WO2021035853A1 - 柔性显示装置的制作方法及柔性显示装置 - Google Patents

柔性显示装置的制作方法及柔性显示装置 Download PDF

Info

Publication number
WO2021035853A1
WO2021035853A1 PCT/CN2019/107938 CN2019107938W WO2021035853A1 WO 2021035853 A1 WO2021035853 A1 WO 2021035853A1 CN 2019107938 W CN2019107938 W CN 2019107938W WO 2021035853 A1 WO2021035853 A1 WO 2021035853A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible display
metal wiring
wiring layer
display device
insulating layer
Prior art date
Application number
PCT/CN2019/107938
Other languages
English (en)
French (fr)
Inventor
徐朝
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2021035853A1 publication Critical patent/WO2021035853A1/zh

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods

Definitions

  • This application relates to the technical field related to flexible display devices, and in particular to a manufacturing method of a flexible display device and a flexible display device.
  • the existing display panel is provided with at least a flexible substrate and a metal wiring layer at the bending position.
  • the neutral plane (neutral plane) subjected to the bending is close to the side of the metal wiring layer.
  • the influence of the material of the metal wiring layer is likely to cause the line to crack or crack, and even if there is no cracking phenomenon, it greatly limits the bending radius and takes up a large space.
  • the embodiments of the present application provide a manufacturing method of a flexible display device and a flexible display device, so as to solve the problem that the metal wiring layer of the display panel is easy to be seamed or broken during the bending process.
  • the embodiment of the present application provides a manufacturing method of a flexible display device, which includes the following steps:
  • Step S1 providing a flexible display panel, the flexible display panel including a bending area, and the flexible display panel including a metal wiring layer located in the bending area;
  • Step S2 irradiate the metal wiring layer with laser light to soften the illuminated surface of the metal wiring layer, and bend the flexible display panel at the bending area.
  • the flexible display panel includes a transparent flexible substrate, and a first insulating layer and a second insulating layer located in the bending area, and the first insulating layer is provided with On the transparent flexible substrate, the metal wiring layer is provided on the first insulating layer, and the second insulating layer is provided on the metal wiring layer.
  • step S2 performing laser light irradiation on the metal wiring layer includes:
  • Laser irradiation is performed on the side of the metal wiring layer close to the transparent flexible substrate and/or laser irradiation is performed on the side of the metal wiring layer away from the transparent flexible substrate.
  • the laser irradiating the side of the metal wiring layer close to the transparent flexible substrate includes:
  • the laser sequentially passes through the transparent flexible substrate and the first insulating layer to irradiate the metal wiring layer.
  • the laser irradiating the side of the metal wiring layer away from the transparent flexible substrate includes:
  • the laser passes through the second insulating layer to irradiate the metal wiring layer.
  • the wavelength of the laser is greater than 350 nm.
  • the duration of the laser illumination is less than 60 seconds and the power of the laser illumination is less than 50W.
  • the laser light is applied to the metal wiring layer to soften the illuminated surface of the metal wiring layer, and the flexible display
  • the bending of the panel at the bending zone includes:
  • the method further includes: Step S3: forming a protective glue layer on the second insulating layer.
  • step S3 forming a protective glue layer on the second insulating layer includes:
  • a flexible display device which is manufactured by using the manufacturing method of the aforementioned flexible display device.
  • the flexible display device includes a flexible display panel, the flexible display panel includes a bending area, and the flexible display panel includes a metal wiring layer located in the bending area.
  • the flexible display panel includes a transparent flexible substrate, and a first insulating layer and a second insulating layer located in the bending area, and the first insulating layer is provided on the On the transparent flexible substrate, the metal wiring layer is provided on the first insulating layer, and the second insulating layer is provided on the metal wiring layer.
  • the flexible display panel further includes a display area, and the transparent flexible substrate is provided with a display module located in the display area.
  • a protective glue layer is provided on the second insulating layer.
  • the beneficial effects of the present application are: on the basis of the original flexible display panel bending process, the present application adds a step of laser irradiating the metal wiring layer in the bending area of the flexible display panel, so that the illuminated surface of the metal wiring layer is softened, The plastic deformation performance is improved, so that the lines of the metal wiring layer of the flexible display panel are not easily cracked or cracked during the bending process. In addition, due to the improvement of the plastic deformation performance, the bending resistance of the metal wiring layer is improved. Compared with the prior art, it can withstand bending with a larger curvature, reduces the bending radius of the flexible display panel, and reduces the overall thickness of the flexible display panel after bending.
  • FIG. 1 is a flow block diagram of a manufacturing method of a flexible display device according to an embodiment of the application
  • FIG. 2 is a schematic structural diagram of a flexible display device before bending according to an embodiment of the application
  • FIG. 3 is a schematic structural diagram of a flexible display device after bending according to an embodiment of the application
  • FIG. 4 is a flow block diagram of another method for manufacturing a flexible display device according to an embodiment of the application.
  • FIG. 5 is a schematic diagram of another structure of a flexible display device after bending according to an embodiment of the application.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the specific meanings of the above-mentioned terms in this application can be understood under specific circumstances.
  • an embodiment of the present application provides a manufacturing method of a flexible display device, which includes the following steps:
  • Step S1 Provide a flexible display panel 1, the flexible display panel 1 includes a bending area 200, and the flexible display panel 1 includes a metal wiring layer 210 located in the bending area 200;
  • Step S2 irradiate the metal wiring layer 210 with laser light to soften the illuminated surface of the metal wiring layer 210, and bend the flexible display panel 1 at the bending area 200.
  • the flexible display panel 1 includes a transparent flexible substrate 110, and a first insulating layer 220 and a second insulating layer 230 located in the bending area 200.
  • the first The insulating layer 220 is provided on the transparent flexible substrate 110
  • the metal wiring layer 210 is provided on the first insulating layer 220
  • the second insulating layer 230 is provided on the metal wiring layer 210.
  • the flexible display panel 1 further includes a display area 100, and the transparent flexible substrate 110 is provided with a display module 120 located in the display area.
  • the functional layers including the TFT array layer are all prior art or conventional settings, and will not be repeated here.
  • the metal wiring layer 210 is a control circuit derived from the TFT array layer, such as scan lines, data lines, etc.; and it is understandable that the first insulating layer 220 and the second insulating layer 220 are control lines derived from the TFT array layer.
  • the insulating layer 230 is a part of the TFT array layer that is partially extended from an insulating layer formed of organic or inorganic materials, such as a gate insulating layer, a flat layer, and an interlayer dielectric layer in the TFT array layer.
  • step S2 laser light is applied to the metal wiring layer 210 to soften the illuminated surface of the metal wiring layer 210, and the flexible display panel 1 is bent at the bending area 200; obviously; , The flexible display panel 1 is bent at the bending area 200, and the specific bending direction is to bend to the side of the transparent flexible substrate 110 away from the display module 120; in addition, the laser light is used to make
  • the metal wiring layer 210 produces a plastic deformation zone on the illuminated surface, and the physical properties of the metal material in this area change, transform into a plastic deformed form and soften, thereby improving the ductility of the metal wiring layer 210, making it difficult to open Seam or crack.
  • performing laser light irradiation on the metal wiring layer 210 includes:
  • Laser irradiation is performed on the side of the metal wiring layer 210 close to the transparent flexible substrate 110 and/or laser irradiation is performed on the side of the metal wiring layer 210 away from the transparent flexible substrate 110.
  • the direction of laser irradiation on the metal wiring layer 210 can be laser irradiation on the side of the metal wiring layer 210 close to the transparent flexible substrate 110.
  • the illumination can also be laser illumination on the side of the metal wiring layer 210 away from the transparent flexible substrate 110; of course, it can also be laser illumination on both sides of the metal wiring layer 210;
  • the laser irradiating the side of the metal wiring layer 210 close to the transparent flexible substrate 110 includes:
  • the laser sequentially passes through the transparent flexible substrate 110 and the first insulating layer 220 to irradiate the metal wiring layer 210.
  • the laser irradiating the side of the metal wiring layer 210 away from the transparent flexible substrate 110 includes:
  • the laser passes through the second insulating layer 230 to irradiate the metal wiring layer 210.
  • the metal wiring layer 210 is irradiated with laser light; specifically, the direction of the laser is perpendicular to the metal wiring layer 210; to ensure that the laser passes through the transparent flexible substrate 110, the The optical path of the first insulating layer 220 or the second insulating layer 230 is the shortest, which reduces the absorption rate and attenuation of laser light;
  • the wavelength of the laser is greater than 350nm; it can be understood that lasers with different wavelengths have different penetrating properties, and different materials have different absorption rates for lasers. Obviously, lasers with larger wavelengths penetrate The better the performance, in this application, specifically, a laser with a wavelength greater than 350 nm is selected to irradiate the metal wiring layer 210.
  • a laser with a wavelength greater than 350 nm is selected to irradiate the metal wiring layer 210.
  • the laser illumination time considering the overall structural thickness of the material and other parameters, it is shown that the laser illumination time should not be too long or too short. Specifically, the laser illumination time is less than 60 seconds and the laser illumination power is less than 50W.
  • the laser light is applied to the metal wiring layer 210 to soften the light-receiving surface of the metal wiring layer 210, and the flexible display panel 1 is bent at the Bending is performed at the area 200; wherein, the two sub-steps of laser irradiating the metal wiring layer 210 and bending the flexible display panel 1 at the bending area 200 are not defined in sequence.
  • the metal wiring layer 210 may be irradiated with laser light first, and then the flexible display panel 1 may be bent at the bending area 200; in this way, the metal wiring layer 210 may be bent first.
  • the wiring layer 210 is irradiated with laser light to soften the illuminated surface of the metal wiring layer 210, and then the flexible display panel 1 is bent, so that the metal wiring layer 210 bends in a softened state.
  • the metal wiring layer The 210 plastic deformation performance is better than that before laser irradiation. Therefore, compared with the existing bonding process, it can achieve a lower bending radius and reduce the thickness of the entire panel.
  • the flexible display panel 1 may be bent at the bending area 200 first, and then the metal wiring layer 210 may be laser irradiated.
  • the effect of the method is poor, but for structures that do not require high bending (binding) processes, after bending, the metal wiring layer 210 can be softened by laser light and then shaped , To avoid the shearing force of stretching and shrinking under the bending state for a long time, and reduce the service life.
  • the method further includes: Step S3: forming a protective glue layer 240 on the second insulating layer 230.
  • a protective glue layer 240 is formed on the outside of the bent portion in the bending area 200, that is, on the second insulating layer 230.
  • the protective glue layer 240 in the present application is more It is used to prevent the metal wiring layer 210 from being corroded.
  • a protective glue layer 240 is formed on the second insulating layer 230. Specifically, a glue material is sprayed on the second insulating layer 230 to form a covering area.
  • the protective glue layer 240 of the second insulating layer 230 is described.
  • the step of laser irradiating the metal wiring layer in the bending area of the flexible display panel 1 is added, so that the illuminated surface of the metal wiring layer is softened and the plastic deformation is improved.
  • Performance making the lines of the metal wiring layer of the flexible display panel 1 less likely to be cracked or broken during the bending process.
  • the bending resistance of the metal wiring layer is improved, compared with the existing The process can withstand bending with a larger curvature, reduce the bending radius of the flexible display panel 1 and reduce the overall thickness of the flexible display panel 1 after bending.
  • This application also provides a flexible display device, as shown in FIG. 2, FIG. 3 and FIG. 5.
  • the display device is manufactured using the manufacturing method of the aforementioned flexible display device; obviously, it is manufactured by the manufacturing method of the display device of this application.
  • the obtained flexible display device has better bending performance, and there are fewer seams or cracks in the circuit, which improves the yield rate of the flexible display device, and is also suitable for mass production.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性显示装置的制作方法及柔性显示装置，制作方法包括如下步骤：步骤S1，提供柔性显示面板(1)，柔性显示面板(1)包括弯折区(200)，柔性显示面板(1)包括一位于弯折区(200)内的金属走线层(210)；步骤S2，对金属走线层(210)进行激光光照以使金属走线层(210)受光照面软化，将柔性显示面板(1)在弯折区(200)处进行弯曲。

Description

柔性显示装置的制作方法及柔性显示装置 技术领域
本申请涉及柔性显示装置相关技术领域，尤其涉及一种柔性显示装置的制作方法及柔性显示装置。
 背景技术
随着电子技术的不断发展，工艺水平的不断提高，全面屏已经成为当下的一个热门趋势；为了扩大智能手机的显示画面，通过弯折在Pad处进行绑定（bending）以此来在整体大小上扩大画面的比例。
 技术问题
目前，现有的显示面板在弯折处至少设有柔性基板和金属走线层，显然，在此处进行弯折时所受应力的临界面（neutral Plane）靠近金属走线层一侧，结合金属走线层材质的影响，容易使线路开缝或破裂（crack），并且，即使不出现破裂现象，也极大的限制了弯折半径，占用较大空间。
 技术解决方案
本申请实施例提供一种柔性显示装置的制作方法及柔性显示装置，以解决显示面板在弯折过程中金属走线层容易开缝或破裂等问题。
本申请实施例提供了一种柔性显示装置的制作方法，包括如下步骤：
步骤S1：提供柔性显示面板，所述柔性显示面板包括弯折区，所述柔性显示面板包括一位于弯折区内的金属走线层；
步骤S2：对所述金属走线层进行激光光照以使所述金属走线层受光照面软化，将所述柔性显示面板在所述弯折区处进行弯曲。
在本申请实施例的柔性显示装置的制作方法中，所述柔性显示面板包括透明柔性基板、以及位于所述弯折区内的第一绝缘层和第二绝缘层，所述第一绝缘层设于所述透明柔性基板上，所述金属走线层设于所述第一绝缘层上，所述第二绝缘层设于所述金属走线层上。
在本申请实施例的柔性显示装置的制作方法中，所述步骤S2中，对所述金属走线层进行激光光照包括：
对金属走线层靠近所述透明柔性基板的一侧进行激光光照和/或对金属走线层远离所述透明柔性基板的一侧进行激光光照。
在本申请实施例的柔性显示装置的制作方法中，所述对金属走线层靠近所述透明柔性基板的一侧进行激光光照包括：
所述激光依次穿过所述透明柔性基板及所述第一绝缘层对所述金属走线层进行照射。
在本申请实施例的柔性显示装置的制作方法中，所述对金属走线层远离所述透明柔性基板的一侧进行激光光照包括：
所述激光穿过所述第二绝缘层对所述金属走线层进行照射。
在本申请实施例的柔性显示装置的制作方法中，所述激光的波长大于350nm。
在本申请实施例的柔性显示装置的制作方法中，所述激光光照的时长小于60秒且激光光照的功率小于50W。
在本申请实施例的柔性显示装置的制作方法中，所述步骤S2中，所述对所述金属走线层进行激光光照以使所述金属走线层受光照面软化，将所述柔性显示面板在所述弯折区处进行弯曲包括：
先对所述金属走线层进行激光光照，然后将所述柔性显示面板在所述弯折区处进行弯曲；或
在将所述柔性显示面板在所述弯折区处进行弯曲的过程中，对所述金属走线层进行激光光照。
在本申请实施例的柔性显示装置的制作方法中，还包括：步骤S3：在所述第二绝缘层上形成保护胶层。
在本申请实施例的柔性显示装置的制作方法中，所述步骤S3中：在所述第二绝缘层上形成保护胶层包括：
在所述第二绝缘层上喷涂胶材，以形成覆盖所述第二绝缘层的保护胶层。
根据本申请的上述目的，还提供一种柔性显示装置，所述显示装置采用如前述柔性显示装置的制作方法制得。
在本申请实施例的柔性显示装置中，所述柔性显示装置包括柔性显示面板，所述柔性显示面板包括弯折区，所述柔性显示面板包括一位于弯折区内的金属走线层。
在本申请实施例的柔性显示装置中，所述柔性显示面板包括透明柔性基板、以及位于所述弯折区内的第一绝缘层和第二绝缘层，所述第一绝缘层设于所述透明柔性基板上，所述金属走线层设于所述第一绝缘层上，所述第二绝缘层设于所述金属走线层上。
在本申请实施例的柔性显示装置中，所述柔性显示面板还包括显示区，所述透明柔性基板上设有位于所述显示区内的显示模组。
在本申请实施例的柔性显示装置中，所述第二绝缘层上设有保护胶层。
 有益效果
本申请的有益效果为：本申请在原有柔性显示面板弯曲工艺的基础上，增加了对柔性显示面板弯折区内金属走线层激光光照的步骤，使金属走线层上受光照面软化，提高了塑性变形的性能，使得柔性显示面板在弯曲过程中金属走线层的线路不易开缝或破裂，此外，由于塑性变形的性能的提高，进而提升了金属走线层的抗弯曲性能，相比于现有工艺，能够承受更大曲率的弯曲，减少了柔性显示面板弯曲的弯曲半径，降低了柔性显示面板弯曲后整体厚度。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种柔性显示装置的制作方法的流程方块图；
图2为本申请实施例提供的一种柔性显示装置弯曲前的结构示意图；
图3为本申请实施例提供的一种柔性显示装置弯曲后的结构示意图；
图4为本申请实施例提供的另一种柔性显示装置的制作方法的流程方块图；及
图5为本申请实施例提供的一种柔性显示装置弯曲后的另一种结构示意图。
 本发明的实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用来描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用来描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和实施例对本申请作进一步说明。
如图1所示，本申请实施例提供了一种柔性显示装置的制作方法，包括如下步骤：
步骤S1：提供柔性显示面板1，所述柔性显示面板1包括弯折区200，所述柔性显示面板1包括一位于弯折区200内的金属走线层210；
步骤S2：对所述金属走线层210进行激光光照以使所述金属走线层210受光照面软化，将所述柔性显示面板1在所述弯折区200处进行弯曲。
在一实施例中，如图2所示，所述柔性显示面板1包括透明柔性基板110、以及位于所述弯折区200内的第一绝缘层220和第二绝缘层230，所述第一绝缘层220设于所述透明柔性基板110上，所述金属走线层210设于所述第一绝缘层220上，所述第二绝缘层230设于所述金属走线层210上。
可以理解的是，如图2所示，所述柔性显示面板1还包括显示区100，并且所述透明柔性基板110上设有位于显示区内的显示模组120，而关于显示模组120具体包括如TFT阵列层等功能层均为现有技术或者常规设置，在此不再赘述。
在一实施例中，显然，所述金属走线层210为从TFT阵列层所引申出的控制线路，如：扫描线、数据线等；并且，可以理解的是第一绝缘层220和第二绝缘层230为TFT阵列层中部分由有机或无机材料形成的绝缘层所延伸出来的部分，例如TFT阵列层中的栅极绝缘层、平坦层和层间介质层等。
具体的，步骤S2：对所述金属走线层210进行激光光照以使所述金属走线层210受光照面软化，将所述柔性显示面板1在所述弯折区200处进行弯曲；显然，将所述柔性显示面板1在所述弯折区200处进行弯曲，具体弯曲的方向是向透明柔性基板110远离所述显示模组120的一侧进行弯曲；此外，通过激光光照的方式使所述金属走线层210受光照面表面产生塑性变形区，该区域内的金属材料物性产生变化，转化为塑性变形的形态而软化，从而提升金属走线层210的延展性，使其不易开缝或破裂。
在一实施例中，所述步骤S2中，对所述金属走线层210进行激光光照包括：
对金属走线层210靠近所述透明柔性基板110的一侧进行激光光照和/或对金属走线层210远离所述透明柔性基板110的一侧进行激光光照。
可以理解的是，根据不同面板结构和所需达到弯曲条件参数，对金属走线层210进行激光光照的方向，即可以是对金属走线层210靠近所述透明柔性基板110的一侧进行激光光照，也可以是对金属走线层210远离所述透明柔性基板110的一侧进行激光光照；当然，更是可以对金属走线层210两侧均进行激光光照；
具体的，所述对金属走线层210靠近所述透明柔性基板110的一侧进行激光光照包括：
所述激光依次穿过所述透明柔性基板110及所述第一绝缘层220对所述金属走线层210进行照射。
具体的，所述对金属走线层210远离所述透明柔性基板110的一侧进行激光光照包括：
所述激光穿过所述第二绝缘层230对所述金属走线层210进行照射。
显然，不管是从哪一侧对所述金属走线层210进行激光光照；具体的，采用激光的方向垂直于所述金属走线层210；以保证激光所穿过透明柔性基板110、所述第一绝缘层220或第二绝缘层230的光程最短，减少激光被吸收率和衰减；
在一实施例中，所述激光的波长大于350nm；可以理解的是，不同波长的激光的穿透性能不同，并且，不同材质对于激光的吸收率也不同，显然，波长越大的激光穿透性能越好，本申请中，具体的，选用波长大于350nm的激光对金属走线层210进行照射。此外，对于激光光照时长的选择，考虑材料整体的结构厚度等参数，显示激光光照时间不宜过长或过短，具体的，激光光照的时长小于60秒且激光光照的功率小于50W。
可以理解的是，所述步骤S2中，所述对所述金属走线层210进行激光光照以使所述金属走线层210受光照面软化，将所述柔性显示面板1在所述弯折区200处进行弯曲；其中，并没有对所述金属走线层210进行激光光照和将所述柔性显示面板1在所述弯折区200处进行弯曲这两子步骤做先后顺序的限定。
在一实施例中， 既可以是先对所述金属走线层210进行激光光照，然后将所述柔性显示面板1在所述弯折区200处进行弯曲；此种方式，先对所述金属走线层210进行激光光照使所述金属走线层210受光照面软化，然后再对柔性显示面板1弯曲，使得金属走线层210在软化的状态下进行弯曲，此时，金属走线层210塑性变形性能相对于激光光照前更好，因此，相比于现有绑定工艺，能达到更下的弯曲半径，减少整个面板的厚度。
也可以是在将所述柔性显示面板1在所述弯折区200处进行弯曲的过程中，对所述金属走线层210进行激光光照；具体弯曲后的结构状态如图3所示；可以理解的是，此种方式，将所述柔性显示面板1在所述弯折区200处进行弯曲和对所述金属走线层210进行激光光照的两子步骤，既可以是同时进行，也可以是在将所述柔性显示面板1在所述弯折区200处进行弯曲先进行，然后再弯曲的过程中对所述金属走线层210进行激光光照；此皆可以达到较好的弯曲效果。
值得注意的是，在特殊情况下，也可采用先将所述柔性显示面板1在所述弯折区200处进行弯曲，然后对所述金属走线层210进行激光光照的方式，此种方式的效果相较于前述两种顺序的方式效果较差，但对于弯曲（绑定）工艺要求不高的结构，可以在弯曲过后，通过激光光照的方式使所述金属走线层210软化之后定型，避免长时间处于弯曲状态下一直承受拉伸收缩的剪切力，而减少使用寿命。
在一实施例中，如图4所示，还包括：步骤S3：在所述第二绝缘层230上形成保护胶层240。
可以理解的是，如图5所示，对弯折区200内经过弯折的部分外侧，即第二绝缘层230上形成保护胶层240，显然，本申请中的保护胶层240更多的是用于避免金属走线层210受到腐蚀。
在一实施例中，所述步骤S3中：在所述第二绝缘层230上形成保护胶层240的方式，具体的，采用在所述第二绝缘层230上喷涂胶材，以形成覆盖所述第二绝缘层230的保护胶层240。
本申请通过在原有柔性显示面板1弯曲工艺的基础上，增加对柔性显示面板1弯折区内金属走线层激光光照的步骤，使金属走线层上受光照面软化，提高了塑性变形的性能，使得柔性显示面板1在弯曲过程中金属走线层的线路不易开缝或破裂，此外，由于塑性变形的性能的提高，进而提升了金属走线层的抗弯曲性能，相比于现有工艺，能够承受更大曲率的弯曲，减少了柔性显示面板1弯曲的弯曲半径，降低了柔性显示面板1弯曲后整体厚度。
本申请还提供一种柔性显示装置，如图2、图3和图5所示，所述显示装置采用如前述柔性显示装置的制作方法制得；显然，通过本申请显示装置的制作方法所制得的柔性显示装置具备更好的弯曲性能，线路开缝或破裂的情况更少，提高了柔性显示装置的良品率，也适于批量生产。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (15)

  1. 一种柔性显示装置的制作方法，包括如下步骤：
    步骤S1：提供柔性显示面板（1），所述柔性显示面板（1）包括弯折区（200），所述柔性显示面板（1）包括一位于弯折区（200）内的金属走线层（210）；
    步骤S2：对所述金属走线层（210）进行激光光照以使所述金属走线层（210）受光照面软化，将所述柔性显示面板（1）在所述弯折区（200）处进行弯曲。
  2. 根据权利要求1所述的柔性显示装置的制作方法，其中，所述柔性显示面板（1）包括透明柔性基板（110）、以及位于所述弯折区（200）内的第一绝缘层（220）和第二绝缘层（230），所述第一绝缘层（220）设于所述透明柔性基板（110）上，所述金属走线层（210）设于所述第一绝缘层（220）上，所述第二绝缘层（230）设于所述金属走线层（210）上。
  3. 根据权利要求2所述的柔性显示装置的制作方法，其中，所述步骤S2中，对所述金属走线层（210）进行激光光照包括：
    对金属走线层（210）靠近所述透明柔性基板（110）的一侧进行激光光照和/或对金属走线层（210）远离所述透明柔性基板（110）的一侧进行激光光照。
  4. 根据权利要求3所述的柔性显示装置的制作方法，其中，所述对金属走线层（210）靠近所述透明柔性基板（110）的一侧进行激光光照包括：
    所述激光依次穿过所述透明柔性基板（110）及所述第一绝缘层（220）对所述金属走线层（210）进行照射。
  5. 根据权利要求3所述的柔性显示装置的制作方法，其中，所述对金属走线层（210）远离所述透明柔性基板（110）的一侧进行激光光照包括：
    所述激光穿过所述第二绝缘层（230）对所述金属走线层（210）进行照射。
  6. 根据权利要求1所述的柔性显示装置的制作方法，其中，所述激光的波长大于350nm。
  7. 根据权利要求1所述的柔性显示装置的制作方法，其中，所述激光光照的时长小于60秒且激光光照的功率小于50W。
  8. 根据权利要求1所述的柔性显示装置的制作方法，其中，所述步骤S2中，所述对所述金属走线层（210）进行激光光照以使所述金属走线层（210）受光照面软化，将所述柔性显示面板（1）在所述弯折区（200）处进行弯曲包括：
    先对所述金属走线层（210）进行激光光照，然后将所述柔性显示面板（1）在所述弯折区（200）处进行弯曲；或
    在将所述柔性显示面板（1）在所述弯折区（200）处进行弯曲的过程中，对所述金属走线层（210）进行激光光照。
  9. 根据权利要求2所述的柔性显示装置的制作方法，其中，还包括：步骤S3：在所述第二绝缘层（230）上形成保护胶层（240）。
  10. 根据权利要求9所述的柔性显示装置的制作方法，其中，所述步骤S3中：在所述第二绝缘层（230）上形成保护胶层（240）包括：
    在所述第二绝缘层（230）上喷涂胶材，以形成覆盖所述第二绝缘层（230）的保护胶层（240）。
  11. 一种柔性显示装置，，所述显示装置采用如权利要求1所述的柔性显示装置的制作方法制得。
  12. 根据权利要求11所述的柔性显示装置，其中，所述柔性显示装置包括柔性显示面板（1），所述柔性显示面板（1）包括弯折区（200），所述柔性显示面板（1）包括一位于弯折区（200）内的金属走线层（210）。
  13. 根据权利要求12所述的柔性显示装置，其中，所述柔性显示面板（1）包括透明柔性基板（110）、以及位于所述弯折区（200）内的第一绝缘层（220）和第二绝缘层（230），所述第一绝缘层（220）设于所述透明柔性基板（110）上，所述金属走线层（210）设于所述第一绝缘层（220）上，所述第二绝缘层（230）设于所述金属走线层（210）上。
  14. 根据权利要求13所述的柔性显示装置，其中，所述柔性显示面板（1）还包括显示区（100），所述透明柔性基板（110）上设有位于所述显示区（100）内的显示模组（120）。
  15. 根据权利要求14所述的柔性显示装置，其中，所述第二绝缘层（230）上设有保护胶层（240）。
PCT/CN2019/107938 2019-08-23 2019-09-25 柔性显示装置的制作方法及柔性显示装置 WO2021035853A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910781534.5 2019-08-23
CN201910781534.5A CN110600427A (zh) 2019-08-23 2019-08-23 一种柔性显示装置的制作方法及柔性显示装置

Publications (1)

Publication Number Publication Date
WO2021035853A1 true WO2021035853A1 (zh) 2021-03-04

Family

ID=68855234

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/107938 WO2021035853A1 (zh) 2019-08-23 2019-09-25 柔性显示装置的制作方法及柔性显示装置

Country Status (2)

Country Link
CN (1) CN110600427A (zh)
WO (1) WO2021035853A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203775525U (zh) * 2014-02-20 2014-08-13 鹤山市银雨照明有限公司 一种弯折式软电路板及具有该种软电路板的led条形灯
CN106920829A (zh) * 2017-03-30 2017-07-04 京东方科技集团股份有限公司 一种柔性显示面板、显示装置及柔性显示面板的制作方法
US20180182983A1 (en) * 2016-12-22 2018-06-28 Samsung Display Co., Ltd. Flexible display panel, method for manufacturing flexible display panel, and apparatus for manufacturing flexible display panel
CN108231672A (zh) * 2018-01-19 2018-06-29 昆山国显光电有限公司 柔性显示面板的制作方法及柔性显示面板
CN208062055U (zh) * 2018-05-09 2018-11-06 京东方科技集团股份有限公司 柔性显示装置
CN109638043A (zh) * 2018-12-03 2019-04-16 武汉华星光电半导体显示技术有限公司 柔性有机发光二极管（oled）显示基板及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222578A (ja) * 2001-01-26 2002-08-09 Nitto Denko Corp 中継フレキシブル配線回路基板
US7943287B2 (en) * 2006-07-28 2011-05-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
KR101073147B1 (ko) * 2010-04-05 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치 및 그 제조방법
US8677796B2 (en) * 2011-02-18 2014-03-25 GM Global Technology Operations LLC Hemmed metal panels, hemming apparatuses, and hemming methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203775525U (zh) * 2014-02-20 2014-08-13 鹤山市银雨照明有限公司 一种弯折式软电路板及具有该种软电路板的led条形灯
US20180182983A1 (en) * 2016-12-22 2018-06-28 Samsung Display Co., Ltd. Flexible display panel, method for manufacturing flexible display panel, and apparatus for manufacturing flexible display panel
CN106920829A (zh) * 2017-03-30 2017-07-04 京东方科技集团股份有限公司 一种柔性显示面板、显示装置及柔性显示面板的制作方法
CN108231672A (zh) * 2018-01-19 2018-06-29 昆山国显光电有限公司 柔性显示面板的制作方法及柔性显示面板
CN208062055U (zh) * 2018-05-09 2018-11-06 京东方科技集团股份有限公司 柔性显示装置
CN109638043A (zh) * 2018-12-03 2019-04-16 武汉华星光电半导体显示技术有限公司 柔性有机发光二极管（oled）显示基板及其制作方法

Also Published As

Publication number Publication date
CN110600427A (zh) 2019-12-20

Similar Documents

Publication Publication Date Title
CN105977400B (zh) 一种显示面板及其制备方法、显示装置
CN111682055B (zh) 显示基板及其制备方法、显示面板和显示装置
CN110444578B (zh) 柔性显示面板及其制造方法
TWI331247B (en) Pixel sturctur and repairing method thereof
WO2020233576A1 (zh) 显示面板、其制作方法及显示装置
WO2019072230A1 (zh) 阵列基板及其制备方法、显示装置及其制备方法
CN102650776B (zh) 一种液晶显示面板及液晶显示器
WO2021000457A1 (zh) 显示面板及其制作方法
CN103107135B (zh) 一种阵列基板的制作方法、阵列基板和显示装置
CN105759522A (zh) Tft基板的断线修复方法
CN103278987A (zh) 阵列基板、该阵列基板断线修复方法及显示装置
WO2013053164A1 (zh) Tft-lcd阵列基板及其制造方法
WO2016112684A1 (zh) 显示面板及其制备方法、显示装置
KR102314509B1 (ko) Tft 기판의 제조 방법 및 tft 기판
CN101114655A (zh) 薄膜晶体管阵列基板及其制造方法、修复方法
WO2018219065A1 (zh) 阵列基板、阵列基板的维修方法、显示面板和显示装置
WO2020107735A1 (zh) 一种液晶显示面板
CN101488479B (zh) 薄膜晶体管阵列基板及其制造方法
US20110006671A1 (en) Organic light emitting display and fabricating method thereof
WO2021035853A1 (zh) 柔性显示装置的制作方法及柔性显示装置
US8471151B2 (en) Layout method for bridging electrode capable of shielding bright spot and structure of the bridging electrode
CN108254988A (zh) 断线修复方法
WO2021258468A1 (zh) 显示面板及其制作方法
TW201037398A (en) Repair structure of liquid crystal display and method thereof
CN106990632A (zh) 阵列基板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19943664

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19943664

Country of ref document: EP

Kind code of ref document: A1