for backlight unit, and light-emitting diode chip for backlight unit is to be arranged on the circuit board.Heat-conducting layer is to be arranged between the sidepiece of circuit board and heat-radiating substrate of light emitting source, so that the heat energy that light-emitting diode chip for backlight unit produced is expelled to heat-radiating substrate via heat-conducting layer.
In an embodiment of the utility model, described backlight module also comprises a base plate, is fixedly arranged on this heat-radiating substrate, to prevent this heat-radiating substrate distortion.
In an embodiment of the utility model, this bottom of this heat-radiating substrate has at least one groove, and this base plate has at least one projection, and this at least one projection is and this at least one groove tight fit, so that this base plate is embedded on this heat-radiating substrate.
In an embodiment of the utility model, described backlight module also comprises: a LGP is arranged on this base plate, the light that this light emitting source was sent is guided to an exiting surface of this backlight module; And a diffuser plate, be arranged between this exiting surface of this LGP and this backlight module, to spread the light that this light emitting source is sent.
In an embodiment of the utility model, the resistance of deformation of this base plate is greater than the resistance of deformation of this heat-radiating substrate.
In an embodiment of the utility model, the material of this base plate is a metal.
In an embodiment of the utility model, the material of this heat-radiating substrate is an aluminium.
Comprehensive the above, the backlight module of the utility model embodiment is to utilize integrated heat-radiating substrate to strengthen the radiating effect of backlight module.
Description of drawings
Fig. 1 is the sectional structure sketch map that illustrates according to the backlight module of the utility model embodiment;
Fig. 2 A is the schematic flow sheet that illustrates according to the manufacturing approach of the backlight module of the utility model embodiment;
Fig. 2 B is the plan structure sketch map that illustrates according to the heat-radiating substrate of the backlight module of the utility model embodiment;
Fig. 2 C and Fig. 2 D are the side-looking structural representations that illustrates according to the heat-radiating substrate of the backlight module of the utility model embodiment;
Fig. 2 E is the side-looking structural representation that illustrates according to metal substrate, light emitting source and the heat-conducting layer of the backlight module of the utility model embodiment.
[primary clustering symbol description]
100: backlight module 200: heat-radiating substrate
201: bottom 201a: groove
202: sidepiece 203: base plate
203a: projection 300: light emitting source
301: light-emitting diode chip for backlight unit 302: circuit board
303: anti-welding enamelled coating 400: heat-conducting layer
Heat-conducting glue 402 in 401: the first: the heat conduction copper foil layer
Heat-conducting glue 500 in 403: the second: LGP
501: reflector plate 502: optical diaphragm group
600: housing 700: the manufacturing approach of backlight module
710: substrate provides step 720: punch steps
730: light emitting source provides step 740: engagement step
S: preset broken line
The specific embodiment
Please with reference to Fig. 1, it is the sectional structure sketch map that illustrates according to the backlight module of the utility model embodiment.The backlight module 100 of the utility model embodiment comprises heat-radiating substrate 200, light emitting source 300, heat-conducting layer 400, LGP 500, reflector plate 501 and optical diaphragm group 502, and is placed in the housing 600.In the present embodiment, housing 600 is high temperature resistant material.Heat-radiating substrate 200 has L type structure, and heat-radiating substrate 200 has bottom 201 and sidepiece 202.In the present embodiment, this heat-radiating substrate 200 can be but not be limited to the aluminum metallic plate.In the present embodiment, also can on the bottom 201 of heat-radiating substrate 200, base plate 203 be set.The resistance of deformation of this base plate 203 (stiffness) is the resistance of deformation greater than heat-radiating substrate 200, to prevent heat-radiating substrate 200 distortion.Projection 203a is set on the base plate 203, and groove 201a is set on the heat-radiating substrate 200.Projection 203a is and groove 201a tight fit that the mutual fixing that so just can see through projection 203a and groove 201a makes base plate 203 be arranged at securely on the bottom 201 of heat-radiating substrate 200.
LGP 500 is arranged on the base plate 203, and LGP 500 belows are provided with a reflector plate 501, and diffuser plate 502 is arranged at 503 of the exiting surfaces of LGP 500 and backlight module 100.Light-emitting diode chip for backlight unit 301 is adjacent setting with LGP 500; So it is luminous after light-emitting diode chip for backlight unit 301 receives electric energy; Then light can import LGP 500 again via after reflector plate 501 reflection through optical diaphragm group 502 (for example diffuser plate) with diffusion light, so can make backlight module 100 start in response to the requirement of display (not illustrating).And the heat energy that when light-emitting diode chip for backlight unit 301 is luminous, is produced; Can see through heat-conducting layer 400 with thermal energy transfer to heat-radiating substrate 200; See through in the air of heat-radiating substrate 200 with the heat energy loss again; So can make backlight module 100 in when work, can not receive temperature increase and influence electrically and the integrated circuit life-span.
In addition, what deserves to be mentioned is that the bottom of housing 600 is for having engraved structure, it can make heat-radiating substrate 200 directly contact with extraneous air, to strengthen the radiating effect of backlight module 100.
Please with reference to Fig. 2 A; And cooperation Fig. 2 B, Fig. 2 C and Fig. 2 D; Fig. 2 A is the schematic flow sheet that illustrates according to the manufacturing approach 700 of the backlight module of the utility model embodiment; Fig. 2 B is the plan structure sketch map that illustrates according to the heat-radiating substrate 200 of the backlight module 100 of the utility model embodiment; Fig. 2 C and Fig. 2 D are the side-looking structural representations that illustrates according to the heat-radiating substrate 200 of the backlight module 100 of the utility model embodiment, and Fig. 2 E is the side-looking structural representation that illustrates according to metal substrate, light emitting source and the heat-conducting layer of the backlight module of the utility model embodiment.
In the manufacturing approach 700 of backlight module, at first carrying out substrate provides step 710, so that metal substrate 200 to be provided, shown in Fig. 2 B and Fig. 2 C.In present embodiment, this metal substrate 200 can be but not be limited to the aluminum metallic plate.Then, carry out punch steps 720, metal substrate 200 is struck out the L type according to preset broken line S.Seeing through punch steps 720 gets so that metal substrate 200 has bottom 201 and sidepiece 202.After the process substrate provides step 710 and punch steps 720, can obtain integrated L type metal substrate 200, it has the advantage of high mechanism intensity and high radiating effect.
Then, carrying out light emitting source provides step 730, so that light emitting source 300 to be provided.In this embodiment, light emitting source 300 comprises light-emitting diode chip for backlight unit 301, circuit board 302.In addition, also can comprise the anti-welding enamelled coating 303 that is arranged between light-emitting diode chip for backlight unit 301 and the circuit board 302.Then, carry out engagement step 740, to utilize heat-conducting layer 400 light emitting source 300 is arranged on the sidepiece 202 of metal substrate 200, so that the heat energy that light-emitting diode chip for backlight unit 301 is produced is expelled to metal substrate 200 via heat-conducting layer 400.In the present embodiment, heat-conducting layer 400 can comprise first heat-conducting glue 401, heat conduction copper foil layer 402 and second heat-conducting glue 403.Heat-conducting layer 400 can be pasted on the heat conduction Copper Foil 202 of the sidepieces of circuit board 302 and metal substrate 200, reaches better heat radiating effect whereby.In other embodiment of the utility model; Can after engagement step 740, reinforce step again, so that base plate (not illustrating) to be set on the bottom 201 of metal substrate 200; The resistance of deformation of this base plate is the resistance of deformation greater than heat-radiating substrate 200, so can prevent metal substrate 200 distortion.
Comprehensive the above, the backlight module of the utility model embodiment is to utilize integrated heat-radiating substrate to strengthen the radiating effect of backlight module.This heat-radiating substrate has large contact surface and amasss to contact with extraneous air, so can reach better heat radiating effect, and avoid influencing service life and influencing problems such as electrical because of the integrated circuit temperature increase.Secondly; The manufacturing approach of the backlight module of the utility model embodiment is to see through the structure of processing L type of punch forming technology with heat-radiating substrate; So can make the light-emitting diodes that is installed on the heat-radiating substrate be in control preferable radiating effect, and mechanism's intensity of substrate also can be strengthened.
Though the utility model discloses as above with several embodiment; Right its is not in order to limit the utility model; Any in the technical field under the utility model have a common knowledge the knowledgeable; In spirit that does not break away from the utility model and scope, when can doing various changes and retouching, so the protection domain of the utility model is as the criterion when looking the scope that appending claims defines.
Claims (7)
1. a backlight module is characterized in that, comprises:
One heat-radiating substrate has L type structure, and wherein this heat-radiating substrate has a bottom and a sidepiece;
One light emitting source is arranged on this sidepiece of this heat-radiating substrate, and wherein this light emitting source comprises:
One circuit board; And
One light-emitting diode chip for backlight unit is arranged on this circuit board; And
One heat-conducting layer is arranged between this sidepiece of this circuit board and this heat-radiating substrate of this light emitting source, so that the heat energy that this light-emitting diode chip for backlight unit produced is expelled to this heat-radiating substrate via this heat-conducting layer.
2. backlight module according to claim 1 is characterized in that, also comprises a base plate, is fixedly arranged on this heat-radiating substrate, to prevent this heat-radiating substrate distortion.
3. backlight module according to claim 2; It is characterized in that this bottom of this heat-radiating substrate has at least one groove, and this base plate has at least one projection; This at least one projection is and this at least one groove tight fit, so that this base plate is embedded on this heat-radiating substrate.
4. backlight module according to claim 2 is characterized in that, also comprises:
One LGP is arranged on this base plate, the light that this light emitting source was sent is guided to an exiting surface of this backlight module; And
One diffuser plate is arranged between this exiting surface of this LGP and this backlight module, to spread the light that this light emitting source is sent.
5. backlight module according to claim 2 is characterized in that the resistance of deformation of this base plate is greater than the resistance of deformation of this heat-radiating substrate.
6. backlight module according to claim 2 is characterized in that, the material of this base plate is a metal.
7. backlight module according to claim 1 is characterized in that, the material of this heat-radiating substrate is an aluminium.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100130729 | 2011-08-26 | ||
| TW100130729A TWI485481B (en) | 2011-08-26 | 2011-08-26 | Backlight module and fabrication method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202209603U true CN202209603U (en) | 2012-05-02 |
Family
ID=45989150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203659737U Expired - Lifetime CN202209603U (en) | 2011-08-26 | 2011-09-23 | Backlight module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202209603U (en) |
| TW (1) | TWI485481B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865503A (en) * | 2012-08-28 | 2013-01-09 | 深圳市华星光电技术有限公司 | Backlight module and radiating device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI349141B (en) * | 2007-02-27 | 2011-09-21 | Au Optronics Corp | An edge-type backlight module comprises |
| TWI368795B (en) * | 2008-07-09 | 2012-07-21 | Chimei Innolux Corp | Side-edge type backlight module, application and fabrication method thereof |
| KR101277865B1 (en) * | 2009-12-10 | 2013-06-21 | 엘지디스플레이 주식회사 | Liquid Crystal Display device |
| TWI400532B (en) * | 2010-01-29 | 2013-07-01 | Radiant Opto Electronics Corp | Backlight module and liquid crystal display device including the same |
| TWM391271U (en) * | 2010-05-10 | 2010-10-21 | Asda Displays Co Ltd | Display panel module with high heat dissipation efficiency |
-
2011
- 2011-08-26 TW TW100130729A patent/TWI485481B/en not_active IP Right Cessation
- 2011-09-23 CN CN2011203659737U patent/CN202209603U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865503A (en) * | 2012-08-28 | 2013-01-09 | 深圳市华星光电技术有限公司 | Backlight module and radiating device |
| CN102865503B (en) * | 2012-08-28 | 2015-09-30 | 深圳市华星光电技术有限公司 | Backlight module and heat abstractor |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI485481B (en) | 2015-05-21 |
| TW201310129A (en) | 2013-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101500373B (en) | Printed circuit board, backlight unit and liquid crystal display device | |
| KR101546741B1 (en) | Light emitting module and display apparatus having the same | |
| CN100580528C (en) | LCD and back light module thereof | |
| CN203273545U (en) | Backlight module | |
| CN102798044A (en) | Edge-lighting backlight module | |
| CN102900989A (en) | LED (Light Emitting Diode) lamp strip and backlight module employing same | |
| CN201119120Y (en) | Improved printed circuit board for LED | |
| JP4587720B2 (en) | Light source device and liquid crystal display device having the same | |
| US20140119000A1 (en) | LED Light Bar and Backlight Module Using the LED Light Bar | |
| CN202209603U (en) | Backlight module | |
| CN101303474B (en) | Backlight module, LCD device and method for manufacturing LCD device | |
| CN202056686U (en) | Backlight module and liquid crystal module | |
| CN202103046U (en) | Light emitting diode radiating structure and backlight module | |
| CN101975376B (en) | Luminous source heat-dissipation structure of backlight module | |
| CN201401698Y (en) | Backlight module | |
| CN106847080A (en) | A kind of display screen module and mobile terminal | |
| CN101446701A (en) | Liquid crystal display device | |
| CN107290898B (en) | Backlight assembly | |
| CN102494259A (en) | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device | |
| CN208983107U (en) | Down straight aphototropism mode set, display and illuminator | |
| CN102003685A (en) | Radiating structure for light-emitting source | |
| CN208025194U (en) | A kind of backlight module | |
| CN206671726U (en) | Backlight module and display device | |
| CN104235662A (en) | Light strip, backlight source and display device | |
| CN100399161C (en) | Backlight module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120502 |
|
| CX01 | Expiry of patent term |