WO2021056728A1 - 真空蒸镀装置 - Google Patents

真空蒸镀装置 Download PDF

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Publication number
WO2021056728A1
WO2021056728A1 PCT/CN2019/117286 CN2019117286W WO2021056728A1 WO 2021056728 A1 WO2021056728 A1 WO 2021056728A1 CN 2019117286 W CN2019117286 W CN 2019117286W WO 2021056728 A1 WO2021056728 A1 WO 2021056728A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporation source
recovery
evaporation
source baffle
residual material
Prior art date
Application number
PCT/CN2019/117286
Other languages
English (en)
French (fr)
Inventor
万之君
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/617,633 priority Critical patent/US20210332472A1/en
Publication of WO2021056728A1 publication Critical patent/WO2021056728A1/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

Definitions

  • the invention relates to the technical field of vapor deposition, in particular to a vacuum vapor deposition device.
  • the vacuum thermal evaporation process is widely used in the preparation of organic light-emitting diodes (OLED), organic photovoltaic cells (OPV), electrochromic devices (ECD) and other products.
  • OLED organic light-emitting diodes
  • OCV organic photovoltaic cells
  • ECD electrochromic devices
  • the organic film layer or some metal layers are generally produced by an evaporation process.
  • the invention provides a vacuum evaporation device, which can reduce the opening time, reduce particle generation, and avoid polluting the cavity, so as to solve the problem that the existing vacuum evaporation device has slow recovery speed and long cavity opening time, which causes the increase in the number of particles and the cavity suffers.
  • Technical issues such as pollution.
  • the invention provides a vacuum evaporation device, which comprises an evaporation cavity formed by a top plate, a bottom plate and a plurality of side plates connected and sealed with each other, and an evaporation source and a material corresponding to the evaporation source are arranged in the evaporation cavity.
  • a recovery device, the material recovery device includes:
  • the evaporation source baffle is provided with a heating resistor ring inside the evaporation source baffle, which is used to heat the evaporation source baffle so that when residual material adheres to the surface of the evaporation source baffle near the bottom plate.
  • the residual material is separated from the evaporation source baffle;
  • a recycling structure the recycling structure is connected with a moving structure, and the moving structure is used to move the recycling structure so that the recycling structure can receive the residual material separated from the evaporation source baffle.
  • the recycling structure includes:
  • a recovery container the recovery container is provided with a containing groove, and the containing groove is used to collect the residual material that has escaped from the evaporation source baffle;
  • the cooling plate is arranged at the bottom of the containing tank, and is used to cool the separated residual material so that the residual material becomes solid to be attached in the containing tank.
  • the vacuum evaporation device further includes a sensor, the sensor includes a transmitter and a receiver, both the transmitter and the receiver are provided with indicator lights, and the indicator lights display red or green;
  • the transmitter is arranged on the evaporation source baffle;
  • the receiver is arranged outside the recovery container;
  • the recovery structure and the evaporation source baffle are aligned through the transmitter and the receiver.
  • a rotating shaft is connected to the end of the evaporation source baffle far away from the evaporation source, and the emitter is close to the connection between the evaporation source baffle and the rotating shaft;
  • the edge of the recovery container extends in a direction close to the rotating shaft to form a bearing part, and the receiver is located on the bearing part;
  • the rotating shaft rotates the evaporation source baffle, and the moving structure moves the recovery structure to make the evaporation source block
  • the board is aligned with the recovery structure; when the indicator light of the receiver and the indicator light of the transmitter both show green, the alignment of the evaporation source baffle and the recovery structure is completed.
  • a reclaimer cover plate is further provided in the vapor deposition chamber for covering the slot opening of the containing tank to close the containing tank when vapor deposition is performed in the vapor deposition chamber.
  • the moving structure is close to a side plate
  • the reclaimer cover plate is arranged on the surface of the side plate close to the moving structure, and the reclaimer cover plate is close to the bottom plate ;
  • the moving structure moves the recovery structure to the reclaimer cover plate, and the reclaimer cover plate covers the slot opening of the accommodating groove to close the Containment slot.
  • the mobile structure includes:
  • a connecting rod, one end of the connecting rod is hinged to the lifter, and the other end of the connecting rod away from the lifter is connected to the recovery container;
  • the lifter lifts and rotates the connecting rod, so that the connecting rod drives the recovery structure to move to the evaporation source baffle to receive the Residual material.
  • the connecting rod and the recovery container are detachably connected.
  • the reclaimer cover is a detachable reclaimer cover.
  • a hollow cavity is formed inside the cooling plate, and condensed water is passed through the hollow cavity.
  • the invention provides a vacuum evaporation device, which comprises an evaporation cavity formed by a top plate, a bottom plate and a plurality of side plates connected and sealed with each other, and an evaporation source and a material corresponding to the evaporation source are arranged in the evaporation cavity.
  • a recovery device, the material recovery device includes:
  • the evaporation source baffle is provided with a heating resistor ring inside the evaporation source baffle, which is used to heat the evaporation source baffle so that when residual material adheres to the surface of the evaporation source baffle near the bottom plate.
  • the residual material is separated from the evaporation source baffle;
  • the recovery structure includes a recovery container and a cooling plate.
  • the recovery container is provided with a containing groove, the cooling plate is arranged at the bottom of the containing groove, a hollow cavity is formed inside the cooling plate, and the hollow cavity is passed through Condensate
  • the moving structure is connected to the recycling structure, and the moving structure is used to move the recycling structure so that the recycling structure can receive the residual material separated from the evaporation source baffle.
  • the vacuum evaporation device further includes a sensor, the sensor includes a transmitter and a receiver, both the transmitter and the receiver are provided with indicator lights, and the indicator lights display red or green;
  • the transmitter is arranged on the evaporation source baffle;
  • the receiver is arranged outside the recovery container;
  • the recovery structure and the evaporation source baffle are aligned through the transmitter and the receiver.
  • a rotating shaft is connected to the end of the evaporation source baffle far away from the evaporation source, and the emitter is close to the connection between the evaporation source baffle and the rotating shaft;
  • the edge of the recovery container extends in a direction close to the rotating shaft to form a bearing part, and the receiver is located on the bearing part;
  • the rotating shaft rotates the evaporation source baffle, and the moving structure moves the recovery structure to make the evaporation source block
  • the board is aligned with the recovery structure; when the indicator light of the receiver and the indicator light of the transmitter both show green, the alignment of the evaporation source baffle and the recovery structure is completed.
  • a reclaimer cover plate is further provided in the vapor deposition chamber for covering the slot opening of the containing tank to close the containing tank when vapor deposition is performed in the vapor deposition chamber.
  • the moving structure is close to a side plate
  • the reclaimer cover plate is arranged on the surface of the side plate close to the moving structure, and the reclaimer cover plate is close to the bottom plate ;
  • the moving structure moves the recovery structure to the reclaimer cover plate, and the reclaimer cover plate covers the slot opening of the accommodating groove to close the Containment slot.
  • the mobile structure includes:
  • a connecting rod, one end of the connecting rod is hinged to the lifter, and the other end of the connecting rod away from the lifter is connected to the recovery container;
  • the lifter lifts and rotates the connecting rod, so that the connecting rod drives the recovery structure to move to the evaporation source baffle to receive the Residual material.
  • the connecting rod and the recovery container are detachably connected.
  • the reclaimer cover is a detachable reclaimer cover.
  • the invention provides a vacuum evaporation device, which comprises an evaporation cavity formed by a top plate, a bottom plate and a plurality of side plates connected and sealed with each other, and an evaporation source and a material corresponding to the evaporation source are arranged in the evaporation cavity.
  • a recovery device, the material recovery device includes:
  • the evaporation source baffle is provided with a heating resistor ring inside the evaporation source baffle, which is used to heat the evaporation source baffle so that when residual material adheres to the surface of the evaporation source baffle near the bottom plate.
  • the residual material is separated from the evaporation source baffle;
  • the recovery structure includes a recovery container and a cooling plate.
  • the recovery container is provided with a containing groove, the cooling plate is arranged at the bottom of the containing groove, a hollow cavity is formed inside the cooling plate, and the hollow cavity is passed through Condensate
  • the mobile structure includes a lifter and a connecting rod, one end of the connecting rod is hinged with the lifter, and the other end of the connecting rod away from the lifter is connected with the recovery container.
  • the vacuum evaporation device further includes a sensor, the sensor includes a transmitter and a receiver, both the transmitter and the receiver are provided with indicator lights, and the indicator lights display red or green;
  • the transmitter is arranged on the evaporation source baffle;
  • the receiver is arranged outside the recovery container;
  • the recovery structure and the evaporation source baffle are aligned through the transmitter and the receiver.
  • the vacuum evaporation device of the present invention includes an evaporation chamber formed by a top plate, a bottom plate, and a plurality of side plates connected and sealed with each other, and an evaporation source is provided in the evaporation chamber and is one-to-one with the evaporation source.
  • the material recovery device includes: an evaporation source baffle, the evaporation source baffle is provided with a heating resistance ring; a recovery structure, the recovery structure is connected with a moving structure, the moving structure is used for moving The recovery structure; when residual material is attached to the evaporation source baffle, the heating resistor ring heats the evaporation source baffle to make the residual material separate from the evaporation source baffle, and at the same time, the moving structure The recycling structure is moved to receive the residual material.
  • the invention recovers the residual material on the evaporation source baffle in the evaporation chamber through the combination of the recovery structure and the moving structure.
  • the evaporation chamber does not need to be opened for a long time, avoiding foreign impurities from entering the cavity, and reducing particle generation. , Avoid polluting the cavity, avoid secondary pollution of recycled materials, ensure the health of operators and reduce the cost of later material reuse.
  • Fig. 1 is a schematic structural diagram of a material recovery device of a vacuum evaporation device provided by a first embodiment of the present invention
  • FIG. 2 is a schematic diagram of the structure of the material recovery device of the vacuum evaporation device provided by the second embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an embodiment of a vacuum evaporation device provided by an embodiment of the present invention.
  • FIG. 4 is a schematic top view of the structure of the vacuum evaporation apparatus in a state according to an embodiment of the present invention
  • FIG. 5 is a schematic top view of the vacuum evaporation apparatus provided by the embodiment of the present invention in another state.
  • the present invention addresses the technical problems of the existing vacuum evaporation device, such as an increase in the number of particles and contamination of the cavity due to slow recovery speed and long cavity opening time, and this embodiment can solve the defects.
  • a first embodiment of the present invention provides a vacuum evaporation device, including a top plate, a bottom plate, and a plurality of side plates connected and sealed to form an evaporation chamber 100, the evaporation chamber 100 is provided with an evaporation source And a material recovery device corresponding to the evaporation source one-to-one, the material recovery device includes: an evaporation source baffle 101, the inside of the evaporation source baffle 101 is a hollow structure, and the hollow structure is provided with a heating resistor coil 102, It is used to heat the evaporation source baffle 101 when the residual material 103 is attached to the surface of the evaporation source baffle 101 on the side close to the bottom plate, so that the residual material 103 is separated from the evaporation source baffle 101; recovery structure A moving structure is connected to the recycling structure, and the moving structure is used to move the recycling structure so that the recycling structure can receive the residual material 103 that is separated from the evaporation source baffle 101
  • the recycling structure includes a recycling container 104 and a cooling plate 105.
  • the recycling container 104 is provided with a containing groove 106
  • the cooling plate 105 is provided at the bottom of the containing groove 106
  • the cooling plate 105 may be formed inside
  • the cooling plate 105 can quickly cool and condense the residual material 103 into a solid state, so that the residual material 103 It is easy to attach to the containing groove 106; it should be pointed out that the opening of the containing groove 106 can be larger than the size of the attachment range of the residual material 103.
  • the residual material 103 is recycled, the residual material 103 can be ensured. Completely enter the containing groove 106.
  • the moving structure may include a lifter 107 and a connecting rod 108.
  • the lifter 107 may be cylindrical.
  • One end of the lifter 107 passing through the bottom plate may be connected to a driving device 109, which may be
  • the driving device 109 may also be a roller skating device; one end of the connecting rod 108 is hinged to the lifter 107, and the other end of the connecting rod 108 away from the lifter 107 is connected to the recovery device. Structural connection.
  • the function of the connecting rod 108 is to connect the lifter 107 with the recovery structure. When the residual material 103 is recovered, the lifter 107 can lift the connecting rod 108 by lifting the connecting rod 108. 108 drives the recovery structure to move.
  • the connecting rod 108 may be a straight rod, or it may include two rods connected to each other at a certain angle.
  • the connecting point of the connecting rod 108 and the lifter 107 may be It is provided with a screw, or it may be provided with a rotating shaft to facilitate the rotation of the connecting rod 108 and to move the recovery structure more quickly.
  • the outer side of the lifter 107 may be covered with a layer of shell, the shell may be made of stainless steel, the part of the shell located outside the evaporation chamber 100 and the bottom plate are connected by a screw, the shell and the The screw can be disassembled.
  • the connection between the lifter 107 and the bottom plate can also be provided with a sealing ring 110, and the sealing ring 110 should be completely
  • the gap between the joints is closed to prevent the vapor deposition chamber 100 from being unable to be vacuum-treated when vapor deposition is performed in the vapor deposition chamber 100.
  • One end of the evaporation source baffle 101 can be connected to a rotating shaft 111, the rotating shaft 111 can pass through the bottom plate to be connected to the motor 112, and the rotating shaft 111 is driven by the motor 112 to rotate the evaporation source baffle 101.
  • the sealing ring 110 may also be provided at the connection between the rotating shaft 111 and the bottom plate. The sealing ring 110 should completely close the gap at the connection to prevent evaporation in the evaporation chamber 100.
  • the vapor deposition chamber 100 cannot be vacuumed.
  • the residual material 103 can automatically fall off the evaporation source baffle 101.
  • the evaporation source baffle 101 and the recovery container 104 are moved to the corresponding positions by designing appropriate movement values.
  • the evaporation source baffle 101 should cover the opening of the containing groove 106 to form a closed cavity, and the residual material 103 attached to the evaporation source baffle 101 needs to be all located in the closed cavity.
  • the vapor deposition chamber 100 When vapor deposition is performed in the vapor deposition chamber 100, the vapor deposition chamber 100 needs to be vacuumed. When the residual material 103 has been recovered in the containing tank 106, the powder of the residual material 103 It is easy to be driven away from the containing tank 106 by the air pressure during vacuuming. The residual material 106 will be scattered in the vapor deposition chamber 100 and pollute the vapor deposition chamber 100.
  • a recycler cover 113 can be provided to avoid The above situation occurs; the moving structure is close to a side plate, the reclaimer cover 113 is provided on the surface of the side plate close to the moving structure, and the reclaimer cover 113 may be close to the bottom plate, so The reclaimer cover 113 is used to cover the opening of the receiving groove 106 to close the receiving groove 106.
  • the recovery container 104 is a rectangular parallelepiped. In other embodiments, the recovery container 104 may also have other shapes, such as a pot shape, a cup shape, or a polygon with arc edges on both sides.
  • the container 104 only needs to provide the containing groove 106 for accommodating the residual material 103 to ensure that the residual material 103 can completely fall into the recovery container 104 after being separated from the evaporation source baffle 101.
  • a plurality of evaporation source baffles 101 may be provided in the evaporation chamber 100, and each evaporation source baffle 101 may be provided with an anti-landing plate below, so The residual material 103 is also easily formed on the anti-landing plate, and each evaporation source baffle 101 and the anti-landing plate corresponds to one recovery structure.
  • each evaporation source baffle 101 and the anti-landing plate corresponds to one recovery structure.
  • the vacuum evaporation device provided by the first embodiment of the present invention is provided with a recovery structure and a moving structure.
  • the recovery structure is composed of a recovery container and a cooling plate.
  • design appropriate Move value rotate the evaporation source baffle and move the recovery structure at the same time, so that the evaporation source baffle and the recovery structure are located in opposite positions and there is a proper vertical distance between the two to ensure that the heating resistor ring on the evaporation source baffle heats the evaporation source
  • the recycling structure can accept the residual material, and allow the residual material to cool quickly and adhere to the inside of the recycling container.
  • the difference between the vacuum evaporation apparatus provided by the second embodiment of the present invention and the first embodiment is that the vacuum evaporation apparatus further includes a sensor, and the sensor includes a transmitter 214 and a receiver 215.
  • the sensor may be an optical sensor, and the transmitter 214 and the receiver 215 are respectively disposed near the evaporation source baffle 101 and outside the recovery container; for example, the transmitter 214 may be disposed on the evaporation source baffle.
  • the receiver 215 is arranged outside the recovery container 104; for another example, the receiver 215 is arranged on the rotating shaft 111, and the transmitter 214 is arranged outside the recovery container 104.
  • the moving structure is close to a side plate
  • the recovery container 104 may extend at the edge in a direction away from the moving structure to form a bearing portion 216, and the receiver 215 or the transmitter 214 is arranged at The carrying portion 216 is attached.
  • Both the transmitter 214 and the receiver 215 are provided with indicator lights, which display red or green.
  • the indicator lights of the transmitter 214 and the receiver 215 The indicator lights all show red
  • the rotating shaft 111 rotates the evaporation source baffle 101
  • the moving structure moves the recovery structure
  • the evaporation source baffle 101 and the recovery structure pass through the emitter 214 and the
  • the receiver 215 is aligned to ensure that the evaporation source baffle 101 and the recovery structure are located at the corresponding positions and maintain a proper vertical distance between each other.
  • the optical sensor receives a signal after sending a signal through software to perform alignment.
  • the residual material 103 can automatically fall off the evaporation source baffle 101.
  • the evaporation source baffle 101 and the recovery container 104 pass through the emitter 214 and The receiver 215 is aligned, the evaporation source baffle 101 covers the opening of the containing groove 106 to form a closed cavity, and the residual material 103 attached to the evaporation source baffle 101 needs to be all Located in the closed cavity.
  • the recycling container 104 is a polygon with arc edges on both sides.
  • the recycling container 104 may also have other shapes, such as a pot shape, a cup shape, or a rectangular parallelepiped.
  • the container 104 only needs to provide one accommodating groove 106 for accommodating the residual material 103, which can ensure that the residual material 103 can completely fall into the recovery container 104 after being separated from the evaporation source baffle 101.
  • a plurality of evaporation source baffles 101 may be provided in the evaporation chamber 100, and each evaporation source baffle 101 may be provided with an anti-landing plate below, so The residual material 103 is also easily formed on the anti-landing plate, and each evaporation source baffle 101 and the anti-landing plate corresponds to one recovery structure.
  • each evaporation source baffle 101 and the anti-landing plate corresponds to one recovery structure.
  • the vacuum evaporation device provided in the second embodiment of the present invention adds an optical sensor on the basis of the first embodiment.
  • the sensor is divided into two parts: a transmitter and a receiver, which are respectively arranged on the evaporation source baffle or rotating shaft, and the recovery Outside the container, the optical sensor can ensure accurate alignment between the evaporation source baffle and the recovery container.
  • the recovery structure recovers the residual material
  • the evaporation source baffle and the recovery container are aligned through the transmitter and receiver, which can increase the residual material. Material recovery rate.
  • the evaporation source of the vacuum evaporation device provided by the present invention includes a crucible 417 and a heat preservation layer 418.
  • the heat preservation layer 418 is located on the periphery of the crucible 417, and a heating resistor can be set between the heat preservation layer 418 and the crucible 417. (Not shown in the figure), the crucible 417 is used to hold the evaporation material 419 that needs to be evaporated.
  • the evaporation source baffle 101 When the evaporation material 419 is evaporated, the evaporation source baffle 101 is located above the evaporation source, A substrate to be evaporated is placed above the evaporation source baffle 101, and an opening may be opened on the evaporation source baffle 101 for allowing the evaporation material 419 to pass through, and the evaporation material 419 is passing through the evaporation source.
  • the opening of the baffle 101 contacts the substrate to be vapor-deposited to form a film, while a small part of the vapor deposition material 419 contacts the evaporation source baffle 101 and the anti-landing plate before passing through the opening.
  • the evaporation source baffle 101 or the landing prevention plate condenses into a solid state and adheres to the surface of the evaporation source baffle 101 or the landing prevention plate to form the residual material 103, or, at the end of evaporation, part of The evaporation material 419 fails to pass through the opening, but gathers under the evaporation source baffle 101 or the landing prevention plate.
  • the evaporation source When the evaporation source is in a cooling state and the surrounding temperature drops, this part of the The evaporation material 419 is condensed and adheres to the evaporation source baffle 101 or the adhesion prevention plate to form the residual material 103; from this, it can be known that the residual material 103 is attached to the evaporation source baffle 101 Or when the surface of the anti-adhering plate is used, the attachment range of the residual material 103 should not exceed the evaporation range of the evaporation source.
  • the evaporation source baffle 101 is in a cooling or shutdown state, a certain amount of the residual material 103 is attached to the evaporation source baffle 101, and the evaporation source baffle is determined by designing an appropriate movement value or by a sensor 101 and the recovery structure.
  • the evaporation source baffle 101 rotates from A to C through the rotating shaft 111, the recoverer cover 113 is opened, and the lifter 107 starts to work.
  • the lifter 107 moves the recovery structure from B to C through the connecting rod 108.
  • the evaporation source baffle 101 and the recovery structure are fine-tuned and aligned.
  • the heating resistor ring 102 is turned on to heat the evaporation source baffle 101, the residual material 103 leaves the evaporation source baffle 101 after being heated, and the residual material 103 leaving the evaporation source baffle 101 enters the evaporation source baffle 101.
  • the inside of the recovery container 104 is cooled and condensed into a solid state via the cooling plate 105 and attached to the receiving tank 106.
  • the evaporation source needs to start working, or the residual material 103 has been recovered.
  • the heating resistor 102 is closed, and the rotating shaft 111 rotates the evaporation source baffle 101 from C to At A, the evaporation source baffle 101 stops above the evaporation source to facilitate the evaporation source to start working next time; the elevator 107 moves the recovery structure from C to At B, the bottom of the recovery container 104 is close to the side plate, and the recovery cover 113 covers the recovery container 104 to close the receiving groove 106.
  • the vacuum evaporation device of the present invention includes an evaporation chamber formed by a top plate, a bottom plate, and a plurality of side plates connected and sealed with each other, and an evaporation source is provided in the evaporation chamber and the same as the evaporation source.
  • a corresponding material recovery device the material recovery device includes: an evaporation source baffle, the evaporation source baffle is provided with a heating resistor ring; a recovery structure, the recovery structure is connected with a moving structure, the moving structure is used for Move the recovery structure; when residual material is attached to the evaporation source baffle, the heating resistor ring heats the evaporation source baffle to make the residual material separate from the evaporation source baffle, and at the same time, the moving The structure moves the recycling structure to receive the residual material.
  • the invention recovers the residual material on the evaporation source baffle in the evaporation chamber through the combination of the recovery structure and the moving structure.
  • the evaporation chamber does not need to be opened for a long time, avoiding foreign impurities from entering the cavity, and reducing particle generation. , Avoid polluting the cavity, avoid secondary pollution of recycled materials, ensure the health of operators and reduce the cost of later material reuse.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

本发明提供了一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,蒸镀腔内设置有蒸发源以及材料回收装置,通过回收结构与移动结构相结合,对蒸镀腔内蒸发源挡板上的残留材料进行回收,能够减少粒子产生、避免污染腔体、避免回收材料二次污染、保证作业人员的身体健康且降低后期材料再利用的成本。

Description

真空蒸镀装置 技术领域
本发明涉及蒸镀技术领域,尤其涉及一种真空蒸镀装置。
背景技术
目前,真空热蒸镀工艺广泛应用于有机发光二极管(OLED)、有机光伏电池(OPV)、电致变色器件(ECD)等产品制备。在器件制备过程一般采用蒸镀工艺制作有机膜层或一些金属层。
技术问题
蒸镀用的有机材料大多较为昂贵,为降低成本,会对材料进行回收提纯再利用,在蒸镀机保养时,会拆卸内部挡板和防着板等部件,回收部件上附着的材料。但在平时蒸镀机工作时,挡板上累积的材料过多容易发生脱落,造成腔体污染、粒子数量增加,影响产品的良率。且现有技术的回收方法,存在回收速度慢、开腔时间长、挡板上易残留材料等问题。
因此,需要一种新的真空蒸镀装置,以解决上述问题。
技术解决方案
本发明提供一种真空蒸镀装置,能够降低开腔时长,减少粒子产生,避免污染腔体,以解决现有的真空蒸镀装置因回收速度慢、开腔时间长而导致粒子数量增加、腔体受到污染等技术问题。
为解决上述问题,本发明提供的技术方案如下:
本发明提供一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
回收结构,所述回收结构连接有移动结构,所述移动结构用于移动所述回收结构,使所述回收结构承接脱离所述蒸发源挡板的所述残余材料。
根据本发明一优选实施例,所述回收结构包括:
回收容器,所述回收容器中设有容纳槽,所述容纳槽用于收集脱离所述蒸发源挡板的所述残余材料;
冷却板,设置于所述容纳槽的底部,用于对脱离的所述残余材料进行冷却,使所述残余材料成为固体以附着在所述容纳槽内。
根据本发明一优选实施例,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
所述发射器设于所述蒸发源挡板上;
所述接收器设于所述回收容器外部;
在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
根据本发明一优选实施例,所述蒸发源挡板远离所述蒸发源的一端连接有转轴,所述发射器靠近所述蒸发源挡板与所述转轴的连接处;
所述回收容器的边缘向靠近所述转轴的方向延伸形成有承载部,所述接收器位于所述承载部上;
其中,当所述接收器的指示灯与所述发射器的指示灯均显示红色时,所述转轴转动所述蒸发源挡板,所述移动结构移动所述回收结构,使所述蒸发源挡板与所述回收结构进行对位;当所述接收器的指示灯与所述发射器的指示灯均显示绿色时,所述蒸发源挡板与所述回收结构对位完毕。
根据本发明一优选实施例,所述蒸镀腔内还设置有回收器盖板,用于在所述蒸镀腔内进行蒸镀时,覆盖所述容纳槽的槽开口以封闭所述容纳槽。
根据本发明一优选实施例,所述移动结构靠近一所述侧板,所述回收器盖板设置于靠近所述移动结构的所述侧板表面,且所述回收器盖板靠近所述底板;
其中,在所述蒸镀腔内进行蒸镀时,所述移动结构移动所述回收结构至所述回收器盖板处,所述回收器盖板覆盖所述容纳槽的槽开口以封闭所述容纳槽。
根据本发明一优选实施例,所述移动结构包括:
升降器;
连杆,所述连杆的一端与所述升降器铰接,所述连杆远离所述升降器的另一端与所述回收容器连接;
其中,在所述回收结构回收所述残余材料时,所述升降器升降并转动所述连杆,使所述连杆带动所述回收结构移动至所述蒸发源挡板处,以承接所述残余材料。
根据本发明一优选实施例,所述连杆与所述回收容器之间为可拆卸式连接。
根据本发明一优选实施例,所述回收器盖板为可拆卸式回收器盖板。
根据本发明一优选实施例,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水。
本发明提供一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
回收结构,包括回收容器和冷却板,所述回收容器中设有容纳槽,所述冷却板设置于所述容纳槽的底部,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水;
移动结构,与所述回收结构连接,所述移动结构用于移动所述回收结构,使所述回收结构承接脱离所述蒸发源挡板的所述残余材料。
根据本发明一优选实施例,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
所述发射器设于所述蒸发源挡板上;
所述接收器设于所述回收容器外部;
在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
根据本发明一优选实施例,所述蒸发源挡板远离所述蒸发源的一端连接有转轴,所述发射器靠近所述蒸发源挡板与所述转轴的连接处;
所述回收容器的边缘向靠近所述转轴的方向延伸形成有承载部,所述接收器位于所述承载部上;
其中,当所述接收器的指示灯与所述发射器的指示灯均显示红色时,所述转轴转动所述蒸发源挡板,所述移动结构移动所述回收结构,使所述蒸发源挡板与所述回收结构进行对位;当所述接收器的指示灯与所述发射器的指示灯均显示绿色时,所述蒸发源挡板与所述回收结构对位完毕。
根据本发明一优选实施例,所述蒸镀腔内还设置有回收器盖板,用于在所述蒸镀腔内进行蒸镀时,覆盖所述容纳槽的槽开口以封闭所述容纳槽。
根据本发明一优选实施例,所述移动结构靠近一所述侧板,所述回收器盖板设置于靠近所述移动结构的所述侧板表面,且所述回收器盖板靠近所述底板;
其中,在所述蒸镀腔内进行蒸镀时,所述移动结构移动所述回收结构至所述回收器盖板处,所述回收器盖板覆盖所述容纳槽的槽开口以封闭所述容纳槽。
根据本发明一优选实施例,所述移动结构包括:
升降器;
连杆,所述连杆的一端与所述升降器铰接,所述连杆远离所述升降器的另一端与所述回收容器连接;
其中,在所述回收结构回收所述残余材料时,所述升降器升降并转动所述连杆,使所述连杆带动所述回收结构移动至所述蒸发源挡板处,以承接所述残余材料。
根据本发明一优选实施例,所述连杆与所述回收容器之间为可拆卸式连接。
根据本发明一优选实施例,所述回收器盖板为可拆卸式回收器盖板。
本发明提供一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
回收结构,包括回收容器和冷却板,所述回收容器中设有容纳槽,所述冷却板设置于所述容纳槽的底部,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水;
移动结构,包括升降器和连接杆,所述连接杆的一端与所述升降器铰接,所述连接杆远离所述升降器的另一端与所述回收容器连接。
根据本发明一优选实施例,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
所述发射器设于所述蒸发源挡板上;
所述接收器设于所述回收容器外部;
在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
有益效果
本揭示的有益效果:本发明的真空蒸镀装置包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈;回收结构,所述回收结构连接有移动结构,所述移动结构用于移动所述回收结构;所述蒸发源挡板上附着有残余材料时,所述加热电阻圈加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板,同时,所述移动结构移动所述回收结构以承接所述残余材料。本发明通过回收结构与移动结构相结合,对蒸镀腔内蒸发源挡板上的残留材料进行回收,回收时,不需长时间开启蒸镀腔,避免外来杂质进入腔体内,能够减少粒子产生、避免污染腔体、避免回收材料二次污染、保证作业人员的身体健康且降低后期材料再利用的成本。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单介绍,显而易见地,下面描述中的附图仅仅是揭示的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明第一实施例提供的真空蒸镀装置的材料回收装置的结构示意图;
图2为本发明第二实施例提供的真空蒸镀装置的材料回收装置的结构示意图;
图3为本发明实施例提供的真空蒸镀装置一种实施方式的结构示意图;
图4为本发明实施例提供的真空蒸镀装置的一种状态下的俯视结构示意图;
图5为本发明实施例提供的真空蒸镀装置的另一种状态下的俯视结构示意图。
本发明的实施方式
以下各实施例的说明是参考附加的图示,用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语,例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本申请,而非用以限制本申请。在图中,结构相似的单元是用以相同标号表示。
本发明针对现有的真空蒸镀装置因回收速度慢、开腔时间长而导致粒子数量增加、腔体受到污染等技术问题,本实施例能够解决该缺陷。
请参阅图1,本发明第一实施例提供一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔100,所述蒸镀腔100内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:蒸发源挡板101,所述蒸发源挡板101内部为中空结构,所述中空结构设置有加热电阻圈102,用于在所述蒸发源挡板101靠近所述底板一侧的表面附着残余材料103时,加热所述蒸发源挡板101,使所述残余材料103脱离所述蒸发源挡板101;回收结构,所述回收结构连接有移动结构,所述移动结构用于移动所述回收结构,使所述回收结构承接脱离所述蒸发源挡板101的所述残余材料103。
其中,所述回收结构包括回收容器104和冷却板105,所述回收容器104内开设有容纳槽106,所述冷却板105设于所述容纳槽106底部,所述冷却板105可以为内部形成有中空腔的结构,在所述中空腔内通有冷凝水,当回收所述残余材料103时,所述冷却板105可以将所述残余材料103快速冷却凝成固态,使所述残余材料103易于附着在所述容纳槽106内;需要指出,所述容纳槽106的槽开口可以是大于所述残余材料103附着的范围大小,当回收所述残余材料103时,能确保所述残余材料103完全进入所述容纳槽106内。
所述移动结构可以包括升降器107和连杆108,所述升降器107可以是圆柱状,所述升降器107穿过所述底板的一端可以连接有驱动装置109,所述驱动装置109可以是液压机或气压机等,所述驱动装置109也可以是轮滑装置;所述连杆108的一端与所述升降器107铰接,所述连杆108远离所述升降器107的另一端与所述回收结构连接,所述连杆108的作用是连接所述升降器107与所述回收结构,在回收所述残余材料103时,所述升降器107可通过升降所述连杆108,所述连杆108带动所述回收结构来进行移动,所述连杆108可以是直杆,也可以是包括两段彼此具有一定角度且相连的杆,所述连杆108与所述升降器107的连接处可以是设有一个螺杆,也可以是设有一截转轴,以方便所述连杆108转动,能够更快速的移动所述回收结构。
所述升降器107的外侧可以覆盖一层外壳,所述外壳可以是不锈钢材质,所述外壳位于所述蒸镀腔100外的部分与所述底板之间通过螺杆连接,所述外壳和所述螺杆均可拆卸,当所述移动结构需要定期更换清洗时,可以只除去外壳进行更换清洗;所述升降器107与所述底板的连接处还可以设置密封圈110,所述密封圈110应完全封闭所述连接处的缝隙,以防止在所述蒸镀腔100内进行蒸镀时,无法将所述蒸镀腔100进行抽真空处理。
所述蒸发源挡板101的一端可以连接转轴111,所述转轴111可以穿过所述底板与电机112连接,所述转轴111通过所述电机112驱动来转动所述蒸发源挡板101,在回收所述残余材料103时,可以通过设计合适的移动值,同时让所述转轴111转动所述蒸发源挡板101、所述移动结构移动所述回收结构,使所述蒸发源挡板101与所述回收结构处于相对垂直的位置,且所述蒸发源挡板101与所述回收结构之间需有适合的垂直距离,保证所述残余材料103能顺利进入所述容纳槽106内;其中,所述转轴111与所述底板的连接处也可以设置所述密封圈110,所述密封圈110应完全封闭所述连接处的缝隙,以防止在所述蒸镀腔100内进行蒸镀时,无法将所述蒸镀腔100进行抽真空处理。
需要指出,若所述残余材料103被加热后,由固态转为液态,或者所述残余材料103在受热后,附着力减小,自动可以从所述蒸发源挡板101上脱落,此时所述蒸发源挡板101与所述回收结构之间可以是具有一段垂直距离,但在一些情况下,例如,在所述加热电阻圈102对所述蒸发源挡板101进行加热后,所述残余材料103可以由固态直接升华变为气态,此时,在对所述残余材料103进行加热之前,所述蒸发源挡板101与所述回收容器104通过设计合适的移动值,移动至对应的位置,所述蒸发源挡板101应盖住所述容纳槽106的槽开口以形成封闭腔,且附着在所述蒸发源挡板101上的所述残余材料103需要全部位于所述封闭腔内。
在所述蒸镀腔100内进行蒸镀时,需对所述蒸镀腔100进行抽真空处理,当所述容纳槽106内已回收有所述残余材料103时,所述残余材料103的粉末容易被抽真空时的气压带动脱离所述容纳槽106,所述残余材料106将会散布在所述蒸镀腔100内,污染所述蒸镀腔100,因此可设置回收器盖板113以避免上述情况发生;所述移动结构靠近一所述侧板,所述回收器盖板113设于靠近所述移动结构的所述侧板表面,所述回收器盖板113可以靠近所述底板,所述回收器盖板113用于覆盖所述容纳槽106的槽开口以封闭所述容纳槽106。
需要指出,所述连杆108与所述回收容器104之间为可拆卸式连接,当所述回收容器104中收集了足够多的所述残余材料103时,需要对所述回收容器104进行处理,此时只需拆卸所述回收容器104,回收所述回收容器104中的所述残余材料103进行再利用即可。
本实施例中,所述回收容器104为长方体,在其它实施例中,所述回收容器104也可以是其它的形状,如壶型、杯型或两侧带弧边的多边形等,所述回收容器104只需提供一个容纳所述残余材料103的所述容纳槽106,保证所述残余材料103在脱离所述蒸发源挡板101后,能完全落入所述回收容器104内即可。
本实施例提供的真空蒸镀装置中,所述蒸镀腔100内可以设置有多个所述蒸发源挡板101,每个所述蒸发源挡板101可以在下方设置有防着板,所述防着板上也易于形成有所述残余材料103,每个所述蒸发源挡板101及所述防着板对应一个所述回收结构,当所述蒸镀腔100内设置有多个回收结构时,需要明确,与所述回收结构相关的其它结构,如所述移动结构、所述回收器盖板113等,也为多个,且分别与每个所述回收结构对应。
本发明第一实施例提供的真空蒸镀装置,通过设置回收结构和移动结构,回收结构由回收容器和冷却板构成,在蒸发源挡板上附着有残余材料需要进行回收时,通过设计合适的移动值,同时转动蒸发源挡板以及移动回收结构,使蒸发源挡板和回收结构位于相对的位置且两者间具有合适的垂直距离,保证当蒸发源挡板上的加热电阻圈加热蒸发源挡板使残余材料脱离时,回收结构能承接残余材料,并让残余材料快速冷却且附着在回收容器内部。
请参阅图2,本发明第二实施例提供的真空蒸镀装置与第一实施例的区别在于,所述真空蒸镀装置还包括传感器,所述传感器包括发射器214和接收器215,所述传感器可以是光学传感器,所述发射器214和所述接收器215分别设置在所述蒸发源挡板101附近及所述回收容器外部;例如,所述发射器214可以设置在所述蒸发源挡板101上,所述接收器215设置在所述回收容器104外部;又例如,所述接收器215设置在所述转轴111上,所述发射器214设置在所述回收容器104外部。
具体地,所述移动结构靠近一所述侧板,所述回收容器104可以在边缘处向远离所述移动结构的方向延伸形成承载部216,所述接收器215或所述发射器214设置在所述承载部216上。
所述发射器214和所述接收器215均设有指示灯,所述指示灯显示红色或绿色,在回收所述残余材料103时,所述发射器214的指示灯和所述接收器215的指示灯均显示红色,所述转轴111转动所述蒸发源挡板101,所述移动结构移动所述回收结构,所述蒸发源挡板101与所述回收结构通过所述发射器214及所述接收器215进行对位,保证所述蒸发源挡板101与所述回收结构位于对应的位置且彼此之间保持合适的垂直距离,当所述发射器214的指示灯和所述接收器215的指示灯均显示绿色时,所述蒸发源挡板101与所述回收结构对位完毕;需要指出的是,所述光学传感器是通过软体发出信号后是否接收信号来进行对位。
需要指出,若所述残余材料103被加热后,由固态转为液态,或者所述残余材料103在受热后,附着力减小,自动可以从所述蒸发源挡板101上脱落,此时所述蒸发源挡板101与所述回收结构之间可以是具有一段垂直距离,但在一些情况下,例如,在所述加热电阻圈102对所述蒸发源挡板101进行加热后,所述残余材料103可以由固态直接升华变为气态,此时,请参阅图3,在对所述残余材料103进行加热之前,所述蒸发源挡板101与所述回收容器104通过所述发射器214及所述接收器215进行对位,所述蒸发源挡板101盖住所述容纳槽106的槽开口以形成封闭腔,且附着在所述蒸发源挡板101上的所述残余材料103需要全部位于所述封闭腔内。
本实施例中,所述回收容器104为两侧带弧边的多边形,在其它实施例中,所述回收容器104也可以是其它的形状,如壶型、杯型或长方体等,所述回收容器104只需提供一个容纳所述残余材料103的所述容纳槽106,能保证所述残余材料103在脱离所述蒸发源挡板101后,能完全落入所述回收容器104内。
本实施例提供的真空蒸镀装置中,所述蒸镀腔100内可以设置有多个所述蒸发源挡板101,每个所述蒸发源挡板101可以在下方设置有防着板,所述防着板上也易于形成有所述残余材料103,每个所述蒸发源挡板101及所述防着板对应一个所述回收结构,当所述蒸镀腔100内设置有多个回收结构时,需要明确,与所述回收结构相关的其它结构,如所述移动结构、所述回收器盖板113等,也为多个,且分别与每个所述回收结构对应。
本发明第二实施例提供的真空蒸镀装置,在第一实施例的基础上,增加了光学传感器,传感器分为发射器和接收器两部分,分别设置在蒸发源挡板或转轴上、回收容器外部,光学传感器能够保证蒸发源挡板与回收容器之间精确对位,在回收结构对残余材料进行回收时,蒸发源挡板与回收容器通过发射器及接收器进行对位,能够提高残余材料的回收率。
请参阅图4、图5,下面通过在本发明的真空蒸镀装置的两种不同状态下各结构的工作步骤,来具体说明本发明的技术方案。
本发明提供的真空蒸镀装置的所述蒸发源包括坩埚417和保温层418,所述保温层418位于所述坩埚417外围,所述保温层418与所述坩埚417之间还可以设置加热电阻圈(图中未示出),所述坩埚417用于盛放需要被蒸发的蒸镀材料419,在蒸发所述蒸镀材料419时,所述蒸发源挡板101位于所述蒸发源上方,所述蒸发源挡板101的上方放置待蒸镀基板,所述蒸发源挡板101上可以开设开口,用于使所述蒸镀材料419通过,所述蒸镀材料419在通过所述蒸发源挡板101的开口后接触所述待蒸镀基板成膜,而少部分所述蒸镀材料419在通过所述开口之前,接触所述蒸发源挡板101及所述防着板,易在所述蒸发源挡板101或所述防着板下方凝成固态且附着在所述蒸发源挡板101或所述防着板表面,形成所述残余材料103,或者,在蒸镀结束时,部分所述蒸镀材料419未能通过所述开口,而聚集在所述蒸发源挡板101或所述防着板下方,当所述蒸发源处于冷却状态,周围的温度降下时,这部分所述蒸镀材料419凝成固态附着在所述蒸发源挡板101或所述防着板上形成所述残余材料103;由此可以得知,所述残余材料103附着于所述蒸发源挡板101或所述防着板表面时,所述残余材料103附着的范围应不超过所述蒸发源的蒸发范围。
请参阅图4,此时所述蒸发源处于冷却或停工状态,所述蒸发源挡板101上附着有一定量的所述残余材料103,通过设计合适移动值或者通过传感器确定所述蒸发源挡板101与所述回收结构的位置,此时,所述蒸发源挡板101从A处通过所述转轴111转动至C处,所述回收器盖板113打开,所述升降器107开始工作,所述升降器107通过所述连杆108将所述回收结构从B处移动至C处,之后,所述蒸发源挡板101与所述回收结构再进行微调对位,对位完毕后,所述加热电阻圈102开启,对所述蒸发源挡板101进行加热,所述残余材料103受热后脱离所述蒸发源挡板101,脱离所述蒸发源挡板101的所述残余材料103进入所述回收容器104内,经由所述冷却板105冷却凝成固态并附着在所述容纳槽106内。
请参阅图5,所述蒸发源需开始工作,或者所述残余材料103已回收完毕,此时关闭所述加热电阻圈102,所述转轴111将所述蒸发源挡板101从C处转动至A处,所述蒸发源挡板101停于所述蒸发源上方,以方便所述蒸发源下次开始工作;所述升降器107通过所述连杆108将所述回收结构从C处移动至B处,所述回收容器104的底部靠近所述侧板,所述回收器盖板113盖下覆盖住所述回收容器104以封闭所述容纳槽106。
本发明的有益效果为:本发明的真空蒸镀装置包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈;回收结构,所述回收结构连接有移动结构,所述移动结构用于移动所述回收结构;所述蒸发源挡板上附着有残余材料时,所述加热电阻圈加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板,同时,所述移动结构移动所述回收结构以承接所述残余材料。本发明通过回收结构与移动结构相结合,对蒸镀腔内蒸发源挡板上的残留材料进行回收,回收时,不需长时间开启蒸镀腔,避免外来杂质进入腔体内,能够减少粒子产生、避免污染腔体、避免回收材料二次污染、保证作业人员的身体健康且降低后期材料再利用的成本。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
    蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
    回收结构,所述回收结构连接有移动结构,所述移动结构用于移动所述回收结构,使所述回收结构承接脱离所述蒸发源挡板的所述残余材料。
  2. 根据权利要求1所述的真空蒸镀装置,其中,所述回收结构包括:
    回收容器,所述回收容器中设有容纳槽,所述容纳槽用于收集脱离所述蒸发源挡板的所述残余材料;
    冷却板,设置于所述容纳槽的底部,用于对脱离的所述残余材料进行冷却,使所述残余材料成为固体以附着在所述容纳槽内。
  3. 根据权利要求2所述的真空蒸镀装置,其中,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
    所述发射器设于所述蒸发源挡板上;
    所述接收器设于所述回收容器外部;
    在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
  4. 根据权利要求3所述的真空蒸镀装置,其中,所述蒸发源挡板远离所述蒸发源的一端连接有转轴,所述发射器靠近所述蒸发源挡板与所述转轴的连接处;
    所述回收容器的边缘向靠近所述转轴的方向延伸形成有承载部,所述接收器位于所述承载部上;
    其中,当所述接收器的指示灯与所述发射器的指示灯均显示红色时,所述转轴转动所述蒸发源挡板,所述移动结构移动所述回收结构,使所述蒸发源挡板与所述回收结构进行对位;当所述接收器的指示灯与所述发射器的指示灯均显示绿色时,所述蒸发源挡板与所述回收结构对位完毕。
  5. 根据权利要求2所述的真空蒸镀装置,其中,所述蒸镀腔内还设置有回收器盖板,用于在所述蒸镀腔内进行蒸镀时,覆盖所述容纳槽的槽开口以封闭所述容纳槽。
  6. 根据权利要求5所述的真空蒸镀装置,其中,所述移动结构靠近一所述侧板,所述回收器盖板设置于靠近所述移动结构的所述侧板表面,且所述回收器盖板靠近所述底板;
    其中,在所述蒸镀腔内进行蒸镀时,所述移动结构移动所述回收结构至所述回收器盖板处,所述回收器盖板覆盖所述容纳槽的槽开口以封闭所述容纳槽。
  7. 根据权利要求2所述的真空蒸镀装置,其中,所述移动结构包括:
    升降器;
    连杆,所述连杆的一端与所述升降器铰接,所述连杆远离所述升降器的另一端与所述回收容器连接;
    其中,在所述回收结构回收所述残余材料时,所述升降器升降并转动所述连杆,使所述连杆带动所述回收结构移动至所述蒸发源挡板处,以承接所述残余材料。
  8. 根据权利要求7所述的真空蒸镀装置,其中,所述连杆与所述回收容器之间为可拆卸式连接。
  9. 根据权利要求6所述的真空蒸镀装置,其中,所述回收器盖板为可拆卸式回收器盖板。
  10. 根据权利要求2所述的真空蒸镀装置,其中,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水。
  11. 一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
    蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
    回收结构,包括回收容器和冷却板,所述回收容器中设有容纳槽,所述冷却板设置于所述容纳槽的底部,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水;
    移动结构,与所述回收结构连接,所述移动结构用于移动所述回收结构,使所述回收结构承接脱离所述蒸发源挡板的所述残余材料。
  12. 根据权利要求11所述的真空蒸镀装置,其中,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
    所述发射器设于所述蒸发源挡板上;
    所述接收器设于所述回收容器外部;
    在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
  13. 根据权利要求12所述的真空蒸镀装置,其中,所述蒸发源挡板远离所述蒸发源的一端连接有转轴,所述发射器靠近所述蒸发源挡板与所述转轴的连接处;
    所述回收容器的边缘向靠近所述转轴的方向延伸形成有承载部,所述接收器位于所述承载部上;
    其中,当所述接收器的指示灯与所述发射器的指示灯均显示红色时,所述转轴转动所述蒸发源挡板,所述移动结构移动所述回收结构,使所述蒸发源挡板与所述回收结构进行对位;当所述接收器的指示灯与所述发射器的指示灯均显示绿色时,所述蒸发源挡板与所述回收结构对位完毕。
  14. 根据权利要求11所述的真空蒸镀装置,其中,所述蒸镀腔内还设置有回收器盖板,用于在所述蒸镀腔内进行蒸镀时,覆盖所述容纳槽的槽开口以封闭所述容纳槽。
  15. 根据权利要求14所述的真空蒸镀装置,其中,所述移动结构靠近一所述侧板,所述回收器盖板设置于靠近所述移动结构的所述侧板表面,且所述回收器盖板靠近所述底板;
    其中,在所述蒸镀腔内进行蒸镀时,所述移动结构移动所述回收结构至所述回收器盖板处,所述回收器盖板覆盖所述容纳槽的槽开口以封闭所述容纳槽。
  16. 根据权利要求11所述的真空蒸镀装置,其中,所述移动结构包括:
    升降器;
    连杆,所述连杆的一端与所述升降器铰接,所述连杆远离所述升降器的另一端与所述回收容器连接;
    其中,在所述回收结构回收所述残余材料时,所述升降器升降并转动所述连杆,使所述连杆带动所述回收结构移动至所述蒸发源挡板处,以承接所述残余材料。
  17. 根据权利要求16所述的真空蒸镀装置,其中,所述连杆与所述回收容器之间为可拆卸式连接。
  18. 根据权利要求17所述的真空蒸镀装置,其中,所述回收器盖板为可拆卸式回收器盖板。
  19. 一种真空蒸镀装置,包括由顶板、底板及多个侧板相互连接密封形成的蒸镀腔,所述蒸镀腔内设置有蒸发源以及与所述蒸发源一一对应的材料回收装置,所述材料回收装置包括:
    蒸发源挡板,所述蒸发源挡板内部设置有加热电阻圈,用于在所述蒸发源挡板靠近所述底板一侧的表面附着残余材料时,加热所述蒸发源挡板,使所述残余材料脱离所述蒸发源挡板;
    回收结构,包括回收容器和冷却板,所述回收容器中设有容纳槽,所述冷却板设置于所述容纳槽的底部,所述冷却板内部形成有中空腔,所述中空腔内通有冷凝水;
    移动结构,包括升降器和连接杆,所述连接杆的一端与所述升降器铰接,所述连接杆远离所述升降器的另一端与所述回收容器连接。
  20. 根据权利要求19所述的真空蒸镀装置,其中,所述真空蒸镀装置还包括传感器,所述传感器包括发射器和接收器,所述发射器与所述接收器均设有指示灯,所述指示灯显示红色或绿色;
    所述发射器设于所述蒸发源挡板上;
    所述接收器设于所述回收容器外部;
    在所述移动结构移动所述回收结构回收所述残余材料时,所述回收结构与所述蒸发源挡板通过所述发射器及所述接收器进行对位。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005149924A (ja) * 2003-11-17 2005-06-09 Toray Ind Inc 蒸着装置および蒸着材料の回収・再利用方法並びに有機電界発光装置の製造方法。
JP2008088465A (ja) * 2006-09-29 2008-04-17 Seiko Epson Corp 蒸着装置および有機エレクトロルミネッセンス装置の製造方法
JP2011094197A (ja) * 2009-10-30 2011-05-12 Seiko Epson Corp 蒸着装置及び有機エレクトロルミネッセンス装置の製造装置
CN103834921A (zh) * 2014-02-28 2014-06-04 上海和辉光电有限公司 一种蒸发源挡板结构
US20140193581A1 (en) * 2009-09-01 2014-07-10 Samsung Display Co., Ltd. Thin film deposition apparatus
CN109182968A (zh) * 2018-07-23 2019-01-11 北京铂阳顶荣光伏科技有限公司 附着物回收方法及装置、真空成膜系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0949070A (ja) * 1995-08-10 1997-02-18 Tanaka Kikinzoku Kogyo Kk 蒸着用治具
JP2008223102A (ja) * 2007-03-14 2008-09-25 Seiko Epson Corp 蒸着装置、および蒸着方法
CN101591764B (zh) * 2008-05-29 2013-03-20 昆山维信诺显示技术有限公司 材料成膜方法及其制备的有机电致发光器件
CN101876055B (zh) * 2010-03-23 2012-02-15 东莞宏威数码机械有限公司 挡板冷却装置
WO2012124563A1 (ja) * 2011-03-14 2012-09-20 シャープ株式会社 蒸着粒子射出装置および蒸着装置並びに蒸着方法
CN103498128B (zh) * 2012-04-29 2017-10-03 江苏中能硅业科技发展有限公司 磁控溅射镀膜装置及镀膜方法
CN105755432B (zh) * 2016-04-13 2019-04-09 京东方科技集团股份有限公司 一种蒸镀罩和蒸镀设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005149924A (ja) * 2003-11-17 2005-06-09 Toray Ind Inc 蒸着装置および蒸着材料の回収・再利用方法並びに有機電界発光装置の製造方法。
JP2008088465A (ja) * 2006-09-29 2008-04-17 Seiko Epson Corp 蒸着装置および有機エレクトロルミネッセンス装置の製造方法
US20140193581A1 (en) * 2009-09-01 2014-07-10 Samsung Display Co., Ltd. Thin film deposition apparatus
JP2011094197A (ja) * 2009-10-30 2011-05-12 Seiko Epson Corp 蒸着装置及び有機エレクトロルミネッセンス装置の製造装置
CN103834921A (zh) * 2014-02-28 2014-06-04 上海和辉光电有限公司 一种蒸发源挡板结构
CN109182968A (zh) * 2018-07-23 2019-01-11 北京铂阳顶荣光伏科技有限公司 附着物回收方法及装置、真空成膜系统

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